EP3956415A1 - Adhesive sealant composition - Google Patents
Adhesive sealant compositionInfo
- Publication number
- EP3956415A1 EP3956415A1 EP20791868.1A EP20791868A EP3956415A1 EP 3956415 A1 EP3956415 A1 EP 3956415A1 EP 20791868 A EP20791868 A EP 20791868A EP 3956415 A1 EP3956415 A1 EP 3956415A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- adhesive sealant
- sealant composition
- composition
- filler
- fatty acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4825—Polyethers containing two hydroxy groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/71—Monoisocyanates or monoisothiocyanates
- C08G18/718—Monoisocyanates or monoisothiocyanates containing silicon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
- C08K5/134—Phenols containing ester groups
- C08K5/1345—Carboxylic esters of phenolcarboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/02—Polyalkylene oxides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/08—Polyurethanes from polyethers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C09J201/10—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/2805—Compounds having only one group containing active hydrogen
- C08G18/288—Compounds containing at least one heteroatom other than oxygen or nitrogen
- C08G18/289—Compounds containing at least one heteroatom other than oxygen or nitrogen containing silicon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2190/00—Compositions for sealing or packing joints
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
Definitions
- the present invention relates to an adhesive sealant composition for application to chipboard flooring joints requiring adhesion in sub-zero outdoor weather conditions, as well as floors formed from floor panels joined by such a composition.
- the invention further relates to the use of a silane modified polymer in such a composition, as well as the use of a fatty acid alkyl ester as a curing promoter in adhesive sealant compositions comprising silane modified polymer.
- platform floors In Norway, health and safety conventions during building construction typically require installation of an internal floor as a working platform on the floor joists of each storey before proceeding with construction of the next storey. Such internal floors are termed platform floors (NO: "certaingulv”). Because platform floors are typically installed during ongoing construction and prior to installation of a roof or covering on the building, the platform floors are exposed to weather conditions typical of the Norwegian climate, which may entail sub zero temperatures (i.e. less than zero degrees Celsius), as well as significant amounts of precipitation in the form of rain and snow.
- the floors are typically constructed of chipboard panels treated with a water-resistant or waterproof coating on the side of the panel intended to face upwards after installation.
- the panels are provided with a tongue-and-groove profile on each edge in order to provide a mechanically strong joint between each panel.
- These joint profiles are not treated with the water-resistant or waterproof coating of the upper surface. Therefore, in order to strengthen the joint and prevent impregnation of water into the joint after installation, an adhesive sealant is typically applied in the joint during installation.
- the same adhesive sealant is also typically applied along the floor joists prior during installation of the floor panel. The floor panels are then typically screwed or nailed onto the floor joist.
- the adhesive sealant used in installation of platform flooring caters to a very specific application since it is required to provide excellent adhesion and sealing whilst fulfilling the requirement of being able to tolerate and harden in moist and cold conditions.
- Regular wood glues or adhesive sealants do not generally meet these requirements, and therefore most adhesive and sealant companies market an adhesive sealant tailored to the specific
- Such adhesive sealants are typically termed chipboard adhesives (NO:
- adhesive sealants suitable for the above-described application may be termed chipboard adhesives. Note however that such adhesive sealants differ greatly from other products marketed as chipboard adhesive in non-Norwegian markets.
- Chipboard adhesives formulated for this specific application are nearly without exception solvent-based synthetic rubber dispersions, and harden by drying (i.e. evaporation of the solvent). Examples of such adhesives include Essve Sponplattelim Original, Casco
- the inventors of the present invention have identified a number of shortcomings in prior art sealant adhesives for the application described. It is important that the adhesive sealants display consistent and predicable performance, and can be used and hardened across a wide range of temperatures, from about -15 °C to about 40 °C.
- Prior-art solvent-based adhesive sealants have a viscosity that varies widely depending on temperature and in some cases may differ more than 10-fold between 40 °C and -15 °C. This leads to inconsistent properties, and for example may lead to the sealant adhesive being difficult to apply with a conventional skeleton pistol at cold temperatures, but being excessively fluid at warm temperatures.
- the properties and performance of prior-art solvent-based adhesive sealants may vary greatly from batch to batch. This may be due to the fact that even a small variation in solvent amount may lead to a large variation in properties such as viscosity, together with common variations in batch composition. For example, at -15 °C the measured viscosity may differ by a factor of three between batches of the same adhesive sealant.
- Solvent-based adhesive sealants typically dry rapidly and have a skin formation time of only a few minutes, regardless of application temperature. This means that the compositions harden rapidly, which may impede correct fitting of the tongue-and-groove joints, or may impede the builder when attempting to screw or nail the floor panel tightly to the floor joist. Moreover, the rapid drying of the compositions means that the composition spoils rapidly once opened, and an opened tube of adhesive sealant must therefore be consumed rapidly.
- Solvent-based adhesive sealants typically comprise more than 20% by weight of one or more solvents. In many cases these solvents may be carcinogens or suspected carcinogens and are detrimental to the health of the builder installing the flooring panels. The builder installing flooring panels does not typically use a mask capable of filtering the volatile solvents and therefore occupational exposure to the solvents is high. Moreover, the use of volatile solvents means that the adhesive sealants continue to emit a strong odour long after they have hardened.
- the inventors of the present invention have understood the potential role that the adhesive sealant could play with regard to resolving a problem commonly occurring with the floors, namely creaking.
- Platform floors have a tendency to start creaking some time after installation, generally within one year of installation. It is thought that this may be due to a number of factors, including shrinkage or faulty installation of joists, or insufficient gluing, screwing or nailing or floor panels. See report no. 722.525 (2008) from the research institute SINTEF Byggforsk for further discussion of this problem.
- the inventors of the present invention have realised that an adhesive sealant having superior properties to those traditionally used could assist in compensating at least partially for one or more of these factors.
- silane modified polymer as defined in the appended independent claims.
- the silane modified polymer (SMP) is used in an adhesive sealant composition for the specific application as described herein, i.e. for application to chipboard flooring joints requiring adhesion in potentially sub-zero outdoor weather conditions.
- adhesive sealant composition for application to chipboard flooring joints it is meant a “sponplattelim” in accord with Norwegian “butgulv” construction practice, as described above.
- requiring adhesion in potentially sub-zero outdoor weather conditions it is meant that it is a requirement that the product is capable of being used even if the prevailing weather conditions are sub-zero.
- the silane modified polymer may be any silane modified polymer discussed in conjunction with adhesive sealant compositions below.
- the adhesive sealant composition may be an adhesive sealant composition as described herein and/or as defined in the appended independent claims.
- an SMP in the adhesive sealant composition facilitates resolution or amelioration of substantially all of the shortcomings in the prior art as described above.
- a solvent-free adhesive sealant composition may be formulated. Due to the use of an SMP, the adhesive sealant composition may be formulated to have properties that are more consistent across the entire range of temperatures that the composition is required to be utilized in. For example, the composition may be formulated to have a viscosity that varies less than three fold between 40 °C and -15 °C. Since the viscosity depends on the bulk properties of the composition as a whole, more consistent viscosity between batches is obtained.
- Adhesive sealant compositions utilizing SMP have a much longer hardening time, regardless of temperature, which means that the composition keeps for longer once opened and does not obstruct the builder when fitting, screwing or nailing the floor panels. Because SMP is moisture-curing and is not dependent on drying for hardening, the adhesive sealant composition may be formulated using only non-volatiles (i.e. solvent-free). This means less occupational exposure to volatiles, no persistent odour, and potentially fewer problems with shrinkage. The excellent elasticity of SMP-based compositions means that all contact between the floor panels and joists will be well-cushioned, leading to a lesser propensity to creak.
- Creaking is due to a complex interplay of several components: the floor panels, the joists and the screws/nails, all of which may be provided by different suppliers. It is probable that the role that the adhesive sealant may play in assisting prevention of creaking has been overlooked in the field due to a focus on the components that actually cause the creaking, i.e. the joists, floor panels and screws/nails. See report no.
- the objects of the invention are obtained by using a fatty acid alkyl ester (FAAE) as a curing promoter in an adhesive sealant composition comprising silane modified polymer, as defined in the appended independent claims.
- FAE fatty acid alkyl ester
- the adhesive sealant composition may be an adhesive sealant composition as described herein and/or as defined in the appended independent claims.
- the FAAE acts to modify the rheological properties of the composition, providing a composition having a suitable viscosity across the range of temperatures from -15 °C to 40 °C. More surprisingly, the FAAE promotes curing of the composition (as compared to compositions comprising other rheology modifiers instead of FAAE). The curing effect is notable at room temperature and is prominent even at temperatures as low as -15 °C. The provision of both excellent rheological properties and excellent curing across the entire applicable temperature range is to our knowledge unique, and makes FAAE extremely well suited for use in the present application. The inclusion of a fatty acid alkyl ester is especially advantageous when seeking to promote curing of the adhesive sealant composition at temperatures below 0 °C.
- the fatty acid alkyl ester may be a fatty acid methyl ester, and is preferably rapeseed methyl ester (RME).
- RME rapeseed methyl ester
- RME provides the adhesive sealant with good rheological and curing properties across the entire range of application temperatures.
- the objects of the invention are obtained by an adhesive sealant composition according to the appended claims.
- the adhesive sealant composition is suitable for use in the application described herein, i.e. suitable for application to chipboard flooring joints requiring adhesion in sub-zero outdoor weather conditions.
- the adhesive sealant composition comprises: a) 5% - 30% of a silane modified polymer;
- the adhesive sealant composition may comprise: a) 5% - 18% of a silane modified polymer; and/or
- the adhesive sealant composition yields the advantages as previously described herein in relation to the use of a SMP in an adhesive sealant composition for application to chipboard flooring joints requiring adhesion in potentially sub-zero outdoor weather conditions, as well as the advantages as described in relation to the use of a fatty acid alkyl ester as a curing promoter in an adhesive sealant composition comprising silane modified polymer.
- the fatty acid alkyl ester may be a fatty acid methyl ester, preferably rapeseed methyl ester (RME).
- the silane modified polymer may be a silane terminated polymer, preferably a silylcarbamate- terminated polyether, most preferably a dimethoxy(methyl)silylmethyl carbamate-terminated polyether.
- Such polymers have excellent moisture curing properties and cure without requiring a dedicated catalyst such as a tin or titanium catalyst.
- the adhesive sealant composition may therefore be free of a metal catalyst, which is environmentally
- the hardener may be a combined hardener and adhesion promoter, i.e. promoting the moisture curing of the composition, as well as promoting the adhesion of the polymer to filler and/or substrate.
- the combined hardener and adhesion promoter may be an aminosilane, such as an aminoalkyl trialkoxysilane, most preferably 3-aminopropyltrimethoxysilane.
- the water scavenger may be a silane, such as a vinyl trialkoxysilane, most preferably vinyltrimethoxysilane. Such water scavengers have been shown to provide adequate product shelf life and curing properties.
- the plasticizer may be a non-phthalate ester plasticizer, preferably 1,2-cyclohexane dicarboxylic acid diisononyl ester.
- the filler composition may comprises a first filler and a second filler.
- the first filler may be a ground calcium carbonate, preferably ground dolomite.
- the second filler may be silicon dioxide or a precipitated calcium carbonate.
- the weight ration of the first filler to the second filler may be from about 20:1 to about 1:20, preferably from about 10:1 to about 1:1, such as about 5:1.
- the adhesive sealant composition may further comprise one or more further substances customary in the field of adhesive sealant compositions, such as an antioxidant, preferably a sterically-hindered phenolic antioxidant. This assists in stabilizing the adhesive sealant composition.
- an antioxidant preferably a sterically-hindered phenolic antioxidant. This assists in stabilizing the adhesive sealant composition.
- the adhesive sealant composition may be solvent-free. Use of a moisture-curing mechanism means that no drying is required and therefore no volatile solvents are required in the composition. However, the composition may comprise non-volatile rheology modifiers such as oils.
- the objects of the invention are obtained by a chipboard floor as defined in the appended independent claims.
- the chipboard floor comprises at least two chipboard panels joined together by an adhesive sealant composition as described herein.
- Fig la schematically illustrates application of adhesive sealant composition to the floor joists and profile edges of floor panels during installation of platform flooring;
- Fig lb schematically illustrates fixing of the floor panels to the floor joists by screws during installation of platform flooring
- the present invention relates to an adhesive sealant composition for use in installing platform floors.
- Platform floors are floor panels, typically constructed of chipboard waterproofed on the side to be installed facing upwards, which are installed for practical and safety purposes during building construction in Norway. Since platform floors are installed prior to the building being made weathertight, they are exposed to the ambient weather conditions such as rain, snow and frost. If the floor is non-optimally installed it may take up excessive amounts of moisture and upon drying start to creak.
- a primary function of the adhesive composition of the present invention is to prevent the platform floors from creaking. This may for example be provided by: improved sealing, i.e. preventing water permeation; improved adhesion, i.e. preventing gaps from opening between joints or between the floor panels and the joists; and/or improved cushioning, i.e. providing an elastic bed to counteract movement of the floor panel.
- Platform flooring A typical installation procedure for installation of a platform floor is described below with reference to Figures la-lc.
- the installation procedure for platform floors is more-or-less the same, regardless of manufacturer, and the installation instructions provided by the two largest platform floor suppliers in Norway, Arbor and Forestia, are very similar.
- Both sets of instructions note that platform floors may be exposed to precipitation during the construction period. Excess water or ice should be removed from floor joists prior to installing the platform floor.
- Both sets of instructions also note that the adhesive used should be able to tolerate the climatic conditions prevailing during installation.
- Figures la-lc illustrate a typical installation procedure.
- Two beads of adhesive (3) are applied along the entire length of each floor joist (5), and a further single bead of adhesive (7) is applied along the entire length of each profiled edge of each floor panel (9) (Fig. la).
- the tongue-and-groove joints are formed by insertion of the cooperating profile edges of the floor panels into each other, and fixed to the floor joist by the adhesive (3).
- the floor panels are further fixed to the joists by inserting screws (11) through the floor panels (9) and into the floor joist (5) along each profile edge (Fig. lb). After screwing of the floor panels (9), excess adhesive (13) is removed from each joint, leaving an adhesive-sealed joint (15) (Fig. lc).
- the adhesive sealant composition comprises a silane modified polymer, a water scavenger, a hardener, a filler composition, and a fatty acid alkyl ester.
- the composition also preferably comprises a plasticizer or thickener to modify the rheological properties of the composition, and a stabilizer such as an antioxidant.
- Silane modified polymers also known as hybrid polymers, are polymers comprising silane pendant or terminal groups. They cure by reaction with ambient moisture to form siloxane linkages between polymer chains.
- the polymer backbone may be a polyester, polyether, polyalkylene or polyacrylate.
- a linear polyether such as polypropylene oxide is preferred.
- the terminal silane groups may be trialkoxysilane groups, trialkylsilane groups or
- alkyldialkoxysilane groups may be attached to the polymer backbone by a linker, such as an alkyl, alkylcarbamate or alkylcarbamide linker.
- the silane modified polymer is preferably a silylcarbamate-terminated polyether, most preferably a
- dimethoxy(methyl)silylmethyl carbamate-terminated polypropylene oxide Suitable polymers are commercially available from Wacker Chemie AG or Kaneka Corporation.
- the silane modified polymer may constitute from about 5% to about 30% of the total dry weight of the adhesive sealant composition, such as from about 6% to about 20%, from about 7% to about 18%, from about 8% to about 15%, or from about 9% to about 11% of the total dry weight of the adhesive sealant composition.
- the adhesive sealant composition comprises a fatty acid alkyl ester.
- the fatty acid alkyl ester modifies the rheological and curing properties of the composition and provides a composition having suitable properties across the entire range of temperatures in which the composition must be applicable, i.e. from -15 °C to 40 °C.
- the fatty acid alkyl ester is preferably obtained by transesterification of a naturally occurring triglyceride with methanol or ethanol, since all required reagents are obtainable from renewable sources.
- the fatty acid alkyl ester is preferably a fatty acid methyl ester (FAME) such as rapeseed oil methyl ester (RME).
- the fatty acid methyl ester may constitute from about 5% to about 20% of the total dry weight of the adhesive sealant composition, such as from about 6% to about 15%, from about 7% to about 10%, such as about 8% of the total dry weight of the adhesive sealant composition.
- Water scavengers react with moisture to prevent premature curing of the silane modified polymer, thus tailoring the curing properties of the SMP composition and increasing the shelf life and time-to-perish of the composition.
- water scavengers (W) are vinylsilanes such as vinyltrimethoxysilane, vinyltriethoxysilane and vinylmethyldimethoxysilane.
- silanes such as (trimethoxysilyl)benzene, O- methylcarbamatomethylmethyldimethoxysilane, O-methylcarbamatomethyltrimethoxysilane, O-ethylcarbamatomethylmethyldiethoxysilane, O-ethyl-carbamatomethyltriethoxysilane, 3- methacryloyloxy-propyltrimethoxysilane, methacryloyloxymethyltrimethoxysilane,
- methacryloyloxymethylmethyldimethoxysilane methacryloyloxymethyltriethoxysilane, methacryloyloxymethylmethyldiethoxysilane, 3-acryloyloxypropyltrimethoxysilane, acryloyloxymethyltrimethoxysilane, acryloyloxymethylmethyldimethoxysilane,
- acryloylmethyltriethoxysilane and acryloyloxymethylmethyldiethoxysilane.
- Even some rapidly hydrolysable non-silane organic compounds such as ortho esters, (e.g. 1,1,1- trimethoxyethane, 1,1,1-triethoxyethane, trimethoxymethane, triethoxymethane) may be utilized.
- Vinyltrimethoxysilane is the preferred water scavenger.
- the water scavenger may constitute from about 1% to about 5% of the total dry weight of the adhesive sealant composition, such as from about 2% to about 4%, or from about 2% to about 3% of the total dry weight of the adhesive sealant composition.
- the hardener promotes curing of the adhesive sealant composition.
- Dedicated hardeners such as metal curing catalysts may be used.
- metal curing catalysts are known in the art and include tetraalkyl titanate esters and dialkyltin complexes.
- the adhesive sealant composition is preferably free of metal curing catalyst. In such a case, a metal-free hardener such as an amine may be used.
- Dedicated organic amine hardeners include triethylamine, tributylamine, l,4-diazabicyclo[2,2,2]octane, l,5-diazabicyclo[4.3.0]-non-5-ene, 1,8- diazabicyclo[5.4.0]undec-7-ene, N,N-bis(N,N-dimethyl-2-aminoethyl)methylamine, N,N- dimethylcyclohexylamine, N,N-dimethylphenylamine, N,N,N',N'-Tetramethyiguanidine, and N- ethylmorpholinine.
- aminosilanes have a dual function and act not only as hardeners, but also as adhesion promoters.
- Suitable aminosilanes include 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- aminopropylmethyldimethoxysilane, 3-aminopropylmethyldiethoxysilane, N-(2-aminoethyl)-3- aminopropyltrimethoxysilane, N-(2-aminoethyl)-3-aminopropyltriethoxysilane, N-(2- aminoethyl)-3-aminopropylmethyldimethoxysilane, N-(2-aminoethyl)-3- aminopropyltriethoxysilane, 3-(2-Aminoethylamino)propyldimethoxymethylsilane,
- the hardener is preferably 3-aminopropyltrimethoxysilane.
- the hardener may constitute from about 0.3% to about 5% of the total dry weight of the adhesive sealant composition, such as from about 0.4% to about 3%, from about 0.5% to about 2%, or from about 0.6% to about 1% of the total dry weight of the adhesive sealant composition.
- the adhesive sealant composition comprises at least a first filler and optionally further fillers.
- the fillers may be selected from fillers known in the art, including but not limited to calcium carbonate, calcium sulfate, barium sulfate, aluminium silicate, kaolin, magnesium sulfate, magnesium hydroxide, microplastic, silicon dioxide (e.g. fumed silica or precipitated silica) and titanium dioxide.
- the term calcium carbonate is intended to encompass all calcium-containing carbonate minerals, such as dolomite, as well as precipitated calcium carbonates.
- the adhesive sealant composition preferably comprises a filler composition comprising two fillers: a first filler such as a ground calcium carbonate (dolomite) and a second filler such as silicon dioxide or precipitated calcium carbonate.
- the weight ration of the first filler to the second filler may be from about 30:1 to about 1:30, such as from about 20:1 to about 1:20, such as from about 10:1 to about 1:1, such as about 5:1.
- the filler composition may constitute from about 60% to about 75% of the total dry weight of the adhesive sealant composition, such as from about 60% to about 70% of the total dry weight of the adhesive sealant composition.
- the adhesive sealant composition includes one or more plasticizers.
- Plasticizers assist in tuning the rheological properties of the composition.
- the plasticizer may be a phthalate ester such as dioctyl phthalate, diisooctyl phthalate or diundecyl phthalate.
- non-phthalate plasticizers are preferred.
- Such non-phthalate plasticizers include esters (such as adipic esters, benzoic esters, glycol esters, alkanediol esters, phosphoric esters, sulfonic esters and polyesters) and polyethers (such as polyethyleneglycol and polypropyleneglycol). Esters of alkane diols, such as 1,2-cyclohexane dicarboxylic acid diisononyl ester are preferred.
- a thickener may be used instead of a plasticizer to tune the rheological properties of the adhesive composition.
- Suitable thickeners are known in the art, and may for example be silicon dioxides (such as fumed or precipitated silica), hydrogenated castor oil or micronised amide modified hydrogenated castor oil.
- the plasticizer or thickener may constitute from about 5% to about 15% of the total dry weight of the adhesive sealant composition, such as from about 10% to about 13% of the total dry weight of the adhesive sealant composition.
- the adhesive sealant composition may comprise further constituents as known in the art. Such constituents may include further silane modified polymers, water scavengers, hardeners, adhesion promoters, fillers, plasticizers or rheology modifiers. Further potentially suitable constituents for utilization in an adhesive sealant composition include but are not limited to pigments, flame retardants and stabilizers.
- the adhesive sealant composition may include an antioxidant.
- a suitable antioxidant may be a sterically hindered phenolic antioxidant such as alkyl esters of 3,5-di-t-butyl-4-hydroxy-benzoic acid.
- the adhesive sealant composition does not require solvent for correct hardening and is preferably free of solvent. However, the composition may comprise small amounts of solvent if desired, up to for example 10% relative to the total dry weight, in order to tailor the hardening and rheological properties.
- the adhesive sealant composition described herein may be used to produce a platform floor by joining together a plurality of chipboard panels as described above. It is understood that when it is stated that when the chipboard panels are joined together by the adhesive sealant composition, the adhesive sealant composition is in a partially-cured or fully-cured state, i.e. the nature of the initial components has been altered by the moisture curing process.
- test compositions were produced differing only by a single test component.
- the test compositions all had the base formulation as shown in Table 1 below.
- Plasticizer Hexamoll Dinch BASF SE 1,2-Cyclohexane dicarboxylic acid 12
- Antioxidant Irganox 1135 BASF SE Alkyl esters of 3,5-te/T-butyl 4- 0.2
- test components evaluated were:
- Test composition A Mesamoll (alkylsulphonic acid ester with phenol, Lanxess);
- Test composition B Hexamoll Dinch (1,2-Cyclohexane dicarboxylic acid diisononyl ester, BASF SE);
- Test composition C Dowfax Defoamer DF143 (polypropylene glycol butyl ether, Dow
- Test composition D - RME rapeseed oil methyl esters
- test composition B comprising Hexamoll Dinch displayed a satisfactory viscosity and cured at an acceptable rate at room temperature (as exemplified by skin formation time and through curing time). However, this test composition was excessively viscous and excessively slow to cure at -15 °C.
- the test compositions A and C comprising Mesamoll or Dowfax Defoamer DF143 displayed suitable curing properties both at room temperature and at -15 °C. However, these test compositions displayed high viscosities at room temperature, and excessively high viscosities at -15°C. This means that these test compositions would be difficult to work with at -15 °C.
- the test composition D comprising RME is the only composition displaying suitable viscosity as well as suitable curing at room temperature and -15 °C.
- test composition E was evaluated, wherein RME was used not only as the test component, but was also used to replace the plasticizer (i.e. no plasticizer other than RME). It was found that this composition lacking plasticizer had inferior storage stability, as evidenced by an approximately four-fold decrease in viscosity upon storage for two months. It was also noted that this test composition, when cured, was much harder than test composition D comprising both plasticizer and RME. Although not evaluated, this will likely result in test composition E having a much higher risk of floor creak as compared to test composition D.
- compositions have a viscosity in excess of 500 000 mPa.s. at -15 °C, potentially making them difficult to apply with a conventional skeleton gun for adhesive application. Even the best performing prior art adhesive sealant with regard to viscosity variation (Novi Pro)
- Sponplatelim demonstrates a 130% increase in viscosity between 20 °C and -15 °C.
- the worst performing prior art compositions demonstrate in excess of a 10-fold increase in viscosity between 20 °C and -15 °C.
- the SMP-based test composition has a well-balanced viscosity profile and has less than an 80% increase in viscosity between 20 °C and -15 °C.
- the SMP-based test composition comprising RME demonstrates consistent and well-balanced properties across the applicable range of temperatures, from -15 °C to 40 °C.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Sealing Material Composition (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE1950486A SE1950486A1 (en) | 2019-04-17 | 2019-04-17 | Adhesive sealant composition |
PCT/SE2020/050390 WO2020214079A1 (en) | 2019-04-17 | 2020-04-16 | Adhesive sealant composition |
Publications (2)
Publication Number | Publication Date |
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EP3956415A1 true EP3956415A1 (en) | 2022-02-23 |
EP3956415A4 EP3956415A4 (en) | 2022-12-21 |
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Application Number | Title | Priority Date | Filing Date |
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EP20791868.1A Pending EP3956415A4 (en) | 2019-04-17 | 2020-04-16 | Adhesive sealant composition |
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EP (1) | EP3956415A4 (en) |
NO (1) | NO20211369A1 (en) |
SE (1) | SE1950486A1 (en) |
WO (1) | WO2020214079A1 (en) |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005314637A (en) * | 2003-09-30 | 2005-11-10 | Sekisui Chem Co Ltd | Curable composition, sealing material and adhesive |
ES2425072T3 (en) * | 2007-07-12 | 2013-10-11 | Dow Global Technologies Llc | Polymers curable at room temperature and precursors thereof |
DE102007038661A1 (en) * | 2007-08-15 | 2009-02-19 | Henkel Ag & Co. Kgaa | Silane-crosslinking adhesive or sealant with N-silylalkylamides and its use |
JP5502723B2 (en) * | 2008-03-13 | 2014-05-28 | 株式会社カネカ | Curable composition and cured product |
DE102009046269A1 (en) * | 2009-10-30 | 2011-05-05 | Henkel Ag & Co. Kgaa | Urea-bound alkoxysilanes for use in sealants and adhesives |
CN102985385B (en) * | 2010-03-08 | 2016-03-16 | 陶氏环球技术有限责任公司 | For the water based primer compositions of isocyanic ester and silane-functionalised tackiness agent |
JP5993367B2 (en) * | 2011-04-15 | 2016-09-14 | 株式会社カネカ | Exterior materials for construction |
EP2562192A1 (en) * | 2011-08-26 | 2013-02-27 | Sika Technology AG | Hardener for moisture curable compositions |
CN104428333B (en) * | 2012-07-13 | 2018-04-10 | Sika技术股份公司 | The composition of high filler content based on Silante terminated polymer |
FR3010409B1 (en) * | 2013-09-11 | 2017-12-22 | Total Marketing Services | PLASTICIZER FOR MASTICS, PLASTISOLS AND ADHESIVES |
EP2952533A1 (en) * | 2014-06-04 | 2015-12-09 | Sika Technology AG | Tin and phthalate-free, sealing composition based on silane-terminated polymers |
-
2019
- 2019-04-17 SE SE1950486A patent/SE1950486A1/en not_active Application Discontinuation
-
2020
- 2020-04-16 NO NO20211369A patent/NO20211369A1/en unknown
- 2020-04-16 WO PCT/SE2020/050390 patent/WO2020214079A1/en unknown
- 2020-04-16 EP EP20791868.1A patent/EP3956415A4/en active Pending
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WO2020214079A1 (en) | 2020-10-22 |
SE1950486A1 (en) | 2020-10-18 |
NO20211369A1 (en) | 2021-11-12 |
EP3956415A4 (en) | 2022-12-21 |
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