WO2020226269A1 - Camera module compensating for lens focus using elastic member, and electronic device comprising camera module - Google Patents

Abstract

Various embodiments of the present invention relate to a camera module compensating for lens focus using an elastic member, and an electronic device comprising the camera module, the camera module comprising: a printed circuit board; an image sensor disposed on a first region on one surface of the printed circuit board; an elastic member surrounding the image sensor and disposed on a second region on the one surface; a filter disposed on at least a portion of the image sensor and the elastic member; a holder for receiving, in the lower portion thereof, the image sensor, the elastic member and the filter; and a lens assembly received in the upper portion of the holder and comprising at least one lens, wherein, according to the thickness of the lens changing depending on the temperature of the outside environment, the thickness of the elastic member may also change. Other various embodiments are possible.

Description

A camera module for compensating the focus of a lens using an elastic member, and an electronic device including the camera module

Various embodiments of the present disclosure relate to a camera module for compensating the focus of a lens using an elastic member and an electronic device including the camera module.

The portable electronic device may include one or more camera modules to take a picture or video.

The camera module includes a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) image sensor due to the development of digital and semiconductor technologies.

Since the camera module is small and lightweight, it is embedded in various digital devices such as portable electronic devices such as smart phones, personal digital assistants (PDAs), and tablet PCs.

The camera module may include an optical zoom lens for enlarging or reducing an image and a fixed focus lens having a fixed focal length.

In the portable electronic device, a camera module having a fixed focus lens may be mounted due to a limitation of an internal space.

In the camera module built into the portable electronic device, when the temperature of the external environment changes (eg, low temperature), the thickness of the lens may change, and thus the focus of the lens may change and resolution may decrease. For example, in the camera module, when the temperature of the external environment decreases to about -10°C, the focal length of the lens may be shortened to about 22 μm due to a change in the thickness of the lens.

Various embodiments of the present invention include a camera module capable of compensating for a focus of a lens by using an elastic member (eg, a bracket) having a high coefficient of thermal expansion even if the thickness of the lens changes due to a lower temperature of the external environment. An electronic device including a can be provided.

The camera module according to various embodiments of the present disclosure includes a printed circuit board, an image sensor disposed in a first area of one surface of the printed circuit board, an elastic member disposed in a second area of the one surface surrounding the image sensor, and An image sensor and a filter disposed on at least a portion of the elastic member, a housing accommodating the image sensor, the elastic member, and the filter below, and a lens assembly accommodating at an upper portion of the housing and including at least one lens And, according to the temperature of the external environment, the thickness of the elastic member may be changed in response to the change in the thickness of the lens.

A camera module according to various embodiments of the present invention includes a printed circuit board, an image sensor disposed on one surface of the printed circuit board, a filter disposed on at least a part of the image sensor, the image sensor and the filter under the A housing, an elastic member disposed on the housing, and a lens assembly disposed on the elastic member and including at least one lens, wherein the thickness of the lens changes according to the temperature of the external environment. Correspondingly, it may be configured to change the thickness of the elastic member.

An electronic device according to various embodiments of the present disclosure includes a first plate, a second plate facing in a direction opposite to the first plate, and a side member surrounding a space between the first plate and the second plate. A housing, and a camera module disposed in the space near a portion of the side member, the camera module comprising: a printed circuit board, an image sensor disposed in a first area of one surface of the printed circuit board, and the image sensor An elastic member surrounding and disposed in the second area of the one surface, a filter disposed on at least a portion of the image sensor and the elastic member, a holder receiving the image sensor, the elastic member, and the filter under the upper portion of the holder And a lens assembly including a lens, and may be configured to change the thickness of the elastic member in response to a change in the thickness of the lens according to the temperature of the external environment.

According to various embodiments of the present disclosure, even if the thickness of the lens is changed due to a decrease in the temperature of the external environment, the focus of the lens is compensated using an elastic member, thereby providing a constant resolution without deteriorating the resolution.

1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

2 is a block diagram of a camera module according to various embodiments of the present disclosure.

3A is a diagram illustrating an example configuration of a camera module according to various embodiments of the present disclosure.

3B is a schematic exploded view of the camera module illustrated in FIG. 3A when viewed from a side (eg, P1).

4A is a diagram schematically illustrating a configuration of another example of a camera module according to various embodiments of the present disclosure.

FIG. 4B is a schematic exploded view of the camera module illustrated in FIG. 4A when viewed from a side (eg, P1).

5A is a front perspective view of an electronic device according to various embodiments of the present disclosure.

5B is a perspective view of the rear side of the electronic device of FIG. 5A.

6 is an exploded perspective view of the electronic device of FIG. 5A.

1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments. Referring to FIG. 1, in a network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (for example, a short-range wireless communication network), or a second network 199 It is possible to communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, and a sensor module ( 176, interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197 ) Can be included. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).

The processor 120, for example, executes software (eg, a program 140) to implement at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and can perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 120 may store commands or data received from other components (eg, the sensor module 176 or the communication module 190) to the volatile memory 132 The command or data stored in the volatile memory 132 may be processed, and result data may be stored in the nonvolatile memory 134. According to an embodiment, the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and a secondary processor 123 (eg, a graphics processing unit, an image signal processor) that can be operated independently or together with the main processor 121 (eg, a central processing unit or an application processor). , A sensor hub processor, or a communication processor). Additionally or alternatively, the coprocessor 123 may be set to use lower power than the main processor 121 or to be specialized for a designated function. The secondary processor 123 may be implemented separately from the main processor 121 or as a part thereof.

The coprocessor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, an application is executed). ) While in the state, together with the main processor 121, at least one of the components of the electronic device 101 (for example, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the functions or states related to. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). have.

The memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176). The data may include, for example, software (eg, the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

The program 140 may be stored as software in the memory 130, and may include, for example, an operating system 142, middleware 144, or an application 146.

The input device 150 may receive a command or data to be used for a component of the electronic device 101 (eg, the processor 120) from an outside (eg, a user) of the electronic device 101. The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).

The sound output device 155 may output an sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display device 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display device 160 may include a touch circuitry set to sense a touch, or a sensor circuit (eg, a pressure sensor) set to measure the strength of a force generated by the touch. have.

The audio module 170 may convert sound into an electric signal or, conversely, convert an electric signal into sound. According to an embodiment, the audio module 170 acquires sound through the input device 150, the sound output device 155, or an external electronic device directly or wirelessly connected to the electronic device 101 (for example, Sound may be output through the electronic device 102 (for example, a speaker or headphones).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101, or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to an embodiment, the sensor module 176 is, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more designated protocols that may be used for the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that a user can perceive through a tactile or motor sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture a still image and a video. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, electronic device 102, electronic device 104, or server 108). It is possible to support establishment and communication through the established communication channel. The communication module 190 operates independently of the processor 120 (eg, an application processor), and may include one or more communication processors that support direct (eg, wired) communication or wireless communication. According to an embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg : A LAN (local area network) communication module, or a power line communication module) may be included. Among these communication modules, a corresponding communication module is a first network 198 (for example, a short-range communication network such as Bluetooth, WiFi direct or IrDA (infrared data association)) or a second network 199 (for example, a cellular network, the Internet, or It can communicate with external electronic devices through a computer network (for example, a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip), or may be implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 in a communication network such as the first network 198 or the second network 199. The electronic device 101 can be checked and authenticated.

The antenna module 197 may transmit a signal or power to the outside (eg, an external electronic device) or receive from the outside. According to an embodiment, the antenna module 197 may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is, for example, provided by the communication module 190 from the plurality of antennas. Can be chosen. The signal or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, other components (eg, RFIC) other than the radiator may be additionally formed as part of the antenna module 197.

At least some of the components are connected to each other through a communication method (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI))) between peripheral devices and signals ( E.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 and 104 may be a device of the same or different type as the electronic device 101. According to an embodiment, all or part of the operations executed by the electronic device 101 may be executed by one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device 101 does not execute the function or service by itself. In addition or in addition, it is possible to request one or more external electronic devices to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the execution result to the electronic device 101. The electronic device 101 may process the result as it is or additionally and provide it as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, or client-server computing technology Can be used.

2 is a block diagram 200 illustrating a camera module 180 according to various embodiments.

Referring to FIG. 2, the camera module 180 is a lens assembly 210, a flash 220, an image sensor 230, an image stabilizer 240, a memory 250 (eg, a buffer memory), or an image signal processor. It may include 260.

The lens assembly 210 may collect light emitted from a subject to be imaged. The lens assembly 210 may include one or more lenses. According to an embodiment, the camera module 180 may include a plurality of lens assemblies 210. In this case, the camera module 180 may form, for example, a dual camera, a 360 degree camera, or a spherical camera. Some of the plurality of lens assemblies 210 have the same lens properties (eg, angle of view, focal length, auto focus, f number, or optical zoom), or at least one lens assembly may be a different lens assembly It may have one or more lens properties different from the lens properties of. The lens assembly 210 may include, for example, a wide-angle lens or a telephoto lens.

The flash 220 may emit light used to enhance light emitted or reflected from a subject. According to an embodiment, the flash 220 may include one or more light emitting diodes (eg, red-green-blue (RGB) LED, white LED, infrared LED, or ultraviolet LED), or a xenon lamp.

The image sensor 230 may acquire an image corresponding to the subject by converting light emitted or reflected from the subject and transmitted through the lens assembly 210 into an electrical signal. According to an embodiment, the image sensor 230 is one image sensor selected from image sensors having different properties, such as an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor, and the same It may include a plurality of image sensors having attributes, or a plurality of image sensors having different attributes. Each image sensor included in the image sensor 230 may be implemented using, for example, a charged coupled device (CCD) sensor or a complementary metal oxide semiconductor (CMOS) sensor.

The image stabilizer 240 may move at least one lens or image sensor 230 included in the lens assembly 210 in a specific direction in response to the movement of the camera module 180 or the electronic device 101 including the same. The operating characteristics of the image sensor 230 may be controlled (eg, read-out timing, etc.) may be controlled. This may compensate for at least some of the negative effects of the motion on the captured image. According to an embodiment, the image stabilizer 240 uses a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 180, and the camera module 180 or the electronic device ( 101) movement can be detected. According to an embodiment, the image stabilizer 240 may be implemented as, for example, an optical image stabilizer.

The memory 250 may temporarily store at least a part of the image acquired through the image sensor 230 for the next image processing operation. For example, when image acquisition is delayed according to the shutter, or when a plurality of images are acquired at high speed, the acquired original image (eg, Bayer-patterned image or high resolution image) is stored in the memory 250 , A copy image corresponding thereto (eg, a low resolution image) may be previewed through the display device 160. Thereafter, when the specified condition is satisfied (eg, user input or system command), at least a part of the original image stored in the memory 250 may be acquired and processed by, for example, the image signal processor 260. According to an embodiment, the memory 250 may be configured as at least a part of the memory 130 or as a separate memory operated independently from the memory 130.

The image signal processor 260 may perform one or more image processing on an image acquired through the image sensor 230 or an image stored in the memory 250. The one or more image processes may be, for example, depth map generation, 3D modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g. noise reduction, resolution adjustment, brightness adjustment, blurring ( blurring), sharpening, or softening. Additionally or alternatively, the image signal processor 260 controls at least one of the components included in the camera module 180 (eg, the image sensor 230) (eg, exposure time control, or readout timing control). ) Can be performed. The image processed by the image signal processor 260 is stored again in the memory 250 for further processing, or external components of the camera module 180 (for example, the memory 130, the display device 160, and the electronic device ( 102), the electronic device 104, or the server 108. According to an embodiment, the image signal processor 260 may be configured as at least a part of the processor 120 or may be configured as a separate processor operated independently of the processor 120. When the image signal processor 260 is configured as a processor separate from the processor 120, at least one image processed by the image signal processor 260 is displayed as it is or after additional image processing is performed by the processor 120. It may be displayed through device 160.

According to an embodiment, the electronic device 101 may include a plurality of camera modules 180 each having different attributes or functions. In this case, for example, at least one of the plurality of camera modules 180 may be a wide-angle camera, and at least the other may be a telephoto camera. Similarly, at least one of the plurality of camera modules 180 may be a front camera, and at least one of the camera modules 180 may be a rear camera.

The term "module" used in this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic blocks, parts, or circuits. The module may be an integrally configured component or a minimum unit of the component or a part thereof that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (for example, the program 140) including them. For example, the processor (eg, the processor 120) of the device (eg, the electronic device 101) may call and execute at least one command among one or more commands stored from a storage medium. This makes it possible for the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here,'non-transient' only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic wave), and this term refers to the case where data is semi-permanently stored in the storage medium. It does not distinguish between temporary storage cases.

According to an embodiment, a method according to various embodiments disclosed in the present document may be provided by being included in a computer program product. Computer program products can be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store ^TM ) or two user devices ( It can be distributed (e.g., downloaded or uploaded) directly between, e.g. smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a storage medium that can be read by a device such as a server of a manufacturer, a server of an application store, or a memory of a relay server.

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular number or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar to that performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are sequentially, parallel, repeatedly, or heuristically executed, or one or more of the above operations are executed in a different order or omitted. Or one or more other actions may be added.

3A is a diagram illustrating an example configuration of a camera module according to various embodiments of the present disclosure. 3B is a schematic exploded view of the camera module illustrated in FIG. 3A when viewed from a side (eg, P1).

3A and 3B, a camera module 300 according to various embodiments of the present invention includes a printed circuit board 310, an image sensor 320, an elastic member 330, a filter 340, and a lens assembly. 350, a holder 360 and/or a protective member 370 may be included.

According to various embodiments, the camera module 300 is, for example, embedded in the front and/or rear of the electronic device 101 of FIG. 1, and is an object on the front and/or rear of the electronic device 101. You can obtain an image for. The camera module 300 may include, for example, the camera module 180 of FIGS. 1 and 2.

According to an embodiment, the printed circuit board 310 may be electrically connected to the image sensor 320 (eg, the image sensor 230 of FIG. 2 ). The printed circuit board 310 may be provided to process an image signal output from the image sensor 320 as a digital signal.

According to various embodiments, the printed circuit board 310 includes various electronic components 315 required for driving and operating the camera module 300 (eg, the image stabilizer 240, the memory 250, and the image An IC chip and/or a capacitor such as the signal processor 260) may be mounted on one surface. For example, the electronic component 315 may be mounted around the edge of the printed circuit board 310. The printed circuit board 310 may include at least one of a printed circuit board (PCB), a flexible printed circuit board (FPCB), and a rigid flexible printed circuit board (RFPCB). According to various embodiments, the printed circuit board 310 may include a connector 313 extending from one side to a predetermined length. The connector 313 may be electrically connected to the printed circuit board 310.

According to an embodiment, the image sensor 320 may include the image sensor 230 of FIG. 2. The image sensor 320 may detect object (subject) information on the front side and/or the rear side of the electronic device 101 and convert it into an electrical image signal. The image sensor 320 may be disposed on one surface (eg, an upper surface) of the printed circuit board 310. For example, the image sensor 320 may be disposed in a first area (eg, near the center) of the printed circuit board 310. The image sensor 320 may be electrically connected to the printed circuit board 310 by any one of wire bonding, flip chip bonding, or ultrasonic bonding. The image sensor 320 may convert light incident through the lens 355 provided in the lens assembly 350 into an electrical signal.

According to various embodiments, the image sensor 320 may include a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS). A cavity (not shown) may be formed between the image sensor 320 and the lens 355 to allow light to travel. The image sensor 320 may be driven, for example, under the control of the image signal processor 260 of FIG. 2.

According to an embodiment, the elastic member 330 may be disposed on one surface (eg, upper portion) of the printed circuit board 310. The elastic member 330 may be disposed surrounding the image sensor 320. The elastic member 330 may be disposed in the second area (eg, around the edge) of the printed circuit board 310 so as not to overlap with the electronic component 315. The elastic member 330 may expand or contract in thickness (or length) according to a temperature change in an external environment. The elastic member 330 may compensate for the thickness (or length) of the lens 355. The thickness (or length) of the elastic member 330 may be changed to correspond to the thickness (or length) of the lens 355. When the thickness of the lens 355 changes according to the temperature change of the external environment, the thickness of the elastic member 330 may also change correspondingly. According to an embodiment, the thickness of the elastic member 330 may also be changed according to the thickness of the lens 355. According to various embodiments, the lens 355 may have a thickness of about 1 mm. The lens 355 may be made of a polymer plastic. The thickness of the lens 355 may be changed as the temperature of the external environment decreases. For example, the lens 355 may have a coefficient of thermal expansion of about 100 Х 10 ^-6 m/m°C. When the thickness of the lens 355 is about 1 mm, when the temperature of the external environment decreases to about -1° C., the thickness of the lens 355 may change by about 0.1 μm. In addition, when the temperature of the external environment decreases to about -35°C, the thickness of the lens 355 may change by about 3.5 μm.

According to various embodiments, the elastic member 330 may be configured as a square-shaped bracket. The elastic member 330 may be made of a material having a high coefficient of thermal expansion. The elastic member 330 may include at least one of polyisoprene, polypropylene, or polyethylene. Polyisoprene may have a coefficient of thermal expansion of about 190 to 220 Х 10 ^-6 m/m°C. Polypropylene may have a coefficient of thermal expansion of about 145 to 180 Х 10 ^-6 m/m°C. Polyethylene may have a coefficient of thermal expansion of about 106 to 198 Х 10 ^-6 m/m°C.

According to various embodiments, when the lens 355 has a thickness of about 1 mm, the elastic member 330 may have a thickness of about 3 mm. The elastic member 330 may be formed of polyisoprene having a coefficient of thermal expansion of about 220 Х 10 ^-6 m/m°C. The thickness of the lens 355 may be changed as the temperature of the external environment decreases. For example, when the thickness of the lens 355 is about 1 mm, when the temperature of the external environment decreases to about -1° C., the thickness of the lens 355 may change by about 0.22 μm. In addition, when the temperature of the external environment decreases to about -35°C, the thickness of the lens 355 may change by about 7.7 μm (about 0.22 μm x 35). In this case, when the thickness of the elastic member 330 is 3 mm, and the temperature of the external environment is reduced to about -35°C, the thickness of the elastic member 330 is about 23.1 μm (about 7.7 μm x 3). I can.

According to various embodiments, the elastic member 330 may be mounted on the printed circuit board 310 through a surface mount device (SMD) or may be adhered to the printed circuit board 310 through an adhesive (eg, thermosetting epoxy). The elastic member 330 may support at least a portion of the upper portion of the printed circuit board 310. When the elastic member 330 is mounted on the printed circuit board 310, the structural rigidity of the printed circuit board 310 is reinforced to prevent the printed circuit board 310 from being warped. According to various embodiments, the elastic member 330 may be made of a material having a strong resistance against external force. For example, the elastic member 330 may include a metal frame made of metal (eg, stainless steel, aluminum, copper, etc.).

According to an embodiment, the filter 340 may be disposed above the elastic member 330 and the image sensor 320. The filter 340 may be disposed between the image sensor 320 and the lens 355. Filter 340 may include an infrared (infrared ray) filter. The filter 340 may block a part of light incident through the lens 355 of the camera module 300. The filter 340 may be a filter that blocks infrared rays. The filter 340 may be an infrared transmission filter that transmits only infrared rays. When the filter 340 is an infrared transmission filter, it may be used to recognize a user's iris.

According to an embodiment, the lens assembly 350 may include the lens assembly 210 of FIG. 2. The lens assembly 350 may collect light emitted from a subject to be imaged. The lens assembly 350 may be configured in a cylindrical shape. The lens assembly 350 may include a lens 355. The lens assembly 350 may be accommodated on the holder 360. According to an embodiment, when the plurality of lenses 355 are vertically disposed in the lens assembly 350, a plurality of elastic members 330 may be used or the thickness of the elastic members 330 may be increased.

According to an embodiment, the holder 360 may accommodate the lens assembly 350 thereon. The holder 360 may accommodate the electronic component 315, the image sensor 320, the elastic member 330, and the filter 340 disposed on the printed circuit board 310 below. For example, the upper part of the holder 360 may be configured in a circular shape, and the lower part may be configured in a square shape. The holder 360 may include a housing structure.

According to various embodiments, the holder 360 may include the flash 220, the image stabilizer 240, and the image signal processor 260 shown in FIG. 2 therein. The holder 360 may further include a digital signal processor (DSP) therein.

According to an embodiment, the protection member 370 may be disposed on the lens assembly 350. The protection member 370 may have a circular shape. The protection member 370 may absorb a physical shock generated outside the camera module 300. The protection member 370 may prevent foreign matter from penetrating through the lens 355. The protection member 370 may be made of an elastic rubber material. The protection member 370 may include a PORON tape.

In the above-described camera module 300, as the temperature of the external environment is lowered to below zero, the thickness of the lens 355 decreases, and accordingly, the focal length of the lens 355 and the image sensor 320 may be shortened. In this case, as the thickness of the elastic member 330 also decreases, the focal length of the lens 355 and the image sensor 320 becomes close, and the focal length may be compensated.

The camera module 300 according to various embodiments of the present invention includes a printed circuit board 310, an image sensor 320 disposed in a first area of one surface of the printed circuit board, and surrounding the image sensor An elastic member 330 disposed in two areas, a filter 340 disposed on at least a portion of the image sensor and the elastic member, a holder 360 receiving the image sensor, the elastic member, and the filter under the And a lens assembly 350 accommodated in the upper portion of the holder and including a lens 355, and in response to a change in thickness of the lens 355 according to a temperature of the external environment, the elastic member The thickness can also be configured to vary.

According to various embodiments, when the thickness of the lens 355 decreases as the temperature of the external environment decreases, the thickness of the elastic member 330 also decreases, so that the lens 355 and the The focal length of the image sensor 320 may be compensated.

According to various embodiments, the elastic member 330 may be made of a material having a high coefficient of thermal expansion.

According to various embodiments, the elastic member 330 may include at least one of polyisoprene, polypropylene, or polyethylene.

According to various embodiments, the polyisoprene has a thermal expansion coefficient of 190 to 220 Х 10 ^-6 m/m°C, and the polypropylene has a thermal expansion of 145 to 180 Х 10 ^-6 m/m°C. Has a coefficient, the polyethylene (polyethylene) may have a coefficient of thermal expansion of 106 ~ 198 Х 10 ^-6 m / m ℃.

According to various embodiments, the lens 355 may be made of a polymer plastic.

According to various embodiments, a protection member 370 may be disposed on the lens assembly 350.

4A is a diagram schematically illustrating a configuration of another example of a camera module according to various embodiments of the present disclosure. 4B is a schematic exploded view of the camera module illustrated in FIG. 4A when viewed from a side (eg, P2).

In the description of FIGS. 4A and 4B, redundant descriptions may be omitted for the same configurations and functions as those of the embodiments of FIGS. 3A and 3B described above.

4A and 4B, the camera module 400 according to various embodiments of the present invention includes a printed circuit board 410, an elastic member 430, a lens assembly 450, and/or a holder 460. Can include.

According to various embodiments, the camera module 400 is, for example, embedded in the front and/or rear of the electronic device 101 of FIG. 1, and is an object on the front and/or rear of the electronic device 101. You can obtain an image for. The camera module 400 may include, for example, the camera module 180 of FIGS. 1 and 2.

According to an embodiment, the printed circuit board 410 may include the same components as the printed circuit board 310 of FIGS. 3A and 3B. For example, the printed circuit board 410 is the same as that provided in the printed circuit board 310 of FIG. 3A, the image sensor 320 and the electronic component 315 (eg, the image stabilizer 240 of FIG. 250 and an IC chip and/or capacitor such as the image signal processor 260). According to various embodiments, the printed circuit board 410 may include a connector 413 extending from one side to a predetermined length. The connector 413 may be electrically connected to the printed circuit board 410.

According to an embodiment, the elastic member 430 may include the elastic member 330 of FIGS. 3A and 3B. The elastic member 430 may be disposed between the lens assembly 450 and the holder 460. The elastic member 430 may expand or contract in thickness (or length) according to a temperature change in an external environment. The elastic member 430 may compensate for the thickness (or length) of the lens 455 provided in the lens assembly 450. The thickness (or length) of the elastic member 430 may be changed to correspond to the thickness (or length) of the lens 455. When the thickness of the lens 455 changes according to the temperature change of the external environment, the thickness of the elastic member 430 may also change correspondingly. According to various embodiments, an elastic member 430 made of a material having the same coefficient of thermal expansion as the elastic member 330 described in FIGS. 3A and 3B may be disposed on the printed circuit board 410.

According to various embodiments, the elastic member 430 may be configured as a bracket having a circular shape. The elastic member 430 may be made of a material having a high coefficient of thermal expansion. The elastic member 430 may include at least one of polyisoprene, polypropylene, or polyethylene. Polyisoprene may have a coefficient of thermal expansion of about 190 to 220 Х 10 ^-6 m/m°C. Polypropylene may have a coefficient of thermal expansion of about 145 to 180 Х 10 ^-6 m/m°C. Polyethylene may have a coefficient of thermal expansion of about 106 to 198 Х 10 ^-6 m/m°C.

According to an embodiment, the lens assembly 450 may include the lens assembly 210 of FIG. 2 or the lens assembly 350 of FIG. 3A. The lens assembly 450 may include a lens 455. According to various embodiments, the protection member 370 of FIG. 3A may be disposed on the lens assembly 450. The protection member 370 may include a PORON tape.

According to an embodiment, the holder 460 may include the holder 360 of FIGS. 3A and 3B. An elastic member 430 may be disposed on the holder 460. The holder 460 may accommodate the electronic component 315 of FIG. 3A, the image sensor 320, and the filter 340 disposed on the printed circuit board 410, for example.

In the above-described camera module 400, as the temperature of the external environment is lowered to below zero, the thickness of the lens 455 decreases, and accordingly, the focal length of the lens 455 may be shortened. In this case, as the thickness of the elastic member 430 disposed between the lens assembly 450 and the holder 460 also decreases, the focal length of the lens 455 and the image sensor 320 becomes close, and the focal length Can be compensated.

The camera module 400 according to various embodiments of the present invention includes a printed circuit board 410, an image sensor disposed on one surface of the printed circuit board (for example, the image sensor 320 of FIG. 3A), and the image sensor. A filter disposed on at least a portion (for example, the filter 340 of FIG. 3A ), a holder 460 receiving the image sensor and the filter under the filter, an elastic member 430 disposed above the holder, and the A thickness of the elastic member including a lens assembly 450 disposed on the elastic member and including a lens 455, and corresponding to a change in the thickness of the lens 455 according to the temperature of the external environment Can also be configured to change.

According to various embodiments, when the thickness of the lens 455 decreases as the temperature of the external environment decreases, the thickness of the elastic member 430 also decreases, so that the lens 455 and the The focal length of the image sensor 320 may be compensated.

According to various embodiments, the elastic member 430 may be made of a material having a high coefficient of thermal expansion.

According to various embodiments, the elastic member 430 may include at least one of polyisoprene, polypropylene, or polyethylene.

According to various embodiments, the lens 455 may be made of polymer plastic.

According to various embodiments, a protective member may be disposed on the lens assembly 450.

5A is a front perspective view of an electronic device according to various embodiments of the present disclosure. 5B is a perspective view of the rear side of the electronic device of FIG. 5A. 6 is an exploded perspective view of the electronic device of FIG. 5A.

5A and 5B, the electronic device 500 (eg, the electronic device 101 of FIG. 1) according to an embodiment includes a first surface (or front surface) 510A, a second surface (or rear surface). It may include a housing 510 including 510B and a side surface 510C (eg, a side member) surrounding a space between the first and second surfaces 510A and 510B. In another embodiment (not shown), the housing may refer to a structure forming some of the first surface 510A, the second surface 510B, and the side surface 510C of FIG. 5A. According to one embodiment, the first surface 510A is formed by a front plate 502 (eg, a first plate) (eg, a glass plate including various coating layers or a polymer plate), at least partially partially transparent. Can be. The second surface 510B may be formed by a substantially opaque rear plate 511 (eg, a second plate). The back plate 511 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. Can be. The side surface 510C is coupled to the front plate 502 and the rear plate 511, and may be formed by a side bezel structure (or “side member”) 518 including metal and/or polymer. In some embodiments, the back plate 511 and the side bezel structure 518 are integrally formed and may include the same material (eg, a metal material such as aluminum).

According to an embodiment, the electronic device 500 includes a display 501, an audio module 503, 507, 514, a sensor module 504, 519, and a camera module 505, 512, 513 (e.g., FIG. 3A). And at least one of the camera module 300 of FIG. 3B or the camera module 400 of FIGS. 4A and 4B), key input devices 515, 516, 517, indicator 506, and connector holes 508 and 509. It may include more than one. In some embodiments, the electronic device 500 may omit at least one of the components (eg, the key input devices 515, 516, 517, or the indicator 506), or may additionally include other components. .

The display 501 may be exposed through a substantial portion of the front plate 502, for example. The display 501 may be combined with or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen.

The audio modules 503, 507, and 514 may include microphone holes 503 and speaker holes 507 and 514. In the microphone hole 503, a microphone for acquiring external sound may be disposed inside, and in some embodiments, a plurality of microphones may be disposed to detect the direction of sound. The speaker holes 507 and 514 may include an external speaker hole 507 and a call receiver hole 514. In some embodiments, the speaker holes 507 and 514 and the microphone hole 503 may be implemented as one hole, or a speaker may be included without the speaker holes 507 and 514 (eg, piezo speakers).

The sensor modules 504 and 519 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 500 or an external environmental state. The sensor modules 504 and 519 are, for example, a first sensor module 504 (for example, a proximity sensor) and/or a second sensor module (not shown) disposed on the first surface 510A of the housing 510. ) (Eg, a fingerprint sensor), and/or a third sensor module 519 (eg, an HRM sensor) disposed on the second surface 510B of the housing 510. The fingerprint sensor may be disposed on the second surface 510B as well as the first surface 510A of the housing 510 (for example, the home key button 515 ). The electronic device 500 is a sensor module not shown, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, At least one of a humidity sensor or an illuminance sensor 504 may be further included.

The camera module 505, 512, 513 (for example, the camera module 300 of FIGS. 3A and 3B or the camera module 400 of FIGS. 4A and 4B) is a first surface 510A of the electronic device 500. A first camera device 505 disposed on and a second camera device 512 disposed on the second surface 510B, and/or a flash 513 may be included. The camera modules 505 and 512 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 513 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 500.

The key input devices 515, 516, 517 include a home key button 515 disposed on the first surface 510A of the housing 510, a touch pad 516 disposed around the home key button 515, and / Or may include a side key button 517 disposed on the side (510C) of the housing 510. In another embodiment, the electronic device 500 may not include some or all of the aforementioned key input devices 515, 516, 517, and the key input devices 515, 516, 517 that are not included may be displayed. It may be implemented in other forms such as a soft key on the 501.

The indicator 506 may be disposed, for example, on the first surface 510A of the housing 510. The indicator 506 may provide state information of the electronic device 500 in the form of light, for example, and may include an LED.

The connector holes 508 and 509 may accommodate a connector (eg, a USB connector) for transmitting and receiving power and/or data with an external electronic device (eg, the electronic devices 102 and 104 of FIG. 1 ). A first connector hole 508 and/or a second connector hole (eg, an earphone jack) 509 capable of accommodating a connector for transmitting/receiving an audio signal with an external electronic device may be included.

Referring to FIG. 6, the electronic device 600 (eg, the electronic device 101 of FIG. 1) includes a side bezel structure 610, a first support member 611 (eg, a bracket), and a front plate 620. (Example: first plate), display 630, printed circuit board 640, battery 650, second support member 660 (eg, rear case), antenna 670, and rear plate 680 (Eg, a second plate) may be included. In some embodiments, the electronic device 600 may omit at least one of the components (for example, the first support member 611 or the second support member 660), or may additionally include other components. . At least one of the components of the electronic device 600 may be the same as or similar to at least one of the components of the electronic device 500 of FIG. 5A or 5B, and redundant descriptions will be omitted below.

The first support member 611 may be disposed inside the electronic device 600 to be connected to the side bezel structure 610 or may be integrally formed with the side bezel structure 610. The first support member 611 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. In the first support member 611, the display 630 may be coupled to one surface and the printed circuit board 640 may be coupled to the other surface. The printed circuit board 640 may be equipped with a processor (eg, the processor 120 of FIG. 1), a memory (the memory 130 of FIG. 1), and/or an interface (eg, the interface 177 of FIG. 1 ). The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.

The memory may include, for example, a volatile memory (eg, the volatile memory 132 of FIG. 1) or a nonvolatile memory (eg, the nonvolatile memory 134 of FIG. 1 ).

The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 600 to an external electronic device, for example, and may include a USB connector, an SD card/MMC connector, or an audio connector.

The battery 650 (eg, the battery 189 in FIG. 1) is a device for supplying power to at least one component of the electronic device 600, for example, a non-rechargeable primary battery, or a rechargeable 2 It may include a rechargeable battery or a fuel cell. At least a portion of the battery 650 may be disposed substantially on the same plane as the printed circuit board 640, for example. The battery 650 may be integrally disposed within the electronic device 600 or may be disposed detachably from the electronic device 600. The antenna 670 may be disposed between the rear plate 680 and the battery 650. The antenna 670 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 670 may perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In another embodiment, an antenna structure may be formed by a side bezel structure 610 and/or a part of the first support member 611 or a combination thereof.

An electronic device (eg, the electronic device 500 of FIGS. 5A and 5B or the electronic device 600 of FIG. 6) according to various embodiments of the present disclosure includes a first plate (eg, the front plate 502 of FIG. 5A ). Or the front plate 620 of FIG. 6), a second plate facing in a direction opposite to the first plate (for example, the rear plate 511 of FIG. 5B or the rear plate 680 of FIG. 6), and the first plate And a housing (e.g., housing 510 in FIG. 5A) including a side member (e.g., a side surface (510C) in FIG. 5A) surrounding the space between the second plate, and near a portion of the side member. A camera module (eg, the camera module 300 of FIGS. 3A and 3B or the camera module 400 of FIGS. 4A and 4B) disposed in the space, and the camera module includes a printed circuit board (eg, FIG. 3A ). And the printed circuit board 310 of FIG. 3B, an image sensor disposed in a first area of one surface of the printed circuit board (eg, the image sensor 320 of FIGS. 3A and 3B ), and surrounding the image sensor The elastic member (for example, the elastic member 330 of FIGS. 3A and 3B) disposed in the second region of (340)), a holder for receiving the image sensor, the elastic member, and the filter at a lower portion (for example, the holder 360 in FIGS. 3A and 3B), and a lens (for example, FIG. 3A The elastic member includes a lens assembly (for example, the lens assembly 350 of FIGS. 3A and 3B) including a lens 355 of, and corresponding to a change in the thickness of the lens according to the temperature of the external environment, The thickness of the can also be configured to change.

According to various embodiments, a camera module (eg, the camera module 300 of FIGS. 3A and 3B) of the electronic device (eg, the electronic device 500 of FIGS. 5A and 5B or the electronic device 600 of FIG. 6) Alternatively, when the thickness of the lens (eg, the lens 355 of FIG. 3A) decreases as the temperature of the external environment decreases, the elastic member (eg, FIG. 3A and the camera module 400) of FIGS. 4A and 4B Since the thickness of the elastic member 330 of FIG. 3B is also reduced, the focal length of the lens and the image sensor (eg, the image sensor 320 of FIGS. 3A and 3B) may be compensated.

According to various embodiments, the elastic member (eg, the elastic member 330 of FIGS. 3A and 3B) may be made of a material having a high coefficient of thermal expansion.

According to various embodiments, the elastic member (eg, the elastic member 330 of FIGS. 3A and 3B) may include at least one of polyisoprene, polypropylene, or polyethylene. .

According to various embodiments, the polyisoprene has a thermal expansion coefficient of 190 to 220 Х 10 ^-6 m/m°C, and the polypropylene has a thermal expansion of 145 to 180 Х 10 ^-6 m/m°C. Has a coefficient, the polyethylene (polyethylene) may have a coefficient of thermal expansion of 106 ~ 198 Х 10 ^-6 m / m ℃.

According to various embodiments, the lens (eg, the lens 355 of FIG. 3A) may be made of a polymer plastic.

According to various embodiments, a protective member may be disposed on the lens assembly (eg, the lens assembly 350 of FIGS. 3A and 3B ).

In the above, the present invention has been described according to various embodiments of the present invention, but changes and modifications within the scope not departing from the technical spirit of the present invention by those of ordinary skill in the art belong to the present invention. Of course.

Claims (15)

1. In the camera module,

   Printed circuit board;

   An image sensor disposed in a first area of one surface of the printed circuit board;

   An elastic member surrounding the image sensor and disposed in a second area of the one surface;

   A filter disposed on at least a portion of the image sensor and the elastic member;

   A holder accommodating the image sensor, the elastic member, and the filter below; And

   It is accommodated on the upper portion of the holder and includes a lens assembly including a lens,

   A camera module in which the thickness of the elastic member also changes in response to the change in the thickness of the lens according to the temperature of the external environment.
2. The method of claim 1,

   When the thickness of the lens decreases as the temperature of the external environment decreases, the thickness of the elastic member decreases, so that the focal length of the lens and the image sensor is compensated.
3. The method of claim 1,

   The elastic member is a camera module made of a material having a high coefficient of thermal expansion.
4. The method of claim 1,

   The elastic member is a camera module including at least one of polyisoprene, polypropylene, or polyethylene.
5. The method of claim 5,

   The polyisoprene has a coefficient of thermal expansion of 190 to 220 Х 10 ^-6 m/m°C, the polypropylene has a coefficient of thermal expansion of 145 to 180 Х 10 ^-6 m/m°C, and the polyethylene (polyethylene) is a camera module that has a coefficient of thermal expansion of 106~198 Х 10 ^-6 m/m℃.
6. The method of claim 1,

   The lens is a camera module made of polymer plastic.
7. The method of claim 1,

   Camera module further comprising a protection member disposed on the upper portion of the lens assembly.
8. In the camera module,

   Printed circuit board;

   An image sensor disposed on one surface of the printed circuit board;

   A filter disposed on at least a portion of the image sensor;

   A holder accommodating the image sensor and the filter below;

   An elastic member disposed on the holder; And

   It is disposed on the top of the elastic member and includes a lens assembly including a lens,

   A camera module in which the thickness of the elastic member also changes in response to the change in the thickness of the lens according to the temperature of the external environment.
9. The method of claim 8,

   When the thickness of the lens decreases as the temperature of the external environment decreases, the thickness of the elastic member decreases, so that the focal length of the lens and the image sensor is compensated.
10. The method of claim 8,

    The elastic member is a camera module made of a material having a high coefficient of thermal expansion.
11. The method of claim 8,

    The elastic member is a camera module including at least one of polyisoprene, polypropylene, or polyethylene.
12. The method of claim 8,

    The lens is a camera module made of polymer plastic.
13. The method of claim 8,

    Camera module further comprising a protection member disposed on the upper portion of the lens assembly.
14. In the electronic device,

    A housing including a first plate, a second plate facing in a direction opposite to the first plate, and a side member surrounding a space between the first plate and the second plate; And

    A camera module disposed in the space near a portion of the side member,

    The camera module,

    Printed circuit board;

    An image sensor disposed in a first area of one surface of the printed circuit board;

    An elastic member surrounding the image sensor and disposed in a second area of the one surface;

    A filter disposed on at least a portion of the image sensor and the elastic member;

    A holder accommodating the image sensor, the elastic member, and the filter below;

    It is accommodated on the upper portion of the holder and includes a lens assembly including a lens,

    An electronic device in which the thickness of the elastic member also changes in response to a change in the thickness of the lens according to the temperature of the external environment.
15. The method of claim 14,

    When the thickness of the lens decreases as the temperature of the external environment decreases, the thickness of the elastic member decreases, so that the focal length of the lens and the image sensor is compensated.

Images