WO2020174874A1

WO2020174874A1 - Substrate processing device, semiconductor manufacturing device, and substrate processing method

Info

Publication number: WO2020174874A1
Application number: PCT/JP2019/051476
Authority: WO
Inventors: 及川　文利
Original assignee: 株式会社荏原製作所
Priority date: 2019-02-28
Filing date: 2019-12-27
Publication date: 2020-09-03
Also published as: TW202033285A; JP2020141052A

Abstract

The present invention relates to a device for cleaning and drying. The present invention relates to a semiconductor manufacturing device that comprises the device above. The present invention relates to a method for cleaning and drying. A substrate processing device (1) includes: a substrate holding part (2) that holds and rotates a substrate W; a spray nozzle (3) that sprays an inert solvent onto the substrate (W) held by the substrate holding part (2); a solvent recovery part (4) that recovers the inert solvent; a component analysis part (5) that analyzes components of the inert solvent recovered by the solvent recovery part (4); a component adjustment part (6) that adjusts the components of the inert solvent analyzed by the component analysis part (5); a solvent supply part (7) that supplies the component-adjusted inert solvent to the spray nozzle (3); and an operation control part (8) that controls operations of the component adjustment part (6) and the solvent supply part (7).

Description

\¥0 2020/174874 1 卩 (: 17 2019/051476 Clarification

Title of invention:

Substrate processing apparatus, semiconductor manufacturing apparatus, and substrate processing method

Technical field

[0001] The present invention relates to an apparatus for treating a substrate, particularly for cleaning and drying. The present invention relates to a semiconductor manufacturing apparatus including the device. The present invention relates to a method of treating, in particular cleaning and drying a substrate.

Background technology

[0002] In a semiconductor manufacturing process, a polishing apparatus is used for polishing a substrate by using a polishing liquid for planarizing the substrate and removing a film on the substrate. For cleaning the substrate, scrub cleaning, ultrasonic cleaning, two-fluid cleaning, etc. are used, and as the cleaning liquid, an acidic or alkaline aqueous solution that is suitable for the removal target (particles or metal contamination) or super liquid is used. Pure water is used. When chemicals are used, it is generally known to rinse the substrate with ultrapure water to remove the chemical components.

[0003] As a method of drying a substrate, spin dry drying is known in which ultrapure water on the substrate after cleaning is shaken off by centrifugal force. In addition, a method of spraying 0.8 steam onto the center of the substrate to dry the substrate, or a method of spraying steam onto the substrate while lifting the substrate immersed in the liquid in a vertical position to dry the substrate It has been known.

Prior art documents

Patent literature

[0004] Patent Document 1: Japanese Patent Laid-Open No. 20 05 _ 5 4 6 9

Patent Document 2: JP 2 0 0 5 _ 1 2 3 2 1 8 Publication

Patent Document 3: JP 2 0 0 6 _ 2 8 6 9 4 8 Publication

Patent Document 4: JP 2 0 1 3 _ 1 7 9 3 4 1 Publication

Patent Document 5: JP 2 0 0 9 _ 2 3 8 9 3 9 Publication

Patent Document 6: Japanese Patent Laid-Open No. 2 0 0 9 -2 6 7 3 6 8 \¥0 2020/174874 2 卩 (: 17 2019/051476 Summary of invention

Problems to be Solved by the Invention

A method is known in which an inert solvent having high volatility is used in order to easily dry the substrate after the substrate processing step (see, for example, Patent Document 1). When the above inert solvent is used, the step of washing out the inert solvent with another solvent can be omitted, and thus the substrate can be dried in a short time. Such an inert solvent is generally guided to a waste liquid treatment facility and treated.

[0006] However, such an inert solvent is more expensive than isopropyl alcohol (0.8). Therefore, if the inert solvent is made disposable, the process cost for cleaning and drying per substrate will be high.

[0007] Therefore, an object of the present invention is to provide a substrate processing apparatus that can reuse an inert solvent.

An object of the present invention is to provide a semiconductor manufacturing apparatus equipped with the above substrate processing apparatus.

It is an object of the present invention to provide a substrate processing method capable of reusing an inert solvent.

Means for solving the problem

[0008] In one aspect, a substrate holding unit that holds and rotates a substrate, an injection nozzle that injects an inert solvent onto the substrate held by the substrate holding unit, and a solvent recovery that recovers the inert solvent Part, a component analysis part for analyzing the components of the inert solvent recovered by the solvent recovery part, a component adjustment part for adjusting the component of the inert solvent analyzed by the component analysis part, and the component adjustment A substrate processing apparatus is provided, comprising: a solvent supply unit that supplies the generated inert solvent to the jet nozzle; and an operation control unit that controls the operations of the component adjustment unit and the solvent supply unit.

[0009] In an aspect, the solvent recovery unit collects and liquefies the vaporized inert solvent injected from the injection nozzle, and a solvent liquefaction device, 〇 2020/174874 3 卩 (: 171? 2019 /051476

A solvent separation device that separates a mixed liquid containing the liquid inert solvent and a cleaning liquid used for cleaning the substrate, and recovers only the inert solvent from the mixed liquid, and the solvent liquefaction device. And a solvent recovery tank for storing the liquefied inert solvent and the inert solvent separated by the solvent separation device.

In one aspect, the inert solvent is a mixed solvent of a fluorine-based solvent and an alcohol-based solvent, and the component analysis unit analyzes a mixing ratio of the fluorine-based solvent and the alcohol-based solvent, The component adjusting unit adjusts the mixing ratio based on the analyzed mixing ratio.

In one aspect, the operation control unit determines whether or not the component of the inert solvent is out of a predetermined control range based on the component of the inert solvent analyzed by the component analysis unit, When the component of the inert solvent is out of the predetermined control range, a command is issued to the component adjusting section to adjust the component of the inert solvent.

[0010] In an aspect, the inert solvent is a solvent containing at least one of a hydrofluoroether and a hydrofluorocarbon, and an alcohol.

In the _ embodiment, the injection nozzle is a two-fluid nozzle that supplies the inert solvent and the inert gas, or a megasonic nozzle that supplies the inert solvent to which megasonic is added.

[001 1] In the aspect, the semiconductor manufacturing apparatus includes a substrate processing apparatus, wherein the substrate processing apparatus holds a substrate, rotates the substrate, and holds the substrate on the substrate. An injection nozzle for injecting an inert solvent, a solvent recovery unit for recovering the inert solvent, a component analysis unit for analyzing the components of the inert solvent recovered by the solvent recovery unit, and the component analysis unit Component adjusting section for adjusting the component of the inert solvent analyzed by the above, a solvent supply section for supplying the inert solvent with the adjusted component to the injection nozzle, and the operation of the component adjusting section and the solvent supply section A semiconductor manufacturing apparatus is provided which includes an operation control unit for controlling the. 〇 2020/174874 4 卩 (: 171? 2019 /051476

[0012] In the _ aspect, while rotating the substrate held by the substrate holding portion,

Injecting an inert solvent with a spray nozzle, collecting the inert solvent, analyzing the components of the recovered inert solvent, adjusting the analyzed components of the inert solvent, and adjusting the components Provided is a method for treating a substrate, which comprises supplying an inert solvent to the spray nozzle.

[0013] In the aspect, the inert solvent vaporized and collected from the jet nozzle is recovered and liquefied, and the liquid inert solvent jetted from the jet nozzle and a cleaning liquid used for cleaning the substrate are provided. The mixed solution containing is separated, only the inert solvent is recovered from the mixed solution, and the liquefied inert solvent and the separated inert solvent are stored.

— In the aspect, the inert solvent is a mixed solvent of a fluorine-based solvent and an alcohol-based solvent, the mixing ratio of the fluorine-based solvent and the alcohol-based solvent is analyzed, and based on the analyzed mixing ratio. Then, the mixing ratio is adjusted.

In the _ embodiment, it is determined whether the component of the inert solvent is out of the predetermined control range based on the analyzed component of the inert solvent, and the component of the inert solvent is in the predetermined control range. When removed, adjust the ingredients of the inert solvent.

[0014] In the aspect, the inert solvent is a solvent containing at least one of a hydrofluoroether and a hydrofluorocarbon, and an alcohol.

Effect of the invention

[0015] The substrate processing apparatus can collect, analyze, adjust, and supply the inert solvent jetted from the jet nozzle to the jet nozzle again. Therefore, the substrate processing apparatus can reuse the inert solvent.

Brief description of the drawings 〇 2020/174874 5 卩 (: 171? 2019 /051476

[0016] [Fig. 1] Fig. 1 is a diagram showing an embodiment of a substrate processing apparatus.

[FIG. 2] A diagram showing a processing flow by an operation control unit.

FIG. 3 is a diagram showing another embodiment of the substrate processing apparatus.

FIG. 4 is a view showing still another embodiment of the substrate processing apparatus.

FIG. 5 is a view showing still another embodiment of the substrate processing apparatus.

FIG. 6 is a diagram showing a semiconductor manufacturing apparatus including a substrate processing apparatus.

MODE FOR CARRYING OUT THE INVENTION

[0017] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components will be denoted by the same reference symbols and redundant description will be omitted.

[0018] FIG. 1 is a diagram showing an embodiment of the substrate processing apparatus 1. As shown in FIG. 1, the substrate processing apparatus 1 includes a substrate holding unit 2 that holds a substrate, and an injection nozzle 3 that injects an inert solvent containing a fluorine-based solvent onto the substrate held by the substrate holding unit 2. A solvent recovery unit 4 for recovering the inert solvent, a component analysis unit 5 for analyzing the components of the inert solvent recovered by the solvent recovery unit 4, and an inert solvent analyzed by the component analysis unit 5. Component adjuster 6 for adjusting the components, solvent supply unit 7 for supplying the inert solvent whose component has been adjusted by the component adjuster 6 to the injection nozzle 3, and operation of the component adjustor 6 and the solvent supply unit 7. It is provided with an operation control unit 8 for controlling the.

[0019] The configuration of the substrate holding unit 2 will be described. The substrate holder 2 is composed of a spin chuck 10 for holding the substrate horizontally, a chuck support shaft 11 fixed to the spin chuck 10, a chuck actuator 12 connected to the chuck support shaft 1 1. Equipped with. The chuck actuator 12 is configured to rotate the substrate about its central axis and raise and lower the substrate. The chuck actuator 12 includes an elevating device that elevates and lowers the substrate via the spin chuck 10 and the chuck support shaft 11 and a rotation drive device that rotates the substrate through the spin chuck 10 and the chuck support shaft 11. I have it. An example of lifting equipment is the combination of a ball screw and a servomotor. 〇 2020/174874 6 卩 (: 171? 2019 /051476

it can. A motor can be given as an example of the rotary drive device. In the present application, the substrate includes a rectangular substrate and a circular substrate. Moreover, the rectangular substrate includes a polygonal glass substrate such as a rectangle, a liquid crystal substrate, a printed circuit board, and other polygonal objects to be plated. Circular substrates include semiconductor wafers, glass substrates, and other circular substrates.

[0020] The cleaning liquid supply nozzle 1 is provided above the substrate held by the spin chuck 10.

5 and 16 are arranged. In the present embodiment, two cleaning liquid supply nozzles are arranged, but the number of cleaning liquid supply nozzles is not limited to this embodiment. Each of the cleaning liquid supply nozzles 15 and 16 is configured to supply a cleaning liquid (for example, a chemical liquid or pure water) to the upper surface (that is, the front surface or the back surface) of the substrate.

Around the spin chuck 10, a process cup 20 that receives the liquid shaken off from the rotating substrate is arranged. The process cup 20 is arranged so as to surround the peripheral portion of the substrate, and is fixed to the support plate 21 arranged below the spin chuck 10.

The injection nozzle 3 is arranged above the center of the substrate held by the spin chuck 10. The injection nozzle 3 is attached to one end of a nozzle arm 25 extending horizontally in the radial direction of the substrate. An arm support shaft 26 is attached to the other end of the nozzle arm 25. A nozzle actuator 27 is connected to the arm support shaft 26.

The nozzle actuator 27 is configured to swivel the jet nozzle 3 in the radial direction of the substrate and move the jet nozzle 3 up and down. Nozzle actuator 2-7 lifts and lowers the spray nozzle 3 via the arm support shaft 26 and nozzle arm 25 and the spray nozzle 3 via the arm support shaft 26 and nozzle arm 25. And a rocking device for rocking. An example of the lifting device is a combination of a ball screw and a servomotor. A motor can be given as an example of the rocking device.

As shown in FIG. 1, the operation control unit 8 includes a chuck actuator 12 and a chuck actuator 12. \¥0 2020/174 874 7 卩 (: 17 2019/051476

It is electrically connected to the nozzle actuator 27 and controls the operation of each of the chuck actuator 12 and nozzle actuator 27.

[0025] The injection nozzle 3, the spin chuck 10, the chuck support shaft 11 and the cleaning liquid supply nozzles 15 and 16 and the process cup 20, the support plate 21 and the nozzle arm 25 and the arm support shaft 26 are , Located inside the chamber 30.

[0026] A filter fan unit 3 1 is arranged above the chamber 30. The filter fan unit 31 has an air filter (not shown). As the air passes through the air filter, impurities such as particles are removed from the air, and clean air is discharged downward from the filter fan unit 3 1. Therefore, a downward flow of clean air is formed in the chamber 30.

Inside the chamber 30 is arranged an ionizer (static elimination device) 32 for removing static electricity from the substrate held by the spin chuck 10. The ionizer 32 is capable of irradiating the substrate held by the spin chuck 10 with ions. Inert solvents with low electrical resistivity are present. If an inert solvent with a low electrical resistivity is used, the substrate may become charged when it is dried. As a result, impurities may adhere to the substrate. In this embodiment, the ionizer 32 can prevent the substrate from being charged.

[0028] When cleaning the substrate, the chuck actuator 1 2

Rotate the substrate held at 0. In this state, the cleaning liquid supply nozzle 1 5,

16 supplies the cleaning liquid to the center of the upper surface of the substrate. The cleaning liquid supplied to the substrate is spread over the entire upper surface of the substrate by the centrifugal force, and as a result, the entire substrate is covered with the cleaning liquid.

After the cleaning liquid is supplied, the spray nozzle 3 sprays the inert solvent onto the center of the upper surface of the substrate. The inert solvent is a solvent containing a fluorine solvent and an alcohol solvent. In this embodiment, the inert solvent is hydrofluoroether. 〇 2020/174 874 8 卩 (: 171? 2019 /051476

A solvent containing at least one of the compounds and hydrofluorocarbons and an alcohol (eg, isopropyl alcohol). Examples of the fluorine-based solvent include perfluorocarbons as well as hydrofluoroethers and hydrofluorocarbons.

[0030] The effects of using such an inert solvent for cleaning and drying the substrate will be described. First, the challenges for cleaning the substrate are as follows. Impurities such as particles that adhere to the substrate adhere to the substrate due to the liquid bridge force and van der Waalsca force. In order to remove such impurities, it is sufficient to give the impurities a removing power that exceeds the adhesive power of the impurities.

As a method of weakening the adhesion of impurities, a method of controlling the hydrogen ion exponent (! ^~ 1) of the liquid supplied to the substrate or a method of slightly etching the substrate can be considered. On the other hand, as a method for enhancing the removing power, a scrub cleaning method using a contact cleaning member such as eight sponges, an ultrasonic cleaning method in which ultrasonic vibration is applied to the liquid, or a mixed gas/liquid flow is jetted onto the substrate. A fluid cleaning method is possible.

The scrub cleaning method is a method of controlling the relative speed and pressure between the substrate and the cleaning member. The ultrasonic cleaning method is a method of controlling the frequency and output of ultrasonic waves. The two-fluid cleaning method is a method of controlling the flow velocity and flow rate of the fluid. Such a method is a method of enhancing the physical power of impurities to enhance the ability to remove impurities.

However, in recent years, with the miniaturization of products such as semiconductors, the size of impurities (particle size) that must be removed has become smaller. In general, as the particle size decreases, the adhesion of impurities to the substrate decreases, but the pressure receiving area that receives the removal force also decreases. As the particle size decreases, van der Waalska, which is one of the adhesion forces, decreases in proportion to the particle size of impurities, but the removal force decreases in proportion to the cube of the particle size. Therefore, as the particle size is reduced, the adhesion force of impurities exceeds the removal force. 〇 2020/174 874 9 卩 (: 171? 2019 /051476

[0034] The problems with respect to the drying of the substrate are as follows. In spin dry drying, in which ultrapure water is spun off by centrifugal force, a watermark, which is a type of defect, occurs. As a countermeasure for this, there is a method of spraying steam onto the central portion of the substrate to dry the substrate. Further, there is a method in which the substrate immersed in the liquid in a vertical position is pulled up, and the vapor is sprayed onto the substrate to dry the substrate.

[0035] On the other hand, with the miniaturization of products such as semiconductors, the watermark size, which must be suppressed, is also decreasing. As a method of suppressing the generation of minute watermarks, there is a drying method that uses liquid I 8 instead of using the steam. However, in such a method, the use amount of Eighteenth will be greatly increased, and an organic wastewater treatment facility will be required. In addition, the environment-friendly cost is required and the equipment must be explosion-proof for safety reasons. As a result, the device becomes more expensive and larger as the structure of the device becomes more complicated.

In the present embodiment, the inert solvent is a solvent containing at least one of hydrofluoroethers and hydrofluorocarbons and alcohols. The effects of using such an inert solvent for cleaning the substrate are as follows.

[0037] The inert solvent has a density (1 ,4401^/111 ³ (@25○○)) of ultrapure water (water: about 9971^/111 ³ (@26.85○○)) It has the property that it is larger than the density of the chemical solution in the alkaline aqueous solution.The droplet of the inert solvent and the droplet of the above liquid (ultra pure water or chemical solution) have the same size and the same flow velocity. In the previous proposal, the impulse and kinetic energy of the droplet of the inert solvent are large due to the high density of the droplet, and the above-mentioned inert solvent causes the droplet to collide with the substrate. , Becomes a large impurity removing power.

Therefore, the inert solvent as a liquid for cleaning and drying the substrate has a large removing power as compared with the removing power of the liquid. As a result, the inert solvent can remove impurities having a larger adhesive force or smaller size than ever before.

[0039] The surface tension of the inert solvent (14.0!^/(!) is the surface tension of ultrapure water (water: approx. 72. 〇 2020/174874 10 卩 (: 171? 2019 /051476

It has the property of being smaller than the surface tension of 751^/(11) and the chemical solution of the aqueous solution. Therefore, when an inert solvent is used as the liquid for cleaning the substrate, the boundary layer thickness of the liquid becomes thin, and small-sized impurities adhering to the substrate (so much as to be buried in the boundary layer of the above liquid). Dynamic pressure can be applied to small size impurities). As a result, the inert solvent can remove impurities of smaller size than ever before.

[0040] The effects of using the above inert solvent for drying the substrate are as follows.

Since the above-mentioned inert solvent contains alcohols, by supplying the inert solvent to the substrate, it is possible to dissolve the slightly remaining water in the alcohol in the inert solvent, and Can be removed. As a result, the inert solvent can suppress the generation of fine watermarks.

[0041] the inert solvent, the density (1, 440 (^ / (11 ³⁾ have the property that large compared to the density of the liquid (chemical solution with ultrapure water or acidic or alkaline) Therefore, the centrifugal force acting on the inert solvent is increased in the spin dry drying step of shaking off the liquid by centrifugal force, and as a result, the inert solvent can be quickly shaken off.

[0042] The inert solvent has a property that the latent heat of vaporization is low (1261^ ₉ ) (for reference, water: about 2, 2 501^ ₉ ). Therefore, the residue of the inert solvent attached to the upper surface of the substrate can be quickly evaporated and quickly removed from the upper surface of the substrate. Compared with the conventional technique of spraying vapor on the interface between gas and liquid to gradually widen the drying range, the use of an inert solvent allows the drying process to be completed in a short time. It is possible and can contribute to improving the productivity of the device.

As described above, the inert solvent according to the present embodiment can exert a great effect in the washing process and the drying process. However, as mentioned above, such inert solvents are very expensive. Therefore, the substrate processing apparatus 1 according to this embodiment has a configuration capable of reusing the inert solvent. \¥0 2020/174 874 1 1 卩 (: 17 2019/051476

It

The configuration of the solvent recovery unit 4 will be described. The solvent recovery unit 4 collects and liquefies the vaporized inert solvent (that is, vaporized solvent) ejected from the ejection nozzle 3, and the liquid liquefaction device 35 ejected from the ejection nozzle 3. Solvent separator 3 6 that separates the mixed solution containing the active solvent (that is, liquid solvent) and the cleaning solution used to clean the substrate, and recovers only the inert solvent from this mixed solution, and the solvent liquefier 3 5 And a solvent recovery tank 37 for storing the inert solvent liquefied by and the inert solvent separated by the solvent separation device 36. The cleaning liquid is a liquid containing at least one of pure water and a chemical liquid supplied from the cleaning liquid supply nozzles 15 and 16.

[0045] The solvent liquefaction device 35 includes an exhaust line 40 for transferring the inert solvent vaporized inside the chamber 30 and a cooling unit 41 connected to the exhaust line 40. .. The exhaust line 40 has an intake port 4 arranged inside the chamber 30 and an exhaust port 40 arranged outside the chamber 30. The intake port 40 3 of the exhaust line 40 is arranged below the spin chuck 10 and inside the process cup 20 in the radial direction.

The vaporized solvent flows into the exhaust line 40 through the intake port 40 ₃ and moves in the exhaust line 40. The cooling unit 41 cools the vaporized solvent moving in the exhaust line 40 and liquefies the vaporized solvent. More specifically, the cooling unit 41 includes a cooling pipe 42 for circulating the cooling liquid and a temperature adjusting device 43 for adjusting the temperature of the cooling liquid flowing through the cooling pipe 42.

As shown in FIG. 1, the operation control unit 8 is electrically connected to the temperature adjusting device 43. The operation control unit 8 issues a command to the temperature adjusting device 43 to adjust the temperature of the cooling liquid flowing through the cooling pipe 42. In the present embodiment, the temperature adjusting device 43 adjusts the temperature of the cooling liquid to a temperature lower than the boiling point of the inert solvent according to a command from the operation control unit 8.

The vaporized solvent moving in the exhaust line 40 contacts the cooling pipe 42 and is liquefied. The liquefied inert solvent is collected through the liquefied solvent transfer line 44. 〇 2020/174874 12 卩 (: 171? 2019 /051476

Be transferred to the link 37. The solvent recovery tank 37 is a tank for storing the reused inert solvent, and the liquefied solvent transfer line 44 is connected to the solvent recovery tank 37. Mixed gas such as vaporized solvent that has not been liquefied and clean air discharged from the filter fan unit 31 is transferred to the outside (for example, an exhaust utility) through the exhaust port 401.

[0049] The solvent separation device 36 includes a recovery line 45 having an inlet 453 arranged inside the chamber 30 and a continuous centrifuge 46 connected to the recovery line 45. I have it. The inlet 453 of the recovery line 45 is arranged at a position lower than the spin chuck 10 and is arranged radially inward of the process cup 20. The chamber 30 is a closed space provided with an exhaust line 40 and a recovery line 45.

[0050] During cleaning and drying of the substrate, when the cleaning liquid supply nozzles 15 and 16 supply the cleaning liquid to the rotating substrate, the cleaning liquid is shaken off from the rotating substrate. The cleaning liquid is captured by the process cup 20 and flows downward on the inner peripheral surface of the process cup 20. Similarly, when the spray nozzle 3 supplies an inert solvent to the rotating substrate, the inert solvent is shaken off from the rotating substrate. The inert solvent is captured by the process cup 20 and flows downward on the inner peripheral surface of the process cup 20.

The inert solvent and the cleaning liquid which flow downward on the inner peripheral surface of the process cup 20 flow into the recovery line 45 through the inlet 4 5 ₃ of the recovery line 45 as a mixed liquid. The mixed liquid (inert solvent and washing liquid) flowing into the recovery line 45 is introduced into the continuous centrifuge 46, and is separated into the inert solvent and the washing liquid by the continuous centrifuge 46. The cleaning liquid is transferred to the outside (for example, a drainage utility). The inert solvent is transferred to the solvent recovery tank 37 through the separation solvent transfer line 47. The separation solvent transfer line 47 is connected to the solvent recovery tank 37.

The configuration of the component analysis unit 5 will be described. As described above, the inert solvent is a mixed solvent of a fluorine solvent and an alcohol solvent. The component analysis unit 5 〇 2020/174874 13 卩 (: 171? 2019 /051476

It is configured to analyze the mixing ratio of the fluorine-based solvent and the alcohol-based solvent. In the present embodiment, the component analysis unit 5 includes a mass detector 50 that detects the mass of the inert solvent stored in the solvent recovery tank 37, and a liquid of the inert solvent stored in the solvent recovery tank 37. Mixing ratio calculation that calculates the mixing ratio of the fluorine-based solvent and alcohol-based solvent based on the values detected by the liquid level detector 51 that detects the surface, the mass detector 50, and the liquid level detector 51. Part 52 and is provided.

As shown in FIG. 1, the mass detector 50 and the liquid level detector 51 are electrically connected to the mixing ratio calculation unit 52. The mixing ratio calculating unit 5 2 includes a memory 5 2 ₃ storing a program, and a processor 5 2 spoon carrying out operations according to the program. The mass detector 50 detects the total mass of the solvent recovery tank 37 and the inert solvent. Storage 5 2 _3, the mass of the solvent recovery tank 3 7 stores pre Me. The processing device 52 calculates the mass of the inert solvent stored in the solvent recovery tank 37 by subtracting the mass of the solvent recovery tank 37 from the total mass detected by the mass detector 50. ..

[0054] storage device 5 2 _3, the size of the solvent recovery tank 3 7 (i.e., volume) stores pre Me a processor 5 2 spoon is inert solvent which is detected by the liquid level detector 5 1 Calculate the volume of the inert solvent from the relationship between the liquid surface of and the size of the solvent recovery tank 37. The processing unit 52 calculates the mixing ratio of the fluorine-based solvent and the alcohol-based solvent based on the values sent from the mass detector 50 and the liquid level detector 51.

[0055] Since the difference between the specific gravity of the fluorine-based solvent and the specific gravity of the alcohol-based solvent is large, when the mixing ratio of the fluorine-based solvent and the alcohol-based solvent changes, the mass of the inert solvent and the volume of the inert solvent are changed. Relationships also change. Therefore, the storage device 5 2 _3, components of the fluorine-based solvent (i.e., mixing ratio of the fluorine-based solvent and an alcohol solvent) data a correlation between the mass and the volume of inert solvent and inert solvent I remember it as a source.

[0056] The processing device 52 is detected by the mass detector 50 and the volume of the inert solvent calculated based on the liquid level of the inert solvent detected by the liquid surface detector 51. 〇 2020/174874 14 卩 (: 171? 2019 /051476

From the relationship with the mass of the inert solvent, calculate the mixing ratio of the fluorine-based solvent and the alcohol-based solvent.

In the present embodiment, the mixing ratio calculation unit 52 is incorporated in the operation control unit 8, but it may be provided separately from the operation control unit 8. In this case, the mixing ratio calculation unit 52 is electrically connected to the operation control unit 8.

In the embodiment, the component analysis unit 5 may include a component meter (not shown) instead of providing the mass detector 50, the liquid level detector 51, and the mixing ratio calculation unit 52. Yes. A chromatographic device or a refractive index sensor can be given as an example of the component meter. The component meter is a device for analyzing the components of the inert solvent in the solvent recovery tank 37 and measuring the mixing ratio of the fluorine-based solvent and the alcohol-based solvent. The component meter is electrically connected to the operation control unit 8.

[0059] During cleaning and drying of the substrate, an inert solvent having a predetermined mixing ratio is sprayed onto the substrate. However, the mixing ratio of the inert solvent in the solvent recovery tank 37 may deviate from the predetermined mixing ratio. Therefore, the operation control unit 8 determines whether the component of the inert solvent is out of the predetermined control range based on the component (mixing ratio) of the inert solvent analyzed by the component analysis unit 5, and When the component of the active solvent is out of the predetermined control range, the component adjusting section 6 is instructed to adjust the component of the inert solvent.

The configuration of the component adjusting unit 6 will be described. The component adjusting unit 6 adjusts the mixing ratio of the fluorine-based solvent and the alcohol-based solvent based on the analyzed mixing ratio. More specifically, the component adjusting unit 6 includes a fluorine-based solvent supply source 55 and an alcohol-based solvent supply source 5 6. Each of the fluorine-based solvent supply source 5 5 and the alcohol-based solvent supply source 5 6 is electrically connected to the operation control unit 8 and stored in the solvent recovery tank 37 in accordance with a command from the operation control unit 8. It is configured to supply each of fluorine-based solvent and alcohol-based solvent.

[0061] For example, when the concentration of the fluorine-based solvent is lower than the predetermined control range (that is, when it is lower than the lower limit value of the control range), the operation control unit 8 uses the fluorine-based solvent. 〇 2020/174874 15 卩 (: 171? 2019 /051476

The component adjusting unit 6 is instructed to increase the concentration of. In response to this command, the fluorine-based solvent supply source 55 of the component adjusting unit 6 supplies the fluorine-based solvent to the solvent recovery tank 37. In this way, the component adjusting section 6 increases the concentration of the fluorinated solvent so that the concentration of the fluorinated solvent falls within the predetermined control range.

[0062] For example, when the concentration of the fluorine-based solvent is higher than the predetermined control range (that is, when it is higher than the upper limit of the control range), the operation control unit 8 lowers the concentration of the fluorine-based solvent. Is issued to the component adjustment unit 6. In response to this command, the alcohol solvent supply source 5 6 of the component adjusting unit 6 supplies the alcohol solvent to the solvent recovery tank 37. In this way, the component adjusting unit 6 lowers the concentration of the fluorinated solvent so that the concentration of the fluorinated solvent falls within the predetermined control range.

[0063] The relationship between the deviation of the concentration of the fluorine-based solvent from the control range and the supply amount of the fluorine-based solvent may be determined in advance. In this case, the operation control unit 8 may supply the amount of alcohol solvent determined from this relationship to the inert solvent in the solvent recovery tank 37. The operation control unit 8 may supply the amount of the fluorine-based solvent determined from this relationship to the inert solvent in the solvent recovery tank 37.

[0064] —In the embodiment, the fluorine-based solvent supply source 55 may include a fluorine-based solvent tank (not shown) provided with a liquid level gauge. The liquid level gauge is electrically connected to the operation control unit 8. The operation control unit 8 may be configured to issue an alarm when the level of the fluorine-based solvent in the fluorine-based solvent tank drops to a predetermined position. With this configuration, the operator can avoid a situation where the supply of the fluorine-based solvent is insufficient. Although not shown, the alcohol solvent supply source 5 6 may have the same configuration.

The configuration of the solvent supply unit 7 will be described. The solvent supply unit 7 is a solvent recovery tank.

3 7 and the injection nozzle 3, and a pump device 61 for transferring the inert solvent in the solvent recovery tank 37 to the injection nozzle 3 through the supply line 60 and the supply line 60. A filter 62 for capturing foreign matters contained in the inert solvent flowing through and a flow rate adjusting valve 63 for adjusting the flow rate of the inert solvent flowing through the supply line 60 are provided. As an example of the flow rate adjustment valve 63, an electromagnetic 〇 2020/174874 16 卩 (: 171? 2019 /051476

You can mention the valve.

[0066] The pump device 61 is arranged upstream of the filter 62 in the flow direction of the inert solvent flowing through the supply line 60, and the flow control valve 63 is provided downstream of the filter 62. It is located in. The pump device 61 is electrically connected to the operation control unit 8. The operation control unit 8 drives the pump device 61 according to the command. The flow rate adjusting valve 63 is electrically connected to the operation controller 8. The operation control unit 8 adjusts the opening degree of the flow rate adjusting valve 63 according to the command.

As shown in FIG. 1, the operation control unit 8 includes a storage device 8 ₃ that stores a program and a processing device 8 13 that executes a calculation according to the program. The above management range is stored in the storage device 83. The operation control unit 8 including a computer operates according to a program electrically stored in the storage device 83.

FIG. 2 is a diagram showing a processing flow by the operation control unit 8. As shown in Fig. 2, the operation control unit 8 compares the components of the inert solvent analyzed by the component analysis unit 5 with a predetermined control range (see step 3101), and determines that the components of the inert solvent are Determine whether it is out of the prescribed management range (see step 3102)

.. When the components of the inert solvent are within the predetermined control range (refer to “NO” in step 3102), the operation control unit 8 operates the solvent supply unit 7 (more specifically, the pump device 6 1). And flow control valve 6 3) to supply a predetermined amount of inert solvent to the injection nozzle 3 (see step 3103).

[0069] When the component of the inert solvent is out of the predetermined control range (Step 3 10

(Refer to “3” in 2)), and the operation control section 8 issues a command to the component adjustment section 6 to adjust the components of the inert solvent in the solvent recovery tank 37 (see step 3104). .. After that, the operation control unit 8 executes the same operation as in steps 3101 and 3102.

The program for causing the operation control unit 8 to execute these steps is recorded in a computer-readable recording medium that is a non-transitory tangible material, and is provided to the operation control unit 8 via the recording medium. .. Or, the program is 〇 2020/174874 17 卩(: 171-1? 2019/051476

It may be input to the operation control unit 8 via a communication network such as a computer or oral area network.

The operation control unit 8 may execute the above steps each time a predetermined unit of substrate is processed. The predetermined unit may be one sheet or plural sheets. In order to prevent the situation where the inert solvent cannot be supplied to the injection nozzle 3 until the composition adjustment of the inert solvent by the component adjustment unit 6 is completed, the operation control unit 8 sets the solvent recovery tank 3 7 The above steps are carried out at time intervals such that the inert solvent components therein are always within the prescribed control range.

According to this embodiment, the substrate processing apparatus 1 can collect, analyze, adjust, and supply the inert solvent jetted from the jet nozzle 3 to the jet nozzle 3 again. In this way, the substrate processing apparatus 1 can circulate the inert solvent between the inside and the outside of the chamber 30 and thus can reuse the inert solvent.

The solvent recovery unit 4 recovers the inert solvent supplied to the substrate, the component analysis unit 5 analyzes the components of the recovered inert solvent, and the component adjustment unit 6 analyzes the analyzed inert solvent. The components of the solvent are adjusted, and the solvent supply unit 7 supplies the inert solvent having the adjusted components to the injection nozzle 3. The substrate processing apparatus 1 can easily collect the inert solvent with such a relatively simple structure.

[0074] The inert solvent has a density (1 ,4401^/111 ³ (@25○○)) of ultrapure water (water: about 9971^/111 ³ (@26.85○○)) Compared with the density of the chemical solution of alkaline aqueous solution, it has the property of being large, so even if the washing solution is mixed with an inert solvent, it can be easily mixed with a small continuous centrifuge 46. The active solvent can be separated and recovered.

[0075] The inert solvent has a property that its boiling point is about 54.5°. As described above, since the inert solvent has a relatively low temperature, the substrate processing apparatus 1 liquefies the vaporized solvent by condensing the vaporized solvent with the cooling unit 41 during the exhaust line 40. You can As described above, the substrate processing apparatus 1 can easily collect the inert solvent with a relatively simple structure. 〇 2020/174 874 18 卩 (: 171? 2019 /051476

By providing the filter 62, foreign matter mixed in the inert solvent can be removed, so that the inert solvent can be cleaned to a level at which it can be reused. Since the inert solvent has excellent thermal and chemical stability as a liquid property, it can be used semipermanently by appropriately adjusting the concentration of the alcohol solvent. In addition, since the inert solvent does not have a flash point, there is no need for explosion-proof specifications on the device side, and it is possible to avoid complications and cost increases in the device design specifications. Compared with the drying method that uses liquid roe, the amount of roe roe used is significantly smaller, so there is no need to provide a waste water treatment facility dedicated to organic waste water treatment, and the waste treatment cost should be reduced. You can

FIG. 3 is a diagram showing another embodiment of the substrate processing apparatus 1. The configuration of this embodiment that is not particularly described is the same as that of the above-described embodiment, and thus the overlapping description will be omitted.

[0078] In the embodiment shown in Fig. 3, the injection nozzle 3 is a two-fluid nozzle that supplies an inert solvent and an inert gas. More specifically, as shown in FIG. 3, the substrate processing apparatus 1 includes a gas line 70 connected to the injection nozzle 3, an inert gas supply source 71 connected to the gas line 70, and a gas line 70. A flow rate adjusting valve 7 2 for adjusting the flow rate of the inert gas flowing through the line 70 is provided. An example of the flow rate adjusting valve 72 is a solenoid valve. The flow rate adjustment valve 72 is electrically connected to the operation control unit 8, and the operation control unit 8 can adjust the opening degree of the flow rate adjustment valve 72.

As an example of the inert gas supplied to the injection nozzle 3, nitrogen gas can be mentioned. The injection nozzle 3 as a two-fluid nozzle supplies a two-fluid jet to the upper surface of the substrate, and as a result, the upper surface of the substrate is cleaned by the two-fluid jet. In one embodiment, the injection nozzle 3 may be a megasonic nozzle that supplies an inert solvent provided with megasonic.

[0080] The fluorine-based solvent has a high specific gravity, and depending on the flow rate of the two-fluid jet, the cleaning ability becomes too high, which may damage the substrate. Therefore, the relationship between the opening degree of the flow rate adjusting valve 63 and the opening degree of the flow rate adjusting valve 72 is as follows. 〇 2020/174874 19 卩 (: 171? 2019 /051476

It may be introduced into the operation control unit 8 as the processing recipe of. With such a configuration, the processing recipe for the two-fluid cleaning can be adjusted.

As shown in FIG. 3, the substrate processing apparatus 1 includes an inert solvent supply device 75 that supplies a new inert solvent to the injection nozzle 3 through the supply line 60. The inert solvent supply device 75 is provided for auxiliary supply of a new inert solvent in case the supply amount of the inert solvent supplied to the injection nozzle 3 is insufficient.

[0082] The inert solvent supply device 75 includes an introduction line 7 6 connected to the supply line 60, an inert solvent supply source 7 7 connected to the introduction line 7 6, and a new flow flowing through the introduction line 7 6. A flow control valve 78 for adjusting the flow rate of the inert solvent is provided. An example of the flow rate adjusting valve 78 is a solenoid valve. The flow rate adjustment valve 78 is electrically connected to the operation control unit 8, and the operation control unit 8 can adjust the opening degree of the flow rate adjustment valve 78.

When the supply amount of the inert solvent supplied to the injection nozzle 3 is insufficient, the operation control unit 8 adjusts the opening degree of the flow rate adjusting valve 78 so that a new amount is supplied from the inert solvent supply source 77. Supply inert solvent to spray nozzle 3. According to this embodiment, the inert solvent supply device 75 is provided. Therefore, the situation in which the inert solvent cannot be supplied to the injection nozzle 3 does not occur until the component adjustment unit 6 completes the component adjustment of the inert solvent.

FIG. 4 is a diagram showing still another embodiment of the substrate processing apparatus 1. The configuration of this embodiment that is not particularly described is the same as that of the above-described embodiment, and thus the duplicate description thereof will be omitted. In FIG. 4, another embodiment of the solvent recovery part 4 is depicted. As shown in FIG. 4, the solvent recovery tank 37 includes a component adjustment tank 80 and a solvent supply tank 81. Each of the fluorine-based solvent supply source 55 and the alcohol-based solvent supply source 56 is configured to supply the fluorine-based solvent and the alcohol-based solvent to the component adjustment tank 80. The mass detector 50 and the liquid level detector 51 are provided in the component adjustment tank 80. The supply line 60 is connected to the solvent supply tank 81. 〇 2020/174 874 20 卩 (: 171? 2019 /051476

[0085] The component adjustment tank 80 and the solvent supply tank 81 are connected through a connection line 82, and the pump device 83 is connected to the connection line 82. Therefore, the pump device 83 can transfer the inert solvent in the component adjustment tank 80 to the solvent supply tank 81 through the connection line 82 by driving the pump device 83.

When the component adjusting unit 6 determines that the component of the inert solvent is within the predetermined control range, the operation control unit 8 drives the pump device 8 3 to activate the inert gas in the component adjusting tank 80. Transfer solvent to solvent supply tank 81. According to this embodiment, the component adjustment tank 80 and the solvent supply tank 81 are provided. Therefore, the situation in which the inert solvent cannot be supplied to the injection nozzle 3 does not occur until the component adjustment of the inert solvent by the component adjusting unit 6 is completed.

FIG. 5 is a diagram showing still another embodiment of the substrate processing apparatus 1. The configuration of this embodiment that is not particularly described is the same as that of the above-described embodiment, and thus the duplicate description thereof will be omitted. FIG. 5 shows another embodiment of the solvent recovery unit 4, the component analysis unit 5, and the component adjustment unit 6.

As shown in FIG. 5, the solvent recovery section 4 includes a plurality (two in the present embodiment) of solvent recovery tanks 37 and 37. The component analysis unit 5 includes a plurality (two in the present embodiment) of mass detectors 50 and 50 and a plurality (two in the present embodiment) of liquid level detectors 5 1, 8 and 5 1. It is equipped with and. The number of mass detectors 50 and 50 corresponds to the number of solvent recovery tanks 37 and 37, and the number of liquid level detectors 5 1 and 5 1 also corresponds to the number of solvent recovery tanks 37. It corresponds to a number of 37.

The component adjusting unit 6 includes a plurality (two in the present embodiment) of a fluorine-based solvent supply source 5.

5 and 8 and 5 and a plurality (two in this embodiment) of alcohol solvent supply sources 5 and 8 and 5 and 6, respectively. The number of fluorine-based solvent sources 5 58, 55 corresponds to the number of solvent recovery tanks 37 8 and 37, and the number of alcohol solvent sources 5 6 and 5 6 It corresponds to the number of recovery tanks 37 and 37. 〇 2020/174874 21 卩 (: 171? 2019 /051476

[0090] As shown in Fig. 5, a switching valve 90 is attached to the liquefied solvent transfer line 44, and the switching valve 90 has the first liquefied solvent branch line 4 4 ₃ and the 2-liquefaction solvent branch line 4 4 13 is installed. The first liquefied solvent branch line 4 4 3 transfers the inert solvent liquefied by the cooling unit 4 1 to the solvent recovery tank 37 8 and the second liquefied solvent branch line 4 4 13 connects the cooling unit 4 1. The inert solvent liquefied by 1 is transferred to the solvent recovery tank 37.

[0091] Similarly, the separation solvent transfer line 47 is equipped with a switching valve 91, and the switching valve 91 is connected to the first separation solvent branch line 4 7 ₃ and the second separation solvent branch line 47. The swallow is attached. The first separation solvent branch line 4 7 3 transfers the inert solvent separated by the continuous centrifuge 4 6 to the solvent recovery tank 37, and the second separation solvent branch line 4 7 connects the continuous centrifuge 4 6 The inert solvent separated by the above is transferred to the solvent recovery tank 37.

[0092] in a solvent recovery tank 3 7 eight is the first supply branch line 6 0 ₃ is connected to the first supply branch line 6 0 3, the first pump unit 61 eight is connected. A second supply branch line 60 sq is connected to the solvent recovery tank 37, and a second pump device 61 s is connected to the second supply stub line 60. A switching valve 92 is attached to the first supply branch line 60 3 and the second supply branch line 6013. A supply line 60 is attached to the switching valve 92.

The operation control unit 8 is electrically connected to the switching valves 90, 91, 92. The operation control unit 8 controls the switching valve 9 0 in order to prevent the situation in which the inert solvent cannot be supplied to the injection nozzle 3 until the component adjustment unit 6 completes the component adjustment of the inert solvent. , 9 1 and 9 2 are controlled.

[0094] More specifically, the operation control unit 8 operates each of the switching valves 90 and 91 to operate one of the solvent recovery tanks 37 8 and 37 (for example, the solvent recovery tank). Store the inert solvent in 37). The operation control unit 8 issues a command to the component analysis unit 5 and the component adjustment unit 6 to control the inert solvent in the solvent recovery tank 37. 〇 2020/174874 22 卩 (: 171? 2019 /051476

Adjust the ingredients. After the components of the inert solvent are adjusted, the operation control unit 8 operates the switching valve 92 to connect the first supply branch line 60 3 and the supply line 60. The operation control unit 8 supplies the inert solvent in the solvent recovery tank 37 to the injection nozzle 3 by driving the first pump device 61.

[0095] After that, the operation control unit 8 operates the switching valves 90, 91 again, so that the other one of the solvent recovery tanks 37, 38 (for example, the solvent recovery tank 37). Storing the inert solvent. The operation control unit 8 issues a command to the component analysis unit 5 and the component adjustment unit 6 to adjust the components of the inert solvent in the solvent recovery tank 37. After the components of the inert solvent have been adjusted, the operation control unit 8 operates the switching valve 92 again to connect the second supply branch line 60 and the supply line 60. The operation control unit 8 supplies the inert solvent in the solvent recovery tank 37 to the injection nozzle 3 by driving the second pump device 61.

[0096] In this way, the operation control unit 8 adjusts the components of the inert solvent stored in one of the solvent recovery tanks 37 8 and 37, and adjusts the inert solvent with the adjusted components. The inert solvent may be stored in the other solvent recovery tank while being supplied to the injection nozzle 3, and the components of the inert solvent stored in the solvent recovery tank may be adjusted. In the embodiment shown in FIG. 5, the substrate processing apparatus 1 includes a solvent recovery tank 37 (or solvent recovery tank 37) as a main tank and a solvent recovery tank 37 (or solvent recovery tank) as a sub tank. Tank 37 8), and. Therefore, the situation in which the inert solvent cannot be supplied to the injection nozzle 3 does not occur until the component adjustment of the inert solvent by the component adjusting unit 6 is completed.

[0097] All the embodiments described above may be combined as much as possible. In one embodiment, the inert solvent supply device 75 shown in FIG. 3 may be incorporated into at least one of the embodiment shown in FIG. 1, the embodiment shown in FIG. 4, and the embodiment shown in FIG.

FIG. 6 is a diagram showing a semiconductor manufacturing apparatus 100 including the substrate processing apparatus 1.

As shown in FIG. 6, the semiconductor manufacturing apparatus 100 includes a substantially rectangular housing 1101, and a port boat 102 on which a substrate cassette that accommodates a large number of substrates is placed. 〇 2020/174874 23 卩 (: 171? 2019 /051476

, Is equipped with. The mouth boat 102 is located adjacent to the housing 101. The mouth boat 102 can be equipped with an open cassette, a SM IF (Standard Manufacturing Interface) pod, or a F○U P (Front Opening Unified Pod). The SM F and F O U P are enclosed containers that house the substrate force set inside and cover it with a partition to maintain an environment independent of the external space.

[0099] Inside the housing 101, a plurality (four in the present embodiment) of polishing units 104a to 104d and a first cleaning unit 1060 for cleaning the substrate after polishing are provided. The second cleaning unit 108 and the substrate processing apparatus 1 described above are housed. The polishing units 1 04 a to 104 d are arranged along the longitudinal direction of the semiconductor manufacturing equipment, and the cleaning units 1 06, 108 and the substrate processing equipment 1 are also arranged along the longitudinal direction of the semiconductor manufacturing equipment. Has been done. The substrate processing apparatus 1 may be referred to as a cleaning and drying unit (or a processing unit).

[0100] The first substrate transfer robot 1 1 2 is arranged in the area surrounded by the port boat 102, the polishing unit 1 04 a, and the substrate processing apparatus 1, and the polishing unit 1 04 a to 1 The board transfer unit 1 1 4 is placed parallel to 04d. The first substrate transfer robot 1 12 receives the substrate before polishing from the port board 102 and transfers it to the substrate transfer unit 1 14 and receives the dried substrate from the substrate processing apparatus 1 and outputs it to the port board 1 1 2. Return to 02. The substrate transfer unit 1 1 1 4 transfers the substrate received from the first substrate transfer robot 1 1 1 2 and transfers the substrate to and from each polishing unit 1 04 a to 104 d. Each polishing unit polishes the upper surface of the substrate by sliding the substrate onto the polishing surface while supplying the polishing liquid to the polishing surface of the substrate.

[0101] It is located between the first cleaning unit 106 and the second cleaning unit 108, and transfers the substrate between these cleaning units 1 06 and 108 and the substrate transfer unit 1 1 4. The second substrate transfer robot 1 16 is arranged between the second cleaning unit 108 and the substrate processing apparatus 1 to transfer the substrate between these units 108, 1. The third board transfer robot 1 18 is installed. Motion control 〇 2020/174874 24 卩 (: 171? 2019 /051476

The hole is located inside the housing 101.

[0102] As the first cleaning unit 106, there is used a substrate cleaning device that cleans the substrate by rubbing a mouth sponge on both sides of the substrate in the presence of a chemical solution. A two-fluid type substrate cleaning device is used as the second cleaning unit 108.

[0103] The substrate is a polishing unit 1 0 4

Polished by at least one of 104. The polished substrate is cleaned by the first cleaning unit 106 and the second cleaning unit 108, and the cleaned substrate is cleaned and dried by the substrate processing apparatus 1.

[0104] In the conventional configuration, since ultrapure water or a chemical solution (acidic or alkaline aqueous solution) is used in the two-fluid cleaning step, a slight residual amount of water or the chemical solution in the chamber causes defects when the substrate is dried. May be a factor. Therefore, it is necessary to configure the cleaning unit and the drying unit separately, that is, by dividing the chamber.

[0105] In the present embodiment, by using the inert solvent in the cleaning step immediately before drying, the above-mentioned concerned material can be wiped off. Therefore, the substrate can be processed in the same unit by using the cleaning process and the drying process as a series of processes. In other words, the washing step can be performed with a conventional drying unit using an inert solvent. Therefore, it is possible to add a cleaning step for the purpose of removing minute impurities, without increasing the number of units. As a typical example, generally, a semiconductor manufacturing apparatus includes three cleaning units and one drying unit, but in the present embodiment, the semiconductor manufacturing apparatus 100 has two cleaning units and one drying unit. Since the cleaning unit and one substrate processing unit 1 are provided, it is possible to reduce the foot print without sacrificing the cleaning performance of the semiconductor manufacturing apparatus.

[0106] —In the embodiment, the semiconductor manufacturing apparatus 100 may include three cleaning units and one substrate processing apparatus 1. With this configuration, it is possible to improve the cleaning performance of semiconductor manufacturing equipment without increasing the number of foot prints. 〇 2020/174874 25 卩 (: 171? 2019 /051476

[0107] —In the embodiment, the semiconductor manufacturing apparatus 100 may include a defect inspection apparatus (not shown) for detecting defects (impurities and/or watermarks) contained in the substrate. With such a configuration, it is possible to appropriately and efficiently perform the defect inspection of the substrate.

Although the embodiments of the present invention have been described so far, the present invention is not limited to the above-described embodiments, and it is needless to say that the embodiments may be implemented in various different modes within the scope of the technical idea thereof. ..

Industrial availability

INDUSTRIAL APPLICABILITY The present invention can be used for an apparatus for cleaning and drying. INDUSTRIAL APPLICABILITY The present invention can be used in a semiconductor manufacturing apparatus equipped with the device. INDUSTRIAL APPLICABILITY The present invention can be used in a method of washing and drying.

Explanation of symbols

[01 10] 1 Substrate processing equipment

2 Board holder

3 injection nozzle

4 Solvent Recovery Department

5 component analysis section

6 component adjustment section

7 Solvent supply section

8 Motion control section

8 3 storage device

8-well processing equipment

1 0 spin chuck

1 1 Chuck support shaft

1 2 Chuck Actuator

1 5 Cleaning liquid supply nozzle

1 6 Cleaning liquid supply nozzle 174874 26 卩 (: 171? 2019 /051476

Process cup

1 Support plate

Nozzle arm

Arm support shaft

Nozzle actuator

Chamber

1 Filter fan unit

Ionizer

Solvent liquefaction device

Solvent separator

7 Solvent recovery tank

Exhaust line

3 air intake

Exhaust outlet

1 Cooling unit

2 cooling pipe

3 Temperature control device

Liquefaction solvent transfer line

3 First liquefied solvent branch line

匕 second liquefaction solvent branch line

5 Recovery line

5 3 entrance

6 continuous centrifuge

7 Separation solvent transfer line

7 3 1st separation solvent branch line

7 Second separation solvent branch line

0 Mass detector

1 Liquid level detector 〇 2020/174 874 27 卩 (: 171? 2019 /051476

52 Mixing ratio calculator

523 Storage device

52 Processor

55 Fluorine-based solvent supply source

56 Alcoholic solvent supply source

60 supply lines

603 1st supply branch line

60th second supply branch line

6 1 Pump device

62 Filter

63 Flow control valve

70 gas line

7 1 Inert gas supply source

72 Flow control valve

75 Inert solvent feeder

76 introduction line

77 Inert solvent source

78 Flow control valve

80 component adjustment tank

81 Solvent supply tank

82 Connection line

83 Pump device

90 switching valve

9 1 Switching valve

92 switching valve

1 00 Semiconductor manufacturing equipment

1 01 housing

1 02 mouth boat /174874 28 卩 (: 171? 2019 /051476

Polishing unit

06 1st cleaning unit

08 2nd cleaning unit

1 2 1st substrate transfer robot

1 4 Board transfer unit

Claims

〇 2020/174874 29 卩 (: 171? 2019 /051476 Claim

[Claim 1] A substrate holding unit for holding and rotating a substrate,

A jet nozzle for jetting an inert solvent on the substrate held by the substrate holder,

A solvent recovery unit for recovering the inert solvent,

A component analysis unit for analyzing the components of the inert solvent recovered by the solvent recovery unit,

A component adjusting unit for adjusting the components of the inert solvent analyzed by the component analyzing unit,

A solvent supply unit for supplying an inert solvent in which the components are adjusted to the injection nozzle,

A substrate processing apparatus, comprising: an operation control section that controls operations of the component adjusting section and the solvent supply section.

[Claim 2] The solvent recovery unit comprises:

A solvent liquefaction device for collecting and liquefying the vaporized inert solvent injected from the injection nozzle.

A solvent separation device that separates a mixed liquid containing a liquid inert solvent sprayed from the spray nozzle and a cleaning liquid used for cleaning the substrate, and recovers only the inert solvent from the mixed liquid;

The substrate processing apparatus according to claim 1, further comprising: a solvent recovery tank that stores the inert solvent liquefied by the solvent liquefaction device and the inert solvent separated by the solvent separation device.

[Claim 3] The inert solvent is a mixed solvent of a fluorine-based solvent and an alcohol-based solvent,

The component analysis unit analyzes the mixing ratio of the fluorine-based solvent and the alcohol-based solvent,

The substrate processing apparatus according to claim 1, wherein the component adjusting unit adjusts the mixture ratio on the basis of the analyzed mixture ratio. 〇 2020/174 874 30 卩 (: 171? 2019 /051476

[Claim 4] The operation control unit

Based on the component of the inert solvent analyzed by the component analysis unit, it is determined whether the component of the inert solvent is out of a predetermined control range,

4. When the component of the inert solvent is out of a predetermined control range, a command is issued to the component adjusting unit to adjust the component of the inert solvent, The component adjusting unit according to claim 1. Substrate processing equipment.

[Claim 5] The inert solvent is a solvent containing at least one of a hydrofluoroether and a hydrofluorocarbon and an alcohol, and the inert solvent is any one of claims 1 to 4. Substrate processing equipment.

6. The injection nozzle is a two-fluid nozzle that supplies the inert solvent and an inert gas, or a megasonic nozzle that supplies an inert solvent to which megasonic is added. The substrate processing apparatus according to any one of claims.

[Claim 7] A semiconductor manufacturing apparatus including a substrate processing apparatus,

The substrate processing apparatus,

A substrate holder that holds and rotates the substrate,

An injection nozzle for injecting an inert solvent onto the substrate held by the substrate holder,

A solvent recovery unit for recovering the inert solvent,

A solvent supply section for supplying the spray nozzle with an inert solvent in which the components are adjusted,

Operation control for controlling operations of the component adjusting section and the solvent supply section 〇 2020/174874 31 卩 (: 171? 2019 /051476

And a semiconductor manufacturing device.

[Claim 8] While rotating the substrate held by the substrate holding portion, an inert solvent is sprayed onto the substrate by a spray nozzle,

Recovering the inert solvent,

Analyzing the components of the recovered inert solvent,

Adjusting the components of the inert solvent analyzed,

A substrate treatment method, comprising supplying an inert solvent having the components adjusted to the spray nozzle.

[Claim 9] The inert solvent vaporized by being jetted from the jet nozzle is recovered and liquefied,

A mixed solution containing a liquid inert solvent sprayed from the spray nozzle and a cleaning liquid used for cleaning the substrate is separated, and only the inert solvent is recovered from the mixed liquid,

9. The substrate processing method according to claim 8, wherein the liquefied inert solvent and the separated inert solvent are stored.

[Claim 10] The inert solvent is a mixed solvent of a fluorine-based solvent and an alcohol-based solvent,

10. The substrate processing method according to claim 8, wherein a mixing ratio of the fluorine-based solvent and the alcohol-based solvent is analyzed, and the mixing ratio is adjusted based on the analyzed mixing ratio.

[Claim 11] Based on the analyzed components of the inert solvent, it is determined whether or not the composition of the inert solvent is out of a predetermined control range, and the component of the inert solvent has a predetermined content. The substrate processing method according to any one of claims 8 to 10, wherein a component of the inert solvent is adjusted when it is out of a control range.

[Claim 12] The inert solvent is a solvent containing at least one of a hydrofluoroether and a hydrofluorocarbon, and an alcohol. Substrate processing described 〇 2020/174874 32 卩 (: 171? 2019 /051476

Method.

13. The injection nozzle is a two-fluid nozzle that supplies the inert solvent and an inert gas, or a megasonic nozzle that supplies an inert solvent to which megasonic has been added. The substrate processing method according to any one of 1.