WO2020163939A1

WO2020163939A1 - Transportable datacenter

Info

Publication number: WO2020163939A1
Application number: PCT/CA2019/050998
Authority: WO
Inventors: Scot Arthur Johnson
Original assignee: Scot Arthur Johnson
Priority date: 2019-02-15
Filing date: 2019-07-19
Publication date: 2020-08-20
Also published as: CA3048706A1

Abstract

Several transportable datacenters are described. The transportable datacenters include transport systems allowing them to be transported between an assembly location and an operating location. The transportable datacenters also include a ventilation system for cooling processor positioned in racks in the datacenters. The ventilation system draws cold air from the environment, through processor bays containing the processors and then exhausts the air back to the environment.

Description

TRANSPORTABLE DATACENTER

Field

[1] The described embodiments relates to transportable datacenters.

Background

[2] Many datacenter facilities have very high power requirements and can require substantial cooling to maintain computing equipment within its acceptable operating conditions. It can be advantageous to locate such datacenter facilities in

geographical location with relatively low-cost electrical power, cold ambient air temperatures, or a combination of both. In a datacenter, electrical power is used for two things: to power the many microprocessors within, and to drive cooling of the microprocessors to maintain a safe operating temperature.

[3] Active cooling (i.e. using a chiller, condenser, pump, cooling towers, etc.) is one commonly used option for cooling the datacenter. This approach has drawbacks however, including high electrical power requirements, high equipment costs, and high maintenance costs.

[4] The economics of data processing on a large scale often vary considerably based on the availability of low-cost power. Cold ambient air is desirable as an input to reduce electrical power consumption for cooling. The opportunity to exhaust heated air into the atmosphere is also desirable.

[5] Conventional datacenter design has drawbacks that inhibit such designs from use in transportable datacenter facilities. For example, conventional datacenter design generally involves air intake from fans or an air conditioning unit via a raised floor having gratings generally in front each rack in the cold air plenum, and air exhausted upwards and into a return air plenum in the ceiling. Such a design itself presents numerous challenges for use in transportable datacenter facilities. For example, access to the server racks in the datacenter requires operator access to the cold air plenum directly in front of the processors in the rack, and operator access to the hot air plenum directly behind the processors in the rack. The requirements for operator access in datacenters having a cold air plenum beneath the raised floor and the hot air plenum above the server racks mean that frequently the cold air plenum and the warm plenum do not have barriers defining the plenums as between different racks. It is desirable to provide a more practical design for cooling a transportable datacenter.

[6] The location of low-cost power and cold ambient air is often distant from population centers and areas of industrial manufacturing, making the utilization of the low-cost power and cold ambient air difficult. It is desirable to provide transportable datacenter facilities that can be manufactured in convenient manufacturing facilities and then transported to appropriate locations where they can more efficiently be put into operation.

[7]

Summary

[8] In accordance with aspects of this invention, there are transportable datacenters and methods of assembling transportable data centers to address the above problems.

[9] In a first aspect, some embodiments of the invention provide a transportable datacenter comprising: a housing having air intake openings from for receiving air from an external environment and air exhaust openings for exhausting air to the external environment; a plurality of racks, each rack having a plurality of processor bays, each processor bay having a front face and a rear face; an electric power system for providing electric power at each processor bay; a data network for providing data communications at each processor bay; a cold air plenum between the air intake openings the front faces of the processor bays; at least one hot air plenum between the rear faces of the processor bays and the air exhaust opening, wherein the hot air plenum is substantially fluidically isolated from the cold air plenum; a ventilation system to draw air progressively through the air intake openings, the cold air plenum, the processor bays, the hot air plenum and the air exhaust openings; and a transport system for transporting the transportable datacenter.

[10] In at least one embodiment, the air intake openings may be on a first sidewall. [11] In at least one embodiment, the air exhaust openings may be on a second sidewall.

[12] In at least one embodiment, the air exhaust openings may be on a roof.

[13] In at least one embodiment, the air intake openings may be on a roof.

[14] In at least one embodiment, the air intake openings may be on a second sidewall.

[15] In at least one embodiment, the air intake openings may be on the roof.

[16] In at least one embodiment, a one or more hot air mixing fans may blow air through an at least one air exhaust opening into an at least one intake opening through ducting.

[17] In at least one embodiment, the ventilation system may include exhaust fans mounted in at least some of the air exhaust openings.

[18] In at least one embodiment, the exhaust fans may be on an outside of the transportable datacenter.

[19] In at least one embodiment, the ventilation system may include intake fans mounted in at least some of the air intake openings.

[20] In at least one embodiment, the intake fans may be on an outside of the transportable datacenter.

[21] In at least one embodiment, the ventilation system may include processor intake cooling fans mounted to a front face of at least some of the processor, adjacent the cold air plenum.

[22] In at least one embodiment, the ventilation system may include processor exhaust cooling fans mounted to a rear face of at least some of the processor, adjacent the hot air plenum.

[23] In at least one embodiment, at least some of the racks may be arranged in pairs, with the rear faces of the processor bays in each rack in a pair adjacent to the same hot air plenum.

[24] In at least one embodiment, the processor bays may have an exhaust flap.

[25] In at least one embodiment, the processor bays may be arranged at an oblique angle to provide a straighter air flow path through the transportable datacenter. [26] In at least one embodiment, the racks may be arranged at an oblique angle to provide a straighter air flow path through the transportable datacenter.

[27] In at least one embodiment, the housing may be a freight container.

[28] In at least one embodiment, the housing may be an intermodal shipping container.

[29] In at least one embodiment, the embodiment may further include a central fan controller for controlling the operation of the ventilation system in response to one or more measured temperatures.

[30] In at least one embodiment, the housing may be a transportable shipping container.

[31] In at least one embodiment, the transport system may includes mounts for mounting the housing on a transport platform.

[32] In at least one embodiment, the mounts may be configured to allow the transportable datacenter to be stacked on top of another similar transportable datacenter.

[33] In at least one embodiment, the transport system may includes wheels mounted to the transportable datacenter.

[34] In at least one embodiment, the wheels may be detachable.

[35] In at least one embodiment, the power system may have a bus bar attached to each rack in the racks.

[36] In a second aspect, some embodiments of the invention provide a

transportable datacenter comprising: a housing having air intake openings from for receiving air from an external environment and air exhaust openings for exhausting air to the external environment; a plurality of racks, each rack having a plurality of processor bays, each processor bay having a front face and a rear face; an electric power system for providing electric power at each processor bay; a data network for providing data communications at each processor bay; a cold air plenum between the air intake openings the front faces of the processor bays; at least one hot air plenum between the rear faces of the processor bays and the air exhaust opening; a ventilation system to draw air progressively through the air intake openings, the cold air plenum, the processor bays, the hot air plenum and the air exhaust openings, and wherein the ventilation system includes one or more hot air mixing fans for blowing air from one or more hot air plenums into the cold air plenum; and a transport system for transporting the transportable datacenter.

[37] In at least one embodiment, the air intake openings may be on a first sidewall.

[38] In at least one embodiment, the air exhaust openings may be on a second sidewall.

[39] In at least one embodiment, the air exhaust openings may be on a roof.

[40] In at least one embodiment, the air intake openings may be on a roof.

[41] In at least one embodiment, the air intake openings may be on a second sidewall.

[42] In at least one embodiment, the air intake openings may be on the roof.

[43] In at least one embodiment, a one or more hot air mixing fans may blow air through an at least one air exhaust opening into an at least one intake opening through ducting.

[44] In at least one embodiment, the ventilation system may include exhaust fans mounted in at least some of the air exhaust openings.

[45] In at least one embodiment, the exhaust fans may be on an outside of the transportable datacenter.

[46] In at least one embodiment, the ventilation system may include intake fans mounted in at least some of the air intake openings.

[47] In at least one embodiment, the intake fans may be on an outside of the transportable datacenter.

[48] In at least one embodiment, the ventilation system may include processor intake cooling fans mounted to a front face of at least some of the processor, adjacent the cold air plenum.

[49] In at least one embodiment, the ventilation system may include processor exhaust cooling fans mounted to a rear face of at least some of the processor, adjacent the hot air plenum.

[50] In at least one embodiment, at least some of the racks may be arranged in pairs, with the rear faces of the processor bays in each rack in a pair adjacent to the same hot air plenum. [51] In at least one embodiment, the processor bays may have an exhaust flap.

[52] In at least one embodiment, the processor bays may be arranged at an oblique angle to provide a straighter air flow path through the transportable datacenter.

[53] In at least one embodiment, the racks may be arranged at an oblique angle to provide a straighter air flow path through the transportable datacenter.

[54] In at least one embodiment, the housing may be a freight container.

[55] In at least one embodiment, the housing may be an intermodal shipping container.

[56] In at least one embodiment, the embodiment may further include a central fan controller for controlling the operation of the ventilation system in response to one or more measured temperatures.

[57] In at least one embodiment, the housing may be a transportable shipping container.

[58] In at least one embodiment, the transport system may includes mounts for mounting the housing on a transport platform.

[59] In at least one embodiment, the mounts may be configured to allow the transportable datacenter to be stacked on top of another similar transportable datacenter.

[60] In at least one embodiment, the transport system may includes wheels mounted to the transportable datacenter.

[61] In at least one embodiment, the wheels may be detachable.

[62] In at least one embodiment, the power system may have a bus bar attached to each rack in the racks.

[63] In a third aspect, some embodiments of the invention provide a method of assembling a transportable datacenter, including: providing a housing, wherein the housing includes: one or more air intake openings; and one or more air exhaust openings, installing a plurality of racks in the transportable datacenter, each rack having a plurality of processor bays, each of the processor bays having a front face and a rear face; substantially fluidically isolating a cold air plenum from one or more hot air plenums, wherein front faces of the processor bays are adjacent the cold air plenum and the rear faces of the processor bays are adjacent the hot air plenum; installing a ventilation system for progressively drawing air from an environment of the transportable datacenter through the air intake openings, the cold air plenum, the processor bays, the hot air plenums and through the air exhaust openings back to the environment.

[64] In at least one embodiment, the one or more air intake openings may be on a first sidewall.

[65] In at least one embodiment, the one or more air exhaust openings may be on a second sidewall.

[66] In at least one embodiment, the one or more air exhaust openings may be on a roof.

[67] In at least one embodiment, the one or more air intake openings may be on a roof.

[68] In at least one embodiment, the one or more air intake openings may be on a second sidewall.

[69] In at least one embodiment, the one or more air intake openings may be on the roof.

[70] In at least one embodiment, one or more hot air mixing fans may blow air through an at least one air exhaust opening into an at least one intake opening through ducting.

[71] In at least one embodiment, the ventilation system may include exhaust fans mounted in at least some of the air exhaust openings.

[72] In at least one embodiment, the one or more exhaust fans may be on an outside of the transportable datacenter.

[73] In at least one embodiment, the ventilation system may include one or more intake fans mounted in at least some of the one or more air intake openings.

[74] In at least one embodiment, the one or more intake fans may be on an outside of the transportable datacenter.

[75] In at least one embodiment, the method of assembly may further comprise installing one or more processors; wherein the ventilation system includes processor intake cooling fans may be mounted to a front face of the at least one processors, adjacent the cold air plenum.

[76] In at least one embodiment, the ventilation system may include processor exhaust cooling fans mounted to a rear face of the at least one processors, adjacent the hot air plenum.

[77] In at least one embodiment, the method of assembly may further comprise a plurality of racks and a plurality of hot air plenums, wherein at least some of the racks may be arranged in pairs, with the rear faces of the processor bays in each rack in a pair adjacent to the same hot air plenum.

[78] In at least one embodiment, the processor bays may have an exhaust flap.

[79] In at least one embodiment, the processor bays may be arranged at an oblique angle to provide a straighter air flow path through the transportable datacenter.

[80] In at least one embodiment, the racks may be arranged at an oblique angle to provide a straighter air flow path through the transportable datacenter.

[81] In at least one embodiment, the housing may be a freight container.

[82] In at least one embodiment, the housing may be an intermodal shipping container.

[83] In at least one embodiment, the method of assembly may further include a central fan controller for controlling the operation of the ventilation system in response to one or more measured temperatures.

[84] In at least one embodiment, the housing may be a transportable shipping container.

[85] In at least one embodiment, the transport system may include mounts for mounting the housing on a transport platform.

[86] In at least one embodiment, the mounts may be configured to allow the transportable datacenter to be stacked on top of another similar transportable datacenter.

[87] In at least one embodiment, the transport system may include wheels mounted to the transportable datacenter.

[88] In at least one embodiment, the wheels may be detachable. [89] In at least one embodiment, the power system may have a bus bar attached to each rack in the racks.

Brief Description of the Drawings

[90] Various preferred embodiments of the present invention will now be described in detail with reference to the drawings, in which:

FIG. 1 is a perspective view an example transportable datacenter;

FIG. 2 is another perspective view of the transportable datacenter of FIG. 1 ; FIG. 3A is a cutaway top view of the transportable datacenter of FIG 1 ;

FIG. 3B is a cutaway portion view of the transportable datacenter of FIG 1 ; FIG. 4A illustrates an intake side view of a rack installed in the transportable datacenter of FIG 1 ;

FIG. 4B illustrates an exhaust side view of a rack installed in the transportable datacenter of FIG 1 ;

FIG. 5 illustrates a processor;

FIG. 6 illustrates airflows in the transportable datacenter of FIG 1 ;

FIG. 7A illustrates an electric power system in the transportable datacenter of

FIG 1 ;

FIG. 7B illustrates an electric power system in the transportable datacenter of

FIG 1 ;

FIG. 8 illustrates a data network in the transportable datacenter of FIG 1 ;

FIG. 9 a method of preparing a transportable datacenter for use;

FIG. 10 illustrates an alternative rack;

FIG. 1 1 illustrates another transportable datacenter; and

FIG. 12 illustrates another transportable datacenter.

FIG. 13A illustrates a perspective view of another transportable datacenter. FIG. 13B illustrates a cutaway top view of the transportable datacenter from FIG. 13A.

FIG. 14 is a cutaway portion view of another transportable datacenter.

FIG. 15A illustrates a perspective view of another transportable datacenter. FIG. 15B is a cutaway portion view of the transportable datacenter of FIG.

15A.

FIG. 15C illustrates a perspective view of another transportable datacenter. FIG. 15D is a cutaway portion view of the transportable datacenter of FIG.

15C.

Description of Exemplary Embodiments

[91] Several example embodiments are described below. Numerous specific details are set forth in order to provide a thorough understanding of the example embodiments. However, it will be understood by those of ordinary skill in the art that the embodiments described herein may be practiced without these specific details. In other instances, well-known methods, procedures and components have not been described in detail so as not to obscure the embodiments described herein.

Furthermore, this description and the drawings are not to be considered as limiting the scope of the embodiments described herein in any way, but rather as merely describing the implementation of the various embodiments described herein.

[92] It should be noted that terms of degree such as "substantially", "about" and "approximately" when used herein mean a reasonable amount of deviation of the modified term such that the end result is not significantly changed. These terms of degree should be construed as including a deviation of the modified term if this deviation would not negate the meaning of the term it modifies.

[93] In addition, as used herein, the wording“and/or” is intended to represent an inclusive-or. That is,“X and/or Y” is intended to mean X or Y or both, for example. As a further example,“X, Y, and/or Z” is intended to mean X or Y or Z or any

combination thereof.

[94] Reference is first made to FIGS. 1-3A, which illustrate a transportable datacenter 100. The transportable datacenter 100 has a housing 102 which, in this example, is a transportable shipping container having sidewalls 104 and 106, end walls 108 and 1 10, a floor 1 18 and a ceiling or roof 120. The housing 102 may be a typical shipping container suitable for transport by truck, rail or boat. The housing 102 will typically be made of rigid, weather resistant material capable of withstanding an outdoor environment. The housing 102 of the transportable datacenter provides a generally weather resistant and enclosed volume in which other elements of the transportable datacenter are installed. In some embodiments, the housing may be freight container or a transportable intermodal container compliant with a

corresponding standard such as ISO 668 or ISO 1496. In some cases, multiple transportable datacenters may be stackable one atop another.

[95] T ransportable datacenter 100 has a ventilation system for cooling processors that may be installed in the transportable datacenter. The cooling system may also serve generally to provide ventilation through the transportable datacenter.

Ventilation is provided through the transportable datacenter 100 by air flowing through datacenter from an air intake to an air exhaust, typically from one sidewall to the opposing sidewall. In transportable datacenter 100, ventilation is provided from sidewall 104 to sidewall 106. Sidewall 104 having the air intake may be referred to as the intake side. The sidewall 106 having the air exhaust may be referred to as the exhaust side.

[96] Air intake sidewall 104 has one or more air intake openings 1 14 to allow intake of cool air from the environment. Each of the intake openings 1 14 will typically have a filter or other protective element installed in the intake opening to reduce the flow of dirt, dust and other particulate matter and contaminants into the transportable datacenter 100. The air intake openings may have baffles or other physical protective elements to reduce the flow of rain and other materials into the transportable datacenter 100. In some embodiments, some or all of the intake openings may have an air intake fan installed within them.

[97] The intake openings may be sized identically or differently from one another, for example, as shown, intake opening 1 14a may be smaller than the intake openings 1 14b, 1 14c, and 1 14d.

[98] The end wall 1 10 may have a door 124 that allows operator access into the transportable datacenter 100, typically into a cold air plenum 154. [99] Air exhaust sidewall 106 has air exhaust openings 1 16 to exhaust hot air from within datacenter 100 to the environment. Each of the exhaust openings 1 16 will typically have an exhaust fan 128 installed within it. The exhaust openings may be sized identically or differently from one another. For example, as shown, exhaust opening 1 16a may be smaller than exhaust openings 116b, 1 16c, and 1 16d. As with the air intake openings, the air exhaust openings 1 16 may have a filters or baffles or both to protect the interior of the transportable datacenter from contamination.

[100] A plurality of racks are installed in the interior of the transportable datacenter 100. While seven racks are shown in this example, other numbers of racks may similarly be installed in the transportable datacenter. Each rack 134 has a plurality of shelves 136, with each shelf 136 having a plurality of processor bays 138 having a front face 140 and a rear face 142. In operation, a processor 500 (FIG. 5) may be installed in each of the processor bays 138.

[101] Reference is next made to FIG 3B, which shows a cutaway portion view of a transportable datacenter 100. In one embodiment an external intake fan 180 is disposed outside of the transportable container 100. The external intake fan 180 may have baffles or other physical protective elements to reduce the flow of rain and other materials into the transportable datacenter 100. In a similar fashion, the exhaust fans may be disposed outside of the transportable container 100 as well.

The external exhaust fans may have baffles or other physical protective elements to reduce the flow of rain and other materials into the transportable datacenter 100.

[102] Reference is next made to FIG. 4A, which illustrates the intake side of a rack 134. The rack 134 has a plurality of shelves 136, each shelf 136 having a plurality of processor bays 138. Each processor bay 138 can accommodate a processor 500.

[103] Each processor bay 138 may have a liner along the intake or exhaust side of the processor bay. The liner may be a thermally insulating foam liner, that provides thermal insulation between the hot plenum and the processor bay 138. The liner may line the processor bays 138, and optionally the plurality shelves 136. The liner may act as a gasket between the processor bay 138 and a processor 500 to provide an air seal around the intake edges of the processor 500. The liner may have be made from a fire resistant material. The liner may provide a frictional attachment between the processor 500 and a processor bay 138.

[104] Referring to FIG. 4B, which illustrates the exhaust side of the rack 134 of FIG. 4A. The exhaust side panel 522 may have a thermally insulating foam liner similar to the foam liner of FIG. 4A. The exhaust side of rack 134 may have an exhaust flap 520 for a processor bay 138. While only flaps 520 for a single row are shown, there may be one flap for each processor bay in the entire rack. The exhaust flap 520 may extend from either side of the processor bay 138. The exhaust flap 520 may have a varying angle compared to other processor flaps relative to the rack. The angle of the flap 520 may be determined based on the airflow through the processor bay 138 and the proximity of the processor bay 138 to the container exhaust. The exhaust flap is for channeling the air exhaust output into the hot air plenum.

[105] Referring also to FIG 5, typically, a processor 500 will be a self-contained or substantially self-contained computing unit. Some processors may have an external power supply 518 that is mounted to or sits adjacent to the processor 502. Other processors may have an internal power supply or may not require a power supply.

Each processor 500 is installed in the corresponding processor bay 138. In transportable datacenter 100, this is accomplished by placing in the processor

(including, if present, its power supply or any other external components) in the processor bay 138. In other embodiments, a processor 500 may be fixedly mounted in a processor bay 138 with one or more fasteners. Each processor has a maximum cross-section from its front 504 to its rear 506. In some cases, the cross-sectional size of a processor may be generally consistent from front to rear, such as in the case of a processor that has a processor housing 508 that is generally shaped as a rectangular cuboid with three sets of opposing generally parallel faces. Each processor bay 138 is preferably shaped to conform to the cross sectional shape of the processor 500 that will be positioned in that processor bay 138. In some cases, an optional processor bay trim may be used to reduce or eliminate gaps between the processor and the sides of the processor bay. In some embodiments, the processor bays may not be specifically shaped to conform to the cross-sections of processors.

In some embodiments, the processor bays may be positioned sufficiently close to one another that the majority of air flows through processor positioned in the processor bays, and relatively little air flows between the processors. In some embodiments, the processor housings may contribute to the cooling of some or all of the processors and the processor bays may be spaced to allow airflow between the processor housings to cool the processor housings.

[106] In some cases, during the operation of transportable datacenter 100, a processor bay 138 may not have a processor 500 installed in it. Such empty processor bays 138 may have a blanking panel 514 installed in them. The blanking panel blocks all or most of the cross-section of the processor 138 to reduce or eliminate airflow through the empty processor bay 138 as is shown in relation to processor bay 138e.

[107] In operation, each processor 500 generates heat, as is typical with computing devices. A processor 500 may have an optional intake cooling fan 512 that draws cold air into the front of the processor. As air flows through a processor 500, it absorbs heat generated by the processor and thereby cooling the processor. A processor may have an exhaust cooling fan 514 that expels heated air from the rear of the processor 500. Some processor may have both an intake cooling fan and an exhaust cooling fan while other processors may not have any such cooling or ventilation fans.

[108] Transportable datacenter 100 includes a relatively large number of processor bays, allowing for many processors to be installed within it. Transportable datacenter may be particularly suitable for tasks that require substantial parallel processing by many processors, such as mining cryptocurrencies, identifying large prime numbers, operating blockchain based information systems and many other such tasks.

[109] Reference is next made to FIG. 6, which illustrates air flows created by the ventilation system through transportable datacenter 100. Each rack extends from a hot air plenum barrier 158 to the exhaust sidewall 106 of the housing 102. The front face 140 of each processor bay 138 opens into a cold air plenum 154 (which may also be referred to as a cold air zone). The rear face 142 of each processor bay 138 opens into a hot air plenum 156 (which may also be referred to as a hot air zone). The airflows in transportable datacenter 100 include intake airflows 602 and exhaust airflows 604. Intake airflows 602 extend from the intake air openings 1 14 on the intake side of housing 102 to the front of the processor bays 138 through the cold air plenum 154. Cold intake air then flows through the processor bays 138, where it cools processors 500 installed in the processor bays 138 and which warms the air. The warmed air exits from the rear of the processor bays 138 into the hot air plenum 156. The warmed air is then exhausted through the exhaust side of the housing as shown by exhaust airflows 604.

[110] In transportable datacenter 100, the hot air plenums 156 are substantially fluidically isolated from the cold air plenum 154 so that warmed air exiting the rear face 142 of the processor bays 138 does not substantially mix with cold air that has not yet reached the front face 140 of the processor bays 138 when the ventilation system is in operation. The ventilation system progressively draws air from the environment of the transportable datacenter 100, through the air intake openings

1 14, the cold air plenum 154, the processor bays 138, the hot air plenums 156 and then through the exhaust air openings 1 16 back to the environment of the

transportable datacenter.

[111] For example, hot air plenum 156a is enclosed or contained within a volume or space defined by hot air plenum barrier 158a, end wall 1 10, side wall 106 and the rear faces 142 of the processor bays 138 on a first rack 134a. Rack 134a may extend from the floor 1 18 to the ceiling 120 of the housing, in which case, the floor and ceiling also define the enclosed volume of hot air plenum 156a.

[112] Hot air plenum 156b is enclosed between the rear faces of racks 134b and

134c, a hot air plenum barrier 158b and side wall 106. Racks 134b and 134c do not extend to the ceiling 120 of the housing 102. Instead a hot air plenum cover 160b

(shown cut away in FIG. 3A) is installed between the tops of racks 134b and 134c.

The hot air plenum cover 160b also defines the enclosed volume of hot air plenum

156b. The hot air plenum may be enclosed in other manners, for example, if a rack does not extend the ceiling 120, a hot air plenum barrier may be installed from the top of the rack to the ceiling. This may allow a hot zone with a larger volume, and possibly larger exhaust fans with greater air moving capacity to be used, provide greater air movement through the transportable datacenter and greater cooling for the processors 500.

[113] Similarly the other hot air plenums 156c and 156d are enclosed between respective racks 134, a hot air plenum barrier 158 and sidewall 106, as described above.

[114] In transportable datacenter 100, intake airflows 602 and exhaust airflows 604 are generated by exhaust fans 128, which draw relatively cold air from the

environment through the intake air openings 1 14, along intake airflows 602, through processor bays 138, exhaust airflows 604 and out of the transportable datacenter

100 through exhaust air openings 1 16. Some or all of the processors 500 installed in processor bays 138 may include processor intake fans 512 or processor exhaust fans 514 or both. Processor fans 512 and 514 move cold air from the cold air plenum 154 to the hot air plenum 156 through the corresponding processors 500. When provided, the processor fans also contribute to generation of the intake airflows 602 and exhaust airflows 604. As noted above, air intake fans may be installed in some or all of the air intake openings 1 14 to blow relatively cold air from the environment of transportable datacenter 100 into the cold air plenum 154. In various embodiments, a transportable datacenter 100 may include any combination of cold air intake fans, processor fans on processors 500, and hot air exhaust fans 128. In any particular embodiment, at least one type of fan will be provided.

[115] Referring to FIG. 7A, transportable datacenter 100 has an electric power terminal 714, which may include a one or three phase interface for receiving an external power supply from an external power source. Power terminal 714 is coupled to a series of power supplies 716 mounted on the hot air plenum barriers 158 facing the cold air plenum 154. From each power supply 716, a cable assembly 718 provides a bay power signal to each processor bay 138 in the adjacent racks 134. The cable assembly may include power cables and power cable harnesses that connect the power supply to a power plug 720 positioned at each processor bay. The bay power signal provided at each processor bay has a voltage suitable for the processor to be installed at that bay, with sufficient power to provide the processor’s power requirements. [116] In some embodiments, the power supply may simply couple the external power source to the power plug 720 positioned at each processor bay. For example, this may be done if the external power supply provides power at a voltage suitable for directly powering the processors.

[117] In other embodiments, the power supply may include one or more

transformers to transform the external power supply to bay power supplies having one or more voltages suitable to power the processors. The appropriate bay power signal for each processor bay is provided at each respective power plug 720 at each processor bay 138 through the cable assembly 718.

[118] In various embodiments, there may be any number of power supplies 716.

For example, some transportable datacenters may include a single power supply 716 that provides power to each processor bay, while others may include a plurality of power supplies located proximate different groups or racks of processor bays as shown in FIG. 7A.

[119] In the present example embodiment, each power supply includes a power supply panel that includes switches to selectively enable and disable the bay power supply at each processor bay. Each switch may be part of a circuit breaker that can automatically disable a bay power supply if an over-current, over-temperature or other trigger condition occurs. In some embodiments, the power supply may consist of a cable assembly that couples the external power supply to a power plug at each processor bay without any intervening switches, transformers or other elements.

[120] Electric power from the external power supply is also used to power any intake fans (if provided in any particular embodiment) and exhaust fans 128 (if provided in any particular embodiment) built into the transportable datacenter 100. Each intake fan and exhaust fan will typically be powered from a fan power supply 722 that provides an appropriate power signal for each intake fan or exhaust fan. In some embodiments, the intake fans and exhaust fans may simply operate at full capacity when they are powered up.

[121] In other embodiments, some or all of the intake fans or exhaust fans may include an onboard speed controller that adjusts the speed of the respective fan in response to one or more measured air temperatures. For example, each fan may include or be connected to temperature sensors that measure the air temperature in the environment of the transportable datacenter, in one or more areas of the cold air plenum, or within one or more areas of one or more of the hot air plenums, or a combination of those locations. The fan may adjust its speed in response to the measured temperatures. For example, an exhaust fan will typically operate at a higher speed in response to a higher air temperature in the corresponding hot air plenum. An intake fan may operate at a higher temperature in response to a higher air temperatures in any of the environment of the transportable datacenter, the cold air plenum or a hot air plenum. In any particular embodiment, each fan may be configured to adjust its speed in response to various temperature conditions, or combinations of temperature conditions in order to maintain a desired temperature or temperature range within one or more areas of the transportable datacenter.

[122] In some embodiments, some or all of the intake fans or exhaust fans may operate under the control of a central fan controller. The central fan controller may be coupled to temperature sensors that sense air temperatures in the environment of the transportable datacenter, in one or more areas of the cold air plenum, or in one or more areas of one or more of the hot air plenums, or in a combinations of those locations. The fan controller may vary the speed of each intake fan or exhaust fan to maintain a desired temperature or range of temperatures within one or more areas of the transportable datacenter.

[123] Controlling the speed of some or all of the intake fans or exhaust fans provided in any particular embodiment may reduce the power consumption of transportable datacenter. For example, when a transportable datacenter operates in a colder environment, less air flow may be required through the transportable datacenter to maintain desired temperatures. Other factors affecting the cooling requirements of a transportable datacenter may include the number of processors installed in the transportable datacenter, the layout of racks and processor bays, heat generated by the processors (which may vary from processor to processor, or from rack to rack, or both), or the rate of change of temperatures in the environment or interior of the transportable datacenter. [124] Reference is next made to FIG. 7B, an alternate embodiment of an electric power system for transportable container 100 is shown. The electric power terminal 754, includes an interface for receiving an external power supply from an external power source. Power terminal 754 is coupled to each of the racks 134. At each rack 134, a bus bar 758 provides a bay power signal to each processor bay 138 in racks

134. The bay power signal may be provided by a plug attached to the bus bar 758, the plug connecting to a processor disposed in the processor bay 138. The bus bars 758 may be integrated with the rack 134, and may have an integrated bus

connection that may couple with the bus bar 758 with the plug via a terminal, a clip, a crimping connection, or another electrical connector. The bay power signal provided at each processor bay has a voltage suitable for the processor to be installed at that bay, with sufficient power to provide the processor’s power requirements. Optionally, there is a relay system (not shown) provided allowing a user to disable a rack, a shelf in a rack, or the transportable container. The electric power system having bus bars 758 may enable easy processor installation.

[125] Reference is next made to FIG. 8, which also illustrates transportable datacenter 100. Transportable datacenter 100 includes an external communication network connection 802. Typically, the external network connection 802 allows processors and other computing devices in transportable datacenter 100 to communicate with external computing devices using an external data communication network 806 such as the Internet or another communication network.

[126] External network connection 802 is coupled to a data network 804 within transportable datacenter 101. The data network 804 may include various network devices such as routers, switches and cables to provide network connectivity at some or all of the processor bays. The data network may include wireless communication devices 808 that facilitate wireless communication between network devices and between processors and the data network. Any particular processor bay may be provided with either wired or wireless network connectivity or both, allowing a processor in the processor bay to communicate with other devices

(including other processors) coupled to the data network, and to communicate with external computing devices. [127] A transportable datacenter may be designed for transport in various ways. Transportable datacenter 100 has a housing 102 which is a transportable shipping container. The shipping container is adapted to be transported by truck, rail or ship from a location at which it is manufactured to a location at which the transportable datacenter will be put into operation. For example, the shipping container may include twistlocks 162 (FIGS. 1 , 2) or other appropriate mounts to allow the container to be mounted on a truck, trailer or rail car or other transport platform. In other embodiments, a transportable datacenter may be built on a frame or base that has or can be equipped with wheels for transportation. For example, a transportable datacenter may be built on a trailer that can be hitched to a truck for transport. In some embodiments, the mounts used to mount a transportable datacenter for transportation may also be used to stack multiple transportable datacenters.

[128] Referring to FIG. 9, a transportable datacenter may be installed by method 900:

• At 902, manufacturing or assembling the transportable datacenter at an assembly facility manufacturing facility. Manufacturing or assembling the transportable datacenter includes:

o Providing a housing having air intake openings and air exhaust openings.

o Installing a plurality of racks in the transportable datacenter, with each rack including a plurality of processor bays.

o Substantially fluidically isolating the cold air plenum at the front face of the processor bays from the hot air plenum at the rear face of the processor bays.

o Installing a cooling system for progressively drawing air from an

environment of the transportable datacenter through the air intake openings, the cold air plenum, the processor bays, the hot air plenums and through the air exhaust openings back to the environment.

• At 904, transporting the assembled transportable datacenter to an operating location. • At 906, connecting the transportable datacenter’s external power supply to an external power source.

• At 908, connecting the transportable datacenter’s external communication network connection to an external data communication network.

• At 910, installing processors in the processor bays of the transportable datacenter, by positioning each processor in a processor bay, and connecting each processor to a respective power plug and connecting the processor to the transportable datacenter’s data network.

[129] Once the transportable datacenter has been installed, the transportable datacenter may be into operation by activating the intake fans (if provided), exhaust fans (if provided), and the processors. When the processors are activated, any processor intake cooling fans and processor exhaust cooling fans will be activated under the control of a fan controller built into the respective processor.

[130] In some situations, the transportable datacenter may be substantially assembled prior to transport to an operating location, where assembly of the transportable datacenter may be completed. For example, the transportable datacenter may be shipped with protective covers over the intake openings 1 14 and the exhaust openings 1 16. Intake filters and exhaust fans 128 may be installed at the operating location. Similarly, the transportable datacenter may be shipped to without other elements installed in their final position, and those elements may be installed prior to putting the transportable datacenter into operation.

[131] Reference is next made to FIG. 10, which illustrates a rack 1 134. Elements of rack 1 134 that correspond to rack 134 are identified by corresponding reference numerals. In rack 134, the processor bays are arranged generally at a right angle to the long direction of the rack. In rack 1034, the processor bays 1038 are arranged at an oblique angle to provide a straighter path for air flow between the intake airflows 1602 and the exhaust air flows 1604, potentially reducing turbulence in the air flow in the transportable datacenter, and potentially increasing the cooling effect of the air flows. Rack 1034 may be used for some or all of the racks in a

transportable datacenter. [132] Reference is next made to FIG. 1 1 , which illustrates another transportable datacenter 2100. Elements of transportable datacenter 2100 that correspond to transportable datacenter 100 are identified by corresponding reference numerals. In transportable datacenter 2100, the racks 2134 extend from hot air plenum barrier 2158 towards exhaust sidewall 2106, but are spaced apart from the exhaust sidewall 2106. This provides a hot air plenum 2156 that extends along the length of exhaust sidewall 2106 and allows additional exhaust fans to be installed along a greater portion of the length of sidewall 2106, potentially providing greater airflow and cooling through the transportable datacenter.

[133] Reference is next made to FIG. 12, which illustrates another transportable datacenter 3100. Elements of transportable datacenter 3100 that correspond to transportable datacenters 100 and 2100 are identified by corresponding reference numerals. In transportable datacenter 3100, the ventilation system includes a plurality of hot air mixing fans 3170 that are operable, under the control of a central fan controller, to draw air from one or more hot air plenums 3156 into to the cold air plenum 3154 through ducting 3172. The central fan controller may activate and control the speed of the hot air mixing fans 3170 in response to temperature measurements in the environment, in the cold air plenum, or at one or more processors, or a combination of these and other locations. In some environments, cold air drawn from the environment of a transportable datacenter into the cold air plenum may be sufficiently cold to negatively impact the operation of the processors or other elements of the transportable datacenter. In those situations, it may be desirable to heat the air in the cold air plenum 3154 by mixing hot air from one or more hot air plenums 3156 into the cold air plenum. In this example, hot air from two hot air plenums 3156b and 3156d is mixed with cold air in the cold air plenum 3154. In other embodiments, a greater or smaller number of hot air mixing fans 3170 may be provided to mix hot air from any number of hot air plenums into the cold air plenum.

[134] Reference is next made to FIGs. 13A and 13B which illustrate another embodiment of a transportable datacenter 3200. The transportable datacenter 3200 has intake ports 3206 on the roof of the transportable datacenter for providing ventilation of cool air from the environment into the cold plenum. Each of the intake openings 3206 will typically have a filter or other protective element installed in the intake opening to reduce the flow of dirt, dust and other particulate matter and contaminants into the transportable datacenter 3200. The air intake openings may have baffles or other physical protective elements to reduce the flow of rain and other materials into the transportable datacenter 3200. In some embodiments, some or all of the intake openings may have an air intake fan installed within them. The intake openings 3206 may be sized identically or differently from one another. The air openings provide intake air flows 3208 from the intake opening 3206 to the plurality of processor bays on the rack 134.

[135] Referring to FIG. 14, there is another embodiment of a transportable datacenter 3300. Elements of rack 3314 that correspond to rack 134 are identified by corresponding reference numerals. In rack 134, the processor bays are arranged generally at a right angle to the long direction of the rack. In rack 3314, the processor bays 3318 are arranged at an oblique angle to provide a straighter path for air flow between the intake airflows and the exhaust air flows, and the racks 3314 are further arranged at an oblique angle, potentially reducing turbulence in the air flow in the transportable datacenter, and potentially increasing the cooling effect of the air flows. Rack 3314 may be used for some or all of the racks in a transportable datacenter. Intake openings 3306 are provided to allow for the intake of cooler air from the environment. Exhaust openings 3308 are provided to allow for exhaust of hot exhaust air into the environment.

[136] Referring to FIG. 15A, there is a perspective view of another embodiment of a transportable datacenter 3350. T ransportable datacenter 3350 has intake openings 3306 on the roof 3374 and exhaust openings 3318 on the roof 3374. One or more exhaust openings 3318a may be connected by ducting to an intake opening 3306a to allow hot exhaust air to recirculate from the hot plenum into the cold plenum. The recirculation of hot air may be controlled by an independent control mechanism. The ducting may be internal or external to container 3350. In this embodiment, air intake occurs through the intake openings 3306 on roof 3374, but air may optionally intake through the intake openings 3306 on roof 3374 and intake openings on side wall 3372 (see FIG. 2 at 1 16).

[137] It is understood that there may be a transportable container with intake openings on the first sidewall (the intake sidewall), intake openings on the roof, or both intake openings of the first sidewall (the intake sidewall) and the roof. It is further understood that there may be a transportable container with exhaust openings on the second sidewall (the exhaust sidewall), exhaust openings on the roof, or exhaust openings on the second sidewall (the exhaust sidewall) and exhaust openings on the roof.

[138] Referring to FIG. 15B, there is cutaway top portion view of the transportable datacenter 3350 from FIG. 15A. In transportable datacenter 3350, a plurality of exhaust ports 3318 are provided generally directed upwards. The plurality of exhaust ports 3318 may be used to exhaust into the environment upwards. The plurality of exhaust ports 3318 may have an independent control mechanism to recirculate the exhaust air flow back into the cold air plenum 3302 via ducting. This independent control mechanism may be an air flow switch or a flue. The air flow switch may switch between recirculating hot air flow from the exhaust opening to the intake opening, and exhausting the hot air flow into the environment. The recirculation may be performed to increase the intake air temperature if the ambient air temperature in the environment is below an operating threshold for the

processors disposed in processor bays 3368.

[139] Referring to FIG. 15C, there is a perspective view of another embodiment of a transportable datacenter 3400. Transportable datacenter 3400 has intake openings 3406 on the intake wall 3472 and exhaust openings 3418 on the roof 3474. One or more exhaust openings 3418a may have ducting 3470 to vent hot exhaust air proximate to an intake opening 3406 to allow hot exhaust air to recirculate from the hot plenum into the cold plenum. Optionally, the ducting 3470 may be connected to an intake opening 3406 . The recirculation of hot air may be controlled by an independent control mechanism. The ducting may be internal or external to container 3400. [140] Referring to FIG. 15D, there is cutaway top portion view of the transportable datacenter 3400 from FIG. 15C. In transportable datacenter 3400, a plurality of exhaust ports 3418 are provided generally directed upwards. The plurality of exhaust ports 3418 may be used to exhaust into the environment upwards. The plurality of exhaust ports 3418 may have an independent control mechanism to recirculate the exhaust air flow back into the cold air plenum 3406 via ducting 3470. This independent control mechanism may be an air flow switch or a flue. The air flow switch may switch between recirculating hot air flow from the exhaust opening to the intake opening, and exhausting the hot air flow into the environment. The recirculation may be performed to increase the intake air temperature if the ambient air temperature in the environment is below an operating threshold for the

processors disposed in processor bays 3468.

[141]

[142] The present invention has been described here by way of example and with reference to several example embodiments. These embodiments are merely exemplary and do not limit the scope of the invention, which is limited only by claims.

Claims

We claim:

1 . A transportable datacenter comprising:

a housing having air intake openings from for receiving air from an external environment and air exhaust openings for exhausting air to the external environment;

a plurality of racks, each rack having a plurality of processor bays, each processor bay having a front face and a rear face; an electric power system for providing electric power at each processor bay;

a data network for providing data communications at each processor bay;

a cold air plenum between the air intake openings the front faces of the processor bays;

at least one hot air plenum between the rear faces of the processor bays and the air exhaust opening, wherein the hot air plenum is substantially fluidically isolated from the cold air plenum; a ventilation system to draw air progressively through the air intake openings, the cold air plenum, the processor bays, the hot air plenum and the air exhaust openings; and

a transport system for transporting the transportable datacenter.

2. The transportable datacenter of claim 1 wherein the air intake openings are on a first sidewall.

3. The transportable datacenter of claim 2 wherein the air exhaust openings are on a second sidewall.

4. The transportable datacenter of claim 2 wherein the air exhaust openings are on a roof.

5. The transportable datacenter of claim 1 wherein the air intake openings are on a roof.

6. The transportable datacenter of claim 5 wherein the air intake openings are on a second sidewall.

7. The transportable datacenter of claim 5 wherein the air intake openings are on the roof.

8. The transportable datacenter of claim 7 wherein one or more hot air mixing fans blow air through an at least one air exhaust opening into an at least one intake opening through ducting.

9. The transportable datacenter of claim 1 wherein the ventilation system includes exhaust fans mounted in at least some of the air exhaust openings.

10. The transportable datacenter of claim 9 wherein the exhaust fans are on an outside of the transportable datacenter.

1 1. The transportable datacenter of claim 1 to 9 wherein the ventilation system includes intake fans mounted in at least some of the air intake openings.

12. The transportable datacenter of claim 1 1 wherein the intake fans are on an outside of the transportable datacenter.

13. The transportable datacenter of any one of claims 1 to 1 1 wherein the ventilation system includes processor intake cooling fans mounted to a front face of at least some of the processor, adjacent the cold air plenum.

14. The transportable datacenter of any one of claims 1 to 13 wherein the ventilation system includes processor exhaust cooling fans mounted to a rear face of at least some of the processor, adjacent the hot air plenum.

15. The transportable datacenter of any one of claims 1 to 14 including a plurality of racks and a plurality of hot air plenums, wherein at least some of the racks are arranged in pairs, with the rear faces of the processor bays in each rack in a pair adjacent to the same hot air plenum.

16. The transportable datacenter of any one of claims 1 to 15 wherein the processor bays have an exhaust flap.

17. The transportable datacenter of any one of claims 1 to 15 wherein the processor bays are arranged at an oblique angle to provide a straighter air flow path through the transportable datacenter.

18. The transportable datacenter of claim 17 wherein the racks are arranged at an oblique angle to provide a straighter air flow path through the transportable datacenter.

19. The transportable datacenter of any one of claims 1 to 18 wherein the housing is a freight container.

20. The transportable datacenter of any one of claims 1 to 18 wherein the housing is an intermodal shipping container.

21. The transportable datacenter of any one of claims 1 to 20 further including a central fan controller for controlling the operation of the ventilation system in response to one or more measured temperatures.

22. The transportable datacenter of any one of claims 1 to 21 wherein the housing is a transportable shipping container.

23. The transportable datacenter of any one of claims 1 to 21 wherein the transport system includes mounts for mounting the housing on a transport platform.

24. The transportable datacenter of claim 23 wherein the mounts are configured to allow the transportable datacenter to be stacked on top of another similar transportable datacenter.

25. The transportable datacenter of any one of claims 1 to 21 wherein the transport system includes wheels mounted to the transportable datacenter.

26. The transportable datacenter of claim 25 wherein the wheels are detachable.

27. The transportable datacenter of any one of claims 1 to 26 wherein the power system has a bus bar attached to each rack in the racks.

28. A transportable datacenter comprising:

a data network for providing data communications at each processor bay;

a cold air plenum between the air intake openings the front faces of the processor bays; at least one hot air plenum between the rear faces of the processor bays and the air exhaust opening;

a ventilation system to draw air progressively through the air intake openings, the cold air plenum, the processor bays, the hot air plenum and the air exhaust openings, and wherein the ventilation system includes one or more hot air mixing fans for blowing air from one or more hot air plenums into the cold air plenum; and

a transport system for transporting the transportable datacenter.

29. The transportable datacenter of claim 28 wherein the air intake openings are on a first sidewall.

30. The transportable datacenter of claim 29 wherein the air exhaust openings are on a second sidewall.

31. The transportable datacenter of claim 29 wherein the air exhaust openings are on a roof.

32. The transportable datacenter of claim 28 wherein the air intake openings are on a roof.

33. The transportable datacenter of claim 32 wherein the air intake openings are on a second sidewall.

34. The transportable datacenter of claim 32 wherein the air intake openings are on the roof.

35. The transportable datacenter of claim 28 wherein the ventilation system includes exhaust fans mounted in at least some of the air exhaust openings.

36. The transportable datacenter of claim 35 wherein the exhaust fans are on an outside of the transportable datacenter.

37. The transportable datacenter of claim 28 to 36 wherein the ventilation system includes intake fans mounted in at least some of the air intake openings.

38. The transportable datacenter of claim 37 wherein the intake fans are on an outside of the transportable datacenter.

39. The transportable datacenter of any one of claims 28 to 38 wherein the ventilation system includes processor intake cooling fans mounted to a front face of at least some of the processor, adjacent the cold air plenum.

40. The transportable datacenter of any one of claims 28 to 39 wherein the ventilation system includes processor exhaust cooling fans mounted to a rear face of at least some of the processor, adjacent the hot air plenum.

41. The transportable datacenter of any one of claims 28 to 40 including a plurality of racks and a plurality of hot air plenums, wherein at least some of the racks are arranged in pairs, with the rear faces of the processor bays in each rack in a pair adjacent to the same hot air plenum.

42. The transportable datacenter of any one of claims 28 to 41 wherein the processor bays have an exhaust flap.

43. The transportable datacenter of any one of claims 28 to 41 wherein the processor bays are arranged at an oblique angle to provide a straighter air flow path through the transportable datacenter.

44. The transportable datacenter of claim 43 wherein the racks are arranged at an oblique angle to provide a straighter air flow path through the transportable datacenter.

45. The transportable datacenter of any one of claims 28 to 44 wherein the housing is a freight container.

46. The transportable datacenter of any one of claims 28 to 44 wherein the housing is an intermodal shipping container.

47. The transportable datacenter of any one of claims 28 to 46 further including a central fan controller for controlling the operation of the ventilation system in response to one or more measured temperatures.

48. The transportable datacenter of any one of claims 28 to 47 wherein the housing is a transportable shipping container.

49. The transportable datacenter of any one of claims 28 to 47 wherein the transport system includes mounts for mounting the housing on a transport platform.

50. The transportable datacenter of claim 49 wherein the mounts are configured to allow the transportable datacenter to be stacked on top of another similar transportable datacenter.

51. The transportable datacenter of any one of claims 28 to 47 wherein the transport system includes wheels mounted to the transportable datacenter.

52. The transportable datacenter of claim 51 wherein the wheels are detachable.

53. The transportable datacenter of any one of claims 28 to 52 wherein the power system has a bus bar attached to each rack in the racks.

54. A method of assembling a transportable datacenter, including: providing a housing, wherein the housing includes:

one or more air intake openings; and

one or more air exhaust openings,

installing a plurality of racks in the transportable datacenter, each rack having a plurality of processor bays, each of the processor bays having a front face and a rear face;

substantially fluidically isolating a cold air plenum from one or more hot air plenums, wherein front faces of the processor bays are adjacent the cold air plenum and the rear faces of the processor bays are adjacent the hot air plenum;

installing a ventilation system for progressively drawing air from an environment of the transportable datacenter through the air intake openings, the cold air plenum, the processor bays, the hot air plenums and through the air exhaust openings back to the environment.

55. The method of assembling a transportable datacenter of claim 54 wherein the one or more air intake openings are on a first sidewall.

56. The method of assembling a transportable datacenter of claim 55 wherein the one or more air exhaust openings are on a second sidewall.

57. The method of assembling a transportable datacenter of claim 55 wherein the one or more air exhaust openings are on a roof.

58. The method of assembling a transportable datacenter of claim 54 wherein the one or more air intake openings are on a roof.

59. The method of assembling a transportable datacenter of claim 58 wherein the one or more air intake openings are on a second sidewall.

60. The method of assembling a transportable datacenter of claim 58 wherein the one or more air intake openings are on the roof.

61. The transportable datacenter of claim 60 wherein one or more hot air mixing fans blow air through an at least one air exhaust opening into an at least one intake opening through ducting.

62. The method of assembling a transportable datacenter of claim 54 wherein the ventilation system includes exhaust fans mounted in at least some of the air exhaust openings.

63. The method of assembling a transportable datacenter of claim 62 wherein the one or more exhaust fans are on an outside of the transportable datacenter.

64. The method of assembling a transportable datacenter of claim 54 to 63 wherein the ventilation system includes one or more intake fans mounted in at least some of the one or more air intake openings.

65. The method of assembling a transportable datacenter of claim 64 wherein the one or more intake fans are on an outside of the transportable datacenter.

66. The method of assembling a transportable datacenter of any one of claims 54 to 65

- installing one or more processors;

- wherein the ventilation system includes processor intake cooling fans mounted to a front face of the at least one processors, adjacent the cold air plenum.

67. The method of assembling a transportable datacenter of any one of claims 54 to 66 wherein the ventilation system includes processor exhaust cooling fans mounted to a rear face of the at least one processors, adjacent the hot air plenum.

68. The method of assembling a transportable datacenter of any one of claims 54 to 67 further comprises a plurality of racks and a plurality of hot air plenums, wherein at least some of the racks are arranged in pairs, with the rear faces of the processor bays in each rack in a pair adjacent to the same hot air plenum.

69. The method of assembling a transportable datacenter of any one of claims 54 to 68 wherein the processor bays have an exhaust flap.

70. The method of assembling a transportable datacenter of any one of claims 54 to 69 wherein the processor bays are arranged at an oblique angle to provide a straighter air flow path through the transportable datacenter.

71. The method of assembling a transportable datacenter of claim 70 wherein the racks are arranged at an oblique angle to provide a straighter air flow path through the transportable datacenter.

72. The method of assembling a transportable datacenter of any one of claims 54 to 71 wherein the housing is a freight container.

73. The method of assembling a transportable datacenter of any one of claims 54 to 72 wherein the housing is an intermodal shipping container.

74. The method of assembling a transportable datacenter of any one of claims 54 to 73 further including a central fan controller for controlling the operation of the ventilation system in response to one or more measured temperatures.

75. The method of assembling a transportable datacenter of any one of claims 54 to 74 wherein the housing is a transportable shipping container.

76. The method of assembling a transportable datacenter of any one of claims 54 to 75 wherein the transport system includes mounts for mounting the housing on a transport platform.

77. The method of assembling a transportable datacenter of claim 76 wherein the mounts are configured to allow the transportable datacenter to be stacked on top of another similar transportable datacenter.

78. The method of assembling a transportable datacenter of any one of claims 54 to 77 wherein the transport system includes wheels mounted to the transportable datacenter.

79. The method of assembling a transportable datacenter of claim 78 wherein the wheels are detachable.

80. The method of assembling a transportable datacenter of any one of claims 54 to 79 wherein the power system has a bus bar attached to each rack in the racks.