JP2011109438A - Antenna module and radio device having the antenna module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a practical structure in an antenna module having a waveguide composed of a plurality of metal pillars and a radio function part. <P>SOLUTION: In the antenna module having the waveguide composed of the plurality of metal pillars, the antenna module has an antenna package, and a semiconductor chip having a radio send/receive function connected onto the antenna package. In the antenna package, the waveguide having an aperture part on one end side thereof and composed of the plurality of metal pillars, the semiconductor chip which is integrated with the waveguide, and has the radio send/receive function on the opposite side of the aperture part of the waveguide, and an interface circuit with an external circuit are formed by a multilayer structure of a dielectric and an electric conductor. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an antenna module and a wireless device having the antenna module.

  As an application of a wireless communication system, an infrared communication function or a Bluetooth (registered trademark) function is installed in a portable terminal, and data communication is performed between portable terminals or between a portable terminal and a data terminal including a personal computer. Things have been done.

  On the other hand, in recent years, studies on the practical use of a millimeter-wave band, which is a new frequency resource, are proceeding. For example, application systems such as a large-capacity video wireless transmission system and an ultrahigh-speed data communication system have been proposed.

  As such an application system, a waveguide (tube) antenna is indispensable in a system using a portable terminal in order to use a millimeter-wave band radio signal.

  Since the conventional waveguide is a metal three-dimensional structure, the weight is inevitably increased and it is not easy to apply this to a portable terminal.

  On the other hand, a technique called a post wall waveguide has been proposed (Non-Patent Document 1).

  Such a post-wall waveguide electrically connects the upper and lower conductors (copper foils) of a printed circuit board (PCB) of an electronic circuit with metal-plated through holes called post (column) walls. A large number of these are arranged to simulate a narrow wall of a rectangular waveguide. The metal pillar can be processed using a printed circuit board processing technique called a through hole or a via hole.

  The present inventors have previously proposed an antenna structure that uses such a column wall waveguide to reduce the entire area when a wireless module is mounted (Patent Document 1).

T. KAI, J. HIROKAWA, and M. ANDO, "Feed through an Aperture to a Post-Wall Waveguide with Step Structure," IEICE Trans. Commun., Vol.E88-B, No.3, pp.1298-1302 , March 2005.

JP 2005-29483A

  Here, in the above-mentioned Patent Document 1, the configuration previously presented by the present inventors is such that a column wall waveguide is used as an antenna (post wall antenna), and a radio module (transmission / reception function device) is disposed on the antenna, It shows that the wireless module and the column wall waveguide are connected by a power feeding unit.

  However, Patent Document 1 does not mention a specific configuration for practical use of a wireless antenna, recognition of problems in the specific configuration, and a solution to the problem.

  Accordingly, an object of the present invention is to propose a practical configuration in an antenna module having a waveguide composed of a plurality of metal columns.

  Furthermore, it is providing the radio | wireless device which has an antenna module of such a practical structure.

  An antenna module according to the present invention that achieves the above object is an antenna module having a waveguide composed of a plurality of metal pillars as a first side surface, and has an antenna package and a wireless transmission / reception function connected to the antenna package. The antenna package has an opening on one end surface side, a waveguide composed of a plurality of metal pillars, and the waveguide and the opposite side of the waveguide opening integrally with the waveguide In addition, the interface circuit between the semiconductor chip having the wireless transmission / reception function and the external circuit is formed by a multilayer structure of a dielectric and a conductor.

  An antenna module according to the present invention that achieves the above object is an antenna module having a waveguide composed of a plurality of metal pillars as a second side surface, wherein the circuit conductor is formed in a multilayer structure. And a semiconductor chip having a wireless transmission / reception function connected to the printed circuit board, and an opening corresponding to one end surface of the printed circuit board is formed in a partial region of the multilayer structure of the printed circuit board. And having a waveguide composed of a plurality of metal columns formed integrally with a circuit conductor of the printed circuit board.

  A wireless device according to the present invention that achieves the above object is a wireless device in which an antenna module is mounted on a printed circuit board, and the antenna module has an antenna package and a wireless transmission / reception function connected to the antenna package. The antenna package has an opening on one end surface side, a waveguide composed of a plurality of metal pillars, and the waveguide and the opposite side of the waveguide opening integrally with the waveguide In addition, the interface circuit between the semiconductor chip having the wireless transmission / reception function and the external circuit is formed by a multilayer structure of a dielectric and a conductor.

  As a feature of the present invention, it is possible to provide an antenna module having a radiation surface on the side surface of a substrate having a mounting structure suitable for mass production at low cost by applying semiconductor technology and substrate manufacturing technology, and a small portable radio using such an antenna module. A device can be realized.

It is a top view of the Example structure of the antenna module by this invention. It is a figure which shows the cross-sectional structure which follows the center part broken line of FIG. 3 is a top view showing an example of the shape of the antenna module 1. FIG. 1 is a plan view of a configuration example of a wireless device on which an antenna module 1 is mounted. It is sectional drawing of the center part of the wireless device top view shown to FIG. 4A. 2 is a cross-sectional view of a configuration example of a wireless device in which an antenna module is formed integrally with a circuit conductor of a PCB substrate. It is a cross-sectional conceptual diagram of the wireless device comprised by incorporating the antenna module according to this invention in the motherboard for PC. 5 is a diagram showing an outline of a manufacturing process of a multilayer structure of the antenna module 1. FIG. It is a perspective view which shows the detail of the waveguide part in the antenna module according to this invention. It is a figure which shows the distribution state of the strength of the electric field E of the waveguide 2 for understanding the effect | action of a reflector. It is a figure explaining the angle (vertical direction) change in E surface. It is a figure explaining the angle (horizontal direction) change in H surface. It is a figure which shows the measurement result of the radiation | emission characteristic in the E surface by a matching post when a measuring device is moved to the up-down direction within the range of +/- 90 degrees as shown in FIG. It is a figure which shows the measurement result of the radiation | emission characteristic in the H surface by a matching post when a measuring device is moved to the horizontal direction in the range of +/- 90 degrees as shown in FIG. It is a figure which shows the measurement result of the radiation | emission characteristic in the E surface by a reflector when a measuring device is moved to the up-down direction within the range of +/- 90 degrees as shown in FIG. It is a figure which shows the measurement result of the radiation | emission characteristic in the H surface by a reflector when a measuring device is moved to the horizontal direction in the range of +/- 90 degrees as shown in FIG. It is a figure which shows the Example structure which has a director in a waveguide. FIG. 16 is a plan view showing an example arrangement of the director 30 corresponding to FIG. 15. It is a graph which shows gain improvement as one effect of a director. It is a figure which shows the mode of the radiation pattern change (directivity) at the frequency of 60 GHz by the presence or absence of a director. It is an Example which shows one form which utilized the reflector for transmission / reception separation. 5 is a configuration example for suppressing a tilt (bias) in the E-plane direction of a millimeter wave beam radiated from the opening 25 of the waveguide 2.

  Embodiments of an antenna module according to the present invention will be described below with reference to the drawings.

  FIG. 1 is a plan view of a configuration of an embodiment of an antenna module according to the present invention, which is shown in a perspective form for easy understanding.

  FIG. 2 is a diagram showing a cross-sectional structure taken along the center dotted line AA in FIG.

  The antenna module 1 includes an antenna package 10 and a semiconductor chip 4 having a wireless transmission / reception functional element flip-chip connected to the upper surface side as an example of the antenna package 10. In FIG. 2, the semiconductor chip 4 is flip-chip connected, but the surface opposite to the side having the bumps 4A and 4B of the semiconductor chip 4 (the upper surface side of the semiconductor chip 4 in FIG. 2) faces the antenna package 10. In this way, the antenna package 10 may be placed and connected to a predetermined terminal of the antenna package 10 by wire bonding.

  Further, a shield cover 5 that covers the semiconductor chip 4 is provided for electromagnetic shielding and protection.

  In the antenna package 10, a plurality of post (column) walls 20 and upper and lower conductors (copper foils) 21 and 22 constitute a waveguide 2 having an opening 25 through which a radio wave is radiated on the front end face.

  Such an antenna package 10 is formed by laminating conductors in multiple layers via a dielectric. The procedure of the manufacturing method in such a case will be described later.

  Further, as shown in FIG. 2, a power feeding portion into which the central conductor 23 is inserted is configured on the rear side of the waveguide 2.

  As a result, the millimeter wave signal introduced from the central conductor 23 is converted by the power feeding unit and radiated as an electromagnetic wave from the opening 25 in front of the waveguide 2.

  In addition, an interface unit 3 is formed on the rear side of the waveguide 2 by laminating a conductor via a dielectric. The interface unit 3 performs an interface function with an external circuit to which the antenna module is connected.

  The output end of the semiconductor chip 4 and the central conductor 23 are connected by a line 24 such as a microstrip or a coplanar formed on the antenna package 10.

  A conductor cover 5 is provided on the surface side of the antenna module 1 for electromagnetic shielding and protection against the line 24 and the semiconductor chip 4.

  On the back side of the antenna module 1, there are a plurality of connection terminals 30 for connection to circuit conductors of a printed circuit board (PCB) not shown in FIGS. 1 and 2.

  FIG. 3 is a top view showing an example of the shape of the antenna module 1. Again, for the sake of convenience, it is shown in a perspective form for easy understanding.

  In FIG. 3, the external dimension of the antenna module 1 is about 15 mm square, and the external shape of the semiconductor (CMOS) chip 4 having the wireless transmission / reception functional elements is about 4 mm square.

In the example shown in FIG. 3, column wall waveguides 2A and 2B formed by a plurality of metal columns 20A and 20B are prepared for the transmission side Tx and the reception side Rx, respectively. The central conductors 23A and 23B inserted in the power feeding portions in the waveguides 2A and 2B on the transmission side Tx and the reception side Rx and the input and output terminals of the semiconductor chip 4 having the wireless transmission / reception functional elements are connected through lines 24A and 24B, respectively. Has been.

  Returning to FIG. 2, the conductors of the column wall waveguide 2 and the interface unit 3 are configured by, for example, a multilayered conductor through an FR-4 standard glass cloth base epoxy resin.

  FIG. 4A is a plan view of a configuration example of a wireless device using the antenna module 1 described above. FIG. 4B is a cross-sectional view of the central portion of the wireless device plan view shown in FIG. 4A, with the longitudinal direction shortened.

  The wireless device of the embodiment shown in FIGS. 4A and 4B is an example of a wireless card connected to a personal computer (PC) or the like.

  4A and 4B, the antenna module 1 according to the present invention described above is connected to the circuit conductor of the PCB substrate 6 through the connection terminal 30 on the back surface side above the printed circuit (PCB) substrate 6. .

  As a wireless card, a plurality of connection terminals 7 connected to a card connector of a PC are provided on the rear end side of the PCB substrate 6. Accordingly, the opening 25 of the waveguide 2 is positioned on the end face of the card opposite to the end face where the connection terminal 7 is provided, and electromagnetic waves in the microwave or millimeter wave band are radiated or received.

  Here, the wireless device shown in FIGS. 4A and 4B has a configuration in which the antenna module 1 according to the present invention is mounted on the PCB substrate 6, but the antenna module 1 is formed integrally with the multilayer circuit conductor of the PCB substrate 6. In other words, the antenna module 1 can be incorporated in the printed circuit board 6.

  FIG. 5A is a conceptual cross-sectional view of a wireless device configured by incorporating the antenna module according to the present invention in the PCB substrate 10A.

  In FIG. 5A, the longitudinal direction is omitted. The portion of the antenna package 10 of the antenna module 1 is manufactured integrally with the other circuit conductor 10B of the PCB substrate 6. In such a case, the interface unit 3 described with reference to FIG. 2 corresponds to a functional unit that interfaces with another circuit conductor 10B of the PCB substrate 6, and this function is provided in the semiconductor chip 4.

  In the example shown in FIG. 4A, FIG. 4B or FIG. 5A as a wireless device, it is shown as having a connection terminal 7 connected to a PC connector as an example of a wireless card, but the application of the present invention is not limited to this. I can't. That is, for example, the antenna module 1 according to the present invention is connected to a motherboard 60 of a PC as shown in the examples of FIGS. 4A and 4B, or the antenna module 1 is integrated into the motherboard 60 as shown in FIG. 5B. Also good.

  Here, the outline of the manufacturing process of the multilayer structure of the antenna module 1 will be described with reference to FIG. For simplification of description, the manufacturing process of a four-layer structure will be described below by taking a part of the column wall waveguide 2 as an example as shown in the upper left part of FIG. 6 showing the manufacturing process.

  First, copper foils CF1 and CF2 are formed on both surfaces of a dielectric layer I such as a glass cloth base epoxy resin (FIG. 6: (1)).

  Next, the copper foil CF2 on the upper surface side is removed by etching, leaving a region to be a conductor portion (FIG. 6: (2)).

  A second dielectric layer II is further laminated on the upper surface side of the copper foil CF2 on the upper surface side and the first dielectric layer I leaving the region to be a conductor portion. Further, a copper foil CF3 is formed on the upper surface of the laminated second dielectric layer II (FIG. 6: (3)).

  Then, on each of the copper foil CF1 on the lower surface side of the first dielectric layer I and the copper foil CF3 formed on the upper surface of the second dielectric layer II, the copper plating CM1,2 and the lid plating LM1, are sequentially formed. 2 are applied in order (FIG. 6: (4)).

  Further, using the mask, the copper foil CF3, the copper plating CM2, and the cover plating LM2 on the upper surface of the second dielectric layer II are etched away except for the portion where the waveguide 2 is formed (FIG. 6: (5)). ).

  Next, the third dielectric III is formed on the upper surface of the second dielectric II. Next, a through hole is formed from the third dielectric III at a position corresponding to the central conductor 23, and copper plating is applied to the inner surface of the through hole. Further, the copper foil CF1, copper plating CM1, and lid plating LM1 layers corresponding to the front end side of the through hole are removed leaving a region to be a conductor portion (FIG. 6: (6)).

  Further, a fourth dielectric layer IV is formed below the first dielectric I. A copper foil CF4 is formed below the fourth dielectric IV. Then, a through hole is formed at a position corresponding to the metal pillar 20 from the copper foil CF4 side, and the inner surface is plated with copper. Thereby, the metal pillar 20 is formed (FIG. 6: (7)).

  Further, the copper foil CF4 is removed, leaving a portion to be a peripheral conductor of the waveguide 2 (FIG. 6: (8)).

  As outlined above, the antenna module according to the present invention can be easily manufactured in a multilayer structure by a semiconductor manufacturing technique.

  FIG. 7 is a perspective view showing details of a waveguide portion in the antenna module according to the present invention.

  As described above, the plurality of metal pillars 20 are obtained by copper plating the inner surfaces of the through holes provided in the dielectric layer.

  The plurality of metal columns 20 and the conductive layers 21 and 22 on the upper and lower surfaces of the plurality of metal columns 20 form a closed space in which an opening 25 is provided on one side, that is, the waveguide 2. A space region into which the central conductor 23 connected to the line 24 such as a microstrip line is inserted is provided on the opposite side of the opening 25 of the closed space. This spatial region serves as a power feeding unit, and a millimeter wave signal inserted into the power feeding unit passes through the waveguide 2 and is radiated as an electromagnetic wave from the opening 25, that is, the end surface of the substrate.

  Here, since the plurality of metal pillars 20 become pseudo-peripheral conductors of the waveguide 2, the spacing between the adjacent metal pillars 20 is arranged to be shorter than the millimeter wave wavelength to be used.

  Further, in the embodiment shown in FIG. 7, metal pillars 20 </ b> A <b> 1 and 20 </ b> A <b> 2 are provided at left and right positions facing the inside of the opening 25. Thereby, the radiation | emission surface of the opening part 25 is set narrowly.

  The metal pillars 20 </ b> A <b> 1 and 20 </ b> A <b> 2 having such a configuration have a role of an impedance adjuster and can be matched with the spatial impedance outside the opening 25.

  Further, in FIG. 7, metal pillars 20 </ b> B <b> 1 and 20 </ b> B <b> 2 are provided at the left and right positions toward the outside of the opening 25. The metal pillars 20B1 and 20B2 have a function as a reflector.

  FIG. 8 is a diagram showing a distribution state of the intensity of the electric field E of the waveguide 2 for understanding the action of the reflector.

  FIG. 8A shows the distribution of the electric field E in the case of a waveguide having a structure without the metal pillars 20B1 and 20B2 serving as reflectors. FIG. 8A shows the metal pillars 20B1 and 20B1, as shown in FIG. It is an intensity distribution of the electric field E in the case of a waveguide having a structure having 20B2.

  From the comparison between FIG. 8A and FIG. 8B, in the case of the waveguide having the metal pillars 20B1 and 20B2 in FIG. 8B, the distribution of the electric field E from the opening to the rear is suppressed, and the forward direction It can be understood that the intensity of the electric field E is increased.

  Thus, as one of the features of the present invention, by providing the reflectors on the left and right of the opening 25 of the waveguide 2, the strength of the forward electrolysis E can be increased.

  In the following, the effect of the metal columns 20A1 and 20A2 (hereinafter referred to as matching posts) as impedance adjusters and the metal columns 20B1 and 20B2 (hereinafter referred to as reflectors) as reflectors will be further discussed with respect to simulation measurement results. To do.

  In the measurement, a measuring instrument is placed at an angle of 0 ° that coincides with the horizontal direction in front of the opening 25 of the waveguide 2, and the measuring instrument is ± 90 ° in the direction of the E plane as shown in FIG. Thus, the change in radiation characteristics was measured by moving ± 90 ° in the direction of the H plane.

  11 and 12 are measurement result graphs showing changes in characteristics due to match-in post. FIG. 11 shows the radiation characteristics on the E plane when the measuring instrument is moved vertically within a range of ± 90 ° as shown in FIG. 9, and FIG. 12 shows the measuring instrument horizontally within a range of ± 90 ° as shown in FIG. It is a measurement result of the radiation characteristic in the H surface when moving in the direction.

  The horizontal axis represents the angle ± 90 °, and the vertical axis represents the gain in terms of a gain ratio (absolute gain) dBi with respect to the completely omnidirectional antenna. The same applies to the characteristic graph below.

  In FIG. 11, when the match-in post is provided (FIG. 11A) as compared to the case where the match-in post is not provided (FIG. 11B), the angle ± 90 ° for each of the operating frequencies 58 GHz to 66 GHz. It can be understood that the gain is improved in the range of.

  In addition, in FIG. 12, when the match-in post is provided (FIG. 12A) compared to the case where the match-in post is not provided (FIG. 12B), the frequency used is the same as in FIG. It can be understood that the gain is improved in the range of the angle ± 90 ° for each of 58 GHz to 66 GHz.

  That is, as an effect of match-in-post, there is an effect of improving the gain of a signal emitted to the outside by matching the external space impedance with the impedance of the waveguide from the opening 25 of the waveguide 2.

  Next, FIG. 13 and FIG. 14 are measurement result graphs showing changes in characteristics due to the reflector. FIG. 13 shows radiation characteristics on the E plane when the measuring device is moved vertically within a range of ± 90 ° as shown in FIG. 9, and FIG. 14 shows the measuring device horizontally within a range of ± 90 ° as shown in FIG. It is a measurement result of the radiation characteristic in the H surface when moving in the direction.

  The magnitudes of gains at the angle 0 ° on the E plane shown in FIG. 13 and the angle 0 ° on the H plane shown in FIG. 14 coincide with each other, and FIG. 13 shows the presence of a reflector (FIG. 13 (A)). Fig. 14 shows the change in gain according to the angle of the E plane according to Fig. 13B. Fig. 14 shows the change of the H plane according to the presence of the reflector (Fig. 14A) and without (Fig. 14B). The change in gain with angle is shown.

  In particular, it can be understood that the gain in the region where the angle of the H plane is large is decreased and the gain is increased in the direction perpendicular to the opening 25, that is, in the direction of 0 ° in the E plane and the H plane.

  Accordingly, according to the present invention, by providing a match-in post in the waveguide, the energy of the signal emitted from the opening 25 is increased, and further, the spread of the emitted radio wave is suppressed, and the direction perpendicular to the opening 25 is increased. To increase the gain of the emitted signal.

  FIG. 15 further shows an embodiment of the present invention, which is a configuration example in which a waveguide 40 is provided in front of the opening 25 of the waveguide 2.

  The director 40 of FIG. 15A is a loop type, and two conductive posts are each formed into a loop shape with upper and lower conductors. On the other hand, the configuration shown in FIG. 15B is a post type, and two conductive posts follow the front of the opening 25 and are arranged in two stages.

  FIG. 16 is a plan view (FIGS. 16A and 16B) showing an example arrangement of the director 40 corresponding to FIG.

  FIGS. 17 and 18 are graphs showing the gain improvement in the direction of the director 40 as an effect of the director 30.

  In FIG. 17, the horizontal axis represents frequency and the vertical axis represents gain. In this figure, it can be seen that when the waveguide is provided, the gain is increased at each use frequency.

  Further, FIG. 18 shows changes [1] and [2] depending on the angle from the direction of the waveguide of the E plane with and without the waveguide, and the direction of the waveguide of the H plane with and without the waveguide at a use frequency of 60 GHz. The change [3], [4] depending on the angle is shown. FIG. 18 shows the relative amplitude (dB) based on the maximum gain under each condition.

  Thereby, when a director is provided, it can be understood that the gain is concentrated in the direction of the director 30 (the angle of the E plane and the H plane is 0 °) in both the E plane and the H plane.

  When such characteristics are used, it is possible to concentrate the beam in a desired direction and increase the gain by changing the position of the waveguide with respect to the direction of the waveguide to be fixed.

  FIG. 19 is an embodiment showing a form of a wireless device using the reflector described above, and is an embodiment using the reflector for transmission / reception separation.

  In this embodiment, the reflectors 50 are provided with waveguides 2A and 2B independently for transmission and reception. The reflector 50 can be formed by a plurality of conductive posts, or by a metal plate, as in the previous embodiment.

  By providing such a reflector 50, it is possible to achieve isolation between transmission and reception, and by adjusting the angle of the reflector 50, the directivity of the H plane can be easily controlled in synergy with the effect of the waveguide 40. Can do.

  FIG. 20 is a configuration example for further suppressing the tilt (bias) of the beam radiated from the opening 25 of the waveguide 2 in the E-plane direction.

  That is, the PCB substrate 6 is provided with through-hole rows (a plurality of through-holes provided in the vertical direction in the drawing) 31. A metal plate is equivalently formed below the waveguide 2 by the through-hole row 31.

  The position of the through-hole row 31 is a distance that matches the phase of the beam radiated from the opening 25 with the phase of the beam reflected and turned back by the through-hole row, and is therefore a half of the wavelength used. That's it.

  On the other hand, the end face of the metal shield cap 5 covering the chip 4 corresponds to the upper side of the waveguide 2.

  Therefore, the tilt component in the E-plane direction of the millimeter wave beam radiated from the opening 25 is reflected by these through-hole rows and by the end face of the shield cap 5 so that the beam can be concentrated in the forward direction.

1: Antenna module
10: Antenna package
2: Waveguide 20: Metal pillar (post)
21, 22: Conductor (copper foil)
23: Center conductor 24: Track
3: Interface part
30: Terminal 4: Semiconductor chip
4A, 4B: Bump 5: Shield cover
6: PCB substrate
20A1, 20A2: Matching post
20B1, 20B2: reflector 40: director

Claims (9)

An antenna module having a waveguide composed of a plurality of metal pillars,
An antenna package;
A semiconductor chip having a wireless transmission / reception function connected to the antenna package;
The antenna package is
A waveguide having an opening on one end surface side and configured by a plurality of metal pillars;
An interface circuit between the semiconductor chip having the wireless transmission / reception function and an external circuit is formed in a multilayer structure with a dielectric and a conductor, integrally with the waveguide, on the side opposite to the opening of the waveguide.
An antenna module characterized by that. In claim 1,
The waveguide is formed with a feeding portion into which a central conductor is inserted on the rear side opposite to the one end face side,
A line connecting the input end or output end of the semiconductor chip having the wireless transmission / reception function and the central conductor is formed in the antenna package,
An antenna module characterized by that. An antenna module having a waveguide composed of a plurality of metal pillars,
A printed circuit board having a circuit conductor formed of a multilayer structure;
A semiconductor chip having a wireless transmission / reception function connected to the printed circuit board;
A plurality of metal pillars having an opening corresponding to one end surface of the printed circuit board in a partial region of the multilayer structure of the printed circuit board and integrally formed with a circuit conductor of the printed circuit board. Having a waveguide configured;
An antenna module characterized by that. In claim 3,
The waveguide is formed with a feeding portion into which a central conductor is inserted on the rear side opposite to the one end face side,
A line connecting the input end or output end of the semiconductor chip having the wireless transmission / reception function and the central conductor is formed on the printed circuit board,
An antenna module characterized by that. In any one of Claims 1 thru | or 4,
An antenna module, wherein a first additional metal column is formed at an inner position narrowing the opening of the opening of the waveguide, and impedance matching is performed with an air layer outside the opening. In any one of Claims 1 thru | or 5,
A reflector is formed by a second additional metal column or a conductive plate on both sides of the outside of the opening of the waveguide. In any one of Claims 1 thru | or 6.
An antenna module comprising a third additional metal column-shaped waveguide arranged in one or more stages at a position in the front direction outside the opening of the waveguide. An antenna module is a wireless device mounted on a printed circuit board,
The antenna module includes an antenna package and a semiconductor chip having a wireless transmission / reception function connected to the antenna package,
The antenna package is
A waveguide having an opening on one end surface side and configured by a plurality of metal pillars;
An interface circuit between the semiconductor chip having the wireless transmission / reception function and an external circuit is formed in a multilayer structure with a dielectric and a conductor, integrally with the waveguide, on the side opposite to the opening of the waveguide.
A wireless device characterized by that. In claim 8,
The waveguide is formed with a feeding portion in which a central conductor is inserted on the side opposite to the one end side,
Furthermore, a semiconductor chip having a wireless transmission / reception function is connected to the interface portion of the waveguide and the wireless function portion,
A line connecting the input end or output end of the semiconductor chip having the wireless transmission / reception function and the central conductor is formed,
A wave reflector in the horizontal direction of the radio wave radiated from the opening of the waveguide is formed by an additional metal column or a conductive plate on both sides of the outside of the opening of the waveguide,
Furthermore, a shield cap that covers the semiconductor chip is provided,
A plurality of metal pillars connected to the pads of the antenna module on the printed circuit board;
The end face of the seed cap and the plurality of metal pillars formed on the printed circuit board function as a reflector in the vertical direction of the radio wave radiated from the opening of the waveguide, and are formed on the printed circuit board. The metal column is provided at a distance where the phase of the radio wave beam radiated from the opening matches the phase of the radio wave reflected by the plurality of metal columns formed on the printed circuit board.
A wireless device characterized by that.