WO2020148037A1

WO2020148037A1 - Lamp with a peripherally closed heatsink

Info

Publication number: WO2020148037A1
Application number: PCT/EP2019/084981
Authority: WO
Inventors: Angelo Favarolo
Original assignee: Zumtobel Lighting Gmbh
Priority date: 2019-01-18
Filing date: 2019-12-12
Publication date: 2020-07-23
Also published as: EP3911892A1; CN112997037A; AT17406U1; EP3911892B1; DE202019100275U1

Abstract

The present invention relates to a lamp (100), in particular a streetlamp (100), comprising an illuminant (200), more particularly an LED, with a main light emission direction (210), a support (400) for carrying the illuminant (200), said support being provided on the backside of the illuminant (200) in respect of the main light emission direction (210), and a heatsink (300), which extends between the support (400) and the illuminant (200), wherein the heatsink (300) has a receiving side (310), the illuminant (200) being thermally coupled therewith, and also a heat conducting structure (330), which extends away from the receiving side (310) to the support (400) counter to the main light emission direction (210), and a side wall (320), which peripherally completely surrounds the heat conducting structure (330) laterally to the outside, wherein the side wall (320) has at least one inlet opening (325) and the receiving side (310) has at least one outlet opening (315), which are fluidly connected to one another by way of a cooling channel (KK) formed by the heat conducting structure (330) in order to dissipate heat transmitted from the illuminant (200) to the heat conducting structure (330) via the cooling channel (KK) by means of convection.

Description

Luminaire with heat sink closed on the circumference

The present invention relates to a lamp, in particular a lamp for street lighting, with a lamp, a support for carrying the lamp and a heat sink.

When using LEDs as illuminants, the removal of the heat generated during the operation of the illuminant is particularly important, since the heat can accumulate in the LED chip and destroy it. Furthermore, a sustained increase in heating of the LED chip has an impact due to a loss of brightness and a reduction in the service life.

In the case of LEDs with a low output, the heat regulation is often negligible, since the heat can easily be dissipated to the outside via the already existing components, such as the LED chip. However, this is no longer possible with powerful LED lamps, such as those used for outdoor lamps, in particular lamps for street lighting, and a dedicated cooling of the lamp is necessary in order to maintain the brightness and service life of such lamps.

It is basically known from the prior art to provide heat sinks in the luminaire on which the illuminant is attached in order to dissipate the heat and thus regulate the temperature in the luminaire. The heat sinks known for this purpose often have a large number of cooling fins which provide the area required for cooling.

However, such a heat sink has the disadvantage, among other things, that it can impair the aesthetics of the lights. In addition, the known heat sinks, due to their size and design, can also negatively influence the light output of the luminaire. For example, shadowing effects and undesirable reflections on the cooling fins of the heat sink can occur. Furthermore, it may be necessary in the known heat sinks to make them as large as possible in order to enlarge the area available for air cooling. The increased space requirement of the heat sink can therefore also result in the fact that the available light-emitting surface of the lamp is restricted by the heat sink.

It is therefore an object of the present invention to provide a luminaire with which the disadvantages and problems known from the prior art are overcome. In particular, it is an object of the invention to provide a luminaire with improved light-emitting properties and at the same time improved heat dissipation of the heat generated by the illuminant and, if appropriate, the heat generated by further heat-generating, in particular electronic, components. This object is solved by the subject matter of the independent claim. The dependent claims develop the central idea of the present invention in a particularly advantageous manner.

The present invention relates to a lamp, in particular a lamp for street lighting, which has an illuminant, such as an LED, with a main direction of light emission.

According to the invention, a “main light emission direction” is understood to mean in particular an orientation which points into the half-space into which the light (for example the mass of the light or the mean light emission direction) of the illuminant is emitted.

Furthermore, the lamp has a carrier for carrying the lamp, which is provided on the back of the lamp with respect to the main direction of light emission.

In addition, the lamp has a heat sink, which extends between the carrier and the lamp. The heat sink has a receiving side with which the illuminant is thermally coupled. Furthermore, the cooling body has a heat-conducting structure, which extends away from the receiving side against the main light-emitting direction toward the carrier. In addition, the heat sink has a side wall which completely surrounds the outside of the heat conducting structure on the outer circumference.

According to the invention, “completely surrounding” the side wall is understood in particular to mean that the side wall encompasses or envelops the outside of the heat-conducting structure at least over the entire height in the main direction of light emission.

The side wall has at least one inlet opening and the receiving side has at least one outlet opening. These are fluidly connected to one another via a cooling duct formed by the heat-conducting structure in order to dissipate heat transferred from the illuminant to the heat-conducting structure by means of convection via the cooling duct.

According to the invention, a “fluid power connection” is understood to mean, in particular, a connection that enables the transport of matter and energy through the flow of fluids, in particular gases and / or liquids.

In other words, the luminaire according to the invention can thus be described, for example, in such a way that a luminaire is provided with a lamp which emits light with a main direction of light emission. The illuminant thus emits light into a half space in front of the illuminant in the direction of light emission. The half space can be divided, for example of the space can be defined by the plane of extent of the LED chip and the main direction of light emission can, for example, correspond to the (orientation and / or direction of) surface normals of this plane of extent. The illuminant is carried by a (direct) / indirect support (element), which is provided on the back of the illuminant. A heat sink is provided between the carrier (element) and the illuminant, which is (at least) thermally coupled to the illuminant via a receiving side. The heat sink also has a heat-conducting structure which is completely surrounded on the outside by a side wall along the circumference. The heat-conducting structure is thus enveloped laterally on the outside by the side wall. Furthermore, an inlet opening in the side wall is fluidically connected to an outlet opening in the receiving side via a cooling channel formed in the heat-conducting structure or by the heat-conducting structure, in order to enable convective heat transport between the two openings by means of the cooling channel. In particular, the heat transferred from the illuminant to the heat-conducting structure is to be transported. The lamp is thus provided on the top in the direction of use (main direction of light emission) so that a cooling medium which has flowed in from below the receiving side (counter to the main direction of light emission) and warmed up in the heat-conducting structure can escape through the outlet opening .

The provision of the side wall which completely surrounds the outside of the heat-conducting structure makes it possible to prevent undesired reflections and absorption of the light emitted by the illuminant on the heat-conducting structure. Such a side wall thus enables the efficiency of the luminaire to be increased, since the light is not absorbed by the heat-conducting structure or is emitted (reflected) in a direction which is not relevant for the lighting application. Shading effects can thus be minimized and the overall light output of the luminaire can be improved.

The heat generated by the illuminant is dissipated to the heat-conducting structure of the heat sink via the receiving side thermally connected to the illuminant. The provision of openings in the receiving side and the side wall that are fluidically connected by cooling channels enables the circulation of a cooling medium, such as air, through the heat-conducting structure and thus the convective transport of the heat generated by the illuminant out of the heat-conducting structure. A chimney effect can also occur between the two openings, by means of which the heat transport is further promoted. In the chimney effect, a local density difference between the warm and the cold cooling medium, which accelerates the convective flows, is used, for example a difference in the density of the cooling medium at the inlet opening and the outlet opening. The heat dissipation can be improved in particular by the side wall that completely surrounds the outside of the heat-conducting structure on the outside. For example, the available heat dissipation area can be maximized by the circumferential side wall. Furthermore, the convective heat transport can be further intensified by a stronger separation of cold cooling medium outside the heat conducting structure and warm cooling medium on the heat conducting structure and the pressure differences that arise. The side wall can thus be used both to improve heat dissipation and to improve light emission.

The carrier also provides a component which both allows the illuminant to be fastened and also opens up the possibility of fastening the illuminant in the luminaire in a thermally decoupled manner.

This makes it possible to provide a luminaire with which the light emission is improved and at the same time the heat dissipation of the heat generated by the illuminant is made possible. In addition, the lifespan of the illuminants can also be increased, since the heat is dissipated in a defined manner from the heat-sensitive components, such as the LED chip.

According to an advantageous development, the side wall and the heat-conducting structure can be flush with one another at least on the receiving side. Alternatively or additionally, the side wall on the side of the heat sink facing away from the receiving side can be flush with the heat conducting structure.

This makes it possible to minimize the size of the heat sink while maintaining the aforementioned effects and to improve the light output of the lamp. In addition, less material is required for the heat sink, so that costs can be reduced.

As an alternative or in addition, the side wall can protrude from the heat-conducting structure counter to the main light-emitting direction in order to completely surround a heat sink receiving space on the rear side of the heat-conducting structure on the outside on the circumference.

This makes it possible to provide the components required for the operation of the lamp near the lamp and to hide them under the heat sink. This makes it possible to further improve the light output properties of the luminaire and to reduce the space required for the luminaire. This also improves the aesthetics of the lamp and there is more freedom in the design of the lamp. Furthermore, the electrical connection, in particular the wiring of the illuminant to the operating devices, is simplified. In addition, such a configuration enables a modular construction of the luminaire, with which the manufacture and maintenance of the luminaire can be simplified and thus costs can be reduced. According to a further advantageous development, the inlet opening can be provided in a region of the side wall which is located to the side and / or to the rear of the heat-conducting structure with respect to the main direction of light emission.

This makes it possible to further improve the convective heat transport through the heat conducting structure. In particular, the chimney effect can set in faster and even at lower temperatures and overall heights of the heat sink.

According to an advantageous development, the carrier (on the side of the heat sink) can have a carrier receiving space that is at least partially open (towards the heat sink) for receiving electronic components for operating the illuminant. The carrier receiving space can form a coherent space with the heat sink receiving space. The heat sink (the side wall) can expand laterally outwards with increasing distance from the receiving side to the carrier. The heat-conducting structure can be provided laterally in the center of the heat sink with respect to the side wall.

This makes it possible to provide the components required for operating the lamp near the lamp and to hide them in the carrier. By connecting the respective recording rooms, the space available for the electronic components can be maximized. This makes it possible to further improve the light output properties of the luminaire by reducing the size of the individual elements and to reduce the space required for the luminaire. Furthermore, the aesthetics of the lamp is improved and there is more freedom in the design of the lamp. Furthermore, the manufacture and maintenance of the lamp can be simplified and thus costs can be reduced.

The carrier receiving space can be delimited towards the heat sink by a carrier side of the carrier. In this case, the carrier side can preferably be open or have openings in order to connect the carrier receiving space to the cooling body in terms of fluid technology. Alternatively or additionally, the carrier (at least the carrier side) can be made from a thermally conductive material. The carrier receiving space can further be delimited by the heat sink towards the illuminant. The carrier receiving space can preferably be completely covered by the heat sink towards the illuminant. The carrier can be mechanically (and also thermally) coupled (with the side wall). The carrier side can particularly preferably be thermally coupled to the heat sink (and / or to the heat conducting structure).

This makes it possible to also absorb and dissipate the heat generated by the electronic components through the heat sink. The fireplace effect can also be enhanced by the additional heat on the back of the lamp and the fluid connection to the heat conducting structure because there is a larger temperature gradient, for example. The heat dissipation from the carrier receiving space by means of thermal conduction also improves the temperature control in the carrier receiving space. The heat sink can also be used to provide a closure of the carrier receiving space to protect the electronic components provided therein with simple means. In this connection, particular reference should be made to the circumferential side wall, which can particularly advantageously provide such a protective function.

According to an advantageous development, the heat-conducting structure for fastening the illuminant on the receiving side can have a fastening section for the illuminant, from which at least one cooling fin extends laterally outwards to the side wall. The at least one cooling fin can extend (longitudinally) between the receiving side and the carrier. In addition, the heat-conducting structure can have a plurality of cooling fins, which are arranged in a plan view of the receiving side (evenly) distributed around the circumference of the fastening section. The fastening section can be arranged centrally with respect to the plurality of cooling fins.

The provision of a defined fastening section simplifies the assembly and maintenance of the lamp. Furthermore, it becomes possible to form the heat conducting structure by means of elements which optimize the heat dissipation area. In addition, the heat flow of the heat given off by the illuminant is defined by the heat-conducting structure, and the heat can be transported away from the illuminant in a controlled manner.

According to a further advantageous development, the inlet opening and the outlet opening can be provided in a (common) section of the heat sink between two adjacent cooling fins in a plan view of the receiving side.

This makes it possible to maximize the heat transport in the heat conducting structure by thermal conduction and at the same time to improve the convective heat transport by providing the openings in a defined manner. This makes it possible to skillfully dissipate the heat from the heat sink.

According to an advantageous development, the cooling channel can be delimited by the side wall and the heat conducting structure. The cooling channel can preferably be delimited by the side wall and two adjacent cooling fins. The cooling duct can be designed as a recess in the heat-conducting structure.

This makes it possible to dissipate the heat transferred to the heat-conducting structure particularly advantageously by convection, since the area over which the cooling medium flows is maximized. According to a further advantageous development, the cooling channel can be designed as a through hole in the heat conducting structure. The cooling channel can extend (directly) between the inlet opening and the outlet opening. The inlet opening and the outlet opening can also be arranged on different sides of the heat sink with respect to the heat-conducting structure (and preferably structurally separated by the heat-conducting structure). Alternatively or additionally, the cooling channel can extend from the outlet opening to the (in) the heat sink receiving space.

This makes it possible to provide convective heat transport in the luminaire in different ways and thus to adapt the luminaire depending on the application and the requirements of the heat transport. In particular, it becomes possible to adapt or optimize the heat transport with respect to the illuminant used.

According to an advantageous development, the cooling channel can extend longitudinally between the receiving side and the carrier (orthogonal to the receiving side or to the fastening section).

This makes it possible to dissipate the heat transferred to the heat-conducting structure particularly advantageously by convection, since the area over which the cooling medium flows is maximized. In addition, the manufacture and manufacture of the heat conducting structure can be simplified.

According to a further advantageous development, the side wall can be connected to the heat-conducting structure (via the fastening section or via the at least one cooling fin). The side wall can also be thermally coupled to the heat conducting structure.

This makes it possible to utilize the area provided by the side wall for the conductive and convective heat transport. This makes it possible to dissipate the heat transferred to the heat-conducting structure particularly advantageously to the environment and thus to conduct the heat away from the illuminant.

According to an advantageous development, the cooling body can be designed symmetrically, in particular mirror-symmetrically or point-symmetrically, in a plan view of the receiving side. Alternatively or additionally, the heat sink can have a polygonal or round cross section. The heat sink can also be designed symmetrically, mirror-symmetrically, and / or polygonally, in particular trapezoidally, in a top view of the side wall.

This makes it possible to provide a visually appealing lamp. In addition, the shape and shape of the luminaire can be adapted accordingly, in particular with regard to the desired light emission properties. The assembly can also be simplified since, due to the symmetry, fewer specifications regarding the luminaire alignment are required. According to a further advantageous development, the side wall can have a surface for influencing light on the side facing away from the heat-conducting structure. Alternatively or additionally, the side wall on the side facing away from the heat-conducting structure can have a smooth, smooth or matt surface, or a reflector or be designed as a reflector.

This makes it possible to improve the light output, since the surface of the side wall can be adapted according to the desired optical properties of the luminaire.

According to an advantageous development, the inlet opening and / or the outlet opening can be designed as slots or recesses with an essentially round, circular or polygonal shape.

This makes it possible to adapt the openings according to the desired properties for heat transport or for light emission. Furthermore, a reduction in the weight of the component can be achieved through the openings, so that the luminaire can be manufactured with less material and can be assembled more easily, for example without load trains.

According to a further advantageous development, the heat sink can be formed in one piece. In particular, the side wall and the heat sink can be formed integrally with one another. Alternatively, the heat sink can also be designed in several parts.

This makes it possible to provide the heat sink as one component, thereby simplifying production, assembly and maintenance. A multi-part design can also be used so that the heat sink can be adjusted to suit the application. Overall, it is thus possible to use the lamp for a large number of applications and to be able to use the effects of the invention.

According to an advantageous development, the illuminant can be an LED, in particular a COB LED (chip-on-board LED).

This makes it possible to provide a lamp with high light output and a small size. Such lamps are also characterized by their service life and their efficiency. Thus, the light output of the lamp can be improved and at the same time the design freedom of the lamp can be increased. Furthermore, fewer illuminants are required in order to achieve a correspondingly high amount of light output.

According to a further advantageous development, the luminaire can furthermore have an optical component, which is arranged in the main light-emitting direction in front of the illuminant, for optically influencing the light emitted by the illuminant in the main light-emitting direction, such as one Optics, a lens and / or a reflector, for example for indirect light emission to the environment.

This makes it possible to further improve the light emission properties and light emission efficiency of the lamp. In particular, it becomes possible for the luminaire to be able to emit light indirectly, i.e. the light is not emitted directly onto the surface to be illuminated, but first strikes in particular a reflector before it is emitted onto the surface to be illuminated. This makes it possible to increase the luminosity and to avoid or at least reduce glare effects, such as, for example, the undesired glare of surrounding buildings, or light pollution such as is caused, for example, by light being emitted upwards.

Alternatively or additionally, the luminaire can furthermore have a lampshade which, for example, at least partially spans the illuminant and further preferably has or carries the optical component (s).

This makes it possible to protect the luminaire from environmental influences. It also makes it possible to use a modular design for the luminaire, which reduces the costs for production, assembly and maintenance.

According to an advantageous development, the luminaire can furthermore have at least one electronic component for operating the lamp, such as, for example, an operating device and a lamp driver. In addition, the lamp can also have a base on which the carrier is arranged. This makes it possible to cool the luminaire better overall, since the wind speed of the air flowing around the luminaire increases with increasing fastening height of the luminaire and the luminaire is thus better cooled from the outside.

Further embodiments and advantages of the present invention are explained on the basis of the following exemplary embodiments in connection with the figures. Features of the invention are identified by reference symbols. However, from the absence of a reference sign in a figure, it cannot be deduced that the corresponding feature is not shown in this figure. Rather, in such a case, reference is explicitly made to the absence of the feature. Show it:

Figure 1 is a perspective view of a lamp according to a first embodiment of the invention.

Figure 2 is a sectional view of a lamp according to a second embodiment of the

Invention.

Figure 3 is a perspective view of a heat sink according to the invention according to a first embodiment. FIG. 4 shows a side view of the heat sink from FIG. 3.

Figure 5 is a top view of the heat sink of Figure 3.

Figure 6 is a perspective view of a heat sink according to the invention according to a second embodiment.

FIG. 7 shows a side view of the heat sink from FIG. 6.

Figure 8 is a top view of the heat sink of Figure 6.

Figures 1 and 2 show different views of different embodiments of a lamp 100 according to the invention. Figures 3 to 8 show different views of different embodiments of a heat sink 300 according to the invention.

FIGS. 1 and 2 show different exemplary embodiments of the lamp 100 according to the invention, which can be used for street lighting, for example. The lamp 100 can be rotationally symmetrical. The lamp 100 can have a round, in particular circular, shape, as shown for example in FIG. 1.

The lamp 100 has a lamp 200. The illuminant 200 can be an LED or a COB LED, for example. The illuminant 200 has a main light emitting direction 210 in which the light is emitted by the illuminant 200. The main light emission direction 210 is indicated by way of example in FIGS. 1 and 2 by an arrow with a two-dot chain line. The main light emitting direction 210 can, for example, also coincide with an axis of symmetry or longitudinal axis LA of the lamp 100, as is shown, for example, in FIG. 2. The illuminant 200 can emit the light radially outward in all directions into a half space of the lamp 100 lying in front of the illuminant 200, towards which the main light emitting direction 210 is also oriented. The illuminant 200 can be a point light source. Alternatively or additionally, the illuminant 200 can be designed such that it emits essentially the same directional light in the main light emission direction 210. Of course, it is also conceivable to provide a plurality of lamps 200. The main light emission direction 210 of the plurality of illuminants 200 can be determined, for example, by a vector addition weighted with their respective illuminance levels. However, other methods of determining the main light emitting direction 210 can be used.

The luminaire 100 can be configured to emit the light from the illuminant 200 either directly or indirectly to the outside. Alternatively, however, it is also conceivable that the luminaire 100 is configured to directly direct parts of the light from the illuminant 200 and other parts of the light indirectly to deliver. For this purpose, the luminaire 100 can, for example, have a reflector arranged in the main light emission direction 210 in front of the illuminant 200 for indirect light emission to the surroundings. However, the luminaire 100 can also have further optical components 700, for example arranged in the main light emitting direction 210 in front of the illuminant 200, for optically influencing the light emitted by the illuminant 200 in the main light emitting direction 210, as shown for example in FIGS. 1 and 2 is. For example, the lamp 100 can have a lens. The luminaire 100 can also have a luminaire shade 800 which, for example, at least partially spans the illuminant 200 and preferably has or carries the optical component (s) 700, as is shown, for example, in FIGS. 1 and 2.

To operate the lamp 200, the lamp 100 can have at least one electronic component 500. For example, the lamp 100 can have an operating device, such as a lamp driver. This is shown by way of example in FIG. 1.

The lamp 100 also has a carrier 400 for carrying the lamp 200. The carrier 400 can carry the illuminant 200 directly, that is to say, for example, by direct attachment to the carrier 400, or indirectly, that is to say via at least one further element between the illuminant 200 and the carrier 400. The carrier 400 is provided on the back of the illuminant 200 with respect to the main light emission direction 210. In FIGS. 1 and 2, the lamp 100 is also shown as an example in such a way that the carrier 400 is arranged on a pedestal 600. However, this is only an example. The carrier 400 can of course also be arranged or fastened to other components or to wall sections. The carrier 400 can be produced from a plastic or from a metallic or ceramic material.

The carrier 400 can have an at least partially open carrier receiving space 470 for receiving the electronic components 500, as is shown, for example, in FIG. 2. For this purpose, the carrier 400 can expand upwards towards the illuminant 200, but other configurations of the carrier 400 are also conceivable.

The lamp 100 also has a heat sink 300. The heat sink 300 extends (preferably completely, further preferably alone) between the carrier 400 and the illuminant 200. This is shown by way of example in FIGS. 1 and 2. The further FIGS. 3 to 5 show a first exemplary embodiment of the heat sink 300 according to the invention. FIGS. 6 to 8 show a further exemplary embodiment of the heat sink 300.

The heat sink 300 has a receiving side 310 with which the illuminant 200 is thermally coupled. The illuminant 200 can be provided directly on the receiving side 310. A thermal paste can preferably be provided between the illuminant 200 and the receiving side 310 in order to improve the thermal coupling, in particular the conductive heat conduction between the illuminant 200 and the receiving side 310. However, the illuminant 200 can also be thermally coupled to the heat sink 300 via a further component. The illuminant 200 is preferably fastened (or also mechanically coupled) to a fastening section 312 on the receiving side 310. As can be seen in particular from FIGS. 3 and 6, the receiving side 310 can have, for example, a surface with fastening means (for example, two diagonally opposed bores with an internal thread) that are adapted to the shape of the illuminant 200. The receiving side 310 can thus be designed, for example, as an independent section of the heat sink 300 or as a surface of the heat sink 300.

The heat sink 300 also has a heat-conducting structure 330, which extends away from the receiving side 310 against the main light-emitting direction 210 toward the carrier 400. This is particularly shown in Figure 2. The heat-conducting structure 330 can have the receiving side 310. The heat-conducting structure 330 can preferably have the fastening section 312 for fastening the illuminant 200.

Furthermore, the cooling body 300 has a side wall 320 which completely surrounds the heat-conducting structure 330 on the outside on the circumferential side. This is shown as an example in all figures. According to the illustration in the figures, the heat-conducting structure 330 is completely enclosed and encased by the side wall 320 in the circumferential direction and along the longitudinal extent of the heat-conducting structure 330. For this purpose, the side wall 320 can be designed as an (almost completely) closed lateral surface which (completely) runs around the circumference of the receiving side 310. The side wall 320 can extend at least over the entire height of the heat-conducting structure 330 along the main light emission direction 210 or in the direction of extension of the heat sink 330, in particular along the longitudinal axis LA of the lamp 100. The heat-conducting structure 330 is preferably completely covered laterally outwards by the side wall 320. In this way it can be achieved, for example, that the light emitted by the illuminant 200 cannot be absorbed or reflected by the heat-conducting structure 330. In addition, the surface of the side wall 320 can be configured in such a way that it forms a barrier to the heat-emitting structure 330 for the emitted light from the illuminant 200. This can be achieved, for example, by designing the side wall 320 as a closed, preferably opaque surface.

The side wall 320 can preferably have a surface for influencing the light on the side facing away from the heat-conducting structure 330. For example, the side wall 320 can have an even, smooth or matt surface, such as that of the illuminant 200 emitted light or the light reflected by a reflector arranged in front of the illuminant 200 (defined) and / or reflected (defined). For this purpose, the side wall 320 can preferably have a reflector or be designed as a reflector.

The side wall 320 can be connected to the heat conducting structure 330. The side wall 320 can preferably be connected to the heat-conducting structure 330 via the fastening section 312. The side wall 320 can be thermally coupled to the heat-conducting structure 330 in order, for example, to enable conductive heat transport from the heat-conducting structure 330 to the side wall 320. Alternatively, however, it is also conceivable that the heat-conducting structure 330 is not connected to the side wall 320, but is, for example, only connected to the side wall 320 via the receiving side 310. Alternatively or additionally, it is also conceivable that the heat-conducting structure 330 is only partially connected to the side wall 320 or is thermally coupled.

The heat-conducting structure 330 can preferably be provided laterally in the center of the heat sink 300 with respect to the side wall 320, as can be seen particularly well from FIG. 2, for example. However, it is also conceivable that the heat-conducting structure 330 is arranged asymmetrically with respect to the side wall 320, in particular laterally eccentrically.

The side wall 320 and the heat-conducting structure 330 can be flush with one another at least on the receiving side 310. This is shown in all figures, for example. However, it is also conceivable that the side wall 320 projects beyond the heat-conducting structure 330 in the main light emission direction 210.

The side wall 320 can expand laterally outwards with increasing distance from the receiving side 310 to the carrier 400. This is shown as an example in all figures. In particular, it is shown by way of example that the side wall 320 can be designed such that it wraps around the heat-conducting structure 330 like a rock. The heat sink 300 can also have a shell-like or dome-like shape.

The side wall 320 can also be flush with the heat-conducting structure 330 on the side of the heat sink 300 facing away from the receiving side 310. However, it is also conceivable that the side wall 320 on the side of the heat sink 300 facing away from the receiving side 310 protrudes from the heat-conducting structure 330 against the main light-emitting direction 210. This is shown in all figures, for example, and can be seen well in FIG. By protruding the side wall 320 from the heat-conducting structure 330 against the main light-emitting direction 210, a heat sink receiving space 370 can be formed on the back of the heat-conducting structure 330, which is completely surrounded on the outside on the circumferential side by the side wall 320. By doing The heat sink receiving space 370, for example, can accommodate the electronic components 500.

In order to provide space for the electronic components 500 in addition to the heat sink receiving space 370, the carrier 400, in particular the carrier receiving space 470, can be open on the side of the heat sink 300 towards the heat sink 300. The carrier receiving space 470 and the heat sink receiving space 370 can form a coherent space, as shown, for example, in FIG. 1. In Figure 1, the contiguous space is delimited by the side wall 320 and the support 400.

However, as shown in FIG. 2, for example, the carrier receiving space 470 can also be delimited towards the heat sink 300 by a carrier side 430 of the carrier 400. The carrier side 430 can, for example, be at least partially open or at least have openings in order to fluidly connect the carrier receiving space 470 to the heat sink 300. If the carrier side 430 does not have any openings, for example, it is also conceivable to produce the carrier 400 or at least only the carrier side 430 from a (particularly) thermally conductive material in order in this way to conduct at least one conductive heat transfer to the outer surfaces of the carrier 400 or to the heat-conducting structure 330 to enable. For this purpose, the carrier side 430 can preferably be thermally coupled to the heat sink 300 or at least to the heat conducting structure 330. If the heat sink 300 has, for example, no heat sink receiving space 370 and also no carrier side 430, the carrier receiving space 470 can be delimited or completely covered by the heat sink 300 toward the illuminant 200. The heat sink 300 can thus be an element delimiting the carrier receiving space 470 at the top.

The carrier 400 can be mechanically and preferably also thermally coupled to the heat sink 300, to the side wall 320 and / or to at least the heat-conducting structure 330. Alternatively, the heat sink 300 can also be mounted on rubber elements or sealing elements on the carrier 400, in order to thermally isolate the components from one another at least in sections and to enable conductive heat conduction only in certain, preferably defined, support sections. FIG. 2 shows, by way of example, that the heat sink 300 rests on the carrier 400 with the side wall 320 and the side facing away from the receiving surface 310.

The heat-conducting structure 330 can, for example, be designed such that at least one cooling fin 313 extends laterally outward from the fastening section 312 to the side wall 320. This is shown, for example, in FIGS. 1 to 3, 5, 6 and 8. The at least one cooling fin 313 can preferably extend longitudinally between the receiving side 310 and the carrier 400. The at least one cooling fin 313 can preferably extend further than the fastening section 312 (towards the beam 400). This is shown, for example, well in FIG. 2, but is also shown in FIGS. 1, 3, 5, 6 and 8.

The heat conducting structure 330 can preferably have a plurality of cooling fins 313. In plan view of the receiving side 310, these can preferably be arranged uniformly distributed on the circumference of the fastening section 312. Furthermore, the fastening section 312 can be arranged centrally with respect to the plurality of cooling fins 313. The fastening section 312 can have a round shape in a plan view of the receiving side 310. However, other shapes are also conceivable. The side wall 320 can also be connected to the heat-conducting structure 330 via the cooling fins 313. An exemplary representation can be found in FIGS. 1, 3, 5, 6 and 8.

However, it is also conceivable that the heat-conducting structure 330 is designed in a different way, for example as a solid body or a hollow body. However, this list is not to be regarded as exhaustive.

The cooling body 300 can be designed symmetrically (rotationally symmetrical, mirror-symmetrical or point-symmetrical) in a plan view of the receiving side 310. The heat sink 300 preferably has a polygonal or round cross section. However, it is also conceivable that the heat sink 300 has other cross-sectional shapes. In a top view of the side wall 320, the heat sink 300 can also be symmetrical (mirror-symmetrical or rotationally symmetrical). In addition, the heat sink can be polygonal (trapezoidal) or bell-shaped.

The heat sink 300 can also be formed in one piece. In particular, the side wall 320 and the heat sink 300 can be formed integrally with one another. Alternatively, the heat sink 300 can, however, also be formed in several parts.

The heat sink 300 can be made from a particularly thermally conductive material, such as aluminum or copper. The side wall 320 can, however, also be encased with an (additional) material, such as plastic, which can reduce the risk of injury during maintenance work (for example, burns).

The side wall 320 also has at least one inlet opening 325. The receiving side 310 has at least one outlet opening 315. All figures represent this as an example.

The inlet opening 325 and the outlet opening 315 can each have different shapes and cross sections. The inlet opening 325 and the outlet opening 315 can in particular be configured in such a way that they emit the light from the luminaire 100 and the Affect illuminant 200 as little as possible and preferably are not recognizable from the outside if possible. Furthermore, the inlet opening 325 and the outlet opening 315 can be designed as slots or recesses with a substantially round, circular or polygonal shape. The inlet opening 325 and the outlet opening 325 can have the same cross-sections or different cross-sectional shapes. This is shown as an example in all figures.

The inlet opening 315 can be provided in a region of the side wall 320 which is located to the side and to the rear of the heat-conducting structure 330 with respect to the main light-emitting direction 210. The heat sink 300 can consequently be configured such that the heat sink 300, viewed in the main light emission direction 210, has at least one outlet opening 315 and at the rear at least one inlet opening 325. As a result, the heat sink 300 can be arranged or oriented in the luminaire 100 such that there is a height difference in the direction of the acceleration due to gravity between the inlet opening 325 and the outlet opening 315. 1 and 2 show, for example, that the outlet opening 315 lies above the inlet opening 325 with respect to gravity. In this arrangement, the heat sink 300 is thus open upwards via the outlet opening 315. However, it is also conceivable that the heat sink 300 is arranged in the luminaire 100 such that the outlet opening 315 is below the inlet opening 325 with respect to gravity. In this arrangement, the heat sink 300 is thus opened upwards via the inlet opening 325. The inlet opening 325 and the outlet opening 315 can also be arranged on different sides of the heat sink 300 with respect to the heat-conducting structure 330, and preferably in a fluidically separate manner by means of the heat-conducting structure 330.

The heat sink 300, in particular the side wall 320, can have a plurality of inlet openings 325. In this case, the inlet openings 325 can be provided on the side wall 320 evenly in the circumferential direction and at the same distance from the receiving side 310. This is shown as an example in all the figures and is clearly illustrated in FIGS. 3 to 5. Furthermore, the inlet openings 325 can be provided on the side wall 320 at different distances from the receiving side 310. Furthermore, the inlet openings 325 can also have different distances from one another on the circumference. This is shown by way of example in FIGS. 6 to 8. Preferably, the plurality of inlet openings 325 can be divided into groups with the same (longitudinal distance from the receiving side 310. Each group of inlet openings 325 can preferably be arranged uniformly or distributed in periodic patterns over the circumference of the side wall 320, such as for example in FIGS Figures 6 to 8 is shown.

The heat sink 300, in particular the receiving side 310, can furthermore have a plurality of outlet openings 315. The outlet openings 315 can be uniform in a plan view of the receiving side 310 be arranged distributed over the circumference of the receiving side 310. This is shown in all figures, for example. However, other arrangements are also conceivable. The outlet openings 315 can be formed, for example, by two adjacent cooling fins 313, the side wall 320 and the fastening section 312. This is shown as an example in all figures. However, the outlet openings 315 can also be provided, for example, only in the fastening section 312 or in a cooling fin 313, for example as a bore or recess.

The inlet opening 325 and the outlet opening 315 can preferably be provided in a top view of the receiving side 310 in a preferably common section of the heat sink 300 between two adjacent cooling fins 313. This is shown by way of example in all of the figures, but is more clearly shown in FIGS. 3, 5, 6 and 8. For example, the outlet opening 315ab is arranged between a first cooling fin 313a and a second cooling fin 313b. The outlet opening (s) 325ab is also (are) arranged in a section between the two cooling fins 313a, 313b.

The inlet opening 325 and the outlet opening 315 are fluidly connected to one another via a cooling channel KK formed by the heat-conducting structure 330, in order to dissipate heat that has been transmitted from the illuminant 200 to the heat-conducting structure 330 by means of convection via the cooling channel KK. This is indicated by way of example in FIG. 1. It shows how cold air KL can flow into the heat sink 300 through the inlet opening 325 in the side wall 320 and leave it again as warm air WL via the outlet opening 315 in the receiving side 310, in order to absorb the heat absorbed structure 330 from the illuminant 200 Dissipate heat. Furthermore, it is also clear from this FIG. 1 that the heat generated by the operating devices 500 can also be dissipated via this convective heat transport. This makes it possible to produce a chimney effect, through which the cold air KL is drawn into the inlet opening 325, can rise upwards against the force of gravity due to a lower density of the cooling medium (air) and can escape through the outlet opening 315. The circumferential side wall 320 can further assist in the fact that the difference in density is locally more pronounced and in this way a stronger suction effect can occur. This effect can also be amplified by the heat from the electronic components 500, which provides additional energy, and consequently the difference in density can be greater. The heat generated by the illuminant 200 and the electronic components 500 can also be passed on to the side wall 320 by means of heat conduction in the heat sink 300, in order to be flowed around by the cold air KL and cooled in this way.

The heat sink 300 can have one or more cooling channels KK for this purpose. The heat sink 300 with several cooling channels KK is shown as an example in all the figures. However, this is by no means to be regarded as limiting. Rather, it is also conceivable that the cooling body 300 has only a single cooling channel KK, which connects all inlet openings 325 and all outlet openings 315 to one another in terms of fluid technology.

Preferably, an inlet opening 325 and an outlet opening 315 may correspond to one another, i.e. the openings can each be assigned to one another (structurally and / or functionally) (using the respective cooling channel KK). This is shown by way of example in FIGS. 1 and 3 to 5. An outlet opening 315 may also preferably correspond to a plurality of inlet openings 325. The outlet opening 325 can preferably be connected to the plurality of inlet openings 325 via the same cooling channel KK. This is shown by way of example in FIGS. 6 to 8. In addition, at least one inlet opening 325 can correspond to a plurality of outlet openings 315. This is shown by way of example in FIG. 6, in which the inlet opening 325c is assigned to two of the outlet openings 315. In this case, the inlet opening 325c can be fluidically connected, for example, to a plurality of outlet openings 315 via a plurality of cooling channels KK assigned to these outlet openings 315. The inlet opening 325c can in particular be provided below a cooling fin 313 on the side wall 320. However, it is also conceivable that the inlet opening (s) 325 and the outlet opening (s) 315 are provided (and arranged) on the heat sink 300 as desired and without any assignment. The cooling channel or channels KK are provided in the heat sink 300 in such a way that there is a fluidic connection.

The cooling channel KK can extend longitudinally between the receiving side 310 and the carrier 400. As shown by way of example in the figures, the cooling duct KK can in particular extend longitudinally orthogonally to the receiving side 310, but preferably orthogonally to the fastening section 312. In particular, the cooling channel KK can extend between the inlet opening 325 and the outlet opening 315. However, it is also conceivable that the cooling channel KK extends, for example, only in the heat-conducting structure 330.

The cooling duct KK can be delimited by the side wall 320 and the heat conducting structure 330. The cooling channel KK can preferably be delimited by the side wall 320 and two adjacent cooling fins 313. This is shown as an example in all figures. Alternatively or additionally, however, it is also conceivable that the cooling channel KK is designed as a recess in the heat-conducting structure 330. Alternatively or additionally, the cooling channel KK can be designed as a through hole in the heat conducting structure 330. The cooling channel KK can, for example, extend diagonally in the heat conducting structure 330 between the receiving side 310 and the receiving side 310. In this case, the cooling duct KK can extend from a section of the heat-conducting structure 330 near the receiving side 310 to the cooling body receiving space 370 or the side of the heat sink facing away from the receiving side 310 Extend heat sink 300. The inlet opening 325 and the outlet opening 325 can only be fluidly connected to the cooling channel KK.

It is also conceivable to provide an external ventilation unit, such as an electrically operated fan, in the carrier 400 in order to increase the cooling of the illuminant 200. Furthermore, it is also conceivable to use a gas or fluid as the cooling medium instead of air, with which, for example, larger amounts of heat can be transported than with.

The present invention is not restricted by the exemplary embodiments described above, provided that it is covered by the subject matter of the following claims. In particular, all features of the exemplary embodiments can be combined and exchanged with one another and with one another in any manner.

Claims

Expectations

1. lamp (100), in particular a lamp (100) for street lighting, comprising a lamp (200), in particular an LED, with a main light emitting direction (210), a carrier (400) for carrying the lamp (200), which with respect to the main light emission direction (210) is provided on the rear side of the illuminant (200), and a heat sink (300) which extends between the carrier (400) and the illuminant (200), the heat sink (300) having: o a Receiving side (310) with which the illuminant (200) is thermally coupled, o a heat-conducting structure (330), which extends away from the receiving side (310) against the main light emission direction (210) towards the carrier (400),

o a side wall (320) which completely surrounds the heat-conducting structure (330) laterally on the outside on the outside, the side wall (320) having at least one inlet opening (325) and the receiving side (310) having at least one outlet opening (315), which is connected by a through the

Thermally conductive structure (330) cooling channel (KK) are fluidly connected to one another in order to dissipate heat transferred from the illuminant (200) to the thermal conductive structure (330) by means of convection via the cooling channel (KK).

2. Luminaire (100) according to claim 1, wherein the side wall (320) and the heat-conducting structure (330) are flush with one another at least on the receiving side (310).

3. Light (100) according to one of claims 1 and 2, wherein the side wall (320) on the

Receiving side (310) facing away from the heat sink (300) flush with the heat-conducting structure (330) or protruding from the heat-conducting structure (330) against the main light-emitting direction (210), around a heat-sink receiving space (370) on the rear side of the heat-conducting structure (330) to be completely surrounded on the circumference.

4. Luminaire (100) according to any one of the preceding claims, wherein the inlet opening (315) is provided in a region of the side wall (320) which is laterally and / or to the rear of the heat conducting structure (330) with respect to the main light emission direction (210).

5. Luminaire (100) according to any one of the preceding claims, wherein the carrier (400) preferably on the side of the heat sink (300) preferably at least partially open to the heat sink (300) towards the carrier receiving space (470) for receiving electronic components (500) Operation of the lamp (200), wherein the carrier receiving space (470) preferably forms a coherent space with the heat sink receiving space (370).

6. luminaire (100) according to claim 5, wherein the carrier receiving space (470) toward the heat sink (300) is preferably delimited by a carrier side (430) of the carrier (400), the carrier side (430) preferably being open or having openings, in order to fluidically connect the carrier receiving space (470) to the heat sink (300), and / or wherein the carrier (400), preferably at least the carrier side (430), is made of a thermally conductive material.

7. Luminaire (100) according to one of claims 5 or 6, wherein the carrier receiving space (470) to the illuminant (200) is delimited by the heat sink (300), preferably completely covered, the carrier (400) preferably with the side wall (320) is mechanically and preferably also thermally coupled, and preferably the carrier side (430) is thermally coupled to the heat sink (300), in particular to the heat-conducting structure (330).

8. lamp (100) according to any one of the preceding claims, wherein the heat sink (300),

in particular the side wall (320), widening laterally outwards with increasing distance from the receiving side (310) to the carrier (400), the heat-conducting structure (330) in the heat sink (300) preferably being provided laterally in the center with respect to the side wall (320) is.

9. lamp (100) according to any one of the preceding claims, wherein the heat-conducting structure (330) for fastening the lamp (200) on the receiving side (310) has a fastening section (312) for the lamp (200), of which at least one cooling fin (313) extends laterally outwards to the side wall (320), the at least one cooling fin (313) preferably extending longitudinally between the receiving side (310) and the carrier (400), and the heat-conducting structure (330) preferably having a plurality of cooling fins ( 313), which in plan view of the receiving side (310) is preferably evenly distributed on the circumference of the Fastening section (312) are arranged, the fastening section (312) preferably being arranged centrally with respect to the plurality of cooling fins (313).

10. lamp (100) according to claim 9, wherein the inlet opening (325) and the outlet opening (315) in plan view of the receiving side (310) are provided in a preferably common portion of the heat sink (300) between two adjacent cooling fins (313).

11. Luminaire (100) according to one of the preceding claims, wherein the cooling channel (KK) is delimited by the side wall (320) and the heat-conducting structure (330), preferably by the side wall (320) and two adjacent cooling fins (313), the Cooling channel (KK) is preferably designed as a recess or as a through hole in the heat-conducting structure (330).

12. Light (100) according to one of the preceding claims, wherein the cooling channel (KK) extends longitudinally between the receiving side (310) and the carrier (400), preferably orthogonal to the receiving side (310), preferably to the fastening section (312) .

13. Luminaire (100) according to one of the preceding claims, wherein the side wall (320) is connected to the heat-conducting structure (330), preferably via the fastening section (312) or via the at least one cooling fin (313), and / or wherein preferably the Side wall (320) is thermally coupled to the heat-conducting structure (330).

14. Luminaire (100) according to any one of the preceding claims, wherein the heat sink (300) in

Top view of the receiving side (310) is symmetrical, in particular mirror-symmetrical or point-symmetrical, and / or has a polygonal or round cross-section, and / or the cooling body (300) is symmetrical in a top view of the side wall (320),

mirror-symmetrical, and / or polygonal, in particular trapezoidal, is formed.

15. Luminaire (100) according to any one of the preceding claims, wherein the side wall (320) on the side facing away from the heat-conducting structure (330) has a surface for influencing light, preferably an even, smooth or matt surface, or a reflector or is designed as a reflector .

16. Luminaire (100) according to one of the preceding claims, wherein the inlet opening (325) and / or the outlet opening (315) is / are designed as slots or recesses with a substantially round, circular or polygonal shape.

17. Luminaire (100) according to one of the preceding claims, wherein the heat sink (300) is formed in one piece, in particular the side wall (320) and the heat sink (300) are integrally formed with one another, or is formed in several parts.

18. Luminaire (100) according to one of the preceding claims, wherein the illuminant (200) is an LED, preferably a COB LED.

19. Luminaire (100) according to one of the preceding claims, the luminaire (100) further comprising an optical component (700) arranged in the main light emission direction (210) in front of the illuminant (200) for optically influencing the illuminant (200) has light emitted in the main light emitting direction (210), such as an optic, a lens and / or a reflector, for example for indirect light emitting to the surroundings, and / or the lamp (100) furthermore has a lampshade (800), which preferably spans the illuminant (200) at least partially and further preferably has or carries the optical component (s) (700).

20. Luminaire (100) according to one of the preceding claims, wherein the luminaire (100) further comprises at least one electronic component (500) for operating the lamp (200), in particular an operating device, such as a lamp driver, and / or wherein the lamp ( 100) furthermore has a base (600) on which the carrier (400) is arranged.