WO2020143355A1 - 一种具有可动结构的植入式传感器/执行器及其封装方法 - Google Patents

一种具有可动结构的植入式传感器/执行器及其封装方法 Download PDF

Info

Publication number
WO2020143355A1
WO2020143355A1 PCT/CN2019/122088 CN2019122088W WO2020143355A1 WO 2020143355 A1 WO2020143355 A1 WO 2020143355A1 CN 2019122088 W CN2019122088 W CN 2019122088W WO 2020143355 A1 WO2020143355 A1 WO 2020143355A1
Authority
WO
WIPO (PCT)
Prior art keywords
protective layer
sensor
actuator
coating
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/122088
Other languages
English (en)
French (fr)
Inventor
杨兴
姚嘉林
王博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tsinghua University
Original Assignee
Tsinghua University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tsinghua University filed Critical Tsinghua University
Publication of WO2020143355A1 publication Critical patent/WO2020143355A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • B81C1/00373—Selective deposition, e.g. printing or microcontact printing

Definitions

  • the present application relates to the technical field of micro-nano manufacturing, in particular to an implantable sensor or actuator with a movable structure and a packaging method thereof.
  • Packaging technology plays an important role in the field of implantable sensors or actuators. It can even be said that without proper packaging technology, there will be no implantable sensors or actuators for clinical application.
  • all implantable sensors or actuators including a large class of implantable sensors or actuators with a movable structure, such as mechanical quantity sensors, actuators, etc., because of the movable structure, its movable parts are working It will be repeatedly deformed by the action of cyclic load, which will drive the protective coating material to repeatedly deform together, so that the protective coating material is prone to delamination, fatigue failure and other problems, making this large class of implantable sensors or actuators Packaging technology puts forward higher requirements.
  • an implanted intraocular pressure sensor As an example, its packaging needs to meet at least two conditions at the same time.
  • One is that the packaged intraocular pressure sensor needs to meet the requirements of high precision, small size, high sensitivity, etc.
  • the main guarantee condition is that the packaging structure cannot have a large impact on the movement of the movable structure that plays a role in the sensor; the second is that the packaging structure of the intraocular pressure sensor must meet the stability requirements of long-term implantation (especially to prevent Long-term stability affected by gas or liquid).
  • polymer materials such as parylene have been used to encapsulate implantable sensors or actuators.
  • polymer materials such as parylene have been used to encapsulate implantable sensors or actuators.
  • due to the general density of polymer materials it is necessary to achieve better protection against gas or liquid intrusion. The effect requires a large thickness.
  • this method only has a good protection effect on the gas or liquid in the state of large molecular clusters, and it is difficult to block the invasion of the gas or liquid in the state of small molecular clusters.
  • atomic layer deposition processes to produce nanometer-thick dense oxides, nitrides, fluorides, metals, carbides, sulfides, and other materials for waterproof packaging of sensors or actuators.
  • the liquid has a good protection effect, but it has a bad protection effect on the gas or liquid in the state of large molecular clusters, and the dense oxide and other materials have a large Young's modulus and hardness, and are suitable for micro sensors with movable structures. Or the performance of the actuator has a greater impact.
  • the implanted sensor or actuator will be affected by the temperature, humidity, corrosive gas or liquid, vibration and other factors of the external environment during work, if the appropriate packaging and protection are not carried out, the sensor or actuator will be affected.
  • the accuracy index of the device has a greater impact.
  • the above two packaging methods can be combined to take advantage of micro-coating and nano-coating respectively, they are implantable sensors or actuators (especially implantable sensors or actuators with movable structures, such as Implanted intraocular pressure sensor, etc.) provides a suitable packaging structure and packaging process to achieve a new type of implant with good shielding gas or liquid effect, ultra-thin size, and little impact on the performance of sensors or actuators with movable structures
  • the packaging method can not only compensate for the gaps and hysteresis in the sensor or actuator after packaging, but also reduce the impact of the external environment on the accuracy of the sensor or actuator, thereby improving the sensor or actuator with a movable structure. Accuracy is of great significance to the research and application of implantable sensors or actuators with movable structures.
  • the main purpose of this application is to provide an at least two-layer packaging method for implantable sensors or actuators with a movable structure, which can meet both the small packaging size and the long-term stability against the influence of gas or liquid At the same time, it has little effect on the sensitivity and other indicators of implantable sensors or actuators with movable structures, and can improve the accuracy of sensors or actuators with movable structures.
  • the present application provides an implantable sensor or actuator with a movable structure for implantation in a living body, wherein the implantable sensor or actuator with a movable structure It includes a sensor or actuator body and a packaging structure provided on the outer surface of the sensor or actuator body, wherein the packaging structure includes a first protective layer coated on the outer surface of the sensor or actuator body and a A second protective layer on the outer surface of the first protective layer, and one of the first protective layer and the second protective layer is a dense nano-scale coating, the first protective layer and all The other of the second protective layers is a micron-scale coating that prevents gas or influence.
  • the first protective layer is a dense nano-scale coating
  • the second protective layer is a micro-scale coating
  • the first protective layer is a micron-level coating
  • the second protective layer is a nano-level coating
  • at least a portion of the second protective layer is filled in the first protection Layer of micropores.
  • At least one third protective layer is further provided on the outer surface of the second protective layer, and the third protective layer is the nano-scale coating or the micro-scale coating.
  • the first protective layer and the second protective layer each independently include a plurality of sublayers, and the plurality of sublayers satisfy at least one of the following conditions: a plurality of the sublayers
  • the materials of the layers are not completely the same; the forming methods of the multiple sub-layers are not completely the same.
  • the implantable sensor or actuator with a movable structure satisfies at least one of the following conditions: the outer surface of the sensor or actuator body and the outer surface of the first protective layer At least one of them has a micro-nano structure that can increase the surface area; there is a first coupling agent layer between the sensor or actuator body and the first protective layer; the first protective layer and the second There is a second coupling agent layer between the protective layers.
  • the dense nano-scale coating is an atomic layer deposition layer or a vapor deposition layer.
  • the micron-scale coating layer is a vapor-deposited layer, an evaporation-deposited layer, a sputter-deposited layer, or a spray-deposited layer.
  • the implantable sensor or actuator with a movable structure may specifically be an implantable pressure sensitive sensor or actuator, and more specifically may be an implantable intraocular pressure sensor.
  • the thickness of the dense nano-scale coating is between 0.1 and 1000 nanometers. In some specific embodiments of the present application, the thickness of the micron coating is between 0.1 and 3000 microns.
  • At least the second protective layer is formed of a biocompatible material.
  • the present application provides a packaging method for the implantable sensor or actuator with a movable structure described above, which includes the steps of:
  • the method further includes at least one of the following steps: performing plasma surface modification treatment or coupling agent surface modification treatment on the outer surface of the sensor or actuator body; The outer surface of the first protective layer is subjected to the plasma surface modification treatment or the coupling agent surface modification treatment.
  • the implantable sensor or actuator with a movable structure includes a chip and a substrate for mounting the chip, and before step S40, further includes the steps of:
  • the dense nano-scale coating is formed on the outer surface of the sensor or actuator body using atomic layer deposition technology or vapor deposition technology.
  • the micron-level coating is formed by using vapor deposition technology, evaporation technology, sputtering technology, and spraying technology.
  • one or more of oxides, nitrides, fluorides, metals, carbides, sulfides, and polymers are used to form the dense nano-scale coating.
  • one or more of polymers, oxides, sulfides, nitrides, carbides, and ceramics are used to form the micron-scale coating.
  • the implantable sensor or actuator with a movable structure and its packaging method of the present application can simultaneously meet the requirements of both the small package size of the sensor or the actuator and the long-term stability to prevent the influence of gas or liquid, thereby satisfying the requirement of having a movable structure
  • the long-term implantation and normal operation of the sensor or actuator are required.
  • the implantable sensors or actuators with movable structures of the present application utilize dense nano-scale coatings (such as atomic layer deposition layers, vapor deposition layers) and micron-scale coatings (such as chemical vapor deposition layers, etc.). Synergistic effect makes the corresponding sensors or actuators with movable structure have good stability against the influence of gas or liquid, where the micron-level coating can prevent the larger molecules of gas or liquid (such as more than 10 gas or liquid Erosion of large molecular clusters composed of molecules), the dense nano-scale coating can prevent the erosion of gas molecules or small molecular clusters composed of less than 10 gas or liquid molecules, thus implementing implantable sensors or movable structures
  • the actuator provides double protection against the influence of gas or liquid, while significantly reducing the package size of the implantable sensor or actuator with a movable structure.
  • the packaging structure provided by the present application can not only compensate for the gaps and hysteresis in the sensor or actuator, but also isolate the sensor or actuator in the external environment.
  • the accuracy of the actuator has a harmful effect on the medium, thereby improving the accuracy of the sensor or actuator with a movable structure.
  • the package structure provided in this application has little effect on the movement of the movable structure, so that the high sensitivity of the sensor or actuator with the movable structure can be guaranteed to a large extent.
  • FIG. 1 is a schematic diagram of the appearance of an implantable sensor or actuator with a movable structure according to a preferred embodiment of the present application, in which area A is partially cut away;
  • FIG. 2 is a partially enlarged schematic view of area A in FIG. 1;
  • FIG. 3 is a flowchart of a preferred packaging method of an implantable sensor or actuator with a movable structure according to a preferred embodiment of the present application;
  • FIG. 4 is a schematic diagram of the chip involved in a preferred embodiment of the present application.
  • FIG. 5 is a schematic diagram of the chip of FIG. 4 attached to a substrate
  • FIG. 6 is a schematic diagram of the outline of a chip substrate assembly formed by wire bonding the chip and the substrate;
  • FIG. 7 is a schematic diagram of the chip substrate assembly of FIG. 6 after the first protective layer is formed, wherein the area B is partially cut away;
  • FIG. 8 is a partially enlarged schematic view of area B in FIG. 7.
  • an implantable sensor or actuator having a movable structure which is used for implantation into a living body (such as a human).
  • the implantable sensor or actuator having a movable structure includes a sensor or actuator body and an outer surface (or outer periphery, outer surface and herein) provided on the outer body of the sensor or actuator body Peripheral can be used interchangeably) packaging structure.
  • the implantable sensor or actuator with a movable structure includes a chip 10 and a substrate 20 for mounting the chip 10, so the sensor or actuator body is a chip substrate assembly That is, the chip 10 and the substrate 20 are bonded to each other to form an assembly.
  • the packaging structure includes a first protective layer 40 coated on the outer surface of the sensor or actuator body and a second protective layer 50 on the outer surface of the first protective layer 40, wherein the first protection One of the layer 40 and the second protective layer 50 is a dense nano-scale coating, and the other is a micro-scale coating.
  • the first protective layer 40 is a dense nano-scale coating
  • the second protective layer 50 is a micro-scale coating.
  • the first protective layer 40 is a micron-level coating
  • the second protective layer 50 is a dense nano-scale coating.
  • the implantable sensor or actuator satisfies at least one of the following conditions: at least one of the outer surface of the sensor or actuator body and the outer surface of the first protective layer There is a micro-nano structure on the surface that can increase the surface area; there is a first coupling agent layer between the sensor or actuator body and the first protective layer; there is between the first protective layer and the second protective layer The second coupling agent layer.
  • the above-mentioned micro-nano structure that can increase the surface area can form multiple anchor points to make the coating adhere better and improve the adhesion of the coating, while the coupling agent layer (including the first coupling agent layer and the first The second coupling agent layer) can enhance the adhesion of the coating by intermolecular forces, hydrogen bonds, chemical bonds, etc., and meet the use requirements of the movable parts for coating deformation, fatigue and other aspects.
  • At least one third protective layer is further provided on the outer surface of the second protective layer, and the third protective layer is the nano-scale coating or the micro-scale coating.
  • the specific stacking order is not particularly limited, and can be freely stacked and combined, specifically, for example, nano-scale coating If the layer is A layer and the micron coating is B layer, you can set the protection of the stacking order of ABA, ABB, BAB, BAA, ABAA, ABAB, BAAA, BABA, etc. on the surface of the sensor or actuator with a movable structure Layer, no longer elaborate here.
  • the biocompatible coating used to prevent the influence of gas or liquid on the contact surface of the biomedical device is mainly a polymer coating, and its function is to improve the interface compatibility between the corresponding biomedical device and the organ in the living body.
  • the main reason why the coating method of the related art cannot maintain the effectiveness of the sensor or actuator against gas or liquid for a long time is that the current coating method mainly uses a single coating as the sensor or implementation The protective layer of the device, and the single coating due to its own material properties and other limitations, the effect of shielding gas or liquid is limited.
  • a single parylene polymer coating such as parylene provides good protection against large molecules in gas or liquid, but it has poor protection against small molecules in gas or liquid; a single coating such as nanoscale oxide
  • the dense structure can better protect small molecules in gas or liquid, the protection of large molecules in gas or liquid is poor, and due to its high Young's modulus and hardness, it is suitable for sensors or actuators with movable structures.
  • the performance of the sensitive or moving parts of the device will have a greater impact.
  • the movable parts will be repeatedly deformed by the action of cyclic load during operation, and then the protective coating materials will be repeatedly deformed together, so that the protective coating materials are prone to problems such as delamination and fatigue failure.
  • water in nature including living organisms
  • water molecule clusters commonly known as "water molecule clusters”.
  • water molecule clusters composed of more than 10 water molecules are called macromolecular clusters, which have poor activity and cannot break through the protection of the above polymer coating.
  • macromolecular clusters exist in a large amount in living organisms, accounting for The vast majority of water; and water molecule clusters composed of less than 10 water molecules are called small molecule clusters, which have large activity and small volume.
  • the dense nano-scale coating in this application is a dense coating with a thickness of nanometers, which can block the penetration of small molecular clusters; the micrometer-scale coating is a coating with a thickness of micrometers to prevent the influence of gas or liquid.
  • the density is lower than that of a dense nano-scale coating, which has a limited barrier to penetration of small molecular clusters, but can effectively block the penetration of large molecular clusters.
  • the packaging structure in this application can not only compensate for the gaps and hysteresis in sensors or actuators with movable structures, but also isolate harmful media in the external environment that affect the accuracy of sensors or actuators with movable structures. This improves the accuracy of sensors or actuators with movable structures.
  • the present application is provided with a first protective layer and a second protective layer on the outer surface of the sensor or actuator body, and in a specific embodiment, the first protective layer is a dense nano-scale coating, the second protection The layer is a micron coating, where the micron coating is used to block the penetration of large molecular clusters (the vast majority of water molecules are macromolecular clusters), and the dense nanoscale coating is used to block the penetration of small molecular clusters.
  • the first protective layer is a micron-level coating
  • the second protective layer is a dense nano-level coating
  • the dense nano-level coating serves as a first line of defense on the periphery for At the same time blocking the penetration of small and large molecular clusters
  • the micron coating acts as a second line of defense inside, used to continue to block the penetration of large molecular clusters in the case of partial failure of the first line of defense, therefore, in the implant
  • the dense nano-scale coating on the periphery fails locally after long-term work, due to the presence of the micro-scale coating, even a small amount of small molecular clusters may penetrate into the micro-scale through the local failure At the coating, it will still take a long time to break through to the chip surface.
  • the dense nano-scale coating can penetrate into the pores of the micro-scale coating during the formation process , Thereby forming a three-dimensional second protective layer.
  • the dense nano-scale coating surface as the first line of defense fails locally, the small molecular groups are still difficult to penetrate into the micro-scale coating layer.
  • the long-term working stability and reliability of implantable sensors or actuators with movable structures can be guaranteed.
  • the packaging structure of the implantable sensor or actuator with a movable structure proposed by the present application can withstand the test of long-term implantation to prevent the influence of gas or liquid, thereby meeting the stability requirements.
  • the packaging structure in this application can not only compensate for the gaps and hysteresis in sensors or actuators with movable structures, but also isolate harmful media in the external environment that affect the accuracy of sensors or actuators with movable structures. This improves the accuracy of sensors or actuators with movable structures.
  • the package structure of the implantable sensor or actuator with a movable structure proposed in the present application may only include two ultra-thin coating layers of micron and nanometer levels, respectively, compared with the related art Implanted packaged sensors or actuators such as housings will be significantly reduced in size, which is very important for the application of implantable sensors or actuators with movable structures.
  • the implantable sensor or actuator with a movable structure of the present application can meet both the requirements of small package size and long-term stability against the influence of gas or liquid, and can meet the implantable sensor with a movable structure
  • actuators such as pressure sensitive sensors or actuators, especially intraocular pressure sensors, are required for long-term implantation and normal operation.
  • the sensitivity of the movable structure depends on the sensitivity of the movable structure when it moves (for example, when the pressure-sensitive diaphragm is deformed).
  • the external of the movable structure Packaging should not hinder the movement of the movable structure itself.
  • the dense nano-scale coating and micro-scale coating can be directly coated on the surface of the corresponding movable structure. Because the thickness of the two coatings to prevent the influence of gas or liquid is very thin, the coating on the movable structure The hindrance of the movement is very small, so it will only have a small effect on the sensitivity of the sensor or actuator. And because the sensor or actuator has a movable structure, the adhesion of the coating is also high.
  • the application of this application has a movable structure.
  • Implanted sensors or actuators, dense nano-scale coatings and micro-scale coatings can be firmly attached to the surface of the sensor or actuator body, and will not cause delamination, cracking and shedding during the action of the sensor or actuator. Defects such as damage.
  • the package structure of this application can not only compensate for the gaps and hysteresis in the sensors or actuators with movable structures, but also isolate harmful media in the external environment that affect the accuracy of sensors or actuators with movable structures, thereby improving The accuracy of sensors or actuators with a movable structure.
  • the dense nanoscale coating layer may be an atomic layer deposition layer or a vapor deposition layer, but is not limited to an atomic layer deposition layer or a vapor deposition layer; the micron coating layer may be a chemical vapor phase
  • the deposited layer, the evaporated deposited layer, the sputtered deposited layer or the sprayed deposited layer but is not limited to these listed kinds of deposited layers.
  • Atomic layer deposition technology is a method that can deposit substances layer by layer in the form of monatomic film.
  • the chemical reaction of a new layer of atomic film is directly related to the previous layer. This way allows only one layer of atoms to be deposited per reaction.
  • a protective coating that meets the requirements to prevent the influence of gas or liquid can be obtained.
  • the thickness of the dense nano-scale coating layer (specifically, it may be an atomic layer deposition layer) is between 0.1 and 1000 nanometers, and specifically may be 0.5 to 400 nanometers, such as 300 nanometers.
  • the density of the atomic layer deposition layer can well guarantee its blocking of small molecular clusters.
  • the material used to form the dense nano-scale coating may be any material that prevents the influence of gas or liquid, such as oxides, nitrides, and fluorides , Metals, carbides, sulfides or combinations thereof.
  • the material used to form the micron-scale coating may be any material that prevents the influence of gases or liquids, such as polymers, oxides, sulfides, nitrides, carbides, ceramics, or their Combination etc.
  • the first protective layer and the second protective layer each independently include a plurality of sublayers, and the plurality of sublayers satisfy at least one of the following conditions: a plurality of the sublayers
  • the materials of the layers are not completely the same; the forming methods of the multiple sub-layers are not completely the same.
  • different materials and/or different processes may be used to form the dense nano-scale coating, and similarly, different materials and/or different processes may also be used to form the micro-scale coating. Taking a micron coating as an example, the micron coating itself may have different materials and/or properties in the thickness direction.
  • the same material and different processes may be used to form the micron-level coating, different materials and different processes may be used to form the micron-level coating, or different materials and the same process may be used
  • the micron coating is formed so as to fully utilize the advantages of different materials and/or different processing methods.
  • silicon carbide may be used to deposit a layer with a thickness of 2 microns to prevent the influence of gas or liquid, and then parylene is used to deposit a layer with a thickness of 2 microns to prevent gas or liquid.
  • Liquid-affected coatings, these two coatings that prevent gas or liquid effects together constitute the micron coating described in this application. In this way, both the density and stability of the coating to prevent the influence of gas or liquid can be improved, and the hydrophobicity of parylene can be used to further improve the ability of the coating to prevent the influence of gas or liquid.
  • the thickness of the micron-level coating (which may be the second protective layer 50, such as a chemical vapor deposition layer, an evaporation deposition layer, or a sputter deposition layer) is between 0.1 and 3000 microns, specifically It can be between 1 and 100 microns, for example 4 microns.
  • the implantable sensor or actuator with a movable structure of the present application may be any kind of implantable sensor or actuator.
  • the implantable sensor or actuator having a movable structure includes, for example, an implantable mechanical quantity sensor and an implantable actuator.
  • mechanical quantity sensors include, for example, pressure sensors, tactile sensors, acceleration sensors, gyroscopes (or angular velocity sensors), flow sensors, etc., which use their movable structure to convert mechanical quantities into stress and deformation of the movable structure during operation. Or changes in parameters such as resonance frequency, and then convert these changes into electrical quantities.
  • a piezoresistive pressure sensor includes a silicon diaphragm carrying the measured pressure and the piezoresistive surface of the diaphragm.
  • the silicon diaphragm acts as a transducing element under the action of the measured pressure Deformation occurs, generating stress and strain; and piezoresistive changes the change of strain into the change of resistance value, and the change of resistance is measured by the circuit to measure the pressure.
  • IOP sensors are a typical type of pressure sensitive sensors or actuators.
  • actuators are also called drivers or actuators, such as micropumps, microvalves, micromotors, microswitches, etc., which work to convert control signals and energy into controllable motion and power output of a movable structure, thereby The actuator performs external work under the control signal.
  • the implantable sensor or actuator with a movable structure of the present application by providing an integrated coating on the outer surface of the sensor or actuator body, the packaged mechanical quantity sensor or actuator sensor or actuator body A layer of dense, thin and reliable coating on the surface to prevent the influence of gas or liquid is deposited on the surface.
  • the encapsulation coating structure can not only meet the ability to prevent the influence of gas or liquid, but also does not affect the sensor or actuator indicators (such as sensitivity, stability Sex, etc.). In addition, it can make up for gaps and hysteresis in sensors or actuators, and can also isolate harmful media that affect the accuracy of sensors or actuators in the external environment, thereby improving the accuracy of sensors or actuators.
  • the ideal size should be in the order of millimeters.
  • the size of the sensor or actuator obtained by the packaging method of the related art is generally in the millimeter level and above, mainly because the existing packaging structure is too large, for example, the ceramic or glass package shell is too thick.
  • the package structure size of the implantable intraocular pressure sensor of the present application is very small, for example, the package can be completed only by means of the coating from the nanoscale to the micrometer scale (such as 100 nanometers to 4000 micrometers), which satisfies the gas prevention or long-term implant The ability of the liquid to influence makes the overall size of the packaged intraocular pressure sensor almost unchanged.
  • At least the second protective layer 50 is formed of a biocompatible material; specifically, both the first protective layer 40 and the second protective layer 50 are made of a biocompatible material form. Therefore, the outer surface of the second protective layer 50 does not need to be biocompatible, so as to reduce the cost and shorten the time used in the packaging process.
  • a biocompatible material can also be provided on the outermost layer of the packaging structure (ie, the outer surface of the second protective layer 50) Coating to meet the biocompatibility requirements of implanted organisms.
  • the implantable sensors or actuators with movable structures of the present application utilize dense nano-scale coatings (such as vapor-deposited layers, atomic layer deposition layers) and micro-scale coatings (such as chemical vapor-deposited layers, etc.). Synergistic effect, so that the corresponding implantable sensors or actuators with movable structures have good ability to prevent the influence of gas or liquid and the stability of implantation in the body.
  • the micron-level coating can prevent gas or liquid molecules (such as many Due to the erosion of large molecular clusters composed of 10 water molecules, the dense nano-scale coating can prevent the erosion of water vapor molecules or small molecular clusters composed of less than 10 water molecules, thereby preventing the implantable type with a movable structure.
  • Sensors or actuators provide double protection against the effects of gas or liquid, while significantly reducing the package size of implantable sensors or actuators with movable structures.
  • FIG. 3 a packaging method for the implantable sensor or actuator having a movable structure described above, as shown in FIG. 3, which includes the steps of:
  • a first protective layer 40 on the outer surface of the sensor or actuator body.
  • atomic layer deposition technology may be used to form an atomic layer deposition layer on the sensor or actuator body, that is, a dense nano-scale coating , Get the structure shown in Figure 7 and Figure 8;
  • a second protective layer 50 on the outer surface of the first protective layer 40.
  • a chemical vapor deposition technique, a vapor deposition technique, a sputter deposition technique, or a spray technique can be used on the first protective layer
  • the second protective layer 50 that is, a micron-level coating is formed on the outer surface of 40 to obtain the structure shown in FIGS. 1 and 2.
  • the packaging of the implantable sensor or actuator has been completed after the end of this step.
  • the packaging method of the present application can be completed mainly by two steps of atomic layer deposition and chemical vapor deposition (or evaporation deposition, or sputter deposition, or spray coating, etc.), compared with the use of glass, ceramics, and metal in related technologies
  • the packaging method such as the packaging shell has the advantages of high packaging efficiency, low cost, and small size after packaging.
  • the sensor or actuator body of the implantable sensor or actuator with a movable structure may be placed in the atomic layer deposition chamber, which will prevent the influence of gas or liquid
  • the coating of the layer is deposited layer by layer on the surface of the sensor or actuator body in the form of a monoatomic film.
  • any material that prevents the influence of gas or liquid such as one or more of oxides, nitrides, fluorides, metals, carbides, and sulfides (such as a combination of the foregoing materials) may be used to form The first protective layer (such as an atomic layer deposition layer).
  • tantalum oxide material may be used, for example, the sensor or actuator body is placed in an atomic layer deposition chamber, and the tantalum oxide coating is deposited layer by layer in the form of a monoatomic film
  • specific parameters include, for example, 3000 cycles, a thickness of 300 nm, and so on.
  • the method before step S40, further includes: performing plasma surface modification treatment or coupling agent surface modification treatment on the outer surface of the sensor or actuator body.
  • plasma can be used to treat the surface of the sensor or actuator body.
  • a micro-nano structure that can increase the surface area can be formed on the surface of the sensor or actuator body.
  • it can play a role on the surface of the sensor or actuator body.
  • the plasma surface modification treatment may be a plasma cleaning step or a plasma treatment step alone.
  • a layer of a coupling agent may be formed on the surface of the sensor or actuator body by deposition, spraying, coating, etc. to improve the first protective layer and the sensor or actuator body Adhesion between.
  • one or more compounds containing element constituting the thin film, elemental gas, etc. may be passed into the implantable sensor or actuator (such as implant Type intraocular pressure sensor) in the reaction chamber, which is deposited on the surface of the implantable sensor or actuator (such as an implantable intraocular pressure sensor) with a movable structure after the gas phase chemical reaction processed in step S40 to prevent the influence of gas or liquid film.
  • implantable sensor or actuator such as implant Type intraocular pressure sensor
  • the reaction chamber which is deposited on the surface of the implantable sensor or actuator (such as an implantable intraocular pressure sensor) with a movable structure after the gas phase chemical reaction processed in step S40 to prevent the influence of gas or liquid film.
  • any material that prevents the influence of gas or liquid such as one or more of polymers, oxides, sulfides, nitrides, carbides, and ceramics (such as the combination of the foregoing materials) may be used to form The second protective layer (such as a chemical vapor deposition layer).
  • parylene material may be used, for example, the sensor or actuator body processed in step S40 is placed in the deposition chamber, and the parylene coating is deposited uniformly in the step
  • specific parameters include, for example, a deposition temperature of room temperature, a thickness of 40 microns, and a deposition time of about 10 hours, and so on.
  • the method further includes: performing plasma surface modification treatment or coupling agent surface modification treatment on the surface of the first protective layer.
  • plasma can be used to treat the surface of the first protective layer.
  • a micro-nano structure that can increase the surface area can be formed on the surface of the first protective layer, and on the other hand, the surface of the first protective layer can be activated.
  • the formed second protective layer can form a hydrogen bond, a chemical bond, etc. between the surface of the first protective layer to improve the adhesion between the second protective layer and the first protective layer.
  • the plasma surface modification treatment may be a plasma cleaning step or a plasma treatment step alone.
  • a coupling agent (specifically, such as a silane coupling agent) layer may be formed on the surface of the first protective layer by deposition, spraying, coating, etc. to increase the distance between the second protective layer and the first protective layer Of adhesion.
  • the implantable sensor or actuator with a movable structure includes a chip 10 and a substrate 20 for mounting the chip 10, as shown in FIG. 3, before step S40, it may further include steps:
  • SMD the chip 10 after cleaning is attached to the substrate 20, as shown in FIG. 5;
  • Wire bonding wire bonding the chip 10 to the substrate 20, for example, through metal wires 30, 31, 32, and 33, as shown in FIG. 6, after the completion of this step, the Apply for the so-called sensor or actuator body.
  • FIG. 4 Exemplarily, the external structure of the chip 10 is shown in FIG. 4.
  • step S10 the main purpose of step S10 is to clean the surface of the chip 10, for example, the chip can be immersed in an acetone solution for ultrasonic cleaning for several minutes to tens of minutes (such as 20 minutes), and then the chip is immersed in the isopropyl alcohol solution Ultrasonic cleaning for several minutes to tens of minutes (such as 20 minutes), or directly using plasma cleaning and other methods to clean.
  • the cleaned chip 10 may be pasted on the substrate 20 by a method such as adhesive bonding sheet, conductive adhesive bonding, Au-Si alloy eutectic method, Pb-Sn alloy patch.
  • step S30 the electrode lead pads on the chip 10 and the outer lead pads of the base of the substrate 20 can be specifically connected with a metal wire.
  • the chip 10 and the substrate 20 can be leaded by methods such as hot pressing, thermosonic and ultrasonic. Bond.
  • an adhesive protection step may be included: that is, a protective adhesive layer is coated on at least the periphery of each metal lead of the sensor or actuator body to protect the chip 10 and each metal lead 30 , 31, 32, 33 are not damaged during the pressure measurement.
  • the protective glue used in this step may be any suitable glue material or polymer material, such as parylene, silicone, PET, PVC, or a combination thereof.
  • this application adopts the method of directly surface-treating the sensor or actuator body to realize the packaging of the implantable sensor or actuator with a movable structure, on the one hand, it can significantly reduce the packaging size and the packaging thickness, on the other hand It also reduces the number of process steps, and at the same time, it is easy to obtain good biocompatibility and stability for long-term implantation in the body to prevent the influence of gas or liquid.
  • it is ultra-thin for sensors or actuators such as pressure sensitive with movable parts inside.
  • the coating does not have a large impact on the sensor characteristics such as sensitivity, so it can meet the requirements of long-term implantation and normal operation of the sensor or actuator (such as the intraocular pressure sensor).
  • after packaging it can not only compensate for gaps and hysteresis in sensors or actuators, but also isolate harmful media that affect the accuracy of sensors or actuators in the external environment, thereby improving sensors or actuators with movable structures. Accuracy.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Prostheses (AREA)

Abstract

一种具有可动结构的植入式传感器或执行器及其封装方法。具有可动结构的植入式传感器或执行器包括传感器或执行器本体和设置在传感器或执行器本体外表面上的封装结构，封装结构包括包覆在传感器或执行器本体外表面上的第一保护层（40）和位于第一保护层（40）外表面上的第二保护层（50），其中，第一保护层（40）和第二保护层（50）中的一者为致密的纳米级涂层，第一保护层（40）和第二保护层（50）中的另一者为微米级涂层。其封装方法为：在所述传感器或执行器本体的外表面上依次形成第一保护层（40）和第二保护层（50）。纳米级涂层和微米级涂层的协同作用，起到双重防止气体或液体影响的保护，同时减小封装尺寸。

Description

一种具有可动结构的植入式传感器/执行器及其封装方法
优先权信息
本申请要求于2019年01月11日提交的申请号为201910025937.7的中国专利申请的优先权权益，并将其全部引入本文。
技术领域
本申请涉及微纳制造技术领域，具体涉及一种具有可动结构的植入式传感器或执行器及其封装方法。
背景技术
封装技术在植入式传感器或执行器技术领域中起着举足轻重的作用，甚至可以说，没有适当的封装技术，就不会有临床应用的植入式传感器或执行器。在所有的植入式传感器或执行器中，包括一大类具有可动结构的植入式传感器或执行器，如机械量传感器、执行器等，因具有可动结构，其可动部件在工作时会受到循环载荷的作用而反复变形，进而带动防护涂层材料一起反复变形，从而使得防护涂层材料容易产生分层、疲劳失效等问题，使得这一大类植入式传感器或执行器对于封装技术提出了更高的要求。
以植入式眼压传感器为例，其封装需要同时满足至少两个条件，其一是封装后的眼压传感器需满足高精度、小尺寸、高灵敏度等要求，其中，高精度和高灵敏度要求的主要保证条件在于在封装结构不能对传感器内起到传感作用的可动结构的运动产生较大影响；其二是眼压传感器的封装结构必须满足长期植入的稳定性要求(尤其是防止气体或液体影响的长期稳定性)。
相关技术中，已有采用聚对二甲苯等微米厚度的聚合物材料进行植入式传感器或执行器的封装，但由于聚合物材料的致密性比较一般，要实现较好的防气体或液体侵入效果需要较大的厚度，此外这种方法仅对大分子团状态的气体或液体的防护效果较好，难以阻挡小分子状态的团气体或液体的侵入。近年也有采用原子层沉积工艺制作纳米厚度的致密氧化物、氮化物、氟化物、金属、碳化物、硫化物等材料进行传感器或执行器的防水封装，这种方法虽然对小分子团状态的气体或液体的防护效果较好，但对大分子团状态的气体或液体的防护效果不好，并且致密的氧化物等材料的杨氏模量和硬度较大，对带有可运动结构的微传感器或执行器的灵敏度等性能具有较大的影响。
同时，由于在植入式传感器或执行器在工作过程中会受到外界环境的温度、湿度、腐蚀气体或液体、振动等因素的影响，因此如果不进行合适的封装和防护，将对传感器或执行器的精度指标造成较大的影响。
因此，若能将上述两种封装方法相结合，分别发挥微米涂层和纳米涂层的优势，为植入式传感器或执行器(尤其是具有可动结构的植入式传感器或执行器，如植入式眼压传感器等)提供一种合适的封装结构和封装工艺，实现一种防护气体或液体效果好、超薄尺寸、 对具有可动结构的传感器或执行器性能影响小的新型植入式封装方法，同时使得在封装后不仅可弥补传感器或执行器中间隙、迟滞等缺陷，还能减小外界环境对传感器或执行器精度的影响，从而提高具有可动结构的传感器或执行器的精度，这对具有可动结构的植入式传感器或执行器的研究和应用都具有重要的意义。
申请内容
基于上述现状，本申请的主要目的在于为具有可动结构的植入式传感器或执行器提供一种至少双层的封装方法，能够满足封装尺寸小和防止气体或液体影响的长期稳定性两方面需求，同时对具有可动结构的植入式传感器或执行器的灵敏度等指标影响很小，并可以提高具有可动结构的传感器或执行器的精度。
上述目的通过以下技术方案实现：
根据本申请的第一方面，本申请提供了一种具有可动结构的植入式传感器或执行器，用于植入生物体内，其中，所述具有可动结构的植入式传感器或执行器包括传感器或执行器本体和设置在所述传感器或执行器本体外表面上的封装结构，其中，所述封装结构包括包覆在所述传感器或执行器本体外表面上的第一保护层和位于所述第一保护层外表面上的第二保护层，并且，所述第一保护层和所述第二保护层中的一者为致密的纳米级涂层，所述第一保护层和所述第二保护层中的另一者为微米级防止气体或影响的涂层。
本申请的一些具体实施例中，所述第一保护层为致密的纳米级涂层，所述第二保护层为微米级涂层。
本申请的一些具体实施例中，所述第一保护层为微米级涂层，所述第二保护层为纳米级涂层，且所述第二保护层的至少一部分填充在所述第一保护层的微孔中。
本申请的一些具体实施例中，所述第二保护层的外表面上还设置有至少一个第三保护层，所述第三保护层为所述纳米级涂层或所述微米级涂层。
本申请的一些具体实施例中，所述第一保护层和所述第二保护层各自独立的包括多个子层，且多个所述子层满足以下条件的至少一种：多个所述子层的材料不完全相同；多个所述子层的形成方法不完全相同。
本申请的一些具体实施例中，该具有可动结构的植入式传感器或执行器满足以下条件的至少之一：所述传感器或执行器本体的外表面和所述第一保护层的外表面中的至少之一上具有可以增加表面积的微纳结构；所述传感器或执行器本体与所述第一保护层之间具有第一偶联剂层；所述第一保护层与所述第二保护层之间具有第二偶联剂层。
本申请的一些具体实施例中，所述致密的纳米级涂层为原子层沉积层或气相沉积层。
本申请的一些具体实施例中，所述微米级涂层为气相沉积层、蒸镀沉积层、溅射沉积层或喷涂沉积层。
本申请的一些具体实施例中，所述具有可动结构的植入式传感器或执行器具体可以为植入式压力敏感传感器或执行器，更具体可以为植入式眼压传感器。
本申请的一些具体实施例中，所述致密的纳米级涂层的厚度在0.1～1000纳米之间。本 申请的一些具体实施例中所述微米级涂层的厚度在0.1～3000微米之间。
本申请的一些具体实施例中，所述封装结构中，至少所述第二保护层由生物相容性材料形成。
根据本申请的第二方面，本申请提供了一种用于前面所述的具有可动结构的植入式传感器或执行器的封装方法，其包括步骤：
S40、在所述传感器或执行器本体的外表面形成所述第一保护层；
S50、在所述第一保护层的外表面形成所述第二保护层。
本申请的一些具体实施例中，该方法还包括以下步骤的至少之一：对所述传感器或执行器本体的外表面进行等离子体表面改性处理或者偶联剂表面改性处理；对所述第一保护层的外表面进行所述等离子体表面改性处理或者所述偶联剂表面改性处理。
本申请的一些具体实施例中，所述具有可动结构的植入式传感器或执行器包括芯片和用于贴装所述芯片的基板，在步骤S40之前，还包括步骤：
S10、对所述芯片进行清洗；
S20、将清洗后的芯片贴于所述基板上；
S30、将所述芯片与所述基板进行引线键合，形成所述传感器或执行器本体。
本申请的一些具体实施例中，采用原子层沉积技术或气相沉积技术在所述传感器或执行器本体的外表面上形成所述致密的纳米级涂层。
本申请的一些具体实施例中，采用气相沉积技术、蒸镀技术、溅射技术、喷涂技术形成所述微米级涂层。
本申请的一些具体实施例中，采用氧化物、氮化物、氟化物、金属、碳化物、硫化物和聚合物中的一种或多种形成所述致密的纳米级涂层。
本申请的一些具体实施例中，采用聚合物、氧化物、硫化物、氮化物、碳化物和陶瓷中的一种或多种形成所述微米级涂层。
本申请的具有可动结构的植入式传感器或执行器及其封装方法能够同时满足传感器或执行器封装尺寸小和防止气体或液体影响的长期稳定性两方面需求，从而可满足具有可动结构的传感器或执行器长期植入并正常工作的要求。
特别地，本申请的具有可动结构的植入式传感器或执行器利用致密的纳米级涂层(如原子层沉积层、气相沉积层)和微米级涂层(诸如化学气相沉积层等)的协同作用，使相应的具有可动结构的传感器或执行器具有良好的防止气体或液体影响的稳定性，其中微米级涂层可防止气体或液体的较大分子(如多于10个气体或液体分子组成的大分子团)的侵蚀，致密的纳米级涂层可防止气体分子或少于10个气体或液体分子组成的小分子团的侵蚀，从而对具有可动结构的植入式传感器或执行器起到双重防止气体或液体影响的保护，同时显著减小具有可动结构的植入式传感器或执行器的封装尺寸。
特别地，对于具有可动结构的植入式传感器或执行器而言，本申请所提供的封装结构不仅可弥补传感器或执行器中间隙、迟滞等缺陷，还能隔绝外界环境中对传感器或执行器精度有影响的有害介质，从而提高了具有可动结构的传感器或执行器的精度。此外，本申 请所提供的封装结构对其可动结构的运动影响很小，从而能够很大程度地保证具有可动结构的传感器或执行器的高灵敏度。
附图说明
以下将参照附图对根据本申请的具有可动结构的植入式传感器或执行器及其封装方法的优选实施方式进行描述。图中：
图1为本申请的一种优选实施方式的具有可动结构的植入式传感器或执行器的外形示意图，其中A区域做局部剖视处理；
图2为图1中A区域的局部放大示意图；
图3为本申请的一种优选实施方式的具有可动结构的植入式传感器或执行器的优选封装方法的流程图；
图4为本申请的一种优选实施方式中所涉及的芯片的外形示意图；
图5为图4的芯片贴于基板上的外形示意图；
图6为芯片与基板进行引线键合后形成的芯片基板组件的外形示意图；
图7为图6的芯片基板组件在形成第一保护层后的外形示意图，其中B区域做局部剖视处理；
图8为图7中B区域的局部放大示意图。
附图标记：10-芯片，20-基板，30、31、32、33-金属引线，40-第一保护层，50-第二保护层。
具体实施方式
为保证具有可动结构的植入式传感器或执行器防止气体或液体影响的能力，同时提高传感器或执行器精度，减小具有可动结构的植入式传感器或执行器的封装体积，本申请摒弃了相关技术中所采用的金属、陶瓷或玻璃等封装外壳，而代之以防止气体或液体影响的保护层结构，由此形成全新的封装结构和封装方法。
根据本申请的第一方面，提供了一种具有可动结构的植入式传感器或执行器，其用于植入生物(例如人)体内。如图1和图2所示，所述具有可动结构的植入式传感器或执行器包括传感器或执行器本体和设置在所述传感器或执行器本体外表面(或称外围，本文中外表面和外围可以互换使用)的封装结构。在图示的实施方式中，所述具有可动结构的植入式传感器或执行器包括芯片10和用于贴装所述芯片10的基板20，因而所述传感器或执行器本体为芯片基板组件，即芯片10与基板20贴合组装后形成的组件。所述封装结构包括包覆在所述传感器或执行器本体外表面上的第一保护层40和位于所述第一保护层40外表面上的第二保护层50，其中，所述第一保护层40和所述第二保护层50中的一者为致密的纳米级涂层，另一者为微米级涂层。
本申请的一些具体实施例中，第一保护层40为致密的纳米级涂层，第二保护层50为微米级涂层。本申请的另一些具体实施例中第一保护层40为微米级涂层，第二保护层50 为致密的纳米级涂层。
本申请的一些具体实施例中，该植入式传感器或执行器满足以下条件的至少之一：所述传感器或执行器本体的外表面和所述第一保护层的外表面中的至少之一上具有可以增加表面积的微纳结构；所述传感器或执行器本体与所述第一保护层之间具有第一偶联剂层；所述第一保护层与所述第二保护层之间具有第二偶联剂层。具体的，上述可以增加表面积的微纳结构，可以形成多个锚点，以使得涂层更好的附着，提高涂层的附着力，而偶联剂层(包括第一偶联剂层和第二偶联剂层)可以通过分子间作用力、氢键、化学键等作用增强涂层的附着力，满足可动部件对于涂层变形、疲劳等各方面的使用要求。
本申请的一些具体实施例中，所述第二保护层的外表面上还设置有至少一个第三保护层，所述第三保护层为所述纳米级涂层或所述微米级涂层。具体来说，具有可动结构的传感器或执行器的表面上可以形成多层纳米级涂层和微米级涂层，且具体的层叠顺序没有特别限制，可以自由叠加组合，具体如，纳米级涂层为A层，微米级涂层为B层，则可以在具有可动结构的传感器或执行器的表面上设置ABA、ABB、BAB、BAA、ABAA、ABAB、BAAA、BABA等等层叠顺序的保护层，在此不再一一详述。
相关技术中，用于生物医学装置的接触面的防止气体或液体影响的生物相容涂层主要是聚合物涂层，其作用是改善相应的生物医学装置与生物体内器官的界面相容性。相关技术的涂层法之所以不能在长时间内保持传感器或执行器的防止气体或液体影响的效果的有效性，主要原因在于：目前的涂层法主要是采用单一的涂层作为传感器或执行器的防护层，而单一的涂层由于其自身材料性能等限制，防护气体或液体影响的效果有限。如单一的聚对二甲苯等微米级聚合物涂层对气体或液体中的大分子的防护较好，但对气体或液体中的小分子的防护较差；单一的纳米级氧化物等涂层虽然结构致密可以较好地防护气体或液体中的小分子，但对气体或液体中大分子的防护较差，并且由于其杨氏模量和硬度较高，对具有可动结构的传感器或执行器的敏感或运动部分的性能会有较大的影响。另外，可动部件在工作时会受到循环载荷的作用而反复变形，进而带动防护涂层材料一起反复变形，从而使得防护涂层材料容易产生分层、疲劳失效等问题。
然而，自然界(包括生物体内)的水往往并不是以单一水分子的形式存在的，而是由若干水分子通过氢键作用而聚合在一起形成水分子簇，俗称“水分子团”的形式存在。通常，由多于10个水分子组成的水分子团称为大分子团，其活性较差，无法突破上述聚合物涂层的保护，这种大分子团在生物体内大量存在，占生物体内的水的绝大多数；而由少于10个水分子组成的水分子团称为小分子团，其活性大、体积小，尽管在生物体内仅少量存在，但由于这些小分子团能够通过聚合物的多孔结构，经过长年累月地积累，会慢慢渗透到聚合物涂层的内部。因此，若将这种聚合物涂层直接应用到本申请的具有可动结构的植入式传感器或执行器，则由于缺少相关技术采用的封装外壳，一部分气体或液体的小分子团会逐渐渗透到聚合物涂层的内部，当达到一定的量时，就会对具有可动结构的传感器或执行器造成损坏，例如损坏芯片的电路等，因而使得相应的具有可动结构的植入式传感器或执行器难以满足长期植入防止气体或液体影响的稳定性要求。
本申请中的致密的纳米级涂层为厚度在纳米级的致密涂层，其能够阻挡小分子团的渗透；微米级涂层为厚度在微米级的防止气体或液体影响的涂层，其致密度低于致密的纳米级涂层，相对于小分子团的渗透的阻挡能力有限，但能够有效阻挡大分子团的渗透。此外，本申请中的封装结构不仅可弥补具有可动结构的传感器或执行器中间隙、迟滞等缺陷，还能隔绝外界环境中对具有可动结构的传感器或执行器精度有影响的有害介质，从而提高了具有可动结构的传感器或执行器的精度。
因此，本申请在传感器或执行器本体的外表面上设置有第一保护层和第二保护层，并且在一种具体实施方式中，第一保护层是致密的纳米级涂层，第二保护层是微米级涂层，其中，微米级涂层用于阻挡大分子团(绝大多数的水分子团为大分子团)的渗透，致密的纳米级涂层用于阻挡小分子团的渗透，因此，在植入体内后的长期工作过程中，纵使有少量小分子团渗透到作为第一道防线的微米级涂层的内部，但由于作为第二道防线的致密的纳米级涂层的存在，这些小分子团将难以突破到芯片表面。
而在另一种具体实施方式中，第一保护层是微米级涂层，第二保护层是致密的纳米级涂层，其中，致密的纳米级涂层在外围充当第一道防线，用于同时阻挡小分子团和大分子团的渗透，微米级涂层在内部充当第二道防线，用于在第一道防线局部失效的情况下继续阻挡大分子团的渗透，因此，在植入体内的长期工作过程中，如果外围的致密的纳米级涂层经过长时间工作后发生局部失效，则由于微米级涂层的存在，纵使有少量的小分子团有可能经局部失效处渗透至微米级涂层处，也仍将需要较长的时间方有可能突破到芯片表面。特别需要说明的是，第一保护层是微米级涂层，第二保护层是致密的纳米级涂层时，致密的纳米级涂层在形成过程中能够渗透到微米级涂层的微孔中，从而形成一种立体的第二保护层，此时，即使作为第一道防线的致密的纳米级涂层表面上在局部发生失效，但小分子团实际上仍难以渗透到微米级涂层的内部，具有可动结构的植入式传感器或执行器的长期工作稳定性和可靠性能够得到保证。
因此，本申请提出的这种具有可动结构的植入式传感器或执行器的封装结构能够经受住长期植入的防止气体或液体影响的考验，从而满足稳定性要求。此外，本申请中的封装结构不仅可弥补具有可动结构的传感器或执行器中间隙、迟滞等缺陷，还能隔绝外界环境中对具有可动结构的传感器或执行器精度有影响的有害介质，从而提高了具有可动结构的传感器或执行器的精度。
另一方面，由于本申请提出的这种具有可动结构的植入式传感器或执行器的封装结构可以仅包括两层分别为微米级和纳米级的超薄涂层，因此相对于相关技术中采用外壳等植入式封装传感器或执行器在尺寸上会显著减小，这对于具有可动结构的植入式传感器或执行器的应用非常重要。
由此可见，本申请的具有可动结构的植入式传感器或执行器能够同时满足封装尺寸小和防止气体或液体影响的长期稳定性两方面需求，可满足具有可动结构的植入式传感器或执行器，如压力敏感传感器或执行器，特别是眼压传感器等，长期植入并正常工作的要求。
特别地，对于具有可动结构的植入式传感器或执行器而言，其灵敏度取决于其可动结 构动作时(例如压敏膜片发生变形时)的灵敏程度，显然，可动结构外部的封装不应阻碍可动结构自身的运动。本申请中，致密的纳米级涂层和微米级涂层可以直接涂覆在相应的可动结构的表面，由于这两个防止气体或液体影响的涂层的厚度很薄，其对可动结构的动作的阻碍很小，因而只会对传感器或执行器的灵敏度产生很小的影响。且由于传感器或执行器具有可动结构，对涂层的附着力要求也较高，在传感器或执行器动作过程中涂层不能分层、开裂和脱落等，而本申请的具有可动结构的植入式传感器或执行器，致密的纳米级涂层和微米级涂层可以牢固的附着在传感器或执行器本体的表面，不会在传感器或执行器动作过程中产生分层、开裂和脱落、破损等不良。其本申请的封装结构不仅可弥补具有可动结构的传感器或执行器中间隙、迟滞等缺陷，还能隔绝外界环境中对具有可动结构的传感器或执行器精度有影响的有害介质，从而提高了具有可动结构的传感器或执行器的精度。
本申请的一些具体实施例中，所述致密的纳米级涂层可以为原子层沉积层或气相沉积层，但不限于原子层沉积层或气相沉积层；所述微米级涂层可以为化学气相沉积层、蒸镀沉积层、溅射沉积层或喷涂沉积层，但不限于所列举的这几种沉积层。
原子层沉积技术是一种可以将物质以单原子膜形式一层一层地沉积在基底表面的方法。在原子层沉积过程中，新一层原子膜的化学反应是直接与之前一层相关联的，这种方式使每次反应只沉积一层原子。通过精确控制沉积涂层的厚度，便可以得到防止气体或液体影响的符合要求的保护涂层。一些具体实施例中，致密的纳米级涂层(具体可以为原子层沉积层)的厚度在0.1～1000纳米之间，具体可以为0.5～400纳米，例如为300纳米。原子层沉积层的致密度能够很好地保证其对小分子团的阻挡。
本申请的一些具体实施例中，形成所述致密的纳米级涂层(具体可以为原子层沉积层)所用的材料可以是任何防止气体或液体影响的材料，如氧化物，氮化物，氟化物，金属，碳化物，硫化物或它们的组合等。
本申请的一些具体实施例中，形成所述微米级涂层所用的材料可以是任何防止气体或液体影响的材料，如聚合物，氧化物、硫化物、氮化物、碳化物、陶瓷或它们的组合等。
本申请的一些具体实施例中，所述第一保护层和所述第二保护层各自独立的包括多个子层，且多个所述子层满足以下条件的至少一种：多个所述子层的材料不完全相同；多个所述子层的形成方法不完全相同。具体的，可采用不同的材料和/或不同的工艺形成所述致密的纳米级涂层，同样，也可以采用不同的材料和/或不同的工艺形成所述微米级涂层。以微米级涂层为例，微米级涂层自身在厚度方向上可以具有不同的材料和/或性能。例如，可以采用同一种材料、不同的工艺来形成该微米级涂层，还可以采用不同材料、分别用不同的工艺来形成该微米级涂层，或者还可以用不同的材料、同一种工艺来形成该微米级涂层，从而充分利用不同材料和/或不同工艺方法的优势。
例如，在一个具体实施例中，可以先采用碳化硅沉积一层例如厚度为2微米的防止气体或液体影响的涂层，再采用聚对二甲苯沉积一层例如厚度为2微米的防止气体或液体影响的涂层，这两个防止气体或液体影响的涂层共同构成本申请中所述的微米级涂层。如此一来，既能提高防止气体或液体影响的涂层的致密性和稳定性，又能利用聚对二甲苯的疏 水性进一步提高涂层的防止气体或液体影响的能力。
本申请的一些具体实施例中，微米级涂层(具体可以为第二保护层50，如化学气相沉积层、蒸镀沉积层或溅射沉积层)的厚度在0.1～3000微米之间，具体可以在1～100微米之间，例如4微米。
如前所述，本申请的具有可动结构的植入式传感器或执行器可以是任何种类的植入式传感器或执行器。具体地，具有可动结构的植入式传感器或执行器例如包括植入式机械量传感器和植入式执行器。
其中，机械量传感器例如包括压力传感器、触觉传感器、加速度传感器、陀螺仪(或称为角速度传感器)、流量传感器等，其工作时利用其可动结构将力学量转换为可动结构的应力、变形或者谐振频率等参数的改变，再将这些改变转换为电学量。例如，作为压力敏感传感器或执行器的一种，压阻式压力传感器包括承载被测压力的硅膜片和膜片表面的压阻，硅膜片充当换能元件，在被测压力的作用下发生变形，产生应力和应变；而压阻将应变的变化转换为阻值的变化，通过电路测量电阻的变化实现对压力的测量。眼压传感器便属于压力敏感传感器或执行器的一个典型种类。
其中，执行器也称为驱动器或致动器，例如微泵、微阀、微马达、微开关等，其工作时是将控制信号和能量转换为可动结构的可控运动和功率输出，从而使执行器在控制信号的作用下对外做功。
本申请的具有可动结构的植入式传感器或执行器中，通过在传感器或执行器本体外表面上设置一体化的涂层，使封装后的机械量传感器或执行器的传感器或执行器本体表面沉积上一层致密、轻薄、可靠的防止气体或液体影响的涂层，封装涂层结构不仅能满足防止气体或液体影响的能力，又不会影响传感器或执行器的指标(如灵敏度、稳定性等)。此外，还可弥补传感器或执行器中间隙、迟滞等缺陷，还能隔绝外界环境中对传感器或执行器精度有影响的有害介质，从而提高了传感器或执行器的精度。
特别地，对于植入式眼压传感器而言，其理想的尺寸应该是在毫米量级以内。相关技术的封装方法得到的传感器或执行器的尺寸一般都在毫米级及毫米级以上，主要原因是现有的封装结构尺寸过大，例如陶瓷或玻璃封装外壳过厚。而本申请的植入式眼压传感器的封装结构尺寸很小，例如仅借助于纳米级到微米级(如100纳米～4000微米)的涂层就能完成封装，满足长期植入的防止气体或液体影响的能力，使得封装后的眼压传感器的总体尺寸几乎不变。
本申请的一些具体实施例中，至少所述第二保护层50由生物相容性材料形成；具体的，所述第一保护层40和所述第二保护层50均由生物相容性材料形成。从而，第二保护层50的外表面无需再做生物相容性处理，以降低成本、缩短封装过程中所用的时间。
容易想到的是，在第二保护层50不采用生物相容性材料形成的前提下，也可以在封装结构的最外层(即第二保护层50的外表面)再设置生物相容性材料涂层，以便满足植入生物体内的生物相容性要求。
综上，本申请的具有可动结构的植入式传感器或执行器利用致密的纳米级涂层(如气 相沉积层、原子层沉积层)和微米级涂层(诸如化学气相沉积层等)的协同作用，使相应的具有可动结构的植入式传感器或执行器具有良好的防止气体或液体影响的能力和体内植入的稳定性，其中微米级涂层可防止气体或液体分子(如多于10个水分子组成的大分子团)的侵蚀，致密的纳米级涂层可防止水气分子或少于10个水分子组成的小分子团的侵蚀，从而对具有可动结构的植入式传感器或执行器起到双重防止气体或液体影响的保护，同时显著减小具有可动结构的植入式传感器或执行器的封装尺寸。
根据本申请的第二方面，还提供了一种用于前面所述的具有可动结构的植入式传感器或执行器的封装方法，如图3所示，其包括步骤：
S40、在所述传感器或执行器本体的外表面上形成第一保护层40，具体可以采用原子层沉积技术在所述传感器或执行器本体上形成原子层沉积层，即致密的纳米级涂层，得到如图7和图8所示的结构；
S50、在所述第一保护层40的外外表面上形成第二保护层50，具体可以采用化学气相沉积技术、蒸镀沉积技术、溅射沉积技术或喷涂技术等在所述第一保护层40的外表面上形成所述第二保护层50，即微米级涂层，得到如图1和图2所示的结构。具体的，本步骤结束后便已完成对所述植入式传感器或执行器的封装。
可见，本申请的封装方法主要通过原子层沉积和化学气相沉积(或蒸镀沉积、或溅射沉积、或喷涂等)两个步骤即可完成，相比于相关技术中采用玻璃、陶瓷、金属等封装外壳的封装方法，具有封装效率高、成本低、以及封装后尺寸小的优点。
示例性地，步骤S40中，可将具有可动结构的植入式传感器或执行器(如植入式眼压传感器)的传感器或执行器本体放置在原子层沉积室内，将防止气体或液体影响的涂层以单原子膜的形式一层一层地沉积在所述传感器或执行器本体的表面上。
具体的，步骤S40中，可采用任何防止气体或液体影响的材料，如氧化物、氮化物、氟化物、金属、碳化物和硫化物中的一种或多种(如前述材料的组合)形成所述第一保护层(如原子层沉积层)。
在原子层沉积的一个示例性实施方式中，例如可以采用氧化钽材料，例如将传感器或执行器本体放置在原子层沉积室内，将氧化钽涂层以单原子膜的形式一层一层地沉积在传感器或执行器本体的表面上，具体参数例如包括：3000个循环，厚度300nm，等等。
一些具体实施例中，在进行步骤S40之前，该方法还包括：对传感器或执行器本体的外表面进行等离子体表面改性处理或者偶联剂表面改性处理。具体的，可以采用等离子体处理传感器或执行器本体的表面，一方面可以在传感器或执行器本体的表面形成可以增加表面积的微纳结构，另一方面可以对传感器或执行器本体的表面起到活化作用，以使得形成的第一保护层可以与传感器或执行器本体的表面之间形成氢键、化学键等键合作用，以提高第一保护层与传感器或执行器本体之间的附着力。其中，等离子体表面改性处理可以为等离子体清洗步骤，也可以单独进行等离子体处理步骤。另一些具体示例中，可以通过沉积、喷涂、涂覆等方法在传感器或执行器本体的表面形成偶联剂(具体如硅烷偶联剂)层，以提高第一保护层与传感器或执行器本体之间的附着力。
示例性地，步骤S50中，可以把一种或几种含有构成薄膜元素的化合物、单质气体等通入放置有步骤S40处理后的具有可动结构的植入式传感器或执行器(如植入式眼压传感器)的反应室，借助空间气相化学反应在步骤S40处理后的具有可动结构的植入式传感器或执行器(如植入式眼压传感器)表面上沉积防止气体或液体影响的薄膜。
具体的，步骤S50中，可采用任何防止气体或液体影响的材料，如聚合物、氧化物、硫化物、氮化物、碳化物和陶瓷中的一种或多种(如前述材料的组合)形成所述第二保护层(如化学气相沉积层)。
在化学气相沉积的一个示例性实施方式中，例如可以采用聚对二甲苯材料，例如将步骤S40处理后的传感器或执行器本体放置在沉积室内，将聚对二甲苯涂层均匀地沉积在步骤S40处理后的传感器或执行器本体表面上(例如在第一保护层的外表面上)，具体参数例如包括：沉积温度为室温，厚度40微米，沉积时间约10小时，等等。
一些具体实施例中，在进行步骤S40之后，且在进行步骤S50之前，该方法还包括：对第一保护层的表面进行等离子体表面改性处理或者偶联剂表面改性处理。具体的，可以采用等离子体处理第一保护层的表面，一方面可以在第一保护层的表面形成可以增加表面积的微纳结构，另一方面可以对第一保护层的表面起到活化作用，以使得形成的第二保护层可以与第一保护层的表面之间形成氢键、化学键等键合作用，以提高第二保护层与第一保护层之间的附着力。其中，等离子体表面改性处理可以为等离子体清洗步骤，也可以单独进行等离子体处理步骤。另一些具体示例中，可以通过沉积、喷涂、涂覆等方法在第一保护层的表面形成偶联剂(具体如硅烷偶联剂)层，以提高第二保护层与第一保护层之间的附着力。
具体的，所述具有可动结构的植入式传感器或执行器包括芯片10和用于贴装所述芯片10的基板20，如图3所示，在步骤S40之前，还可包括步骤：
S10、清洗：即对所述芯片10进行清洗；
S20、贴片：即将清洗后的芯片10贴于基板20上，如图5所示；
S30、引线键合：即将所述芯片10与所述基板20进行引线键合，例如通过金属引线30、31、32、33实现引线键合，如图6所示，本步骤完成后即得到本申请所称的传感器或执行器本体。
示例性地，芯片10的外形结构如图4所示。
其中，步骤S10的主要目的是将芯片10的表面清洗干净，例如，可以先将芯片浸入丙酮溶液中超声清洗数分钟至数十分钟(如20分钟)，之后再将芯片浸入异丙醇溶液中超声清洗数分钟至数十分钟(如20分钟)，或者直接用等离子清洗等方式进行清洗。
步骤S20中，具体可通过胶粘贴片、导电胶粘接、Au－Si合金共熔法、Pb－Sn合金贴片等方法将清洗后的芯片10贴于基板20上。
步骤S30中，具体可以采用金属丝将芯片10上的电极引线衬垫与基板20底座外引线衬垫连接在一起，通常可采用热压、热超声和超声等方法将芯片10和基板20做引线键合。
一些具体实施例中，在步骤S30之后还可以包括涂胶保护的步骤：即在所述传感器或 执行器本体的至少各金属引线的外围涂布保护胶层，以保护芯片10及各金属引线30、31、32、33在测压过程中不受损坏。本步骤中所用的保护胶可以是任何合适的胶类材料或聚合物材料，如聚对二甲苯、硅酮、PET、PVC或它们的组合等。
综上，本申请采用直接对传感器或执行器本体做表面处理的方式实现对具有可动结构的植入式传感器或执行器的封装，一方面可显著减小封装尺度和封装厚度，另一方面还减少了工艺步骤，并且同时还容易获得良好的生物兼容性和长期植入体内防止气体或液体影响的稳定性，此外，对于内部带有可动部件的压力敏感等传感器或执行器，超薄的涂层不会对灵敏度等传感器特性产生较大的影响，从而可满足传感器或执行器(如眼压传感器)长期植入并正常工作的要求。此外，使得在封装后不仅可弥补传感器或执行器中间隙、迟滞等缺陷，还能隔绝外界环境中对传感器或执行器精度有影响的有害介质，从而提高了具有可动结构的传感器或执行器的精度。
本领域的技术人员容易理解的是，在不冲突的前提下，上述各具体方案可以自由地组合、叠加(比如由纳米级涂层和微米级涂层组合的两层以上的复合结构及其表面防护方法)。
应当理解，上述的实施方式仅是示例性的，而非限制性的，在不偏离本申请的基本原理的情况下，本领域的技术人员可以针对上述细节做出的各种明显的或等同的修改或替换，都将包含于本申请的权利要求范围内。

Claims (20)

  1. 一种具有可动结构的植入式传感器或执行器，用于植入生物体内，其特征在于，所述具有可动结构的植入式传感器或执行器包括传感器或执行器本体和设置在所述传感器或执行器本体外表面的封装结构，所述封装结构包括包覆在所述传感器或执行器本体外表面上的第一保护层和位于所述第一保护层外表面上的第二保护层，其中，所述第一保护层和所述第二保护层中的一者为纳米级涂层，所述第一保护层和所述第二保护层中的另一者为微米级涂层。
  2. 根据权利要求1所述的植入式传感器或执行器，其特征在于，所述第一保护层为纳米级涂层，所述第二保护层为微米级涂层。
  3. 根据权利要求1所述的植入式传感器或执行器，其特征在于，所述第一保护层为微米级涂层，所述第二保护层为纳米级涂层，且所述第二保护层的至少一部分填充在所述第一保护层的微孔中。
  4. 根据权利要求2或3所述的植入式传感器或执行器，其特征在于，所述第二保护层的外表面上还设置有至少一个第三保护层，所述第三保护层为所述纳米级涂层或所述微米级涂层。
  5. 根据权利要求1-4中任一项所述的植入式传感器或执行器，其特征在于，所述第一保护层和所述第二保护层各自独立的包括多个子层，且多个所述子层满足以下条件的至少一种：
    多个所述子层的材料不完全相同；多个所述子层的形成方法不完全相同。
  6. 根据权利要求1-5中任一项所述的植入式传感器或执行器，其特征在于，满足以下条件的至少之一：
    所述传感器或执行器本体的外表面和所述第一保护层的外表面中的至少之一上具有可以增加表面积的微纳结构；
    所述传感器或执行器本体与所述第一保护层之间具有第一偶联剂层；
    所述第一保护层与所述第二保护层之间具有第二偶联剂层。
  7. 根据权利要求1-6中任一项所述的植入式传感器或执行器，其特征在于，所述纳米级涂层为原子层沉积层或气相沉积层。
  8. 根据权利要求1-7中任一项所述的植入式传感器或执行器，其特征在于，所述微米级涂层为气相沉积层、蒸镀沉积层、溅射沉积层或喷涂沉积层。
  9. 根据权利要求1-8中任一项所述的植入式传感器或执行器，其特征在于，为植入式压力敏感传感器或执行器。
  10. 根据权利要求9所述的植入式传感器或执行器，其特征在于，所述植入式传感器或执行器为植入式眼压传感器。
  11. 根据权利要求1-10中任一项所述的植入式传感器或执行器，其特征在于，所述纳米级涂层的厚度在0.1～1000纳米之间。
  12. 根据权利要求1-11中任一项所述的植入式传感器或执行器，其特征在于，所述微 米级涂层的厚度在0.1～3000微米之间。
  13. 根据权利要求1-12中任一项所述的植入式传感器或执行器，其特征在于，所述封装结构中，至少所述第二保护层由生物相容性材料形成。
  14. 一种用于权利要求1-13中任一项所述的植入式传感器或执行器的封装方法，其特征在于，包括步骤：
    S40、在所述传感器或执行器本体的外表面上形成所述第一保护层；
    S50、在所述第一保护层的外表面上形成所述第二保护层。
  15. 根据权利要求14所述的封装方法，其特征在于，还包括以下步骤的至少之一：
    对所述传感器或执行器本体的外表面进行等离子体表面改性处理或者偶联剂表面改性处理；
    对所述第一保护层的外表面进行所述等离子体表面改性处理或者所述偶联剂表面改性处理。
  16. 根据权利要求14或15所述的封装方法，其特征在于，所述植入式传感器或执行器包括芯片和用于贴装所述芯片的基板，在步骤S40之前，还包括步骤：
    S10、对所述芯片进行清洗；
    S20、将清洗后的所述芯片贴于所述基板上；
    S30、将所述芯片与所述基板进行引线键合，形成所述传感器或执行器本体。
  17. 根据权利要求14-16中任一项所述的封装方法，其特征在于，采用原子层沉积技术或气相沉积技术在所述传感器或执行器本体的外表面上形成所述纳米级涂层。
  18. 根据权利要求14-17中任一项所述的封装方法，其特征在于，采用气相沉积技术、蒸镀技术、溅射技术或喷涂技术形成所述微米级涂层。
  19. 根据权利要求14-18中任一项所述的封装方法，其特征在于，采用氧化物、氮化物、氟化物、金属、碳化物、硫化物和聚合物中的一种或多种形成所述纳米级涂层。
  20. 根据权利要求14-19中任一项所述的封装方法，其特征在于，采用聚合物、氧化物、硫化物、氮化物、碳化物、陶瓷中的一种或多种形成所述微米级涂层。
PCT/CN2019/122088 2019-01-11 2019-11-29 一种具有可动结构的植入式传感器/执行器及其封装方法 Ceased WO2020143355A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910025937.7 2019-01-11
CN201910025937.7A CN109626319B (zh) 2019-01-11 2019-01-11 一种植入式器件及其封装方法

Publications (1)

Publication Number Publication Date
WO2020143355A1 true WO2020143355A1 (zh) 2020-07-16

Family

ID=66060472

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/122088 Ceased WO2020143355A1 (zh) 2019-01-11 2019-11-29 一种具有可动结构的植入式传感器/执行器及其封装方法

Country Status (2)

Country Link
CN (1) CN109626319B (zh)
WO (1) WO2020143355A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109626319B (zh) * 2019-01-11 2024-10-18 清华大学 一种植入式器件及其封装方法
CN109518185B (zh) * 2019-01-11 2020-10-20 清华大学 一种具有可动结构的器件的表面防护方法
WO2021114202A1 (zh) * 2019-12-13 2021-06-17 西安电子科技大学 半导体器件封装结构及其制备方法
CN111330155B (zh) * 2020-03-11 2020-10-16 微智医疗器械有限公司 植入装置、封装方法及脑皮层刺激视觉假体
CN115886768A (zh) * 2021-09-30 2023-04-04 清华大学 生命体内压力监测装置

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030185964A1 (en) * 2002-03-28 2003-10-02 Jan Weber Method for spray-coating a medical device having a tubular wall such as a stent
US20060216494A1 (en) * 2002-11-25 2006-09-28 Helga Furedi-Milhofer Organic-inorganic nanocomposite coatings for implant materials and methods of preparation thereof
US20070173952A1 (en) * 2003-11-27 2007-07-26 Doxa Ab Implant and method of producing the same, and a system for implantation
US20100228348A1 (en) * 2007-05-25 2010-09-09 Micell Technologies, Inc. Polymer Films for Medical Device Coating
CN202335944U (zh) * 2011-11-28 2012-07-18 英作纳米科技（北京）有限公司 新型医疗用品
CN102676990A (zh) * 2011-03-14 2012-09-19 鸿富锦精密工业（深圳）有限公司 铝或铝合金的壳体及其制造方法
CN102764599A (zh) * 2012-06-29 2012-11-07 清华大学 一种纳米材料混合基质膜的制备方法
CN103378247A (zh) * 2012-04-25 2013-10-30 清华大学 外延结构体
CN104491923A (zh) * 2014-12-26 2015-04-08 四川大学 纳米/微米晶梯度结构磷酸钙生物陶瓷材料及其制备方法和应用
CN106310376A (zh) * 2015-06-30 2017-01-11 先健科技(深圳)有限公司 植入医疗器械预制件、植入医疗器械及其制备方法
CN109626319A (zh) * 2019-01-11 2019-04-16 清华大学 一种植入式器件及其封装方法
CN209411765U (zh) * 2019-01-11 2019-09-20 清华大学 一种植入式器件

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050194348A1 (en) * 2001-12-03 2005-09-08 University Of Southern California Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
JP5221150B2 (ja) * 2005-02-01 2013-06-26 セカンド サイト メディカル プロダクツ インコーポレイテッド 超小型埋め込み型の被覆された装置
CN102157394A (zh) * 2011-03-22 2011-08-17 南通富士通微电子股份有限公司 高密度系统级封装方法
US9781842B2 (en) * 2013-08-05 2017-10-03 California Institute Of Technology Long-term packaging for the protection of implant electronics
CN108136174B (zh) * 2015-04-17 2022-02-25 穆贾拉医疗私人有限公司 可植入式神经刺激装置
CN105225972B (zh) * 2015-10-22 2017-09-26 长电科技（滁州）有限公司 一种半导体封装结构的制作方法
CN105428488B (zh) * 2015-12-28 2018-04-17 上海交通大学 一种基于金丝球焊法的光刺激神经电极器件及其制备方法
CN107818957A (zh) * 2017-11-03 2018-03-20 清华大学 封装体及其制造方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030185964A1 (en) * 2002-03-28 2003-10-02 Jan Weber Method for spray-coating a medical device having a tubular wall such as a stent
US20060216494A1 (en) * 2002-11-25 2006-09-28 Helga Furedi-Milhofer Organic-inorganic nanocomposite coatings for implant materials and methods of preparation thereof
US20070173952A1 (en) * 2003-11-27 2007-07-26 Doxa Ab Implant and method of producing the same, and a system for implantation
US20100228348A1 (en) * 2007-05-25 2010-09-09 Micell Technologies, Inc. Polymer Films for Medical Device Coating
CN102676990A (zh) * 2011-03-14 2012-09-19 鸿富锦精密工业（深圳）有限公司 铝或铝合金的壳体及其制造方法
CN202335944U (zh) * 2011-11-28 2012-07-18 英作纳米科技（北京）有限公司 新型医疗用品
CN103378247A (zh) * 2012-04-25 2013-10-30 清华大学 外延结构体
CN102764599A (zh) * 2012-06-29 2012-11-07 清华大学 一种纳米材料混合基质膜的制备方法
CN104491923A (zh) * 2014-12-26 2015-04-08 四川大学 纳米/微米晶梯度结构磷酸钙生物陶瓷材料及其制备方法和应用
CN106310376A (zh) * 2015-06-30 2017-01-11 先健科技(深圳)有限公司 植入医疗器械预制件、植入医疗器械及其制备方法
CN109626319A (zh) * 2019-01-11 2019-04-16 清华大学 一种植入式器件及其封装方法
CN209411765U (zh) * 2019-01-11 2019-09-20 清华大学 一种植入式器件

Also Published As

Publication number Publication date
CN109626319B (zh) 2024-10-18
CN109626319A (zh) 2019-04-16

Similar Documents

Publication Publication Date Title
CN109626319B (zh) 一种植入式器件及其封装方法
CN106908176B (zh) 具有微结构化的多相介电层电容式压力传感器及其制法
US11165011B2 (en) Piezoelectric element and method for manufacturing piezoelectric element
JP5221150B2 (ja) 超小型埋め込み型の被覆された装置
AU2006311850B2 (en) Implantable microelectronic device and method of manufacture
US7673385B2 (en) Laminated structure method
CN111392690B (zh) 一种基于薄膜热电器件供电的压力传感系统及其制备方法
EP1403212A2 (en) Flexible mems transducer and manufacturing method thereof, and flexible mems wireless microphone
JPH10249768A (ja) 力センサー
JP2000515344A (ja) 生体適合性で埋め込み可能な補聴器マイクロアクチュエータ
JP2005534020A (ja) 電気機械変換器のための防湿技術
US7800241B2 (en) Semiconductor device with semiconductor device components embedded in a plastics composition
WO2002067770A2 (en) Implantable device using ultra-nanocrystalline diamond
JPH06503423A (ja) 力を検出しまたは力を印加するマイクロ素子とその製造法
CN107108200B (zh) 用于密封非磁性封装的盖和方法
JPH10211701A (ja) 圧電体素子を備えたアクチュエータ及びインクジェット式記録ヘッド、並びにこれらの製造方法
CN108225620A (zh) 一种具有多层结构的柔性触觉传感器及其制作方法
CN209411765U (zh) 一种植入式器件
EP1602124A2 (en) Micromachined assembly with a multi-layer cap defining cavity
EP2142083A2 (en) Layered structure for corrosion resistant interconnect contacts
WO2020143356A1 (zh) 一种用于带有可动结构的传感器/执行器的表面防护方法及具有可动结构的传感器/执行器组件
CN100346143C (zh) 一种复合封装的箔式锰铜超高压力传感器
KR102298213B1 (ko) 다층 구조의 멤브레인을 가진 초음파 트랜스듀서 및 이의 제작 방법
JP6453019B2 (ja) 圧電型センサ及び拍動センサ
CN115183896A (zh) 一种陶瓷基底嵌入式温度传感器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19908364

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19908364

Country of ref document: EP

Kind code of ref document: A1