存储服务器机箱Storage server chassis
本申请要求申请日为2019年5月21日、申请号为201910425928.7的中国专利申请的优先权,该申请的全部内容通过引用结合在本申请中。This application claims the priority of the Chinese patent application whose application date is May 21, 2019 and the application number is 201910425928.7. The entire content of this application is incorporated into this application by reference.
技术领域Technical field
本公开涉及服务器机箱技术领域,例如涉及一种存储服务器机箱。The present disclosure relates to the technical field of server chassis, for example, to a storage server chassis.
背景技术Background technique
网络附加存储(Nework Attached Storage,NAS)作为一个企业用品现在也开始慢慢的渗透进了家庭生活中,而NAS机箱市面上的可选择性并不是很多,价格高,设计也不是非常合理,相关技术中的NAS机箱都采用的是硬盘上置设计,主板下置的设计,存在着重心高,振动噪音大的问题。Nework Attached Storage (NAS), as an enterprise product, has slowly penetrated into family life. However, there are not many options on the market for NAS enclosures, the price is high, and the design is not very reasonable. The NAS chassis in the technology adopts the design of the upper hard disk and the design of the lower motherboard, which has the problems of high center of gravity and large vibration and noise.
发明内容Summary of the invention
本公开提供了一种存储服务器机箱,能够解决相关技术中NAS机箱存在的重心高及振动噪音大的技术问题。The present disclosure provides a storage server chassis, which can solve the technical problems of high center of gravity and large vibration and noise in the NAS chassis in related technologies.
一种存储服务器机箱,包括:箱体,所述箱体包括底板、顶板、前面板、后面板、左侧板和右侧板;位于所述箱体内,并设置于所述底板上的支撑板,所述支撑板设置为将所述箱体沿左右方向分隔成电源放置区和硬盘放置区;及设置于所述箱体的内壁,并与所述支撑板相配合的支撑结构;其中,所述支撑板和所述支撑结构设置为将主板托盘支撑于所述硬盘放置区的上方。A storage server chassis, comprising: a box body including a bottom plate, a top plate, a front panel, a rear panel, a left side panel, and a right side panel; a support plate located in the box body and arranged on the bottom plate , The supporting plate is arranged to divide the box into a power supply placement area and a hard disk placement area along the left and right directions; and a supporting structure provided on the inner wall of the box and matched with the supporting plate; wherein The supporting plate and the supporting structure are arranged to support the motherboard tray above the hard disk placement area.
附图说明Description of the drawings
图1是一实施例提供的存储服务器机箱的结构示意图一;FIG. 1 is a first structural diagram of a storage server chassis provided by an embodiment;
图2是一实施例提供的存储服务器机箱的结构示意图二;2 is a second structural diagram of a storage server chassis provided by an embodiment;
图3是一实施例提供的存储服务器机箱去掉顶板和后面板之后的结构示意图;3 is a schematic structural diagram of the storage server chassis provided by an embodiment after removing the top plate and the rear panel;
图4是一实施例提供的存储服务器机箱去掉顶板、后面板以及主板托盘之后的结构示意图。4 is a schematic structural diagram of the storage server chassis provided by an embodiment after removing the top plate, the rear panel and the motherboard tray.
图中:In the picture:
10-箱体;11-底板;111-辅助散热孔;12-顶板;121-第二风扇安装孔;122-主板散热孔;13-前面板;131-硬盘散热孔;132-电源走线口;133-主板挡板安装口;134-固定槽;14-后面板;141-第一风扇安装孔;142-第一风扇散热孔;15-左侧板;151-插槽;16-右侧板;161-电源散热孔;10- cabinet; 11- bottom plate; 111- auxiliary cooling hole; 12- top plate; 121- second fan mounting hole; 122- main board cooling hole; 13- front panel; 131- hard disk cooling hole; 132- power wiring port 133-Mainboard baffle mounting port; 134-Fixed slot; 14-rear panel; 141-first fan mounting hole; 142-first fan cooling hole; 15-left side plate; 151-slot; 16-right Board; 161-power cooling hole;
20-支撑板;30-电源放置区;40-硬盘放置区;41-隔板;42-硬盘放置位;50-主板托盘;51-凸起板。20-support board; 30-power supply placement area; 40-hard disk placement area; 41-partition board; 42-hard disk placement location; 50-mainboard tray; 51-raised board.
具体实施方式Detailed ways
在本申请的描述中,除非另有明确的规定和限定,术语“相连”、“连接”、“固定”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或成一体;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本申请中的具体含义。In the description of this application, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be interpreted broadly. For example, they can be fixedly connected, detachably connected, or integrated. ; It can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
在本实施例的描述中,术语“上”、“下”、“左”、“右”、等方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述和简化操作,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。此外,术语“第一”、“第二”仅仅用于在描述上加以区分,并没有特殊的含义。In the description of this embodiment, the terms "upper", "lower", "left", "right", and other orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for ease of description and simplified operations , Rather than indicating or implying that the pointed device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the application. In addition, the terms "first" and "second" are only used to distinguish them in description and have no special meaning.
如图1-图4所示,本实施例提供了一种存储服务器机箱,该存储服务器机箱包括箱体10,箱体10包括底板11、顶板12、前面板13、后面板14、左侧板15和右侧板16,箱体10内,于箱体10的底板11上设置有支撑板20,支撑板20将箱体10分隔成电源放置区30和硬盘放置区40,在本实施例中,电源放置区30和硬盘放置区40沿箱体10的左右方向分布,电源和硬盘分别对应放置于电源放置区30和硬盘放置区40,箱体10的内壁设置有与支撑板20相配合的支撑结构,支撑板20和支撑结构将主板托盘50支撑于硬盘放置区40的上方,主板设置于主板托盘50上方。本实施例提供的存储服务器机箱,能够将硬盘下置、主板上置,使得机箱的重心下移,结构更加稳固,有效降低了由于机箱振动带来的噪音。As shown in Figures 1 to 4, this embodiment provides a storage server chassis. The storage server chassis includes a box body 10. The box body 10 includes a bottom plate 11, a top plate 12, a front panel 13, a rear panel 14, and a left side panel. 15 and the right side plate 16. In the box body 10, a support plate 20 is provided on the bottom plate 11 of the box body 10. The support plate 20 divides the box body 10 into a power supply storage area 30 and a hard disk storage area 40. In this embodiment , The power supply placement area 30 and the hard disk placement area 40 are distributed along the left and right directions of the box 10, the power supply and the hard disk are placed in the power placement area 30 and the hard disk placement area 40 respectively, and the inner wall of the box 10 is provided with a matching support plate 20 The supporting structure, the supporting plate 20 and the supporting structure support the motherboard tray 50 above the hard disk placement area 40, and the motherboard is arranged above the motherboard tray 50. The storage server chassis provided in this embodiment can place the hard disk on the bottom and the motherboard on the top, so that the center of gravity of the chassis is moved down, the structure is more stable, and the noise caused by chassis vibration is effectively reduced.
底板11、前面板13、左侧板15和右侧板16为一体成型的框架,顶板12和后面板14均与框架可拆卸连接。组装时,先在框架上安装电源、硬盘和主板,然后再将后面板14和顶板12依次连接在框架上。通过上述设置,便于电源、硬盘 和主板的安装。在一实施例中,框架上设置有与顶板12和后面板14对应的安装槽,顶板12和后面板14插设于对应的安装槽中,安装和拆卸十分方便。The bottom panel 11, the front panel 13, the left side panel 15 and the right side panel 16 are integrally formed frames, and the top panel 12 and the rear panel 14 are detachably connected to the frame. When assembling, first install the power supply, hard disk and main board on the frame, and then connect the rear panel 14 and the top board 12 to the frame in turn. Through the above settings, it is convenient to install the power supply, hard disk and motherboard. In one embodiment, the frame is provided with installation grooves corresponding to the top plate 12 and the rear panel 14, and the top plate 12 and the rear panel 14 are inserted into the corresponding installation grooves, which is very convenient for installation and removal.
硬盘放置区40间隔设置有多个隔板41,隔板41将硬盘放置区40沿左右方向分隔成多个硬盘放置位42,每个硬盘放置位42能够放置一个硬盘。在本实施例中,隔板41的数量为四个,将硬盘放置区40分隔为五个硬盘放置位42,五个硬盘放置位42采用了“4+1”的设计,四个设置为放置3.5寸硬盘的硬盘放置位42加一个设置为放置2.5寸硬盘的硬盘放置位42。在其他实施例中,隔板41的数量以及每个硬盘放置位42放置硬盘的大小不局限于此,具体可以根据需要进行设置,在此不再赘述。其中,左右方向指的是图4中的左右方向,即由所述右侧板16指向所述左侧板15的方向。The hard disk placement area 40 is provided with a plurality of partitions 41 at intervals. The partitions 41 divide the hard disk placement area 40 into a plurality of hard disk placement positions 42 in the left and right direction, and each hard disk placement position 42 can place a hard disk. In this embodiment, the number of partitions 41 is four, and the hard disk placement area 40 is divided into five hard disk placement positions 42. The five hard disk placement positions 42 adopt a "4+1" design, and four are set as placement positions. Hard disk placement 42 for 3.5-inch hard disks plus a hard disk placement 42 for 2.5-inch hard drives. In other embodiments, the number of partitions 41 and the size of the hard disk placed in each hard disk placement position 42 are not limited to this, and can be specifically set as required, and will not be repeated here. Wherein, the left-right direction refers to the left-right direction in FIG. 4, that is, the direction from the right side plate 16 to the left side plate 15.
支撑结构包括沿箱体10的前后方向延伸并开设于箱体10的左侧板15上的插槽151,插槽151的底壁与支撑板20的顶面平齐,主板托盘50可抽拉于插槽151内,并由支撑板20的顶面支撑。或者在其他实施例,支撑结构也可以为在箱体10的内壁上设置的沿前后方向延伸的凸楞,凸楞的顶面与支撑板20的顶面平齐,主板托盘50可抽拉于支撑板20的顶面以及凸楞的顶面,并由支撑板20的顶面以及凸楞的顶面支撑。在其他实施例中,支撑结构还包括箱体10的前面板13上设置的沿箱体10的左右方向延伸的固定槽134,主板托盘50的前端部能够插设固定于固定槽134中。另外,主板托盘50的后端部间隔设置有两个凸起板51,一方面,两个凸起板51能够与后面板14抵接,使得主板托盘50更加稳固,另一方面,两个凸起板51之间的间隙便于走线。其中,前后方向为垂直于所述前面板13,且与所述左侧板15平行的方向。The support structure includes a slot 151 extending along the front and rear direction of the box 10 and opened on the left side plate 15 of the box 10. The bottom wall of the slot 151 is flush with the top surface of the support plate 20, and the motherboard tray 50 can be pulled out It is in the slot 151 and supported by the top surface of the support plate 20. Or in other embodiments, the supporting structure may also be a convex corrugation extending in the front-rear direction provided on the inner wall of the box body 10. The top surface of the convex corrugation is flush with the top surface of the supporting board 20, and the main board tray 50 can be drawn on The top surface of the support plate 20 and the top surface of the corrugation are supported by the top surface of the support plate 20 and the top surface of the corrugation. In other embodiments, the support structure further includes a fixing groove 134 provided on the front panel 13 of the box 10 and extending along the left and right direction of the box 10, and the front end of the motherboard tray 50 can be inserted and fixed in the fixing groove 134. In addition, the rear end of the main board tray 50 is provided with two convex plates 51 at intervals. On the one hand, the two convex plates 51 can abut the rear panel 14 to make the main board tray 50 more stable. On the other hand, two convex plates 51 The gap between the lifting plates 51 is convenient for wiring. Wherein, the front-rear direction is a direction perpendicular to the front panel 13 and parallel to the left side panel 15.
箱体10的后面板14上设置有第一风扇安装孔141和第一风扇散热孔142,第一散热风扇通过第一风扇安装孔141安装于后面板14,箱体10的右侧板16上设置有正对电源放置区30的电源散热孔161,箱体10的前面板13上设置有正对硬盘放置区40的硬盘散热孔131,箱体10的顶板12上设置有正对主板的主板散热孔122。第一散热风扇能够通过电源散热孔161、硬盘散热孔131以及主板散热孔122抽取冷空气,并将冷空气从第一风扇散热孔142排出,第一散热风扇能够同时对电源、硬盘和主板进行散热,且通过设置电源散热孔161、硬盘散热孔131以及主板散热孔122,能够提高电源、硬盘和主板的散热效率。在一实施例中,在箱体10的底板11上开设有辅助散热孔111,能够进一步提高机箱的散热效率。The rear panel 14 of the box body 10 is provided with a first fan mounting hole 141 and a first fan radiating hole 142. The first cooling fan is installed on the rear panel 14 through the first fan mounting hole 141 on the right side plate 16 of the box body 10. A power radiating hole 161 facing the power placement area 30 is provided, a hard disk radiating hole 131 facing the hard disk placement area 40 is provided on the front panel 13 of the cabinet 10, and a main board facing the motherboard is provided on the top plate 12 of the cabinet 10 Heat dissipation holes 122. The first cooling fan can draw cold air through the power supply cooling holes 161, the hard drive cooling holes 131, and the motherboard cooling holes 122, and discharge the cold air from the first fan cooling holes 142. Heat dissipation, and the heat dissipation efficiency of the power supply, the hard disk, and the motherboard can be improved by providing the power dissipation hole 161, the hard disk dissipation hole 131, and the mainboard dissipation hole 122. In one embodiment, the bottom plate 11 of the cabinet 10 is provided with auxiliary heat dissipation holes 111, which can further improve the heat dissipation efficiency of the cabinet.
在一实施例中,在箱体10的顶板12上设置有第二风扇安装孔121,第二风扇 安装孔121设置为安装第二散热风扇,一般情况下,第一散热风扇就能够满足机箱的散热需求,但是当采用的主板为高能耗主板时,可以通过第二风扇安装孔121安装第二散热风扇,此时主板散热孔122为第二风扇散热孔,由第二散热风扇对主板进行主要散热,由第一散热风扇辅助第二散热风扇对主板进行高效散热,从而更好的满足机箱的散热需求。In one embodiment, a second fan mounting hole 121 is provided on the top plate 12 of the box body 10, and the second fan mounting hole 121 is configured to install a second cooling fan. Generally, the first cooling fan can meet the requirements of the chassis. Heat dissipation requirements, but when the motherboard used is a high-energy-consumption motherboard, a second cooling fan can be installed through the second fan mounting hole 121. At this time, the motherboard cooling hole 122 is the second fan cooling hole, and the second cooling fan performs the main For heat dissipation, the first heat dissipation fan assists the second heat dissipation fan to efficiently dissipate heat from the motherboard, so as to better meet the heat dissipation requirements of the chassis.
此外,箱体10的前面板13上开设有电源走线口132和主板挡板安装口133,电源走线口132为电源线的预留口,主板挡板安装口133设置为安装主板挡板。In addition, the front panel 13 of the cabinet 10 is provided with a power wiring port 132 and a motherboard baffle mounting port 133. The power wiring port 132 is a reserved port for the power cord, and the motherboard baffle mounting port 133 is set to install the motherboard baffle. .
本实施例提供的机箱采用3D打印技术成型,成本较低,体积仅为6L-8L,体积小巧,非常轻便。在其他实施例中,机箱的成型方式并不局限于3D打印,还可以通过其他任何合适的加工方法成型,在此不再一一列举。The case provided in this embodiment is formed by 3D printing technology, has a low cost, and has a volume of only 6L-8L, and is compact and very light. In other embodiments, the molding method of the chassis is not limited to 3D printing, and may also be molded by any other suitable processing method, which will not be listed here.