WO2020147697A1 - 一种相变散热设备 - Google Patents

一种相变散热设备 Download PDF

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Publication number
WO2020147697A1
WO2020147697A1 PCT/CN2020/071871 CN2020071871W WO2020147697A1 WO 2020147697 A1 WO2020147697 A1 WO 2020147697A1 CN 2020071871 W CN2020071871 W CN 2020071871W WO 2020147697 A1 WO2020147697 A1 WO 2020147697A1
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Prior art keywords
heat pipe
heat
phase transition
phase change
water cooling
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PCT/CN2020/071871
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English (en)
French (fr)
Inventor
周哲明
周发明
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周哲明
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Publication of WO2020147697A1 publication Critical patent/WO2020147697A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps

Definitions

  • the present invention relates to electronic equipment, in particular to the dissipation of heat generated by high-power electronic equipment such as servers, network equipment, and LED lights.
  • the heat pipe is an efficient radiator that uses the phase change process of the liquid medium to evaporate at the hot end and condense at the cold end to quickly conduct heat.
  • the inside of the heat pipe is pumped into a negative pressure state and filled with an appropriate liquid, which has a low boiling point and is easy to volatilize.
  • There is a liquid wick in the heat pipe which is made of capillary porous material.
  • One end of the heat pipe is the evaporating end, and the other end is the condensation end. When one end of the heat pipe is heated, the liquid in the capillary tube vaporizes rapidly.
  • the vapor flows to the other end under the power of thermal diffusion, and condenses at the cold end to release heat, and the liquid flows along the porous
  • the material flows back to the evaporation end by capillary action, and the cycle continues until the temperature at both ends of the heat pipe is equal, at which time the thermal diffusion of steam stops.
  • the uniform temperature plate is a flat-plate structure heat pipe, generally composed of upper and lower covers.
  • the lower cover of the uniform temperature plate is the evaporating end and is in contact with the heat source.
  • the upper cover of the uniform temperature plate is the condensing end.
  • Flat heat pipe
  • the heat pipe needs to be flattened to better contact the uniform temperature plate, which has a certain impact on the performance of the heat pipe, and each heat pipe needs to occupy a larger area of the uniform temperature plate.
  • the space utilization rate is not high, so the overall heat dissipation capacity of the radiator is limited.
  • the present invention proposes a phase change heat dissipation device solution.
  • a phase change heat dissipation device which is composed of a phase change cavity and a heat pipe.
  • the phase change cavity is a sealed cavity made according to the principle of heat pipe.
  • the surface of the phase change cavity has grooves for installing heat pipes or holes for inserting heat pipes. .
  • the evaporating end of the heat pipe is installed on the tank or inserted into the hole.
  • the surface refers to the surface wall of the phase change cavity, and the grooves or holes on the surface of the phase change cavity do not penetrate the surface wall.
  • the installation method of the water cooling component is to make the condensing end of the heat pipe fit the water cooling plate, or insert the condensing end of the heat pipe into the water cooling channel.
  • a phase change heat dissipation device The surface of the phase change cavity is provided with a groove for easy installation of a heat pipe, or a hole for easy insertion of the heat pipe, and the evaporating end of the heat pipe is installed on the groove or inserted into the hole.
  • the surface refers to the surface wall of the phase change cavity.
  • the grooves or holes on the surface of the phase change cavity do not penetrate the surface wall.
  • the air tightness of the phase change cavity is not affected by the grooves or holes.
  • the product has high reliability and can be independent The production cost is lower.
  • the heat pipe does not need to be flattened to be in good contact with the phase change cavity, which can protect the capillary structure of the heat pipe; when the heat pipe is inserted into the hole, each heat pipe occupies a small area, so more heat pipes can be inserted to improve the phase Variable cavity space utilization. Therefore, the device can effectively improve the heat dissipation efficiency, and can well solve the heat dissipation problem of high-power chips.
  • Fig. 1 is a schematic structural diagram of a phase change heat dissipation device according to the present invention.
  • Fig. 2 is a schematic perspective view of a phase change heat dissipation device according to the present invention.
  • Fig. 3 is a perspective schematic view of a phase change cavity of a phase change heat dissipation device according to the present invention.
  • Phase change cavity 1.
  • Heat pipe 3.
  • Surface of the phase change cavity 4.
  • Round hole 5.
  • Heat pipe evaporation end 6.
  • Heat pipe condensation end 7.
  • Heat sink 8.
  • a phase change heat dissipation device which is composed of a phase change cavity 1 and a heat pipe 2.
  • the surface 3 of the phase change cavity has a round hole 4 for inserting the heat pipe 2.
  • the evaporating end 5 of the heat pipe is inserted into the circular hole 4.
  • the cooling fin 7 is installed on the condensing end 6 of the heat pipe.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明涉及电子设备，特别是涉及服务器、网络设备、LED灯等高功率电子设备产生的热量的排散。一种相变散热设备，由相变腔体和热管组成，相变腔体的表面有方便安装热管的槽，或者有方便插入热管的孔。热管的蒸发端安装在槽上，或者插入孔内。热管的冷凝端安装散热片，或者安装水冷部件等外部散热器。水冷部件的安装方式是，使热管的冷凝端与水冷板贴合，或者使热管的冷凝端插入水冷通道。热管不需要压扁就能很好地与相变腔体接触，能保护热管的毛细结构；在热管插入孔内的情况下，每根热管占用相变腔体的面积很小，可以插入更多热管，提高相变腔体的空间利用率。因此，该设备可以有效地提高散热效率，可以很好地解决高功率芯片的散热问题。

Description

一种相变散热设备 技术领域
本发明涉及电子设备，特别是涉及服务器、网络设备、LED灯等高功率电子设备产生的热量的排散。
背景技术
热管是一种高效的散热器，利用液体介质在热端蒸发后在冷端冷凝的相变过程，使热量快速传导。热管内部是被抽成负压状态，充入适当的液体，这种液体沸点低，容易挥发。热管内有吸液芯，其由毛细多孔材料构成。热管一端为蒸发端，另外一端为冷凝端，当热管一端受热时，毛细管中的液体迅速汽化，蒸气在热扩散的动力作用下流向另外一端，并在冷端冷凝释放出热量，液体再沿多孔材料靠毛细作用流回蒸发端，如此循环不止，直到热管两端温度相等，此时蒸汽热扩散停止。
均温板是一种平板结构的热管，一般由上下盖组成，均温板的下盖是蒸发端，与发热源接触，均温板的上盖是冷凝端，表面安装散热鳍片，或者安装扁平热管。
受制于均温板的扁平结构，热管需要压扁才能更好的与均温板接触，对热管的性能有一定的影响，而且每根热管需要占用均温板较大的面积，均温板的空间利用率不高，因此散热器的整体散热能力受到限制。
发明内容
为了提高散热效率，本发明提出一种相变散热设备方案。
本实用新型解决其技术问题所采用的技术方案是：
一种相变散热设备，由相变腔体和热管组成，相变腔体是根据热管原理制作的密封腔体，相变腔体的表面有方便安装热管的槽，或者有方便插入热管的孔。热管的蒸发端安装在槽上，或者插入孔内。表面是指相变腔体的表壁，相变腔体表面的槽或孔不穿透表壁。热管的冷凝端安装散热片，或者安装水冷部件等外部散热器。水冷部件的安装方式是，使热管的冷凝端与水冷板贴合，或者使热管的冷凝端插入水冷通道。
本实用新型的有益效果是：
一种相变散热设备，相变腔体的表面有方便安装热管的槽，或者有方便插入热管 的孔，热管的蒸发端安装在槽上，或者插入孔内。表面是指相变腔体的表壁，相变腔体表面的槽或孔不穿透表壁，相变腔体不因槽或孔影响其气密性，产品的可靠性高，而且可以单独生产，生产成本较低。热管不需要压扁就能很好地与相变腔体接触，能保护热管的毛细结构；在热管插入孔内的情况下，每根热管占用的面积很小，可以插入更多热管，提高相变腔体的空间利用率。因此，该设备可以有效地提高散热效率，可以很好地解决高功率芯片的散热问题。
附图说明
图1是根据本发明的相变散热设备的结构示意图。
图2是根据本发明的相变散热设备的立体示意图。
图3是根据本发明的相变散热设备的相变腔体的立体示意图。
图中，1.相变腔体，2.热管，3.相变腔体的表面，4.圆孔，5.热管蒸发端，6.热管冷凝端，7.散热片。
具体实施方式
下面结合附图和实施例对本发明进一步说明。
如图1，2，3所示：一种相变散热设备，由相变腔体1和热管2组成，相变腔体的表面3有方便插入热管2的圆孔4。热管的蒸发端5插入圆孔4。热管的冷凝端6安装散热片7。

Claims (8)

  1. 一种相变散热设备，由相变腔体和热管组成，其特征是：所述相变腔体的表面有方便安装所述热管的孔，所述孔不穿透所述相变腔体的表壁。
  2. 根据权利要求1所述的散热设备，其特征是：所述热管的蒸发端插入所述孔内，所述热管的冷凝端安装散热片。
  3. 根据权利要求1所述的散热设备，其特征是：所述热管的蒸发端插入所述孔内，所述热管的冷凝端安装水冷板。
  4. 根据权利要求1所述的散热设备，其特征是：所述热管的蒸发端插入所述孔内，所述热管的冷凝端插入水冷通道。
  5. 一种相变散热设备，由相变腔体和热管组成，其特征是：所述相变腔体的表面有方便安装所述热管的槽，所述槽不穿透所述相变腔体的表壁。
  6. 根据权利要求5所述的散热设备，其特征是：所述热管的蒸发端安装在所述槽上，所述热管的冷凝端安装散热片。
  7. 根据权利要求5所述的散热设备，其特征是：所述热管的蒸发端安装在所述槽上，所述热管的冷凝端安装水冷板。
  8. 根据权利要求5所述的散热设备，其特征是：所述热管的蒸发端安装在所述槽上，所述热管的冷凝端插入水冷通道。
PCT/CN2020/071871 2019-01-18 2020-01-14 一种相变散热设备 WO2020147697A1 (zh)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070199340A1 (en) * 2003-08-25 2007-08-30 Isothermal Systems Research, Inc. Multi-chamber spray cooling system
CN201387265Y (zh) * 2009-01-20 2010-01-20 北京中视中科光电技术有限公司 一种散热装置
CN107525425A (zh) * 2017-08-16 2017-12-29 四川建源节能科技有限公司 提高使用寿命的换热装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070199340A1 (en) * 2003-08-25 2007-08-30 Isothermal Systems Research, Inc. Multi-chamber spray cooling system
CN201387265Y (zh) * 2009-01-20 2010-01-20 北京中视中科光电技术有限公司 一种散热装置
CN107525425A (zh) * 2017-08-16 2017-12-29 四川建源节能科技有限公司 提高使用寿命的换热装置

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