WO2020214079A1 - Adhesive sealant composition - Google Patents

Adhesive sealant composition Download PDF

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Publication number
WO2020214079A1
WO2020214079A1 PCT/SE2020/050390 SE2020050390W WO2020214079A1 WO 2020214079 A1 WO2020214079 A1 WO 2020214079A1 SE 2020050390 W SE2020050390 W SE 2020050390W WO 2020214079 A1 WO2020214079 A1 WO 2020214079A1
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WO
WIPO (PCT)
Prior art keywords
adhesive sealant
sealant composition
composition
filler
fatty acid
Prior art date
Application number
PCT/SE2020/050390
Other languages
French (fr)
Inventor
Anders ÖBERG
Lisa JUNGERTS
Fredrik SIVERTSSON
Original Assignee
Essve Produkter Ab
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Publication date
Application filed by Essve Produkter Ab filed Critical Essve Produkter Ab
Priority to NO20211369A priority Critical patent/NO20211369A1/en
Priority to EP20791868.1A priority patent/EP3956415A4/en
Publication of WO2020214079A1 publication Critical patent/WO2020214079A1/en

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4825—Polyethers containing two hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/71—Monoisocyanates or monoisothiocyanates
    • C08G18/718—Monoisocyanates or monoisothiocyanates containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/32—Polymers modified by chemical after-treatment
    • C08G65/329—Polymers modified by chemical after-treatment with organic compounds
    • C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C08K5/134—Phenols containing ester groups
    • C08K5/1345—Carboxylic esters of phenolcarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/08—Polyurethanes from polyethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09J201/10—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/2805—Compounds having only one group containing active hydrogen
    • C08G18/288—Compounds containing at least one heteroatom other than oxygen or nitrogen
    • C08G18/289—Compounds containing at least one heteroatom other than oxygen or nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate

Definitions

  • the present invention relates to an adhesive sealant composition for application to chipboard flooring joints requiring adhesion in sub-zero outdoor weather conditions, as well as floors formed from floor panels joined by such a composition.
  • the invention further relates to the use of a silane modified polymer in such a composition, as well as the use of a fatty acid alkyl ester as a curing promoter in adhesive sealant compositions comprising silane modified polymer.
  • platform floors In Norway, health and safety conventions during building construction typically require installation of an internal floor as a working platform on the floor joists of each storey before proceeding with construction of the next storey. Such internal floors are termed platform floors (NO: "certaingulv”). Because platform floors are typically installed during ongoing construction and prior to installation of a roof or covering on the building, the platform floors are exposed to weather conditions typical of the Norwegian climate, which may entail sub zero temperatures (i.e. less than zero degrees Celsius), as well as significant amounts of precipitation in the form of rain and snow.
  • the floors are typically constructed of chipboard panels treated with a water-resistant or waterproof coating on the side of the panel intended to face upwards after installation.
  • the panels are provided with a tongue-and-groove profile on each edge in order to provide a mechanically strong joint between each panel.
  • These joint profiles are not treated with the water-resistant or waterproof coating of the upper surface. Therefore, in order to strengthen the joint and prevent impregnation of water into the joint after installation, an adhesive sealant is typically applied in the joint during installation.
  • the same adhesive sealant is also typically applied along the floor joists prior during installation of the floor panel. The floor panels are then typically screwed or nailed onto the floor joist.
  • the adhesive sealant used in installation of platform flooring caters to a very specific application since it is required to provide excellent adhesion and sealing whilst fulfilling the requirement of being able to tolerate and harden in moist and cold conditions.
  • Regular wood glues or adhesive sealants do not generally meet these requirements, and therefore most adhesive and sealant companies market an adhesive sealant tailored to the specific
  • Such adhesive sealants are typically termed chipboard adhesives (NO:
  • adhesive sealants suitable for the above-described application may be termed chipboard adhesives. Note however that such adhesive sealants differ greatly from other products marketed as chipboard adhesive in non-Norwegian markets.
  • Chipboard adhesives formulated for this specific application are nearly without exception solvent-based synthetic rubber dispersions, and harden by drying (i.e. evaporation of the solvent). Examples of such adhesives include Essve Sponplattelim Original, Casco
  • the inventors of the present invention have identified a number of shortcomings in prior art sealant adhesives for the application described. It is important that the adhesive sealants display consistent and predicable performance, and can be used and hardened across a wide range of temperatures, from about -15 °C to about 40 °C.
  • Prior-art solvent-based adhesive sealants have a viscosity that varies widely depending on temperature and in some cases may differ more than 10-fold between 40 °C and -15 °C. This leads to inconsistent properties, and for example may lead to the sealant adhesive being difficult to apply with a conventional skeleton pistol at cold temperatures, but being excessively fluid at warm temperatures.
  • the properties and performance of prior-art solvent-based adhesive sealants may vary greatly from batch to batch. This may be due to the fact that even a small variation in solvent amount may lead to a large variation in properties such as viscosity, together with common variations in batch composition. For example, at -15 °C the measured viscosity may differ by a factor of three between batches of the same adhesive sealant.
  • Solvent-based adhesive sealants typically dry rapidly and have a skin formation time of only a few minutes, regardless of application temperature. This means that the compositions harden rapidly, which may impede correct fitting of the tongue-and-groove joints, or may impede the builder when attempting to screw or nail the floor panel tightly to the floor joist. Moreover, the rapid drying of the compositions means that the composition spoils rapidly once opened, and an opened tube of adhesive sealant must therefore be consumed rapidly.
  • Solvent-based adhesive sealants typically comprise more than 20% by weight of one or more solvents. In many cases these solvents may be carcinogens or suspected carcinogens and are detrimental to the health of the builder installing the flooring panels. The builder installing flooring panels does not typically use a mask capable of filtering the volatile solvents and therefore occupational exposure to the solvents is high. Moreover, the use of volatile solvents means that the adhesive sealants continue to emit a strong odour long after they have hardened.
  • the inventors of the present invention have understood the potential role that the adhesive sealant could play with regard to resolving a problem commonly occurring with the floors, namely creaking.
  • Platform floors have a tendency to start creaking some time after installation, generally within one year of installation. It is thought that this may be due to a number of factors, including shrinkage or faulty installation of joists, or insufficient gluing, screwing or nailing or floor panels. See report no. 722.525 (2008) from the research institute SINTEF Byggforsk for further discussion of this problem.
  • the inventors of the present invention have realised that an adhesive sealant having superior properties to those traditionally used could assist in compensating at least partially for one or more of these factors.
  • silane modified polymer as defined in the appended independent claims.
  • the silane modified polymer (SMP) is used in an adhesive sealant composition for the specific application as described herein, i.e. for application to chipboard flooring joints requiring adhesion in potentially sub-zero outdoor weather conditions.
  • adhesive sealant composition for application to chipboard flooring joints it is meant a “sponplattelim” in accord with Norwegian “butgulv” construction practice, as described above.
  • requiring adhesion in potentially sub-zero outdoor weather conditions it is meant that it is a requirement that the product is capable of being used even if the prevailing weather conditions are sub-zero.
  • the silane modified polymer may be any silane modified polymer discussed in conjunction with adhesive sealant compositions below.
  • the adhesive sealant composition may be an adhesive sealant composition as described herein and/or as defined in the appended independent claims.
  • an SMP in the adhesive sealant composition facilitates resolution or amelioration of substantially all of the shortcomings in the prior art as described above.
  • a solvent-free adhesive sealant composition may be formulated. Due to the use of an SMP, the adhesive sealant composition may be formulated to have properties that are more consistent across the entire range of temperatures that the composition is required to be utilized in. For example, the composition may be formulated to have a viscosity that varies less than three fold between 40 °C and -15 °C. Since the viscosity depends on the bulk properties of the composition as a whole, more consistent viscosity between batches is obtained.
  • Adhesive sealant compositions utilizing SMP have a much longer hardening time, regardless of temperature, which means that the composition keeps for longer once opened and does not obstruct the builder when fitting, screwing or nailing the floor panels. Because SMP is moisture-curing and is not dependent on drying for hardening, the adhesive sealant composition may be formulated using only non-volatiles (i.e. solvent-free). This means less occupational exposure to volatiles, no persistent odour, and potentially fewer problems with shrinkage. The excellent elasticity of SMP-based compositions means that all contact between the floor panels and joists will be well-cushioned, leading to a lesser propensity to creak.
  • Creaking is due to a complex interplay of several components: the floor panels, the joists and the screws/nails, all of which may be provided by different suppliers. It is probable that the role that the adhesive sealant may play in assisting prevention of creaking has been overlooked in the field due to a focus on the components that actually cause the creaking, i.e. the joists, floor panels and screws/nails. See report no.
  • the objects of the invention are obtained by using a fatty acid alkyl ester (FAAE) as a curing promoter in an adhesive sealant composition comprising silane modified polymer, as defined in the appended independent claims.
  • FAE fatty acid alkyl ester
  • the adhesive sealant composition may be an adhesive sealant composition as described herein and/or as defined in the appended independent claims.
  • the FAAE acts to modify the rheological properties of the composition, providing a composition having a suitable viscosity across the range of temperatures from -15 °C to 40 °C. More surprisingly, the FAAE promotes curing of the composition (as compared to compositions comprising other rheology modifiers instead of FAAE). The curing effect is notable at room temperature and is prominent even at temperatures as low as -15 °C. The provision of both excellent rheological properties and excellent curing across the entire applicable temperature range is to our knowledge unique, and makes FAAE extremely well suited for use in the present application. The inclusion of a fatty acid alkyl ester is especially advantageous when seeking to promote curing of the adhesive sealant composition at temperatures below 0 °C.
  • the fatty acid alkyl ester may be a fatty acid methyl ester, and is preferably rapeseed methyl ester (RME).
  • RME rapeseed methyl ester
  • RME provides the adhesive sealant with good rheological and curing properties across the entire range of application temperatures.
  • the objects of the invention are obtained by an adhesive sealant composition according to the appended claims.
  • the adhesive sealant composition is suitable for use in the application described herein, i.e. suitable for application to chipboard flooring joints requiring adhesion in sub-zero outdoor weather conditions.
  • the adhesive sealant composition comprises: a) 5% - 30% of a silane modified polymer;
  • the adhesive sealant composition may comprise: a) 5% - 18% of a silane modified polymer; and/or
  • the adhesive sealant composition yields the advantages as previously described herein in relation to the use of a SMP in an adhesive sealant composition for application to chipboard flooring joints requiring adhesion in potentially sub-zero outdoor weather conditions, as well as the advantages as described in relation to the use of a fatty acid alkyl ester as a curing promoter in an adhesive sealant composition comprising silane modified polymer.
  • the fatty acid alkyl ester may be a fatty acid methyl ester, preferably rapeseed methyl ester (RME).
  • the silane modified polymer may be a silane terminated polymer, preferably a silylcarbamate- terminated polyether, most preferably a dimethoxy(methyl)silylmethyl carbamate-terminated polyether.
  • Such polymers have excellent moisture curing properties and cure without requiring a dedicated catalyst such as a tin or titanium catalyst.
  • the adhesive sealant composition may therefore be free of a metal catalyst, which is environmentally
  • the hardener may be a combined hardener and adhesion promoter, i.e. promoting the moisture curing of the composition, as well as promoting the adhesion of the polymer to filler and/or substrate.
  • the combined hardener and adhesion promoter may be an aminosilane, such as an aminoalkyl trialkoxysilane, most preferably 3-aminopropyltrimethoxysilane.
  • the water scavenger may be a silane, such as a vinyl trialkoxysilane, most preferably vinyltrimethoxysilane. Such water scavengers have been shown to provide adequate product shelf life and curing properties.
  • the plasticizer may be a non-phthalate ester plasticizer, preferably 1,2-cyclohexane dicarboxylic acid diisononyl ester.
  • the filler composition may comprises a first filler and a second filler.
  • the first filler may be a ground calcium carbonate, preferably ground dolomite.
  • the second filler may be silicon dioxide or a precipitated calcium carbonate.
  • the weight ration of the first filler to the second filler may be from about 20:1 to about 1:20, preferably from about 10:1 to about 1:1, such as about 5:1.
  • the adhesive sealant composition may further comprise one or more further substances customary in the field of adhesive sealant compositions, such as an antioxidant, preferably a sterically-hindered phenolic antioxidant. This assists in stabilizing the adhesive sealant composition.
  • an antioxidant preferably a sterically-hindered phenolic antioxidant. This assists in stabilizing the adhesive sealant composition.
  • the adhesive sealant composition may be solvent-free. Use of a moisture-curing mechanism means that no drying is required and therefore no volatile solvents are required in the composition. However, the composition may comprise non-volatile rheology modifiers such as oils.
  • the objects of the invention are obtained by a chipboard floor as defined in the appended independent claims.
  • the chipboard floor comprises at least two chipboard panels joined together by an adhesive sealant composition as described herein.
  • Fig la schematically illustrates application of adhesive sealant composition to the floor joists and profile edges of floor panels during installation of platform flooring;
  • Fig lb schematically illustrates fixing of the floor panels to the floor joists by screws during installation of platform flooring
  • the present invention relates to an adhesive sealant composition for use in installing platform floors.
  • Platform floors are floor panels, typically constructed of chipboard waterproofed on the side to be installed facing upwards, which are installed for practical and safety purposes during building construction in Norway. Since platform floors are installed prior to the building being made weathertight, they are exposed to the ambient weather conditions such as rain, snow and frost. If the floor is non-optimally installed it may take up excessive amounts of moisture and upon drying start to creak.
  • a primary function of the adhesive composition of the present invention is to prevent the platform floors from creaking. This may for example be provided by: improved sealing, i.e. preventing water permeation; improved adhesion, i.e. preventing gaps from opening between joints or between the floor panels and the joists; and/or improved cushioning, i.e. providing an elastic bed to counteract movement of the floor panel.
  • Platform flooring A typical installation procedure for installation of a platform floor is described below with reference to Figures la-lc.
  • the installation procedure for platform floors is more-or-less the same, regardless of manufacturer, and the installation instructions provided by the two largest platform floor suppliers in Norway, Arbor and Forestia, are very similar.
  • Both sets of instructions note that platform floors may be exposed to precipitation during the construction period. Excess water or ice should be removed from floor joists prior to installing the platform floor.
  • Both sets of instructions also note that the adhesive used should be able to tolerate the climatic conditions prevailing during installation.
  • Figures la-lc illustrate a typical installation procedure.
  • Two beads of adhesive (3) are applied along the entire length of each floor joist (5), and a further single bead of adhesive (7) is applied along the entire length of each profiled edge of each floor panel (9) (Fig. la).
  • the tongue-and-groove joints are formed by insertion of the cooperating profile edges of the floor panels into each other, and fixed to the floor joist by the adhesive (3).
  • the floor panels are further fixed to the joists by inserting screws (11) through the floor panels (9) and into the floor joist (5) along each profile edge (Fig. lb). After screwing of the floor panels (9), excess adhesive (13) is removed from each joint, leaving an adhesive-sealed joint (15) (Fig. lc).
  • the adhesive sealant composition comprises a silane modified polymer, a water scavenger, a hardener, a filler composition, and a fatty acid alkyl ester.
  • the composition also preferably comprises a plasticizer or thickener to modify the rheological properties of the composition, and a stabilizer such as an antioxidant.
  • Silane modified polymers also known as hybrid polymers, are polymers comprising silane pendant or terminal groups. They cure by reaction with ambient moisture to form siloxane linkages between polymer chains.
  • the polymer backbone may be a polyester, polyether, polyalkylene or polyacrylate.
  • a linear polyether such as polypropylene oxide is preferred.
  • the terminal silane groups may be trialkoxysilane groups, trialkylsilane groups or
  • alkyldialkoxysilane groups may be attached to the polymer backbone by a linker, such as an alkyl, alkylcarbamate or alkylcarbamide linker.
  • the silane modified polymer is preferably a silylcarbamate-terminated polyether, most preferably a
  • dimethoxy(methyl)silylmethyl carbamate-terminated polypropylene oxide Suitable polymers are commercially available from Wacker Chemie AG or Kaneka Corporation.
  • the silane modified polymer may constitute from about 5% to about 30% of the total dry weight of the adhesive sealant composition, such as from about 6% to about 20%, from about 7% to about 18%, from about 8% to about 15%, or from about 9% to about 11% of the total dry weight of the adhesive sealant composition.
  • the adhesive sealant composition comprises a fatty acid alkyl ester.
  • the fatty acid alkyl ester modifies the rheological and curing properties of the composition and provides a composition having suitable properties across the entire range of temperatures in which the composition must be applicable, i.e. from -15 °C to 40 °C.
  • the fatty acid alkyl ester is preferably obtained by transesterification of a naturally occurring triglyceride with methanol or ethanol, since all required reagents are obtainable from renewable sources.
  • the fatty acid alkyl ester is preferably a fatty acid methyl ester (FAME) such as rapeseed oil methyl ester (RME).
  • the fatty acid methyl ester may constitute from about 5% to about 20% of the total dry weight of the adhesive sealant composition, such as from about 6% to about 15%, from about 7% to about 10%, such as about 8% of the total dry weight of the adhesive sealant composition.
  • Water scavengers react with moisture to prevent premature curing of the silane modified polymer, thus tailoring the curing properties of the SMP composition and increasing the shelf life and time-to-perish of the composition.
  • water scavengers (W) are vinylsilanes such as vinyltrimethoxysilane, vinyltriethoxysilane and vinylmethyldimethoxysilane.
  • silanes such as (trimethoxysilyl)benzene, O- methylcarbamatomethylmethyldimethoxysilane, O-methylcarbamatomethyltrimethoxysilane, O-ethylcarbamatomethylmethyldiethoxysilane, O-ethyl-carbamatomethyltriethoxysilane, 3- methacryloyloxy-propyltrimethoxysilane, methacryloyloxymethyltrimethoxysilane,
  • methacryloyloxymethylmethyldimethoxysilane methacryloyloxymethyltriethoxysilane, methacryloyloxymethylmethyldiethoxysilane, 3-acryloyloxypropyltrimethoxysilane, acryloyloxymethyltrimethoxysilane, acryloyloxymethylmethyldimethoxysilane,
  • acryloylmethyltriethoxysilane and acryloyloxymethylmethyldiethoxysilane.
  • Even some rapidly hydrolysable non-silane organic compounds such as ortho esters, (e.g. 1,1,1- trimethoxyethane, 1,1,1-triethoxyethane, trimethoxymethane, triethoxymethane) may be utilized.
  • Vinyltrimethoxysilane is the preferred water scavenger.
  • the water scavenger may constitute from about 1% to about 5% of the total dry weight of the adhesive sealant composition, such as from about 2% to about 4%, or from about 2% to about 3% of the total dry weight of the adhesive sealant composition.
  • the hardener promotes curing of the adhesive sealant composition.
  • Dedicated hardeners such as metal curing catalysts may be used.
  • metal curing catalysts are known in the art and include tetraalkyl titanate esters and dialkyltin complexes.
  • the adhesive sealant composition is preferably free of metal curing catalyst. In such a case, a metal-free hardener such as an amine may be used.
  • Dedicated organic amine hardeners include triethylamine, tributylamine, l,4-diazabicyclo[2,2,2]octane, l,5-diazabicyclo[4.3.0]-non-5-ene, 1,8- diazabicyclo[5.4.0]undec-7-ene, N,N-bis(N,N-dimethyl-2-aminoethyl)methylamine, N,N- dimethylcyclohexylamine, N,N-dimethylphenylamine, N,N,N',N'-Tetramethyiguanidine, and N- ethylmorpholinine.
  • aminosilanes have a dual function and act not only as hardeners, but also as adhesion promoters.
  • Suitable aminosilanes include 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- aminopropylmethyldimethoxysilane, 3-aminopropylmethyldiethoxysilane, N-(2-aminoethyl)-3- aminopropyltrimethoxysilane, N-(2-aminoethyl)-3-aminopropyltriethoxysilane, N-(2- aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3- aminopropyltriethoxysilane, 3-(2-Aminoethylamino)propyldimethoxymethylsilane,
  • the hardener is preferably 3-aminopropyltrimethoxysilane.
  • the hardener may constitute from about 0.3% to about 5% of the total dry weight of the adhesive sealant composition, such as from about 0.4% to about 3%, from about 0.5% to about 2%, or from about 0.6% to about 1% of the total dry weight of the adhesive sealant composition.
  • the adhesive sealant composition comprises at least a first filler and optionally further fillers.
  • the fillers may be selected from fillers known in the art, including but not limited to calcium carbonate, calcium sulfate, barium sulfate, aluminium silicate, kaolin, magnesium sulfate, magnesium hydroxide, microplastic, silicon dioxide (e.g. fumed silica or precipitated silica) and titanium dioxide.
  • the term calcium carbonate is intended to encompass all calcium-containing carbonate minerals, such as dolomite, as well as precipitated calcium carbonates.
  • the adhesive sealant composition preferably comprises a filler composition comprising two fillers: a first filler such as a ground calcium carbonate (dolomite) and a second filler such as silicon dioxide or precipitated calcium carbonate.
  • the weight ration of the first filler to the second filler may be from about 30:1 to about 1:30, such as from about 20:1 to about 1:20, such as from about 10:1 to about 1:1, such as about 5:1.
  • the filler composition may constitute from about 60% to about 75% of the total dry weight of the adhesive sealant composition, such as from about 60% to about 70% of the total dry weight of the adhesive sealant composition.
  • the adhesive sealant composition includes one or more plasticizers.
  • Plasticizers assist in tuning the rheological properties of the composition.
  • the plasticizer may be a phthalate ester such as dioctyl phthalate, diisooctyl phthalate or diundecyl phthalate.
  • non-phthalate plasticizers are preferred.
  • Such non-phthalate plasticizers include esters (such as adipic esters, benzoic esters, glycol esters, alkanediol esters, phosphoric esters, sulfonic esters and polyesters) and polyethers (such as polyethyleneglycol and polypropyleneglycol). Esters of alkane diols, such as 1,2-cyclohexane dicarboxylic acid diisononyl ester are preferred.
  • a thickener may be used instead of a plasticizer to tune the rheological properties of the adhesive composition.
  • Suitable thickeners are known in the art, and may for example be silicon dioxides (such as fumed or precipitated silica), hydrogenated castor oil or micronised amide modified hydrogenated castor oil.
  • the plasticizer or thickener may constitute from about 5% to about 15% of the total dry weight of the adhesive sealant composition, such as from about 10% to about 13% of the total dry weight of the adhesive sealant composition.
  • the adhesive sealant composition may comprise further constituents as known in the art. Such constituents may include further silane modified polymers, water scavengers, hardeners, adhesion promoters, fillers, plasticizers or rheology modifiers. Further potentially suitable constituents for utilization in an adhesive sealant composition include but are not limited to pigments, flame retardants and stabilizers.
  • the adhesive sealant composition may include an antioxidant.
  • a suitable antioxidant may be a sterically hindered phenolic antioxidant such as alkyl esters of 3,5-di-t-butyl-4-hydroxy-benzoic acid.
  • the adhesive sealant composition does not require solvent for correct hardening and is preferably free of solvent. However, the composition may comprise small amounts of solvent if desired, up to for example 10% relative to the total dry weight, in order to tailor the hardening and rheological properties.
  • the adhesive sealant composition described herein may be used to produce a platform floor by joining together a plurality of chipboard panels as described above. It is understood that when it is stated that when the chipboard panels are joined together by the adhesive sealant composition, the adhesive sealant composition is in a partially-cured or fully-cured state, i.e. the nature of the initial components has been altered by the moisture curing process.
  • test compositions were produced differing only by a single test component.
  • the test compositions all had the base formulation as shown in Table 1 below.
  • Plasticizer Hexamoll Dinch BASF SE 1,2-Cyclohexane dicarboxylic acid 12
  • Antioxidant Irganox 1135 BASF SE Alkyl esters of 3,5-te/T-butyl 4- 0.2
  • test components evaluated were:
  • Test composition A Mesamoll (alkylsulphonic acid ester with phenol, Lanxess);
  • Test composition B Hexamoll Dinch (1,2-Cyclohexane dicarboxylic acid diisononyl ester, BASF SE);
  • Test composition C Dowfax Defoamer DF143 (polypropylene glycol butyl ether, Dow
  • Test composition D - RME rapeseed oil methyl esters
  • test composition B comprising Hexamoll Dinch displayed a satisfactory viscosity and cured at an acceptable rate at room temperature (as exemplified by skin formation time and through curing time). However, this test composition was excessively viscous and excessively slow to cure at -15 °C.
  • the test compositions A and C comprising Mesamoll or Dowfax Defoamer DF143 displayed suitable curing properties both at room temperature and at -15 °C. However, these test compositions displayed high viscosities at room temperature, and excessively high viscosities at -15°C. This means that these test compositions would be difficult to work with at -15 °C.
  • the test composition D comprising RME is the only composition displaying suitable viscosity as well as suitable curing at room temperature and -15 °C.
  • test composition E was evaluated, wherein RME was used not only as the test component, but was also used to replace the plasticizer (i.e. no plasticizer other than RME). It was found that this composition lacking plasticizer had inferior storage stability, as evidenced by an approximately four-fold decrease in viscosity upon storage for two months. It was also noted that this test composition, when cured, was much harder than test composition D comprising both plasticizer and RME. Although not evaluated, this will likely result in test composition E having a much higher risk of floor creak as compared to test composition D.
  • compositions have a viscosity in excess of 500 000 mPa.s. at -15 °C, potentially making them difficult to apply with a conventional skeleton gun for adhesive application. Even the best performing prior art adhesive sealant with regard to viscosity variation (Novi Pro)
  • Sponplatelim demonstrates a 130% increase in viscosity between 20 °C and -15 °C.
  • the worst performing prior art compositions demonstrate in excess of a 10-fold increase in viscosity between 20 °C and -15 °C.
  • the SMP-based test composition has a well-balanced viscosity profile and has less than an 80% increase in viscosity between 20 °C and -15 °C.
  • the SMP-based test composition comprising RME demonstrates consistent and well-balanced properties across the applicable range of temperatures, from -15 °C to 40 °C.

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Abstract

The present disclosure relates to the use of a silane modified polymer in an adhesive sealant composition for application to chipboard flooring joints requiring adhesion in potentially sub- zero outdoor weather conditions. The disclosure also relates to use of a fatty acid alkyl ester as a curing promoter in an adhesive sealant composition comprising silane modified polymer. The disclosure further relates to an adhesive sealant composition for application to chipboard flooring joints requiring adhesion in sub-zero outdoor weather conditions. The composition comprises silane modified polymer and fatty acid alkyl ester.

Description

Adhesive sealant composition
TECHNICAL FIELD
The present invention relates to an adhesive sealant composition for application to chipboard flooring joints requiring adhesion in sub-zero outdoor weather conditions, as well as floors formed from floor panels joined by such a composition. The invention further relates to the use of a silane modified polymer in such a composition, as well as the use of a fatty acid alkyl ester as a curing promoter in adhesive sealant compositions comprising silane modified polymer.
BACKGROUND ART
In Norway, health and safety conventions during building construction typically require installation of an internal floor as a working platform on the floor joists of each storey before proceeding with construction of the next storey. Such internal floors are termed platform floors (NO: "plattformgulv"). Because platform floors are typically installed during ongoing construction and prior to installation of a roof or covering on the building, the platform floors are exposed to weather conditions typical of the Norwegian climate, which may entail sub zero temperatures (i.e. less than zero degrees Celsius), as well as significant amounts of precipitation in the form of rain and snow.
In order to address the challenging conditions that platform floors are routinely exposed to, the floors are typically constructed of chipboard panels treated with a water-resistant or waterproof coating on the side of the panel intended to face upwards after installation. The panels are provided with a tongue-and-groove profile on each edge in order to provide a mechanically strong joint between each panel. These joint profiles are not treated with the water-resistant or waterproof coating of the upper surface. Therefore, in order to strengthen the joint and prevent impregnation of water into the joint after installation, an adhesive sealant is typically applied in the joint during installation. In order to strengthen the fixation of the floor panels to the floor joists, the same adhesive sealant is also typically applied along the floor joists prior during installation of the floor panel. The floor panels are then typically screwed or nailed onto the floor joist.
The adhesive sealant used in installation of platform flooring caters to a very specific application since it is required to provide excellent adhesion and sealing whilst fulfilling the requirement of being able to tolerate and harden in moist and cold conditions. Regular wood glues or adhesive sealants do not generally meet these requirements, and therefore most adhesive and sealant companies market an adhesive sealant tailored to the specific
application. Such adhesive sealants are typically termed chipboard adhesives (NO:
"sponplattelim"). Herein and henceforth, adhesive sealants suitable for the above-described application may be termed chipboard adhesives. Note however that such adhesive sealants differ greatly from other products marketed as chipboard adhesive in non-Norwegian markets.
Chipboard adhesives formulated for this specific application are nearly without exception solvent-based synthetic rubber dispersions, and harden by drying (i.e. evaporation of the solvent). Examples of such adhesives include Essve Sponplattelim Original, Casco
Sponplatelim, Bostik Spanplattelim 2511, Motek Spanplattelim PRO+, Soudal Sponplatelim, Optimera Novi Pro Sponplatelim and Sika SikaBond 510 sponplatelim.
There remains a need for improved adhesive sealant compositions for application to chipboard flooring joints requiring adhesion in sub-zero outdoor weather conditions.
SUMMARY OF THE INVENTION
The inventors of the present invention have identified a number of shortcomings in prior art sealant adhesives for the application described. It is important that the adhesive sealants display consistent and predicable performance, and can be used and hardened across a wide range of temperatures, from about -15 °C to about 40 °C.
Prior-art solvent-based adhesive sealants have a viscosity that varies widely depending on temperature and in some cases may differ more than 10-fold between 40 °C and -15 °C. This leads to inconsistent properties, and for example may lead to the sealant adhesive being difficult to apply with a conventional skeleton pistol at cold temperatures, but being excessively fluid at warm temperatures. The properties and performance of prior-art solvent-based adhesive sealants may vary greatly from batch to batch. This may be due to the fact that even a small variation in solvent amount may lead to a large variation in properties such as viscosity, together with common variations in batch composition. For example, at -15 °C the measured viscosity may differ by a factor of three between batches of the same adhesive sealant.
Solvent-based adhesive sealants typically dry rapidly and have a skin formation time of only a few minutes, regardless of application temperature. This means that the compositions harden rapidly, which may impede correct fitting of the tongue-and-groove joints, or may impede the builder when attempting to screw or nail the floor panel tightly to the floor joist. Moreover, the rapid drying of the compositions means that the composition spoils rapidly once opened, and an opened tube of adhesive sealant must therefore be consumed rapidly.
Solvent-based adhesive sealants typically comprise more than 20% by weight of one or more solvents. In many cases these solvents may be carcinogens or suspected carcinogens and are detrimental to the health of the builder installing the flooring panels. The builder installing flooring panels does not typically use a mask capable of filtering the volatile solvents and therefore occupational exposure to the solvents is high. Moreover, the use of volatile solvents means that the adhesive sealants continue to emit a strong odour long after they have hardened.
Finally, the inventors of the present invention have understood the potential role that the adhesive sealant could play with regard to resolving a problem commonly occurring with the floors, namely creaking. Platform floors have a tendency to start creaking some time after installation, generally within one year of installation. It is thought that this may be due to a number of factors, including shrinkage or faulty installation of joists, or insufficient gluing, screwing or nailing or floor panels. See report no. 722.525 (2008) from the research institute SINTEF Byggforsk for further discussion of this problem. The inventors of the present invention have realised that an adhesive sealant having superior properties to those traditionally used could assist in compensating at least partially for one or more of these factors. It is an object of the present invention to achieve an adhesive sealant composition that overcomes or alleviates at least some of the above-mentioned shortcomings. In particular, it is an object of the present invention to enable a less hazardous adhesive sealant composition that provides consistently excellent performance, even when used in inclement conditions.
These objects are achieved by use of a silane modified polymer as defined in the appended independent claims. The silane modified polymer (SMP) is used in an adhesive sealant composition for the specific application as described herein, i.e. for application to chipboard flooring joints requiring adhesion in potentially sub-zero outdoor weather conditions. By "adhesive sealant composition for application to chipboard flooring joints", it is meant a "sponplattelim" in accord with Norwegian "plattformgulv" construction practice, as described above. By "requiring adhesion in potentially sub-zero outdoor weather conditions" it is meant that it is a requirement that the product is capable of being used even if the prevailing weather conditions are sub-zero. A tradesman choosing a suitable "sponplattelim" adhesive sealant to use for the construction of "plattformgulv" flooring must be confident that the product will perform satisfactorily in all temperatures, if there is any risk at all of such temperatures occurring during application. The actual use may however take place in sub zero, or non-sub-zero conditions, depending on the temperature prevailing at the exact moment of application. The silane modified polymer may be any silane modified polymer discussed in conjunction with adhesive sealant compositions below. The adhesive sealant composition may be an adhesive sealant composition as described herein and/or as defined in the appended independent claims.
The use of an SMP in the adhesive sealant composition facilitates resolution or amelioration of substantially all of the shortcomings in the prior art as described above. Using an SMP, a solvent-free adhesive sealant composition may be formulated. Due to the use of an SMP, the adhesive sealant composition may be formulated to have properties that are more consistent across the entire range of temperatures that the composition is required to be utilized in. For example, the composition may be formulated to have a viscosity that varies less than three fold between 40 °C and -15 °C. Since the viscosity depends on the bulk properties of the composition as a whole, more consistent viscosity between batches is obtained. Adhesive sealant compositions utilizing SMP have a much longer hardening time, regardless of temperature, which means that the composition keeps for longer once opened and does not obstruct the builder when fitting, screwing or nailing the floor panels. Because SMP is moisture-curing and is not dependent on drying for hardening, the adhesive sealant composition may be formulated using only non-volatiles (i.e. solvent-free). This means less occupational exposure to volatiles, no persistent odour, and potentially fewer problems with shrinkage. The excellent elasticity of SMP-based compositions means that all contact between the floor panels and joists will be well-cushioned, leading to a lesser propensity to creak.
SMP-based adhesives and sealants have been known for approximately 40 years, but hitherto there has not been an adhesive sealant tailored, used or marketed for the particular application as described herein. This is despite the fact that essentially all major adhesive and sealant manufacturers in the Norwegian market have a (solvent-based) product formulated and marketed towards this specific application. We can only speculate as to the reasons why this is so.
Foremost is probably a lack of recognition of the potential role that the adhesive sealant may play in assisting reduction of creaking. Creaking is due to a complex interplay of several components: the floor panels, the joists and the screws/nails, all of which may be provided by different suppliers. It is probable that the role that the adhesive sealant may play in assisting prevention of creaking has been overlooked in the field due to a focus on the components that actually cause the creaking, i.e. the joists, floor panels and screws/nails. See report no.
722.525 (2008) from SINTEF Byggforsk.
Furthermore, the application in question requires large quantities of adhesive sealant, approximately one litre per 10 m2 of floor. Therefore, cost of the adhesive sealant has potentially been a determining factor. SMP adhesive formulations are generally considered in the art to be relatively expensive and have typically been used in niche, high-end applications where cost is not a determining factor. Therefore, it is possible that SMP-based formulations have for this reason not been considered, or have been dismissed out of hand. Finally, there possibly also has been question marks over whether an SMP-based product can withstand exposure to, or cure during exposure to, the weather conditions prevalent under a typical Norwegian winter. With regard to this matter, SMP-based products are generally considered to thicken substantially in cold weather, which could raise questions regarding to their usability during Norwegian winters. According to another aspect of the invention, the objects of the invention are obtained by using a fatty acid alkyl ester (FAAE) as a curing promoter in an adhesive sealant composition comprising silane modified polymer, as defined in the appended independent claims. The adhesive sealant composition may be an adhesive sealant composition as described herein and/or as defined in the appended independent claims.
By using a FAAE as a curing promoter, a number of effects are surprisingly obtained. The FAAE acts to modify the rheological properties of the composition, providing a composition having a suitable viscosity across the range of temperatures from -15 °C to 40 °C. More surprisingly, the FAAE promotes curing of the composition (as compared to compositions comprising other rheology modifiers instead of FAAE). The curing effect is notable at room temperature and is prominent even at temperatures as low as -15 °C. The provision of both excellent rheological properties and excellent curing across the entire applicable temperature range is to our knowledge unique, and makes FAAE extremely well suited for use in the present application. The inclusion of a fatty acid alkyl ester is especially advantageous when seeking to promote curing of the adhesive sealant composition at temperatures below 0 °C.
The fatty acid alkyl ester may be a fatty acid methyl ester, and is preferably rapeseed methyl ester (RME). RME is derived from renewable sources, is cheap and is widely available.
Moreover, RME provides the adhesive sealant with good rheological and curing properties across the entire range of application temperatures.
According to a further aspect of the invention, the objects of the invention are obtained by an adhesive sealant composition according to the appended claims. The adhesive sealant composition is suitable for use in the application described herein, i.e. suitable for application to chipboard flooring joints requiring adhesion in sub-zero outdoor weather conditions. The adhesive sealant composition comprises: a) 5% - 30% of a silane modified polymer;
b) 1% - 5% of a water scavenger;
c) 0.3 - 5% of a hardener;
d) 5% - 15% of a plasticizer;
e) 60% - 75% of a filler composition; and
f) 5% - 20% of a fatty acid alkyl ester. The given percentages are expressed as percent by weight relative to the total dry weight of the composition. The total dry weight of the composition amounting to 100 percent.
For example, the adhesive sealant composition may comprise: a) 5% - 18% of a silane modified polymer; and/or
b) 2% - 3% of a water scavenger; and/or
c) 0.5 - 2% of a hardener; and/or
d) 5% - 15% of a plasticizer; and/or
e) 60% - 75% of a filler composition; and/or
f) 5% - 15% of a fatty acid alkyl ester. The adhesive sealant composition yields the advantages as previously described herein in relation to the use of a SMP in an adhesive sealant composition for application to chipboard flooring joints requiring adhesion in potentially sub-zero outdoor weather conditions, as well as the advantages as described in relation to the use of a fatty acid alkyl ester as a curing promoter in an adhesive sealant composition comprising silane modified polymer. As previously discussed, the fatty acid alkyl ester may be a fatty acid methyl ester, preferably rapeseed methyl ester (RME).
The silane modified polymer may be a silane terminated polymer, preferably a silylcarbamate- terminated polyether, most preferably a dimethoxy(methyl)silylmethyl carbamate-terminated polyether. Such polymers have excellent moisture curing properties and cure without requiring a dedicated catalyst such as a tin or titanium catalyst. The adhesive sealant composition may therefore be free of a metal catalyst, which is environmentally
advantageous.
The hardener may be a combined hardener and adhesion promoter, i.e. promoting the moisture curing of the composition, as well as promoting the adhesion of the polymer to filler and/or substrate. The combined hardener and adhesion promoter may be an aminosilane, such as an aminoalkyl trialkoxysilane, most preferably 3-aminopropyltrimethoxysilane.
The water scavenger may be a silane, such as a vinyl trialkoxysilane, most preferably vinyltrimethoxysilane. Such water scavengers have been shown to provide adequate product shelf life and curing properties. The plasticizer may be a non-phthalate ester plasticizer, preferably 1,2-cyclohexane dicarboxylic acid diisononyl ester.
The filler composition may comprises a first filler and a second filler. In such a case, the first filler may be a ground calcium carbonate, preferably ground dolomite. Alternatively, or in addition, the second filler may be silicon dioxide or a precipitated calcium carbonate. The use of multiple fillers allows tailoring of the rheological properties of the composition across the applicable temperature range.
The weight ration of the first filler to the second filler may be from about 20:1 to about 1:20, preferably from about 10:1 to about 1:1, such as about 5:1.
The adhesive sealant composition may further comprise one or more further substances customary in the field of adhesive sealant compositions, such as an antioxidant, preferably a sterically-hindered phenolic antioxidant. This assists in stabilizing the adhesive sealant composition.
The adhesive sealant composition may be solvent-free. Use of a moisture-curing mechanism means that no drying is required and therefore no volatile solvents are required in the composition. However, the composition may comprise non-volatile rheology modifiers such as oils.
According to yet another aspect of the invention, the objects of the invention are obtained by a chipboard floor as defined in the appended independent claims. The chipboard floor comprises at least two chipboard panels joined together by an adhesive sealant composition as described herein.
Further objects, advantages and novel features of the present invention will become apparent to one skilled in the art from the following detailed description.
BRIEF DESCRIPTION OF THE DRAWINGS
For a fuller understanding of the present invention and further objects and advantages of it, the detailed description set out below should be read together with the accompanying drawings, in which the same reference notations denote similar items in the various diagrams, and in which:
Fig la schematically illustrates application of adhesive sealant composition to the floor joists and profile edges of floor panels during installation of platform flooring;
Fig lb schematically illustrates fixing of the floor panels to the floor joists by screws during installation of platform flooring; and
Fig lc schematically illustrates removal of excess adhesive during installation of
platform flooring.
The drawings shall not be considered drawn to scale as some features may be exaggerated in order to more clearly illustrate certain features.
DETAILED DESCRIPTION
The present invention relates to an adhesive sealant composition for use in installing platform floors. Platform floors are floor panels, typically constructed of chipboard waterproofed on the side to be installed facing upwards, which are installed for practical and safety purposes during building construction in Norway. Since platform floors are installed prior to the building being made weathertight, they are exposed to the ambient weather conditions such as rain, snow and frost. If the floor is non-optimally installed it may take up excessive amounts of moisture and upon drying start to creak. A primary function of the adhesive composition of the present invention is to prevent the platform floors from creaking. This may for example be provided by: improved sealing, i.e. preventing water permeation; improved adhesion, i.e. preventing gaps from opening between joints or between the floor panels and the joists; and/or improved cushioning, i.e. providing an elastic bed to counteract movement of the floor panel.
Installation of platform flooring A typical installation procedure for installation of a platform floor is described below with reference to Figures la-lc. The installation procedure for platform floors is more-or-less the same, regardless of manufacturer, and the installation instructions provided by the two largest platform floor suppliers in Norway, Arbor and Forestia, are very similar. Both sets of instructions note that platform floors may be exposed to precipitation during the construction period. Excess water or ice should be removed from floor joists prior to installing the platform floor. Both sets of instructions also note that the adhesive used should be able to tolerate the climatic conditions prevailing during installation.
Figures la-lc illustrate a typical installation procedure. Two beads of adhesive (3) are applied along the entire length of each floor joist (5), and a further single bead of adhesive (7) is applied along the entire length of each profiled edge of each floor panel (9) (Fig. la). The tongue-and-groove joints are formed by insertion of the cooperating profile edges of the floor panels into each other, and fixed to the floor joist by the adhesive (3). The floor panels are further fixed to the joists by inserting screws (11) through the floor panels (9) and into the floor joist (5) along each profile edge (Fig. lb). After screwing of the floor panels (9), excess adhesive (13) is removed from each joint, leaving an adhesive-sealed joint (15) (Fig. lc).
Adhesive sealant composition
The adhesive sealant composition comprises a silane modified polymer, a water scavenger, a hardener, a filler composition, and a fatty acid alkyl ester. The composition also preferably comprises a plasticizer or thickener to modify the rheological properties of the composition, and a stabilizer such as an antioxidant.
Silane modified polymers, also known as hybrid polymers, are polymers comprising silane pendant or terminal groups. They cure by reaction with ambient moisture to form siloxane linkages between polymer chains. The polymer backbone may be a polyester, polyether, polyalkylene or polyacrylate. A linear polyether such as polypropylene oxide is preferred. The terminal silane groups may be trialkoxysilane groups, trialkylsilane groups or
alkyldialkoxysilane groups. The silane groups may be attached to the polymer backbone by a linker, such as an alkyl, alkylcarbamate or alkylcarbamide linker. The silane modified polymer is preferably a silylcarbamate-terminated polyether, most preferably a
dimethoxy(methyl)silylmethyl carbamate-terminated polypropylene oxide. Suitable polymers are commercially available from Wacker Chemie AG or Kaneka Corporation.
The silane modified polymer may constitute from about 5% to about 30% of the total dry weight of the adhesive sealant composition, such as from about 6% to about 20%, from about 7% to about 18%, from about 8% to about 15%, or from about 9% to about 11% of the total dry weight of the adhesive sealant composition.
The adhesive sealant composition comprises a fatty acid alkyl ester. The fatty acid alkyl ester modifies the rheological and curing properties of the composition and provides a composition having suitable properties across the entire range of temperatures in which the composition must be applicable, i.e. from -15 °C to 40 °C. The fatty acid alkyl ester is preferably obtained by transesterification of a naturally occurring triglyceride with methanol or ethanol, since all required reagents are obtainable from renewable sources. The fatty acid alkyl ester is preferably a fatty acid methyl ester (FAME) such as rapeseed oil methyl ester (RME).
The fatty acid methyl ester may constitute from about 5% to about 20% of the total dry weight of the adhesive sealant composition, such as from about 6% to about 15%, from about 7% to about 10%, such as about 8% of the total dry weight of the adhesive sealant composition.
Water scavengers react with moisture to prevent premature curing of the silane modified polymer, thus tailoring the curing properties of the SMP composition and increasing the shelf life and time-to-perish of the composition. Examples of water scavengers (W) are vinylsilanes such as vinyltrimethoxysilane, vinyltriethoxysilane and vinylmethyldimethoxysilane. However, other silanes may be utilized, such as (trimethoxysilyl)benzene, O- methylcarbamatomethylmethyldimethoxysilane, O-methylcarbamatomethyltrimethoxysilane, O-ethylcarbamatomethylmethyldiethoxysilane, O-ethyl-carbamatomethyltriethoxysilane, 3- methacryloyloxy-propyltrimethoxysilane, methacryloyloxymethyltrimethoxysilane,
methacryloyloxymethylmethyldimethoxysilane, methacryloyloxymethyltriethoxysilane, methacryloyloxymethylmethyldiethoxysilane, 3-acryloyloxypropyltrimethoxysilane, acryloyloxymethyltrimethoxysilane, acryloyloxymethylmethyldimethoxysilane,
acryloylmethyltriethoxysilane and acryloyloxymethylmethyldiethoxysilane. Even some rapidly hydrolysable non-silane organic compounds such as ortho esters, (e.g. 1,1,1- trimethoxyethane, 1,1,1-triethoxyethane, trimethoxymethane, triethoxymethane) may be utilized. Vinyltrimethoxysilane is the preferred water scavenger.
The water scavenger may constitute from about 1% to about 5% of the total dry weight of the adhesive sealant composition, such as from about 2% to about 4%, or from about 2% to about 3% of the total dry weight of the adhesive sealant composition.
The hardener promotes curing of the adhesive sealant composition. Dedicated hardeners such as metal curing catalysts may be used. Such metal curing catalysts are known in the art and include tetraalkyl titanate esters and dialkyltin complexes. However, the adhesive sealant composition is preferably free of metal curing catalyst. In such a case, a metal-free hardener such as an amine may be used. Dedicated organic amine hardeners include triethylamine, tributylamine, l,4-diazabicyclo[2,2,2]octane, l,5-diazabicyclo[4.3.0]-non-5-ene, 1,8- diazabicyclo[5.4.0]undec-7-ene, N,N-bis(N,N-dimethyl-2-aminoethyl)methylamine, N,N- dimethylcyclohexylamine, N,N-dimethylphenylamine, N,N,N',N'-Tetramethyiguanidine, and N- ethylmorpholinine. The use of an aminosilane as hardener is advantageous since aminosilanes have a dual function and act not only as hardeners, but also as adhesion promoters. Suitable aminosilanes include 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- aminopropylmethyldimethoxysilane, 3-aminopropylmethyldiethoxysilane, N-(2-aminoethyl)-3- aminopropyltrimethoxysilane, N-(2-aminoethyl)-3-aminopropyltriethoxysilane, N-(2- aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3- aminopropyltriethoxysilane, 3-(2-Aminoethylamino)propyldimethoxymethylsilane,
cyclohexylaminomethyltriethoxysilane, cyclohexylaminomethylmethyldiethoxysilane, cyclohexylaminomethyltriethoxysilane, 3-cyclohexylaminomethyltrimethoxysilane,
cyclohexylaminomethyltrimethoxysilane, and cyclohexylaminomethylmethyldimethoxysilane. The hardener is preferably 3-aminopropyltrimethoxysilane.
The hardener may constitute from about 0.3% to about 5% of the total dry weight of the adhesive sealant composition, such as from about 0.4% to about 3%, from about 0.5% to about 2%, or from about 0.6% to about 1% of the total dry weight of the adhesive sealant composition.
The adhesive sealant composition comprises at least a first filler and optionally further fillers. The fillers may be selected from fillers known in the art, including but not limited to calcium carbonate, calcium sulfate, barium sulfate, aluminium silicate, kaolin, magnesium sulfate, magnesium hydroxide, microplastic, silicon dioxide (e.g. fumed silica or precipitated silica) and titanium dioxide. The term calcium carbonate is intended to encompass all calcium-containing carbonate minerals, such as dolomite, as well as precipitated calcium carbonates. The adhesive sealant composition preferably comprises a filler composition comprising two fillers: a first filler such as a ground calcium carbonate (dolomite) and a second filler such as silicon dioxide or precipitated calcium carbonate. The weight ration of the first filler to the second filler may be from about 30:1 to about 1:30, such as from about 20:1 to about 1:20, such as from about 10:1 to about 1:1, such as about 5:1.
The filler composition may constitute from about 60% to about 75% of the total dry weight of the adhesive sealant composition, such as from about 60% to about 70% of the total dry weight of the adhesive sealant composition.
The adhesive sealant composition includes one or more plasticizers. Plasticizers assist in tuning the rheological properties of the composition. The plasticizer may be a phthalate ester such as dioctyl phthalate, diisooctyl phthalate or diundecyl phthalate. However, non-phthalate plasticizers are preferred. Such non-phthalate plasticizers include esters (such as adipic esters, benzoic esters, glycol esters, alkanediol esters, phosphoric esters, sulfonic esters and polyesters) and polyethers (such as polyethyleneglycol and polypropyleneglycol). Esters of alkane diols, such as 1,2-cyclohexane dicarboxylic acid diisononyl ester are preferred.
A thickener may be used instead of a plasticizer to tune the rheological properties of the adhesive composition. Suitable thickeners are known in the art, and may for example be silicon dioxides (such as fumed or precipitated silica), hydrogenated castor oil or micronised amide modified hydrogenated castor oil.
The plasticizer or thickener may constitute from about 5% to about 15% of the total dry weight of the adhesive sealant composition, such as from about 10% to about 13% of the total dry weight of the adhesive sealant composition.
The adhesive sealant composition may comprise further constituents as known in the art. Such constituents may include further silane modified polymers, water scavengers, hardeners, adhesion promoters, fillers, plasticizers or rheology modifiers. Further potentially suitable constituents for utilization in an adhesive sealant composition include but are not limited to pigments, flame retardants and stabilizers. For example, the adhesive sealant composition may include an antioxidant. A suitable antioxidant may be a sterically hindered phenolic antioxidant such as alkyl esters of 3,5-di-t-butyl-4-hydroxy-benzoic acid. The adhesive sealant composition does not require solvent for correct hardening and is preferably free of solvent. However, the composition may comprise small amounts of solvent if desired, up to for example 10% relative to the total dry weight, in order to tailor the hardening and rheological properties.
Platform floor
The adhesive sealant composition described herein may be used to produce a platform floor by joining together a plurality of chipboard panels as described above. It is understood that when it is stated that when the chipboard panels are joined together by the adhesive sealant composition, the adhesive sealant composition is in a partially-cured or fully-cured state, i.e. the nature of the initial components has been altered by the moisture curing process.
Examples
Evaluation of various components in the adhesive sealant
In order to investigate how a variety of potential components may affect the properties of an adhesive sealant composition, a number of test compositions were produced differing only by a single test component. The test compositions all had the base formulation as shown in Table 1 below.
Table 1: Base formulation of test compositions
Component Name and supplier Structure Amount
(wt%) Silane Geniosil STP-E10, Wacker Dimethoxy(methyl)silylmethyl 10 modified Chemie AG carbamate-terminated
polymer polypropylene glycol
1st Filler Myanit 0-30, Bjorka Ground dolomite (calcium 56
Mineral AB magnesium carbonate)
2nd filler Socal U1S1, Solvay Precipitated calcium carbonate 11
Plasticizer Hexamoll Dinch, BASF SE 1,2-Cyclohexane dicarboxylic acid 12
diisononyl ester
Water Geniosil XL-10, Wacker Vinyltrimethoxysilane 2 scavenger Chemie AG
Hardener / Geniosil GF-96, Wacker 3-Aminopropyltrimethoxysilane 0.6 adhesion Chemie AG
promoter
Antioxidant Irganox 1135, BASF SE Alkyl esters of 3,5-te/T-butyl 4- 0.2
hydroxy benzenepropanoic acid
Test 8 component
Total 100
The test components evaluated were:
Test composition A - Mesamoll (alkylsulphonic acid ester with phenol, Lanxess);
Test composition B - Hexamoll Dinch (1,2-Cyclohexane dicarboxylic acid diisononyl ester, BASF SE);
Test composition C - Dowfax Defoamer DF143 (polypropylene glycol butyl ether, Dow
Chemical); and
Test composition D - RME (rapeseed oil methyl esters).
The results obtained for the test compositions are shown in Table 2 below. Table 2: Properties of Test Compositions
Test Composition A B C D
Mesamoll Hexamoll Dinch Dowfax RME
Defoamer
Property DF143
Skin formation time (min)
• 21°C/40% RH 77 87 64 64
• -15°C 210 346 202 215
Through curing time
(mm/day)
• 21°C/40% RH 2,5 2,5 3 3
• -15°C 1 0,5 1 1 Viscosity (mPa.s.)
• 23°C 213 400 108 500 183 100 88 600
• -15°C 1 566 700 1 521 600 973 700 637 800
It can be seen that test composition B comprising Hexamoll Dinch displayed a satisfactory viscosity and cured at an acceptable rate at room temperature (as exemplified by skin formation time and through curing time). However, this test composition was excessively viscous and excessively slow to cure at -15 °C. The test compositions A and C comprising Mesamoll or Dowfax Defoamer DF143 displayed suitable curing properties both at room temperature and at -15 °C. However, these test compositions displayed high viscosities at room temperature, and excessively high viscosities at -15°C. This means that these test compositions would be difficult to work with at -15 °C. The test composition D comprising RME is the only composition displaying suitable viscosity as well as suitable curing at room temperature and -15 °C.
A further test composition E was evaluated, wherein RME was used not only as the test component, but was also used to replace the plasticizer (i.e. no plasticizer other than RME). It was found that this composition lacking plasticizer had inferior storage stability, as evidenced by an approximately four-fold decrease in viscosity upon storage for two months. It was also noted that this test composition, when cured, was much harder than test composition D comprising both plasticizer and RME. Although not evaluated, this will likely result in test composition E having a much higher risk of floor creak as compared to test composition D.
Comparison with prior art adhesive sealant compositions
The properties of a variety of prior art chipboard adhesive (sponplattelim) compositions were determined and compared to an SMP-based adhesive sealant test composition comprising RME, similar to the test composition D as described above. The results are shown in Table 3 below.
Table 3: Comparison of SMP-based test composition and prior art compositions
Producer ESSVE ESSVE ESSVE Casco Casco Casco
Product Sponplattelim Sponplattelim Sponplattelim Sponplatelim Sponplatelim Sponplatelim Test
Original (Ute) Original (Ute) Original (Ute) Composition
Batch CV00030 BQ00264 CU00118 661101017 661221617 661191217
Vise -15°C 450000 883 000 258 000 1 258 800 968 100 934 300 273 900 (mPas)
Application Ok Ok Ok Sluggish Ok Ok Good by skeleton
gun
Vise 20°C 92 000 107 000 74000 107 600 140000 66000 155 000 (mPas)
Vise 40°C 38 700 56 300 50 700 102 200 118 200 44 700 103 000 (mPas)
Vise 60°C 27 200 52 600 94900 44800 35 000 (mPas)
Oven test Runny Slightly runny Slightly runny Does not run Does not run Does not run Slightly 60 °C runny
Skin form, 5 3 5 1 1 1 40-55 time 23°C
(min)
Skin form, 0-5 0-5 0-5 0-5 0-5 0-5 184 time -15°C
(min)
Dry matter, 84 84 84 63 64 63 100
%
Tensile 2,6 2,05 strength
(N/mm2)
Producer Bostik Bostik Motek Soudal Optimera SIKA
Product Spanplattelim Spanplattelim Spanplattelim Sponplatelim Novi Pro SikaBond 510 Test
2511 2511 PRO+ Sponplatelim Composition
Batch GS16B92186 GS16940227 1611029350 206853431 300253601 1705032859
Vise -15°C 1 308 600 2 550 700 710 700 483 400 306000 1 483 200 273 900 (mPas)
Application Sluggish Sluggish Sluggish Ok Ok Sluggish Good by skeleton
gun
Vise 20°C 186 300 297 600 43 200 136800 132 800 86 000 155 000 (mPas)
Vise 40°C 126900 230 500 60 700 121 100 103 300 68 100 103 000 (mPas)
Vise 60°C 117 700 91 600 55 000 35 000 (mPas)
Oven test Does not run Bubbles / Does not run Does not run Does not run Slightly runny Slightly 60 °C foams runny
Skin form, 3 1 3 3 5 5 40-55 time 23°C
(min)
Skin form, 0-5 0-5 0-5 0-5 0-5 0-5 184 time -15°C
(min)
Dry matter, 76 75 58 78 78 69 100
%
Tensile 2,29 2,24 2,05 strength
(N/mm2) It can be seen that for prior art solvent-based adhesive sealant compositions, the viscosity properties of the compositions can vary significantly between batches. It is thought that the reason for this may be variation in the exact amount or composition of solvent in each batch. Note that although the percentage dry matter is given for each batch, this is taken from the general product specification and has not been measured for each batch.
It can be seen for all prior art solvent-based adhesive sealant compositions that the viscosity varies considerably between warm application temperature (40 °C), room temperature application (20 °C) and cold application temperature (-15 °C). Most of the prior art
compositions have a viscosity in excess of 500 000 mPa.s. at -15 °C, potentially making them difficult to apply with a conventional skeleton gun for adhesive application. Even the best performing prior art adhesive sealant with regard to viscosity variation (Novi Pro
Sponplatelim) demonstrates a 130% increase in viscosity between 20 °C and -15 °C. The worst performing prior art compositions demonstrate in excess of a 10-fold increase in viscosity between 20 °C and -15 °C. In contrast, the SMP-based test composition has a well-balanced viscosity profile and has less than an 80% increase in viscosity between 20 °C and -15 °C.
All of the solvent-based prior art adhesive sealant compositions have a skin formation time of 5 minutes or less, regardless of temperature. This makes them difficult to work with since they may harden before the builder has engaged the tongue-and-groove joints, thus impeding engagement of the joints. Hardened adhesive sealant can also impede fixation of the floor panel to the joist with screws. Furthermore, after fixation with screws excess adhesive should be removed from the floor joint. If excess adhesive is not removed due to premature hardening, this means that any interior flooring subsequently laid upon the platform floor, such as a floating interior parquet, may rest unevenly against the platform floor and therefore may creak. Moreover, the quick-drying nature of prior art products means that they must be consumed rapidly after opening if they are not to perish. The SMP-based test composition on the other hand has a skin formation time of between 40 minutes (23 °C) and approximately 3 hours (-15 °C). This means that the test composition is easier to work with and does not perish so rapidly.
In summary, the SMP-based test composition comprising RME demonstrates consistent and well-balanced properties across the applicable range of temperatures, from -15 °C to 40 °C.

Claims

1. Use of a silane modified polymer in an adhesive sealant composition for application to chipboard flooring joints requiring adhesion in potentially sub-zero outdoor weather conditions.
2. Use according to claim 1, where the chipboard flooring joints require adhesion in sub-zero outdoor weather conditions.
3. An adhesive sealant composition for application to chipboard flooring joints requiring adhesion in sub-zero outdoor weather conditions, the composition comprising:
a) 5% - 30% of a silane modified polymer;
b) 1% - 5% of a water scavenger;
c) 0.3 - 5% of a hardener;
d) 5% - 15% of a plasticizer;
e) 60% - 75% of a filler composition; and
f) 5% - 20% of a fatty acid alkyl ester;
wherein the percentages are expressed as percent by weight relative to the total dry weight of the composition, the total dry weight of the composition amounting to 100 percent.
4. The adhesive sealant composition according to claim 3, wherein the fatty acid alkyl ester is a fatty acid methyl ester, preferably rapeseed methyl ester (RME).
5. The adhesive sealant composition according to any one of claims 3-4, wherein the silane modified polymer is a silane terminated polymer, preferably a silylcarbamate-terminated polyether, most preferably a dimethoxy(methyl)silylmethyl carbamate-terminated polyether.
6. The adhesive sealant composition according to any one of claims 3-5, wherein the water scavenger is a silane water scavenger, preferably a vinyl trialkoxysilane, most preferably vinyltrimethoxysilane.
7. The adhesive sealant composition according to any one of claims 3-6, wherein the hardener is a combined hardener and adhesion promoter, such as an aminosilane, preferably aminoalkyl trialkoxysilane, most preferably 3-aminopropyltrimethoxysilane.
8. The adhesive sealant composition according to any one of claims 3-7, wherein the plasticizer is a non-phthalate ester plasticizer, preferably 1,2-cyclohexane dicarboxylic acid diisononyl ester.
9. The adhesive sealant composition according to any one of claims 3-8, wherein the filler composition comprises a first filler and a second filler,
wherein optionally
the first filler is a ground calcium carbonate, preferably ground dolomite;
and/or
the second filler is silicon dioxide or a precipitated calcium carbonate.
10. The adhesive sealant composition according to claim 9, wherein the weight ratio of the first filler to the second filler is from 30:1 to 1:30.
11. The adhesive sealant composition according to any one of claims 3-10, further comprising one or more further substances customary in the field of adhesive sealant compositions, such as an antioxidant, preferably a sterically-hindered phenolic antioxidant.
12. The adhesive sealant composition according to any one of claims 3-11, wherein the adhesive sealant composition is solvent-free.
13. A chipboard floor comprising at least two chipboard panels joined together by an adhesive sealant composition according to any one of claims 3-12. .
14. Use of a fatty acid alkyl ester as a curing promoter in an adhesive sealant composition comprising silane modified polymer, wherein the fatty acid alkyl ester is used to promote curing of the adhesive sealant composition at temperatures below 0 °C.
15. Use according to claim 14, wherein the fatty acid alkyl ester is a fatty acid methyl ester, preferably rapeseed methyl ester (RME).
PCT/SE2020/050390 2019-04-17 2020-04-16 Adhesive sealant composition WO2020214079A1 (en)

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Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005314637A (en) * 2003-09-30 2005-11-10 Sekisui Chem Co Ltd Curable composition, sealing material and adhesive
US20100143712A1 (en) * 2007-08-15 2010-06-10 Henkel Ag & Co. Kgaa Silane-crosslinking adhesive or sealant comprising n-silylalkylamides and use thereof
US20100249357A1 (en) * 2007-07-12 2010-09-30 Dow Global Technologies Room temperature curable polymers and precursors thereof
EP2267083A1 (en) * 2008-03-13 2010-12-29 Kaneka Corporation Curable composition and cured material
US20120238695A1 (en) * 2009-10-30 2012-09-20 Henkel Ag & Co. Kgaa Urea-bonded alkoxysilanes for use in sealants and adhesives
US20120318436A1 (en) * 2010-03-08 2012-12-20 Dow Global Technologies Llc Water based primer composition for isocyante and silane functional adhesives
US20140093679A1 (en) * 2011-04-15 2014-04-03 Kaneka Corporation Cladding material for construction
US20140128507A1 (en) * 2011-08-26 2014-05-08 Sika Technology Ag Curing agent for moisture-curing compositions
US20150166859A1 (en) * 2012-07-13 2015-06-18 Sika Technology Ag High filler content composition based on silane-terminated polymers
US20160222188A1 (en) * 2013-09-11 2016-08-04 Total Marketing Services Plasticiser for sealants, plastisols and adhesives
US20170101564A1 (en) * 2014-06-04 2017-04-13 Sika Technology Ag Tin- and phthalate-free sealant based on silane terminated polymers

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005314637A (en) * 2003-09-30 2005-11-10 Sekisui Chem Co Ltd Curable composition, sealing material and adhesive
US20100249357A1 (en) * 2007-07-12 2010-09-30 Dow Global Technologies Room temperature curable polymers and precursors thereof
US20100143712A1 (en) * 2007-08-15 2010-06-10 Henkel Ag & Co. Kgaa Silane-crosslinking adhesive or sealant comprising n-silylalkylamides and use thereof
EP2267083A1 (en) * 2008-03-13 2010-12-29 Kaneka Corporation Curable composition and cured material
US20120238695A1 (en) * 2009-10-30 2012-09-20 Henkel Ag & Co. Kgaa Urea-bonded alkoxysilanes for use in sealants and adhesives
US20120318436A1 (en) * 2010-03-08 2012-12-20 Dow Global Technologies Llc Water based primer composition for isocyante and silane functional adhesives
US20140093679A1 (en) * 2011-04-15 2014-04-03 Kaneka Corporation Cladding material for construction
US20140128507A1 (en) * 2011-08-26 2014-05-08 Sika Technology Ag Curing agent for moisture-curing compositions
US20150166859A1 (en) * 2012-07-13 2015-06-18 Sika Technology Ag High filler content composition based on silane-terminated polymers
US20160222188A1 (en) * 2013-09-11 2016-08-04 Total Marketing Services Plasticiser for sealants, plastisols and adhesives
US20170101564A1 (en) * 2014-06-04 2017-04-13 Sika Technology Ag Tin- and phthalate-free sealant based on silane terminated polymers

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SE1950486A1 (en) 2020-10-18
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EP3956415A4 (en) 2022-12-21

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