WO2020186388A1

WO2020186388A1 - Light-emitting assembly, optical module, and optical line terminal

Info

Publication number: WO2020186388A1
Application number: PCT/CN2019/078275
Authority: WO
Inventors: 王衡; 周恩宇; 锁靖; 董英华; 王海丽; 包占京
Original assignee: 华为技术有限公司
Priority date: 2019-03-15
Filing date: 2019-03-15
Publication date: 2020-09-24
Also published as: CN113574432A; CN113574432B

Abstract

A light-emitting assembly, an optical module, and an optical line terminal. The light-emitting assembly comprises a laser (602), an optical switch (609), a light exit (605), a single chip microcomputer (607), a thermoelectric cooler (604). The laser (602) is connected to the light exit (605). The optical switch (609) is provided on an optical path between the laser (602) and the light exit (605). The laser (602), the optical switch (609) and the thermoelectric cooler (604) are connected to the single chip microcomputer (607). The single chip microcomputer (607) controls the laser (602) to be in an on state. Regardless of whether the light-emitting assembly is positioned in a main port of a passive optical network or in a backup port of the passive optical network, the laser (602) remains in a normal operating state, and the thermoelectric cooler (604) remains in a thermal equilibrium state. The invention ensures that thermal equilibrium of the thermoelectric cooler (604) is not affected.

Description

Optical emission component, optical module and optical line terminal

Technical field

This application relates to a passive optical fiber network, and in particular to an optical transmitting component, an optical module and an optical line terminal.

Background technique

With the development of communication technology, the requirements for the speed of passive optical fiber networks are getting higher and higher. Passive optical fiber networks are composed of optical line terminals, multiple optical network units, and optical distribution networks and other passive components. In order to ensure uninterrupted services, the optical line terminal may include a main passive optical fiber network port and a backup passive optical fiber network port. When the main passive optical fiber network port cannot carry normal service bearing, the standby passive optical network port carries the service.

The spare passive optical fiber network port includes a laser for emitting light and a semiconductor cooler used to provide a constant operating temperature for the laser. When the spare passive optical fiber network port is suddenly activated, the thermal balance of the semiconductor cooler is destroyed, resulting in the laser The working temperature changes and the wavelength drifts, making the laser unable to work stably within the specified time.

Summary of the invention

This application provides an optical transmitter component, an optical module, and an optical line terminal, which can effectively ensure that the standby passive optical fiber network port can be used when the main passive optical fiber network port and the standby passive optical fiber network port are switched. Stable work within a period of time.

The first aspect of the present application provides a light emitting component, the light emitting component is located in an optical module, and the optical module is located in an optical line terminal;

Specifically, the light emitting assembly includes a laser, an optical switch, a light outlet for emitting light to an optical fiber, a single-chip microcomputer, and a semiconductor cooler attached to the laser. The laser is connected to the light outlet, and The optical switch is provided on the optical path between the laser and the optical outlet;

The laser, the optical switch, and the semiconductor refrigerator are all connected to the single-chip microcomputer, the laser is used to be in an on state under the control of the single-chip microcomputer, and the semiconductor refrigerator is used to be under the control of the single-chip microcomputer. Provide a working temperature for the laser;

When the optical transmitting component is located in the main passive optical fiber network port, the single-chip microcomputer determines that it is necessary to control the optical transmitting component to be in a working state, then the single-chip microcomputer is used to power off the optical switch to make all The optical path between the laser and the light outlet is turned on, and the light emitting component is in a normal light emitting state at this time;

When the light emitting component is located in the spare passive optical fiber network port, and the single-chip microcomputer determines that it is necessary to control the light emitting component to be in the off state, the single-chip microcomputer is used to perform power-on processing on the optical switch to enable the The optical path between the laser and the optical outlet is disconnected. At this time, the light-emitting assembly is not emitting light or is in a relatively weak light-emitting state, so that the standby passive optical fiber network port will not cause damage to the normal working main passive optical fiber network port. influences.

In the case that Type B protection is required, and when the optical transmitting component is located in the main passive optical fiber network port, the single-chip microcomputer determines that it is necessary to control the optical transmitting component to be in the off state, then the single-chip microcomputer is used to The optical switch performs power-on processing to disconnect the optical path between the laser and the light outlet, and at this time the light emitting component is in a non-light emitting or weak light emitting state;

When the optical transmitting component is located in the spare passive optical fiber network port, therefore the passive optical network port that works normally is switched from the active passive optical network port to the standby passive optical network port, the single-chip microcomputer determines that it needs to be controlled If the light emitting component is in a normal working state, the single-chip microcomputer is used to perform power-off processing on the optical switch to make the optical path between the laser and the light outlet open, and the light emitting component is in a light emitting state at this time .

Using the specific structure of the optical transmitter assembly shown in the aspect, it can be seen that whether the optical transmitter assembly is located in the main passive optical fiber network port or the standby passive optical fiber network port, the laser is in a normal working state. It can be seen that even if the optical module Located in the spare passive optical fiber network port, because the laser is in a normal working state, the semiconductor cooler is always in a thermal equilibrium state, and in the case of Type B protection, the laser located in the spare passive optical fiber network port has been in a stable state It will not be opened suddenly. The standby passive optical fiber network port only needs to power off the optical switch, so that in the case of Type B protection, the thermal balance of the semiconductor cooler will not be destroyed, and the optical module can realize Type in a short time. B. Purpose of protection.

Based on the first aspect of the present application, in an optional implementation of the first aspect of the present application, the light emitting component further includes a filter and a multiplexer, and the laser, the filter, and the multiplexer The semiconductor cooler and the light outlet are sequentially connected, the semiconductor cooler is also attached to the filter, and the semiconductor cooler is used to provide a stable working temperature for the laser and the filter.

Adopting the structure of the light emitting component shown in this aspect, the scheme of combining the laser and the filter is adopted, which can effectively suppress the chirp of the laser, so that the filter can pass the required signal in the laser and filter out the unwanted signal , Thereby reducing the influence of dispersion on signal transmission. The sensitivity of the light emitting component can be improved, the dispersion cost is reduced, and the power consumption can also be reduced.

Based on the first aspect of the present application, in an optional implementation of the first aspect of the present application, the optical switch is integrated on the multiplexer.

Using the structure of the optical transmitting component shown in the aspect, the optical switch and the multiplexer are integrated. When the optical switch is not energized, the multiplexer only has the multiplexing function, and when the optical switch is energized, the multiplexer has the function of the optical switch. The function is to disconnect the optical path between the laser and the optical outlet, so that in the case of Type B protection, the TEC thermal balance will not be destroyed. The optical module realizes the purpose of Type B protection in a short time, and because of the multiplexer and optical switch The integrated solution can effectively reduce the size and volume of the optical module and reduce the cost of the optical module.

Based on the first aspect of the present application, in an optional implementation of the first aspect of the present application, the multiplexer in the Mach-Zinde structure includes a first optical fiber arm and a second optical fiber arm. A first electrode in the form of a positive electrode and a second electrode in the form of a negative electrode are provided on the upper part, the target optical fiber arm is the first optical fiber arm or the second optical fiber arm, and the first electrode and the second electrode are the An optical switch, and the first electrode and the second electrode are both connected with the single-chip microcomputer.

Using the structure of the light emitting component shown in this aspect, the first electrode and the second electrode as the optical switch and the multiplexer are integrated. When the first electrode and the second electrode are not energized, the multiplexer only has the multiplexing function , And when the first electrode and the second electrode are energized, the multiplexer has the function of an optical switch, that is, the optical path between the laser and the optical outlet is disconnected, so that in the case of Type B protection, the TEC thermal balance will not be destroyed. The first electrode and the second electrode achieve the purpose of Type B protection in a short time, and because the multiplexer and the optical switch are integrated, the size and volume of the optical module can be effectively reduced, and the cost of the optical module can be reduced.

Based on the first aspect of the present application, in an optional implementation of the first aspect of the present application, the optical switch is integrated on the filter.

The structure of the light emitting component shown in the aspect is adopted to integrate the optical switch and the filter. When the optical switch is not energized, the filter only has a filtering function, and when the optical switch is energized, the filter has the function of an optical switch, namely The optical path between the laser and the optical outlet is disconnected, so that in the case of Type B protection, the thermal balance of the TEC will not be destroyed. The optical module achieves the purpose of Type B protection in a short time, and because of the integrated solution of the filter and the optical switch, It can effectively reduce the size and volume of the optical module and reduce the cost of the optical module.

Based on the first aspect of the present application, in an optional implementation of the first aspect of the present application, the filter is a loop filter, and the loop body of the filter is connected with a first positive pole. An electrode and a second electrode that is a negative electrode, the first electrode and the second electrode are the optical switch, and the first electrode and the second electrode are both connected with the single-chip microcomputer.

With the structure of the light emitting component shown in this aspect, the first electrode and the second electrode as the optical switch and the filter are integrated. When the first electrode and the second electrode are not energized, the filter only has a filtering function, and When the first electrode and the second electrode are energized, the filter has the function of an optical switch, that is, the optical path between the laser and the light outlet is disconnected, so that in the case of Type B protection, the thermal balance of the TEC will not be destroyed. The second electrode achieves the purpose of realizing Type B protection in a short time, and because the filter and optical switch are integrated, the size and volume of the optical module can be effectively reduced, and the cost of the optical module can be reduced.

Based on the first aspect of the present application, in an optional implementation of the first aspect of the present application, the optical switch is connected between the filter and the multiplexer.

With the structure of the light emitting component shown in this aspect, the optical switch is arranged between the filter and the multiplexer. When the optical switch is not energized, the optical switch only has the function of connecting the filter and the multiplexer, When the optical switch is energized, the optical switch has the function of an optical switch, that is, it disconnects the optical path between the laser and the optical outlet, so that in the case of Type B protection, the thermal balance of the semiconductor cooler will not be destroyed, and the optical module can achieve a short time The purpose of Type B protection is achieved inside, which can effectively reduce the size and volume of the optical module and reduce the cost of the optical module.

Based on the first aspect of the present application, in an optional implementation of the first aspect of the present application, the optical switch has a Mach-Zinde structure, and the optical switch includes a first optical fiber arm and a second optical fiber arm. The target fiber arm is provided with a first electrode that is positive and a second electrode that is negative. The target fiber arm is the first fiber arm or the second fiber arm, and the first electrode and the second The electrodes are all connected with the single chip microcomputer.

With the structure of the light emitting assembly shown in this aspect, the first electrode and the second electrode are arranged between the filter and the multiplexer. When the first electrode and the second electrode are not energized, the first electrode and the second electrode are only It has the function of connecting the filter and the multiplexer. When the first electrode and the second electrode are energized, the first electrode and the second electrode have the function of an optical switch, that is, disconnect the laser and the optical outlet. Optical path, so that in the case of Type B protection, the TEC thermal balance will not be destroyed. The optical module achieves the purpose of Type B protection in a short time, and can effectively reduce the size and volume of the optical module and reduce the cost of the optical module.

A second aspect of the present application provides an optical module, which includes a laser driver and the light emitting assembly shown in the first aspect, the laser driver is connected to the laser and the single-chip microcomputer, and the laser driver is used for Under the control of the single-chip microcomputer, the laser is driven to be in an on state or in an off state.

The third aspect of the present application provides an optical line terminal, including the optical module as shown in the first aspect.

Description of the drawings

Figure 1 is a diagram of an example structure of a passive optical fiber network provided by this application;

Figure 2 is a diagram of another example structure of the passive optical fiber network provided by this application;

FIG. 3 is a diagram of another example structure of the passive optical fiber network provided by this application;

4 is a schematic structural diagram of an embodiment of an optical line terminal provided by this application;

5 is a schematic structural diagram of an embodiment of the optical module provided by this application;

6 is a schematic structural diagram of another embodiment of the optical module provided by this application;

FIG. 7 is a schematic structural diagram of an embodiment of the light emitting component provided by this application;

8 is a schematic structural diagram of another embodiment of the light emitting component provided by this application;

FIG. 9 is a schematic structural diagram of another embodiment of the light emitting component provided by this application.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work shall fall within the protection scope of the present invention.

The term "and/or" in this application can be an association relationship describing associated objects, indicating that there can be three types of relationships, for example, A and/or B, which can mean: A alone exists, and both A and B exist , There are three cases of B alone. In addition, the character "/" in this application generally indicates that the associated objects before and after are in an "or" relationship.

The terms "first", "second", etc. in the description and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific sequence or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments described herein can be implemented in an order other than the content illustrated or described herein. In addition, the terms "including" and "having" and any variations of them are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or modules is not necessarily limited to the clearly listed Those steps or modules may include other steps or modules that are not clearly listed or are inherent to these processes, methods, products, or equipment.

The access network is a bridge for users to enter the metropolitan area network/backbone network, and is the "last mile" of the information transmission channel. At present, broadband access technologies for access networks include wired access technologies and wireless access technologies. Among them, wired access technologies include asymmetric digital subscriber line (ADSL), local area network (LAN), and hybrid optical fiber. Hybrid fiber-coaxial (HFC) and fiber to the home (FTTH), some of which use passive optical network (PON) + local area network (LAN) The wireless access technology includes wireless local area networks (WLAN), worldwide interoperability for microwave access (WiMAX), wireless fidelity (WiFi), and Bluetooth (Bluetooth). ) And other technologies.

Among various broadband access technologies, passive optical fiber networks have the advantages of large capacity, long transmission distance, good upgradeability, and low cost. Active devices are removed from the access network, thereby avoiding electromagnetic interference and lightning effects. It reduces the failure rate of lines and external equipment, reduces the corresponding operation and maintenance costs, has good business transparency, high bandwidth, can be applied to signals of any standard and rate, can support analog broadcast and television services economically, and is highly reliable It provides quality of service (QoS) guarantees with different business priorities, suitable for large-scale applications.

The structure of the passive optical fiber network provided by the prior art will be exemplarily described below with reference to Fig. 1:

As shown in Figure 1, the passive optical fiber network includes an optical line terminal (OLT) 101 located in a central office, multiple optical network units (ONU) 102, and an optical distribution network (optical network unit, ONU) 102. distribution network, ODN)103. PON "passive" means that the ODN is entirely composed of passive components such as optical splitters (Splitter), and does not contain any electronic components and power supplies.

Specifically, OLT101 is an important central office equipment. Its function is to connect to the front-end switch with a network cable and convert electrical signals into optical signals. OLT101 uses optical fibers to interconnect with ODN103. The role of ODN103 is to provide light between OLT101 and ONU102. Transmission channel. ONU102 is used to connect to the end user or corridor switch, and the data of multiple ONU102 can be time-division multiplexed to one OLT port by using a single optical fiber through a passive optical splitter. Due to the point-to-multipoint tree topology structure, the investment in aggregation equipment is reduced, and the network hierarchy is clearer.

With the continuous rapid development of various broadband services such as video conferencing, 3D TV, mobile backhaul, interactive games, and cloud services, the line rate in the PON system also needs to be continuously improved. Especially the existing PON standards, such as Ethernet passive optical network (Ethernet passive optical network, EPON) and passive optical access system (Gigabit PON, GPON) can effectively meet the line rate requirements of the PON system. EPON inherits the low cost, ease of use and high bandwidth of optical network of Ethernet. It is the most cost-effective one in FTTH. The industry alliance of EPON has grown from EPON core chips, optical modules to systems. mature. GPON has a slight technical advantage. It can support a variety of rate levels and can support asymmetric upstream and downstream rates. GPON optical devices have greater options, and they also have considerable advantages in terms of total efficiency and equivalent system cost.

This application is mainly applied to the Type B protection scenario. To better understand this application, the following first describes the Type B protection scenario:

As shown in Figure 2, an OLT 200 includes an active PON port 201 and a backup PON port 202. When the OLT 200 is in a normal working state, the active PON port 201 carries services, and when the active PON port 201 is located in the chain When the circuit fails, the OLT 200 automatically switches the service of the main PON port 201 to the standby PON port 202 to ensure normal service transmission. It can be seen that Type B protection can improve the reliability of PON and ensure that services are not interrupted.

Among them, the active PON port 201 and the standby PON port 202 can be located on the same OLT single board at the same time, or the active PON port 201 and the standby PON port 202 can be located on different OLT single boards. Specifically, in this embodiment, Make a limit.

The beneficial effect of the active PON port 201 and the standby PON port 202 on the same OLT board at the same time is that the hardware cost of the OLT can be saved, while the active PON port 201 and the standby PON port 202 can be located on different OLT units. The beneficial effect of the board is that when the OLT board where the main PON port 201 is located fails, the service can be automatically switched to the OLT board where the standby PON port 202 is located for service access without causing service interruption. This implementation For example, the main PON port 201 and the backup PON port 202 are located on the same OLT board as an example for illustration.

The following describes the specific scenarios that trigger Type B protection:

As shown in Figure 3, the active PON port 201 detects a loss of signal (LOS) alarm, where the LOS alarm is caused by the break of the backbone fiber 301 between the active PON port 201 and the ODN. PON port 202 detects the active PON port 201 LOS alarm, the standby PON port 202 will perform ONU ranging operation. If the backbone fiber 302 between the standby PON port 202 and the ODN is normal and the ONU ranging is successful, the active PON port 201 switches to the backup PON port 202 to carry services.

The other is shown in Figure 2. The active PON port 201 detects a LOS alarm. The LOS alarm is an alarm caused by all ONUs offline. Then the active PON port 201 disables the optical module transmission function, and the standby PON port 202 detects the active If the LOS alarm of the PON port 201 is alarmed, the standby PON port 202 will bear the service by the standby PON port 202 when the ONU is detected to be online.

The following describes the specific process of implementing Type B protection shown in the prior art with reference to FIG. 4, where FIG. 4 is an example diagram of the hardware structure of the OLT provided in the prior art;

As shown in Figure 4, the OLT includes an optical line terminal OLT single board 401, and the OLT single board 401 is connected with an active PON port 402 and a backup PON port 403. The active PON port shown in this embodiment is 402 includes an optical module 404, the backup PON port 403 includes an optical module 405, and the optical module 404 included in the main PON port 402 and the optical module 405 included in the backup PON port 403 have the same structure.

The specific structure of the optical module 404 is described by taking the optical module 404 as an example. The optical module 404 shown in this embodiment includes a laser driver LDD4041 and a light emitting component 4042 connected to the laser driver LDD4041. The LDD4041 is used to drive the As for the light emitting component 4042, when the light emitting component 4042 emits light, the light module 404 works normally, and when the light emitting component 4042 does not emit light, the light module 404 does not work.

The structure of the optical module is described below with reference to FIG. 5, where the optical module 500 shown in FIG. 5 may be the optical module 404 or the optical module 405 shown in FIG. 4, specifically, the optical module shown in this embodiment 500 specifically includes:

The laser drives the LDD501 and the light emitting component connected to the LDD501. The light emitting component includes a laser 502, a filter 503, a thermoelectric cooler (TEC) 504, a monitoring photodiode 506, a light outlet 505, a single-chip microcomputer 507, and a combination Waver 508.

Specifically, a golden finger is provided at the interface between the OLT single board and the optical module 500, and the OLT single board controls the single-chip microcomputer 507 included in the optical module 500 through the golden finger, wherein the single-chip 507 and the optical module 500 The LDD501 is connected, and the LDD501 is connected with the laser 502. In the case that the OLT single board needs to control the laser 502, the OLT single board can issue instructions to the single-chip microcomputer 507 so that the single-chip 507 can control the laser driving LDD501, and the laser driving LDD501 is Under the control of 507, the laser 502 can be controlled to turn on and off.

More specifically, the single-chip microcomputer 507 can control the laser to drive the Tx-disable pin of the LDD501 to turn on and off the laser 502 according to the instructions sent by the OLT board.

In the case where the optical module 500 is an optical module included in the main PON port, if the central processing unit (CPU) installed on the OLT board detects that Type B protection is required, a specific description of Type B protection , Please refer to the above description for details. The CPU can use the MCU 507 to pull up the TX-Disable pin of the laser driving LDD501 to enable the bias current and modulation current of the laser 502 to enable the master The laser 502 included in the PON port does not emit light to turn off the laser 502.

If the optical module 500 is an optical module included in the backup PON port, if the CPU installed on the OLT board detects that Type B protection is required, the CPU can be enabled by pulling down the TX-Disable pin through the MCU 507 The bias current and modulation current of the laser 502 are used to make the laser 502 included in the standby PON port emit light to turn on the laser 502, and the standby PON port performs ONU online work, so that the OLT can normally resume services through the standby PON port.

Since the output wavelength of the laser 502 is directly related to the grating, whether it is a change in the external temperature or an increase in the carrier density in the laser 502, it will cause a change in the center wavelength of the grating, thereby causing a change in the laser emission wavelength. When a directly modulated digital signal is applied to the laser 502, due to different injection currents corresponding to different digital signals, different peaks, that is, chirp, appear in the output spectrum after the directly modulated signal. In optical fiber, dispersion is the basic characteristic of optical fiber, that is, light of different wavelengths have different propagation speeds in the same optical fiber. Therefore, the laser 502 with chirp, due to the broadening of the pulse, makes the signal after a certain distance transmission There will be inter-code interference between them, which greatly limits the transmission distance;

In order to suppress the chirp, a filter 503 may be connected after the laser 502, so that the filter 503 can pass the required signals in the laser 502 and filter out the unnecessary signals, thereby reducing the influence of dispersion on signal transmission. It can be seen that the combination of lasers and filters adopted in the prior art can improve the sensitivity of the optical and optical emission components, reduce the cost of dispersion, and reduce the power consumption.

Continuing as shown in FIG. 5, the optical module 500 further includes a TEC504 and an MPD506, where the MPD506 is used to adjust the temperature of the TEC504, specifically, the TEC504 and the laser 502 and the filter 503 The light signal filtered by the filter 503 is irradiated to the MPD506. The MPD506 is used to convert the received light signal into a backlight current. The single-chip microcomputer 507 connected to the MPD506 is used to detect the backlight current The single-chip microcomputer 507 is also connected to the TEC504, and the single-chip microcomputer 507 can adjust the temperature of the TEC504 according to the size of the backlight current.

Specifically, if the optical module shown in FIG. 5 is the optical module included in the main PON port, the microcontroller 507 can control the TEC504 so that the TEC504 provides a constant value for the laser 502 and the filter 503. The working temperature is to effectively ensure that the signal wavelength of the laser 502 is aligned with the wavelength of the filter 503, so that the light emitted by the laser 502 passes through the filter 503 and the multiplexer connected to each other in turn 507 and the optical outlet 505. The multiplexer 507 is used to combine two or more lights of different wavelengths into a waveguide for transmission. The optical outlet 505 is a port of the waveguide, so that the light The light emitted by the outlet 505 is the largest, and the light emitted by the light outlet 505 is coupled with the rear lens into the optical fiber to be emitted to the ODN.

In the case of Type B protection, that is, during the process of switching between the active PON port and the standby PON port, in addition to copying the information of the active PON port to the standby PON port, the ONU also needs to be tested again. However, the ONU needs to re-register, and the entire PON is required to complete the switch between the main PON port and the standby PON port within 50 milliseconds, and realize the switch between the main PON port and the standby PON port in a short time.

However, adopting the structure of the optical module 500 shown in the prior art cannot effectively ensure that the optical module 500 realizes Type B protection in a short time. The specific reasons are as follows:

Taking the laser shown in FIG. 5 as a distributed feedback laser (distributed feedback laser, DFB) as an example, it should be clarified that the description of the specific type of laser in this embodiment is an optional example and is not limited For example, the laser may also be a directly modulated laser (directly modulated laser, DML).

The optical module 500 adopts the scheme of combining the laser 502 and the filter 503. Because the channel bandwidth of the filter 503 is relatively narrow, usually 50GHz or 100GHz channel bandwidth, the stability of the laser wavelength is relatively high. Specifically, In the case that the optical module 500 shown in FIG. 5 is an optical module included in the spare PON port, when the single-chip microcomputer 507 turns on the laser 502, the time to start the laser 502 is very short, because the laser 502 is suddenly turned on, which suddenly heats the TEC504 The load causes a change in the working current of the TEC504 that has reached thermal equilibrium, which breaks the thermal equilibrium of the TEC504. The working temperature of the laser 502 will change, making the laser 502 unable to work at a stable wavelength, and the wavelength emitted by the laser 502 drifts due to filtering. The optical bandwidth of the laser 503 is relatively narrow. Due to the destruction of the thermal balance of the TEC504, the laser 502 drifts beyond the optical bandwidth of the filter 503, which affects the performance of the PON system. The stability of the laser 502 often takes 1 minute, which is far from satisfying the above requirements. It is shown that the Type B protection needs to be completed within 50 milliseconds in a short time.

In order to solve the problem that the optical module provided in the prior art cannot guarantee the realization of Type B protection in a short time, this application provides the structure of the optical module as shown in FIG. 6:

The optical module 600 shown in this embodiment includes an LDD601 and an optical emitting component connected to the LDD601. The optical emitting component specifically includes a laser 602, a filter 603, a multiplexer 608, an optical switch 609, a TEC604, a first MPD606, The second MPD610 and the single-chip microcomputer 607, the specific structure of the optical module 600 shown in this embodiment, compared to the one shown in FIG. 5, an optical switch 609 is added, and the LDD601, laser 602, filter 603, TEC604, multiplexer 608 and For a specific description of the single-chip microcomputer 607, please refer to the embodiment shown in Fig. 5, and details are not repeated.

Specifically, in this embodiment, the LDD 601 is simultaneously connected to the optical switch 609 and the laser 602, and the optical switch 609 is connected to the filter 603.

This embodiment does not limit the specific position of the optical switch 609, as long as the optical switch 609 is connected to the optical path between the laser 602 and the optical outlet 605 and the optical switch 609 is electrically connected to the LDD 601. Just connect, this embodiment takes the example shown in FIG. 6 as an example for illustrative description, and takes the optical switch 609 provided between the filter 603 and the multiplexer 608 as an example. The optical switch 609 may also be integrated in the multiplexer 608, and optionally, the optical switch 609 may also be integrated in the filter 603. It can be seen that, with the structure shown in this embodiment, the single-chip microcomputer 607 for control can be connected to the laser and the optical switch through the LDD601.

Optionally, the filter shown in this embodiment is an optional device. In other examples, the optical module may not include the filter, and the laser 602 and the optical switch 609 can be connected through a waveguide structure, and the waveguide structure has Filtering function.

With the structure of the optical module 600 shown in this embodiment, whether the optical module 600 is located in the main PON port or the standby PON port, the LDD601 controls the laser 602 to be in the on state. For specific instructions on the LDD control laser, please It is shown in Fig. 5 for details, which will not be described in detail in this embodiment.

Because the laser 602 is in the on state whether it is located in the main PON port or the standby PON port, the TEC604 is always in a thermal equilibrium state.

Specifically, as shown in this embodiment, if the light switch 609 is powered off, the light path is in the open state, and if the light switch 609 is powered on, the light path is in the off state, wherein the light path is the filter 603 and the light outlet. Light path between 605.

Optionally, when the OLT board detects that the optical module 600 is located in the main PON port, the Tx-Disable control of LDD601 powers off the optical switch 609, and the optical path between the filter 603 and the optical outlet 605 Open, the optical outlet 605 emits light normally, and the entire optical module 600 emits light. The single-chip microcomputer 607 can monitor through the second MPD610 whether the wavelength of the laser 602 is consistent with the wavelength allowed by the filter 603. If not, the single-chip 607 passes the first MPD606. Adjust the temperature of the TEC604 to adjust the wavelength of the laser 602 until the wavelength of the laser 602 is consistent with the wavelength allowed by the filter 603, then the microcontroller 607 can lock the current wavelength of the laser 602, that is, complete the laser 602 wave lock, so that the main PON port including the optical module 600 is in a normal working state, the second MPD610 used for wave lock shown in this embodiment and the first MPD606 used for adjusting the temperature of the TEC604 It can be the same MPD or different MPDs. In this embodiment, the first MPD 606 and the second MPD 610 are different MPDs as an example for illustration. For the specific description of the second MPD 610, please give details See the MPD shown in Figure 5, which will not be described in detail.

Optionally, when the single-chip microcomputer 607 detects that the optical module 600 is located in the standby PON port, the Tx-Disable control of the LDD601 powers on the optical switch 609, and when the optical switch 609 is powered on, The optical path between the filter 603 and the optical outlet 605 is disconnected, the optical outlet 605 does not emit light, the entire optical module 600 does not emit light, and the optical module 600 included in the standby PON port does not emit light, the optical module 600 includes The laser 602 will also perform wave locking. For a specific description of the wave locking, please refer to the specific description of the wave locking of the laser included in the main PON port shown above, and the details will not be repeated. Since the optical module included in the standby PON port does not emit light, the standby PON port will not affect the normal operation of the main PON port.

This embodiment does not limit the optical switch, as long as the optical module emits light when the optical switch is powered off, and the optical module does not emit light when the optical switch is powered on.

When Type B protection needs to be realized, that is, when the single-chip microcomputer 607 detects that the optical module 600 is located in the main PON port, the Tx-Disable control of the LDD601 performs power-on processing on the optical switch 609, and the optical switch When the 609 is powered on, the optical path between the filter 603 and the optical outlet 605 is disconnected, the optical outlet 605 included in the main PON port does not emit light, and the entire optical module 600 does not emit light.

When the single-chip microcomputer 607 detects that the optical module 600 is located in the standby PON port, the Tx-Disable control of the LDD601 performs power-off processing on the optical switch 609. When the optical switch 609 is powered off, the filter 603 The optical path is connected to the optical outlet 605, the optical outlet 605 included in the standby PON port emits light normally, and the entire optical module 600 emits light. At this time, the standby PON port performs normal operation.

Using the specific structure of the optical module shown in this embodiment, it can be seen that no matter whether the optical module is located in the main PON port or the standby PON port, the laser is in a normal working state. It can be seen that even if the optical module is located in the standby PON port, Because the laser is in a normal working state, the TEC is always in a thermal equilibrium state. In the case of Type B protection, the laser in the standby PON port that has been in a stable state will not be suddenly turned on. The standby PON port only needs to switch on the light. Simply power off, so that in the case of Type B protection, the TEC thermal balance will not be destroyed, and the optical module can achieve Type B protection in a short time.

The specific setting method of the light switch is described below with reference to the drawings. First, with reference to FIG. 7, FIG. 7 is a structural example diagram of the light emitting assembly provided by this application.

As shown in Fig. 7, the light emitting component shown in this embodiment specifically includes a multiplexer 701. For a specific description of the multiplexer 701, please refer to Fig. 6 for details. The details are not repeated. In this example, The multiplexer 701 has a Mach-Zehnder (MZ) structure. Specifically, the multiplexer 701 includes a first optical fiber arm 702 and a second optical fiber arm 703. A positive electrode is connected to the target optical fiber arm. The first electrode 704 and the second electrode 705 that are negative, the target fiber arm shown in this embodiment is the first fiber arm 702 or the second fiber arm 703, which is not specifically limited in this embodiment. In this embodiment, the target optical fiber arm is the first optical fiber arm 702 as an example for illustration. In this embodiment, the first electrode 704 and the second electrode 705 are on the first optical fiber arm 702. The specific location of is not limited, as long as the first electrode 704 and the second electrode 705 are both connected to the single-chip microcomputer.

The first electrode 704 and the second electrode 705 shown in this embodiment are optical switches, that is, in this example, the optical switch is set in the form of the first electrode 704 and the second electrode 705 in the light emitting Component.

The multiplexer 701 shown in this embodiment is connected to the micro-ring filter 709 through a waveguide. For the description of the function of the micro-ring filter 709, please refer to the specific description of the filter shown in FIG. 6 for details. It will not be repeated in this embodiment;

A laser 706 is connected to the micro-ring filter 709. For a specific description of the laser 706, please refer to the embodiment shown in FIG. 6 for details, and will not be repeated in this embodiment.

The output end of the first optical fiber arm 702 and the output end of the second optical fiber arm 703 shown in this embodiment merge at the node 707 to generate interference light, and interference fringes appear. Because the first electrode 704 and the second electrode 705 are connected to the first optical fiber arm 702, and when the single-chip microcomputer energizes the first electrode 704 and the second electrode 705, the The first electrode 704 and the second electrode 705 can heat the first optical fiber arm 702. When the temperature of the first optical fiber arm 702 relative to the second optical fiber arm 703 changes, the first optical fiber arm 702 and the second optical fiber arm 703 have a change in the phase difference of the transmitted light. When the first optical fiber arm 702 and the second optical fiber arm 703 have a change in the phase difference of the transmitted light, they will change. According to the wavelength of the light of the multiplexer 701, the second MPD708 can detect the size of the light passing through the multiplexer 701, so that the single-chip microcomputer can adjust the temperature of the TEC according to the second MPD708, and adjust the temperature of the TEC according to the second MPD708 Please refer to Figure 6 for specific instructions of adjustment.

The light emitting component shown in this embodiment also includes a first MPD710, the first MPD is connected to the single-chip microcomputer through a waveguide, and the first MPD710 is used for wave locking. For details, please refer to Figure 6 for details. Details are not described in this embodiment.

Specifically, when the single-chip microcomputer detects that the PON port where it is located is the main PON port, that is, the optical transmitting component shown in FIG. The first electrode 704 and the second electrode 705 of 702 are energized, that is, the first electrode 704 and the second electrode 705 will not be heated. The multiplexer 701 is only used to realize the multiplexing function. The light of the device 701 is emitted through the light exit port as shown in FIG. 6 and coupled with the rear lens to enter the optical fiber. At this time, the main PON port is in a normal working state.

When the single-chip microcomputer detects that the PON port where it is located is the standby PON port, that is, the optical transmitting component shown in FIG. 7 is arranged inside the standby PON port, and the single-chip microcomputer faces the first electrode 704 and the first electrode 704 of the first optical fiber arm 702. The second electrode 705 is energized, that is, the first electrode 704 and the second electrode 705 are heated. When the temperature of the first optical fiber arm 702 increases, the first optical fiber arm 702 is relative to the second optical fiber. The temperature of the arm 703 changes, so that the phase difference of the transmitted light in the first optical fiber arm 702 and the second optical fiber arm 703 changes.

Specifically, the single-chip microcomputer detects the backlight current of the second MPD708. For a specific description of the backlight current, please refer to Figure 5 for details, which will not be repeated; if the backlight current is too small, the standby PON port is illuminated At this time, it will affect the normal operation of the main PON port, the single-chip microcomputer can increase the current on the first electrode 704 and the second electrode 705 until the single-chip microcomputer determines the backlight of the second MPD708 The current is the largest, indicating that most of the light emitted by the multiplexer 701 is irradiated on the second MPD708, indicating that the standby PON port at this time does not emit light or the light is very weak. At this time, the standby PON port has no effect on the performance of the main PON port. .

When Type B protection needs to be realized, that is, when the single-chip microcomputer detects that the optical transmitting component of the single-chip microcomputer is located in the main PON port, the single-chip microcomputer determines that the main PON port will no longer work in the future. The first electrode 704 and the second electrode 705 of the first fiber arm 702 are energized until the main PON port no longer emits light or the light is weak.

When the single-chip microcomputer detects that the optical transmitting component where the single-chip microcomputer is located is located in the spare PON port, the single-chip microcomputer determines that the spare PON port will perform subsequent work. At this time, the single-chip microcomputer no longer controls the first electrode 704 and the first electrode 704 of the first optical fiber arm 702. The second electrode 705 is energized, and the multiplexer 701 is only used to realize the multiplexing function. The light passing through the multiplexer 701 is emitted through the light outlet as shown in FIG. 6, and is coupled with the rear lens into the optical fiber. At this time, the standby PON port is in a normal working state.

Using the structure of the light emitting component shown in this embodiment, the optical switch (first electrode and second electrode) and the multiplexer are integrated. When the first electrode and the second electrode are not energized, the multiplexer only has a multiplexer. When the first electrode and the second electrode are energized, the multiplexer has the function of an optical switch, that is, the optical path between the laser and the optical outlet is disconnected, so that in the case of Type B protection, the TEC thermal balance will not be destroyed. The optical module achieves the purpose of achieving Type B protection in a short time, and because of the integration of the multiplexer and the optical switch, the size and volume of the optical module can be effectively reduced, and the cost of the optical module can be reduced.

Hereinafter, another configuration method of the optical switch will be exemplarily described in conjunction with FIG. 8, where FIG. 8 is a diagram of another structure example of the light emitting component provided in this application.

The light emitting component shown in FIG. 8 includes a micro-ring filter 801. For a specific description of the micro-ring filter 801 shown in this embodiment, please refer to FIG. 7 for details, and details will not be repeated in this embodiment.

In this embodiment, two electrodes are provided on the micro-ring filter 801, one is a positive electrode and the other is a negative electrode. Taking FIG. 8 as an example, a first electrode 802 that is a positive electrode is provided on the micro-ring filter 801. And the second electrode 803 which is a negative electrode. The first electrode 802 and the second electrode 803 shown in this embodiment are the optical switches shown in this application. It can be seen that the optical switches and micro-ring filters shown in this embodiment are Integration. The micro-ring filter 801 shown in this embodiment includes a ring body in a ring structure. This example does not limit the specific positions where the first electrode 802 and the second electrode 803 are arranged on the ring body, as long as The micro-ring filter 801 only needs to be connected with the first electrode 802 and the second electrode 803.

Specifically, when the single-chip microcomputer detects that the PON port where it is located is the main PON port, that is, the optical switch shown in Fig. 8 is set inside the main PON port, the single-chip microcomputer will reduce the first PON port located on the micro-ring filter 801. The current on one electrode 802 and the second electrode 803, so that the first electrode 802 and the second electrode 803 will provide different heat to the micro-ring filter 801 according to the magnitude of the received current, so The center wavelength of the micro-ring filter 801 will change according to the change of the external environment temperature of the micro-ring filter 801. At this time, the single-chip microcomputer obtains the size of the backlight current on the second MPD805, and the single-chip microcomputer can gradually reduce to the first electrode 802. And the magnitude of the current energized by the second electrode 803 until the single-chip microcomputer detects that the backlight current is the minimum value, that is, the single-chip microcomputer no longer provides current for the first electrode 802 and the second electrode 803, so The micro-ring filter 801 is only used to implement the filtering function. The light passing through the multiplexer 804 is emitted through the light exit port as shown in FIG. 6, and is coupled to the back-end lens into the optical fiber. At this time, the main PON port is in In the normal working state, for the specific description of the second MPD 805 and the multiplexer 804, please refer to FIG. 7 for details, and details are not described in this embodiment.

The specific structure of the light emitting component shown in this embodiment and the light emitting component shown in FIG. 7 is only different in the setting position of the optical switch. For the specific description of the rest of the structure, please refer to FIG. 7 for details. Details are not described in the embodiment.

In the case where the single-chip microcomputer detects that the PON port where it is located is the standby PON port, that is, the optical switch shown in FIG. 8 is set inside the standby PON port, and the single-chip microcomputer aligns the first electrode 802 and the second The electrode 803 is energized so that the first electrode 802 and the second electrode 803 will be heated, and the first electrode 802 and the second electrode 803 will supply the micro-ring filter 801 according to the magnitude of the received current. Provide different heat, the center wavelength of the micro-ring filter 801 will change according to the change of the external environment temperature of the micro-ring filter 801, at this time, the single-chip microcomputer obtains the magnitude of the backlight current on the second MPD805, and when it detects When the backlight current is at the maximum value, the light emitted by the multiplexer 804 is received by the second MPD805 at this time, indicating that the standby PON port at this time does not emit light or the light is very weak. There is no impact on the performance of the PON port.

When Type B protection needs to be implemented, that is, when the single-chip microcomputer detects that the optical module in which the single-chip microcomputer is located is located in the main PON port, the single-chip microcomputer determines that the main PON port will no longer work in the future. The first electrode 802 and the second electrode 803 are energized until the main PON port no longer emits light or the light is weak.

When the single-chip microcomputer detects that the optical module in which the single-chip microcomputer is located is located in the spare PON port, the single-chip microcomputer determines that the spare PON port will perform subsequent work. At this time, the single-chip microcomputer no longer performs operations on the first electrode 802 and the second electrode 803. When the power is turned on, the filter is only used to achieve the filtering function. The light passing through the multiplexer 804 is emitted through the optical outlet as shown in FIG. 6 and coupled with the back-end lens into the optical fiber. At this time, the standby PON port is in normal operation status.

Using the structure of the optical switch shown in this embodiment, the optical switch (the first electrode and the second electrode) and the filter are integrated. When the first electrode and the second electrode are not energized, the filter only has a filtering function. When the first electrode and the second electrode are energized, the filter has the function of an optical switch, that is, the optical path between the laser and the optical outlet is disconnected, so that in the case of Type B protection, the thermal balance of the TEC will not be destroyed, and the optical module is realized in The purpose of Type B protection is realized in a short time, and the integrated solution of the filter and the optical switch can effectively reduce the size and volume of the optical module and reduce the cost of the optical module. Moreover, the power consumption of the micro-loop filter is effectively reduced.

The following is an exemplary description of another setting method of the optical switch shown in FIG. 9, and FIG. 9 shows an example diagram of another structure of the light emitting component provided by this application.

As shown in FIG. 9, the light emitting component shown in this embodiment specifically includes a multiplexer 901. For a specific description of the multiplexer 901, please refer to FIG. 8 for details, and details are not repeated;

This embodiment also includes a micro-loop filter 903. For a specific description of the micro-loop filter 903, please refer to FIG. 8 for details, and details are not repeated;

The optical switch 900 shown in this embodiment is connected between the micro-ring filter 903 and the multiplexer 901. Specifically, the optical switch 900 composed of a waveguide shown in this embodiment has a Mach-Zehnder (MZ) structure. More specifically, the optical switch 900 includes a first optical fiber arm 904 and a second optical fiber arm 905 As shown in this embodiment, a first electrode 902 that is positive and a second electrode 908 that is negative are set on the target fiber arm. This embodiment does not limit the target fiber arm, as long as the target fiber arm is the Either one of the first optical fiber arm 904 and the second optical fiber arm 905 is sufficient. In this embodiment, the target optical fiber arm is the second optical fiber arm 905 as an example. The optical fiber arm 904 and the second optical fiber arm 905 are provided on the second optical fiber arm 905 as an example for description.

The output end of the first optical fiber arm 904 and the output end of the second optical fiber arm 905 shown in this embodiment converge at the node 906 to generate interference light, and interference fringes appear. Because the first electrode 902 and the second electrode 908 are connected to the second optical fiber arm 905, and when the microcontroller energizes the first electrode 902 and the second electrode 908, the first electrode 902 and the second electrode 908 are The second electrode 908 can heat the second fiber arm 905. When the temperature of the second fiber arm 905 relative to the first fiber arm 904 changes, the first fiber arm 904 and the second fiber arm The phase difference of the transmitted light in 905 changes. When the phase difference of the transmitted light in the first fiber arm 904 and the second fiber arm 905 changes, the light transmitted to the multiplexer 901 will be changed. The second MPD907 can detect the size of the light passing through the multiplexer 901, so that the microcontroller can adjust the temperature of the TEC according to the second MPD907. For specific instructions on adjusting the temperature of the TEC according to the second MPD907, please see Shown in Figure 6.

Specifically, when the single-chip microcomputer detects that the PON port where it is located is the main PON port, that is, the optical transmitter assembly shown in FIG. 9 is set inside the main PON port, and the single-chip microcomputer will not directly position the second optical fiber arm. The first electrode 902 and the second electrode 908 of 905 are energized, that is, the first electrode 902 and the second electrode 908 will not be heated, and the optical switch 900 is only used to turn on the micro-ring filter 903 and the multiplexer 901. The light passing through the multiplexer 901 is emitted through the light exit port as shown in FIG. 6, and is coupled with the rear lens into the optical fiber. At this time, the main PON port is in a normal working state.

In the case that the single-chip microcomputer detects that the PON port where it is located is the standby PON port, that is, the optical transmitter assembly shown in FIG. 9 is arranged inside the standby PON port, and the single-chip microcomputer faces the first electrode 902 and the second optical fiber arm 905 The second electrode 908 is energized, that is, the first electrode 902 and the second electrode 908 will be heated. When the temperature of the second optical fiber arm 905 increases, the temperature of the second optical fiber arm 905 relative to the temperature of the first optical fiber arm 904 The change occurs, so that the phase difference of the transmitted light in the first fiber arm 904 and the second fiber arm 905 is changed.

Specifically, the single-chip microcomputer detects the backlight current of the second MPD907. For a specific description of the backlight current, please refer to Fig. 5, and the details will not be repeated; if the backlight current is too small, the standby PON port is illuminated At this time, it will affect the normal operation of the main PON port, the single-chip microcomputer can increase the current on the first electrode 902 and the second electrode 908 until the single-chip microcomputer determines that the backlight current of the second MPD907 is the largest , It means that most of the light emitted by the multiplexer 901 is irradiated on the second MPD907, which means that the standby PON port at this time does not emit light or the light is very weak, and the standby PON port at this time has no effect on the performance of the main PON port.

When Type B protection needs to be realized, that is, when the single-chip microcomputer detects that the optical transmitting component of the single-chip microcomputer is located in the main PON port, the single-chip microcomputer determines that the main PON port will no longer work in the future. The first electrode 902 and the second electrode 908 of the second optical fiber arm 905 are energized until the main PON port no longer emits light or the light is weak.

When the single-chip microcomputer detects that the optical transmitting component where the single-chip microcomputer is located is located in the spare PON port, the single-chip microcomputer determines that the spare PON port will perform subsequent work. The second electrode 908 is energized, and the optical switch 900 is only used to connect the micro-ring filter 903 and the multiplexer 901. The light passing through the multiplexer 901 is emitted through the light outlet as shown in FIG. 6, and The rear lens is coupled into the optical fiber, and the standby PON port is in a normal working state at this time.

The specific structure of the light emitting component shown in this embodiment and the light emitting component shown in FIG. 8 is only different in the setting position of the optical switch. For the specific description of the rest of the structure, please refer to FIG. 8 for details. Details are not described in the embodiment.

Using the structure of the light emitting component shown in this embodiment, the optical switch is arranged between the micro-ring filter and the multiplexer. When the first electrode and the second electrode are not energized, the optical switch only has the connection to the micro-ring filter. When the first electrode and the second electrode are energized, the optical switch 900 has the function of an optical switch, that is, the optical path between the laser and the optical outlet is disconnected, thus in the case of Type B protection Without destroying the thermal balance of the TEC, the optical module realizes the purpose of Type B protection in a short time, and because it can realize the function of the optical switch without adding new devices, it can effectively reduce the size and volume of the optical module and reduce the light. The cost of the module.

Those skilled in the art can clearly understand that, for the convenience and conciseness of description, the specific working process of the above-described system, device, and unit can refer to the corresponding process in the foregoing method embodiment, which will not be repeated here.

In the several embodiments provided in this application, it should be understood that the disclosed system, device, and method may be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components can be combined or It can be integrated into another system, or some features can be ignored or not implemented. In addition, the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical, mechanical or other forms.

The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions of the embodiments.

In addition, the functional units in the various embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or software functional unit.

If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer readable storage medium. Based on this understanding, the technical solution of the present invention essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium , Including several instructions to make a computer device (which may be a personal computer, a server, or a network device, etc.) execute all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage media include: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disk and other media that can store program code .

As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present invention, but not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions recorded in the embodiments are modified, or some of the technical features are equivalently replaced; these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

A light emitting component, which is located in an optical module, is characterized by comprising a laser, an optical switch, a light outlet for emitting light to an optical fiber, a single-chip microcomputer, and a semiconductor refrigerator attached to the laser, The laser is connected to the light outlet, and the optical switch is provided on the optical path between the laser and the light outlet;

The laser, the optical switch, and the semiconductor refrigerator are all connected to the single-chip microcomputer, the laser is used to be in an on state under the control of the single-chip microcomputer, and the semiconductor refrigerator is used to be under the control of the single-chip microcomputer. Provide a working temperature for the laser;

When the light emitting component is in the working state, the single-chip microcomputer is used to power off the optical switch, so that the optical path between the laser and the light outlet is turned on. When the component is in the off state, the single-chip microcomputer is used to perform power-on processing on the optical switch to disconnect the optical path between the laser and the optical outlet.
The light emitting component according to claim 1, wherein the light emitting component further comprises a filter and a multiplexer, and the laser, the filter, the multiplexer, and the optical outlet are sequentially connected to each other. Connected, the semiconductor refrigerator is also arranged in close contact with the filter.
The light emitting component according to claim 2, wherein the optical switch is integrated on the multiplexer.
The light emitting assembly according to claim 3, wherein the multiplexer with a Mach-Zinde structure comprises a first optical fiber arm and a second optical fiber arm, and a first electrode with a positive pole is arranged on the target optical fiber arm and The second electrode is a negative electrode, the target fiber arm is the first fiber arm or the second fiber arm, the first electrode and the second electrode are the optical switch, and the first electrode Both the second electrode and the single-chip microcomputer are connected.
The light emitting component according to claim 2, wherein the optical switch is integrated on the filter.
The light emitting assembly of claim 5, wherein the filter is a loop filter, and a first electrode that is a positive electrode and a second electrode that is a negative electrode are connected to the annular body of the filter, and The first electrode and the second electrode are the optical switch, and both the first electrode and the second electrode are connected to the single-chip microcomputer.
The light emitting component according to claim 2, wherein the optical switch is connected between the filter and the multiplexer.
The light emitting assembly according to claim 7, wherein the optical switch has a Mach-Zinde structure, and the optical switch includes a first optical fiber arm and a second optical fiber arm, and a positive first optical fiber arm is provided on the target optical fiber arm. An electrode and a second electrode that is a negative electrode, the target fiber arm is the first fiber arm or the second fiber arm, and the first electrode and the second electrode are both connected to the single chip microcomputer.
An optical module, characterized in that it comprises a laser driver and the light emitting assembly according to any one of claims 1 to 8, wherein the laser driver is connected to the laser and the single-chip microcomputer, and the laser driver is used in The laser is driven to be in an on state or in an off state under the control of the single-chip microcomputer.
An optical line terminal, characterized by comprising the optical module as claimed in claim 9.