WO2020158176A1

WO2020158176A1 - Layered body

Info

Publication number: WO2020158176A1
Application number: PCT/JP2019/047249
Authority: WO
Inventors: 元気越智; 武史仲野
Original assignee: 日東電工株式会社
Priority date: 2019-01-29
Filing date: 2019-12-03
Publication date: 2020-08-06
Also published as: CN113365810B; KR20210121042A; JP7249160B2; JP2020121424A; TWI826611B; TW202037486A; CN113365810A

Abstract

Provided is a layered body having a surface protective film or a reinforcing film layered on a carrier sheet, wherein the base material surface of the surface protective film or the reinforcing film does not lift readily from the adhesive layer of the carrier sheet, when being adhered continuously onto a member via a roll-to-roll process.　This layered body is a layered body of five or more layers comprising a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), and a resin film (3), in this order, wherein the adhesive layer (1) and the resin film (2) have been layered directly on one another, and the resin film (2) and the adhesive layer (2) have been layered directly on one another. In a direction substantially orthogonal to the length direction, the layered part between the adhesive layer (1) and the resin film (2) is segmented into a plurality by 0.5 mm to 10 mm-wide through-holes. The length of the plurality of layered parts from the adhesive layers (1) and the resin film (2) segmented by the through-holes is 1 mm to 2,000 mm in the length direction. When the layered body is wound around a six-inch diameter roll in such a manner that the resin film (1) is on the outside, the maximum amount by which the plurality of layered parts from the adhesive layer (1) and the resin film (2) segmented by the through-holes are lifted from the adhesive layer (2) is 0.2 mm or less, when the width of the through-holes is 5 mm and the length of the plurality of layered parts from the adhesive layer (1) and the resin film (2) segmented by the through-holes is 50 mm in the length direction.

Description

Laminate

The present invention relates to a laminated body. Preferably, the present invention relates to a laminate that can be suitably used in the manufacturing process of optical members and electronic members.

In the manufacturing process of optical members and electronic members, a surface protective film (SPV) is attached to prevent scratches on the surface of members during processing, assembly, inspection, transportation, etc. A reinforcing film (RF) may be attached for reinforcement (for example, Patent Document 1).

In order to improve the efficiency in the above-mentioned pasting process, a continuous roll-to-roll method is used rather than the step of pasting the surface protection film and the reinforcing film one by one. The process is effective.

If the substrate surface of the surface protective film or the reinforcing film is a laminate pasted on the light release adhesive layer surface of the carrier sheet having a base material and a light release adhesive layer, a roll-to-roll method, The surface protection film and the reinforcing film can be continuously attached to the member. In this case, the carrier sheet is peeled off after the attachment.

However, when the step of attaching to a member using the above-mentioned laminate is continuously performed, the light release adhesive layer of the carrier sheet is used to remove the surface protection film or the base material surface of the reinforcing film (particularly the end portion). ) May appear to float. Such a phenomenon is often seen particularly when the above-mentioned laminated body is unrolled, when it passes through a roll, or when the surface protective film or the separator of the reinforcing film is peeled off.

If the above phenomena occur, the accuracy of the attachment position alignment of the surface protection film and the reinforcing film on the member will decrease, causing a problem of deviation. In addition, when the phenomenon as described above occurs, there arises a problem that the surface protection film and the reinforcing film are peeled off from the light release adhesive layer of the carrier sheet before being attached to the member, triggered by the floating portion.

JP, 2016-17109, A

An object of the present invention is a laminate in which a surface protective film and a reinforcing film are laminated on a carrier sheet, and when continuously attached to a member by roll-to-roll, from a pressure-sensitive adhesive layer included in the carrier sheet. An object of the present invention is to provide a laminate in which the base material surface of a surface protection film or a reinforcing film is hard to float.

The laminate of the present invention is
A laminate having five or more layers, which has a resin film (1), a pressure-sensitive adhesive layer (1), a resin film (2), a pressure-sensitive adhesive layer (2), and a resin film (3) in this order,
The pressure-sensitive adhesive layer (1) and the resin film (2) are directly laminated,
The resin film (2) and the adhesive layer (2) are directly laminated,
The laminated portion of the adhesive layer (1) and the resin film (2) is divided into a plurality of through holes having a width of 0.5 mm to 10 mm in a direction substantially orthogonal to the longitudinal direction,
The length in the longitudinal direction of the laminated portion of the plurality of pressure-sensitive adhesive layers (1) and the resin film (2) divided by the through holes is 1 mm to 2000 mm,
When the resin film (1) is wound around a roll having a diameter of 6 inches so that the resin film (1) is on the outer side, a laminated portion of a plurality of the adhesive layers (1) and the resin film (2) divided by the through holes Is the maximum amount of floating from the pressure-sensitive adhesive layer (2), the width of the through-hole is 5 mm, the plurality of pressure-sensitive adhesive layer (1) and the resin film (2) laminated portion divided by the through-hole When the length in the longitudinal direction is 50 mm, it is 0.2 mm or less.

In one embodiment, the total area of the resin film (2) in the plane direction is smaller than the total area of the adhesive layer (2) in the plane direction.

According to the present invention, a laminate in which a surface protection film or a reinforcing film is laminated on a carrier sheet, and when continuously attached to a member by roll-to-roll, from a pressure-sensitive adhesive layer included in the carrier sheet. It is possible to provide a laminate in which the base material surface of the surface protection film or the reinforcing film does not easily float.

It is a schematic sectional drawing of one Embodiment of the laminated body of this invention.

When the expression "weight" is used in this specification, it may be read as "mass" which is commonly used as an SI system unit indicating weight.

In the present specification, the expression "(meth)acrylic" means "acrylic and/or methacrylic", and the expression "(meth)acrylate" means "acrylate and/or methacrylate". And the expression "(meth)allyl" means "allyl and/or methallyl", and the expression "(meth)acrolein" means "acrolein and/or methacrolein". Means "rain".

<<<< 1. Laminate >>
The laminate of the present invention is a laminate of 5 or more layers having the resin film (1), the pressure-sensitive adhesive layer (1), the resin film (2), the pressure-sensitive adhesive layer (2), and the resin film (3) in this order. Therefore, the pressure-sensitive adhesive layer (1) and the resin film (2) are directly laminated, and the resin film (2) and the pressure-sensitive adhesive layer (2) are directly laminated.

The laminate of the present invention has a resin film (1), a pressure-sensitive adhesive layer (1), a resin film (2), a pressure-sensitive adhesive layer (2) and a resin film (3) in this order, and the pressure-sensitive adhesive layer (1 ) And the resin film (2) are directly laminated, and the resin film (2) and the pressure-sensitive adhesive layer (2) are directly laminated, as long as the effects of the present invention are not impaired. It may have other suitable layers.

The number of layers of the laminate of the present invention is preferably 5 to 10 layers, more preferably 5 to 8 layers, and further preferably 5 to 7 layers, depending on the number of other layers described above. , Particularly preferably 5 to 6 layers, most preferably 5 layers.

In the laminate of the present invention, the laminated portion of the pressure-sensitive adhesive layer (1) and the resin film (2) is divided into a plurality of through holes having a width of 0.5 mm to 10 mm in a direction substantially orthogonal to the longitudinal direction. Become. The width of such a through hole is preferably 0.6 mm to 8 mm, more preferably 0.7 mm to 6 mm, further preferably 0.8 mm to 5 mm, and particularly preferably 0.9 mm to 4 mm. Yes, and most preferably 1 mm to 3 mm. Such a through hole is preferably substantially rectangular parallelepiped-shaped.

In the laminate of the present invention, the laminated portion of the pressure-sensitive adhesive layer (1) and the resin film (2) is divided into a plurality of through holes each having a predetermined length in a direction substantially orthogonal to the longitudinal direction. When a roll-to-roll member is continuously attached to a member, the surface of the surface protective film or the reinforcing film of the carrier sheet may not easily float from the pressure-sensitive adhesive layer of the carrier sheet.

In the laminated body of the present invention, the laminated portion of the pressure-sensitive adhesive layer (1) and the resin film (2) is divided into a plurality of parts by the above-mentioned through holes. The length in the longitudinal direction of the laminated portion of the plurality of pressure-sensitive adhesive layers (1) and the resin film (2) divided by the through holes is 1 mm to 2000 mm, preferably 1 mm to 1000 mm, more preferably 1 mm to 500 mm. And more preferably 2 mm to 500 mm, particularly preferably 2 mm to 400 mm, and most preferably 2 mm to 300 mm. Since the length in the longitudinal direction of the laminated portion of the plurality of pressure-sensitive adhesive layers (1) and the resin film (2) divided by the through holes is within a predetermined range, the laminate of the present invention is roll-to-roll. When continuously attached to a member, the surface of the base material of the surface protection film or the reinforcing film may be hardly floated from the pressure-sensitive adhesive layer of the carrier sheet to form a laminate.

In the laminate of the present invention, the total area of the resin film (2) in the plane direction is preferably smaller than the total area of the adhesive layer (2) in the plane direction. The ratio of the total area of the resin film (2) in the plane direction to the total area of the adhesive layer (2) in the plane direction is preferably 20% to 99.9%, more preferably 50% to 99%. %, more preferably 60% to 98%, particularly preferably 70% to 97%, and most preferably 80% to 96%. Since the total area of the resin film (2) in the plane direction is smaller than the total area of the pressure-sensitive adhesive layer (2) in the plane direction, the laminate of the present invention is roll-to-roll continuous to the member. When it is attached to, the base material surface of the surface protection film or the reinforcing film may become a laminate more difficult to float from the pressure-sensitive adhesive layer of the carrier sheet.

In the laminate of the present invention, the resin film (1) is wound around a roll having a diameter of 6 inches so that the resin film (1) is on the outer side, and the laminated portion of the plurality of pressure-sensitive adhesive layers (1) and the resin film (2) adheres to each other. The maximum amount floating from the agent layer (2) is that the width of the through hole is 5 mm, and the length in the longitudinal direction of the laminated portion of the plurality of adhesive layers (1) and the resin film (2) divided by the through hole is When it is 50 mm, it is 0.5 mm or less, preferably 0.3 mm or less, more preferably 0.2 mm or less, still more preferably 0.1 mm or less, and particularly preferably 0.08 mm or less. , And most preferably 0 mm. The method for measuring the above-mentioned floating will be described later.

In the laminate of the present invention, the resin film (1) is wound around a roll having a diameter of 6 inches so that the resin film (1) is on the outer side, and the laminated portion of the plurality of pressure-sensitive adhesive layers (1) and the resin film (2) adheres to each other. The maximum amount floating from the agent layer (2) is that the width of the through hole is 3 mm, and the length in the longitudinal direction of the laminated portion of the plurality of pressure-sensitive adhesive layers (1) and the resin film (2) divided by the through hole is When it is 50 mm, it is preferably 0.7 mm or less, more preferably 0.5 mm or less, further preferably 0.3 mm or less, particularly preferably 0.2 mm or less, and most preferably 0 mm. .. The method for measuring the above-mentioned floating will be described later.

In the laminate of the present invention, the resin film (1) is wound around a roll having a diameter of 6 inches so that the resin film (1) is on the outer side, and the laminated portion of the plurality of pressure-sensitive adhesive layers (1) and the resin film (2) adheres to each other. The maximum amount floating from the agent layer (2) is that the width of the through hole is 1 mm, and the length in the longitudinal direction of the laminated portion of the plurality of adhesive layer (1) and the resin film (2) divided by the through hole is When it is 50 mm, it is preferably 1.2 mm or less, more preferably 1.0 mm or less, further preferably 0.5 mm or less, particularly preferably 0.2 mm or less, and most preferably 0.1 mm. It is as follows. The method for measuring the above-mentioned floating will be described later.

In one embodiment of the laminate of the present invention, as shown in FIG. 1, the laminate 100 of the present invention comprises a resin film (1) 10, an adhesive layer (1) 20, a resin film (2) 30, and an adhesive. The agent layer (2) 40 and the resin film (3) 50 are directly laminated in this order. In FIG. 1, the laminated portion of the pressure-sensitive adhesive layer (1) 20 and the resin film (2) 30 is divided into a plurality of portions by a through hole 60 having a predetermined length in a direction substantially orthogonal to the longitudinal direction, and is divided. It constitutes a laminated portion of the plurality of pressure-sensitive adhesive layers (1) and the resin film (2).

In one embodiment of the laminate of the present invention shown in FIG. 1, the laminate portion of the resin film (1), the adhesive layer (1) and the resin film (2) can be a surface protection film or a reinforcing film. In this case, the resin film (1) can serve as a separator.

In one embodiment of the laminate of the present invention shown in FIG. 1, the laminate portion of the pressure-sensitive adhesive layer (2) and the resin film (3) can be a carrier sheet. The carrier sheet can also be treated as a surface protective film.

The laminate of the present invention is obtained when the pressure-sensitive adhesive layer (2) is peeled from the resin film (2) at a peeling angle of 180° and a peeling speed of 30 mm/min in an atmosphere of a temperature of 23° C. and a humidity of 50% RH. The adhesive strength is preferably 1 gf/25 mm or more, more preferably 1 gf/25 mm to 10 gf/25 mm, further preferably 1.2 gf/25 mm to 8 gf/25 mm, and further preferably 1.4 gf/25 mm- It is 7 gf/25 mm, particularly preferably 1.6 gf/25 mm to 5 gf/25 mm, and most preferably 1.8 gf/25 mm to 3 gf/25 mm. When the above-mentioned adhesive force is within the above range, the laminate of the present invention makes it possible to prevent the resin film (2) from being lifted from the adhesive layer (2) when continuously attached to a member by roll-to-roll. Can be suppressed. The method for measuring the adhesive strength will be described later.

The laminate of the present invention is obtained when the pressure-sensitive adhesive layer (2) is peeled from the resin film (2) at a peeling angle of 180° and a peeling speed of 300 mm/min in an atmosphere of a temperature of 23° C. and a humidity of 50% RH. The adhesive force is preferably 2 gf/25 mm or more, more preferably 2 gf/25 mm to 20 gf/25 mm, further preferably 2.5 gf/25 mm to 10 gf/25 mm, further preferably 3 gf/25 mm to 9 gf/ It is 25 mm, particularly preferably 3 gf/25 mm to 8 gf/25 mm, and most preferably 3.5 gf/25 mm to 7 gf/25 mm. When the above-mentioned adhesive force is within the above range, the laminate of the present invention makes it possible to prevent the resin film (2) from being lifted from the adhesive layer (2) when continuously attached to a member by roll-to-roll. Can be suppressed. The method for measuring the adhesive strength will be described later.

The laminate of the present invention is obtained when the pressure-sensitive adhesive layer (2) is peeled from the resin film (2) at a peeling angle of 180° and a peeling speed of 2400 mm/min in an atmosphere of a temperature of 23° C. and a humidity of 50% RH. The adhesive strength is preferably 5 gf/25 mm or more, more preferably 5 gf/25 mm to 100 gf/25 mm, further preferably 7 gf/25 mm to 60 gf/25 mm, further preferably 8 gf/25 mm to 40 gf/25 mm. Yes, particularly preferably 9 gf/25 mm to 30 gf/25 mm, and most preferably 10 gf/25 mm to 25 gf/25 mm. When the above-mentioned adhesive force is within the above range, the laminate of the present invention makes it possible to prevent the resin film (2) from being lifted from the adhesive layer (2) when continuously attached to a member by roll-to-roll. Can be suppressed. The method for measuring the adhesive strength will be described later.

The laminate of the present invention peels the pressure-sensitive adhesive layer (1) from glass at a peeling angle of 180 degrees and a peeling speed of 300 mm/min in an atmosphere of a temperature of 23° C. and a humidity of 50% RH. Adhesive strength (1) when the temperature of the adhesive layer (2) is 23° C. and humidity is 50% RH, and the peeling angle is 180 degrees and the peeling speed is 300 mm/min. The adhesive force (2) when peeled from the adhesive layer is preferably adhesive force (1)>adhesive force (2). When the adhesive strength (1)>the adhesive strength (2), the effect of the present invention can be more exhibited. The method for measuring the adhesive strength will be described later.

The laminate of the present invention has a total light transmittance of preferably 60% or more, more preferably 70% to 100%, further preferably 80% to 100%, particularly preferably 83% to 100%. %, and most preferably 85% to 100%. The method for measuring the total light transmittance will be described later.

The haze of the laminate of the present invention is preferably 15% or less, more preferably 0% to 10%, further preferably 0% to 8%, and particularly preferably 0% to 7%. , And most preferably 0% to 6%. The method for measuring the haze will be described later.

<<1-1. Resin film (1)>>
The thickness of the resin film (1) is preferably from 1 μm to 300 μm, more preferably from 10 μm to 200 μm, further preferably from 30 μm to 150 μm, and particularly preferably from the viewpoint that the effect of the present invention can be further exhibited. Is 40 μm to 100 μm, and most preferably 50 μm to 80 μm.

The resin film (1) includes a resin base film (1a).

Examples of the resin substrate film (1a) include plastic films made of polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN) and polybutylene terephthalate (PBT); polyethylene (PE), polypropylene ( PP), polymethylpentene (PMP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA) and other plastic films composed of an olefin resin containing α-olefin as a monomer component; polyvinyl chloride Plastic film composed of (PVC); plastic film composed of vinyl acetate resin; plastic film composed of polycarbonate (PC); plastic film composed of polyphenylene sulfide (PPS); polyamide (nylon), all Plastic film composed of amide resin such as aromatic polyamide (aramid); Plastic film composed of polyimide resin; Plastic film composed of polyether ether ketone (PEEK); Polyethylene (PE), polypropylene (PP) ) And other plastic films composed of olefinic resins; polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, chlorofluoroethylene-vinylidene fluoride And a plastic film composed of a fluororesin such as a copolymer.

The resin base film (1a) may have only one layer, or may have two or more layers. The resin substrate film (1a) may be stretched.

The resin base film (1a) may be surface-treated. Examples of the surface treatment include corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high piezoelectric bombardment exposure, ionizing radiation treatment, and coating treatment with an undercoating agent.

The resin base film (1a) may contain any appropriate additive as long as the effects of the present invention are not impaired.

The resin film (1) may have a release layer (1b) in order to enhance the releasability from the adhesive layer (1). When the resin film (1) has the release layer (1b), the release layer (1b) side is directly laminated on the pressure-sensitive adhesive layer (1).

As the forming material of the release layer (1b), any appropriate forming material can be adopted as long as the effect of the present invention is not impaired. Examples of such a forming material include a silicone type release agent, a fluorine type release agent, a long chain alkyl type release agent, and a fatty acid amide type release agent. Of these, silicone-based release agents are preferred. The release layer (1b) can be formed as a coating layer.

As the thickness of the release layer (1b), any appropriate thickness can be adopted according to the purpose within the range where the effect of the present invention is not impaired. Such a thickness is preferably 10 nm to 2000 nm, more preferably 10 nm to 1500 nm, further preferably 10 nm to 1000 nm, and particularly preferably 10 nm to 500 nm.

The release layer (1b) may be only one layer or two or more layers.

Examples of the silicone type release layer include addition reaction type silicone resins. Specific examples of the addition reaction type silicone resin include KS-774, KS-775, KS-778, KS-779H, KS-847H, KS-847T manufactured by Shin-Etsu Chemical; TPR- manufactured by Toshiba Silicone. 6700, TPR-6710, TPR-6721; Toray Dow Corning SD7220, SD7226; and the like. The coating amount (after drying) of the silicone-based release layer is preferably 0.01 g/m ² to 2 g/m ² , more preferably 0.01 g/m ² to 1 g/m ² , and further preferably It is 0.01 g/m ² to 0.5 g/m ² .

The release layer (1b) is usually formed by coating the above-mentioned forming material on any appropriate layer by a conventionally known coating method such as reverse gravure coating, bar coating, die coating, etc. It can be performed by heat treatment at about 200° C. to cure. If necessary, heat treatment and irradiation with active energy rays such as ultraviolet irradiation may be used in combination.

The resin film (1) may have an antistatic layer (1c).

As the thickness of the antistatic layer (1c), any appropriate thickness can be adopted as long as the effect of the present invention is not impaired. Such a thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, further preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.

The antistatic layer (1c) may be a single layer or two or more layers.

As the antistatic layer (1c), any suitable antistatic layer can be adopted as long as it can exhibit an antistatic effect as long as the effect of the present invention is not impaired. Such an antistatic layer is preferably an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on any appropriate base material layer. Specifically, for example, it is an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on the resin substrate film (1a). Specific coating methods include a roll coating method, a bar coating method and a gravure coating method.

As the conductive polymer, any appropriate conductive polymer can be adopted as long as the effect of the present invention is not impaired. Examples of such a conductive polymer include a conductive polymer obtained by doping a π-conjugated conductive polymer with a polyanion. Examples of the π-conjugated conductive polymer include chain conductive polymers such as polythiophene, polypyrrole, polyaniline, and polyacetylene. Examples of the polyanion include polystyrene sulfonic acid, polyisoprene sulfonic acid, polyvinyl sulfonic acid, polyallyl sulfonic acid, polyacrylic acid ethyl sulfonic acid, and polymethacryl carboxylic acid. The conductive polymer may be only one kind or two or more kinds.

One embodiment of the resin film (1) includes a resin substrate film (1a), an antistatic layer (1c) and a release layer (1b) in this order. Typically, this embodiment comprises a resin substrate film (1a), an antistatic layer (1c) and a release layer (1b).

Another embodiment of the resin film (1) includes an antistatic layer (1c), a resin base film (1a), an antistatic layer (1c) and a release layer (1b) in this order. Typically, this embodiment comprises an antistatic layer (1c), a resin substrate film (1a), an antistatic layer (1c) and a release layer (1b).

<<1-2. Adhesive layer (1)>>
As the pressure-sensitive adhesive layer (1), any appropriate pressure-sensitive adhesive layer can be adopted as long as the effect of the present invention is not impaired. The pressure-sensitive adhesive layer (1) may be a single layer or two or more layers.

The thickness of the pressure-sensitive adhesive layer (1) is preferably 0.5 μm to 150 μm, more preferably 1 μm to 100 μm, and further preferably 3 μm to 80 μm, from the viewpoint that the effect of the present invention can be further exhibited. Particularly preferred is 5 μm to 50 μm, and most preferred is 5 μm to 30 μm.

As described above, the pressure-sensitive adhesive layer (1) has a laminated portion with the resin film (2) divided into a plurality of through holes each having a predetermined length in a direction substantially orthogonal to the longitudinal direction.

The pressure-sensitive adhesive layer (1) is preferably composed of at least one selected from the group consisting of acrylic pressure-sensitive adhesives, urethane pressure-sensitive adhesives, rubber pressure-sensitive adhesives and silicone pressure-sensitive adhesives.

The adhesive layer (1) can be formed by any appropriate method. Examples of such a method include, for example, at least one selected from the group consisting of a pressure-sensitive adhesive composition (acrylic pressure-sensitive adhesive composition, urethane-based pressure-sensitive adhesive composition, rubber-based pressure-sensitive adhesive composition, silicone-based pressure-sensitive adhesive composition). ) Is applied on any suitable base material (for example, the resin film (2)), heated and dried as necessary, and cured as necessary to form a pressure-sensitive adhesive layer on the base material. There is a method of doing. Examples of such a coating method include a gravure roll coater, a reverse roll coater, a kiss roll coater, a dip roll coater, a bar coater, a knife coater, an air knife coater, a spray coater, a comma coater, a direct coater and a roll brush coater. The method of is mentioned.

The adhesive layer (1) may include a conductive component. The conductive component may be only one kind or two or more kinds.

<1-2-1. Acrylic adhesive>
The acrylic pressure-sensitive adhesive is formed from an acrylic pressure-sensitive adhesive composition.

The acrylic pressure-sensitive adhesive composition preferably contains an acrylic polymer and a crosslinking agent from the viewpoint that the effects of the present invention can be more exhibited.

The acrylic polymer can be called a so-called base polymer in the field of acrylic pressure-sensitive adhesives. Only one type of acrylic polymer may be used, or two or more types may be used.

The content ratio of the acrylic polymer in the acrylic pressure-sensitive adhesive composition is preferably 60% by weight to 99.9% by weight, and more preferably 65% by weight to 99.9% by weight, in terms of solid content. It is more preferably 70% to 99.9% by weight, particularly preferably 75% to 99.9% by weight, and most preferably 80% to 99.9% by weight.

As the acrylic polymer, any suitable acrylic polymer can be adopted as long as the effect of the present invention is not impaired.

The weight average molecular weight of the acrylic polymer is preferably 300,000 to 2,500,000, more preferably 350,000 to 2,000,000, and further preferably 400,000 to 1800,000, from the viewpoint that the effects of the present invention can be further exhibited. And particularly preferably 500,000 to 1,500,000.

The acrylic polymer is preferably a (meth)acrylic acid alkyl ester in which the alkyl group of the (a component) alkyl ester moiety has 4 to 12 carbon atoms from the viewpoint that the effect of the present invention can be further exhibited, and (b) It is an acrylic polymer formed by polymerization from a composition (A) containing (component) at least one selected from the group consisting of (meth)acrylic acid ester having an OH group and (meth)acrylic acid.

The acrylic polymer is preferably a (meth)acrylic acid alkyl ester in which the alkyl group of the alkyl ester moiety has 4 to 12 carbon atoms, as the component (a), from the viewpoint that the effects of the present invention can be further exhibited. And (acrylic acid) as a component (b), which is formed by polymerization from the composition (A) and contains (meth)acrylic acid without containing (meth)acrylic acid ester having an OH group, and more preferably , (A component) does not include (meth)acrylic acid alkyl ester in which the alkyl group of the alkyl ester moiety has 4 to 8 carbon atoms, and (b component) does not include (meth)acrylic acid ester having an OH group. It is an acrylic polymer formed by polymerization from the composition (A) containing acrylic acid in the composition.

Each of (a component) and (b component) may be independently one type, or two or more types.

Examples of the (meth)acrylic acid alkyl ester (component a) in which the alkyl group of the alkyl ester moiety has 4 to 12 carbon atoms include, for example, n-butyl (meth)acrylate, isobutyl (meth)acrylate, and (meth)acrylate. S-Butyl acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-(meth)acrylate Ethylhexyl, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate And so on. Among these, n-butyl (meth)acrylate and 2-ethylhexyl (meth)acrylate are preferable, and n-butyl acrylate and acryl are more preferable, from the viewpoint that the effects of the present invention can be further exhibited. It is 2-ethylhexyl acid.

Examples of at least one component (component (b)) selected from the group consisting of (meth)acrylic acid ester having an OH group and (meth)acrylic acid include, for example, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, Examples thereof include (meth)acrylic acid ester having an OH group such as hydroxybutyl (meth)acrylate and (meth)acrylic acid. Among these, hydroxyethyl (meth)acrylate and (meth)acrylic acid are preferable, and hydroxyethyl acrylate and acrylic acid are more preferable, from the viewpoint that the effects of the present invention can be further exhibited.

The composition (A) may contain a copolymerizable monomer other than the components (a) and (b). The copolymerizable monomer may be only one type, or may be two or more types. Such copolymerizable monomers include, for example, itaconic acid, maleic acid, fumaric acid, crotonic acid, isocrotonic acid, and acid anhydrides thereof (for example, acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride). ) And other carboxyl group-containing monomers (excluding (meth)acrylic acid); (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-methylol(meth)acrylamide, N-methoxymethyl(meth)acrylamide , N-butoxymethyl (meth)acrylamide, N-hydroxyethyl (meth)acrylamide, and other amide group-containing monomers; aminoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, t-butyl (meth)acrylate Amino group-containing monomers such as aminoethyl; epoxy group-containing monomers such as glycidyl (meth)acrylate and methylglycidyl (meth)acrylate; cyano group-containing monomers such as acrylonitrile and methacrylonitrile; N-vinyl-2-pyrrolidone, Heterocycle-containing vinyl monomers such as (meth)acryloylmorpholine, N-vinylpiperidone, N-vinylpiperazine, N-vinylpyrrole, N-vinylimidazole, vinylpyridine, vinylpyrimidine, vinyloxazole; sulfonic acids such as sodium vinylsulfonate Group-containing monomer; phosphoric acid group-containing monomer such as 2-hydroxyethylacryloyl phosphate; imide group-containing monomer such as cyclohexylmaleimide and isopropylmaleimide; isocyanate group-containing monomer such as 2-methacryloyloxyethylisocyanate; cyclopentyl (meth)acrylate, (Meth)acrylic acid ester having an alicyclic hydrocarbon group such as cyclohexyl (meth)acrylate and isobornyl (meth)acrylate; aromatic such as phenyl (meth)acrylate, phenoxyethyl (meth)acrylate and benzyl (meth)acrylate (Meth)acrylic ester having a hydrocarbon group; vinyl ester such as vinyl acetate and vinyl propionate; aromatic vinyl compound such as styrene and vinyltoluene; olefins and dienes such as ethylene, butadiene, isoprene and isobutylene; vinyl Vinyl ethers such as alkyl ethers; vinyl chloride; and the like.

As the copolymerizable monomer, a polyfunctional monomer can also be adopted. The polyfunctional monomer means a monomer having two or more ethylenically unsaturated groups in one molecule. As the ethylenically unsaturated group, any appropriate ethylenically unsaturated group can be adopted as long as the effects of the present invention are not impaired. Examples of such an ethylenically unsaturated group include radically polymerizable functional groups such as a vinyl group, a propenyl group, an isopropenyl group, a vinyl ether group (vinyloxy group), and an allyl ether group (allyloxy group). Examples of the polyfunctional monomer include hexanediol di(meth)acrylate, butanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol. Di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, trimethylolpropane tri(meth)acrylate, tetramethylolmethane tri(meth)acrylate, allyl Examples thereof include (meth)acrylate, vinyl (meth)acrylate, divinylbenzene, epoxy acrylate, polyester acrylate and urethane acrylate. Only one kind of such a polyfunctional monomer may be used, or two or more kinds thereof may be used.

As a copolymerizable monomer, (meth)acrylic acid alkoxyalkyl ester can also be adopted. Examples of the (meth)acrylic acid alkoxyalkyl ester include 2-(meth)acrylic acid 2-methoxyethyl, (meth)acrylic acid 2-ethoxyethyl, (meth)acrylic acid methoxytriethylene glycol, and (meth)acrylic acid 3-methacrylate. Examples thereof include methoxypropyl, 3-ethoxypropyl (meth)acrylate, 4-methoxybutyl (meth)acrylate, and 4-ethoxybutyl (meth)acrylate. The (meth)acrylic acid alkoxyalkyl ester may be only one kind, or may be two or more kinds.

The content of the (meth)acrylic acid alkyl ester (a component) in which the alkyl group of the alkyl ester moiety has 4 to 12 carbon atoms is a monomer that constitutes the acrylic polymer in that the effects of the present invention can be further exhibited. It is preferably 30% by weight or more, more preferably 35% by weight to 99% by weight, further preferably 40% by weight to 98% by weight, particularly preferably 50% by weight based on the total amount of the components (100% by weight). % By weight to 95% by weight.

The content of at least one kind (component (b)) selected from the group consisting of (meth)acrylic acid ester having an OH group and (meth)acrylic acid is such that the acrylic polymer is added in that the effect of the present invention can be further exhibited. It is preferably 1% by weight or more, more preferably 1% by weight to 30% by weight, further preferably 2% by weight to 20% by weight, based on the total amount of the constituent monomer components (100% by weight). It is preferably 3% by weight to 10% by weight.

The composition (A) may contain any appropriate other component as long as the effect of the present invention is not impaired. Examples of such other components include a polymerization initiator, a chain transfer agent, and a solvent. As the content of these other components, any appropriate content can be adopted as long as the effect of the present invention is not impaired.

As the polymerization initiator, a thermal polymerization initiator, a photopolymerization initiator (photoinitiator) or the like can be adopted depending on the type of the polymerization reaction. The polymerization initiator may be only one type, or may be two or more types.

The thermal polymerization initiator can be preferably used when the acrylic polymer is obtained by solution polymerization. Examples of such thermal polymerization initiators include azo-based polymerization initiators, peroxide-based polymerization initiators (eg, dibenzoyl peroxide, tert-butyl permaleate, etc.), redox-based polymerization initiators, and the like. .. Among these thermal polymerization initiators, the azo initiators disclosed in JP-A-2002-69411 are particularly preferable. Such an azo-based polymerization initiator is preferable in that the decomposed product of the polymerization initiator is unlikely to remain in the acrylic polymer as a portion causing generation of a heat-generated gas (outgas). Examples of the azo-based polymerization initiator include 2,2′-azobisisobutyronitrile (hereinafter sometimes referred to as AIBN) and 2,2′-azobis-2-methylbutyronitrile (hereinafter referred to as AMBN). , 2,2′-azobis(2-methylpropionic acid)dimethyl, 4,4′-azobis-4-cyanovaleric acid and the like.

The photopolymerization initiator can be preferably used when the acrylic polymer is obtained by active energy ray polymerization. Examples of the photopolymerization initiator include benzoin ether photopolymerization initiators, acetophenone photopolymerization initiators, α-ketol photopolymerization initiators, aromatic sulfonyl chloride photopolymerization initiators, and photoactive oxime photopolymerization initiators. Agents, benzoin photopolymerization initiators, benzyl photopolymerization initiators, benzophenone photopolymerization initiators, ketal photopolymerization initiators, thioxanthone photopolymerization initiators, and the like.

Examples of the benzoin ether photopolymerization initiator include benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2,2-dimethoxy-1,2-diphenylethan-1-one, and anisole. Examples include methyl ether. Examples of the acetophenone-based photopolymerization initiator include 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexylphenyl ketone, 4-phenoxydichloroacetophenone, and 4-(t-butyl). Examples thereof include dichloroacetophenone. Examples of the α-ketol-based photopolymerization initiator include 2-methyl-2-hydroxypropiophenone and 1-[4-(2-hydroxyethyl)phenyl]-2-methylpropan-1-one. .. Examples of the aromatic sulfonyl chloride photopolymerization initiator include 2-naphthalene sulfonyl chloride. Examples of the photoactive oxime-based photopolymerization initiator include 1-phenyl-1,1-propanedione-2-(o-ethoxycarbonyl)-oxime. Examples of the benzoin-based photopolymerization initiator include benzoin and the like. Examples of the benzyl photopolymerization initiator include benzyl and the like. Examples of the benzophenone-based photopolymerization initiator include benzophenone, benzoylbenzoic acid, 3,3′-dimethyl-4-methoxybenzophenone, polyvinylbenzophenone, α-hydroxycyclohexylphenylketone, and the like. Examples of the ketal photopolymerization initiator include benzyl dimethyl ketal. Examples of the thioxanthone photopolymerization initiator include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-diisopropylthioxanthone and dodecylthioxanthone.

The acrylic pressure-sensitive adhesive composition may contain a crosslinking agent. By using the cross-linking agent, the cohesive force of the acrylic pressure-sensitive adhesive can be improved, and the effect of the present invention can be further exhibited. The cross-linking agent may be only one kind or two or more kinds.

As the crosslinking agent, a polyfunctional isocyanate crosslinking agent, an epoxy crosslinking agent, a melamine crosslinking agent, a peroxide crosslinking agent, a urea crosslinking agent, a metal alkoxide crosslinking agent, a metal chelate crosslinking agent, a metal salt. Examples thereof include a system-based crosslinking agent, a carbodiimide-based crosslinking agent, an oxazoline-based crosslinking agent, an aziridine-based crosslinking agent, and an amine-based crosslinking agent. Among these, at least one kind (component (c)) selected from the group consisting of a polyfunctional isocyanate cross-linking agent and an epoxy cross-linking agent is preferable from the viewpoint that the effect of the present invention can be further exhibited.

Examples of the polyfunctional isocyanate cross-linking agent include lower aliphatic polyisocyanates such as 1,2-ethylene diisocyanate, 1,4-butylene diisocyanate and 1,6-hexamethylene diisocyanate; cyclopentylene diisocyanate, cyclohexylene diisocyanate, Aliphatic polyisocyanates such as isophorone diisocyanate, hydrogenated tolylene diisocyanate, hydrogenated xylene diisocyanate; 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate, etc. Aromatic polyisocyanates of Examples of the polyfunctional isocyanate cross-linking agent include trimethylolpropane/tolylene diisocyanate adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name “Coronate L”), trimethylolpropane/hexamethylene diisocyanate adduct (Japan Polyurethane Industry Co., Ltd. Company name, product name "Coronate HL"), product name "Coronate HX" (Nippon Polyurethane Industry Co., Ltd.), trimethylolpropane/xylylene diisocyanate adduct (Mitsui Chemicals, Inc., product name "Takenate 110N"), etc. Commercial products are also included.

Examples of the epoxy cross-linking agent (polyfunctional epoxy compound) include N,N,N′,N′-tetraglycidyl-m-xylenediamine, diglycidylaniline, and 1,3-bis(N,N-diglycidylamino). Methyl) cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, Glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, trimethylolpropane polyglycidyl ether, adipic acid diglycidyl ester, o-phthalic acid diglycidyl ester, triglycidyl-tris(2- Examples thereof include hydroxyethyl)isocyanurate, resorcin diglycidyl ether, bisphenol-S-diglycidyl ether, and epoxy resins having two or more epoxy groups in the molecule. As the epoxy-based cross-linking agent, commercially available products such as trade name “Tetrad C” (manufactured by Mitsubishi Gas Chemical Co., Inc.) can also be mentioned.

As the content of the cross-linking agent in the acrylic pressure-sensitive adhesive composition, any appropriate content can be adopted as long as the effect of the present invention is not impaired. Such a content is, for example, preferably 0.05 parts by weight to 20 parts by weight with respect to the solid content (100 parts by weight) of the acrylic polymer, from the viewpoint that the effect of the present invention can be exhibited more. It is more preferably 0.1 part by weight to 18 parts by weight, further preferably 0.5 parts by weight to 15 parts by weight, and particularly preferably 0.5 parts by weight to 10 parts by weight.

The acrylic pressure-sensitive adhesive composition may contain any appropriate other component as long as the effect of the present invention is not impaired. Examples of such other components include polymer components other than acrylic polymers, crosslinking accelerators, crosslinking catalysts, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), Anti-aging agent, inorganic filler, organic filler, metal powder, colorant (pigment or dye, etc.), foil, UV absorber, antioxidant, light stabilizer, chain transfer agent, plasticizer, softener, Examples thereof include surfactants, antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat stabilizers, polymerization inhibitors, lubricants, solvents and catalysts.

<1-2-2. Urethane adhesive>
As the urethane-based pressure-sensitive adhesive, any appropriate urethane-based pressure-sensitive adhesive may be adopted, for example, known urethane-based pressure-sensitive adhesives described in JP-A-2017-039859, etc., within a range that does not impair the effects of the present invention. .. As such a urethane-based pressure-sensitive adhesive, for example, a urethane-based pressure-sensitive adhesive formed from a urethane-based pressure-sensitive adhesive composition, wherein the urethane-based pressure-sensitive adhesive composition is selected from the group consisting of a urethane prepolymer and a polyol. It contains at least one kind and a crosslinking agent. The urethane-based pressure-sensitive adhesive may be only one kind or two or more kinds. The urethane-based pressure-sensitive adhesive may contain any appropriate component as long as the effect of the present invention is not impaired.

<1-2-3. Rubber adhesive>
As the rubber-based pressure-sensitive adhesive, any suitable rubber-based pressure-sensitive adhesive can be adopted, for example, known rubber-based pressure-sensitive adhesives described in JP-A-2005-074771 and the like, within a range that does not impair the effects of the present invention. .. These may be only one kind or two or more kinds. The rubber-based pressure-sensitive adhesive may contain any appropriate component as long as the effect of the present invention is not impaired.

<1-2-4. Silicone adhesive>
As the silicone-based pressure-sensitive adhesive, any appropriate silicone-based pressure-sensitive adhesive may be adopted, for example, known silicone-based pressure-sensitive adhesives described in JP-A-2014-047280 and the like, as long as the effects of the present invention are not impaired. .. These may be only one kind or two or more kinds. The silicone-based pressure-sensitive adhesive may contain any appropriate component as long as the effect of the present invention is not impaired.

<1-2-5. Conductive component>
The adhesive layer (1) may contain a conductive component. Typically, a pressure-sensitive adhesive composition as a material of the pressure-sensitive adhesive layer (1) (a group consisting of an acrylic pressure-sensitive adhesive composition, a urethane pressure-sensitive adhesive composition, a rubber pressure-sensitive adhesive composition, a silicone pressure-sensitive adhesive composition At least one selected from the above may contain a conductive component.

As the conductive component, any appropriate conductive component can be adopted as long as the effect of the present invention is not impaired. Such a conductive component is preferably at least one compound selected from an ionic liquid, an ion conductive polymer, an ion conductive filler and an electric conductive polymer.

In the case where the pressure-sensitive adhesive composition contains a conductive component, the ratio of the base polymer (for example, acrylic polymer, polyol, urethane prepolymer, rubber polymer, silicone polymer) to the conductive component is such that the conductive component is With respect to 100 parts by weight of the base polymer, it is preferably 0.01 parts by weight to 10 parts by weight, more preferably 0.05 parts by weight to 9.0 parts by weight, and further preferably 0.075 parts by weight to 8 parts by weight. 0.0 parts by weight, particularly preferably 0.1 parts by weight to 7.0 parts by weight.

As the ionic liquid, any appropriate ionic liquid can be adopted as long as the effect of the present invention is not impaired. Here, the ionic liquid means a molten salt (ionic compound) which is liquid at 25°C. The ionic liquid may be only one kind or two or more kinds.

Such an ionic liquid is preferably an ionic liquid composed of a fluoroorganic anion and an onium cation.

As the onium cation that can form the ionic liquid, any appropriate onium cation can be adopted as long as the effect of the present invention is not impaired. Such an onium cation is preferably at least one selected from nitrogen-containing onium cations, sulfur-containing onium cations, and phosphorus-containing onium cations.

The onium cation that can form the ionic liquid is preferably at least one selected from cations having a structure represented by any one of the general formulas (1) to (5) from the viewpoint that the effects of the present invention can be further exhibited. Is.

In the general formula (1), Ra represents a hydrocarbon group having 4 to 20 carbon atoms and may contain a hetero atom, and Rb and Rc are the same or different and each represents hydrogen or a carbon atom having 1 to 16 carbon atoms. It represents a hydrogen group and may contain a hetero atom. However, when the nitrogen atom contains a double bond, there is no Rc.

In the general formula (2), Rd represents a hydrocarbon group having 2 to 20 carbon atoms and may contain a hetero atom, and Re, Rf and Rg are the same or different and each represents hydrogen or a carbon number of 1 to It represents 16 hydrocarbon groups and may contain a hetero atom.

In the general formula (3), Rh represents a hydrocarbon group having 2 to 20 carbon atoms and may include a hetero atom, and Ri, Rj, and Rk are the same or different and each represents hydrogen or a carbon number of 1 to It represents 16 hydrocarbon groups and may contain a hetero atom.

In the general formula (4), Z represents a nitrogen atom, a sulfur atom, or a phosphorus atom, Rl, Rm, Rn, and Ro are the same or different and each represents a hydrocarbon group having 1 to 20 carbon atoms; It may contain atoms. However, when Z is a sulfur atom, there is no Ro.

In the general formula (5), X represents a Li atom, a Na atom, or a K atom.

Examples of the cation represented by the general formula (1) include a pyridinium cation, a pyrrolidinium cation, a piperidinium cation, a cation having a pyrroline skeleton, and a cation having a pyrrole skeleton.

Specific examples of the cation represented by the general formula (1) include 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-ethyl-3-methylpyridinium cation, 1-butyl. Pyridinium cation such as -3-methylpyridinium cation, 1-hexyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, 1-octyl-4-methylpyridinium cation; 1-ethyl-1-methylpyrroli Dinium cation, 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1-butylpyrrolidinium cation, 1-methyl-1-pentylpyrrolidinium cation, 1-methyl-1-hexylpyrrolidinide Cation, 1-methyl-1-heptylpyrrolidinium cation, 1-ethyl-1-propylpyrrolidinium cation, 1-ethyl-1-butylpyrrolidinium cation, 1-ethyl-1-pentylpyrrolidinium cation , 1-Ethyl-1-hexylpyrrolidinium cation, 1-ethyl-1-heptylpyrrolidinium cation, etc.; 1-methyl-1-ethylpiperidinium cation, 1-methyl-1 -To propylpiperidinium cation, 1-methyl-1-butylpiperidinium cation, 1-methyl-1-pentylpiperidinium cation, 1-methyl-1-hexylpiperidinium cation, 1-methyl-1- Putylpiperidinium cation, 1-ethyl-1-propylpiperidinium cation, 1-ethyl-1-butylpiperidinium cation, 1-ethyl-1-pentylpiperidinium cation, 1-ethyl-1-hexylpi And a piperidinium cation such as 1-ethyl-1-heptylpiperidinium cation and 1-propyl-1-butylpiperidinium cation; and the like, more preferably 1-hexylpyridinium cation , 1-ethyl-3-methylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-octyl-4-methylpyridinium cation, 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1-propyl It is a piperidinium cation.

Examples of the cation represented by the general formula (2) include imidazolium cation, tetrahydropyrimidinium cation, and dihydropyrimidinium cation.

Specific examples of the cation represented by the general formula (2) include, for example, 1,3-dimethylimidazolium cation, 1,3-diethylimidazolium cation, 1-ethyl-3-methylimidazolium cation, 1-butyl. -3-Methylimidazolium cation, 1-hexyl-3-methylimidazolium cation, 1-octyl-3-methylimidazolium cation, 1-decyl-3-methylimidazolium cation, 1-dodecyl-3-methylimidazole It is an imidazolium cation such as a lithium cation and a 1-tetradecyl-3-methylimidazolium cation, and more preferably a 1-ethyl-3-methylimidazolium cation and a 1-hexyl-3-methylimidazolium cation.

Examples of the cation represented by the general formula (3) include a pyrazolium cation and a pyrazolinium cation.

Specific examples of the cation represented by the general formula (3) include, for example, 1-methylpyrazolium cation, 3-methylpyrazolium cation, 1-ethyl-2-methylpyrazolinium cation, 1-ethyl- A pyrazolium cation such as a 2,3,5-trimethylpyrazolium cation, a 1-propyl-2,3,5-trimethylpyrazolium cation, a 1-butyl-2,3,5-trimethylpyrazolium cation; Pyra such as 1-ethyl-2,3,5-trimethylpyrazolinium cation, 1-propyl-2,3,5-trimethylpyrazolinium cation, 1-butyl-2,3,5-trimethylpyrazolinium cation Zolinium cation; and the like.

Examples of the cation represented by the general formula (4) include a tetraalkylammonium cation, a trialkylsulfonium cation, a tetraalkylphosphonium cation, and a part of the above alkyl group substituted with an alkenyl group, an alkoxyl group, or an epoxy group. Some of them are listed.

Specific examples of the cation represented by the general formula (4) include, for example, triethylmethylammonium cation, tributylethylammonium cation, trimethyldecylammonium cation, diethylmethylsulfonium cation, dibutylethylsulfonium cation, dimethyldecylsulfonium cation, triethylmethyl. Asymmetric tetraalkylammonium cations such as phosphonium cations, tributylethylphosphonium cations, trimethyldecylphosphonium cations, trialkylsulfonium cations, tetraalkylphosphonium cations, N,N-diethyl-N-methyl-N-(2-methoxyethyl) Ammonium cation, glycidyl trimethyl ammonium cation, diallyl dimethyl ammonium cation, N,N-dimethyl-N-ethyl-N-propyl ammonium cation, N,N-dimethyl-N-ethyl-N-butyl ammonium cation, N,N-dimethyl -N-ethyl-N-pentylammonium cation, N,N-dimethyl-N-ethyl-N-hexylammonium cation, N,N-dimethyl-N-ethyl-N-heptylammonium cation, N,N-dimethyl-N -Ethyl-N-nonyl ammonium cation, N,N-dimethyl-N,N-dipropyl ammonium cation, N,N-diethyl-N-propyl-N-butyl ammonium cation, N,N-dimethyl-N-propyl- N-pentyl ammonium cation, N,N-dimethyl-N-propyl-N-hexyl ammonium cation, N,N-dimethyl-N-propyl-N-heptyl ammonium cation, N,N-dimethyl-N-butyl-N- Hexyl ammonium cation, N,N-diethyl-N-butyl-N-heptyl ammonium cation, N,N-dimethyl-N-pentyl-N-hexyl ammonium cation, N,N-dimethyl-N,N-dihexyl ammonium cation, Trimethylheptyl ammonium cation, N,N-diethyl-N-methyl-N-propyl ammonium cation, N,N-diethyl-N-methyl-N-pentyl ammonium cation, N,N-diethyl-N-methyl-N-heptyl Ammonium cation, N,N-diethyl-N-propyl-N-pentylammonium cation, triethylpropylammonium cation, triethylpentylammonium cation , Triethylheptyl ammonium cation, N,N-dipropyl-N-methyl-N-ethyl ammonium cation, N,N-dipropyl-N-methyl-N-pentyl ammonium cation, N,N-dipropyl-N-butyl-N- Hexyl ammonium cation, N,N-dipropyl-N,N-dihexyl ammonium cation, N,N-dibutyl-N-methyl-N-pentyl ammonium cation, N,N-dibutyl-N-methyl-N-hexyl ammonium cation, Examples thereof include trioctylmethylammonium cation and N-methyl-N-ethyl-N-propyl-N-pentylammonium cation, and more preferably trimethylpropylammonium cation.

As the fluoroorganic anion that can form the ionic liquid, any appropriate fluoroorganic anion can be adopted as long as the effect of the present invention is not impaired. Such a fluoroorganic anion may be completely fluorinated (perfluorinated) or partially fluorinated.

Examples of such a fluoroorganic anion include perfluoroalkyl sulfonate, bis(fluorosulfonyl)imide, bis(perfluoroalkanesulfonyl)imide, and more specifically, for example, trifluoromethane sulfonate, pentafluoroethane sulfonate. , Heptafluoropropane sulfonate, nonafluorobutane sulfonate, bis(fluorosulfonyl)imide, bis(trifluoromethanesulfonyl)imide.

As a specific example of the ionic liquid, a combination of the above cation component and the above anion component can be appropriately selected and used. Specific examples of such an ionic liquid include, for example, 1-hexylpyridinium bis(fluorosulfonyl)imide, 1-ethyl-3-methylpyridinium trifluoromethanesulfonate, 1-ethyl-3-methylpyridinium pentafluoroethanesulfonate, 1-ethyl-3-methylpyridinium heptafluoropropane sulfonate, 1-ethyl-3-methylpyridinium nonafluorobutane sulfonate, 1-butyl-3-methylpyridinium trifluoromethane sulfonate, 1-butyl-3-methylpyridinium bis(trifluoromethane Sulfonyl)imide, 1-octyl-4-methylpyridinium bis(fluorosulfonyl)imide, 1-methyl-1-propylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-propylpyrrolidinium bis(fluoro) Sulfonyl)imide, 1-methyl-1-propylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-propylpiperidinium bis(fluorosulfonyl)imide, 1-ethyl-3-methylimidazolium trifluoromethane Sulfonate, 1-ethyl-3-methylimidazolium heptafluoropropane sulfonate, 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide, 1-ethyl-3-methylimidazolium bis(fluorosulfonyl)imide, 1 -Hexyl-3-methylimidazolium bis(fluorosulfonyl)imide, trimethylpropylammonium bis(trifluoromethanesulfonyl)imide, lithium bis(trifluoromethanesulfonyl)imide, lithium bis(fluorosulfonyl)imide.

As the ionic liquid, a commercially available one may be used, but it is also possible to synthesize it as follows. The method for synthesizing an ionic liquid is not particularly limited as long as the desired ionic liquid can be obtained, but in general, the literature "Ionic liquids-the forefront and future of development-" (CMC Publishing Co., Ltd.) Issue), a halide method, a hydroxide method, an acid ester method, a complex formation method, a neutralization method and the like are used.

The halide method, the hydroxide method, the acid ester method, the complex formation method, and the neutralization method are shown below for the synthesis method using a nitrogen-containing onium salt as an example. Other sulfur-containing onium salts, phosphorus-containing onium salts Other ionic liquids such as the above can be obtained by the same method.

The halide method is a method performed by the reactions shown in the reaction formulas (1) to (3). First, a tertiary amine is reacted with an alkyl halide to obtain a halide (reaction formula (1), chlorine, bromine, or iodine is used as halogen).

The obtained halide is an acid (HA) or salt having the anion structure (A ⁻ ) of the desired ionic liquid (MA and M are cations that form a salt with the desired anion such as ammonium, lithium, sodium and potassium). ) And the target ionic liquid (R ₄ NA) is obtained.

The hydroxide method is a method performed by the reactions shown in the reaction formulas (4) to (8). First, a reaction of a halide (R ₄ NX) with an ion exchange membrane method electrolysis (reaction formula (4)), an OH type ion exchange resin method (reaction formula (5)), or silver oxide (Ag ₂ O) (reaction formula ( In 6)), a hydroxide (R ₄ NOH) is obtained (as halogen, chlorine, bromine or iodine is used).

By using the reaction of the reaction formulas (7) to (8) for the obtained hydroxide in the same manner as in the halogenation method, the target ionic liquid (R ₄ NA) can be obtained.

The acid ester method is a method performed by the reactions shown in the reaction formulas (9) to (11). First, a tertiary amine (R ₃ N) is reacted with an acid ester to obtain an acid ester product (reaction formula (9). As the acid ester, inorganic acids such as sulfuric acid, sulfurous acid, phosphoric acid, phosphorous acid, and carbonic acid can be used. Esters and methanesulfonic acid, methylphosphonic acid, and organic acid esters such as formic acid are used).

The target ionic liquid (R ₄ NA) is obtained by using the reaction of the reaction formulas (10) to (11) for the obtained acid ester product in the same manner as in the above halogenation method. Alternatively, an ionic liquid can be directly obtained by using methyltrifluoromethanesulfonate, methyltrifluoroacetate, or the like as the acid ester.

The neutralization method is a method performed by the reaction shown in the reaction formula (12). Tertiary amine and _{_{_{_{CF 3 COOH, CF 3 SO 3}}}} H, is reacted _{_{_{_{(CF 3 SO 2) 2 NH}}}} , (CF 3 SO 2) 3 CH, and organic acids such as _{_{(C 2 F 5 SO 2)}} 2 NH Can be obtained.

R in the above reaction formulas (1) to (12) represents hydrogen or a hydrocarbon group having 1 to 20 carbon atoms and may contain a hetero atom.

As the ion conductive polymer, any appropriate ion conductive polymer can be adopted as long as the effect of the present invention is not impaired. Examples of such an ion conductive polymer include an ion conductive polymer obtained by polymerizing or copolymerizing a monomer having a quaternary ammonium salt group; polythiophene, polyaniline, polypyrrole, polyethyleneimine, allylamine-based polymer, and the like. Conductive polymer; and the like. The ion conductive polymer may be only one kind or two or more kinds.

As the ion conductive filler, any appropriate ion conductive filler can be adopted as long as the effect of the present invention is not impaired. Examples of such an ion conductive filler include tin oxide, antimony oxide, indium oxide, cadmium oxide, titanium oxide, zinc oxide, indium, tin, antimony, gold, silver, copper, aluminum, nickel, chromium, titanium and iron. , Cobalt, copper iodide, ITO (indium oxide/tin oxide), ATO (antimony oxide/tin oxide) and the like. The ion conductive filler may be only one kind or two or more kinds.

As the electrically conductive polymer, any appropriate electrically conductive polymer can be adopted as long as the effect of the present invention is not impaired. Examples of such an electrically conductive polymer include (3,4-ethylenedioxythiophene)-poly(styrene sulfonic acid).

<1-2-6. Other ingredients>
A pressure-sensitive adhesive composition as a material of the pressure-sensitive adhesive layer (1) (at least one selected from the group consisting of an acrylic pressure-sensitive adhesive composition, a urethane pressure-sensitive adhesive composition, a rubber pressure-sensitive adhesive composition, and a silicone pressure-sensitive adhesive composition). The seed) may contain any appropriate other component as long as the effect of the present invention is not impaired. Examples of such other components include other polymer components, crosslinking accelerators, crosslinking catalysts, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), antiaging agents. , Inorganic fillers, organic fillers, metal powders, colorants (pigments and dyes, etc.), foil materials, UV absorbers, antioxidants, light stabilizers, chain transfer agents, plasticizers, softeners, surfactants , Antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat stabilizers, polymerization inhibitors, lubricants, solvents, catalysts and the like.

<<1-3. Resin film (2)>>
As the thickness of the resin film (2), any appropriate thickness can be adopted according to the purpose within the range where the effect of the present invention is not impaired. Such a thickness is preferably 25 μm to 500 μm, more preferably 25 μm to 400 μm, further preferably 25 μm to 300 μm, and particularly preferably 25 μm to the point that the effect of the present invention can be further exhibited. It is 200 μm, and most preferably 25 μm to 150 μm.

As described above, the resin film (2) has a laminated portion with the adhesive layer (1) divided into a plurality of through holes each having a predetermined length in a direction substantially orthogonal to the longitudinal direction.

The resin film (2) includes a resin base film (2a).

As the resin substrate film (2a), for example, a plastic film composed of a polyester resin such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT); polyethylene (PE), polypropylene ( PP), polymethylpentene (PMP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA) and other plastic films composed of an olefin resin containing α-olefin as a monomer component; polyvinyl chloride Plastic film composed of (PVC); plastic film composed of vinyl acetate resin; plastic film composed of polycarbonate (PC); plastic film composed of polyphenylene sulfide (PPS); polyamide (nylon), all Plastic film composed of amide resin such as aromatic polyamide (aramid); Plastic film composed of polyimide resin; Plastic film composed of polyetheretherketone (PEEK); Polyethylene (PE), polypropylene (PP) ) And other plastic films composed of olefinic resins; polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, chlorofluoroethylene-vinylidene fluoride And a plastic film composed of a fluororesin such as a copolymer.

The resin base film (2a) may have only one layer or two or more layers. The resin substrate film (2a) may be stretched.

The resin base film (2a) may be surface-treated. Examples of the surface treatment include corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high piezoelectric bombardment exposure, ionizing radiation treatment, and coating treatment with an undercoating agent.

The resin substrate film (2a) may contain any appropriate additive depending on the purpose, within a range that does not impair the effects of the present invention.

The resin film (2) may have a conductive layer (2b). The conductive layer (2b) may be arranged between the pressure-sensitive adhesive layer (1) and the resin base film (2a).

The conductive layer (2b) may be only one layer or two or more layers.

The conductive layer (2b) can be provided by forming it on any suitable base material. Such a substrate is preferably a resin substrate film (2a).

The conductive layer (2b) is formed by any suitable thin film forming method such as a vacuum vapor deposition method, a sputtering method, an ion plating method, a spray pyrolysis method, a chemical plating method, an electroplating method, or a combination thereof. The conductive film is formed on any suitable substrate (preferably, the resin substrate film (2a)). Among these thin film forming methods, the vacuum deposition method and the sputtering method are preferable from the viewpoints of the formation speed of the conductive film, the formability of a large-area film, the productivity, and the like.

As the material for forming the conductive film, for example, metal-based materials such as gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin, alloys thereof; indium oxide, A metal oxide-based material composed of tin oxide, titanium oxide, cadmium oxide, a mixture thereof, or the like; another metal compound composed of copper iodide or the like is used.

As the thickness of the conductive layer (2b), any appropriate thickness can be adopted according to the purpose within a range that does not impair the effects of the present invention. Such a thickness is, for example, preferably 30 Å to 600 Å when formed of a metal-based material, and preferably 80 Å to 5000 Å when formed of a metal oxide-based material.

The surface resistance value of the conductive layer (2b) is preferably 1.0×10 ¹⁰ Ω/□ or less, more preferably 1.0×10 ⁹ Ω/□ or less, further preferably 1.0×10 9. ^{It is 8} Ω/□ or less, and particularly preferably 1.0×10 ⁷ Ω/□ or less.

When the conductive film is formed on any suitable substrate (preferably the resin substrate film (2a)), the corona discharge is formed on the surface of the substrate (preferably the resin substrate film (2a)). Adhesion between the conductive film and the substrate (preferably the resin substrate film (2a)) after any suitable pretreatment such as treatment, ultraviolet irradiation treatment, plasma treatment, sputter etching treatment, and undercoat treatment. Can also be increased.

The resin film (2) may have an antistatic layer (2c). The antistatic layer (2c) may be arranged between the pressure-sensitive adhesive layer (1) and the resin base film (2a) and/or between the resin base film (2a) and the pressure-sensitive adhesive layer (2).

The antistatic layer (2c) may be a single layer or two or more layers.

As the thickness of the antistatic layer (2c), any appropriate thickness can be adopted according to the purpose within the range where the effect of the present invention is not impaired. Such a thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, further preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.

The surface resistance value of the antistatic layer (2c) is preferably 1.0×10 ¹⁰ Ω/□ or less, more preferably 8.0×10 ⁹ Ω/□ or less, further preferably 5.0×. It is 10 ⁹ Ω/□ or less, and particularly preferably 1.0×10 ⁹ Ω/□ or less.

As the antistatic layer (2c), any appropriate antistatic layer can be adopted as long as it can exhibit an antistatic effect as long as the effect of the present invention is not impaired. Such an antistatic layer is preferably an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on any appropriate base material layer. Specifically, for example, it is an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on the resin substrate film (2a). After coating, it is dried if necessary and a curing treatment (heat treatment, ultraviolet treatment, etc.) is performed if necessary. Specific coating methods include a roll coating method, a bar coating method and a gravure coating method.

As the conductive coating liquid containing a conductive polymer, any appropriate conductive coating liquid can be adopted as long as the effect of the present invention is not impaired. Such a conductive coating liquid preferably contains a conductive polymer, a binder, a crosslinking agent and a solvent. The solvent is substantially removed by volatilization, evaporation, etc. due to heating in the process of forming the antistatic layer (2c). Therefore, the antistatic layer (2c) preferably contains a conductive polymer, a binder and a crosslinking agent. ..

Examples of the solvent include organic solvents, water, and mixed solvents thereof. Examples of the organic solvent include esters such as ethyl acetate; ketones such as methyl ethyl ketone, acetone and cyclohexanone; cyclic ethers such as tetrahydrofuran (THF) and dioxane; aliphatic or alicyclic carbonization such as n-hexane and cyclohexane. Hydrogen; aromatic hydrocarbons such as toluene and xylene; aliphatic or alicyclic alcohols such as methanol, ethanol, n-propanol, isopropanol, cyclohexanol; alkylene glycol monoalkyl ethers (eg ethylene glycol monomethyl ether, Glycol ethers such as ethylene glycol monoethyl ether) and dialkylene glycol monoalkyl ether; and the like. The solvent is preferably water or a mixed solvent containing water as a main component (for example, a mixed solvent of water and ethanol).

The content ratio of the conductive polymer in the antistatic layer (2c) is preferably 3% by weight to 80% by weight, more preferably 5% by weight to 60% by weight.

As the conductive polymer, any appropriate conductive polymer can be adopted as long as the effect of the present invention is not impaired. Examples of such a conductive polymer include a conductive polymer obtained by doping a π-conjugated conductive polymer with a polyanion. Examples of the π-conjugated conductive polymer include chain conductive polymers such as polythiophene, polypyrrole, polyaniline, and polyacetylene. Examples of the polyanion include polystyrene sulfonic acid, polyisoprene sulfonic acid, polyvinyl sulfonic acid, polyallyl sulfonic acid, polyacrylic acid ethyl sulfonic acid, and polymethacryl carboxylic acid.

The conductive polymer may be only one kind or two or more kinds.

The content ratio of the binder in the antistatic layer (2c) is preferably 50% by weight to 95% by weight, more preferably 60% by weight to 90% by weight.

As the binder that can be contained in the conductive coating liquid, any appropriate binder can be adopted as long as the effect of the present invention is not impaired. The binder may be only one type or two or more types. As such a binder, a resin is preferable, and a polyester resin is more preferable. The proportion of the polyester resin in the binder is preferably 90% by weight to 100% by weight, more preferably 98% by weight to 100% by weight.

The polyester resin contains polyester as a main component (preferably more than 50% by weight, more preferably 75% by weight or more, further preferably 90% by weight or more, particularly preferably substantially 100% by weight). It is preferable to include as.

As the polyester, any appropriate polyester can be adopted as long as the effect of the present invention is not impaired. Such a polyester is preferably a polyvalent carboxylic acid having two or more carboxyl groups in one molecule (for example, a dicarboxylic acid compound) and a derivative thereof (for example, an anhydride or an esterified product of the polyvalent carboxylic acid). One or two or more compounds (polyvalent carboxylic acid component) selected from halides and the like, and one selected from a polyhydric alcohol (eg, diol) having two or more hydroxyl groups in one molecule. Alternatively, it preferably has a structure in which two or more compounds (polyhydric alcohol components) are condensed.

As the polyvalent carboxylic acid component, any suitable polyvalent carboxylic acid can be adopted as long as the effect of the present invention is not impaired. Examples of such polycarboxylic acid components include oxalic acid, malonic acid, difluoromalonic acid, alkylmalonic acid, succinic acid, tetrafluorosuccinic acid, alkylsuccinic acid, (±)-malic acid, meso-tartaric acid, Itaconic acid, maleic acid, methyl maleic acid, fumaric acid, methyl fumaric acid, acetylenedicarboxylic acid, glutaric acid, hexafluoroglutaric acid, methyl glutaric acid, glutaconic acid, adipic acid, dithioadipic acid, methyl adipic acid, dimethyl adipic acid, Tetramethyl adipic acid, methylene adipic acid, muconic acid, galactaric acid, pimelic acid, suberic acid, perfluorosuberic acid, 3,3,6,6-tetramethylsuberic acid, azelaic acid, sebacic acid, perfluorosebacic acid, Aliphatic dicarboxylic acids such as brassic acid, dodecyldicarboxylic acid, tridecyldicarboxylic acid, and tetradecyldicarboxylic acid; cycloalkyldicarboxylic acids (eg, 1,4-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid), 1,4 Alicyclic dicarboxylic acids such as -(2-norbornene)dicarboxylic acid, 5-norbornene-2,3-dicarboxylic acid (hymic acid), adamantanedicarboxylic acid, spiroheptanedicarboxylic acid; phthalic acid, isophthalic acid, dithioisophthalic acid, Methyl isophthalic acid, dimethyl isophthalic acid, chloroisophthalic acid, dichloroisophthalic acid, terephthalic acid, methylterephthalic acid, dimethylterephthalic acid, chloroterephthalic acid, bromoterephthalic acid, naphthalenedicarboxylic acid, oxofluorangecarboxylic acid, anthracenedicarboxylic acid, biphenyldicarboxylic acid Acid, biphenylenedicarboxylic acid, dimethylbiphenylenedicarboxylic acid, 4,4"-p-terephenylenedicarboxylic acid, 4,4"-p-quarrelphenyldicarboxylic acid, bibenzyldicarboxylic acid, azobenzenedicarboxylic acid, homophthalic acid, phenylene di Acetic acid, phenylenedipropionic acid, naphthalenedicarboxylic acid, naphthalenedipropionic acid, biphenyldiacetic acid, biphenyldipropionic acid, 3,3′-[4,4′-(methylenedi-p-biphenylene)]dipropionic acid, 4, Aromatic dicarboxylic acids such as 4′-bibenzyldiacetic acid, 3,3′-[(4,4′-bibenzyl)]dipropionic acid, oxydi-p-phenylenediacetic acid; Acid anhydrides; esters of any of the above polycarboxylic acids (eg, For example, alkyl ester. Monoesters, diesters, etc.); acid halides corresponding to any of the above polycarboxylic acids (eg, dicarboxylic acid chloride); and the like.

As the polycarboxylic acid component, preferably, aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid and naphthalenedicarboxylic acid and acid anhydrides thereof; adipic acid, sebacic acid, azelaic acid, succinic acid, fumaric acid, maleic acid, Alimic dicarboxylic acids such as hymic acid and 1,4-cyclohexanedicarboxylic acid and their acid anhydrides; lower alkyl esters of these dicarboxylic acids (eg, esters with monoalcohols having 1 to 3 carbon atoms); To be

As the polyhydric alcohol component, any appropriate polyhydric alcohol can be adopted as long as the effect of the present invention is not impaired. Examples of such polyhydric alcohol components include ethylene glycol, propylene glycol, 1,2-propanediol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 1,5-pentanediol, 1,6-hexanediol, 3-methylpentanediol, diethylene glycol, 1,4-cyclohexanedimethanol, 3-methyl-1,5-pentanediol, 2-methyl-1,3-propane Diols such as diol, 2,2-diethyl-1,3-propanediol, 2-butyl-2-ethyl-1,3-propanediol, xylylene glycol, hydrogenated bisphenol A, bisphenol A; these diols Alkylene oxide adduct (for example, ethylene oxide adduct, propylene oxide adduct, etc.);

The molecular weight of the polyester resin is preferably 5×10 ³ to 1.5×10 ⁵ , and more preferably 1 as the weight average molecular weight (Mw) in terms of standard polystyrene measured by gel permeation chromatography (GPC). ×10 ⁴ to 6×10 ⁴ .

The glass transition temperature (Tg) of the polyester resin is preferably 0°C to 120°C, more preferably 10°C to 80°C.

As the polyester resin, for example, commercially available Toyobo Co., Ltd. product name “Bironard” can be used.

The conductive coating liquid, as long as the effect of the present invention is not impaired, as a binder, a resin other than polyester resin (for example, acrylic resin, acrylic urethane resin, acrylic styrene resin, acrylic silicone resin, silicone resin, polysilazane resin, polyurethane resin, It may further contain at least one resin selected from a fluororesin and a polyolefin resin.

As the cross-linking agent that can be contained in the conductive coating liquid, any appropriate cross-linking agent can be adopted as long as the effect of the present invention is not impaired. The cross-linking agent may be only one kind or two or more kinds. As such a crosslinking agent, preferably an isocyanate crosslinking agent, an epoxy crosslinking agent, a melamine crosslinking agent, a peroxide crosslinking agent, a urea crosslinking agent, a metal alkoxide crosslinking agent, a metal chelate crosslinking agent. Agents, metal salt-based crosslinking agents, carbodiimide-based crosslinking agents, oxazoline-based crosslinking agents, aziridine-based crosslinking agents, amine-based crosslinking agents and the like. Of these, a melamine-based cross-linking agent is preferable.

The content ratio of the crosslinking agent in the antistatic layer (2c) is preferably 1% by weight to 30% by weight, more preferably 2% by weight to 20% by weight.

The antistatic layer (2c) may contain any appropriate other component as long as the effect of the present invention is not impaired.

<< 1-4. Adhesive layer (2)>>
As the pressure-sensitive adhesive layer (2), any appropriate pressure-sensitive adhesive layer can be adopted as long as the effect of the present invention is not impaired. The pressure-sensitive adhesive layer (2) may be only one layer or may be two or more layers.

The thickness of the pressure-sensitive adhesive layer (2) is preferably 0.5 μm to 150 μm, more preferably 1 μm to 100 μm, and further preferably 2 μm to 80 μm, from the viewpoint that the effect of the present invention can be further exhibited. Particularly preferred is 3 μm to 50 μm, and most preferred is 5 μm to 30 μm.

The adhesive layer (2) can be formed by any appropriate method. As such a method, for example, a pressure-sensitive adhesive composition that forms a pressure-sensitive adhesive forming the pressure-sensitive adhesive layer (2) is applied onto any appropriate base material (for example, the resin film (3)), Examples include a method of forming a pressure-sensitive adhesive layer on the substrate by heating and drying according to need, and curing if necessary. Examples of such a coating method include a gravure roll coater, a reverse roll coater, a kiss roll coater, a dip roll coater, a bar coater, a knife coater, an air knife coater, a spray coater, a comma coater, a direct coater and a roll brush coater. The method of is mentioned.

<1-4-1. Acrylic adhesive>
The pressure-sensitive adhesive layer (2) is preferably composed of an acrylic pressure-sensitive adhesive.

The acrylic pressure-sensitive adhesive is formed from an acrylic pressure-sensitive adhesive composition.

The acrylic polymer is preferably a (meth)acrylic acid alkyl ester in which the alkyl group of the (a component) alkyl ester moiety has 4 to 12 carbon atoms from the viewpoint that the effect of the present invention can be further exhibited, and (b) It is an acrylic polymer formed by polymerization from a composition (B) containing (component) at least one selected from the group consisting of (meth)acrylic acid ester having an OH group and (meth)acrylic acid. The (a component) and the (b component) may each independently be only one kind or two or more kinds.

The composition (B) may contain a copolymerizable monomer other than the components (a) and (b). The copolymerizable monomer may be only one type, or may be two or more types. Such copolymerizable monomers include, for example, itaconic acid, maleic acid, fumaric acid, crotonic acid, isocrotonic acid, and acid anhydrides thereof (for example, acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride). ) And other carboxyl group-containing monomers (excluding (meth)acrylic acid); (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-methylol(meth)acrylamide, N-methoxymethyl(meth)acrylamide , N-butoxymethyl (meth)acrylamide, N-hydroxyethyl (meth)acrylamide, and other amide group-containing monomers; aminoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, t-butyl (meth)acrylate Amino group-containing monomers such as aminoethyl; epoxy group-containing monomers such as glycidyl (meth)acrylate and methylglycidyl (meth)acrylate; cyano group-containing monomers such as acrylonitrile and methacrylonitrile; N-vinyl-2-pyrrolidone, Heterocycle-containing vinyl monomers such as (meth)acryloylmorpholine, N-vinylpiperidone, N-vinylpiperazine, N-vinylpyrrole, N-vinylimidazole, vinylpyridine, vinylpyrimidine, vinyloxazole; sulfonic acids such as sodium vinylsulfonate Group-containing monomer; phosphoric acid group-containing monomer such as 2-hydroxyethylacryloyl phosphate; imide group-containing monomer such as cyclohexylmaleimide and isopropylmaleimide; isocyanate group-containing monomer such as 2-methacryloyloxyethylisocyanate; cyclopentyl (meth)acrylate, (Meth)acrylic acid ester having an alicyclic hydrocarbon group such as cyclohexyl (meth)acrylate and isobornyl (meth)acrylate; aromatic such as phenyl (meth)acrylate, phenoxyethyl (meth)acrylate and benzyl (meth)acrylate (Meth)acrylic ester having a hydrocarbon group; vinyl ester such as vinyl acetate and vinyl propionate; aromatic vinyl compound such as styrene and vinyltoluene; olefins and dienes such as ethylene, butadiene, isoprene and isobutylene; vinyl Vinyl ethers such as alkyl ethers; vinyl chloride; and the like.

The composition (B) may contain any appropriate other component as long as the effect of the present invention is not impaired. Examples of such other components include a polymerization initiator, a chain transfer agent, and a solvent. As the content of these other components, any appropriate content can be adopted as long as the effect of the present invention is not impaired.

<1-4-2. Conductive component>
The adhesive layer (2) may contain a conductive component. Regarding the conductive component, <1-2-5. The description in the section of conductive component> can be directly applied.

<1-4-3. Other ingredients>
The pressure-sensitive adhesive composition (preferably an acrylic pressure-sensitive adhesive composition) that is a material of the pressure-sensitive adhesive layer (2) may contain any appropriate other component as long as the effect of the present invention is not impaired. Examples of such other components include other polymer components, crosslinking accelerators, crosslinking catalysts, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), antiaging agents. , Inorganic fillers, organic fillers, metal powders, colorants (pigments and dyes, etc.), foil materials, UV absorbers, antioxidants, light stabilizers, chain transfer agents, plasticizers, softeners, surfactants , Antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat stabilizers, polymerization inhibitors, lubricants, solvents, catalysts and the like.

<<1-5. Resin film (3) >>
The thickness of the resin film (3) is preferably from 4 μm to 450 μm, more preferably from 8 μm to 350 μm, further preferably from 12 μm to 250 μm, and particularly preferably from the viewpoint that the effect of the present invention can be further exhibited. It is 16 μm to 150 μm, and most preferably 20 μm to 100 μm.

The resin film (3) includes a resin base film (3a).

Examples of the resin substrate film (3a) include plastic films made of polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN) and polybutylene terephthalate (PBT); polyethylene (PE), polypropylene ( PP), polymethylpentene (PMP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA) and other plastic films composed of an olefin resin containing α-olefin as a monomer component; polyvinyl chloride Plastic film composed of (PVC); plastic film composed of vinyl acetate resin; plastic film composed of polycarbonate (PC); plastic film composed of polyphenylene sulfide (PPS); polyamide (nylon), all Plastic film composed of amide resin such as aromatic polyamide (aramid); Plastic film composed of polyimide resin; Plastic film composed of polyetheretherketone (PEEK); Polyethylene (PE), polypropylene (PP) ) And other olefinic resin films; polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, chlorofluoroethylene-vinylidene fluoride And a plastic film composed of a fluororesin such as a copolymer.

The resin base film (3a) may have only one layer or two or more layers. The resin substrate film (3a) may be stretched.

The resin base film (3a) may be surface-treated. Examples of the surface treatment include corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high piezoelectric bombardment exposure, ionizing radiation treatment, and coating treatment with an undercoating agent.

On the surface of the resin film (3) on which the pressure-sensitive adhesive layer (2) is not attached, a fatty acid amide or polyethyleneimine is added to the resin film (3) for the purpose of forming a wound body that can be easily rewound. It is possible to add a long-chain alkyl-based additive or the like for release treatment, or to provide a coating layer made of any suitable release agent such as silicone-based, long-chain alkyl-based or fluorine-based release agent.

The resin film (3) may contain any appropriate additive depending on the purpose, as long as the effects of the present invention are not impaired.

The resin film (3) may have a conductive layer (3b). The conductive layer (3b) may be arranged between the pressure-sensitive adhesive layer (2) and the resin base film (3a).

The conductive layer (3b) may be only one layer or two or more layers.

The conductive layer (3b) can be provided by forming it on any appropriate base material. Such a substrate is preferably a resin substrate film (3a).

The conductive layer (3b) is formed by any suitable thin film forming method such as a vacuum deposition method, a sputtering method, an ion plating method, a spray pyrolysis method, a chemical plating method, an electroplating method, or a combination thereof. The conductive film is formed on any suitable base material (preferably, the resin base material film (3a)). Among these thin film forming methods, the vacuum deposition method and the sputtering method are preferable from the viewpoints of the formation speed of the conductive film, the formability of a large-area film, the productivity, and the like.

As the thickness of the conductive layer (3b), any appropriate thickness can be adopted according to the purpose within the range where the effect of the present invention is not impaired. Such a thickness is, for example, preferably 30 Å to 600 Å when formed of a metal-based material, and preferably 80 Å to 5000 Å when formed of a metal oxide-based material.

The surface resistance value of the conductive layer (3b) is preferably 1.0×10 ¹⁰ Ω/□ or less, more preferably 1.0×10 ⁹ Ω/□ or less, and further preferably 1.0×10 9. ^{It is 8} Ω/□ or less, and particularly preferably 1.0×10 ⁷ Ω/□ or less.

When the conductive film is formed on any suitable base material (preferably the resin base material film (3a)), a corona discharge is formed on the surface of the base material (preferably the resin base film (3a)). Adhesion between the conductive film and the substrate (preferably the resin substrate film (3a)) after any suitable pretreatment such as treatment, ultraviolet irradiation treatment, plasma treatment, sputter etching treatment, and undercoat treatment. Can also be increased.

The resin film (3) may have an antistatic layer (3c). The antistatic layer (3c) may be disposed between the pressure-sensitive adhesive layer (2) and the resin base film (3a) and/or on the opposite side of the resin base film (3a) from the pressure-sensitive adhesive layer (2). ..

The antistatic layer (3c) may be a single layer or two or more layers.

As the thickness of the antistatic layer (3c), any appropriate thickness can be adopted according to the purpose within the range where the effect of the present invention is not impaired. Such a thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, further preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.

The surface resistance value of the antistatic layer (3c) is preferably 1.0×10 ¹⁰ Ω/□ or less, more preferably 8.0×10 ⁹ Ω/□ or less, and further preferably 5.0×. It is 10 ⁹ Ω/□ or less, and particularly preferably 1.0×10 ⁹ Ω/□ or less.

As the antistatic layer (3c), any suitable antistatic layer can be adopted as long as it is a layer capable of exhibiting an antistatic effect, as long as the effect of the present invention is not impaired. Such an antistatic layer is preferably an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on any appropriate base material layer. Specifically, for example, it is an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on the resin substrate film (3a). After coating, it is dried if necessary and a curing treatment (heat treatment, ultraviolet treatment, etc.) is performed if necessary. Specific coating methods include a roll coating method, a bar coating method and a gravure coating method.

As the conductive coating liquid containing a conductive polymer, any appropriate conductive coating liquid can be adopted as long as the effect of the present invention is not impaired. Such a conductive coating liquid preferably contains a conductive polymer, a binder, a crosslinking agent and a solvent. The solvent is substantially eliminated by volatilization or evaporation by heating or the like in the process of forming the antistatic layer (3c). Therefore, the antistatic layer (3c) preferably contains a conductive polymer, a binder and a crosslinking agent. ..

The content ratio of the conductive polymer in the antistatic layer (3c) is preferably 3% by weight to 80% by weight, more preferably 5% by weight to 60% by weight.

The conductive polymer may be only one kind or two or more kinds.

The content ratio of the binder in the antistatic layer (3c) is preferably 50% by weight to 95% by weight, more preferably 60% by weight to 90% by weight.

The content ratio of the cross-linking agent in the antistatic layer (3c) is preferably 1% by weight to 30% by weight, more preferably 2% by weight to 20% by weight.

The antistatic layer (3c) may contain any appropriate other component as long as the effect of the present invention is not impaired.

<<<<2. Manufacturing method of laminated body ≫≫
The layered product of the present invention can be manufactured by any appropriate method as long as the effects of the present invention are not impaired.

As a typical example of the method for producing a laminate of the present invention, the laminate of the present invention comprises a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2) and a resin film (3). ) Are provided in this order, and a case of a laminated body composed of these components will be described.

One embodiment of the method for producing a laminate of the present invention has a resin film (1), a pressure-sensitive adhesive layer (1), and a resin film (2) in this order, and a laminate (I ), a pressure-sensitive adhesive layer (2) and a resin film (3) in this order to produce a laminate (II) composed of these components, and then, the resin film of the laminate (I). The surface of (2) and the surface of the pressure-sensitive adhesive layer (2) of the laminate (II) are attached.

The laminate (I) is, for example, a pressure-sensitive adhesive composition (acrylic pressure-sensitive adhesive composition, urethane-based pressure-sensitive adhesive composition, rubber-based pressure-sensitive adhesive composition, silicone, which forms a pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer (1). At least one selected from the group consisting of the adhesive system) is applied on the resin film (2), heated and dried if necessary, and cured as necessary to obtain the resin film (2). The pressure-sensitive adhesive layer (1) is formed thereon, and then the resin film (1) (release layer (1b) is provided on the surface of the pressure-sensitive adhesive layer (1) opposite to the resin film (2). If that is the case, paste that side). After that, a plurality of portions of the resin film are cut from the resin film (2) side with a CO ₂ laser or the like so that the width of the portion to be cut has a predetermined width and the width of the portion that is not cut has a predetermined width. Half-cut up to the surface of (1) (that is, the resin film (1) is not cut), and the half-cut portion is removed by any appropriate method.

The laminate (II) is required, for example, by applying a pressure-sensitive adhesive composition (preferably an acrylic pressure-sensitive adhesive composition) forming a pressure-sensitive adhesive forming the pressure-sensitive adhesive layer (2) onto the resin film (3). The adhesive layer (2) is formed on the resin film (3) by heating and drying according to the above, and curing as necessary. In addition, in order to protect the exposed surface of the pressure-sensitive adhesive layer (2) until the laminated body (I) and the laminated body (II) are attached, any suitable separator (for example, the resin film (1)) may be used. A similar film) may be attached.

Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited to these examples. The tests and evaluation methods in Examples and the like are as follows. In addition, when it is described as “part”, it means “part by weight” unless otherwise specified, and when described as “%”, it means “weight %” unless otherwise specified.

<Measurement of weight average molecular weight>
The weight average molecular weight was measured by the gel permeation chromatograph (GPC) method. Specifically, the product name "HLC-8120GPC" (manufactured by Tosoh Corporation) was used as a GPC measuring device, and the measurement was performed under the following conditions, and the standard polystyrene conversion value was calculated.
(Molecular weight measurement conditions)
・Sample concentration: 0.2 wt% (tetrahydrofuran solution)
・Sample injection volume: 10 μL
-Column: Product name "TSKguardcolumn SuperHZ-H (1) + TSKgel SuperHZM-H (2)" (manufactured by Tosoh Corporation)
・Reference column: Product name "TSKgel Super H-RC (1)" (manufactured by Tosoh Corporation)
・Eluent: Tetrahydrofuran (THF)
・Flow rate: 0.6 mL/min
・Detector: Differential refractometer (RI)
・Column temperature (measurement temperature): 40°C

<Measurement of adhesive strength when peeling the pressure-sensitive adhesive layer (2) from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 30 mm/min>
The separator of the laminate (I) having a size of 10 cm×10 cm was peeled off, and the pressure-sensitive adhesive layer surface of the sample for evaluation was subjected to a 10 cm×10 cm glass plate (manufactured by Matsunami Glass Industry Co., Ltd., under an atmosphere of a temperature of 23° C. and a humidity of 50% RH). The product was attached to a micro slide glass S) with a hand roller and then pressure-bonded at a pressure of 0.25 MPa. A laminated body in which a surface protective film with a separator (which may be referred to as a carrier sheet) that has been decharged in advance is cut into a width of 25 mm and a length of 150 mm, and is fixed to glass under an atmosphere of a temperature of 23° C. and a humidity of 50% RH. The resin film of (I) was attached by reciprocating once with a 2.0 kg roller and then pressure-bonded at a pressure of 0.25 MPa. After curing for 30 minutes in an atmosphere of a temperature of 23° C. and a humidity of 50% RH, a universal tensile tester (manufactured by Minebea Co., Ltd., product name: TCM-1kNB) was used at a peeling angle of 180 degrees and a peeling speed of 30 mm/min. The adhesive layer (2) was peeled off from the resin film (2), and the adhesive strength was measured.

<Measurement of adhesive force when peeling the pressure-sensitive adhesive layer (2) from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 300 mm/min>
The separator of the laminate (I) having a size of 10 cm×10 cm was peeled off, and the pressure-sensitive adhesive layer surface of the sample for evaluation was subjected to a 10 cm×10 cm glass plate (manufactured by Matsunami Glass Industry Co., Ltd., under an atmosphere of a temperature of 23° C. and a humidity of 50% RH). The product was attached to a micro slide glass S) with a hand roller and then pressure-bonded at a pressure of 0.25 MPa. A laminated body in which a surface protective film with a separator (which may be referred to as a carrier sheet) that has been decharged in advance is cut into a width of 25 mm and a length of 150 mm, and is fixed to glass under an atmosphere of a temperature of 23° C. and a humidity of 50% RH. The resin film of (I) was attached by reciprocating once with a 2.0 kg roller and then pressure-bonded at a pressure of 0.25 MPa. After curing for 30 minutes in an atmosphere of a temperature of 23° C. and a humidity of 50% RH, a universal tensile tester (manufactured by Minebea Co., Ltd., product name: TCM-1kNB) was used at a peeling angle of 180 degrees and a peeling speed of 300 mm/min. The adhesive layer (2) was peeled off from the resin film (2), and the adhesive strength was measured.

<Measurement of adhesive force when peeling the pressure-sensitive adhesive layer (2) from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 2400 mm/min>
The separator of the laminate (I) having a size of 10 cm×10 cm was peeled off, and the pressure-sensitive adhesive layer surface of the sample for evaluation was subjected to a 10 cm×10 cm glass plate (manufactured by Matsunami Glass Industry Co., Ltd., under an atmosphere of a temperature of 23° C. and a humidity of 50% RH). The product was attached to a micro slide glass S) with a hand roller and then pressure-bonded at a pressure of 0.25 MPa. A laminated body in which a surface protective film with a separator (which may be referred to as a carrier sheet) that has been decharged in advance is cut into a width of 25 mm and a length of 150 mm, and is fixed to glass under an atmosphere of a temperature of 23° C. and a humidity of 50% RH. The resin film of (I) was attached by reciprocating once with a 2.0 kg roller and then pressure-bonded at a pressure of 0.25 MPa. After curing for 30 minutes in an atmosphere of a temperature of 23° C. and a humidity of 50% RH, a universal tensile tester (manufactured by Minebea Co., Ltd., product name: TCM-1kNB) was used at a peeling angle of 180 degrees and a peeling speed of 2400 mm/min. The adhesive layer (2) was peeled off from the resin film (2), and the adhesive strength was measured.

<Measurement of adhesive strength (1)>
A laminate (I) composed of resin film (1)/adhesive layer (1)/resin film (2) was cut into a width of 25 mm and a length of 150 mm to prepare an evaluation sample. In an atmosphere of a temperature of 23° C. and a humidity of 50% RH, the resin film (1) was peeled from the produced evaluation sample, and the glass plate (Matsunami Glass Industry Co., Ltd., trade name: Micro Slide Glass S) was used. It was attached by reciprocating once with a 0 kg roller. After curing for 30 minutes in an atmosphere of a temperature of 23° C. and a humidity of 50% RH, a universal tensile tester was used to perform peeling at a peeling angle of 180° and a peeling speed of 300 mm/min, and the adhesive strength (1) was measured.

<Measurement of adhesive strength (2)>
A laminate (II) with a separator composed of separator/adhesive layer (2)/resin film (3) was cut into a width of 25 mm and a length of 150 mm to prepare an evaluation sample. Separately, an adherend prepared by peeling the resin film (1) from the laminate (I) and adhered to a glass plate as described in the section <Measurement of adhesive strength (1)> is prepared at a temperature of 23° C. In an atmosphere of a humidity of 50% RH, the separator was peeled from the evaluation sample and attached to the adherend by reciprocating a 2.0 kg roller once. After curing for 30 minutes in an atmosphere of a temperature of 23° C. and a humidity of 50% RH, a universal tensile tester was used to peel at a peeling angle of 180° and a peeling speed of 300 mm/min, and the adhesive strength (2) was measured.

<Measurement of total light transmittance and haze>
Using HM-150N of Murakami Color Research Laboratory, total light transmittance was measured under the conditions of JIS-K-7361 and haze was measured under the conditions of JIS-K-7136. At this time, the 5-layer laminated product was installed so that the resin film (3) faced to the light source side.

<Float measurement>
The laminate (I) is cut into a width of 50 mm and a length of 300 mm, and is cut from the resin film (2) side by a CO ₂ laser at 5 positions so as to be evenly spaced at 1 mm or at 3 mm equally spaced. Half-cut to the surface of the resin film (1) (that is, the resin film (1) is not cut), and half-cut at 5 positions so that The removed part was removed by hand. At this time, the sample was manufactured so that the distance between the half-cut/removed portions was 50 mm. Then, the surface of the pressure-sensitive adhesive layer (2) of the laminate (II) cut into a width of 60 mm and a length of 400 mm was attached to the surface of the resin film (2) of the laminate (I) to obtain a measurement sample.
The measurement sample was wound around a roll having a diameter of 6 inches so that the resin film (1) was on the outer side, and the laminated portion of the plurality of divided adhesive layers (1) and the resin film (2) formed an adhesive layer ( The maximum amount floating from 2) was measured with a magnifying glass, and the average value of the measurements at any 5 points was taken as the floating amount.

[Production Example 1] Production of pressure-sensitive adhesive composition (1) In a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas introduction tube, and a condenser, 95 parts of butyl acrylate (manufactured by Nippon Shokubai Co., Ltd.) and acrylic acid ( Toa Gosei Co., Ltd.) 5 parts, as a polymerization initiator 2,2'-azobisisobutyronitrile (Wako Pure Chemical Industries, Ltd.) 0.2 part, ethyl acetate 156 parts by weight were charged, and nitrogen was gently stirred. A gas was introduced and a polymerization reaction was carried out for 10 hours while maintaining the liquid temperature in the flask at around 63° C. to prepare a (meth)acrylic polymer (1) solution (40% by weight) having a weight average molecular weight of 700,000. In the (meth)acrylic polymer (1) solution, TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Inc.) as a cross-linking agent was added as a solid content to 100 parts by weight of the solid content of the (meth)acrylic polymer (1) solution. 6 parts by weight in terms of conversion was added, diluted with ethyl acetate so that the total solid content was 20% by weight, and stirred with a disper to obtain a pressure-sensitive adhesive composition (1) containing an acrylic resin.

[Production Example 2] Production of pressure-sensitive adhesive composition (2) 100 parts by weight of 2-ethylhexyl acrylate (manufactured by Nippon Shokubai Co., Ltd.) in a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas introduction tube, and a condenser. -Hydroxyethyl acrylate (manufactured by Toagosei Co., Ltd.) 4 parts by weight, 2,2'-azobisisobutyronitrile (manufactured by Wako Pure Chemical Industries, Ltd.) 0.2 parts by weight as a polymerization initiator, and ethyl acetate 156 parts by weight were charged. Then, nitrogen gas was introduced with gentle stirring, the temperature of the liquid in the flask was kept at about 65° C., and the polymerization reaction was carried out for 8 hours to give a (meth)acrylic polymer (2) solution (40) having a weight average molecular weight of 550,000. Wt%) was prepared. In the (meth)acrylic polymer (2) solution, Coronate HX (manufactured by Tosoh Corporation) as a cross-linking agent was added as solid content to 4 parts by weight per 100 parts by weight of the solid content of the (meth)acrylic polymer (2) solution. By weight, 0.01 part by weight of Enbilizer OL-1 (manufactured by Tokyo Fine Chemical Co., Ltd.) as a crosslinking catalyst in terms of solid content is added, and the mixture is diluted with ethyl acetate so that the total solid content is 25% by weight. The mixture was stirred with to obtain an adhesive composition (2) containing an acrylic resin.

[Production Example 3] Production of pressure-sensitive adhesive composition (3) Acrylic resin was produced in the same procedure as in Production Example 2 except that the amount of the emulizer OL-1 used as a crosslinking catalyst was 0.05 parts by weight in terms of solid content. An adhesive composition (3) containing a resin was obtained.

[Production Example 4] Production of pressure-sensitive adhesive composition (4) 100 parts by weight of 2-ethylhexyl acrylate (manufactured by Nippon Shokubai Co., Ltd.) and acetic acid were placed in a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas inlet tube, and a condenser. Charge 80 parts by weight of vinyl monomer (Showa Denko KK), 5 parts by weight of acrylic acid (Toagosei Co., Ltd.), and 45 parts by weight of toluene, introduce nitrogen gas with gentle stirring, and use Niper BW (Japan) as a polymerization initiator. (Manufactured by Yuya Co., Ltd.) 0.2 part by weight, the temperature of the liquid in the flask is kept at about 40° C. to carry out a polymerization reaction for 3 hours, and a (meth)acrylic polymer (4) solution having a weight average molecular weight of 700,000 (35% by weight ) Was prepared. In the (meth)acrylic polymer (4) solution, TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Inc.) as a cross-linking agent was added as a solid content to 100 parts by weight of the solid content of the (meth)acrylic polymer (4) solution. 10 parts by weight in terms of conversion was added, diluted with methyl ethyl ketone so that the total solid content was 20% by weight, and stirred with a disper to obtain a pressure-sensitive adhesive composition (4) containing an acrylic resin.

[Production Example 5] Production of pressure-sensitive adhesive composition (5) As a polyfunctional polyol, 100 parts by weight of preminol S3011 (manufactured by Asahi Glass Co., Ltd., Mn=10000) in terms of solid content, Coronate HX (Nippon Polyurethane Industry Co., Ltd.) as a crosslinking agent. 18 parts by weight in terms of solid content, 0.04 parts by weight of Nasem ferric iron (manufactured by Nippon Kagaku Sangyo Co., Ltd.) in terms of solid content as a crosslinking catalyst, and Irganox 1010 (manufactured by BASF Corporation) in terms of solid content as a deterioration inhibitor. 0.5 parts by weight was added, and the mixture was diluted with ethyl acetate so that the total solid content was 35% by weight and stirred with a disper to obtain a pressure-sensitive adhesive composition (5) containing a urethane resin.

[Production Example 6] Production of adhesive composition (6) Same as Production Example 1 except that the amount of TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Inc.) used as a cross-linking agent is 0.07 parts by weight in terms of solid content. By the procedure, an adhesive composition (6) containing an acrylic resin was obtained.

[Production Example 7] Production of Laminate (A) The pressure-sensitive adhesive composition (6) obtained in Production Example 6 was formed on a polyester resin substrate "Lumirror S10" (thickness: 75 µm, manufactured by Toray Industries, Inc.) with a fountain roll. It was applied so that the thickness after drying would be 15 μm, and was cured and dried under the conditions of a drying temperature of 130° C. and a drying time of 2 minutes. In this way, the pressure-sensitive adhesive layer was prepared on the substrate. Then, a silicone-treated surface of a substrate made of a 75 μm-thick polyester resin “Lumirror S10” (thickness: 75 μm, manufactured by Toray Industries, Inc.) having a silicone treatment on one surface is bonded to the surface of the adhesive layer to form a resin. A laminate (A) having a structure of film (with silicone-treated surface)/adhesive layer/resin film was obtained.

[Production Example 8] Production of Laminate (B1) The pressure-sensitive adhesive composition (1) obtained in Production Example 1 was formed on a polyester resin substrate "Lumirror S10" (thickness 38 µm, manufactured by Toray Industries, Inc.) with a fountain roll. It was applied so that the thickness after drying would be 5 μm, and was cured and dried under the conditions of a drying temperature of 130° C. and a drying time of 30 seconds. In this way, the pressure-sensitive adhesive layer was prepared on the substrate. Then, a silicone-treated surface of a base material made of a polyester resin having a thickness of 25 μm, one surface of which is treated with silicone, is attached to the surface of the adhesive layer to form a laminate having a constitution of separator/adhesive layer/resin film. (B1) was obtained.

[Production Example 9] Production of laminate (B2) Production except that the base material "Lumirror S10" (thickness 38 µm, manufactured by Toray) made of polyester resin was changed to "Lumirror S10" (thickness 50 µm, manufactured by Toray). By the same procedure as in Example 8, a laminate (B2) having a constitution of separator/adhesive layer/resin film was obtained.

[Production Example 10] Production of Laminate (B3) The base material "Lumirror S10" (thickness 38 µm, manufactured by Toray) made of polyester resin was changed to the base material "Lumirror S10" (thickness 75 µm, manufactured by Toray) and adhesive A laminate (B3) having a constitution of separator/adhesive layer/resin film was obtained by the same procedure as in Production Example 8 except that the thickness of the agent layer was changed to 15 μm.

[Production Example 11] Production of Laminate (B4) The pressure-sensitive adhesive composition (2) obtained in Production Example 2 was formed on a polyester resin substrate "Lumirror S10" (thickness 38 µm, manufactured by Toray Industries, Inc.) with a fountain roll. It was applied so that the thickness after drying would be 20 μm, and was cured and dried under the conditions of a drying temperature of 130° C. and a drying time of 30 seconds. In this way, the pressure-sensitive adhesive layer was prepared on the substrate. Then, a silicone-treated surface of a base material made of a polyester resin having a thickness of 25 μm, one surface of which is treated with silicone, is attached to the surface of the adhesive layer to form a laminate having a constitution of separator/adhesive layer/resin film. (B4) was obtained.

[Production Example 12] Production of Laminate (B5) The pressure-sensitive adhesive composition (3) obtained in Production Example 3 was formed on a polyester resin substrate "Lumirror S10" (thickness 38 µm, manufactured by Toray Industries, Inc.) with a fountain roll. It was applied so that the thickness after drying would be 20 μm, and was cured and dried under the conditions of a drying temperature of 130° C. and a drying time of 30 seconds. In this way, the pressure-sensitive adhesive layer was prepared on the substrate. Then, a silicone-treated surface of a base material made of a polyester resin having a thickness of 25 μm, one surface of which is treated with silicone, is attached to the surface of the adhesive layer to form a laminate having a constitution of separator/adhesive layer/resin film. (B5) was obtained.

[Production Example 13] Production of laminate (B6) The pressure-sensitive adhesive composition (4) obtained in Production Example 4 was formed on a polyester resin substrate "Lumirror S10" (thickness 38 µm, manufactured by Toray Industries, Inc.) with a fountain roll. It was applied so that the thickness after drying would be 20 μm, and was cured and dried under the conditions of a drying temperature of 130° C. and a drying time of 30 seconds. In this way, the pressure-sensitive adhesive layer was prepared on the substrate. Then, a silicone-treated surface of a base material made of a polyester resin having a thickness of 25 μm, one surface of which is treated with silicone, is attached to the surface of the adhesive layer to form a laminate having a constitution of separator/adhesive layer/resin film. (B6) was obtained.

[Production Example 14] Production of Laminate (B7) The pressure-sensitive adhesive composition (5) obtained in Production Example 5 was formed on a polyester resin substrate "Lumirror S10" (thickness 38 µm, manufactured by Toray Industries, Inc.) with a fountain roll. It was applied so that the thickness after drying would be 12 μm, and cured and dried under the conditions of a drying temperature of 130° C. and a drying time of 30 s. In this way, the pressure-sensitive adhesive layer was prepared on the substrate. Then, a silicone-treated surface of a base material made of a polyester resin having a thickness of 25 μm, one surface of which is treated with silicone, is attached to the surface of the adhesive layer to form a laminate having a constitution of separator/adhesive layer/resin film. (B7) was obtained.

[Example 1]
The separator was peeled off from the laminate (B1) obtained in Production Example 8, and the exposed adhesive layer was covered with the resin film of the laminate (A) obtained in Production Example 7 (resin film not treated with silicone). The sides were attached to obtain a laminate (1). The results are shown in Table 1.

[Example 2]
The separator was peeled off from the laminate (B2) obtained in Production Example 9, and the exposed adhesive layer was covered with the resin film of the laminate (A) obtained in Production Example 7 (resin film not treated with silicone). The sides were attached to obtain a laminate (2). The results are shown in Table 1.

[Example 3]
The separator was peeled off from the laminate (B3) obtained in Production Example 10, and the exposed adhesive layer was covered with the resin film of the laminate (A) obtained in Production Example 7 (resin film not treated with silicone). The side was attached to obtain a laminate (3). The results are shown in Table 1.

[Example 4]
The separator was peeled off from the laminate (B4) obtained in Production Example 11, and the exposed adhesive layer was covered with the resin film of the laminate (A) obtained in Production Example 7 (resin film not treated with silicone). The sides were attached to obtain a laminate (4). The results are shown in Table 1.

[Example 5]
The separator was peeled off from the laminate (B5) obtained in Production Example 12, and the exposed adhesive layer was covered with the resin film of the laminate (A) obtained in Production Example 7 (resin film not treated with silicone). The sides were attached to obtain a laminate (5). The results are shown in Table 1.

[Example 6]
The separator was peeled off from the laminate (B6) obtained in Production Example 13, and the exposed adhesive layer was covered with the resin film of the laminate (A) obtained in Production Example 7 (resin film not treated with silicone). The sides were attached to obtain a laminate (6). The results are shown in Table 1.

[Comparative Example 1]
The separator was peeled off from the laminate (B7) obtained in Production Example 14, and the exposed adhesive layer was covered with the resin film of the laminate (A) obtained in Production Example 7 (resin film not treated with silicone). The sides were attached to obtain a laminate (C1). The results are shown in Table 1.

The laminated body of the present invention can be suitably used in the manufacturing process of optical members and electronic members.

Resin film (1) 10
Adhesive layer (1) 20
Resin film (2) 30
Adhesive layer (2) 40
Resin film (3) 50
Through hole 60
Laminate 100

Claims

A laminate having five or more layers, which has a resin film (1), a pressure-sensitive adhesive layer (1), a resin film (2), a pressure-sensitive adhesive layer (2), and a resin film (3) in this order,
The pressure-sensitive adhesive layer (1) and the resin film (2) are directly laminated,
The resin film (2) and the adhesive layer (2) are directly laminated,
The laminated portion of the adhesive layer (1) and the resin film (2) is divided into a plurality of through holes having a width of 0.5 mm to 10 mm in a direction substantially orthogonal to the longitudinal direction,
The length in the longitudinal direction of the laminated portion of the plurality of pressure-sensitive adhesive layers (1) and the resin film (2) divided by the through holes is 1 mm to 2000 mm,
When the resin film (1) is wound around a roll having a diameter of 6 inches so that the resin film (1) is on the outer side, a laminated portion of a plurality of the adhesive layers (1) and the resin film (2) divided by the through holes Is the maximum amount of floating from the pressure-sensitive adhesive layer (2), the width of the through-hole is 5 mm, the plurality of pressure-sensitive adhesive layer (1) and the resin film (2) laminated portion divided by the through-hole When the length in the longitudinal direction of is 50 mm, it is 0.2 mm or less,
Laminate.
The laminate according to claim 1, wherein the total area of the resin film (2) in the plane direction is smaller than the total area of the adhesive layer (2) in the plane direction.