WO2020143079A1

WO2020143079A1 - Communication device and terminal

Info

Publication number: WO2020143079A1
Application number: PCT/CN2019/073250
Authority: WO
Inventors: 郭进良; 余慧明; 朱志荣
Original assignee: 上海移远通信技术股份有限公司
Priority date: 2019-01-11
Filing date: 2019-01-25
Publication date: 2020-07-16
Also published as: CN109586752A; CN109586752B

Abstract

The present application relates to the technical field of communication devices, and provided thereby are a communication device and a terminal. The communication device comprises: an antenna module, a control circuit and a circuit board; the control circuit comprises: a main control chip and a control chip; the antenna module is provided on a first side of the circuit board, and the main control chip and the control chip are provided on a second side of the circuit board; and the main control chip is electrically connected to the control chip, the antenna module and the control chip are electrically connected by means of vias on the circuit board, and the control chip is configured to control the antenna module to receive and send signals according to instructions of the main control chip. The control circuit and the antenna module in the communication device are provided on both sides of the circuit board, thereby saving space occupied by the antenna module and the control circuit. Also, since the antenna module and the control circuit are provided on one circuit board, the path between the antenna module and the control circuit is made smaller, which saves space. Furthermore, radio frequency loss may be reduced, which thereby improves the radio frequency performance of the antenna module.

Description

Communication device and terminal

Cross-reference of related applications

This application requires the priority of the Chinese patent application with the application number 2019100296249 and the name "Communication Devices and Terminals" filed with the Chinese Patent Office on January 11, 2019, the entire contents of which are incorporated by reference in this application.

Technical field

The present application relates to the technical field of communication devices, and in particular, to a communication device and a terminal.

Background technique

A communication terminal refers to an electronic terminal device that can perform information interaction through a communication network, and is generally provided with a communication device to provide a communication function. With the development of communication technology, the application of communication terminals is becoming more and more common, and people have higher and higher requirements for communication devices in communication terminals. Among them, the antenna is an integral part of the communication terminal. The antenna radiates electromagnetic wave signals and receives electromagnetic wave signals. The working process of the antenna is to convert the received current signal into an electromagnetic wave signal for transmission, and convert the received electromagnetic wave signal into electricity. Signal device.

In the prior art, in the communication device used by the communication terminal, the communication control circuit and the antenna are designed separately, and are connected by a printed circuit board (Printed Circuit Board, PCB for short) trace or a radio frequency coaxial line, or an independent antenna The modules are connected through a flexible printed circuit (FPC).

However, in the above-mentioned prior art, the communication control circuit and the antenna are designed separately, so that the communication device will occupy a larger space in the communication terminal, affecting the overall structure of the communication terminal or the layout of other components.

Summary of the invention

One of the purposes of the present application is to provide a communication device and terminal in response to at least one of the above-mentioned shortcomings in the prior art, at least to solve the problem that the antenna and module occupy a large space in the prior art.

To achieve the above purpose, the technical solutions adopted in the embodiments of the present application are as follows:

In a first aspect, an embodiment of the present application provides a communication device, including: an antenna module, a control circuit, and a circuit board; the control circuit includes: a main control chip and a control chip;

The antenna module is arranged on the first side of the circuit board, and the main control chip and the control chip are arranged on the second side of the circuit board;

The main control chip is electrically connected to the control chip, the antenna module and the control chip are electrically connected through vias on the circuit board, and the control chip is configured to control the antenna module to send and receive signals according to the instructions of the main control chip.

Optionally, the antenna module includes multiple groups of antenna matrices, each group of antenna matrices is correspondingly provided with a control chip, each control chip is electrically connected to a group of antenna matrices through vias on the circuit board, and each control chip controls a corresponding group of Antenna matrix.

Optionally, the position of the via is mapped on the lead of the antenna matrix.

Optionally, the antenna module is provided on the ground-covered copper side of the circuit board, and the ground-covered copper of the circuit board is configured to reflect the electromagnetic wave signal sent by the antenna module, so that the electromagnetic wave signal emitted by the antenna module Converge toward the side away from the circuit board.

Optionally, the position of the via is mapped on the wire at the center of the antenna matrix.

Optionally, the control circuit further includes a memory chip, which is disposed on the second surface of the circuit board and is electrically connected to the main control chip.

Optionally, the control circuit further includes a power chip. The power chip is disposed on the second side of the circuit board, and the power chip is electrically connected to the main chip.

Optionally, it also includes a shield cover, which is provided outside the control circuit.

Optionally, a radio frequency processing module is further included. The radio frequency processing module is disposed between the control chip and the main control chip, and is configured to perform radio frequency processing on the electromagnetic wave signal received by the antenna module.

Optionally, the control circuit further includes a power chip, the power chip is disposed on the second surface of the circuit board, the power chip is electrically connected to the main control chip, and the power chip is configured to Under the control of the main control chip, the control power supply supplies power to the communication device.

Optionally, the circuit board is a high-frequency circuit board, a dielectric loss factor of the circuit board is less than 0.004, and a dielectric constant of the circuit board is less than 3.5.

In a second aspect, an embodiment of the present application further provides a terminal, including a case, a built-in motherboard, and the communication device of the first aspect;

The built-in motherboard and communication device are set in the housing;

The second surface of the circuit board in the communication device is provided with a grid array package LGA pad;

The communication device is connected to the built-in motherboard through the LGA pad.

Optionally, the LGA pad is disposed on the second surface of the circuit board.

Optionally, the built-in main board is provided with a through hole, the control circuit card of the communication device is provided in the through hole, and the LGA pad is soldered to one side of the built-in main board.

Optionally, the position on the housing corresponding to the antenna module is a hollow structure or adopts a wave-transmitting material.

One of the beneficial effects of the embodiments of the present application includes: by setting the control circuit and the antenna module in the communication device on both sides of the circuit board, thereby saving the space occupied by the antenna module and the control circuit, and because the antenna module and the control circuit are provided On a circuit board, the path between the antenna module and the control circuit is reduced, saving space, and further reducing the radio frequency loss, improving the radio frequency performance of the antenna module, and also reducing the design cost.

BRIEF DESCRIPTION

In order to more clearly explain the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, so they are not It should be regarded as a limitation on the scope. For those of ordinary skill in the art, without paying any creative labor, other related drawings can also be obtained based on these drawings.

1 is a schematic structural diagram of a communication device according to an embodiment of the present application;

2 is a schematic structural diagram of another communication device provided by this application;

3 is a schematic structural diagram of another communication device provided by this application;

4 is a schematic diagram of another communication device module provided by this application;

5 is a schematic structural diagram of another communication device provided by this application.

Icons: 1-communication device; 11-circuit board; 111-via; 113-shield cover; 13-main control chip; 14-RF processing module; 15-control chip; 151-control chip A; 153-control chip B 155-control chip C; 157-control chip D; 16-power chip; 17-antenna module; 171-antenna module A; 173-antenna module B; 175-antenna module C; 177-antenna module D; 18-storage Chip; 21-built-in motherboard; 23-through hole; 25-LGA pad.

detailed description

To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, but not all the embodiments. The components of the embodiments of the present application generally described and illustrated in the drawings herein can be arranged and designed in various configurations.

Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the scope of protection of the present application.

It should be noted that similar reference numerals and letters indicate similar items in the following drawings, therefore, once an item is defined in one drawing, there is no need to further define and explain it in subsequent drawings.

In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship conventionally placed when the product of the invention is used, only for the convenience of describing the present application and simplifying the description, rather than indicating or implying The device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

FIG. 1 is a schematic structural diagram of a communication device provided in this application; FIG. 2 is a schematic structural diagram of another communication device provided in this application.

As shown in FIGS. 1 and 2, the communication device 1 may include: an antenna module 17, a control circuit, and a circuit board 11. The control circuit may include a main control chip 13 and a control chip 15. The circuit board 11 may be a printed circuit board (Printed Circuit Board, PCB for short), but it is not limited thereto.

The antenna module 17 may be disposed on the first surface of the circuit board 11, and the main control chip 13 and the control chip 15 may be disposed on the second surface of the circuit board 11. That is, the control circuit and the antenna module 17 are integrated on one circuit board 11 and distributed on opposite sides of the circuit board 11.

Optionally, in this embodiment, since the signal frequency of the communication device 1 may be higher, in order to reduce the transmission loss on the circuit board 11, the circuit board 11 is a high-frequency circuit board, and the dielectric loss factor of the circuit board 11 may be set as Less than 0.004, the dielectric constant of the circuit board 11 can be set to less than 3.5.

The main control chip 13 is electrically connected to the control chip 15, the antenna module 17 and the control chip 15 are electrically connected through a via 111 penetrating through the circuit board 11, the control chip 15 is configured to control the antenna module 17 to send and receive signals according to the instructions of the main control chip 13.

Optionally, the antenna module 17 may be disposed on the side of the circuit board 11 with the ground copper, and the ground copper of the circuit board 11 is configured to reflect the electromagnetic wave signal sent by the antenna module 17 so that the electromagnetic wave signal emitted by the antenna module 17 is far away One side of the circuit board 11 converges, so that the electromagnetic wave signals emitted by the antenna module 17 are all transmitted outward, enhancing the signal strength of the antenna module in one direction.

In an alternative embodiment, the antenna module 17 is disposed on the first surface of the circuit board 11, the control chip 15 configured to control the antenna module 17 is disposed on the second surface of the circuit board 11, and the control chip 15 is located The projection position of the antenna module 17 is the same as the projected position of the module. Such a setting is beneficial to reduce the path between the antenna module 17 and the control circuit, thereby reducing radio frequency loss, and improving the radio frequency performance of the antenna module 17.

Optionally, the manner in which the antenna module 17 and the control chip 15 are electrically connected through the via 111 on the circuit board 11 may be, for example, connected through a wire passing through the hole in the circuit board 11 or extended to the hole The inner metal layer is turned on, etc. The connection mode is not specifically limited in this embodiment, and the main control chip 13 can be electrically connected to the antenna module 17.

The communication device 1 provided by the embodiment of the present application may include: an antenna module 17, a control circuit, and a circuit board 11. By setting the control circuit and the antenna module 17 in the communication device 1 on both sides of the circuit board 11, the antenna module 17 is saved The space occupied by the control circuit and the control circuit, and because the antenna module 17 and the control circuit are arranged on a circuit board 11, the path between the antenna module 17 and the control circuit is reduced, thereby also reducing the radio frequency loss and improving the antenna module 17 RF performance. In addition, adopting the circuit layout method eliminates the need to purchase a separate antenna module, and at the same time reduces the design cost.

Optionally, as shown in FIG. 2, the antenna module 17 may include multiple groups of antenna matrices, and each group of antenna matrices corresponds to a control chip 15. Each control chip 15 and a group of antenna matrices pass through the via 111 on the circuit board 11 Electrically connected, each control chip 15 controls a corresponding set of antenna matrices.

The antenna matrix in the embodiment of the present application may be a 5G antenna, or a 3G or 4G antenna, which is not limited herein, and may be any different frequency band.

Based on the above embodiments, the multiple groups of antenna matrixes are provided on the first surface of the circuit board 11, and a control chip 15 is provided on the second surface of the circuit board 11 at a position corresponding to each group of antenna matrix , Each control chip 15 and its corresponding antenna matrix are connected through a via 111, each control chip 15 controls a group of antenna matrix connected to it, and each control chip 15 is electrically connected to the main control chip 13, configured as Receive the control command of the main control chip 13 and control the antenna matrix through the control command.

Taking the circuit board 11 as an example, four groups of antenna matrixes are provided, and correspondingly four control chips 15 are provided. Each control chip 15 controls a group of antenna matrices, and each control chip 15 passes through the circuit of the circuit board 11 The control chip 13 is electrically connected and configured to receive and execute control commands of the main control chip 13.

It should be noted that each group of antenna matrices may contain multiple antenna small matrices, the number of antenna small matrices is determined by the number that the control chip 15 can simultaneously control, and the number of rows and columns of the antenna matrix can be determined by the antenna controller .

For example, four control chips 15 are provided on the second surface of the circuit board 11, each antenna array provided on the first surface of the corresponding circuit board 11 may include 4 rows and 4 columns, and each control chip 15 may control each A small matrix of 16 antennas in the antenna matrix.

Optionally, the position of the via 111 corresponds to the lead of the antenna matrix. That is, the control chip 15 is connected to the lead of the antenna matrix through the via 111, thereby controlling the corresponding antenna matrix. Wherein, the lead is connected between each small matrix of the antenna matrix.

The length of the lead between the small antenna arrays can be determined according to the actual frequency. Generally, the length of the lead in each group of antenna matrix is 1/2 or 1/4 of the wavelength in the millimeter wave band. Optionally, the supported frequency bands are different, and the length of the leads in each group of antenna matrix is different.

In addition, in order to facilitate the complete and effective transmission of the electromagnetic wave signal received by the antenna matrix to the control chip 15, the position of the control chip 15 is opposite to the position of the antenna matrix, that is, on both sides of the same position area of the circuit board 11. And a via 111 is provided on the circuit board 11 where the antenna matrix lead is located, so that the control chip 15 is electrically connected to the antenna matrix through the via 111.

Further optionally, the position of the via 111 corresponds to the lead at the central position of the antenna matrix. Therefore, the electromagnetic wave signal received by the antenna matrix can be transmitted to the control chip 15 in the shortest possible path. Therefore, the radio frequency loss can be better reduced, and the radio frequency performance of the communication device 1 can be improved.

FIG. 3 is a schematic structural diagram of another communication device provided by the present application; as shown in FIG. 3, optionally, the control circuit may further include: a memory chip 18, which is disposed on the second side of the circuit board 11 and The control chip 13 is electrically connected.

Optionally, the storage chip 18 is electrically connected to the main control chip 13 and is configured to store the electromagnetic wave signals and control instructions received by the main control chip 13, etc., and the stored electromagnetic wave signals and control instructions can also be converted to be recognized by the main control chip 13 Language so that the main control chip 13 extracts and processes the electromagnetic wave signals and control instructions stored in the memory chip 18.

In practical applications, the memory chip 18 is integrated on the circuit board 11 and is on the same side as the main control chip 13, and is electrically connected to the main control chip 13.

Optionally, the control circuit further includes a power chip 16, the power chip 16 is disposed on the second surface of the circuit board 11, and the power chip 16 is electrically connected to the main control chip 13.

Specifically, the power chip 16 is integrated on the circuit board 11 and is on the same side as the main control chip 13. The power chip 16 and the power source are electrically connected to the main control chip 13 respectively. The power chip 16 is configured to Under control, the control power supply supplies power to the communication device 1.

Optionally, as shown in FIG. 3, it further includes a shield cover 113, which is disposed outside the control circuit.

Since the communication device 1 needs to send and receive electromagnetic wave signals through the antenna matrix, the electromagnetic wave signals will cause certain interference to the control chip 15, so a shield cover 113 is provided around the control chip 15, and the shield cover 113 may be configured to isolate electromagnetic wave signals or other The interference of the signal to the control chip 15 is not limited by the material and structure of the shield 113, as long as the shield chip 113 can be provided to isolate the control chip 15 from electromagnetic wave signals or other signals.

FIG. 4 is a schematic diagram of another communication device module provided by this application; for example, as shown in FIG. 4, optionally, the communication device 1 may further include: a radio frequency processing module 14 that is disposed on the control chip 15 Between the main control chip 13, it is configured to perform radio frequency processing on the electromagnetic wave signal received by the antenna module 17, and the radio frequency processing includes operations such as denoising, amplification, and filtering.

For example, the work flow of the communication device 1 may include: the main control chip 13 generates an instruction to the control chip 15, the control chip 15 controls the antenna module 17 to send and receive signals according to the instruction, and when the instruction is to transmit an electromagnetic wave signal, the control chip 15 directly controls The antenna module 17 emits electromagnetic waves; when the command is to receive electromagnetic wave signals, the control chip 15 directly controls the antenna module 17 to receive electromagnetic waves, and sends the received electromagnetic wave signals to the radio frequency processing module 14, and the radio frequency processing module 14 signals the received electromagnetic wave signals Processing, sending the electromagnetic wave signal after processing to the main control chip 13.

For example, the communication device 1 may include a main control chip 13, a radio frequency processing module 14, a power chip 16, a control chip A151, a control chip B153, a control chip C155, a control chip D157, an antenna module A171, an antenna module B173, an antenna module C175 and Antenna module D177.

The main control chip 13 sends a control command to one or more of the control chip A151, the control chip B153, the control chip C155, and the control chip D157, and the control chip that receives the control command controls the corresponding antenna module to send an electromagnetic wave signal. Or control one or more of the antenna module A171, the antenna module B173, the antenna module C175 and the antenna module D177 to receive the electromagnetic wave signal and send the received electromagnetic wave signal to the corresponding control chip, and the control chip then sends the electromagnetic wave signal to the radio frequency The processing module 14 and the radio frequency processing module 14 perform radio frequency processing on the received electromagnetic wave signal according to the instruction of the main control chip 13, and send the processed electromagnetic wave signal to the main control chip 13, and the power chip 16 is configured to the communication device 1 Power supply.

The communication device 1 provided by the embodiment of the present application saves the space occupied by the antenna module 17 and the control circuit by arranging the control circuit and the antenna module 17 in the communication device 1 on both sides of the circuit board 11, and because the antenna module 17 The control circuit and the control circuit are arranged on a circuit board 11, so that the path between the antenna module 17 and the control circuit is reduced, thereby reducing the radio frequency difference and improving the radio frequency performance of the antenna module 17.

FIG. 5 is a schematic structural diagram of a terminal provided by this application; as shown in FIGS. 3 and 5, the terminal includes: a housing, a built-in main board 21 and the above-mentioned communication device 1.

The built-in motherboard 21 and the communication device 1 are provided in the housing;

The second surface of the circuit board 11 in the communication device 1 is provided with a grid array package LGA pad 25;

The communication device 1 is connected to the built-in motherboard 21 through the LGA pad 25.

Optionally, the communication device 1 solderably connects the circuit board 11 of the communication device 1 to the built-in main board 21 of the terminal through the LGA pad 25, and the soldered built-in main board 21 is provided inside the housing.

Optionally, the built-in main board 21 is provided with a through hole 23, the control circuit card of the communication device 1 is installed in the through hole 23, and the LGA pad 25 is soldered to one side of the built-in main board 21.

Specifically, a through hole 23 is dug at a position corresponding to the built-in motherboard 21 and the control circuit in the communication device 1, the communication device 1 is carded in the through hole 23 on the built-in motherboard 21, and then the LGA pad 25 is used to communicate The device 1 is soldered to one side of the built-in main board 21, thereby saving the space occupied by the antenna module 17 and the control circuit.

Optionally, the position on the housing corresponding to the antenna module 17 is a hollow structure or adopts a wave-transmitting material.

Specifically, the communication device 1 is welded to the built-in main board 21 of the terminal, and the main board is installed inside the terminal case, because the communication device 1 is configured to transmit and receive electromagnetic wave signals, but the electromagnetic wave signals are in the process of propagation , It is easy to be reflected or absorbed, in order to make the electromagnetic wave signal better propagate, so in the position corresponding to the antenna module 17 on the housing, the transparent wave processing is carried out, wherein the transparent wave processing includes: on the housing and the antenna module 17 The corresponding position is hollowed out, so that the electromagnetic wave signal generated by the antenna module 17 is not absorbed or reflected by the casing during transmission, thereby reducing the radio frequency loss, or the material on the casing corresponding to the antenna module 17 Replaced by a wave-transmitting material, in practical applications, the wave-transmitting material includes: at least one wave-transmitting material among glass fiber and ceramics.

In the terminal provided by this application, the antenna module 17 and the control circuit are arranged on a circuit board 11, so that the path between the antenna module 17 and the control circuit is reduced, space is saved, and furthermore, the radio frequency loss can be reduced, and the antenna module can be improved. 17 RF performance. In addition, there is no need to purchase a separate antenna module, while also reducing design costs. Further, wave transmission processing is performed on the housing corresponding to the antenna module 17 so that the electromagnetic wave signal generated by the antenna module 17 is not absorbed or reflected by the housing during transmission, reducing radio frequency loss.

The above are only optional embodiments of the present application, and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of this application shall be included in the scope of protection of this application.

Industrial applicability

The communication device and the terminal provided by the present application, by arranging the control circuit and the antenna module in the communication device on both sides of the circuit board, thereby saving the space occupied by the antenna module and the control circuit, and because the antenna module and the control circuit are arranged together On the circuit board, the path between the antenna module and the control circuit is reduced, saving space, and further reducing the radio frequency loss, improving the radio frequency performance of the antenna module, and also reducing the design cost.

Claims

A communication device, characterized by comprising: an antenna module, a control circuit and a circuit board; the control circuit comprises: a main control chip and a control chip;

The antenna module is provided on the first surface of the circuit board, and the main control chip and the control chip are provided on the second surface of the circuit board;

The main control chip is electrically connected to the control chip, the antenna module and the control chip are electrically connected through vias on the circuit board, and the control chip is configured to control the station according to the instructions of the main control chip The antenna module sends and receives signals.
The communication device according to claim 1, wherein the antenna module includes a plurality of groups of antenna matrices, each group of antenna matrices corresponds to a control chip, and each control chip and a group of antenna matrices pass through the circuit board The vias are electrically connected, and each control chip controls a corresponding set of antenna matrices.
The communication device according to claim 2, wherein the position of the via corresponds to the lead of the antenna matrix.
The communication device according to claim 3, characterized in that the position of the via corresponds to the wire at the central position of the antenna matrix.
The communication device according to claim 1, wherein the antenna module is provided on the side of the circuit board with copper ground, and the ground copper of the circuit board is configured to reflect the electromagnetic wave signal sent by the antenna module , So that the electromagnetic wave signal emitted by the antenna module converges toward the side away from the circuit board.
The communication device according to any one of claims 1 to 5, wherein the control circuit further includes a memory chip, the memory chip is disposed on the second side of the circuit board, and is electrically connected to the main control chip connection.
The communication device according to any one of claims 1 to 6, wherein the control circuit further includes a power supply chip, the power supply chip is provided on the second side of the circuit board, and the power supply chip and the main The control chip is electrically connected.
The communication device according to any one of claims 1-7, further comprising a shield cover, the shield cover is provided outside the control circuit.
The communication device according to any one of claims 1-8, further comprising a radio frequency processing module, the radio frequency processing module is disposed between the control chip and the main control chip, and is configured in pairs The electromagnetic wave signal received by the antenna module is processed by radio frequency.
The communication device according to claims 1-9, wherein the control circuit further includes a power supply chip, the power supply chip is disposed on the second surface of the circuit board, the power supply chip and the main control chip Electrically connected, the power supply chip is configured to control the power supply to supply power to the communication device under the control of the main control chip.
The communication device according to claims 1-11, wherein the circuit board is a high-frequency circuit board, a dielectric loss factor of the circuit board is less than 0.004, and a dielectric constant of the circuit board is less than 3.5.
A terminal, characterized in that it includes: a housing, a built-in motherboard, and the communication device according to any one of claims 1-7;

The built-in motherboard and the communication device are provided in the housing;

In the communication device, the circuit board is provided with a grid array package LGA pad;

The communication device is connected to the built-in motherboard through the LGA pad.
The terminal according to claim 12, wherein the LGA pad is provided on the second surface of the circuit board.
The terminal according to claim 12 or 13, wherein the built-in main board is provided with a through hole, the control circuit card of the communication device is provided in the through hole, and the LGA pad is connected to all Describe the solder connection on one side of the built-in motherboard.
The terminal according to any one of claims 12 to 14, wherein the position on the housing corresponding to the antenna module is a hollow structure or a wave-transmitting material.