WO2020220400A1 - 一种显示面板及其制作方法、以及显示装置 - Google Patents

一种显示面板及其制作方法、以及显示装置 Download PDF

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Publication number
WO2020220400A1
WO2020220400A1 PCT/CN2019/086944 CN2019086944W WO2020220400A1 WO 2020220400 A1 WO2020220400 A1 WO 2020220400A1 CN 2019086944 W CN2019086944 W CN 2019086944W WO 2020220400 A1 WO2020220400 A1 WO 2020220400A1
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Prior art keywords
layer
light emitting
organic light
emitting device
pixel separation
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Ceased
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PCT/CN2019/086944
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English (en)
French (fr)
Inventor
白亚梅
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/494,405 priority Critical patent/US20210336179A1/en
Publication of WO2020220400A1 publication Critical patent/WO2020220400A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/15—Hole transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/17—Carrier injection layers
    • H10K50/171—Electron injection layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/18—Carrier blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/16—Electron transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/17—Carrier injection layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • This application relates to the field of display technology, in particular to a display panel, a manufacturing method thereof, and a display device.
  • OLEDs Organic electroluminescent devices
  • the present application provides a display panel, a manufacturing method thereof, and a display device, so as to effectively avoid the charge crosstalk light-emitting effect in the light-emitting device, thereby improving the light-emitting efficiency of the light-emitting device and extending the service life.
  • the embodiments of the present application provide a display panel, the display panel includes a substrate, and a pixel separation layer and an organic light emitting device layer sequentially disposed on the substrate; wherein the pixel separation layer includes a spacer and a plurality of spacers.
  • the adjacent opening areas are separated by a separator, the organic light emitting device layer includes a plurality of organic light emitting devices, the organic light emitting device includes a hole injection layer, and the hole injection layers of adjacent organic light emitting devices are spaced apart.
  • the organic light emitting device further includes a hole transport layer, the hole transport layer is located on the pixel separation layer provided with the hole injection layer, and the hole transport layers of adjacent organic light emitting devices are arranged at intervals.
  • the organic light emitting device further includes a light emitting layer, the light emitting layer is located on the pixel separation layer provided with the hole injection layer, and the light emitting layers of adjacent organic light emitting devices are arranged at intervals.
  • the organic light emitting device further includes an electron transport layer, the electron transport layer is located on the pixel separation layer provided with the hole injection layer, and the electron transport layers of adjacent organic light emitting devices are arranged at intervals.
  • the organic light emitting device further includes an electron blocking layer, a hole blocking layer, and an electron injection layer that are sequentially away from the hole injection layer, and at least one of the electron blocking layer, hole blocking layer, and electron injection layer of the adjacent organic light emitting device Interval settings.
  • the organic light emitting device further includes an anode, which is located in the opening area and between the substrate and the hole injection layer.
  • an embodiment of the present application also provides a manufacturing method of a display panel.
  • the manufacturing method of the display panel includes: providing a substrate; and forming a pixel separation layer on the substrate.
  • the pixel separation layer includes a separator and a plurality of spaced apart.
  • the opening area of the adjacent opening area is separated by a separator; an organic light-emitting device layer is formed on a substrate formed with a pixel separation layer, the organic light-emitting device layer includes a plurality of organic light-emitting devices, and the organic light-emitting device includes a hole injection layer, And the hole injection layers of adjacent organic light emitting devices are arranged at intervals.
  • the step of forming an organic light emitting device layer on a substrate with a pixel separation layer specifically includes: using a first fine mask, depositing a hole injection layer on the substrate on which the pixel separation layer is formed; On the pixel separation layer of the injection layer, a hole transport layer, a light emitting layer, and an electron transport layer are sequentially deposited, and at least one of the hole transport layer, the light emitting layer, and the electron transport layer is made by using a second fine mask.
  • the method before the step of depositing the hole injection layer on the substrate on which the pixel separation layer is formed by using the first fine mask, the method further includes: evaporating an anode in the opening area.
  • the step of sequentially depositing a hole transport layer, a light emitting layer, and an electron transport layer on the pixel separation layer where the hole injection layer is formed specifically includes: using a second fine mask to form the hole injection layer A hole transport layer is deposited on the pixel separation layer; an open mask is used to sequentially deposit a light-emitting layer and an electron transport layer on the pixel separation layer where the hole transport layer is formed.
  • the organic light emitting device further includes an electron blocking layer, a hole blocking layer, and an electron injection layer that are sequentially away from the hole injection layer, and at least one of the electron blocking layer, hole blocking layer, and electron injection layer of the adjacent organic light emitting device Interval settings.
  • the embodiments of the present application also provide a display device, the display device includes a drive circuit and a display panel, the drive circuit is used to provide a drive voltage to the display panel, the display panel includes a substrate, and the substrate is sequentially arranged Pixel separation layer and organic light emitting device layer; wherein, the pixel separation layer includes a spacer and a plurality of spaced opening regions, adjacent opening regions are separated by the spacer, the organic light emitting device layer includes a plurality of organic light emitting devices, and organic light emitting The device includes a hole injection layer, and the hole injection layers of adjacent organic light emitting devices are arranged at intervals.
  • the organic light emitting device further includes a hole transport layer, the hole transport layer is located on the pixel separation layer provided with the hole injection layer, and the hole transport layers of adjacent organic light emitting devices are arranged at intervals.
  • the organic light emitting device further includes a light emitting layer, the light emitting layer is located on the pixel separation layer provided with the hole injection layer, and the light emitting layers of adjacent organic light emitting devices are arranged at intervals.
  • the organic light emitting device further includes an electron transport layer, the electron transport layer is located on the pixel separation layer provided with the hole injection layer, and the electron transport layers of adjacent organic light emitting devices are arranged at intervals.
  • the organic light emitting device further includes an electron blocking layer, a hole blocking layer, and an electron injection layer that are sequentially away from the hole injection layer, and at least one of the electron blocking layer, hole blocking layer, and electron injection layer of the adjacent organic light emitting device Interval settings.
  • the organic light emitting device further includes an anode, which is located in the opening area and between the substrate and the hole injection layer.
  • the beneficial effect of the present application is that, different from the prior art, the display panel provided by the present application has the hole injection layers of adjacent organic light-emitting devices spaced apart, so as to effectively avoid the charge crosstalk luminescence effect in the light-emitting devices, thereby improving the luminescence.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • FIG. 2 is another schematic structural diagram of a display panel provided by an embodiment of the present application.
  • FIG. 3 is another schematic structural diagram of a display panel provided by an embodiment of the present application.
  • FIG. 4 is a schematic flowchart of a manufacturing method of a display panel provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a display device provided by an embodiment of the present application.
  • the technical solution adopted in this application is to provide a display panel to effectively avoid the charge crosstalk light emitting effect in the light emitting device, thereby improving the light emitting efficiency of the light emitting device and prolonging the service life.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
  • the display panel 10 includes a substrate 11, and a pixel separation layer 12 and an organic light emitting device layer 13 which are sequentially arranged on the substrate 11.
  • the pixel separation layer 12 includes a partition 121 and a plurality of spaced opening regions 122.
  • the adjacent opening regions 122 are separated by the partition 121.
  • the organic light-emitting device layer 13 includes a plurality of organic light-emitting devices 131.
  • the hole injection layer 1311 is included, and the hole injection layers 1311 of adjacent organic light emitting devices 131 are spaced apart.
  • the substrate 11 may be a glass substrate or a rigid resin substrate, or may be a flexible substrate used to prepare a flexible display panel.
  • the pixel separation layer 12 can be made of organic insulating materials such as polyimide and epoxy resin, or inorganic insulating materials such as SiNx, SiOx, etc., and the spacer 121 of the pixel separation layer 12 defines a plurality of spaces on the substrate 11
  • the opening area 122 is used to arrange the organic light emitting device 131.
  • the organic light emitting device layer 13 between the two dotted lines in FIG. 1 can be used as an organic light emitting device 131.
  • the organic light emitting device 131 further includes a hole transport layer 1312, a light emitting layer 1313 and an electron transport layer 1314.
  • the hole transport layer 1312, the light emitting layer 131, and the electron transport layer 1314 are sequentially disposed on the pixel separation layer 12 where the hole injection layer 1311 is formed, and the hole transport layer 1312 and the light emitting layer 1313 of the plurality of organic light emitting devices 131
  • the electron transport layer 1314 and the electron transport layer 1314 respectively constitute a hole transport layer 1312 on the entire surface, a light emitting layer 1313 on the entire surface, and a resistance transport layer 1314 on the entire surface.
  • the hole injection layers 1311 of adjacent organic light-emitting devices 131 are arranged at intervals to prevent the organic light-emitting devices 131 from appearing in the hole injection layer 1311 of the charge crosstalk light-emitting effect.
  • the light emitting layer 1313 or the electron transport layer 1314 are arranged at intervals.
  • the hole transport layers 1312 of adjacent organic light-emitting devices 131 are arranged at intervals to prevent the organic light-emitting devices 131 from exhibiting a charge crosstalk light-emitting effect on the hole transport layer 1312.
  • the light-emitting layers 1313 of adjacent organic light-emitting devices 131 are arranged at intervals to prevent the organic light-emitting devices 131 from appearing in the light-emitting layer 1313 of charge crosstalk light emission effect.
  • the electron transport layers 1314 of adjacent organic light emitting devices 131 are arranged at intervals to prevent the organic light emitting devices 131 from exhibiting a charge crosstalk light emitting effect on the resistance transmission layer 1314.
  • the efficiency, lifetime, and viewing angle of the hole transport layer 1312, the light emitting layer 1313, and the electron transport layer 1314 can be verified to determine whether there is a charge crosstalk effect. If there is a charge crosstalk light emitting effect , The corresponding layers of adjacent organic light-emitting devices 131 are arranged at intervals to solve the problem of charge crosstalk light-emitting effects in this layer.
  • the organic light emitting device 131 may further include an electron blocking layer 1315, a hole blocking layer 1316, and an electron injection layer 1317 that are sequentially away from the hole injection layer 1311, wherein the electron blocking layer 1315 Located between the hole transport layer 1312 and the light emitting layer 1313, the hole blocking layer 1316 is located between the light emitting layer 1313 and the electron transport layers 1314, the electron injection layer 1317 covers the electron transport layer 1314, and the adjacent organic light emitting device 131 blocks the electrons At least one of the layer 1315, the hole blocking layer 1316, and the electron injection layer 1317 is arranged at intervals to prevent the organic light emitting device 131 from appearing in the electron blocking layer 1315, the hole blocking layer 1316, and the electron injection layer 1317 from the charge crosstalk light emitting effect.
  • the electron blocking layers 1315 of adjacent organic light-emitting devices 131 are arranged at intervals to prevent the organic light-emitting devices 131 from appearing in the resistance blocking layer 1315 of charge crosstalk light-emitting effect.
  • the hole blocking layers 1316 of adjacent organic light-emitting devices 131 are arranged at intervals to prevent the organic light-emitting devices 131 from appearing in the hole blocking layer 1316 of charge crosstalk light emission effect.
  • the electron injection layers 1317 of adjacent organic light emitting devices 131 are arranged at intervals to prevent the organic light emitting devices 131 from appearing in the resistance injection layer 1317 of charge crosstalk light emission.
  • the efficiency, lifetime, and viewing angle of the electron blocking layer 1315, hole blocking layer 1316, and electron injection layer 1317 can be verified to determine whether there is a charge crosstalk effect. Therefore, the corresponding layers of adjacent organic light-emitting devices 131 are arranged at intervals to solve the problem of charge crosstalk light-emitting effects in this layer.
  • the organic light emitting device 131 may include some of the above-mentioned hole injection layer 1311, hole transport layer 1312, electron blocking layer 1315, light emitting layer 1313, hole blocking layer 1316, electron transport layer 1314, and electron injection layer 1317,
  • the organic light emitting device 131 may include the hole injection layer 1311, the hole transport layer 1312, the light emitting layer 1313, and the electron transport layer 1314. Then, on this basis, the organic light emitting device 131 may also add the above electron blocking layer 1315, Hole blocking layer 1316 or electron injection layer 1317.
  • the organic light emitting device 131 further includes an anode 1318 and a cathode 1319.
  • the anode 1318 is located in the opening area 122 and between the substrate 11 and the hole injection layer 1311 to effectively improve the charge crosstalk effect in the organic light emitting device 131.
  • the cathode 1319 is located on the pixel separation layer 12 and covers the electron injection layer 1317.
  • the display panel 10 may further include a thin film transistor (not shown in the figure) and a flat layer (not shown in the figure) sequentially arranged on the substrate 11, wherein the flat layer covers the thin film transistor, and the pixel separation layer 12 covers the flat layer.
  • a thin film transistor not shown in the figure
  • a flat layer not shown in the figure
  • the hole injection layers of adjacent organic light-emitting devices are arranged at intervals to effectively avoid the charge crosstalk light-emitting effect in the light-emitting device, thereby improving the luminous efficiency and lengthening of the light-emitting device. Service life.
  • FIG. 4 is a schematic flowchart of a manufacturing method of a display panel provided by an embodiment of the present application.
  • the manufacturing method of the display panel includes the following steps:
  • the substrate may be a glass substrate or a rigid resin substrate, and may also be a flexible substrate used to prepare a flexible display panel.
  • the pixel separation layer includes a separator and a plurality of spaced opening areas, and adjacent opening areas are separated by the separator.
  • the pixel separation layer is formed on the substrate through processes such as deposition, exposure, and etching.
  • the pixel separation layer can be made of organic insulating materials such as polyimide and epoxy resin, or inorganic insulating materials such as SiNx and SiOx, and the spacer of the pixel separation layer defines a plurality of spaced openings on the substrate. The open area is used to define the formation position of the organic light emitting device.
  • the organic light emitting device layer includes a plurality of organic light emitting devices, the organic light emitting device includes a hole injection layer, and the hole injection layers of adjacent organic light emitting devices are arranged at intervals .
  • S43 may specifically include:
  • Sub-step A Using the first fine mask, a hole injection layer is deposited on the substrate on which the pixel separation layer is formed.
  • the first fine mask is aligned with the above-mentioned opening area, and then a hole injection layer is formed on the substrate with the pixel separation layer by vacuum evaporation, physical vapor deposition, chemical vapor deposition, pulsed laser deposition, etc.
  • the hole injection layers of adjacent organic light emitting devices are arranged at intervals, so as to avoid the charge crosstalk light emitting effect of the organic light emitting devices in the hole injection layer.
  • sub-step A it may also include:
  • the anode is vapor-deposited in the open area.
  • vacuum evaporation is used to fabricate anodes in the opening area, so that the anodes of adjacent organic light-emitting devices are arranged at intervals, thereby effectively improving the charge crosstalk effect existing in the organic light-emitting devices 131.
  • Sub-step B On the pixel separation layer where the hole injection layer is formed, a hole transport layer, a light emitting layer, and an electron transport layer are sequentially deposited, and at least one of the hole transport layer, the light emitting layer and the electron transport layer uses the second Fine mask production.
  • sub-step B may specifically include:
  • the hole transport layer is fabricated through the second fine mask, which can prevent the organic light-emitting device from appearing in the hole transport layer with the charge crosstalk light-emitting effect.
  • sub-step B may also specifically be:
  • a hole transport layer, an electron blocking layer, a light emitting layer, a hole blocking layer, an electron transport layer, and an electron injection layer are sequentially deposited, and the hole transport layer, the electron blocking layer, At least one of the light-emitting layer, the hole blocking layer, the electron transport layer, and the electron injection layer is made using a second fine mask.
  • sub-step B may specifically include:
  • the hole transport layer and the electron blocking layer are fabricated through the second fine mask, which can prevent the organic light emitting device from appearing in the hole transport layer and the electron blocking layer of the charge crosstalk luminescence effect.
  • first fine mask and second fine mask may be the same fine mask or different masks.
  • the hole transport layer, resistance blocking layer, light-emitting layer, hole blocking layer, electron transport layer, or electron injection layer are produced by using the second fine mask, different layers can correspond to different second fine masks.
  • the second fine mask that is, the second fine mask may specifically be a fine mask, or it may be a general term for multiple different fine masks. In specific implementation, the second fine mask may be selected according to specific conditions.
  • sub-step B it may also include:
  • a cathode is formed on the pixel separation layer, and the cathode covers the electron injection layer.
  • the organic light emitting device may specifically include the above-mentioned anode, hole injection layer, hole transport layer, electron blocking layer, light emitting layer, hole blocking layer, electron transport layer, electron injection layer and cathode.
  • the organic light-emitting device may include some of the above-mentioned hole injection layer, hole transport layer, electron blocking layer, light emitting layer, hole blocking layer and electron transport layer, for example, organic light emitting device
  • the above-mentioned hole injection layer, hole transport layer, light-emitting layer, and electron transport layer may be included, and then on this basis, the organic light-emitting device may also add the above-mentioned electron blocking layer, hole blocking layer or electron injection layer.
  • the efficiency, lifetime and viewing angle of the hole transport layer, electron blocking layer, light emitting layer, hole blocking layer, electron transport layer and electron injection layer of the organic light emitting device can be verified to determine whether there is a charge crosstalk effect. If there is a charge crosstalk light emitting effect, a fine mask is used to make the corresponding layer of the organic light emitting device to avoid the problem of the charge crosstalk light emitting effect in this layer of the organic light emitting device.
  • the manufacturing method of the display panel provided in the embodiments of the present application by arranging the hole injection layers of adjacent organic light-emitting devices at intervals, can effectively avoid the occurrence of charge crosstalk light-emitting effects in the light-emitting device, thereby improving the Luminous efficiency and extended service life.
  • FIG. 5 is a schematic structural diagram of a display device provided by an embodiment of the present application.
  • the display device 50 includes a driving circuit and the display panel 51 of any of the above embodiments, wherein the driving circuit is used to provide a driving voltage to the display panel 51.
  • the display panel 51 includes a substrate, and a pixel separation layer and an organic light-emitting device layer sequentially disposed on the substrate.
  • the pixel separation layer includes a spacer and a plurality of spaced opening regions, and adjacent opening regions are separated by the spacer.
  • the organic light emitting device layer includes a plurality of organic light emitting devices, the organic light emitting device includes a hole injection layer, and the hole injection layers of adjacent organic light emitting devices are arranged at intervals.
  • the display device in this embodiment arranges the hole injection layers of adjacent organic light-emitting devices at intervals to effectively avoid charge crosstalk light-emitting effects in the light-emitting devices, thereby improving the luminous efficiency and lengthening of the light-emitting devices. Service life.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种显示面板（10）及其制作方法、显示装置，显示面板（10）包括基板（11）、以及在基板（11）上依次设置的像素分隔层（12）和有机发光器件层（13）；像素分隔层（12）包括分隔体（121）和多个间隔设置的开口区域（122），相邻开口区域（122）由分隔体（121）分隔开，有机发光器件层（13）包括多个有机发光器件（131），有机发光器件（131）包括空穴注入层（1311），且相邻有机发光器件（131）的空穴注入层（1311）间隔设置。

Description

一种显示面板及其制作方法、以及显示装置 技术领域
本申请涉及显示技术领域，具体涉及一种显示面板及其制作方法、以及显示装置。
 背景技术
有机电致发光器件（OLED）以其自发光、全固态、高对比等优点，成为近年来最具潜力的新型显示器件。
但是，OLED器件中存在电荷串扰发光效应，这会影响OLED器件的发光效率和使用寿命。因此，如何避免OLED器件中出现电荷串扰发光效应是目前亟需解决的难题之一。
 技术问题
本申请提供了一种显示面板及其制作方法、以及显示装置，以有效避免发光器件中出现电荷串扰发光效应，进而提高发光器件的发光效率以及延长使用寿命。
 技术解决方案
为了解决上述问题，本申请实施例提供了一种显示面板，该显示面板包括基板、以及在基板上依次设置的像素分隔层和有机发光器件层；其中，像素分隔层包括分隔体和多个间隔设置的开口区域，相邻开口区域由分隔体分隔开，有机发光器件层包括多个有机发光器件，有机发光器件包括空穴注入层，且相邻有机发光器件的空穴注入层间隔设置。
其中，有机发光器件还包括空穴传输层，空穴传输层位于设置有空穴注入层的像素分隔层上，且相邻有机发光器件的空穴传输层间隔设置。
其中，有机发光器件还包括发光层，发光层位于设置有空穴注入层的像素分隔层上，且相邻有机发光器件的发光层间隔设置。
其中，有机发光器件还包括电子传输层，电子传输层位于设置有空穴注入层的像素分隔层上，且相邻有机发光器件的电子传输层间隔设置。
其中，有机发光器件还包括依次远离空穴注入层的电子阻挡层、空穴阻挡层和电子注入层，且相邻有机发光器件的电子阻挡层、空穴阻挡层和电子注入层中至少一个层间隔设置。
其中，有机发光器件还包括阳极，阳极位于开口区域内，且位于基板与空穴注入层之间。
为了解决上述问题，本申请实施例还提供了一种显示面板的制作方法，该显示面板的制作方法包括：提供基板；在基板上形成像素分隔层，像素分隔层包括分隔体和多个间隔设置的开口区域，相邻开口区域由分隔体分隔开；在形成有像素分隔层的基板上形成有机发光器件层，有机发光器件层包括多个有机发光器件，有机发光器件包括空穴注入层，且相邻有机发光器件的空穴注入层间隔设置。
其中，在形成有像素分隔层的基板上形成有机发光器件层的步骤，具体包括：利用第一精细掩膜版，在形成有像素分隔层的基板上沉积空穴注入层；在形成有空穴注入层的像素分隔层上，依次沉积空穴传输层、发光层、电子传输层，且空穴传输层、发光层和电子传输层中至少一个层利用第二精细掩膜版制作。
其中，在利用第一精细掩膜版，在形成有像素分隔层的基板上沉积空穴注入层的步骤之前，还包括：在开口区域内蒸镀阳极。
其中，在形成有空穴注入层的像素分隔层上，依次沉积空穴传输层、发光层、电子传输层的步骤，具体包括：利用第二精细掩膜版，在形成有空穴注入层的像素分隔层上沉积空穴传输层；利用开口掩膜版，在形成有空穴传输层的像素分隔层上依次沉积发光层和电子传输层。
其中，有机发光器件还包括依次远离空穴注入层的电子阻挡层、空穴阻挡层和电子注入层，且相邻有机发光器件的电子阻挡层、空穴阻挡层和电子注入层中至少一个层间隔设置。
为了解决上述问题，本申请实施例还提供了一种显示装置，该显示装置包括驱动电路和显示面板，驱动电路用于向显示面板提供驱动电压，显示面板包括基板、以及在基板上依次设置的像素分隔层和有机发光器件层；其中，像素分隔层包括分隔体和多个间隔设置的开口区域，相邻开口区域由分隔体分隔开，有机发光器件层包括多个有机发光器件，有机发光器件包括空穴注入层，且相邻有机发光器件的空穴注入层间隔设置。
其中，有机发光器件还包括空穴传输层，空穴传输层位于设置有空穴注入层的像素分隔层上，且相邻有机发光器件的空穴传输层间隔设置。
其中，有机发光器件还包括发光层，发光层位于设置有空穴注入层的像素分隔层上，且相邻有机发光器件的发光层间隔设置。
其中，有机发光器件还包括电子传输层，电子传输层位于设置有空穴注入层的像素分隔层上，且相邻有机发光器件的电子传输层间隔设置。
其中，有机发光器件还包括依次远离空穴注入层的电子阻挡层、空穴阻挡层和电子注入层，且相邻有机发光器件的电子阻挡层、空穴阻挡层和电子注入层中至少一个层间隔设置。
其中，有机发光器件还包括阳极，阳极位于开口区域内，且位于基板与空穴注入层之间。
 有益效果
本申请的有益效果是：区别于现有技术，本申请提供的显示面板，通过将相邻有机发光器件的空穴注入层间隔设置，以有效避免发光器件中出现电荷串扰发光效应，进而提高发光器件的发光效率以及延长使用寿命。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的显示面板的结构示意图；
图2是本申请实施例提供的显示面板的另一结构示意图；
图3是本申请实施例提供的显示面板的另一结构示意图；
图4是本申请实施例提供的显示面板的制作方法的流程示意图；
图5是本申请实施例提供的显示装置的结构示意图。
 本发明的实施方式
下面结合附图和实施例，对本申请作进一步地详细描述。特别指出的是，以下实施例仅用于说明本申请，但不对本申请的范围进行限定。同样的，以下实施例仅为本申请的部分实施例而非全部实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例，都属于本申请保护的范围。
由于OLED器件中存在电荷串扰发光效应，会影响OLED器件的发光效率和使用寿命，因此，如何避免OLED器件中出现电荷串扰发光效应是目前亟需解决的难题之一。为了解决上述技术问题，本申请采用的技术方案是提供一种显示面板，以有效避免发光器件中出现电荷串扰发光效应，进而提高发光器件的发光效率以及延长使用寿命。
请参阅图1，图1是本申请实施例提供的显示面板的结构示意图。如图1所示，该显示面板10包括基板11、以及在基板11上依次设置的像素分隔层12和有机发光器件层13。其中，像素分隔层12包括分隔体121和多个间隔设置的开口区域122，相邻开口区域122由分隔体121分隔开，有机发光器件层13包括多个有机发光器件131，有机发光器件131包括空穴注入层1311，且相邻有机发光器件131的空穴注入层1311间隔设置。
其中，基板11可以为玻璃基板或者硬质的树脂基板，也可以为用于制备柔性显示面板的柔性基板。像素分隔层12可以为聚酰亚胺、环氧树脂等有机绝缘材质，也可以为SiNx、SiOx等无机绝缘材质，并且，像素分隔层12的分隔体121在基板11上界定出多个间隔设置的开口区域122，开口区域122用于设置有机发光器件131。具体地，可以将图1中两条虚线之间的有机发光器件层13作为一个有机发光器件131。
在一个具体实施例中，请继续参阅图1，有机发光器件131还包括空穴传输层1312、发光层1313和电子传输层1314。其中，空穴传输层1312、发光层131和电子传输层1314依次设置于形成有空穴注入层1311的像素分隔层12上，且多个有机发光器件131的空穴传输层1312、发光层1313和电子传输层1314分别构成整面的空穴传输层1312、整面的发光层1313、以及整面的电阻传输层1314。在本实施例中，相邻有机发光器件131的空穴注入层1311间隔设置，以避免有机发光器件131在空穴注入层1311出现电荷串扰发光效应。
进一步地，为了避免有机发光器件131在空穴传输层1312、发光层1313或电子传输层1314出现电荷串扰发光效应，也可以使相邻有机发光器件131的空穴传输层1312、发光层1313或电子传输层1314间隔设置。
例如，如图2所示，相邻有机发光器件131的空穴传输层1312间隔设置，以避免有机发光器件131在空穴传输层1312出现电荷串扰发光效应。
又例如，如图2所示，相邻有机发光器件131的发光层1313间隔设置，以避免有机发光器件131在发光层1313出现电荷串扰发光效应。
再例如，如图2所示，相邻有机发光器件131的电子传输层1314间隔设置，以避免有机发光器件131在电阻传输层1314出现电荷串扰发光效应。
值得注意的是，具体实施时，可以通过对空穴传输层1312、发光层1313和电子传输层1314的效率、寿命及视角等参数进行验证以确定是否存在电荷串扰效应，若存在电荷串扰发光效应，则将相邻有机发光器件131的对应层间隔设置，以解决该层出现电荷串扰发光效应的问题。
在一个具体实施例中，如图3所示，有机发光器件131还可以包括依次远离空穴注入层1311的电子阻挡层1315、空穴阻挡层1316和电子注入层1317，其中，电子阻挡层1315位于空穴传输层1312和发光层1313之间，空穴阻挡层1316位于发光层1313个电子传输层1314之间，电子注入层1317覆盖电子传输层1314，且相邻有机发光器件131的电子阻挡层1315、空穴阻挡层1316和电子注入层1317中至少一个层间隔设置，以避免有机发光器件131在电子阻挡层1315、空穴阻挡层1316和电子注入层1317出现电荷串扰发光效应。
例如，如图3所示，相邻有机发光器件131的电子阻挡层1315间隔设置，以避免有机发光器件131在电阻阻挡层1315出现电荷串扰发光效应。
又例如，如图3所示，相邻有机发光器件131的空穴阻挡层1316间隔设置，以避免有机发光器件131在空穴阻挡层1316出现电荷串扰发光效应。
再例如，如图3所示，相邻有机发光器件131的电子注入层1317间隔设置，以避免有机发光器件131在电阻注入层1317出现电荷串扰发光效应。
值得注意的是，具体实施时，可以通过对电子阻挡层1315、空穴阻挡层1316和电子注入层1317的效率、寿命及视角等参数进行验证以确定是否存在电荷串扰效应，若存在电荷串扰发光效应，则将相邻有机发光器件131的对应层间隔设置，以解决该层出现电荷串扰发光效应的问题。另外，有机发光器件131可以包括上述空穴注入层1311、空穴传输层1312、电子阻挡层1315、发光层1313、空穴阻挡层1316、电子传输层1314和电子注入层1317中的部分层，例如，有机发光器件131可以包括上述空穴注入层1311、空穴传输层1312、发光层1313和电子传输层1314，然后再此基础上，有机发光器件131还可以新增上述电子阻挡层1315、空穴阻挡层1316或电子注入层1317。
进一步地，请继续参阅图3，有机发光器件131还包括阳极1318和阴极1319。其中，阳极1318位于开口区域122内，且位于基板11与空穴注入层1311之间，以有效改善有机发光器件131中存在的电荷串扰效应。阴极1319位于像素分隔层12上且覆盖电子注入层1317。
具体地，显示面板10还可以包括在基板11上依次设置的薄膜晶体管（图中未示出）和平坦层（图中未示出），其中，平坦层覆盖薄膜晶体管，像素分隔层12覆盖平坦层。
区别于现有技术，本实施例中的显示面板，通过将相邻有机发光器件的空穴注入层间隔设置，以有效避免发光器件中出现电荷串扰发光效应，进而提高发光器件的发光效率以及延长使用寿命。
请参阅图4，图4是本申请实施例提供的显示面板的制作方法的流程示意图。该显示面板的制作方法包括以下步骤：
S41：提供基板。
基板可以为玻璃基板或者硬质的树脂基板，也可以为用于制备柔性显示面板的柔性基板。
S42：在基板上形成像素分隔层，像素分隔层包括分隔体和多个间隔设置的开口区域，相邻开口区域由分隔体分隔开。
例如，通过沉积、曝光、蚀刻等工艺在基板上形成像素分隔层。其中，像素分隔层可以为聚酰亚胺、环氧树脂等有机绝缘材质，也可以为SiNx、SiOx等无机绝缘材质，并且，像素分隔层的分隔体在基板上界定出多个间隔设置的开口区域，开口区域用于界定有机发光器件的形成位置。
S43：在形成有像素分隔层的基板上形成有机发光器件层，有机发光器件层包括多个有机发光器件，有机发光器件包括空穴注入层，且相邻有机发光器件的空穴注入层间隔设置。
在一个实施例中，S43可以具体包括：
子步骤A：利用第一精细掩膜版，在形成有像素分隔层的基板上沉积空穴注入层。
例如，将第一精细掩膜版对准上述开口区域，然后利用真空蒸镀、物理气相沉积、化学气相沉积、脉冲激光沉积等方式在形成有像素分隔层的基板上制作空穴注入层，以使相邻有机发光器件的空穴注入层间隔设置，进而避免有机发光器件在空穴注入层出现电荷串扰发光效应。
具体地，在子步骤A之前，还可以包括：
在开口区域内蒸镀阳极。例如，利用真空蒸镀在开口区域内制作阳极，以使相邻有机发光器件的阳极间隔设置，进而有效改善有机发光器件131中存在的电荷串扰效应。
子步骤B：在形成有空穴注入层的像素分隔层上，依次沉积空穴传输层、发光层、电子传输层，且空穴传输层、发光层和电子传输层中至少一个层利用第二精细掩膜版制作。
例如，子步骤B可以具体包括：
（1）将第二精细掩膜版对准空穴注入层，然后利用真空蒸镀、物理气相沉积、化学气相沉积、脉冲激光沉积等方式在形成有空穴注入层的像素分隔层上制作空穴传输层；
（2）将开口掩膜版对准像素分隔层，然后利用真空蒸镀、物理气相沉积、化学气相沉积、脉冲激光沉积等方式在形成有空穴传输层的像素分隔层上依次制作发光层和电子传输层。
如此，通过第二精细掩膜版制作空穴传输层，能够避免有机发光器件在空穴传输层出现电荷串扰发光效应。
在一个具体实施例中，子步骤B还可以具体为：
在形成有空穴注入层的像素分隔层上，依次沉积空穴传输层、电子阻挡层、发光层、空穴阻挡层、电子传输层和电子注入层，且空穴传输层、电子阻挡层、发光层、空穴阻挡层、电子传输层和电子注入层中至少一个层利用第二精细掩膜版制作。
例如，子步骤B可以具体包括：
（1）将第二精细掩膜版对准空穴注入层，然后利用真空蒸镀、物理气相沉积、化学气相沉积、脉冲激光沉积等方式在形成有空穴注入层的像素分隔层上制作空穴传输层；
（2）将第二精细掩膜版对准空穴传输层，然后利用真空蒸镀、物理气相沉积、化学气相沉积、脉冲激光沉积等方式在形成有空穴传输层的像素分隔层上制作电子阻挡层；
（3）将开口掩膜版对准像素分隔层，然后利用真空蒸镀、物理气相沉积、化学气相沉积、脉冲激光沉积等方式在形成有电子阻挡层的像素分隔层上依次制作发光层、空穴阻挡层、电子传输层和电子注入层。
如此，通过第二精细掩膜版制作空穴传输层和电子阻挡层，能够避免有机发光器件在空穴传输层和电子阻挡层中出现电荷串扰发光效应。
值得注意的是，上述第一精细掩膜版、第二精细掩膜版可以是同一精细掩膜版，也可以不同的进行掩膜版。另外，在利用第二精细掩膜版制作上述空穴传输层、电阻阻挡层、发光层、空穴阻挡层、电子传输层或电子注入层时，不同层可以对应有不同的第二精细掩膜版，也即第二精细掩膜版可以具体是一个精细掩膜版，也可以是多个不同精细掩膜版的总称，具体实施时，可以根据具体情况来选择第二精细掩膜版。
进一步地，在子步骤B之后，还可以包括：
在像素分隔层上形成阴极，阴极覆盖电子注入层。
其中，有机发光器件可以具体包括上述阳极、空穴注入层、空穴传输层、电子阻挡层、发光层、空穴阻挡层、电子传输层、电子注入层和阴极。
值得注意的是，具体实施时，有机发光器件可以包括上述空穴注入层、空穴传输层、电子阻挡层、发光层、空穴阻挡层和电子传输层中的部分层，例如，有机发光器件可以包括上述空穴注入层、空穴传输层、发光层和电子传输层，然后再此基础上，有机发光器件还可以新增上述电子阻挡层、空穴阻挡层或电子注入层。另外，可以通过对有机发光器件的空穴传输层、电子阻挡层、发光层、空穴阻挡层、电子传输层和电子注入层的效率、寿命及视角等参数进行验证以确定是否存在电荷串扰效应，若存在电荷串扰发光效应，则利用精细掩膜版制作有机发光器件的对应层，以避免有机发光器件的该层出现电荷串扰发光效应的问题。
区别于现有技术，本申请实施例提供的显示面板的制作方法，通过将相邻有机发光器件的空穴注入层间隔设置，以有效避免发光器件中出现电荷串扰发光效应，进而提高发光器件的发光效率以及延长使用寿命。
请参阅图5，图5是本申请实施例提供的显示装置的结构示意图。该显示装置50包括驱动电路和上述任一实施例的显示面板51，其中，驱动电路用于向显示面板51提供驱动电压。
显示面板51包括基板、以及在基板上依次设置的像素分隔层和有机发光器件层，其中，像素分隔层包括分隔体和多个间隔设置的开口区域，相邻开口区域由分隔体分隔开，有机发光器件层包括多个有机发光器件，有机发光器件包括空穴注入层，且相邻有机发光器件的空穴注入层间隔设置。
区别于现有技术，本实施例中的显示装置，通过将相邻有机发光器件的空穴注入层间隔设置，以有效避免发光器件中出现电荷串扰发光效应，进而提高发光器件的发光效率以及延长使用寿命。
以上所述仅为本申请的较佳实施例而已，并不用以限制本申请，凡在本申请的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本申请的保护范围之内。

Claims (17)

  1. 一种显示面板，其包括基板、以及在所述基板上依次设置的像素分隔层和有机发光器件层；
    其中，所述像素分隔层包括分隔体和多个间隔设置的开口区域，相邻所述开口区域由所述分隔体分隔开，所述有机发光器件层包括多个有机发光器件，所述有机发光器件包括空穴注入层，且相邻所述有机发光器件的所述空穴注入层间隔设置。
  2. 根据权利要求1所述的显示面板，其中，所述有机发光器件还包括空穴传输层，所述空穴传输层位于设置有所述空穴注入层的所述像素分隔层上，且相邻所述有机发光器件的所述空穴传输层间隔设置。
  3. 根据权利要求1所述的显示面板，其中，所述有机发光器件还包括发光层，所述发光层位于设置有所述空穴注入层的所述像素分隔层上，且相邻所述有机发光器件的所述发光层间隔设置。
  4. 根据权利要求1所述的显示面板，其中，所述有机发光器件还包括电子传输层，所述电子传输层位于设置有所述空穴注入层的所述像素分隔层上，且相邻所述有机发光器件的所述电子传输层间隔设置。
  5. 根据权利要求1所述的显示面板，其中，所述有机发光器件还包括依次远离所述空穴注入层的电子阻挡层、空穴阻挡层和电子注入层，且相邻所述有机发光器件的所述电子阻挡层、所述空穴阻挡层和所述电子注入层中至少一个层间隔设置。
  6. 根据权利要求1所述的显示面板，其中，所述有机发光器件还包括阳极，所述阳极位于所述开口区域内，且位于所述基板与所述空穴注入层之间。
  7. 一种显示面板的制作方法，其包括：
    提供基板；
    在所述基板上形成像素分隔层，所述像素分隔层包括分隔体和多个间隔设置的开口区域，相邻所述开口区域由所述分隔体分隔开；
    在形成有所述像素分隔层的所述基板上形成有机发光器件层，所述有机发光器件层包括多个有机发光器件，所述有机发光器件包括空穴注入层，且相邻所述有机发光器件的所述空穴注入层间隔设置。
  8. 根据权利要求7所述的制作方法，其中，所述在形成有所述像素分隔层的所述基板上形成有机发光器件层的步骤，具体包括：
    利用第一精细掩膜版，在形成有所述像素分隔层的所述基板上沉积空穴注入层；
    在形成有所述空穴注入层的所述像素分隔层上，依次沉积空穴传输层、发光层、电子传输层，且所述空穴传输层、所述发光层和所述电子传输层中至少一个层利用第二精细掩膜版制作。
  9. 根据权利要求8所述的制作方法，其中，在所述利用第一精细掩膜版，在形成有所述像素分隔层的所述基板上沉积空穴注入层的步骤之前，还包括：
    在所述开口区域内蒸镀阳极。
  10. 根据权利要求8所述的制作方法，其中，所述在形成有所述空穴注入层的所述像素分隔层上，依次沉积空穴传输层、发光层、电子传输层的步骤，具体包括：
    利用第二精细掩膜版，在形成有所述空穴注入层的所述像素分隔层上沉积空穴传输层；
    利用开口掩膜版，在形成有所述空穴传输层的所述像素分隔层上依次沉积发光层和电子传输层。
  11. 根据权利要求7所述的制作方法，其中，所述有机发光器件还包括依次远离所述空穴注入层的电子阻挡层、空穴阻挡层和电子注入层，且相邻所述有机发光器件的所述电子阻挡层、所述空穴阻挡层和所述电子注入层中至少一个层间隔设置。
  12. 一种显示装置，其包括驱动电路和显示面板，所述驱动电路用于向所述显示面板提供驱动电压，所述显示面板包括基板、以及在所述基板上依次设置的像素分隔层和有机发光器件层；
    其中，所述像素分隔层包括分隔体和多个间隔设置的开口区域，相邻所述开口区域由所述分隔体分隔开，所述有机发光器件层包括多个有机发光器件，所述有机发光器件包括空穴注入层，且相邻所述有机发光器件的所述空穴注入层间隔设置。
  13. 根据权利要求12所述的显示装置，其中，所述有机发光器件还包括空穴传输层，所述空穴传输层位于设置有所述空穴注入层的所述像素分隔层上，且相邻所述有机发光器件的所述空穴传输层间隔设置。
  14. 根据权利要求12所述的显示装置，其中，所述有机发光器件还包括发光层，所述发光层位于设置有所述空穴注入层的所述像素分隔层上，且相邻所述有机发光器件的所述发光层间隔设置。
  15. 根据权利要求12所述的显示装置，其中，所述有机发光器件还包括电子传输层，所述电子传输层位于设置有所述空穴注入层的所述像素分隔层上，且相邻所述有机发光器件的所述电子传输层间隔设置。
  16. 根据权利要求12所述的显示装置，其中，所述有机发光器件还包括依次远离所述空穴注入层的电子阻挡层、空穴阻挡层和电子注入层，且相邻所述有机发光器件的所述电子阻挡层、所述空穴阻挡层和所述电子注入层中至少一个层间隔设置。
  17. 根据权利要求12所述的显示装置，其中，所述有机发光器件还包括阳极，所述阳极位于所述开口区域内，且位于所述基板与所述空穴注入层之间。
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