WO2020235387A1 - Manufacturing device and manufacturing method - Google Patents

Manufacturing device and manufacturing method Download PDF

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Publication number
WO2020235387A1
WO2020235387A1 PCT/JP2020/018911 JP2020018911W WO2020235387A1 WO 2020235387 A1 WO2020235387 A1 WO 2020235387A1 JP 2020018911 W JP2020018911 W JP 2020018911W WO 2020235387 A1 WO2020235387 A1 WO 2020235387A1
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WO
WIPO (PCT)
Prior art keywords
packaging material
recess
maximum height
height roughness
male
Prior art date
Application number
PCT/JP2020/018911
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French (fr)
Japanese (ja)
Inventor
天野　真
山下　孝典
Original Assignee
大日本印刷株式会社
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Publication date
Application filed by 大日本印刷株式会社 filed Critical 大日本印刷株式会社
Priority to JP2020543126A priority Critical patent/JP6798650B1/en
Publication of WO2020235387A1 publication Critical patent/WO2020235387A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
    • H01G11/84—Processes for the manufacture of hybrid or EDL capacitors, or components thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings, jackets or wrappings of a single cell or a single battery
    • H01M50/102—Primary casings, jackets or wrappings of a single cell or a single battery characterised by their shape or physical structure
    • H01M50/103—Primary casings, jackets or wrappings of a single cell or a single battery characterised by their shape or physical structure prismatic or rectangular
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present invention relates to a manufacturing apparatus configured to manufacture an accommodating body for a power storage device, and a method for producing the accommodating body.
  • Patent Document 1 discloses a power storage device including an exterior packaging material made of a laminated film.
  • the exterior packaging material (accommodator) made of a laminated film houses the power storage element inside.
  • the housing is molded to facilitate the housing of the power storage element.
  • the present invention has been made to solve such a problem, and an object of the present invention is to manufacture an apparatus and a manufacturing apparatus capable of manufacturing an accommodating body having a desired shape by molding a packaging material into a desired shape. To provide a method.
  • a manufacturing apparatus provides an accommodating body for a power storage device by molding a packaging material composed of a laminate having at least a base material layer, a barrier layer, and a thermosetting resin layer in this order. It is configured to be manufactured.
  • This manufacturing apparatus includes a female mold, a holding plate, and a male mold.
  • the female mold has a recess.
  • the presser plate has a hole formed at a position overlapping the recess in a plan view.
  • the male mold is configured to penetrate the hole and enter the recess. Roundness is formed on at least a part of the ridge line extending along the surface of the male surface that enters the recess.
  • the packaging material is molded by the male mold entering the recess while the packaging material is sandwiched between the female mold and the holding plate.
  • the maximum height roughness Rz of at least one surface of the female mold surface that is in contact with the packaging material and the surface of the presser plate that is in contact with the packaging material is the maximum height roughness of the ridgeline. Is less than or equal to Rz.
  • the maximum height roughness Rz of both the first surface and the second surface is larger than the maximum height roughness Rz of the ridgeline.
  • the contact area between the female mold and the presser plate and the packaging material is small and the force between the female mold and the presser plate is weak to sandwich the packaging material, the contact area between the male ridge line and the packaging material is large and the male Since the mold has a strong force to pull the packaging material into the recess, excessive pulling of the packaging material may occur.
  • the roundness (R) on the male ridgeline is not sufficiently formed in the packaging material, and the corners of the packaging material may be gently curved. Further, for example, excessive pulling of the packaging material may cause scratches on the front surface and the back surface of the packaging material.
  • the maximum height roughness Rz of at least one of the first surface and the second surface is equal to or less than the maximum height roughness Rz of the ridgeline. Therefore, the contact between the female mold and the presser plate and the packaging material is compared with the case where the maximum height roughness Rz of both the first surface and the second surface is larger than the maximum height roughness Rz of the ridgeline. Since the area is large and the female mold and the presser plate have a strong force to sandwich the packaging material, and the contact area between the ridgeline of the male mold and the packaging material is small, the male mold has a weak force to pull the packaging material into the recess. Excessive pulling of material does not occur.
  • the roundness (R) on the male ridgeline can be shaped into the packaging material. Further, according to this manufacturing apparatus, since the packaging material is not excessively drawn in, it is possible to suppress a situation in which scratches are generated on the front surface and the back surface of the packaging material.
  • the maximum height roughness Rz of each of the first surface and the second surface may be equal to or less than the maximum height roughness Rz of the ridgeline.
  • the female mold, the holding plate and the packaging Since the contact area with the material is large and the female mold and the holding plate have a strong force to pinch the packaging material, the contact area between the ridgeline of the male mold and the packaging material is small, and the male mold has a force to pull the packaging material into the recess. Due to its weakness, excessive pulling of the packaging material does not occur.
  • the roundness (R) on the male ridgeline can be sufficiently shaped in the packaging material. Further, according to this manufacturing apparatus, since the packaging material is not excessively drawn in, it is possible to further suppress the situation where the front surface and the back surface of the packaging material are scratched.
  • the maximum height roughness Rz of at least one of the first surface and the second surface may be less than 1.6 ⁇ m.
  • the maximum height roughness Rz of the ridgeline may be 0.8 ⁇ m or more.
  • the male shape in plan view is rectangular and has a long side and a short side, and the length of the long side may be 150 mm or more.
  • a manufacturing method is a housing for a power storage device by molding a packaging material composed of a laminate having at least a base material layer, a barrier layer, and a thermosetting resin layer in this order.
  • the manufacturing apparatus includes a female mold, a holding plate, and a male mold.
  • the female mold has a recess.
  • the presser plate has a hole formed at a position overlapping the recess in a plan view.
  • the male mold is configured to penetrate the hole and enter the recess. Roundness is formed on at least a part of the ridge line extending along the surface of the male surface that enters the recess.
  • the manufacturing method includes a step of sandwiching the packaging material between the female mold and the pressing plate, and a step of molding the packaging material by inserting the male mold into the recess.
  • the maximum height roughness Rz of at least one surface of the female mold surface that is in contact with the packaging material and the surface of the presser plate that is in contact with the packaging material is the maximum height roughness of the ridgeline. Is less than or equal to Rz.
  • the maximum height roughness Rz of at least one of the first surface and the second surface is equal to or less than the maximum height roughness Rz of the ridgeline. Therefore, the contact between the female mold and the presser plate and the packaging material is compared with the case where the maximum height roughness Rz of both the first surface and the second surface is larger than the maximum height roughness Rz of the ridgeline. Since the area is large and the female mold and the presser plate have a strong force to sandwich the packaging material, and the contact area between the ridgeline of the male mold and the packaging material is small, the male mold has a weak force to pull the packaging material into the recess. Excessive pulling of material does not occur.
  • the roundness (R) on the male ridgeline can be sufficiently shaped in the packaging material. Further, according to this manufacturing method, since the packaging material is not excessively drawn in, it is possible to suppress a situation in which scratches are generated on the front surface and the back surface of the packaging material.
  • the present invention it is possible to provide a manufacturing apparatus and a manufacturing method capable of manufacturing an accommodating body having a desired shape by molding the packaging material into a desired shape.
  • FIG. 4 is a sectional view taken along line VI-VI of FIG. It is a figure which shows the state before the male mold rises while the packaging material is sandwiched by a female mold and a holding plate. It is a figure which shows the state after the packaging material is sandwiched by a female mold and a holding plate, and the male mold is raised. It is a flowchart which shows the manufacturing procedure of a molded product.
  • FIG. 1 is a diagram showing an outline of a manufacturing apparatus 10 according to the present embodiment.
  • the manufacturing apparatus 10 uses a method in which the packaging material 20 is unwound from the winding body attached to the reel 30 described later, the packaging material 20 is molded by the molding unit 100 on the downstream side, and the packaging material 20 is cut in the width direction. For example, it is configured to manufacture an accommodating body for a power storage device.
  • the directions indicated by the arrows UDLRFB (up / down / left / right / front / rear) in FIG. 1 are common to each drawing.
  • the manufacturing apparatus 10 includes a reel 30, a transport unit 40, servo mechanisms 200 and 300, and a molding unit 100.
  • the reel 30 is configured to feed out the sheet-shaped packaging material 20.
  • the packaging material 20 is a so-called laminated film, and is composed of a laminate having at least a base material layer, a barrier layer, and a thermosetting resin layer in this order.
  • the transport unit 40 is configured to transport the packaging material 20 from the upstream side to the downstream side of the manufacturing apparatus 10.
  • Each of the servo mechanisms 200 and 300 is configured to control the drive of the molding unit 100.
  • the molding unit 100 is configured to mold the packaging material 20 by receiving driving force from each of the servo mechanisms 200 and 300. When the molding by the molding unit 100 is completed, the molded product 50 (accommodating body) is completed.
  • FIG. 2 is a diagram showing an outline of the molding unit 100.
  • the molding unit 100 includes a base 102, a female mold 110, a base 104, a plurality of air cylinders 132, a holding plate 130, a male mold 120, and a plurality of pillars 106. Includes.
  • a female mold 110 is attached below the base 102 (in the direction of arrow D).
  • the base 102 is movable in the vertical direction with respect to each pillar 106.
  • the base 102 moves in the vertical direction by the driving force supplied from the servo mechanism 200.
  • FIG. 3 is a diagram showing an outline of a state in which the female mold 110 is viewed from below.
  • the female mold 110 has a rectangular shape in a plan view.
  • "rectangular shape” means not only a perfect rectangular shape having right-angled corners but also a substantially rectangular shape in which roundness (R) is formed at the four corners of the rectangle. is there. That is, what is represented by a substantially rectangular shape in the drawing can be replaced with a completely rectangular shape, and what is represented by a completely rectangular shape in the drawing can be replaced with a substantially rectangular shape.
  • R roundness
  • a hole H1 is formed on the surface 115 (lower surface) of the female mold 110, and a cutting blade (not shown) is provided on the downstream side (in the direction of arrow R) of the hole H1 on the surface 115.
  • the shape of the hole H1 in a plan view is a shape in which R is formed at the four corners of the rectangle. That is, the shape of the hole H1 in a plan view is substantially rectangular.
  • the shape of the hole H1 in a plan view does not necessarily have to be substantially rectangular, and may be completely rectangular.
  • the female mold 110 does not necessarily have to have the hole H1 formed, and may simply have a recess.
  • the "recess” does not simply mean a recess, but is a concept including a hole.
  • a holding plate 130 is attached above the base 104 (in the direction of arrow U) via a plurality of air cylinders 132.
  • the presser plate 130 can move in the vertical direction by the driving force supplied from the air cylinder 132.
  • the packaging material 20 is sandwiched between the female mold 110 and the pressing plate 130 while the pressing plate 130 is pressed upward. That is, when the packaging material 20 is molded, the upper surface of the holding plate 130 comes into contact with the lower surface of the packaging material 20 (thermosetting resin layer (innermost layer)).
  • FIG. 4 is a diagram showing an outline of a state in which the presser plate 130 and the male type 120 are viewed from above.
  • the pressing plate 130 has a rectangular shape in a plan view, and a hole H2 is formed on the surface 135 (upper surface) of the pressing plate 130.
  • the shape of the hole H2 in a plan view is a shape in which R is formed at the four corners of the rectangle. That is, the shape of the hole H2 in a plan view is substantially rectangular.
  • the shape of the hole H2 in a plan view does not necessarily have to be substantially rectangular, and may be completely rectangular.
  • the position of the hole H2 in the molding unit 100 is a position overlapping the hole H1 (FIGS. 2 and 3) in a plan view.
  • An air cylinder 132 is arranged below each of the four corners of the presser plate 130.
  • the male type 120 can move in the vertical direction through the hole H2 formed in the holding plate 130.
  • the male type 120 moves in the vertical direction by the driving force supplied from the servo mechanism 300.
  • the male type 120 moves upward, the male type 120 enters the hole H1 formed in the female type 110.
  • the packaging material 20 is molded and the hole H1 on the surface 115 of the female mold 110 is formed.
  • the packaging material 20 is cut in the width direction (arrow FB direction) by a cutting blade (not shown) provided on the downstream side (arrow R direction).
  • the shape of the male type 120 in a plan view is rectangular and has a long side and a short side.
  • the length of the long side is, for example, 150 mm or more
  • the length of the short side is, for example, 50 mm or more.
  • a groove G1 for allowing air to escape during molding of the packaging material 20 is formed on the surface 125 (upper surface) of the male mold 120.
  • roundness (R) is formed at the four corners of the surface 125 of the male mold 120. That is, the shape of the male type 120 in a plan view is substantially rectangular.
  • the shape of the male type 120 in a plan view does not necessarily have to be substantially rectangular, and may be a perfect rectangular shape.
  • FIG. 5 is a sectional view taken along line VV of FIG.
  • FIG. 6 is a sectional view taken along line VI-VI of FIG.
  • each of the ridge lines extending along the surface 125 (the ridge line existing between the surface 125 and each side surface of the male type 120) is formed with a roundness (R). ..
  • the ridge line extending along the surface 125 (hereinafter, also referred to as “male type 120 ridge line”) mainly contacts the packaging material 20.
  • the roundness (R) formed on each of the ridges extending along the surface 125 is smaller than the roundness (R) formed at the corner (FIG. 4) of the surface 125 in a plan view.
  • FIG. 7 is a diagram showing a state in which the packaging material 20 is sandwiched between the female mold 110 and the holding plate 130, and the male mold 120 is before rising.
  • FIG. 8 is a diagram showing a state in which the packaging material 20 is sandwiched between the female mold 110 and the holding plate 130, and the male mold 120 is raised. As shown in FIG. 8, as the male mold 120 rises, a force is applied to the packaging material 20 in the direction in which the packaging material 20 is pulled toward the recess of the female mold 110 (in the direction of the arrow in FIG. 8).
  • the surface roughness of the surfaces 115 and 135 is coarser than the surface roughness of the ridge line extending along the surface 125.
  • the maximum height roughness Rz (3.2 ⁇ m) of the surfaces 115 and 135 is larger than the maximum height roughness Rz (1.6 ⁇ m) of the ridge line extending along the surface 125.
  • the maximum height roughness Rz means the maximum height roughness (nominal value of Rz) specified in JIS B0659-1: 2002 Annex 1 Table 2.
  • the roundness (R) on the ridgeline of the male mold 120 may not be sufficiently shaped in the packaging material 20, and the corners of the packaging material 20 may be gently curved. Further, for example, when the packaging material 20 is excessively drawn in, scratches may occur on the front surface and the back surface of the packaging material 20.
  • the surface roughness of the surfaces 115 and 135 is smoother than the surface roughness of the ridge line extending along the surface 125. That is, the maximum height roughness Rz (for example, 0.8 ⁇ m) of the surfaces 115 and 135 is equal to or less than the maximum height roughness Rz (for example, 1.6 ⁇ m) of the ridge line extending along the surface 125.
  • the contact area between the female mold 110 and the pressing plate 130 and the packaging material 20 is large and the force between the female mold 110 and the pressing plate 130 to sandwich the packaging material 20 is strong, the ridgeline of the male mold 120 and the packaging material 20 are further combined. Since the contact area is small and the male mold 120 has a weak force to pull the packaging material 20 into the hole H1 of the female mold 110, excessive pulling of the packaging material 20 does not occur.
  • the manufacturing apparatus 10 As a result, according to the manufacturing apparatus 10 according to the present embodiment, even if the long side of the male mold 120 is in contact with the packaging material 20 at the time of molding, for example, the roundness (R) on the ridgeline of the male mold 120 is Can be sufficiently shaped into the packaging material 20. Further, according to the manufacturing apparatus 10, since the packaging material 20 is not excessively drawn in, it is possible to suppress a situation in which scratches are generated on the front surface and the back surface of the packaging material 20.
  • the maximum height roughness Rz of the surfaces 115 and 135 is 0.2 ⁇ m on the premise that the maximum height roughness Rz of the surfaces 115 and 135 is equal to or less than the maximum height roughness Rz of the ridgeline of the male type 120. As mentioned above, it may be less than 1.6 ⁇ m. That is, the surfaces 115 and 135 may be provided with a so-called mirror finish.
  • the maximum height roughness Rz of the surfaces 115 and 135 is equal to or less than the maximum height roughness Rz of the ridgeline of the male type 120 is satisfied. It may be 0.8 ⁇ m or more and 3.2 ⁇ m or less.
  • FIG. 9 is a flowchart showing a manufacturing procedure of the molded product 50. The process shown in FIG. 9 is executed by the manufacturing apparatus 10 after the packaging material 20 to be processed is arranged between the female mold 110 and the pressing plate 130.
  • the manufacturing apparatus 10 sandwiches the packaging material 20 between the female mold 110 and the holding plate 130 by lowering the base 102 (step S100).
  • the manufacturing apparatus 10 controls each air cylinder 132 to pressurize the pressing plate 130 upward, thereby sandwiching the packaging material 20 more strongly (step S110).
  • the surface pressure in this case is 0.27 MPa.
  • the surface pressure is appropriately adjusted according to the characteristics of the packaging material 20 and the like.
  • the manufacturing apparatus 10 molds the packaging material 20 by raising the male mold 120 (step S120). As a result, the molded product 50 is completed.
  • the maximum height roughness Rz of the surfaces 115 (first surface) and 135 (second surface) is the maximum height roughness of the ridge line extending along the surface 125. Is less than or equal to Rz.
  • the roundness (R) on the ridgeline of the male mold 120 can be sufficiently shaped in the packaging material 20.
  • the packaging material 20 is not excessively drawn in, it is possible to suppress a situation in which scratches are generated on the front surface and the back surface of the packaging material 20.
  • the maximum height roughness Rz of the surfaces 115 (first surface) and 135 (second surface) is higher than the maximum height roughness Rz of the ridge line extending along the surface 125. Is also preferably small.
  • the maximum height roughness Rz of both the surface 115 of the female mold 110 and the surface 135 of the holding plate 130 is the maximum height of the ridge line extending along the surface 125 of the male mold 120. It was considered that the roughness was Rz or less. However, the maximum height roughness Rz of both the surface 115 and the surface 135 does not necessarily have to be equal to or less than the maximum height roughness Rz of the ridgeline extending along the surface 125 of the male type 120. For example, only the maximum height roughness Rz of any one of the surfaces 115 and 135 may be equal to or less than the maximum height roughness Rz of the ridge line extending along the surface 125.
  • the maximum height roughness Rz of the surface 115 is equal to or less than the maximum height roughness Rz of the ridgeline of the male type 120, it is possible to suppress the occurrence of scratches on the base material layer side of the packaging material 20. .. As a result, for example, in a module in which a plurality of molded products 50 accommodating a power storage element are arranged, the possibility of dielectric breakdown occurring between adjacent molded products 50 can be suppressed.
  • the maximum height roughness Rz of the surface 135 is equal to or less than the maximum height roughness Rz of the ridgeline of the male type 120, scratches on the thermosetting resin layer side of the packaging material 20 may occur. It can be suppressed. As a result, for example, the internal insulating property of the molded product 50 containing the power storage element can be maintained.
  • the female mold 110 is arranged above and the male mold 120 is arranged below.
  • the male mold 120 is arranged above and the female mold 110 is arranged below. It may be arranged.
  • the positions of the presser plate 130, the air cylinder 132, the servo mechanisms 200, 300, etc. are also adjusted as appropriate.
  • examples of the power storage device accommodated in the molded product 50 in the above embodiment are, for example, an all-solid-state battery, a lithium ion battery, a lithium ion polymer battery, a lead storage battery, a nickel / hydrogen storage battery, a nickel / cadmium storage battery, and a nickel / iron.
  • Another example of the power storage device is a capacitor, an electric double layer capacitor (EDLC), and a lithium ion capacitor.
  • R is formed on the entire circumference of the ridge line extending along the surface 125 of the male mold 120.
  • R may be formed only in a part of the ridgeline.

Abstract

This manufacturing device is configured to manufacture a housing for a power storage device by shaping a packaging material composed of a laminate including at least a base layer, a barrier layer, and a thermally fusible resin layer in this order. The manufacturing device has a female mold, a holding plate, and a male mold. The female mold has a recess. The holding plate has a hole formed at a position overlapping the recess in plan view. The male mold is configured to pass through the hole and enter the recess. A ridge extending along the surface that enters the recess among the surfaces of the male mold is at least partially rounded. The maximum height roughness Rz of a first surface that contacts the packaging material among the surfaces of the female mold and/or a second surface that contacts the packaging material among the surfaces of the holding plate is less than or equal to the maximum height roughness Rz of the ridge.

Description

製造装置及び製造方法Manufacturing equipment and manufacturing method
　本発明は、蓄電デバイス用の収容体を製造するように構成された製造装置、及び、該収容体の製造方法に関する。 The present invention relates to a manufacturing apparatus configured to manufacture an accommodating body for a power storage device, and a method for producing the accommodating body.
　特開２０１９－３８４２号公報（特許文献１）は、ラミネートフィルムによって構成された外装用包装材を備える蓄電デバイスを開示する。 Japanese Unexamined Patent Publication No. 2019-3842 (Patent Document 1) discloses a power storage device including an exterior packaging material made of a laminated film.
特開２０１９－３８４２号公報Japanese Unexamined Patent Publication No. 2019-3842
　上記特許文献１に開示されるような蓄電デバイスにおいて、ラミネートフィルムによって構成された外装用包装材（収容体）は、内部に蓄電素子を収容する。蓄電素子の収容を容易にするために、多くの場合、収容体は成型されている。しかしながら、ラミネートフィルムのような包材を所望の形状に成型することは必ずしも容易ではない。 In the power storage device as disclosed in Patent Document 1, the exterior packaging material (accommodator) made of a laminated film houses the power storage element inside. In many cases, the housing is molded to facilitate the housing of the power storage element. However, it is not always easy to mold a packaging material such as a laminated film into a desired shape.
　本発明は、このような問題を解決するためになされたものであって、その目的は、包材を所望の形状に成型することによって、所望の形状の収容体を製造可能な製造装置及び製造方法を提供することである。 The present invention has been made to solve such a problem, and an object of the present invention is to manufacture an apparatus and a manufacturing apparatus capable of manufacturing an accommodating body having a desired shape by molding a packaging material into a desired shape. To provide a method.
　本発明のある局面に従う製造装置は、少なくとも、基材層、バリア層及び熱融着性樹脂層をこの順に有する積層体により構成された包材を成型することによって、蓄電デバイス用の収容体を製造するように構成されている。この製造装置は、雌型と、押え板と、雄型とを備える。雌型は、凹部を有する。押え板は、平面視において上記凹部と重なる位置に形成された孔を有する。雄型は、上記孔を貫通し上記凹部に進入するように構成されている。雄型の面のうち上記凹部に進入する面に沿って延びる稜線の少なくとも一部には、丸みが形成されている。包材が雌型と押え板とによって挟まれた状態で、雄型が上記凹部に進入することによって包材が成型される。雌型の面のうち包材と接する第１面、及び、押え板の面のうち包材と接する第２面の少なくとも一方の面の最大高さ粗さＲｚは、上記稜線の最大高さ粗さＲｚ以下である。 A manufacturing apparatus according to a certain aspect of the present invention provides an accommodating body for a power storage device by molding a packaging material composed of a laminate having at least a base material layer, a barrier layer, and a thermosetting resin layer in this order. It is configured to be manufactured. This manufacturing apparatus includes a female mold, a holding plate, and a male mold. The female mold has a recess. The presser plate has a hole formed at a position overlapping the recess in a plan view. The male mold is configured to penetrate the hole and enter the recess. Roundness is formed on at least a part of the ridge line extending along the surface of the male surface that enters the recess. The packaging material is molded by the male mold entering the recess while the packaging material is sandwiched between the female mold and the holding plate. The maximum height roughness Rz of at least one surface of the female mold surface that is in contact with the packaging material and the surface of the presser plate that is in contact with the packaging material is the maximum height roughness of the ridgeline. Is less than or equal to Rz.
　仮に、上記第１面及び上記第２面の双方の最大高さ粗さＲｚが上記稜線の最大高さ粗さＲｚよりも大きいとする。この場合には、雌型及び押え板と包材との接触面積が小さく雌型及び押え板が包材を挟む力が弱いため、さらに、雄型の稜線と包材との接触面積が大きく雄型が包材を上記凹部内に引き込む力が強いため、包材の過度な引込みが発生し得る。その結果、たとえば、雄型の稜線上の丸み（アール（Ｒ））が包材に十分に賦形されず、包材の角がなだらかに湾曲した形状となり得る。また、たとえば、包材が過度に引き込まれることによって、包材の表面及び裏面に擦れキズが発生し得る。 It is assumed that the maximum height roughness Rz of both the first surface and the second surface is larger than the maximum height roughness Rz of the ridgeline. In this case, since the contact area between the female mold and the presser plate and the packaging material is small and the force between the female mold and the presser plate is weak to sandwich the packaging material, the contact area between the male ridge line and the packaging material is large and the male Since the mold has a strong force to pull the packaging material into the recess, excessive pulling of the packaging material may occur. As a result, for example, the roundness (R) on the male ridgeline is not sufficiently formed in the packaging material, and the corners of the packaging material may be gently curved. Further, for example, excessive pulling of the packaging material may cause scratches on the front surface and the back surface of the packaging material.
　本発明に従う製造装置においては、上記第１面及び上記第２面の少なくとも一方の面の最大高さ粗さＲｚは、上記稜線の最大高さ粗さＲｚ以下である。したがって、上記第１面及び上記第２面の双方の最大高さ粗さＲｚが上記稜線の最大高さ粗さＲｚよりも大きい場合と比較して、雌型及び押え板と包材との接触面積が大きく雌型及び押え板が包材を挟む力が強いため、さらに、雄型の稜線と包材との接触面積が小さく雄型が包材を上記凹部内に引き込む力が弱いため、包材の過度な引込みが発生しない。その結果、この製造装置によれば、たとえば、雄型の稜線上の丸み（アール（Ｒ））を包材に賦形することができる。また、この製造装置によれば、包材が過度に引き込まれないため、包材の表面及び裏面に擦れキズが発生する事態を抑制することができる。 In the manufacturing apparatus according to the present invention, the maximum height roughness Rz of at least one of the first surface and the second surface is equal to or less than the maximum height roughness Rz of the ridgeline. Therefore, the contact between the female mold and the presser plate and the packaging material is compared with the case where the maximum height roughness Rz of both the first surface and the second surface is larger than the maximum height roughness Rz of the ridgeline. Since the area is large and the female mold and the presser plate have a strong force to sandwich the packaging material, and the contact area between the ridgeline of the male mold and the packaging material is small, the male mold has a weak force to pull the packaging material into the recess. Excessive pulling of material does not occur. As a result, according to this manufacturing apparatus, for example, the roundness (R) on the male ridgeline can be shaped into the packaging material. Further, according to this manufacturing apparatus, since the packaging material is not excessively drawn in, it is possible to suppress a situation in which scratches are generated on the front surface and the back surface of the packaging material.
　第１面及び第２面の各々の最大高さ粗さＲｚは、上記稜線の最大高さ粗さＲｚ以下であってもよい。 The maximum height roughness Rz of each of the first surface and the second surface may be equal to or less than the maximum height roughness Rz of the ridgeline.
　この場合には、上記第１面及び上記第２面の一方のみの最大高さ粗さＲｚが上記稜線の最大高さ粗さＲｚ以下である場合と比較して、雌型及び押え板と包材との接触面積が大きく雌型及び押え板が包材を挟む力が強いため、さらに、雄型の稜線と包材との接触面積が小さく雄型が包材を上記凹部内に引き込む力が弱いため、包材の過度な引込みが発生しない。その結果、この製造装置によれば、たとえば、雄型の稜線上の丸み（アール（Ｒ））を包材に十分に賦形することができる。また、この製造装置によれば、包材が過度に引き込まれないため、包材の表面及び裏面に擦れキズが発生する事態をより抑制することができる。 In this case, as compared with the case where the maximum height roughness Rz of only one of the first surface and the second surface is equal to or less than the maximum height roughness Rz of the ridgeline, the female mold, the holding plate and the packaging Since the contact area with the material is large and the female mold and the holding plate have a strong force to pinch the packaging material, the contact area between the ridgeline of the male mold and the packaging material is small, and the male mold has a force to pull the packaging material into the recess. Due to its weakness, excessive pulling of the packaging material does not occur. As a result, according to this manufacturing apparatus, for example, the roundness (R) on the male ridgeline can be sufficiently shaped in the packaging material. Further, according to this manufacturing apparatus, since the packaging material is not excessively drawn in, it is possible to further suppress the situation where the front surface and the back surface of the packaging material are scratched.
　第１面及び第２面の少なくとも一方の面の最大高さ粗さＲｚは、１．６μｍ未満であってもよい。 The maximum height roughness Rz of at least one of the first surface and the second surface may be less than 1.6 μm.
　上記稜線の最大高さ粗さＲｚは、０．８μｍ以上であってもよい。 The maximum height roughness Rz of the ridgeline may be 0.8 μm or more.
　平面視における雄型の形状は、長方形状であって、長辺及び短辺を有し、長辺の長さは、１５０ｍｍ以上であってもよい。 The male shape in plan view is rectangular and has a long side and a short side, and the length of the long side may be 150 mm or more.
　本発明の他の局面に従う製造方法は、少なくとも、基材層、バリア層及び熱融着性樹脂層をこの順に有する積層体により構成された包材を成型することによって、蓄電デバイス用の収容体を製造する方法である。製造装置は、雌型と、押え板と、雄型とを備える。雌型は、凹部を有する。押え板は、平面視において上記凹部と重なる位置に形成された孔を有する。雄型は、上記孔を貫通し上記凹部に進入するように構成されている。雄型の面のうち上記凹部に進入する面に沿って延びる稜線の少なくとも一部には、丸みが形成されている。製造方法は、雌型と押え板とによって包材を挟むステップと、雄型を上記凹部に進入させることによって包材を成型するステップとを含む。雌型の面のうち包材と接する第１面、及び、押え板の面のうち包材と接する第２面の少なくとも一方の面の最大高さ粗さＲｚは、上記稜線の最大高さ粗さＲｚ以下である。 A manufacturing method according to another aspect of the present invention is a housing for a power storage device by molding a packaging material composed of a laminate having at least a base material layer, a barrier layer, and a thermosetting resin layer in this order. Is a method of manufacturing. The manufacturing apparatus includes a female mold, a holding plate, and a male mold. The female mold has a recess. The presser plate has a hole formed at a position overlapping the recess in a plan view. The male mold is configured to penetrate the hole and enter the recess. Roundness is formed on at least a part of the ridge line extending along the surface of the male surface that enters the recess. The manufacturing method includes a step of sandwiching the packaging material between the female mold and the pressing plate, and a step of molding the packaging material by inserting the male mold into the recess. The maximum height roughness Rz of at least one surface of the female mold surface that is in contact with the packaging material and the surface of the presser plate that is in contact with the packaging material is the maximum height roughness of the ridgeline. Is less than or equal to Rz.
　本発明に従う製造方法においては、上記第１面及び上記第２面の少なくとも一方の面の最大高さ粗さＲｚは、上記稜線の最大高さ粗さＲｚ以下である。したがって、上記第１面及び上記第２面の双方の最大高さ粗さＲｚが上記稜線の最大高さ粗さＲｚよりも大きい場合と比較して、雌型及び押え板と包材との接触面積が大きく雌型及び押え板が包材を挟む力が強いため、さらに、雄型の稜線と包材との接触面積が小さく雄型が包材を上記凹部内に引き込む力が弱いため、包材の過度な引込みが発生しない。その結果、この製造方法によれば、たとえば、雄型の稜線上の丸み（アール（Ｒ））を包材に十分に賦形することができる。また、この製造方法によれば、包材が過度に引き込まれないため、包材の表面及び裏面に擦れキズが発生する事態を抑制することができる。 In the manufacturing method according to the present invention, the maximum height roughness Rz of at least one of the first surface and the second surface is equal to or less than the maximum height roughness Rz of the ridgeline. Therefore, the contact between the female mold and the presser plate and the packaging material is compared with the case where the maximum height roughness Rz of both the first surface and the second surface is larger than the maximum height roughness Rz of the ridgeline. Since the area is large and the female mold and the presser plate have a strong force to sandwich the packaging material, and the contact area between the ridgeline of the male mold and the packaging material is small, the male mold has a weak force to pull the packaging material into the recess. Excessive pulling of material does not occur. As a result, according to this manufacturing method, for example, the roundness (R) on the male ridgeline can be sufficiently shaped in the packaging material. Further, according to this manufacturing method, since the packaging material is not excessively drawn in, it is possible to suppress a situation in which scratches are generated on the front surface and the back surface of the packaging material.
　本発明によれば、包材を所望の形状に成型することによって、所望の形状の収容体を製造可能な製造装置及び製造方法を提供することができる。 According to the present invention, it is possible to provide a manufacturing apparatus and a manufacturing method capable of manufacturing an accommodating body having a desired shape by molding the packaging material into a desired shape.
製造装置の概略を示す図である。It is a figure which shows the outline of the manufacturing apparatus. 成型ユニットの概略を示す図である。It is a figure which shows the outline of the molding unit. 雌型を下方から見た状態の概略を示す図である。It is a figure which shows the outline of the state which the female type was seen from below. 押え板及び雄型を上方から見た状態の概略を示す図である。It is a figure which shows the outline of the state which the holding plate and the male form were seen from above. 図４のＶ－Ｖ断面図である。It is a VV cross-sectional view of FIG. 図４のＶＩ－ＶＩ断面図である。FIG. 4 is a sectional view taken along line VI-VI of FIG. 包材が雌型及び押え板によって挟まれており、かつ、雄型が上昇する前の状態を示す図である。It is a figure which shows the state before the male mold rises while the packaging material is sandwiched by a female mold and a holding plate. 包材が雌型及び押え板によって挟まれており、かつ、雄型が上昇した後の状態を示す図である。It is a figure which shows the state after the packaging material is sandwiched by a female mold and a holding plate, and the male mold is raised. 成型品の製造手順を示すフローチャートである。It is a flowchart which shows the manufacturing procedure of a molded product.
　以下、本発明の実施の形態について、図面を参照しながら詳細に説明する。なお、図中同一又は相当部分には同一符号を付してその説明は繰り返さない。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The same or corresponding parts in the drawings are designated by the same reference numerals, and the description thereof will not be repeated.
　［１．製造装置の概要］
　図１は、本実施の形態に従う製造装置１０の概略を示す図である。製造装置１０は、後述のリール３０に取付けられた巻取体から包材２０を繰り出し、下流側の成型ユニット１００で包材２０を成型するとともに、包材２０を幅方向に断裁する方式を用いて、たとえば、蓄電デバイス用の収容体を製造するように構成されている。なお、図１における矢印ＵＤＬＲＦＢ（上下左右前後）の各々が示す方向は各図面で共通である。 [1. Overview of manufacturing equipment]
FIG. 1 is a diagram showing an outline of a manufacturing apparatus 10 according to the present embodiment. The manufacturing apparatus 10 uses a method in which the packaging material 20 is unwound from the winding body attached to the reel 30 described later, the packaging material 20 is molded by the molding unit 100 on the downstream side, and the packaging material 20 is cut in the width direction. For example, it is configured to manufacture an accommodating body for a power storage device. The directions indicated by the arrows UDLRFB (up / down / left / right / front / rear) in FIG. 1 are common to each drawing.
　図１に示されるように、製造装置１０は、リール３０と、搬送ユニット４０と、サーボ機構２００，３００と、成型ユニット１００とを含んでいる。 As shown in FIG. 1, the manufacturing apparatus 10 includes a reel 30, a transport unit 40, servo mechanisms 200 and 300, and a molding unit 100.
　リール３０は、シート状の包材２０を繰り出すように構成されている。包材２０は、いわゆるラミネートフィルムであり、少なくとも、基材層、バリア層及び熱融着性樹脂層をこの順に有する積層体により構成されている。搬送ユニット４０は、包材２０を製造装置１０の上流側から下流側に搬送するように構成されている。サーボ機構２００，３００の各々は、成型ユニット１００の駆動を制御するように構成されている。成型ユニット１００は、サーボ機構２００，３００の各々から駆動力を受けることによって、包材２０を成型するように構成されている。成型ユニット１００による成型が完了すると、成型品５０（収容体）が完成する。 The reel 30 is configured to feed out the sheet-shaped packaging material 20. The packaging material 20 is a so-called laminated film, and is composed of a laminate having at least a base material layer, a barrier layer, and a thermosetting resin layer in this order. The transport unit 40 is configured to transport the packaging material 20 from the upstream side to the downstream side of the manufacturing apparatus 10. Each of the servo mechanisms 200 and 300 is configured to control the drive of the molding unit 100. The molding unit 100 is configured to mold the packaging material 20 by receiving driving force from each of the servo mechanisms 200 and 300. When the molding by the molding unit 100 is completed, the molded product 50 (accommodating body) is completed.
　［２．成型ユニットの構成］
　図２は、成型ユニット１００の概略を示す図である。図２に示されるように、成型ユニット１００は、基台１０２と、雌型１１０と、基台１０４と、複数のエアシリンダ１３２と、押え板１３０と、雄型１２０と、複数の柱１０６とを含んでいる。 [2. Molding unit configuration]
FIG. 2 is a diagram showing an outline of the molding unit 100. As shown in FIG. 2, the molding unit 100 includes a base 102, a female mold 110, a base 104, a plurality of air cylinders 132, a holding plate 130, a male mold 120, and a plurality of pillars 106. Includes.
　基台１０２の下方（矢印Ｄ方向）には雌型１１０が取り付けられている。基台１０２は、各柱１０６に対して上下方向に移動可能である。基台１０２は、サーボ機構２００から供給される駆動力によって、上下方向に移動する。 A female mold 110 is attached below the base 102 (in the direction of arrow D). The base 102 is movable in the vertical direction with respect to each pillar 106. The base 102 moves in the vertical direction by the driving force supplied from the servo mechanism 200.
　図３は、雌型１１０を下方から見た状態の概略を示す図である。図３に示されるように、雌型１１０は平面視矩形状である。なお、本明細書において、「矩形状」とは、四隅の角が直角の完全な矩形状の他、例えば、矩形の四隅に丸み（Ｒ）が形成されたような略矩形状も含む意味である。すなわち、図面において略矩形状で表現されているものは完全な矩形状に置換可能であり、図面において完全な矩形状で表現されているものは略矩形状に置換可能である。なお、本願明細書においては、角が丸みを帯びていることを「Ｒが形成されている」とも表現する。「Ｒが形成されている」とは、構造的には、面取り加工が施され、角が丸みを帯びた状態を意味する。また、「Ｒ」単独で角の丸みの半径を意味する場合がある。 FIG. 3 is a diagram showing an outline of a state in which the female mold 110 is viewed from below. As shown in FIG. 3, the female mold 110 has a rectangular shape in a plan view. In addition, in this specification, "rectangular shape" means not only a perfect rectangular shape having right-angled corners but also a substantially rectangular shape in which roundness (R) is formed at the four corners of the rectangle. is there. That is, what is represented by a substantially rectangular shape in the drawing can be replaced with a completely rectangular shape, and what is represented by a completely rectangular shape in the drawing can be replaced with a substantially rectangular shape. In the specification of the present application, the fact that the corners are rounded is also expressed as "R is formed". "R is formed" structurally means a state in which chamfering is performed and the corners are rounded. In addition, "R" alone may mean the radius of rounded corners.
　雌型１１０の面１１５（下面）には孔Ｈ１が形成されており、面１１５の孔Ｈ１の下流側（矢印Ｒ方向）には断裁刃（図示せず）が設けられている。孔Ｈ１の平面視における形状は、矩形の四隅にＲが形成された形状である。すなわち、孔Ｈ１の平面視における形状は、略矩形状である。なお、孔Ｈ１の平面視における形状は、必ずしも略矩形状である必要はなく、完全な矩形状であってもよい。 A hole H1 is formed on the surface 115 (lower surface) of the female mold 110, and a cutting blade (not shown) is provided on the downstream side (in the direction of arrow R) of the hole H1 on the surface 115. The shape of the hole H1 in a plan view is a shape in which R is formed at the four corners of the rectangle. That is, the shape of the hole H1 in a plan view is substantially rectangular. The shape of the hole H1 in a plan view does not necessarily have to be substantially rectangular, and may be completely rectangular.
　なお、雌型１１０には、必ずしも孔Ｈ１が形成されている必要はなく、単に窪みが形成されているだけであってもよい。本発明において、「凹部」は、単に窪みだけを意味するわけではなく、孔をも含む概念である。包材２０の成型時には、基台１０２（図２）が下降し、雌型１１０の面１１５が包材２０の上面（基材層（最外層））に接触する。 It should be noted that the female mold 110 does not necessarily have to have the hole H1 formed, and may simply have a recess. In the present invention, the "recess" does not simply mean a recess, but is a concept including a hole. At the time of molding the packaging material 20, the base 102 (FIG. 2) is lowered, and the surface 115 of the female mold 110 comes into contact with the upper surface (base material layer (outermost layer)) of the packaging material 20.
　再び図２を参照して、基台１０４の上方（矢印Ｕ方向）には、複数のエアシリンダ１３２を介して、押え板１３０が取り付けられている。押え板１３０は、エアシリンダ１３２から供給される駆動力によって、上下方向に移動可能である。包材２０の成型時には、押え板１３０が上方に加圧された状態で、包材２０が雌型１１０と押え板１３０とによって挟まれる。すなわち、包材２０の成型時には、押え板１３０の上面が包材２０の下面（熱融着性樹脂層（最内層））に接触する。 With reference to FIG. 2 again, a holding plate 130 is attached above the base 104 (in the direction of arrow U) via a plurality of air cylinders 132. The presser plate 130 can move in the vertical direction by the driving force supplied from the air cylinder 132. At the time of molding the packaging material 20, the packaging material 20 is sandwiched between the female mold 110 and the pressing plate 130 while the pressing plate 130 is pressed upward. That is, when the packaging material 20 is molded, the upper surface of the holding plate 130 comes into contact with the lower surface of the packaging material 20 (thermosetting resin layer (innermost layer)).
　図４は、押え板１３０及び雄型１２０を上方から見た状態の概略を示す図である。図４に示されるように、押え板１３０は平面視矩形状であり、押え板１３０の面１３５（上面）には孔Ｈ２が形成されている。孔Ｈ２の平面視における形状は、矩形の四隅にＲが形成された形状である。すなわち、孔Ｈ２の平面視における形状は、略矩形状である。なお、孔Ｈ２の平面視における形状は、必ずしも略矩形状である必要はなく、完全な矩形状であってもよい。成型ユニット１００における孔Ｈ２の位置は、平面視において孔Ｈ１（図２，３）と重なる位置である。押え板１３０の四隅の各々の下方には、エアシリンダ１３２が配置されている。 FIG. 4 is a diagram showing an outline of a state in which the presser plate 130 and the male type 120 are viewed from above. As shown in FIG. 4, the pressing plate 130 has a rectangular shape in a plan view, and a hole H2 is formed on the surface 135 (upper surface) of the pressing plate 130. The shape of the hole H2 in a plan view is a shape in which R is formed at the four corners of the rectangle. That is, the shape of the hole H2 in a plan view is substantially rectangular. The shape of the hole H2 in a plan view does not necessarily have to be substantially rectangular, and may be completely rectangular. The position of the hole H2 in the molding unit 100 is a position overlapping the hole H1 (FIGS. 2 and 3) in a plan view. An air cylinder 132 is arranged below each of the four corners of the presser plate 130.
　再び図２を参照して、雄型１２０は、押え板１３０に形成された孔Ｈ２を貫通して、上下方向に移動可能である。雄型１２０は、サーボ機構３００から供給される駆動力によって、上下方向に移動する。雄型１２０が上方に移動することによって、雄型１２０は、雌型１１０に形成された孔Ｈ１に進入する。包材２０が雌型１１０と押え板１３０とによって挟まれた状態で、雄型１２０が孔Ｈ１に進入することによって、包材２０の成型が行なわれるとともに、雌型１１０の面１１５の孔Ｈ１の下流側（矢印Ｒ方向）に設けられた断裁刃（図示せず）により包材２０が幅方向（矢印ＦＢ方向）に断裁される。 With reference to FIG. 2 again, the male type 120 can move in the vertical direction through the hole H2 formed in the holding plate 130. The male type 120 moves in the vertical direction by the driving force supplied from the servo mechanism 300. As the male type 120 moves upward, the male type 120 enters the hole H1 formed in the female type 110. When the male mold 120 enters the hole H1 while the packaging material 20 is sandwiched between the female mold 110 and the holding plate 130, the packaging material 20 is molded and the hole H1 on the surface 115 of the female mold 110 is formed. The packaging material 20 is cut in the width direction (arrow FB direction) by a cutting blade (not shown) provided on the downstream side (arrow R direction).
　再び図４を参照して、平面視における雄型１２０の形状は、長方形であって、長辺及び短辺を有する。長辺の長さは、たとえば、１５０ｍｍ以上であり、短辺の長さは、たとえば、５０ｍｍ以上である。また、雄型１２０の面１２５（上面）には、包材２０の成型時に空気を逃がすための溝Ｇ１が形成されている。また、雄型１２０の面１２５の四隅には、丸み（Ｒ）が形成されている。すなわち、雄型１２０の平面視における形状は、略矩形状である。なお、雄型１２０の平面視における形状は、必ずしも略矩形状である必要はなく、完全な矩形状であってもよい。 With reference to FIG. 4 again, the shape of the male type 120 in a plan view is rectangular and has a long side and a short side. The length of the long side is, for example, 150 mm or more, and the length of the short side is, for example, 50 mm or more. Further, a groove G1 for allowing air to escape during molding of the packaging material 20 is formed on the surface 125 (upper surface) of the male mold 120. In addition, roundness (R) is formed at the four corners of the surface 125 of the male mold 120. That is, the shape of the male type 120 in a plan view is substantially rectangular. The shape of the male type 120 in a plan view does not necessarily have to be substantially rectangular, and may be a perfect rectangular shape.
　図５は、図４のＶ－Ｖ断面図である。図６は、図４のＶＩ－ＶＩ断面図である。図５及び図６に示されるように、面１２５に沿って延びる稜線（面１２５と雄型１２０の各側面との間に存在する稜線）の各々には、丸み（Ｒ）が形成されている。包材２０の成型時には、面１２５に沿って延びる稜線（以下、「雄型１２０の稜線」とも称する。）が主に包材２０に接触する。なお、雄型１２０において、面１２５に沿って延びる稜線の各々に形成された丸み（Ｒ）は、平面視における面１２５の隅（図４）に形成された丸み（Ｒ）より小さい。 FIG. 5 is a sectional view taken along line VV of FIG. FIG. 6 is a sectional view taken along line VI-VI of FIG. As shown in FIGS. 5 and 6, each of the ridge lines extending along the surface 125 (the ridge line existing between the surface 125 and each side surface of the male type 120) is formed with a roundness (R). .. At the time of molding the packaging material 20, the ridge line extending along the surface 125 (hereinafter, also referred to as “male type 120 ridge line”) mainly contacts the packaging material 20. In the male type 120, the roundness (R) formed on each of the ridges extending along the surface 125 is smaller than the roundness (R) formed at the corner (FIG. 4) of the surface 125 in a plan view.
　［３．雌型及び雄型の表面粗さ］
　図７は、包材２０が雌型１１０及び押え板１３０によって挟まれており、かつ、雄型１２０が上昇する前の状態を示す図である。図８は、包材２０が雌型１１０及び押え板１３０によって挟まれており、かつ、雄型１２０が上昇した後の状態を示す図である。図８に示されるように、雄型１２０が上昇することによって、包材２０には、雌型１１０の凹部に向かって包材２０が引き込まれる方向（図８における矢印方向）の力が加わる。 [3. Surface roughness of female and male types]
FIG. 7 is a diagram showing a state in which the packaging material 20 is sandwiched between the female mold 110 and the holding plate 130, and the male mold 120 is before rising. FIG. 8 is a diagram showing a state in which the packaging material 20 is sandwiched between the female mold 110 and the holding plate 130, and the male mold 120 is raised. As shown in FIG. 8, as the male mold 120 rises, a force is applied to the packaging material 20 in the direction in which the packaging material 20 is pulled toward the recess of the female mold 110 (in the direction of the arrow in FIG. 8).
　仮に、面１１５，１３５の表面粗さが、面１２５に沿って延びる稜線の表面粗さよりも粗いとする。たとえば、面１１５，１３５の最大高さ粗さＲｚ（３．２μｍ）が、面１２５に沿って延びる稜線の最大高さ粗さＲｚ（１．６μｍ）よりも大きいとする。なお、本明細書において、最大高さ粗さＲｚは、ＪＩＳ　Ｂ０６５９－１：２００２附属書１表２に規定される、最大高さ粗さ（Ｒｚの呼び値）をいう。 Suppose that the surface roughness of the surfaces 115 and 135 is coarser than the surface roughness of the ridge line extending along the surface 125. For example, it is assumed that the maximum height roughness Rz (3.2 μm) of the surfaces 115 and 135 is larger than the maximum height roughness Rz (1.6 μm) of the ridge line extending along the surface 125. In this specification, the maximum height roughness Rz means the maximum height roughness (nominal value of Rz) specified in JIS B0659-1: 2002 Annex 1 Table 2.
　この場合には、雌型１１０及び押え板１３０と包材２０との接触面積が小さく雌型１１０及び押え板１３０が包材２０を挟む力が弱いため、さらに、雄型１２０の稜線と包材２０との接触面積が大きく雄型１２０が包材２０を雌型１１０の孔Ｈ１に引き込む力が強いため、包材２０の過度な引込みが発生し得る。 In this case, since the contact area between the female mold 110 and the pressing plate 130 and the packaging material 20 is small and the force between the female mold 110 and the pressing plate 130 to sandwich the packaging material 20 is weak, further, the ridge line and the packaging material of the male mold 120 Since the contact area with the 20 is large and the male type 120 has a strong force to pull the packaging material 20 into the hole H1 of the female type 110, excessive pulling of the packaging material 20 may occur.
　その結果、たとえば、雄型１２０の稜線上の丸み（Ｒ）が包材２０に十分に賦形されず、包材２０の角がなだらかに湾曲した形状となり得る。また、たとえば、包材２０が過度に引き込まれることによって、包材２０の表面及び裏面に擦れキズが発生し得る。 As a result, for example, the roundness (R) on the ridgeline of the male mold 120 may not be sufficiently shaped in the packaging material 20, and the corners of the packaging material 20 may be gently curved. Further, for example, when the packaging material 20 is excessively drawn in, scratches may occur on the front surface and the back surface of the packaging material 20.
　特に、このような現象は、包材２０のうち、成型時に雄型１２０の長辺が接する部分で顕著に生じる。包材２０のうち雄型１２０の長辺が接する部分は、各エアシリンダ１３２（図４）から遠くに位置しており、雌型１１０及び押え板１３０によって十分に押さえられていない可能性があるためである。 In particular, such a phenomenon occurs remarkably in the portion of the packaging material 20 where the long sides of the male mold 120 are in contact during molding. The portion of the packaging material 20 in contact with the long side of the male mold 120 is located far from each air cylinder 132 (FIG. 4), and may not be sufficiently pressed by the female mold 110 and the pressing plate 130. Because.
　本実施の形態に従う製造装置１０において、面１１５，１３５の表面粗さは、面１２５に沿って延びる稜線の表面粗さよりも滑らかである。すなわち、面１１５，１３５の最大高さ粗さＲｚ（たとえば、０．８μｍ）が、面１２５に沿って延びる稜線の最大高さ粗さＲｚ（たとえば、１．６μｍ）以下である。 In the manufacturing apparatus 10 according to the present embodiment, the surface roughness of the surfaces 115 and 135 is smoother than the surface roughness of the ridge line extending along the surface 125. That is, the maximum height roughness Rz (for example, 0.8 μm) of the surfaces 115 and 135 is equal to or less than the maximum height roughness Rz (for example, 1.6 μm) of the ridge line extending along the surface 125.
　したがって、雌型１１０及び押え板１３０と包材２０との接触面積が大きく雌型１１０及び押え板１３０が包材２０を挟む力が強いため、さらに、雄型１２０の稜線と包材２０との接触面積が小さく雄型１２０が包材２０を雌型１１０の孔Ｈ１に引き込む力が弱いため、包材２０の過度な引込みが発生しない。 Therefore, since the contact area between the female mold 110 and the pressing plate 130 and the packaging material 20 is large and the force between the female mold 110 and the pressing plate 130 to sandwich the packaging material 20 is strong, the ridgeline of the male mold 120 and the packaging material 20 are further combined. Since the contact area is small and the male mold 120 has a weak force to pull the packaging material 20 into the hole H1 of the female mold 110, excessive pulling of the packaging material 20 does not occur.
　その結果、本実施の形態に従う製造装置１０によれば、包材２０のうち成型時に雄型１２０の長辺が接する位置であったとしても、たとえば、雄型１２０の稜線上の丸み（Ｒ）を包材２０に十分に賦形することができる。また、製造装置１０によれば、包材２０が過度に引き込まれないため、包材２０の表面及び裏面に擦れキズが発生する事態を抑制することができる。 As a result, according to the manufacturing apparatus 10 according to the present embodiment, even if the long side of the male mold 120 is in contact with the packaging material 20 at the time of molding, for example, the roundness (R) on the ridgeline of the male mold 120 is Can be sufficiently shaped into the packaging material 20. Further, according to the manufacturing apparatus 10, since the packaging material 20 is not excessively drawn in, it is possible to suppress a situation in which scratches are generated on the front surface and the back surface of the packaging material 20.
　面１１５，１３５の最大高さ粗さＲｚが雄型１２０の稜線の最大高さ粗さＲｚ以下であるという条件を満たす前提で、面１１５，１３５の最大高さ粗さＲｚは、０．２μｍ以上、１．６μｍ未満であればよい。すなわち、面１１５，１３５には、いわゆる鏡面仕上げが施されていればよい。 The maximum height roughness Rz of the surfaces 115 and 135 is 0.2 μm on the premise that the maximum height roughness Rz of the surfaces 115 and 135 is equal to or less than the maximum height roughness Rz of the ridgeline of the male type 120. As mentioned above, it may be less than 1.6 μm. That is, the surfaces 115 and 135 may be provided with a so-called mirror finish.
　また、面１１５，１３５の最大高さ粗さＲｚが雄型１２０の稜線の最大高さ粗さＲｚ以下であるという条件を満たす前提で、雄型１２０の稜線の最大高さ粗さＲｚは、０．８μｍ以上、３．２μｍ以下であればよい。 Further, on the premise that the condition that the maximum height roughness Rz of the surfaces 115 and 135 is equal to or less than the maximum height roughness Rz of the ridgeline of the male type 120 is satisfied, the maximum height roughness Rz of the ridgeline of the male type 120 is determined. It may be 0.8 μm or more and 3.2 μm or less.
　［４．製造手順］
　図９は、成型品５０の製造手順を示すフローチャートである。図９に示される工程は、加工対象の包材２０が雌型１１０と押え板１３０との間に配置された後に製造装置１０によって実行される。 [4. Manufacturing procedure]
FIG. 9 is a flowchart showing a manufacturing procedure of the molded product 50. The process shown in FIG. 9 is executed by the manufacturing apparatus 10 after the packaging material 20 to be processed is arranged between the female mold 110 and the pressing plate 130.
　図９を参照して、製造装置１０は、基台１０２を下降させることによって、雌型１１０及び押え板１３０で包材２０を挟み込む（ステップＳ１００）。製造装置１０は、各エアシリンダ１３２を制御して押え板１３０を上方に加圧することによって、包材２０をより強く挟み込む（ステップＳ１１０）。たとえば、この場合の面圧は、０．２７ＭＰａである。なお、この面圧は、包材２０の特性等によって適宜調整される。その後、製造装置１０は、雄型１２０を上昇させることによって、包材２０の成型を行なう（ステップＳ１２０）。これにより、成型品５０が完成する。 With reference to FIG. 9, the manufacturing apparatus 10 sandwiches the packaging material 20 between the female mold 110 and the holding plate 130 by lowering the base 102 (step S100). The manufacturing apparatus 10 controls each air cylinder 132 to pressurize the pressing plate 130 upward, thereby sandwiching the packaging material 20 more strongly (step S110). For example, the surface pressure in this case is 0.27 MPa. The surface pressure is appropriately adjusted according to the characteristics of the packaging material 20 and the like. After that, the manufacturing apparatus 10 molds the packaging material 20 by raising the male mold 120 (step S120). As a result, the molded product 50 is completed.
　［５．特徴］
　以上のように、本実施の形態に従う製造装置１０において、面１１５（第１面），１３５（第２面）の最大高さ粗さＲｚは、面１２５に沿って延びる稜線の最大高さ粗さＲｚ以下である。本実施の形態に従う製造装置１０によれば、たとえば、雄型１２０の稜線上の丸み（Ｒ）を包材２０に十分に賦形することができる。また、製造装置１０によれば、包材２０が過度に引き込まれないため、包材２０の表面及び裏面に擦れキズが発生する事態を抑制することができる。 [5. Characteristic]
As described above, in the manufacturing apparatus 10 according to the present embodiment, the maximum height roughness Rz of the surfaces 115 (first surface) and 135 (second surface) is the maximum height roughness of the ridge line extending along the surface 125. Is less than or equal to Rz. According to the manufacturing apparatus 10 according to the present embodiment, for example, the roundness (R) on the ridgeline of the male mold 120 can be sufficiently shaped in the packaging material 20. Further, according to the manufacturing apparatus 10, since the packaging material 20 is not excessively drawn in, it is possible to suppress a situation in which scratches are generated on the front surface and the back surface of the packaging material 20.
　なお、本実施の形態に従う製造装置１０において、面１１５（第１面），１３５（第２面）の最大高さ粗さＲｚは、面１２５に沿って延びる稜線の最大高さ粗さＲｚよりも小さいことが好ましい。 In the manufacturing apparatus 10 according to the present embodiment, the maximum height roughness Rz of the surfaces 115 (first surface) and 135 (second surface) is higher than the maximum height roughness Rz of the ridge line extending along the surface 125. Is also preferably small.
　［６．変形例］
　以上、実施の形態について説明したが、本発明は、上記実施の形態に限定されるものではなく、その趣旨を逸脱しない限りにおいて、種々の変更が可能である。以下、変形例について説明する。 [6. Modification example]
Although the embodiments have been described above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the embodiments. Hereinafter, a modified example will be described.
　（６－１）
　上記実施の形態に従う製造装置１０においては、雌型１１０の面１１５及び押え板１３０の面１３５の双方の最大高さ粗さＲｚが、雄型１２０の面１２５に沿って延びる稜線の最大高さ粗さＲｚ以下であるとされた。しかしながら、必ずしも、面１１５及び面１３５の双方の最大高さ粗さＲｚが、雄型１２０の面１２５に沿って延びる稜線の最大高さ粗さＲｚ以下である必要はない。たとえば、面１１５，１３５のいずれか一方の最大高さ粗さＲｚのみが、面１２５に沿って延びる稜線の最大高さ粗さＲｚ以下であってもよい。 (6-1)
In the manufacturing apparatus 10 according to the above embodiment, the maximum height roughness Rz of both the surface 115 of the female mold 110 and the surface 135 of the holding plate 130 is the maximum height of the ridge line extending along the surface 125 of the male mold 120. It was considered that the roughness was Rz or less. However, the maximum height roughness Rz of both the surface 115 and the surface 135 does not necessarily have to be equal to or less than the maximum height roughness Rz of the ridgeline extending along the surface 125 of the male type 120. For example, only the maximum height roughness Rz of any one of the surfaces 115 and 135 may be equal to or less than the maximum height roughness Rz of the ridge line extending along the surface 125.
　たとえば、面１１５の最大高さ粗さＲｚが雄型１２０の稜線の最大高さ粗さＲｚ以下である場合には、包材２０の基材層側の擦れキズの発生を抑制することができる。その結果、たとえば、蓄電素子を収容した成型品５０を複数並べたモジュールにおいて、隣り合う成型品５０間で絶縁破壊が生じる可能性を抑制することができる。 For example, when the maximum height roughness Rz of the surface 115 is equal to or less than the maximum height roughness Rz of the ridgeline of the male type 120, it is possible to suppress the occurrence of scratches on the base material layer side of the packaging material 20. .. As a result, for example, in a module in which a plurality of molded products 50 accommodating a power storage element are arranged, the possibility of dielectric breakdown occurring between adjacent molded products 50 can be suppressed.
　また、たとえば、面１３５の最大高さ粗さＲｚが雄型１２０の稜線の最大高さ粗さＲｚ以下である場合には、包材２０の熱融着性樹脂層側の擦れキズの発生を抑制することができる。その結果、たとえば、蓄電素子を収容した成型品５０において内部の絶縁性を維持することができる。 Further, for example, when the maximum height roughness Rz of the surface 135 is equal to or less than the maximum height roughness Rz of the ridgeline of the male type 120, scratches on the thermosetting resin layer side of the packaging material 20 may occur. It can be suppressed. As a result, for example, the internal insulating property of the molded product 50 containing the power storage element can be maintained.
　（６－２）
　また、上記実施の形態に従う製造装置１０においては、上方に雌型１１０が配置され、下方に雄型１２０が配置されたが、たとえば、上方に雄型１２０が配置され、下方に雌型１１０が配置されてもよい。この場合には、押え板１３０、エアシリンダ１３２及びサーボ機構２００，３００等の位置も適宜調整される。 (6-2)
Further, in the manufacturing apparatus 10 according to the above embodiment, the female mold 110 is arranged above and the male mold 120 is arranged below. For example, the male mold 120 is arranged above and the female mold 110 is arranged below. It may be arranged. In this case, the positions of the presser plate 130, the air cylinder 132, the servo mechanisms 200, 300, etc. are also adjusted as appropriate.
　（６－３）
　また、上記実施の形態における成型品５０が収容する蓄電デバイスの一例は、たとえば、全固体電池、リチウムイオン電池、リチウムイオンポリマー電池、鉛蓄電池、ニッケル・水素蓄電池、ニッケル・カドミウム蓄電池、ニッケル・鉄蓄電池、ニッケル・亜鉛蓄電池、酸化銀・亜鉛蓄電池、金属空気電池、多価カチオン電池である。また、蓄電デバイスの他の一例は、キャパシタ、電気二重層コンデンサ（ＥＤＬＣ）、リチウムイオンキャパシタである。 (6-3)
Further, examples of the power storage device accommodated in the molded product 50 in the above embodiment are, for example, an all-solid-state battery, a lithium ion battery, a lithium ion polymer battery, a lead storage battery, a nickel / hydrogen storage battery, a nickel / cadmium storage battery, and a nickel / iron. Storage batteries, nickel / zinc storage batteries, silver oxide / zinc storage batteries, metal air batteries, and polyvalent cation batteries. Another example of the power storage device is a capacitor, an electric double layer capacitor (EDLC), and a lithium ion capacitor.
　（６－４）
　また、上記実施の形態に従う製造装置１０においては、雄型１２０の面１２５に沿って延びる稜線の全周にＲが形成されていた。しかしながら、必ずしも稜線の全周にＲが形成されている必要はない。たとえば、稜線の一部のみにＲが形成されていてもよい。 (6-4)
Further, in the manufacturing apparatus 10 according to the above embodiment, R is formed on the entire circumference of the ridge line extending along the surface 125 of the male mold 120. However, it is not always necessary that R is formed on the entire circumference of the ridgeline. For example, R may be formed only in a part of the ridgeline.
　１０　製造装置、２０　包材、３０　リール、４０　搬送ユニット、５０　成型品、１００　成型ユニット、１０２，１０４　基台、１０６　柱、１１０　雌型、１１５，１２５，１３５　面、１２０　雄型、１３０　押え板、１３２　エアシリンダ、２００，３００　サーボ機構、Ｇ１　溝、Ｈ１，Ｈ２　孔。 10 manufacturing equipment, 20 packaging materials, 30 reels, 40 transport units, 50 molded products, 100 molding units, 102, 104 bases, 106 pillars, 110 female molds, 115, 125, 135 surfaces, 120 male molds, 130 presser plates. , 132 air cylinder, 200,300 servo mechanism, G1 groove, H1, H2 holes.

Claims (6)

  1. 　少なくとも、基材層、バリア層及び熱融着性樹脂層をこの順に有する積層体により構成された包材を成型することによって、蓄電デバイス用の収容体を製造するように構成された製造装置であって、
    　凹部を有する雌型と、
    　平面視において前記凹部と重なる位置に形成された孔を有する押え板と、
    　前記孔を貫通し前記凹部に進入するように構成された雄型とを備え、
    　前記雄型の面のうち前記凹部に進入する面に沿って延びる稜線の少なくとも一部には、丸みが形成されており、
    　前記包材が前記雌型と前記押え板とによって挟まれた状態で、前記雄型が前記凹部に進入することによって前記包材が成型され、
    　前記雌型の面のうち前記包材と接する第１面、及び、前記押え板の面のうち前記包材と接する第２面の少なくとも一方の面の最大高さ粗さＲｚは、前記稜線の最大高さ粗さＲｚ以下である、製造装置。     A manufacturing apparatus configured to manufacture an accommodating body for a power storage device by molding a packaging material composed of a laminate having at least a base material layer, a barrier layer, and a thermosetting resin layer in this order. There,
    A female mold with a recess and
    A holding plate having a hole formed at a position overlapping the recess in a plan view,
    With a male mold configured to penetrate the hole and enter the recess.
    Roundness is formed on at least a part of the ridge line extending along the surface entering the recess in the male-shaped surface.
    The packaging material is molded by the male mold entering the recess while the packaging material is sandwiched between the female mold and the holding plate.
    The maximum height roughness Rz of at least one surface of the female mold surface that is in contact with the packaging material and the surface of the holding plate that is in contact with the packaging material is the ridgeline. A manufacturing apparatus having a maximum height roughness Rz or less.
  2. 　前記第１面及び前記第２面の各々の最大高さ粗さＲｚは、前記稜線の最大高さ粗さＲｚ以下である、請求項１に記載の製造装置。 The manufacturing apparatus according to claim 1, wherein the maximum height roughness Rz of each of the first surface and the second surface is equal to or less than the maximum height roughness Rz of the ridgeline.
  3. 　前記第１面及び前記第２面の少なくとも一方の面の最大高さ粗さＲｚは、１．６μｍ未満である、請求項１又は請求項２に記載の製造装置。 The manufacturing apparatus according to claim 1 or 2, wherein the maximum height roughness Rz of the first surface and at least one surface of the second surface is less than 1.6 μm.
  4. 　前記稜線の最大高さ粗さＲｚは、０．８μｍ以上である、請求項１から請求項３のいずれか１項に記載の製造装置。 The manufacturing apparatus according to any one of claims 1 to 3, wherein the maximum height roughness Rz of the ridgeline is 0.8 μm or more.
  5. 　平面視における前記雄型の形状は、長方形状であって、長辺及び短辺を有し、
    　前記長辺の長さは、１５０ｍｍ以上である、請求項１から請求項４のいずれか１項に記載の製造装置。     The male shape in plan view is rectangular and has long and short sides.
    The manufacturing apparatus according to any one of claims 1 to 4, wherein the length of the long side is 150 mm or more.
  6. 　少なくとも、基材層、バリア層及び熱融着性樹脂層をこの順に有する積層体により構成された包材を成型することによって、蓄電デバイス用の収容体を製造する製造方法であって、
    　前記製造装置は、
    　凹部を有する雌型と、
    　平面視において前記凹部と重なる位置に形成された孔を有する押え板と、
    　前記孔を貫通し前記凹部に進入するように構成された雄型とを備え、
    　前記雄型の面のうち前記凹部に進入する面に沿って延びる稜線の少なくとも一部には、丸みが形成されており、
    　前記製造方法は、
    　前記雌型と前記押え板とによって前記包材を挟むステップと、
    　前記雄型を前記凹部に進入させることによって前記包材を成型するステップとを含み、
    　前記雌型の面のうち前記包材と接する第１面、及び、前記押え板の面のうち前記包材と接する第２面の少なくとも一方の面の最大高さ粗さＲｚは、前記稜線の最大高さ粗さＲｚ以下である、製造方法。     A manufacturing method for manufacturing an accommodating body for a power storage device by molding a packaging material composed of a laminate having at least a base material layer, a barrier layer, and a thermosetting resin layer in this order.
    The manufacturing equipment
    A female mold with a recess and
    A holding plate having a hole formed at a position overlapping the recess in a plan view,
    With a male mold configured to penetrate the hole and enter the recess.
    Roundness is formed on at least a part of the ridge line extending along the surface entering the recess in the male-shaped surface.
    The manufacturing method is
    A step of sandwiching the packaging material between the female mold and the holding plate,
    Including a step of molding the packaging material by allowing the male mold to enter the recess.
    The maximum height roughness Rz of at least one surface of the female mold surface that is in contact with the packaging material and the surface of the presser plate that is in contact with the packaging material is the ridgeline. A manufacturing method having a maximum height roughness Rz or less.
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JP2002208384A (en) * 2001-01-11 2002-07-26 Sony Corp Nonaqueous electrolyte battery and its manufacturing method
JP2003126919A (en) * 2001-10-18 2003-05-08 Showa Denko Kk Squeeze-processing method for resin-laminated aluminum foil, squeeze-processed products and squeeze-processing equipment
JP2013154388A (en) * 2012-01-31 2013-08-15 Showa Denko Packaging Co Ltd Die for drawing
JP2016195113A (en) * 2015-03-31 2016-11-17 大日本印刷株式会社 Metal mold for molding packaging material for battery
WO2017094724A1 (en) * 2015-11-30 2017-06-08 大日本印刷株式会社 Packaging material for battery, battery, and method for manufacturing packaging material for battery
WO2018097054A1 (en) * 2016-11-22 2018-05-31 昭和電工パッケージング株式会社 Power storage device exterior case and production method therefor
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Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002208384A (en) * 2001-01-11 2002-07-26 Sony Corp Nonaqueous electrolyte battery and its manufacturing method
JP2003126919A (en) * 2001-10-18 2003-05-08 Showa Denko Kk Squeeze-processing method for resin-laminated aluminum foil, squeeze-processed products and squeeze-processing equipment
JP2013154388A (en) * 2012-01-31 2013-08-15 Showa Denko Packaging Co Ltd Die for drawing
JP2016195113A (en) * 2015-03-31 2016-11-17 大日本印刷株式会社 Metal mold for molding packaging material for battery
WO2017094724A1 (en) * 2015-11-30 2017-06-08 大日本印刷株式会社 Packaging material for battery, battery, and method for manufacturing packaging material for battery
WO2018097054A1 (en) * 2016-11-22 2018-05-31 昭和電工パッケージング株式会社 Power storage device exterior case and production method therefor
WO2018097329A1 (en) * 2016-11-28 2018-05-31 大日本印刷株式会社 Packaging material for batteries, method for producing same, and battery

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