WO2020227978A1 - 电子设备及电子设备的制备方法 - Google Patents

电子设备及电子设备的制备方法 Download PDF

Info

Publication number
WO2020227978A1
WO2020227978A1 PCT/CN2019/087061 CN2019087061W WO2020227978A1 WO 2020227978 A1 WO2020227978 A1 WO 2020227978A1 CN 2019087061 W CN2019087061 W CN 2019087061W WO 2020227978 A1 WO2020227978 A1 WO 2020227978A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
conductive layer
electronic device
layer
flexible cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/087061
Other languages
English (en)
French (fr)
Inventor
林源城
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Royole Technologies Co Ltd
Original Assignee
Shenzhen Royole Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Priority to PCT/CN2019/087061 priority Critical patent/WO2020227978A1/zh
Priority to CN201980079832.8A priority patent/CN113330401A/zh
Publication of WO2020227978A1 publication Critical patent/WO2020227978A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Definitions

  • the invention relates to the field of electronic technology, in particular to an electronic device and a preparation method of the electronic device.
  • the entire touch screen of the existing electronic equipment is placed on the desktop.
  • the touch screen is in a floating state,
  • the floating problem of mutual capacitance can be solved, but in the case of a thin flexible cover, the floating problem of the mutual capacitance between the housing of the electronic device and the flexible cover has not been solved well at present , hardly lead to abnormal touch.
  • the embodiment of the present invention provides an electronic device.
  • the electronic device includes a housing, a flexible cover, and conductive glue.
  • the housing is made of metal and the housing has a housing space.
  • the flexible cover is located at the opening of the housing space.
  • the flexible cover The board has an inner surface and an outer surface opposite to each other, the outer surface constitutes the touch surface of the flexible cover, the outer surface is provided with a first conductive layer, and the conductive glue is located between the first conductive layer and the Between the shells to electrically connect the first conductive layer and the shell.
  • the electronic device provided by the embodiment of the present invention includes a housing, a flexible cover, and conductive glue.
  • the material of the housing is metal and the housing has a storage space.
  • the flexible cover is located at the opening of the storage space.
  • the flexible cover has opposite inner and outer surfaces, and the outer surface constitutes the touch of the flexible cover.
  • the outer surface is provided with a first conductive layer, and the conductive glue is located between the first conductive layer and the casing to electrically connect the first conductive layer and the casing.
  • the electronic device provided by the embodiments of the present application electrically connects the first conductive layer and the housing through conductive glue, so that the first conductive layer and the housing are in a common ground state. At this time, the difference between the housing and the flexible cover can be eliminated. Mutual capacitance between the two, thereby enhancing the touch effect of the electronic device.
  • the embodiment of the present invention also provides a method for manufacturing an electronic device.
  • the preparation method of the electronic device includes:
  • the material of the housing is metal and has a receiving space
  • the flexible cover is accommodated in the opening of the accommodating space, and conductive glue is formed between the flexible cover and the casing to electrically connect the first conductive layer and the casing.
  • Fig. 1 is a schematic structural diagram of a first electronic device provided by an embodiment of the present application.
  • Fig. 2 is a schematic structural diagram of a second type of electronic device provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a first conductive layer of the first type provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a second type of first conductive layer provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a third type of first conductive layer provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a fourth type of first conductive layer provided by an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a third electronic device provided by an embodiment of the present application.
  • Fig. 8 is a schematic structural diagram of a fourth type of electronic device provided by an embodiment of the present application.
  • FIG. 9 is a schematic diagram of the structure of the thin film transistor layer in FIG. 8.
  • FIG. 10 is a schematic structural diagram of a fifth electronic device provided by an embodiment of the present application.
  • FIG. 11 is a schematic diagram of the structure of the driving circuit in FIG. 10.
  • FIG. 12 is a schematic structural diagram of a sixth electronic device provided by an embodiment of the present application.
  • FIG. 13 is a schematic structural diagram of a seventh electronic device provided by an embodiment of the present application.
  • Fig. 14 is a schematic structural diagram of an eighth electronic device provided by an embodiment of the present application.
  • FIG. 15 is a schematic flowchart of the first method of manufacturing an electronic device according to an embodiment of the present application.
  • FIG. 16 is a schematic diagram of the structure corresponding to S100 in FIG. 15.
  • FIG. 17 is a schematic diagram of the structure corresponding to S200 in FIG. 15.
  • FIG. 18 is a schematic diagram of the structure corresponding to S300 in FIG. 15.
  • FIG. 19 is a schematic diagram of the structure corresponding to S400 in FIG. 15.
  • FIG. 20 is a schematic diagram of the structure corresponding to S500 in FIG. 15.
  • FIG. 21 is a schematic partial flowchart of a second method for manufacturing an electronic device according to an embodiment of the present application.
  • FIG. 22 is a schematic diagram of the structure corresponding to S310 in FIG. 21.
  • FIG. 23 is a schematic partial flowchart of a third method for manufacturing an electronic device according to an embodiment of the present application.
  • FIG. 24 is a schematic diagram of the structure corresponding to S320 in FIG. 23.
  • FIG. 25 is a schematic partial flowchart of a fourth method for manufacturing an electronic device according to an embodiment of the present application.
  • FIG. 26 is a schematic diagram of the structure corresponding to S330 in FIG. 25.
  • FIG. 27 is a schematic partial flowchart of a fifth method for manufacturing an electronic device according to an embodiment of the present application.
  • FIG. 28 is a schematic diagram of the structure corresponding to S340 in FIG. 27.
  • FIG. 29 is a schematic diagram of the structure corresponding to S350 in FIG. 27.
  • FIG. 30 is a schematic partial flowchart of a sixth method for manufacturing an electronic device according to an embodiment of the present application.
  • FIG. 31 is a schematic diagram of the structure corresponding to S360 in FIG. 30.
  • FIG. 32 is a schematic diagram of the structure corresponding to S370 in FIG. 30.
  • FIG. 33 is a schematic partial flowchart of a seventh method for manufacturing an electronic device according to an embodiment of the present application.
  • FIG. 34 is a schematic diagram of the structure corresponding to S210 in FIG. 33.
  • FIG. 35 is a schematic diagram of the structure corresponding to S211 in FIG. 33.
  • FIG. 36 is a schematic diagram of the structure corresponding to S212 in FIG. 33.
  • FIG. 37 is a schematic diagram of the structure corresponding to S213 in FIG. 33.
  • FIG. 38 is a schematic partial flowchart of an eighth method for manufacturing an electronic device according to an embodiment of the present application.
  • FIG. 39 is a schematic diagram of the structure corresponding to S600 in FIG. 38.
  • FIG. 40 is a schematic diagram of the structure corresponding to S610 in FIG. 38.
  • FIG. 41 is a schematic partial flowchart of a ninth method for manufacturing an electronic device according to an embodiment of the present application.
  • FIG. 42 is a schematic diagram of the structure corresponding to S700 in FIG. 41.
  • FIG. 43 is a schematic diagram of the structure corresponding to S710 in FIG. 41.
  • FIG. 44 is a schematic partial flowchart of the tenth method for manufacturing an electronic device according to an embodiment of the present application.
  • FIG. 45 is a schematic diagram of the structure corresponding to S720 and S730 in FIG. 44.
  • FIG. 46 is a schematic diagram of the structure corresponding to S740 in FIG. 44.
  • FIG. 47 is a schematic partial flowchart of the eleventh method for manufacturing an electronic device according to an embodiment of the present application.
  • FIG. 48 is a schematic diagram of the structure corresponding to S620, S630, and S640 in FIG. 47.
  • FIG. 49 is a schematic partial flowchart of the twelfth method for manufacturing an electronic device according to an embodiment of the present application.
  • FIG. 50 is a schematic diagram of the structure corresponding to S800 in FIG. 49.
  • the electronic device 10 provided by the embodiment of the present application includes a housing 100, a flexible cover 200 and a conductive adhesive 300.
  • the housing 100 is made of metal and the housing 100 has a receiving space 100a.
  • the flexible cover 200 is located at the opening of the accommodating space 100a.
  • the flexible cover 200 has an inner surface 200a and an outer surface 200b that are arranged opposite to each other.
  • the outer surface 200b constitutes the touch surface of the flexible cover 200.
  • the outer surface 200b is provided with a first conductive layer 410, and the conductive glue 300 is located between the first conductive layer 410 and the housing 100 to electrically connect the first conductive layer 410 and the housing 100 .
  • the electronic device 10 may be any device with communication and storage functions.
  • tablet computers mobile phones, e-readers, remote controls, personal computers (Personal Computer, PC), notebook computers, in-vehicle devices, Internet TVs, wearable devices and other smart devices with network functions.
  • PC Personal Computer
  • the housing 100 may be a metal back cover of the electronic device 10, and the housing 100 constitutes the packaging structure of the electronic device 10.
  • the housing 100 has a receiving space 100a, the flexible cover 200 is located at the opening of the receiving space 100a of the housing 100, the flexible cover 200 is a cover of the electronic device 10, and the outer surface 200b of the flexible cover 200 is provided with a first conductive layer 410
  • the conductive glue 300 is used to fix the flexible cover 200 to the housing 100 and make the first conductive layer 410 and the housing 100 conduct.
  • the first conductive layer 410 is made of a conductive material, and the housing 100 is also made of a metal material. Therefore, the first conductive layer 410 can be electrically connected to the housing 100. Thus, the first conductive layer 410 can be connected to the housing 100.
  • the housing 100 shares the ground.
  • the conductive adhesive 300 is located between the housing 100 and the flexible cover 200, and the conductive adhesive 300 may be adjacent to the opening of the receiving space 100a, or may be located in the receiving space 100a.
  • the flexible cover 200 has a display area 210 and a non-display area 220 surrounding the display area 210, and the conductive adhesive 300 is disposed corresponding to the non-display area 220, so that the first conductive layer 410 can be electrically connected to the non-display area 220.
  • the surface of the housing 100 facing the flexible cover 200 has a receiving groove 110, the conductive glue 300 is located in the receiving groove 110, and the conductive glue 300 is used to The first conductive layer 410 and the housing 100 form an electrical connection. Since the conductive glue 300 is accommodated in the receiving groove 110 of the housing 100, the conductive glue 300 does not occupy additional space, which helps reduce the thickness of the electronic device 10 and realizes a thinner and lighter design of the electronic device 10.
  • the flexible cover 200 of the electronic device 10 when the electronic device 10 is not in contact with the human body except the operating area of the flexible cover 200, the flexible cover 200 of the electronic device 10 is in a suspended state. There is no electrical connection between the operating area and the housing 100, and the human body does not touch the housing 100 of the electronic device 10. Therefore, the housing 100 and the flexible cover 200 are in a different ground state, which will cause the housing 100 to be flexible. Mutual capacitance is generated between the cover plates 200, which causes the electronic device 10 to experience abnormal touch.
  • the electronic device 10 provided by the embodiment of the present invention includes a housing 100, a flexible cover 200 and a conductive glue 300.
  • the material of the housing 100 is metal and the housing 100 has a receiving space 100a.
  • the flexible cover 200 is located at the opening of the receiving space 100a.
  • the flexible cover 200 has an inner surface 200a and an outer surface 200b that are arranged oppositely. 200b constitutes the touch surface of the flexible cover 200, and the outer surface 200b is provided with a first conductive layer 410, and the conductive glue 300 is located between the first conductive layer 410 and the housing 100 to protect the The first conductive layer 410 is electrically connected to the housing 100.
  • a conductive state is formed between the user's finger and the housing 100.
  • a common ground is formed between the first conductive layer 410 and the housing 100. status.
  • the first conductive layer 410 and the housing 100 are electrically connected through the conductive adhesive 300, so that the first conductive layer 410 and the housing 100 are in a common ground state. At this time, the gap between the housing 100 and the flexible cover 200 can be eliminated.
  • the mutual capacitance of the electronic device 10 improves the touch sensitivity of the electronic device 10.
  • the outer surface 200 b of the flexible cover 200 has a receiving groove 201, and the first conductive layer 410 is located in the receiving groove 201.
  • a receiving groove 201 is opened on the flexible cover 200, and the receiving groove 201 is in the shape of a groove.
  • the first conductive layer 410 is received in the receiving groove 201 by embedding, and the first conductive layer 410 is kept flush with the outer surface 200b of the flexible cover 200.
  • the first conductive layer 410 The outer side surface of and the outer surface 200b of the flexible cover 200 are coplanar. When the user touches the outer surface 200b of the flexible cover 200, it is relatively smooth and does not feel uncomfortable.
  • the receiving groove 201 may be a mesh-shaped receiving groove 201, and each receiving groove 201 is connected to each other.
  • the first conductive layer 410 is embedded in the receiving groove 201 of the flexible cover 200, on the one hand, the first The conductive layer 410 is stably embedded in the flexible cover 200.
  • the first conductive layer 410 can form a conductive network with multiple loops, and the multiple loops are all connected to the housing 100. When one of the circuits is interrupted, there are other circuits that continue to maintain the connection state with the housing 100, so that the housing 100 and the first conductive layer 410 maintain a stable electrical connection relationship.
  • the size of the receiving groove 201 is smaller than a predetermined threshold, and the size of the first conductive layer 410 is also smaller than the predetermined size, that is, the existence of the receiving groove 201 and the first conductive layer 410 does not The display effect of the flexible cover 200 is badly interfered.
  • the first conductive layer 410 includes a plurality of conductive wires 411 arranged at intervals, and the distance between two adjacent conductive wires 411 is smaller than a first predetermined distance.
  • the conductive wires 411 extend in a straight line, a plurality of conductive wires 411 are arranged at intervals, and the distance between two adjacent conductive wires 411 is smaller than a first predetermined distance. Since the distance between two adjacent conductive lines 411 is less than the first preset distance, where the first preset distance is less than the width of the finger, when the user's finger touches the outer surface 200b of the flexible cover 200, the finger can Always touch the first conductive layer 410 on the flexible cover 200, so that the user’s finger and the housing 100 can be connected through the first conductive layer 410 and the conductive glue 300.
  • the layer 410 has a common ground, and the first conductive layer 410 is in contact with the flexible cover 200, which helps to solve the problem of mutual capacitance between the housing 100 and the flexible cover 200 and improve touch sensitivity.
  • the conductive wire 411 may be composed of a single wire, or may be formed by a plurality of wires intertwined, that is, the conductive wire 411 may have a linear structure or a mesh structure.
  • the conductive wire 411 is composed of one wire.
  • the size of the conductive wire 411 can be set smaller, so that the display of the conductive wire 411 on the flexible cover 200 can be minimized. Undesirable interference produced.
  • the conductive wire 411 has a mesh structure, the conductive wire 411 is formed by winding multiple wires with each other. At this time, the conductive wire 411 has multiple conductive loops, which can make the electrical connection between the first conductive layer 410 and the housing 100 The connection relationship is more stable.
  • the first conductive layer 410 is a whole conductive layer, and the first conductive layer 410 has a grid shape.
  • the first conductive layer 410 is a conductive layer whose entire layer is grid-shaped. At this time, the resistance of the first conductive layer 410 is smaller, and the grounding effect is better. And because the first conductive layer 410 is a whole conductive layer, it can cover a relatively large area of the flexible cover 200. When the user's finger touches any position of the flexible cover 200, the flexible cover 200 can be touched.
  • the upper first conductive layer 410 facilitates the common ground between the first conductive layer 410 and the housing 100, and the first conductive layer 410 is in contact with the flexible cover 200, thereby improving the mutual capacitance between the housing 100 and the flexible cover 200. Improve the touch sensitivity of the electronic device 10.
  • the first conductive layer 410 includes a plurality of sub-conductive layers 412 arranged at intervals, the sub-conductive layers 412 are in a grid shape, and the distance between two adjacent sub-conductive layers 412 Less than the second preset distance.
  • a plurality of sub-conductive layers 412 are arranged at intervals, the sub-conductive layers 412 are in a grid shape, and the distance between two adjacent sub-conductive layers 412 is smaller than the second preset distance, where the first 2.
  • the preset distance is smaller than the width of the finger.
  • the first conductive layer 410 includes a conductive portion 413 and a fixing portion 414 surrounding the conductive portion 413, the conductive portion 413 is fixedly connected to the fixing portion 414, and the conductive portion 413 is embedded On the outer surface 200b, the fixing portion 414 is electrically connected to the housing 100 through the conductive glue 300.
  • the conductive portion 413 has a grid shape
  • the fixed portion 414 forms a frame of the conductive portion 413
  • the conductive portion 413 is disposed on the outer surface 200b of the flexible cover 200
  • the conductive portion 413 is disposed corresponding to the display area 210 of the flexible cover 200
  • the fixing portion 414 is disposed corresponding to the non-display area 220 of the flexible cover 200
  • conductive glue is disposed between the fixing portion 414 and the housing 100 300 to electrically connect the fixing portion 414 and the housing 100.
  • the fixing portion 414 and the conductive portion 413 are electrically connected, the conductive portion 413 and the housing 100 also form an electrical connection relationship.
  • the first conductive layer 410 and the housing 100 can be made to share the ground, and the first conductive layer 410 is in contact with the flexible cover 200, which helps to improve the housing 100 and the flexible cover 200. A mutual capacitance problem occurs between them, thereby improving the touch sensitivity of the electronic device 10.
  • the first conductive layer 410 has a plurality of first conductive nodes 410a
  • the electronic device 10 further includes a second conductive layer 420
  • the second conductive layer 420 is electrically connected to the housing 100
  • the second conductive layer 420 is located in the flexible cover 200 and stacked with the first conductive layer 410.
  • the second conductive layer 420 has a plurality of second conductive nodes 420a. There is a correspondence between the node 420a and the first conductive node 410a, and the second conductive node 420a and the first conductive node 410a are electrically connected.
  • the correspondence between the second conductive node 420a and the first conductive node 410a may be a one-to-one correspondence, that is, an electrical connection is formed between one second conductive node 420a and one first conductive node 410a. It may also be a one-to-many relationship, that is, an electrical connection is formed between one second conductive node 420a and a plurality of first conductive nodes 410a. It may also be a many-to-one relationship, that is, an electrical connection is formed between a plurality of second conductive nodes 420a and one first conductive node 410a.
  • a double-layer mesh structure is formed between the first conductive layer 410 and the second conductive layer 420, the first conductive layer 410 has a plurality of first conductive nodes 410a, and the second conductive layer 420 has a plurality of The second conductive node 420a, the first conductive layer 410 is located on the outer surface 200b of the flexible cover 200, the second conductive layer 420 is embedded in the flexible cover 200, and the first conductive Both the layer 410 and the second conductive layer 420 are electrically connected to the housing 100. In addition, an electrical connection is formed between the first conductive layer 410 and the second conductive layer 420.
  • the sweat on the finger may corrode the first conductive layer 410. If the first conductive node 410a on the first conductive layer 410 is The electrical connection relationship is damaged.
  • the first conductive node 410a touched by the user's finger can also form an electrical connection with the second conductive node 420a in the second conductive layer 420, thereby forming an electrical connection between the second conductive layer 420 and the housing 100.
  • the first conductive layer 410 may form a common ground with the housing 100 through the second conductive node 420a in the second conductive layer 420, and the second conductive node 420a is in contact with the flexible cover 200, thereby improving the housing 100
  • the mutual capacitance generated between the electronic device and the flexible cover 200 helps to improve the touch sensitivity of the electronic device 10.
  • the electronic device 10 further includes a display panel 500 laminated with the flexible cover 200, the display panel 500 is located in the receiving space 100a, and the display panel 500 includes several
  • the thin film transistor layers 510 are arranged in an array, the first conductive layer 410 is arranged corresponding to the target device 520 in the thin film transistor layer 510, and the light transmittance of the target device 520 is less than a preset light transmittance.
  • the display panel 500 may be a liquid crystal display panel, the display panel 500 and the flexible cover 200 are laminated and arranged, and the display panel 500 is used for displaying images and text information.
  • the display panel 500 is located inside the housing 100 relative to the flexible cover 200.
  • the display panel 500 includes a plurality of thin film transistor layers 510 arranged in an array, and the first conductive layer 410 is arranged corresponding to the target device 520 in the thin film transistor layer 510, wherein the light transmittance of the target device 520 is less than the predetermined value. Set the light transmittance. In other words, the projection of the first conductive layer 410 on the thin film transistor layer 510 falls on the target device 520.
  • the first conductive layer 410 and the target device 520 correspond to each other. During the setting, it will not cause bad interference to the display of the display panel 500, which helps to ensure the display effect of the display panel 500.
  • the thin film transistor layer 510 includes a source 521, a drain 523, and a gate 522
  • the target device 520 includes any one of the source 521, the drain 523, and the gate 522 Or multiple. Since the source electrode 521, the drain electrode 523, and the gate electrode 522 are made of metal material, they have low light transmittance.
  • the first conductive layer 410 corresponds to any one or more of the source electrode 521, the drain electrode 523, and the gate electrode 522 During the setting, the display effect of the display panel 500 will not be adversely affected, and the display effect of the display panel 500 can be better guaranteed.
  • the electronic device 10 further includes a display assembly 600 stacked with the flexible cover 200, the display assembly 600 is located in the receiving space 100a, and the display assembly 600 includes a driver A circuit 610 and a light-emitting unit 620, the driving circuit 610 is used to drive the light-emitting unit 620 to work, and the first conductive layer 410 is arranged corresponding to the storage capacitor 611 in the driving circuit 610.
  • the display component 600 may be a flexible display component.
  • the driving circuit 610 includes a storage capacitor 611 and a switch unit 612, and the storage capacitor 611 cooperates with the switch unit 612 to drive the light emitting unit 620 to work.
  • the first conductive layer 410 is disposed corresponding to the storage capacitor 611, and both the first conductive layer 410 and the storage capacitor 611 are disposed avoiding the light emitting unit 620. Since the storage capacitor 611 is made of metal and has a low light transmittance, the first conductive layer 410 and the storage capacitor 611 are arranged correspondingly, which can reduce the first conductive layer 410 and the storage capacitor 611 to block the light emitting unit 620 and ensure the display assembly 600 The display effect.
  • the electronic device 10 further includes a display assembly 600 stacked with the flexible cover 200, the display assembly 600 is located in the receiving space 100a, and the display assembly 600 includes a plurality of spacer rows.
  • the display assembly 600 includes a plurality of spacer rows.
  • an isolation pillar 630 is arranged between two adjacent light-emitting units 620, and the first conductive layer 410 is arranged corresponding to the isolation pillar 630.
  • the spacer 630 is used to prevent the light-emitting unit 620 of the display assembly 600 from being scratched when the light-emitting unit 620 of the display assembly 600 is vapor-depositing the photomask.
  • the material of the spacer 630 has a high light transmittance, it still has a certain loss of light.
  • the first conductive layer 410 and the isolation pillars 630 are arranged correspondingly, which can reduce the first conductive layer 410 and the isolation pillars 630 to block the light emitting unit 620 and ensure the display effect of the display assembly 600.
  • the electronic device 10 further includes a touch layer 650, the touch layer 650 is located between the flexible cover 200 and the display panel 500, the touch layer 650 and the flexible
  • the cover plates 200 are bonded by a first optical glue 660, and the touch layer 650 and the display panel 500 are bonded by a second optical glue 670.
  • the touch layer 650 is used to detect external touch actions.
  • the touch layer 650 is arranged between the flexible cover 200 and the display panel 500, and the touch action from the flexible cover 200 can be quickly transferred to the touch layer 650, which helps to improve the touch detection sensitivity of the touch layer 650 .
  • a first optical glue 660 is arranged between the touch layer 650 and the flexible cover 200
  • a second optical glue 670 is arranged between the touch layer 650 and the display panel 500, and the first optical glue 660 and the second optical glue 670 cooperate with each other ,
  • the first optical adhesive 660 and the second optical adhesive 670 can be transparent OCA optical adhesives.
  • OCA optical adhesives are colorless and transparent, have a light transmittance of over 90%, and have good bonding strength. They can be cured at room temperature or medium temperature, and have Features such as small curing shrinkage.
  • the electronic device 10 further includes a main board 800 and a battery 810, the main board 800 and the battery 810 are both located in the receiving space 100a, and the main board 800 is connected to the housing 100, The main board 800 and the battery 810 are electrically connected, and the main board 800 is electrically connected to the touch layer 650 through a flexible circuit board 820, and touch signals sensed by the touch layer 650 pass through the flexible circuit The board 820 is transmitted to the main board 800.
  • the main board 800 is located inside the casing 100 relative to the display panel 500, and the battery 810 is located inside the casing 100 relative to the main board 800.
  • the touch signal sensed by the touch layer 650 is transmitted to the main board 800 through the flexible circuit board 820, and then the main board 800 generates a control signal according to the touch signal, and the control signal is used to instruct the display panel 500 to generate a corresponding Touch function.
  • the preparation method of the electronic device 10 provided in the embodiment of the present application includes but is not limited to S100, S200, S300, S400, and S500.
  • S100, S200, S300, S400 and S500 are described below.
  • the substrate 1000 may be an optically transparent flexible substrate 1000.
  • S200 forming a flexible protective layer 1100 covering the substrate 1000, please refer to FIG. 17.
  • the flexible protective layer 1100 is made of optically transparent material. Specifically, the flexible protective layer 1100 can be formed by painting and scraping to obtain the flexible cover 200.
  • the surface of the flexible protective layer 1100 away from the substrate 1000 may be imprinted, so that the flexible protective layer 1100 is away from the surface of the substrate 1000 to form a groove 1101, and then a metal material is filled in the groove 1101 to form A grid-shaped first conductive layer 410, at this time, the substrate 1000 and the flexible protective layer 1100 can be used as the flexible cover 200, and the first conductive layer 410 is formed on one side of the flexible cover 200.
  • S400 Provide a housing 100.
  • the housing 100 is made of metal and has a receiving space 100a. Please refer to FIG. 19.
  • the housing 100 may be processed already, or may be processed immediately.
  • the housing 100 may be a metal back cover of the electronic device 10.
  • the housing 100 constitutes the packaging structure of the electronic device 10.
  • the flexible cover 200 is accommodated in the opening of the accommodating space 100a, and a conductive glue 300 is formed between the first conductive layer 410 and the housing 100, so that the first conductive layer 410 is electrically connected to the housing 100, please refer to FIG. 20.
  • S100 is described before S400 in this embodiment, it does not mean that S100 must be before S400.
  • S400 can also be before S100, or S400 can also be performed simultaneously with S100.
  • the housing 100 has a receiving space 100a, the flexible cover 200 is located at the opening of the receiving space 100a of the housing 100, the flexible cover 200 is the glass cover of the electronic device 10, and the outer surface 200b of the flexible cover 200 is provided with a first conductive layer 410.
  • the conductive adhesive 300 is used to fix the flexible cover 200 to the housing 100 and make the first conductive layer 410 and the housing 100 conductive.
  • the first conductive layer 410 is made of a conductive material, and the housing 100 is also made of a metal material. Therefore, the first conductive layer 410 can be electrically connected to the housing 100. Thus, the first conductive layer 410 can be connected to the housing 100.
  • the housing 100 shares the ground.
  • the conductive glue 300 is located between the housing 100 and the flexible cover 200.
  • the flexible cover 200 has a display area 210 and a non-display area 220 surrounding the display area 210, and the conductive adhesive 300 is disposed corresponding to the non-display area 220, so that the first conductive layer 410 can be electrically connected to the non-display area 220.
  • the flexible cover 200 of the electronic device 10 when the electronic device 10 is not in contact with the human body except the operating area of the flexible cover 200, the flexible cover 200 of the electronic device 10 is in a suspended state.
  • the operating area is not electrically connected to the housing 100, and the human body does not touch the housing 100 of the electronic device 10. Therefore, the housing 100 and the flexible cover 200 are in a different ground state, which will cause the housing 100 and the flexible Mutual capacitance is generated between the cover plates 200, which causes the electronic device 10 to experience abnormal touch.
  • the electronic device 10 provided by the embodiment of the present invention includes a housing 100, a flexible cover 200 and a conductive glue 300.
  • the material of the housing 100 is metal and the housing 100 has a receiving space 100a.
  • the flexible cover 200 is located at the opening of the receiving space 100a.
  • the flexible cover 200 has an inner surface 200a and an outer surface 200b that are arranged oppositely. 200b constitutes the touch surface of the flexible cover 200, and the outer surface 200b is provided with a first conductive layer 410, and the conductive glue 300 is located between the first conductive layer 410 and the housing 100 to protect the The first conductive layer 410 is electrically connected to the housing 100.
  • a conductive state is formed between the user's finger and the housing 100.
  • a common ground is formed between the first conductive layer 410 and the housing 100. status.
  • the first conductive layer 410 and the housing 100 are electrically connected through the conductive adhesive 300, so that the first conductive layer 410 and the housing 100 are in a common ground state, and since the first conductive layer 410 is in contact with the flexible cover 200 At this time, the mutual capacitance between the housing 100 and the flexible cover 200 can be eliminated, thereby improving the touch effect of the electronic device 10.
  • S300 forming a first conductive layer 410 on the surface of the flexible protective layer 1100 away from the substrate 1000” includes but is not limited to S310.
  • S310 is introduced as follows.
  • S310 forming a plurality of conductive wires 411 arranged at intervals on the surface of the flexible protective layer 1100 away from the substrate 1000, and making the distance between two adjacent conductive wires 411 smaller than a first predetermined distance;
  • a plurality of conductive lines 411 arranged at intervals constitutes the first conductive layer 410, please refer to FIG. 22.
  • the conductive wires 411 extend in a straight line, a plurality of conductive wires 411 are arranged at intervals, and the distance between two adjacent conductive wires 411 is smaller than a first predetermined distance. Since the distance between two adjacent conductive lines 411 is less than the first preset distance, where the first preset distance is less than the width of the finger, when the user's finger touches the outer surface 200b of the flexible cover 200, the finger can Always touch the first conductive layer 410 on the flexible cover 200, so that the user’s finger and the housing 100 can be connected through the first conductive layer 410 and the conductive glue 300.
  • the housing 100 and the first conductive layer share the same ground, and since the first conductive layer 410 is in contact with the flexible cover 200, it helps to solve the problem of mutual capacitance between the housing 100 and the flexible cover 200 and ensure that the touch is more sensitive.
  • the conductive wire 411 may be formed by a single wire, or may be formed by interlacing multiple wires, that is, the conductive wire 411 may have a linear structure or a mesh structure.
  • the conductive wire 411 is composed of one wire.
  • the size of the conductive wire 411 can be set smaller, so that the display of the conductive wire 411 on the flexible cover 200 can be minimized. Undesirable interference produced.
  • the conductive wire 411 has a mesh structure, the conductive wire 411 is formed by winding multiple wires with each other. At this time, the conductive wire 411 has multiple conductive loops, which can make the electrical connection between the first conductive layer 410 and the housing 100 The connection relationship is more stable.
  • S300 forming a first conductive layer 410 on the surface of the flexible protective layer 1100 away from the substrate 1000” includes but is not limited to S320.
  • S320 is introduced as follows.
  • S320 Form a grid-shaped conductive layer on the surface of the flexible protective layer 1100 away from the substrate 1000, wherein a grid-shaped conductive layer constitutes the first conductive layer 410, please refer to Figure 24.
  • the first conductive layer 410 is a conductive layer whose entire layer is grid-shaped. At this time, the resistance of the first conductive layer 410 is smaller, and the grounding effect is better. And because the first conductive layer 410 is a whole conductive layer, it can cover a relatively large area of the flexible cover 200. When the user's finger touches any position of the flexible cover 200, the flexible cover 200 can be touched.
  • the first conductive layer 410 on the upper side facilitates the common ground between the first conductive layer 410 and the housing 100, and since the first conductive layer 410 is in contact with the flexible cover 200, the problem between the housing 100 and the flexible cover 200 is solved.
  • the mutual capacitance of the electronic device 10 improves the touch sensitivity of the electronic device 10.
  • S300 forming a first conductive layer 410 on the surface of the flexible protective layer 1100 away from the substrate 1000” includes but is not limited to S330.
  • S330 is introduced as follows.
  • S330 Form a plurality of grid-shaped sub-conductive layers 412 on the surface of the flexible protective layer 1100 away from the substrate 1000, and make the distance between two adjacent sub-conductive layers 412 Less than the second predetermined distance, wherein a plurality of the sub-conductive layers 412 arranged in a grid shape at intervals constitute the first conductive layer 410. Please refer to FIG. 26.
  • a plurality of sub-conductive layers 412 are arranged at intervals, the sub-conductive layers 412 are in a grid shape, and the distance between two adjacent sub-conductive layers 412 is smaller than the second preset distance, where the first 2.
  • the preset distance is smaller than the width of the finger.
  • the housing 100 and the first conductive layer 410 share the same ground, and since the first conductive layer 410 is in contact with the flexible cover 200, The problem of mutual capacitance generated between the housing 100 and the flexible cover 200 is solved, and the touch sensitivity of the electronic device 10 is improved.
  • S300 forming a first conductive layer 410 on the surface of the flexible protective layer 1100 away from the substrate 1000” includes but is not limited to S340 and S350, regarding S340 and S350 The details are as follows.
  • S350 Fill the conductive coating 1200 in the receiving groove 201 to form the first conductive layer 410, please refer to FIG. 29.
  • a receiving groove 201 is formed on the flexible cover 200, and then a conductive coating 1200 is filled in the receiving groove 201, and the conductive coating 1200 forms the first conductive layer 410.
  • the first conductive layer 410 is received in the receiving groove 201 by embedding, and the first conductive layer 410 is kept flush with the outer surface 200b of the flexible cover 200.
  • the first conductive layer 410 The outer side surface of and the outer surface 200b of the flexible cover 200 are coplanar. When the user touches the outer surface 200b of the flexible cover 200, it is relatively smooth and does not feel uncomfortable.
  • the receiving groove 201 may be a mesh-shaped receiving groove 201, and each receiving groove 201 is connected to each other.
  • the first conductive layer 410 is embedded in the receiving groove 201 of the flexible cover 200, on the one hand, the first The conductive layer 410 is stably embedded in the flexible cover 200.
  • the first conductive layer 410 can form a conductive network with multiple loops, and the multiple loops are all connected to the housing 100. When one of the circuits is interrupted, there are other circuits that continue to maintain the connection state with the housing 100, so that the housing 100 and the first conductive layer 410 maintain a stable electrical connection relationship.
  • the size of the receiving groove 201 is smaller than a predetermined threshold, and the size of the first conductive layer 410 is also smaller than the predetermined size, that is, the existence of the receiving groove 201 and the first conductive layer 410 does not The display effect of the flexible cover 200 is badly interfered.
  • S300 forming a first conductive layer 410 on the surface of the flexible protective layer 1100 away from the substrate 1000” includes but is not limited to S360 and S370. S360 and S370 are described in detail as follows.
  • S370 forming a fixing portion 414 surrounding the conductive portion 413 and fixedly connected to the conductive portion 413, and the conductive portion 413 and the fixing portion 414 together constitute the first conductive layer 410, wherein the fixing portion 414 and the housing 100 are electrically connected through the conductive adhesive 300, please refer to FIG. 32.
  • the conductive portion 413 has a grid shape
  • the fixed portion 414 forms a frame of the conductive portion 413
  • the conductive portion 413 is disposed on the outer surface 200b of the flexible cover 200
  • the conductive portion 413 is disposed corresponding to the display area 210 of the flexible cover 200
  • the fixing portion 414 is disposed corresponding to the non-display area 220 of the flexible cover 200
  • a conductive adhesive 300 is disposed before the fixing portion 414 and the housing 100 , To electrically connect the fixing portion 414 and the housing 100.
  • the fixing portion 414 and the conductive portion 413 are electrically connected, the conductive portion 413 and the housing 100 also form an electrical connection relationship.
  • the first conductive layer 410 and the housing 100 can be made to share the ground, and since the first conductive layer 410 is in contact with the flexible cover 200, it is helpful to solve the problem of The mutual capacitance problem generated between the flexible cover plates 200 further improves the touch sensitivity of the electronic device 10.
  • the flexible protective layer 1100 includes a first protective layer and a second protective layer that are stacked, and the preparation method of the electronic device 10 includes but is not limited to S210, S211, S212, and S213, regarding S210, S211 , S212 and S213 are described in detail as follows.
  • a second conductive layer 420 is formed on the surface of the first protective layer 1300 away from the substrate 1000.
  • the second conductive layer 420 has a plurality of second conductive nodes 420a. Please continue to refer to FIG. 35.
  • S213 Form a first conductive layer 410 on the surface of the second protective layer 1400 away from the second conductive layer 420, the first conductive layer 410 has a plurality of first conductive nodes 410a, wherein the first conductive layer There is a correspondence between the node 410a and the second conductive node 420a, and the first conductive node 410a and the second conductive node 420a are electrically connected. Please refer to FIG. 37 continuously.
  • the correspondence between the second conductive node 420a and the first conductive node 410a may be a one-to-one correspondence, that is, an electrical connection is formed between one second conductive node 420a and one first conductive node 410a. It may also be a one-to-many relationship, that is, an electrical connection is formed between one second conductive node 420a and a plurality of first conductive nodes 410a. It may also be a many-to-one relationship, that is, an electrical connection is formed between a plurality of second conductive nodes 420a and one first conductive node 410a.
  • a double-layer mesh structure is formed between the first conductive layer 410 and the second conductive layer 420, the first conductive layer 410 has a plurality of first conductive nodes 410a, and the second conductive layer 420 has a plurality of The second conductive node 420a, the first conductive layer 410 is located on the outer surface 200b of the flexible cover 200, the second conductive layer 420 is embedded in the flexible cover 200, and the first conductive Both the layer 410 and the second conductive layer 420 are electrically connected to the housing 100. In addition, an electrical connection is formed between the first conductive layer 410 and the second conductive layer 420.
  • the sweat on the finger may corrode the first conductive layer 410. If the first conductive node 410a on the first conductive layer 410 is The electrical connection relationship is damaged.
  • the first conductive node 410a touched by the user's finger can also form an electrical connection with the second conductive node 420a in the second conductive layer 420, thereby forming an electrical connection between the second conductive layer 420 and the housing 100.
  • the first conductive layer 410 may form a common ground with the housing 100 through the second conductive node 420a in the second conductive layer 420, and since the second conductive node 420a contacts the flexible cover 200, it helps To solve the mutual capacitance problem generated between the housing 100 and the flexible cover 200, it helps to improve the touch sensitivity of the electronic device 10.
  • the preparation method of the electronic device 10 also includes but is not limited to S600 and S610. The details of S600 and S610 are described below.
  • S610 forming a plurality of thin film transistor layers 510 arranged in an array on the display panel 500, so that the target device 520 in the thin film transistor layer 510 is arranged corresponding to the first conductive layer 410, wherein the target The light transmittance of the device 520 is less than the preset light transmittance, please refer to FIG. 40.
  • the display panel 500 is a liquid crystal display panel 500, the display panel 500 and the flexible cover 200 are laminated and arranged, and the display panel 500 is used for displaying images and text information.
  • the display panel 500 is located inside the housing 100 relative to the flexible cover 200.
  • the display panel 500 includes a plurality of thin film transistor layers 510 arranged in an array, and the first conductive layer 410 is arranged corresponding to the target device 520 in the thin film transistor layer 510, wherein the light transmittance of the target device 520 is less than the predetermined value. Set the light transmittance. In other words, the projection of the first conductive layer 410 on the thin film transistor layer 510 falls on the target device 520.
  • the first conductive layer 410 and the target device 520 correspond to each other. During the setting, it will not cause bad interference to the display of the display panel 500, which helps to ensure the display effect of the display panel 500.
  • the thin film transistor layer 510 includes a source 521, a drain 523, and a gate 522
  • the target device 520 includes any one of the source 521, the drain 523, and the gate 522 Or multiple. Since the source electrode 521, the drain electrode 523, and the gate electrode 522 are made of metal material, they have low light transmittance.
  • the first conductive layer 410 corresponds to any one or more of the source electrode 521, the drain electrode 523, and the gate electrode 522 During the setting, the display effect of the display panel 500 will not be adversely affected, and the display effect of the display panel 500 can be better guaranteed.
  • the preparation method of the electronic device 10 also includes but is not limited to S700 and S710. S700 and S710 are described in detail as follows.
  • S700 forming the display assembly 600 located in the receiving space 100a, please refer to FIG. 42.
  • S710 Form a driving circuit 610 and a light-emitting unit 620 on the display assembly 600, so that the storage capacitor 611 in the driving circuit 610 is arranged corresponding to the first conductive layer 410, wherein the driving circuit 610 is used for For driving the light emitting unit 620 to work, please refer to FIG. 43.
  • the display component 600 may be a flexible display component 600.
  • the driving circuit 610 includes a storage capacitor 611 and a switch unit 612, and the storage capacitor 611 cooperates with the switch unit 612 to drive the light emitting unit 620 to work.
  • the first conductive layer 410 is disposed corresponding to the storage capacitor 611, and both the first conductive layer 410 and the storage capacitor 611 are disposed avoiding the light emitting unit 620. Since the storage capacitor 611 is made of metal and has a low light transmittance, the first conductive layer 410 and the storage capacitor 611 are arranged correspondingly, which can reduce the first conductive layer 410 and the storage capacitor 611 to block the light emitting unit 620 and ensure the display assembly 600 The display effect.
  • the preparation method of the electronic device 10 also includes but is not limited to S720, S730, and S740. Details of S720, S730 and S740 are described below.
  • S720 Form the display assembly 600 in the receiving space 100a, please refer to FIG. 45.
  • S730 A number of light-emitting units 620 arranged at intervals are formed on the display assembly 600. Please continue to refer to FIG. 45.
  • S740 Form an isolation pillar 630 between two adjacent light-emitting units 620, so that the isolation pillar 630 is disposed corresponding to the first conductive layer 410, please refer to FIG. 46.
  • the spacer 630 is used to prevent the light-emitting unit 620 of the display assembly 600 from being scratched when the light-emitting unit 620 of the display assembly 600 is vapor-depositing the photomask.
  • the material of the spacer 630 has a high light transmittance, it still has a certain loss of light.
  • the first conductive layer 410 and the isolation pillar 630 are arranged correspondingly, which can reduce the first conductive layer 410 and the storage capacitor 611 to block the light emitting unit 620 and ensure the display effect of the display assembly 600.
  • the preparation method of the electronic device 10 also includes but is not limited to S620, S630, and S640. The details of S620, S630 and S640 are described below.
  • a touch layer 650 is formed between the flexible cover 200 and the display panel 500, please continue to refer to FIG. 48.
  • a first optical glue 660 is formed between the touch layer 650 and the flexible cover 200 to connect the touch layer 650 and the flexible cover 200, please continue to refer to FIG. 48.
  • a second optical glue 670 is formed between the touch layer 650 and the display panel 500 to connect the touch layer 650 and the display panel 500, please continue to refer to FIG. 48.
  • the touch layer 650 is used to detect external touch actions.
  • the touch layer 650 is arranged between the flexible cover 200 and the display panel 500, and the touch action from the flexible cover 200 can be quickly transferred to the touch layer 650, which helps to improve the touch detection sensitivity of the touch layer 650 .
  • a first optical glue 660 is arranged between the touch layer 650 and the flexible cover 200
  • a second optical glue 670 is arranged between the touch layer 650 and the display panel 500, and the first optical glue 660 and the second optical glue 670 cooperate with each other ,
  • the first optical adhesive 660 and the second optical adhesive 670 can be transparent OCA optical adhesives.
  • OCA optical adhesives are colorless and transparent, have a light transmittance of over 90%, and have good bonding strength. They can be cured at room temperature or medium temperature, and have Features such as small curing shrinkage.
  • the manufacturing method of the electronic device 10 further includes but is not limited to S800.
  • S800 The detailed description of S800 is as follows.
  • S800 Form the main board 800 and the battery 810 in the receiving space 100a, wherein the main board 800 is connected to the housing 100, the main board 800 and the battery 810 are electrically connected, and the main board 800 is The circuit board 820 is electrically connected to the touch layer 650, and the touch signal sensed by the touch layer 650 is transmitted to the main board 800 through the flexible circuit board 820. Please refer to FIG. 50.
  • the main board 800 is located inside the casing 100 relative to the display panel 500, and the battery 810 is located inside the casing 100 relative to the main board 800.
  • the touch signal sensed by the touch layer 650 is transmitted to the main board 800 through the flexible circuit board 820, and then the main board 800 generates a control signal according to the touch signal, and the control signal is used to instruct the display panel 500 to generate a corresponding Touch function.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本发明实施例提供一种电子设备（10）。所述电子设备（10）包括壳体（100）、柔性盖板（200）和导电胶（300），所述壳体（100）的材质为金属且所述壳体（100）具有收容空间（100a），所述柔性盖板（200）位于所述收容空间（100a）的开口处，所述柔性盖板（200）具有相对设置的内表面（200a）和外表面（200b），所述外表面（200b）构成所述柔性盖板（200）的触摸面，所述外表面（200b）设置有第一导电层（410），所述导电胶（300）位于所述第一导电层（410）与所述壳体（100）之间，以将所述第一导电层（410）和所述壳体（100）电连接。本发明实施例还提供一种电子设备（10）的制备方法。本申请实施例提供的电子设备（10）可以解决壳体（100）与柔性盖板（200）之间的互电容的问题，有助于提高电子设备（10）的触控灵敏度。

Description

电子设备及电子设备的制备方法 技术领域
本发明涉及电子技术领域，尤其涉及一种电子设备及电子设备的制备方法。
背景技术
现有电子设备的触控屏整机放置与桌面上，当电子设备不连接充电器，数据线，除触控屏操作区域外不和人体接触的状态下，触控屏处于悬浮状态，在厚柔性盖板的情况下，互电容的悬浮问题可以被解决，但在薄柔性盖板的情况下，电子设备的壳体和柔性盖板之间的互电容的悬浮问题目前未有较好的解决，容易导致触控异常。
发明内容
本发明实施例提供一种电子设备。所述电子设备包括壳体、柔性盖板和导电胶，所述壳体的材质为金属且所述壳体具有收容空间，所述柔性盖板位于所述收容空间的开口处，所述柔性盖板具有相对设置的内表面和外表面，所述外表面构成所述柔性盖板的触摸面，所述外表面设置有第一导电层，所述导电胶位于所述第一导电层与所述壳体之间，以将所述第一导电层和所述壳体电连接。
本发明实施例提供的电子设备包括壳体、柔性盖板和导电胶。壳体的材质为金属且壳体具有收容空间，柔性盖板位于所述收容空间的开口处，柔性盖板具有相对设置的内表面和外表面，所述外表面构成所述柔性盖板的触摸面，所述外表面设置有第一导电层，所述导电胶位于所述第一导电层与所述壳体之间，以将所述第一导电层和所述壳体电连接。本申请实施例提供的电子设备通过导电胶将第一导电层和壳体进行电连接，从而使得第一导电层和壳体处于共地的状态，此时，可以消除壳体和柔性盖板之间的互电容，进而提升电子设备的触控效果。
本发明实施例还提供一种电子设备的制备方法。所述电子设备的制备方法包括：
提供衬底；
形成覆盖所述衬底的柔性保护层；
在所述柔性保护层远离所述衬底的表面形成第一导电层，以得到柔性盖板；
提供壳体，所述壳体的材质为金属且具有收容空间；
将所述柔性盖板收容于所述收容空间的开口处，且在所述柔性盖板和所述壳体之间形成导电胶，以将所述第一导电层和所述壳体电连接。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的第一种电子设备的结构示意图。
图2是本申请实施例提供的第二种电子设备的结构示意图。
图3是本申请实施例提供的第一种第一导电层的结构示意图。
图4是本申请实施例提供的第二种第一导电层的结构示意图。
图5是本申请实施例提供的第三种第一导电层的结构示意图。
图6是本申请实施例提供的第四种第一导电层的结构示意图。
图7是本申请实施例提供的第三种电子设备的结构示意图。
图8是本申请实施例提供的第四种电子设备的结构示意图。
图9是图8中薄膜晶体管层的结构示意图。
图10是本申请实施例提供的第五种电子设备的结构示意图。
图11是图10中驱动电路的结构示意图。
图12是本申请实施例提供的第六种电子设备的结构示意图。
图13是本申请实施例提供的第七种电子设备的结构示意图。
图14是本申请实施例提供的第八种电子设备的结构示意图。
图15是本申请实施例提供的第一种电子设备的制备方法的流程示意图。
图16是图15中S100对应的结构示意图。
图17是图15中S200对应的结构示意图。
图18是图15中S300对应的结构示意图。
图19是图15中S400对应的结构示意图。
图20是图15中S500对应的结构示意图。
图21是本申请实施例提供的第二种电子设备的制备方法的局部流程示意图。
图22是图21中S310对应的结构示意图。
图23是本申请实施例提供的第三种电子设备的制备方法的局部流程示意图。
图24是图23中S320对应的结构示意图。
图25是本申请实施例提供的第四种电子设备的制备方法的局部流程示意图。
图26是图25中S330对应的结构示意图。
图27是本申请实施例提供的第五种电子设备的制备方法的局部流程示意图。
图28是图27中S340对应的结构示意图。
图29是图27中S350对应的结构示意图。
图30是本申请实施例提供的第六种电子设备的制备方法的局部流程示意图。
图31是图30中S360对应的结构示意图。
图32是图30中S370对应的结构示意图。
图33是本申请实施例提供的第七种电子设备的制备方法的局部流程示意图。
图34是图33中S210对应的结构示意图。
图35是图33中S211对应的结构示意图。
图36是图33中S212对应的结构示意图。
图37是图33中S213对应的结构示意图。
图38是本申请实施例提供的第八种电子设备的制备方法的局部流程示意图。
图39是图38中S600对应的结构示意图。
图40是图38中S610对应的结构示意图。
图41是本申请实施例提供的第九种电子设备的制备方法的局部流程示意图。
图42是图41中S700对应的结构示意图。
图43是图41中S710对应的结构示意图。
图44是本申请实施例提供的第十种电子设备的制备方法的局部流程示意图。
图45是图44中S720及S730对应的结构示意图。
图46是图44中S740对应的结构示意图。
图47是本申请实施例提供的第十一种电子设备的制备方法的局部流程示意图。
图48是图47中S620、S630和S640对应的结构示意图。
图49是本申请实施例提供的第十二种电子设备的制备方法的局部流程示意图。
图50是图49中S800对应的结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图1，本申请实施例提供的电子设备10包括壳体100、柔性盖板200和导电胶300，所述壳体100的材质为金属且所述壳体100具有收容空间100a，所述柔性盖板200位于所述收容空间100a的开口处，所述柔性盖板200具有相对设置的内表面200a和外表面200b，所述外表面200b构成所述柔性盖板200的触摸面，所述外表面200b设置有第一导电层410，所述导电胶300位于所述第一导电层410与所述壳体100之间，以将所述第一导电层410和所述壳体100电连接。
其中，所述电子设备10可以是任何具备通信和存储功能的设备。例如：平板电脑、手机、电子阅读器、遥控器、个人计算机(Personal Computer，PC)、笔记本电脑、车载设备、网络电视、可穿戴设备等具有网络功能的智能设备。
其中，所述壳体100可以为电子设备10的金属后盖，所述壳体100构成所述电子设备10的封装结构。壳体100具有收容空间100a，柔性盖板200位于壳体100的收容空间100a的开口处，柔性盖板200为电子设备10的盖板，柔性盖板200的外表面200b设置第一导电层410，导电胶300用于将柔性盖板200固定连接于壳体100，且使得第一导电层410与壳体100导通。第一导电层410为导电材质制成，壳体100也为金属材质，于是，第一导电层410就可以与壳体100之间形成电连接，由此，就可以将第一导电层410和壳体100共地。
其中，导电胶300位于壳体100和柔性盖板200之间，所述导电胶300可以邻近所述收容空间100a的开口处，也可以位于所述收容空间100a内。柔性盖板200具有显示区210和环绕所述显示区210的非显示区220，所述导电胶300对应所述非显示区220设置，以使得第一导电层410与所述可以保持电连接。
在一种实施方式中，所述壳体100面对所述柔性盖板200的表面具有容纳槽110，所述导电胶300位于所述容纳槽110内，且所述导电胶300用于将所述第一导电层410和壳体100形成电连接。由于导电胶300收容在壳体100的容纳槽110内，因此，导电胶300不占额外占据空间，有助于减小电子设备10的厚度，实现电子设备10的轻薄化设计。
相关技术中，当电子设备10除柔性盖板200的操作区域外，壳体100不和人体接触的状态下，电子设备10的柔性盖板200处于悬浮状态，此时，由于柔性盖板200的操作区域没有与壳体100之间形成电连接，且人体没有接触到电子设备10的壳体100，因此，壳体100和柔性盖板200处于不共地的状态，会导致壳体100和柔性盖板200之间产生互电容，进而导致电子设备10出现触控异常的情况。
本发明实施例提供的电子设备10包括壳体100、柔性盖板200和导电胶300。壳体100的材质为金属且壳体100具有收容空间100a，柔性盖板200位于所述收容空间100a的开口处，柔性盖板200具有相对设置的内表面200a和外表面200b，所述外表面200b构成所述柔性盖板200的触摸面，所述外表面200b设置有第一导电层410，所述导电胶300位于所述第一导电层410与所述壳体100之间，以将所述第一导电层410和所述壳体100电连接。当用户的手指触摸到柔性盖板200上的第一导电层410时，用户的手指与壳体100之间形成导通状态，此时，第一导电层410和壳体100之间形成共地状态。通过导电胶300将第一导电层410和壳体100进行电连接，从而使得第一导电层410和壳体100处于共地的状态，此时，可以消除壳体100和柔性盖板200之间的互电容，进而提高电子设备10的触控灵敏度。
请继续参阅图2，所述柔性盖板200的外表面200b具有收容槽201，所述第一导电层410位于所述收容槽201内。
具体的，所述柔性盖板200上开设有收容槽201，所述收容槽201呈凹槽状。第一导电层410通过嵌设的方式收容于所述收容槽201内，且所述第一导电层410与所述柔性盖板200的外表面200b保持平齐，此时，第一导电层410的外侧面和所述柔性盖板200的外表面200b共面。当用户触摸于柔性盖板200的外表面200b时，较为平滑，不会有不舒适感。
所述收容槽201可以为网状的收容槽201，各个收容槽201之间相互连通，当第一导电层410内嵌于柔性盖板200的收容槽201内时，一方面，可以使得第一导电层410稳定的内嵌于柔性盖板200，另一方面，可以使得第一导电层410形成导电网络，具有多个回路，且多个回路均连接于壳体100。当其中一个回路中断时，还有其他的回路继续保持与壳体100的连接状态，使得壳体100和第一导电层410之间维持稳定的电连接关系。
进一步的，所述收容槽201的尺寸小于预设阈值，且所述第一导电层410的尺寸也小于预设尺寸，即所述收容槽201和所述第一导电层410的存在并不会对柔性盖板200的显示效果形成不良干扰。
请继续参阅图3，所述第一导电层410包括若干个间隔排布的导电线411，相邻两个所述导电线411之间的间距小于第一预设距离。
在一种实施方式中，所述导电线411呈直线延伸，若干个导电线411之间间隔排布，且相邻两个导电线411之间的间距小于第一预设距离。由于相邻两个导电线411之间的间距小于第一预设距离，其中，第一预设距离小于手指的宽度尺寸，当用户的手指触摸在柔性盖板200的外表面200b时，手指可以始终触摸到柔性盖板200上的第一导电层410，从而可以使得用户手指和壳体100之间通过第一导电层410、导电胶300形成导通，此时，壳体100和第一导电层410共地，第一导电层410与柔性盖板200接触，有助于解决壳体100和柔性盖板200之间互电容的问题，提高触控灵敏度。
需要说明的是，所述导电线411可以为一根导线构成，也可以由多根导线交 错缠绕形成，即导电线411可以为线性结构，也可以为网状结构。当导电线411为线性结构时，导电线411为一根导线构成，此时，可以将导电线411的尺寸设置的更小，从而可以最大程度的减小导电线411对柔性盖板200的显示产生的不良干扰。当导电线411为网状结构时，导电线411由多跟导线相互缠绕形成，此时，导电线411具有多个导电回路，可以使得第一导电层410和所述壳体100之间的电连接关系更加稳定。
请继续参阅图4，所述第一导电层410为一整层导电层，所述第一导电层410呈网格状。
具体的，在本实施方式中，所述第一导电层410为一整层呈网格状的导电层。此时，所述第一导电层410的电阻较小，接地效果更好。且由于第一导电层410为一整层的导电层，可以覆盖柔性盖板200相对较大的面积，当用户的手指触摸至柔性盖板200的任意位置时，均可以触摸到柔性盖板200上的第一导电层410，便于第一导电层410和壳体100共地，第一导电层410与柔性盖板200接触，进而改善壳体100和柔性盖板200之间产生互电容情况，提高电子设备10的触控灵敏度。
请继续参阅图5，所述第一导电层410包括若干个间隔排布的子导电层412，所述子导电层412呈网格状，相邻两个所述子导电层412之间的间距小于第二预设距离。
具体的，在本实施方式中，若干个子导电层412间隔排布，所述子导电层412呈网格状，相邻两个子导电层412之间的间距小于第二预设距离，其中，第二预设距离小于手指的宽度尺寸，当用户的手指触摸在柔性盖板200的外表面200b时，手指可以始终触摸到柔性盖板200上的第一导电层410，从而可以使得用户手指和壳体100之间通过第一导电层410、导电胶300形成导通，此时，壳体100和第一导电层410共地，第一导电层410与柔性盖板200接触，有助于解决壳体100和柔性盖板200之间产生互电容的问题，提高电子设备10的触控灵敏度。
请继续参阅图6，所述第一导电层410包括导电部413和环绕所述导电部413的固定部414，所述导电部413与所述固定部414固定连接，所述导电部413嵌设于所述外表面200b，所述固定部414与所述壳体100通过所述导电胶300电连接。
具体的，所述导电部413呈现网格状，所述固定部414构成所述导电部413的边框，所述导电部413设置在所述柔性盖板200的外表面200b，且所述导电部413对应所述柔性盖板200的显示区210设置，所述固定部414对应所述柔性盖板200的非显示区220设置，所述固定部414和所述壳体100之间设置有导电胶300，以将所述固定部414和所述壳体100电连接。且由于固定部414和导电部413之间为电连接，因此，导电部413与壳体100之间也形成了电连接关系。当用户的手指触摸于导电部413上时，可以使得第一导电层410和壳体100共地，第一导电层410与柔性盖板200接触，有助于改善壳体100和柔性盖板200之间产生互电容问题，进而提高电子设备10的触控灵敏度。
请继续参阅图7，所述第一导电层410具有若干个第一导电节点410a，所述电子设备10还包括第二导电层420，所述第二导电层420电连接于所述壳体100，所述第二导电层420位于所述柔性盖板200内，且与所述第一导电层410层叠设置，所述第二导电层420具有若干个第二导电节点420a，所述第二导电节点420a和所述第一导电节点410a之间具有对应关系，且所述第二导电节点420a和所述 第一导电节点410a之间电连接。
其中，所述第二导电节点420a和所述第一导电节点410a之间具有对应关系。所述第二导电节点420a和所述第一导电节点410a之间的对应关系可以为一一对应，即一个第二导电节点420a与一个第一导电节点410a之间形成电连接。也可以为一对多的关系，即一个第二导电节点420a与多个第一导电节点410a之间形成电连接。还可以为多对一的关系，即多个第二导电节点420a与一个第一导电节点410a之间形成电连接。
所述第一导电层410和所述第二导电层420之间形成双层网状结构，所述第一导电层410具有多个第一导电节点410a，所述第二导电层420具有多个第二导电节点420a，所述第一导电层410位于所述柔性盖板200的外表面200b上，所述第二导电层420内嵌于所述柔性盖板200的内部，所述第一导电层410和所述第二导电层420均电连接于所述壳体100。且所述第一导电层410和所述第二导电层420之间形成电连接。当用户的手指触摸于第一导电层410上的第一导电节点410a时，由于手指上的汗液可能会腐蚀第一导电层410，假如第一导电层410上的第一导电节点410a之间的电连接关系被损坏，用户手指触摸到的第一导电节点410a还可以与第二导电层420中的第二导电节点420a形成电连接，从而通过第二导电层420与壳体100之间形成电连接，此时，第一导电层410可以通过第二导电层420中的第二导电节点420a与壳体100形成共地，第二导电节点420a与柔性盖板200接触，进而可以改善壳体100和柔性盖板200之间产生的互电容，有助于提高电子设备10的触控灵敏度。
请继续参阅图8和图9，所述电子设备10还包括与所述柔性盖板200层叠设置的显示面板500，所述显示面板500位于所述收容空间100a内，所述显示面板500包括若干个阵列排布的薄膜晶体管层510，所述第一导电层410与所述薄膜晶体管层510中的目标器件520对应设置，所述目标器件520的透光率小于预设透光率。
具体的，所述显示面板500可以为液晶显示面板，所述显示面板500与所述柔性盖板200层叠设置，所述显示面板500用于显示图像以及文字信息。所述显示面板500相对于所述柔性盖板200位于所述壳体100的内部。所述显示面板500包括若干个阵列排布的薄膜晶体管层510，所述第一导电层410与所述薄膜晶体管层510中的目标器件520对应设置，其中，目标器件520的透光率小于预设透光率。也就是说，第一导电层410在所述薄膜晶体管层510上的投影落在所述目标器件520上，由于目标器件520的透光率较小，将第一导电层410和目标器件520对应设置时，不会对显示面板500的显示产生不良干扰，有助于保证显示面板500的显示效果。
进一步的，所述薄膜晶体管层510包括源极521、漏极523以及栅极522，所述目标器件520包括所述源极521、所述漏极523以及所述栅极522中的任意一种或多种。由于源极521、漏极523以及栅极522为金属材质，具有较低的透光率，当第一导电层410对应源极521、漏极523以及栅极522中的任意一种或多种设置时，不会对显示面板500的显示效果产生不良影响，可以较好的保证显示面板500的显示效果。
请继续参阅图10和图11，所述电子设备10还包括与所述柔性盖板200层叠设置的显示组件600，所述显示组件600位于所述收容空间100a内，所述显示组件600包括驱动电路610、及发光单元620，所述驱动电路610用于驱动所述发光单元620工作，所述第一导电层410与所述驱动电路610中的存储电容 611对应设置。
其中，显示组件600可以为柔性显示组件。所述驱动电路610包括存储电容611、及开关单元612，所述存储电容611与所述开关单元612相互配合以驱动所述发光单元620工作。
在一种实施方式中，所述第一导电层410对应所述存储电容611设置，且所述第一导电层410和所述存储电容611均避开所述发光单元620设置。由于存储电容611为金属材质，透光率较低，将第一导电层410和存储电容611对应设置，可以减小第一导电层410和存储电容611对发光单元620产生遮挡，确保显示组件600的显示效果。
请继续参阅图12，所述电子设备10还包括与所述柔性盖板200层叠设置的显示组件600，所述显示组件600位于所述收容空间100a内，所述显示组件600包括若干个间隔排布的发光单元620，相邻两个所述发光单元620之间设置有隔离柱630，所述第一导电层410与所述隔离柱630对应设置。
其中，隔离柱630的作用时防止显示组件600的发光单元620在进行光罩蒸镀时，光罩与显示组件600已经做好的膜层发生刮伤。虽然隔离柱630材料透光率较高，但是还是会对光有一定的损耗。所述第一导电层410与所述隔离柱630对应设置，可以减小第一导电层410和隔离柱630对发光单元620产生遮挡，确保显示组件600的显示效果。
请继续参阅图13，所述电子设备10还包括触控层650，所述触控层650位于所述柔性盖板200和所述显示面板500之间，所述触控层650和所述柔性盖板200之间通过第一光学胶660粘接，所述触控层650和所述显示面板500之间通过第二光学胶670粘接。
其中，触控层650用于检测外界触控动作。将触控层650设置在柔性盖板200和显示面板500之间，来自柔性盖板200的触控动作可以快速的传递至触控层650，有助于提高触控层650的触控检测灵敏度。触控层650和柔性盖板200之间设置有第一光学胶660，触控层650和显示面板500之间设置有第二光学胶670，第一光学胶660和第二光学胶670相互配合，以将柔性盖板200、触控层650和显示面板500固定连接。第一光学胶660和第二光学胶670可以为透明的OCA光学胶，OCA光学胶具有无色透明、光透过率在90％以上、胶结强度良好，可在室温或中温下固化，且有固化收缩小等特点。
请继续参阅图14，所述电子设备10还包括主板800和电池810，所述主板800和所述电池810均位于所述收容空间100a内，且所述主板800连接于所述壳体100，所述主板800和所述电池810电连接，且所述主板800通过柔性电路板820与所述触控层650电连接，所述触控层650感测到的触控信号通过所述柔性电路板820传输至所述主板800。
具体的，主板800相对于显示面板500位于所述壳体100的内部，所述电池810相对于所述主板800位于所述壳体100的内部。所述触控层650感测到的触控信号通过柔性电路板820传输至主板800上，然后主板800根据所述触控信号产生控制信号，所述控制信号用于指示显示面板500产生相应的触控功能。
请继续参阅图15，本申请实施例提供的电子设备10的制备方法包括但不限于S100、S200、S300、S400和S500，关于S100、S200、S300、S400和S500详细介绍如下。
S100：提供衬底1000，请参阅图16。
其中，所述衬底1000可以为光学透明的柔性衬底1000。
S200：形成覆盖所述衬底1000的柔性保护层1100，请参阅图17。
其中，所述柔性保护层1100为光学透明材质。具体的，可以通过涂抹、刮扫的方式形成所述柔性保护层1100，以得到柔性盖板200。
S300：在所述柔性保护层1100远离所述衬底1000的表面形成第一导电层410，请参阅图18。
具体的，可以对柔性保护层1100远离衬底1000的表面进行压印，以使得柔性保护层1100远离衬底1000的表面形成凹槽1101，然后在所述凹槽1101内填充金属材料，以形成网格状的第一导电层410，此时，可以将衬底1000和柔性保护层1100作为柔性盖板200，所述第一导电层410形成于所述柔性盖板200的一侧。
S400：提供壳体100，所述壳体100的材质为金属且具有收容空间100a，请参阅图19。
其中，壳体100可以是已经加工好的，也可以是即时加工形成的。所述壳体100可以为电子设备10的金属后盖。所述壳体100构成所述电子设备10的封装结构。
S500：将所述柔性盖板200收容于所述收容空间100a的开口处，且在所述第一导电层410和所述壳体100之间形成导电胶300，以将所述第一导电层410和所述壳体100电连接，请参阅图20。
可以理解地，虽然在本实施方式中，S100先于S400描述，但是并不代表S100一定位于S400之前，S400也可位于S100之前，或者S400也可和S100同步进行。
壳体100具有收容空间100a，柔性盖板200位于壳体100的收容空间100a的开口处，柔性盖板200为电子设备10的玻璃盖板，柔性盖板200的外表面200b设置第一导电层410，导电胶300用于将柔性盖板200固定连接于壳体100，且使得第一导电层410与壳体100导通。第一导电层410为导电材质制成，壳体100也为金属材质，于是，第一导电层410就可以与壳体100之间形成电连接，由此，就可以将第一导电层410和壳体100进行共地。
其中，导电胶300位于壳体100和柔性盖板200之间。柔性盖板200具有显示区210和环绕所述显示区210的非显示区220，所述导电胶300对应所述非显示区220设置，以使得第一导电层410与所述可以保持电连接。
相关技术中，当电子设备10除柔性盖板200的操作区域外，壳体100不和人体接触的状态下，电子设备10的柔性盖板200处于悬浮状态，此时，由于柔性盖板200的操作区域没有与壳体100之间形成电连接，且人体没有接触到电子设备10的壳体100，因此，壳体100和柔性盖板200处于不共地的状态，会导致壳体100与柔性盖板200之间产生互电容，进而导致电子设备10出现触控异常的情况。
本发明实施例提供的电子设备10包括壳体100、柔性盖板200和导电胶300。壳体100的材质为金属且壳体100具有收容空间100a，柔性盖板200位于所述收容空间100a的开口处，柔性盖板200具有相对设置的内表面200a和外表面200b，所述外表面200b构成所述柔性盖板200的触摸面，所述外表面200b设置有第一导电层410，所述导电胶300位于所述第一导电层410与所述壳体100之间，以将所述第一导电层410和所述壳体100电连接。当用户的手指触摸到柔性盖板200上的第一导电层410时，用户的手指与壳体100之间形成导通状态，此时，第一导电层410和壳体100之间形成共地状态。通过导电胶300将第一导电 层410和壳体100进行电连接，从而使得第一导电层410和壳体100处于共地的状态，且由于第一导电层410接触于所述柔性盖板200，此时，可以消除壳体100与柔性盖板200之间的互电容，进而提高电子设备10的触控效果。
请继续参阅图21，在一种实施方式中，“S300：在所述柔性保护层1100远离所述衬底1000的表面形成第一导电层410”包括但不限于S310，关于S310介绍如下。
S310：在所述柔性保护层1100远离所述衬底1000的表面形成若干个间隔排布的导电线411，且使得相邻两个所述导电线411之间的间距小于第一预设距离，其中，若干个间隔排布的所述导电线411构成所述第一导电层410，请参阅图22。
在一种实施方式中，所述导电线411呈直线延伸，若干个导电线411之间间隔排布，且相邻两个导电线411之间的间距小于第一预设距离。由于相邻两个导电线411之间的间距小于第一预设距离，其中，第一预设距离小于手指的宽度尺寸，当用户的手指触摸在柔性盖板200的外表面200b时，手指可以始终触摸到柔性盖板200上的第一导电层410，从而可以使得用户手指和壳体100之间通过第一导电层410、导电胶300形成导通，此时，壳体100和第一导电层410共地，且由于第一导电层410接触于所述柔性盖板200，有助于解决壳体100与柔性盖板200之间产生互电容的问题，确保触控较为灵敏。
需要说明的是，所述导电线411可以为一根导线构成，也可以由多根导线交错缠绕形成，即导电线411可以为线性结构，也可以为网状结构。当导电线411为线性结构时，导电线411为一根导线构成，此时，可以将导电线411的尺寸设置的更小，从而可以最大程度的减小导电线411对柔性盖板200的显示产生的不良干扰。当导电线411为网状结构时，导电线411由多跟导线相互缠绕形成，此时，导电线411具有多个导电回路，可以使得第一导电层410和所述壳体100之间的电连接关系更加稳定。
请继续参阅图23，在一种实施方式中，“S300：在所述柔性保护层1100远离所述衬底1000的表面形成第一导电层410”包括但不限于S320，关于S320介绍如下。
S320：在所述柔性保护层1100远离所述衬底1000的表面形成一整层呈网格状的导电层，其中，一整层呈网格状的所述导电层构成所述第一导电层410，请参阅图24。
具体的，在本实施方式中，所述第一导电层410为一整层呈网格状的导电层。此时，所述第一导电层410的电阻较小，接地效果更好。且由于第一导电层410为一整层的导电层，可以覆盖柔性盖板200相对较大的面积，当用户的手指触摸至柔性盖板200的任意位置时，均可以触摸到柔性盖板200上的第一导电层410，便于第一导电层410和壳体100共地，且由于第一导电层410接触于所述柔性盖板200，进而解决壳体100与柔性盖板200之间产生的互电容情况，提高电子设备10的触控灵敏度。
请继续参阅图25，在一种实施方式中，“S300：在所述柔性保护层1100远离所述衬底1000的表面形成第一导电层410”包括但不限于S330，关于S330介绍如下。
S330：在所述柔性保护层1100远离所述衬底1000的表面形成若干个间隔排布的呈网格状的子导电层412，且使得相邻两个所述子导电层412之间的间距小于第二预设距离，其中，若干个间隔排布的呈网格状的所述子导电层412构成所述第一导电层410，请参阅图26。
具体的，在本实施方式中，若干个子导电层412间隔排布，所述子导电层412呈网格状，相邻两个子导电层412之间的间距小于第二预设距离，其中，第二预设距离小于手指的宽度尺寸，当用户的手指触摸在柔性盖板200的外表面200b时，手指可以始终触摸到柔性盖板200上的第一导电层410，从而可以使得用户手指和壳体100之间通过第一导电层410、导电胶300形成导通，此时，壳体100和第一导电层410共地，且由于第一导电层410接触于所述柔性盖板200，进而解决壳体100与柔性盖板200之间产生的互电容问题，提高电子设备10的触控灵敏度。
请继续参阅图27，在一种实施方式中，“S300：在所述柔性保护层1100远离所述衬底1000的表面形成第一导电层410”包括但不限于S340和S350，关于S340和S350详细介绍如下。
S340：在所述柔性保护层1100远离所述衬底1000的表面通过压印形成收容槽201，请参阅图28。
S350：在所述收容槽201内填充导电涂层1200，以形成所述第一导电层410，请参阅图29。
具体的，所述柔性盖板200上形成收容槽201，然后在所述收容槽201内填充导电涂层1200，所述导电涂层1200形成第一导电层410。第一导电层410通过嵌设的方式收容于所述收容槽201内，且所述第一导电层410与所述柔性盖板200的外表面200b保持平齐，此时，第一导电层410的外侧面和所述柔性盖板200的外表面200b共面。当用户触摸于柔性盖板200的外表面200b时，较为平滑，不会有不舒适感。
所述收容槽201可以为网状的收容槽201，各个收容槽201之间相互连通，当第一导电层410内嵌于柔性盖板200的收容槽201内时，一方面，可以使得第一导电层410稳定的内嵌于柔性盖板200，另一方面，可以使得第一导电层410形成导电网络，具有多个回路，且多个回路均连接于壳体100。当其中一个回路中断时，还有其他的回路继续保持与壳体100的连接状态，使得壳体100和第一导电层410之间维持稳定的电连接关系。
进一步的，所述收容槽201的尺寸小于预设阈值，且所述第一导电层410的尺寸也小于预设尺寸，即所述收容槽201和所述第一导电层410的存在并不会对柔性盖板200的显示效果形成不良干扰。
请继续参阅图30，“S300：在所述柔性保护层1100远离所述衬底1000的表面形成第一导电层410”包括但不限于S360和S370，关于S360和S370详细介绍如下。
S360：在所述柔性保护层1100远离所述衬底1000的表面形成导电部413，请参阅图31。
S370：形成环绕所述导电部413且与所述导电部413固定连接的固定部414，所述导电部413和所述固定部414共同构成所述第一导电层410，其中，所述固定部414与所述壳体100通过所述导电胶300电连接，请参阅图32。
具体的，所述导电部413呈现网格状，所述固定部414构成所述导电部413的边框，所述导电部413设置在所述柔性盖板200的外表面200b，且所述导电部413对应所述柔性盖板200的显示区210设置，所述固定部414对应所述柔性盖板200的非显示区220设置，所述固定部414和所述壳体100之前设置有导电胶300，以将所述固定部414和所述壳体100电连接。且由于固定部414和导电部413之间为电连接，因此，导电部413与壳体100之间也形成了电连接关系。 当用户的手指触摸于导电部413上时，可以使得第一导电层410和壳体100共地，且由于第一导电层410接触于所述柔性盖板200，有助于解决壳体100与柔性盖板200之间产生的互电容问题，进而提高电子设备10的触控灵敏度。
请继续参阅图33，所述柔性保护层1100包括层叠设置的第一保护层和第二保护层，所述电子设备10的制备方法包括但不限于S210、S211、S212和S213，关于S210、S211、S212和S213详细介绍如下。
S210：形成覆盖所述衬底1000的第一保护层1300，请继续参阅图34。
S211：在所述第一保护层1300远离所述衬底1000的表面形成第二导电层420，所述第二导电层420具有若干个第二导电节点420a，请继续参阅图35。
S212：形成覆盖所述第二导电层420的第二保护层1400，请继续参阅图36。
S213：在所述第二保护层1400远离所述第二导电层420的表面形成第一导电层410，所述第一导电层410具有若干个第一导电节点410a，其中，所述第一导电节点410a和所述第二导电节点420a之间具有对应关系，且所述第一导电节点410a和所述第二导电节点420a之间电连接，请继续参阅图37。
其中，所述第二导电节点420a和所述第一导电节点410a之间具有对应关系。所述第二导电节点420a和所述第一导电节点410a之间的对应关系可以为一一对应，即一个第二导电节点420a与一个第一导电节点410a之间形成电连接。也可以为一对多的关系，即一个第二导电节点420a与多个第一导电节点410a之间形成电连接。还可以为多对一的关系，即多个第二导电节点420a与一个第一导电节点410a之间形成电连接。
所述第一导电层410和所述第二导电层420之间形成双层网状结构，所述第一导电层410具有多个第一导电节点410a，所述第二导电层420具有多个第二导电节点420a，所述第一导电层410位于所述柔性盖板200的外表面200b上，所述第二导电层420内嵌于所述柔性盖板200的内部，所述第一导电层410和所述第二导电层420均电连接于所述壳体100。且所述第一导电层410和所述第二导电层420之间形成电连接。当用户的手指触摸于第一导电层410上的第一导电节点410a时，由于手指上的汗液可能会腐蚀第一导电层410，假如第一导电层410上的第一导电节点410a之间的电连接关系被损坏，用户手指触摸到的第一导电节点410a还可以与第二导电层420中的第二导电节点420a形成电连接，从而通过第二导电层420与壳体100之间形成电连接，此时，第一导电层410可以通过第二导电层420中的第二导电节点420a与壳体100形成共地，且由于第二导电节点420a接触于所述柔性盖板200，有助于解决壳体100与柔性盖板200之间产生的互电容问题，有助于提高电子设备10的触控灵敏度。
请继续参阅图38，所述电子设备10的制备方法还包括但不限于S600和S610，关于S600和S610详细介绍如下。
S600：形成位于所述收容空间100a内的显示面板500，请参阅图39。
S610：在所述显示面板500上形成若干个阵列排布的薄膜晶体管层510，以使得所述薄膜晶体管层510中的目标器件520与所述第一导电层410对应设置，其中，所述目标器件520的透光率小于预设透光率，请参阅图40。
具体的，所述显示面板500为液晶显示面板500，所述显示面板500与所述柔性盖板200层叠设置，所述显示面板500用于显示图像以及文字信息。所述显示面板500相对于所述柔性盖板200位于所述壳体100的内部。所述显示面板500包括若干个阵列排布的薄膜晶体管层510，所述第一导电层410与所述薄膜晶体管层510中的目标器件520对应设置，其中，目标器件520的透光率小于预 设透光率。也就是说，第一导电层410在所述薄膜晶体管层510上的投影落在所述目标器件520上，由于目标器件520的透光率较小，将第一导电层410和目标器件520对应设置时，不会对显示面板500的显示产生不良干扰，有助于保证显示面板500的显示效果。
进一步的，所述薄膜晶体管层510包括源极521、漏极523以及栅极522，所述目标器件520包括所述源极521、所述漏极523以及所述栅极522中的任意一种或多种。由于源极521、漏极523以及栅极522为金属材质，具有较低的透光率，当第一导电层410对应源极521、漏极523以及栅极522中的任意一种或多种设置时，不会对显示面板500的显示效果产生不良影响，可以较好的保证显示面板500的显示效果。
请继续参阅图41，所述电子设备10的制备方法还包括但不限于S700和S710，关于S700和S710详细介绍如下。
S700：形成位于所述收容空间100a内的显示组件600，请参阅图42。
S710：在所述显示组件600上形成驱动电路610及发光单元620，以使得所述驱动电路610中的存储电容611与所述第一导电层410对应设置，其中，所述驱动电路610用于驱动所述发光单元620工作，请参阅图43。
其中，所述显示组件600可以为柔性显示组件600。所述驱动电路610包括存储电容611、及开关单元612，所述存储电容611与所述开关单元612相互配合以驱动所述发光单元620工作。
在一种实施方式中，所述第一导电层410对应所述存储电容611设置，且所述第一导电层410和所述存储电容611均避开所述发光单元620设置。由于存储电容611为金属材质，透光率较低，将第一导电层410和存储电容611对应设置，可以减小第一导电层410和存储电容611对发光单元620产生遮挡，确保显示组件600的显示效果。
请继续参阅图44，所述电子设备10的制备方法还包括但不限于S720、S730和S740，关于S720、S730和S740详细介绍如下。
S720：形成位于所述收容空间100a内的显示组件600，请参阅图45。
S730：在所述显示组件600上形成若干个间隔排布的发光单元620，请继续参阅图45。
S740：在相邻两个所述发光单元620之间形成隔离柱630，以使得所述隔离柱630与所述第一导电层410对应设置，请参阅图46。
其中，隔离柱630的作用时防止显示组件600的发光单元620在进行光罩蒸镀时，光罩与显示组件600已经做好的膜层发生刮伤。虽然隔离柱630材料透光率较高，但是还是会对光有一定的损耗。所述第一导电层410与所述隔离柱630对应设置，可以减小第一导电层410和存储电容611对发光单元620产生遮挡，确保显示组件600的显示效果。
请继续参阅图47，所述电子设备10的制备方法还包括但不限于S620、S630和S640，关于S620、S630和S640详细介绍如下。
S620：在所述柔性盖板200和所述显示面板500之间形成触控层650，请继续参阅图48。
S630：在所述触控层650和所述柔性盖板200之间形成第一光学胶660，以将所述触控层650和所述柔性盖板200连接，请继续参阅图48。
S640：在所述触控层650和所述显示面板500之间形成第二光学胶670，以将所述触控层650和所述显示面板500连接，请继续参阅图48。
其中，触控层650用于检测外界触控动作。将触控层650设置在柔性盖板200和显示面板500之间，来自柔性盖板200的触控动作可以快速的传递至触控层650，有助于提高触控层650的触控检测灵敏度。触控层650和柔性盖板200之间设置有第一光学胶660，触控层650和显示面板500之间设置有第二光学胶670，第一光学胶660和第二光学胶670相互配合，以将柔性盖板200、触控层650和显示面板500固定连接。第一光学胶660和第二光学胶670可以为透明的OCA光学胶，OCA光学胶具有无色透明、光透过率在90％以上、胶结强度良好，可在室温或中温下固化，且有固化收缩小等特点。
请继续参阅图49，所述电子设备10的制备方法还包括但不限于S800，关于S800详细介绍如下。
S800：形成位于所述收容空间100a内的主板800和电池810，其中，所述主板800连接于所述壳体100，所述主板800和所述电池810电连接，且所述主板800通过柔性电路板820与所述触控层650电连接，所述触控层650感测到的触控信号通过所述柔性电路板820传输至所述主板800，请参阅图50。
具体的，主板800相对于显示面板500位于所述壳体100的内部，所述电池810相对于所述主板800位于所述壳体100的内部。所述触控层650感测到的触控信号通过柔性电路板820传输至主板800上，然后主板800根据所述触控信号产生控制信号，所述控制信号用于指示显示面板500产生相应的触控功能。
最后应说明的是：以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到的变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以权利要求的保护范围为准。

Claims (26)

  1. 一种电子设备，其特征在于，所述电子设备包括壳体、柔性盖板和导电胶，所述壳体的材质为金属且所述壳体具有收容空间，所述柔性盖板位于所述收容空间的开口处，所述柔性盖板具有相对设置的内表面和外表面，所述外表面构成所述柔性盖板的触摸面，所述外表面设置有第一导电层，所述导电胶位于所述第一导电层与所述壳体之间，以将所述第一导电层和所述壳体电连接。
  2. 如权利要求1所述的电子设备，其特征在于，所述第一导电层包括若干个间隔排布的导电线，相邻两个所述导电线之间的间距小于第一预设距离。
  3. 如权利要求1所述的电子设备，其特征在于，所述第一导电层为一整层导电层，所述第一导电层呈网格状。
  4. 如权利要求1所述的电子设备，其特征在于，所述第一导电层包括若干个间隔排布的子导电层，所述子导电层呈网格状，相邻两个所述子导电层之间的间距小于第二预设距离。
  5. 如权利要求1-4任一项所述的电子设备，其特征在于，所述柔性盖板的外表面具有收容槽，所述第一导电层位于所述收容槽内。
  6. 如权利要求1所述的电子设备，其特征在于，所述第一导电层包括导电部和环绕所述导电部的固定部，所述导电部与所述固定部固定连接，所述导电部嵌设于所述外表面，所述固定部与所述壳体通过所述导电胶电连接。
  7. 如权利要求3-6任一项所述的电子设备，其特征在于，所述第一导电层具有若干个第一导电节点，所述电子设备还包括第二导电层，所述第二导电层电连接于所述壳体，所述第二导电层位于所述柔性盖板内，且与所述第一导电层层叠设置，所述第二导电层具有若干个第二导电节点，所述第二导电节点和所述第一导电节点之间具有对应关系，且所述第二导电节点和所述第一导电节点之间电连接。
  8. 如权利要求1所述的电子设备，其特征在于，所述电子设备还包括与所述柔性盖板层叠设置的显示面板，所述显示面板位于所述收容空间内，所述显示面板包括若干个阵列排布的薄膜晶体管层，所述第一导电层与所述薄膜晶体管层中的目标器件对应设置，所述目标器件的透光率小于预设透光率。
  9. 如权利要求8所述的电子设备，其特征在于，所述薄膜晶体管层包括源极、漏极以及栅极，所述目标器件包括所述源极、所述漏极以及所述栅极中的任意一种或多种。
  10. 如权利要求1所述的电子设备，其特征在于，所述电子设备还包括与所述柔性盖板层叠设置的显示组件，所述显示组件位于所述收容空间内，所述显示组件包括驱动电路、及发光单元，所述驱动电路用于驱动所述发光单元工作，所述第一导电层与所述驱动电路中的存储电容对应设置。
  11. 如权利要求1所述的电子设备，其特征在于，所述电子设备还包括与所述柔性盖板层叠设置的显示组件，所述显示组件位于所述收容空间内，所述显示组件包括若干个间隔排布的发光单元，相邻两个所述发光单元之间设置有隔离柱，所述第一导电层与所述隔离柱对应设置。
  12. 如权利要求8-9任一项所述的电子设备，其特征在于，所述电子设备还包括触控层，所述触控层位于所述柔性盖板和所述显示面板之间，所述触控层和所述柔性盖板之间通过第一光学胶粘接，所述触控层和所述显示面板之间通过第二光学胶粘接。
  13. 如权利要求12所述的电子设备，其特征在于，所述电子设备还包括主板和电池，所述主板和所述电池均位于所述收容空间内，且所述主板连接于所述壳体，所述主板和所述电池电连接，且所述主板通过柔性电路板与所述触控层电连接，所述触控层感测到的触控信号通过所述柔性电路板传输至所述主板。
  14. 一种电子设备的制备方法，其特征在于，所述电子设备的制备方法包括：
    提供衬底；
    形成覆盖所述衬底的柔性保护层；
    在所述柔性保护层远离所述衬底的表面形成第一导电层；
    提供壳体，所述壳体的材质为金属且具有收容空间；
    将所述柔性盖板收容于所述收容空间的开口处，且在所述第一导电层和所述壳体之间形成导电胶，以将所述第一导电层和所述壳体电连接。
  15. 如权利要求14所述的电子设备的制备方法，其特征在于，在所述柔性保护层远离所述衬底的表面形成若干个间隔排布的导电线，且使得相邻两个所述导电线之间的间距小于第一预设距离，其中，若干个间隔排布的所述导电线构成所述第一导电层。
  16. 如权利要求14所述的电子设备的制备方法，其特征在于，在所述柔性保护层远离所述衬底的表面形成一整层呈网格状的导电层，其中，一整层呈网格状的所述导电层构成所述第一导电层。
  17. 如权利要求14所述的电子设备的制备方法，其特征在于，在所述柔性保护层远离所述衬底的表面形成若干个间隔排布的呈网格状的子导电层，且使得相邻两个所述子导电层之间的间距小于第二预设距离，其中，若干个间隔排布的呈网格状的所述子导电层构成所述第一导电层。
  18. 如权利要求14-17任一项所述的电子设备的制备方法，其特征在于，
    在所述柔性保护层远离所述衬底的表面通过压印形成收容槽；
    在所述收容槽内填充导电涂层，以形成所述第一导电层。
  19. 如权利要求14所述的电子设备的制备方法，其特征在于，
    在所述柔性保护层远离所述衬底的表面形成导电部；
    形成环绕所述导电部且与所述导电部固定连接的固定部，所述导电部和所述固定部共同构成所述第一导电层，其中，所述固定部与所述壳体通过所述导电胶电连接。
  20. 如权利要求16-19任一项所述的电子设备的制备方法，其特征在于，所述柔性保护层包括层叠设置的第一保护层和第二保护层，所述电子设备的制备方法包括：
    形成覆盖所述衬底的第一保护层；
    在所述第一保护层远离所述衬底的表面形成第二导电层，所述第二导电层具有若干个第二导电节点；
    形成覆盖所述第二导电层的第二保护层；
    在所述第二保护层远离所述第二导电层的表面形成第一导电层，所述第一导电层具有若干个第一导电节点，其中，所述第一导电节点和所述第二导电节点之间具有对应关系，且所述第一导电节点和所述第二导电节点之间电连接。
  21. 如权利要求14所述的电子设备的制备方法，其特征在于，
    形成位于所述收容空间内的显示面板；
    在所述显示面板上形成若干个阵列排布的薄膜晶体管层，以使得所述薄膜晶体管层中的目标器件与所述第一导电层对应设置，其中，所述目标器件的透光率 小于预设透光率。
  22. 如权利要求21所述的电子设备的制备方法，其特征在于，所述薄膜晶体管层包括源极、漏极以及栅极，所述目标器件包括所述源极、所述漏极及所述栅极中的任意一种或多种。
  23. 如权利要求14所述的电子设备的制备方法，其特征在于，
    形成位于所述收容空间内的显示组件；
    在所述显示组件上形成驱动电路及发光单元，以使得所述驱动电路中的存储电容与所述第一导电层对应设置，其中，所述驱动电路用于驱动所述发光单元工作。
  24. 如权利要求14所述的电子设备的制备方法，其特征在于，
    形成位于所述收容空间内的显示组件；
    在所述显示组件上形成若干个间隔排布的发光单元；
    在相邻两个所述发光单元之间形成隔离柱，以使得所述隔离柱与所述第一导电层对应设置。
  25. 如权利要求21-22任一项所述的电子设备的制备方法，其特征在于，
    在所述柔性盖板和所述显示面板之间形成触控层；
    在所述触控层和所述柔性盖板之间形成第一光学胶，以将所述触控层和所述柔性盖板连接；
    在所述触控层和所述显示面板之间形成第二光学胶，以将所述触控层和所述显示面板连接。
  26. 如权利要求25所述的电子设备的制备方法，其特征在于，
    形成位于所述收容空间内的主板和电池，其中，所述主板连接于所述壳体，所述主板和所述电池电连接，且所述主板通过柔性电路板与所述触控层电连接，所述触控层感测到的触控信号通过所述柔性电路板传输至所述主板。
PCT/CN2019/087061 2019-05-15 2019-05-15 电子设备及电子设备的制备方法 Ceased WO2020227978A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2019/087061 WO2020227978A1 (zh) 2019-05-15 2019-05-15 电子设备及电子设备的制备方法
CN201980079832.8A CN113330401A (zh) 2019-05-15 2019-05-15 电子设备及电子设备的制备方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/087061 WO2020227978A1 (zh) 2019-05-15 2019-05-15 电子设备及电子设备的制备方法

Publications (1)

Publication Number Publication Date
WO2020227978A1 true WO2020227978A1 (zh) 2020-11-19

Family

ID=73290117

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/087061 Ceased WO2020227978A1 (zh) 2019-05-15 2019-05-15 电子设备及电子设备的制备方法

Country Status (2)

Country Link
CN (1) CN113330401A (zh)
WO (1) WO2020227978A1 (zh)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102063219A (zh) * 2010-11-26 2011-05-18 友达光电股份有限公司 触控显示模块及操作方法
CN102902402A (zh) * 2012-06-29 2013-01-30 联想(北京)有限公司 电子装置、电子设备和辨别电子装置的表面的方法
CN103197821A (zh) * 2013-04-03 2013-07-10 清华大学 可感知触控力度和精准定位的电容-压电复合式触摸屏
CN103268181A (zh) * 2013-06-15 2013-08-28 福建科创光电有限公司 电容式触摸屏模组及其制备方法
CN203217542U (zh) * 2013-04-03 2013-09-25 清华大学 一种感知触控力度和精准定位的电容-压电复合式触摸屏
CN103927032A (zh) * 2013-01-11 2014-07-16 瀚宇彩晶股份有限公司 触控显示装置
CN104346006A (zh) * 2013-07-31 2015-02-11 比亚迪股份有限公司 电容屏及其制造方法和具有该电容屏的设备
CN104345967A (zh) * 2014-05-31 2015-02-11 深圳市骏达光电股份有限公司 一种触摸屏用感应组件及其制备方法、触摸屏

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103699269B (zh) * 2013-12-27 2017-02-01 京东方科技集团股份有限公司 一种双面触摸显示装置
CN204679956U (zh) * 2015-06-14 2015-09-30 吉林大学 一种可增强移动终端静电力触觉再现感受的屏幕组件
CN205827354U (zh) * 2016-06-17 2016-12-21 深圳市汇顶科技股份有限公司 一种触控设备及电子终端

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102063219A (zh) * 2010-11-26 2011-05-18 友达光电股份有限公司 触控显示模块及操作方法
CN102902402A (zh) * 2012-06-29 2013-01-30 联想(北京)有限公司 电子装置、电子设备和辨别电子装置的表面的方法
CN103927032A (zh) * 2013-01-11 2014-07-16 瀚宇彩晶股份有限公司 触控显示装置
CN103197821A (zh) * 2013-04-03 2013-07-10 清华大学 可感知触控力度和精准定位的电容-压电复合式触摸屏
CN203217542U (zh) * 2013-04-03 2013-09-25 清华大学 一种感知触控力度和精准定位的电容-压电复合式触摸屏
CN103268181A (zh) * 2013-06-15 2013-08-28 福建科创光电有限公司 电容式触摸屏模组及其制备方法
CN104346006A (zh) * 2013-07-31 2015-02-11 比亚迪股份有限公司 电容屏及其制造方法和具有该电容屏的设备
CN104345967A (zh) * 2014-05-31 2015-02-11 深圳市骏达光电股份有限公司 一种触摸屏用感应组件及其制备方法、触摸屏

Also Published As

Publication number Publication date
CN113330401A (zh) 2021-08-31

Similar Documents

Publication Publication Date Title
KR102714659B1 (ko) 전자 기기
US10892428B2 (en) Flexible substrate and manufacturing method thereof
CN102760010B (zh) 触控显示面板与触控液晶显示面板
CN114038317B (zh) 电子装置
KR102687959B1 (ko) 포스 터치 기능을 갖는 전자 기기
CN203386163U (zh) 触控显示装置
CN107340942A (zh) 触控面板及显示设备
TW201435670A (zh) 觸控顯示裝置
CN106126001A (zh) 触控面板及其制造方法
TW201430661A (zh) 觸控面板
CN106502441B (zh) 触控面板及其制作方法
TWI818069B (zh) 輸入感測單元及包含其之顯示裝置
JP2019101095A (ja) 液晶パネル
US20190163306A1 (en) Touch panel and touch display device and method for fabricating the same, touch display device (as amended)
TW202009673A (zh) 觸控顯示裝置
TWI452612B (zh) 觸控面板及觸控顯示面板
CN103676266A (zh) 具有低反射静电屏蔽的显示器
TW201530400A (zh) 觸控裝置
CN115877974A (zh) 触摸感测单元和显示装置
CN104461155A (zh) 一种内嵌式触控显示屏及显示装置
CN214201990U (zh) 一种触控显示屏和显示装置
TWI531945B (zh) 觸控顯示裝置及觸控裝置
TWM570470U (zh) 觸控顯示裝置
CN104834407A (zh) 触控面板的制备方法、触控面板和显示装置
CN204650467U (zh) 触控元件

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19928891

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19928891

Country of ref document: EP

Kind code of ref document: A1