WO2020199188A1 - 指纹模组、电子设备及封装方法 - Google Patents

指纹模组、电子设备及封装方法 Download PDF

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Publication number
WO2020199188A1
WO2020199188A1 PCT/CN2019/081457 CN2019081457W WO2020199188A1 WO 2020199188 A1 WO2020199188 A1 WO 2020199188A1 CN 2019081457 W CN2019081457 W CN 2019081457W WO 2020199188 A1 WO2020199188 A1 WO 2020199188A1
Authority
WO
WIPO (PCT)
Prior art keywords
fpc
fingerprint
fingerprint module
mirror
reflector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/081457
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English (en)
French (fr)
Inventor
张胜斌
刘凯
许炜添
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Goodix Technology Co Ltd
Original Assignee
Shenzhen Goodix Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Goodix Technology Co Ltd filed Critical Shenzhen Goodix Technology Co Ltd
Priority to PCT/CN2019/081457 priority Critical patent/WO2020199188A1/zh
Priority to CN201980002488.2A priority patent/CN110692064B/zh
Publication of WO2020199188A1 publication Critical patent/WO2020199188A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/10—Image acquisition
    • G06V10/12—Details of acquisition arrangements; Constructional details thereof
    • G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
    • G06V10/147—Details of sensors, e.g. sensor lenses

Definitions

  • This application relates to the field of fingerprint identification technology, and in particular to a fingerprint module, electronic equipment and packaging method.
  • fingerprint modules are widely used in mobile terminals, smart homes, automotive electronics and other fields.
  • the fingerprint sensor chip is usually packaged in the fingerprint module by forming an integrated bracket.
  • the way of forming the accommodating cavity for accommodating the fingerprint sensor chip through the integrated bracket will result in the larger size of the side wall and the top of the accommodating cavity, which in turn makes the fingerprint module manufactured larger in size, which requires an electronic device Occupies a larger installation space.
  • the present invention provides a fingerprint module, an electronic device, and a packaging method to reduce the size of the fingerprint module, thereby reducing the installation space occupied in the installed electronic device.
  • the present invention provides a fingerprint module, including: a flexible circuit board FPC, and a lens, a fingerprint sensor chip, and a bracket arranged on the FPC;
  • One side of the FPC is bent to form an accommodation cavity with the lens and the bracket;
  • a second mirror is arranged on the inner wall of the top of the accommodating cavity, and the fingerprint sensor chip is arranged at a position of the inner wall of the bottom of the accommodating cavity relative to the second mirror;
  • a first reflector is arranged outside the accommodating cavity, so that a fingerprint image imaged in the first reflector is input into the fingerprint sensor chip after passing through the lens and the second reflector in sequence.
  • the FPC is rectangular, and the first mirror, the lens, the second mirror, and the fingerprint sensor chip are arranged in parallel on the FPC;
  • One side of the FPC is bent into a U-shaped side wall, the front opening of the U-shaped side wall faces the first reflector, the lens blocks the front opening of the U-shaped side wall, and the bracket The openings on both sides of the U-shaped side wall are sealed to form the accommodating cavity.
  • the FPC includes a first FPC and a second FPC arranged perpendicular to each other;
  • the first mirror, the lens, the fingerprint sensor chip, and the bracket are arranged on the first FPC, and the second mirror is arranged on the second FPC;
  • the bracket constitutes a U-shaped side wall, the front opening of the U-shaped side wall faces the first reflector, the lens blocks the front opening of the U-shaped side wall, and the second FPC is bent After that, the top opening of the U-shaped side wall is sealed to form the accommodating cavity.
  • the fingerprint module further includes: a first reinforcing plate provided at the bottom of the fingerprint module;
  • the FPC is arranged on the first reinforcement board
  • the FPC is provided with a first through hole, so that the first through hole and the first reinforcing plate form a first accommodating groove for accommodating the first reflector.
  • the fingerprint module further includes: a second reinforcing plate;
  • the second reinforcing plate covers the top outer side wall of the accommodating cavity
  • the FPC is provided with a second through hole, so that the second through hole and the second reinforcing plate form a second accommodating groove for accommodating the second reflector.
  • the second reflecting mirror is arranged on the FPC, and the second reflecting mirror covers the top inner side wall of the accommodating cavity.
  • the fingerprint module further includes: a light emitting diode LED arranged on the FPC;
  • the LED is used to emit light to image the fingerprint image in the first mirror.
  • the light emitted by the LED is infrared light with a wavelength of 850 nanometers or 940 nanometers.
  • the thickness of the first reflector and the second reflector is 0.03 mm-0.15 mm.
  • a sealant is arranged at the side wall of the accommodating cavity to form a sealed accommodating cavity.
  • the present invention provides an electronic device including any one of the fingerprint modules provided in the first aspect.
  • the present invention provides a fingerprint module packaging method, including:
  • the FPC is bent to set one side of the second mirror, so that the folded FPC, the lens, and the bracket form an accommodating cavity, wherein the first mirror is located in the container.
  • the second mirror is located on the inner wall of the top of the accommodating cavity after the FPC is bent, and the fingerprint sensor chip is located on the inner wall of the bottom of the accommodating cavity relative to the second reflection.
  • the method before assembling the fingerprint sensor chip, lens, first reflector, second reflector and bracket on the flexible circuit board FPC, the method further includes:
  • the light-emitting diode LED is assembled on the FPC.
  • the method before the assembling the light emitting diode LED on the FPC, the method further includes:
  • a first reinforcement plate is provided on the side of the FPC away from the fingerprint sensor chip, so that after the FPC is bent, the first reinforcement plate is provided at the bottom of the fingerprint module, and
  • the FPC is provided with a first through hole, so that the first through hole and the first reinforcing plate form a first accommodating groove for accommodating the first reflector.
  • the method further includes:
  • a second reinforcing plate is provided on the side of the FPC away from the fingerprint sensor chip, so that after the FPC is bent, the second reinforcing plate covers the top outer side wall of the accommodating cavity And, a second through hole is provided on the FPC, so that the second through hole and the second reinforcing plate form a second accommodating groove for accommodating the second reflector.
  • a sealant is arranged at the blocking position of the side wall of the containing cavity to form the sealed containing cavity.
  • the present invention also provides a fingerprint detection system for a liquid crystal display, including a fingerprint module, which is configured to be arranged under the non-display area of the liquid crystal panel, and the fingerprint detection area of the fingerprint module is at least partially located in the liquid crystal In the display area of the panel, the fingerprint module is any one of the fingerprint modules provided in the first aspect.
  • the fingerprint module is located between the liquid crystal panel of the liquid crystal display and the backlight module.
  • the fingerprint detection light source is located at the edge area of the liquid crystal display, and is arranged side by side with the liquid crystal panel under the glass cover, the fingerprint detection light source is mainly It is used to emit fingerprint excitation light to the fingerprint detection area of the liquid crystal panel.
  • the fingerprint module, electronic equipment and packaging method provided by the present invention form an accommodation cavity with a lens and a bracket after bending one side of the FPC, and a second reflector is arranged on the inner wall of the top of the accommodation cavity, and the accommodation cavity
  • the fingerprint sensor chip is arranged on the inner wall of the bottom of the cavity relative to the second mirror, and then the first mirror is arranged outside the cavity, so that the fingerprint image formed on the first mirror is sequentially reflected by the lens and the second mirror.
  • the fingerprint sensor chip is input after the mirror to realize the fingerprint recognition function of the fingerprint module, and the FPC is bent to form part of the side wall of the accommodating cavity, which makes the side wall and top of the accommodating cavity thinner, thereby reducing
  • the overall size of the manufactured fingerprint module is to reduce the installation space in the electronic device.
  • FIG. 1 is a schematic structural diagram of a fingerprint module provided in Embodiment 1 of the present invention in a first state before packaging;
  • Fig. 2 is a schematic cross-sectional view in the direction of A-A in Fig. 1;
  • Figure 3 is a schematic cross-sectional view in the direction of B-B in Figure 1;
  • FIG. 4 is a schematic structural diagram of the fingerprint module shown in FIG. 1 in a second state before packaging
  • Figure 5 is a schematic cross-sectional view in the direction of A-A in Figure 4.
  • Fig. 6 is a schematic cross-sectional view in the direction B-B in Fig. 4;
  • FIG. 7 is a schematic structural diagram of the fingerprint module provided in the first embodiment of the present invention during the bending process
  • FIG. 8 is a schematic cross-sectional view in the A-A direction of the fingerprint module provided by the first embodiment of the present invention after packaging;
  • FIG. 9 is a schematic cross-sectional view of the fingerprint module provided in the first embodiment of the present invention in the B-B direction after packaging;
  • FIG. 10 is a schematic cross-sectional view in the B-B direction of the fingerprint module provided in the second embodiment of the present invention after packaging;
  • FIG. 11 is a schematic structural diagram of the fingerprint module provided in Embodiment 3 of the present invention in the first state before packaging;
  • FIG. 12 is a schematic structural diagram of the fingerprint module shown in FIG. 11 in a second state before packaging
  • FIG. 13 is a schematic cross-sectional view in the C-C direction of the fingerprint module provided in the third embodiment of the present invention after packaging;
  • FIG. 14 is a schematic cross-sectional view of the fingerprint module provided in the third embodiment of the present invention in the D-D direction after packaging;
  • FIG. 15 is a schematic flowchart of a fingerprint module packaging method provided by Embodiment 4 of the present invention.
  • FIG. 16 is a schematic flowchart of a fingerprint module packaging method provided by Embodiment 5 of the present invention.
  • FIG. 17 is a schematic structural diagram of an electronic device according to Embodiment 6 of the present invention.
  • FIG. 18 is a schematic structural diagram of an electronic device according to Embodiment 7 of the present invention.
  • FIG. 1 is a schematic structural diagram of a fingerprint module provided in Embodiment 1 of the present invention in a first state before packaging.
  • FIG. 2 is a schematic cross-sectional view in the direction A-A in FIG. 1
  • FIG. 3 is a schematic cross-sectional view in the B-B direction in FIG. 1.
  • the fingerprint sensor chip 5, the first mirror 41, and the second mirror 42 may be assembled to a flexible circuit board (Flexible On the Printed Circuit Board (FPC for short) 2, the fingerprint sensor chip 5, the first mirror 41, and the second mirror 42 may be assembled using a high-precision placement machine.
  • an ultra-thin mirror can be used.
  • the thickness of the first mirror 41 and the second mirror 42 can be selected as 0.03 mm- The reflector is 0.15 mm, but the thickness of the first reflector 41 and the second reflector 42 is not specifically limited in this embodiment.
  • FIG. 4 is a schematic structural diagram of the fingerprint module shown in FIG. 1 in a second state before packaging
  • FIG. 5 is a schematic cross-sectional view in the A-A direction in FIG. 4
  • FIG. 6 is a schematic cross-sectional view in the B-B direction in FIG. 4.
  • the FPC 2 in this embodiment may be rectangular, and the first mirror 41, the lens 6, the second mirror 42 and the fingerprint sensor chip 5 may be arranged on the FPC 2 in parallel.
  • FIG. 7 is a schematic structural diagram of the fingerprint module provided in the first embodiment of the present invention during the bending process
  • FIG. 8 is a schematic cross-sectional view in the AA direction of the fingerprint module provided in the first embodiment of the present invention after packaging
  • FIG. 9 is the first embodiment of the present invention
  • the provided fingerprint module is a schematic cross-sectional view in the BB direction after packaging.
  • the side of the FPC2 close to the second reflector 42 can be bent into a U-shaped side wall, wherein the front opening of the U-shaped side wall faces the first reflector 41, and the lens 6 blocks the U-shaped side wall.
  • the front part of the U-shaped side wall is open, and the bracket 7 blocks the openings on both sides of the U-shaped side wall, thereby forming an accommodation cavity.
  • a sealant can also be arranged at the side wall of the accommodating cavity to form a sealed accommodating cavity to hold the fingerprint sensor chip 5 Set in a confined space.
  • the bracket 7 may be an integral type or a split combined type, which is not specifically limited in this embodiment.
  • the bracket 7 can be made of injection molding material, substrate material or metal or other materials.
  • the side of the FPC2 close to the second reflector 42 may first face the direction of the fingerprint sensor chip 5, that is, the first bending is performed in the first direction as shown in FIG. 6, where the first bending is performed after the first bending
  • the state is shown in Figure 7.
  • the FPC2 can be bent downward toward the fingerprint sensor chip 5, that is, the second bending is performed in the second direction as shown in FIG. 7, where the second bending is performed after the second bending.
  • the state is shown in Figure 9.
  • the second mirror 42 is now located on the inner wall of the top of the accommodating cavity, and the fingerprint sensor chip 5 is now located at the bottom of the accommodating cavity The position of the inner wall relative to the second reflecting mirror 42.
  • the first reflecting mirror 41 is arranged outside the accommodating cavity. As a result, the fingerprint image imaged in the first mirror 41 is input into the fingerprint sensor chip 5 after passing through the lens 6 and the second mirror 41 in turn, thereby realizing the fingerprint recognition function of the fingerprint module.
  • a first reinforcing plate 11 may also be provided at the bottom of the fingerprint module.
  • the FPC2 is disposed on the first reinforcing plate 11, and a first through hole is disposed on the FPC2, so that the first through hole and the first reinforcing plate 11 form a second part for accommodating the first reflecting mirror 41.
  • a second reinforcing plate 12 may also be provided on the outer side wall of the top of the accommodating cavity to form a protective structure on the top of the accommodating cavity.
  • the FPC2 is disposed on the first reinforcing plate 12, and a second through hole is disposed on the FPC2, so that the second through hole and the second reinforcing plate 12 form a first for accommodating the second reflector 42 Two containing tanks. That is, the second reinforcing plate 12 is the bottom of the second accommodating groove, and the second through hole on the FPC 2 is the groove wall of the second accommodating groove. As shown in FIG.
  • the second reflector 42 may be assembled on the second reinforcing plate 12 by a high-precision placement machine first, and then transformed into the inner wall of the top of the accommodating cavity during the bending process of the FPC2. Since the second reinforcing plate 12 has formed a protective structure on the top of the accommodating cavity, the size of the second reflector 42 can be designed to be the smallest size according to the actual optical signal transmission, so that only the inner wall of the top of the accommodating cavity is covered. Partial area.
  • FIG. 10 is a schematic cross-sectional view of the fingerprint module provided in the second embodiment of the present invention in the B-B direction after packaging.
  • the protection of the top of the containing cavity can also be achieved by covering the second reflector 42 on the inner side wall of the top of the containing cavity.
  • the second reflecting mirror 42 is arranged on the FPC2, and the second reflecting mirror 42 is transformed into the inner wall of the top of the accommodating cavity during the process of bending the FPC2. It can be understood that the second reflecting mirror 42 completely covers the accommodating cavity The inner wall of the top.
  • a light-emitting diode (Light-Emitting Diode, LED for short) 3 may also be provided on the FPC2.
  • the LED 3 is used to emit light to image a fingerprint image in the first reflector 41, and the method of imaging the fingerprint image can be realized by an optical method, which will not be repeated in this embodiment.
  • the LED 3 may be arranged on the periphery of the first reflecting mirror 41 or other positions on the FPC 2, for example, may be arranged symmetrically on both sides of the first reflecting mirror 41. It should be noted that the number of LEDs 3 provided on the FPC 2 and the locations of the LEDs 3 are not specifically limited in this embodiment.
  • the light emitted by the LED is infrared light with a wavelength of 850 nanometers or 940 nanometers.
  • the wavelength of the light emitted by the LED is also not specifically limited in this embodiment, and it only needs to ensure that the image can be imaged in the first reflector 41. Fingerprint image is fine.
  • a second reflector is arranged on the inner wall of the top of the housing cavity, and the inner wall of the bottom of the housing cavity is opposite to the first
  • the fingerprint sensor chip is arranged at the position of the second mirror, and then the first mirror is arranged outside the accommodating cavity, so that the fingerprint image formed on the first mirror passes through the lens and the second mirror in turn and then is input into the fingerprint sensor chip, so
  • the fingerprint recognition function of the fingerprint module is realized, and part of the side wall of the accommodating cavity is formed by bending the FPC, making the side wall and top of the accommodating cavity thinner, thereby reducing the overall size of the manufactured fingerprint module , To reduce the installation space in electronic equipment.
  • FIG. 11 is a schematic structural diagram of a fingerprint module provided in Embodiment 3 of the present invention in a first state before packaging.
  • the fingerprint sensor chip 5, the first reflector 41, and the second reflector 42 may be assembled to a flexible printed circuit board (Flexible Printed Circuit Board). , Referred to as FPC)2, where the fingerprint sensor chip 5, the first mirror 41, and the second mirror 42 can be assembled using a high-precision placement machine.
  • FPC Flexible Printed Circuit Board
  • an ultra-thin mirror can be used.
  • the thickness of the first mirror 41 and the second mirror 42 can be selected as 0.03 mm- The reflector is 0.15 mm, but the thickness of the first reflector 41 and the second reflector 42 is not specifically limited in this embodiment.
  • FIG. 12 is a schematic structural diagram of the fingerprint module shown in FIG. 11 in a second state before packaging. As shown in FIG. 12, after the fingerprint sensor chip 5, the first mirror 41, and the second mirror 42 are assembled on the FPC2, the lens 6 and the bracket 7 can be assembled.
  • the FPC2 in this embodiment may include a first FPC and a second FPC arranged perpendicular to each other, that is, the first FPC and the second FPC are arranged vertically to form an L-shaped FPC structure, where the second FPC may It is arranged on the left side of the first FPC, or can be arranged on the right side of the first FPC.
  • the second FPC may be provided on the left side of the first FPC for description.
  • the first reflecting mirror 41, the lens 6, the fingerprint sensor chip 5, and the bracket 7 are arranged on the first FPC
  • the second reflecting mirror 42 is arranged on the second FPC.
  • the bracket 7 constitutes a U-shaped side wall, the front opening of the U-shaped side wall faces the first reflector 41, the lens 6 blocks the front opening of the U-shaped side wall, and the second FPC is bent to block the top of the U-shaped side wall Opening to form a containing cavity.
  • a sealant can also be arranged at the side wall of the accommodating cavity to form a sealed accommodating cavity to hold the fingerprint sensor chip 5 Set in a confined space.
  • the bracket 7 may be an integral type or a split combined type, which is not specifically limited in this embodiment.
  • the bracket 7 can be made of injection molding material, substrate material or metal or other materials.
  • FIG. 13 is a schematic cross-sectional view of the fingerprint module provided in the third embodiment of the present invention in the C-C direction after packaging
  • FIG. 14 is a schematic cross-sectional view of the fingerprint module provided in the third embodiment of the present invention in the D-D direction after packaging.
  • the second FPC can be bent to the right, so that after bending, the second mirror 42 is located on the inner wall of the top of the accommodating cavity, and the fingerprint The sensing chip 5 is located at a position of the inner wall of the bottom of the containing cavity relative to the second reflecting mirror 42.
  • the first reflecting mirror 41 is arranged outside the accommodating cavity. As a result, the fingerprint image formed on the first mirror 41 is input into the fingerprint sensor chip 5 after passing through the lens 6 and the second mirror 41 in turn, thereby realizing the fingerprint recognition function of the fingerprint module.
  • the second FPC can be bent to the left.
  • the specific implementation principle is similar to that of the second FPC arranged on the left side of the first FPC. It will not be repeated in this embodiment.
  • a first reinforcing plate 11 may also be provided at the bottom of the fingerprint module.
  • the FPC2 is disposed on the first reinforcing plate 11, and a first through hole is disposed on the FPC2, so that the first through hole and the first reinforcing plate 11 form a second part for accommodating the first reflecting mirror 41.
  • a second reinforcing plate 12 may also be covered on the outer side wall of the top of the containing cavity, thereby forming a protective structure on the top of the containing cavity.
  • the FPC2 is disposed on the first reinforcing plate 12, and a second through hole is disposed on the FPC2, so that the second through hole and the second reinforcing plate 12 form a first for accommodating the second reflector 42 Two containing tanks. That is, the second reinforcing plate 12 is the bottom of the second accommodating groove, and the second through hole on the FPC 2 is the groove wall of the second accommodating groove.
  • the second reflector 42 can be assembled on the second reinforcing plate 12 by a high-precision placement machine first, and then transformed into the inner wall of the top of the accommodating cavity during the bending process of the FPC2. Since the second reinforcing plate 12 has formed a protective structure on the top of the accommodating cavity, the size of the second reflector 42 can be designed to be the smallest size according to the actual optical signal transmission, so that only the inner wall of the top of the accommodating cavity is covered. Partial area. In addition, the protection of the top of the containing cavity can also be achieved by covering the second reflector 42 on the inner side wall of the top of the containing cavity.
  • the second reflecting mirror 42 is arranged on the FPC2, and the second reflecting mirror 42 is transformed into the inner wall of the top of the accommodating cavity during the process of bending the FPC2. It can be understood that the second reflecting mirror 42 completely covers the accommodating cavity The inner wall of the top.
  • a light-emitting diode (Light-Emitting Diode, LED for short) 3 can also be provided on the FPC2.
  • the LED 3 is used to emit light to image a fingerprint image in the first reflector 41, and the method of imaging the fingerprint image can be realized optically, which will not be repeated in this embodiment.
  • the LED 3 may be arranged on the periphery of the first reflecting mirror 41 or other positions on the FPC 2, for example, may be arranged symmetrically on both sides of the first reflecting mirror 41. It should be noted that the number of LEDs 3 provided on the FPC 2 and the locations of the LEDs 3 are not specifically limited in this embodiment.
  • the light emitted by the LED is infrared light with a wavelength of 850 nanometers or 940 nanometers.
  • the wavelength of the light emitted by the LED is also not specifically limited in this embodiment, and it only needs to ensure that the image can be imaged in the first reflector 41. Fingerprint image is fine.
  • a second reflector is arranged on the inner wall of the top of the housing cavity, and the inner wall of the bottom of the housing cavity is opposite to the first
  • the fingerprint sensor chip is arranged at the position of the second mirror, and then the first mirror is arranged outside the accommodating cavity, so that the fingerprint image formed on the first mirror passes through the lens and the second mirror in turn and then is input into the fingerprint sensor chip, so
  • the fingerprint recognition function of the fingerprint module is realized, and part of the side wall of the accommodating cavity is formed by bending the FPC, making the side wall and top of the accommodating cavity thinner, thereby reducing the overall size of the manufactured fingerprint module , To reduce the installation space in electronic equipment.
  • An embodiment of the present invention also provides an electronic device, including the fingerprint module provided in any of the foregoing embodiments.
  • the electronic device can be a screen component, or can be a smart phone, a tablet computer, a personal computer, or an electronic device that requires a fingerprint identification operation.
  • the fingerprint module packaging method provided in this embodiment includes:
  • Step 101 Assemble the fingerprint sensor chip, the lens, the first reflector, the second reflector and the bracket on the flexible circuit board FPC.
  • the fingerprint sensor chip, the lens, the first mirror, the second mirror, and the bracket can be mounted on the flexible circuit board FPC by means of a high-precision placement machine.
  • the specific sequence of assembling the fingerprint sensor chip, lens, first mirror, second mirror, and bracket can be adjusted according to specific process requirements.
  • the fingerprint sensor chip can be attached first, and then the first reflector, second reflector, lens, and bracket; or the first reflector, second reflector, and then the fingerprint sensor chip, lens, and bracket. Bracket.
  • Step 102 Bending the FPC to set one side of the second reflector, so that the folded FPC, the lens and the bracket form an accommodating cavity, thereby forming a fingerprint module.
  • the FPC is bent to set one side of the second reflector, so that the folded FPC, the lens and the bracket form an accommodation cavity, wherein the first reflector is located outside the accommodation cavity, and the second reflector is on the FPC After bending, it is located on the inner wall of the top of the accommodating cavity, and the fingerprint sensor chip is located at the position of the inner wall of the bottom of the accommodating cavity relative to the second mirror, so that the fingerprint image formed on the first mirror is sequentially reflected by the lens and the second mirror Enter the fingerprint sensor chip after the mirror.
  • FIG. 16 is a schematic flowchart of a fingerprint module packaging method according to Embodiment 5 of the present invention. As shown in FIG. 16, the fingerprint module packaging method provided by this embodiment includes:
  • Step 201 Assemble the first reinforcing plate and the second reinforcing plate on the FPC.
  • Step 202 Assemble the light emitting diode LED on the FPC.
  • the light-emitting diode LED may be assembled on the FPC by means of Surface Mount Technology (SMT).
  • SMT Surface Mount Technology
  • the LED 3 may be arranged on the periphery of the first reflecting mirror 41 or other positions on the FPC 2, for example, it may be arranged symmetrically on both sides of the first reflecting mirror 41. It should be noted that the number of LEDs 3 provided on the FPC 2 and the locations of the LEDs 3 are not specifically limited in this embodiment.
  • Step 203 Assemble the fingerprint sensor chip, the lens, the first reflector, the second reflector and the bracket on the flexible circuit board FPC.
  • Step 204 Bending the FPC to set one side of the second reflector, so that the folded FPC, the lens and the bracket form an accommodating cavity, thereby forming a fingerprint module.
  • step 203 to step 204 in this embodiment refers to the description of steps 101 to 102 in the fourth embodiment, which will not be repeated here.
  • Step 205 Set up a sealant on the side wall of the accommodating cavity where it is blocked.
  • a sealant can also be arranged on the side wall of the accommodating cavity to form a sealed accommodating cavity to install the fingerprint sensor chip In a confined space.
  • the fingerprint module provided in this application is particularly suitable for electronic devices with a liquid crystal display (LCD) screen to implement a liquid crystal display fingerprint detection system.
  • the optical fingerprint system under the LCD screen can adopt the system architecture of the LCD fingerprint identification device as described in the international patent application PCT/CN2019/072598, and the entire content of the above application is incorporated into this patent application file by reference. .
  • FIG. 17 is a schematic structural diagram of an electronic device according to Embodiment 6 of the present invention. Please refer to FIG. 17.
  • the fingerprint module shown in FIG. 9 is applied to an electronic device with a liquid crystal display screen as an example.
  • the liquid crystal display screen of the electronic device to which the fingerprint module is applied includes a liquid crystal panel and a backlight module, wherein the backlight module is disposed under the liquid crystal panel, and is used to provide uniformity for the liquid crystal panel.
  • a visible light source enables the liquid crystal panel to display a picture.
  • a transparent protective cover such as a glass cover, may also be provided above the liquid crystal panel.
  • the liquid crystal panel may specifically display an area and a non-display area, and the non-display area is generally located in an edge area, that is, located at the chin portion of the electronic device.
  • the non-display area can be used to set a display driver chip and external connection wires.
  • the fingerprint module provided by the present application can be arranged between the backlight module and the liquid crystal panel, and located below the non-display area of the liquid crystal panel; and through the design of the optical path, the fingerprint module can be The fingerprint detection area is at least partially located within the display area of the liquid crystal panel.
  • the light source inside the fingerprint module (such as the light emitting diode 3 shown in FIG. 8) can emit to the fingerprint detection area located in the display area of the liquid crystal panel under the control of the fingerprint sensor chip 5.
  • the fingerprint excitation light may generally be invisible light, such as infrared light or light of other specific wavelengths. As shown in FIG. 17, when a finger is pressed on the fingerprint detection area, the fingerprint excitation light irradiates the finger and is reflected or scattered on the finger to form return light; the return light carries the finger
  • the fingerprint information can be used as fingerprint detection light.
  • the returning light enters the fingerprint module after passing through the liquid crystal panel, firstly after the first reflection of the first mirror 41 occurs, it is transmitted to the second mirror 42 through the lens 6, and is The second reflector 42 is transmitted to the fingerprint sensor chip 5 after the second reflection, and the fingerprint sensor chip 5 can perform optical imaging according to the received return light to obtain the fingerprint image of the finger.
  • the lens 6 may include at least one aspheric lens, and the incident surface of the lens 6 may also be formed as A micro-hole, the micro-hole can be formed by opening a micro-through hole in a non-transmissive layer or a non-transmissive material (such as the inside or outer casing of the lens barrel where the lens 6 is installed), and the center of the micro-hole can be slightly Deviate from the optical center of the lens 6, thereby expanding the field of view of the fingerprint module.
  • the fingerprint excitation light can also be provided by components independent of the outside of the fingerprint module, and it can be installed and fixed in other specific areas, as long as the fingerprint excitation light emitted by it can illuminate the The fingerprint detection area in the display area of the LCD panel is sufficient.
  • FIG. 18 is a schematic structural diagram of an electronic device according to Embodiment 7 of the present invention.
  • the fingerprint module may further include a fingerprint detection light source 21, which is arranged below the edge of the glass cover and close to the non-display area of the liquid crystal panel.
  • the fingerprint detection light source 21 may be arranged side by side with the liquid crystal panel under the glass cover.
  • the fingerprint detection light source 21 may be one or more, and it may also be installed and connected to the flexible circuit board 2 of the fingerprint module.
  • a light blocking layer may be provided between the fingerprint detection light source 21 and the liquid crystal panel, and the light blocking layer is mainly used to prevent the fingerprint detection light emitted by the fingerprint light source 21 from directly entering the place.
  • the liquid crystal panel affects the display performance of the liquid crystal panel.

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Abstract

本发明提供一种指纹模组、电子设备及封装方法。本发明提供的指纹模组，包括：柔性电路板FPC，以及设置在FPC上的透镜、指纹感应芯片以及支架，其中，FPC的一侧弯折后与透镜以及支架形成容置腔，在容置腔顶部的内壁上设置有第二反射镜，指纹感应芯片设置在容置腔的底部内壁相对于第二反射镜的位置上，并且，在容置腔的外部设置有第一反射镜，以使成像于第一反射镜中指纹图像依次经透镜与第二反射镜之后输入指纹感应芯片。本发明提供的指纹模组在实现指纹模组的指纹识别功能的同时，通过FPC弯折后形成容置腔的部分侧壁的方式，使得容置腔的侧壁以及顶部尺寸较薄，进而减小制造出的指纹模组整体尺寸，以减小在电子设备中的安装的空间。

Description

指纹模组、电子设备及封装方法 技术领域
本申请涉及指纹识别技术领域，尤其涉及一种指纹模组、电子设备及封装方法。
背景技术
随着生物识别传感器的发展，尤其是指纹识别传感器的迅猛发展，指纹模组被广泛应用于移动终端、智能家居、汽车电子等领域。
当前，对于屏下指纹模组的实设计，通常都是通过成型一体式支架的方式将指纹感应芯片封装在指纹模组中。
而通过一体式的支架形成容置指纹感应芯片的容置腔的方式，会导致容置腔的侧壁以及顶部尺寸较大，进而使得制造出的指纹模组的尺寸较大，需要在电子设备中占用较大的安装的空间。
发明内容
本发明提供一种指纹模组、电子设备及封装方法，以减小指纹模组的尺寸，从而减少在所安装的电子设备中所占用的安装空间。
第一方面，本发明提供一种指纹模组，包括：柔性电路板FPC，以及设置在所述FPC上的透镜、指纹感应芯片以及支架；
所述FPC的一侧弯折后与所述透镜以及所述支架形成容置腔；
所述容置腔顶部的内壁上设置有第二反射镜，所述指纹感应芯片设置在所述容置腔的底部内壁相对于所述第二反射镜的位置上；
在所述容置腔的外部设置有第一反射镜，以使成像于所述第一反射镜中指纹图像依次经所述透镜与所述第二反射镜之后输入所述指纹感应芯片。
在一种可能的设计方式中，所述FPC为矩形，所述第一反射镜、所述透镜、所述第二反射镜以及所述指纹感应芯片平行设置在所述FPC上；
所述FPC一侧弯折成U型侧壁，所述U型侧壁的前部开口朝向所述 第一反射镜，所述透镜封堵所述U型侧壁的前部开口，所述支架封堵所述U型侧壁的两侧开口，以形成所述容置腔。
在一种可能的设计方式中，所述FPC包括相互垂直设置的第一FPC以及第二FPC；
所述第一反射镜、所述透镜、所述指纹感应芯片以及所述支架设置在所述第一FPC上，所述第二反射镜设置在所述第二FPC上；
所述支架构成U型侧壁，所述U型侧壁的前部开口朝向所述第一反射镜，所述透镜封堵所述U型侧壁的前部开口，所述第二FPC弯折后封堵所述U型侧壁的顶部开口，以形成所述容置腔。
在一种可能的设计方式中，所述的指纹模组，还包括：设置在所述指纹模组底部的第一补强板；
所述FPC设置在所述第一补强板上；
所述FPC上设置有第一通孔，以使所述第一通孔与所述第一补强板形成用于容置所述第一反射镜的第一容置槽。
在一种可能的设计方式中，所述的指纹模组，还包括：第二补强板；
所述第二补强板覆盖在所述容置腔的顶部外侧壁上；
所述FPC上设置有第二通孔，以使所述第二通孔与所述第二补强板形成用于容置所述第二反射镜的第二容置槽。
在一种可能的设计方式中，所述第二反射镜设置在所述FPC上，且所述第二反射镜覆盖所述容置腔的顶部内侧壁。
在一种可能的设计方式中，所述的指纹模组，还包括：设置在所述FPC上的发光二极管LED；
所述LED用于发射光线，以在所述第一反射镜中成像所述指纹图像。
在一种可能的设计方式中，所述LED发射的光线为波长为850纳米或者940纳米的红外光线。
在一种可能的设计方式中，所述第一反射镜以及所述第二反射镜的厚度为0.03毫米-0.15毫米。
在一种可能的设计方式中，在所述容置腔的侧壁封堵处设置密封胶，以形成密封的所述容置腔。
第二方面，本发明提供一种电子设备，包括第一方面中所提供的任意一种指纹模组。
第三方面，本发明提供一种指纹模组封装方法，包括：
将指纹感应芯片、透镜、第一反射镜、第二反射镜以及支架装配至柔性电路板FPC上；
弯折所述FPC设置所述第二反射镜的一侧，以使弯折后的所述FPC与所述透镜以及所述支架形成容置腔，其中，所述第一反射镜位于所述容置腔的外部，所述第二反射镜在所述FPC弯折之后位于所述容置腔顶部的内壁上，所述指纹感应芯片位于所述容置腔的底部内壁相对于所述第二反射镜的位置上，以使成像于所述第一反射镜中指纹图像依次经所述透镜与所述第二反射镜之后输入所述指纹感应芯片。
在一种可能的设计中，在所述将指纹感应芯片、透镜、第一反射镜、第二反射镜以及支架装配至柔性电路板FPC上之前，还包括：
将发光二极管LED装配至所述FPC上。
在一种可能的设计中，在所述将发光二极管LED装配至所述FPC上之前，还包括：
在所述FPC远离所述指纹感应芯片的一侧上设置第一补强板，以使在所述FPC弯折之后，所述第一补强板设置在所述指纹模组底部，并且，所述FPC上设置有第一通孔，以使所述第一通孔与所述第一补强板形成用于容置所述第一反射镜的第一容置槽。
在一种可能的设计中，在所述FPC远离所述指纹感应芯片的一侧上设置第一补强板之后，还包括：
在所述FPC远离所述指纹感应芯片的一侧上设置第二补强板，以使在所述FPC弯折之后，所述第二补强板覆盖在所述容置腔的顶部外侧壁上，并且，所述FPC上设置有第二通孔，以使所述第二通孔与所述第二补强板形成用于容置所述第二反射镜的第二容置槽。
在一种可能的设计中，在所述弯折所述FPC设置所述第二反射镜的一侧，以使弯折后的所述FPC与所述透镜以及所述支架形成容置腔之后，还包括：
在所述容置腔的侧壁封堵处设置密封胶，以形成密封的所述容置腔。
第四方面，本发明还提供一种液晶显示屏指纹检测系统，包括指纹模组，用于设置在液晶面板的非显示区域下方，且所述指纹模组的指纹检测区域至少部分位于所述液晶面板的显示区域之中，其中，所述指纹模组为 第一方面中所提供的任意一种指纹模组。
在一种可能的设计中，所述指纹模组位于所述液晶显示屏的液晶面板和背光模组之间。
在一种可能的设计中，还包括指纹探测光源，所述指纹探测光源位于所述液晶显示屏的边缘区域，并与所述液晶面板并排设置在玻璃盖板的下方，所述指纹探测光源主要用于向所述液晶面板的指纹检测区域发射指纹激励光。
本发明提供的指纹模组、电子设备及封装方法，通过将FPC的一侧弯折后与透镜以及支架形成容置腔，并在容置腔顶部的内壁上设置第二反射镜，以及在容置腔的底部内壁相对于第二反射镜的位置设置指纹感应芯片，然后将第一反射镜设置在容置腔的外部，以使得成像于第一反射镜中指纹图像依次经透镜与第二反射镜之后输入指纹感应芯片，从而实现指纹模组的指纹识别功能，并且通过FPC弯折后形成容置腔的部分侧壁的方式，使得容置腔的侧壁以及顶部尺寸较薄，进而减小制造出的指纹模组整体尺寸，以减小在电子设备中的安装的空间。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例一提供的指纹模组在封装前第一状态的结构示意图；
图2为图1中A-A方向的剖面示意图；
图3为图1中B-B方向的剖面示意图；
图4为图1所示指纹模组在封装前第二状态的结构示意图；
图5为图4中A-A方向的剖面示意图；
图6为图4中B-B方向的剖面示意图；
图7为本发明实施例一提供的指纹模组弯折过程中的结构示意图；
图8为本发明实施例一提供的指纹模组封装后A-A方向的剖面示意图；
图9为本发明实施例一提供的指纹模组封装后B-B方向的剖面示意图；
图10为本发明实施例二提供的指纹模组封装后B-B方向的剖面示意图；
图11为本发明实施例三提供的指纹模组在封装前第一状态的结构示意图；
图12为图11所示指纹模组在封装前第二状态的结构示意图；
图13为本发明实施例三提供的指纹模组封装后C-C方向的剖面示意图；
图14为本发明实施例三提供的指纹模组封装后D-D方向的剖面示意图；
图15为本发明实施例四提供的指纹模组封装方法的流程示意图；
图16为本发明实施例五提供的指纹模组封装方法的流程示意图；
图17为本发明实施例六提供的电子设备的结构示意图；
图18为本发明实施例七提供的电子设备的结构示意图。
通过上述附图，已示出本公开明确的实施例，后文中将有更详细的描述。这些附图和文字描述并不是为了通过任何方式限制本公开构思的范围，而是通过参考特定实施例为本领域技术人员说明本公开的概念。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的本发明的实施例例如能够以除了在这里图示或描述的那些以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、 系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
下面以具体地实施例对本发明的技术方案以及本申请的技术方案如何解决上述技术问题进行详细说明。下面这几个具体的实施例可以相互结合，对于相同或相似的概念或过程可能在某些实施例中不再赘述。下面将结合附图，对本发明的实施例进行描述。
图1为本发明实施例一提供的指纹模组在封装前第一状态的结构示意图，图2为图1中A-A方向的剖面示意图，图3为图1中B-B方向的剖面示意图。如图1-图3所示，在本实施例所提供的指纹模组封装过程中，可以是先将指纹感应芯片5、第一反射镜41以及第二反射镜42装配至柔性电路板(Flexible Printed Circuit Board，简称FPC)2上，其中，指纹感应芯片5、第一反射镜41以及第二反射镜42可以是利用高精度贴片机进行装配。其中，为了使得指纹模组能够在厚度尺寸上可以做的更薄，可以采用超薄的反射镜，例如，对于第一反射镜41以及所述第二反射镜42的厚度可以选取为0.03毫米-0.15毫米的反射镜，但是，在本实施中并不对第一反射镜41以及所述第二反射镜42的厚度进行具体限定。
图4为图1所示指纹模组在封装前第二状态的结构示意图，图5为图4中A-A方向的剖面示意图，图6为图4中B-B方向的剖面示意图。如图4-图6所示，在将指纹感应芯片5、第一反射镜41以及第二反射镜42装配至FPC2上之后，可以继续组装透镜6和支架7。
继续参照图1-图6，本实施例中的FPC2可以为矩形，而第一反射镜41、透镜6、第二反射镜42以及指纹感应芯片5则可以平行设置在FPC2上。
图7为本发明实施例一提供的指纹模组弯折过程中的结构示意图，图8为本发明实施例一提供的指纹模组封装后A-A方向的剖面示意图，图9为本发明实施例一提供的指纹模组封装后B-B方向的剖面示意图。如图7-图9所示，FPC2靠近第二反射镜42的一侧可以弯折成U型侧壁，其中，U型侧壁的前部开口朝向第一反射镜41，透镜6封堵U型侧壁的前部开口，而支架7封堵U型侧壁的两侧开口，从而形成容置腔。
此外，为了能够对指纹模组中的指纹感应芯片5进行更好的保护，还 可以在容置腔的侧壁封堵处设置密封胶，从而形成密封的容置腔，以将指纹感应芯片5设置在密闭空间内。
其中，支架7可以是采用整体式的，也可以是采用分体组合式的，在本实施例中不作具体限定。而对于支架7可以是采用注塑材料、基板材料或者是金属等材料制成。
继续参照图6，FPC2靠近第二反射镜42的一侧可以先朝向指纹感应芯片5的方向，即如图6中的第一方向进行第一次弯折，其中，第一次弯折之后的状态如图7所示。在图7所示的结构的基础上，可以继续将FPC2朝向指纹感应芯片5向下弯折，即如图7中的第二方向进行第二次弯折，其中，第二次弯折之后的状态如图9所示。
在对FPC2的进行弯折与透镜6以及支架7形成容置腔之后，第二反射镜42此时则位于容置腔顶部的内壁上，而指纹感应芯片5此时则位于容置腔的底部内壁相对于第二反射镜42的位置上。第一反射镜41则是设置在容置腔的外部。从而使得成像于第一反射镜41中指纹图像依次经透镜6与第二反射镜41之后输入指纹感应芯片5，从而实现指纹模组的指纹识别功能。
继续参照图9，为了使得封装之后的指纹模组能够具有稳定的支撑结构，还可以在指纹模组底部设置第一补强板11。具体的，FPC2设置在第一补强板11上，并且，FPC2上设置有第一通孔，以使第一通孔与第一补强板11形成用于容置第一反射镜41的第一容置槽。即第一补强板11为第一容置槽的槽底，FPC2上的第一通孔为第一容置槽的槽壁，而第一反射镜41则可以是通过高精度贴片机装配至第一补强板11上。
继续参照图9，还可以在容置腔的顶部外侧壁上覆盖设置有第二补强板12，从而在容置腔的顶部形成保护结构。具体的，FPC2设置在第一补强板12上，并且，FPC2上设置有第二通孔，以使第二通孔与第二补强板12形成用于容置第二反射镜42的第二容置槽。即第二补强板12为第二容置槽的槽底，FPC2上的第二通孔为第二容置槽的槽壁。如图6所示，第二反射镜42可以是先通过高精度贴片机装配至第二补强板12上，然后，在对FPC2进行弯折的过程中变换为容置腔顶部的内壁。由于已经通过第二补强板12对容置腔的顶部形成保护结构，因此，第二反射镜42的尺寸可以根据实际的光路信号传输设计为最小尺寸，从而只覆盖容置腔顶部的内 壁的局部区域。
图10为本发明实施例二提供的指纹模组封装后B-B方向的剖面示意图。如图10所示，还可以是通过在容置腔的顶部内侧壁上覆盖第二反射镜42的方式实现对容置腔的顶部的保护。具体的，第二反射镜42设置在FPC2上，在对FPC2进行弯折的过程中第二反射镜42变换为容置腔顶部的内壁，可以理解为第二反射镜42完全覆盖了容置腔顶部的内壁。
除了上述通过第一补强板11对指纹模组的底部进行保护，以及通过第二补强板12或者完全覆盖容置腔顶部内壁的第二反射镜42对指纹模组的顶部进行保护之外，还可以利用聚酰亚胺薄膜(Polyimide Film，简称PI膜)、泡棉或者双面胶等材料对指纹模组的其他部分，例如指纹模组的侧壁进行保护。
继续参照图1、图2、图4、图5以及图8，还可以在FPC2上设置发光二极管(Light-Emitting Diode，简称LED)3。其中，LED3用于发射光线，以在第一反射镜41中成像指纹图像，而对于成像指纹图像的方式可以通过光学方式实现，在本实施例中不再进行赘述。可选的，LED3可以是设置在第一反射镜41的周边或者FPC2上的其他位置，例如可以是对称设置在第一反射镜41的两侧。值得说明的，对于FPC2上所设置的LED3的数量以及所设置的位置在本实施例中不作具体限定。而对于LED发射的光线为波长可以为850纳米或者940纳米的红外光线，但是，在本实施中同样并不对LED发射的光线为波长进行具体限定，只需保证能够在第一反射镜41中成像指纹图像即可。
在本实施例中，通过将FPC的一侧弯折后与透镜以及支架形成容置腔，并在容置腔顶部的内壁上设置第二反射镜，以及在容置腔的底部内壁相对于第二反射镜的位置设置指纹感应芯片，然后将第一反射镜设置在容置腔的外部，以使得成像于第一反射镜中指纹图像依次经透镜与第二反射镜之后输入指纹感应芯片，从而实现指纹模组的指纹识别功能，并且通过FPC弯折后形成容置腔的部分侧壁的方式，使得容置腔的侧壁以及顶部尺寸较薄，进而减小制造出的指纹模组整体尺寸，以减小在电子设备中的安装的空间。
图11为本发明实施例三提供的指纹模组在封装前第一状态的结构示意图。如图11所示，在本实施例所提供的指纹模组封装过程中，可以是先 将指纹感应芯片5、第一反射镜41以及第二反射镜42装配至柔性电路板(Flexible Printed Circuit Board，简称FPC)2上，其中，指纹感应芯片5、第一反射镜41以及第二反射镜42可以是利用高精度贴片机进行装配。其中，为了使得指纹模组能够在厚度尺寸上可以做的更薄，可以采用超薄的反射镜，例如，对于第一反射镜41以及所述第二反射镜42的厚度可以选取为0.03毫米-0.15毫米的反射镜，但是，在本实施中并不对第一反射镜41以及所述第二反射镜42的厚度进行具体限定。
图12为图11所示指纹模组在封装前第二状态的结构示意图。如图12所示，在将指纹感应芯片5、第一反射镜41以及第二反射镜42装配至FPC2上之后，可以继续组装透镜6和支架7。
继续参照图11-图12，本实施例中的FPC2可以包括相互垂直设置的第一FPC以及第二FPC，即第一FPC以及第二FPC垂直设置形成L形的FPC结构，其中第二FPC可以是设置在第一FPC的左侧，也可以是设置在第一FPC的右侧。其中，参照图11-图12，可以以第二FPC可以是设置在第一FPC的左侧进行说明。具体的，第一反射镜41、透镜6、指纹感应芯片5以及支架7设置在第一FPC上，而第二反射镜42则是设置在第二FPC上。支架7构成U型侧壁，U型侧壁的前部开口朝向第一反射镜41，透镜6封堵U型侧壁的前部开口，第二FPC弯折后封堵U型侧壁的顶部开口，以形成容置腔。
此外，为了能够对指纹模组中的指纹感应芯片5进行更好的保护，还可以在容置腔的侧壁封堵处设置密封胶，从而形成密封的容置腔，以将指纹感应芯片5设置在密闭空间内。
其中，支架7可以是采用整体式的，也可以是采用分体组合式的，在本实施例中不作具体限定。而对于支架7可以是采用注塑材料、基板材料或者是金属等材料制成。
图13为本发明实施例三提供的指纹模组封装后C-C方向的剖面示意图，图14为本发明实施例三提供的指纹模组封装后D-D方向的剖面示意图。如图13-图14所示，在本实施例中，可以是将第二FPC向右进行弯折，从而使得在弯折之后，第二反射镜42位于容置腔顶部的内壁上，而指纹感应芯片5位于容置腔的底部内壁相对于第二反射镜42的位置上。第一反射镜41则是设置在容置腔的外部。从而使得成像于第一反射镜41中指纹图 像依次经透镜6与第二反射镜41之后输入指纹感应芯片5，从而实现指纹模组的指纹识别功能。
值得说明地，若第二FPC是设置在第一FPC的右侧，则可以是将第二FPC向左进行弯折，其具体地实现原理与第二FPC是设置在第一FPC的左侧类似，在本实施例中不再进行赘述。
继续参照图13-图14，为了使得封装之后的指纹模组能够具有稳定的支撑结构，还可以在指纹模组底部设置第一补强板11。具体的，FPC2设置在第一补强板11上，并且，FPC2上设置有第一通孔，以使第一通孔与第一补强板11形成用于容置第一反射镜41的第一容置槽。即第一补强板11为第一容置槽的槽底，FPC2上的第一通孔为第一容置槽的槽壁，而第一反射镜41则可以是通过高精度贴片机装配至第一补强板11上。
继续参照图14，还可以在容置腔的顶部外侧壁上覆盖设置有第二补强板12，从而在容置腔的顶部形成保护结构。具体的，FPC2设置在第一补强板12上，并且，FPC2上设置有第二通孔，以使第二通孔与第二补强板12形成用于容置第二反射镜42的第二容置槽。即第二补强板12为第二容置槽的槽底，FPC2上的第二通孔为第二容置槽的槽壁。其中，第二反射镜42可以是先通过高精度贴片机装配至第二补强板12上，然后，在对FPC2进行弯折的过程中变换为容置腔顶部的内壁。由于已经通过第二补强板12对容置腔的顶部形成保护结构，因此，第二反射镜42的尺寸可以根据实际的光路信号传输设计为最小尺寸，从而只覆盖容置腔顶部的内壁的局部区域。此外，还可以是通过在容置腔的顶部内侧壁上覆盖第二反射镜42的方式实现对容置腔的顶部的保护。具体的，第二反射镜42设置在FPC2上，在对FPC2进行弯折的过程中第二反射镜42变换为容置腔顶部的内壁，可以理解为第二反射镜42完全覆盖了容置腔顶部的内壁。
除了上述通过第一补强板11对指纹模组的底部进行保护，以及通过第二补强板12或者完全覆盖容置腔顶部内壁的第二反射镜42对指纹模组的顶部进行保护之外，还可以利用聚酰亚胺薄膜(Polyimide Film，简称PI膜)、泡棉或者双面胶等材料对指纹模组的其他部分，例如指纹模组的侧壁进行保护。
继续参照图11-图13，为了对用户的指纹进行清晰成像，还可以在FPC2上设置发光二极管(Light-Emitting Diode，简称LED)3。其中，LED3 用于发射光线，以在第一反射镜41中成像指纹图像，而对于成像指纹图像的方式可以通过光学方式实现，在本实施例中不再进行赘述。可选的，LED3可以是设置在第一反射镜41的周边或者FPC2上的其他位置，例如可以是对称设置在第一反射镜41的两侧。值得说明的，对于FPC2上所设置的LED3的数量以及所设置的位置在本实施例中不作具体限定。而对于LED发射的光线为波长可以为850纳米或者940纳米的红外光线，但是，在本实施中同样并不对LED发射的光线为波长进行具体限定，只需保证能够在第一反射镜41中成像指纹图像即可。
在本实施例中，通过将FPC的一侧弯折后与透镜以及支架形成容置腔，并在容置腔顶部的内壁上设置第二反射镜，以及在容置腔的底部内壁相对于第二反射镜的位置设置指纹感应芯片，然后将第一反射镜设置在容置腔的外部，以使得成像于第一反射镜中指纹图像依次经透镜与第二反射镜之后输入指纹感应芯片，从而实现指纹模组的指纹识别功能，并且通过FPC弯折后形成容置腔的部分侧壁的方式，使得容置腔的侧壁以及顶部尺寸较薄，进而减小制造出的指纹模组整体尺寸，以减小在电子设备中的安装的空间。
本发明实施例还提供一种电子设备，包括上述任一实施例提供的指纹模组。其中，电子设备可以为屏幕组件，也可以为智能手机、平板电脑、个人计算机、指纹锁具需要进行指纹识别操作的电子设备。
图15为本发明实施例四提供的指纹模组封装方法的流程示意图。如图15所示，本实施例提供的指纹模组封装方法，包括：
步骤101、将指纹感应芯片、透镜、第一反射镜、第二反射镜以及支架装配至柔性电路板FPC上。
值得说明的，可以是通过高精度贴片机将指纹感应芯片、透镜、第一反射镜、第二反射镜以及支架以贴片的方式，安装至柔性电路板FPC上。而对于指纹感应芯片、透镜、第一反射镜、第二反射镜以及支架的装配具体顺序可以根据具体地工艺需求进行调整。例如，可以是先贴指纹感应芯片，然后再贴第一反射镜、第二反射镜、透镜以及支架；也可以是先贴第一反射镜、第二反射镜，再贴指纹感应芯片、透镜以及支架。
步骤102、弯折FPC设置第二反射镜的一侧，以使弯折后的FPC与透镜以及支架形成容置腔，从而形成指纹模组。
具体的，弯折FPC设置第二反射镜的一侧，以使弯折后的FPC与透镜以及支架形成容置腔，其中，第一反射镜位于容置腔的外部，第二反射镜在FPC弯折之后位于容置腔顶部的内壁上，指纹感应芯片位于容置腔的底部内壁相对于第二反射镜的位置上，以使成像于第一反射镜中指纹图像依次经透镜与第二反射镜之后输入指纹感应芯片。
图16为本发明实施例五提供的指纹模组封装方法的流程示意图。如图16所示，本实施例提供的指纹模组封装方法，包括：
步骤201、在FPC上组装第一补强板以及第二补强板。
步骤202、将发光二极管LED装配至FPC上。
具体的，发光二极管LED可以是通过表面贴装技术(Surface Mount Technology，简称SMT)的方式装配至FPC上。LED3可以是设置在第一反射镜41的周边或者FPC2上的其他位置，例如可以是对称设置在第一反射镜41的两侧。值得说明的，对于FPC2上所设置的LED3的数量以及所设置的位置在本实施例中不作具体限定。
步骤203、将指纹感应芯片、透镜、第一反射镜、第二反射镜以及支架装配至柔性电路板FPC上。
步骤204、弯折FPC设置第二反射镜的一侧，以使弯折后的FPC与透镜以及支架形成容置腔，从而形成指纹模组。
值得说明的，本实施例中步骤203-步骤204的具体实现方式参照实施例四中步骤101-102的描述，这里不再赘述。
步骤205、在容置腔的侧壁封堵处设置密封胶。
具体的，为了能够对指纹模组中的指纹感应芯片进行更好的保护，还可以在容置腔的侧壁封堵处设置密封胶，从而形成密封的容置腔，以将指纹感应芯片设置在密闭空间内。
本申请提供的指纹模组特别适用于具有液晶显示(LCD)屏幕的电子设备以实现液晶显示屏指纹检测系统。具体地，所述LCD屏下光学指纹系统可以采用如国际专利申请PCT/CN2019/072598所描述的液晶显示屏指纹识别装置的系统架构，上述申请的全部内容通过引用结合到本专利申请文件之中。
图17为本发明实施例六提供的电子设备的结构示意图。请参阅图17，本实施例以图9所示的指纹模组应用在具有液晶显示屏幕的电子设备为例，应 该理解，上述指纹模组各个实施例也同样适用，本申请对此不做限制。具体地，所述指纹模组所应用的电子设备的液晶显示屏幕包括液晶面板和背光模组，其中所述背光模组设置在所述液晶面板下方，其用于为所述液晶面板提供均匀的可见光源以使所述液晶面板显示画面。另一方面，所述液晶面板上方还可以设置有透明保护盖板，比如玻璃盖板。
所述液晶面板可以具体显示区域以及非显示区域，所述非显示区域一般位于边缘区域，即位于所述电子设备的下巴部分。所述非显示区域可以用于设置显示驱动芯片以及外部连接导线等。本申请提供的指纹模组可以设置在所述背光模组和所述液晶面板之间，并位于所述液晶面板的非显示区域的下方；并且，通过光路设计，可以使得所述指纹模组的指纹检测区域至少部分位于所述液晶面板的显示区域之内。
当所述指纹模组工作时，所述指纹模组内部的光源(比如图8所示的发光二极管3)可以在指纹感应芯片5的控制下向位于所述液晶面板显示区域的指纹检测区域发射指纹激励光，所述指纹激励光一般可以采用非可见光，比如红外光或者其他特定波长的光线。如图17所示，当手指按压在所述指纹检测区域时，所述指纹激励光照射到所述手指并在所述手指发生反射或者散射从而形成返回光；所述返回光携带有所述手指的指纹信息，因此可以作为指纹检测光。所述返回光穿过所述液晶面板之后进入所述指纹模组，首先在所述第一反射镜41发生第一次反射之后，经由透镜6传输到所述第二反射镜42，并在所述第二反射镜42发生第二次反射之后传输到所述指纹感应芯片5，所述指纹感应芯片5便可以根据接收到的返回光进行光学成像从而得到所述手指的指纹图像。
其中，为增大所述指纹模组在所述液晶面板显示区域的有效指纹检测区域的面积，所述透镜6可以包括至少一个非球面透镜，且在所述透镜6的入射面还可以形成为微孔，所述微孔可以通过在非透光层或者非透光材料(比如安装所述透镜6的镜筒内部或者外侧壳体)开设微型通孔来形成，所述微孔的中心可以稍微偏离与所述透镜6的光学中心，从而扩大所述指纹模组的视场角。
作为其他替代的实施例，所述指纹激励光也可以采用独立于所述指纹模组外部的元器件来提供，且其安装固定在其他特定区域，只要其发射的指纹激励光可以照射到所述液晶面板显示区域中的指纹检测区域便可。
比如，图18为本发明实施例七提供的电子设备的结构示意图。在图18所示的实施例中，所述指纹模组还可以包括指纹探测光源21，所述指纹探测光源21设置在所述玻璃盖板的边缘下方并靠近所述液晶面板非显示区域的部分，也即是说，所述指纹探测光源21可以与所述液晶面板并排设置在所述玻璃盖板的下方。所述指纹探测光源21可以为一个或者多个，且其也可以安装连接在所述指纹模组的柔性电路板2。并且，可选地，所述指纹探测光源21与所述液晶面板之间可以设置有阻光层，所述阻光层主要用于阻止所述指纹他侧光源21发射的指纹探测光直接进去所述液晶面板而对所述液晶面板的显示性能造成影响。
本领域技术人员在考虑说明书及实践这里公开的发明后，将容易想到本公开的其它实施方案。本发明旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由下面的权利要求书指出。
应当理解的是，本公开并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本公开的范围仅由所附的权利要求书来限制。

Claims (20)

  1. 一种指纹模组，其特征在于，包括：柔性电路板FPC，以及设置在所述FPC上的透镜、指纹感应芯片以及支架；
    所述FPC的一侧弯折后与所述透镜以及所述支架形成容置腔；
    所述容置腔顶部的内壁上设置有第二反射镜，所述指纹感应芯片设置在所述容置腔的底部内壁相对于所述第二反射镜的位置上；
    在所述容置腔的外部设置有第一反射镜，以使成像于所述第一反射镜中指纹图像依次经所述透镜与所述第二反射镜之后输入所述指纹感应芯片。
  2. 根据权利要求1所述的指纹模组，其特征在于，所述FPC为矩形，所述第一反射镜、所述透镜、所述第二反射镜以及所述指纹感应芯片平行设置在所述FPC上；
    所述FPC一侧弯折成U型侧壁，所述U型侧壁的前部开口朝向所述第一反射镜，所述透镜封堵所述U型侧壁的前部开口，所述支架封堵所述U型侧壁的两侧开口，以形成所述容置腔。
  3. 根据权利要求1所述的指纹模组，其特征在于，所述FPC包括相互垂直设置的第一FPC以及第二FPC；
    所述第一反射镜、所述透镜、所述指纹感应芯片以及所述支架设置在所述第一FPC上，所述第二反射镜设置在所述第二FPC上；
    所述支架构成U型侧壁，所述U型侧壁的前部开口朝向所述第一反射镜，所述透镜封堵所述U型侧壁的前部开口，所述第二FPC弯折后封堵所述U型侧壁的顶部开口，以形成所述容置腔。
  4. 根据权利要求2或3所述的指纹模组，其特征在于，还包括：设置在所述指纹模组底部的第一补强板；
    所述FPC设置在所述第一补强板上；
    所述FPC上设置有第一通孔，以使所述第一通孔与所述第一补强板形成用于容置所述第一反射镜的第一容置槽。
  5. 根据权利要求4所述的指纹模组，其特征在于，还包括：第二补强板；
    所述第二补强板覆盖在所述容置腔的顶部外侧壁上；
    所述FPC上设置有第二通孔，以使所述第二通孔与所述第二补强板形 成用于容置所述第二反射镜的第二容置槽。
  6. 根据权利要求4所述的指纹模组，其特征在于，所述第二反射镜设置在所述FPC上，且所述第二反射镜覆盖所述容置腔的顶部内侧壁。
  7. 根据权利要求1-3中任意一项所述的指纹模组，其特征在于，还包括：设置在所述FPC上的发光二极管LED；
    所述LED用于发射光线，以在所述第一反射镜中成像所述指纹图像。
  8. 根据权利要求7所述的指纹模组，其特征在于，所述LED发射的光线为波长为850纳米或者940纳米的红外光线。
  9. 根据权利要求1-3中任意一项所述的指纹模组，其特征在于，所述第一反射镜以及所述第二反射镜的厚度为0.03毫米-0.15毫米。
  10. 根据权利要求1-3中任意一项所述的指纹模组，其特征在于，在所述容置腔的侧壁封堵处设置密封胶，以形成密封的所述容置腔。
  11. 根据权利要求1-3中任意一项所述的指纹模组，其特征在于，所述透镜的入射面形成有微孔，所述微孔用于扩大所述指纹模组的有效视场角，且所述微孔与所述透镜的光学中心偏离。
  12. 一种电子设备，其特征在于，包括如权利要求1-11中任意一项所述的指纹模组。
  13. 一种指纹模组封装方法，其特征在于，包括：
    将指纹感应芯片、透镜、第一反射镜、第二反射镜以及支架装配至柔性电路板FPC上；
    弯折所述FPC设置所述第二反射镜的一侧，以使弯折后的所述FPC与所述透镜以及所述支架形成容置腔，其中，所述第一反射镜位于所述容置腔的外部，所述第二反射镜在所述FPC弯折之后位于所述容置腔顶部的内壁上，所述指纹感应芯片位于所述容置腔的底部内壁相对于所述第二反射镜的位置上，以使成像于所述第一反射镜中指纹图像依次经所述透镜与所述第二反射镜之后输入所述指纹感应芯片。
  14. 根据权利要求13所述的指纹模组封装方法，其特征在于，在所述将指纹感应芯片、透镜、第一反射镜、第二反射镜以及支架装配至柔性电路板FPC上之前，还包括：
    将发光二极管LED装配至所述FPC上。
  15. 根据权利要求14所述的指纹模组封装方法，其特征在于，在所述 将发光二极管LED装配至所述FPC上之前，还包括：
    在所述FPC远离所述指纹感应芯片的一侧上设置第一补强板，以使在所述FPC弯折之后，所述第一补强板设置在所述指纹模组底部，并且，所述FPC上设置有第一通孔，以使所述第一通孔与所述第一补强板形成用于容置所述第一反射镜的第一容置槽。
  16. 根据权利要求15所述的指纹模组封装方法，其特征在于，在所述FPC远离所述指纹感应芯片的一侧上设置第一补强板之后，还包括：
    在所述FPC远离所述指纹感应芯片的一侧上设置第二补强板，以使在所述FPC弯折之后，所述第二补强板覆盖在所述容置腔的顶部外侧壁上，并且，所述FPC上设置有第二通孔，以使所述第二通孔与所述第二补强板形成用于容置所述第二反射镜的第二容置槽。
  17. 根据权利要求13-16中任意一项所述的指纹模组封装方法，其特征在于，在所述弯折所述FPC设置所述第二反射镜的一侧，以使弯折后的所述FPC与所述透镜以及所述支架形成容置腔之后，还包括：
    在所述容置腔的侧壁封堵处设置密封胶，以形成密封的所述容置腔。
  18. 一种液晶显示屏指纹检测系统，其特征在于，包括指纹模组，用于设置在液晶面板的非显示区域下方，且所述指纹模组的指纹检测区域至少部分位于所述液晶面板的显示区域之中，其中，所述指纹模组为如权利要求1-11中任意一项所述的指纹模组。
  19. 根据权利要求18所述的液晶显示屏指纹检测系统，其特征在于，所述指纹模组位于所述液晶显示屏的液晶面板和背光模组之间。
  20. 根据权利要求18所述的液晶显示屏指纹检测系统，其特征在于，还包括指纹探测光源，所述指纹探测光源位于所述液晶显示屏的边缘区域，并与所述液晶面板并排设置在玻璃盖板的下方，所述指纹探测光源主要用于向所述液晶面板的指纹检测区域发射指纹激励光。
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106960198A (zh) * 2017-03-29 2017-07-18 华勤通讯技术有限公司 指纹识别装置及电子设备
US20190026533A1 (en) * 2017-07-21 2019-01-24 Primax Electronics Ltd. Package structure of fingerprint identification chip
CN109460731A (zh) * 2018-11-05 2019-03-12 京东方科技集团股份有限公司 一种显示装置和指纹模组的贴合方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204480267U (zh) * 2015-03-06 2015-07-15 南昌欧菲生物识别技术有限公司 指纹识别模组及基于指纹识别的触控屏
US10380395B2 (en) * 2016-09-30 2019-08-13 Synaptics Incorporated Optical sensor with angled reflectors
CN206332018U (zh) * 2016-10-27 2017-07-14 江苏凯尔生物识别科技有限公司 指纹识别模组的封装结构
CN206282307U (zh) * 2016-12-28 2017-06-27 南昌欧菲生物识别技术有限公司 指纹识别按键及电子装置
CN209879523U (zh) * 2019-04-04 2019-12-31 深圳市汇顶科技股份有限公司 指纹模组、电子设备及液晶显示屏指纹检测系统

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106960198A (zh) * 2017-03-29 2017-07-18 华勤通讯技术有限公司 指纹识别装置及电子设备
US20190026533A1 (en) * 2017-07-21 2019-01-24 Primax Electronics Ltd. Package structure of fingerprint identification chip
CN109460731A (zh) * 2018-11-05 2019-03-12 京东方科技集团股份有限公司 一种显示装置和指纹模组的贴合方法

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