WO2020173193A1 - 卫星授时装置 - Google Patents

卫星授时装置 Download PDF

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Publication number
WO2020173193A1
WO2020173193A1 PCT/CN2019/126668 CN2019126668W WO2020173193A1 WO 2020173193 A1 WO2020173193 A1 WO 2020173193A1 CN 2019126668 W CN2019126668 W CN 2019126668W WO 2020173193 A1 WO2020173193 A1 WO 2020173193A1
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WIPO (PCT)
Prior art keywords
partition wall
heat insulation
tank body
circuit board
tank
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PCT/CN2019/126668
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English (en)
French (fr)
Inventor
谭斯仪
高峰
许祥滨
谢树
Original Assignee
泰斗微电子科技有限公司
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Application filed by 泰斗微电子科技有限公司 filed Critical 泰斗微电子科技有限公司
Publication of WO2020173193A1 publication Critical patent/WO2020173193A1/zh

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L1/00—Stabilisation of generator output against variations of physical values, e.g. power supply
    • H03L1/02—Stabilisation of generator output against variations of physical values, e.g. power supply against variations of temperature only
    • H03L1/04—Constructional details for maintaining temperature constant

Definitions

  • the invention belongs to the technical field of communication products, and particularly relates to a satellite timing device.
  • the high-precision operation of the internal clock source is mainly closely related to its internal quartz crystal oscillator (crystal oscillator) that provides clock signals.
  • the crystal oscillators commonly used in internal clock sources include ordinary active crystal oscillators, temperature-compensated crystal oscillators, voltage-controlled crystal oscillators, and constant-temperature crystal oscillators. Since these internal clock sources are all electronic, the stability and accuracy of their work are more or less Less will be affected by the ambient temperature.
  • temperature-compensated crystal oscillators In the prior art, temperature-compensated crystal oscillators, voltage-controlled crystal oscillators or constant-temperature crystal oscillators are often used to avoid or reduce the influence of the external environment temperature on the timing device.
  • constant-temperature crystal oscillators have high stability, but are bulky and relatively expensive;
  • the crystal oscillator needs an additional closed-loop control system to control, and the stability depends on the closed-loop control system;
  • the temperature-compensated crystal oscillator is small in size, relatively low in price, and has high stability.
  • the typical frequency temperature characteristic of the temperature-compensated crystal oscillator commonly used in navigation and positioning equipment is ⁇ 0.5ppm, but for the timing device, its frequency temperature stability is still slightly insufficient.
  • the purpose of the present invention is to provide a satellite timing device, which aims to solve the technical problem that the temperature of the quartz crystal oscillator in the satellite timing device in the prior art is easily affected by the external airflow and the temperature of the external environment.
  • a satellite timing device including a circuit board, an upper cover and a quartz crystal oscillator.
  • the upper cover covers the circuit board and surrounds the circuit board to form a mounting cavity.
  • the surface of the circuit board facing the upper cover is provided with a heat insulation groove located in the orthographic projection of the upper cover.
  • a support is provided in the heat insulation groove.
  • the quartz crystal oscillator is fixed on the support and is located in the installation cavity.
  • An insulating air layer is formed between the bottom of the heat tank.
  • the heat insulation tank includes a first tank body
  • the support includes a first partition wall and a second partition wall that separate the first tank body in the heat insulation tank
  • the quartz crystal oscillator is covered and arranged on the first tank body. Fixedly connected with the first partition wall and the second partition wall, the quartz crystal oscillator, the first tank and the circuit board are surrounded by a first heat insulation cavity.
  • the heat insulation tank further includes a second tank body
  • the support member further includes a third partition wall and a fourth partition wall separating the second tank body in the heat insulation tank, and the first tank body has opposite first ends.
  • the second end, the second tank is arranged at the first end of the first tank and extends from one end to the other end of the circuit board, the middle of the second tank is connected with the first end of the first tank, and the third The end of the partition wall facing the first tank body is connected to the end of the first partition wall facing the second tank body, the end of the fourth partition wall facing the first tank body and the end of the second partition wall facing the second tank body Connected, the upper cover, the second tank and the circuit board are surrounded by a second heat insulation cavity.
  • the heat insulation tank further includes a third tank body
  • the support member further includes a fifth partition wall and a sixth partition wall that separate the third tank body in the heat insulation tank, and the third tank body is disposed on the first tank body.
  • the second end has opposite first and second ends; the first end of the third tank body communicates with the second end of the first tank body, and the fifth partition wall faces the end of the first tank body and the second end.
  • a partition wall is connected to the end facing the third tank body, the end of the sixth partition wall facing the first tank body is connected to the end of the second partition wall facing the third tank body, and the second end of the third tank body faces away
  • the first tank body extends in the direction, and the upper cover, the third tank body and the circuit board are surrounded by a third heat insulation cavity.
  • the heat insulation tank further includes a fourth tank body and a fifth tank body respectively arranged on both sides of the first tank body, and the third partition wall, the first partition wall and the fifth partition wall are sequentially connected to the partition in the heat insulation tank.
  • Out of the fourth tank body, the fourth partition wall, the second partition wall and the sixth partition wall are sequentially connected in the heat insulation tank to separate the fifth tank body, and the upper cover, the fourth tank body and the circuit board are surrounded to form a fourth partition
  • the thermal cavity, the upper cover, the fifth tank body and the circuit board are enclosed to form a fifth heat insulation cavity.
  • the upper surface of the first partition wall facing the upper cover and the upper surface of the second partition wall facing the upper cover are both provided with pads, and the quartz crystal oscillator and the pads are welded and fixed.
  • the number of pads is at least two, and at least two of the pads are respectively disposed on the first partition wall and the second partition wall.
  • the satellite timing device further includes at least two connecting wires for electrically connecting the quartz crystal oscillator and the circuit board, and the first ends of the at least two connecting wires are respectively soldered to the at least two pads, each connected The second end of the wire extends along the third partition wall, the fourth partition wall, the fifth partition wall, or the sixth partition wall, respectively.
  • the heat insulation groove is a deep groove made on the circuit board by a method of controlled depth milling.
  • the upper cover is welded to the circuit board, or the upper cover and the circuit board are connected by fasteners.
  • the satellite timing device of the present invention is provided with a heat insulation groove on the circuit board for installing a quartz crystal oscillator, and a support member is arranged in the heat insulation groove, and the quartz crystal oscillator is fixed on the support member and It is contained in the mounting cavity.
  • a heat-insulating air layer can be formed between the quartz crystal oscillator and the circuit board, which is equivalent to setting a layer of heat preservation layer between the quartz crystal oscillator and the circuit board.
  • the quartz crystal oscillator Since the thermal conductivity of air is less than that of the circuit board, the quartz crystal oscillator is The thermal resistance of the heat exchange between the external environment becomes larger. At this time, compared with the direct heat transfer through the circuit board, the heat exchange between the quartz crystal oscillator and the external environment after the heat insulation groove is set and the heat insulation air layer is constructed The resistance increases and the heat exchange speed decreases, thereby reducing the influence of external airflow on the temperature of the quartz crystal oscillator in the installation cavity, effectively improving the temperature stability of the quartz crystal oscillator, and improving the working accuracy of the quartz crystal oscillator.
  • FIG. 1 is a schematic structural diagram of a satellite timing device provided by an embodiment of the present invention
  • FIG. 2 is an exploded view of the satellite timing device provided by the embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a circuit board of a satellite timing device provided by an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of the structure of the supporting member on the circuit board of the satellite timing device provided by the embodiment of the present invention.
  • the first tank 112 The second tank 113—The third tank
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the present invention, “plurality” means two or more than two, unless specifically defined otherwise.
  • the terms “installed”, “connected”, “connected”, “fixed” and other terms should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. , Or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components.
  • installed can be a fixed connection or a detachable connection. , Or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components.
  • an embodiment of the present invention provides a satellite timing device, including a circuit board 10, an upper cover 20, and a quartz crystal oscillator 30.
  • the circuit board 10 is a PCB board, which is connected to the quartz crystal oscillator.
  • the oscillator 30 is electrically connected and can transmit electrical signals such as clock signals between the two.
  • the upper cover 20 is used to protect the electronic components on the circuit board 10 such as the quartz crystal oscillator 30.
  • the upper cover 20 covers the circuit board 10 and surrounds the circuit board 10 to form a mounting cavity (not shown).
  • the surface of the circuit board 10 facing the upper cover 20 is provided with a partition located in the orthographic projection of the upper cover 20.
  • the heat tank 11 is provided with a support 116 in the heat insulation tank 11, the quartz crystal oscillator 30 is fixed on the support 116 and is located in the installation cavity, and the quartz crystal oscillator 30 is formed between the bottom of the heat insulation tank 11 There is an insulating air layer (not shown).
  • the circuit board 10 for installing the quartz crystal oscillator 30 is provided with a heat insulation groove 11, and a support 116 is provided in the heat insulation groove, and the quartz crystal oscillator 30 is fixed to the support 116 Is placed in the mounting cavity.
  • a heat-insulating air layer can be formed between the quartz crystal oscillator 30 and the circuit board 10, which is equivalent to providing a layer between the quartz crystal oscillator 30 and the circuit board 10. Insulation.
  • the heat insulation air layer in the heat insulation groove 11 replaces the circuit board 10 for heat transfer and conduction.
  • the thermal conductivity of air is much smaller than that of the circuit board 10 (the former The thermal conductivity is less than or only one-tenth of the thermal conductivity of the latter).
  • the thermal resistance for heat exchange between the quartz crystal oscillator 30 and the external environment becomes larger.
  • the heat insulation groove 11 is set and the heat insulation air layer is constructed, the heat exchange resistance between the quartz crystal oscillator 30 and the external environment increases, and the heat exchange speed decreases, thereby reducing the impact of external airflow on the quartz in the installation cavity.
  • the influence of the temperature of the crystal oscillator 30 effectively improves the temperature stability of the quartz crystal oscillator 30 and improves the working accuracy of the quartz crystal oscillator 30.
  • the heat insulation groove 11 can improve the ability of the ordinary active crystal oscillator to resist the influence of external airflow and temperature, thereby improving its Working stability, and when the internal clock source of the timing device adopts a temperature-compensated crystal oscillator, a voltage-controlled crystal oscillator or a constant-temperature crystal oscillator, the heat insulation tank 11 can cooperate with the temperature-compensated crystal oscillator or a constant-temperature crystal oscillator to further improve its working stability.
  • the aforementioned quartz crystal oscillator 30 is any one of a common active crystal oscillator, a temperature-compensated crystal oscillator, a voltage-controlled crystal oscillator, or a constant-temperature crystal oscillator, which can be selected according to actual conditions during use, and is not exclusively limited here.
  • the size of the heat insulation tank 11 can be individually modeled and designed by modeling and simulation software.
  • various design parameters of the heat insulation tank 11 are optimized through the modeling software, such as adjusting the tank body of the heat insulation tank 11. Shape and groove depth, etc., so as to adjust and optimize the thermal insulation parameters of the air thermal insulation layer formed inside the thermal insulation tank 11, reduce the thermal conductivity of the air thermal insulation layer, and increase the thermal conductivity between the quartz crystal oscillator 30 and the external environment.
  • the thermal resistance improves the heat insulation and heat preservation effect of the heat insulation groove 11 and its air insulation layer on the quartz crystal oscillator 30.
  • the heat insulation tank 11 includes a first tank body 111, and the support 116 includes a first part that separates the first tank body 111 in the heat insulation tank 11.
  • the partition wall 1161 and the second partition wall 1162, the quartz crystal oscillator 30 is arranged on the first tank 111 and fixedly connected with the first partition wall 1161 and the second partition wall 1162, the quartz crystal oscillator 30, the first tank 111
  • a first heat insulation cavity (not shown) is formed around the circuit board 10.
  • the first tank 111 is arranged directly opposite to the quartz crystal oscillator 30, the quartz crystal oscillator 30 is arranged on the first tank 111, and the quartz crystal oscillator 30 is directly facing the bottom edge of the circuit board 10 and the first partition wall. 1161 and the second partition wall 1162 are fixedly connected (that is, the outer edge of the notch of the first tank 111 is fixedly connected). At this time, the quartz crystal oscillator 30, the first tank 111 and the circuit board 10 are surrounded to form a first heat insulation The first heat-insulating cavity contains air to form a heat-insulating air layer.
  • the vertical heat exchange between the quartz crystal oscillator 30 and the external airflow needs to be conducted through the heat-insulating air layer in the first heat-insulating cavity .
  • the insulating air layer with smaller thermal conductivity replaces the circuit board 10 with larger thermal conductivity for heat conduction, which increases the vertical thermal resistance of the quartz crystal oscillator 30, thereby effectively reducing the impact of external airflow on the satellite timing device of this implementation.
  • the temperature influence of the quartz crystal oscillator 30 is beneficial to the improvement of the temperature stability and working accuracy of the quartz crystal oscillator 30.
  • the size of the first tank 111 can be individually modeled and designed by modeling and simulation software.
  • the design parameters of the first tank 111 are optimized by the modeling software, such as adjusting the size of the first tank 111.
  • the thermal conductivity of the heat insulation layer increases the thermal resistance between the quartz crystal oscillator 30 and the external environment, and improves the heat insulation and heat preservation effect of the first tank body 111 and the internal air heat insulation layer on the quartz crystal oscillator 30.
  • the heat insulation tank 11 further includes a second tank body 112
  • the support 116 further includes a second tank body 112 that separates the second tank body 112 in the heat insulation tank 11.
  • the three partition walls 1163 and the fourth partition wall 1164, the first tank body 111 has opposite first and second ends, and the second tank body 112 is disposed at the first end of the first tank body 111 and separated from the circuit board 10
  • One end extends to the other end, the middle of the second tank body 112 communicates with the first end of the first tank body 111, the end of the third partition wall 1163 facing the first tank body 111 and the first partition wall 1161 facing the second tank
  • the ends of the body 112 are connected, the end of the fourth partition wall 1164 facing the first tank body 111 is connected with the end of the second partition wall 1162 facing the second tank body 112, the upper cover 20, the second tank body 112 and the circuit board 10 is surrounded and formed with a second heat insulation cavity (not shown), the second heat insulation cavity
  • the circuit board 10 at one end of the quartz crystal oscillator 30 is set as a second heat-insulating cavity for the expansion of the heat-insulating air layer to further expand the insulation.
  • the coverage area of the hot air layer increases the thermal resistance on the peripheral side of the quartz crystal oscillator 30, especially increases the thermal resistance of the quartz crystal oscillator 30 for heat transfer along the length direction (or width direction) of the circuit board 10, and further reduces
  • the small quartz crystal oscillator 30 has the possibility of temperature changes due to external airflow, which improves the temperature stability of the quartz crystal oscillator 30.
  • the middle portion of the second tank body 112 may not communicate with the first tank body 111, that is, the third partition wall 1163 is directly facing the end of the first tank body 111. It is connected to the end of the fourth partition wall 1164 facing the first groove body 111. At this time, the third groove body 113 and the first groove body 111 are independently arranged.
  • the heat insulation tank 11 further includes a third tank body 113
  • the support 116 further includes a fifth partition wall 1165 and a sixth partition wall 1165 that separates the third tank body 113 in the heat insulation tank 11
  • the partition wall 1166, the third groove body 113 is arranged at the second end of the first groove body 111 and also has opposite first and second ends; the first end of the third groove body 113 is connected to the first groove body 111 The second end is connected, the end of the fifth partition wall 1165 facing the first tank 111 is connected with the end of the first partition 1161 facing the third tank 113, and the sixth partition 1166 is facing the end of the first tank 111 Part is connected to the end of the second partition wall 1162 facing the third tank body 113, the second end of the third tank body 113 extends in the direction away from the first tank body 111, the upper cover 20, the third tank body 113 and the circuit board 10 is surrounded and formed with a third heat insulation chamber (not shown), which can contain air and form
  • a third tank body 113 communicating with the first tank body 111 is also provided at the other end of the quartz crystal oscillator 30.
  • the coverage area of the insulating air layer can be further expanded.
  • the first end of the third tank body 113 may not communicate with the second end of the first tank body 111.
  • the third tank body 113 and the second end A tank 111 is arranged independently of each other.
  • the dimensions of the second tank body 112 and the third tank body 113 can also be modeled and designed by combining the design parameters of the first tank body 111 with modeling simulation software.
  • the second tank body can be optimized by the modeling software.
  • 112 and the design parameters of the third tank 113 so as to adjust and optimize the thermal insulation parameters of the air insulation layer on the peripheral side of the quartz crystal oscillator 30, reduce the thermal conductivity of the air insulation layer in the horizontal direction, and further increase
  • the large thermal resistance between the quartz crystal oscillator 30 and the external environment can improve the heat insulation and heat preservation effects of the second tank body 112, the third tank body 113 and the internal air insulation layer on the quartz crystal oscillator 30.
  • the heat insulation tank 11 further includes a fourth tank body 114 and a fifth tank body 115 respectively disposed on both sides of the first tank body 111, a third partition wall 1163, and a first partition wall.
  • the partition wall 1161 and the fifth partition wall 1165 are sequentially connected in the heat insulation tank 11 to separate the fourth tank body 114, and the fourth partition wall 1164, the second partition wall 1162 and the sixth partition wall 1166 are sequentially connected in the heat insulation tank 11 to partition Out of the fifth tank 115, the upper cover 20, the fourth tank 114 and the circuit board 10 are surrounded to form a fourth heat insulation cavity (not shown), and the upper cover 20, the fifth tank 115 and the circuit board are surrounded to form a Five heat insulation chambers (not shown), the fourth heat insulation chamber and the fifth heat insulation chamber can contain air and form a heat insulation air layer.
  • the design parameters of the fourth tank body 114 and the fifth tank body 115 can also be optimized by combining the design parameters of the first tank body 111, the second tank body 112, and the third tank body 113 through modeling and simulation software. Provide an optimal thermal resistance value and minimize the influence of external airflow on the quartz crystal oscillator 30, and maintain the temperature stability of the quartz crystal oscillator 30.
  • the fourth heat insulation cavity and the fifth heat insulation cavity may also be connected to at least one of the first heat insulation cavity, the second heat insulation cavity, or the third heat insulation cavity, respectively.
  • One is connected.
  • the insulating air layer extends from the first insulating cavity (the second insulating cavity or the third insulating cavity) to the fourth insulating cavity and the fifth insulating cavity respectively.
  • the upper surface of the first partition wall 1161 facing the upper cover and the upper surface of the second partition wall 1162 facing the upper cover 20 are both provided with welding
  • the disk 40, the quartz crystal oscillator 30 and the bonding pad 40 are welded and fixed, so that the quartz crystal oscillator 30 is fixed on the circuit board 10.
  • the number of pads 40 is at least two, and there are at least two pads 40 respectively disposed on the first partition wall 1161 and the second partition wall 1162, that is, one pad 40 is disposed near the first tank 111
  • the outer edge of the notch of the fourth tank body 114, and the other pad 40 is arranged on the outer edge of the notch of the first tank body 111 close to the fifth tank body 115, so that the opposite sides of the quartz crystal oscillator 30 pass through one
  • the bonding pad 40 is welded to the edge of the notch of the first tank body 111, so that the quartz crystal oscillator 30 is stably covered on the first tank body 111, and the air heat insulation layer can give full play to the heat insulation of the quartz crystal oscillator 30 effect.
  • the number of pads is four, wherein two pads 40 are provided on the first partition wall 1161, and the other two pads 40 are provided on the second partition wall. 1162, that is, two of the four pads 40 are arranged on the outer edge of the first groove body 111 near the groove of the fourth groove body 114, and the other two are arranged on the groove of the first groove body 111 near the fifth groove body 115
  • the outer edge of the mouth in this way, the four corners of the bottom of the quartz crystal oscillator 30 are welded to the edge of the notch of the first tank 111 through a bonding pad 40, so as to better improve the installation stability of the quartz crystal oscillator 30.
  • the satellite timing device further includes at least two connecting wires 50 for electrically connecting the quartz crystal oscillator 30 and the circuit board 10, and there are at least two connecting wires 50.
  • the first end of each connecting wire 50 is respectively welded to at least two pads 40, and the second end of each connecting wire 50 is respectively along the third partition wall 1163, the fourth partition wall 1164, the fifth partition wall 1165 or the sixth partition.
  • the partition wall 1166 is extended.
  • the aforementioned connecting wire 50 is a copper wire with a relatively small cross-sectional area and a relatively long length.
  • the thermal resistance is relatively small.
  • Layer structure thermal resistance formula R ⁇ /( ⁇ A) (where R is the thermal resistance value (k/w), ⁇ is the material layer thickness of the heat transfer path (m), and ⁇ is the thermal conductivity of the material [W/(m ⁇ K)], A is the cross-sectional area of the material perpendicular to the heat transfer path (m ⁇ 2)).
  • the design parameters of the connecting wire 50 can also be optimized through modeling and simulation software to select the optimal length, cross-sectional area, and shape of the connecting wire 50 to balance the thermal conductivity and parasitics of the connecting wire 50.
  • Design parameters such as inductance, DC resistance, and actual production of the circuit board 10 provide an optimal value of the thermal resistance of the connecting wire 50.
  • the number of connecting wires 50 described above is less than or equal to the number of pads 40.
  • one pad 40 corresponds to one connecting wire 50, that is, the first end of each connecting wire 50 is connected to each
  • the pads 40 are soldered in one-to-one correspondence; and when the number of connecting wires 50 is less than the number of pads 40, the pads 40 not connected to the connecting wires 50 are only used for welding and fixing the quartz crystal oscillator 30.
  • the number of pads 40 is preferably four
  • the number of connecting wires 50 is preferably set to four correspondingly
  • the first ends of the four connecting wires 50 are connected to the four pads 40 one by one.
  • the second ends of the four connecting wires 50 respectively extend along the third partition wall 1163, the fourth partition wall 1164, the fifth partition wall 1165 or the sixth partition wall 1166, so as to ensure the stable connection of the quartz crystal oscillator 30 .
  • the heat insulation groove 11 is preferably a deep groove made on the circuit board 10 by a method of controlled depth milling.
  • the heat-insulating groove 11 of this embodiment is processed on the circuit board 10 by using the controlled depth milling groove technology to ensure the processing accuracy of the heat-insulating groove 11, and the controlled depth milling groove technology is used for processing, and the circuit board will not be damaged during processing.
  • the structural integrity of the surface of the circuit board 10 away from the quartz crystal oscillator 30 does not allow the heat insulation groove 11 to penetrate the entire circuit board 10, which can ensure the integrity of the outer surface of the circuit board 10 away from the quartz crystal oscillator 30.
  • the present embodiment adopts the controlled depth milling groove processing technology to mill the above-mentioned first groove body 111, second groove body 112, third groove body 113, and the circuit board 10 respectively.
  • the fourth groove body 114 and the fifth groove body 115 form the aforementioned support 116 on the circuit board 12.
  • the upper cover 20 is welded to the circuit board 10, or the upper cover 20 and the circuit board 10 are connected by fasteners; the upper cover 20 is arranged to cover On the circuit board 10, the quartz crystal oscillator 30 is installed in the mounting cavity formed by the upper cover 20 and the circuit board 10 to protect the quartz crystal oscillator 30 and reduce the temperature of the quartz crystal oscillator 30 caused by the external air flow. influences.
  • a gap with a smaller height is formed between the upper cover 20 and the quartz crystal oscillator 30, that is, the distance between the upper cover 20 and the quartz crystal oscillator 30
  • the distance is relatively small, in order to minimize the air in the entire installation cavity, especially the air in the heat insulation tank 11, through the gap for convection, so as to better ensure the thin insulation air layer in the heat insulation tank 11 The thermal insulation effect.

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Abstract

一种卫星授时装置，其包括电路板（10）、上盖（20）和石英晶体振荡器（30），上盖（20）盖合于电路板（10）上并与电路板（10）围设形成安装空腔，电路板（10）的表面设有隔热槽（11），隔热槽（11）中设置有支撑件（116），石英晶体振荡器（30）固定于支撑件（116）上并位于安装空腔内，石英晶体振荡器（30）与隔热槽（11）的槽底之间形成有隔热空气层。通过在电路板（10）上开设隔热槽（11），使隔热槽（11）内的隔热空气层代替电路板（10）进行热量传递和传导，由于空气的导热系数小于电路板（10）的导热系数，石英晶体振荡器（30）与外界环境之间进行热量交换的热阻变大，从而能够减小外界气流对石英晶体振荡器（30）温度的影响，提高石英晶体振荡器（30）的温度稳定性。

Description

卫星授时装置 技术领域
本发明属于通讯产品技术领域，尤其涉及一种卫星授时装置。
背景技术
随着计算机网络的迅猛发展，网络应用已经非常普遍，而网络系统对时间同步的精确度需求也越来越高，如电力、金融、通信、交通、国防等领域的网络系统需要在大范围内保持计算机的时间同步性和时间准确性。众所周知，利用GPS、北斗等GNSS无线卫星信号能够实现全天候、全时段以及高精度的授时作业，能够使不同设备之间的时间高度统一，授时精度高达几十纳秒。
基于上述卫星授时原理的授时装置，其正常运行授时离不开装置内部的内部时钟源；内部时钟源的高精度运行则主要与其内部提供时钟信号的石英晶体振荡器(简称晶振)密切相关。一般地，内部时钟源常使用的晶振包括普通有源晶振、温补晶振、压控晶振以及恒温晶振等，由于这些内部时钟源都是电子式的，其工作的稳定性和准确性或多或少都会受到环境温度的影响。
现有技术中，常使用温补晶振、压控晶振或者恒温晶振来避免或减小外界环境温度对授时装置的影响，其中，恒温晶振稳定性高，但体积庞大且价格相对较高；压控晶振需要额外的闭环控制系统来控制，稳定度依赖于闭环控制系统；温补晶振体积小，价格相对较低，稳定性较高，常用于导航定位设备的温补晶振的典型频率温度特性是±0.5ppm，但对于授时装置来说，其频率温度稳定性仍稍显不足。
发明内容
本发明的目的在于提供一种卫星授时装置，旨在解决现有技术中的卫星授时装置内的石英晶体振荡器的温度易受外界气流及外界环境温度影响的技术问题。
为实现上述目的，本发明采用的技术方案是：一种卫星授时装置，包括电路板、上盖和石英晶体振荡器，上盖盖合于电路板上并与电路板围设形成安装空腔，电路板朝向上盖的表面设有位于上盖正投影内的隔热槽，隔热槽中设置有支撑件，石英晶体振荡器固定于支撑件上并位于安装空腔内，且石英晶体与隔热槽的槽底之间形成有隔热空气层。
进一步地，隔热槽包括第一槽体，支撑件包括于隔热槽内分隔出第一槽体的第一分隔壁和第二分隔壁，石英晶体振荡器盖设于第一槽体上并与第一分隔壁和第二分隔壁固定连接，石英晶体振荡器、第一槽体和电路板围设形成有第一隔热腔。
进一步地，隔热槽还包括第二槽体，支撑件还包括于隔热槽内分隔出第二槽体的第三分隔壁和第四分隔壁，第一槽体具有相对设置的第一端和第二端，第二槽体设置于第一槽体的第一端并从电路板的一端延伸至另一端，第二槽体的中部与第一槽体的第一端相连通，第三分隔壁朝向第一槽体的端部与第一分隔壁朝向第二槽体的端部相连，第四分隔壁朝向第一槽体的端部与第二分隔壁朝向第二槽体的端部相连，上盖、第二槽体和电路板围设形成有第二隔热腔。
进一步地，隔热槽还包括第三槽体，支撑件还包括于隔热槽内分隔出第三槽体的第五分隔壁和第六分隔壁，第三槽体设置于第一槽体的第二端且具有相对设置的第一端和第二端；第三槽体的第一端与第一槽体的第二端相连通，第五分隔壁朝向第一槽体的端部与第一分隔壁朝向第三槽体的端部相连，第六分隔壁朝向第一槽体的端部与第二分隔壁朝向第三槽体的端部相连，第三槽体的第二端朝背离第一槽体的方向延伸，上盖、第三槽体和电路板围设形成有第三隔热腔。
进一步地，隔热槽还包括分别设置于第一槽体两侧的第四槽体和第五槽体， 第三分隔壁、第一分隔壁和第五分隔壁依次相连于隔热槽内分隔出第四槽体，第四分隔壁、第二分隔壁和第六分隔壁依次相连于隔热槽内分隔出第五槽体，上盖、第四槽体和电路板围设形成第四隔热腔，上盖、第五槽体和电路板围设形成第五隔热腔。
进一步地，第一分隔壁正对上盖的上表面和第二分隔壁正对上盖的上表面均设置有焊盘，石英晶体振荡器与焊盘焊接固定。
进一步地，焊盘的数量至少为两个，且至少有两个所述焊盘分别设置于所述第一分隔壁和所述第二分隔壁上。
进一步地，卫星授时装置还包括至少两根用于电性连接石英晶体振荡器与电路板的连接导线，且至少有两根连接导线的第一端分别与至少两个焊盘对应焊接，各连接导线的第二端分别沿第三分隔壁、第四分隔壁、第五分隔壁或第六分隔壁延伸设置。
进一步地，隔热槽为于电路板上采用控深铣槽方法制成的深凹槽。
进一步地，上盖与电路板焊接，或者，上盖与电路板通过紧固件连接。
本发明的有益效果：本发明的卫星授时装置，其用于安装石英晶体振荡器的电路板上开设有隔热槽，隔热槽内设置有支撑件，石英晶体振荡器固定于支撑件上并被收容于安装空腔内，此时，石英晶体振荡器与电路板之间能够形成隔热空气层，即相当于在石英晶体振荡器与电路板之间设置了一层保温层。这样，通过在电路板上开设隔热槽，使隔热槽内的隔热空气层代替电路板进行热量传递和传导，由于空气的导热系数小于电路板的导热系数，如此，石英晶体振荡器与外界环境之间进行热量交换的热阻变大，此时，相较于直接通过电路板进行热量传递，设置隔热槽并构建隔热空气层后，石英晶体振荡器与外界环境之间热交换阻力变大，热交换速度降低，从而能够减小外界气流对安装空腔内石英晶体振荡器的温度的影响，有效的提高石英晶体振荡器的温度稳定性，提升石英晶体振荡器工作准确性。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的卫星授时装置的结构示意图；
图2为本发明实施例提供的卫星授时装置的分解视图；
图3为本发明实施例提供的卫星授时装置的电路板的结构示意图；
图4为本发明实施例提供的卫星授时装置的电路板上的支撑件的结构示意图。
其中，图中各附图标记：
10—电路板             11—隔热槽             20—上盖
30—石英晶体振荡器     40—焊盘               50—连接导线
111—第一槽体          112—第二槽体          113—第三槽体
114—第四槽体          115—第五槽体          116—支撑件
1161—第一分隔壁       1162—第二分隔壁       1163—第三分隔壁
1164—第四分隔壁       1165—第五分隔壁       1166—第六分隔壁。
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图1～4描述的实施例是示例性的，旨在用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，需要理解的是，术语“长度”、“宽度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化 描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
如图1～4所示，本发明的一实施例提供了一种卫星授时装置，包括电路板10、上盖20和石英晶体振荡器30，其中，电路板10为PCB板，其与石英晶体振荡器30电性连接，且两者之间能够进行电信号如时钟信号等的传递，上盖20用于保护电路板10上的如石英晶体振荡器30等的电子元件。具体地，上盖20盖合于电路板10上并与电路板10围设形成安装空腔(图未示)，电路板10朝向上盖20的表面设有位于上盖20正投影内的隔热槽11，隔热槽11中设置有支撑件116，石英晶体振荡器30固定于支撑件116上并位于安装空腔内，且石英晶体振荡器30与隔热槽11的槽底之间形成有隔热空气层(图未示)。
本发明实施例的卫星授时装置，其用于安装石英晶体振荡器30的电路板10上开设有隔热槽11，隔热槽内设置有支撑件116，石英晶体振荡器30固定于支撑件116上并被收容于安装空腔内，此时，石英晶体振荡器30与电路板10之间能够形成隔热空气层，即相当于在石英晶体振荡器30与电路板10之间设置了一层保温层。这样，通过在电路板10上开设隔热槽11，使隔热槽11内的隔热空气层代替电路板10进行热量传递和传导，由于空气的导热系数远小于电路 板10的导热系数(前者的导热系数小于或仅为后者导热系数的十分之一)，如此，石英晶体振荡器30与外界环境之间进行热量交换的热阻变大，此时，相较于直接通过电路板10进行热量传递，设置隔热槽11并构建隔热空气层后，石英晶体振荡器30与外界环境之间热交换阻力变大，热交换速度降低，从而能够减小外界气流对安装空腔内石英晶体振荡器30的温度的影响，有效的提高石英晶体振荡器30的温度稳定性，提升石英晶体振荡器30工作准确性。如此，通过在电路板1上开设隔热槽11，当授时装置的内部时钟源采用普通有源晶振时，隔热槽11能够提高普通有源晶振抵抗外界气流及温度影响的能力，从而提高其工作稳定性，而当授时装置的内部时钟源采用温补晶振、压控晶振或恒温晶振时，隔热槽11则能够与温补晶振或恒温晶振相配合，进一步地提高其工作稳定性。
具体地，上述的石英晶体振荡器30为普通有源晶振、温补晶振、压控晶振或者恒温晶振中的任意一种，使用时可以根据实际情况进行选用，此处不做唯一限定。
优选地，上述隔热槽11的尺寸大小可以通过建模仿真软件进行单独的建模设计，如此，通过建模软件优化隔热槽11的各项设计参数，如调整隔热槽11的槽体形状以及开槽深度等，从而调整和优化隔热槽11内部形成的空气隔热层的隔热参数，减小空气隔热层的导热系数，增大石英晶体振荡器30与外界环境之间的热阻，提高隔热槽11及其空气隔热层对石英晶体振荡器30的隔热和保温效果。
在本发明的另一实施例中，如图2～4所示，隔热槽11包括第一槽体111，支撑件116包括于隔热槽11内分隔出第一槽体111的第一分隔壁1161和第二分隔壁1162，石英晶体振荡器30盖设于第一槽体111上并与第一分隔壁1161和第二分隔壁1162固定连接，石英晶体振荡器30、第一槽体111和电路板10围设形成有第一隔热腔(图未示)。
具体地，第一槽体111正对石英晶体振荡器30设置，石英晶体振荡器30 盖设于第一槽体111上，石英晶体振荡器30正对电路板10的底部边缘与第一分隔壁1161和第二分隔壁1162固定连接(即第一槽体111槽口的外边缘固定连接)，此时，石英晶体振荡器30、第一槽体111和电路板10围设形成第一隔热腔，第一隔热腔内容置空气以形成隔热空气层，如此，石英晶体振荡器30与外界气流沿竖直方向上的热量交换需经过第一隔热腔内的隔热空气层进行传导，导热系数较小的隔热空气层代替导热系数较大的电路板10进行热量传导，使石英晶体振荡器30的竖向导热阻力增大，从而有效减小外界气流对本实施的卫星授时装置内的石英晶体振荡器30的温度影响，有利于石英晶体振荡器30的温度稳定性及工作准确性的提高。
优选地，第一槽体111的尺寸大小可以通过建模仿真软件进行单独的建模设计，如此，通过建模软件优化第一槽体111的各项设计参数，如调整第一槽体111的槽体形状以及开槽深度等，从而调整和优化第一隔热腔的腔体形状及尺寸大小、优化第一隔热腔内的空气隔热层的隔热参数，减小竖直方向上空气隔热层的导热系数，增大石英晶体振荡器30与外界环境之间的热阻，提高第一槽体111及其内部空气隔热层对石英晶体振荡器30的隔热和保温效果。
在本发明的另一实施例中，如图2～4所示，隔热槽11还包括第二槽体112，支撑件116还包括于隔热槽11内分隔出第二槽体112的第三分隔壁1163和第四分隔壁1164，第一槽体111具有相对设置的第一端和第二端，第二槽体112设置于第一槽体111的第一端并从电路板10的一端延伸至另一端，第二槽体112的中部与第一槽体111的第一端相连通，第三分隔壁1163朝向第一槽体111的端部与第一分隔壁1161朝向第二槽体112的端部相连，第四分隔壁1164朝向第一槽体111的端部与第二分隔壁1162朝向第二槽体112的端部相连，上盖20、第二槽体112和电路板10围设形成有第二隔热腔(图未示)，第二隔热腔能容置空气并形成隔热空气层，或者，第二隔热腔与第一隔热腔相连通，隔热空气层从第一隔热腔延展至第二隔热腔内。如此，通过设置与第一槽体111连通的第二槽体112，将石英晶体振荡器30一端的电路板10设置成可供隔热空气层延 展的第二隔热腔，以进一步的扩展隔热空气层的覆盖面积，增大石英晶体振荡器30周侧的热阻，尤其是增加了石英晶体振荡器30沿电路板10的长度方向(或者宽度方向)进行热传递的热阻，进一步减小石英晶体振荡器30受外界气流而产生温度变化的可能性，提高石英晶体振荡器30的温度稳定性。
需要说明的是，在本发明的一些其它实施例中，第二槽体112的中部也可以不与第一槽体111相连通，即第三分隔壁1163朝向第一槽体111的端部直接与第四分隔壁1164朝向第一槽体111的端部相连，此时，第三槽体113和第一槽体111彼此独立设置。
进一步地，如图2～4所示，隔热槽11还包括第三槽体113，支撑件116还包括于隔热槽11内分隔出第三槽体113的第五分隔壁1165和第六分隔壁1166，第三槽体113设置于第一槽体111的第二端且同样具有相对设置的第一端和第二端；第三槽体113的第一端与第一槽体111的第二端相连通，第五分隔壁1165朝向第一槽体111的端部与第一分隔壁1161朝向第三槽体113的端部相连，第六分隔壁1166朝向第一槽体111的端部与第二分隔壁1162朝向第三槽体113的端部相连，第三槽体113的第二端朝背离第一槽体111的方向延伸，上盖20、第三槽体113和电路板10围设形成有第三隔热腔(图未示)，第三隔热腔能容置空气并形成隔热空气层，或者，第三隔热腔也与第一隔热腔相连通，隔热空气层同样能从第一隔热腔延展至第三隔热腔内。即在石英晶体振荡器30的另一端同样设置与第一槽体111连通的第三槽体113，如此，在第二槽体112的基础上，能够更进一步的扩展隔热空气层的覆盖面积，增大石英晶体振荡器30周侧的热阻，尤其是增加了石英晶体振荡器30沿横向进行热传递的热阻，以更进一步减小石英晶体振荡器30受外界气流而产生温度变化的可能性，提高石英晶体振荡器30的温度稳定性。
需要说明的是，在本发明的一些其它实施例中，第三槽体113的第一端也可以不与第一槽体111的第二端相连通，此时，第三槽体113和第一槽体111彼此独立设置。
优选地，上述第二槽体112和第三槽体113的尺寸大小同样可以通过建模仿真软件结合第一槽体111的设计参数进行建模设计，如此，通过建模软件优化第二槽体112和第三槽体113的各项设计参数，从而调整和优化石英晶体振荡器30周侧的空气隔热层的隔热参数，减小水平方向上空气隔热层的导热系数，进一步地增大石英晶体振荡器30与外界环境之间的热阻，以提高第二槽体112、第三槽体113及其内部空气隔热层对石英晶体振荡器30的隔热和保温效果。
更进一步地，如图2～4所示，隔热槽11还包括分别设置于第一槽体111两侧的第四槽体114和第五槽体115，第三分隔壁1163、第一分隔壁1161和第五分隔壁1165依次相连于隔热槽11内分隔出第四槽体114，第四分隔壁1164、第二分隔壁1162和第六分隔壁1166依次相连于隔热槽11内分隔出第五槽体115，上盖20、第四槽体114和电路板10围设形成第四隔热腔(图未示)，上盖20、第五槽体115和电路板围设形成第五隔热腔(图未示)，第四隔热腔和第五隔热腔均能容置空气并形成隔热空气层。这样，通过设置第四槽体114和第五槽体115，能够更进一步地的拓展空气隔热层的覆盖面积，增加石英晶体振荡器30周侧的热阻，更好的提高隔热槽11及其内部空气隔热层对石英晶体振荡器30的保温作用。并且，对第四槽体114和第五槽体115的设计参数同样可以通过建模仿真软件结合第一槽体111、第二槽体112以及第三槽体113的设计参数进行优化设计，以提供最优的热阻值并最大限度的减小外界气流对石英晶体振荡器30的影响，维持石英晶体振荡器30的温度稳定性。
需要说明的是，在本发明的一些其它实施例中，第四隔热腔和第五隔热腔也可以分别与第一隔热腔、第二隔热腔或第三隔热腔中的至少一个相连通，此时，隔热空气层从第一隔热腔(第二隔热腔或者第三隔热腔)分别延展至第四隔热腔和第五隔热腔内。
在本发明的另一实施例中，如图2和图3所示，且第一分隔壁1161正对上盖的上表面和第二分隔壁1162正对上盖20的上表面均设置有焊盘40，石英晶体振荡器30与焊盘40焊接固定，从而将石英晶体振荡器30固定于电路板10 上。
优选地，焊盘40的数量至少为两个，且至少有两个焊盘40分别设置于第一分隔壁1161和第二分隔壁1162上，即一个焊盘40设置于第一槽体111靠近第四槽体114的槽口外边缘，另一焊盘40则设置于第一槽体111靠近第五槽体115的槽口外边缘，如此，石英晶体振荡器30的相对的两侧边各通过一个焊盘40与第一槽体111的槽口边缘焊接，从而使石英晶体振荡器30稳定的盖设于第一槽体111上，充分发挥空气隔热层对石英晶体振荡器30的隔热保温作用。
更优选地，在本实施例中，如图2所示，焊盘的数量为四个，其中，两焊盘40设置于第一分隔壁1161上，另外两焊盘40设置于第二分隔壁1162上，即四个焊盘40中的两个设置于第一槽体111靠近第四槽体114的槽口外边缘，另外两个则设置于第一槽体111靠近第五槽体115的槽口外边缘，如此，石英晶体振荡器30的底部四角各通过一个焊盘40与第一槽体111的槽口边缘焊接，以更好的提高石英晶体振荡器30的安装稳定性。
在本发明的另一实施例中，如图2和图3所示，卫星授时装置还包括至少两根用于电性连接石英晶体振荡器30与电路板10的连接导线50，且至少有两根连接导线50的第一端分别与至少两个焊盘40对应焊接，各连接导线50的第二端分别沿第三分隔壁1163、第四分隔壁1164、第五分隔壁1165或第六分隔壁1166延伸设置。
优选地，上述的连接导线50为横截面积相对较小且长度相对较长的铜导线。一般地，由于铜的导热系数相对较大，热阻相对较小，然而，为了保证石英晶体振荡器30的温度稳定性，需要尽可能的增大连接导线50的热阻；具体地，根据单层结构热阻公式R＝δ/(λA)(式中，R是热阻值(k/w)，δ是传热路径的材料层厚度(m)，λ是材料导热系数[W/(m·k)]，A是垂直于传热路径的材料横截面积(m^2))，据此可以看出，减小连接导线50的横截面积，同时增加连接导线50的长度，能够增大连接导线50的热阻。因此，本实施例选用横截面积较小、长度较长的铜导线作为连接导线50，以此来增大连接导线50的热阻。
优选地，连接导线50的各项设计参数同样可以通过建模仿真软件进行优化设计，以选择最优的连接导线50的长度、横截面积以及形状等，来平衡连接导线50的导热系数、寄生电感、直流电阻以及电路板10实际制作情况等设计参数，从而提供连接导线50的热阻最优值。
具体地，上述连接导线50的设置数量小于或者等于焊盘40的设置数量当两者设置数量相同时，一个焊盘40对应连接一根连接导线50，即各连接导线50的第一端与各焊盘40一一对应焊接；而当连接导线50的设置数量少于焊盘的40的设置数量时，未与连接导线50相连的焊盘40仅用于石英晶体振荡器30的焊接固定。
优选地，如图2所示，焊盘40的数量优选为4个，连接导线50的数量对应优选设置为四根，且四根连接导线50的第一端分别与四个焊盘40一一对应焊接，四个连接导线50的第二端分别沿第三分隔壁1163、第四分隔壁1164、第五分隔壁1165或第六分隔壁1166延伸设置，从而确保石英晶体振荡器30的稳定连接。
在本发明的另一实施例中，如图2～4所示，隔热槽11优选为于电路板10上采用控深铣槽方法制成的深凹槽。采用控深铣槽技术于电路板10上加工成型本实施例的隔热槽11，能够确保隔热槽11的加工精度，并且，使用控深铣槽技术进行加工，加工时不会破坏电路板10的背离石英晶体振荡器30的表面的结构完整性，不会使隔热槽11贯穿整个电路板10，能够确保电路板10背离石英晶体振荡器30的外表面的完整性。
具体地，如图3和图4所示，本实施例采用控深铣槽加工技术于电路板10上分别铣出上述的第一槽体111、第二槽体112、第三槽体113、第四槽体114和第五槽体115，并于电路板12上形成上述的支撑件116。
在本发明的另一实施例中，如图1和图2所示，上盖20与电路板10焊接，或者，上盖20与电路板10通过紧固件连接；设置上盖20盖设于电路板10上，并将石英晶体振荡器30安装在上盖20与电路板10围设形成的安装空腔内，以 保护石英晶体振荡器30，减小外界气流对石英晶体振荡器30温度的影响。
优选地，当上盖20盖设于电路板10上时，上盖20与石英晶体振荡器30之间形成有高度尺寸较小的空隙，即上盖20与石英晶体振荡器30之间的间隔距离相对较小，以尽可能的减小整个安装空腔内的空气尤其是隔热槽11内的空气通过该空隙进行对流，从而更好的保证隔热槽11内的薄层隔热空气层的隔热效果。
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种卫星授时装置，其特征在于：包括电路板、上盖和石英晶体振荡器，所述上盖盖合于所述电路板上并与所述电路板围设形成安装空腔，所述电路板朝向所述上盖的表面设有位于所述上盖正投影内的隔热槽，所述隔热槽中设置有支撑件，所述石英晶体振荡器固定于所述支撑件上并位于所述安装空腔内，所述石英晶体振荡器与所述隔热槽的槽底之间形成有隔热空气层。
  2. 根据权利要求1所述的卫星授时装置，其特征在于：所述隔热槽包括第一槽体，所述支撑件包括于所述隔热槽内分隔出所述第一槽体的第一分隔壁和第二分隔壁，所述石英晶体振荡器盖设于所述第一槽体上并与所述第一分隔壁和所述第二分隔壁固定连接，所述石英晶体振荡器、所述第一槽体和所述电路板围设形成有第一隔热腔。
  3. 根据权利要求2所述的卫星授时装置，其特征在于：所述隔热槽还包括第二槽体，所述支撑件还包括于所述隔热槽内分隔出所述第二槽体的第三分隔壁和第四分隔壁；所述第一槽体具有相对设置的第一端和第二端，所述第二槽体设置于所述第一槽体的第一端并从所述电路板的一端延伸至另一端，所述第二槽体的中部与所述第一槽体的第一端相连通，所述第三分隔壁朝向所述第一槽体的端部与所述第一分隔壁朝向所述第二槽体的端部相连，所述第四分隔壁朝向所述第一槽体的端部与所述第二分隔壁朝向所述第二槽体的端部相连；所述上盖、所述第二槽体和所述电路板围设形成有第二隔热腔。
  4. 根据权利要求3所述的卫星授时装置，其特征在于：所述隔热槽还包括第三槽体，所述支撑件还包括于所述隔热槽内分隔出所述第三槽体的第五分隔壁和第六分隔壁，所述第三槽体设置于所述第一槽体的第二端且具有相对设置的第一端和第二端；所述第三槽体的第一端与所述第一槽体的第二端相连通，所述第五分隔壁朝向所述第一槽体的端部与所述第一分隔壁朝向所述第三槽体的端部相连，所述第六分隔壁朝向所述第一槽体的端部与所述第二分隔壁朝向 所述第三槽体的端部相连，所述第三槽体的第二端朝背离所述第一槽体的方向延伸；所述上盖、所述第三槽体和所述电路板围设形成有第三隔热腔。
  5. 根据权利要求4所述的卫星授时装置，其特征在于：所述隔热槽还包括分别设置于所述第一槽体两侧的第四槽体和第五槽体，所述第三分隔壁、所述第一分隔壁和所述第五分隔壁依次相连于所述隔热槽内分隔出所述第四槽体，所述第四分隔壁、所述第二分隔壁和所述第六分隔壁依次相连于所述隔热槽内分隔出所述第五槽体，所述上盖、所述第四槽体和所述电路板围设形成第四隔热腔，所述上盖、所述第五槽体和所述电路板围设形成第五隔热腔。
  6. 根据权利要求5所述的卫星授时装置，其特征在于：所述第一分隔壁正对所述上盖的上表面和所述第二分隔壁正对所述上盖的上表面均设置有焊盘，所述石英晶体振荡器与所述焊盘焊接固定。
  7. 根据权利要求6所述的卫星授时装置，其特征在于：所述焊盘的数量至少为两个，且至少有两个所述焊盘分别设置于所述第一分隔壁和所述第二分隔壁上。
  8. 根据权利要求7所述的卫星授时装置，其特征在于：所述卫星授时装置还包括至少两根用于电性连接所述石英晶体振荡器与所述电路板的连接导线，且至少有两根所述连接导线的第一端分别与至少两个所述焊盘对应焊接，各所述连接导线的第二端分别沿所述第三分隔壁、所述第四分隔壁、所述第五分隔壁或所述第六分隔壁延伸设置。
  9. 根据权利要求1～8任一项所述的卫星授时装置，其特征在于：所述隔热槽为于所述电路板上采用控深铣槽方法制成的深凹槽。
  10. 根据权利要求1～8任一项所述的卫星授时装置，其特征在于：所述上盖与所述电路板焊接，或者，所述上盖与所述电路板通过紧固件连接。
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