WO2020238854A1 - 显示面板的制备方法、显示面板及显示装置 - Google Patents

显示面板的制备方法、显示面板及显示装置 Download PDF

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Publication number
WO2020238854A1
WO2020238854A1 PCT/CN2020/092120 CN2020092120W WO2020238854A1 WO 2020238854 A1 WO2020238854 A1 WO 2020238854A1 CN 2020092120 W CN2020092120 W CN 2020092120W WO 2020238854 A1 WO2020238854 A1 WO 2020238854A1
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Prior art keywords
substrate
layer
light
concave
display panel
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PCT/CN2020/092120
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English (en)
French (fr)
Inventor
谢学武
艾雨
孔玉宝
孙诗
刘博文
张阿猛
刘浩
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
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Priority to US17/263,587 priority Critical patent/US20210367117A1/en
Publication of WO2020238854A1 publication Critical patent/WO2020238854A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Definitions

  • the embodiment of the present disclosure relates to a manufacturing method of a display panel, a display panel and a display device.
  • Display devices such as mobile phones, PADs, and TVs mostly use wide viewing angle screens, and few manufacturers have added anti-peeping related technologies, which cannot meet the privacy needs of users. Information leakage incidents have increased frequently in recent years. With the enhancement of enterprises and individuals' awareness of security protection, there is a great market demand for anti-peeping technology for display devices.
  • An embodiment of the present disclosure discloses a display panel.
  • the display panel includes: a first substrate and a second substrate disposed opposite to each other; the first substrate includes a first substrate and is disposed on the first substrate close to the The base film layer on the side of the second substrate, the surface of the base film layer on the side close to the second substrate has a plurality of concave mirror structures, the second substrate includes a second substrate and is arranged on the second substrate.
  • the bottom is close to a plurality of light-emitting units on one side of the first substrate, and each of the light-emitting units is located at the focal position of the corresponding concave mirror structure.
  • each light-emitting unit on the first substrate is located within the orthographic projection of a concave mirror structure on the first substrate.
  • the ratio of the size of each light-emitting unit in a direction parallel to the first substrate to the size of the corresponding concave mirror structure in the direction is less than 1.
  • the ratio of the size of each light-emitting unit to the size of the corresponding concave mirror structure ranges from 1/5 to 1/3.
  • the surface of the concave mirror structure facing the light-emitting unit is a concave surface and a reflective surface.
  • the surface of the concave mirror structure facing the light emitting unit is a concave spherical surface or a concave paraboloid.
  • each of the concave mirror structures includes a concave structure provided on a surface of the base film layer close to the second substrate, and a first reflective layer provided on the surface of the concave structure.
  • the surface of the first reflective layer facing away from the concave structure is a concave surface and a reflective surface.
  • the concave structure is a concave spherical structure or a concave parabolic structure.
  • a gas layer or a transparent resin layer is a gas layer or a transparent resin layer.
  • each of the light-emitting units includes a second reflective layer and a light-emitting layer that are stacked, and the second reflective layer is provided close to the second substrate.
  • the light-emitting layer includes a GaAs substrate layer, an n-AlGaInP layer, an i-AlGaInP layer, a P-AlGaInP layer, and an anode layer that are stacked, the second reflective layer is multiplexed as a cathode layer, and the GaAs substrate layer is close to The second reflective layer is provided.
  • the light emitting unit includes an anode layer and a cathode layer, the anode layer is located between the cathode layer and the first substrate, and the anode layer has a hollow portion.
  • the second substrate further includes an isolation layer disposed on a side of the second substrate close to the first substrate, and the isolation layer is disposed between the light-emitting units; the second substrate further includes A protective layer on the light-emitting unit and the isolation layer, and a support layer disposed on the protective layer, the orthographic projection of the support layer on the second substrate is located on the isolation layer on the Within the orthographic projection range on the second substrate.
  • the surface of the base film layer on the side close to the second substrate further has a planar structure, the planar structure is located between the concave mirror structures, and the planar structure is attached to the support layer.
  • the embodiment of the present disclosure further provides a display panel, including: a first substrate; a base film layer disposed on the first substrate, wherein a surface of the base film layer facing away from the first substrate has A plurality of concave mirror structures, the plurality of concave mirror structures are concave toward the first substrate; a plurality of light-emitting units arranged on a side of the base film layer away from the first substrate, wherein the plurality of The light-emitting units correspond to the plurality of concave mirror structures one-to-one, each of the light-emitting units is located at the focal position of the corresponding concave mirror structure, and the surface of the concave mirror structure facing the light-emitting unit is concave toward the first A concave surface of the substrate and a reflective surface.
  • the embodiment of the present disclosure also discloses a display device, and the display device includes the display panel described in any one of the embodiments.
  • the embodiment of the present disclosure also discloses a method for manufacturing a display panel.
  • the manufacturing method includes: providing a first substrate.
  • the first substrate includes a first substrate and is disposed on the first substrate close to the second substrate.
  • a base film layer on one side of the substrate, the surface of the base film layer close to the second substrate side has a plurality of concave mirror structures;
  • a second substrate is provided, and the second substrate includes a second substrate and is arranged on the The second substrate is close to the multiple light-emitting units on one side of the first substrate; the first substrate and the second substrate are aligned so that each light-emitting unit is located at the focal point of the corresponding concave mirror structure .
  • the providing the first substrate includes: providing the first substrate; forming a base film material layer on the first substrate; using a patterning process to form a plurality of concave structures on the surface of the base film material layer ; A first reflective layer is formed on the concave structure.
  • the providing the second substrate includes: providing the second substrate; patterning and forming the light-emitting unit and the isolation layer on the second substrate, and the light-emitting unit includes sequentially formed on the second substrate.
  • the projection is located within the orthographic projection range of the isolation layer on the second substrate.
  • the aligning the first substrate and the second substrate includes: aligning the supporting layer of the second substrate with the planar structure of the first substrate by using a vacuum aligning method, so The planar structure is located on the surface of the base film layer close to the second substrate and between the concave mirror structures.
  • FIG. 1 shows a schematic cross-sectional structure diagram of a display panel provided by an embodiment of the present application
  • FIG. 2 shows a schematic cross-sectional structure diagram of a first substrate provided by an embodiment of the present application
  • FIG. 3 shows a schematic cross-sectional structure diagram of a second substrate provided by an embodiment of the present application
  • FIG. 4 shows an optical path diagram of parallel light generated by a concave mirror structure provided by an embodiment of the present application
  • FIG. 5 is a schematic top view of a concave mirror structure, a supporting layer and a light-emitting unit in an embodiment of the application;
  • 6A is a schematic top view of the anode layer of the light-emitting unit in an embodiment of the application.
  • Figure 6B is a schematic cross-sectional view taken along line A-A in Figure 6A;
  • Figure 6C is a schematic cross-sectional view taken along line B-B in Figure 6A;
  • FIG. 7 shows a step flow chart of a method for manufacturing a display panel provided by an embodiment of the present application
  • FIG. 8 is a schematic diagram of forming a base film material layer on the first substrate in the preparation method provided by an embodiment of the application.
  • the display panel includes a first substrate 10 and a second substrate 11 disposed oppositely.
  • the first substrate 10 includes a first substrate 101 and a base film layer 102 disposed on a side of the first substrate 101 close to the second substrate 11.
  • the first substrate 101 has an upper side and a lower side, the upper side is closer to the second substrate 11 than the lower side, and the base film layer 102 is located on the upper side of the first substrate 101, so that the base film layer 102 Located between the first substrate 101 and the second substrate 11.
  • the surface 1021 of the base film layer 102 on the side close to the second substrate 11 has a plurality of concave mirror structures 103.
  • the base film layer 102 has a surface facing the first substrate 101 and a surface 1021 facing away from the first substrate 101, and the surface 1021 is closer to the second substrate 11 than the surface facing the first substrate 101, and The surface 1021 has a plurality of concave mirror structures 103.
  • the second substrate 11 includes a second substrate 111 and a plurality of light emitting units 112 arranged on a side of the second substrate 111 close to the first substrate 10.
  • the second substrate 111 has an upper side and a lower side. The lower side is closer to the first substrate 10 than the upper side, and the light emitting unit 112 is located on the lower side of the second substrate 111, so that the light emitting unit 112 is located on the second substrate. Between the second substrate 111 and the first substrate 10. Each light emitting unit 112 is located at the focal point of the corresponding concave mirror structure 103. For example, as shown in FIGS.
  • the light-emitting unit 112 corresponds to the concave mirror structure 103 one-to-one, that is, the orthographic projection of each light-emitting unit 112 on the first substrate 101 is located on only one concave mirror structure 103 In the orthographic projection on the first substrate 101, and the orthographic projection of each concave mirror structure 103 has only the orthographic projection of one light-emitting unit 112; the focal point of each concave mirror structure 103 is located at the corresponding light-emitting unit of the concave mirror structure 103 112 is in the area.
  • the multiple light-emitting units 112 in the display panel are arranged in multiple rows and multiple columns, for example, and FIG. 5 only uses two light-emitting units 112 located in the same row as an example for description.
  • the concave mirror structure 103 is recessed from the upper surface 1021 of the base film layer 102 (that is, the surface of the base film layer 102 away from the first substrate 101) to the first substrate 101, that is, the concave mirror structure 103 has a top 1031 and a bottom.
  • the distance from the top end 1032 to the first substrate 101 is greater than the distance from the bottom end 1032 to the first substrate 101, and the bottom end 1032 is perpendicular to the upper surface of the first substrate 101 (that is, the surface facing the first substrate 101).
  • the surface of the base film layer 102) is located between the top end 1031 and the first substrate 101 in the direction.
  • the concave mirror structure 103 has a focal point (as shown at point A in FIG. 2), the surface of the concave mirror structure 103 facing the corresponding light-emitting unit 112 is a concave surface and a reflective surface, and the focal point of the concave mirror structure 103 is the concave mirror structure 103 The focal point facing the surface of the corresponding light emitting unit 112.
  • the concave mirror structure 103 reflects the incident light from the corresponding light-emitting unit 112 and incident on the concave mirror structure 103.
  • the parallel light When the parallel light is irradiated on the concave mirror structure 103, the parallel light is reflected by the concave mirror structure 103 and collected on the focal point in front of the concave mirror structure 103; based on this principle, when the light-emitting unit 112 is at the focal point, the light-emitting unit 112 emits After being reflected by the concave mirror structure 103, the light beams formed parallel beams, as shown in FIGS. 1 and 4.
  • the light emitting unit 112 may include an OLED (Organic Light-Emitting Diode) structure or an LED (Light-Emitting Diode) structure or the like.
  • OLED Organic Light-Emitting Diode
  • LED Light-Emitting Diode
  • the size of the light emitting unit 112 is smaller than the size of the corresponding concave mirror structure 103.
  • the size of each light emitting unit 112 in a direction parallel to the upper surface of the first substrate 101 is equal to the size of the corresponding concave mirror structure 103 in this direction.
  • the size ratio is less than 1.
  • the ratio of the size of each light-emitting unit 112 to the size of the corresponding concave mirror structure 103 ranges from 1/5 to 1/3.
  • the size of the light emitting unit 112 along this direction is 10 ⁇ m-50 ⁇ m, and the size of the curved mirror structure 103 along this direction is 30 ⁇ m-300 ⁇ m.
  • the light emitting unit 112 may be Micro LED or Mini LED to have a smaller size.
  • the parallel beam formed by the light emitted by the light-emitting unit 112 after being reflected by the concave mirror structure 103 can have better directivity.
  • the display panel does not include light-shielding materials such as a black matrix between adjacent light-emitting units 112 to prevent crosstalk between adjacent light-emitting units 112.
  • the first substrate 101 and the second substrate 111 may be transparent substrates, such as glass substrates, quartz substrates, or plastic substrates.
  • the first substrate 101 and the second substrate 111 may be flexible substrates.
  • the material of the base film layer 102 may be a resin (Resin) material or the like.
  • a display panel has a plurality of pixel units, for example, the plurality of pixel units are arranged in multiple rows and multiple columns, each pixel unit may include a concave mirror structure 103 and a light-emitting unit 112, and the light-emitting unit 112 and the concave mirror structure 103 are one One correspondence.
  • the multiple light-emitting units 112 in the display panel can emit light of different colors, such as red light R, green light G, and blue light B. Since the multiple light emitting units 112 can emit light of different colors, the display panel does not need to include a color filter layer to achieve color display.
  • the display panel provided by at least one embodiment of the present application may further include a control unit, which is connected to the light-emitting unit 112 and used to control the brightness of the light-emitting unit 112 of each pixel unit.
  • a control unit which is connected to the light-emitting unit 112 and used to control the brightness of the light-emitting unit 112 of each pixel unit.
  • the light emitting unit is placed at the focal point of the concave mirror structure, and the light emitted by the light emitting unit is reflected by the concave mirror structure to form a parallel beam.
  • the display panel With this display panel, only users standing in front of the screen The content of the screen can be seen, and people who observe from a non-orthogonal perspective cannot see the content of the screen, which can effectively prevent the leakage of confidential information and realize the anti-peep function of the display device.
  • the incident light passing through the focal point of the concave mirror structure becomes parallel light parallel to the main axis of the concave mirror structure after being reflected. Since the concave mirror structure adopted in the embodiment of the present application is reflective imaging, there is no chromatic aberration.
  • each concave mirror structure 103 may include a surface 1021 disposed on the side of the base film layer 102 close to the second substrate 11 (that is, the surface of the base film layer 102 facing the second substrate 11, which is also the second surface of the base film layer 102 away from the second substrate 11).
  • the surface of a substrate 101 has a concave structure 201 and a first reflective layer 202 disposed on the surface of the concave structure 201.
  • the surface of the first reflective layer 202 facing away from the concave structure 201 is a concave and reflective surface, that is, the first reflective layer 202
  • the surface of the corresponding light emitting unit 112 is a concave surface and a reflective surface.
  • the first reflective layer 202 directly contacts the concave structure 201, so that the first reflective layer 202 has a concave shape consistent with the concave structure 201, that is, the surface of the first reflective layer 202 facing the concave structure 201 and the concave structure 201 facing the first
  • the surface of the reflective layer 202 is a concave surface with the same shape (including size and contour).
  • the above-mentioned surface of the concave mirror structure 103 facing the light-emitting unit 112 is a concave spherical surface or a concave paraboloid.
  • the concave structure 201 may be a concave spherical structure or a concave parabolic structure.
  • the surface of the first reflective layer 202 facing the light emitting unit 112 is Concave spherical structure or concave parabolic structure.
  • the parallel incident light may not be well converged on a single focal point after being reflected, and the light emitted by the light-emitting unit 112 at the focal point may be reflected after being reflected.
  • Light rays with good parallelism cannot be obtained.
  • a concave parabolic structure can achieve better results.
  • the concave structure 201 is a partial surface of the base film layer 102.
  • the surface 1021 of the base film layer 102 facing away from the first substrate 101 has a concave structure 201 and a planar structure 1021A located between adjacent concave structures 201 (as shown in FIGS. 1 and 2 ).
  • the concave structure 201 is formed by etching a film for forming the base film layer 102.
  • the material of the first reflective layer 202 may be a metal material with a light-reflecting function, such as aluminum (Al) or silver (Ag).
  • the light-emitting unit 112 is of a bottom emission type, that is, the side of the light-emitting unit 112 facing the first substrate 101 emits light, and the side of the light-emitting unit 112 facing away from the first substrate 101 does not emit light.
  • the light-emitting unit 112 includes an anode layer and a cathode layer 112B.
  • the anode layer is located between the cathode layer 112B and the first substrate in a direction perpendicular to the aforementioned surface of the first substrate 101 (as shown in FIG. 1). Between bottom 101.
  • the cathode layer 112B is a reflective layer (for example, the reflective layer is made of an opaque metal material) to realize the bottom emission of the light emitting unit 112.
  • the anode layer has a hollow portion 112L, the hollow portion 112L penetrates the anode layer, and the portion of the anode layer located at the periphery of the hollow portion 112L is electrically connected at the edge of the anode layer (as shown in FIG. 6B). Show).
  • the hollow portion 112L it is advantageous for the light emitted by the light-emitting unit 112 to be irradiated on the lower first substrate as much as possible.
  • the anode layer may be made of an opaque metal material to reduce electrical resistance.
  • each light-emitting unit 112 may include a second reflective layer 112B and a light-emitting layer 112C that are stacked, and the second reflective layer 112B is close to the second The substrate 111 is disposed, that is, the second reflective layer 112B is closer to the second substrate 111 than the light emitting layer 112C.
  • the material of the second reflective layer 112B may be a metal material with a light reflection function, such as aluminum Al, silver and Ag.
  • the light-emitting unit 112 has a Micro LED structure.
  • the Micro LED structure adopts an AlGaInP LED structure.
  • the light emitting layer 112C includes a stacked GaAs substrate layer 1124, an n-AlGaInP layer 1123, an i-AlGaInP layer 1122, a P-AlGaInP layer 1121, and an anode layer ANL.
  • the second reflective layer 112B is multiplexed as a cathode layer, and a GaAs substrate layer It is arranged close to the second reflective layer, that is, the GaAs substrate layer is closer to the second reflective layer 112B than other layers included in the light-emitting layer 112C.
  • the second reflective layer 112B included in the multiple light-emitting units 112 may be directly connected, that is, the multiple light-emitting units 112 share the second reflective layer 112B.
  • the second substrate 11 may also include an isolation layer 119 disposed on the side of the second substrate 111 close to the first substrate 10 (as shown in FIG. 1), that is, the isolation layer 119 is located on the second substrate 111. Between the first substrate 10 and the first substrate 10, an isolation layer 119 is provided between the light emitting units 112 to space adjacent light emitting units 112 from each other.
  • the second substrate 11 further includes a protective layer 118 disposed on the side of the light emitting unit 112 and the isolation layer 119 facing the first substrate 10 (that is, the light emitting unit 112 and the isolation layer 119 are located between the protective layer 118 and the second substrate 111 ), and the support layer 117 provided on the protective layer 118 (that is, the support layer 117 is located between the protective layer 118 and the first substrate 10), the orthographic projection of the support layer 117 on the second substrate 111 is located on the isolation layer 119 in the first Within the orthographic projection range on the second substrate 111.
  • the support layer 117 is opaque to reduce crosstalk between the lights emitted by adjacent light emitting units 112.
  • the surface 1021 of the base film layer 102 on the side close to the second substrate 11 also has a planar structure, the planar structure is located between the concave mirror structures 103, and the planar structure is attached to the support layer 117.
  • the supporting layer 117 abuts on the planar structure, and the orthographic projection of the supporting layer 117 on the planar structure does not exceed the area where the planar structure is located, so that the signal line can be arranged at the position of the planar structure 117 where the supporting layer 117 is not provided,
  • the support layer 117 By providing the support layer 117, it is beneficial to avoid the situation that foreign matter such as particles in the concave mirror structure 103 damage the reflective surface of the concave mirror structure 103 when the second substrate 11 is pressed.
  • the focus of the concave mirror structure 103 can be located in the area where the light emitting unit 112 is located by adjusting the height of the support layer 117.
  • the layer 12 between the concave mirror structure 103 and the second substrate 11 may be a gas layer, such as an air layer.
  • the first substrate 10 and the second substrate 11 can be manufactured separately, and then the first substrate 10 and the second substrate 11 can be vacuum boxed to manufacture the display panel.
  • the layer 12 between the concave mirror structure 103 and the second substrate 11 may be a transparent resin layer.
  • a transparent resin layer By filling the concave mirror structure 103 with a transparent resin, foreign matter such as particles can be prevented from appearing in the concave mirror structure 103, thereby helping to prevent the reflective surface of the concave mirror structure 103 from being damaged.
  • the light emitting unit 112 can be fabricated on the transparent resin layer, so that the first substrate 10 and the second substrate 11 do not need to be vacuum boxed to simplify the fabrication process.
  • the display panel provided by at least another embodiment of the present application includes a first substrate 101, a base film layer 102 disposed on the first substrate 101, and a base film layer 102 disposed on the base film layer 102 facing away from the first substrate.
  • the surface 1021 of the base film layer 102 facing away from the first substrate 101 has a plurality of concave mirror structures 103 which are concave toward the first substrate 101.
  • the multiple light-emitting units 112 correspond to the multiple concave mirror structures 103 one-to-one, and each light-emitting unit 103 is located at the focal position of the corresponding concave mirror structure 103, and the surface of the concave mirror structure 103 facing the corresponding light-emitting unit 112 is concave and For the reflective surface.
  • the setting manner of each component in the display panel is the same as the setting manner of the same component in any of the above embodiments, and the repetition is not repeated here.
  • At least another embodiment of the present application provides a display device including the display panel described in any of the above embodiments.
  • the display device in the embodiment of the present application may be any product or component with display function, such as a display panel, electronic paper, mobile phone, tablet computer, television, notebook computer, digital photo frame, navigator, etc.
  • the embodiment of the present application provides a manufacturing method of a display panel.
  • the manufacturing method includes the following steps 501 to 503.
  • Step 501 Provide a first substrate.
  • the first substrate includes a first substrate and a base film layer disposed on the side of the first substrate close to the second substrate.
  • the surface of the base film layer close to the second substrate has a plurality of concave mirrors. structure.
  • this step 501 may include: as shown in FIG. 8, providing a first substrate 101; as shown in FIG. 8, forming a base film material layer 1020 on the first substrate 101; Process, the surface 102A of the base film material layer 1020 (the surface 102A is the surface of the base film material layer 1020 away from the first substrate 101) is formed with a plurality of concave structures 201 to obtain a base film layer having the plurality of concave structures 201 102, as shown in FIGS. 1 and 2; a first reflective layer 201 is formed on the concave structure 201, as shown in FIGS. 1 and 2.
  • the first substrate 101 (such as a glass substrate) may be coated with a material (such as resin (Resin)) for forming the base film material layer 1020, and the material may be manufactured by a series of patterning processes such as exposure and etching.
  • the concave structure 201 is formed; then a first reflective layer 202 is formed in the concave structure 201 by evaporation or sputtering (Sputter) to obtain the first substrate 10.
  • Step 502 Provide a second substrate.
  • the second substrate includes a second substrate and a plurality of light emitting units arranged on a side of the second substrate close to the first substrate.
  • this step 502 may include: as shown in FIG. 3, providing a second substrate 111; forming a light emitting unit 112 and an isolation layer 119 on the second substrate 111 through a patterning process, and the light emitting unit 112 includes a second reflective layer 112B and a light emitting layer 112C sequentially formed on the second substrate 111; a protective layer 118 is formed on the side of the light emitting unit 112 and the isolation layer 119 away from the second substrate 111; on the protective layer 118 The support layer 117 is formed, and the orthographic projection of the support layer 117 on the second substrate 111 is within the orthographic projection range of the isolation layer 119 on the second substrate 111.
  • the patterning process refers to a process of processing the film layer to obtain a patterned film structure.
  • the embodiments of the present disclosure do not limit the specific type of the patterning process.
  • the light-emitting unit 112 can be manufactured by a wet etching method.
  • a plurality of light emitting units 112 in the display panel are arranged in an array, and the array is an LED array with a micron structure.
  • Step 503 align the first substrate and the second substrate so that each light-emitting unit is located at the focal position of the corresponding concave mirror structure.
  • a vacuum boxing method can be used to attach the support layer 117 of the second substrate 11 to the planar structure of the first substrate 10.
  • the planar structure is located on the surface of the base film layer 102 near the second substrate 11 and located on the concave mirror. Between structure 103.
  • the first substrate 10 provided in step 501 and the second substrate 11 provided in step 502 are bonded together by using a vacuum box.
  • the light-emitting unit 112 (such as Micro LED) is located at the focal position of the concave mirror structure 103.
  • the light emitted by the light-emitting unit 112 (such as Micro LED) is reflected by the concave mirror structure 103 and then becomes parallel light, and no light is directed to the peripheral position.
  • this display panel only the user directly in front of the display panel can see the screen content, which can prevent peeping.
  • the manufacturing method of the display panel provided by the embodiment of the application is to fabricate a concave mirror structure 103 on a first substrate 101, fabricate a light-emitting unit 112 on a second substrate 111, and place the light-emitting unit 112 on the concave mirror structure 103. At the focus position. By placing the light-emitting unit 112 at the focal point of the concave mirror structure 103, the light emitted by the light-emitting unit 112 will form a parallel beam after being reflected by the concave mirror structure 103. With this display panel, only users standing in front of the screen can see the screen Content, people who observe from a non-orthogonal perspective cannot see the screen content, which can effectively prevent the leakage of confidential information and realize the anti-peeping of the display device.
  • step 501 and step 502 can be interchanged.

Abstract

一种显示面板的制备方法、显示面板及显示装置，该显示面板包括相对设置的第一基板(10)和第二基板(11)；第一基板(10)包括第一衬底(101)以及设置在第一衬底(101)靠近第二基板(11)一侧的基膜层(102)，基膜层(102)靠近第二基板(11)一侧的表面具有多个凹面镜结构(103)，第二基板(11)包括第二衬底(111)以及设置在第二衬底(111)靠近第一基板(10)一侧的多个发光单元(112)，各发光单元(112)位于相应的凹面镜结构(103)的焦点位置处。该显示面板可以实现显示设备的防窥。

Description

显示面板的制备方法、显示面板及显示装置
对相关申请的交叉参考
本申请要求于2019年05月31日递交的中国专利申请第201910472073.3号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开实施例涉及一种显示面板的制备方法、显示面板及显示装置。
背景技术
手机、PAD、TV等显示设备多采用宽视角屏，极少厂商加入防窥相关技术，这无法满足用户的隐私需求，信息泄露事件近年频增。随着企业、个人保密防护意识的增强，对显示设备的防窥技术有了极大的市场需求。
例如在日程生活中，取款机为人们提供了诸多便利。在取款时，防止取款账号、密码等泄露是非常重要的。现有取款机采用的显示屏无法做到非正视角观察的人员完全看不到屏幕画面，有造成取款人保密信息泄露的风险。
发明内容
本公开实施例公开了一种显示面板，所述显示面板包括：相对设置的第一基板和第二基板；所述第一基板包括第一衬底以及设置在所述第一衬底靠近所述第二基板一侧的基膜层，所述基膜层靠近所述第二基板一侧的表面具有多个凹面镜结构，所述第二基板包括第二衬底以及设置在所述第二衬底靠近所述第一基板一侧的多个发光单元，各所述发光单元位于相应的凹面镜结构的焦点位置处。
例如，每个发光单元在所述第一衬底上的正投影都位于一个凹面镜结构在所述第一衬底上的正投影内。
例如，每个发光单元在平行于所述第一衬底的方向上的尺寸与相应的凹面镜结构在所述方向上的尺寸之比小于1。
例如，每个发光单元的所述尺寸与相应的凹面镜结构的所述尺寸之比的范围为1/5～1/3。
例如，所述凹面镜结构的面向所述发光单元的表面为凹面且为反射面。
例如，所述凹面镜结构的面向所述发光单元的所述表面为凹球面或凹抛物面。
例如，各所述凹面镜结构包括设置在所述基膜层靠近所述第二基板一侧表面的凹面结构以及设置在所述凹面结构表面的第一反射层。
例如，所述第一反射层的背离所述凹面结构的表面为凹面且为反射面。
例如，所述凹面结构为凹球面结构或凹抛物面结构。
例如，所述多个凹面镜结构与所述第二基板之间为气体层或透明树脂层。
例如，各所述发光单元包括层叠设置的第二反射层和发光层，所述第二反射层靠近所述第二衬底设置。
例如，所述发光层包括层叠设置的GaAs衬底层、n-AlGaInP层、i-AlGaInP层、P-AlGaInP层和阳极层，所述第二反射层复用为阴极层，所述GaAs衬底层靠近所述第二反射层设置。
例如，所述发光单元包括阳极层和阴极层，所述阳极层位于所述阴极层与所述第一衬底之间，并且所述阳极层具有镂空部。
例如，所述第二基板还包括设置在所述第二衬底靠近所述第一基板一侧的隔离层，所述隔离层设置在所述发光单元之间；所述第二基板还包括设置在所述发光单元和所述隔离层上的保护层、以及设置在所述保护层上的支撑层，所述支撑层在所述第二衬底上的正投影位于所述隔离层在所述第二衬底上的正投影范围内。
例如，所述基膜层靠近所述第二基板一侧的表面还具有平面结构，所述平面结构位于所述凹面镜结构之间，所述平面结构与所述支撑层相贴合。
本公开实施例还提供一种显示面板，包括：第一衬底；设置在所述第一衬底上的基膜层，其中，所述基膜层的背离所述第一衬底的表面具有多个凹面镜结构，所述多个凹面镜结构凹向所述第一衬底；设置在所述基膜层背离所述第一衬底一侧的多个发光单元，其中，所述多个发光单元与所述多个凹面镜结构一一对应，各所述发光单元位于相应的凹面镜结构的焦点位置处，并且所述凹面镜结构的面向所述发光单元的表面为凹向所述第一衬底的凹面 且为反射面。
本公开实施例还公开了一种显示装置，所述显示装置包括任一实施例所述的显示面板。
本公开实施例还公开了一种显示面板的制备方法，所述制备方法包括：提供第一基板，所述第一基板包括第一衬底以及设置在所述第一衬底靠近所述第二基板一侧的基膜层，所述基膜层靠近所述第二基板一侧的表面具有多个凹面镜结构；提供第二基板，所述第二基板包括第二衬底以及设置在所述第二衬底靠近所述第一基板一侧的多个发光单元；将所述第一基板和所述第二基板进行对盒，使各所述发光单元位于相应的凹面镜结构的焦点位置处。
例如，所述提供第一基板包括：提供所述第一衬底；在所述第一衬底上形成基膜材料层；采用构图工艺，在所述基膜材料层的表面形成多个凹面结构；在所述凹面结构上形成第一反射层。
例如，所述提供第二基板包括：提供所述第二衬底；在所述第二衬底上图案化形成所述发光单元和隔离层，所述发光单元包括依次形成在所述第二衬底上的第二反射层和发光层；在所述发光单元和所述隔离层上形成保护层；在所述保护层上形成支撑层，所述支撑层在所述第二衬底上的正投影位于所述隔离层在所述第二衬底上的正投影范围内。所述将所述第一基板和所述第二基板进行对盒包括：采用真空对盒方式，将所述第二基板的所述支撑层与所述第一基板的平面结构相贴合，所述平面结构位于所述基膜层靠近所述第二基板一侧的表面且位于所述凹面镜结构之间。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本公开的一些实施例，而非对本公开的限制。
图1示出了本申请实施例提供的一种显示面板的剖面结构示意图；
图2示出了本申请实施例提供的一种第一基板的剖面结构示意图；
图3示出了本申请实施例提供的一种第二基板的剖面结构示意图；
图4示出了本申请实施例提供的一种凹面镜结构产生平行光的光路图；
图5为本申请实施例中凹面镜结构、支撑层和发光单元的俯视示意图；
图6A为本申请实施例中发光单元的阳极层的俯视示意图；
图6B为沿图6A中A-A线的剖视示意图；
图6C为沿图6A中B-B线的剖视示意图；
图7示出了本申请实施例提供的一种显示面板的制备方法的步骤流程图；
图8为本申请实施例提供的制备方法中在第一衬底上形成基膜材料层的示意图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
本申请至少一实施例提供了一种显示面板，参照图1，该显示面板包括相对设置的第一基板10和第二基板11。
第一基板10包括第一衬底101以及设置在第一衬底101靠近第二基板11一侧的基膜层102。如图1所示，第一衬底101具有上侧和下侧，上侧比下侧更靠近第二基板11，并且基膜层102位于第一衬底101的上侧，从而基膜层102位于第一衬底101与第二基板11之间。基膜层102靠近第二基板11一侧的表面1021具有多个凹面镜结构103。也就是说，基膜层102具有面 向第一衬底101的表面以及背离第一衬底101的表面1021，该表面1021比所述面向第一衬底101的表面更靠近第二基板11，并且该表面1021具有多个凹面镜结构103。
第二基板11包括第二衬底111以及设置在第二衬底111靠近第一基板10一侧的多个发光单元112。如图1所示，第二衬底111具有上侧和下侧，下侧比上侧更靠近第一基板10，并且发光单元112位于第二衬底111的下侧，从而发光单元112位于第二衬底111与第一基板10之间。各发光单元112位于相应的凹面镜结构103的焦点位置处。例如，如图1和图5所示，发光单元112与凹面镜结构103一一对应，也就是说，每个发光单元112在第一衬底101上的正投影都只位于一个凹面镜结构103在第一衬底101上的正投影内，并且每个凹面镜结构103的正投影都只有一个发光单元112的正投影；每个凹面镜结构103的焦点位于该凹面镜结构103对应的发光单元112所在的区域中。需要说明的是，显示面板中的多个发光单元112例如排列成多行多列，图5仅以位于同一行中的两个发光单元112为例进行说明。
凹面镜结构103从基膜层102的上表面1021(即基膜层102的背离第一衬底101的表面)凹向第一衬底101，也就是说，凹面镜结构103具有顶端1031和底端1032，顶端1031到第一衬底101的距离大于底端1032到第一衬底101的距离，并且底端1032在垂直于第一衬底101的上表面(即第一衬底101的面向基膜层102的表面)的方向上位于顶端1031和第一衬底101之间。
凹面镜结构103具有焦点(如图2中的A点所示)，凹面镜结构103的面向对应的发光单元112的表面为凹面且为反射面，并且凹面镜结构103的焦点为凹面镜结构103的面向对应的发光单元112的所述表面的焦点。凹面镜结构103对来自相应的发光单元112且入射到该凹面镜结构103的入射光线起反射作用。当平行光线照射到凹面镜结构103上时，该平行光线通过凹面镜结构103反射而聚在凹面镜结构103前的焦点上；基于该原理，当发光单元112位于焦点上时，发光单元112发出的光经凹面镜结构103反射后形成平行光束，如图1和图4所示。
例如，发光单元112可以包括OLED(有机发光二极管，Organic Light-Emitting Diode)结构或LED(发光二极管)结构等。
例如，为了使发光单元112发出的尽可能多地被凹面镜结构103反射， 发光单元112的尺寸小于相应的凹面镜结构103的尺寸。例如，如图1所示，每个发光单元112在平行于第一衬底101的上表面的方向(即图1中的水平方向)上的尺寸与相应的凹面镜结构103在该方向上的尺寸之比小于1。优选为，每个发光单元112的所述尺寸与相应的凹面镜结构103的所述尺寸之比的范围为1/5～1/3。例如，发光单元112沿该方向的尺寸为10μm-50μm，曲面镜结构103沿该方向的尺寸为30μm-300μm。例如，发光单元112可以为Micro LED或者Mini LED，以具有较小的尺寸。
在一些实施例中，通过控制发光单元112的尺寸与凹面镜结构的尺寸之比，可以使发光单元112发出的光被凹面镜结构103反射后形成的平行光束具有较好的方向性，在这种情况下，显示面板不包括位于相邻发光单元112之间的例如黑矩阵等遮光材料即可实现防止相邻发光单元112之间的串扰。
例如，第一衬底101和第二衬底111可以为透明衬底，例如玻璃衬底、石英衬底或者塑料衬底等。例如，第一衬底101和第二衬底111可以为柔性衬底。
例如，基膜层102的材料可以为树脂(Resin)材料等。
例如，显示面板具备多个像素单元，例如该多个像素单元排列成多行和多列，每个像素单元可以包括一个凹面镜结构103和一个发光单元112，发光单元112与凹面镜结构103一一对应。
例如，显示面板中的多个发光单元112可以出射不同颜色的光线，如红光R、绿光G以及蓝光B等。由于该多个发光单元112本身可以出射不同颜色的光线，因此显示面板无需包括彩色滤光层即可实现彩色显示。
例如，本申请至少一个实施例提供的显示面板还可以包括控制单元，控制单元与发光单元112连接，并且用于控制各像素单元的发光单元112的出光亮度等。
本申请实施例提供的显示面板，通过在凹面镜结构的焦点处放置发光单元，发光单元发出的光经凹面镜结构反射后形成平行光束，采用这种显示面板，只有站在屏幕正前方的用户可以看到屏幕内容，非正视角观察的人员无法看到屏幕内容，从而可以有效防止保密信息泄露，实现显示设备的防窥功能。经过凹面镜结构的焦点的入射光线经反射后成为平行于凹面镜结构的主轴的平行光，由于本申请实施例采用的凹面镜结构是反射成像，因此不会出 现色差。
参照图2，各凹面镜结构103可以包括设置在基膜层102靠近第二基板11一侧表面1021(即基膜层102的面向第二基板11的表面，也为基膜层102的背离第一衬底101的表面)的凹面结构201以及设置在凹面结构201表面的第一反射层202，第一反射层202的背离凹面结构201的表面为凹面且为反射面，即第一反射层202的面向相应地发光单元112的表面为凹面且为反射面。例如，第一反射层202直接接触凹面结构201，从而第一反射层202具有与凹面结构201一致的凹面形状，即第一反射层202的面向凹面结构201的表面与凹面结构201的面向第一反射层202的表面为形状(包括大小和轮廓)相同的凹面。
例如，凹面镜结构103的面向发光单元112的上述表面为凹球面或凹抛物面。例如，在凹面镜结构103包括凹面结构201和第一反射层202的情况下，凹面结构201可以为凹球面结构或凹抛物面结构，相应地，第一反射层202的面向发光单元112的表面为凹球面结构或凹抛物面结构。考虑到采用凹球面结构容易产生球面像差，如平行的入射光线经反射后在一些情况下可能不能较好地汇聚在单一的焦点上，焦点位置处的发光单元112发出的光线经反射后可能不能得到平行性较好的光线，在实际应用中，例如，采用凹抛物面结构可以获得更好的效果。
例如，凹面结构201为基膜层102的部分表面。例如，基膜层102的背离第一衬底101的表面1021具有凹面结构201以及位于相邻凹面结构201之间的平面结构1021A(如图1和图2所示)。在这种情况下，例如，凹面结构201通过对用于形成基膜层102的膜进行刻蚀形成。
例如，第一反射层202的材料可以为铝(Al)或银(Ag)等具有反光功能的金属材料。
例如，发光单元112为底发光型，即发光单元112的面向第一衬底101的一侧发光，并且发光单元112的背离第一衬底101的一侧不发光。例如，如图3所示，发光单元112包括阳极层和阴极层112B，阳极层在垂直于第一衬底101(如图1所示)的上述表面的方向上位于阴极层112B与第一衬底101之间。例如，阴极层112B为反射层(例如，该反射层采用不透明的金属材料制作)，以实现发光单元112的底发光。例如，如图3和图6A-6C所示， 阳极层具有镂空部112L，镂空部112L贯穿阳极层，阳极层的位于镂空部112L周边的部分在阳极层的边缘处电连接(如图6B所示)。通过设置镂空部112L，有利于发光单元112发出的光尽可能多地照射到下方的第一基板上。由于阳极层具有允许光通过的镂空部112L，在至少一个实施例中，阳极层可以采用不透明的金属材料制作，以减小电阻。
参照图3，为了避免发光单元112发出的光线不经过凹面镜结构103直接出射，例如，各发光单元112可以包括层叠设置的第二反射层112B和发光层112C，第二反射层112B靠近第二衬底111设置，也就是说，第二反射层112B比发光层112C更靠近第二衬底111。这样，发光层112C出射的光线一部分向下传输，直接入射到凹面镜结构103上，一部分向上传输，经第二反射层112B反射到凹面镜结构103上，确保显示面板出射的光线都经过凹面镜结构103的反射。
例如，第二反射层112B的材料可以为铝Al、银Ag等具有反光功能的金属材料。
例如，在一种实现方式中，参照图3，发光单元112为Micro LED结构。例如，该Micro LED结构采用AlGaInP LED结构。例如，发光层112C包括层叠设置的GaAs衬底层1124、n-AlGaInP层1123、i-AlGaInP层1122、P-AlGaInP层1121和阳极层ANL，第二反射层112B复用为阴极层，GaAs衬底层靠近第二反射层设置，即GaAs衬底层比发光层112C包括的其它层更靠近第二反射层112B。例如，在一些实施例中，多个发光单元112包括的第二反射层112B可以直接连接，即该多个发光单元112共用第二反射层112B。
在实际应用中，例如，第二基板11还可以包括设置在第二衬底111靠近第一基板10(如图1所示)一侧的隔离层119，即隔离层119位于第二衬底111与第一基板10之间，隔离层119设置在发光单元112之间以使相邻的发光单元112彼此间隔开。例如，第二基板11还包括设置在发光单元112和隔离层119的面向第一基板10一侧的保护层118(即发光单元112和隔离层119位于保护层118与第二衬底111之间)，以及设置在保护层118上的支撑层117(即支撑层117位于保护层118与第一基板10之间)，支撑层117在第二衬底111上的正投影位于隔离层119在第二衬底111上的正投影范围内。
例如，支撑层117是不透光的，以减小相邻发光单元112发出的光之间 的串扰。
例如，如图1和图2所示，基膜层102靠近第二基板11一侧的表面1021还具有平面结构，平面结构位于凹面镜结构103之间，平面结构与支撑层117相贴合。例如，支撑层117抵靠在平面结构上，并且支撑层117在平面结构上的正投影不超过平面结构所在的区域，从而可以在平面结构117的未设置支撑层117的位置处设置信号线，例如与发光单元112电连接的栅线或数据线等。通过设置支撑层117，有利于避免第二基板11被按压时出现凹面镜结构103中的颗粒等异物损坏凹面镜结构103的反射面的情况。另一方面，通过设置支撑层107，可以通过调整支撑层117的高度来实现使凹面镜结构103的焦点位于发光单元112所在的区域中。
例如，凹面镜结构103与第二基板11之间的层12可以为气体层，例如空气层。在这种情况下，例如，可以通过分别制作第一基板10和第二基板11，然后将第一基板10与第二基板11真空对盒的方式来制作显示面板。
例如，凹面镜结构103与第二基板11之间的层12可以透明树脂层。通过在凹面镜结构103中填充透明树脂，可以避免凹面镜结构103中出现颗粒等异物，从而有利于避免凹面镜结构103的反射面被损坏。另一方面，在一些实施例中，通过设置透明树脂层，可以实现在透明树脂层上制作发光单元112，从而无需进行第一基板10和第二基板11的真空对盒，以简化制作工艺。
如图1所示，本申请至少另一实施例提供的显示面板包括第一衬底101、设置在第一衬底101上的基膜层102、以及设置在基膜层102背离第一衬底101一侧的多个发光单元112。基膜层102的背离第一衬底101的表面1021具有多个凹面镜结构103，该多个凹面镜结构103凹向第一衬底101。该多个发光单元112与多个凹面镜结构103一一对应，各发光单元103位于相应的凹面镜结构103的焦点位置处，并且凹面镜结构103的面向对应的发光单元112的表面为凹面且为反射面。该显示面板中各部件的设置方式与以上任一实施例中相同部件的设置方式相同，重复之处这里不再赘述。
本申请至少另一实施例提供了一种显示装置，该显示装置包括以上任一实施例所述的显示面板。
需要说明的是，本申请实施例中的显示装置可以为：显示面板、电子纸、手机、平板电脑、电视机、笔记本电脑、数码相框、导航仪等任何具有显示 功能的产品或部件。
本申请实施例提供了一种显示面板的制备方法，参照图7，该制备方法包括以下步骤501至503。
步骤501：提供第一基板，第一基板包括第一衬底以及设置在第一衬底靠近第二基板一侧的基膜层，基膜层靠近第二基板一侧的表面具有多个凹面镜结构。
例如，在一种实现方式中，该步骤501可以包括：如图8所示，提供第一衬底101；如图8所示，在第一衬底101上形成基膜材料层1020；采用构图工艺，使基膜材料层1020的表面102A(该表面102A为基膜材料层1020的背离第一衬底101的表面)形成多个凹面结构201从而得到具有该多个凹面结构201的基膜层102，如图1和图2所示；在凹面结构201上形成第一反射层201，如图1和图2所示。
例如，可以在第一衬底101(如玻璃基板)上涂覆用于形成基膜材料层1020的材料(如树脂(Resin))，通过对该材料进行曝光、刻蚀等一系列构图工艺制作出凹面结构201；再通过蒸镀或溅射(Sputter)方式在凹面结构201内制作第一反射层202，得到第一基板10。
步骤502：提供第二基板，第二基板包括第二衬底以及设置在第二衬底靠近第一基板一侧的多个发光单元。
例如，在一种实现方式中，该步骤502可以包括：如图3所示，提供第二衬底111；在第二衬底111上通过图案化工艺形成发光单元112和隔离层119，发光单元112包括依次形成在第二衬底111上的第二反射层112B和发光层112C；在发光单元112和隔离层119的背离第二衬底111的一侧形成保护层118；在保护层118上形成支撑层117，支撑层117在第二衬底111上的正投影位于隔离层119在第二衬底111上的正投影范围内。
需要说明的是，图案化工艺是指对膜层进行处理以得到图案化的膜结构的工艺。本公开实施例不限定图案化工艺的具体类型。
例如，可以采用湿法刻蚀的方法制作出发光单元112。例如，显示面板中的多个发光单元112排列成阵列，该阵列为具有微米结构的LED阵列。
步骤503：将第一基板和第二基板进行对盒，使各发光单元位于相应的凹面镜结构的焦点位置处。
例如，可以采用真空对盒方式，将第二基板11的支撑层117与第一基板10的平面结构相贴合，平面结构位于基膜层102靠近第二基板11一侧的表面且位于凹面镜结构103之间。
例如，采用真空对盒的方式，将步骤501提供的第一基板10和步骤502提供的第二基板11贴合起来。通过调节支撑层117的高度和真空对盒压力，使发光单元112(如Micro LED)位于凹面镜结构103的焦点位置处。根据凹面镜特性，发光单元112(如Micro LED)发出的光经过凹面镜结构103反射后变为平行光，没有光射向周边位置。采用这种显示面板，只有显示面板正前方的用户能够看到屏幕内容，这样可以防止偷窥的发生。
本申请实施例提供的显示面板的制备方法，通过在第一衬底101上制作凹面镜结构103，在第二衬底111上制作发光单元112，并将发光单元112放置在凹面镜结构103的焦点位置处。通过在凹面镜结构103的焦点处放置发光单元112，发光单元112发出的光经凹面镜结构103反射后会形成平行光束，采用这种显示面板，只有站在屏幕正前方的用户可以看到屏幕内容，非正视角观察的人员无法看到屏幕内容，从而可以有效防止保密信息泄露，实现显示设备的防窥。
需要说明的是，步骤501与步骤502的顺序可以互换。
以上所述仅是本公开的示范性实施方式，而非用于限制本公开的保护范围，本公开的保护范围由所附的权利要求确定。

Claims (20)

  1. 一种显示面板，包括：相对设置的第一基板和第二基板；
    所述第一基板包括第一衬底以及设置在所述第一衬底靠近所述第二基板一侧的基膜层，所述基膜层靠近所述第二基板一侧的表面具有多个凹面镜结构，所述第二基板包括第二衬底以及设置在所述第二衬底靠近所述第一基板一侧的多个发光单元，各所述发光单元位于相应的凹面镜结构的焦点位置处。
  2. 根据权利要求1所述的显示面板，其中，每个发光单元在所述第一衬底上的正投影都位于一个凹面镜结构在所述第一衬底上的正投影内。
  3. 根据权利要求1或2所述的显示面板，其中，每个发光单元在平行于所述第一衬底的方向上的尺寸与相应的凹面镜结构在所述方向上的尺寸之比小于1。
  4. 根据权利要求3所述的显示面板，其中，每个发光单元的所述尺寸与相应的凹面镜结构的所述尺寸之比的范围为1/5～1/3。
  5. 根据权利要求1至4中任一项所述的显示面板，其中，所述凹面镜结构的面向所述发光单元的表面为凹面且为反射面。
  6. 根据权利要求5所述的显示面板，其中，所述凹面镜结构的面向所述发光单元的所述表面为凹球面或凹抛物面。
  7. 根据权利要求1至6中任一项所述的显示面板，其中，各所述凹面镜结构包括设置在所述基膜层靠近所述第二基板一侧表面的凹面结构以及设置在所述凹面结构表面的第一反射层。
  8. 根据权利要求7所述的显示面板，其中，所述第一反射层的背离所述凹面结构的表面为凹面且为反射面。
  9. 根据权利要求7或8所述的显示面板，其中，所述凹面结构为凹球面结构或凹抛物面结构。
  10. 根据权利要求1至9中任一项所述的显示面板，其中，所述多个凹面镜结构与所述第二基板之间为气体层或透明树脂层。
  11. 根据权利要求1至10任一项所述的显示面板，其中，各所述发光单元包括层叠设置的第二反射层和发光层，所述第二反射层靠近所述第二衬底设置。
  12. 根据权利要求11所述的显示面板，其中，所述发光层包括层叠设置的GaAs衬底层、n-AlGaInP层、i-AlGaInP层、P-AlGaInP层和阳极层，所述第二反射层复用为阴极层，所述GaAs衬底层靠近所述第二反射层设置。
  13. 根据权利要求1至11中任一项所述的显示面板，其中，所述发光单元包括阳极层和阴极层，所述阳极层位于所述阴极层与所述第一衬底之间，并且所述阳极层具有镂空部。
  14. 根据权利要求1至13任一项所述的显示面板，其中，
    所述第二基板还包括设置在所述第二衬底靠近所述第一基板一侧的隔离层，所述隔离层设置在所述发光单元之间；
    所述第二基板还包括设置在所述发光单元和所述隔离层上的保护层、以及设置在所述保护层上的支撑层，所述支撑层在所述第二衬底上的正投影位于所述隔离层在所述第二衬底上的正投影范围内。
  15. 根据权利要求14所述的显示面板，其中，所述基膜层靠近所述第二基板一侧的表面还具有平面结构，所述平面结构位于所述凹面镜结构之间，所述平面结构与所述支撑层相贴合。
  16. 一种显示面板，包括：
    第一衬底；
    设置在所述第一衬底上的基膜层，其中，所述基膜层的背离所述第一衬底的表面具有多个凹面镜结构，所述多个凹面镜结构凹向所述第一衬底；以及
    设置在所述基膜层背离所述第一衬底一侧的多个发光单元，其中，所述多个发光单元与所述多个凹面镜结构一一对应，各所述发光单元位于相应的凹面镜结构的焦点位置处，并且所述凹面镜结构的面向所述发光单元的表面为凹向所述第一衬底的凹面且为反射面。
  17. 一种显示装置，包括权利要求1至15任一项所述的显示面板或者权利要求16所述的显示面板。
  18. 一种显示面板的制备方法，包括：
    提供第一基板，所述第一基板包括第一衬底以及设置在所述第一衬底靠近所述第二基板一侧的基膜层，所述基膜层靠近所述第二基板一侧的表面具有多个凹面镜结构；
    提供第二基板，所述第二基板包括第二衬底以及设置在所述第二衬底靠近所述第一基板一侧的多个发光单元；
    将所述第一基板和所述第二基板进行对盒，使各所述发光单元位于相应的凹面镜结构的焦点位置处。
  19. 根据权利要求18所述的制备方法，其中，所述提供第一基板包括：
    提供所述第一衬底；
    在所述第一衬底上形成基膜材料层；
    采用构图工艺，在所述基膜材料层的表面形成多个凹面结构；
    在所述凹面结构上形成第一反射层。
  20. 根据权利要求18或19所述的制备方法，其中，
    所述提供第二基板包括：
    提供所述第二衬底；
    在所述第二衬底上图案化形成所述发光单元和隔离层，所述发光单元包括依次形成在所述第二衬底上的第二反射层和发光层；
    在所述发光单元和所述隔离层上形成保护层；
    在所述保护层上形成支撑层，所述支撑层在所述第二衬底上的正投影位于所述隔离层在所述第二衬底上的正投影范围内；
    所述将所述第一基板和所述第二基板进行对盒包括：
    采用真空对盒方式，将所述第二基板的所述支撑层与所述第一基板的平面结构相贴合，所述平面结构位于所述基膜层靠近所述第二基板一侧的表面且位于所述凹面镜结构之间。
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