WO2020216894A1

WO2020216894A1 - Error identification in a production or processing operation for a component, in particular for a control board, by means of a sensor carrier part

Info

Publication number: WO2020216894A1
Application number: PCT/EP2020/061449
Authority: WO
Inventors: Daniel Schneider; Holger FLATT
Original assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Priority date: 2019-04-24
Filing date: 2020-04-24
Publication date: 2020-10-29
Also published as: DE102019205812A1

Abstract

The invention relates to the error identification in a production or processing operation for a component (1), in particular for checking a production or processing operation for a circuit board provided with or to be provided with control electronics, comprising: a) acquiring at least one geometric property (b, d, l) of the component (1); b) producing a sensor carrier part (2) having a geometric property (b', d', l') equal to the geometric property (b, d, l) of the component (1), the sensor carrier part (2) having at least one sensor element (3a-3e) for measuring a measurement variable and a read-out element (4) connected to the sensor element (3a-3e) for reading out at least one measurement value of the measurement variable measured by the sensor element (3a-3e); c) introducing the sensor carrier part (2) into the production or processing operation instead of the component (1); d) carrying out the production or processing operation with the introduced sensor carrier component (2), the sensor element (3a-3e) measuring the measurement variable; and e) reading out the at least one measured measurement value in order to improve the troubleshooting in and the optimization of production and/or processing operations in a production and/or processing system. The invention further relates to a corresponding sensor carrier part.

Description

Defect identification in a manufacturing or machining process for a component, in particular for a control board, with a sensor carrier part

The invention relates to a method for identifying a fault in a manufacturing and / or machining process for a component, in particular for a printed circuit board (control board) provided or to be provided with control electronics. The invention also relates to a corresponding sensor carrier part for identifying an error in the manufacturing and / or machining process.

In modern manufacturing, production process modules are combined in a network to form a manufacturing or machining process. For example, in the production of electronic control boards, the production process modules “assembly of a circuit board”, “soldering of the assembled circuit board”, “programming of the soldered circuit board” and “quality control of the programmed circuit board” are combined into the manufacturing or machining process for the component. This finished The manufacturing or machining process does not usually run perfectly, which leads to scrap. However, manufacturing defects are typically only discovered at the end of the process, during quality control. The cause of the error is accordingly difficult to understand and is sometimes not discovered.

A solution approach used so far is the use of process and / or system-external sensor elements in order to uncover faults which the associated (production or processing) system cannot detect itself or which cannot be perceived by an operator. The problem with this approach is the selection of the suitable measurement method and the associated, possibly very large amount of measurement data that has to be interpreted in order to find a fault in the system. The initial assessment is typically the greatest challenge here, since in the vast majority of cases it is unclear whether certain measurement data represent an incorrect course of the process or a normal course of the process. In some cases this can be assessed by an expert, although this method reaches its limits with increasing plant size and complexity. Machine learning processes, on the other hand, also reveal complex causes of errors without the need for expert knowledge. However, these methods have so far only been effective if sufficient training data are available for pattern recognition. When using machine learning methods to identify errors in manufacturing or machining processes, a large amount of rejects must always be produced.

In the article "Recent trends in the Classification of remote sensing data: active and semi-supervised machine learning paradigms" by Lorenzo Bruzzone and Claudio Persello, published at the IEEE International Geoscience And Remote Sensing Symposium, Honolulu, USA between 25. and July 30, 2010, a method for condition monitoring with semi-monitored, machine learning methods is presented to monitor systems.

Another approach also uses different sensors and combinations of machine learning processes to determine and correct anomalies in operation. This is in the article "Novel Industrial Wireless Sensor Networks for Machine Condition Monitoring and Fault Diagnosis" by Liqun Hou and Neil W. Bergmann, published on June 11, 2011 in the IEEE Transactions on Instrumentation and Measurement, vol. 61, issue 10, October 2012.

In contrast, other solutions use external, statically installed sensors along a measuring path in order to be able to carry out cloud-based analyzes. This is for example in the article "Enabling the multiple use of Condition Monitoring Devices for Realtime Monitoring, Realtime Data Logging and Remote Condition Monitoring" by EPC Morris et al., Published between September 27 and 28, 2016 at the 7th IET Conference on Railway Condition Monitoring in Birmingham, UK, or in the article "loT Platform for Condition Monitoring of Industrial Motors" by D. Shyamala et al., Published between 19 and 20 October 2017 at the second International Conference on Communication and Electronic Systems in Coimbatore, India, in the article "Condition Monitoring Of Railway Tracks Using Compact Size On-Board Monitoring Device" by H. Tsunashima et al., Published September 17-18, 2017 at the 6th IET Conference on Railway Condition Monitoring, Birmingham, UK, a sensor system is presented that measures the condition of a route from the vehicle.

US 2018 350165 A1 describes a distributed monitoring system for monitoring a vehicle, in which a large number of sensor elements are attached to the vehicle and make measurement data available. In a somewhat more general way, WO 2018 195 488 A1 provides methods and devices that are used to monitor objects such as motors, bearings, rollers, conveyor belts, gears and water pumps. The monitoring systems contain a number of sensors that are attached to an object to be monitored and collect movement information from the object. This movement information is then processed by a remote analysis device. WO 2018 177669 shows a method for acquiring at least one characteristic value of a tool, for example a drilling machine, which is connected to an additional module which acquires said characteristic value. A training process can also be carried out in which at least one reference value is derived from the at least one characteristic value and stored. In summary, it can be stated that troubleshooting and optimization of manufacturing or machining processes assigned to a component fall back on two different approaches. It is either assumed that a norm and / or malfunction is learned by machine or that it is evaluated by an expert and additional measurement data.

The task is therefore to improve the troubleshooting in and the optimization of manufacturing and / or machining processes in a manufacturing and / or machining system.

This object is achieved by the subjects of the independent patent claims. Advantageous embodiments result from the dependent claims, the description and the figures.

One aspect relates to a method for identifying an error in a manufacturing and / or machining process, in particular a machine manufacturing and / or machining process, for components in a manufacturing and / or machining system. The component can be or comprise, for example, an electronic control board. The process accordingly includes a number of process steps.

One method step is the acquisition of at least one geometric property of the component to be manufactured and / or processed, that is to say one or more, in particular all of the geometric properties of the component. The at least one geometric property can in particular comprise or be an outer dimension of the component. Further properties of the component, for example a weight, can also be recorded. The recorded property is preferably an important property for the production and / or machining process, ie that the production and / or machining process is coordinated with the recorded property. For example, an external dimension such as the length and width of a control board for the manufacturing and machining process can be important in that, for example, a gripper of the corresponding manufacturing and / or machining system is configured as a function of this property. Under the term "component" in the context of the present document, the output component, that is, the component as it is made at the beginning of the corresponding manufacturing or machining process, or the End component, i.e. the component as it is created after it has gone through the corresponding manufacturing or machining process, or one, several, or all transition state components, i.e. the component as it is at one, several, or all times of the corresponding manufacturing or processing Machining process is to be understood. The detected geometric properties are preferably geometric properties which are not changed in the process.

Another method step is the production of a sensor carrier part with a geometric property which is identical to the geometric property of the component, preferably is identical to the geometric property of the component. The geometry of the sensor support part is at least partially se, d. H. in an area in which the geometry was previously recorded, identical to the geometry of the component. The sensor carrier part can also have an overall geometry that is the same as that of the component (preferably the starting component). The sensor carrier part can therefore be designed according to the geometry of the construction part to the extent that the manufacturing and / or machining process requires so that the sensor carrier part can go through the manufacturing and / or machining process instead of the component.

This serves to ensure that the sensor carrier part, as will be explained further below, can be introduced into the production and / or machining process instead of the component without having to make changes to the corresponding system. The sensor carrier part has at least one sensor element, i.e. one sensor element or several sensor elements for measuring one or more measured variables, as well as a readout element connected to the sensor element with a data connection for reading out at least one measured value measured by the at least one sensor element Measurand. The at least one sensor element and / or the readout element is preferably integrated into the geometry of the sensor carrier part, so that the sensor and / or readout element does not impair the compatibility of the sensor carrier component with the manufacturing and / or machining process. A measured value or several measured values of the measured variable can therefore be measured by the sensor element in a carrier that is geometrically similar or identical to the component, before a series of measured values of the measured variable is given. There are no special requirements for the geometry of the component, the sensor The carrier part can be modeled on any component geometry.

Another method step is the introduction of the sensor carrier component with the sensor element and the readout element in the manufacturing or machining process instead of the component. Another method step is running through the manufacturing and / or machining process with the introduced sensor carrier component, the sensor element measuring the measured variable at one or more points in time while running through the process. For these two process steps, it is correspondingly important that the detected geometric property of the component is the same as the geometric property of the sensor carrier part so that the replacement of the component in the production and / or machining process by the sensor carrier part does not cause any errors and thus quality losses.

A further method step is reading out the at least one measured value, preferably the entire series of measured values, and identifying an error in the manufacturing and / or machining process based on the measured value or series of measured values read out.

This has the advantage that process-relevant measured variables such as vibrations, humidity, temperature and material stress can be measured in the process directly at the location of the component, namely directly on the sensor carrier part. This enables the sensor carrier part to measure the production influences that occur directly on the component and thus influence the product. The described method thus enables the condition of the component and thus of the product to be followed directly (directly) during manufacture. This allows a high level of accuracy and sensitivity in process monitoring. A simplification of the troubleshooting in the production and / or machining process is thus achieved, since a focus is made on the influences directly relevant to the product or component. In addition, the proposed approach enables complete, ie continuous process monitoring from the point of view of the product, whereby errors can be found with a higher probability. Finally, the method can be applied to components and manufacturing or machining processes of almost any shape. For example, not only can circuit boards be monitored during assembly, soldering and programming as a production or machining process, but bottles can also be monitored during cleaning as machining process. By considering a course of the measured variable, it is also possible to identify the causes and locations of errors in the production or machining process, for example within certain production process modules.

The measured values or measurement data can e.g. B. can be analyzed by a manual target / actual comparison or by machine processes, as are known in the prior art. The evaluation is simplified considerably with the method described, since there is now a significantly smaller number of product status data, the measured measured values, compared to the large number of all system measured values. Anyone who detects abnormalities on the basis of this product status data can identify a malfunction and assign it to a section of the production and / or processing system. For this purpose, the measured value can, for example, receive a time stamp or be read out in various stages of the manufacturing and / or machining process. The measured value, in particular the series of measured values, can also be correlated with the data of other sensors, for example the known external sensors, which represent the external system behavior, in their course or their measurement time, and this again enables improved identification of the error in the process .

In summary, it can be stated that the method described solves the basic problem described at the beginning with regard to the high complexity and difficult interpretability of measurement data in manufacturing and / or machining processes. For this purpose, the known external system measurement data are supplemented or replaced by direct product measurement data, thus offering the possibility of directly identifying the causes and locations of errors. This is also generic and can therefore be used across industries.

The solution is implemented by replacing a product component in the manufacturing and / or machining process with a sensor carrier part. In this case, the sensor carrier part is modeled on the product component in such a way that the sensor carrier part can go through the manufacturing or machining process without having to be adapted on the system side. The sensor carrier part and the product component are suitable for the manufacturing and / or processing The system assigned to the process is indistinguishable.

In an advantageous embodiment it is provided that the production of the sensor carrier part comprises an additive production method and / or additive production steps or the production is an additive production. This has the advantage that the sensor carrier part can be provided with the geometric property particularly easily, so that it cannot be distinguished from the normal component for the system. In this way, the sensor elements or further electronic elements can also be embedded in the sensor carrier part without the geometric property or the geometric properties of the sensor carrier part deviating from the recorded geometrical properties of the product component, so that the manufacturing and / or machining process does not or is only influenced negligibly.

Through the additive production process or additive process steps in the production of the sensor carrier part, any geometries and product components can be modeled, which enables the analysis of production and / or machining processes in different products and industries. For example, through additive process steps, the sensor element and readout element can be incorporated into a bottle-shaped or printed circuit board / circuit board-shaped sensor carrier part without the outer shape, which is reflected in one or more geometric properties of the sensor carrier part, differing from the outer shape of the usually bottle used in the manufacturing and / or machining process differs.

The additive method enables, in particular, the embedding of a large number of sensors within the recorded specified geometry, ie the recorded geometric properties of the component. A large number of measurands can be measured, for example temperature and / or vibration. Temperature sensors can, for example, determine if a soldering temperature is exceeded on a printed circuit board, which would otherwise remain hidden in an indirect measurement by external sensor elements. Integrated vibration sensor elements can, for example, determine whether components move on the circuit board before or during the soldering process. The additive method can also be used for additional sensors can easily be integrated into the sensor carrier part and thus enable particularly precise process and product monitoring that is not possible with conventional methods.

In a further advantageous embodiment it is provided that the sensor carrier part has a memory element connected to the at least one sensor element and / or the readout element for storing the at least one measured value, in particular the series of measured values, of the at least one sensor element, and the measured value when passing through , in particular the series of measured values, is stored in the memory element. As an alternative or in addition, it can be provided that the at least one measured value is read out during the run and that the read-out measured values, in particular the series of measured values, are stored in an external storage element outside the sensor carrier part. This has the advantage that a temporal course of the measured value can be stored so that the influences on the component in the manufacturing and / or machining process can be understood particularly precisely.

Another advantageous embodiment provides that the readout element is or comprises a wireless readout element for wirelessly reading out the at least one measured value and the reading out takes place wirelessly, preferably while the manufacturing and / or machining process is running. The readout can also take place during the run and additionally after the run, for example to achieve prompt processing of the measured value (or measured values) and to use the measured value (or values) read after the run through the manufacturing and / or machining process Measured values) to check error-free transmission of the measured value (or measured values).

This has the advantage that reading is particularly convenient and particularly few elements, in particular no memory element, need to be present in the sensor carrier part itself, so that there is particularly great flexibility with regard to the geometry of the sensor carrier part. As a result, a particularly large number of components can be imitated by the sensor carrier part and a particularly large number of manufacturing and / or machining processes can be checked accordingly. In a particularly advantageous embodiment, it is provided that the at least one sensor element repeats the measured variable while running through the production and / or machining process, in particular continuously, over the duration of part of the production and machining process or over the duration of the entire production and / or the machining process and in particular the measured variable is read out and / or stored as a series of measured values. The information on the temporal progression of the measured variable has the advantage that measured values can be correlated temporally and / or locally with the system assigned to the manufacturing and / or machining process, and thus errors can be found particularly quickly and easily.

Another embodiment provides that the error in the manufacturing and / or machining process is identified using the read-out measured value, in particular the read-out series of measured values, and the identification is a comparison, preferably an automatic comparison, of the measured value, in particular the read-out series of measured values, with a predetermined target measured value, in particular a predetermined target measured value series. This has the advantage that an error in the manufacturing and / or machining process is particularly easily discovered. In particular, individual tolerances can be established for specific sections of the process, for example a certain deviation from a target temperature when soldering a board can be assessed differently than the same deviation from the target temperature when programming or cleaning the board.

In a further advantageous embodiment, it is provided that the at least one sensor element is used as a measured variable to include a vibration and / or a humidity and / or a temperature and / or a force, in particular a material tension, and / or an optical transmission and / or an optical Reflection is measured. Sensor elements assigned to the different measured variables can be provided for the different measured variables. The named measured variables have proven to be particularly advantageous for identifying errors in manufacturing and / or machining processes, that is, for checking manufacturing and / or machining processes. The at least one sensor element can comprise one or more (in particular respective) printed sensor components, for example optical channels, their optical transmission and / or optical reflection (the two

5 properties can be summarized under the term translucency) is temperature-dependent and / or force-dependent and / or vibration-dependent. A respective local temperature, local force or local vibration can thus be determined indirectly via an optical (and preferably non-contact) measurement process.

10

In a further advantageous embodiment it is provided that the at least one measured variable is measured in each case by several different sensor elements. The measured variable or, in the case of several measured variables, each of the measured variables can each have several different ones

15 sensor elements are assigned. This has the advantage that the corresponding measured variables can be measured at different locations on the sensor carrier part and thus for different locations on the component and thus, for example, a measured value distribution for the respective measured variable can be generated across the component. This is for example with the

Monitoring of temperatures in a soldering process is particularly advantageous, and enables a further improved identification of errors in the manufacturing and / or machining process.

In another advantageous embodiment it is provided that in the

25 detecting at least one geometric property of the component, a length of the component over all and / or a width of the component over all and / or a thickness of the component over all is detected as a geometric property and the sensor carrier part with the detected length and / or with the detected width and / or is generated with the detected thickness. In particular acts

BO the length is a cuboid length and / or the width is a

Cuboid width and / or the thickness by a cuboid thickness. The component is preferably a printed circuit board or control board. This has the advantage that the sensor carrier part imitates the product component in a particularly simple manner, since typically, especially in the case of printed circuit boards or control boards, these

35 are gripped from the outside by the system, for which primarily the length and / or width of the corresponding cuboid or at least rectangular component must be simulated by the sensor carrier part. Another aspect relates to a sensor carrier part for identifying a fault in a manufacturing and / or machining process assigned to a component, the sensor carrier part for at least one sensor element

5 Measurement of a measured variable and one connected to the sensor element

Having readout element for reading out at least one measured value of the measured variable measured by the sensor element. The geometry of the sensor carrier part is at least regionally, that is to say regionally or completely, the same as the geometry of the component (preferably of the starting component), see above

10 that the sensor carrier part can go through the manufacturing and / or machining process instead of the component without an adaptation to the sensor carrier part being necessary in the system associated with the manufacturing and / or machining process. The geometry of the sensor support part or at least one geometric property of the sensor support part can therefore be the

15 geometry of the component or at least one geometric property of the

The same component in such a way that the system assigned to the manufacturing and / or machining process cannot distinguish or differentiate the component from the sensor carrier part. The aspect can also be the combination of the sensor support part with the corresponding component, the geometry of which corresponds to the Geo

20 metry of the sensor support part is at least partially the same, concern.

Advantages and advantageous embodiments of the sensor carrier part or the combination of the sensor carrier part with the corresponding component correspond to advantages and advantageous embodiments

25 of the method described and vice versa.

It can be provided that a characteristic of the sensor carrier part, in particular a mechanical stability and / or an electronic functionality and / or another for the intended use

BO use of the component required characteristic is less pronounced than for the component.

The features and feature combinations mentioned above in the description, as well as those below in the description of the figures

35 mentioned and / or shown alone in the figures and

Combinations of features can be used not only in the specified combination, but also in other combinations, without the To leave the scope of the invention. There are thus also embodiments of the invention to be considered as encompassed and disclosed, which are not explicitly shown and explained in the figures, but emerge from the explained embodiments and can be generated by separate combinations of features. Designs and combinations of features are also to be regarded as disclosed, which therefore do not have all the features of an originally formulated independent or dependent claim. In addition, designs and combinations of features, in particular through the statements set out above, are to be regarded as disclosed which go beyond the combinations of features set forth in the back references of the claims or differ from them.

Embodiments of the invention are explained in more detail using a cal matic drawing.

1 shows a component 1 embodied by way of example as a control board, with a specified cuboid length I, a specified cuboid width b, and a prescribed cuboid thickness d as geometric properties. In the present example, a large number of solder points 8a-8e are present, to which corresponding electronic elements are soldered on the control board. For the sake of clarity, the electronic elements, for example microprocessors, transistors and other elements, are not shown in the figures.

Fig. 2 also shows a sensor support part 2 with a corresponding cuboid width b ', a cuboid length G and a cuboid thickness d' as corresponding geometric properties, which the respective geometric properties b, I, d of the component 1 are the same. In this case, the sensor carrier part 2 has at least one sensor element, in the present case several sensor elements 3a-3e, which are connected to a readout element 4 via a corresponding data line 5. In the illustration, an upper part 6 of the sensor carrier part 2 is shown removed from the rest 7 of the sensor carrier part 2 in the manner of an exploded view in the positive x-direction, in order to improve the elements 3a-3e, 4 arranged in the interior of the sensor carrier part 2 to represent. The ele ments 3 a-3e, 4 thus in the example shown do not influence the geometric properties of the sensor carrier part 2, here accordingly the cuboid width b ', the cuboid thickness d' and the cuboid length I ', so that the sensor carrier part 2 is indistinguishable from the component 1, for example, for a gripper of a production and / or processing system. This can be achieved, for example, by an additive production method for the sensor carrier 2. For example, optical sensor elements Ba-Be can be integrated directly into the geometry of the sensor carrier part 2 determined by the geometric properties of the component 2, be it as discrete sensor components or printed sensor components such as transparent optical channels, the translucency of which is temperature-dependent and / or force-dependent and / or is dependent on vibration. This ensures that the

Sensor carrier part 2 runs through the manufacturing or machining process completely without influencing it disadvantageously. The sensor elements 3a-3e are spatially distributed according to the soldering points 8a-8e so that the sensor elements 3a-3e can measure the measured variable, for example a temperature during soldering at the soldering points 8a-8e, in a spatially resolved manner in the areas of the respective solder points 8a-8e.

Claims

Expectations

1) Method for identifying a fault in a manufacturing or machining process for a component (1), in particular for identifying a fault in a manufacturing or machining process for a control board, with the method steps:

a) detecting at least one geometric property (b, d, I) of the component (1);

b) producing a sensor support part (2) with a geometric property (b ', d', I ') which is the same as the geometric property (b, d, I) of the component (1), the sensor support part ( 2) has at least one sensor element (Ba-Be) for measuring a measured variable and a readout element (4) connected to the sensor element (3a-3e) for reading out at least one measured value of the measured variable measured by the sensor element (3a-3e);

c) introducing the sensor support part (2) in the manufacturing or processing process instead of the component (1);

d) running through the manufacturing or machining process with the introduced sensor carrier component (2), the sensor element (3a-3e) measuring the measured variable;

e) reading out the at least one measured value.

2) method according to claim 1,

characterized in that

the generation according to method step a) comprises an additive generation method.

3) Method according to one of the preceding claims,

characterized in that

the sensor carrier part (2) has a storage element connected to the at least one sensor element (3a-3e) and / or the readout element (4) for storing the at least one measured value, in particular a series of measured values, of the at least one sensor element (3a-3e) , and when running through according to method step d), the measured value, in particular the series of measured values, is stored in the memory element.

4) Method according to one of the preceding claims,

characterized in that

the readout element (4) a wireless readout element (4) for wireless sen reading out of the measured value and the reading out according to method step e) takes place wirelessly, in particular while running according to method step d).

5) Method according to one of the preceding claims,

characterized in that

the at least one sensor element (3a-3e) repeats, in particular continuously, the measured variable while running through according to method step d) over the duration of part of the manufacturing or machining process or over the duration of the entire manufacturing or machining process and measures the measured variable is read out and / or saved as a series of measured values.

6) Method according to one of the preceding claims,

marked by a

Checking the manufacturing or machining process based on the read out measured value, in particular the read out measured value series, which comprises comparing the measured value, in particular the read out measured value series, with a predetermined target measured value, in particular a predetermined target measured value series.

7) Method according to one of the preceding claims,

characterized in that

the at least one sensor element (3a-3e) measures a vibration and / or a humidity and / or a temperature and / or a force, in particular a material tension, and / or an optical transmission and / or an optical reflection.

8) Method according to one of the preceding claims,

characterized in that

the at least one measured variable is measured by several different sensor elements.

9) Method according to one of the preceding claims,

characterized in that

in the detection according to method step a) a length of the component (1) and / or a width of the component (1) and / or a thickness of the construction part (1) is detected as a geometric property (b, d, I) and the Sen sor support part (2) is generated with the detected length and / or width and / or thickness. 10) Sensor carrier part (2) for identifying a fault in a production and / or machining process for a component (1), the sensor carrier part (2) having at least one sensor element (Ba-Be) for measuring a Has a measured variable and a readout element (4) connected to the sensor element (3a-3e) for reading out at least one measured value of the measured variable measured by the sensor element (3a-3e),

characterized in that

the geometry of the sensor support part (2) at least in some areas of the

The geometry of the component (1) is the same.

11) sensor support part (2) according to claim 10,

characterized in that

a characteristic of the sensor support part (2), in particular mechanical stability and / or electronic functionality and / or another characteristic required for the intended use of the component (1), is less pronounced than for the component.