WO2020175765A1 - Dispositif d'affichage transparent et ensemble verre le comprenant - Google Patents

Dispositif d'affichage transparent et ensemble verre le comprenant Download PDF

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Publication number
WO2020175765A1
WO2020175765A1 PCT/KR2019/015280 KR2019015280W WO2020175765A1 WO 2020175765 A1 WO2020175765 A1 WO 2020175765A1 KR 2019015280 W KR2019015280 W KR 2019015280W WO 2020175765 A1 WO2020175765 A1 WO 2020175765A1
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WO
WIPO (PCT)
Prior art keywords
transparent
light
electrode unit
edge
fpcb
Prior art date
Application number
PCT/KR2019/015280
Other languages
English (en)
Inventor
Jangyoul CHAE
Original Assignee
Hankuk Glass Industries Inc.
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Filing date
Publication date
Application filed by Hankuk Glass Industries Inc. filed Critical Hankuk Glass Industries Inc.
Publication of WO2020175765A1 publication Critical patent/WO2020175765A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Definitions

  • the present invention relates to a transparent display and a glass assembly. Specifically, the present invention relates to a transparent display and a glass assembly capable of displaying characters or images while maintaining virtual transparency.
  • a glass window serves to allow external light to be introduced indoors, to perform appropriate ventilation of indoor air by blocking and introducing external air, and to maintain cooling and heating efficiency by blocking heat flow between indoors and outdoors in a closed state.
  • a window made of a light emitting diode (LED) electronic signage glass assembly to which LEDs are inserted has been used as a glass window of a building.
  • the window made of an LED electronic signage glass assembly may exhibit an illumination effect and an advertising effect without impairing an intrinsic function of a glass window.
  • the LED electronic signage glass assembly has the LEDs inserted between two glass sheets, and the LEDs are mounted on a transparent electrode layer formed on a glass sheet.
  • a flexible printed circuit board for electrically connecting the electrode layer and the driver controller is formed at the edge portion of the electrode layer of the glass assembly.
  • the driving controller controls the driving of the LED to display a character or an image.
  • the present invention is to provide a transparent display and a glass assembly capable of preventing the damage to the edge electrode layer by heat even if the application amount of the current increases.
  • a transparent display includes: a transparent substrate film; a transparent electrode layer disposed on an upper surface of the transparent substrate film; a plurality of light-emitting elements disposed on the transparent electrode layer; an edge electrode electrically connected to the transparent electrode layer and disposed on the edge of the transparent substrate film; and at least one flexible printed circuit board (FPCB) including a plurality of wires electrically connected to the edge electrode, wherein the edge electrode includes an input electrode unit respectively transmitting a current input signal to the plurality of light-emitting elements and an output electrode unit commonly transmitting a current output signal from each of the plurality of light-emitting elements, the input electrode unit is disposed corresponding to the inside of a width direction of the flexible printed circuit board (FPCB), the output electrode unit is disposed corresponding to both edges of a width direction of the flexible printed circuit board (FPCB), and the output electrode unit extends beyond the edge of the width direction of the flexible printed circuit board (FPCB).
  • FPCB flexible printed circuit board
  • the length of the output electrode unit may be 20 % or more of the length of the input electrode unit.
  • a transparent display includes: a transparent substrate film; a transparent electrode layer disposed on an upper surface of the transparent substrate film; a plurality of light-emitting elements disposed on the transparent electrode layer; an edge electrode electrically connected to the transparent electrode layer and disposed on the edge of the transparent substrate film; and at least one flexible printed circuit board (FPCB) including a plurality of wires electrically connected to the edge electrode, wherein the edge electrode includes an input electrode unit transmitting a current input signal to each of the plurality of light-emitting elements and an output electrode unit commonly transmitting a current output signal from each the plurality of light-emitting elements, and the length of the output electrode unit is 20 % or more of the length of the input electrode unit.
  • FPCB flexible printed circuit board
  • the length of the output electrode unit may be 60 % or more of the length of the input electrode unit.
  • the light-emitting element may be a three-color light-emitting element.
  • a ratio of an entire width W of the flexible printed circuit board (FPCB) to an entire length of the edge portion of the transparent substrate film may be 10 % to 50 %.
  • the transparent electrode layer may include a circuit pattern formed of one or more of a metal line, a metallic nanowire, a transparent conductive oxide, a metal mesh, carbon nanotubes, and graphene.
  • the transparent display and the glass assembly according to an exemplary embodiment of the present invention may prevent the damage to the edge electrode layer due to heat even if the applied amount is increased.
  • FIG. 1 is a schematic view showing a configuration of a transparent display according to an exemplary embodiment of the present invention.
  • FIG. 2 is an enlarged view showing a part of a transparent display according to an exemplary embodiment of the present invention.
  • FIG. 3 is a schematic view showing a cross-section of a transparent display according to an exemplary embodiment of the present invention.
  • FIG. 4 is a schematic view showing a cross-section of a glass assembly according to an exemplary embodiment of the present invention.
  • FIG. 5 is a photograph of an edge electrode taken to evaluate thermal damage of a transparent display according to an exemplary embodiment of the present invention.
  • FIG. 6 is a photograph of an edge electrode taken to evaluate thermal damage of a transparent display according to a comparative example.
  • first, second, third, etc. may be used herein to describe various elements, components, regions, layers, and/or sections, they are not limited thereto. These terms are only used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Therefore, a first part, component, area, layer, or section to be described below may be referred to as second part, component, area, layer, or section within the range of the present invention.
  • FIG. 1 to FIG. 3 A configuration of a transparent display according to an exemplary embodiment of the present invention is described with reference to FIG. 1 to FIG. 3.
  • FIG. 1 is a schematic view showing a configuration of a transparent display according to an exemplary embodiment of the present invention
  • FIG. 2 is an enlarged view showing a part of a transparent display according to an exemplary embodiment of the present invention
  • FIG. 3 is a schematic view showing a cross-section of a transparent display according to an exemplary embodiment of the present invention.
  • a transparent display 100 includes a transparent substrate film 10, a transparent electrode layer (shown in FIG. 3) disposed on the upper surface of the transparent substrate film 10, and a plurality of light-emitting elements (LEDs) 20 mounted on the transparent electrode layer.
  • a transparent substrate film 10 a transparent substrate film 10 a transparent electrode layer (shown in FIG. 3) disposed on the upper surface of the transparent substrate film 10, and a plurality of light-emitting elements (LEDs) 20 mounted on the transparent electrode layer.
  • LEDs light-emitting elements
  • a driving controller (not shown) controlling driving of the transparent display is connected to the edge portion of the transparent substrate film 10.
  • the driving controller controls the driving of the transparent display 100, that is, the driving of the light-emitting element 20, thereby displaying characters or images.
  • a plurality of flexible printed circuit boards (FPCBs) 40 to electrically connect the driving controller and a transparent electrode layer 23 are connected to the edge portion of the transparent electrode layer 23.
  • a plurality of wires 42 for transmitting signals from the driving controller are disposed on the flexible printed circuit board (FPCB) 40, and a plurality of wires 42 are electrically connected to the transparent electrode layer 23 through an edge electrode 30 disposed on the edge of the transparent substrate film 10 to be configured to input the signals to each of the plurality of light-emitting elements 20.
  • FPCB flexible printed circuit board
  • FIG. 2 is the view enlarging a part of the transparent display according to an exemplary embodiment of the present invention, particularly, an edge portion where the edge electrode 30 and one flexible printed circuit board (FPCB) 40 are disposed.
  • the transparent display 100 of FIG. 2 is merely to illustrate the present invention, and the present invention is not limited thereto. Thus, the transparent display 100 of FIG.2 may be transformed into various forms.
  • the edge electrode 30 of the transparent display 100 includes an input electrode unit 32 for transmitting a current input signal to each of the plurality of light-emitting elements 20 and an output electrode unit 34 for transmitting a current output signal to each of the plurality of light-emitting elements 20, and at this time, the length of the output electrode unit 34 is configured to be 20 % or more of the length of the input electrode unit 32.
  • the transparent substrate film 10 may be a light transmitting polymer film of a single layer or a plurality of layers.
  • the transparent substrate film 10 may have an insulation characteristic and heat resistance to prevent a state change by external light while preventing power from being leaked to the outside.
  • An example of the transparent substrate film 10 is polyethylene terephthalate (PET), polycarbonate (PC), cyclo olefin polymer (COP), etc. however it is not limited thereto.
  • the transparent substrate film 10 may be a COP film. In this case, the heat resistance is excellent, and the durability of the transparent display unit 100 is improved.
  • the thickness of this transparent substrate film 10 is not particularly limited. However, in a case where the thickness of the transparent substrate film 10 is too thin, when bonding of a glass assembly 1000, the transparent substrate film 10 may be deformed or a crack in the electrode layer part may occur due to a pressure applied to the light-emitting element side. On the other hand, if the thickness of the transparent substrate film is too thick, cracks may occur on glass sheets 71 and 72 due to a stress. According to an example, the thickness of the transparent substrate film 10 may be about 200 to 300 ⁇ m. In this case, since the problems described above do not occur and the heat resistance of the transparent substrate film is excellent, it is possible to prevent heat deformation of the transparent substrate film 10 even though the transparent display 100 is exposed to external light for a long period of time.
  • the transparent electrode layer 23 is disposed on one surface of the transparent substrate film 10 to serve to apply the signal to the light-emitting element 20 to be driven.
  • the transparent electrode layer 23 is excellent in light transmittance, not only is the external light incident, but the portion in which the transparent electrode layer 23 is formed does not block the user's view, and the appearance characteristic is also excellent. Therefore, the transparent display 100 according to an exemplary embodiment of the present invention has excellent visual transparency.
  • the transparent electrode layer 23 may include a circuit pattern formed of one or more of a metal line, a metallic nanowire, a transparent conductive oxide, a metal mesh, carbon nanotubes, and graphene.
  • the transparent electrode layer 23 may include one or more of a metallic nanowire, a transparent conductive oxide, a metal mesh, carbon nanotubes, and graphene.
  • a non-limiting example of the metal nanowire may include Ag nanowire, copper nanowire, nickel nanowire, and the like, which may be used alone or in combination of two or more thereof.
  • a non-limiting example of the transparent conductive oxide may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), aluminum zinc oxide (AZO), indium oxide (In 2 O 3 ), and the like, which may be used alone or in combination of two or more thereof.
  • a non-limiting example of the metal mesh may include silver (Ag) mesh, copper (Cu) mesh, aluminum (Al) mesh, and the like, which may be used alone or in combination of two or more thereof.
  • the silver nanowire, the copper mesh, and the silver mesh are excellent in conductivity and light transmissivity, and ITO and IZO have a low specific resistance value, may be deposited at a low temperature, and are high in transmittance of visible light.
  • the transparent electrode layer 23 may include a circuit pattern made of an electrode material selected from a group consisting of the Ag nanowire, the copper mesh, and the silver mesh.
  • a line width and a thickness of the circuit pattern are not particularly limited. However, when the circuit pattern has a width of about 5 to about 15 mm and a thickness of about 0.2 to about 1 mm, the transparent electrode layer 23 has sheet resistance of about 0.5 to about 3 ⁇ /sq.
  • the transparent electrode layer 120 may be formed through a method known to the art. For example, in the transparent electrode layer 23, the electrode material is coated on the transparent substrate film 10, and then a laser is irradiated onto the electrode material or mask and etching processes are performed to form at least circuit pattern. Alternatively, the circuit pattern made of the electrode material may be formed on the first transparent substrate film 110 through an inkjet printing process. However, the present invention is not limited thereto.
  • a light-emitting element (light emitting diode, LED, 20) is a light emitter that is mounted on the transparent electrode layer 23 and lights in accordance with a supply of power. Since the plurality of light-emitting elements 20 are arranged in a matrix form, a plurality of light-emitting elements 20 may display various types of characters or images, and may also display a motion picture.
  • the light-emitting element 20 usable in an exemplary embodiment of the present invention may be used without particular limitation as long as it is commonly known in the art.
  • the color of the light-emitting element 20 may be a monochromatic light-emitting element 20 such as red (R), green (G), and blue (B) element, or a two-color light-emitting element 20 of R and G, or may be a three-color light-emitting element 20 of R, G, and B.
  • R red
  • G green
  • B blue
  • each light-emitting element 20 is the three-color light-emitting element 20 of R, G, and B, it is possible to display characters or images having various colors.
  • the light-emitting element 20 includes a plurality of terminals capable of receiving a signal from the outside. That is, through the plurality of wires 42 on the flexible printed circuit board (FPCB) 40 from the driving controller, the signal is applied to the terminal of the light-emitting element 20 through the circuit pattern of the transparent electrode layer 23 via the edge electrode 30.
  • an input terminal receiving the current input signal and an output terminal transmitting the current output signal may be included.
  • the current input signal may be R, G, and B signals, and in this case, three input terminals and three output terminals may be included.
  • the input terminal is electrically connected to the input electrode unit 32 of the edge electrode 30, and the output terminal is electrically connected to the output electrode unit 34 of the edge electrode 30.
  • the light-emitting element 20 may be fixed on the transparent electrode layer 23 through mounting methods known in the art.
  • a pad (not illustrated) including a material having high electrical conductivity such as silver (Ag) may be formed in at least a part of the transparent electrode layer 23.
  • the light-emitting element 20 may be fixed on the pad by using a low temperature SMT (a surface mount technology) process.
  • the light-emitting element 20 may be attached to the pad through a solder.
  • the edge electrode 30 is connected to a plurality of wires 42 of the flexible printed circuit board (FPCB) 40 to transmit the signal to the transparent electrode layer 23.
  • the edge electrode 30 may be opaque and may have lower resistance than transparent electrode layer 23.
  • it may be a metal layer formed of the same material as the metal mesh constituting the transparent electrode layer 23 to be patterned.
  • the transparent electrode layer 23 is made of a transparent conductive oxide, it may be configured by attaching a separate metal layer.
  • the edge electrode 30 includes an input electrode unit 32 electrically connected to the input terminal of the light-emitting element 20 and an output electrode unit 34 electrically connected to the output terminal.
  • the input electrode unit 32 may also include a plurality of sub-electrodes 321 electrically connected to each input terminal of the light-emitting element 20.
  • the wires 42 connected to the light-emitting elements 20 may be disposed on one flexible printed circuit board (FPCB) 40, and correspondingly, the edge electrode 30 may include a set of input electrode units 32 and output electrode units 34 connected to ten light-emitting elements 20.
  • FPCB flexible printed circuit board
  • the light-emitting element 20 is the three-color light-emitting element 20 of R, G, and B
  • three input terminals are included, thus thirty input terminals and thirty sub-electrodes 321 included in the ten light-emitting elements 20 are electrically connected, respectively, thereby configuring the input electrode units 32 of one set.
  • a common output electrode unit 34 disposed adjacent to the input electrode unit 32 may be electrically connected to the thirty output terminals included in the ten light-emitting elements 20.
  • the length is longer than that of the output electrode unit 34 which is commonly connected to the output terminals of the light-emitting elements 20.
  • the input signal and the output signal are applied together so that the current of the same magnitude is applied to the input electrode unit 32 and the output electrode unit 34 having different lengths.
  • the magnitude of the current applied to the output electrode unit 34 may increase up to 30 times the magnitude of the current applied to the input electrode unit 32 at a maximum.
  • the current is concentrated in the output electrode unit 34 having the short length such that heat may be generated, and the heat may cause damage such as to the edge electrode 30 and the transparent electrode unit 23 and the transparent substrate film 10 adjacent thereto.
  • the damage to the edge electrode 30 and the adjacent elements (the transparent substrate film, the transparent electrode layer, etc.) caused by such heating may be prevented.
  • the ten R, G, and B three-color light-emitting elements are composed of one set, when the current applied to each of the light-emitting elements 20 is 5 mA, the current applied to the output electrode unit 34 to emit the full white light may increase up to 150 mA.
  • the damage to the transparent display 100 may be prevented by configuring the length of the output electrode unit 34 to be 20 % or more of the length of the input electrode unit 32.
  • the length of the output electrode unit 34 may be configured to be 50 % or more of the length of the input electrode unit 32. According to this, even if the amount of current applied to each light-emitting element 20 further increases (for example, 10 mA or more), the damage to the transparent display 100 may be prevented.
  • the output electrode unit 34 may extend beyond the edge of the width direction of the flexible printed circuit board (FPCB) 40. That is, the input electrode unit 32 may be disposed to correspond to the inside of the width direction of the flexible printed circuit board (FPCB) 40, and the output electrode unit 34 may be disposed to correspond to both edges of the width direction of the flexible printed circuit board (FPCB) 40, and in this case, the length of the output electrode unit 34 may be increased by modifying the output electrode unit 34 to extend beyond the edge of the width direction of the flexible printed circuit board (FPCB) 40.
  • a set of the edge electrodes 30 may be disposed on both sides of the flexible printed circuit board (FPCB) 40 in the center of the width direction (i.e., where the input electrode unit 32 and the output electrode unit 34 electrically connected to the ten light-emitting element 20 may be located).
  • the arrangement of the flexible printed circuit board (FPCB) 40 and the edge electrode 30 may be changed according to the type, the arrangement, and the number of the light-emitting elements 20, but the present invention is not limited thereto.
  • the edge electrode 30 and the flexible printed circuit board (FPCB) 40 may be electrically connected to each other by an anisotropic conductive adhesive layer (not shown), and at this time, the anisotropic conductive adhesive layer may be an anisotropic conductive adhesive or an adhesive film used in the field in various ways without limitation.
  • the anisotropic conductive adhesive layer may include a resin and conductive particles dispersed in the resin.
  • the anisotropic conductive adhesive layer may be a film having electrical conductivity in the thickness direction of the adhesive layer and an insulation characteristic in the plane direction of the film.
  • resins such as an acryl or an epoxy may be used to secure the adhesion performance between the edge electrode 30 and the flexible printed circuit board (FPCB) 40.
  • the conductive particles may include a polymer core having an average particle diameter of 2 to 20 ⁇ m and a coating layer including at least one of Ni, Au, Cu, and Ag.
  • the flexible printed circuit board (FPCB) 40 is disposed on the anisotropic conductive adhesive layer and electrically connected to the edge electrode 30.
  • the electrically-connected flexible printed circuit board (FPCB) 40 electrically connects the edge electrode 30 and the driving controller.
  • the flexible printed circuit board (FPCB) 40 may be a flexible printed circuit board (FPCB) used in the field without limitation.
  • the flexible printed circuit board (FPCB) 40 may include a plurality of wires 42 formed on the resin layer.
  • the wires 42 of the flexible printed circuit board (FPCB) 40 may be formed of a conductive metal such as copper, tin plated copper, nickel plated copper, and the like. As a conductor, a conductive metal of a thin shape is preferable.
  • the resin layer of the flexible printed circuit board (FPCB) 40 may include polyimide or polyester.
  • the flexible printed circuit board (FPCB) 40 may be one or plural. However, when the flexible printed circuit board (FPCB) 40 is disposed on a large portion of the transparent substrate film 10, bonding reliability of the glass assembly 1000 may be deteriorated. Thus, it is desirable to adjust the width of each flexible printed circuit board (FPCB) 40 so that a ratio of the entire width W of the flexible printed circuit board (FPCB) 40 to the edge portion entire length L of the transparent substrate film 10 is in a range of about 0.1 to about 0.5.
  • the entire width W of the flexible printed circuit board (FPCB) 40 is the sum of the widths W1 of n flexible printed circuit boards (FPCB) as (n ⁇ W1), and in this case, the width of each flexible printed circuit board (FPCB) 40 may be the same as or different from each other.
  • FIG. 4 shows the cross-sectional view of the glass assembly 1000 according to an exemplary embodiment of the present invention.
  • the glass assembly 1000 of FIG. 4 is merely for illustrating the present invention, and the present invention is not limited thereto. Thus, the glass assembly 1000 of FIG. 4 may be modified in various forms.
  • the glass assembly 1000 includes the transparent substrate film 10, the edge electrode 30 disposed on the upper surface of the transparent substrate film 10, the flexible printed circuit board (FPCB) 40 disposed on the edge electrode 30 and electrically connected to the edge electrode 30 through the anisotropic conductive adhesive layer, a first sealing member 61 disposed on the flexible printed circuit board (FPCB) 40, and a first glass sheet 71 disposed on the first sealing member 61.
  • a protection layer for a sealing member may be further included between the first sealing member 61 and the flexible printed circuit board (FPCB) 40.
  • the transparent substrate film 10, the edge electrode 30, and the flexible printed circuit board (FPCB) 40 described above in the transparent display 100 are the same as for the transparent display 100, redundant description thereof is omitted.
  • the first sealing member 61 is a part disposed between the first glass sheet 71 and the transparent display 100 so that the first glass sheet 71 and the transparent display 100 are not separated from each other.
  • the first sealing member 61 also prevents moisture or outside air such as oxygen from penetrating into the transparent display 100.
  • the first sealing member 61 may be disposed on the entire surface of the first glass sheet 71. Alternatively, although not shown, the first sealing member 61 may be disposed on the edge of the first glass sheet 71.
  • the first sealing member 61 is formed of an optically transparent polymer so that external light may be incident without blocking a user's view.
  • the first sealing member 61 may include at least one of polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), an ionoplast polymer, and polyurethane.
  • the first sealing member 61 may be formed of a PVB resin.
  • the first sealing member 61 may not only seal the transparent display 100 on the first glass sheet 71, but may also block about 99 % or more of ultraviolet rays (UV) while blocking the external air.
  • UV ultraviolet rays
  • the thickness of the first sealing member 61 is not particularly limited. However, if the thickness of the first sealing member 61 is too thick, a pressure may be applied to the transparent display 100 during the bonding process between the first glass sheet 71 and the transparent display 100, thereby causing cracks in the electrode layer or deteriorating the light transmittance. On the other hand, if the thickness of the first sealing member 61 is too thin, the sealing characteristic and the outside air blocking property may be deteriorated. Therefore, the thickness of the first sealing member 61 may be 0.2 to 0.8 mm.
  • the first glass sheet 71 is a plate member including a transparent polymer such as glass and/or polymethyl methacrylate (PMMA), polycarbonate (PC), etc., and it can be colorless transparent or colored transparent.
  • the first glass sheet 71 may have light transmittance of about 85 % or more for visible light.
  • the first glass sheet 71 may have a planar shape or a curved shape such as a bow, that is, a curved surface shape.
  • the curvature radius R may be about 0.2 to 0.3 m.
  • a second sealing member 62 and a second glass sheet 72 may be further included at the lower surface of the transparent substrate film 10, that is, the lower surface of the transparent display 100.
  • the second sealing member 62 is a portion disposed between the second glass sheet 72 and the transparent display 100, and prevents the penetration of external air such as moisture or oxygen into the transparent display 100.
  • the second sealing member 62 may be disposed on the entire surface of the transparent display 100 to cover the transparent display 100. In this case, the second sealing member 62 protects the light-emitting element 20 of the transparent display 100, and seals the transparent display 100 and the second glass sheet 72 so that they are not separated from each other.
  • the second sealing member 62 may be disposed on the edge of the second glass sheet 72.
  • the second sealing member 62 is formed of an optically transparent polymer so that the external light may be incident without blocking the user's view.
  • the second sealing member 62 may include at least one of polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), an ionoplast polymer, and polyurethane.
  • the second sealing member 62 may be formed of the PVB resin.
  • the second sealing member 62 may not only seal the transparent display 100 on the second glass sheet 72, but may also block about 99 % or more of ultraviolet rays (UV) while blocking the external air.
  • UV ultraviolet rays
  • the thickness of the second sealing member 62 is adjusted according to the height of the light-emitting element 20 in the transparent display 100.
  • the ratio D1/H1 of the thickness D1 of the second sealing member 62 to the height H1 of the light-emitting element 20 may be in the 1.5 to 5 range.
  • the second glass sheet 72 is a plate member including a transparent polymer such as glass and/or polymethyl methacrylate (PMMA), polycarbonate (PC), etc., and it may be colorless transparent or colored transparent. At this time, the second glass sheet 72 may have light transmittance of about 85 % or more for visible light.
  • the second glass sheet 72 may have the same or different materials, colors, and/or light transmittances as the first glass sheet 71.
  • the shape of the second glass sheet 72 may be a planar shape or a curved shape such as a bow, that is, a curved-surface shape.
  • the curved radius R may be about 0.2 to 0.3 m.
  • the transparent display 100 is a portion interposed between the first glass sheet 71 and the second glass sheet 72 to display the images and text information.
  • the transparent display 100 has a yellowness index (YI) value of 3.0 or less, the external light may not only be incident, but also does not deteriorate the visual transparency of the glass assembly 1000, and thus the user's view is not blocked.
  • YI yellowness index
  • the transparent display 100 may be one or plural.
  • a plurality of transparent displays 100 may display one large image. That is, when image signals are split according to a screen split method set in the LED driver, a plurality of split images are generated from the one large image, and each of the split images may be displayed on the transparent display 130 corresponding thereto.
  • the glass assembly 1000 has light transmittance of about 70 to 80 % and light reflectance of about 8 to 15 % at a wavelength in a visible light range (a wavelength of 400 to 700 nm).
  • a wavelength in a visible light range a wavelength of 400 to 700 nm.
  • vision is not obstructed by the transparent electrode layer 132, the transparency from the inside or the outside may be secured, and the appearance characteristics, electrical conductivity, and visual transparency may be further improved.
  • T is light transmittance (%) of a glass assembly in a wavelength of a visible light region
  • R S represent sheet resistance ( ⁇ /sq) of a transparent electrode layer.
  • the glass assembly 1000 has light transmittance of 70 % or more at the wavelength in the visible light range and satisfies the following Equation 2.
  • the glass assembly 100 may have low power consumption and low heat generation, and may also have visual transparency to more clearly display characters or images.
  • T represents the light transmittance (%) of the glass assembly in the wavelength of the visible light region
  • R S represents the sheet resistance ( ⁇ /sq) of the transparent electrode layer.
  • the length of the output electrode unit 34 is 20 % or more of the length of the input electrode unit 32, and even if a high current is applied, the transparent display 100 may be prevented from being damaged by heat.
  • a circuit pattern (line width: 15 ⁇ m) is formed of a copper mesh through a mask and etching process to form a transparent electrode layer (sheet resistance: about 1 ⁇ /sq).
  • the edge electrode forms a circuit pattern with copper lines.
  • Each edge electrode is electrically connected to two light-emitting element arrays, each light-emitting element array is composed of ten light-emitting elements, and an RGB LED is used as the light-emitting element.
  • the input electrode unit consists of 30 sub-electrodes and the entire length of the input electrode unit is 20.4 mm, while the length of the common output electrode unit is 12.24 mm (i.e., 60 % of the length of the input electrode unit).
  • a silver (Ag) solder is formed on the electrode layer through a screen printing process, and then a plurality of LEDs (height: about 1 mm) are mounted on each silver (Ag) solder using a low temperature surface mount technology (SMT) method.
  • SMT surface mount technology
  • An anisotropic conductive adhesive layer (RA3351, H&S Manufacturing Company) is formed at the edge portion of the electrode layer where the LED is not mounted, and a flexible printed circuit board (FPCB) is stacked on the anisotropic conductive adhesive layer.
  • FPCB flexible printed circuit board
  • a protection adhesive layer (a silicon adhesive layer/PET double layer) is stacked to manufacture a transparent display.
  • the transparent display is manufactured by the same method as Exemplary Embodiment 1, except that the length of the output electrode unit is formed to be 4.08 mm, that is, 20 % of the length of the input electrode unit.
  • the transparent display is manufactured by the same method as Exemplary Embodiment 1, except that the length of the output electrode unit is formed to be 8.16 mm, that is, 40 % of the length of the input electrode unit.
  • the transparent display is manufactured by the same method as Exemplary Embodiment 1, except that the length of the output electrode unit is formed to be 16.32 mm, that is, 80 % of the length of the input electrode unit.
  • the transparent display is manufactured by the same method as Exemplary Embodiment 1, except that the length of the output electrode unit is formed to be 2.04 mm, that is, 10 % of the length of the input electrode unit.
  • the experimental example is the case of allocating the ten light-emitting elements to one light-emitting element array, that is, the case of using the input electrode unit made of the thirty sub-electrodes and one common output electrode unit to input and output the current to the ten light-emitting elements, however the same length ratio may be applied even when the number of light-emitting elements allocated to one light-emitting element array changes.
  • the intensity of the current applied to the common output electrode unit increases linearly, but the number of the sub-electrodes of the input electrode unit also increases, so that the entire length of the input electrode unit also increases linearly, the ratio of the length of the input electrode unit and the length of the output electrode unit is equally maintained regardless of the number of light-emitting elements.
  • FIG. 5 and FIG. 6 show the results of photographing the edge electrodes to evaluate the thermal damage of the transparent display according to Exemplary Embodiment 1 and Comparative Example 1. That is, the temperature change and the appearance change are observed by using a thermal imaging camera and a general camera for the edge electrode. As shown in the drawing, in Exemplary Embodiment 1, the temperature of the output electrode unit is hardly increased, but in Comparative Example 1, the temperature of the output electrode unit is increased to 95.9 °C. The damage caused by this is also visible to the naked eye as shown in the drawing.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

Un dispositif d'affichage transparent selon un mode de réalisation donné à titre d'exemple de la présente invention comprend : un film de substrat transparent ; une couche d'électrode transparente disposée sur une surface supérieure du film de substrat transparent ; une pluralité d'éléments électroluminescents disposés sur la couche d'électrode transparente ; une électrode de bord connectée électriquement à la couche d'électrode transparente et disposée sur le bord du film de substrat transparent ; et au moins une carte de circuit imprimé souple (FPCB) comprenant une pluralité de fils électriquement connectés à l'électrode de bord, l'électrode de bord comprenant une unité d'électrode d'entrée transmettant respectivement un signal d'entrée de courant à la pluralité d'éléments électroluminescents et une unité d'électrode de sortie transmettant en commun un signal de sortie de courant à partir de chacun de la pluralité d'éléments électroluminescents, l'unité d'électrode d'entrée est disposée de manière à correspondre à l'intérieur d'une direction de largeur de la carte de circuit imprimé souple (FPCB), l'unité d'électrode de sortie est disposée de manière à correspondre aux deux bords d'une direction de largeur de la carte de circuit imprimé souple (FPCB), et l'unité d'électrode de sortie s'étend au-delà du bord de la direction de largeur de la carte de circuit imprimé souple (FPCB).
PCT/KR2019/015280 2019-02-28 2019-11-11 Dispositif d'affichage transparent et ensemble verre le comprenant WO2020175765A1 (fr)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004006396A (ja) * 1999-11-24 2004-01-08 Lg Electronics Inc プラズマディスプレーパネル
US20070013629A1 (en) * 2005-07-12 2007-01-18 Shoichiro Matsumoto Electroluminescence display device
US20080242181A1 (en) * 2007-03-30 2008-10-02 Toshiro Takahashi Display device manufacturing method and display device produced thereby
WO2017138469A1 (fr) * 2016-02-10 2017-08-17 シャープ株式会社 Substrat à matrice active et panneau d'affichage
US20180033847A1 (en) * 2016-07-29 2018-02-01 Lg Display Co., Ltd. Transparent display device and method for manufacturing the same

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Publication number Priority date Publication date Assignee Title
KR100293982B1 (ko) 1998-08-03 2001-07-12 윤종용 액정패널
JP2011129554A (ja) 2009-12-15 2011-06-30 Epson Imaging Devices Corp Ｆｐｃ基板が接続された回路基板及びｆｐｃ基板と回路基板との接続方法。
KR102260060B1 (ko) * 2013-11-22 2021-06-04 삼성디스플레이 주식회사 표시 기판 및 이를 포함하는 표시 장치
KR20170139924A (ko) * 2016-06-10 2017-12-20 엘지전자 주식회사 투명 발광다이오드 필름

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004006396A (ja) * 1999-11-24 2004-01-08 Lg Electronics Inc プラズマディスプレーパネル
US20070013629A1 (en) * 2005-07-12 2007-01-18 Shoichiro Matsumoto Electroluminescence display device
US20080242181A1 (en) * 2007-03-30 2008-10-02 Toshiro Takahashi Display device manufacturing method and display device produced thereby
WO2017138469A1 (fr) * 2016-02-10 2017-08-17 シャープ株式会社 Substrat à matrice active et panneau d'affichage
US20180033847A1 (en) * 2016-07-29 2018-02-01 Lg Display Co., Ltd. Transparent display device and method for manufacturing the same

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