WO2020206867A1

WO2020206867A1 - In-line power device, semiconductor assembly, in-wheel motor driver or automobile driver, and new energy vehicle

Info

Publication number: WO2020206867A1
Application number: PCT/CN2019/096825
Authority: WO
Inventors: 叶春显; 詹旭标; 李涛; 阮胜超
Original assignee: 深圳市鹏源电子有限公司
Priority date: 2019-04-08
Filing date: 2019-07-19
Publication date: 2020-10-15
Also published as: US20220399252A1

Abstract

Provided are an in-line power device, a semiconductor assembly, an in-wheel motor driver or an automobile driver, and a new energy vehicle. The in-line power device comprises: a body (10), comprising a power chip and a wrapping layer wrapping an outer surface of the power chip; and a plurality of pins (20) arranged at a first side edge of the body at intervals. The plurality of pins comprise a power pin (21), an auxiliary control pin (22) and a control signal pin (23), wherein each pin (20) comprises a first section arranged inside the wrapping layer and a second section arranged outside the wrapping layer; and a second section of the auxiliary control pin (22) and a second section of the control signal pin (23) are located in a first plane, and a second section of the power pin (21) and the first side edge (11) are located in a second plane, with the first plane not being parallel to the second plane.

Description

In-line power devices, semiconductor components, in-wheel motor drives or car drives and new energy vehicles

Priority information

This application requests the priority and rights of the patent applications with patent application numbers 201920465783.9 and 201910277415.6 filed with the State Intellectual Property Office of China on April 8, 2019, and the full texts of them are incorporated herein by reference.

Technical field

This application relates to the field of semiconductor technology, in particular to direct plug-in power devices, semiconductor components, hub motor drives or automobile drives, and new energy vehicles.

Background technique

Discrete in-line power devices, because of their simple design, strong versatility, good delivery time, and high cost performance, are the most widely used package types for power devices. However, due to the development of power semiconductor devices, with the increase of voltage and current, its speed is getting faster and faster. The rate of change of current di/dt is determined by the common terminal (source/emitter) of the power and control signals. The interference of parasitic inductance on the control signal is becoming more and more serious.

Therefore, the related technologies of discrete in-line power devices still need to be improved and optimized.

Summary of the invention

This application aims to solve one of the technical problems in the related technology at least to a certain extent.

This application is completed based on the inventor's following findings and knowledge:

Since commonly used power devices such as thyristors, transistors (such as IGBT (Insulated Gate Bipolar Transistor), MOSFET (Metal Oxide Semiconductor Field Effect Transistor)) are composed of three terminals, for example, MOSFET is composed of drain, The source (Source) and the control terminal gate (Gate) are composed, while the IGBT is composed of the collector (Collector), the emitter (Emitter) and the control terminal gate (Gate). Therefore, the package of discrete in-line power devices generally has three pins, two are power pins, and the other is a control signal pin. As the current, voltage and speed of the power device increase, it can be set in related technologies. The auxiliary control pin used to avoid crosstalk of parasitic inductance forms a four-pin package. In the related art, the auxiliary pin can also be used to detect the voltage drop to cooperate with the gate driver for short-circuit protection or other purposes. However, during the research process, the inventor found that the addition of auxiliary control pins has reached the circuit The purpose of the control signal to resist the interference of parasitic inductance, but in the layout of the client, such as the lead layout of the connecting component (such as a printed circuit board (PCB)), because the power and high current are located on the same plane as the control signal, in order to achieve Safety creepage distance and other requirements, the layout of the layout will be selected, it will cause a certain degree of adverse impact on the layout of the driver, the lead layout cannot be completely stacked in multiple layers, which will cause the parasitic inductance of the main loop to be too large and the driver If the loop is too long, the loop will oscillate, which will not only cause problems such as parallel consistency and current sharing, but also reduce the power density and speed of the system, sacrificing efficiency. After discovering the problem, the inventor conducted in-depth research and proposed a new power device packaging structure. Specifically, the power pins, auxiliary control pins and control signal pins of the in-line power device were adjusted to make it They are not located on the same plane, so that the power pins, auxiliary control pins, and control signal pins can be connected to the power connection part and the control signal connection part in the three-dimensional space, making full use of the three-dimensional space and reducing the connection parts. Layout requirements, and can greatly reduce the crosstalk between high power currents and control signals, improve reliability, improve the layout of the main power terminal connection components, reduce parasitic inductance, greatly increase system power density, reduce system vibration, and optimize parallel consistency And other issues.

In view of this, the present application provides a direct plug-in power device and its related products that can greatly reduce crosstalk, improve the layout of the connection components of the main power end, reduce parasitic inductance, increase system power density, reduce system oscillations, or optimize parallel consistency problems. application.

In one aspect of the present application, the present application provides a direct plug-in power device. According to an embodiment of the present application, the in-line power device includes: a body including a power chip and a wrapping layer wrapped on an outer surface of the power chip; a plurality of pins, and a plurality of the pins are arranged at intervals On the first side of the body, there are power pins, auxiliary control pins, and control signal pins. Each of the pins includes a first section and a second section. The first section is arranged on the package. And electrically connected to the power chip, the second section is electrically connected to the first section and arranged outside the wrapping layer, and the second section of the auxiliary control pin is electrically connected to the The second section of the control signal pin is located in the first plane, the second section of the power pin and the first side are located in the second plane, the first plane and the second plane are not parallel, and so The first included angle between the first plane and the third plane where the body is located is greater than or equal to -180° and less than or equal to +180°, and the second included angle between the second plane and the third plane It is greater than or equal to -180° and less than or equal to +180°. The direct plug-in power device can greatly reduce or even completely avoid the crosstalk between the high power current and the control signal by arranging the power pin, the auxiliary control pin and the control signal pin on two non-parallel planes, and improve the main The layout of the connecting components of the power end reduces parasitic inductance, greatly increases system power density, reduces system vibration, optimizes parallel consistency, etc. It is especially suitable for reducing volume, high power and high requirements, such as new energy vehicle drives, especially wheel hub motors Drives, and power grids, locomotives, photovoltaics, wind power, high power density power supplies and other fields.

According to an embodiment of the present application, the angle between the first plane and the third plane where the body is located is greater than or equal to -90° and less than or equal to +90°, and the second plane and the third plane are different The angle between is greater than or equal to -90° and less than or equal to +90°.

According to an embodiment of the present application, one of the first plane and the second plane is parallel to the third plane where the body is located.

According to an embodiment of the present application, the angle between the other of the first plane and the second plane and the third plane is +90°.

According to an embodiment of the present application, the included angle between the first plane and the second plane is 90°.

According to an embodiment of the present application, the angle between one of the first plane and the second plane and the third plane is +45°, and the angle between the first plane and the second plane The angle between the other and the third plane is -45°.

According to an embodiment of the present application, the pin further includes an auxiliary pin, and the second section of the auxiliary pin is located in the first plane.

According to an embodiment of the present application, the power chip includes a transistor. According to an embodiment of the present application, the transistor includes at least one of an insulated gate bipolar transistor, a metal oxide semiconductor field effect transistor, a junction field effect transistor, a diode, a thyristor, and a high electron mobility field effect transistor.

In another aspect of the present application, the present application provides a semiconductor component. According to an embodiment of the present application, the semiconductor assembly includes: the aforementioned direct plug-in power device; a first connecting part, the first connecting part and the second connecting part of the auxiliary control pin in the direct plug-in power device The segment is electrically connected to the second segment of the control signal pin; a second connecting part, the second connecting part is electrically connected to the power pin in the in-line power device. This semiconductor component has all the features and advantages of the aforementioned direct plug-in power device, and will not be repeated here.

According to an embodiment of the present application, the first connecting component and the second connecting component respectively include at least one of a printed circuit board, a composite bus bar, a copper bar, a screw nut, and a connection terminal.

According to an embodiment of the present application, the semiconductor component further includes a heat sink, the shape of the heat sink is at least one of a circle, a polygon, a triangle, and a strip shape, and at least one surface of the heat sink is provided with At least one such direct plug-in power device.

According to an embodiment of the present application, the semiconductor component includes at least one of an inverter, a power converter, a power supply, and a rectifier.

In yet another aspect of the present application, the present application provides a wheel hub motor drive or automobile drive. According to an embodiment of the present application, the in-wheel motor drive or automobile drive includes the aforementioned direct plug-in power device or the aforementioned semiconductor component. The in-wheel motor drive or automobile drive has all the features and advantages of the aforementioned direct plug-in power device, and will not be repeated here.

In another aspect of this application, this application provides a new energy vehicle. According to an embodiment of the present application, the new energy vehicle includes the aforementioned in-line power device, the aforementioned semiconductor component, or the aforementioned in-wheel motor drive or automobile drive. The new energy vehicle has all the features and advantages of the aforementioned direct plug-in power device, and will not be repeated here.

Description of the drawings

FIG. 1 is a schematic structural diagram of a direct plug-in power device according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a direct plug-in power device according to another embodiment of the present application.

FIG. 3 is a schematic structural diagram of a direct plug-in power device according to another embodiment of the present application.

FIG. 4 is a schematic structural diagram of a direct plug-in power device according to another embodiment of the present application.

FIG. 5 is a schematic structural diagram of a direct plug-in power device according to another embodiment of the present application.

FIG. 6 is a schematic structural diagram of a semiconductor component according to an embodiment of the present application.

FIG. 7 is a schematic structural diagram of a semiconductor component according to another embodiment of the present application.

FIG. 8 is a schematic structural diagram of a semiconductor device according to another embodiment of the present application.

Fig. 9 is a schematic structural diagram of an in-wheel motor according to an embodiment of the present application.

FIG. 10 is a schematic structural diagram of a semiconductor component according to another embodiment of the present application.

Fig. 11 is a schematic structural diagram of an in-wheel motor according to another embodiment of the present application.

12 is a gate waveform diagram of the in-line power device in Embodiment 1 of the present application.

FIG. 13 is a gate waveform diagram of the in-line power device in Comparative Example 1 of the present application.

detailed description

The embodiments of the present application are described in detail below. The embodiments described below are exemplary, and are only used to explain the application, and cannot be understood as a limitation to the application. Where specific techniques or conditions are not indicated in the examples, the procedures shall be carried out in accordance with the techniques or conditions described in the literature in the field or in accordance with the product specification. The reagents or instruments used without the manufacturer's indication are all conventional products that are commercially available.

In one aspect of the present application, the present application provides a direct plug-in power device. According to an embodiment of the present application, referring to FIG. 1, the direct plug-in power device includes: a body 10 including a power chip and a wrapping layer wrapped on the outer surface of the power chip; a plurality of pins 20, and a plurality of The pins 20 are arranged at intervals on the first side 11 of the body, and include a power pin 21, an auxiliary control pin 22 and a control signal pin 23, each of the pins 20 includes a first section (in the figure (Not shown) and the second section, the first section is arranged in the wrapping layer and electrically connected with the power chip, and the second section is electrically connected with the first section and arranged on the Outside of the wrapping layer, and the second section 222 of the auxiliary control pin and the second section 232 of the control signal pin are located in the first plane, and the second section 212 of the power pin is The side 11 is located in a second plane, the first plane and the second plane are not parallel, and the first angle between the first plane and the third plane where the body is located is greater than or equal to -180° and less than Equal to +180°, and the second included angle between the second plane and the third plane is greater than or equal to -180° and less than or equal to +180°. This in-line power device can greatly reduce or even completely avoid the crosstalk between power current and control signal by arranging the power pin, auxiliary control pin and control signal pin on two non-parallel planes, and improve the main power The layout of the connection components at the end, reduce parasitic inductance, greatly increase system power density, reduce system vibration, optimize parallel consistency, etc., especially suitable for reducing size, high power and high requirements, such as new energy vehicle drives, especially wheel hub motor drives , And power grids, locomotives, photovoltaics, wind power, high power density power supplies and other fields.

According to the embodiment of the present application, as long as the first plane and the second plane do not work, the angle between the two is not particularly limited, and can be flexibly set to any angle. Specifically, in this article, viewing from the left side of the power device (i.e., left view), based on the third plane where the body is located (that is, the plane containing the first side and the largest area surface in the body), If the second section of the pin deflects in the counterclockwise direction, the angle between the plane where the second section of the pin is located and the third plane is positive, and the second section of the pin deflects in the clockwise direction, then the second section of the pin The angle between the plane of the segment and the third plane is negative, as long as they are not equal, the first angle between the first plane and the third plane and the second angle between the second plane and the third plane You can choose between -180° and +180°.

In some specific embodiments, considering factors such as ease of processing and better safety of the device, the first angle between the first plane and the third plane where the body is located is greater than or equal to -90° and less than or equal to +90 °, the second included angle between the second plane and the third plane is greater than or equal to -90° and less than or equal to +90°. Therefore, within this angle range, it is easy to process, and the second section of the lead has a small bending angle, which is not easy to crack or break.

According to an embodiment of the present application, one of the first plane and the second plane may be parallel to the third plane where the body is located, as shown in FIG. 1 (wherein, the left picture is a front view, and the right picture is a left view) The second plane where the power pin is located is parallel to the third plane where the main body is located. Therefore, it is only necessary to bend the power pin or the auxiliary control pin and the control signal pin, which can simplify the processing steps, improve the yield, and reduce the cost.

According to the embodiment of the present application, the included angle between the first plane and the second plane may be 90°, that is, the first plane and the second plane are perpendicular to each other. As a result, while avoiding crosstalk, the power connection components and control signal connection components connected to the pins can be vertically distributed, thereby optimizing the distribution of the connection components, making better use of the three-dimensional space, thereby reducing the volume of the device and improving the device Power density.

In some specific embodiments, when one of the first plane and the second plane is parallel to the third plane where the body is located, the other of the first plane and the second plane is The included angle between the third planes may be +90°. Specifically, referring to Figure 1, it shows a case where the second plane is parallel to the third plane, and the first angle between the first plane and the third plane is +90°; refer to Figure 2 (wherein the left picture is a front view) The figure, the right figure is the left view), shows the case where the first plane and the third plane are parallel, and the second angle between the second plane and the third plane is +90°.

In other specific embodiments, the angle between one of the first plane and the second plane and the third plane is +45°, and the angle between the first plane and the second plane The angle between the other and the third plane is -45°. Specifically, referring to Figure 3 (where the left picture is a front view, the right picture is a left view), it shows that the first angle between the first plane and the third plane is +45°, and the second plane and the third plane When the second angle between the planes is -45°, refer to Figure 4 (wherein, the left picture is the front view, and the right picture is the left view), which shows the second clamp between the second plane and the third plane When the angle is +45°, and the first angle between the first plane and the third plane is -45°.

According to the embodiment of the present application, the specific number of the aforementioned power pins, auxiliary control pins, and control signal pins is not particularly limited, and the specific numbers can be flexibly selected according to the type of power chip and specific usage requirements. In some specific embodiments, since the more commonly used power chips such as transistors are composed of three terminals, the power device may include two power pins, an auxiliary control pin, and a control signal pin (refer to Figure 1-Figure 4); In other specific embodiments, an auxiliary pin can be introduced to detect the voltage drop to cooperate with the gate driver for short-circuit protection or other purposes. For details, refer to Figure 5 (wherein the left is a front view, and the right is (Left side view), the pin 20 further includes an auxiliary pin 24, and the second section 242 of the auxiliary pin is located in the first plane. Of course, those skilled in the art can understand that, according to actual needs, the number of auxiliary pins can be one, or two, three, four, or more.

According to the embodiment of the present application, the specific packaging method of the above body is not particularly limited, and can be any known packaging method in the art, for example, including but not limited to TO-220, TO-247, TO-264, TO-247Plus, ISOPLUS247 , TO-264Plus and ISOPLUS i4-PAC, etc. Therefore, the range of use is wide.

According to the embodiments of the present application, there is no particular limitation on the manner in which the first plane and the second plane are not parallel. In some specific embodiments, the pins can be bent to an appropriate angle before the body is packaged. After packaging, the first plane and the second plane have a predetermined angle; in other embodiments, after the package of the body is completed, the second section of the lead can be bent to an appropriate angle. Therefore, the operation is simple, convenient and easy to realize.

According to the embodiment of the present application, there is no restriction on the specific type of the power chip in the body, and it can be any power chip in the field, for example, including but not limited to a transistor. According to some specific embodiments of the present application, the transistors may include insulated gate bipolar transistors (IGBT), metal oxide semiconductor field effect transistors (MOSFET), junction field effect transistors (JFET), diodes, thyristors, and high-electronics At least one of mobility field effect transistors. Those skilled in the art can understand that the power chip may be a silicon carbide material chip, a silicon material chip, a gallium nitride material chip, a gallium oxide material chip, a diamond material chip, an aluminum nitride material chip, or the like. Therefore, the scope of application is wide and can be applied to various fields.

In another aspect of the present application, the present application provides a semiconductor component. According to an embodiment of the present application, referring to FIG. 6 (wherein, the left picture is a front view, and the right picture is a left view), the semiconductor assembly includes: the aforementioned direct plug-in power device 100; the first connecting component 200, the The first connecting part 200 is electrically connected to the second section 222 of the auxiliary control pin and the second section 232 of the control signal pin in the direct plug-in power device 100; the second connecting part 300 is electrically connected to The second section 212 of the power pin in the in-line power device 100 is electrically connected. The power current and the control signal in the semiconductor component are arranged separately in space, so that the connecting parts connected to the power pin and the control signal pin are not on the same plane, which can greatly reduce or even completely avoid the crosstalk between the power current and the control signal The problem is to improve the safety of the assembly, and at the same time, it can make the distribution of connecting parts more optimized, reduce the volume of the assembly, and increase the power density of the assembly.

According to an embodiment of the present application, the semiconductor component further includes a heat sink, the shape of the heat sink is at least one of a circle, a polygon, and a strip shape, and at least one surface of the heat sink is provided with at least one The in-line power device. As a result, in-line power devices can be integrated to save the volume of the components and increase the power density of the components.

According to the embodiment of the present application, the specific type of the semiconductor component is not particularly limited, and can be any semiconductor component. In some specific embodiments of the present application, the semiconductor component includes at least one of an inverter, a power converter, a power supply, and a rectifier. As a result, the crosstalk problem of the above-mentioned components can be significantly reduced, and the layout of the connecting components in the components can be more optimized, thereby reducing the volume of the components and increasing the power density of the components.

In some specific embodiments, referring to FIG. 7, there is shown a schematic diagram of an inverter structure in which six power devices are connected in parallel and form a three-phase bridge in parallel, wherein the second angle between the second plane and the third plane is 0 ゜, The first angle between the first plane and the third plane is +90 ゜. Specifically, referring to FIG. 7, the inverter includes a heat sink 400, a direct plug-in power device 100, a first connecting component (specifically a printed circuit board) 200, a second connecting component (specifically a printed circuit board) 300, and power The supporting capacitor 500 and the current adopt the sensor 600, wherein a plurality of direct plug-in power devices 100 are provided on two opposite surfaces of the heat sink 400, and the first connecting component (specifically a printed circuit board) 200 is connected to the direct plug-in power device. The second section 242 of the auxiliary pin, the second section 222 of the auxiliary control pin, and the second section 232 of the control signal pin in the device 100 are electrically connected, and the second connecting part 300 is electrically connected to the power lead in the in-line power device 100 The second section 212 of the foot is electrically connected, and the power support capacitor 500 and the current adopting sensor 600 are both electrically connected to the second connecting part 300. As a result, the second connecting part and the first connecting part can form a vertical layout, making full use of the three-dimensional space , Which reduces the requirements for the layout of the connecting components, reduces the crosstalk of the system, and increases the reliability.

In other specific embodiments, referring to FIG. 8, there is shown a schematic diagram of an inverter structure of a three-phase bridge composed of six devices in parallel in a triangular layout, wherein the second angle between the second plane and the third plane is Is 0 ゜, and the first angle between the first plane and the third plane is +90 ゜. Specifically, referring to FIG. 8, the inverter includes a heat sink 400 and a direct plug-in power device 100, wherein a plurality of direct plug-in power devices 100 are provided on opposite surfaces of the heat sink 400, and a plurality of direct plug-in power devices 100 are provided on opposite surfaces of the heat sink 400. The power devices 100 are connected in parallel. By setting the radiator in a triangular shape, the water path of the water-cooled radiator can be shortened, and the heat dissipation effect can be further improved. In addition, if the driving is a motor, such as a hub motor, the installation method can be embedded in the hub motor (refer to Figure 9). Specifically, the inverter can be set between the outer rotor 1 and the inner stator 2 of the hub motor. , To achieve integration of drive and motor, greatly reduce transmission loss and interference, and improve the real-time performance of motor drive.

In other specific embodiments, referring to FIG. 10, there is shown a schematic diagram of an inverter structure of a three-phase bridge composed of six devices in parallel and formed in a polygonal or circular layout, wherein the space between the second plane and the third plane is The second included angle is 0 ゜, and the first included angle between the first plane and the third plane is +90 ゜. Specifically, referring to FIG. 10, the inverter includes a heat sink 400 and a direct plug-in power device 100, wherein multiple direct plug-in power devices 100 are provided on multiple surfaces of the heat sink 400, and multiple direct plug-in power devices 100 are provided on multiple surfaces of the heat sink 400. The power devices 100 are connected in parallel. By setting the radiator in a circular or polygonal shape, the water path of the water-cooled radiator can be shortened, and the heat dissipation effect can be further improved. In addition, if the drive is a motor, such as a hub motor, the installation method can be embedded in the hub motor (refer to Figure 11). Specifically, the inverter can be set between the outer rotor 1 and the inner stator 2 of the hub motor. , To achieve integration of drive and motor, greatly reduce transmission loss and interference, and improve the real-time performance of motor drive.

Of course, those skilled in the art can understand that, in addition to the aforementioned structure, the aforementioned in-wheel motor drive, automobile drive or new energy vehicle also includes the necessary structure of conventional in-wheel motor drive, automobile drive or new energy vehicle. And components, taking a new energy vehicle as an example, it also includes the body, windows, tires, engine, seat, interior trim and other necessary structures and components of conventional cars, which will not be repeated here.

The embodiments of the present application are described in detail below.

Example 1

Prepare the in-line power device according to TO-247-4L, and then bend the auxiliary control pin and the control signal pin to the first plane where the auxiliary control pin and the control signal pin are located and the third plane where the body of the power device is located. The first included angle between the planes is +90 degrees, where the power chip is a silicon carbide MOSFET, and the included angle between the second plane where the first side of the power pin and the body is located and the third plane where the body is located is 0 Degree, get in-line power device.

Comparative example 1

Same as Embodiment 1, the difference is that the angle between the first plane where the auxiliary control pin and the control signal pin are located and the third plane where the main body is located is 0 degrees.

Performance Testing:

The direct plug-in power devices obtained in Example 1 and Comparative Example 1 were tested and compared under a dual pulse test platform. The test conditions were 800VDC bus voltage, 30A current, and the gate waveform of the direct plug-in power device obtained in Example 1. The figure is shown in Fig. 12, and the gate waveform diagram of the in-line power device obtained in Comparative Example 1 is shown in Fig. 13. It can be seen from Fig. 12 and Fig. 13 that when the silicon carbide MOSFET is turned on at a bus voltage of 800 VDC and a current of 30 A, the gate waveform oscillation and crosstalk of the in-line power device obtained in Example 1 are obviously improved.

In the description of this application, it should be understood that the terms "first" and "second" are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of these features. In the description of this application, "multiple" means two or more than two, unless otherwise specifically defined.

In the description of this specification, descriptions with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean specific features described in conjunction with the embodiment or example , The structure, materials, or characteristics are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples and the characteristics of the different embodiments or examples described in this specification without contradicting each other.

Although the embodiments of the present application have been shown and described above, it can be understood that the above-mentioned embodiments are exemplary and should not be construed as limiting the present application. A person of ordinary skill in the art can comment on the foregoing within the scope of the present application. The embodiment undergoes changes, modifications, substitutions and modifications.

Claims

A direct plug-in power device, characterized in that it comprises:

A body, the body including a power chip and a wrapping layer wrapped on the outer surface of the power chip;

A plurality of pins, the plurality of pins are arranged on the first side of the body at intervals, including a power pin, an auxiliary control pin, and a control signal pin, each of the pins includes a first section and The second section, the first section is arranged in the wrapping layer and electrically connected with the power chip, and the second section is electrically connected with the first section and arranged outside the wrapping layer, And the second section of the auxiliary control pin and the second section of the control signal pin are located in a first plane, and the second section of the power pin and the first side edge are located in a second plane, The first plane and the second plane are not parallel, and the first included angle between the first plane and the third plane where the body is located is greater than or equal to -180° and less than or equal to +180°, the second The second included angle between the plane and the third plane is greater than or equal to -180° and less than or equal to +180°.
The in-line power device according to claim 1, wherein the first included angle is greater than or equal to -90° and less than or equal to +90°, and the second included angle is greater than or equal to -90° and less than or equal to + 90°.
The in-line power device according to claim 1 or 2, wherein one of the first plane and the second plane is parallel to a third plane where the body is located.
The in-line power device according to claim 3, wherein the angle between the other of the first plane and the second plane and the third plane is +90°.
The in-line power device according to claim 1 or 2, wherein the included angle between the first plane and the second plane is +90°.
The in-line power device according to claim 5, wherein the angle between one of the first plane and the second plane and the third plane is +45°, and the first plane The angle between one plane and the other of the second plane and the third plane is -45°.
The in-line power device according to any one of claims 1-6, wherein the pin further comprises an auxiliary pin, and the second section of the auxiliary pin is located in the first plane.
The in-line power device of claim 1, wherein the power chip includes a transistor.
The in-line power device according to claim 8, wherein the transistors include insulated gate bipolar transistors, metal oxide semiconductor field effect transistors, junction field effect transistors, diodes, thyristors, and high electron mobility At least one of field effect transistors.
A semiconductor component, characterized in that it comprises:

The in-line power device according to any one of claims 1-9;

A first connecting part, the first connecting part is electrically connected to the second section of the auxiliary control pin and the second section of the control signal pin in the in-line power device;

The second connecting component is electrically connected with the power pin in the in-line power device.
The semiconductor assembly according to claim 10, wherein the first connecting part and the second connecting part respectively comprise at least one of a printed circuit board, a composite bus bar, a copper bar, a screw nut, and a connection terminal .
The semiconductor component according to claim 10 or 11, further comprising:

A heat sink, the shape of the heat sink includes at least one of a circle, a polygon, a triangle, and an elongated shape, and at least one in-line power device is provided on at least one surface of the heat sink.
The semiconductor component according to any one of claims 10-12, wherein the semiconductor component comprises at least one of an inverter, a power converter, a power supply, and a rectifier.
A wheel hub motor drive or automobile drive, characterized by comprising the in-line power device according to any one of claims 1-9 or the semiconductor component according to any one of claims 10-13.
A new energy vehicle, characterized by comprising the in-line power device according to any one of claims 1-9, the semiconductor component according to any one of claims 10-13, or the Hub motor drive or car drive.