WO2020135729A1 - 一种车载电源结构及其线路板布局结构 - Google Patents

一种车载电源结构及其线路板布局结构 Download PDF

Info

Publication number
WO2020135729A1
WO2020135729A1 PCT/CN2019/129246 CN2019129246W WO2020135729A1 WO 2020135729 A1 WO2020135729 A1 WO 2020135729A1 CN 2019129246 W CN2019129246 W CN 2019129246W WO 2020135729 A1 WO2020135729 A1 WO 2020135729A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
pcb board
capacitor
circuit board
present disclosure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/129246
Other languages
English (en)
French (fr)
Inventor
刘宇
王超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BYD Co Ltd
Original Assignee
BYD Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BYD Co Ltd filed Critical BYD Co Ltd
Publication of WO2020135729A1 publication Critical patent/WO2020135729A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components

Definitions

  • the present disclosure relates to the technical field of electric vehicles, and more particularly, to a vehicle-mounted power supply structure and its circuit board layout structure.
  • the electrical layout of the switching power supply of electric vehicles is an important link in the early stage of product development, and the layout design and peripheral structure design of the device are basically centered on the PCB.
  • most switching power supplies on the market are arranged on a single board plane, and all electronic devices 16 are soldered on the first PCB board 4, and then a shell 15 is added externally; or as shown in FIG. 2.
  • a part of the electronic device 16 is soldered on the first PCB board 4, another part of the electronic device 16 is soldered on the second PCB board 5, and then an external case 15 is added. Interference between components soldered on the same PCB board will affect the overall performance of the vehicle power supply.
  • the present disclosure provides a circuit board layout structure to solve the technical problem existing in the prior art that interference occurs between components soldered on the same PCB board.
  • the technical solution adopted by the present disclosure is to provide a circuit board layout structure including a main PCB board, a first isolator, a magnetic element module and a switch tube module, the first isolator is fixed on the main On the PCB, the magnetic element module is located on one side of the first isolator, the switch tube module is located on the other side of the first isolator, the magnetic element module and the switch tube module are both fixed And it is electrically connected to the main PCB board.
  • the beneficial effect of a circuit board layout structure provided by the present disclosure is that, compared with the prior art, the isolated PCB board of the present disclosure has the function of shielding the magnetic field, ensuring the normal operation of the switch tube module.
  • the switch tube module and the magnetic element module are separated, so that the switch tube module is not easy to generate magnetic field coupling and near field coupling under the action of the magnetic field of the magnetic element module.
  • the present disclosure also provides a vehicle-mounted power supply structure to solve the technical problems existing in the prior art that magnetic devices soldered on the same PCB board are likely to affect each other, and to optimize the performance of the vehicle-mounted power supply.
  • Figure 1 is a structural schematic diagram 1 of the prior art
  • FIG. 2 is a schematic structural diagram 2 of the prior art
  • FIG. 3 is a schematic structural diagram of a circuit board layout structure provided by an embodiment of the present disclosure.
  • FIG. 4 is a schematic structural diagram 1 of a vehicle-mounted power supply structure provided by an embodiment of the present disclosure
  • FIG. 5 is a second structural diagram of a vehicle-mounted power supply structure provided by an embodiment of the present disclosure.
  • FIG. 6 is a schematic diagram of an explosion structure of a vehicle-mounted power supply structure provided by an embodiment of the present disclosure
  • FIG. 7 is a schematic structural diagram 1 of a box of a vehicle-mounted power supply structure provided by an embodiment of the present disclosure
  • FIG. 8 is a schematic structural diagram of a control PCB board of a vehicle-mounted power supply structure provided by an embodiment of the present disclosure
  • FIG. 9 is a second schematic structural diagram of a car body structure provided by an embodiment of the present disclosure.
  • FIG. 10 is a schematic structural diagram of a U-shaped sheet of a vehicle-mounted power supply structure provided by an embodiment of the present disclosure.
  • first and second are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.
  • the features defined as “first” and “second” may explicitly or implicitly include one or more of the features.
  • the meaning of “plurality” is two or more, unless specifically defined otherwise.
  • a circuit board layout structure 100 includes a main PCB board 4, a first isolator 10, a magnetic element module 20 and a switch tube module 30, and the first isolator 10 is an isolating PCB board 6.
  • the magnetic element module 20 includes a transformer module 421 and an inductance module 422.
  • the switch tube module 30 includes several identical switch tubes 424.
  • the isolation PCB board 6 is vertically or obliquely arranged on the main PCB board 4, at least two isolation PCB boards 6 are oppositely arranged, and the switch tube 424 or the transformer module 421 and the inductance module 422 are arranged between the oppositely separated isolation PCB boards 6, In some embodiments of the present disclosure, the switch tube 424 is disposed between the oppositely arranged isolation PCB boards 6, and the transformer module 421 and the inductance module 422 are both disposed outside the isolation PCB board 6.
  • the circuit board layout structure 100 provided by the present disclosure has the effect of shielding the magnetic field of the PCB board 6 while ensuring the normal operation of the switch tube 424.
  • the isolation PCB board 6 separates the switch tube 424 from the transformer module 421 and the inductor module 422, so that the switch tube 424 is not easily affected by the magnetic fields of the inductor module 422 and the transformer module 421 and magnetic field coupling and near-field coupling occur.
  • the two isolation PCB boards 6 enclose the switch tube 424 better, so that the switch tube 424 is located in a space with less magnetic field.
  • the transformer module 421 includes a plurality of closely-coupled transformers 4211, and the inductance module 422 includes a plurality of closely-coupled inductive components 4221.
  • the switch tube 424 is disposed on the main PCB board 4 or the isolation PCB board 6.
  • the switch tube 424 is disposed on the isolation PCB board 6, the use of the space of the main PCB board 4 is reduced, and it is convenient for the main PCB board 4 to set other components.
  • the isolation PCB 6 is provided with eight copper skin layers.
  • the copper skin has a good magnetic field shielding effect.
  • a second isolator 43 is provided between the transformer module 421 and the inductance module 422,
  • the second isolator 43 is a capacitor module 423.
  • the capacitor module 423 is disposed on the circuit board, and the circuit board is the main PCB board 4.
  • the capacitor module 423 includes a capacitor PCB 9 and a plurality of capacitor elements 4231.
  • the capacitor PCB 9 is fixed to the main PCB 4 vertically or obliquely, and the capacitor PCB 9 is electrically connected to the main PCB 4.
  • the magnetic field between the transformer module 421 and the inductor module 422 will affect each other.
  • the capacitor module 423 and the capacitor PCB 9 block the magnetic field between the transformer module 421 and the inductor module 422, so that the magnetic field between the transformer module 421 and the inductor module 422 is weakened.
  • the capacitor PCB 9 has a shielding function, which further prevents the transformer module 421 and the inductor module 422 from easily affecting each other.
  • the capacitive PCB board 9 utilizes the vertical space of the main PCB board 4 to enable the main PCB board 4 to solder more capacitive elements 4231, reducing the overall volume of the vehicle power supply.
  • the cooperation of the capacitor PCB 9 and the capacitor element 4231 greatly reduces the influence between the transformer module 421 and the inductor module 422.
  • the capacitor PCB 9 is provided with eight copper skin layers.
  • the height of the capacitor PCB 9 is higher than the heights of the transformer module 421 and the inductor module 422.
  • FIG. 3 as a specific implementation of a circuit board layout structure 100 provided by the present disclosure, it also includes a powered heating module provided on the main PCB 4 and fixed on the capacitor The packaging surface of the capacitive element 4231 on the PCB 9 faces the outside of the energized heating module.
  • the inductance module 422 emits heat during use, and the packaging surface of the capacitive element 4231 on the capacitor PCB 9 faces the outer side of the energized heating module, which is convenient for reducing the influence of the energized heating module on the capacitor module 423.
  • the power-on heating module is a transformer module 421.
  • At least two energized heating modules are provided, and at least two energized heating modules generate different heat at the same time when energized, and the packaging surface of the capacitive element 4231 fixed on the capacitor PCB 9 Towards a low-temperature energized heating module.
  • the pins of the capacitive element 4231 are vertically connected on the capacitive PCB board 9, and a number of capacitors The components 4231 are aligned on the capacitor PCB 9.
  • the capacitive elements 4231 are closely arranged on the capacitive PCB board 9 to improve the space utilization rate on the capacitive PCB board 9.
  • capacitive elements 4231 are aligned in rows or columns.
  • the capacitor PCB 9 is provided with a first jack 91 and a second jack 92, the first jack 91 is used to connect a pin of the capacitive element 4231, and the second jack 92 is used It is connected to the other pin of the capacitive element 4231.
  • the first insertion hole 91 and the second insertion hole 92 are provided in plurality, the plurality of first insertion holes 91 are provided in rows, and the plurality of second insertion holes 92 are provided in rows.
  • FIG. 3 as a specific implementation of a circuit board layout structure 100 provided by the present disclosure, at least two sets of aligned capacitive elements 4231 are provided on the same capacitor PCB 9 At least two sets of aligned capacitive elements 4231 are provided with isolation plates 93, which are fixed on the main PCB board 4.
  • At least two groups of aligned capacitive elements 4231 of the isolation plate 93 are not likely to affect each other.
  • the isolation board 93 plays a role of supporting the capacitor PCB 9, so that the capacitor PCB 9 is stably connected to the main PCB 4.
  • the capacitive element 4231 is a chip capacitor.
  • the package of the capacitive element 4231 is a rectangular package.
  • the capacitor module 423 further includes a cylindrical capacitor 4232, and the cylindrical capacitor 4232 is disposed in two Between isolated PCB boards 6.
  • the cylindrical capacitor 4232 is provided between the isolated PCB boards 6, so as to make full use of the area between the two isolated PCB boards 6, so that more components are soldered on the main PCB board 4.
  • the present disclosure also provides a vehicle power supply structure 200.
  • a vehicle power supply structure 200 includes a cabinet 1, a shielding plate 2, a water cooling mechanism 3, a main PCB board 4, a control PCB board 5, a power device 41, a non-power device 51, a low voltage
  • the current signal device 52 and the high-voltage large-current signal device 42, the shielding plate 2 is provided in the cabinet 1, and the cabinet 1 is divided into the first area 11 and the second area 12 by the shielding plate 2, the first area 11 and the second area 12 Connected;
  • the water cooling mechanism 3 is provided on the shielding plate 2 or/and the inner wall of the cabinet 1, the water cooling mechanism 3 radiates heat to at least one of the first area 11 and the second area 12;
  • the main PCB board 4 and the control PCB board 5 Electrically connected, the main PCB board 4, the power device 41 and the high-voltage high-current signal device 42 are arranged in the first region 11, the control PCB board 5, the non-power device 51 and the low-voltage low-current signal device 52 are arranged in the second region 12,
  • the low voltage and small current signal device 52 and the high voltage and high current signal device 42 are separated, which prevents the high voltage and high current signal device 42 from being interfered by a weak signal and solves the EMC problem.
  • the water cooling mechanism 3 simultaneously dissipates heat in the first area 11 and the second area 12, which provides a new way for heat dissipation in the cabinet 1 and thus speeds up the heat dissipation in the cabinet 1.
  • the power device 41 has a small volume and is soldered on the main PCB 4 in a unified manner, so that the space in the first area 11 is fully utilized, and the space utilization rate is high, which helps to solve the power density problem of the electrical layout.
  • the water cooling mechanism 3 simultaneously dissipates heat to the first area 11 and the second area 12.
  • the shielding plate 2 is integrally formed with the box 1.
  • the main PCB board 4 and the control PCB board 5 are arranged parallel to the shielding board 2.
  • the box 1 is provided with a first opening 13 for placing the main PCB 4 in the first area 11.
  • the cabinet 1 is provided with a second opening 14 for placing the control PCB 5 in the second area 12.
  • the water cooling mechanism 3 is a metal mechanism.
  • the switch tube 424 is a MOS tube, four MOS tubes are electrically connected to form an H bridge, and two MOS tubes are electrically connected to form a half bridge.
  • control PCB board 5, the isolation PCB board 6, and the main PCB board 4 cooperate to perform signal acquisition, driving, control, communication, power transmission, and the like.
  • the water cooling mechanism 3 includes a cooling tank 31, a water inlet pipe 32, and drainage The tube 33 and the sealing cover 34; the cooling tank 31 is provided with a water inlet 36 and a drain 37, the water inlet 36 and the drain 37 are located in the first area 11; the water inlet 32 is connected to the water inlet 36, and the drain 33 is connected to the drain Port 37; the cooling tank 31, the water inlet pipe 32 and the drain pipe 33 are all provided on the shielding plate 2 and integrally formed with the shielding board 2, the water inlet pipe 32, the drain pipe 33 and the cabinet 1 are integrally formed, the water inlet pipe 32 and the drain pipe 33 The cooling tank 31 is communicated with the outside of the case 1, and the sealing cover 34 is hermetically connected to the opening of the cooling tank 31.
  • the water inlet pipe 32 and the drain pipe 33 facilitate water inflow and water outflow, so that the cooling water in the cooling tank 31 is flowed, so that the heat in the first area 11 and the second area 12 can be quickly taken away, and the speed of heat dissipation is improved.
  • the opening of the cooling groove 31 is located in the first region 11 or the second region 12.
  • the sealing cover 34 is welded at the opening of the cooling groove 31.
  • a number of grid plates 35 are provided in the cooling tank 31, and the grid plates 35 are spaced apart.
  • the grid plate 35 slows down the flow rate of the cooling water entering the cooling tank 31, so that the cooling water can absorb enough heat.
  • the low-voltage small current signal device 52 includes a DC filter 521 and an AC filter 522.
  • the shielding plate 2 or the box 1 is provided with a first groove 21 and a second groove 22.
  • the water cooling mechanism 3 is located between the first groove 21 and the second groove 22.
  • the cooling groove 31 is located between the first groove 21 and the second groove 22.
  • the DC filter 521 is located in the first groove 21 or the second groove 22, and the AC filter 522 is located in the second groove 22 or the first groove 21.
  • the cooling tank 31 isolates the DC filter 521 and the AC filter 522 so that the DC filter 521 and the AC filter 522 are less likely to interfere with each other.
  • the first groove 21 and the second groove 22 are integrally provided on the shielding plate 2.
  • the first groove 21 and the second groove 22 are covered with a sealing plate 23, and the wiring between the DC filter 521, the AC filter 522 and the control PCB 5 passes through the sealing plate 23.
  • the sealing plate 23 allows the DC filter 521 and the AC filter 522 to be disposed in the relatively sealed first groove 21 or the second groove 22, which greatly reduces the mutual interference between the DC filter 521 and the AC filter 522.
  • the low voltage small current signal device 52 includes a battery pack module 523 DC filter 521 and an AC filter 522.
  • the non-power device 51 includes a battery pack module 523 DC filter 521 and an AC filter 522.
  • the high-voltage high-current signal device 42 includes a transformer module 421, an inductor module 422, and a capacitor module 423.
  • the power device 41 is a switch 424.
  • the box 1 is a metal body.
  • FIG. 3 and FIG. 10 as a specific embodiment of a vehicle-mounted power supply structure 200 provided by the present disclosure, the relative arrangement of the control PCB board 5 and the shielding board 2 and the power device 41 are provided On the isolated PCB 6, the power device 41 is in contact with the water cooling mechanism 3 through the heat conduction mechanism 7.
  • the switch tube 424 easily generates a large amount of heat during use.
  • the water cooling mechanism 3 rapidly cools the switch tube 424 to ensure the working performance of the switch tube 424.
  • the heat-conducting mechanism 7 facilitates the rapid transfer of the heat from the switch tube 424 to the water-cooling mechanism 3 so that the heat is directionally transferred, thereby ensuring the speed of heat dissipation.
  • FIG. 3 and FIG. 10 as a specific embodiment of an in-vehicle power supply structure 200 provided by the present disclosure, further includes an elastic mechanism 8 through which the power device 41 interferes with Heat conduction mechanism 7.
  • the power device 41 is a switch 424.
  • the switch tube 424 can be in good contact with the heat conduction mechanism 7, so that the connection between the switch tube 424 and the water cooling mechanism 3 is not easily affected by the environment and is disconnected.
  • the on-board power supply vibrates due to the bumps of the vehicle, and the elastic mechanism 8 counteracts the impact of the vibration on the switch tube 424.
  • the heat conduction mechanism 7 is a heat conduction plate.
  • the heat conduction plate is placed between the water cooling mechanism 3 and the switch tube 424.
  • the elastic mechanism 8 may be a spring or a bending piece.
  • the spring or bending piece has a better ability to restore deformation.
  • the elastic mechanism 8 includes a grid baffle 81, a U-shaped sheet 82 and a fixed On the elastic sheet 83 outside the U-shaped sheet 82, the grid barrier 81 is fixed on the main PCB board 4, and the grid barrier 81 may be vertically arranged on the main PCB board 4.
  • the side of the grid baffle 81 is located inside the U-shaped piece 82, and the elastic piece 83 abuts against the switch tube 424.
  • the grid baffle 81 is connected to the main PCB board 4 so that the elastic mechanism 8 is not easily separated from the main PCB board 4.
  • the U-shaped piece 82 is connected to the grid baffle 81 to facilitate the installation and removal of the elastic piece 83.
  • the elastic piece 83 makes the switch tube 424 interfere with the heat conduction mechanism 7, and the structure is simple and very practical.
  • the U-shaped sheet 82 and the elastic sheet 83 may be integrally formed.
  • the U-shaped sheet 82 is disposed along the length direction of the grid baffle 81, A plurality of switch tubes 424 are provided, and a plurality of elastic sheets 83 are provided.
  • the number of elastic sheets 83 corresponds to the number of switch tubes 424 in one-to-one correspondence.
  • the elastic mechanism 8 can simultaneously abut the plurality of switch tubes 424 on the heat-conducting mechanism 7 to facilitate the stable contact of the plurality of switch tubes 424 with the water cooling mechanism 3.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

一种车载电源结构（200）及其线路板布局结构（100），线路板布局结构（100）包括主PCB板（4）、第一隔离件（10）、磁性元件模块（20）和开关管模块（30），第一隔离件（10）固定在主PCB板（4）上，磁性元件模块（20）位于第一隔离件（10）的一侧，开关管模块（30）位于第一隔离件（10）的另一侧，磁性元件模块（20）和开关管模块（30）均固定且电连接在主PCB板（4）上。

Description

一种车载电源结构及其线路板布局结构
相关申请的交叉引用
本公开基于申请号为201822279126.3，申请日为2018年12月29日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本公开作为参考。
技术领域
本公开涉及电动汽车技术领域，更具体地，涉及一种车载电源结构及其线路板布局结构。
背景技术
电动汽车的开关电源的电气布局是产品开发初期一个重要环节，而且基本都以PCB为中心展开器件布局设计和外围结构设计。如图1所示，在市面上大部分开关电源都为单板平面布置,所有电子器件16焊接在该第一PCB板4上，然后在外部增加一个外壳15；或者如图2所示的一种上下层布置结构，将部分电子器件16焊接在第一PCB板4上，另一部分电子器件16焊接在第二PCB板5上，然后在外部增加一个外壳15。焊接在同一PCB板上的元器件之间会发生干扰，从而影响到车载电源的整体性能。
发明内容
本公开提供一种线路板布局结构，以解决现有技术中存在的焊接在同一PCB板上的元器件之间会发生干扰的技术问题。
为实现上述目的，本公开采用的技术方案是：提供一种线路板布局结构，包括主PCB板、第一隔离件，磁性元件模块和开关管模块，所述第一隔离件固定在所述主PCB板上，所述磁性元件模块位于所述第一隔离件的一侧，所述开关管模块位于所述第一隔离件的另一侧，所述磁性元件模块和所述开关管模块均固定且电连接在所述主PCB板上。
本公开提供的一种线路板布局结构的有益效果在于：与现有技术相比，本公开的隔离PCB板具有屏蔽磁场的作用，保证了开关管模块的正常工作。通过隔离PCB板将开关管模块与磁性元件模块分隔开，使开关管模块不易在磁性元件模块的磁场作用下而发生磁场耦合和近场耦合。
本公开还提供一种车载电源结构，以解决现有技术中存在的焊接在同一PCB板的磁性器件之间容易互相影响的技术问题，优化车载电源的性能的作用。
本公开的其他特征和优点将在随后的具体实施方式部分予以详细说明。
附图说明
附图是用来提供对本公开的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本公开，但并不构成对本公开的限制。在附图中：
图1为现有技术的结构示意图一；
图2为现有技术的结构示意图二；
图3为本公开实施例提供的一种线路板布局结构的结构示意图；
图4为本公开实施例提供的一种车载电源结构的结构示意图一；
图5为本公开实施例提供的一种车载电源结构的结构示意图二；
图6为本公开实施例提供的一种车载电源结构的爆炸结构示意图；
图7为本公开实施例提供的一种车载电源结构的箱体的结构示意图一；
图8为本公开实施例提供的一种车载电源结构的控制PCB板的结构示意图；
图9为本公开实施例提供的一种车载电源结构的箱体的结构示意图二；
图10为本公开实施例提供的一种车载电源结构的U形片的结构示意图。
具体实施方式
为了使本公开所要解决的技术问题、技术方案及有益效果更加清楚明白，以下结合附图及实施例，对本公开进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本公开，并不用于限定本公开。
需要说明的是，当元件被称为“固定于”或“设置于”另一个元件，它可以直接在另一个元件上或者间接在该另一个元件上。当一个元件被称为是“连接于”另一个元件，它可以是直接连接到另一个元件或间接连接至该另一个元件上。
需要理解的是，术语“长度”、“宽度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本公开和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本公开的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本公开的描述中，“多个”的含义是两个或两个 以上，除非另有明确具体的限定。
请参阅图3，现对本公开提供的一种线路板布局结构100进行说明。一种线路板布局结构100，包括主PCB板4、第一隔离件10，磁性元件模块20和开关管模块30，第一隔离件10为隔离PCB板6。磁性元件模块20包括变压器模块421和电感模块422。开关管模块30包括若干相同的开关管424。隔离PCB板6垂直或倾斜设置于主PCB板4上，隔离PCB板6至少相对设置有两个，开关管424或变压器模块421和电感模块422设置在相对设置的隔离PCB板6之间，在本公开的一些实施例中，开关管424设置在相对设置的隔离PCB板6之间，变压器模块421和电感模块422均设置在隔离PCB板6的外侧。
本公开提供的一种线路板布局结构100，与现有技术相比，隔离PCB板6具有屏蔽磁场的作用，同时保证了开关管424的正常工作。通过隔离PCB板6将开关管424与变压器模块421、电感模块422分隔开，使开关管424不易受到电感模块422与变压器模块421的磁场的影响而发生磁场耦合和近场耦合。两个隔离PCB板6将开关管424较好的围住，使开关管424位于磁场较少的空间内。
在本公开的一些实施例中，变压器模块421包括若干紧靠的变压器4211，电感模块422包括若干紧靠的电感元器件4221。
在本公开的一些实施例中，开关管424设置在主PCB板4或隔离PCB板6上。当开关管424设置在隔离PCB板6上时，减少了主PCB板4的空间的使用，便于主PCB板4设置其他的元器件。
在本公开的一些实施例中，隔离PCB板6设置八层铜皮层。铜皮层具有较好的磁场屏蔽的作用。
在本公开的一些实施例中，请参阅图3，作为本公开提供的一种线路板布局结构100的一种具体实施方式，变压器模块421和电感模块422之间设有第二隔离件43，第二隔离件43为电容模块423，电容模块423设置在电路主板上，电路主板为主PCB板4。电容模块423包括电容PCB板9和若干个电容元件4231。电容PCB板9垂直或倾斜固定于主PCB板4，电容PCB板9与主PCB板4电连接。
变压器模块421和电感模块422之间的磁场会相互影响。电容模块423和电容PCB板9阻挡在变压器模块421和电感模块422之间的磁场上，使变压器模块421和电感模块422之间的磁场减弱。电容PCB板9具有屏蔽的作用，进一步使变压器模块421和电感模块422之间不易相互影响。同时，电容PCB板9利用了主PCB板4的竖向空间，使主PCB板4能够焊接较多的电容元件4231，减少了车载电源的整体的体积。电容PCB板9和电容元件4231配合，极大地降低了变压器模块421和电感模块422之间影响。
在本公开的一些实施例中，电容PCB板9设置八层铜皮层。
在本公开的一些实施例中，电容PCB板9的高度高于变压器模块421和电感模块422的高度。
在本公开的一些实施例中，请参阅图3，作为本公开提供的一种线路板布局结构100的一种具体实施方式，还包括设置在主PCB板4上的通电发热模块，固定在电容PCB板9上的电容元件4231的封装面朝向通电发热模块的外侧。
电感模块422在使用的过程发出热量，电容PCB板9上的电容元件4231的封装面朝向通电发热模块的外侧，便于减少通电发热模块对电容模块423的影响。
在本公开的一些实施例中，通电发热模块为变压器模块421。
在本公开的一些实施例中，通电发热模块至少设置有两个，至少两个通电发热模块通电时在相同时间内产生的热量不一样，固定在电容PCB板9上的电容元件4231的封装面朝向温度低的通电发热模块。
在本公开的一些实施例中，请参阅图3，作为本公开提供的一种线路板布局结构100的一种具体实施方式，电容元件4231的引脚垂直连接在电容PCB板9上，若干电容元件4231之间对齐设置在电容PCB板9上。
电容元件4231紧密排列在电容PCB板9上，提高电容PCB板9上的空间利用率。
在本公开的一些实施例中，若干电容元件4231之间呈排对齐或呈列对齐。
在本公开的一些实施例中，电容PCB板9上设有第一插孔91和第二插孔92，第一插孔91用于连接电容元件4231的一引脚，第二插孔92用于连接电容元件4231的另一引脚。第一插孔91和第二插孔92设置多个，多个第一插孔91成排设置，多个第二插孔92成排设置。当需要安装或拆卸电容时，将电容元件4231从电容PCB板9上插入或拔出，非常方便。
在本公开的一些实施例中，请参阅图3，作为本公开提供的一种线路板布局结构100的一种具体实施方式，同一个电容PCB板9上设置有至少两组对齐的电容元件4231，至少两组对齐电容元件4231之间设置有隔离板93，隔离板93固定在主PCB板4上。
隔离板93至少两组对齐的电容元件4231之间不易相互影响。同时隔离板93起到支撑电容PCB板9的作用，使电容PCB板9稳定连接在主PCB板4上。
在本公开的一些实施例中，电容元件4231为贴片电容。
在本公开的一些实施例中，电容元件4231的封装为方体封装。
在本公开的一些实施例中，请参阅图3，作为本公开提供的一种线路板布局结构100的一种具体实施方式，电容模块423还包括圆柱形电容4232，圆柱形电容4232设置在两个隔离PCB板6之间。
圆柱形电容4232设置在隔离PCB板6之间，从而充分利用两个隔离PCB板6之间的区 域，使主PCB板4上焊接较多的元器件。
请参阅图4到图10，本公开还提供一种车载电源结构200。
一种车载电源结构200，如图4和图5所示，包括箱体1、屏蔽板2、水冷机构3、主PCB板4、控制PCB板5、功率器件41、非功率器件51、低压小电流信号器件52以及高压大电流信号器件42，屏蔽板2设置在箱体1内，箱体1通过屏蔽板2分为第一区域11和第二区域12，第一区域11和第二区域12连通；水冷机构3设置屏蔽板2上或/和箱体1的内壁上，水冷机构3对第一区域11和第二区域12中的至少一个区域进行散热；主PCB板4和控制PCB板5电连接，主PCB板4、功率器件41和高压大电流信号器件42设置在第一区域11，控制PCB板5、非功率器件51和低压小电流信号器件52设置在第二区域12，功率器件41和高压大电流器件42电连接在主PCB板4上，非功率器件51和低压小电流信号器件52电连接在控制PCB板5上。
通过增加了水冷机构3和屏蔽板2，将低压小电流信号器件52和高压大电流信号器件42隔开，防止了高压大电流信号器件42被弱信号干扰，解决了EMC问题。水冷机构3同时对第一区域11和第二区域12进行散热，为箱体1内的散热提供了新的途径，进而加快了箱体1内的散热速度。功率器件41，功率器件41的体积较小，统一焊接在主PCB板4，便于对第一区域11内的空间进行充分利用，空间利用率高，有助于解决电气布局的功率密度问题。
在本公开的一些实施例中，水冷机构3同时对第一区域11和第二区域12进行散热。
在本公开的一些实施例中，屏蔽板2与箱体1一体成型。主PCB板4和控制PCB板5平行设置于屏蔽板2。箱体1上设有用于放置主PCB板4在第一区域11的第一开口13。箱体1上设有用于放置控制PCB板5在第二区域12的第二开口14。水冷机构3为金属机构。开关管424为MOS管，四个MOS管电连接组成H桥，两个MOS管电连接成半桥。
在本公开的一些实施例中，控制PCB板5、隔离PCB板6以及主PCB板4配合进行信号的采集、驱动、控制、通信和功率传输等。
在本公开的一些实施例中，请一并参阅图6和图7，作为本公开提供的一种车载电源结构200的一种具体实施方式，水冷机构3包括冷却槽31、进水管32、排水管33、以及密封盖34；冷却槽31上设有进水口36和排水口37，进水口36和排水口37位于第一区域11；进水管32连接于进水口36，排水管33连接于排水口37；冷却槽31、进水管32与排水管33均设置在屏蔽板2上且与屏蔽板2一体成型，进水管32、排水管33与箱体1一体成型，进水管32和排水管33使冷却槽31与箱体1的外部连通，密封盖34密封连接于冷却槽31的开口处。
进水管32和排水管33便于进水和出水，使冷却槽31内的冷却水得到流动，使第一区 域11和第二区域12内的热量能够被快速带走，提高散热的速度。
在本公开的一些实施例中，冷却槽31的开口位于第一区域11或者第二区域12。
在本公开的一些实施例中，密封盖34焊接在冷却槽31的开口处。
在本公开的一些实施例中，冷却槽31内设有若干个格栅板35，若干格栅板35之间相隔设置。格栅板35使进入到冷却槽31内的冷却水的流速减慢，便于冷却水吸收足够多的热量。
在本公开的一些实施例中，请参阅图6至图8，作为本公开提供的一种车载电源结构200的一种具体实施方式，低压小电流信号器件52包括直流滤波器521和交流滤波器522。屏蔽板2或箱体1上设有第一凹槽21和第二凹槽22。水冷机构3位于第一凹槽21和第二凹槽22之间，在一些实施例中，冷却槽31位于第一凹槽21和第二凹槽22之间。直流滤波器521位于第一凹槽21或第二凹槽22，交流滤波器522位于第二凹槽22或第一凹槽21。
冷却槽31对直流滤波器521和交流滤波器522进行隔离，使直流滤波器521和交流滤波器522之间不易发生相互干扰。
在本公开的一些实施例中，第一凹槽21和第二凹槽22一体设置在屏蔽板2上。
在本公开的一些实施例中，第一凹槽21和第二凹槽22盖设有密封板23，直流滤波器521、交流滤波器522与控制PCB板5的接线穿过密封板23。密封板23使直流滤波器521和交流滤波器522设置在相对密闭的第一凹槽21或第二凹槽22内，极大地减少直流滤波器521和交流滤波器522之间的相互干扰。
在本公开的一些实施例中，低压小电流信号器件52包括电池包模块523直流滤波器521以及交流滤波器522。
非功率器件51包括电池包模块523直流滤波器521以及交流滤波器522。
在本公开的一些实施例中，高压大电流信号器件42包括变压器模块421、电感模块422、电容模块423。功率器件41为开关管424。
在本公开的一些实施例中，箱体1为金属体。
在本公开的一些实施例中，请参阅图3和图10，作为本公开提供的一种车载电源结构200的一种具体实施方式，控制PCB板5相对设置与屏蔽板2，功率器件41设置在隔离PCB板6上，功率器件41与水冷机构3通过导热机构7接触。
开关管424在使用的过程中容易产生大量的热量，通过水冷机构3对开关管424进行快速降温，从而保证开关管424的工作性能。导热机构7便于将开关管424上的热量快速传递到水冷机构3上，使热量进行定向传递，从而保证散热的速度。
在本公开的一些实施例中，请参阅图3和图10，作为本公开提供的一种车载电源结构200的一种具体实施方式，还包括弹性机构8，功率器件41通过弹性机构8抵触在导热机 构7上。功率器件41为开关管424。
保证开关管424能够较好地与导热机构7接触，从而开关管424与水冷机构3的连接不易受到环境的影响而发生脱离。在行车的过程中，车载电源因车辆的颠簸而发生振动，弹性机构8抵消了振动对开关管424的影响。
在本公开的一些实施例中，导热机构7为导热板。导热板放置在水冷机构3和开关管424之间。
在本公开的一些实施例中，弹性机构8可为弹簧或弯折片。弹簧或弯折片具有较好的恢复形变的能力。
在本公开的一些实施例中，请参阅图3至图10，作为本公开提供的一种车载电源结构200的一种具体实施方式，弹性机构8包括格挡板81、U形片82和固定在U形片82的外侧的弹性片83，格挡板81固定在主PCB板4上，格挡板81可垂直设置于主PCB板4。格挡板81的侧边位于U形片82的内侧，弹性片83抵触在开关管424上。
通过格挡板81连接在主PCB板4，从而弹性机构8不易脱离主PCB板4。U形片82连接在格挡板81上，便于安装和拆卸弹性片83。弹性片83使开关管424抵触在导热机构7，结构简单，非常实用。U形片82和弹性片83可以一体成型。
在本公开的一些实施例中，请参阅图3和图10，作为本公开提供的一种车载电源结构200的一种具体实施方式，U形片82沿着格挡板81的长度方向设置，开关管424设置有多个，弹性片83设置有多个，弹性片83的数量和开关管424的数量一一对应。
弹性机构8能够同时将多个开关管424抵触在导热机构7上，便于使多个开关管424稳定与水冷机构3接触。
以上所述仅为本公开的较佳实施例而已，并不用以限制本公开，凡在本公开的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本公开的保护范围之内。

Claims (10)

  1. 一种线路板布局结构，其特征在于，包括主PCB板、第一隔离件，磁性元件模块和开关管模块，所述第一隔离件固定在所述主PCB板上，所述磁性元件模块位于所述第一隔离件的一侧，所述开关管模块位于所述第一隔离件的另一侧，所述磁性元件模块和所述开关管模块均固定且电连接在所述主PCB板上。
  2. 如权利要求1所述的一种线路板布局结构，其特征在于，所述第一隔离件为隔离PCB板，所述隔离PCB板电连接于所述主PCB板，所述开关管模块包括若干相同的开关管，所述开关管固定且电连接于所述隔离PCB板上。
  3. 如权利要求2所述的一种线路板布局结构，其特征在于，所述隔离PCB板相对设置有两个，所述开关管模块或所述磁性元件模块位于两个所述隔离PCB板之间。
  4. 如权利要求1-3中任一项所述的一种线路板布局结构，其特征在于，所述磁性元件模块包括变压器模块和电感模块，所述变压器模块包括若干紧靠的变压器，所述电感模块包括若干紧靠的电感元器件。
  5. 如权利要求4所述的一种线路板布局结构，其特征在于，所述变压器模块和所述电感模块之间设有第二隔离件。
  6. 如权利要求5所述的一种线路板布局结构，其特征在于，所述第二隔离件为电容模块，所述电容模块固定且电连接于所述主PCB板上。
  7. 如权利要求6所述的一种线路板布局结构，其特征在于，所述电容模块包括电容PCB板以及若干布置于所述电容PCB板上的电容元件，所述电容PCB板垂直或倾斜固定在主PCB板上，所述电容PCB板与于所述主PCB板电连接，所述电容PCB板位于所述主PCB板的侧面。
  8. 如权利要求7所述的一种线路板布局结构，其特征在于，所述电容元件的封装面朝向所述变压器模块，所述电容PCB板朝向所述电感模块。
  9. 如权利要求8所述的一种线路板布局结构，其特征在于，同一个所述电容PCB板上设置有至少两组对齐的所述电容元件，至少两组对齐所述电容元件之间设置有隔离板，所述隔离板固定在主PCB板上。
  10. 一种车载电源结构，其特征在于，包括权利要求1-9任意一项所述的一种线路板布局结构。
PCT/CN2019/129246 2018-12-29 2019-12-27 一种车载电源结构及其线路板布局结构 Ceased WO2020135729A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201822279126.3U CN209593902U (zh) 2018-12-29 2018-12-29 一种车载电源结构及其线路板布局结构
CN201822279126.3 2018-12-29

Publications (1)

Publication Number Publication Date
WO2020135729A1 true WO2020135729A1 (zh) 2020-07-02

Family

ID=68351860

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/129246 Ceased WO2020135729A1 (zh) 2018-12-29 2019-12-27 一种车载电源结构及其线路板布局结构

Country Status (2)

Country Link
CN (1) CN209593902U (zh)
WO (1) WO2020135729A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN209593902U (zh) * 2018-12-29 2019-11-05 比亚迪股份有限公司 一种车载电源结构及其线路板布局结构
CN111386022A (zh) * 2018-12-29 2020-07-07 比亚迪股份有限公司 一种车载电源结构

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110176279A1 (en) * 2010-01-21 2011-07-21 Broadcom Corporation Electromagnetic interference shield with integrated heat sink
CN203251517U (zh) * 2013-05-15 2013-10-23 安波电机(宁德)有限公司 一种具有集成设计的调速电机控制器
CN105376938A (zh) * 2015-11-12 2016-03-02 惠州Tcl移动通信有限公司 一种通讯设备及其电路板组件
CN209594201U (zh) * 2018-12-29 2019-11-05 比亚迪股份有限公司 一种车载电源结构
CN209593902U (zh) * 2018-12-29 2019-11-05 比亚迪股份有限公司 一种车载电源结构及其线路板布局结构
CN209593254U (zh) * 2018-12-29 2019-11-05 比亚迪股份有限公司 一种车载电源结构、线路板布局结构及其电容模块

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110176279A1 (en) * 2010-01-21 2011-07-21 Broadcom Corporation Electromagnetic interference shield with integrated heat sink
CN203251517U (zh) * 2013-05-15 2013-10-23 安波电机(宁德)有限公司 一种具有集成设计的调速电机控制器
CN105376938A (zh) * 2015-11-12 2016-03-02 惠州Tcl移动通信有限公司 一种通讯设备及其电路板组件
CN209594201U (zh) * 2018-12-29 2019-11-05 比亚迪股份有限公司 一种车载电源结构
CN209593902U (zh) * 2018-12-29 2019-11-05 比亚迪股份有限公司 一种车载电源结构及其线路板布局结构
CN209593254U (zh) * 2018-12-29 2019-11-05 比亚迪股份有限公司 一种车载电源结构、线路板布局结构及其电容模块

Also Published As

Publication number Publication date
CN209593902U (zh) 2019-11-05

Similar Documents

Publication Publication Date Title
EP2830073B1 (en) Power conversion apparatus
CN111403174B (zh) 集成emc和泄放功能的薄膜电容及其电机控制器
US10568235B2 (en) On-board charger with heat dissipation structure
CN107294312B (zh) 一种电动汽车电机控制器结构
WO2020135732A1 (zh) 一种车载电源结构
CN209593902U (zh) 一种车载电源结构及其线路板布局结构
CN209594201U (zh) 一种车载电源结构
CN209593254U (zh) 一种车载电源结构、线路板布局结构及其电容模块
CN115802734A (zh) 一种emc滤波器屏蔽结构及emc滤波器
CN118201345A (zh) 车载充电机
CN203675518U (zh) 一种嵌入式车载机箱
CN215073615U (zh) 一种模块化的有源电力滤波器
CN218519541U (zh) 一种电动汽车充电桩散热系统和充电桩
CN219418779U (zh) 母线电容及控制器
CN121618863A (zh) 一种光伏逆变器
CN206789434U (zh) 超级电容模组
CN209786002U (zh) 一种环保型新能源汽车用双层结构铝合金电池箱
WO2024178564A1 (zh) 车载充电机及车辆
CN221688506U (zh) 功率模块、车载电源及车辆
CN102522510A (zh) 电池系统
CN209823630U (zh) 一种双面对插式安装方式的功率模块
CN207720015U (zh) 一种基于压接式igbt的多电平模组装置
CN223553660U (zh) 电机控制器、电机及车辆
CN206623793U (zh) 一种新能源汽车控制器
CN203761682U (zh) 绕线集成于印刷电路板的磁元件及绕线的散热结构

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19901669

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19901669

Country of ref document: EP

Kind code of ref document: A1