JP7249160B2 - laminate - Google Patents

Description

The present invention relates to laminates. Preferably, the present invention relates to a laminate that can be suitably used in manufacturing processes of optical members and electronic members.

In the manufacturing process of optical and electronic components, surface protection films (SPV) are attached to prevent damage to the surface of components during processing, assembly, inspection, and transportation. A reinforcing film (RF) may be attached for reinforcement (for example, Patent Document 1, etc.).

In order to increase the efficiency of the pasting process as described above, a continuous roll-to-roll method is used rather than a process of laminating surface protective films and reinforcing films one by one. Process is effective.

If the substrate surface of the surface protective film or reinforcing film is attached to the surface of the carrier sheet having the substrate and the light-release adhesive layer, the roll-to-roll, Continuous attachment of the surface protective film and the reinforcing film to the member becomes possible. In this case, the carrier sheet is peeled off after the application.

However, when continuously performing the step of attaching a laminate to a member using the laminate as described above, the base surface of the surface protective film or reinforcing film (especially the end portion) from the lightly peeling adhesive layer of the carrier sheet. ) can be seen floating. Such a phenomenon is often observed particularly when the laminate as described above is paid out, passed through a roll, or when the separator of the surface protective film or reinforcing film is peeled off.

When the phenomenon described above occurs, there arises a problem in that the accuracy of positioning the surface protective film or the reinforcing film to the member is lowered, resulting in misalignment. In addition, when the above phenomenon occurs, there is a problem that the surface protective film and the reinforcing film are peeled off from the light release adhesive layer of the carrier sheet before being attached to the member due to the floating point.

JP 2016-17109 A

An object of the present invention is to provide a laminate in which a surface protection film and a reinforcing film are laminated on a carrier sheet, and when continuously pasted to a member by roll-to-roll, from the adhesive layer of the carrier sheet To provide a laminate in which the substrate surface of a surface protection film or a reinforcing film is difficult to lift.

The laminate of the present invention is
A laminate of five or more layers having a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), and a resin film (3) in this order,
The adhesive layer (1) and the resin film (2) are directly laminated,
The resin film (2) and the adhesive layer (2) are directly laminated,
The laminated portion of the adhesive layer (1) and the resin film (2) is divided into a plurality of through-holes having a width of 0.5 mm to 10 mm in a direction substantially perpendicular to the longitudinal direction,
The longitudinal length of the laminated portion of the plurality of pressure-sensitive adhesive layers (1) and the resin film (2) separated by the through-holes is 1 mm to 2000 mm,
Laminated portions of a plurality of adhesive layers (1) and resin films (2) separated by the through-holes when the resin film (1) is wound around a roll having a diameter of 6 inches on the outside. is floating from the pressure-sensitive adhesive layer (2), the width of the through-hole is 5 mm, and the laminated portion of the plurality of pressure-sensitive adhesive layers (1) and the resin film (2) separated by the through-holes is 0.2 mm or less when the length in the longitudinal direction is 50 mm.

In one embodiment, the total area of the resin film (2) in the plane direction is smaller than the total area of the pressure-sensitive adhesive layer (2) in the plane direction.

According to the present invention, a laminate in which a surface protective film and a reinforcing film are laminated on a carrier sheet, and when continuously attached to a member by roll-to-roll, from the adhesive layer of the carrier sheet It is possible to provide a laminate in which the surface of the base material of the surface protection film or the reinforcing film is less likely to lift.

1 is a schematic cross-sectional view of one embodiment of a laminate of the present invention; FIG.

In the present specification, the expression "weight" may be read as "mass" which is commonly used as an SI unit indicating weight.

When the expression "(meth) acrylic" is used in this specification, it means "acrylic and/or methacrylic", and when the expression "(meth) acrylate" is used, "acrylate and/or methacrylate ", and the expression "(meth)allyl" means "allyl and/or methallyl", and the expression "(meth)acrolein" means "acrolein and/or methacrolein". means rain.

<<<1. Laminates≫≫
The laminate of the present invention is a laminate of five or more layers, having a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), and a resin film (3) in this order. The pressure-sensitive adhesive layer (1) and the resin film (2) are directly laminated, and the resin film (2) and the pressure-sensitive adhesive layer (2) are directly laminated.

The laminate of the present invention has a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), and a resin film (3) in this order, and the adhesive layer (1 ) and the resin film (2) are directly laminated, and as long as the resin film (2) and the pressure-sensitive adhesive layer (2) are directly laminated, any may have other suitable layers of

The number of layers of the laminate of the present invention is preferably 5 to 10 layers, more preferably 5 to 8 layers, still more preferably 5 to 7 layers, depending on the number of other layers described above. , particularly preferably 5 to 6 layers, most preferably 5 layers.

In the laminate of the present invention, the laminated portion of the pressure-sensitive adhesive layer (1) and the resin film (2) is divided into a plurality of sections by through holes having a width of 0.5 mm to 10 mm in a direction substantially perpendicular to the longitudinal direction. Become. The width of such through holes is preferably 0.6 mm to 8 mm, more preferably 0.7 mm to 6 mm, even more preferably 0.8 mm to 5 mm, and particularly preferably 0.9 mm to 4 mm. Yes, most preferably between 1 mm and 3 mm. Such through-holes are preferably substantially rectangular parallelepiped-shaped.

The laminate of the present invention is obtained by dividing the laminated portion of the pressure-sensitive adhesive layer (1) and the resin film (2) into a plurality of through-holes having a predetermined length in a direction substantially perpendicular to the longitudinal direction. When continuously applied to a member by roll-to-roll, the substrate surface of the surface protection film or the reinforcing film is difficult to lift from the pressure-sensitive adhesive layer of the carrier sheet.

In the laminate of the present invention, the laminate portion of the pressure-sensitive adhesive layer (1) and the resin film (2) is divided into a plurality of sections by the through holes. The longitudinal length of the laminated portion of the plurality of pressure-sensitive adhesive layers (1) and the resin film (2) separated by the through holes is 1 mm to 2000 mm, preferably 1 mm to 1000 mm, more preferably 1 mm to 500 mm. , more preferably 2 mm to 500 mm, particularly preferably 2 mm to 400 mm, and most preferably 2 mm to 300 mm. Since the length in the longitudinal direction of the laminated portion of the plurality of pressure-sensitive adhesive layers (1) and the resin film (2) separated by the through-holes is within a predetermined range, the laminate of the present invention can be rolled-to-roll. When continuously attached to a member, a laminate can be obtained in which the substrate surface of the surface protection film or the reinforcing film is difficult to lift from the pressure-sensitive adhesive layer of the carrier sheet.

In the laminate of the present invention, the total area of the resin film (2) in the plane direction is preferably smaller than the total area of the pressure-sensitive adhesive layer (2) in the plane direction. The ratio of the total area of the resin film (2) in the planar direction to the total area of the adhesive layer (2) in the planar direction is preferably 20% to 99.9%, more preferably 50% to 99%. , more preferably 60% to 98%, particularly preferably 70% to 97%, and most preferably 80% to 96%. Since the total area of the resin film (2) in the plane direction is smaller than the total area of the pressure-sensitive adhesive layer (2) in the plane direction, the laminate of the present invention can be continuously rolled to the member by roll-to-roll. A laminate in which the substrate surface of the surface protection film or the reinforcing film is less likely to lift off from the adhesive layer of the carrier sheet can be obtained.

The laminate of the present invention is wound around a roll having a diameter of 6 inches so that the resin film (1) is on the outside, and the laminated portion of the divided multiple adhesive layers (1) and the resin film (2) is adhered. The maximum amount floating from the adhesive layer (2) is 5 mm in the width of the through-hole, and the length in the longitudinal direction of the laminated portion of the plurality of adhesive layers (1) and the resin film (2) separated by the through-hole. When it is 50 mm, it is 0.5 mm or less, preferably 0.3 mm or less, more preferably 0.2 mm or less, still more preferably 0.1 mm or less, and particularly preferably 0.08 mm or less. , most preferably 0 mm. A method for measuring the float will be described later.

The laminate of the present invention is wound around a roll having a diameter of 6 inches so that the resin film (1) is on the outside, and the laminated portion of the divided multiple adhesive layers (1) and the resin film (2) is adhered. The maximum amount floating from the adhesive layer (2) is 3 mm in the width of the through-hole, and the length in the longitudinal direction of the laminated portion of the plurality of adhesive layers (1) and the resin film (2) separated by the through-hole. When the length is 50 mm, it is preferably 0.7 mm or less, more preferably 0.5 mm or less, still more preferably 0.3 mm or less, particularly preferably 0.2 mm or less, and most preferably 0 mm. . A method for measuring the float will be described later.

The laminate of the present invention is wound around a roll having a diameter of 6 inches so that the resin film (1) is on the outside, and the laminated portion of the divided multiple adhesive layers (1) and the resin film (2) is adhered. The maximum amount floating from the adhesive layer (2) is 1 mm in the width of the through-hole, and the length in the longitudinal direction of the laminated portion of the plurality of adhesive layers (1) and the resin film (2) separated by the through-hole is When the length is 50 mm, it is preferably 1.2 mm or less, more preferably 1.0 mm or less, still more preferably 0.5 mm or less, particularly preferably 0.2 mm or less, and most preferably 0.1 mm. It is below. A method for measuring the float will be described later.

One embodiment of the laminate of the present invention, as shown in FIG. An agent layer (2) 40 and a resin film (3) 50 are directly laminated in this order. In FIG. 1, the laminated portion of the adhesive layer (1) 20 and the resin film (2) 30 is divided into a plurality of through-holes 60 having a predetermined length in a direction substantially perpendicular to the longitudinal direction. A laminated portion of a plurality of pressure-sensitive adhesive layers (1) and a resin film (2) is constituted.

In one embodiment of the laminate of the present invention shown in FIG. 1, the laminate portion of the resin film (1), adhesive layer (1), and resin film (2) can be a surface protection film or a reinforcing film. In this case, the resin film (1) can serve as a separator.

In one embodiment of the laminate of the present invention shown in FIG. 1, the laminate portion of the adhesive layer (2) and resin film (3) can serve as a carrier sheet. A carrier sheet can also be treated as a surface protective film.

When the laminate of the present invention is peeled from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 30 mm/min in an atmosphere of 23°C and 50% RH, The adhesive strength is preferably 1 gf/25 mm or more, more preferably 1 gf/25 mm to 10 gf/25 mm, still more preferably 1.2 gf/25 mm to 8 gf/25 mm, still more preferably 1.4 gf/25 mm to 7 gf/25 mm, particularly preferably 1.6 gf/25 mm to 5 gf/25 mm, most preferably 1.8 gf/25 mm to 3 gf/25 mm. If the adhesive strength is within the above range, the laminate of the present invention is more likely to lift the resin film (2) from the adhesive layer (2) when continuously attached to a member by roll-to-roll. can be suppressed. A method for measuring the adhesive strength will be described later.

When the laminate of the present invention is peeled from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 300 mm/min in an atmosphere of 23° C. and 50% RH, The adhesive strength is preferably 2 gf/25 mm or more, more preferably 2 gf/25 mm to 20 gf/25 mm, still more preferably 2.5 gf/25 mm to 10 gf/25 mm, still more preferably 3 gf/25 mm to 9 gf/ 25 mm, particularly preferably 3 gf/25 mm to 8 gf/25 mm, most preferably 3.5 gf/25 mm to 7 gf/25 mm. If the adhesive strength is within the above range, the laminate of the present invention is more likely to lift the resin film (2) from the adhesive layer (2) when continuously attached to a member by roll-to-roll. can be suppressed. A method for measuring the adhesive strength will be described later.

When the laminate of the present invention is peeled from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 2400 mm/min in an atmosphere of 23°C and 50% RH, The adhesive strength is preferably 5 gf/25 mm or more, more preferably 5 gf/25 mm to 100 gf/25 mm, still more preferably 7 gf/25 mm to 60 gf/25 mm, still more preferably 8 gf/25 mm to 40 gf/25 mm. Yes, particularly preferably 9 gf/25 mm to 30 gf/25 mm, most preferably 10 gf/25 mm to 25 gf/25 mm. If the adhesive strength is within the above range, the laminate of the present invention is more likely to lift the resin film (2) from the adhesive layer (2) when continuously attached to a member by roll-to-roll. can be suppressed. A method for measuring the adhesive strength will be described later.

In the laminate of the present invention, the pressure-sensitive adhesive layer (1) is peeled from the glass at a peeling angle of 180 degrees and a peeling speed of 300 mm/min in an atmosphere of 23° C. temperature and 50% RH. The pressure-sensitive adhesive layer (2) is removed from the glass at a peeling angle of 180 degrees and a peeling speed of 300 mm / min in an atmosphere of a temperature of 23 ° C. and a humidity of 50% RH. The adhesive strength (2) when peeling from the adhesive is preferably adhesive strength (1)>adhesive strength (2). Adhesion (1) > Adhesion (2) allows the effect of the present invention to be exhibited more effectively. A method for measuring the adhesive strength will be described later.

The laminate of the present invention preferably has a total light transmittance of 60% or more, more preferably 70% to 100%, still more preferably 80% to 100%, and particularly preferably 83% to 100%. %, most preferably between 85% and 100%. A method for measuring the total light transmittance will be described later.

The laminate of the present invention preferably has a haze of 15% or less, more preferably 0% to 10%, still more preferably 0% to 8%, and particularly preferably 0% to 7%. , most preferably 0% to 6%. A method for measuring the haze will be described later.

<<1-1. Resin film (1)>>
The thickness of the resin film (1) is preferably from 1 μm to 300 μm, more preferably from 10 μm to 200 μm, still more preferably from 30 μm to 150 μm, and particularly preferably from the viewpoint that the effects of the present invention can be more expressed. is between 40 μm and 100 μm, most preferably between 50 μm and 80 μm.

The resin film (1) includes a resin substrate film (1a).

Examples of the resin base film (1a) include plastic films made of polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT); polyethylene (PE), polypropylene ( PP), polymethylpentene (PMP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA) and other α-olefin-based olefin-based resins as monomer components; polyvinyl chloride; plastic film made of (PVC); plastic film made of vinyl acetate resin; plastic film made of polycarbonate (PC); plastic film made of polyphenylene sulfide (PPS); Plastic film composed of amide resin such as aromatic polyamide (aramid); plastic film composed of polyimide resin; plastic film composed of polyether ether ketone (PEEK); polyethylene (PE), polypropylene (PP ) and other olefinic resins; polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, chlorofluoroethylene-vinylidene fluoride a plastic film composed of a fluororesin such as a copolymer; and the like.

The resin substrate film (1a) may have only one layer, or may have two or more layers. The resin substrate film (1a) may be stretched.

The resin substrate film (1a) may be surface-treated. Examples of surface treatment include corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high voltage shock exposure, ionizing radiation treatment, and coating treatment with a primer.

The resin substrate film (1a) may contain any appropriate additive within a range that does not impair the effects of the present invention.

The resin film (1) may have a release layer (1b) in order to enhance the releasability from the pressure-sensitive adhesive layer (1). When the resin film (1) has a release layer (1b), the release layer (1b) side is directly laminated on the adhesive layer (1).

Any appropriate material can be adopted as the material for forming the release layer (1b) as long as the effects of the present invention are not impaired. Examples of such forming materials include silicone-based release agents, fluorine-based release agents, long-chain alkyl-based release agents, fatty acid amide-based release agents, and the like. Among these, silicone release agents are preferred. The release layer (1b) can be formed as a coating layer.

As the thickness of the release layer (1b), any suitable thickness can be adopted according to the purpose within a range that does not impair the effects of the present invention. Such a thickness is preferably 10 nm to 2000 nm, more preferably 10 nm to 1500 nm, still more preferably 10 nm to 1000 nm, and particularly preferably 10 nm to 500 nm.

The release layer (1b) may consist of only one layer, or may consist of two or more layers.

Examples of silicone-based release layers include addition-reactive silicone resins. Specific examples of the addition reaction type silicone resin include, for example, KS-774, KS-775, KS-778, KS-779H, KS-847H, and KS-847T manufactured by Shin-Etsu Chemical; TPR- 6700, TPR-6710, TPR-6721; SD7220, SD7226 manufactured by Dow Corning Toray; The ^coating amount (after drying) of the silicone release layer is preferably 0.01 g/m ² to 2 g/m 2 , more preferably 0.01 g/m ² to 1 g/m ² , still more preferably 0.01 g/m ² to 0.5 g/m ² .

The release layer (1b) is formed, for example, by applying the above-described forming material on any appropriate layer by a conventionally known coating method such as reverse gravure coating, bar coating, die coating, etc. It can be cured by heat treatment at about 200°C. Moreover, you may combine heat processing and active-energy-ray irradiation, such as ultraviolet irradiation, as needed.

The resin film (1) may have an antistatic layer (1c).

Any appropriate thickness can be adopted as the thickness of the antistatic layer (1c) as long as the effects of the present invention are not impaired. Such a thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, even more preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.

The antistatic layer (1c) may consist of only one layer, or may consist of two or more layers.

As the antistatic layer (1c), any appropriate antistatic layer can be employed as long as it is a layer capable of exhibiting an antistatic effect within a range that does not impair the effects of the present invention. Such an antistatic layer is preferably an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on any suitable substrate layer. Specifically, for example, it is an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on the resin substrate film (1a). Specific coating methods include a roll coating method, a bar coating method, a gravure coating method, and the like.

As the conductive polymer, any appropriate conductive polymer can be adopted as long as the effects of the present invention are not impaired. Examples of such a conductive polymer include a conductive polymer obtained by doping a π-conjugated conductive polymer with a polyanion. Examples of π-conjugated conductive polymers include linear conductive polymers such as polythiophene, polypyrrole, polyaniline, and polyacetylene. Polyanions include polystyrene sulfonic acid, polyisoprene sulfonic acid, polyvinyl sulfonic acid, polyallylsulfonic acid, polyethyl acrylate sulfonic acid, polymethacrylic carboxylic acid, and the like. Only one type of conductive polymer may be used, or two or more types may be used.

One embodiment of the resin film (1) includes a resin substrate film (1a), an antistatic layer (1c) and a release layer (1b) in this order. Typically, this embodiment consists of a resin substrate film (1a), an antistatic layer (1c) and a release layer (1b).

Another embodiment of the resin film (1) comprises an antistatic layer (1c), a resin substrate film (1a), an antistatic layer (1c) and a release layer (1b) in this order. Typically, this embodiment comprises an antistatic layer (1c), a resin base film (1a), an antistatic layer (1c) and a release layer (1b).

<<1-2. Adhesive layer (1)>>
Any appropriate pressure-sensitive adhesive layer can be adopted as the pressure-sensitive adhesive layer (1) as long as the effects of the present invention are not impaired. The pressure-sensitive adhesive layer (1) may consist of only one layer, or may consist of two or more layers.

The thickness of the pressure-sensitive adhesive layer (1) is preferably 0.5 μm to 150 μm, more preferably 1 μm to 100 μm, still more preferably 3 μm to 80 μm, in order to further express the effects of the present invention. Especially preferred is 5 μm to 50 μm, most preferred is 5 μm to 30 μm.

As described above, the pressure-sensitive adhesive layer (1) is formed by dividing the portion laminated with the resin film (2) into a plurality of through-holes having a predetermined length in a direction substantially perpendicular to the longitudinal direction.

The pressure-sensitive adhesive layer (1) preferably comprises at least one selected from the group consisting of acrylic pressure-sensitive adhesives, urethane-based pressure-sensitive adhesives, rubber-based pressure-sensitive adhesives, and silicone pressure-sensitive adhesives.

The adhesive layer (1) can be formed by any appropriate method. As such a method, for example, at least one selected from the group consisting of an adhesive composition (acrylic adhesive composition, urethane adhesive composition, rubber adhesive composition, silicone adhesive composition ) is applied onto any appropriate substrate (e.g., resin film (2)), heated and dried as necessary, and cured as necessary to form a pressure-sensitive adhesive layer on the substrate. method. Examples of such coating methods include gravure roll coater, reverse roll coater, kiss roll coater, dip roll coater, bar coater, knife coater, air knife coater, spray coater, comma coater, direct coater, roll brush coater, and the like. method.

The adhesive layer (1) may contain a conductive component. Only one type of conductive component may be used, or two or more types may be used.

<1-2-1. Acrylic adhesive>
An acrylic pressure-sensitive adhesive is formed from an acrylic pressure-sensitive adhesive composition.

The acrylic pressure-sensitive adhesive composition preferably contains an acrylic polymer and a cross-linking agent so that the effects of the present invention can be exhibited more effectively.

Acrylic polymers can be referred to as so-called base polymers in the field of acrylic pressure-sensitive adhesives. Only one type of acrylic polymer may be used, or two or more types may be used.

The content of the acrylic polymer in the acrylic pressure-sensitive adhesive composition is preferably 60% to 99.9% by weight, more preferably 65% to 99.9% by weight, in terms of solid content, More preferably 70% to 99.9% by weight, particularly preferably 75% to 99.9% by weight, most preferably 80% to 99.9% by weight.

As the acrylic polymer, any appropriate acrylic polymer can be adopted as long as the effects of the present invention are not impaired.

The weight-average molecular weight of the acrylic polymer is preferably 300,000 to 2,500,000, more preferably 350,000 to 2,000,000, and still more preferably 400,000 to 1,800,000 in terms of allowing the effect of the present invention to be expressed more. and particularly preferably 500,000 to 1,500,000.

The acrylic polymer is preferably (component a) an alkyl (meth)acrylate having 4 to 12 carbon atoms in the alkyl group of the alkyl ester moiety, (b Component) An acrylic polymer formed by polymerization from a composition (A) containing at least one member selected from the group consisting of (meth)acrylic acid esters having an OH group and (meth)acrylic acid.

As the acrylic polymer, the (component a) is preferably a (meth)acrylic acid alkyl ester in which the alkyl group in the alkyl ester portion has 4 to 12 carbon atoms, in that the effects of the present invention can be further exhibited. and (component b) is an acrylic polymer formed by polymerization from the composition (A), which contains (meth)acrylic acid but does not contain a (meth)acrylic acid ester having an OH group, more preferably , (component a) as an alkyl (meth)acrylic acid ester in which the alkyl group in the alkyl ester portion has 4 to 8 carbon atoms, and (component b) does not contain a (meth)acrylic acid ester having an OH group. is an acrylic polymer formed by polymerization from the composition (A) containing acrylic acid.

(Component a) and (Component b) may each independently be one kind or two or more kinds.

Examples of the (meth)acrylic acid alkyl ester (component a) in which the alkyl group of the alkyl ester moiety has 4 to 12 carbon atoms include n-butyl (meth)acrylate, isobutyl (meth)acrylate, and (meth)acrylate. s-butyl acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-(meth)acrylate Ethylhexyl, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate etc. Among these, n-butyl (meth)acrylate and 2-ethylhexyl (meth)acrylate are preferred, and n-butyl acrylate and acrylic are more preferred, in that the effects of the present invention can be more expressed. acid 2-ethylhexyl.

At least one (component b) selected from the group consisting of (meth)acrylic acid esters having an OH group and (meth)acrylic acid includes, for example, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, Examples thereof include (meth)acrylic acid esters having an OH group such as hydroxybutyl (meth)acrylate, and (meth)acrylic acid. Among these, hydroxyethyl (meth)acrylate and (meth)acrylic acid are preferred, and hydroxyethyl acrylate and acrylic acid are more preferred, from the viewpoint that the effects of the present invention can be exhibited more.

Composition (A) may contain copolymerizable monomers other than components (a) and (b). The number of copolymerizable monomers may be one, or two or more. Such copolymerizable monomers include, for example, itaconic acid, maleic acid, fumaric acid, crotonic acid, isocrotonic acid, acid anhydrides thereof (for example, acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride). ) and other carboxyl group-containing monomers (excluding (meth)acrylic acid); (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-methylol(meth)acrylamide, N-methoxymethyl(meth)acrylamide , N-butoxymethyl (meth)acrylamide, N-hydroxyethyl (meth)acrylamide and other amide group-containing monomers; aminoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, t-butyl (meth)acrylate amino group-containing monomers such as aminoethyl; epoxy group-containing monomers such as glycidyl (meth)acrylate and methylglycidyl (meth)acrylate; cyano group-containing monomers such as acrylonitrile and methacrylonitrile; N-vinyl-2-pyrrolidone, Heterocycle-containing vinyl-based monomers such as (meth)acryloylmorpholine, N-vinylpiperidone, N-vinylpiperazine, N-vinylpyrrole, N-vinylimidazole, vinylpyridine, vinylpyrimidine and vinyloxazole; sulfonic acids such as sodium vinylsulfonate Group-containing monomers; phosphoric acid group-containing monomers such as 2-hydroxyethyl acryloyl phosphate; imide group-containing monomers such as cyclohexylmaleimide and isopropylmaleimide; isocyanate group-containing monomers such as 2-methacryloyloxyethyl isocyanate; (Meth)acrylic acid esters having alicyclic hydrocarbon groups such as cyclohexyl (meth)acrylate and isobornyl (meth)acrylate; aromatics such as phenyl (meth)acrylate, phenoxyethyl (meth)acrylate and benzyl (meth)acrylate (Meth)acrylic acid esters having a hydrocarbon group; vinyl esters such as vinyl acetate and vinyl propionate; aromatic vinyl compounds such as styrene and vinyl toluene; olefins and dienes such as ethylene, butadiene, isoprene and isobutylene; vinyl ethers such as alkyl ether; vinyl chloride; and the like.

Polyfunctional monomers may also be employed as copolymerizable monomers. A polyfunctional monomer refers to a monomer having two or more ethylenically unsaturated groups in one molecule. As the ethylenically unsaturated group, any suitable ethylenically unsaturated group can be adopted as long as the effects of the present invention are not impaired. Such ethylenically unsaturated groups include, for example, radically polymerizable functional groups such as vinyl groups, propenyl groups, isopropenyl groups, vinyl ether groups (vinyloxy groups), and allyl ether groups (allyloxy groups). Examples of polyfunctional monomers include hexanediol di(meth)acrylate, butanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, and neopentyl glycol. Di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, trimethylolpropane tri(meth)acrylate, tetramethylolmethane tri(meth)acrylate, allyl (Meth)acrylate, vinyl (meth)acrylate, divinylbenzene, epoxy acrylate, polyester acrylate, urethane acrylate, and the like. Only one such polyfunctional monomer may be used, or two or more thereof may be used.

(Meth)acrylic acid alkoxyalkyl esters may also be employed as copolymerizable monomers. Examples of (meth)acrylic acid alkoxyalkyl esters include 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, methoxytriethylene glycol (meth)acrylate, and 3-(meth)acrylate. methoxypropyl, 3-ethoxypropyl (meth)acrylate, 4-methoxybutyl (meth)acrylate, 4-ethoxybutyl (meth)acrylate and the like. The (meth)acrylic acid alkoxyalkyl ester may be used alone or in combination of two or more.

The content of the (meth)acrylic acid alkyl ester (ingredient a) in which the alkyl group of the alkyl ester portion has 4 to 12 carbon atoms is the monomer constituting the acrylic polymer in that the effect of the present invention can be expressed more. With respect to the total amount of components (100% by weight), it is preferably 30% by weight or more, more preferably 35% by weight to 99% by weight, still more preferably 40% by weight to 98% by weight, particularly preferably 50% by weight. % to 95% by weight.

The content of at least one (component b) selected from the group consisting of (meth)acrylic acid esters having an OH group and (meth)acrylic acid is such that the effects of the present invention can be more expressed, and the acrylic polymer is It is preferably 1% by weight or more, more preferably 1% by weight to 30% by weight, still more preferably 2% by weight to 20% by weight, based on the total amount (100% by weight) of the constituent monomer components. It is preferably 3% to 10% by weight.

Composition (A) may contain any appropriate other component within a range that does not impair the effects of the present invention. Such other components include, for example, polymerization initiators, chain transfer agents, solvents and the like. Any appropriate content can be adopted as the content of these other components as long as the effects of the present invention are not impaired.

A thermal polymerization initiator, a photopolymerization initiator (photoinitiator), or the like can be used as the polymerization initiator depending on the type of polymerization reaction. Only one polymerization initiator may be used, or two or more polymerization initiators may be used.

A thermal polymerization initiator can preferably be employed when the acrylic polymer is obtained by solution polymerization. Examples of such thermal polymerization initiators include azo polymerization initiators, peroxide polymerization initiators (eg, dibenzoyl peroxide, tert-butyl permaleate, etc.), redox polymerization initiators, and the like. . Among these thermal polymerization initiators, the azo initiators disclosed in JP-A-2002-69411 are particularly preferred. Such an azo polymerization initiator is preferable in that the decomposition product of the polymerization initiator is less likely to remain in the acrylic polymer as a portion that causes the generation of heat-generated gas (outgas). As the azo polymerization initiator, 2,2'-azobisisobutyronitrile (hereinafter sometimes referred to as AIBN), 2,2'-azobis-2-methylbutyronitrile (hereinafter referred to as AMBN) ), 2,2′-azobis(2-methylpropionate)dimethyl, 4,4′-azobis-4-cyanovaleric acid, and the like.

A photopolymerization initiator can be preferably employed when obtaining an acrylic polymer by active energy ray polymerization. Examples of photopolymerization initiators include benzoin ether-based photopolymerization initiators, acetophenone-based photopolymerization initiators, α-ketol-based photopolymerization initiators, aromatic sulfonyl chloride-based photopolymerization initiators, and photoactive oxime-based photopolymerization initiators. benzoin-based photopolymerization initiators, benzyl-based photopolymerization initiators, benzophenone-based photopolymerization initiators, ketal-based photopolymerization initiators, thioxanthone-based photopolymerization initiators, and the like.

Examples of benzoin ether-based photopolymerization initiators include benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2,2-dimethoxy-1,2-diphenylethan-1-one, and anisole. and methyl ether. Acetophenone-based photopolymerization initiators include, for example, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexylphenylketone, 4-phenoxydichloroacetophenone, and 4-(t-butyl). and dichloroacetophenone. Examples of α-ketol photopolymerization initiators include 2-methyl-2-hydroxypropiophenone, 1-[4-(2-hydroxyethyl)phenyl]-2-methylpropan-1-one, and the like. . Examples of aromatic sulfonyl chloride photopolymerization initiators include 2-naphthalenesulfonyl chloride. Examples of photoactive oxime-based photopolymerization initiators include 1-phenyl-1,1-propanedione-2-(o-ethoxycarbonyl)-oxime. Benzoin-based photopolymerization initiators include, for example, benzoin. Examples of benzyl-based photopolymerization initiators include benzyl. Examples of benzophenone-based photopolymerization initiators include benzophenone, benzoylbenzoic acid, 3,3′-dimethyl-4-methoxybenzophenone, polyvinylbenzophenone, α-hydroxycyclohexylphenylketone, and the like. Examples of ketal-based photopolymerization initiators include benzyl dimethyl ketal. Thioxanthone-based photopolymerization initiators include, for example, thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-diisopropylthioxanthone, and dodecylthioxanthone.

The acrylic pressure-sensitive adhesive composition may contain a cross-linking agent. By using a cross-linking agent, the cohesive force of the acrylic pressure-sensitive adhesive can be improved, and the effects of the present invention can be exhibited more. The number of cross-linking agents may be one, or two or more.

Examples of cross-linking agents include polyfunctional isocyanate-based cross-linking agents, epoxy-based cross-linking agents, melamine-based cross-linking agents, peroxide-based cross-linking agents, urea-based cross-linking agents, metal alkoxide cross-linking agents, metal chelate-based cross-linking agents, and metal salts. cross-linking agents, carbodiimide-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, amine-based cross-linking agents, and the like. Among these, at least one (component c) selected from the group consisting of polyfunctional isocyanate-based cross-linking agents and epoxy-based cross-linking agents is preferable in that the effects of the present invention can be exhibited more effectively.

Polyfunctional isocyanate-based cross-linking agents include, for example, lower aliphatic polyisocyanates such as 1,2-ethylene diisocyanate, 1,4-butylene diisocyanate, and 1,6-hexamethylene diisocyanate; cyclopentylene diisocyanate, cyclohexylene diisocyanate, Alicyclic polyisocyanates such as isophorone diisocyanate, hydrogenated tolylene diisocyanate and hydrogenated xylene diisocyanate; 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4′-diphenylmethane diisocyanate, xylylene diisocyanate and aromatic polyisocyanates. Polyfunctional isocyanate-based cross-linking agents include, for example, trimethylolpropane/tolylene diisocyanate adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate L"), trimethylolpropane/hexamethylene diisocyanate adduct (Nippon Polyurethane Industry Co., Ltd. company, trade name "Coronate HL"), trade name "Coronate HX" (Nippon Polyurethane Industry Co., Ltd.), trimethylolpropane/xylylene diisocyanate adduct (manufactured by Mitsui Chemicals, trade name "Takenate 110N"), etc. A commercial item is also mentioned.

Examples of epoxy-based cross-linking agents (polyfunctional epoxy compounds) include N,N,N',N'-tetraglycidyl-m-xylenediamine, diglycidylaniline, 1,3-bis(N,N-diglycidylamino methyl)cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, trimethylolpropane polyglycidyl ether, adipate diglycidyl ester, o-phthalate diglycidyl ester, triglycidyl-tris(2- hydroxyethyl)isocyanurate, resorcinol diglycidyl ether, bisphenol-S-diglycidyl ether, epoxy resins having two or more epoxy groups in the molecule, and the like. Examples of epoxy-based cross-linking agents include commercially available products such as the trade name "Tetrad C" (manufactured by Mitsubishi Gas Chemical Company, Inc.).

Any appropriate content can be adopted as the content of the cross-linking agent in the acrylic pressure-sensitive adhesive composition as long as the effects of the present invention are not impaired. Such a content is, for example, preferably 0.05 parts by weight to 20 parts by weight with respect to the solid content (100 parts by weight) of the acrylic polymer in terms of being able to express the effects of the present invention more. , more preferably 0.1 to 18 parts by weight, still more preferably 0.5 to 15 parts by weight, and particularly preferably 0.5 to 10 parts by weight.

The acrylic pressure-sensitive adhesive composition may contain any appropriate other component within a range that does not impair the effects of the present invention. Such other components include, for example, polymer components other than acrylic polymers, cross-linking accelerators, cross-linking catalysts, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), Antiaging agents, inorganic fillers, organic fillers, metal powders, colorants (pigments, dyes, etc.), foils, UV absorbers, antioxidants, light stabilizers, chain transfer agents, plasticizers, softeners, Surfactants, antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat stabilizers, polymerization inhibitors, lubricants, solvents, catalysts and the like.

<1-2-2. Urethane Adhesive>
As the urethane-based pressure-sensitive adhesive, any suitable urethane-based pressure-sensitive adhesive such as a known urethane-based pressure-sensitive adhesive described in JP-A-2017-039859 can be employed as long as the effects of the present invention are not impaired. . Such a urethane-based pressure-sensitive adhesive is, for example, a urethane-based pressure-sensitive adhesive formed from a urethane-based pressure-sensitive adhesive composition, wherein the urethane-based pressure-sensitive adhesive composition is selected from the group consisting of urethane prepolymers and polyols. It contains at least one type and a cross-linking agent. Only one type of urethane adhesive may be used, or two or more types may be used. The urethane pressure-sensitive adhesive may contain any appropriate component within a range that does not impair the effects of the present invention.

<1-2-3. Rubber adhesive>
As the rubber-based pressure-sensitive adhesive, any suitable rubber-based pressure-sensitive adhesive such as known rubber-based pressure-sensitive adhesives described in JP-A-2015-074771 can be employed as long as the effects of the present invention are not impaired. . These may be of only one type, or may be of two or more types. The rubber-based pressure-sensitive adhesive may contain any appropriate component within a range that does not impair the effects of the present invention.

<1-2-4. Silicone adhesive>
As the silicone-based pressure-sensitive adhesive, any suitable silicone-based pressure-sensitive adhesive such as known silicone-based pressure-sensitive adhesives described in JP-A-2014-047280 can be employed as long as the effects of the present invention are not impaired. . These may be of only one type, or may be of two or more types. The silicone-based pressure-sensitive adhesive may contain any appropriate component within a range that does not impair the effects of the present invention.

<1-2-5. Conductive Component>
The adhesive layer (1) may contain a conductive component. Typically, the adhesive composition to be the material of the adhesive layer (1) (group consisting of acrylic adhesive composition, urethane adhesive composition, rubber adhesive composition, silicone adhesive composition at least one selected from) may contain a conductive component.

As the conductive component, any suitable conductive component can be adopted as long as the effects of the present invention are not impaired. Such a conductive component is preferably at least one compound selected from ionic liquids, ion-conducting polymers, ion-conducting fillers, and electrically-conducting polymers.

When the pressure-sensitive adhesive composition contains a conductive component, the ratio of the base polymer (e.g., acrylic polymer, polyol, urethane prepolymer, rubber-based polymer, silicone-based polymer) to the conductive component is It is preferably 0.01 to 10 parts by weight, more preferably 0.05 to 9.0 parts by weight, still more preferably 0.075 to 8 parts by weight, relative to 100 parts by weight of the base polymer. .0 parts by weight, particularly preferably 0.1 to 7.0 parts by weight.

As the ionic liquid, any appropriate ionic liquid can be adopted as long as the effects of the present invention are not impaired. Here, the ionic liquid means a molten salt (ionic compound) that exhibits a liquid state at 25°C. Only one type of ionic liquid may be used, or two or more types may be used.

Such an ionic liquid is preferably an ionic liquid composed of a fluoroorganic anion and an onium cation.

As the onium cation that can constitute the ionic liquid, any suitable onium cation can be adopted as long as the effects of the present invention are not impaired. Such an onium cation is preferably at least one selected from nitrogen-containing onium cations, sulfur-containing onium cations, and phosphorus-containing onium cations.

As the onium cation that can constitute the ionic liquid, at least one selected from cations having structures represented by general formulas (1) to (5) is preferable in that the effects of the present invention can be further expressed. is.

In general formula (1), Ra represents a hydrocarbon group having 4 to 20 carbon atoms and may contain a heteroatom; It represents a hydrogen group and may contain a heteroatom. However, when the nitrogen atom contains a double bond, there is no Rc.

In general formula (2), Rd represents a hydrocarbon group having 2 to 20 carbon atoms and may contain a heteroatom, and Re, Rf, and Rg are the same or different and are hydrogen or It represents 16 hydrocarbon groups and may contain heteroatoms.

In general formula (3), Rh represents a hydrocarbon group having 2 to 20 carbon atoms and may contain a heteroatom; Ri, Rj, and Rk are the same or different and are hydrogen or It represents 16 hydrocarbon groups and may contain heteroatoms.

In general formula (4), Z represents a nitrogen atom, a sulfur atom, or a phosphorus atom; R ₁ , Rm, Rn, and Ro are the same or different and represent a hydrocarbon group having 1 to 20 carbon atoms; It may contain heteroatoms. However, when Z is a sulfur atom, there is no Ro.

In general formula (5), X represents a Li atom, Na atom, or K atom.

Examples of the cation represented by the general formula (1) include pyridinium cation, pyrrolidinium cation, piperidinium cation, cation having a pyrroline skeleton, cation having a pyrrole skeleton, and the like.

Specific examples of the cation represented by formula (1) include 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-ethyl-3-methylpyridinium cation, 1-butyl -pyridinium cations such as 3-methylpyridinium cation, 1-hexyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, 1-octyl-4-methylpyridinium cation; 1-ethyl-1-methylpyrroli dinium cation, 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1-butylpyrrolidinium cation, 1-methyl-1-pentylpyrrolidinium cation, 1-methyl-1-hexylpyrrolidinium cation cation, 1-methyl-1-heptylpyrrolidinium cation, 1-ethyl-1-propylpyrrolidinium cation, 1-ethyl-1-butylpyrrolidinium cation, 1-ethyl-1-pentylpyrrolidinium cation , 1-ethyl-1-hexylpyrrolidinium cation, 1-ethyl-1-heptylpyrrolidinium cation; 1-methyl-1-ethylpiperidinium cation, 1-methyl-1 -propylpiperidinium cation, 1-methyl-1-butylpiperidinium cation, 1-methyl-1-pentylpiperidinium cation, 1-methyl-1-hexylpiperidinium cation, 1-methyl-1-to butylpiperidinium cation, 1-ethyl-1-propylpiperidinium cation, 1-ethyl-1-butylpiperidinium cation, 1-ethyl-1-pentylpiperidinium cation, 1-ethyl-1-hexylpiperidinium cation piperidinium cations such as peridinium cation, 1-ethyl-1-heptylpiperidinium cation, 1-propyl-1-butylpiperidinium cation; and the like, more preferably 1-hexylpyridinium cation , 1-ethyl-3-methylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-octyl-4-methylpyridinium cation, 1-methyl-1-propylpyrrolidinium cation, 1-methyl-1-propyl It is a piperidinium cation.

Examples of cations represented by general formula (2) include imidazolium cations, tetrahydropyrimidinium cations, and dihydropyrimidinium cations.

Specific examples of the cation represented by the general formula (2) include, for example, 1,3-dimethylimidazolium cation, 1,3-diethylimidazolium cation, 1-ethyl-3-methylimidazolium cation, 1-butyl -3-methylimidazolium cation, 1-hexyl-3-methylimidazolium cation, 1-octyl-3-methylimidazolium cation, 1-decyl-3-methylimidazolium cation, 1-dodecyl-3-methylimidazolium cation imidazolium cations such as lithium cations and 1-tetradecyl-3-methylimidazolium cations, more preferably 1-ethyl-3-methylimidazolium cations and 1-hexyl-3-methylimidazolium cations.

Examples of the cation represented by formula (3) include pyrazolium cation and pyrazolinium cation.

Specific examples of the cation represented by the general formula (3) include, for example, 1-methylpyrazolium cation, 3-methylpyrazolium cation, 1-ethyl-2-methylpyrazolinium cation, 1-ethyl- pyrazolium cations such as 2,3,5-trimethylpyrazolium cation, 1-propyl-2,3,5-trimethylpyrazolium cation, 1-butyl-2,3,5-trimethylpyrazolium cation; pyrazolinium cation such as 1-ethyl-2,3,5-trimethylpyrazolinium cation, 1-propyl-2,3,5-trimethylpyrazolinium cation, 1-butyl-2,3,5-trimethylpyrazolinium cation Zolinium cation; and the like.

Examples of cations represented by general formula (4) include tetraalkylammonium cations, trialkylsulfonium cations, tetraalkylphosphonium cations, and some of the above alkyl groups are substituted with alkenyl groups, alkoxyl groups, and epoxy groups. and the like.

Specific examples of the cation represented by the general formula (4) include, for example, triethylmethylammonium cation, tributylethylammonium cation, trimethyldecylammonium cation, diethylmethylsulfonium cation, dibutylethylsulfonium cation, dimethyldecylsulfonium cation, triethylmethyl Asymmetric tetraalkylammonium cations such as phosphonium cations, tributylethylphosphonium cations, trimethyldecylphosphonium cations, trialkylsulfonium cations, tetraalkylphosphonium cations, and N,N-diethyl-N-methyl-N-(2-methoxyethyl) ammonium cation, glycidyltrimethylammonium cation, diallyldimethylammonium cation, N,N-dimethyl-N-ethyl-N-propylammonium cation, N,N-dimethyl-N-ethyl-N-butylammonium cation, N,N-dimethyl -N-ethyl-N-pentylammonium cation, N,N-dimethyl-N-ethyl-N-hexylammonium cation, N,N-dimethyl-N-ethyl-N-heptylammonium cation, N,N-dimethyl-N -ethyl-N-nonylammonium cation, N,N-dimethyl-N,N-dipropylammonium cation, N,N-diethyl-N-propyl-N-butylammonium cation, N,N-dimethyl-N-propyl- N-pentylammonium cation, N,N-dimethyl-N-propyl-N-hexylammonium cation, N,N-dimethyl-N-propyl-N-heptylammonium cation, N,N-dimethyl-N-butyl-N- hexylammonium cation, N,N-diethyl-N-butyl-N-heptylammonium cation, N,N-dimethyl-N-pentyl-N-hexylammonium cation, N,N-dimethyl-N,N-dihexylammonium cation, trimethylheptylammonium cation, N,N-diethyl-N-methyl-N-propylammonium cation, N,N-diethyl-N-methyl-N-pentylammonium cation, N,N-diethyl-N-methyl-N-heptyl ammonium cation, N,N-diethyl-N-propyl-N-pentylammonium cation, triethylpropylammonium cation, triethylpentylammonium cation, triethylheptylammonium cation, N,N-dipropyl-N-methyl-N-ethylammonium cation, N,N-dipropyl-N-methyl-N-pentylammonium cation, N,N-dipropyl-N-butyl-N-hexylammonium cation, N,N-dipropyl-N,N-dihexylammonium cation, N,N- Dibutyl-N-methyl-N-pentylammonium cation, N,N-dibutyl-N-methyl-N-hexylammonium cation, trioctylmethylammonium cation, N-methyl-N-ethyl-N-propyl-N-pentylammonium cation cations, and more preferably trimethylpropylammonium cation.

As the fluoroorganic anion that can constitute the ionic liquid, any suitable fluoroorganic anion can be adopted as long as the effects of the present invention are not impaired. Such fluoroorganic anions may be fully fluorinated (perfluorinated) or partially fluorinated.

Examples of such fluoroorganic anions include perfluoroalkylsulfonate, bis(fluorosulfonyl)imide and bis(perfluoroalkanesulfonyl)imide, and more specifically trifluoromethanesulfonate and pentafluoroethanesulfonate. , heptafluoropropanesulfonate, nonafluorobutanesulfonate, bis(fluorosulfonyl)imide, bis(trifluoromethanesulfonyl)imide.

Specific examples of the ionic liquid may be appropriately selected from combinations of the above cationic components and the above anionic components. Specific examples of such ionic liquids include 1-hexylpyridinium bis(fluorosulfonyl)imide, 1-ethyl-3-methylpyridinium trifluoromethanesulfonate, 1-ethyl-3-methylpyridinium pentafluoroethanesulfonate, 1-ethyl-3-methylpyridinium heptafluoropropanesulfonate, 1-ethyl-3-methylpyridinium nonafluorobutanesulfonate, 1-butyl-3-methylpyridinium trifluoromethanesulfonate, 1-butyl-3-methylpyridinium bis(trifluoromethane sulfonyl)imide, 1-octyl-4-methylpyridinium bis(fluorosulfonyl)imide, 1-methyl-1-propylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-propylpyrrolidinium bis(fluoro sulfonyl)imide, 1-methyl-1-propylpiperidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-propylpiperidinium bis(fluorosulfonyl)imide, 1-ethyl-3-methylimidazolium trifluoromethane Sulfonate, 1-ethyl-3-methylimidazolium heptafluoropropanesulfonate, 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide, 1-ethyl-3-methylimidazolium bis(fluorosulfonyl)imide, 1 -hexyl-3-methylimidazolium bis(fluorosulfonyl)imide, trimethylpropylammonium bis(trifluoromethanesulfonyl)imide, lithium bis(trifluoromethanesulfonyl)imide, lithium bis(fluorosulfonyl)imide.

A commercially available ionic liquid may be used, but it is also possible to synthesize it as follows. The method for synthesizing the ionic liquid is not particularly limited as long as the desired ionic liquid can be obtained. Publishing), the halide method, the hydroxide method, the acid ester method, the complexation method, and the neutralization method are used.

The synthesis methods of the halide method, the hydroxide method, the acid ester method, the complex formation method, and the neutralization method are shown below using nitrogen-containing onium salts as examples, but other sulfur-containing onium salts and phosphorus-containing onium salts and other ionic liquids can be obtained by the same method.

The halide method is a method carried out by reactions shown in reaction formulas (1) to (3). First, a tertiary amine is reacted with an alkyl halide to obtain a halide (reaction formula (1), chlorine, bromine, and iodine are used as the halogen).

The obtained halide is an acid (HA) or salt having an anion structure (A ⁻ ) of the target ionic liquid (MA, M are cations that form a salt with the target anion such as ammonium, lithium, sodium, potassium, etc. ) to obtain the desired ionic liquid (R ₄ NA).

The hydroxide method is a method carried out by reactions shown in reaction formulas (4) to (8). First, a halide (R ₄ NX) is electrolyzed by an ion-exchange membrane method (reaction formula (4)), an OH-type ion-exchange resin method (reaction formula (5)), or a reaction with silver oxide (Ag ₂ O) (reaction formula ( A hydroxide (R ₄ NOH) is obtained in 6)) (chlorine, bromine, and iodine are used as halogens).

The target ionic liquid (R ₄ NA) can be obtained by subjecting the resulting hydroxide to the reactions of reaction formulas (7) and (8) in the same manner as in the above halogenation method.

The acid ester method is a method carried out by reactions shown in reaction formulas (9) to (11). First, a tertiary amine (R ₃ N) is reacted with an acid ester to obtain an acid ester (reaction formula (9)). Esters and esters of organic acids such as methanesulfonic acid, methylphosphonic acid and formic acid are used).

The target ionic liquid (R ₄ NA) can be obtained by subjecting the obtained acid ester to the reactions of reaction formulas (10) to (11) in the same manner as in the above halogenation method. Alternatively, the ionic liquid can be obtained directly by using methyltrifluoromethanesulfonate, methyltrifluoroacetate, or the like as the acid ester.

The neutralization method is a method carried out by the reaction shown in reaction formula (12). reacting _a tertiary amine with _an organic acid such _{as CF3COOH} , _CF3SO3H , ( _CF3SO2 ) _2NH , ( _{CF3SO2 ) 3CH} , ( _C2F5SO2 ) _{2NH ;} can be obtained by

R in the reaction formulas (1) to (12) above represents hydrogen or a hydrocarbon group having 1 to 20 carbon atoms and may contain a heteroatom.

As the ion-conducting polymer, any suitable ion-conducting polymer can be adopted as long as the effects of the present invention are not impaired. Examples of such ion-conducting polymers include ion-conducting polymers obtained by polymerizing or copolymerizing monomers having a quaternary ammonium base); conductive polymer; and the like. Only one kind of ion-conducting polymer may be used, or two or more kinds thereof may be used.

As the ion-conducting filler, any appropriate ion-conducting filler can be adopted as long as the effects of the present invention are not impaired. Examples of such ion-conducting fillers include tin oxide, antimony oxide, indium oxide, cadmium oxide, titanium oxide, zinc oxide, indium, tin, antimony, gold, silver, copper, aluminum, nickel, chromium, titanium, and iron. , cobalt, copper iodide, ITO (indium oxide/tin oxide), ATO (antimony oxide/tin oxide), and the like. Only one kind of ion conductive filler may be used, or two or more kinds thereof may be used.

As the electrically conductive polymer, any appropriate electrically conductive polymer can be adopted as long as the effects of the present invention are not impaired. Examples of such electrically conductive polymers include (3,4-ethylenedioxythiophene)-poly(styrenesulfonic acid).

<1-2-6. Other Ingredients>
At least one adhesive composition selected from the group consisting of an adhesive composition (acrylic adhesive composition, urethane adhesive composition, rubber adhesive composition, silicone adhesive composition) as a material for the adhesive layer (1) seeds) may contain any appropriate other component within a range that does not impair the effects of the present invention. Such other components include, for example, other polymer components, cross-linking accelerators, cross-linking catalysts, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), anti-aging agents. , inorganic fillers, organic fillers, metal powders, colorants (pigments, dyes, etc.), foils, UV absorbers, antioxidants, light stabilizers, chain transfer agents, plasticizers, softeners, surfactants , antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat resistant stabilizers, polymerization inhibitors, lubricants, solvents, catalysts and the like.

<<1-3. Resin film (2)>>
As the thickness of the resin film (2), any appropriate thickness can be adopted according to the purpose within a range that does not impair the effects of the present invention. Such a thickness is preferably from 25 μm to 500 μm, more preferably from 25 μm to 400 μm, even more preferably from 25 μm to 300 μm, and particularly preferably from 25 μm to 25 μm, from the viewpoint that the effects of the present invention can be more expressed. 200 μm, most preferably between 25 μm and 150 μm.

As described above, the resin film (2) is formed by dividing the portion laminated with the pressure-sensitive adhesive layer (1) into a plurality of through-holes having a predetermined length in a direction substantially perpendicular to the longitudinal direction.

The resin film (2) includes a resin substrate film (2a).

Examples of the resin base film (2a) include plastic films made of polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT); polyethylene (PE), polypropylene ( PP), polymethylpentene (PMP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA) and other α-olefin-based olefin-based resins as monomer components; polyvinyl chloride; plastic film made of (PVC); plastic film made of vinyl acetate resin; plastic film made of polycarbonate (PC); plastic film made of polyphenylene sulfide (PPS); Plastic film composed of amide resin such as aromatic polyamide (aramid); plastic film composed of polyimide resin; plastic film composed of polyether ether ketone (PEEK); polyethylene (PE), polypropylene (PP ) and other olefinic resins; polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, chlorofluoroethylene-vinylidene fluoride a plastic film composed of a fluororesin such as a copolymer; and the like.

The resin substrate film (2a) may consist of only one layer, or may consist of two or more layers. The resin substrate film (2a) may be stretched.

The resin substrate film (2a) may be surface-treated. Examples of surface treatment include corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high voltage shock exposure, ionizing radiation treatment, and coating treatment with a primer.

The resin substrate film (2a) may contain any appropriate additive according to the purpose within a range that does not impair the effects of the present invention.

The resin film (2) may have a conductive layer (2b). The conductive layer (2b) can be arranged between the adhesive layer (1) and the resin base film (2a).

The conductive layer (2b) may consist of only one layer, or may consist of two or more layers.

The conductive layer (2b) can be provided by forming it on any suitable substrate. Such a substrate is preferably a resin substrate film (2a).

The conductive layer (2b) is formed by any suitable thin film forming method such as, for example, vacuum deposition, sputtering, ion plating, spray pyrolysis, chemical plating, electroplating, or combinations thereof. A conductive film is formed on any appropriate substrate (preferably, resin substrate film (2a)). Among these thin film forming methods, the vacuum vapor deposition method and the sputtering method are preferable from the viewpoints of the forming speed of the conductive film, the formability of the large-area film, the productivity, and the like.

Materials for forming the conductive film include, for example, gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin, metal-based materials such as alloys thereof; indium oxide; Metal oxide materials such as tin oxide, titanium oxide, cadmium oxide, and mixtures thereof; other metal compounds such as copper iodide; and the like are used.

As the thickness of the conductive layer (2b), any suitable thickness can be adopted according to the purpose within a range that does not impair the effects of the present invention. Such a thickness is, for example, preferably 30 Å to 600 Å when formed from a metal-based material, and preferably 80 Å to 5000 Å when formed from a metal oxide-based material.

The surface resistance value of the conductive layer (2b) is preferably 1.0×10 ¹⁰ Ω/□ or less, more preferably 1.0×10 ⁹ Ω/□ or less, still more preferably 1.0×10 Ω/□ or less. It is ⁸ Ω/□ or less, and particularly preferably 1.0×10 ⁷ Ω/□ or less.

When the conductive film is formed on any suitable substrate (preferably resin substrate film (2a)), corona discharge is applied to the surface of the substrate (preferably resin substrate film (2a)). Any appropriate pretreatment such as treatment, ultraviolet irradiation treatment, plasma treatment, sputter etching treatment, undercoat treatment, etc. is performed to improve the adhesion between the conductive film and the substrate (preferably, the resin substrate film (2a)). can also be increased.

The resin film (2) may have an antistatic layer (2c). The antistatic layer (2c) can be arranged between the adhesive layer (1) and the resin substrate film (2a) and/or between the resin substrate film (2a) and the adhesive layer (2).

The antistatic layer (2c) may consist of only one layer, or may consist of two or more layers.

As the thickness of the antistatic layer (2c), any appropriate thickness can be adopted according to the purpose within a range that does not impair the effects of the present invention. Such a thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, even more preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.

The surface resistance value of the antistatic layer (2c) is preferably 1.0×10 ¹⁰ Ω/□ or less, more preferably 8.0×10 ⁹ Ω/□ or less, still more preferably 5.0×10 Ω/□ or less. It is 10 ⁹ Ω/□ or less, and particularly preferably 1.0×10 ⁹ Ω/□ or less.

As the antistatic layer (2c), any appropriate antistatic layer can be employed as long as it is a layer capable of exhibiting an antistatic effect, as long as it does not impair the effects of the present invention. Such an antistatic layer is preferably an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on any suitable substrate layer. Specifically, for example, it is an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on the resin substrate film (2a). After coating, it is dried as necessary, and hardening treatment (heat treatment, ultraviolet treatment, etc.) is performed as necessary. Specific coating methods include a roll coating method, a bar coating method, a gravure coating method, and the like.

As the conductive coating liquid containing the conductive polymer, any appropriate conductive coating liquid can be adopted as long as the effects of the present invention are not impaired. Such a conductive coating liquid preferably contains a conductive polymer, a binder, a cross-linking agent and a solvent. Since this solvent is substantially lost by volatilization or evaporation due to heating or the like during the process of forming the antistatic layer (2c), the antistatic layer (2c) preferably contains a conductive polymer, a binder and a cross-linking agent. .

Examples of solvents include organic solvents, water, and mixed solvents thereof. Examples of organic solvents include esters such as ethyl acetate; ketones such as methyl ethyl ketone, acetone and cyclohexanone; cyclic ethers such as tetrahydrofuran (THF) and dioxane; Hydrogens; aromatic hydrocarbons such as toluene and xylene; aliphatic or alicyclic alcohols such as methanol, ethanol, n-propanol, isopropanol and cyclohexanol; alkylene glycol monoalkyl ethers (e.g., ethylene glycol monomethyl ether, ethylene glycol monoethyl ether), glycol ethers such as dialkylene glycol monoalkyl ether; The solvent is preferably water or a mixed solvent containing water as a main component (for example, a mixed solvent of water and ethanol).

The content of the conductive polymer in the antistatic layer (2c) is preferably 3% to 80% by weight, more preferably 5% to 60% by weight.

As the conductive polymer, any appropriate conductive polymer can be adopted as long as the effects of the present invention are not impaired. Examples of such a conductive polymer include a conductive polymer obtained by doping a π-conjugated conductive polymer with a polyanion. Examples of π-conjugated conductive polymers include linear conductive polymers such as polythiophene, polypyrrole, polyaniline, and polyacetylene. Polyanions include polystyrene sulfonic acid, polyisoprene sulfonic acid, polyvinyl sulfonic acid, polyallylsulfonic acid, polyethyl acrylate sulfonic acid, polymethacrylic carboxylic acid, and the like.

Only one type of conductive polymer may be used, or two or more types may be used.

The content of the binder in the antistatic layer (2c) is preferably 50% to 95% by weight, more preferably 60% to 90% by weight.

As the binder that can be contained in the conductive coating liquid, any suitable binder can be adopted as long as the effects of the present invention are not impaired. Only one binder may be used, or two or more binders may be used. Such a binder is preferably a resin, more preferably a polyester resin. The proportion of the polyester resin in the binder is preferably 90 wt % to 100 wt %, more preferably 98 wt % to 100 wt %.

The polyester resin is mainly composed of polyester (preferably more than 50% by weight, more preferably 75% by weight or more, still more preferably 90% by weight or more, and particularly preferably substantially 100% by weight). It is preferable to include as

As the polyester, any appropriate polyester can be adopted as long as the effects of the present invention are not impaired. Such polyesters preferably include polycarboxylic acids having two or more carboxyl groups in one molecule (e.g., dicarboxylic acid compounds) and derivatives thereof (e.g., polycarboxylic anhydrides, esters, one or more compounds (polycarboxylic acid components) selected from halides, etc.) and one selected from polyhydric alcohols (e.g., diols) having two or more hydroxyl groups in one molecule Alternatively, it preferably has a structure in which two or more compounds (polyhydric alcohol components) are condensed.

Any appropriate polyvalent carboxylic acid may be employed as the polyvalent carboxylic acid component as long as the effects of the present invention are not impaired. Examples of such polyvalent carboxylic acid components include oxalic acid, malonic acid, difluoromalonic acid, alkylmalonic acid, succinic acid, tetrafluorosuccinic acid, alkylsuccinic acid, (±)-malic acid, meso-tartaric acid, itaconic acid, maleic acid, methylmaleic acid, fumaric acid, methylfumaric acid, acetylenedicarboxylic acid, glutaric acid, hexafluoroglutaric acid, methylglutaric acid, glutaconic acid, adipic acid, dithioadipic acid, methyladipic acid, dimethyladipic acid, tetramethyladipic acid, methylene adipic acid, muconic acid, galactaric acid, pimelic acid, suberic acid, perfluorosuberic acid, 3,3,6,6-tetramethylsuberic acid, azelaic acid, sebacic acid, perfluorosebacic acid, aliphatic dicarboxylic acids such as brassylic acid, dodecyldicarboxylic acid, tridecyldicarboxylic acid, tetradecyldicarboxylic acid; cycloalkyldicarboxylic acids (e.g., 1,4-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid), 1,4 Alicyclic dicarboxylic acids such as -(2-norbornene)dicarboxylic acid, 5-norbornene-2,3-dicarboxylic acid (himic acid), adamantanedicarboxylic acid, spiroheptanedicarboxylic acid; phthalic acid, isophthalic acid, dithioisophthalic acid, Methylisophthalic acid, dimethylisophthalic acid, chloroisophthalic acid, dichloroisophthalic acid, terephthalic acid, methylterephthalic acid, dimethylterephthalic acid, chloroterephthalic acid, bromoterephthalic acid, naphthalenedicarboxylic acid, oxofluorenedicarboxylic acid, anthracenedicarboxylic acid, biphenyldicarboxylic acid acid, biphenylenedicarboxylic acid, dimethylbiphenylenedicarboxylic acid, 4,4″-p-terephenylenedicarboxylic acid, 4,4″-p-qualylphenyldicarboxylic acid, bibenzyldicarboxylic acid, azobenzenedicarboxylic acid, homophthalic acid, phenylene dicarboxylic acid Acetic Acid, Phenylenedipropionic Acid, Naphthalenedicarboxylic Acid, Naphthalenedipropionic Acid, Biphenyldiacetic Acid, Biphenyldipropionic Acid, 3,3′-[4,4′-(methylenedi-p-biphenylene)dipropionic Acid, 4,4 Aromatic dicarboxylic acids such as '-bibenzyl diacetic acid, 3,3' (4,4'-bibenzyl) dipropionic acid, oxydi-p-phenylene diacetic acid; acid anhydrides of any of the above polyvalent carboxylic acids; Esters (eg, alkyl esters) of any of the above polycarboxylic acids. monoesters, diesters, etc.); acid halides corresponding to any of the above polyvalent carboxylic acids (eg, dicarboxylic acid chlorides); and the like.

Polyvalent carboxylic acid components preferably include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid and naphthalenedicarboxylic acid and their acid anhydrides; adipic acid, sebacic acid, azelaic acid, succinic acid, fumaric acid, maleic acid, Himic acid, aliphatic dicarboxylic acids such as 1,4-cyclohexanedicarboxylic acid and acid anhydrides thereof; lower alkyl esters of these dicarboxylic acids (for example, esters with monoalcohols having 1 to 3 carbon atoms); be done.

As the polyhydric alcohol component, any appropriate polyhydric alcohol can be adopted as long as the effects of the present invention are not impaired. Examples of such polyhydric alcohol components include ethylene glycol, propylene glycol, 1,2-propanediol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 1,5-pentanediol, 1,6-hexanediol, 3-methylpentanediol, diethylene glycol, 1,4-cyclohexanedimethanol, 3-methyl-1,5-pentanediol, 2-methyl-1,3-propane Diols such as diols, 2,2-diethyl-1,3-propanediol, 2-butyl-2-ethyl-1,3-propanediol, xylylene glycol, hydrogenated bisphenol A, and bisphenol A; these diols alkylene oxide adducts (eg, ethylene oxide adducts, propylene oxide adducts, etc.); and the like.

The molecular weight of the polyester resin is preferably 5×10 ³ to 1.5×10 ⁵ , more preferably 1, as a standard polystyrene equivalent weight average molecular weight (Mw) measured by gel permeation chromatography (GPC). ×10 ⁴ to 6×10 ⁴ .

The glass transition temperature (Tg) of the polyester resin is preferably 0°C to 120°C, more preferably 10°C to 80°C.

As the polyester resin, for example, a commercially available product such as "Bylonal" manufactured by Toyobo Co., Ltd. can be used.

The conductive coating liquid contains resins other than polyester resins (for example, acrylic resins, acrylic urethane resins, acrylic styrene resins, acrylic silicone resins, silicone resins, polysilazane resins, polyurethane resins, at least one resin selected from fluororesins and polyolefin resins).

As the cross-linking agent that can be contained in the conductive coating liquid, any appropriate cross-linking agent can be adopted as long as the effects of the present invention are not impaired. The number of cross-linking agents may be one, or two or more. Such cross-linking agents preferably include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, melamine-based cross-linking agents, peroxide-based cross-linking agents, urea-based cross-linking agents, metal alkoxide-based cross-linking agents, and metal chelate-based cross-linking agents. cross-linking agents, metal salt-based cross-linking agents, carbodiimide-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, and amine-based cross-linking agents. Among them, a melamine-based cross-linking agent is preferred.

The content of the cross-linking agent in the antistatic layer (2c) is preferably 1 wt % to 30 wt %, more preferably 2 wt % to 20 wt %.

The antistatic layer (2c) may contain any appropriate other component within a range that does not impair the effects of the present invention.

<<1-4. Adhesive layer (2)>>
Any appropriate pressure-sensitive adhesive layer can be adopted for the pressure-sensitive adhesive layer (2) as long as the effects of the present invention are not impaired. The pressure-sensitive adhesive layer (2) may consist of only one layer, or may consist of two or more layers.

The thickness of the pressure-sensitive adhesive layer (2) is preferably 0.5 μm to 150 μm, more preferably 1 μm to 100 μm, still more preferably 2 μm to 80 μm, in order to further express the effects of the present invention. Especially preferred is 3 μm to 50 μm, most preferred is 5 μm to 30 μm.

The adhesive layer (2) can be formed by any appropriate method. As such a method, for example, a pressure-sensitive adhesive composition that forms the pressure-sensitive adhesive that constitutes the pressure-sensitive adhesive layer (2) is applied onto any suitable substrate (for example, the resin film (3)), and if necessary A method of forming a pressure-sensitive adhesive layer on the base material by heating and drying as necessary and curing as necessary can be mentioned. Examples of such coating methods include gravure roll coater, reverse roll coater, kiss roll coater, dip roll coater, bar coater, knife coater, air knife coater, spray coater, comma coater, direct coater, roll brush coater, and the like. method.

<1-4-1. Acrylic adhesive>
The adhesive layer (2) is preferably composed of an acrylic adhesive.

An acrylic pressure-sensitive adhesive is formed from an acrylic pressure-sensitive adhesive composition.

The acrylic pressure-sensitive adhesive composition preferably contains an acrylic polymer and a cross-linking agent so that the effects of the present invention can be exhibited more effectively.

Acrylic polymers can be referred to as so-called base polymers in the field of acrylic pressure-sensitive adhesives. Only one type of acrylic polymer may be used, or two or more types may be used.

The content of the acrylic polymer in the acrylic pressure-sensitive adhesive composition is preferably 60% to 99.9% by weight, more preferably 65% to 99.9% by weight, in terms of solid content, More preferably 70% to 99.9% by weight, particularly preferably 75% to 99.9% by weight, most preferably 80% to 99.9% by weight.

As the acrylic polymer, any appropriate acrylic polymer can be adopted as long as the effects of the present invention are not impaired.

The weight-average molecular weight of the acrylic polymer is preferably 300,000 to 2,500,000, more preferably 350,000 to 2,000,000, and still more preferably 400,000 to 1,800,000 in terms of allowing the effect of the present invention to be expressed more. and particularly preferably 500,000 to 1,500,000.

The acrylic polymer is preferably (component a) an alkyl (meth)acrylate having 4 to 12 carbon atoms in the alkyl group of the alkyl ester moiety, (b Component) An acrylic polymer formed by polymerization from a composition (B) containing at least one selected from the group consisting of (meth)acrylic acid esters having an OH group and (meth)acrylic acid. (Component a) and (Component b) may each independently be one kind or two or more kinds.

Examples of the (meth)acrylic acid alkyl ester (component a) in which the alkyl group of the alkyl ester moiety has 4 to 12 carbon atoms include n-butyl (meth)acrylate, isobutyl (meth)acrylate, and (meth)acrylate. s-butyl acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-(meth)acrylate Ethylhexyl, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate etc. Among these, n-butyl (meth)acrylate and 2-ethylhexyl (meth)acrylate are preferred, and n-butyl acrylate and acrylic are more preferred, in that the effects of the present invention can be more expressed. acid 2-ethylhexyl.

At least one (component b) selected from the group consisting of (meth)acrylic acid esters having an OH group and (meth)acrylic acid includes, for example, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, Examples thereof include (meth)acrylic acid esters having an OH group such as hydroxybutyl (meth)acrylate, and (meth)acrylic acid. Among these, hydroxyethyl (meth)acrylate and (meth)acrylic acid are preferred, and hydroxyethyl acrylate and acrylic acid are more preferred, from the viewpoint that the effects of the present invention can be exhibited more.

Composition (B) may contain copolymerizable monomers other than components (a) and (b). The number of copolymerizable monomers may be one, or two or more. Such copolymerizable monomers include, for example, itaconic acid, maleic acid, fumaric acid, crotonic acid, isocrotonic acid, acid anhydrides thereof (for example, acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride). ) and other carboxyl group-containing monomers (excluding (meth)acrylic acid); (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-methylol(meth)acrylamide, N-methoxymethyl(meth)acrylamide , N-butoxymethyl (meth)acrylamide, N-hydroxyethyl (meth)acrylamide and other amide group-containing monomers; aminoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, t-butyl (meth)acrylate amino group-containing monomers such as aminoethyl; epoxy group-containing monomers such as glycidyl (meth)acrylate and methylglycidyl (meth)acrylate; cyano group-containing monomers such as acrylonitrile and methacrylonitrile; N-vinyl-2-pyrrolidone, Heterocycle-containing vinyl-based monomers such as (meth)acryloylmorpholine, N-vinylpiperidone, N-vinylpiperazine, N-vinylpyrrole, N-vinylimidazole, vinylpyridine, vinylpyrimidine and vinyloxazole; sulfonic acids such as sodium vinylsulfonate Group-containing monomers; phosphoric acid group-containing monomers such as 2-hydroxyethyl acryloyl phosphate; imide group-containing monomers such as cyclohexylmaleimide and isopropylmaleimide; isocyanate group-containing monomers such as 2-methacryloyloxyethyl isocyanate; (Meth)acrylic acid esters having alicyclic hydrocarbon groups such as cyclohexyl (meth)acrylate and isobornyl (meth)acrylate; aromatics such as phenyl (meth)acrylate, phenoxyethyl (meth)acrylate and benzyl (meth)acrylate (Meth)acrylic acid esters having a hydrocarbon group; vinyl esters such as vinyl acetate and vinyl propionate; aromatic vinyl compounds such as styrene and vinyl toluene; olefins and dienes such as ethylene, butadiene, isoprene and isobutylene; vinyl ethers such as alkyl ether; vinyl chloride; and the like.

Polyfunctional monomers may also be employed as copolymerizable monomers. A polyfunctional monomer refers to a monomer having two or more ethylenically unsaturated groups in one molecule. As the ethylenically unsaturated group, any suitable ethylenically unsaturated group can be adopted as long as the effects of the present invention are not impaired. Such ethylenically unsaturated groups include, for example, radically polymerizable functional groups such as vinyl groups, propenyl groups, isopropenyl groups, vinyl ether groups (vinyloxy groups), and allyl ether groups (allyloxy groups). Examples of polyfunctional monomers include hexanediol di(meth)acrylate, butanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, and neopentyl glycol. Di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, trimethylolpropane tri(meth)acrylate, tetramethylolmethane tri(meth)acrylate, allyl (Meth)acrylate, vinyl (meth)acrylate, divinylbenzene, epoxy acrylate, polyester acrylate, urethane acrylate, and the like. Only one such polyfunctional monomer may be used, or two or more thereof may be used.

(Meth)acrylic acid alkoxyalkyl esters may also be employed as copolymerizable monomers. Examples of (meth)acrylic acid alkoxyalkyl esters include 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, methoxytriethylene glycol (meth)acrylate, and 3-(meth)acrylate. methoxypropyl, 3-ethoxypropyl (meth)acrylate, 4-methoxybutyl (meth)acrylate, 4-ethoxybutyl (meth)acrylate and the like. The (meth)acrylic acid alkoxyalkyl ester may be used alone or in combination of two or more.

The content of the (meth)acrylic acid alkyl ester (ingredient a) in which the alkyl group of the alkyl ester portion has 4 to 12 carbon atoms is the monomer constituting the acrylic polymer because the effect of the present invention can be more expressed. With respect to the total amount of components (100% by weight), it is preferably 30% by weight or more, more preferably 35% by weight to 99% by weight, still more preferably 40% by weight to 98% by weight, and particularly preferably 50% by weight. % to 95% by weight.

The content of at least one (component b) selected from the group consisting of (meth)acrylic acid esters having an OH group and (meth)acrylic acid is such that the effects of the present invention can be more expressed, and the acrylic polymer is It is preferably 1% by weight or more, more preferably 1% by weight to 30% by weight, still more preferably 2% by weight to 20% by weight, based on the total amount (100% by weight) of the constituent monomer components. It is preferably 3% to 10% by weight.

Composition (B) may contain any appropriate other component within a range that does not impair the effects of the present invention. Such other components include, for example, polymerization initiators, chain transfer agents, solvents and the like. Any appropriate content can be adopted as the content of these other components as long as the effects of the present invention are not impaired.

A thermal polymerization initiator, a photopolymerization initiator (photoinitiator), or the like can be used as the polymerization initiator depending on the type of polymerization reaction. Only one polymerization initiator may be used, or two or more polymerization initiators may be used.

A thermal polymerization initiator can preferably be employed when the acrylic polymer is obtained by solution polymerization. Examples of such thermal polymerization initiators include azo polymerization initiators, peroxide polymerization initiators (eg, dibenzoyl peroxide, tert-butyl permaleate, etc.), redox polymerization initiators, and the like. . Among these thermal polymerization initiators, the azo initiators disclosed in JP-A-2002-69411 are particularly preferred. Such an azo polymerization initiator is preferable in that the decomposition product of the polymerization initiator is less likely to remain in the acrylic polymer as a portion that causes the generation of heat-generated gas (outgas). As the azo polymerization initiator, 2,2'-azobisisobutyronitrile (hereinafter sometimes referred to as AIBN), 2,2'-azobis-2-methylbutyronitrile (hereinafter referred to as AMBN) ), 2,2′-azobis(2-methylpropionate)dimethyl, 4,4′-azobis-4-cyanovaleric acid, and the like.

A photopolymerization initiator can be preferably employed when obtaining an acrylic polymer by active energy ray polymerization. Examples of photopolymerization initiators include benzoin ether-based photopolymerization initiators, acetophenone-based photopolymerization initiators, α-ketol-based photopolymerization initiators, aromatic sulfonyl chloride-based photopolymerization initiators, and photoactive oxime-based photopolymerization initiators. benzoin-based photopolymerization initiators, benzyl-based photopolymerization initiators, benzophenone-based photopolymerization initiators, ketal-based photopolymerization initiators, thioxanthone-based photopolymerization initiators, and the like.

Examples of benzoin ether-based photopolymerization initiators include benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2,2-dimethoxy-1,2-diphenylethan-1-one, and anisole. and methyl ether. Acetophenone-based photopolymerization initiators include, for example, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexylphenylketone, 4-phenoxydichloroacetophenone, and 4-(t-butyl). and dichloroacetophenone. Examples of α-ketol photopolymerization initiators include 2-methyl-2-hydroxypropiophenone, 1-[4-(2-hydroxyethyl)phenyl]-2-methylpropan-1-one, and the like. . Examples of aromatic sulfonyl chloride photopolymerization initiators include 2-naphthalenesulfonyl chloride. Examples of photoactive oxime-based photopolymerization initiators include 1-phenyl-1,1-propanedione-2-(o-ethoxycarbonyl)-oxime. Benzoin-based photopolymerization initiators include, for example, benzoin. Examples of benzyl-based photopolymerization initiators include benzyl. Examples of benzophenone-based photopolymerization initiators include benzophenone, benzoylbenzoic acid, 3,3′-dimethyl-4-methoxybenzophenone, polyvinylbenzophenone, α-hydroxycyclohexylphenylketone, and the like. Examples of ketal-based photopolymerization initiators include benzyl dimethyl ketal. Thioxanthone-based photopolymerization initiators include, for example, thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-diisopropylthioxanthone, and dodecylthioxanthone.

The acrylic pressure-sensitive adhesive composition may contain a cross-linking agent. By using a cross-linking agent, the cohesive force of the acrylic pressure-sensitive adhesive can be improved, and the effects of the present invention can be exhibited more. The number of cross-linking agents may be one, or two or more.

Examples of cross-linking agents include polyfunctional isocyanate-based cross-linking agents, epoxy-based cross-linking agents, melamine-based cross-linking agents, peroxide-based cross-linking agents, urea-based cross-linking agents, metal alkoxide cross-linking agents, metal chelate-based cross-linking agents, and metal salts. cross-linking agents, carbodiimide-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, amine-based cross-linking agents, and the like. Among these, at least one (component c) selected from the group consisting of polyfunctional isocyanate-based cross-linking agents and epoxy-based cross-linking agents is preferable in that the effects of the present invention can be exhibited more effectively.

Polyfunctional isocyanate-based cross-linking agents include, for example, lower aliphatic polyisocyanates such as 1,2-ethylene diisocyanate, 1,4-butylene diisocyanate, and 1,6-hexamethylene diisocyanate; cyclopentylene diisocyanate, cyclohexylene diisocyanate, Alicyclic polyisocyanates such as isophorone diisocyanate, hydrogenated tolylene diisocyanate and hydrogenated xylene diisocyanate; 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate and aromatic polyisocyanates. Polyfunctional isocyanate-based cross-linking agents include, for example, trimethylolpropane/tolylene diisocyanate adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate L"), trimethylolpropane/hexamethylene diisocyanate adduct (Nippon Polyurethane Industry Co., Ltd. company, trade name "Coronate HL"), trade name "Coronate HX" (Nippon Polyurethane Industry Co., Ltd.), trimethylolpropane/xylylene diisocyanate adduct (manufactured by Mitsui Chemicals, trade name "Takenate 110N"), etc. A commercial item is also mentioned.

Examples of epoxy-based cross-linking agents (polyfunctional epoxy compounds) include N,N,N',N'-tetraglycidyl-m-xylenediamine, diglycidylaniline, 1,3-bis(N,N-diglycidylamino methyl)cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, trimethylolpropane polyglycidyl ether, adipate diglycidyl ester, o-phthalate diglycidyl ester, triglycidyl-tris(2- hydroxyethyl)isocyanurate, resorcinol diglycidyl ether, bisphenol-S-diglycidyl ether, epoxy resins having two or more epoxy groups in the molecule, and the like. Examples of epoxy-based cross-linking agents include commercially available products such as the trade name "Tetrad C" (manufactured by Mitsubishi Gas Chemical Company, Inc.).

Any appropriate content can be adopted as the content of the cross-linking agent in the acrylic pressure-sensitive adhesive composition as long as the effects of the present invention are not impaired. Such a content is, for example, preferably 0.05 parts by weight to 20 parts by weight with respect to the solid content (100 parts by weight) of the acrylic polymer in terms of being able to express the effects of the present invention more. , more preferably 0.1 to 18 parts by weight, still more preferably 0.5 to 15 parts by weight, and particularly preferably 0.5 to 10 parts by weight.

The acrylic pressure-sensitive adhesive composition may contain any appropriate other component within a range that does not impair the effects of the present invention. Such other components include, for example, polymer components other than acrylic polymers, cross-linking accelerators, cross-linking catalysts, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), Antiaging agents, inorganic fillers, organic fillers, metal powders, colorants (pigments, dyes, etc.), foils, UV absorbers, antioxidants, light stabilizers, chain transfer agents, plasticizers, softeners, Surfactants, antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat stabilizers, polymerization inhibitors, lubricants, solvents, catalysts and the like.

<1-4-2. Conductive Component>
The adhesive layer (2) may contain a conductive component. Regarding the conductive component, <1-2-5. Conductive Component> section can be used as it is.

<1-4-3. Other Ingredients>
The pressure-sensitive adhesive composition (preferably acrylic pressure-sensitive adhesive composition) that is the material for the pressure-sensitive adhesive layer (2) may contain any appropriate other component within a range that does not impair the effects of the present invention. Such other components include, for example, other polymer components, cross-linking accelerators, cross-linking catalysts, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), anti-aging agents. , inorganic fillers, organic fillers, metal powders, colorants (pigments, dyes, etc.), foils, UV absorbers, antioxidants, light stabilizers, chain transfer agents, plasticizers, softeners, surfactants , antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat resistant stabilizers, polymerization inhibitors, lubricants, solvents, catalysts and the like.

<<1-5. Resin film (3)>>
The thickness of the resin film (3) is preferably 4 μm to 450 μm, more preferably 8 μm to 350 μm, even more preferably 12 μm to 250 μm, and particularly preferably 16 μm to 150 μm, most preferably 20 μm to 100 μm.

The resin film (3) includes a resin substrate film (3a).

Examples of the resin base film (3a) include plastic films made of polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT); polyethylene (PE), polypropylene ( PP), polymethylpentene (PMP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA) and other α-olefin-based olefin-based resins as monomer components; polyvinyl chloride; plastic film made of (PVC); plastic film made of vinyl acetate resin; plastic film made of polycarbonate (PC); plastic film made of polyphenylene sulfide (PPS); Plastic film composed of amide resin such as aromatic polyamide (aramid); plastic film composed of polyimide resin; plastic film composed of polyether ether ketone (PEEK); polyethylene (PE), polypropylene (PP ) and other olefinic resins; polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, chlorofluoroethylene-vinylidene fluoride a plastic film composed of a fluororesin such as a copolymer; and the like.

The resin substrate film (3a) may consist of only one layer, or may consist of two or more layers. The resin substrate film (3a) may be stretched.

The resin base film (3a) may be surface-treated. Examples of surface treatment include corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high voltage shock exposure, ionizing radiation treatment, and coating treatment with a primer.

For the surface of the resin film (3a) on which the pressure-sensitive adhesive layer (2) is not attached, for example, fatty acid amide or polyethyleneimine is added to the resin film (3a) for the purpose of forming a roll that can be easily unwound. , a long-chain alkyl-based additive or the like may be added for release treatment, or a coat layer made of any suitable release agent such as silicone-based, long-chain alkyl-based, and fluorine-based release agents may be provided.

The resin film (3a) may contain any suitable additive according to the purpose within a range that does not impair the effects of the present invention.

The resin film (3) may have a conductive layer (3b). A conductive layer (3b) may be placed between the adhesive layer (2) and the resin base film (3a).

The conductive layer (3b) may consist of only one layer, or may consist of two or more layers.

The conductive layer (3b) can be provided by forming it on any suitable substrate. Such a substrate is preferably a resin substrate film (3a).

The conductive layer (3b) is formed by any suitable thin film forming method such as, for example, vacuum deposition, sputtering, ion plating, spray pyrolysis, chemical plating, electroplating, or combinations thereof. A conductive film is formed on any appropriate substrate (preferably, resin substrate film (3a)). Among these thin film forming methods, the vacuum vapor deposition method and the sputtering method are preferable from the viewpoints of the forming speed of the conductive film, the formability of the large-area film, the productivity, and the like.

Materials for forming the conductive film include, for example, gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin, metal-based materials such as alloys thereof; indium oxide; Metal oxide materials such as tin oxide, titanium oxide, cadmium oxide, and mixtures thereof; other metal compounds such as copper iodide; and the like are used.

As the thickness of the conductive layer (3b), any appropriate thickness can be adopted according to the purpose within a range that does not impair the effects of the present invention. Such a thickness is, for example, preferably 30 Å to 600 Å when formed from a metal-based material, and preferably 80 Å to 5000 Å when formed from a metal oxide-based material.

The surface resistance value of the conductive layer (3b) is preferably 1.0×10 ¹⁰ Ω/□ or less, more preferably 1.0×10 ⁹ Ω/□ or less, still more preferably 1.0×10 It is ⁸ Ω/□ or less, and particularly preferably 1.0×10 ⁷ Ω/□ or less.

When the conductive film is formed on any appropriate substrate (preferably resin substrate film (3a)), corona discharge is applied to the surface of the substrate (preferably resin substrate film (3a)). treatment, ultraviolet irradiation treatment, plasma treatment, sputter etching treatment, undercoat treatment, etc., to improve the adhesion between the conductive film and the substrate (preferably, the resin substrate film (3a)). can also be increased.

The resin film (3) may have an antistatic layer (3c). The antistatic layer (3c) can be disposed between the adhesive layer (2) and the resin-based film (3a) and/or on the opposite side of the resin-based film (3a) to the adhesive layer (2). .

The antistatic layer (3c) may consist of only one layer, or may consist of two or more layers.

As the thickness of the antistatic layer (3c), any appropriate thickness can be adopted according to the purpose within a range that does not impair the effects of the present invention. Such a thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, even more preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.

The surface resistance value of the antistatic layer (3c) is preferably 1.0×10 ¹⁰ Ω/□ or less, more preferably 8.0×10 ⁹ Ω/□ or less, still more preferably 5.0×10 Ω/□ or less. It is 10 ⁹ Ω/□ or less, and particularly preferably 1.0×10 ⁹ Ω/□ or less.

As the antistatic layer (3c), any appropriate antistatic layer can be employed as long as it is a layer capable of exhibiting an antistatic effect within a range that does not impair the effects of the present invention. Such an antistatic layer is preferably an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on any suitable substrate layer. Specifically, for example, it is an antistatic layer formed by coating the resin substrate film (3a) with a conductive coating liquid containing a conductive polymer. After coating, it is dried as necessary, and hardening treatment (heat treatment, ultraviolet treatment, etc.) is performed as necessary. Specific coating methods include a roll coating method, a bar coating method, a gravure coating method, and the like.

As the conductive coating liquid containing the conductive polymer, any appropriate conductive coating liquid can be adopted as long as the effects of the present invention are not impaired. Such a conductive coating liquid preferably contains a conductive polymer, a binder, a cross-linking agent and a solvent. Since this solvent is substantially lost by volatilization or evaporation due to heating or the like during the process of forming the antistatic layer (3c), the antistatic layer (3c) preferably contains a conductive polymer, a binder and a cross-linking agent. .

Examples of solvents include organic solvents, water, and mixed solvents thereof. Examples of organic solvents include esters such as ethyl acetate; ketones such as methyl ethyl ketone, acetone and cyclohexanone; cyclic ethers such as tetrahydrofuran (THF) and dioxane; Hydrogens; aromatic hydrocarbons such as toluene and xylene; aliphatic or alicyclic alcohols such as methanol, ethanol, n-propanol, isopropanol and cyclohexanol; alkylene glycol monoalkyl ethers (e.g., ethylene glycol monomethyl ether, ethylene glycol monoethyl ether), glycol ethers such as dialkylene glycol monoalkyl ether; The solvent is preferably water or a mixed solvent containing water as a main component (for example, a mixed solvent of water and ethanol).

The content of the conductive polymer in the antistatic layer (3c) is preferably 3 wt % to 80 wt %, more preferably 5 wt % to 60 wt %.

As the conductive polymer, any appropriate conductive polymer can be adopted as long as the effects of the present invention are not impaired. Examples of such a conductive polymer include a conductive polymer obtained by doping a π-conjugated conductive polymer with a polyanion. Examples of π-conjugated conductive polymers include linear conductive polymers such as polythiophene, polypyrrole, polyaniline, and polyacetylene. Polyanions include polystyrene sulfonic acid, polyisoprene sulfonic acid, polyvinyl sulfonic acid, polyallylsulfonic acid, polyethyl acrylate sulfonic acid, polymethacrylic carboxylic acid, and the like.

Only one type of conductive polymer may be used, or two or more types may be used.

The content of the binder in the antistatic layer (3c) is preferably 50% to 95% by weight, more preferably 60% to 90% by weight.

As the binder that can be contained in the conductive coating liquid, any suitable binder can be adopted as long as the effects of the present invention are not impaired. Only one binder may be used, or two or more binders may be used. Such a binder is preferably a resin, more preferably a polyester resin. The proportion of the polyester resin in the binder is preferably 90 wt % to 100 wt %, more preferably 98 wt % to 100 wt %.

The polyester resin is mainly composed of polyester (preferably more than 50% by weight, more preferably 75% by weight or more, still more preferably 90% by weight or more, and particularly preferably substantially 100% by weight). It is preferable to include as

As the polyester, any appropriate polyester can be adopted as long as the effects of the present invention are not impaired. Such polyesters preferably include polycarboxylic acids having two or more carboxyl groups in one molecule (e.g., dicarboxylic acid compounds) and derivatives thereof (e.g., polycarboxylic anhydrides, esters, one or more compounds (polycarboxylic acid components) selected from halides, etc.) and one selected from polyhydric alcohols (e.g., diols) having two or more hydroxyl groups in one molecule Alternatively, it preferably has a structure in which two or more compounds (polyhydric alcohol components) are condensed.

Any appropriate polyvalent carboxylic acid may be employed as the polyvalent carboxylic acid component as long as the effects of the present invention are not impaired. Examples of such polyvalent carboxylic acid components include oxalic acid, malonic acid, difluoromalonic acid, alkylmalonic acid, succinic acid, tetrafluorosuccinic acid, alkylsuccinic acid, (±)-malic acid, meso-tartaric acid, itaconic acid, maleic acid, methylmaleic acid, fumaric acid, methylfumaric acid, acetylenedicarboxylic acid, glutaric acid, hexafluoroglutaric acid, methylglutaric acid, glutaconic acid, adipic acid, dithioadipic acid, methyladipic acid, dimethyladipic acid, tetramethyladipic acid, methylene adipic acid, muconic acid, galactaric acid, pimelic acid, suberic acid, perfluorosuberic acid, 3,3,6,6-tetramethylsuberic acid, azelaic acid, sebacic acid, perfluorosebacic acid, aliphatic dicarboxylic acids such as brassylic acid, dodecyldicarboxylic acid, tridecyldicarboxylic acid, tetradecyldicarboxylic acid; cycloalkyldicarboxylic acids (e.g., 1,4-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid), 1,4 Alicyclic dicarboxylic acids such as -(2-norbornene)dicarboxylic acid, 5-norbornene-2,3-dicarboxylic acid (himic acid), adamantanedicarboxylic acid, spiroheptanedicarboxylic acid; phthalic acid, isophthalic acid, dithioisophthalic acid, Methylisophthalic acid, dimethylisophthalic acid, chloroisophthalic acid, dichloroisophthalic acid, terephthalic acid, methylterephthalic acid, dimethylterephthalic acid, chloroterephthalic acid, bromoterephthalic acid, naphthalenedicarboxylic acid, oxofluorenedicarboxylic acid, anthracenedicarboxylic acid, biphenyldicarboxylic acid acid, biphenylenedicarboxylic acid, dimethylbiphenylenedicarboxylic acid, 4,4″-p-terephenylenedicarboxylic acid, 4,4″-p-qualylphenyldicarboxylic acid, bibenzyldicarboxylic acid, azobenzenedicarboxylic acid, homophthalic acid, phenylene dicarboxylic acid Acetic Acid, Phenylenedipropionic Acid, Naphthalenedicarboxylic Acid, Naphthalenedipropionic Acid, Biphenyldiacetic Acid, Biphenyldipropionic Acid, 3,3′-[4,4′-(methylenedi-p-biphenylene)dipropionic Acid, 4,4 Aromatic dicarboxylic acids such as '-bibenzyl diacetic acid, 3,3' (4,4'-bibenzyl) dipropionic acid, oxydi-p-phenylene diacetic acid; acid anhydrides of any of the above polyvalent carboxylic acids; Esters (eg, alkyl esters) of any of the above polycarboxylic acids. monoesters, diesters, etc.); acid halides corresponding to any of the above polyvalent carboxylic acids (eg, dicarboxylic acid chlorides); and the like.

Polyvalent carboxylic acid components preferably include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid and naphthalenedicarboxylic acid and their acid anhydrides; adipic acid, sebacic acid, azelaic acid, succinic acid, fumaric acid, maleic acid, Himic acid, aliphatic dicarboxylic acids such as 1,4-cyclohexanedicarboxylic acid and acid anhydrides thereof; lower alkyl esters of these dicarboxylic acids (for example, esters with monoalcohols having 1 to 3 carbon atoms); be done.

As the polyhydric alcohol component, any appropriate polyhydric alcohol can be adopted as long as the effects of the present invention are not impaired. Examples of such polyhydric alcohol components include ethylene glycol, propylene glycol, 1,2-propanediol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 1,5-pentanediol, 1,6-hexanediol, 3-methylpentanediol, diethylene glycol, 1,4-cyclohexanedimethanol, 3-methyl-1,5-pentanediol, 2-methyl-1,3-propane Diols such as diols, 2,2-diethyl-1,3-propanediol, 2-butyl-2-ethyl-1,3-propanediol, xylylene glycol, hydrogenated bisphenol A, and bisphenol A; these diols alkylene oxide adducts (eg, ethylene oxide adducts, propylene oxide adducts, etc.); and the like.

The molecular weight of the polyester resin is preferably 5×10 ³ to 1.5×10 ⁵ , more preferably 1, as a standard polystyrene equivalent weight average molecular weight (Mw) measured by gel permeation chromatography (GPC). ×10 ⁴ to 6×10 ⁴ .

The glass transition temperature (Tg) of the polyester resin is preferably 0°C to 120°C, more preferably 10°C to 80°C.

As the polyester resin, for example, a commercially available product such as "Bylonal" manufactured by Toyobo Co., Ltd. can be used.

The conductive coating liquid contains resins other than polyester resins (for example, acrylic resins, acrylic urethane resins, acrylic styrene resins, acrylic silicone resins, silicone resins, polysilazane resins, polyurethane resins, at least one resin selected from fluororesins and polyolefin resins).

As the cross-linking agent that can be contained in the conductive coating liquid, any appropriate cross-linking agent can be adopted as long as the effects of the present invention are not impaired. The number of cross-linking agents may be one, or two or more. Such cross-linking agents preferably include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, melamine-based cross-linking agents, peroxide-based cross-linking agents, urea-based cross-linking agents, metal alkoxide-based cross-linking agents, and metal chelate-based cross-linking agents. cross-linking agents, metal salt-based cross-linking agents, carbodiimide-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, amine-based cross-linking agents, and the like. Among them, a melamine-based cross-linking agent is preferred.

The content of the cross-linking agent in the antistatic layer (3c) is preferably 1 wt % to 30 wt %, more preferably 2 wt % to 20 wt %.

The antistatic layer (3c) may contain any appropriate other component within a range that does not impair the effects of the present invention.

<<<2. Laminate Manufacturing Method>>>>
The laminate of the present invention can be produced by any appropriate method as long as the effects of the present invention are not impaired.

As a representative example of the method for producing the laminate of the present invention, the laminate of the present invention comprises a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), a resin film (3 ) in this order, and a laminate composed of these constituent elements will be described.

One embodiment of the method for producing a laminate of the present invention has a resin film (1), an adhesive layer (1), and a resin film (2) in this order, and a laminate (I ), and a laminate (II) comprising the adhesive layer (2) and the resin film (3) in this order and comprising these constituent elements (II), respectively, and then laminated The surface of the resin film (2) of the body (I) and the surface of the adhesive layer (2) of the laminate (II) are attached.

The laminate (I) is, for example, a pressure-sensitive adhesive composition (acrylic pressure-sensitive adhesive composition, urethane-based pressure-sensitive adhesive composition, rubber-based pressure-sensitive adhesive composition, silicone at least one selected from the group consisting of adhesive compositions) is applied onto the resin film (2), heated and dried as necessary, cured as necessary, and the resin film (2) The pressure-sensitive adhesive layer (1) is formed thereon, and then the resin film (1) (release layer (1b) is formed on the surface of the pressure-sensitive adhesive layer (1) opposite to the resin film (2). (if it is on that side). After that, from the resin film (2) side, a CO ₂ laser or the like is used to cut the resin film at multiple locations so that the width of the cut location has a predetermined width, and the width of the uncut location has a predetermined width. Half-cut to the surface of (1) (that is, the resin film (1) is not cut), and remove the half-cut portion by any appropriate method.

Laminate (II) is prepared, for example, by applying a pressure-sensitive adhesive composition (preferably an acrylic pressure-sensitive adhesive composition) forming the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer (2) onto the resin film (3), The adhesive layer (2) is formed on the resin film (3) by heating and drying as necessary and curing as necessary. In order to protect the exposed surface of the pressure-sensitive adhesive layer (2), any suitable separator (for example, resin film (1) and A similar film) may be attached.

EXAMPLES The present invention will be specifically described below with reference to Examples, but the present invention is not limited to these Examples. The tests and evaluation methods used in Examples and the like are as follows. "Parts" means "parts by weight" unless otherwise specified, and "%" means "% by weight" unless otherwise specified.

<Measurement of weight average molecular weight>
A weight average molecular weight was measured by a gel permeation chromatography (GPC) method. Specifically, as a GPC measuring device, using a product name "HLC-8120GPC" (manufactured by Tosoh Corporation), measurement was performed under the following conditions, and the values were calculated in terms of standard polystyrene.
(Molecular weight measurement conditions)
・ Sample concentration: 0.2% by weight (tetrahydrofuran solution)
・Sample injection volume: 10 μL
・ Column: Product name “TSKguardcolumn SuperHZ-H (1 piece) + TSKgel SuperHZM-H (2 pieces)” (manufactured by Tosoh Corporation)
・ Reference column: Product name “TSKgel SuperH-RC (1 piece)” (manufactured by Tosoh Corporation)
- Eluent: tetrahydrofuran (THF)
・Flow rate: 0.6mL/min
・Detector: Differential refractometer (RI)
・Column temperature (measurement temperature): 40°C

<Measurement of adhesive force when peeling the adhesive layer (2) from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 30 mm/min>
The separator of the laminate (I) of 10 cm × 10 cm was peeled off, and the adhesive layer surface of the evaluation sample was placed on a 10 cm × 10 cm glass plate (manufactured by Matsunami Glass Industry Co., Ltd., under an atmosphere of 23 ° C. temperature and 50% RH humidity. (trade name: Microslide Glass S)) with a hand roller, and then press-bonded with a pressure of 0.25 MPa. A separator-attached surface protective film (which may be referred to as a carrier sheet) that has been neutralized in advance is cut into a width of 25 mm and a length of 150 mm, and the laminate is fixed to glass in an atmosphere of 23° C. and 50% RH. It was pasted on the resin film side of (I) by one reciprocation of a 2.0 kg roller, and then crimped at a pressure of 0.25 MPa. After curing for 30 minutes in an atmosphere with a temperature of 23 ° C. and a humidity of 50% RH, using a universal tensile tester (manufactured by Minebea Co., Ltd., product name: TCM-1kNB), at a peel angle of 180 degrees and a peel speed of 30 mm / min, The pressure-sensitive adhesive layer (2) was peeled off from the resin film (2), and the pressure-sensitive adhesive strength was measured.

<Measurement of adhesive force when peeling the adhesive layer (2) from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 300 mm/min>
The separator of the laminate (I) of 10 cm × 10 cm was peeled off, and the adhesive layer surface of the evaluation sample was placed on a 10 cm × 10 cm glass plate (manufactured by Matsunami Glass Industry Co., Ltd., under an atmosphere of 23 ° C. temperature and 50% RH humidity. (trade name: Microslide Glass S)) with a hand roller, and then press-bonded with a pressure of 0.25 MPa. A separator-attached surface protective film (which may be referred to as a carrier sheet) that has been neutralized in advance is cut into a width of 25 mm and a length of 150 mm, and the laminate is fixed to glass in an atmosphere of 23° C. and 50% RH. It was pasted on the resin film side of (I) by one reciprocation of a 2.0 kg roller, and then crimped at a pressure of 0.25 MPa. After curing for 30 minutes in an atmosphere with a temperature of 23 ° C. and a humidity of 50% RH, using a universal tensile tester (manufactured by Minebea Co., Ltd., product name: TCM-1kNB), at a peel angle of 180 degrees and a peel speed of 300 mm / min, The pressure-sensitive adhesive layer (2) was peeled off from the resin film (2), and the pressure-sensitive adhesive strength was measured.

<Measurement of adhesive force when peeling the adhesive layer (2) from the resin film (2) at a peeling angle of 180 degrees and a peeling speed of 2400 mm/min>
The separator of the laminate (I) of 10 cm × 10 cm was peeled off, and the adhesive layer surface of the evaluation sample was placed on a 10 cm × 10 cm glass plate (manufactured by Matsunami Glass Industry Co., Ltd., under an atmosphere of 23 ° C. temperature and 50% RH humidity. (trade name: Microslide Glass S)) with a hand roller, and then press-bonded with a pressure of 0.25 MPa. A separator-attached surface protective film (which may be referred to as a carrier sheet) that has been neutralized in advance is cut into a width of 25 mm and a length of 150 mm, and the laminate is fixed to glass in an atmosphere of 23° C. and 50% RH. It was pasted on the resin film side of (I) by one reciprocation of a 2.0 kg roller, and then crimped at a pressure of 0.25 MPa. After curing for 30 minutes in an atmosphere with a temperature of 23 ° C. and a humidity of 50% RH, using a universal tensile tester (manufactured by Minebea Co., Ltd., product name: TCM-1kNB), at a peel angle of 180 degrees and a peel speed of 2400 mm / min, The pressure-sensitive adhesive layer (2) was peeled off from the resin film (2), and the pressure-sensitive adhesive strength was measured.

<Measurement of adhesive strength (1)>
A laminate (I) consisting of resin film (1)/adhesive layer (1)/resin film (2) was cut into a width of 25 mm and a length of 150 mm to prepare an evaluation sample. In an atmosphere with a temperature of 23° C. and a humidity of 50% RH, the resin film (1) was peeled off from the prepared sample for evaluation, and attached to a glass plate (manufactured by Matsunami Glass Industry Co., Ltd., trade name: Microslide Glass S). It was pasted by one reciprocation of a 0 kg roller. After curing for 30 minutes in an atmosphere with a temperature of 23° C. and a humidity of 50% RH, the adhesive strength (1) was measured using a universal tensile tester at a peel angle of 180 degrees and a peel speed of 300 mm/min.

<Measurement of adhesive strength (2)>
A separator-attached laminate (II) consisting of separator/adhesive layer (2)/resin film (3) was cut into a width of 25 mm and a length of 150 mm to prepare an evaluation sample. Separately, prepare an adherend attached to a glass plate after peeling the resin film (1) from the laminate (I), as described in <Measurement of Adhesion (1)>, at a temperature of 23 ° C. In an atmosphere with a humidity of 50% RH, the separator was peeled off from the evaluation sample and attached to the adherend by one reciprocation of a 2.0 kg roller. After curing for 30 minutes in an atmosphere with a temperature of 23° C. and a humidity of 50% RH, the adhesive strength (2) was measured by peeling at a peeling angle of 180 degrees and a peeling speed of 300 mm/min using a universal tensile tester.

<Measurement of total light transmittance and haze>
Using HM-150N manufactured by Murakami Color Research Laboratory, the total light transmittance was measured under the conditions of JIS-K-7361, and the haze was measured under the conditions of JIS-K-7136. At this time, the five-layer laminate was placed so that the resin film (3) faced the light source side.

<Measurement of float>
The laminate (I) is cut into a width of 50 mm and a length of 300 mm, and cut at five locations with a 1 mm width at equal intervals from the resin film (2) side with a CO ₂ laser, or at equal intervals with a 3 mm width. Half-cut to the surface of the resin film (1) (that is, the resin film (1) is not cut), half-cut Removed parts by hand. At this time, the sample was prepared so that the distance between the half-cut and removed portions was 50 mm. After that, the surface of the adhesive layer (2) of the laminate (II) cut into a width of 60 mm and a length of 400 mm was attached to the surface of the resin film (2) of the laminate (I) to obtain a measurement sample.
A measurement sample is wound around a roll with a diameter of 6 inches so that the resin film (1) is on the outside, and the laminated portion of the divided multiple adhesive layers (1) and the resin film (2) is the adhesive layer ( The maximum amount of floating from 2) was measured with a magnifying glass, and the average value of the measurements at any five locations was taken as the floating amount.

[Production Example 1] Production of adhesive composition (1) In a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas inlet tube, and a cooler, 95 parts of butyl acrylate (manufactured by Nippon Shokubai Co., Ltd.), acrylic acid ( Toagosei Co., Ltd.) 5 parts, 2,2′-azobisisobutyronitrile (manufactured by Wako Pure Chemical Industries, Ltd.) 0.2 parts as a polymerization initiator, and ethyl acetate 156 parts by weight were charged, and nitrogen was added while gently stirring. A gas was introduced, and the liquid temperature in the flask was maintained at around 63° C., and the polymerization reaction was carried out for 10 hours to prepare a solution (40% by weight) of (meth)acrylic polymer (1) having a weight average molecular weight of 700,000. In the (meth)acrylic polymer (1) solution, TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a cross-linking agent is added to the solid content of 100 parts by weight of the (meth)acrylic polymer (1) solution. 6 parts by weight in terms of conversion was added, diluted with ethyl acetate so that the total solid content was 20% by weight, and stirred with a disper to obtain a pressure-sensitive adhesive composition (1) containing an acrylic resin.

[Production Example 2] Production of adhesive composition (2) 100 parts by weight of 2-ethylhexyl acrylate (manufactured by Nippon Shokubai Co., Ltd.), 2 - 4 parts by weight of hydroxyethyl acrylate (manufactured by Toagosei Co., Ltd.), 0.2 parts by weight of 2,2'-azobisisobutyronitrile (manufactured by Wako Pure Chemical Industries, Ltd.) as a polymerization initiator, and 156 parts by weight of ethyl acetate were charged. Then, while gently stirring, nitrogen gas was introduced, and the liquid temperature in the flask was maintained at around 65° C., and the polymerization reaction was carried out for 8 hours. %) were prepared. To the (meth)acrylic polymer (2) solution, 4 parts of Coronate HX (manufactured by Tosoh Corporation) as a cross-linking agent is added to 100 parts by weight of the solid content of the (meth)acrylic polymer (2) solution in terms of solid content. Add 0.01 part by weight of Envirizer OL-1 (manufactured by Tokyo Fine Chemical Co., Ltd.) as a cross-linking catalyst in terms of solid content, dilute with ethyl acetate so that the total solid content is 25% by weight, and dispers to obtain a pressure-sensitive adhesive composition (2) containing an acrylic resin.

[Production Example 3] Production of pressure-sensitive adhesive composition (3) Acrylic-based A pressure-sensitive adhesive composition (3) containing a resin was obtained.

[Production Example 4] Production of adhesive composition (4) 100 parts by weight of 2-ethylhexyl acrylate (manufactured by Nippon Shokubai Co., Ltd.) and acetic acid were placed in a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen gas inlet tube, and a condenser. 80 parts by weight of vinyl monomer (manufactured by Showa Denko), 5 parts by weight of acrylic acid (manufactured by Toagosei Co., Ltd.), and 45 parts by weight of toluene were charged, and nitrogen gas was introduced while gently stirring. Oil company) 0.2 parts by weight, the liquid temperature in the flask was maintained at around 40 ° C., and the polymerization reaction was performed for 3 hours to obtain a (meth)acrylic polymer (4) solution (35% by weight) having a weight average molecular weight of 700,000. ) was prepared. In the (meth)acrylic polymer (4) solution, TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a cross-linking agent is added to the solid content of 100 parts by weight of the (meth)acrylic polymer (4) solution. 10 parts by weight in terms of conversion was added, diluted with methyl ethyl ketone so that the total solid content was 20% by weight, and stirred with a disper to obtain a pressure-sensitive adhesive composition (4) containing an acrylic resin.

[Production Example 5] Production of pressure-sensitive adhesive composition (5) Preminol S3011 (manufactured by Asahi Glass Co., Ltd., Mn = 10000) as a polyfunctional polyol was added to 100 parts by weight in terms of solid content, and Coronate HX (Nippon Polyurethane Industry Co., Ltd.) was used as a cross-linking agent. ) is 18 parts by weight in terms of solid content, Nasem ferric iron (manufactured by Nippon Kagaku Sangyo Co., Ltd.) as a cross-linking catalyst is 0.04 parts by weight in terms of solid content, and Irganox 1010 (manufactured by BASF) as a deterioration inhibitor is converted to solid content. and diluted with ethyl acetate so that the total solid content was 35% by weight, and stirred with a disper to obtain a pressure-sensitive adhesive composition (5) containing a urethane-based resin.

[Production Example 6] Production of adhesive composition (6) Same as Production Example 1, except that the amount of TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.) used as a cross-linking agent is 0.07 parts by weight in terms of solid content. A pressure-sensitive adhesive composition (6) containing an acrylic resin was obtained by the procedure.

[Production Example 7] Production of Laminate (A) The pressure-sensitive adhesive composition (6) obtained in Production Example 6 was applied to a polyester resin substrate "Lumirror S10" (thickness: 75 µm, manufactured by Toray Industries, Inc.) with a fountain roll. It was applied so as to have a thickness of 15 μm after drying, and was cured and dried under the conditions of a drying temperature of 130° C. and a drying time of 2 minutes. Thus, a pressure-sensitive adhesive layer was produced on the substrate. Next, on the surface of the pressure-sensitive adhesive layer, a silicone-treated surface of a substrate made of a 75 μm-thick polyester resin “Lumirror S10” (thickness: 75 μm, manufactured by Toray Industries, Inc.) having one surface treated with silicone is laminated. A laminate (A) having a structure of film (with silicone-treated surface)/adhesive layer/resin film was obtained.

[Production Example 8] Production of Laminate (B1) The pressure-sensitive adhesive composition (1) obtained in Production Example 1 was applied to a polyester resin substrate "Lumirror S10" (thickness: 38 µm, manufactured by Toray Industries, Inc.) with a fountain roll. It was applied so as to have a thickness of 5 μm after drying, and was cured and dried under the conditions of a drying temperature of 130° C. and a drying time of 30 seconds. Thus, a pressure-sensitive adhesive layer was produced on the substrate. Next, on the surface of the pressure-sensitive adhesive layer, a silicone-treated surface of a base material made of polyester resin having a thickness of 25 μm and having one surface subjected to silicone treatment is laminated to obtain a laminate having a structure of separator/adhesive layer/resin film. (B1) was obtained.

[Production Example 9] Production of laminate (B2) Except for changing the base material "Lumirror S10" (thickness 38 µm, manufactured by Toray Industries, Inc.) made of polyester resin to "Lumirror S10" (thickness 50 µm, manufactured by Toray Industries, Inc.), manufacturing A laminate (B2) having a configuration of separator/adhesive layer/resin film was obtained by the same procedure as in Example 8.

[Production Example 10] Production of laminate (B3) The substrate "Lumirror S10" (thickness 38 µm, manufactured by Toray Industries, Inc.) made of polyester resin was changed to the substrate "Lumirror S10" (thickness 75 µm, manufactured by Toray Industries, Inc.), and adhesive A laminate (B3) having a structure of separator/adhesive layer/resin film was obtained by the same procedure as in Production Example 8, except that the thickness of the agent layer was changed to 15 μm.

[Production Example 11] Production of Laminate (B4) The pressure-sensitive adhesive composition (2) obtained in Production Example 2 was applied to a polyester resin substrate "Lumirror S10" (thickness: 38 µm, manufactured by Toray Industries, Inc.) with a fountain roll. It was applied so as to have a thickness of 20 μm after drying, and was cured and dried under the conditions of a drying temperature of 130° C. and a drying time of 30 seconds. Thus, a pressure-sensitive adhesive layer was produced on the substrate. Next, on the surface of the pressure-sensitive adhesive layer, a silicone-treated surface of a base material made of polyester resin having a thickness of 25 μm and having one surface subjected to silicone treatment is laminated to obtain a laminate having a structure of separator/adhesive layer/resin film. (B4) was obtained.

[Production Example 12] Production of Laminate (B5) The pressure-sensitive adhesive composition (3) obtained in Production Example 3 was applied to a polyester resin substrate "Lumirror S10" (thickness: 38 µm, manufactured by Toray Industries, Inc.) with a fountain roll. It was applied so as to have a thickness of 20 μm after drying, and was cured and dried under the conditions of a drying temperature of 130° C. and a drying time of 30 seconds. Thus, a pressure-sensitive adhesive layer was produced on the substrate. Next, on the surface of the pressure-sensitive adhesive layer, a silicone-treated surface of a base material made of polyester resin having a thickness of 25 μm and having one surface subjected to silicone treatment is laminated to obtain a laminate having a structure of separator/adhesive layer/resin film. (B5) was obtained.

[Production Example 13] Production of Laminate (B6) The pressure-sensitive adhesive composition (4) obtained in Production Example 4 was applied to a polyester resin substrate "Lumirror S10" (thickness: 38 µm, manufactured by Toray Industries, Inc.) with a fountain roll. It was applied so as to have a thickness of 20 μm after drying, and was cured and dried under the conditions of a drying temperature of 130° C. and a drying time of 30 seconds. Thus, a pressure-sensitive adhesive layer was produced on the substrate. Next, on the surface of the pressure-sensitive adhesive layer, a silicone-treated surface of a base material made of polyester resin having a thickness of 25 μm and having one surface subjected to silicone treatment is laminated to obtain a laminate having a structure of separator/adhesive layer/resin film. (B6) was obtained.

[Production Example 14] Production of Laminate (B7) The pressure-sensitive adhesive composition (5) obtained in Production Example 5 was applied to a polyester resin substrate "Lumirror S10" (thickness: 38 µm, manufactured by Toray Industries, Inc.) with a fountain roll. It was applied so as to have a thickness of 12 μm after drying, and was cured and dried under the conditions of a drying temperature of 130° C. and a drying time of 30 s. Thus, a pressure-sensitive adhesive layer was produced on the substrate. Next, on the surface of the pressure-sensitive adhesive layer, a silicone-treated surface of a base material made of polyester resin having a thickness of 25 μm and having one surface subjected to silicone treatment is laminated to obtain a laminate having a structure of separator/adhesive layer/resin film. (B7) was obtained.

[Example 1]
The separator was peeled off from the laminate (B1) obtained in Production Example 8, and the resin film of the laminate (A) obtained in Production Example 7 (resin film not silicone-treated) was applied to the exposed adhesive layer. The sides were attached to obtain a laminate (1). Table 1 shows the results.

[Example 2]
The separator was peeled off from the laminate (B2) obtained in Production Example 9, and the resin film (resin film not silicone-treated) of the laminate (A) obtained in Production Example 7 was applied to the exposed adhesive layer. The sides were attached to obtain a laminate (2). Table 1 shows the results.

[Example 3]
The separator was peeled off from the laminate (B3) obtained in Production Example 10, and the resin film of the laminate (A) obtained in Production Example 7 (resin film not silicone-treated) was applied to the exposed adhesive layer. The sides were attached to obtain a laminate (3). Table 1 shows the results.

[Example 4]
The separator was peeled off from the laminate (B4) obtained in Production Example 11, and the resin film of the laminate (A) obtained in Production Example 7 (resin film not silicone-treated) was applied to the exposed adhesive layer. The sides were attached to obtain a laminate (4). Table 1 shows the results.

[Example 5]
The separator was peeled off from the laminate (B5) obtained in Production Example 12, and the exposed adhesive layer was coated with the resin film (resin film not silicone-treated) of the laminate (A) obtained in Production Example 7. The sides were attached to obtain a laminate (5). Table 1 shows the results.

[Example 6]
The separator was peeled off from the laminate (B6) obtained in Production Example 13, and the resin film of the laminate (A) obtained in Production Example 7 (resin film not silicone-treated) was applied to the exposed adhesive layer. The sides were attached to obtain a laminate (6). Table 1 shows the results.

[Comparative Example 1]
The separator was peeled off from the laminate (B7) obtained in Production Example 14, and the resin film of the laminate (A) obtained in Production Example 7 (resin film not silicone-treated) was applied to the exposed adhesive layer. The sides were attached to obtain a laminate (C1). Table 1 shows the results.

The laminate of the present invention can be suitably used in the manufacturing process of optical members and electronic members.

Resin film (1) 10
Adhesive layer (1) 20
Resin film (2) 30
Adhesive layer (2) 40
Resin film (3) 50
Through hole 60
Laminate 100

Claims (2)

A laminate of five or more layers having a resin film (1), an adhesive layer (1), a resin film (2), an adhesive layer (2), and a resin film (3) in this order,
The adhesive layer (1) and the resin film (2) are directly laminated,
The resin film (2) and the adhesive layer (2) are directly laminated,
The resin film (1) is a separator,
The adhesive layer (2) and the resin film (3) are directly laminated, and the laminate portion of the adhesive layer (2) and the resin film (3) is a carrier sheet,
The adhesive layer (1) is composed of an acrylic adhesive,
The adhesive layer (2) is composed of an acrylic adhesive,
The resin film (1) has a thickness of 1 μm to 300 μm,
The pressure-sensitive adhesive layer (1) has a thickness of 0.5 μm to 150 μm,
The resin film (2) has a thickness of 25 μm to 500 μm,
The pressure-sensitive adhesive layer (2) has a thickness of 0.5 μm to 150 μm,
The resin film (3) has a thickness of 4 μm to 450 μm,
The laminated portion of the adhesive layer (1) and the resin film (2) is divided into a plurality of through-holes having a width of 0.5 mm to 10 mm in a direction substantially perpendicular to the longitudinal direction,
The longitudinal length of the laminated portion of the plurality of pressure-sensitive adhesive layers (1) and the resin film (2) separated by the through-holes is 1 mm to 2000 mm,
Laminated portions of a plurality of adhesive layers (1) and resin films (2) separated by the through-holes when the resin film (1) is wound around a roll having a diameter of 6 inches on the outside. is floating from the pressure-sensitive adhesive layer (2), the width of the through-hole is 5 mm, and the laminated portion of the plurality of pressure-sensitive adhesive layers (1) and the resin film (2) separated by the through-holes is 0.2 mm or less when the length in the longitudinal direction is 50 mm,
laminate. The laminate according to claim 1, wherein the total area of the resin film (2) in the planar direction is smaller than the total area of the pressure-sensitive adhesive layer (2) in the planar direction.

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