WO2020196031A1 - Cover tape for paper carrier tapes, package for electronic component conveyance, and electronic component package - Google Patents
Cover tape for paper carrier tapes, package for electronic component conveyance, and electronic component package Download PDFInfo
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- WO2020196031A1 WO2020196031A1 PCT/JP2020/011462 JP2020011462W WO2020196031A1 WO 2020196031 A1 WO2020196031 A1 WO 2020196031A1 JP 2020011462 W JP2020011462 W JP 2020011462W WO 2020196031 A1 WO2020196031 A1 WO 2020196031A1
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- paper carrier
- carrier tape
- tape
- cover tape
- cover
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D73/00—Packages comprising articles attached to cards, sheets or webs
- B65D73/02—Articles, e.g. small electrical components, attached to webs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
Definitions
- the present invention relates to a cover tape for paper carrier tape, a packaging body for transporting electronic parts, and a packaging body for electronic parts.
- a carrier tape used for transporting or storing electronic parts such as microchips As a packaging material, a carrier tape used for transporting or storing electronic parts such as microchips is known. By using this carrier tape, it is possible to store and transport electronic parts and the like, which are difficult to handle due to their too small size, by accommodating them one by one in the recesses provided in the carrier tape.
- the carrier tape has a recess that can accommodate electronic components and the like, and is packaged by closing the recess with a cover tape. After transporting and storing in this state, the carrier tape is set in a parts assembly machine (mounting machine) called a mounter, and the stored electronic parts and the like can be taken out.
- Patent Document 1 Japanese Unexamined Patent Publication No. 2004-51105.
- Patent Document 1 describes a cover tape having a structure in which a plastic film layer, a thermosetting resin layer containing an adhesive-imparting agent, and an antistatic blocking prevention layer are laminated.
- the antistatic blocking prevention layer is formed to a thickness of 0.01 to 0.5 ⁇ m by a composition in which a quaternary ammonium salt-type cationic surfactant is dispersed in a urethane resin, an acrylic resin, or a polyester resin. The configuration is disclosed
- the carrier tape a paper carrier tape based on paper may be used.
- the cover tape for the paper carrier tape has an appropriate adhesiveness (that is, an adhesiveness that can be easily peeled off when peeling off while having the necessary adhesiveness to the paper carrier tape. ), And there is no paper peeling when peeling from the paper carrier tape (that is, the base paper is not peeled and fluffed).
- antistatic properties are also required to prevent electronic components from sticking to the cover tape or popping out of the cover tape when the electronic components are taken out.
- the conventional cover tape for paper carrier tape as described in Patent Document 1 has adhesiveness to the paper carrier tape, easy peeling property from the paper carrier tape, and antistatic property. It became clear that there is room for improvement in the performance balance of.
- the present invention has been made in view of the above circumstances, and provides a cover tape for a paper carrier tape having an excellent balance of adhesiveness to a paper carrier tape, easy peeling property from a paper carrier tape, and antistatic property. Is.
- the paper carrier is formed by laminating the base material layer (A), the heat-sealing layer (B) containing the thermoplastic resin, and the antistatic layer (C) containing the conductive polymer in this order.
- the cover tape for a paper carrier tape having an excellent balance of adhesiveness to a tape, easy peelability from a paper carrier tape, and antistatic property can be obtained, and have completed the present invention.
- cover tape for paper carrier tape packaging for transporting electronic components, and packaging for electronic components are provided.
- a base material layer (A), a heat-sealing layer (B) containing a thermoplastic resin, and an antistatic layer (C) containing a conductive polymer are provided in this order.
- MFR melt flow rate
- a cover tape for paper carrier tape in which the conductive polymer contains polythiophene [7] In the cover tape for paper carrier tape according to any one of the above [1] to [6]. A cover tape for a paper carrier tape having a thickness of the antistatic layer (C) of 0.001 ⁇ m or more and 5.0 ⁇ m or less.
- Paper carrier tape with recesses that can store electronic components The cover tape that is heat-bonded to the paper carrier tape and It is a packaging body for transporting electronic parts equipped with A packaging body for transporting electronic components, wherein the cover tape includes the cover tape for the paper carrier tape according to any one of the above [1] to [7].
- a cover tape for a paper carrier tape having an excellent balance of adhesiveness to the paper carrier tape, easy peeling property from the paper carrier tape, and antistatic property.
- FIG. 1 is a cross-sectional view schematically showing an example of the structure of the cover tape 10 for paper carrier tape according to the embodiment of the present invention.
- the cover tape 10 for a paper carrier tape according to the present embodiment includes a base material layer (A), a heat-sealing layer (B) containing a thermoplastic resin, an antistatic layer (C) containing a conductive polymer, and the like.
- the melt flow rate (MFR) of the above thermoplastic resin is 0.1 g / 10 minutes or more and 150 g / 10 minutes or less, which is measured under the condition of 190 ° C. and 2160 g load in accordance with JIS K7210: 1999. Is.
- the conventional cover tape for paper carrier tape as described in Patent Document 1 has adhesiveness to the paper carrier tape and easy peeling from the paper carrier tape. It became clear that there is room for improvement in the performance balance between sex and antistatic properties.
- the present inventors have made extensive studies to achieve the above problems.
- the paper carrier is formed by laminating the base material layer (A), the heat-sealing layer (B) containing the thermoplastic resin, and the antistatic layer (C) containing the conductive polymer in this order. It has been found that a cover tape for a paper carrier tape having an excellent balance of adhesiveness to a tape, easy peeling property from a paper carrier tape, and antistatic property can be obtained. That is, the cover tape 10 for the paper carrier tape according to the present embodiment has a good balance of adhesiveness to the paper carrier tape, easy peelability from the paper carrier tape, and antistatic property by having the above layer structure. Can be.
- the base material layer (A) is a layer provided for the purpose of improving the handleability, mechanical properties, heat resistance, and other properties of the cover tape 10 for paper carrier tape.
- the base material layer (A) is a plate-like material (sheet or sheet) made of, for example, paper, aluminum, polyester (for example, polyethylene terephthalate), polyethylene, polypropylene, polystyrene, polyamide, aluminum-deposited polyester, aluminum-deposited polypropylene, silica-deposited polyester, or the like. Film) and the like. Among these, a sheet or film made of polyethylene terephthalate is preferable.
- These base material layers (A) may have not only a single layer structure but also a laminated structure of two or more layers.
- the thickness of the base material layer (A) is, for example, 5 ⁇ m or more and 100 ⁇ m or less, preferably 10 ⁇ m or more and 50 ⁇ m or less, from the viewpoint of mechanical strength and workability.
- the base material layer (A) has a corona treatment, a plasma treatment, and a flame on the surface on the side to be bonded (or laminated) with the heat-sealing layer (B) in order to increase the adhesive strength with the heat-sealing layer (B). Physical treatment such as treatment and ozone treatment may be performed. Further, the base material layer (A) may be subjected to a known anchor coating treatment.
- the heat-sealable layer (B) is a layer for imparting heat-sealability to the cover tape 10 for the paper carrier tape according to the present embodiment, and contains a thermoplastic resin.
- the heat-sealing layer (B) may be a single layer or may have a laminated structure of two or more layers.
- the thickness of the heat-sealing layer (B) is, for example, 1 ⁇ m or more and 300 ⁇ m or less, preferably 5 ⁇ m or more and 200 ⁇ m or less, and more preferably 10 ⁇ m or more and 150 ⁇ m or less.
- thermoplastic resin examples include polyethylenes such as high-density polyethylene, high-pressure low-density polyethylene, low-density polyethylene (LDPE), and linear low-density polyethylene (LLDPE), and ethylene / unsaturated carboxylic acid-based polymers.
- polyethylenes such as high-density polyethylene, high-pressure low-density polyethylene, low-density polyethylene (LDPE), and linear low-density polyethylene (LLDPE), and ethylene / unsaturated carboxylic acid-based polymers.
- Polymers ethylene / vinyl ester copolymers, ethylene / ⁇ -olefin copolymers, ethylene-based copolymers such as elastomers, polypropylene, propylene-based copolymers (polymers of propylene and ⁇ -olefins other than propylene) , Polybutene, and other olefin-based (co) polymers, and polyolefins such as blends of these polymers.
- the ⁇ -olefin include propylene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1-decene, 1-dodecene, 4-methyl-1-pentene and the like.
- the thermoplastic resin preferably contains polyolefin, and more preferably contains at least one selected from the group consisting of polyethylene and ethylene-based copolymers, and polyethylene and ethylene.
- -It is further preferable to contain at least one selected from the group consisting of vinyl ester copolymers, even more preferably to contain an ethylene-vinyl ester copolymer, and even more preferably to contain an ethylene-vinyl acetate copolymer. It is preferable to contain both an ethylene-vinyl acetate copolymer and a linear low-density polyethylene.
- the melt flow rate (MFR) of a thermoplastic resin measured under the conditions of 190 ° C. and 2160 g load according to JIS K7210: 1999 is 0.1 g / 10 minutes or more and 150 g / from the viewpoint of workability and mechanical strength. It is preferably 10 minutes or less, more preferably 0.1 g / 10 minutes or more and 50 g / 10 minutes or less, and 0.5 g / 10 minutes or more and 50 g / 10 minutes or less is 1.0 g / 10. It is particularly preferable that the amount is 30 g / 10 minutes or more.
- the content of the thermoplastic resin in the heat-sealing layer (B) according to the present embodiment is preferably 50% by mass or more and 100% by mass or less when the whole of the heat-sealing layer (B) is 100% by mass. It is more preferably 70% by mass or more and 99% by mass or less, still more preferably 7075% by mass or more and 95% by mass or less, and further preferably 80% by mass or more and 95% by mass or less. As a result, the balance between the adhesiveness with the antistatic layer and the heat sealability can be improved.
- the ethylene / vinyl ester copolymer according to the present embodiment contains at least a structural unit derived from ethylene and a structural unit derived from vinyl ester.
- the ethylene / vinyl ester copolymer may be a random copolymer, a block copolymer, or an alternating copolymer.
- Examples of the ethylene / vinyl ester copolymer include an ethylene / vinyl butyrate copolymer, an ethylene / vinyl acetate copolymer, an ethylene / vinyl propionate copolymer, and an ethylene / vinyl stearate copolymer.
- Ethylene-vinyl acetate copolymer is preferable.
- the content of the structural unit derived from ethylene is preferably 50% by mass or more and 95% by mass or less, and 70% by mass or more, based on the total mass of the ethylene / vinyl ester copolymer from the viewpoint of film forming processability. More preferably, it is 95% by mass or less.
- the content of the structural unit derived from vinyl ester is preferably 5% by mass or more and 50% by mass or less with respect to the total mass of the ethylene / vinyl ester copolymer, and is 5% by mass or more and 30% by mass. It is more preferably mass% or less.
- the ethylene / vinyl ester copolymer may further contain a structural unit derived from the vinyl ester and a monomer other than ethylene, as long as the characteristics of one embodiment of the present invention are not impaired. However, it is preferable that the content of the structural unit derived from other monomers does not exceed the content of the structural unit derived from vinyl ester.
- the ethylene / vinyl ester copolymer may be produced by a conventionally known method, or a commercially available one may be used.
- the melt flow rate (MFR) of an ethylene / vinyl ester copolymer measured at 190 ° C. and a load of 2160 g according to JIS K7210: 1999 is 0.1 g / 10 from the viewpoint of workability and mechanical strength. Minutes or more and 150 g / 10 minutes or less is preferable, 0.1 g / 10 minutes or more and 50 g / 10 minutes or less is more preferable, and 1.0 g / 10 minutes or more and 50 g / 10 minutes or less is 5 g. It is particularly preferably / 10 minutes or more and 30 g / 10 minutes or less.
- the heat-sealable layer (B) preferably contains a tackifier resin in addition to the above-mentioned thermoplastic resin. Since the tackifying resin has a function of imparting tackiness to the resin, it is possible to easily adjust the adhesive strength of the heat-sealing layer (B).
- the tackifying resin is selected from resins having a function of imparting tackiness. Examples of the tackifier resin include aromatic hydrocarbon resins, alicyclic hydrocarbon resins, aliphatic hydrocarbon resins, terpene resins, rosins, styrene resins, and kumaron-inden resins.
- the aromatic hydrocarbon resin examples include resins obtained by polymerizing a fraction containing at least one vinyl aromatic hydrocarbon having 8 to 10 carbon atoms such as vinyl toluene, indene, and ⁇ -methylstyrene. Examples thereof include a resin obtained by copolymerizing a distillate and an aliphatic hydrocarbon distillate. Examples of the alicyclic hydrocarbon resin include a resin obtained by cyclizing and dimerizing the diene component in the Spent C4 to C5 distillates and then polymerizing the resin, a resin obtained by polymerizing a cyclic monomer such as cyclopentadiene, and an aromatic resin.
- Examples thereof include a resin in which a hydrocarbon resin is hydrogenated in the nucleus (for example, a hydride petroleum resin).
- a hydrocarbon resin for example, a distillate containing at least one or more mono or diolefin having 4 to 5 carbon atoms such as 1-butene, isobutene, butadiene, 1,3-pentadiene, and isoprene is polymerized.
- the resin obtained by Examples of the terpene-based resin include ⁇ -pinene polymer, ⁇ -pinene polymer, dipentene polymer, terpene-phenol copolymer, ⁇ -pinene-phenol copolymer, and hydrogenated products thereof.
- rosins examples include rosins such as gum rosin, wood rosin, and tall oil and their modified products, and examples of the modified products include those subjected to modification such as hydrogenation, disproportionation, dimerization, and esterification. ..
- styrene-based resin examples include resin-like polymers having a low molecular weight obtained by polymerizing styrene-based monomers such as styrene, vinyltoluene, ⁇ -methylstyrene, and isopropyltoluene.
- the tackifier resin is preferably a resin having a softening point of 85 ° C. to 130 ° C. Generally, when the softening point is 85 ° C. or higher, the effect of excellent heat resistance tends to be exhibited, and when the temperature is 130 ° C. or lower, the effect of imparting adhesiveness tends to be excellent.
- a value measured based on the softening point test method (ring ball method) in accordance with JIS-K2207: 2006 can be used.
- the content of the tackifier resin in the heat-sealable layer (B) according to the present embodiment is 1% by mass or more and 30% by mass or less when the entire heat-sealable layer (B) is 100% by mass. It is more preferable that it is 5% by mass or more and 25% by mass or less, and further preferably 5% by mass or more and 20% by mass or less.
- the heat-sealable layer (B) according to the present embodiment can contain components other than the thermoplastic resin and the tackifier resin as long as the object of the present invention is not impaired.
- the other components are not particularly limited, but are, for example, a plasticizer, an antioxidant, an ultraviolet absorber, an antioxidant, a surfactant, a colorant, a light stabilizer, a foaming agent, a lubricant, a crystal nucleating agent, and crystallization.
- thermoplastic resin other than the above thermoplastic resin thermosetting resin, inorganic filler, organic filler, impact resistance improver, slip agent, cross-linking agent, cross-linking aid Agents, tackifiers other than the above tackifier resins, silane coupling agents, processing aids, mold release agents, hydrolysis inhibitors, heat stabilizers, antiblocking agents, antifogging agents, flame retardants, flame retardant aids, Examples thereof include light diffusers, antibacterial agents, anti-crosslinking agents, dispersants and other resins. Other components may be used alone or in combination of two or more.
- the antistatic layer (C) is a layer for preventing or suppressing the charge of the cover tape 10 for the paper carrier tape according to the present embodiment, and contains a conductive polymer. These antistatic layers (C) may have not only a single layer structure but also a laminated structure of two or more layers.
- the conductive polymer is not particularly limited, and examples thereof include polythiophene, polyaniline, polypyrrole, polyethyleneimine, and allylamine-based polymers. Such conductive polymers can be used alone or in combination of two or more.
- Polythiophene is preferable from the viewpoint of low humidity dependence of antistatic performance.
- the polythiophene refers to a polymer of unsubstituted or substituted thiophene.
- the substituted thiophene polymer poly (3,4-ethylenedioxythiophene) is preferable.
- the antistatic layer (C) may contain other antistatic components such as an organic conductive substance other than the conductive polymer, an inorganic conductive substance, and an antistatic agent, if necessary.
- the antistatic layer (C) may contain a binder resin in addition to the above-mentioned conductive polymer.
- the binder resin is used in the coating material. It is used by dissolving it in a solvent or as an aqueous emulsion (aqueous dispersion).
- binder resin a known binder resin can be used, and a water-soluble resin or a water-dispersible resin having a hydrophilic group such as a carboxyl group, for example, a chlorinated polypropylene resin, a styrene / acrylic copolymer resin, polyurethane, etc. Examples thereof include emulsions of polyester ionomers and the like, water-soluble polyester resins, water-dispersible polyester resins and the like.
- the method for forming the antistatic layer (C) is not particularly limited, and for example, a coating material in which a coating composition containing a conductive polymer and a binder resin is dissolved or dispersed in a solvent is applied to the surface of the heat-sealing layer (B).
- a coating material in which a coating composition containing a conductive polymer and a binder resin is dissolved or dispersed in a solvent is applied to the surface of the heat-sealing layer (B).
- a known method such as a gravure coating method, a roll coating method, a dip coating method, or a spraying method can be used.
- the coated surface may be subjected to a corona discharge treatment or a primer treatment with another coating agent.
- the solvent used for the coating material for example, water or a mixed solvent of water and a water-soluble organic solvent is used.
- the water-soluble organic solvent include alcohols such as methanol, ethanol, isopropyl alcohol and n-propyl alcohol, glycols such as ethylene glycol, diethylene glycol, glycol monomethyl ether and glycol monoethyl ether or derivatives thereof, acetone, methyl ethyl ketone and the like.
- examples thereof include ketones, water-soluble ethers such as tetrahydrofuran, and water-soluble esters such as ethyl acetate.
- the total concentration of the conductive polymer dissolved or dispersed in the solvent and the binder resin used as needed is not particularly limited as long as it is suitable for the coating method on the heat-sealing layer (B), but for example. , 0.1 to 40% by mass, preferably 0.2 to 30% by mass. If necessary, components other than the above, such as a surfactant and an antifoaming agent for improving the wettability to the coated body, can be added to the coating material.
- the thickness of the antistatic layer (C) is not particularly limited and can be set as appropriate, but is preferably 0.001 to 5.0 ⁇ m, and more preferably 0.01 to 3.0 ⁇ m.
- the paper carrier tape cover tape 10 may be provided with an intermediate layer such as polyethylene between the heat-sealing layer (B) and the base material layer (A).
- the intermediate layer is provided in order to enhance the adhesiveness between the heat-sealable layer (B) and the base material layer (A) and to enhance the workability when forming the heat-sealable layer (B). It is a layer to be.
- Examples thereof include a so-called thermal laminating method, a dry laminating method, a sand laminating method, a coextrusion inflation method, and a coextrusion T-die method in which the resulting composition is laminated with the base material layer (A).
- the packaging for transporting electronic parts includes a paper carrier tape having a recess for storing electronic parts and a cover tape that is heat-bonded to the paper carrier tape.
- the cover tape includes the paper carrier tape cover tape 10 according to the present embodiment.
- a bottom cover tape can be heat-sealed on one side (lower surface) of a storage mount having a plurality of punched holes formed at regular intervals in the length direction, and electronic components can be stored in each of the punched holes. Examples thereof include those used as recesses; the storage mount is embossed, and a plurality of recesses capable of storing electronic components are formed at regular intervals along the longitudinal direction of the storage mount; and the like.
- the packaging body for transporting electronic components according to the present embodiment is configured by using the cover tape 10 for the paper carrier tape according to the present embodiment, it has adhesiveness to the paper carrier tape and easy peelability from the paper carrier tape. It has an excellent balance of antistatic performance.
- the electronic component package according to the present embodiment includes the electronic component transport package according to the present embodiment and the electronic component housed in the recess of the paper carrier tape.
- the paper carrier tape according to this embodiment is set in a machine for assembling parts (mounting machine), and electronic parts such as microchips can be embedded, stored, transported, etc., and then taken out as desired. It is formed on a scale.
- the packaging body for transporting electronic parts according to the present embodiment uses a paper carrier tape and a cover tape 10 for the paper carrier tape, and electronic parts of the paper carrier tape (eg, IC chip, microchip, electrostatic sensitive device, etc.).
- the cover tape 10 for paper carrier tape is laminated on the opening surface where the accommodating portion (concave portion) for accommodating the paper carrier tape is opened so that the antistatic layer (C) faces the opening surface. It is produced by heat-sealing from above.
- Anchor coating agent also called ac
- Seikadyne 2710A manufactured by Dainichiseika Kogyo Co., Ltd.
- Seikadyne 2710C manufactured by Dainichiseika Kogyo Co., Ltd.
- ethyl acetate 2 + 4 + 31 (parts by mass) (solid concentration: 7% by mass)
- Antistatic layer (C)> -Thiophoene antistatic (AS) agent Antistatic agent containing poly (3,4-ethylenedioxythiophene), manufactured by Kaken Sangyo Co., Ltd., product name: MC-100 -Cationic surfactant: manufactured by Kao Corporation, product name: electro stripper QN
- the evaluation resin surface of the laminate (PET film (25 ⁇ m) / ac ⁇ LDPE (15 ⁇ m) / evaluation resin (15 ⁇ m)) is subjected to corona treatment to improve the wetting of the antistatic agent or the surfactant. (Treatment density: 300 W / m 2 / min), and then 6 ⁇ m of antistatic agent or surfactant on the evaluation resin layer using K303 Multi Coater manufactured by RK PrintCoat Instruments Ltd. (wet state before drying).
- ⁇ Antistatic property evaluation> Using a resistivity meter (Mitsubishi Chemical Analytech Co., Ltd., High Restor-UP, UR-100 probe), cover tape for paper carrier tape under the conditions of measurement voltage 500V, measurement time 30 seconds, 23 ° C, 50% RH. The surface resistivity was measured and the antistatic property was evaluated. The lower the surface resistivity, the better the antistatic property.
- the cover tapes for paper carrier tapes of Examples 1 and 2 have an excellent balance of adhesiveness, easy peeling property, and antistatic property.
- the cover tapes for paper carrier tapes of Comparative Examples 1 to 3 were inferior in the performance balance of adhesiveness, easy peeling property and antistatic property.
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Abstract
A cover tape (10) for paper carrier tapes, which sequentially comprises (A) a base material layer, (B) a heat-sealable layer that contains a thermoplastic resin, and (C) an antistatic layer that contains a conductive polymer in this order, and which is configured such that the melt flow rate (MFR) of the thermoplastic resin as determined in accordance with JIS K7210 (1999) at 190°C under a load of 2,160 g is from 0.1 g/10 minutes to 150 g/10 minutes (inclusive).
Description
本発明は、紙キャリアテープ用カバーテープ、電子部品搬送用包装体および電子部品包装体に関する。
The present invention relates to a cover tape for paper carrier tape, a packaging body for transporting electronic parts, and a packaging body for electronic parts.
包装用材料として、マイクロチップ等の電子部品を輸送するまたは保管するために用いられるキャリアテープが知られている。このキャリアテープを用いれば、あまりに小さいサイズのために取り扱いが困難な電子部品等を、キャリアテープに設けられた凹部に１個ずつ収容することで保管し、運搬することができる。
キャリアテープは、電子部品等を収容できる凹部を有し、この凹部をカバーテープによって塞ぐことで、パッケージ化される。この状態で運搬や保管等をした後、キャリアテープをマウンターという部品組立用の機械（実装機）にセットし、収容されていた電子部品等を取り出せるようになっている。 As a packaging material, a carrier tape used for transporting or storing electronic parts such as microchips is known. By using this carrier tape, it is possible to store and transport electronic parts and the like, which are difficult to handle due to their too small size, by accommodating them one by one in the recesses provided in the carrier tape.
The carrier tape has a recess that can accommodate electronic components and the like, and is packaged by closing the recess with a cover tape. After transporting and storing in this state, the carrier tape is set in a parts assembly machine (mounting machine) called a mounter, and the stored electronic parts and the like can be taken out.
キャリアテープは、電子部品等を収容できる凹部を有し、この凹部をカバーテープによって塞ぐことで、パッケージ化される。この状態で運搬や保管等をした後、キャリアテープをマウンターという部品組立用の機械（実装機）にセットし、収容されていた電子部品等を取り出せるようになっている。 As a packaging material, a carrier tape used for transporting or storing electronic parts such as microchips is known. By using this carrier tape, it is possible to store and transport electronic parts and the like, which are difficult to handle due to their too small size, by accommodating them one by one in the recesses provided in the carrier tape.
The carrier tape has a recess that can accommodate electronic components and the like, and is packaged by closing the recess with a cover tape. After transporting and storing in this state, the carrier tape is set in a parts assembly machine (mounting machine) called a mounter, and the stored electronic parts and the like can be taken out.
このようなキャリアテープ用カバーテープに関する技術としては、例えば、特許文献１（特開２００４－５１１０５号公報）に記載のものが挙げられる。
Examples of the technique related to such a cover tape for a carrier tape include those described in Patent Document 1 (Japanese Unexamined Patent Publication No. 2004-51105).
特許文献１には、プラスチックフィルム層と粘着性付与剤を含む熱接着性樹脂層と帯電防止性ブロッキング防止層が積層された構成からなることを特徴とするカバーテープが記載されている。特許文献１には、帯電防止性ブロッキング防止層がウレタン樹脂、アクリル樹脂、ポリエステル樹脂に４級アンモニウム塩型カチオン系界面活性剤を分散した組成物により０．０１～０．５μｍの厚さに形成した構成が開示されている
Patent Document 1 describes a cover tape having a structure in which a plastic film layer, a thermosetting resin layer containing an adhesive-imparting agent, and an antistatic blocking prevention layer are laminated. In Patent Document 1, the antistatic blocking prevention layer is formed to a thickness of 0.01 to 0.5 μm by a composition in which a quaternary ammonium salt-type cationic surfactant is dispersed in a urethane resin, an acrylic resin, or a polyester resin. The configuration is disclosed
キャリアテープとして、紙を基材とした紙キャリアテープが用いられることがある。この場合、紙キャリアテープ用カバーテープには、適度な接着性（すなわち、紙キャリアテープに対して必要な接着性を有しながら、剥離する際には容易に剥離することができる程度の接着性）を有するとともに、紙キャリアテープから剥離するときに紙剥けがないこと（すなわち、基材の紙が剥けて毛羽立たないこと）が求められている。また、電子部品の取り出し時にカバーテープに電子部品が付着したり、カバーテープから飛び出したりする取り出し不良を防止するための帯電防止性も求められている。
本発明者らの検討によれば、特許文献１に記載されているような従来の紙キャリアテープ用カバーテープは、紙キャリアテープへの接着性、紙キャリアテープからの易剥離性および帯電防止性の性能バランスに改善の余地があることが明らかになった。 As the carrier tape, a paper carrier tape based on paper may be used. In this case, the cover tape for the paper carrier tape has an appropriate adhesiveness (that is, an adhesiveness that can be easily peeled off when peeling off while having the necessary adhesiveness to the paper carrier tape. ), And there is no paper peeling when peeling from the paper carrier tape (that is, the base paper is not peeled and fluffed). In addition, antistatic properties are also required to prevent electronic components from sticking to the cover tape or popping out of the cover tape when the electronic components are taken out.
According to the studies by the present inventors, the conventional cover tape for paper carrier tape as described in Patent Document 1 has adhesiveness to the paper carrier tape, easy peeling property from the paper carrier tape, and antistatic property. It became clear that there is room for improvement in the performance balance of.
本発明者らの検討によれば、特許文献１に記載されているような従来の紙キャリアテープ用カバーテープは、紙キャリアテープへの接着性、紙キャリアテープからの易剥離性および帯電防止性の性能バランスに改善の余地があることが明らかになった。 As the carrier tape, a paper carrier tape based on paper may be used. In this case, the cover tape for the paper carrier tape has an appropriate adhesiveness (that is, an adhesiveness that can be easily peeled off when peeling off while having the necessary adhesiveness to the paper carrier tape. ), And there is no paper peeling when peeling from the paper carrier tape (that is, the base paper is not peeled and fluffed). In addition, antistatic properties are also required to prevent electronic components from sticking to the cover tape or popping out of the cover tape when the electronic components are taken out.
According to the studies by the present inventors, the conventional cover tape for paper carrier tape as described in Patent Document 1 has adhesiveness to the paper carrier tape, easy peeling property from the paper carrier tape, and antistatic property. It became clear that there is room for improvement in the performance balance of.
本発明は上記事情に鑑みてなされたものであり、紙キャリアテープへの接着性、紙キャリアテープからの易剥離性および帯電防止性の性能バランスに優れた紙キャリアテープ用カバーテープを提供するものである。
The present invention has been made in view of the above circumstances, and provides a cover tape for a paper carrier tape having an excellent balance of adhesiveness to a paper carrier tape, easy peeling property from a paper carrier tape, and antistatic property. Is.
本発明者らは、上記課題を達成するために鋭意検討を重ねた。その結果、基材層（Ａ）と、熱可塑性樹脂を含むヒートシール性層（Ｂ）と、導電性ポリマーを含む帯電防止性層（Ｃ）と、をこの順番に積層することによって、紙キャリアテープへの接着性、紙キャリアテープからの易剥離性および帯電防止性の性能バランスに優れた紙キャリアテープ用カバーテープが得られることを見出し、本発明を完成するに至った。
The present inventors have made extensive studies in order to achieve the above problems. As a result, the paper carrier is formed by laminating the base material layer (A), the heat-sealing layer (B) containing the thermoplastic resin, and the antistatic layer (C) containing the conductive polymer in this order. We have found that a cover tape for a paper carrier tape having an excellent balance of adhesiveness to a tape, easy peelability from a paper carrier tape, and antistatic property can be obtained, and have completed the present invention.
すなわち、本発明によれば、以下に示す紙キャリアテープ用カバーテープ、電子部品搬送用包装体および電子部品包装体が提供される。
That is, according to the present invention, the following cover tape for paper carrier tape, packaging for transporting electronic components, and packaging for electronic components are provided.
［１］
基材層（Ａ）と、熱可塑性樹脂を含むヒートシール性層（Ｂ）と、導電性ポリマーを含む帯電防止性層（Ｃ）と、をこの順番に備え、
ＪＩＳ Ｋ７２１０：１９９９に準拠し、１９０℃、２１６０ｇ荷重の条件で測定される、上記熱可塑性樹脂のメルトフローレート（ＭＦＲ）が０．１ｇ／１０分以上１５０ｇ／１０分以下である紙キャリアテープ用カバーテープ。
［２］
上記［１］に記載の紙キャリアテープ用カバーテープにおいて、
上記ヒートシール性層（Ｂ）が粘着付与樹脂を含む紙キャリアテープ用カバーテープ。
［３］
上記［１］または［２］に記載の紙キャリアテープ用カバーテープにおいて、
上記熱可塑性樹脂がポリオレフィンを含む紙キャリアテープ用カバーテープ。
［４］
上記［３］に記載の紙キャリアテープ用カバーテープにおいて、
上記ポリオレフィンがポリエチレンおよびエチレン系共重合体から選ばれる少なくとも１種を含む紙キャリアテープ用カバーテープ。
［５］
上記［４］に記載の紙キャリアテープ用カバーテープにおいて、
上記エチレン系共重合体がエチレン・酢酸ビニル共重合体を含む紙キャリアテープ用カバーテープ。
［６］
上記［１］乃至［５］のいずれか一つに記載の紙キャリアテープ用カバーテープにおいて、
上記導電性ポリマーがポリチオフェンを含む紙キャリアテープ用カバーテープ。
［７］
上記［１］乃至［６］のいずれか一項に記載の紙キャリアテープ用カバーテープにおいて、
上記帯電防止性層（Ｃ）の厚みが０．００１μｍ以上５．０μｍ以下である紙キャリアテープ用カバーテープ。
［８］
電子部品を収納可能な凹部を有する紙キャリアテープと、
上記紙キャリアテープに熱接着されるカバーテープと、
を備える電子部品搬送用包装体であって、
上記カバーテープが上記［１］乃至［７］のいずれか一つに記載の紙キャリアテープ用カバーテープを含む電子部品搬送用包装体。
［９］
上記［８］に記載の電子部品搬送用包装体と、
前記紙キャリアテープの前記凹部に収納された電子部品と、
を備える電子部品包装体。 [1]
A base material layer (A), a heat-sealing layer (B) containing a thermoplastic resin, and an antistatic layer (C) containing a conductive polymer are provided in this order.
For paper carrier tapes with a melt flow rate (MFR) of 0.1 g / 10 minutes or more and 150 g / 10 minutes or less, which is measured under the conditions of 190 ° C. and 2160 g load according to JIS K7210: 1999. Cover tape.
[2]
In the cover tape for paper carrier tape described in [1] above,
A cover tape for a paper carrier tape in which the heat-sealing layer (B) contains an adhesive resin.
[3]
In the cover tape for paper carrier tape according to the above [1] or [2],
A cover tape for paper carrier tape in which the above thermoplastic resin contains polyolefin.
[4]
In the cover tape for paper carrier tape described in [3] above,
A cover tape for a paper carrier tape containing at least one of the polyolefins selected from polyethylene and an ethylene-based copolymer.
[5]
In the cover tape for paper carrier tape described in [4] above,
A cover tape for a paper carrier tape in which the ethylene-based copolymer contains an ethylene-vinyl acetate copolymer.
[6]
In the cover tape for paper carrier tape according to any one of the above [1] to [5].
A cover tape for paper carrier tape in which the conductive polymer contains polythiophene.
[7]
In the cover tape for paper carrier tape according to any one of the above [1] to [6].
A cover tape for a paper carrier tape having a thickness of the antistatic layer (C) of 0.001 μm or more and 5.0 μm or less.
[8]
Paper carrier tape with recesses that can store electronic components,
The cover tape that is heat-bonded to the paper carrier tape and
It is a packaging body for transporting electronic parts equipped with
A packaging body for transporting electronic components, wherein the cover tape includes the cover tape for the paper carrier tape according to any one of the above [1] to [7].
[9]
The packaging body for transporting electronic components according to the above [8],
Electronic components housed in the recesses of the paper carrier tape and
Electronic component packaging.
基材層（Ａ）と、熱可塑性樹脂を含むヒートシール性層（Ｂ）と、導電性ポリマーを含む帯電防止性層（Ｃ）と、をこの順番に備え、
ＪＩＳ Ｋ７２１０：１９９９に準拠し、１９０℃、２１６０ｇ荷重の条件で測定される、上記熱可塑性樹脂のメルトフローレート（ＭＦＲ）が０．１ｇ／１０分以上１５０ｇ／１０分以下である紙キャリアテープ用カバーテープ。
［２］
上記［１］に記載の紙キャリアテープ用カバーテープにおいて、
上記ヒートシール性層（Ｂ）が粘着付与樹脂を含む紙キャリアテープ用カバーテープ。
［３］
上記［１］または［２］に記載の紙キャリアテープ用カバーテープにおいて、
上記熱可塑性樹脂がポリオレフィンを含む紙キャリアテープ用カバーテープ。
［４］
上記［３］に記載の紙キャリアテープ用カバーテープにおいて、
上記ポリオレフィンがポリエチレンおよびエチレン系共重合体から選ばれる少なくとも１種を含む紙キャリアテープ用カバーテープ。
［５］
上記［４］に記載の紙キャリアテープ用カバーテープにおいて、
上記エチレン系共重合体がエチレン・酢酸ビニル共重合体を含む紙キャリアテープ用カバーテープ。
［６］
上記［１］乃至［５］のいずれか一つに記載の紙キャリアテープ用カバーテープにおいて、
上記導電性ポリマーがポリチオフェンを含む紙キャリアテープ用カバーテープ。
［７］
上記［１］乃至［６］のいずれか一項に記載の紙キャリアテープ用カバーテープにおいて、
上記帯電防止性層（Ｃ）の厚みが０．００１μｍ以上５．０μｍ以下である紙キャリアテープ用カバーテープ。
［８］
電子部品を収納可能な凹部を有する紙キャリアテープと、
上記紙キャリアテープに熱接着されるカバーテープと、
を備える電子部品搬送用包装体であって、
上記カバーテープが上記［１］乃至［７］のいずれか一つに記載の紙キャリアテープ用カバーテープを含む電子部品搬送用包装体。
［９］
上記［８］に記載の電子部品搬送用包装体と、
前記紙キャリアテープの前記凹部に収納された電子部品と、
を備える電子部品包装体。 [1]
A base material layer (A), a heat-sealing layer (B) containing a thermoplastic resin, and an antistatic layer (C) containing a conductive polymer are provided in this order.
For paper carrier tapes with a melt flow rate (MFR) of 0.1 g / 10 minutes or more and 150 g / 10 minutes or less, which is measured under the conditions of 190 ° C. and 2160 g load according to JIS K7210: 1999. Cover tape.
[2]
In the cover tape for paper carrier tape described in [1] above,
A cover tape for a paper carrier tape in which the heat-sealing layer (B) contains an adhesive resin.
[3]
In the cover tape for paper carrier tape according to the above [1] or [2],
A cover tape for paper carrier tape in which the above thermoplastic resin contains polyolefin.
[4]
In the cover tape for paper carrier tape described in [3] above,
A cover tape for a paper carrier tape containing at least one of the polyolefins selected from polyethylene and an ethylene-based copolymer.
[5]
In the cover tape for paper carrier tape described in [4] above,
A cover tape for a paper carrier tape in which the ethylene-based copolymer contains an ethylene-vinyl acetate copolymer.
[6]
In the cover tape for paper carrier tape according to any one of the above [1] to [5].
A cover tape for paper carrier tape in which the conductive polymer contains polythiophene.
[7]
In the cover tape for paper carrier tape according to any one of the above [1] to [6].
A cover tape for a paper carrier tape having a thickness of the antistatic layer (C) of 0.001 μm or more and 5.0 μm or less.
[8]
Paper carrier tape with recesses that can store electronic components,
The cover tape that is heat-bonded to the paper carrier tape and
It is a packaging body for transporting electronic parts equipped with
A packaging body for transporting electronic components, wherein the cover tape includes the cover tape for the paper carrier tape according to any one of the above [1] to [7].
[9]
The packaging body for transporting electronic components according to the above [8],
Electronic components housed in the recesses of the paper carrier tape and
Electronic component packaging.
本発明によれば、紙キャリアテープへの接着性、紙キャリアテープからの易剥離性および帯電防止性の性能バランスに優れた紙キャリアテープ用カバーテープを提供することができる。
According to the present invention, it is possible to provide a cover tape for a paper carrier tape having an excellent balance of adhesiveness to the paper carrier tape, easy peeling property from the paper carrier tape, and antistatic property.
以下、本発明の実施の形態について、図面を用いて説明する。なお、数値範囲の「Ｘ～Ｙ」は特に断りがなければ、Ｘ以上Ｙ以下を表す。
Hereinafter, embodiments of the present invention will be described with reference to the drawings. Unless otherwise specified, "X to Y" in the numerical range represents X or more and Y or less.
１．紙キャリアテープ用カバーテープ
図１は、本発明に係る実施形態の紙キャリアテープ用カバーテープ１０の構造の一例を模式的に示した断面図である。
本実施形態に係る紙キャリアテープ用カバーテープ１０は、基材層（Ａ）と、熱可塑性樹脂を含むヒートシール性層（Ｂ）と、導電性ポリマーを含む帯電防止性層（Ｃ）と、をこの順番に備え、ＪＩＳ Ｋ７２１０：１９９９に準拠し、１９０℃、２１６０ｇ荷重の条件で測定される、上記熱可塑性樹脂のメルトフローレート（ＭＦＲ）が０．１ｇ／１０分以上１５０ｇ／１０分以下である。 1. 1. Cover Tape for Paper Carrier Tape FIG. 1 is a cross-sectional view schematically showing an example of the structure of thecover tape 10 for paper carrier tape according to the embodiment of the present invention.
Thecover tape 10 for a paper carrier tape according to the present embodiment includes a base material layer (A), a heat-sealing layer (B) containing a thermoplastic resin, an antistatic layer (C) containing a conductive polymer, and the like. The melt flow rate (MFR) of the above thermoplastic resin is 0.1 g / 10 minutes or more and 150 g / 10 minutes or less, which is measured under the condition of 190 ° C. and 2160 g load in accordance with JIS K7210: 1999. Is.
図１は、本発明に係る実施形態の紙キャリアテープ用カバーテープ１０の構造の一例を模式的に示した断面図である。
本実施形態に係る紙キャリアテープ用カバーテープ１０は、基材層（Ａ）と、熱可塑性樹脂を含むヒートシール性層（Ｂ）と、導電性ポリマーを含む帯電防止性層（Ｃ）と、をこの順番に備え、ＪＩＳ Ｋ７２１０：１９９９に準拠し、１９０℃、２１６０ｇ荷重の条件で測定される、上記熱可塑性樹脂のメルトフローレート（ＭＦＲ）が０．１ｇ／１０分以上１５０ｇ／１０分以下である。 1. 1. Cover Tape for Paper Carrier Tape FIG. 1 is a cross-sectional view schematically showing an example of the structure of the
The
前述したように、本発明者らの検討によれば、特許文献１に記載されているような従来の紙キャリアテープ用カバーテープは、紙キャリアテープへの接着性、紙キャリアテープからの易剥離性および帯電防止性の性能バランスに改善の余地があることが明らかになった。本発明者らは、上記課題を達成するために鋭意検討を重ねた。その結果、基材層（Ａ）と、熱可塑性樹脂を含むヒートシール性層（Ｂ）と、導電性ポリマーを含む帯電防止性層（Ｃ）と、をこの順番に積層することによって、紙キャリアテープへの接着性、紙キャリアテープからの易剥離性および帯電防止性の性能バランスに優れた紙キャリアテープ用カバーテープが得られることを見出した。
すなわち、本実施形態に係る紙キャリアテープ用カバーテープ１０は、上記層構成とすることで、紙キャリアテープへの接着性、紙キャリアテープからの易剥離性および帯電防止性の性能バランスを良好なものとすることができる。 As described above, according to the study by the present inventors, the conventional cover tape for paper carrier tape as described in Patent Document 1 has adhesiveness to the paper carrier tape and easy peeling from the paper carrier tape. It became clear that there is room for improvement in the performance balance between sex and antistatic properties. The present inventors have made extensive studies to achieve the above problems. As a result, the paper carrier is formed by laminating the base material layer (A), the heat-sealing layer (B) containing the thermoplastic resin, and the antistatic layer (C) containing the conductive polymer in this order. It has been found that a cover tape for a paper carrier tape having an excellent balance of adhesiveness to a tape, easy peeling property from a paper carrier tape, and antistatic property can be obtained.
That is, thecover tape 10 for the paper carrier tape according to the present embodiment has a good balance of adhesiveness to the paper carrier tape, easy peelability from the paper carrier tape, and antistatic property by having the above layer structure. Can be.
すなわち、本実施形態に係る紙キャリアテープ用カバーテープ１０は、上記層構成とすることで、紙キャリアテープへの接着性、紙キャリアテープからの易剥離性および帯電防止性の性能バランスを良好なものとすることができる。 As described above, according to the study by the present inventors, the conventional cover tape for paper carrier tape as described in Patent Document 1 has adhesiveness to the paper carrier tape and easy peeling from the paper carrier tape. It became clear that there is room for improvement in the performance balance between sex and antistatic properties. The present inventors have made extensive studies to achieve the above problems. As a result, the paper carrier is formed by laminating the base material layer (A), the heat-sealing layer (B) containing the thermoplastic resin, and the antistatic layer (C) containing the conductive polymer in this order. It has been found that a cover tape for a paper carrier tape having an excellent balance of adhesiveness to a tape, easy peeling property from a paper carrier tape, and antistatic property can be obtained.
That is, the
以下、本実施形態に係る紙キャリアテープ用カバーテープ１０を構成する各層について説明する。
Hereinafter, each layer constituting the cover tape 10 for the paper carrier tape according to the present embodiment will be described.
＜基材層（Ａ）＞
基材層（Ａ）は、紙キャリアテープ用カバーテープ１０の取り扱い性や機械的特性、耐熱性等の特性をより良好にすることを目的として設けられる層である。
基材層（Ａ）としては、例えば、紙、アルミニウム、ポリエステル（例えばポリエチレンテレフタレート）、ポリエチレン、ポリプロピレン、ポリスチレン、ポリアミド、アルミ蒸着ポリエステル、アルミ蒸着ポリプロピレン、シリカ蒸着ポリエステル等からなる板状材（シートまたはフィルム）等が挙げられる。これらの中でもポリエチレンテレフタレートからなるシートまたはフィルムが好ましい。これらの基材層（Ａ）は、単層構造のみならず、２層以上の積層構造であってもよい。 <Base material layer (A)>
The base material layer (A) is a layer provided for the purpose of improving the handleability, mechanical properties, heat resistance, and other properties of thecover tape 10 for paper carrier tape.
The base material layer (A) is a plate-like material (sheet or sheet) made of, for example, paper, aluminum, polyester (for example, polyethylene terephthalate), polyethylene, polypropylene, polystyrene, polyamide, aluminum-deposited polyester, aluminum-deposited polypropylene, silica-deposited polyester, or the like. Film) and the like. Among these, a sheet or film made of polyethylene terephthalate is preferable. These base material layers (A) may have not only a single layer structure but also a laminated structure of two or more layers.
基材層（Ａ）は、紙キャリアテープ用カバーテープ１０の取り扱い性や機械的特性、耐熱性等の特性をより良好にすることを目的として設けられる層である。
基材層（Ａ）としては、例えば、紙、アルミニウム、ポリエステル（例えばポリエチレンテレフタレート）、ポリエチレン、ポリプロピレン、ポリスチレン、ポリアミド、アルミ蒸着ポリエステル、アルミ蒸着ポリプロピレン、シリカ蒸着ポリエステル等からなる板状材（シートまたはフィルム）等が挙げられる。これらの中でもポリエチレンテレフタレートからなるシートまたはフィルムが好ましい。これらの基材層（Ａ）は、単層構造のみならず、２層以上の積層構造であってもよい。 <Base material layer (A)>
The base material layer (A) is a layer provided for the purpose of improving the handleability, mechanical properties, heat resistance, and other properties of the
The base material layer (A) is a plate-like material (sheet or sheet) made of, for example, paper, aluminum, polyester (for example, polyethylene terephthalate), polyethylene, polypropylene, polystyrene, polyamide, aluminum-deposited polyester, aluminum-deposited polypropylene, silica-deposited polyester, or the like. Film) and the like. Among these, a sheet or film made of polyethylene terephthalate is preferable. These base material layers (A) may have not only a single layer structure but also a laminated structure of two or more layers.
基材層（Ａ）の厚みは、機械的強度および作業性の観点から、例えば５μｍ以上１００μｍ以下、好ましくは１０μｍ以上５０μｍ以下である。
基材層（Ａ）は、ヒートシール性層（Ｂ）と接着（又は積層）される側の表面に、ヒートシール性層（Ｂ）との接着強度を高めるためにコロナ処理、プラズマ処理、火炎処理、オゾン処理等の物理的な処理がなされていてもよい。また、基材層（Ａ）に公知のアンカーコート処理を施してもよい。 The thickness of the base material layer (A) is, for example, 5 μm or more and 100 μm or less, preferably 10 μm or more and 50 μm or less, from the viewpoint of mechanical strength and workability.
The base material layer (A) has a corona treatment, a plasma treatment, and a flame on the surface on the side to be bonded (or laminated) with the heat-sealing layer (B) in order to increase the adhesive strength with the heat-sealing layer (B). Physical treatment such as treatment and ozone treatment may be performed. Further, the base material layer (A) may be subjected to a known anchor coating treatment.
基材層（Ａ）は、ヒートシール性層（Ｂ）と接着（又は積層）される側の表面に、ヒートシール性層（Ｂ）との接着強度を高めるためにコロナ処理、プラズマ処理、火炎処理、オゾン処理等の物理的な処理がなされていてもよい。また、基材層（Ａ）に公知のアンカーコート処理を施してもよい。 The thickness of the base material layer (A) is, for example, 5 μm or more and 100 μm or less, preferably 10 μm or more and 50 μm or less, from the viewpoint of mechanical strength and workability.
The base material layer (A) has a corona treatment, a plasma treatment, and a flame on the surface on the side to be bonded (or laminated) with the heat-sealing layer (B) in order to increase the adhesive strength with the heat-sealing layer (B). Physical treatment such as treatment and ozone treatment may be performed. Further, the base material layer (A) may be subjected to a known anchor coating treatment.
＜ヒートシール性層（Ｂ）＞
ヒートシール性層（Ｂ）は、本実施形態に係る紙キャリアテープ用カバーテープ１０にヒートシール性を付与するための層であり、熱可塑性樹脂を含む。ヒートシール性層（Ｂ）は、単層であってもよいし、２層以上の積層構造であってもよい。
ヒートシール性層（Ｂ）の厚さは、例えば１μｍ以上３００μｍ以下であり、好ましくは５μｍ以上２００μｍ以下、より好ましくは１０μｍ以上１５０μｍ以下である。 <Heat sealable layer (B)>
The heat-sealable layer (B) is a layer for imparting heat-sealability to thecover tape 10 for the paper carrier tape according to the present embodiment, and contains a thermoplastic resin. The heat-sealing layer (B) may be a single layer or may have a laminated structure of two or more layers.
The thickness of the heat-sealing layer (B) is, for example, 1 μm or more and 300 μm or less, preferably 5 μm or more and 200 μm or less, and more preferably 10 μm or more and 150 μm or less.
ヒートシール性層（Ｂ）は、本実施形態に係る紙キャリアテープ用カバーテープ１０にヒートシール性を付与するための層であり、熱可塑性樹脂を含む。ヒートシール性層（Ｂ）は、単層であってもよいし、２層以上の積層構造であってもよい。
ヒートシール性層（Ｂ）の厚さは、例えば１μｍ以上３００μｍ以下であり、好ましくは５μｍ以上２００μｍ以下、より好ましくは１０μｍ以上１５０μｍ以下である。 <Heat sealable layer (B)>
The heat-sealable layer (B) is a layer for imparting heat-sealability to the
The thickness of the heat-sealing layer (B) is, for example, 1 μm or more and 300 μm or less, preferably 5 μm or more and 200 μm or less, and more preferably 10 μm or more and 150 μm or less.
本実施形態に係る熱可塑性樹脂としては、例えば、高密度ポリエチレン、高圧法低密度ポリエチレン、低密度ポリエチレン（ＬＤＰＥ）、線状低密度ポリエチレン（ＬＬＤＰＥ）等のポリエチレン、エチレン・不飽和カルボン酸系共重合体、エチレン・ビニルエステル共重合体、エチレン・α－オレフィン共重合体エラストマー等のエチレン系共重合体、ポリプロピレン、プロピレン系共重合体（プロピレンとプロピレン以外のα―オレフィンとの共重合体）、ポリブテン、及びその他のオレフィン系（共）重合体、並びにこれらのポリマーブレンド等のポリオレフィン等を挙げることができる。上記α－オレフィンとしては、例えば、プロピレン、１－ブテン、１－ペンテン、１－ヘキセン、１－オクテン、１－デセン、１－ドデセン、４－メチル－１－ペンテン等が挙げられる。
これらの中でも、ヒートシール性に優れる点から、熱可塑性樹脂としてはポリオレフィンを含むことが好ましく、ポリエチレンおよびエチレン系共重合体からなる群から選択される少なくとも一種を含むことがより好ましく、ポリエチレンおよびエチレン・ビニルエステル共重合体からなる群から選択される少なくとも一種を含むことがさらに好ましく、エチレン・ビニルエステル共重合体を含むことがさらにより好ましく、エチレン・酢酸ビニル共重合体を含むことがさらにより好ましく、エチレン・酢酸ビニル共重合体および線状低密度ポリエチレンの両方を含むことが特に好ましい。 Examples of the thermoplastic resin according to the present embodiment include polyethylenes such as high-density polyethylene, high-pressure low-density polyethylene, low-density polyethylene (LDPE), and linear low-density polyethylene (LLDPE), and ethylene / unsaturated carboxylic acid-based polymers. Polymers, ethylene / vinyl ester copolymers, ethylene / α-olefin copolymers, ethylene-based copolymers such as elastomers, polypropylene, propylene-based copolymers (polymers of propylene and α-olefins other than propylene) , Polybutene, and other olefin-based (co) polymers, and polyolefins such as blends of these polymers. Examples of the α-olefin include propylene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1-decene, 1-dodecene, 4-methyl-1-pentene and the like.
Among these, from the viewpoint of excellent heat-sealing property, the thermoplastic resin preferably contains polyolefin, and more preferably contains at least one selected from the group consisting of polyethylene and ethylene-based copolymers, and polyethylene and ethylene. -It is further preferable to contain at least one selected from the group consisting of vinyl ester copolymers, even more preferably to contain an ethylene-vinyl ester copolymer, and even more preferably to contain an ethylene-vinyl acetate copolymer. It is preferable to contain both an ethylene-vinyl acetate copolymer and a linear low-density polyethylene.
これらの中でも、ヒートシール性に優れる点から、熱可塑性樹脂としてはポリオレフィンを含むことが好ましく、ポリエチレンおよびエチレン系共重合体からなる群から選択される少なくとも一種を含むことがより好ましく、ポリエチレンおよびエチレン・ビニルエステル共重合体からなる群から選択される少なくとも一種を含むことがさらに好ましく、エチレン・ビニルエステル共重合体を含むことがさらにより好ましく、エチレン・酢酸ビニル共重合体を含むことがさらにより好ましく、エチレン・酢酸ビニル共重合体および線状低密度ポリエチレンの両方を含むことが特に好ましい。 Examples of the thermoplastic resin according to the present embodiment include polyethylenes such as high-density polyethylene, high-pressure low-density polyethylene, low-density polyethylene (LDPE), and linear low-density polyethylene (LLDPE), and ethylene / unsaturated carboxylic acid-based polymers. Polymers, ethylene / vinyl ester copolymers, ethylene / α-olefin copolymers, ethylene-based copolymers such as elastomers, polypropylene, propylene-based copolymers (polymers of propylene and α-olefins other than propylene) , Polybutene, and other olefin-based (co) polymers, and polyolefins such as blends of these polymers. Examples of the α-olefin include propylene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1-decene, 1-dodecene, 4-methyl-1-pentene and the like.
Among these, from the viewpoint of excellent heat-sealing property, the thermoplastic resin preferably contains polyolefin, and more preferably contains at least one selected from the group consisting of polyethylene and ethylene-based copolymers, and polyethylene and ethylene. -It is further preferable to contain at least one selected from the group consisting of vinyl ester copolymers, even more preferably to contain an ethylene-vinyl ester copolymer, and even more preferably to contain an ethylene-vinyl acetate copolymer. It is preferable to contain both an ethylene-vinyl acetate copolymer and a linear low-density polyethylene.
ＪＩＳ Ｋ７２１０：１９９９に準拠し、１９０℃、２１６０ｇ荷重の条件で測定される、熱可塑性樹脂のメルトフローレート（ＭＦＲ）は、加工性及び機械強度の観点から、０．１ｇ／１０分以上１５０ｇ／１０分以下であることが好ましく、０．１ｇ／１０分以上５０ｇ／１０分以下であることがより好ましく、０．５ｇ／１０分以上５０ｇ／１０分以下であることが、１．０ｇ／１０分以上３０ｇ／１０分以下であることが特に好ましい。
The melt flow rate (MFR) of a thermoplastic resin measured under the conditions of 190 ° C. and 2160 g load according to JIS K7210: 1999 is 0.1 g / 10 minutes or more and 150 g / from the viewpoint of workability and mechanical strength. It is preferably 10 minutes or less, more preferably 0.1 g / 10 minutes or more and 50 g / 10 minutes or less, and 0.5 g / 10 minutes or more and 50 g / 10 minutes or less is 1.0 g / 10. It is particularly preferable that the amount is 30 g / 10 minutes or more.
本実施形態に係るヒートシール性層（Ｂ）中の熱可塑性樹脂の含有量は、ヒートシール性層（Ｂ）の全体を１００質量％としたとき、好ましくは５０質量％以上１００質量％以下、より好ましくは７０質量％以上９９質量％以下、さらに好ましくは７０７５質量％以上９５質量％以下、さらに好ましくは８０質量％以上９５質量％以下である。これにより、帯電防止性層との接着性やヒートシール性等のバランスをより良好にすることができる。
The content of the thermoplastic resin in the heat-sealing layer (B) according to the present embodiment is preferably 50% by mass or more and 100% by mass or less when the whole of the heat-sealing layer (B) is 100% by mass. It is more preferably 70% by mass or more and 99% by mass or less, still more preferably 7075% by mass or more and 95% by mass or less, and further preferably 80% by mass or more and 95% by mass or less. As a result, the balance between the adhesiveness with the antistatic layer and the heat sealability can be improved.
（エチレン・ビニルエステル共重合体）
本実施形態に係るエチレン・ビニルエステル共重合体は、少なくとも、エチレンに由来する構成単位と、ビニルエステルに由来する構成単位と、を含む。エチレン・ビニルエステル共重合体は、ランダム共重合体であっても、ブロック共重合体であっても、交互共重合体であってもよい。
エチレン・ビニルエステル共重合体としては、例えば、エチレン・酪酸ビニル共重合体、エチレン・酢酸ビニル共重合体、エチレン・プロピオン酸ビニル共重合体、エチレン・ステアリン酸ビニル共重合体等が挙げられ、エチレン・酢酸ビニル共重合体が好ましい。
エチレンに由来する構成単位の含有量は、成膜加工性の観点から、エチレン・ビニルエステル共重合体の全質量に対して５０質量％以上９５質量％以下であることが好ましく、７０質量％以上９５質量％以下であることがより好ましい。
ビニルエステルに由来する構成単位の含有量は、接着性の観点から、エチレン・ビニルエステル共重合体の全質量に対して５質量％以上５０質量％以下であることが好ましく、５質量％以上３０質量％以下であることがより好ましい。
エチレン・ビニルエステル共重合体は、ビニルエステル及びエチレン以外の他のモノマーに由来する構成単位を、本発明の一実施態様の特性を損なわない範囲で更に含んでいてもよい。ただし、その他のモノマーに由来する構成単位の含有量はビニルエステルに由来する構成単位の含有量を超えないことが好ましい。 (Ethylene / vinyl ester copolymer)
The ethylene / vinyl ester copolymer according to the present embodiment contains at least a structural unit derived from ethylene and a structural unit derived from vinyl ester. The ethylene / vinyl ester copolymer may be a random copolymer, a block copolymer, or an alternating copolymer.
Examples of the ethylene / vinyl ester copolymer include an ethylene / vinyl butyrate copolymer, an ethylene / vinyl acetate copolymer, an ethylene / vinyl propionate copolymer, and an ethylene / vinyl stearate copolymer. Ethylene-vinyl acetate copolymer is preferable.
The content of the structural unit derived from ethylene is preferably 50% by mass or more and 95% by mass or less, and 70% by mass or more, based on the total mass of the ethylene / vinyl ester copolymer from the viewpoint of film forming processability. More preferably, it is 95% by mass or less.
From the viewpoint of adhesiveness, the content of the structural unit derived from vinyl ester is preferably 5% by mass or more and 50% by mass or less with respect to the total mass of the ethylene / vinyl ester copolymer, and is 5% by mass or more and 30% by mass. It is more preferably mass% or less.
The ethylene / vinyl ester copolymer may further contain a structural unit derived from the vinyl ester and a monomer other than ethylene, as long as the characteristics of one embodiment of the present invention are not impaired. However, it is preferable that the content of the structural unit derived from other monomers does not exceed the content of the structural unit derived from vinyl ester.
本実施形態に係るエチレン・ビニルエステル共重合体は、少なくとも、エチレンに由来する構成単位と、ビニルエステルに由来する構成単位と、を含む。エチレン・ビニルエステル共重合体は、ランダム共重合体であっても、ブロック共重合体であっても、交互共重合体であってもよい。
エチレン・ビニルエステル共重合体としては、例えば、エチレン・酪酸ビニル共重合体、エチレン・酢酸ビニル共重合体、エチレン・プロピオン酸ビニル共重合体、エチレン・ステアリン酸ビニル共重合体等が挙げられ、エチレン・酢酸ビニル共重合体が好ましい。
エチレンに由来する構成単位の含有量は、成膜加工性の観点から、エチレン・ビニルエステル共重合体の全質量に対して５０質量％以上９５質量％以下であることが好ましく、７０質量％以上９５質量％以下であることがより好ましい。
ビニルエステルに由来する構成単位の含有量は、接着性の観点から、エチレン・ビニルエステル共重合体の全質量に対して５質量％以上５０質量％以下であることが好ましく、５質量％以上３０質量％以下であることがより好ましい。
エチレン・ビニルエステル共重合体は、ビニルエステル及びエチレン以外の他のモノマーに由来する構成単位を、本発明の一実施態様の特性を損なわない範囲で更に含んでいてもよい。ただし、その他のモノマーに由来する構成単位の含有量はビニルエステルに由来する構成単位の含有量を超えないことが好ましい。 (Ethylene / vinyl ester copolymer)
The ethylene / vinyl ester copolymer according to the present embodiment contains at least a structural unit derived from ethylene and a structural unit derived from vinyl ester. The ethylene / vinyl ester copolymer may be a random copolymer, a block copolymer, or an alternating copolymer.
Examples of the ethylene / vinyl ester copolymer include an ethylene / vinyl butyrate copolymer, an ethylene / vinyl acetate copolymer, an ethylene / vinyl propionate copolymer, and an ethylene / vinyl stearate copolymer. Ethylene-vinyl acetate copolymer is preferable.
The content of the structural unit derived from ethylene is preferably 50% by mass or more and 95% by mass or less, and 70% by mass or more, based on the total mass of the ethylene / vinyl ester copolymer from the viewpoint of film forming processability. More preferably, it is 95% by mass or less.
From the viewpoint of adhesiveness, the content of the structural unit derived from vinyl ester is preferably 5% by mass or more and 50% by mass or less with respect to the total mass of the ethylene / vinyl ester copolymer, and is 5% by mass or more and 30% by mass. It is more preferably mass% or less.
The ethylene / vinyl ester copolymer may further contain a structural unit derived from the vinyl ester and a monomer other than ethylene, as long as the characteristics of one embodiment of the present invention are not impaired. However, it is preferable that the content of the structural unit derived from other monomers does not exceed the content of the structural unit derived from vinyl ester.
エチレン・ビニルエステル共重合体は従来公知の方法で製造してもよいし、市販されているものを用いてもよい。
The ethylene / vinyl ester copolymer may be produced by a conventionally known method, or a commercially available one may be used.
ＪＩＳ Ｋ７２１０：１９９９に準拠し、１９０℃、２１６０ｇ荷重の条件で測定される、エチレン・ビニルエステル共重合体のメルトフローレート（ＭＦＲ）は、加工性及び機械強度の観点から、０．１ｇ／１０分以上１５０ｇ／１０分以下であることが好ましく、０．１ｇ／１０分以上５０ｇ／１０分以下であることがより好ましく、１．０ｇ／１０分以上５０ｇ／１０分以下であることが、５ｇ／１０分以上３０ｇ／１０分以下であることが特に好ましい。
The melt flow rate (MFR) of an ethylene / vinyl ester copolymer measured at 190 ° C. and a load of 2160 g according to JIS K7210: 1999 is 0.1 g / 10 from the viewpoint of workability and mechanical strength. Minutes or more and 150 g / 10 minutes or less is preferable, 0.1 g / 10 minutes or more and 50 g / 10 minutes or less is more preferable, and 1.0 g / 10 minutes or more and 50 g / 10 minutes or less is 5 g. It is particularly preferably / 10 minutes or more and 30 g / 10 minutes or less.
（粘着付与樹脂）
ヒートシール性層（Ｂ）は、前述の熱可塑性樹脂に加え、さらに粘着付与樹脂を含むことが好ましい。粘着付与樹脂は、樹脂に粘着性を付与する機能を有するため、ヒートシール性層（Ｂ）の接着強度の調整を容易にすることができる。
粘着付与樹脂としては、粘着性を付与する機能を有する樹脂から選択される。粘着付与樹脂としては、例えば、芳香族系炭化水素樹脂、脂環族系炭化水素樹脂、脂肪族系炭化水素樹脂、テルペン系樹脂、ロジン類、スチレン系樹脂、クマロン・インデン樹脂等が挙げられる。 (Adhesive-imparting resin)
The heat-sealable layer (B) preferably contains a tackifier resin in addition to the above-mentioned thermoplastic resin. Since the tackifying resin has a function of imparting tackiness to the resin, it is possible to easily adjust the adhesive strength of the heat-sealing layer (B).
The tackifying resin is selected from resins having a function of imparting tackiness. Examples of the tackifier resin include aromatic hydrocarbon resins, alicyclic hydrocarbon resins, aliphatic hydrocarbon resins, terpene resins, rosins, styrene resins, and kumaron-inden resins.
ヒートシール性層（Ｂ）は、前述の熱可塑性樹脂に加え、さらに粘着付与樹脂を含むことが好ましい。粘着付与樹脂は、樹脂に粘着性を付与する機能を有するため、ヒートシール性層（Ｂ）の接着強度の調整を容易にすることができる。
粘着付与樹脂としては、粘着性を付与する機能を有する樹脂から選択される。粘着付与樹脂としては、例えば、芳香族系炭化水素樹脂、脂環族系炭化水素樹脂、脂肪族系炭化水素樹脂、テルペン系樹脂、ロジン類、スチレン系樹脂、クマロン・インデン樹脂等が挙げられる。 (Adhesive-imparting resin)
The heat-sealable layer (B) preferably contains a tackifier resin in addition to the above-mentioned thermoplastic resin. Since the tackifying resin has a function of imparting tackiness to the resin, it is possible to easily adjust the adhesive strength of the heat-sealing layer (B).
The tackifying resin is selected from resins having a function of imparting tackiness. Examples of the tackifier resin include aromatic hydrocarbon resins, alicyclic hydrocarbon resins, aliphatic hydrocarbon resins, terpene resins, rosins, styrene resins, and kumaron-inden resins.
芳香族系炭化水素樹脂としては、例えば、ビニルトルエン、インデン、α－メチルスチレン等の炭素数８～１０のビニル芳香族炭化水素を少なくとも一種含有する留分を重合して得られる樹脂、これらの留分と脂肪族炭化水素留分を共重合して得られる樹脂等が挙げられる。
脂環族系炭化水素樹脂としては、例えば、スペントＣ４～Ｃ５留分中のジエン成分を環化二量化後、重合させて得られる樹脂、シクロペンタジエン等の環状モノマーを重合させた樹脂、芳香族系炭化水素樹脂を核内水添した樹脂（例えば、水素化石油樹脂等）等が挙げられる。
脂肪族系炭化水素樹脂としては、例えば、１－ブテン、イソブテン、ブタジエン、１，３－ペンタジエン、イソプレン等の炭素数４～５のモノ又はジオレフィンの少なくとも１種以上を含む留分を重合して得られる樹脂が挙げられる。
テルペン系樹脂としては、例えば、α－ピネン重合体、β－ピネン重合体、ジペンテン重合体、テルペン・フェノール共重合体、α－ピネン・フェノール共重合体、これらの水素添加物等が挙げられる。
ロジン類としては、例えば、ガムロジン、ウッドロジン、トール油等のロジン及びその変性物等であり、変性物としては水素添加、不均化、二量化、エステル化等の変性を施したものが挙げられる。
スチレン系樹脂としては、例えば、スチレン、ビニルトルエン、α－メチルスチレン、イソプロピルトルエン等のスチレン系単量体を重合して得られる分子量の低い樹脂状重合体が挙げられる。 Examples of the aromatic hydrocarbon resin include resins obtained by polymerizing a fraction containing at least one vinyl aromatic hydrocarbon having 8 to 10 carbon atoms such as vinyl toluene, indene, and α-methylstyrene. Examples thereof include a resin obtained by copolymerizing a distillate and an aliphatic hydrocarbon distillate.
Examples of the alicyclic hydrocarbon resin include a resin obtained by cyclizing and dimerizing the diene component in the Spent C4 to C5 distillates and then polymerizing the resin, a resin obtained by polymerizing a cyclic monomer such as cyclopentadiene, and an aromatic resin. Examples thereof include a resin in which a hydrocarbon resin is hydrogenated in the nucleus (for example, a hydride petroleum resin).
As the aliphatic hydrocarbon resin, for example, a distillate containing at least one or more mono or diolefin having 4 to 5 carbon atoms such as 1-butene, isobutene, butadiene, 1,3-pentadiene, and isoprene is polymerized. The resin obtained by
Examples of the terpene-based resin include α-pinene polymer, β-pinene polymer, dipentene polymer, terpene-phenol copolymer, α-pinene-phenol copolymer, and hydrogenated products thereof.
Examples of the rosins include rosins such as gum rosin, wood rosin, and tall oil and their modified products, and examples of the modified products include those subjected to modification such as hydrogenation, disproportionation, dimerization, and esterification. ..
Examples of the styrene-based resin include resin-like polymers having a low molecular weight obtained by polymerizing styrene-based monomers such as styrene, vinyltoluene, α-methylstyrene, and isopropyltoluene.
脂環族系炭化水素樹脂としては、例えば、スペントＣ４～Ｃ５留分中のジエン成分を環化二量化後、重合させて得られる樹脂、シクロペンタジエン等の環状モノマーを重合させた樹脂、芳香族系炭化水素樹脂を核内水添した樹脂（例えば、水素化石油樹脂等）等が挙げられる。
脂肪族系炭化水素樹脂としては、例えば、１－ブテン、イソブテン、ブタジエン、１，３－ペンタジエン、イソプレン等の炭素数４～５のモノ又はジオレフィンの少なくとも１種以上を含む留分を重合して得られる樹脂が挙げられる。
テルペン系樹脂としては、例えば、α－ピネン重合体、β－ピネン重合体、ジペンテン重合体、テルペン・フェノール共重合体、α－ピネン・フェノール共重合体、これらの水素添加物等が挙げられる。
ロジン類としては、例えば、ガムロジン、ウッドロジン、トール油等のロジン及びその変性物等であり、変性物としては水素添加、不均化、二量化、エステル化等の変性を施したものが挙げられる。
スチレン系樹脂としては、例えば、スチレン、ビニルトルエン、α－メチルスチレン、イソプロピルトルエン等のスチレン系単量体を重合して得られる分子量の低い樹脂状重合体が挙げられる。 Examples of the aromatic hydrocarbon resin include resins obtained by polymerizing a fraction containing at least one vinyl aromatic hydrocarbon having 8 to 10 carbon atoms such as vinyl toluene, indene, and α-methylstyrene. Examples thereof include a resin obtained by copolymerizing a distillate and an aliphatic hydrocarbon distillate.
Examples of the alicyclic hydrocarbon resin include a resin obtained by cyclizing and dimerizing the diene component in the Spent C4 to C5 distillates and then polymerizing the resin, a resin obtained by polymerizing a cyclic monomer such as cyclopentadiene, and an aromatic resin. Examples thereof include a resin in which a hydrocarbon resin is hydrogenated in the nucleus (for example, a hydride petroleum resin).
As the aliphatic hydrocarbon resin, for example, a distillate containing at least one or more mono or diolefin having 4 to 5 carbon atoms such as 1-butene, isobutene, butadiene, 1,3-pentadiene, and isoprene is polymerized. The resin obtained by
Examples of the terpene-based resin include α-pinene polymer, β-pinene polymer, dipentene polymer, terpene-phenol copolymer, α-pinene-phenol copolymer, and hydrogenated products thereof.
Examples of the rosins include rosins such as gum rosin, wood rosin, and tall oil and their modified products, and examples of the modified products include those subjected to modification such as hydrogenation, disproportionation, dimerization, and esterification. ..
Examples of the styrene-based resin include resin-like polymers having a low molecular weight obtained by polymerizing styrene-based monomers such as styrene, vinyltoluene, α-methylstyrene, and isopropyltoluene.
粘着付与樹脂は、軟化点が８５℃～１３０℃の樹脂が好ましい。軟化点は、一般的に８５℃以上であると耐熱性に優れた効果を発揮する傾向があり、１３０℃以下であると粘着性付与に優れた効果を発揮する傾向がある。
粘着付与樹脂の軟化点は、ＪＩＳ－Ｋ２２０７：２００６に準拠して、軟化点試験方法（環球法）に基づいて測定された値を用いることができる。
本実施形態に係るヒートシール性層（Ｂ）中の粘着付与樹脂の含有量は、ヒートシール性層（Ｂ）の全体を１００質量％としたとき、１質量％以上３０質量％以下であることが好ましく、５質量％以上２５質量％以下であることがより好ましく、５質量％以上２０質量％以下であることがさらに好ましい。 The tackifier resin is preferably a resin having a softening point of 85 ° C. to 130 ° C. Generally, when the softening point is 85 ° C. or higher, the effect of excellent heat resistance tends to be exhibited, and when the temperature is 130 ° C. or lower, the effect of imparting adhesiveness tends to be excellent.
As the softening point of the tackifier resin, a value measured based on the softening point test method (ring ball method) in accordance with JIS-K2207: 2006 can be used.
The content of the tackifier resin in the heat-sealable layer (B) according to the present embodiment is 1% by mass or more and 30% by mass or less when the entire heat-sealable layer (B) is 100% by mass. It is more preferable that it is 5% by mass or more and 25% by mass or less, and further preferably 5% by mass or more and 20% by mass or less.
粘着付与樹脂の軟化点は、ＪＩＳ－Ｋ２２０７：２００６に準拠して、軟化点試験方法（環球法）に基づいて測定された値を用いることができる。
本実施形態に係るヒートシール性層（Ｂ）中の粘着付与樹脂の含有量は、ヒートシール性層（Ｂ）の全体を１００質量％としたとき、１質量％以上３０質量％以下であることが好ましく、５質量％以上２５質量％以下であることがより好ましく、５質量％以上２０質量％以下であることがさらに好ましい。 The tackifier resin is preferably a resin having a softening point of 85 ° C. to 130 ° C. Generally, when the softening point is 85 ° C. or higher, the effect of excellent heat resistance tends to be exhibited, and when the temperature is 130 ° C. or lower, the effect of imparting adhesiveness tends to be excellent.
As the softening point of the tackifier resin, a value measured based on the softening point test method (ring ball method) in accordance with JIS-K2207: 2006 can be used.
The content of the tackifier resin in the heat-sealable layer (B) according to the present embodiment is 1% by mass or more and 30% by mass or less when the entire heat-sealable layer (B) is 100% by mass. It is more preferable that it is 5% by mass or more and 25% by mass or less, and further preferably 5% by mass or more and 20% by mass or less.
本実施形態に係るヒートシール性層（Ｂ）には、本発明の目的を損なわない範囲内において、上記熱可塑性樹脂及び上記粘着付与樹脂以外の成分を含有させることができる。その他の成分としては特に限定されないが、例えば、可塑剤、酸化防止剤、紫外線吸収剤、帯電防止剤、界面活性剤、着色剤、光安定剤、発泡剤、潤滑剤、結晶核剤、結晶化促進剤、結晶化遅延剤、触媒失活剤、上記熱可塑性樹脂以外の熱可塑性樹脂、熱硬化性樹脂、無機充填剤、有機充填剤、耐衝撃性改良剤、スリップ剤、架橋剤、架橋助剤、上記粘着付与樹脂以外の粘着付与剤、シランカップリング剤、加工助剤、離型剤、加水分解防止剤、耐熱安定剤、アンチブロッキング剤、防曇剤、難燃剤、難燃助剤、光拡散剤、抗菌剤、防黴剤、分散剤やその他の樹脂等を挙げることができる。その他の成分は１種単独で用いてもよいし、２種以上を組み合わせて用いてもよい。
The heat-sealable layer (B) according to the present embodiment can contain components other than the thermoplastic resin and the tackifier resin as long as the object of the present invention is not impaired. The other components are not particularly limited, but are, for example, a plasticizer, an antioxidant, an ultraviolet absorber, an antioxidant, a surfactant, a colorant, a light stabilizer, a foaming agent, a lubricant, a crystal nucleating agent, and crystallization. Accelerator, crystallization retardant, catalyst deactivating agent, thermoplastic resin other than the above thermoplastic resin, thermosetting resin, inorganic filler, organic filler, impact resistance improver, slip agent, cross-linking agent, cross-linking aid Agents, tackifiers other than the above tackifier resins, silane coupling agents, processing aids, mold release agents, hydrolysis inhibitors, heat stabilizers, antiblocking agents, antifogging agents, flame retardants, flame retardant aids, Examples thereof include light diffusers, antibacterial agents, anti-crosslinking agents, dispersants and other resins. Other components may be used alone or in combination of two or more.
＜帯電防止性層（Ｃ）＞
帯電防止性層（Ｃ）は、本実施形態に係る紙キャリアテープ用カバーテープ１０の帯電を防止または抑止するための層であり、導電性ポリマーを含む。これらの帯電防止性層（Ｃ）は、単層構造のみならず、２層以上の積層構造であってもよい。 <Antistatic layer (C)>
The antistatic layer (C) is a layer for preventing or suppressing the charge of thecover tape 10 for the paper carrier tape according to the present embodiment, and contains a conductive polymer. These antistatic layers (C) may have not only a single layer structure but also a laminated structure of two or more layers.
帯電防止性層（Ｃ）は、本実施形態に係る紙キャリアテープ用カバーテープ１０の帯電を防止または抑止するための層であり、導電性ポリマーを含む。これらの帯電防止性層（Ｃ）は、単層構造のみならず、２層以上の積層構造であってもよい。 <Antistatic layer (C)>
The antistatic layer (C) is a layer for preventing or suppressing the charge of the
上記導電性ポリマーとしては特に限定されないが、例えば、ポリチオフェン、ポリアニリン、ポリピロール、ポリエチレンイミン、アリルアミン系重合体等が挙げられる。このような導電性ポリマーは、単独で又は２種以上を組み合わせて用いることができる。帯電防止性能の湿度依存性の少なさの観点から、ポリチオフェンが好ましい。ここで、ポリチオフェンとは、無置換または置換チオフェンの重合体をいう。特に、置換チオフェン重合体としては、ポリ（３，４－エチレンジオキシチオフェン）が好ましい。
The conductive polymer is not particularly limited, and examples thereof include polythiophene, polyaniline, polypyrrole, polyethyleneimine, and allylamine-based polymers. Such conductive polymers can be used alone or in combination of two or more. Polythiophene is preferable from the viewpoint of low humidity dependence of antistatic performance. Here, the polythiophene refers to a polymer of unsubstituted or substituted thiophene. In particular, as the substituted thiophene polymer, poly (3,4-ethylenedioxythiophene) is preferable.
帯電防止性層（Ｃ）は、必要に応じて、導電性ポリマー以外の有機導電性物質、無機導電性物質、帯電防止剤等の他の帯電防止成分を含んでいてもよい。
帯電防止性層（Ｃ）は、前述の導電性ポリマーに加えて、バインダー樹脂を含んでいてもよい。帯電防止性層（Ｃ）を形成する方法として、帯電防止層形成用のコーティング材をヒートシール性層（Ｂ）に塗布して乾燥または硬化させる方法を採用する場合、バインダー樹脂は、コーティング材において溶剤に溶解させて、或いは水系エマルジョン（水性分散液）等として使用される。
バインダー樹脂としては、公知のバインダー樹脂が使用可能であり、カルボキシル基等の親水性基を有する水溶性樹脂若しくは水分散性樹脂、例えば、塩素化ポリプロピレン樹脂、スチレン・アクリル共重合体樹脂、ポリウレタン、ポリエステルアイオノマー等のエマルジョン、水溶性ポリエステル樹脂、水分散性ポリエステル樹脂等が挙げられる。 The antistatic layer (C) may contain other antistatic components such as an organic conductive substance other than the conductive polymer, an inorganic conductive substance, and an antistatic agent, if necessary.
The antistatic layer (C) may contain a binder resin in addition to the above-mentioned conductive polymer. When a method of applying a coating material for forming an antistatic layer to the heat-sealing layer (B) and drying or curing it is adopted as a method of forming the antistatic layer (C), the binder resin is used in the coating material. It is used by dissolving it in a solvent or as an aqueous emulsion (aqueous dispersion).
As the binder resin, a known binder resin can be used, and a water-soluble resin or a water-dispersible resin having a hydrophilic group such as a carboxyl group, for example, a chlorinated polypropylene resin, a styrene / acrylic copolymer resin, polyurethane, etc. Examples thereof include emulsions of polyester ionomers and the like, water-soluble polyester resins, water-dispersible polyester resins and the like.
帯電防止性層（Ｃ）は、前述の導電性ポリマーに加えて、バインダー樹脂を含んでいてもよい。帯電防止性層（Ｃ）を形成する方法として、帯電防止層形成用のコーティング材をヒートシール性層（Ｂ）に塗布して乾燥または硬化させる方法を採用する場合、バインダー樹脂は、コーティング材において溶剤に溶解させて、或いは水系エマルジョン（水性分散液）等として使用される。
バインダー樹脂としては、公知のバインダー樹脂が使用可能であり、カルボキシル基等の親水性基を有する水溶性樹脂若しくは水分散性樹脂、例えば、塩素化ポリプロピレン樹脂、スチレン・アクリル共重合体樹脂、ポリウレタン、ポリエステルアイオノマー等のエマルジョン、水溶性ポリエステル樹脂、水分散性ポリエステル樹脂等が挙げられる。 The antistatic layer (C) may contain other antistatic components such as an organic conductive substance other than the conductive polymer, an inorganic conductive substance, and an antistatic agent, if necessary.
The antistatic layer (C) may contain a binder resin in addition to the above-mentioned conductive polymer. When a method of applying a coating material for forming an antistatic layer to the heat-sealing layer (B) and drying or curing it is adopted as a method of forming the antistatic layer (C), the binder resin is used in the coating material. It is used by dissolving it in a solvent or as an aqueous emulsion (aqueous dispersion).
As the binder resin, a known binder resin can be used, and a water-soluble resin or a water-dispersible resin having a hydrophilic group such as a carboxyl group, for example, a chlorinated polypropylene resin, a styrene / acrylic copolymer resin, polyurethane, etc. Examples thereof include emulsions of polyester ionomers and the like, water-soluble polyester resins, water-dispersible polyester resins and the like.
帯電防止性層（Ｃ）を形成する方法は特に限定されないが、例えば、導電性ポリマーおよびバインダー樹脂を含むコーティング組成物を溶剤に溶解または分散させたコーティング材をヒートシール性層（Ｂ）の表面に塗布して乾燥させ、必要に応じて硬化処理（熱処理、紫外線処理等）を行う手法が挙げられる。塗布方法としては、例えばグラビアコーティング法、ロールコーティング法、ディップコーティング法、噴霧法等公知の方法が使用できる。また必要に応じて塗布面にコロナ放電処理を行ったり、別のコーティング剤でプライマー処理を行ったりすることもできる。
The method for forming the antistatic layer (C) is not particularly limited, and for example, a coating material in which a coating composition containing a conductive polymer and a binder resin is dissolved or dispersed in a solvent is applied to the surface of the heat-sealing layer (B). There is a method of applying it to a solvent, drying it, and performing a curing treatment (heat treatment, ultraviolet treatment, etc.) as necessary. As the coating method, for example, a known method such as a gravure coating method, a roll coating method, a dip coating method, or a spraying method can be used. Further, if necessary, the coated surface may be subjected to a corona discharge treatment or a primer treatment with another coating agent.
コーティング材に用いられる溶剤としては、例えば、水あるいは水と水溶性有機溶剤との混合溶剤が使用される。水溶性有機溶剤としては、例えば、メタノール、エタノール、イソプロピルアルコール、ｎ－プロピルアルコール等のアルコール類、エチレングリコール、ジエチレングリコール、グリコールモノメチルエーテル、グリコールモノエチルエーテル等のグリコール類又はその誘導体、アセトン、メチルエチルケトン等のケトン類、テトラヒドロフラン等の水溶性エーテル類、酢酸エチル等の水溶性エステル類等が挙げられる。
溶剤中に溶解または分散させた導電性ポリマー及び必要に応じて用いられるバインダー樹脂の合計の濃度はヒートシール性層（Ｂ）上へのコーティング法に適した濃度であれば特に限定されないが、例えば、０．１～４０質量％、好ましくは０．２～３０質量％である。
コーティング材には必要に応じて、例えば、塗被体への濡れ性向上のための界面活性剤や消泡剤等の上記以外の成分を添加することができる。 As the solvent used for the coating material, for example, water or a mixed solvent of water and a water-soluble organic solvent is used. Examples of the water-soluble organic solvent include alcohols such as methanol, ethanol, isopropyl alcohol and n-propyl alcohol, glycols such as ethylene glycol, diethylene glycol, glycol monomethyl ether and glycol monoethyl ether or derivatives thereof, acetone, methyl ethyl ketone and the like. Examples thereof include ketones, water-soluble ethers such as tetrahydrofuran, and water-soluble esters such as ethyl acetate.
The total concentration of the conductive polymer dissolved or dispersed in the solvent and the binder resin used as needed is not particularly limited as long as it is suitable for the coating method on the heat-sealing layer (B), but for example. , 0.1 to 40% by mass, preferably 0.2 to 30% by mass.
If necessary, components other than the above, such as a surfactant and an antifoaming agent for improving the wettability to the coated body, can be added to the coating material.
溶剤中に溶解または分散させた導電性ポリマー及び必要に応じて用いられるバインダー樹脂の合計の濃度はヒートシール性層（Ｂ）上へのコーティング法に適した濃度であれば特に限定されないが、例えば、０．１～４０質量％、好ましくは０．２～３０質量％である。
コーティング材には必要に応じて、例えば、塗被体への濡れ性向上のための界面活性剤や消泡剤等の上記以外の成分を添加することができる。 As the solvent used for the coating material, for example, water or a mixed solvent of water and a water-soluble organic solvent is used. Examples of the water-soluble organic solvent include alcohols such as methanol, ethanol, isopropyl alcohol and n-propyl alcohol, glycols such as ethylene glycol, diethylene glycol, glycol monomethyl ether and glycol monoethyl ether or derivatives thereof, acetone, methyl ethyl ketone and the like. Examples thereof include ketones, water-soluble ethers such as tetrahydrofuran, and water-soluble esters such as ethyl acetate.
The total concentration of the conductive polymer dissolved or dispersed in the solvent and the binder resin used as needed is not particularly limited as long as it is suitable for the coating method on the heat-sealing layer (B), but for example. , 0.1 to 40% by mass, preferably 0.2 to 30% by mass.
If necessary, components other than the above, such as a surfactant and an antifoaming agent for improving the wettability to the coated body, can be added to the coating material.
帯電防止層（Ｃ）の厚みは特に限定されず適宜設定できるが、好ましくは０．００１～５．０μｍ、より好ましくは０．０１～３．０μｍである。
The thickness of the antistatic layer (C) is not particularly limited and can be set as appropriate, but is preferably 0.001 to 5.0 μm, and more preferably 0.01 to 3.0 μm.
＜中間層＞
本実施形態に係る紙キャリアテープ用カバーテープ１０は、ヒートシール性層（Ｂ）と基材層（Ａ）との間に、ポリエチレン等の中間層が設けられていてもよい。上記中間層は、ヒートシール性層（Ｂ）と基材層（Ａ）との間の接着性を高めたり、ヒートシール性層（Ｂ）を形成する際の加工性を高めたりするために設けられる層である。 <Mesosphere>
The paper carriertape cover tape 10 according to the present embodiment may be provided with an intermediate layer such as polyethylene between the heat-sealing layer (B) and the base material layer (A). The intermediate layer is provided in order to enhance the adhesiveness between the heat-sealable layer (B) and the base material layer (A) and to enhance the workability when forming the heat-sealable layer (B). It is a layer to be.
本実施形態に係る紙キャリアテープ用カバーテープ１０は、ヒートシール性層（Ｂ）と基材層（Ａ）との間に、ポリエチレン等の中間層が設けられていてもよい。上記中間層は、ヒートシール性層（Ｂ）と基材層（Ａ）との間の接着性を高めたり、ヒートシール性層（Ｂ）を形成する際の加工性を高めたりするために設けられる層である。 <Mesosphere>
The paper carrier
２．紙キャリアテープ用カバーテープの製造方法
ヒートシール性層（Ｂ）を基材層（Ａ）に積層する方法としては、例えば、熱可塑性樹脂と、必要に応じて、粘着付与樹脂と、その他の成分と、を含む組成物を、二軸の混練り機、ニーダールーダー等で混合し、得られた混合物を基材層（Ａ）に押出ラミネートする方法；インフレーションやＴ－ダイキャスト成形によりフィルム状にした組成物を、基材層（Ａ）とラミネートさせる、いわゆるサーマルラミネート法、ドライラミネート法、サンドラミネート法、共押出インフレーション法、共押出Ｔダイ法等の方法が挙げられる。 2. 2. Method for Manufacturing Cover Tape for Paper Carrier Tape As a method for laminating the heat-sealable layer (B) on the base material layer (A), for example, a thermoplastic resin,, if necessary, a tackifier resin, and other components. A method in which the composition containing the above is mixed by a biaxial kneader, a kneader ruder, etc., and the obtained mixture is extruded and laminated on the base material layer (A); in the form of a film by inflation or T-diecast molding. Examples thereof include a so-called thermal laminating method, a dry laminating method, a sand laminating method, a coextrusion inflation method, and a coextrusion T-die method in which the resulting composition is laminated with the base material layer (A).
ヒートシール性層（Ｂ）を基材層（Ａ）に積層する方法としては、例えば、熱可塑性樹脂と、必要に応じて、粘着付与樹脂と、その他の成分と、を含む組成物を、二軸の混練り機、ニーダールーダー等で混合し、得られた混合物を基材層（Ａ）に押出ラミネートする方法；インフレーションやＴ－ダイキャスト成形によりフィルム状にした組成物を、基材層（Ａ）とラミネートさせる、いわゆるサーマルラミネート法、ドライラミネート法、サンドラミネート法、共押出インフレーション法、共押出Ｔダイ法等の方法が挙げられる。 2. 2. Method for Manufacturing Cover Tape for Paper Carrier Tape As a method for laminating the heat-sealable layer (B) on the base material layer (A), for example, a thermoplastic resin,, if necessary, a tackifier resin, and other components. A method in which the composition containing the above is mixed by a biaxial kneader, a kneader ruder, etc., and the obtained mixture is extruded and laminated on the base material layer (A); in the form of a film by inflation or T-diecast molding. Examples thereof include a so-called thermal laminating method, a dry laminating method, a sand laminating method, a coextrusion inflation method, and a coextrusion T-die method in which the resulting composition is laminated with the base material layer (A).
３．電子部品搬送用包装体
本実施形態に係る電子部品搬送用包装体は、電子部品を収納可能な凹部を有する紙キャリアテープと、紙キャリアテープに熱接着されるカバーテープと、を備える電子部品搬送用包装体であって、上記カバーテープが本実施形態に係る紙キャリアテープ用カバーテープ１０を含む。
上記紙キャリアテープとしては、例えば、長さ方向に一定間隔に複数の打ち抜き穴を形成した収納台紙の片面（下面）にボトムカバーテープを熱シールし、上記各打ち抜き穴を電子部品を収納可能な凹部として用いたもの；収納台紙にエンボス加工が施されて、電子部品を収納可能な凹部が収納台紙の長手方向に沿って一定間隔で複数形成されたもの；等が挙げられる。
本実施形態に係る電子部品搬送用包装体は、本実施形態に係る紙キャリアテープ用カバーテープ１０を用いて構成されているため、紙キャリアテープへの接着性、紙キャリアテープからの易剥離性および帯電防止性の性能バランスに優れている。
また、本実施形態に係る電子部品包装体は、本実施形態に係る電子部品搬送用包装体と、紙キャリアテープの凹部に収納された電子部品と、を備える。 3. 3. Packaging for transporting electronic parts The packaging for transporting electronic parts according to the present embodiment includes a paper carrier tape having a recess for storing electronic parts and a cover tape that is heat-bonded to the paper carrier tape. The cover tape includes the paper carriertape cover tape 10 according to the present embodiment.
As the paper carrier tape, for example, a bottom cover tape can be heat-sealed on one side (lower surface) of a storage mount having a plurality of punched holes formed at regular intervals in the length direction, and electronic components can be stored in each of the punched holes. Examples thereof include those used as recesses; the storage mount is embossed, and a plurality of recesses capable of storing electronic components are formed at regular intervals along the longitudinal direction of the storage mount; and the like.
Since the packaging body for transporting electronic components according to the present embodiment is configured by using thecover tape 10 for the paper carrier tape according to the present embodiment, it has adhesiveness to the paper carrier tape and easy peelability from the paper carrier tape. It has an excellent balance of antistatic performance.
Further, the electronic component package according to the present embodiment includes the electronic component transport package according to the present embodiment and the electronic component housed in the recess of the paper carrier tape.
本実施形態に係る電子部品搬送用包装体は、電子部品を収納可能な凹部を有する紙キャリアテープと、紙キャリアテープに熱接着されるカバーテープと、を備える電子部品搬送用包装体であって、上記カバーテープが本実施形態に係る紙キャリアテープ用カバーテープ１０を含む。
上記紙キャリアテープとしては、例えば、長さ方向に一定間隔に複数の打ち抜き穴を形成した収納台紙の片面（下面）にボトムカバーテープを熱シールし、上記各打ち抜き穴を電子部品を収納可能な凹部として用いたもの；収納台紙にエンボス加工が施されて、電子部品を収納可能な凹部が収納台紙の長手方向に沿って一定間隔で複数形成されたもの；等が挙げられる。
本実施形態に係る電子部品搬送用包装体は、本実施形態に係る紙キャリアテープ用カバーテープ１０を用いて構成されているため、紙キャリアテープへの接着性、紙キャリアテープからの易剥離性および帯電防止性の性能バランスに優れている。
また、本実施形態に係る電子部品包装体は、本実施形態に係る電子部品搬送用包装体と、紙キャリアテープの凹部に収納された電子部品と、を備える。 3. 3. Packaging for transporting electronic parts The packaging for transporting electronic parts according to the present embodiment includes a paper carrier tape having a recess for storing electronic parts and a cover tape that is heat-bonded to the paper carrier tape. The cover tape includes the paper carrier
As the paper carrier tape, for example, a bottom cover tape can be heat-sealed on one side (lower surface) of a storage mount having a plurality of punched holes formed at regular intervals in the length direction, and electronic components can be stored in each of the punched holes. Examples thereof include those used as recesses; the storage mount is embossed, and a plurality of recesses capable of storing electronic components are formed at regular intervals along the longitudinal direction of the storage mount; and the like.
Since the packaging body for transporting electronic components according to the present embodiment is configured by using the
Further, the electronic component package according to the present embodiment includes the electronic component transport package according to the present embodiment and the electronic component housed in the recess of the paper carrier tape.
本実施形態に係る紙キャリアテープは、部品組立用の機械（実装機）にセットされて、マイクロチップ等の電子部品を埋め込んで保管、運搬等し、その後は所望に応じて取り出すことができる長尺に形成されたものである。
また、本実施形態に係る電子部品搬送用包装体は、紙キャリアテープと紙キャリアテープ用カバーテープ１０を用い、紙キャリアテープの電子部品（例：ＩＣチップやマイクロチップ、静電気敏感性デバイス等）が収容される収容部（凹部）が開口する開口面の上に、紙キャリアテープ用カバーテープ１０をその帯電防止性層（Ｃ）が開口面に向くように重ね、紙キャリアテープ用カバーテープ１０の上からヒートシールすることにより作製される。 The paper carrier tape according to this embodiment is set in a machine for assembling parts (mounting machine), and electronic parts such as microchips can be embedded, stored, transported, etc., and then taken out as desired. It is formed on a scale.
Further, the packaging body for transporting electronic parts according to the present embodiment uses a paper carrier tape and acover tape 10 for the paper carrier tape, and electronic parts of the paper carrier tape (eg, IC chip, microchip, electrostatic sensitive device, etc.). The cover tape 10 for paper carrier tape is laminated on the opening surface where the accommodating portion (concave portion) for accommodating the paper carrier tape is opened so that the antistatic layer (C) faces the opening surface. It is produced by heat-sealing from above.
また、本実施形態に係る電子部品搬送用包装体は、紙キャリアテープと紙キャリアテープ用カバーテープ１０を用い、紙キャリアテープの電子部品（例：ＩＣチップやマイクロチップ、静電気敏感性デバイス等）が収容される収容部（凹部）が開口する開口面の上に、紙キャリアテープ用カバーテープ１０をその帯電防止性層（Ｃ）が開口面に向くように重ね、紙キャリアテープ用カバーテープ１０の上からヒートシールすることにより作製される。 The paper carrier tape according to this embodiment is set in a machine for assembling parts (mounting machine), and electronic parts such as microchips can be embedded, stored, transported, etc., and then taken out as desired. It is formed on a scale.
Further, the packaging body for transporting electronic parts according to the present embodiment uses a paper carrier tape and a
以上、図面を参照して本発明の実施形態について述べたが、これらは本発明の例示であり、上記以外の様々な構成を採用することもできる。
Although the embodiments of the present invention have been described above with reference to the drawings, these are examples of the present invention, and various configurations other than the above can be adopted.
以下、本発明を実施例に基づいて具体的に説明するが、本発明はこれらの実施例に限定されるものではない。
Hereinafter, the present invention will be specifically described based on examples, but the present invention is not limited to these examples.
紙キャリアテープ用カバーテープの作製に用いた材料の詳細は以下の通りである。
The details of the materials used to make the cover tape for the paper carrier tape are as follows.
＜基材層（Ａ）＞
・ＰＥＴフィルム：東レ社製、製品名：ルミラー、厚み２５μｍ
・アンカーコート剤（ａｃとも呼ぶ。）：セイカダイン２７１０Ａ(大日精化工業社製)＋セイカダイン２７１０Ｃ（大日精化工業社製)＋酢酸エチル＝２＋４＋３１（質量部）（固形濃度：７質量％） <Base material layer (A)>
-PET film: manufactured by Toray Industries, Inc., product name: Lumirror, thickness 25 μm
Anchor coating agent (also called ac): Seikadyne 2710A (manufactured by Dainichiseika Kogyo Co., Ltd.) + Seikadyne 2710C (manufactured by Dainichiseika Kogyo Co., Ltd.) + ethyl acetate = 2 + 4 + 31 (parts by mass) (solid concentration: 7% by mass)
・ＰＥＴフィルム：東レ社製、製品名：ルミラー、厚み２５μｍ
・アンカーコート剤（ａｃとも呼ぶ。）：セイカダイン２７１０Ａ(大日精化工業社製)＋セイカダイン２７１０Ｃ（大日精化工業社製)＋酢酸エチル＝２＋４＋３１（質量部）（固形濃度：７質量％） <Base material layer (A)>
-PET film: manufactured by Toray Industries, Inc., product name: Lumirror, thickness 25 μm
Anchor coating agent (also called ac): Seikadyne 2710A (manufactured by Dainichiseika Kogyo Co., Ltd.) + Seikadyne 2710C (manufactured by Dainichiseika Kogyo Co., Ltd.) + ethyl acetate = 2 + 4 + 31 (parts by mass) (solid concentration: 7% by mass)
＜ヒートシール性層（Ｂ）＞
・評価樹脂１：エチレン・酢酸ビニル共重合体１（ＥＶＡ１、ＭＦＲ＝９ｇ/１０ｍｉｎ、酢酸ビニルに由来する構成単位（酢酸ビニル含有量）：１０質量％）＋直鎖状低密度ポリエチレン（ｍＬＬＤＰＥ、ＭＦＲ＝３．８ｇ/１０ｍｉｎ、密度＝９０３ｋｇ/ｍ３)＋粘着付与樹脂（荒川化学工業社製、製品名：アルコンＰ－１１５）＝７５＋１０＋１５（質量比）
・評価樹脂２：エチレン・酢酸ビニル共重合体２（ＥＶＡ２、ＭＦＲ＝２４ｇ/１０ｍｉｎ、酢酸ビニルに由来する構成単位（酢酸ビニル含有量）：５．５質量％）＋エチレン・酢酸ビニル共重合体３（ＥＶＡ３、ＭＦＲ＝１５０ｇ/１０ｍｉｎ、酢酸ビニルに由来する構成単位（酢酸ビニル含有量）：１９質量％）＋粘着付与樹脂（荒川化学工業社製、製品名：アルコンＰ－１１５）＝８７＋５＋８（質量比） <Heat sealable layer (B)>
-Evaluation resin 1: Ethylene-vinyl acetate copolymer 1 (EVA1, MFR = 9 g / 10 min, structural unit derived from vinyl acetate (vinyl acetate content): 10% by mass) + linear low-density polyethylene (mLLDPE, MFR = 3.8 g / 10 min, density = 903 kg / m 3 ) + adhesive resin (manufactured by Arakawa Chemical Industry Co., Ltd., product name: Archon P-115) = 75 + 10 + 15 (mass ratio)
-Evaluation resin 2: Ethylene-vinyl acetate copolymer 2 (EVA2, MFR = 24 g / 10 min, structural unit derived from vinyl acetate (vinyl acetate content): 5.5% by mass) + ethylene-vinyl acetate copolymer 3 (EVA3, MFR = 150g / 10min, structural unit derived from vinyl acetate (vinyl acetate content): 19% by mass) + tackifier resin (manufactured by Arakawa Chemical Industry Co., Ltd., product name: Archon P-115) = 87 + 5 + 8 ( Mass ratio)
・評価樹脂１：エチレン・酢酸ビニル共重合体１（ＥＶＡ１、ＭＦＲ＝９ｇ/１０ｍｉｎ、酢酸ビニルに由来する構成単位（酢酸ビニル含有量）：１０質量％）＋直鎖状低密度ポリエチレン（ｍＬＬＤＰＥ、ＭＦＲ＝３．８ｇ/１０ｍｉｎ、密度＝９０３ｋｇ/ｍ３)＋粘着付与樹脂（荒川化学工業社製、製品名：アルコンＰ－１１５）＝７５＋１０＋１５（質量比）
・評価樹脂２：エチレン・酢酸ビニル共重合体２（ＥＶＡ２、ＭＦＲ＝２４ｇ/１０ｍｉｎ、酢酸ビニルに由来する構成単位（酢酸ビニル含有量）：５．５質量％）＋エチレン・酢酸ビニル共重合体３（ＥＶＡ３、ＭＦＲ＝１５０ｇ/１０ｍｉｎ、酢酸ビニルに由来する構成単位（酢酸ビニル含有量）：１９質量％）＋粘着付与樹脂（荒川化学工業社製、製品名：アルコンＰ－１１５）＝８７＋５＋８（質量比） <Heat sealable layer (B)>
-Evaluation resin 1: Ethylene-vinyl acetate copolymer 1 (EVA1, MFR = 9 g / 10 min, structural unit derived from vinyl acetate (vinyl acetate content): 10% by mass) + linear low-density polyethylene (mLLDPE, MFR = 3.8 g / 10 min, density = 903 kg / m 3 ) + adhesive resin (manufactured by Arakawa Chemical Industry Co., Ltd., product name: Archon P-115) = 75 + 10 + 15 (mass ratio)
-Evaluation resin 2: Ethylene-vinyl acetate copolymer 2 (EVA2, MFR = 24 g / 10 min, structural unit derived from vinyl acetate (vinyl acetate content): 5.5% by mass) + ethylene-vinyl acetate copolymer 3 (EVA3, MFR = 150g / 10min, structural unit derived from vinyl acetate (vinyl acetate content): 19% by mass) + tackifier resin (manufactured by Arakawa Chemical Industry Co., Ltd., product name: Archon P-115) = 87 + 5 + 8 ( Mass ratio)
＜帯電防止性層（Ｃ）＞
・チオフォエン系帯電防止（ＡＳ）剤：ポリ（３，４－エチレンジオキシチオフェン）を含む帯電防止剤、化研産業社製、製品名：ＭＣ－１００
・陽イオン性界面活性剤：花王社製、製品名：エレクトロストリッパーＱＮ <Antistatic layer (C)>
-Thiophoene antistatic (AS) agent: Antistatic agent containing poly (3,4-ethylenedioxythiophene), manufactured by Kaken Sangyo Co., Ltd., product name: MC-100
-Cationic surfactant: manufactured by Kao Corporation, product name: electro stripper QN
・チオフォエン系帯電防止（ＡＳ）剤：ポリ（３，４－エチレンジオキシチオフェン）を含む帯電防止剤、化研産業社製、製品名：ＭＣ－１００
・陽イオン性界面活性剤：花王社製、製品名：エレクトロストリッパーＱＮ <Antistatic layer (C)>
-Thiophoene antistatic (AS) agent: Antistatic agent containing poly (3,4-ethylenedioxythiophene), manufactured by Kaken Sangyo Co., Ltd., product name: MC-100
-Cationic surfactant: manufactured by Kao Corporation, product name: electro stripper QN
＜中間層＞
・ＬＤＰＥ：低密度ポリエチレン（三井・ダウポリケミカル社製、製品名：ミラソン
１６Ｐ、ＭＦＲ＝３．７ｇ/１０ｍｉｎ、密度＝９２３ｋｇ/ｍ３） <Mesosphere>
-LDPE: Low density polyethylene (manufactured by Mitsui Dow Polychemical Co., Ltd., product name: Mirason 16P, MFR = 3.7 g / 10 min, density = 923 kg / m 3 )
・ＬＤＰＥ：低密度ポリエチレン（三井・ダウポリケミカル社製、製品名：ミラソン
１６Ｐ、ＭＦＲ＝３．７ｇ/１０ｍｉｎ、密度＝９２３ｋｇ/ｍ３） <Mesosphere>
-LDPE: Low density polyethylene (manufactured by Mitsui Dow Polychemical Co., Ltd., product name: Mirason 16P, MFR = 3.7 g / 10 min, density = 923 kg / m 3 )
［実施例１～２および比較例１～３］
以下の手順で紙キャリアテープ用カバーテープをそれぞれ作製した。
（１）６５ｍｍФ押出機（Ｌ／Ｄ＝２８）を有する押出ラミネーターを使用し、ＰＥＴフィルムのコロナ処理面へアンカーコート剤をインラインで塗布し、次いで、アンカーコート剤上にダイ下樹脂温度３２０℃でＬＤＰＥの溶融膜を押出し、積層体（ＰＥＴフィルム（２５μｍ）／ａｃ・ＬＤＰＥ（１５μｍ））を作製した。
（２）次いで、６５ｍｍФ押出機（Ｌ／Ｄ＝２８）を有する押出ラミネーターを使用し、上記積層体（ＰＥＴフィルム（２５μｍ）／ａｃ・ＬＤＰＥ（１５μｍ））のＬＤＰＥ上にダイ下温度２４０℃で評価樹脂を押出し、積層体（ＰＥＴフィルム（２５μｍ）／ａｃ・ＬＤＰＥ（１５μｍ）／評価樹脂（１５μｍ））を作製した。
（３）次いで、上記積層体（ＰＥＴフィルム（２５μｍ）／ａｃ・ＬＤＰＥ（１５μｍ）／評価樹脂（１５μｍ））の評価樹脂面に、帯電防止剤又は界面活性剤の濡れを良くするためにコロナ処理（処理密度：３００Ｗ／ｍ２／ｍｉｎ）を実施し、次いで、RK PrintCoat Instruments Ltd.製K303 Multi Coaterを使用して評価樹脂層上に帯電防止剤又は界面活性剤を６μｍ（乾燥前のウェット状態の厚み）塗工し、オーブン中で乾燥させ、評価用の紙キャリアテープ用カバーテープ（ＰＥＴ（２５μｍ）／ａｃ・ＬＤＰＥ（１５μｍ）／評価樹脂（１５μｍ）／帯電防止剤又は界面活性剤）を得た。
ここで、比較例２および３については、上記（１）および（２）のみを実施し、（３）は実施していない。
得られた紙キャリアテープ用カバーテープについて以下の評価をそれぞれおこなった。得られた結果を表１にそれぞれ示す。 [Examples 1 and 2 and Comparative Examples 1 to 3]
Cover tapes for paper carrier tapes were prepared by the following procedures.
(1) Using an extrusion laminator equipped with a 65 mmФ extruder (L / D = 28), an anchor coating agent is applied in-line to the corona-treated surface of the PET film, and then the resin temperature under the die is 320 ° C. on the anchor coating agent. The melt film of LDPE was extruded to prepare a laminated body (PET film (25 μm) / ac · LDPE (15 μm)).
(2) Next, using an extrusion laminator having a 65 mmФ extruder (L / D = 28), the laminate (PET film (25 μm) / ac · LDPE (15 μm)) is placed on the LDPE at a temperature under the die of 240 ° C. The evaluation resin was extruded to prepare a laminate (PET film (25 μm) / ac · LDPE (15 μm) / evaluation resin (15 μm)).
(3) Next, the evaluation resin surface of the laminate (PET film (25 μm) / ac · LDPE (15 μm) / evaluation resin (15 μm)) is subjected to corona treatment to improve the wetting of the antistatic agent or the surfactant. (Treatment density: 300 W / m 2 / min), and then 6 μm of antistatic agent or surfactant on the evaluation resin layer using K303 Multi Coater manufactured by RK PrintCoat Instruments Ltd. (wet state before drying). (Thickness) Apply, dry in an oven, and apply a cover tape for evaluation paper carrier tape (PET (25 μm) / ac ・ LDPE (15 μm) / evaluation resin (15 μm) / antistatic agent or surfactant). Obtained.
Here, with respect to Comparative Examples 2 and 3, only the above (1) and (2) are carried out, and (3) is not carried out.
The following evaluations were performed on the obtained cover tapes for paper carrier tapes. The results obtained are shown in Table 1.
以下の手順で紙キャリアテープ用カバーテープをそれぞれ作製した。
（１）６５ｍｍФ押出機（Ｌ／Ｄ＝２８）を有する押出ラミネーターを使用し、ＰＥＴフィルムのコロナ処理面へアンカーコート剤をインラインで塗布し、次いで、アンカーコート剤上にダイ下樹脂温度３２０℃でＬＤＰＥの溶融膜を押出し、積層体（ＰＥＴフィルム（２５μｍ）／ａｃ・ＬＤＰＥ（１５μｍ））を作製した。
（２）次いで、６５ｍｍФ押出機（Ｌ／Ｄ＝２８）を有する押出ラミネーターを使用し、上記積層体（ＰＥＴフィルム（２５μｍ）／ａｃ・ＬＤＰＥ（１５μｍ））のＬＤＰＥ上にダイ下温度２４０℃で評価樹脂を押出し、積層体（ＰＥＴフィルム（２５μｍ）／ａｃ・ＬＤＰＥ（１５μｍ）／評価樹脂（１５μｍ））を作製した。
（３）次いで、上記積層体（ＰＥＴフィルム（２５μｍ）／ａｃ・ＬＤＰＥ（１５μｍ）／評価樹脂（１５μｍ））の評価樹脂面に、帯電防止剤又は界面活性剤の濡れを良くするためにコロナ処理（処理密度：３００Ｗ／ｍ２／ｍｉｎ）を実施し、次いで、RK PrintCoat Instruments Ltd.製K303 Multi Coaterを使用して評価樹脂層上に帯電防止剤又は界面活性剤を６μｍ（乾燥前のウェット状態の厚み）塗工し、オーブン中で乾燥させ、評価用の紙キャリアテープ用カバーテープ（ＰＥＴ（２５μｍ）／ａｃ・ＬＤＰＥ（１５μｍ）／評価樹脂（１５μｍ）／帯電防止剤又は界面活性剤）を得た。
ここで、比較例２および３については、上記（１）および（２）のみを実施し、（３）は実施していない。
得られた紙キャリアテープ用カバーテープについて以下の評価をそれぞれおこなった。得られた結果を表１にそれぞれ示す。 [Examples 1 and 2 and Comparative Examples 1 to 3]
Cover tapes for paper carrier tapes were prepared by the following procedures.
(1) Using an extrusion laminator equipped with a 65 mmФ extruder (L / D = 28), an anchor coating agent is applied in-line to the corona-treated surface of the PET film, and then the resin temperature under the die is 320 ° C. on the anchor coating agent. The melt film of LDPE was extruded to prepare a laminated body (PET film (25 μm) / ac · LDPE (15 μm)).
(2) Next, using an extrusion laminator having a 65 mmФ extruder (L / D = 28), the laminate (PET film (25 μm) / ac · LDPE (15 μm)) is placed on the LDPE at a temperature under the die of 240 ° C. The evaluation resin was extruded to prepare a laminate (PET film (25 μm) / ac · LDPE (15 μm) / evaluation resin (15 μm)).
(3) Next, the evaluation resin surface of the laminate (PET film (25 μm) / ac · LDPE (15 μm) / evaluation resin (15 μm)) is subjected to corona treatment to improve the wetting of the antistatic agent or the surfactant. (Treatment density: 300 W / m 2 / min), and then 6 μm of antistatic agent or surfactant on the evaluation resin layer using K303 Multi Coater manufactured by RK PrintCoat Instruments Ltd. (wet state before drying). (Thickness) Apply, dry in an oven, and apply a cover tape for evaluation paper carrier tape (PET (25 μm) / ac ・ LDPE (15 μm) / evaluation resin (15 μm) / antistatic agent or surfactant). Obtained.
Here, with respect to Comparative Examples 2 and 3, only the above (1) and (2) are carried out, and (3) is not carried out.
The following evaluations were performed on the obtained cover tapes for paper carrier tapes. The results obtained are shown in Table 1.
＜帯電防止性評価＞
抵抗率計（三菱化学アナリテック社製、ハイレスタ－ＵＰ、ＵＲ－１００プローブ）を用いて、測定電圧５００Ｖ、測定時間３０秒、２３℃、５０％ＲＨの条件で、紙キャリアテープ用カバーテープの表面抵抗率を測定し、帯電防止性を評価した。表面抵抗率が低いほど帯電防止性に優れていることを意味する。
・判定基準：
〇：表面抵抗率が１．０Ｅ１４Ω／□未満
×：表面抵抗率が１．０Ｅ１４Ω／□以上 <Antistatic property evaluation>
Using a resistivity meter (Mitsubishi Chemical Analytech Co., Ltd., High Restor-UP, UR-100 probe), cover tape for paper carrier tape under the conditions of measurement voltage 500V, measurement time 30 seconds, 23 ° C, 50% RH. The surface resistivity was measured and the antistatic property was evaluated. The lower the surface resistivity, the better the antistatic property.
・ Judgment criteria:
〇: Surface resistivity is less than 1.0E14Ω / □ ×: Surface resistivity is 1.0E14Ω / □ or more
抵抗率計（三菱化学アナリテック社製、ハイレスタ－ＵＰ、ＵＲ－１００プローブ）を用いて、測定電圧５００Ｖ、測定時間３０秒、２３℃、５０％ＲＨの条件で、紙キャリアテープ用カバーテープの表面抵抗率を測定し、帯電防止性を評価した。表面抵抗率が低いほど帯電防止性に優れていることを意味する。
・判定基準：
〇：表面抵抗率が１．０Ｅ１４Ω／□未満
×：表面抵抗率が１．０Ｅ１４Ω／□以上 <Antistatic property evaluation>
Using a resistivity meter (Mitsubishi Chemical Analytech Co., Ltd., High Restor-UP, UR-100 probe), cover tape for paper carrier tape under the conditions of measurement voltage 500V, measurement time 30 seconds, 23 ° C, 50% RH. The surface resistivity was measured and the antistatic property was evaluated. The lower the surface resistivity, the better the antistatic property.
・ Judgment criteria:
〇: Surface resistivity is less than 1.0E14Ω / □ ×: Surface resistivity is 1.0E14Ω / □ or more
［接着性および剥離性評価］
以下の条件で紙キャリアテープ用カバーテープの接着性および剥離性を評価した。
＜試料＞
・紙（被着体）：厚み＝０．４ｍｍ、坪量：３８０ｇｓｍ
＜シール条件＞
・テーピングマシン：株式会社バンガードシステムズ社製ＶＳ－１２０
・シールコテ：２列、幅＝０．５ｍｍ、長さ＝４８ｍｍ
・シール温度：２００℃
・シール時間：０．１秒
・シール回数：２回
＜剥離条件（シール強度測定）＞
・装置：株式会社バンガードシステムズ社製ＶＧ－３５
・剥離速度：３００ｍｍ／ｍｉｎ
・剥離角度：１６５～１８０°
＜接着性評価＞
・判定基準：
〇：シール強度が５ｇ以上５０ｇ以下
×：シール強度が５ｇ未満または５０ｇを超える
＜紙剥け状態評価＞
・手順：上記条件で剥離（シール強度測定）後のサンプルを顕微鏡で観察した。
・判定基準：
〇：紙繊維の付着が無いあるいは紙繊維の付着がほとんど無い
×：紙繊維の付着量が多い [Evaluation of adhesiveness and peelability]
The adhesiveness and peelability of the cover tape for paper carrier tape were evaluated under the following conditions.
<Sample>
-Paper (adhesive body): Thickness = 0.4 mm, Basis weight: 380 gsm
<Seal condition>
-Taping machine: VS-120 manufactured by Vanguard Systems Co., Ltd.
・ Seal iron: 2 rows, width = 0.5 mm, length = 48 mm
・ Seal temperature: 200 ℃
-Seal time: 0.1 seconds-Number of seals: 2 <Peeling conditions (seal strength measurement)>
・ Equipment: VG-35 manufactured by Vanguard Systems Co., Ltd.
-Peeling speed: 300 mm / min
・ Peeling angle: 165 to 180 °
<Adhesion evaluation>
・ Judgment criteria:
〇: Seal strength is 5 g or more and 50 g or less ×: Seal strength is less than 5 g or more than 50 g <Paper peeling condition evaluation>
-Procedure: The sample after peeling (sealing strength measurement) under the above conditions was observed with a microscope.
・ Judgment criteria:
〇: No paper fiber adhesion or almost no paper fiber adhesion ×: Large amount of paper fiber adhesion
以下の条件で紙キャリアテープ用カバーテープの接着性および剥離性を評価した。
＜試料＞
・紙（被着体）：厚み＝０．４ｍｍ、坪量：３８０ｇｓｍ
＜シール条件＞
・テーピングマシン：株式会社バンガードシステムズ社製ＶＳ－１２０
・シールコテ：２列、幅＝０．５ｍｍ、長さ＝４８ｍｍ
・シール温度：２００℃
・シール時間：０．１秒
・シール回数：２回
＜剥離条件（シール強度測定）＞
・装置：株式会社バンガードシステムズ社製ＶＧ－３５
・剥離速度：３００ｍｍ／ｍｉｎ
・剥離角度：１６５～１８０°
＜接着性評価＞
・判定基準：
〇：シール強度が５ｇ以上５０ｇ以下
×：シール強度が５ｇ未満または５０ｇを超える
＜紙剥け状態評価＞
・手順：上記条件で剥離（シール強度測定）後のサンプルを顕微鏡で観察した。
・判定基準：
〇：紙繊維の付着が無いあるいは紙繊維の付着がほとんど無い
×：紙繊維の付着量が多い [Evaluation of adhesiveness and peelability]
The adhesiveness and peelability of the cover tape for paper carrier tape were evaluated under the following conditions.
<Sample>
-Paper (adhesive body): Thickness = 0.4 mm, Basis weight: 380 gsm
<Seal condition>
-Taping machine: VS-120 manufactured by Vanguard Systems Co., Ltd.
・ Seal iron: 2 rows, width = 0.5 mm, length = 48 mm
・ Seal temperature: 200 ℃
-Seal time: 0.1 seconds-Number of seals: 2 <Peeling conditions (seal strength measurement)>
・ Equipment: VG-35 manufactured by Vanguard Systems Co., Ltd.
-Peeling speed: 300 mm / min
・ Peeling angle: 165 to 180 °
<Adhesion evaluation>
・ Judgment criteria:
〇: Seal strength is 5 g or more and 50 g or less ×: Seal strength is less than 5 g or more than 50 g <Paper peeling condition evaluation>
-Procedure: The sample after peeling (sealing strength measurement) under the above conditions was observed with a microscope.
・ Judgment criteria:
〇: No paper fiber adhesion or almost no paper fiber adhesion ×: Large amount of paper fiber adhesion
実施例１および２の紙キャリアテープ用カバーテープは接着性、易剥離性および帯電防止性の性能バランスに優れた。これに対し、比較例１～３の紙キャリアテープ用カバーテープは接着性、易剥離性および帯電防止性の性能バランスに劣っていた。
The cover tapes for paper carrier tapes of Examples 1 and 2 have an excellent balance of adhesiveness, easy peeling property, and antistatic property. On the other hand, the cover tapes for paper carrier tapes of Comparative Examples 1 to 3 were inferior in the performance balance of adhesiveness, easy peeling property and antistatic property.
この出願は、２０１９年３月２７日に出願された日本出願特願２０１９－０６１２１３号を基礎とする優先権を主張し、その開示の全てをここに取り込む。
This application claims priority based on Japanese Application Japanese Patent Application No. 2019-061213 filed on March 27, 2019, and incorporates all of its disclosures herein.
Ａ 基材層
Ｂ ヒートシール性層
Ｃ 帯電防止性層
１０ 紙キャリアテープ用カバーテープ A Base material layer B Heat sealable layerC Antistatic layer 10 Cover tape for paper carrier tape
Ｂ ヒートシール性層
Ｃ 帯電防止性層
１０ 紙キャリアテープ用カバーテープ A Base material layer B Heat sealable layer
Claims (9)
- 基材層（Ａ）と、熱可塑性樹脂を含むヒートシール性層（Ｂ）と、導電性ポリマーを含む帯電防止性層（Ｃ）と、をこの順番に備え、
ＪＩＳ Ｋ７２１０：１９９９に準拠し、１９０℃、２１６０ｇ荷重の条件で測定される、前記熱可塑性樹脂のメルトフローレート（ＭＦＲ）が０．１ｇ／１０分以上１５０ｇ／１０分以下である紙キャリアテープ用カバーテープ。 A base material layer (A), a heat-sealing layer (B) containing a thermoplastic resin, and an antistatic layer (C) containing a conductive polymer are provided in this order.
For paper carrier tapes in which the melt flow rate (MFR) of the thermoplastic resin is 0.1 g / 10 minutes or more and 150 g / 10 minutes or less, which is measured under the condition of 190 ° C. and 2160 g load according to JIS K7210: 1999. Cover tape. - 請求項１に記載の紙キャリアテープ用カバーテープにおいて、
前記ヒートシール性層（Ｂ）が粘着付与樹脂を含む紙キャリアテープ用カバーテープ。 In the cover tape for paper carrier tape according to claim 1,
A cover tape for a paper carrier tape in which the heat-sealing layer (B) contains an adhesive resin. - 請求項１または２に記載の紙キャリアテープ用カバーテープにおいて、
前記熱可塑性樹脂がポリオレフィンを含む紙キャリアテープ用カバーテープ。 In the cover tape for paper carrier tape according to claim 1 or 2.
A cover tape for a paper carrier tape in which the thermoplastic resin contains polyolefin. - 請求項３に記載の紙キャリアテープ用カバーテープにおいて、
前記ポリオレフィンがポリエチレンおよびエチレン系共重合体から選ばれる少なくとも１種を含む紙キャリアテープ用カバーテープ。 In the cover tape for paper carrier tape according to claim 3,
A cover tape for a paper carrier tape, wherein the polyolefin contains at least one selected from polyethylene and an ethylene-based copolymer. - 請求項４に記載の紙キャリアテープ用カバーテープにおいて、
前記エチレン系共重合体がエチレン・酢酸ビニル共重合体を含む紙キャリアテープ用カバーテープ。 In the cover tape for paper carrier tape according to claim 4.
A cover tape for a paper carrier tape in which the ethylene-based copolymer contains an ethylene-vinyl acetate copolymer. - 請求項１乃至５のいずれか一項に記載の紙キャリアテープ用カバーテープにおいて、
前記導電性ポリマーがポリチオフェンを含む紙キャリアテープ用カバーテープ。 The cover tape for paper carrier tape according to any one of claims 1 to 5.
A cover tape for a paper carrier tape in which the conductive polymer contains polythiophene. - 請求項１乃至６のいずれか一項に記載の紙キャリアテープ用カバーテープにおいて、
前記帯電防止性層（Ｃ）の厚みが０．００１μｍ以上５．０μｍ以下である紙キャリアテープ用カバーテープ。 In the cover tape for paper carrier tape according to any one of claims 1 to 6.
A cover tape for a paper carrier tape having a thickness of the antistatic layer (C) of 0.001 μm or more and 5.0 μm or less. - 電子部品を収納可能な凹部を有する紙キャリアテープと、
前記紙キャリアテープに熱接着されるカバーテープと、
を備える電子部品搬送用包装体であって、
前記カバーテープが請求項１乃至７のいずれか一項に記載の紙キャリアテープ用カバーテープを含む電子部品搬送用包装体。 Paper carrier tape with recesses that can store electronic components,
A cover tape that is heat-bonded to the paper carrier tape and
It is a packaging body for transporting electronic parts equipped with
A packaging body for transporting electronic components, wherein the cover tape includes the cover tape for the paper carrier tape according to any one of claims 1 to 7. - 請求項８に記載の電子部品搬送用包装体と、
前記紙キャリアテープの前記凹部に収納された電子部品と、
を備える電子部品包装体。 The packaging body for transporting electronic components according to claim 8 and
Electronic components housed in the recesses of the paper carrier tape and
Electronic component packaging.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021509092A JPWO2020196031A1 (en) | 2019-03-27 | 2020-03-16 | |
| KR1020247004493A KR20240025041A (en) | 2019-03-27 | 2020-03-16 | Cover tape for paper carrier tapes, package for electronic component conveyance, and electronic component package |
| CN202080024327.6A CN113614002B (en) | 2019-03-27 | 2020-03-16 | Cover tape for paper carrier tape, package for transporting electronic component, and package for electronic component |
| KR1020217033995A KR20210141645A (en) | 2019-03-27 | 2020-03-16 | Cover tape for paper carrier tape, electronic component conveyance package and electronic component package |
| JP2022200044A JP7300052B2 (en) | 2019-03-27 | 2022-12-15 | Cover tape for paper carrier tape, package for transporting electronic parts, and package for electronic parts |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-061213 | 2019-03-27 | ||
| JP2019061213 | 2019-03-27 |
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| WO2020196031A1 true WO2020196031A1 (en) | 2020-10-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| PCT/JP2020/011462 WO2020196031A1 (en) | 2019-03-27 | 2020-03-16 | Cover tape for paper carrier tapes, package for electronic component conveyance, and electronic component package |
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| Country | Link |
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| JP (2) | JPWO2020196031A1 (en) |
| KR (2) | KR20210141645A (en) |
| CN (1) | CN113614002B (en) |
| TW (1) | TW202100428A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114229231A (en) * | 2021-12-28 | 2022-03-25 | 浙江洁美电子科技股份有限公司 | Cover tape and electronic component packaging body |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR102495657B1 (en) | 2022-05-13 | 2023-02-07 | 주식회사 지피씨 | Water-soluble paper tape and the method thereof |
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| JP2016068987A (en) * | 2014-09-29 | 2016-05-09 | 住友ベークライト株式会社 | Cover tape for packaging electronic component |
| WO2016129567A1 (en) * | 2015-02-09 | 2016-08-18 | 三井・デュポンポリケミカル株式会社 | Adhesive resin and easily releasable film |
| US20190067072A1 (en) * | 2017-08-29 | 2019-02-28 | Daewon Semiconductor Packaging Industrial Company | Tape carrier assemblies having an integrated adhesive film |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114229231A (en) * | 2021-12-28 | 2022-03-25 | 浙江洁美电子科技股份有限公司 | Cover tape and electronic component packaging body |
| CN114229231B (en) * | 2021-12-28 | 2023-03-31 | 浙江洁美电子科技股份有限公司 | Cover tape and electronic component packaging body |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023021347A (en) | 2023-02-10 |
| CN113614002A (en) | 2021-11-05 |
| TW202100428A (en) | 2021-01-01 |
| KR20210141645A (en) | 2021-11-23 |
| JP7300052B2 (en) | 2023-06-28 |
| CN113614002B (en) | 2023-06-09 |
| JPWO2020196031A1 (en) | 2020-10-01 |
| KR20240025041A (en) | 2024-02-26 |
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