WO2020237692A1

WO2020237692A1 - Antenna in package and terminal device

Info

Publication number: WO2020237692A1
Application number: PCT/CN2019/089711
Authority: WO
Inventors: 胡豪涛; 张海伟; 张跃江; 许帅; 兰增奇; 刘亮胜
Original assignee: 华为技术有限公司
Priority date: 2019-05-31
Filing date: 2019-05-31
Publication date: 2020-12-03
Also published as: CN113678318A; CN113678318B

Abstract

The present application provides an antenna in package and a terminal device. The antenna in package comprises a horizontally polarized antenna and a vertically polarized antenna. A first radiator portion and a second radiator portion of the vertically polarized antenna are connected by means of a ground plate. A first feed path is used for feeding the first radiator portion and the second radiator portion. The horizontally polarized antenna comprises a second feed path and a third radiator portion provided in a substrate. The second feed path is used for feeding the third radiator portion. The first radiator portion also serves as the ground for the horizontally polarized antenna. In the above-mentioned antenna in package, the first radiator portion of the vertically polarized antenna is directly connected to the ground plate, and therefore, the first radiator portion can serve as not only a radiation portion of the vertically polarized antenna but also the ground; by using the first radiator portion as the ground for the vertically polarized antenna when configuring the vertically polarized antenna, there is no need to use an additional ground. Therefore, the structure of the entire antenna in package can be simplified.

Description

Packaging antenna device and terminal equipment

Technical field

This application relates to the field of communication technology, and in particular to a packaged antenna device and terminal equipment.

Background technique

The transmission and reception of signals in wireless communication requires an antenna for transmission and reception. As shown in Figure 1(a), the basic composition of the antenna includes a reflector 2 (also a signal reference ground), a radiator 3, and a feeder 1 ( Used to connect the radio frequency signal to the antenna) and the director 4 etc. The main indicators of the antenna are bandwidth, gain, polarization, etc. The wider the bandwidth means that the antenna can support more working frequency bands, thereby supporting higher channel capacity transmission; the higher the gain, the higher the energy emitted by the antenna, and the longer the communication distance can be supported. In addition to the above-mentioned structure, the antenna can also be provided with a parasitic antenna for increasing the bandwidth of the antenna, or a director for increasing the gain of the antenna.

In 5G millimeter wave communication, due to the short wavelength, the antenna size can be small, so in recent years millimeter wave antennas are generally designed as AOB (Antenna on board, board-level antenna) or AIP (Antenna in package, package antenna device) Compared with AOB, AIP's RF leads are shorter, so the feed loss will be smaller. At the same time, because the antenna is directly designed on the package, the overall antenna will be more compact and the system integration will be higher. As shown in Fig. 1(b), a schematic diagram of a traditional AIP is shown. There are two radiation modes, namely, a Broadside radiation antenna 5 and an Endfire radiation antenna 6. As shown in Figure 1b, the side-fire radiation is perpendicular to the upper surface of the AIP and the end-fire radiation is perpendicular to the side of the AIP. Strictly speaking, the working mode of each radiation should be dual-polarized radiation. For Endfire radiation, its dual polarization refers to two polarizations, horizontal polarization and vertical polarization.

However, the previous research on dual-polarization AIP mostly focused on the design of the packaged antenna device of the side-fire (Broadside), while the research on the design of the end-fire (Endfire) dual-polarization AIP was relatively rare. In the prior art, the horizontally polarized antenna and the vertically polarized antenna of the end-fire antenna are still provided separately, which causes the structure of the end-fire antenna to be more complicated.

Summary of the invention

This application provides a packaged antenna device and terminal equipment to simplify the structure of the packaged antenna device.

In a first aspect, a packaged antenna device is provided. The packaged antenna device includes a substrate, a horizontally polarized antenna, and a vertically polarized antenna; in specific installation, the substrate serves as a carrier, such as when a vertically polarized antenna is installed. When, it includes a first radiator part, a second radiator part, a ground plate and a first feed path arranged in the substrate; wherein the first radiator part and the second radiator part pass The ground plate is connected; the first feeding path is used to feed the first radiator part and the second radiator part; when a horizontally polarized antenna is set, the horizontally polarized antenna includes setting The second power feeding path and the third radiator part in the substrate; wherein the second power feeding path is used to feed the third radiator part; in specific settings, the first radiation The body part also serves as the ground of the horizontally polarized antenna. In the above-mentioned packaged antenna device, the first radiator part of the vertically polarized antenna is connected to the ground plate, so that the first radiator part and the ground layer are at the same potential, so the first radiator part serves as a vertically polarized antenna The radiating part can be used as the ground of the horizontally polarized antenna. When setting the horizontally polarized antenna, there is no need to use additional ground (the ground corresponding to the horizontally polarized antenna), and the first radiator part can be directly used as the ground of the horizontally polarized antenna. Therefore, the structure of the entire package antenna can be simplified.

In a specific implementation, the third radiator part includes a positive polarization oscillator and a negative polarization oscillator, wherein the vertical projection of the positive polarization oscillator and the negative polarization oscillator on the first plane is located in the first plane. The radiator part is outside the vertical projection of the first plane; the first plane is the setting surface of the first radiator part. The positive and negative polarized vibrators are located outside the first radiator, and the positive and negative polarized vibrators are separated from the ground (the first radiator) by a quarter of the waveguide wavelength, so that the horizontally polarized antenna is better Radiation characteristics.

In a specific implementation, the first radiator portion is provided with a first gap, one of the two opposite sidewalls of the first gap is connected to the positive electrode oscillator, and the other side The wall is connected to the negative polarizing vibrator. The first slot can be coupled with the second feed path. When the second feed path is coupled with the first slot, two currents flowing in opposite directions are excited on both sides of the first slot, which are connected to the two side walls of the first slot The positive polarized vibrator and the negative polarized vibrator excite current, thereby realizing partial coupling and feeding of the second feed path and the third radiator through the first gap.

In a specific implementation, the end of the second feeding path partially coupled with the first radiator is a fan-shaped structure. The sector structure can make the horizontally polarized antenna obtain better impedance matching.

In a specific implementation, the positive polarization vibrator and the negative polarization vibrator are stacked, wherein the positive polarization vibrator is connected to the second feed path; the negative polarization vibrator is connected to the first The radiator is partially connected. The third radiator part is set by different setting methods.

In a specific implementation, the second power feeding path is respectively connected to the positive polarizing vibrator and the negative polarizing vibrator through a balun structure. The provided balun structure is used to adjust the phases of the signals on the positive polarization oscillator and the negative polarization oscillator, so that the phases of the signals on the positive polarization oscillator and the negative polarization oscillator are opposite.

In a specific implementation, the horizontally polarized antenna further includes a horizontally polarized director arranged in the substrate and partially matched with the third radiator. The horizontal polarization director is set to enhance the directivity of the electromagnetic wave signal.

In a specific implementation, the first power feeding path passes through the ground plate, and the first power feeding path is electrically isolated from the ground plate.

In a specific implementation, the first feed path includes a feed line, and a feed post connected to the feed line, and the feed post is used to feed the first radiator part, the second The radiating structure composed of the radiator part and the ground plate is coupled and fed.

In a specific implementation, the number of the feeder posts is two, and the two feeder posts are symmetrically arranged on both sides of the feeder line. The use of two feed posts improves the coupling effect with the first radiator part and the second radiator part.

In a specific implementation, a second gap is provided on the ground plate, and the second gap spans the feed column. The first feeding path excites the first radiator part and the second radiator part through the gap, thereby generating a vertical electric field, and then forming a vertically polarized electromagnetic wave radiating outward, thereby improving the performance of the vertically polarized antenna .

In a specific implementation, the packaged antenna device further includes a radio frequency processing chip, and the radio frequency processing chip is respectively connected to the first feeding path and the second feeding path. The signal is respectively transmitted to the horizontally polarized antenna and the vertically polarized antenna through the set radio frequency processing chip.

In a specific implementation, the second feeding path includes a first feeding line and a second feeding line; one end of the first feeding line is connected to the radio frequency processing chip, and the other end is connected to the positive electrode Connection; one end of the second feeder line is connected to the ground layer, and the other end is connected to the negative polarized vibrator.

In a second aspect, a packaged antenna device is provided. The packaged antenna device includes two substrates, specifically a first substrate and a second substrate, a horizontally polarized antenna and a vertically polarized antenna that are stacked and arranged; wherein,

The vertically polarized antenna includes a first radiator part, a second radiator part, a ground plate, and a first feeding path; wherein the first radiator part is disposed in the first substrate, and the second radiator part The two radiator parts are arranged in the second substrate; the first radiator part and the second radiator part are connected by the ground plate, and the ground plate includes a first ground layer, a second ground layer and Metal connecting piece, the first ground plate is arranged on the first substrate, the second ground plate is arranged on the second substrate, and the first ground plate and the second ground plate are connected by the metal Piece connection; the first feed path is used to feed the first radiator part and the second radiator part; the horizontally polarized antenna includes a second feed path provided in the first substrate And a third radiator part; wherein the second feed path is used to feed the third radiator part; the first radiator part also serves as a ground for the horizontally polarized antenna. In the above-mentioned packaged antenna device, the first radiator part of the vertically polarized antenna is connected to the ground plate, so that the first radiator part and the ground layer are at the same potential, so the first radiator part serves as a vertically polarized antenna The radiating part can be used as the ground of the horizontally polarized antenna. When setting the horizontally polarized antenna, there is no need to use additional ground (the ground corresponding to the horizontally polarized antenna), and the first radiator part can be directly used as the ground of the horizontally polarized antenna. Therefore, the structure of the entire package antenna can be simplified. In addition, the vertically polarized antenna is carried by the two substrates, which increases the installation space of the first radiator part and the second radiator of the vertically polarized antenna, thereby improving the performance of the antenna.

In a specific implementation, the positive polarization vibrator and the negative polarization vibrator are stacked, wherein the positive polarization vibrator is connected to the second feed path; the negative polarization vibrator is connected to the first The radiator is partially connected. The third radiator part can be arranged in different ways.

In a specific implementation, the horizontally polarized antenna further includes a horizontally polarized director arranged in the first substrate and partially matched with the third radiator. The horizontal polarization director is set to enhance the directivity of the electromagnetic wave signal.

In a specific implementation, the first feed path includes a feed line, and at least one feed post connected to the feed line, and the at least one feed post is used to feed the first radiator The radiating structure composed of the part, the second radiator part and the ground plate is coupled to feed, and each feed post includes a first feed part arranged in the first substrate and a first feeding part arranged in the second substrate. The second power feeder in the substrate, and the first power feeder and the second power feeder are electrically connected. The coupling effect is improved by at least one feed post.

In a specific implementation, the number of the power feeder is two, and the two power feeders are symmetrically arranged on both sides of the feeder line. Improve the effect of coupling.

In a specific implementation, a second gap is provided on the first ground plate, and the second gap spans the at least one power feeder. The first feeding path excites the first radiator part and the second radiator part through the gap, thereby generating a vertical electric field, and then forming a vertically polarized electromagnetic wave radiating outward, thereby improving the performance of the vertically polarized antenna .

In a specific implementation, the packaged antenna device further includes a radio frequency processing chip, the radio frequency processing chip is arranged between the first substrate and the second substrate, and the radio frequency processing chip is connected to the The first feeding path and the second feeding path are connected. The signal is respectively transmitted to the horizontally polarized antenna and the vertically polarized antenna through the set radio frequency processing chip.

In a third aspect, a terminal device is provided. The terminal device includes a printed circuit board, and the packaged antenna device in any of the above aspects electrically connected to the printed circuit board. The packaged antenna device in the terminal equipment uses the first radiator part of the vertically polarized antenna to be connected to the ground plate, so that the first radiator part and the ground layer are at the same potential, so the first radiator part serves as a vertical pole The radiating part of the polarized antenna can be used as the ground of the horizontally polarized antenna. When setting the horizontally polarized antenna, no additional ground (corresponding to the horizontally polarized antenna) is required, and the first radiator can be directly used as the horizontally polarized antenna. The ground of the antenna can simplify the structure of the entire package antenna. In addition, the vertically polarized antenna is carried by the two substrates, which increases the installation space of the first radiator part and the second radiator of the vertically polarized antenna, thereby improving the performance of the antenna.

Description of the drawings

Figure 1(a) is a schematic diagram of a polarized antenna;

Figure 1(b) is a schematic diagram of a packaged antenna device in the prior art;

2 is a schematic diagram of a cross-sectional structure of a terminal device in an embodiment of the application;

Fig. 3(a) is a cross-sectional view of an antenna device provided by an embodiment of the application;

Figure 3(b) is a cross-sectional view of the packaged antenna device taken along a cross-section perpendicular to Figure 3(a);

Fig. 4(a) is a cross-sectional view of an antenna device provided by an embodiment of the application;

Figure 4(b) is a cross-sectional view of the packaged antenna device taken along a cross-section perpendicular to Figure 4(a);

FIG. 5(a) is a 3D schematic diagram of a more specific packaged antenna device provided by an embodiment of this application;

FIG. 5(b) is a schematic cross-sectional structure diagram of the packaged antenna device provided by an embodiment of the application;

6 is a schematic diagram of simulation of the packaged antenna device provided by an embodiment of the application;

FIG. 7(a) is a 3D schematic diagram of another more specific packaged antenna device provided by an embodiment of this application;

FIG. 7(b) is a schematic cross-sectional structure diagram of the packaged antenna device provided by an embodiment of the application;

FIG. 8(a) is a 3D schematic diagram of another more specific packaged antenna device provided by an embodiment of this application;

FIG. 8(b) is a schematic cross-sectional structure diagram of the packaged antenna device provided by an embodiment of the application;

FIG. 9(a) is a 3D schematic diagram of another more specific packaged antenna device provided by an embodiment of this application;

FIG. 9(b) is a schematic cross-sectional structure diagram of the packaged antenna device provided by an embodiment of the application;

FIG. 10 is a schematic diagram of yet another packaged antenna device provided by an embodiment of the application;

11 is a schematic cross-sectional structure diagram of a packaged antenna device in an embodiment of the application;

12 is a schematic cross-sectional structure diagram of another packaged antenna device in an embodiment of the application;

13 is a schematic cross-sectional structure diagram of yet another packaged antenna device in an embodiment of the application;

14 is a schematic cross-sectional structure diagram of another terminal device in an embodiment of the application;

15 is a schematic cross-sectional structure diagram of another terminal device in an embodiment of the application;

FIG. 16 is a schematic cross-sectional structure diagram of a more specific terminal device in an embodiment of this application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of this application.

2 is a schematic cross-sectional structure diagram of a terminal device 200 provided by an embodiment of the present application. The terminal device 200 may be a smart phone, a portable computer, a tablet computer, an electronic bracelet, or other terminal devices with communication functions. The above-mentioned terminal device 200 may include a back cover 210, a frame 220, a display device 230, and a middle frame 240. The back cover 210 and the display device 230 are arranged opposite to each other and connected by the frame 220 to form a gap between the back cover 210 and the display device 230. Cavity. The middle frame 240 is disposed on the side of the display device 230 facing the rear cover 210. A packaged antenna device 250 and a PCB (Printed Circuit Board) 262 are arranged between the back cover 210 and the middle frame 240. The packaged antenna device 250 is disposed on the side of the PCB 262 facing the back cover 210 and is connected to The PCB 262 forms an electrical connection. The above-mentioned packaged antenna device 250 can be used to receive, transmit and process electromagnetic wave signals. The packaged antenna device 250 includes a substrate 400.

The embodiment of the present application shown in FIG. 3(a) provides a cross-sectional view of a packaged antenna device. The packaged antenna device includes a substrate 400 having an upper surface 401 and a lower surface 402 opposite to each other. A radio frequency processing chip 310 is provided on one side of the lower surface 402 of the substrate 400. The radio frequency processing chip 310 is used to process radio frequency signals and is electrically connected to the substrate 400 by solder balls or other metal soldering materials. A side-fire antenna 320 is provided on one side of the upper surface 401 of the substrate 400, and the maximum radiation direction of the side-fire antenna 320 is parallel to the normal line of the radio frequency processing chip 310. It should be noted that in this application, the direction of the RF processing chip 310 facing the substrate 400 is defined as the normal direction of the RF processing chip 310. For example, the vertical direction in FIG. 3(a) is the normal direction of the RF processing chip 310. . The radio frequency processing chip 310 can feed power to the side-fire antenna 320 through a feed path provided in the substrate 400, so that the side-fire antenna 320 is excited to receive and transmit electromagnetic wave signals.

Continuing to refer to Fig. 3(a), the packaged antenna device provided by the embodiment of the present application further includes an end-fire antenna, and the end-fire antenna includes a horizontally polarized antenna and a vertically polarized antenna. The vertically polarized antenna includes a first radiator portion 330 and a second radiator portion 340, and the first radiator portion 330 and the second radiator portion 340 are stacked along the normal direction of the radio frequency processing chip 310. Both the first radiator part 330 and the second radiator part 340 may be plate-like structures of equal size. For example, the length H of the first radiator part 330 and the second radiator part 340 may both be the length of a vertically polarized antenna. A quarter of the waveguide wavelength corresponding to the working frequency band, where the waveguide wavelength is the wavelength of electromagnetic waves when the electromagnetic wave propagates in the substrate 400. The above-mentioned sizes of the first radiator portion 330 and the second radiator portion 340 are only an example, and the sizes and shapes of the first radiator portion 330 and the second radiator portion 340 in the present application may also adopt other forms. 3(a), the first radiator portion 330 and the second radiator portion 340 are connected by a ground plate 390, where the ground plate 390 includes a plurality of metal layers 391 and vias 392 connecting the plurality of metal layers 391 . The first radiator portion 330, the second radiator portion 340 and the ground layer 390 constitute the radiation structure of the vertically polarized antenna. In this application, the radiation structure of the vertically polarized antenna is not limited to the components listed above, but may also include Other structures that can achieve radiation signals.

Continuing to refer to FIG. 3(a), the vertically polarized antenna further includes a first feeding path 360. The first feeding path 360 is used to feed the first radiator part 330 and the second radiator part 340. The electrical path 360 is connected to the radio frequency processing chip 310 and is used to couple the signal from the radio frequency processing chip 310 to the first radiator portion 330 and the second radiator portion 340, as shown in FIG. 3(a), the first feeding path 360 passes through the opening of the ground plate 390, and the first feed path is electrically isolated from the ground plate 390 at the position of the opening through the ground plate 390. As shown in Figure 3(a), the first feed path 360 includes a feed line 361 connected to the radio frequency processing chip 310, and a feed post 363 connected to the feed line 361. The feed post 363 is composed of multiple metal layers and connected to multiple metals. A column structure composed of layer vias. As shown in FIG. 3(b), FIG. 3(b) is a cross-sectional view of the packaged antenna device taken along a cross-section perpendicular to FIG. 3(a). The number of feeding posts 363 is two, and two feeding The posts 363 are arranged symmetrically on both sides of the feed line 361. The grounding plate 390 is provided with a second slot 393 that is matched with the feeding pole 363. The second slot 393 spans the two feeding poles 363. As shown in FIG. 3(b), the length d1 of the second slot 393 is greater than two The spacing d2 between the feed posts 363. When the packaged antenna device is working, the two feed posts 363 in the first feed path 360 are coupled with the second slot 393 in the ground layer 390, and a current is excited in the ground layer 390 through the second slot 393, so that the first The radiator part 330 and the second radiator part 340 generate currents flowing in opposite directions, and a vertical electric field is generated between the first radiator part 330 and the second radiator part 340, thereby forming a vertically polarized electromagnetic wave radiating outward . Simultaneous feeding by the two feed posts 363 at the same time can improve the impedance matching of the vertical polarization, achieve the purpose of increasing the bandwidth, and improve the performance of the vertical polarization antenna.

Continuing to refer to FIG. 3(a), the horizontally polarized antenna of the endfire antenna includes a third radiator portion 380 and a second feeding path 362 arranged in the substrate 400, and the second feeding path 362 is connected and used with the radio frequency processing chip 310 To couple and feed the third radiator part 380. The distance between the third radiator part 380 and the first radiator part 330 may be a quarter of the waveguide wavelength; in the vertical direction, the third radiator part 380 and the first radiator part 330 may be arranged in the same layer or in different layers. The first radiator part 330 is connected to the ground plate 390, and the potentials of the first radiator part 330 and the ground plate 390 are equal. Therefore, the first radiator part 330 can be used as the radiation structure of the vertically polarized antenna, and the first radiation The body part 330 can also serve as a ground for a horizontally polarized antenna. When the horizontally polarized antenna is set, the first radiator portion 330 is used as the ground of the horizontally polarized antenna, and no additional ground (the ground corresponding to the horizontally polarized antenna) is used. Thus, the structure of the entire package antenna can be simplified.

Continuing to refer to FIG. 3(a), the horizontally polarized antenna further includes a horizontally polarized director 381 arranged in the substrate 400 and matched with the third radiator portion 380. The horizontally polarized director 381 can increase the horizontal polarization. The gain of the antenna.

Referring to Figures 3(a) and 3(b) together, the two feed posts 363 in the first feed path 360 are symmetrically arranged on both sides of the feed line 361, and the current on the feed line 361 In the process of passing to the feeding column 363, there will be currents of opposite levels (arrows a and b in Figure 3(b)). Since the feeding line 361 is close to the third radiator part 380, this part of the current will be coupled To the third radiator part 380. However, the currents coupled to the third radiator portion 380 by the current a and the current b will cancel each other and will not affect the horizontally polarized antenna, thus enhancing the port isolation between the vertically polarized antenna and the horizontally polarized antenna.

The embodiment of the present application as shown in FIG. 4(a) provides a cross-sectional view of another packaged antenna device. The markings in FIG. 4(a) can refer to FIG. 3(a). The difference from FIG. 3(a) is that The bottom end of the feeding column 363 of a feeding path 360 is close to the second radiator portion 340. 4(b) together, FIG. 4(b) is a cross-sectional view of the packaged antenna device taken along a cross-section perpendicular to FIG. 4(a). When the packaged antenna device is used, the two feeding posts 363 in the first feeding path 360 are coupled to the second radiator part 340, and a current is excited in the second radiator part 340, and the current flows to the first through the ground plate 390 The radiator 330 causes the first radiator portion 330 and the second radiator portion 340 to generate currents flowing in opposite directions, and a vertical electric field is generated between the first radiator portion 330 and the second radiator portion 340, thereby forming an external Radiated vertically polarized electromagnetic waves. In this application, the top ends of the two feeding posts 363 can also be used to couple with the first radiator part 330, and the principle is the same as the coupling principle of the aforementioned feeding posts 363 and the second radiator part 340. Simultaneous feeding of the two feed posts 363 at the same time can improve the impedance matching of the vertical polarization, and achieve the purpose of increasing the bandwidth and improve the performance of the vertical polarization antenna.

Figure 5(a) shows a structure of a packaged antenna device provided by an embodiment of the present application. The third radiator part 380 of the horizontally polarized antenna includes a positive polarization element 3802 and a negative polarization element 3801. Continuing to refer to FIG. 5(a), the first radiator portion 330 is provided with a first slit 3301, and the positive polarized vibrator 3802 and the negative polarized vibrator 3801 are respectively connected to the two opposite side walls of the first slit 3301 in a one-to-one correspondence, and The positive polarization vibrator 3802 and the negative polarization vibrator 3801 are located outside the first radiator part 330. The vertical projection of the positive polarized vibrator 3802 and the negative polarized vibrator 3801 on the first plane is outside the vertical projection of the first radiator part 330 on the first plane. The above-mentioned first plane refers to the arrangement plane of the first radiator part 330. The positive polarizing element 3802 and the negative polarizing element 3801 are separated from the ground (the first radiator portion 330) by a quarter of the waveguide wavelength, so that the horizontally polarized antenna can obtain better radiation characteristics.

The second feeding path 362 as shown in FIG. 5(a) is located above the first radiator portion 330 (taking the placement direction of the packaged antenna device in FIG. 5(a) as the reference direction), and the second feeding path 362 is coupled with the first slot 3301, and one end of the second feed path 362 coupled with the first slot 3301 is a sector structure 3621, which can make the horizontally polarized antenna obtain better impedance matching. When the second feed path 362 is coupled to feed the positive polarization oscillator 3802 and the negative polarization oscillator 3801, the second feed path 362 is first coupled with the first slot 3301, and the currents flowing in opposite directions are excited on the first slot 3301 to pass respectively Go to the positive polarizing vibrator 3802 and the negative polarizing vibrator 3801. At the same time, the first radiator part 330 serves as the reflection ground of the horizontally polarized antenna. Using the first radiator part 330 as the ground of the horizontally polarized antenna can suppress the backward radiation of the horizontally polarized antenna and improve the gain of the horizontally polarized antenna.

Refer to Fig. 5(b) together, and the same reference numerals in Fig. 5(b) can refer to Fig. 4(a) and Fig. 5(a). The horizontally polarized antenna further includes a horizontally polarized director 381 arranged in the substrate 400 and matched with the third radiator portion 380. The horizontally polarized director 381 can increase the gain of the horizontally polarized antenna.

In order to facilitate the understanding of the packaged antenna device provided by the embodiment of the present application, the packaged antenna device shown in Figure 5(a) is taken as an example for simulation. The simulation result is shown in Figure 6. The ordinate in Figure 6 is the amplitude (unit dB), and the abscissa is Is the frequency (unit GHz), the curve S1,1 in Figure 6 is the reflection coefficient of the vertically polarized antenna, S2,2 is the reflection coefficient of the horizontally polarized antenna, and S1,2 is the vertical and horizontally polarized antenna. Port isolation between antennas. It can be seen from Figure 6 that the reflection coefficients of the vertically polarized antenna and the horizontally polarized antenna are both within a very wide bandwidth (covering 24-30 GHz) and are less than -10 (dB). In addition, the isolation between the horizontally polarized antenna and the vertically polarized antenna exceeds 25 (dB) in the entire frequency band, and very good antenna performance is obtained.

As shown in Figure 7(a) is another more specific packaged antenna device. The endfire antenna also includes a horizontally polarized antenna. The horizontally polarized antenna includes a third radiator portion 380 and a second Feed path 362. 7(a) and 7(b) together, the third radiator portion 380 includes a stacked positive polarizing vibrator 3802 and a negative polarizing vibrator 3801, and the positive polarizing vibrator 3802 is located above the negative polarizing vibrator 3801 (as shown in FIG. The placement direction of the packaged antenna device shown in 7(b) is the reference direction). The positive polarizing vibrator 3802 is connected to the second feeding path 362, and the negative polarizing vibrator 3801 is connected to the first radiator part 330. In use, the current in the second power feeding path 362 flows to the polarized vibrator 3802, and the second power feeding path 362 excites a reverse current on the ground (the first radiator portion 330). Continuing to refer to FIG. 7(b), the horizontally polarized antenna further includes a horizontally polarized director 381 arranged in the substrate 400 and matched with the third radiator part 380. The horizontally polarized director 381 can increase the horizontal polarization. The gain of the antenna.

As shown in FIG. 8(a) is another more specific packaged antenna device. The endfire antenna of the packaged antenna device also includes a horizontally polarized antenna. The second feed path 362 of the horizontally polarized antenna and the radio frequency processing chip And the second feed path 362 is respectively connected to the positive polarization oscillator 3802 and the negative polarization oscillator 3801 through the balun structure. One end of the balun structure is connected to the second feeding path 362, and the other end includes a first conductor 3642 and a second conductor 3641. The first conductor 3642 is connected to the positive polarized oscillator 3802, and the second conductor 3641 is connected to the negative electrode. The 3801 chemical vibrator is connected. The current path length of the first conductive body 3642 is smaller than the current path length of the second conductive body 3641. When the current on the second feed path 362 flows to the positive electrode 3802 and the negative electrode 3801, the current path lengths flowing through the first conductor 3642 and the second conductor 3641 differ by an odd multiple of half the waveguide wavelength, so that the positive electrode The phases of the signals on the polarized oscillator 3802 and the negative polarized oscillator 3801 are opposite. Continuing to refer to FIG. 8(b), the horizontally polarized antenna further includes a horizontally polarized director 381 arranged in the substrate 400 and matched with the third radiator portion 380. The horizontally polarized director 381 can increase the horizontal polarization. The gain of the antenna.

As shown in FIG. 9(a) is another more specific packaged antenna device. The endfire antenna of the packaged antenna device also includes a horizontally polarized antenna. The second feed path 362 of the horizontally polarized antenna includes a first feeder. Wire 3621 and the second feeder 3622, the first feeder 3621 and the second feeder 3622 are stacked, and the first feeder 3621 is located above the second feeder 3622, and the second feeder 3622 is located above the first radiator portion 330 (Take the placement direction of the packaged antenna device shown in Figure 9(b) as the reference direction). One end of the first feed line 3621 is connected to the radio frequency processing chip, and the other end is connected to the positive polarized vibrator 3802. The first feed line 3621 in Figure 9(a) passes through the opening of the ground plate 390, but the first feed line 3621 is connected to the The floors 390 are electrically isolated. One end of the second feed line 3622 is connected to the ground plate 390, and the other end is connected to the negative polarized oscillator 3801. As shown in Fig. 9(b), the horizontally polarized antenna further includes a horizontally polarized director 381 arranged in the substrate 400 and matched with the third radiator part 380. The horizontally polarized antenna can be improved by the horizontally polarized director 381 The gain.

As shown in Figure 10 is another more specific packaged antenna device, the same reference numerals in Figure 10 (a) can refer to Figure 3 (a) and Figure 4 (a), and Figure 3 (a) and Figure 4 (a) ) The difference is that the packaged antenna device includes a first substrate 300 and a second substrate 260 that are stacked, and the first substrate 300 and the second substrate 260 can be different substrates. For example, the first substrate 300 can be a printed circuit board or a package. The second substrate 260 can also be a printed circuit board or an encapsulation layer. The first substrate 300 and the second substrate 260 are electrically connected by BGA solder balls 312. The side of the lower surface of the first substrate 300, that is, the side of the first substrate 300 facing the second substrate 260, is provided with a radio frequency processing chip 310. The radio frequency processing chip 310 is used to process radio frequency signals and is welded by solder balls or other metals. The material forms an electrical connection with the first substrate 300.

Continuing to refer to Fig. 10, in the packaged antenna device shown in Fig. 10, the horizontally polarized antenna of the endfire antenna can refer to Fig. 3(a), Fig. 5(a), Fig. 7(a), Fig. 8(a), Fig. 9(a). The vertical polarization antenna of the end-fire antenna is different from FIG. 3( a) in that the structure of the vertical polarization antenna is arranged in the first substrate 300 and the second substrate 260. With continued reference to FIG. 10, the first radiator part 330 is disposed on the first substrate 300, and the second radiator part 340 is disposed on the second substrate 260. The first radiator part 330 and the second radiator part 340 are connected by a ground plate 390. The ground plate 390 includes: a first ground plate 394 provided in the first substrate 300, a second ground plate 396 provided in the second substrate 260, and solder balls connecting the first ground plate 394 and the second ground plate 396 395. Of course, the first grounding plate 394 and the second grounding plate 396 in this application can also be connected by connecting wires, conductive posts, or other conductive metal connectors. The first feeding path 360 is used to couple the signal of the radio frequency processing chip 310 to the first radiator part 330 and the second radiator part 340. The first feeding path 360 includes a feeding post 363 including: a first feeding portion 3631 provided in the first substrate 300, a second feeding portion 3633 provided in the second substrate 260, and The solder balls 3632 connecting the first power feeder 3631 and the second power feeder 3633. The above-mentioned first power feeding portion 3631 and second power feeding portion 3633 are both composed of a plurality of metal layers and via holes connecting the metal layers. The vertically polarized antenna structure is carried by the first substrate 300 and the second substrate 260, thereby meeting the installation space requirements of the packaged antenna device, and realizing the ultra-wideband design of the packaged antenna device. Moreover, the first radiator part serves as the ground of the horizontally polarized antenna, so that the backward radiation of the third radiator part 380 can be suppressed, and the gain of the antenna can be improved.

FIG. 11 is a schematic cross-sectional structure diagram of a packaged antenna device 250 provided by an embodiment of the present application. The above-mentioned packaged antenna device 250 includes a first substrate 300 and a second substrate 260 arranged opposite to each other. The first substrate 300 may be an interposer implemented by using passive silicon wafers; the second substrate 260 may also be an interposer or a printed circuit board implemented by using a copper clad laminate. The first substrate 300 and the second substrate 260 are electrically connected through the BGA ball 312 disposed therebetween. The side of the lower surface of the first substrate 300, that is, the side of the first substrate 300 facing the second substrate 260, is provided with a radio frequency processing chip 310. The radio frequency processing chip 310 is used to process radio frequency signals and is welded by solder balls or other metals. The material forms an electrical connection with the first substrate 300. The side of the upper surface of the first substrate 300, that is, the side of the first substrate 300 opposite to the second substrate 260, is provided with a side-fire antenna 320. The maximum radiation direction of the side-fire antenna 320 is parallel to the normal of the radio frequency processing chip 310 . It should be noted that in the present application, the direction of the RF processing chip 310 facing the first substrate 300 is defined as the normal direction of the RF processing chip 310. For example, the vertical direction in FIG. 11 is the normal direction of the RF processing chip 310. The radio frequency processing chip 310 may feed the side-fire antenna 320 through a feed path provided in the first substrate 300, so that the side-fire antenna 320 is excited to receive and transmit electromagnetic wave signals. The packaged antenna device 250 also includes an end-fire antenna whose maximum radiation direction is perpendicular to the normal of the radio frequency processing chip 310. The above-mentioned end-fire antenna includes a first radiator part 330 and a second radiator part 340 having the same direction.

In the aforementioned packaged antenna device 250, the first radiator portion 330 is provided in the first substrate 300, the second radiator portion 340 is provided in the second substrate 260, and the first radiator portion 330 and the second radiator portion 340 pass The first metal piece 350 forms an electrical connection. Soldering pads may be provided at the end of the first radiator part 330 close to the second substrate 260 and the end of the second radiator part 340 close to the first substrate 300, so that the first metal piece 350 is in contact with the first radiator part 330 and the second substrate. The connection between the two radiator parts 340 is more stable. The radio frequency processing chip 310 may also feed the first radiator part 330 through the first feeding path 360 provided in the first substrate 300, so that the first radiator part 330 and the second radiator part 340 are excited to receive And emit electromagnetic signals. The excited first radiator portion 330, the first metal piece 350, and the second radiator portion 340 have vertical polarization currents, the direction of which is parallel to the normal direction of the radio frequency processing chip 310. The antenna polarization mode includes horizontal polarization and vertical polarization, and may also include ±45° polarization. For example, when the above-mentioned end-fire antenna is excited by vertical polarization or ±45° polarization, a current of ±45° polarization will be generated in the end-fire antenna.

Since the first metal part 350 connects the second radiator part 340 with the first radiator part 330, the equivalent height of the endfire antenna is changed from the height of the original first radiator part 330 to the first radiator part 330, The height of the first metal part 350 and the second radiator part 340. The increase in the equivalent height of the end-fire antenna allows the vertically polarized current path generated by the end-fire antenna to be distributed on the first radiator part 330, the first metal piece 350 and the second radiator part 340, that is, the end-fire antenna is increased. The antenna polarizes the current path in the vertical direction, thus increasing the gain and bandwidth of the end-fire antenna. It should be noted that the equivalent height of the antenna in this application refers to the height of the aforementioned end-fire antenna in a vertical direction, that is, a direction parallel to the normal line of the radio frequency processing chip 310.

In one embodiment, the above-mentioned packaged antenna device 250 may further include a chip disposed on the side of the second substrate 250 that faces away from the first substrate. The chip may be a CPU (Central Processing Unit, central processing unit) chip, or It is a cache chip, such as DRAM (Dynamic Random Access Memory, dynamic random access memory). The chip is electrically connected to the second substrate 250 through solder balls or other metal connections.

The above-mentioned first radiator portion 330 and second radiator portion 340 can be realized by a via as shown in FIG. 11, wherein the first radiator portion 330, the first metal piece 350 and the second radiator portion 340 are located In a straight line. FIG. 12 is a schematic cross-sectional structure diagram of another embodiment of the above-mentioned packaged antenna device 250, wherein the same signs in FIG. 12 can refer to FIG. 11. The difference from FIG. 11 is that according to the required antenna type and wiring requirements, the first radiator part 330 and the second radiator part 340 in FIG. 12 can also be arranged through an array of vias and layers in a staggered arrangement. Inter-layer wiring is implemented (the inter-layer wiring is used to connect the misaligned vias), that is, the first radiator part 330 and the second radiator part 340 are processed by bending, etc., to increase the bandwidth of the antenna. Compared with the vias, the actual equivalent height achieved by the staggered via array and interlayer wiring is the same, and the vertical polarization current path can also be made in the first radiator part 330 and the first metal part respectively. 350 and the second radiator part 340 to improve the gain and bandwidth of the end-fire antenna.

FIG. 13 is a schematic cross-sectional structure diagram of another embodiment of the above-mentioned packaged antenna device 250, wherein the same signs in FIG. 13 can refer to FIG. 11. The difference from FIG. 11 is that the second radiator portion 340 in the packaged antenna device 250 in FIG. 13 can also be realized by a trace or a solder pad disposed on the side of the second substrate 260 facing the first substrate 300. Since the first metal part 350 (such as a solder ball) has a certain volume and height, the vertical polarization current can also be distributed in the first metal part 350 and the second radiator part 340 to improve the gain and bandwidth of the end-fire antenna .

14 is a schematic cross-sectional structure diagram of another terminal device 200 according to an embodiment of the present application, including a packaged antenna device 250, a first structure 370 and a second structure 373, the packaged antenna device 250 may be Any packaged antenna device provided in the application embodiments. Wherein, the first structural member 370 is disposed under the second substrate 260, that is, a side facing away from the first substrate 300. The first structural member 370 includes a third radiator portion 371 disposed therein, and the third radiator portion 371 is connected to the second radiator portion 340 through a third metal member 372, and the third metal member 372 is disposed on the second substrate 260 and the first structure 370. The second structural member 373 is disposed above the first substrate 300, that is, on the side facing away from the second substrate 260. The second structural member 373 includes a fourth radiator portion 374 disposed therein, and the fourth radiator portion 374 is connected to the first radiator portion 330 through a fourth metal member 375. The fourth metal member 375 is disposed on the first substrate. Between 300 and the second structure 373.

The above-mentioned first structural member 370 and second structural member 373 may be a frame or a middle frame in a terminal device, or may be structural members in other terminal devices. The third metal piece 372 and the fourth metal piece 375 may be metal bonding wires, or other bonding wires or connecting balls with conductive functions. The above-mentioned third radiator part 371 and fourth radiator part 374 can be implemented through vias, or through via arrays and interlayer wiring (interlayer wiring is used to connect vias with staggered arrangements), or through Implementation of metal pillars and metal plating traces. In an embodiment, other structural members, radiator parts, and metal members may be provided on the side of the first structural member 370 facing away from the first substrate 300 according to the design requirements of the terminal device 200. In one embodiment, other structural members, radiator parts, and metal members may be provided on the side of the second structural member 373 opposite to the first substrate 300. In another embodiment, only the first structural member 370, the third radiator portion 371, and the third metal member 372 may be provided, or only the second structural member 373, the fourth radiator portion 374, and the fourth metal member may be provided. Pieces 375. This application does not limit the number of structural parts, radiator parts and metal parts in the terminal device 200 in any way.

FIG. 15 is a schematic cross-sectional structure diagram of another terminal device 200 according to an embodiment of the present application, wherein the same signs in FIG. 15 can refer to FIG. 14. The difference from FIG. 14 is that the terminal device 200 in FIG. 15 further includes a PCB 262, and the PCB 262 may be disposed between the second substrate 260 and the first structure 370. Specifically, the aforementioned PCB 262 includes a fifth radiator portion 376 disposed in the PCB 262. One end of the fifth radiator portion 376 and the second radiator portion 340 pass through a fifth metal disposed between the second substrate 260 and the PCB 262. The member 377 is connected, and the other end of the fifth radiator portion 376 and the third radiator portion 371 are connected by a third metal member 372 disposed between the PCB 262 and the first structural member 370. In an embodiment, the second substrate 260 may be a high frequency PCB board for transmitting and processing high frequency signals; the PCB 262 may be a low frequency PCB board for transmitting and processing intermediate frequency and low frequency signals. In an embodiment, other PCBs can be provided on the side of the first structure 370 facing the first substrate 300 or the side of the second structure 373 facing the first substrate 300 according to design requirements. This application does not limit the number and positions of PCBs in the terminal device 200 in any way.

The above-mentioned fifth metal member 377 may be a metal bonding wire, or may be other bonding wires or connecting balls with a conductive function. The above-mentioned fifth radiator portion 376 can be realized through via holes, or through via hole arrays and interlayer wiring (interlayer wiring is used to connect vias that are misaligned), or through metal pillars and metal plating. Line realization. Similar to the first radiator portion 330 and the second radiator portion 340, the third radiator portion 371, the fourth radiator portion 374, and the fifth radiator portion 376 respectively include at least a ground plane, a main radiator board, and a parasitic radiator board. At least one of them will not be repeated here.

The embodiment of the present application also provides a more specific terminal device 1700, wherein FIG. 16 is a schematic cross-sectional structure diagram of the terminal device 1700. The aforementioned terminal equipment 1700 includes a back cover 210, a frame 220, a display device 230, a middle frame 340, a first shield frame 242, a second shield frame 244, a packaged antenna device 250, a PCB 262, and an electronic device 270. The packaged antenna device 250 may be any packaged antenna device in the embodiments of the application. For ease of description, the direction perpendicular to the middle frame 340 is taken as the vertical direction, and the direction parallel to the middle frame 340 is taken as the horizontal direction. The middle frame 340 is arranged on one side of the display device 230, the first shield frame 242, the PCB 262, the second shield frame 244, and the package antenna device 250 are sequentially stacked in a vertical direction away from the middle frame 340, wherein the package antenna device 250 It includes a first substrate 300 and a second substrate 260 that are electrically connected. Whether to provide the first shield frame 242 and the PCB 262 can be selected according to the cross-sectional height of the terminal device 1700 and actual requirements. The middle frame 340 and the display device 230 are connected to one end of the frame 220, and the other end is connected to the back cover 210. The electronic device 270 is disposed on the side of the middle frame 340 facing away from the display device 230 and is located in the horizontal direction of the packaged antenna device 250 away from the frame 220. The back cover 210 is disposed on the side of the above-mentioned packaged antenna device 250 and the electronic device 270 facing away from the middle frame 340, and can be connected and fixed to the frame 220 by a structural member or an adhesive. The aforementioned electronic device 270 may be a sensor or other electronic device. The above-mentioned first shield frame 242 and second shield frame 244 are used for shielding interference electromagnetic waves from the PCB 262 and the second substrate 260. The above-mentioned second substrate 260 and PCB 262 may both be high-frequency or low-frequency printed circuit boards, and component arrangement and circuit layout and wiring of the second substrate 260 and PCB 262 may be performed. As shown in FIG. 17, in order to make electromagnetic waves better radiate from the end of the back cover 210 and the frame 220, the part of the frame 220 close to the package antenna device 250 can be hollowed out, so that the frame 220 is at the end of the antenna. It has good support while radiating radiation.

The above are only specific implementations of this application, but the scope of protection of this application is not limited to this. Anyone familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in this application, and they should all cover Within the protection scope of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.

Claims

A packaged antenna device, characterized by comprising: a substrate, a horizontally polarized antenna and a vertically polarized antenna; wherein,

The vertically polarized antenna includes a first radiator portion, a second radiator portion, a ground plate, and a first feeding path provided in the substrate; wherein, the first radiator portion and the second radiator portion The radiator part is connected by the ground plate; the first feeding path is used to feed the first radiator part and the second radiator part;

The horizontally polarized antenna includes a second feeding path and a third radiator part arranged in the substrate; wherein the second feeding path is used to feed the third radiator part;

The first radiator part also serves as a ground for the horizontally polarized antenna.
The packaged antenna device according to claim 1, wherein the third radiator part includes a positive electrode and a negative electrode, wherein the positive electrode and the negative electrode are perpendicular to the first plane The projection is located outside the vertical projection of the first radiator part on the first plane; the first plane is the setting surface of the first radiator part.
The packaged antenna device according to claim 2, wherein the first radiator portion is provided with a first slot, and one of the two opposite sidewalls of the first slot is connected to the positive electrode. The vibrator is connected, and the other side wall is connected with the negative polarized vibrator.
The packaged antenna device according to claim 3, wherein an end of the second feeding path partially coupled with the first radiator has a sector structure.
The packaged antenna device according to claim 2, wherein the positive polarization vibrator and the negative polarization vibrator are stacked, wherein:

The positive polarization vibrator is connected to the second feed path;

The negative polarization vibrator is partially connected to the first radiator.
3. The packaged antenna device of claim 2, wherein the second feed path is connected to the positive polarization oscillator and the negative polarization oscillator respectively through a balun structure.
The packaged antenna device according to any one of claims 1 to 6, wherein the horizontally polarized antenna further comprises a horizontally polarized guide that is provided in the substrate and partially matched with the third radiator. Device.
The packaged antenna device according to any one of claims 1 to 7, wherein the first feeding path passes through the ground plate, and the first feeding path is electrically isolated from the ground plate.
The packaged antenna device according to claim 8, wherein the first feed path includes a feed line, and a feed post connected to the feed line, and the feed post is used to feed the first The radiation structure composed of the radiator part, the second radiator part and the ground plate is coupled and fed.
The packaged antenna device according to claim 8 or 9, wherein the number of the feed posts is two, and the two feed posts are symmetrically arranged on both sides of the feed line.
The packaged antenna device according to claim 9 or 10, wherein a second slot is provided on the ground plate, and the second slot spans the feed column.
The packaged antenna device according to any one of claims 2-11, wherein the packaged antenna device comprises a radio frequency processing chip, and the radio frequency processing chip is connected to the first feed path and the second feed respectively. Electrical path connection.
The packaged antenna device of claim 12, wherein the second feeding path includes a first feeding line and a second feeding line;

One end of the first feeder line is connected to the radio frequency processing chip, and the other end is connected to the positive polarization oscillator;

One end of the second feeder line is connected to the ground layer, and the other end is connected to the negative polarized vibrator.
A packaged antenna device, characterized in that it comprises a first substrate and a second substrate, a horizontally polarized antenna and a vertically polarized antenna which are stacked and arranged; wherein,

The vertically polarized antenna includes a first radiator part, a second radiator part, a ground plate, and a first feeding path; wherein the first radiator part is disposed in the first substrate, and the second radiator part The two radiator parts are arranged in the second substrate; the first radiator part and the second radiator part are connected by the ground plate, and the ground plate includes a first ground layer, a second ground layer and Metal connecting piece, the first ground plate is arranged on the first substrate, the second ground plate is arranged on the second substrate, and the first ground plate and the second ground plate are connected by the metal Piece connection; the first feed path is used to feed the first radiator part and the second radiator part;

The horizontally polarized antenna includes a second feeding path and a third radiator part arranged in the first substrate; wherein the second feeding path is used to feed the third radiator part;

The first radiator part also serves as a ground for the horizontally polarized antenna.
The packaged antenna device according to claim 14, wherein the third radiator part includes a positive electrode and a negative electrode, wherein the positive electrode and the negative electrode are perpendicular to the first plane The projection is located outside the vertical projection of the first radiator part on the first plane; the first plane is the setting surface of the first radiator part.
The packaged antenna device according to claim 15, wherein a first slit is provided on the first radiator portion, and one of the two opposite side walls of the first slit is connected to the positive electrode. The polarizing vibrator is connected, and the other side wall is connected with the negative polarizing vibrator.
The packaged antenna device according to claim 16, wherein an end of the second feeding path partially coupled with the first radiator is a sector structure.
The packaged antenna device according to claim 15, wherein the positive polarizing vibrator and the negative polarizing vibrator are stacked, wherein:

The positive polarization vibrator is connected to the second feed path;

The negative polarization vibrator is partially connected to the first radiator.
The packaged antenna device according to claim 15, wherein the third radiator part includes a positive polarization vibrator and a negative polarization vibrator, wherein the second feed path is connected to the positive polarization via a balun structure. The vibrator and the negative polarized vibrator are connected.
The packaged antenna device according to any one of claims 14 to 19, wherein the horizontally polarized antenna further comprises a horizontally polarized antenna that is provided in the first substrate and partially matched with the third radiator. Director.
The packaged antenna device according to any one of claims 14 to 20, wherein the first feed path passes through the ground plate, and the first feed path is electrically isolated from the ground plate.
The packaged antenna device according to claim 21, wherein the first feed path includes a feed line, and at least one feed post connected to the feed line, and the at least one feed post is used for feeding The first radiator part, the second radiator part, and the ground plate are composed of a radiating structure that is coupled to feed power, and each feed post includes a first power feeder and a first power feeder provided in the first substrate. A second power feeder provided in the second substrate, and the first power feeder and the second power feeder are electrically connected.
The packaged antenna device according to claim 21 or 22, wherein the number of the feeding pillars is two, and the two feeding pillars are symmetrically arranged on both sides of the feeding line.
The packaged antenna device of claim 22 or 23, wherein a second slot is provided on the first ground plate, and the second slot straddles the at least one feeding column.
The packaged antenna device according to any one of claims 14 to 24, wherein the packaged antenna device comprises a radio frequency processing chip, and the radio frequency processing chip is disposed between the first substrate and the second substrate , And the radio frequency processing chip is respectively connected to the first feeding path and the second feeding path.
The packaged antenna device according to claim 25, wherein the second feeding path includes a first feeding line and a second feeding line;

One end of the first feeder line is connected to the radio frequency processing chip, and the other end is connected to the positive polarization oscillator;

One end of the second feeder line is connected to the ground layer, and the other end is connected to the negative polarized vibrator.
A terminal device, characterized by comprising a printed circuit board, and the packaged antenna device according to any one of claims 1 to 13, or any one of claims 14 to 26 electrically connected to the printed circuit board The packaged antenna device.