WO2020134823A1 - 移动终端 - Google Patents

移动终端 Download PDF

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Publication number
WO2020134823A1
WO2020134823A1 PCT/CN2019/121436 CN2019121436W WO2020134823A1 WO 2020134823 A1 WO2020134823 A1 WO 2020134823A1 CN 2019121436 W CN2019121436 W CN 2019121436W WO 2020134823 A1 WO2020134823 A1 WO 2020134823A1
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WO
WIPO (PCT)
Prior art keywords
host
sub
machine
slave
module
Prior art date
Application number
PCT/CN2019/121436
Other languages
English (en)
French (fr)
Inventor
杨自美
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2020134823A1 publication Critical patent/WO2020134823A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/72—Mobile telephones; Cordless telephones, i.e. devices for establishing wireless links to base stations without route selection
    • H04M1/725—Cordless telephones

Definitions

  • the invention relates to the technical field of terminals, in particular to a mobile terminal.
  • a mobile terminal including:
  • the slave unit includes a display screen, a first power module and a first extremely high frequency communication chip, and the first power module can supply power to the display screen and the first extremely high frequency communication chip;
  • the host includes a second power module and a second extremely high frequency communication chip, and the second power module can supply power to the second extremely high frequency communication chip; the slave unit can be installed on the host to make the first An EHF communication chip is paired with the second EHF communication chip to realize the communication connection between the slave and the host; the slave can be detached from the host, and the slave After the host is disassembled, the slave can communicate with the host.
  • a mobile terminal including:
  • the handset including the display screen and the first extremely high frequency communication chip;
  • a host including a second very high frequency communication chip
  • the slave can be installed on the host to pair the first extremely high frequency communication chip with the second extremely high frequency communication chip to realize the slave Communication connection with the host; the slave can be detached from the host, and after the slave is detached from the host, the slave can be communicatively connected with the host.
  • FIG. 1 is a perspective view of a mobile terminal in an embodiment
  • FIG. 2 is a perspective view of the mobile terminal shown in FIG. 1 after being detached from the host;
  • FIG. 3 is a front view of the mobile terminal shown in FIG. 2 after removing some parts;
  • FIG. 4 is an exploded view of the handset of the mobile terminal shown in FIG. 2;
  • FIG. 5 is a perspective view of the mobile terminal shown in FIG. 2 after removing some parts;
  • FIG. 6 is a perspective view of another perspective of the host of the mobile terminal shown in FIG. 5 after removing some parts;
  • FIG. 7 is a perspective view of the mobile terminal shown in FIG. 2 placed obliquely on the main unit;
  • FIG. 8 is a flowchart of a mobile terminal in a first working state in an embodiment
  • FIG. 9 is another flowchart of the mobile terminal shown in FIG. 8 in the first working state
  • FIG. 10 is a flowchart of a mobile terminal in a second working state in an embodiment
  • FIG. 11 is another flowchart of the mobile terminal shown in FIG. 10 in the second working state
  • FIG. 12 is a schematic structural diagram of a module of a mobile terminal in an embodiment
  • FIG. 13 is a schematic structural diagram of a module of a mobile terminal in another embodiment
  • FIG. 14 is a schematic structural diagram of a module of a mobile terminal in another embodiment.
  • terminal device refers to a device that includes but is not limited to a device capable of receiving and/or transmitting communication signals connected via any one or several of the following connection methods:
  • connection via wired line such as via Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, direct cable connection;
  • PSTN Public Switched Telephone Networks
  • DSL Digital Subscriber Line
  • DSL Digital Subscriber Line
  • wireless interface such as cellular network, wireless local area network (Wireless Local Area Network, WLAN), digital TV network such as DVB-H network, satellite network, AM-FM broadcast transmitter.
  • wireless local area network Wireless Local Area Network, WLAN
  • digital TV network such as DVB-H network
  • satellite network AM-FM broadcast transmitter.
  • a terminal device set to communicate through a wireless interface may be called a "mobile terminal".
  • mobile terminals include but are not limited to the following electronic devices:
  • Satellite phone or cellular phone (1) Satellite phone or cellular phone
  • PCS personal communication system
  • the mobile terminal 10 is a smartphone.
  • the mobile terminal 10 includes a slave 100 and a host 200.
  • the handset 100 includes a display screen 110, a first power module 130, and a first extremely high frequency communication chip 150.
  • the first power module 130 can be the display screen 110 and the first extremely high frequency communication chip 150.
  • Power supply, the display screen 110 can be used to display information and provide an interactive interface for the user.
  • the host 200 includes a second power module 220 and a second extremely high frequency communication chip 240, and the second power module 220 can supply power to the second extremely high frequency communication chip 240. Referring to FIG.
  • the slave 100 can be installed in the host 200 to pair the first extremely high frequency communication chip 150 with the second extremely high frequency communication chip 240 to realize the communication connection between the slave 100 and the host 200.
  • the slave 100 can also be detached from the host 200, and after the slave 100 is detached from the host 200, the slave 100 can be communicatively connected to the host 200.
  • the first extremely high frequency communication chip 150 and the second extremely high frequency communication chip 240 are both extremely high frequency communication chips.
  • the UHF communication chip is an IC (Integrated Circuit) chip with an EHF (extremely high frequency) antenna packaged inside. Only when the two UHF communication chips are close enough can they be paired for wireless Communication.
  • An example of an extremely high frequency communication chip is an EHF common link chip.
  • the terms "common link chip”, “common link chip package” and “EHF communication link chip package” are used to refer to the EHF antenna embedded in the IC package.
  • the extremely high frequency communication chip encapsulates the extremely high frequency antenna, and the handset 100 equipped with the extremely high frequency communication chip can realize high-speed wireless data communication with the terminal device equipped with the extremely high frequency communication chip based on a high carrier frequency (for example, 60 GHz) Transmission (for example, a transmission speed of up to 6GB/s).
  • a high carrier frequency for example, 60 GHz
  • Transmission for example, a transmission speed of up to 6GB/s.
  • short-range wireless communication based on high carrier frequency has the advantages of low power consumption, small size, fast transmission rate, non-contact transmission, etc., and can also realize the function of a plug-and-play module, which can greatly improve signal integrity , Support more flexible system implementation, reduce standby power consumption, increase the bandwidth and security of data transmission, compatible with the support of high-speed video signals and other features.
  • the high carrier frequency may be a carrier frequency that can realize high-speed data wireless transmission.
  • the high carrier frequency may be a specific carrier frequency or a carrier frequency band, for example, 30 GHz-300 GHz, which is not specifically limited in the embodiments of the present application.
  • the high carrier frequency is 60 GHz.
  • the first very high frequency communication chip 150 may include a first transducer and a first integrated circuit (IC).
  • the first transducer is used to convert electromagnetic signals into radio frequency electrical signals. Is coupled to the first transducer.
  • the first integrated circuit includes a receiver circuit and a signal detector circuit. The receiver circuit is used to receive a first radio frequency electrical signal from the first transducer, and convert the first radio frequency electrical signal into a first baseband signal, and the control signal The first baseband signal is output when there is a first state, and the first baseband signal is not output when the control signal has a second state different from the first state.
  • the signal detector circuit is responsive to a monitor signal representing the received first radio frequency electrical signal for generating a control signal having a first state when the monitor signal indicates that the received first radio frequency electrical signal is an acceptable signal, And a control signal having a second state is generated when the monitor signal indicates that the received first radio frequency electrical signal is not an acceptable signal.
  • This type of extremely high frequency communication chip is an extremely high frequency communication chip that receives electromagnetic signals.
  • the second EHF communication chip 240 may include a second transducer and a second integrated circuit.
  • the second transducer is used to convert the radio frequency electrical signal into an electromagnetic signal, and the second transducer is sufficiently close to the first transducer to allow The first transducer receives the electromagnetic signal generated by the second transducer.
  • the second integrated circuit is used for coupling to the second transducer.
  • the second integrated circuit contains a transmitter circuit for receiving the second baseband signal and converting the second baseband signal into a second radio frequency electrical signal, and converting the second radio frequency electrical signal The signal is conducted to the second transducer.
  • This type of extremely high frequency communication chip is an extremely high frequency communication chip that transmits electromagnetic signals.
  • the first very high frequency communication chip 150 may be provided in two, one of which is an extremely high frequency communication chip that receives electromagnetic signals, and the other is an extremely high frequency communication chip that transmits electromagnetic signals.
  • Two second extremely high frequency communication chips 240 may be provided correspondingly, one of which is an extremely high frequency communication chip that transmits electromagnetic signals, and the other is an extremely high frequency communication chip that receives electromagnetic signals.
  • the first extremely high frequency communication chip 150 or the second extremely high frequency communication chip 240 may be an extremely high frequency communication chip having both the functions of transmitting and receiving signals.
  • the first ultra-high frequency communication chip 150 may include a transducer and an integrated circuit (IC). To convert between radio frequency electrical signals and electromagnetic signals.
  • the integrated circuit is used to couple to the transducer.
  • the integrated circuit contains a transmitter circuit and a receiver circuit.
  • the transmitter circuit can convert the baseband signal to a radio frequency electrical signal, and the radio frequency electrical signal is conducted to the transducer, and then the transducer
  • the radio frequency electrical signal is converted into an electromagnetic signal and transmitted; after the transducer receives the electromagnetic signal, it can be converted into a radio frequency electrical signal.
  • the receiver circuit can receive the radio frequency electrical signal from the transducer and convert the radio frequency electrical signal into a baseband signal.
  • the first extremely high-frequency communication chip 150 may further include an electromagnetic energy guide assembly that is mounted relative to the transducer for guiding in a region that includes the transducer and away from the integrated circuit Electromagnetic energy.
  • the first extremely high frequency communication chip 150 when the first extremely high frequency communication chip 150 is an extremely high frequency communication chip having a function of transmitting and receiving signals at the same time, the first extremely high frequency communication chip 150 may include a first transducer and a second transducer Device, first integrated circuit and second integrated circuit.
  • the first transducer is used to convert the electromagnetic signal into a radio frequency electrical signal
  • the first integrated circuit is used to couple to the first transducer.
  • the first integrated circuit includes a receiver circuit and a signal detector circuit.
  • the receiver circuit is used to receive a first radio frequency electrical signal from the first transducer, and convert the first radio frequency electrical signal into a first baseband signal, and the control signal
  • the first baseband signal is output when there is a first state, and the first baseband signal is not output when the control signal has a second state different from the first state.
  • the signal detector circuit is responsive to a monitor signal representing the received first radio frequency electrical signal for generating a control signal having a first state when the monitor signal indicates that the received first radio frequency electrical signal is an acceptable signal, And a control signal having a second state is generated when the monitor signal indicates that the received first radio frequency electrical signal is not an acceptable signal.
  • the second transducer is used to convert the radio frequency electrical signal into an electromagnetic signal.
  • the second transducer is sufficiently close to the first transducer to allow the first transducer to receive the electromagnetic signal generated by the second transducer.
  • the second integrated circuit is used for coupling to the second transducer.
  • the second integrated circuit contains a transmitter circuit for receiving the second baseband signal and converting the second baseband signal into a second radio frequency electrical signal, and converting the second radio frequency electrical signal The signal is conducted to the second transducer.
  • the first very high frequency communication chip 150 is substantially rectangular shaped
  • the second extremely high frequency communication chip 240 is substantially rectangular shaped.
  • the normal line passing through the centroid of the first EHF communication chip 150 and the second EHF communication chip 240 There is an intersection point on the surface, and the distance between the intersection point and the centroid of the second EHF communication chip 240 is less than or equal to 2.5 mm.
  • the centroid of the first EHF communication chip 150 and the center of the second EHF communication chip 240 The distance between the centroids is less than or equal to 8.5 mm.
  • the above setting can achieve reliable communication between the first extremely high-frequency communication chip 150 and the second extremely high-frequency communication chip 240, so as to facilitate the communication between the host 200 and the slave 100 data transmission.
  • the slave 100 can be installed in and removed from the host 200, and after the disassembly, the slave 100 can communicate with the host 200, and the electronic components of the slave 100 can be set less to make the slave 100 is thinner.
  • the host 200 may be provided with a large-capacity battery or storage unit, and the host 200 may be placed in a pocket or other place and wirelessly connected to the slave 100.
  • the host 200 can access a cellular communication network or WiFi (Wireless), and perform data interactive transmission with the slave 100.
  • WiFi Wireless
  • the mobile terminal 10 with the above-mentioned structure can not only improve the thinness and portability of the mobile terminal 10 through the handset 100, but also enable the mobile terminal 10 to have higher performance.
  • the slave 100 is installed on the host 200, since the first extremely high frequency communication chip 150 can be paired with the second extremely high frequency communication chip 240 to realize the communication connection between the slave 100 and the master 200, the above setting makes the master 200 and the slave 100 The communication connection between them can achieve higher quality and efficiency.
  • the main body 200 is substantially in the shape of a rectangular block.
  • the main body 200 includes a front surface 211 and a rear surface 213 disposed opposite to each other, and a side peripheral surface connected between the front surface 211 and the rear surface 213.
  • the top side 212 and the bottom side 214 are provided, and the left side 216 and the right side 218 opposite to each other are located between the top side 212 and the bottom side 214, respectively.
  • the side of the handset 100 facing away from the displayable area of the display screen 110 can be stacked on the front surface 211 so that the first EHF communication chip 150 and the second EHF communication chip 240 are paired.
  • the front surface 211 side of the main unit 200 is in the form of a groove with a low center and a high circumferential direction.
  • the groove of the main unit 200 can accommodate part of the structure of the sub-machine 100, and the main unit
  • the structure protruding in the circumferential direction of 200 can surround the outer periphery of the sub machine 100 so that the sub machine 100 can be conveniently positioned on the main machine 200.
  • the above positioning facilitates the pairing of the first EHF communication chip 150 and the second EHF communication chip 240.
  • the sub machine 100 may include a magnetic attraction assembly 160, and the main machine 200 includes an adsorption member.
  • the magnetic attraction assembly 160 can be adsorbed to the adsorption member.
  • one of the magnetic attraction component 160 and the suction member is a magnet, and the other may be a ferromagnetic metal or a magnet.
  • the magnetic metal may be iron, cobalt, nickel or alloys thereof.
  • the magnetic component 160 is a magnet.
  • the host 200 includes a housing 210, and a front surface 211, a rear surface 213, and a side peripheral surface are respectively located on the housing 210.
  • the housing 210 of the host 200 may be made of ferromagnetic metal, so as to use the housing 210 of the host 200 as an adsorption member.
  • the arrangement of the magnetic component 160 and the suction member is beneficial to the reliable positioning of the slave 100 on the host 200.
  • the handset 100 has a substantially rectangular block shape.
  • the handset 100 includes a front end face 121 and a rear end face 123 disposed opposite to each other, and a side end face 125 connected between the front end face 121 and the rear end face 123.
  • the displayable area of 110 faces the front end surface 121.
  • the handset 100 may include a glass cover plate, the glass cover plate cover is disposed on the display screen 110, and the side of the glass cover plate facing away from the display screen 110 forms all or part of the front end surface 121.
  • the handset 100 may include a back cover 170, which is provided on the first power module 130. The surface of the back cover 170 facing away from the display screen 110 constitutes all or part of the back surface 213.
  • the host 200 includes a bracket 260 connected to the housing 210.
  • the front surface 211 of the housing 210 is provided with an accommodating groove 261, and an installation space for mounting electronic components of the host 200 is formed in the housing 210.
  • the bracket 260 can be flipped relative to the housing 210 to a locked state and a deployed state. Referring to FIG. 2, the bracket 260 is received in the accommodating groove 261 in the locked state.
  • the handset 100 in the deployed state, the handset 100 can be placed vertically or obliquely on the housing 210 and the bracket 260 can be in contact with the rear end surface 123, and the housing 210 can be in contact with the side end surface 125.
  • the bracket 260 can support the handset 100 to facilitate the user to use the handset 100 to watch videos or play games.
  • the handset 100 includes a first main board 141 and a first sub-board 143 that are spaced apart.
  • the area of the first main board 141 is larger than the first sub-board 143.
  • the handset 100 includes a camera module 145, the camera module 145 is connected to the first sub-board 143, and the first EHF communication chip 150 is connected to the first main board 141.
  • the first power module 130 is located between the first main board 141 and the first sub-board 143 and can supply power to the first main board 141 and the first sub-board 143.
  • the first power module 130 may be connected to the first main board 141 or the first sub-board 143 through a flexible circuit board, and supply power to the first main board 141 or the first sub-board 143.
  • one of the first main board 141 or the first sub board 143 may be provided with a power management module.
  • the first power module 130 is electrically connected to the power management module through a flexible circuit board.
  • the first main board 141 and the first sub board 143 The other is electrically connected to the power management module through the flexible circuit board, so that the first power module 130 can be effectively managed and controlled.
  • the first EHF communication chip 150 may be connected to the first sub-board 143.
  • the handset 100 includes a fingerprint identification component 147, and the display screen 110 covers the fingerprint identification component 147.
  • the first main board 141 defines a through hole 148.
  • the fingerprint identification component 147 is accommodated in the through hole 148 and connected to the first main board 141.
  • the first power module 130 can supply power to the fingerprint identification component 147.
  • the fingerprint identification component 147 may be used to detect the user's fingerprint information and verify the user's identity. Since the display screen 110 covers the fingerprint identification component 147, the side where the display screen 110 is located has a high appearance integrity.
  • the fingerprint identification component 147 is accommodated in the through hole 148 of the first main board 141, there is no need to stack the fingerprint identification component 147 on the first main board 141, which is beneficial to the thickness reduction of the sub machine 100 and the sub machine 100 Thin and light design.
  • the sub machine 100 may include a middle plate 180, and the material of the middle plate 180 may be aluminum alloy or stainless steel.
  • the display screen 110, the first main board 141 and the first sub-board 143 are connected to the middle board 180, and the middle board 180 can support the display screen 110, the first main board 141 and the first sub-board 143 to facilitate the display screen 110,
  • the first main board 141 and the first sub-board 143 are installed and fixed.
  • the middle plate 180 is provided with a through hole 181 corresponding to the installation position of the fingerprint recognition assembly 147, and the fingerprint recognition assembly 147 is penetrated with the through hole 181. This structure is beneficial to the thickness reduction of the sub machine 100 and the sub machine 100 Lightweight design.
  • the middle plate 180 is not necessary.
  • the handset 100 may be provided with a frame surrounding the periphery of the display screen 110, and the display screen 110, the first main board 141 and the first sub-board 143 are connected to the frame.
  • This structure can also realize the display screen 110, the first main board 141 and The reliable positioning of the first sub-plate 143, and this structure is conducive to the slim design of the sub machine 100.
  • the host 200 includes a second main board 231 and a second sub board 233 that are spaced apart.
  • the area of the second main board 231 is larger than that of the second sub board 233.
  • the second power module 220 is located on the second main board 231 and the second sub board 233 In between and capable of supplying power to the second main board 231 and the second sub board 233, the second extremely high frequency communication chip 240 is connected to the second sub board 233.
  • the second power module 220 may be connected to the second main board 231 or the second sub board 233 through a flexible circuit board, and supply power to the second main board 231 or the second sub board 233.
  • one of the second main board 231 or the second sub board 233 may be provided with a power management module.
  • the second power module 220 is electrically connected to the power management module through a flexible circuit board.
  • the second main board 231 and the second sub board 233 The other is electrically connected to the power management module through the flexible circuit board, so that the second power module 220 can be effectively managed and controlled.
  • the second EHF communication chip 240 may be connected to the second motherboard 231.
  • the slave 100 includes a slave contact 149 connected to the first main board 141, while referring to FIGS. 5 and 6, the host 200 includes a master contact 235 connected to the second sub-board 233,
  • the slave contact 149 can be in contact with the host contact 235 to make the host 200 charge the slave 100.
  • the slave contact 149 and the host contact 235 respectively include a plurality of metal contacts for electrical conduction.
  • the slave contact 149 and the host contact 235 can be connected in one-to-one contact, the first power module 130 can be connected to the slave contact 149, and the second power module 220 can be connected to the host contact 235, so that the host 200 can charge the slave 100.
  • the main unit 200 can be provided with a large-capacity battery, the above-mentioned structure is advantageous for the main unit 200 to charge the sub-machine 100, which improves the convenience of charging the sub-machine 100, and further facilitates the sub-machine 100 to reserve sufficient power for the convenience of users.
  • the main unit 200 can charge the sub unit 100 through the main unit contact 235 and the sub unit contact 149, the battery capacity of the first power module 130 of the sub unit 100 can be appropriately reduced to facilitate the thinning and thinning of the first power module 130, This further contributes to the slim design of the handset 100.
  • the host 200 includes a wireless modem module, a host main controller, and a host wireless transceiver module.
  • the slave 100 includes a slave keyboard, a slave main controller, and a slave wireless transceiver module.
  • the control command output from the sub-machine keyboard under the control of the sub-machine main controller, is modulated by the sub-machine wireless transceiver module, and then sent to the host wireless transceiver module. Under control, after being modulated by the wireless modem module, it is sent to the air.
  • the control signal from the air is demodulated by the wireless modulation and demodulation module, sent to the slave 100 after being modulated by the master wireless transceiver module of the host, and sent to the slave 100 by the master wireless transceiver module.
  • the display 110 displays.
  • the sub-machine keyboard may be a touch keyboard, or may also be realized by a display screen 110 having a touch screen operation function.
  • the host 200 includes a wireless modem module, a host main controller, and a host wireless transceiver module
  • the slave 100 includes a slave main controller, a slave microphone, and a slave receiver.
  • a slave audio encoder, a slave audio decoder, and a slave wireless transceiver module capable of communicating with the host wireless transceiver module.
  • the audio signal from the sub-machine microphone is encoded by the sub-machine audio encoder and then transmitted to the sub-machine main controller. Under the control of the sub-machine main controller, it is sent out by the sub-machine wireless transceiver module.
  • the host wireless transceiver module After being received by the host wireless transceiver module, it is transmitted to the wireless modem module under the control of the host host controller, and sent to the air after being modulated by the wireless modem module.
  • the signal from the air is demodulated by the wireless modulation and demodulation module and transmitted to the host main controller. Under the control of the host main controller, it is transmitted to the host wireless transceiver module. After being modulated by the host wireless transceiver module, it is sent to the sub
  • the audio signal demodulated by the wireless transceiver module of the handset 100 under the control of the master controller of the handset, is decoded by the audio decoder of the handset, and then output by the receiver of the handset.
  • the slave audio encoder can be a separate hardware unit, can also be integrated in the slave microphone, or can be integrated in the master controller of the slave, in terms of its function, it can also have audio decoding function
  • the audio codec of the handset; the handset audio decoder can be a separate hardware unit, or it can be integrated in the handset of the handset, or it can be integrated in the main controller of the handset. Functional audio codec.
  • the host 200 includes a wireless modem module, a host host controller, and a host wireless transceiver module.
  • the host host controller can communicate with the wireless modem module and the host wireless transceiver module.
  • the slave 100 includes a slave main controller and a slave wireless transceiver module that can communicate with the master wireless transceiver module, and the slave main controller can communicate with the slave wireless transceiver module.
  • the slave 100 can access the communication network through the host 200.
  • the host 200 includes a host first wireless communication module, a host main controller, and a host second wireless communication module.
  • the host main controller can communicate with the host first wireless communication module and the host second wireless communication module.
  • the slave 100 includes a slave main controller and a slave wireless communication module.
  • the slave main controller can communicate with the slave wireless communication module, the slave wireless communication module can communicate with the first wireless communication module of the master, and the second wireless of the master
  • the communication module can communicate with the base station (Base Station).
  • the first wireless communication module of the host and the wireless communication module of the slave are both low-power Bluetooth communication modules.
  • the host first wireless communication module and the slave wireless communication module may both be wireless local area network (WiFi, Wireless) communication modules.

Abstract

一种移动终端(10)，包括子机(100)和主机(200)，子机(100)包括显示屏(110)、第一电源模块(130)和第一极高频通信芯片(150)，第一电源模块(130)能够为显示屏(110)和第一极高频通信芯片(150)供电。主机(200)包括第二电源模块(220)和第二极高频通信芯片(240)，第二电源模块(220)能够为第二极高频通信芯片(240)供电，子机(100)能够安装于主机(200)以使第一极高频通信芯片(150)与第二极高频通信芯片(240)配对，以实现子机(100)与主机(200)的通信连接，子机(100)能够从主机(200)拆卸，且在子机(100)从主机(200)拆卸后，子机(100)能够与主机(200)通信连接。

Description

移动终端 技术领域
本发明涉及终端技术领域，特别是涉及一种移动终端。
背景技术
智能手机等移动终端的轻薄化趋势越来越明显，且消费者对于智能手机的性能要求也在逐渐提高，但轻薄化与性能在某种程度上相互制约，使得传统的移动终端的设计遇到了瓶颈。
发明内容
基于此，有必要提供一种移动终端。
一种移动终端，包括：
子机，包括显示屏、第一电源模块和第一极高频通信芯片，所述第一电源模块能够为所述显示屏和所述第一极高频通信芯片供电；及
主机，包括第二电源模块和第二极高频通信芯片，所述第二电源模块能够为所述第二极高频通信芯片供电；所述子机能够安装于所述主机以使所述第一极高频通信芯片与所述第二极高频通信芯片配对，以实现所述子机与所述主机的通信连接；所述子机能够从所述主机拆卸，且在所述子机从所述主机拆卸后，所述子机能够与所述主机通信连接。
一种移动终端，包括：
子机，包括显示屏和第一极高频通信芯片；及
主机，包括第二极高频通信芯片，所述子机能够安装于所述主机以使所述第一极高频通信芯片与所述第二极高频通信芯片配对，以实现所述子机与所述主机的通信连接；所述子机能够从所述主机拆卸，且在所述子机从所述主机拆卸后，所述子机能够与所述主机通信连接。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他实施例的附图。
图1为一实施例中移动终端的立体图；
图2为图1所示移动终端的子机从主机上拆卸后的立体图；
图3为图2所示移动终端的子机拆除部分零部件后的主视图；
图4为图2所示移动终端的子机的爆炸图；
图5为图2所示移动终端的主机拆除部分零部件后的立体图；
图6为图5所示移动终端的主机拆除部分零部件后的另一视角的立体图；
图7为图2所示移动终端的子机倾斜放置于主机上的立体图；
图8为一实施例中移动终端在第一种工作状态下的流程图；
图9为图8所示移动终端在第一种工作状态下的另一流程图；
图10为一实施例中移动终端在第二种工作状态下的流程图；
图11为图10所示移动终端在第二种工作状态下的另一流程图；
图12为一实施例中移动终端的模块结构示意图；
图13为另一实施例中移动终端的模块结构示意图；
图14为又一实施例中移动终端的模块结构示意图。
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳的实施例。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面。
作为在此使用的“终端设备”指包括但不限于经由以下任意一种或者数种连接方式连接的能够接收和/或发送通信信号的装置：
(1)经由有线线路连接方式，如经由公共交换电话网络(Public Switched Telephone Networks，PSTN)、数字用户线路(Digital Subscriber Line，DSL)、数字电缆、直接电缆连接；
(2)经由无线接口方式，如蜂窝网络、无线局域网(Wireless Local Area Network，WLAN)、诸如DVB-H网络的数字电视网络、卫星网络、AM-FM广播发送器。
被设置成通过无线接口通信的终端设备可以被称为“移动终端”。移动终端的示例包括但不限于以下电子装置：
(1)卫星电话或蜂窝电话；
(2)可以组合蜂窝无线电电话与数据处理、传真以及数据通信能力的个人通信系统(Personal Communications System,PCS)终端；
(3)无线电电话、寻呼机、因特网/内联网接入、Web浏览器、记事簿、日历、配备有全球定位系统(Global Positioning System，GPS)接收器的个人数字助理(Personal Digital Assistant，PDA)；
(4)常规膝上型和/或掌上型接收器；
(5)常规膝上型和/或掌上型无线电电话收发器等。
参考图1和图2，在一实施例中，移动终端10为智能手机。移动终端10包括子机100和主机200。同时参考图3和图4，子机100包括显示屏110、第一电源模块130和第一极高频通信芯片150，第一电源模块130能够为显示屏110和第一极高频通信芯片150供电，显示屏110可用于显示信息并为用户提供交互界面。同时参考图5和图6，主机200包括第二电源模块220和第二极高频通信芯片240，第二电源模块220能够为第二极高频通信芯片240供电。参考图1，子机100能够安装于主机200以使第一极高频通信芯片150与第二极高频通信芯片240配对，以实现子机100与主机200的通信连接。参考图2，子机100还能够从主机200拆卸，且在子机100从主机200拆卸后，子机100能够与主机200通信连接。
第一极高频通信芯片150和第二极高频通信芯片240均为极高频通信芯片。极高频通信芯片为内部封装有EHF(extremely high frequency,极高频率)天线的IC(Integrated Circuit，集成电路)芯片，两个极高频通信芯片之间足够接近时才能够完成配对以进行无线通信。极高频通信芯片的实例为EHF共同链路芯片。术语“共同链路芯片”、“共同链路芯片封装”及“EHF通信链路芯片封装”用以指代嵌入于IC封装中的EHF天线。极高频通信芯片的实例可参考描述于第2012/0263244号及第2012/0307932号美国专利申请公开案中的信息，也可参见公布号为CN103563166A、CN104145380A中国专利文献中披露的信息。
极高频通信芯片的实例可以参见授权公告号为CN105264785B的中国授权专利文献。极高频通信芯片内封装有极高频天线，配置有极高频通信芯片的子机100可以基于高载波频率(例如，60GHz)与配置有极高频通信芯片的终端设备实现数据的高速无线传输(例如，最高可达6GB/s的传输速度)。
可以理解的是，基于高载波频率的近距离无线通信具有低功耗、体积小、传输速率快、非接触传输等优点，还可以实现即插即用模块的功能，可以大幅提高的信号完整性，支持更灵活的系统实现，降低待机功耗，增加带宽幅度与数据传输的安全性，兼容对高速视频信号的支持等特点。
可以理解的是，高载波频率可以是能够实现高速的数据无线传输的载波频率。高载波频率可以是某个明确的载波频率，也可以是一个载波频段，例如30GHz-300GHz，本申请实施例对此不做具体限定。可选地，该高载波频率为60GHz。
在一个实施例中，第一极高频通信芯片150可以包括第一换能器和第一集成电路(IC)，第一换能器用于将电磁信号转换为射频电信号，第一集成电路用于耦合到第一换能器。第一集成电路包括接收器电路和信号检测器电路，接收器电路用于从第一换能器接收第一射频电信号，且将第一射频电信号变换为第一基带信号，且在控制信号具有第一状态时输出第一基带信号，且在控制信号具有不同于第一状态的第二状态时不输出第一基带信号。信号检测器电路响应于表示所接收的第一射频电信号的监视器信号，以用于在监视器信号指示所接收的第一射频电信号是可接受信号时产生具有第一状态的控制信号，且在监视器信号指示所接收的第一射频电信号不是可接受信号时产生具有第二状态的控制信号。此类型的极高频通信芯片为具有接收电磁信号的极高频通信芯片。
第二极高频通信芯片240可以包括第二换能器和第二集成电路，第二换能器用于将射频电信号转换为电磁信号，第二换能器充分靠近第一换能器以让第一换能器接收由第二换能器产生的电磁信号。第二集成电路用于耦合到第二换能器，第二集成电路含有发射器电路，用于接收第二基带信号且将第二基带信号变换为第二射频电信号，且将第二射频电信号传导到第二换能器。此类型的极高频通信芯片为具有发送电磁信号的极高频通信芯片。
当然，第一极高频通信芯片150可以设置两个，其中一个为具有接收电磁信号的极高频通信芯片，另一个为具有发送电磁信号的极高频通信芯片。第二极高频通信芯片240可以对应设置两个，其中一个为具有发送电磁信号的极高频通信芯片，另一个为具有接收电磁信号的极高频通信芯片。当然，第一极高频通信芯片150或第二极高频通信芯片240可以为同时具有发射信号和接收信号的功能的极高频通信芯片。当第一极高频通信芯片150为同时具有发射信号和接收信号的功能的极高频通信芯片时，第一极高频通信芯片150可以包括换能器和集成电路(IC)，换能器用于在射频电信号与电磁信号之间转换。集成电路用于耦合到换能器，集成电路含有发射器电路和接收器电路，发射器电路能够将基带信号变换为射频电信号，且将射频电信号传导到换能器，再由换能器将射频电信号变换为电磁信号并发射出去；换能器接收电磁信号后可以变换为射频电信号，接收器电路能够从换能器接收射频电信号，并将射频电信号变换为基带信号。第一极高频通信芯片150还可以包括电磁能量引导组合件，电磁能量引导组合件相对于换能器而安装，以用于在包含换能器的区中且在远离集成电路的方向上引导电磁能量。
具体地，当第一极高频通信芯片150为同时具有发射信号和接收信号的功能的极高频通信芯片时，第一极高频通信芯片150可以包括第一换能器、第二换能器、第一集成电路和第二集成电路。第一换能器用于将电磁信号转换为射频电信号，第一集成电路用于耦合到第一换能器。第一集成电路包括接收器电路和信号检测器电路，接收器电路用于从第一换能器接收第一射频电信号，且将第一射频电信号变换为第一基带信号，且在控制信号具有第一状态时输出第一基带信号，且在控制信号具有不同于第一状态的第二状态时不输出第一基带信号。信号检测器电路响应于表示所接收的第一射频电信号的监视器信号，以用于在监视器信号指示所接收的第一射频电信号是可接受信号时产生具有第一状态的控制信号，且在监视器信号指示所接收的第一射频电信号不是可接受信号时产生具有第二状态的控制信号。第二换能器用于将射频电信号转换为电磁信号，第二换能器充分靠近第一换能器以让第一换能器接收由第二换能器产生的电磁信号。第二集成电路用于耦合到第二换 能器，第二集成电路含有发射器电路，用于接收第二基带信号且将第二基带信号变换为第二射频电信号，且将第二射频电信号传导到第二换能器。
在一实施例中，第一极高频通信芯片150大致呈矩形块状，第二极高频通信芯片240大致呈矩形块状。当第一极高频通信芯片150与第二极高频通信芯片240足够接近以完成配对时，穿过第一极高频通信芯片150的形心的法线与第二极高频通信芯片240的表面存在交点，且该交点与第二极高频通信芯片240的形心之间的距离小于等于2.5毫米，第一极高频通信芯片150的形心与第二极高频通信芯片240的形心之间的距离小于等于8.5毫米，上述设置能够实现第一极高频通信芯片150与第二极高频通信芯片240之间的可靠的通信，以利于主机200与子机100之间的数据传输。
以上的移动终端10，子机100能够安装于主机200且能够从主机200拆卸，且拆卸后子机100能够与主机200通信连接，子机100的电子元器件可以设置得较少以使子机100较为轻薄。主机200可以设置大容量的电池或者存储单元，且主机200可以放置于口袋或者其他地方并与子机100无线通信连接。主机200可以接入蜂窝通信网络或者WiFi(Wireless Fidelity)，并与子机100进行数据交互传输。子机100与主机200分离时，子机100可以正常使用并实现基本的功能，子机100安装于主机200时，能够获得完整的移动终端10并使移动终端10具有大电池容量、大存储空间等优点。换言之，上述结构的移动终端10既能通过子机100提升移动终端10的轻薄化和便携性，又能使得移动终端10具有较高的性能。当子机100安装于主机200时，由于第一极高频通信芯片150能够与第二极高频通信芯片240配对以实现子机100与主机200的通信连接，上述设置使得主机200和子机100之间的通信连接可以获得较高的质量和效率。
参考图2，主机200大致呈矩形块状，主机200包括相背设置的前表面211、后表面213，和连接在前表面211、后表面213之间的侧周面，侧周面包括相背设置的顶侧面212、底侧面214，和相背设置的左侧面216、右侧面218，左侧面216、右侧面218分别位于顶侧面212、底侧面214之间。子机100的背向显示屏110的可显示区的一侧能够叠设于前表面211，以使第一极高频通信芯片150与第二极高频通信芯片240配对。在一实施例中，主机200的前表面211一侧呈中间低、周向高的凹槽状，子机100安装于主机200时，主机200的凹槽可以容置子机100的部分结构，并且主机200的周向凸出的结构能够围设于子机100的外周，以使子机100能够方便地在主机200上定位。例如，上述定位有利于第一极高频通信芯片150与第二极高频通信芯片240的配对。
进一步，参考图3和图4，子机100可以包括磁吸组件160，主机200包括吸附件，在子机100安装于主机200时，磁吸组件160能够吸附于吸附件。具体地，磁吸组件160和吸附件中的一个为磁铁，另一个可以为铁磁金属或者为磁铁。磁性金属可以为铁、钴、镍或者其合金。在图3所示实施例中，磁吸组件160为磁铁。主机200包括外壳210，前表面211、后表面213、侧周面对应地位于外壳210上。主机200的外壳210可以采用铁磁金属制成，以将主机200的外壳210作为吸附件。磁吸组件160和吸附件的设置，有利于子机100在主机200上可靠的定位。
进一步，参考图2，子机100大致呈矩形块状，子机100包括相背设置的前端面121和后端面123，及连接于前端面121和后端面123之间的侧端面125，显示屏110的可显示区朝向前端面121。进一步，子机100可以包括玻璃盖板，玻璃盖板盖设于显示屏110，玻璃盖板的背向显示屏110的一侧构成前端面121的全部或者部分。参考图4，子机100可以包括后盖170，后盖170盖设于第一电源模块130，后盖170的背向显示屏110的一侧的表面构成后表面213的全部或者部分。同时参考图7，主机200包括与外壳210连接的支架260，外壳210的前表面211开设有容置槽261，外壳210内形成有用于安装主机200电子元器件的安装空间。支架260能够相对外壳210翻转至扣合状态和展开状态。参考图2，在扣合状态时支架260收容于容置槽261内。参考图7，在展开状态时子机100 能够垂直或者倾斜地放置于外壳210上且支架260能够与后端面123接触，外壳210能够与侧端面125接触。利用支架260可以支撑子机100，以方便用户使用子机100观看视频或者玩游戏等。
参考图3，子机100包括间隔设置的第一主板141和第一副板143，第一主板141的面积大于第一副板143。子机100包括摄像头模组145，摄像头模组145连接第一副板143，第一极高频通信芯片150连接于第一主板141。第一电源模块130位于第一主板141和第一副板143之间且能够为第一主板141和第一副板143供电。具体地，第一电源模块130可以通过柔性线路板连接于第一主板141或者第一副板143，并为第一主板141或者第一副板143供电。当然，第一主板141或者第一副板143中的一个可以设置电源管理模块，第一电源模块130通过柔性线路板与电源管理模块电性连接，第一主板141和第一副板143中的另一个再通过柔性线路板电性连接至电源管理模块，以使第一电源模块130能够得到有效的管理和控制。当然，在其他实施方式中，第一极高频通信芯片150可以连接于第一副板143。
在一实施例中，子机100包括指纹识别组件147，显示屏110覆盖指纹识别组件147。第一主板141开设有通孔148，指纹识别组件147容置于通孔148并与第一主板141连接，第一电源模块130能够为指纹识别组件147供电。指纹识别组件147可用于检测用户的指纹信息并验证用户的身份。由于显示屏110覆盖指纹识别组件147，显示屏110所在一侧具有较高的外观整体性。由于指纹识别组件147容置于第一主板141的通孔148内，因此无需将指纹识别组件147叠设于第一主板141，因此有利于子机100的厚度的减薄，以利于子机100的轻薄化设计。
进一步，参考图4，子机100可以包括中板180，中板180的材质可以为铝合金或者不锈钢等。显示屏110、第一主板141和第一副板143连接于中板180，中板180能够对显示屏110、第一主板141和第一副板143起到支撑作用，以利于显示屏110、第一主板141和第一副板143的安装与固定。进一步，中板180对应于指纹识别组件147的安装位置开设有贯穿孔181，指纹识别组件147穿设贯穿孔181，这种结构有利于子机100的厚度的减薄，以利于子机100的轻薄化设计。当然，中板180不是必须的。例如，子机100可以设置围设于显示屏110外周的边框，显示屏110、第一主板141和第一副板143连接于边框，这种结构同样能够实现显示屏110、第一主板141和第一副板143的可靠定位，且这种结构有利于子机100的轻薄化设计。
参考图5，主机200包括间隔设置的第二主板231和第二副板233，第二主板231的面积大于第二副板233，第二电源模块220位于第二主板231和第二副板233之间且能够为第二主板231和第二副板233供电，第二极高频通信芯片240连接于第二副板233。具体地，第二电源模块220可以通过柔性线路板连接于第二主板231或者第二副板233，并为第二主板231或者第二副板233供电。当然，第二主板231或者第二副板233中的一个可以设置电源管理模块，第二电源模块220通过柔性线路板与电源管理模块电性连接，第二主板231和第二副板233中的另一个再通过柔性线路板电性连接至电源管理模块，以使第二电源模块220能够得到有效的管理和控制。当然，在其他实施方式中，第二极高频通信芯片240可以连接于第二主板231。
进一步，参考图3和图4，子机100包括连接于第一主板141的子机触点149，同时参考图5和图6，主机200包括连接于第二副板233的主机触点235，在子机100安装于主机200时，子机触点149能够与主机触点235接触导通，以使主机200能够为子机100充电。具体地，在一实施例中，子机触点149、主机触点235分别包括多个用于导电的金属触点，在子机100安装于主机200时，子机触点149和主机触点235能够一一对应接触连接，第一电源模块130能够与子机触点149导通，第二电源模块220能够与主机触点235导通，以使主机200能够为子机100充电。由于主机200可以设置大容量的电池，上 述结构有利于主机200为子机100充电，提升了子机100充电的便利性，进而有利于子机100保留充足的电量，以方便用户的使用。当然，由于主机200可以通过主机触点235和子机触点149为子机100充电，子机100的第一电源模块130的电池容量可以适当减小，以利于第一电源模块130的轻薄化，进而利于子机100的轻薄化设计。
参考图8至图14，以下对主机200与子机100之间的通信方式，及主机200与外部设备的通信方式予以说明。
参考图8和图9，在一实施例中，主机200包括无线调制解调模块、主机主控制器、主机无线收发模块。子机100包括子机键盘、子机主控制器和子机无线收发模块。在移动终端10的第一种工作状态下，子机键盘输出的控制命令，在子机主控制器控制下，经子机无线收发模块调制后，发给主机无线收发模块，在主机主控制器控制下，经无线调制解调模块调制后，发送到空中。来自空中的控制信号，经无线调制解调模块解调后，经过主机主控制器，由主机无线收发模块调制后发给子机100，子机无线收发模块接收后，在子机主控制器的控制下，由显示屏110显示。可以理解的是，子机键盘可以为触摸键盘，也可以通过具有触屏操作功能的显示屏110实现。
参考图10和图11，在一实施例中，主机200包括无线调制解调模块、主机主控制器、主机无线收发模块，子机100包括子机主控制器、子机麦克、子机受话器、子机音频编码器、子机音频解码器、能够与主机无线收发模块通信的子机无线收发模块。在第二种工作状态下，来自子机麦克的音频信号，经子机音频编码器编码后传输到子机主控制器中，经子机主控制器控制下，被子机无线收发模块发送出去，由主机无线收发模块接收后，在主机主控制器的控制下，传送到无线调制解调模块，经无线调制解调模块调制后发送到空中。来自空中的信号，经无线调制解调模块解调后传送到主机主控制器中，在主机主控制器的控制下，传送到主机无线收发模块中，经主机无线收发模块调制后，发送到子机100，子机无线收发模块解调出的音频信号，在子机主控制器控制下，经子机音频解码器解码后，由子机受话器输出。可以理解的是，子机音频编码器可以是单独的硬件单元，也可以集成在子机麦克中，也可以集成在子机主控制器中，就其功能而言可以是兼具有音频解码功能的音频编解码器；子机音频解码器可以是单独的硬件单元，也可以集成在子机受话器中，也可以集成在子机主控制器中，就其功能而言可以是兼具有音频编码功能的音频编解码器。
参考图12和图13，在一实施例中，主机200包括无线调制解调模块、主机主控制器、主机无线收发模块，主机主控制器能够与无线调制解调模块和主机无线收发模块通信。子机100包括子机主控制器、与主机无线收发模块能够通信的子机无线收发模块，子机主控制器能够与子机无线收发模块通信。子机100能够通过主机200接入通信网络。
进一步，参考图14，主机200包括主机第一无线通信模块、主机主控制器、主机第二无线通信模块，主机主控制器能够与主机第一无线通信模块、主机第二无线通信模块通信。子机100包括子机主控制器、子机无线通信模块，子机主控制器能够与子机无线通信模块通信，子机无线通信模块能够与主机第一无线通信模块进行通信，主机第二无线通信模块能够与基站(Base Station)通信。在一实施例中，主机第一无线通信模块和子机无线通信模块均为低功率蓝牙(Bluetooth)通信模块。在其他实施方式中，主机第一无线通信模块和子机无线通信模块可以均为无线局域网(WiFi，Wireless Fidelity)通信模块。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说， 在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (20)

  1. 一种移动终端，包括：
    子机，包括显示屏、第一电源模块和第一极高频通信芯片，所述第一电源模块能够为所述显示屏和所述第一极高频通信芯片供电；及
    主机，包括第二电源模块和第二极高频通信芯片，所述第二电源模块能够为所述第二极高频通信芯片供电；所述子机能够安装于所述主机以使所述第一极高频通信芯片与所述第二极高频通信芯片配对，以实现所述子机与所述主机的通信连接；所述子机能够从所述主机拆卸，且在所述子机从所述主机拆卸后，所述子机能够与所述主机通信连接。
  2. 根据权利要求1所述的移动终端，其特征在于，所述主机包括相背设置的前表面、后表面，和连接在所述前表面、所述后表面之间的侧周面，所述侧周面包括相背设置的顶侧面、底侧面，和相背设置的左侧面、右侧面；所述左侧面、所述右侧面分别位于所述顶侧面、所述底侧面之间；所述子机的背向所述显示屏的可显示区的一侧能够叠设于所述前表面，以使所述第一极高频通信芯片与所述第二极高频通信芯片配对。
  3. 根据权利要求1所述的移动终端，其特征在于，所述子机包括间隔设置的第一主板和第一副板，所述第一电源模块位于所述第一主板和所述第一副板之间且能够为所述第一主板和所述第一副板供电；所述子机包括摄像头模组，所述摄像头模组连接所述第一副板；所述第一极高频通信芯片连接于所述第一主板或所述第一副板。
  4. 根据权利要求3所述的移动终端，其特征在于，所述子机包括指纹识别组件，所述显示屏覆盖所述指纹识别组件；所述第一主板开设有通孔，所述指纹识别组件容置于所述通孔并与所述第一主板连接。
  5. 根据权利要求4所述的移动终端，其特征在于，所述子机包括中板，所述显示屏、所述第一主板和所述第一副板分别连接所述中板，所述中板开设有贯穿孔，所述指纹识别组件穿设所述贯穿孔。
  6. 根据权利要求3所述的移动终端，其特征在于，所述主机包括间隔设置的第二主板和第二副板，所述第二电源模块位于所述第二主板和所述第二副板之间且能够为第二主板和第二副板供电；所述第二极高频通信芯片连接于所述第二副板或者所述第二主板。
  7. 根据权利要求6所述的移动终端，其特征在于，所述子机包括连接于所述第一主板的子机触点，所述主机包括连接于所述第二副板的主机触点，在所述子机安装于所述主机时，所述子机触点能够与所述主机触点接触导通，以使所述主机能够为所述子机充电。
  8. 根据权利要求1～7任一项所述的移动终端，其特征在于，所述子机包括磁吸组件，所述主机包括吸附件，在所述子机安装于所述主机时，所述磁吸组件能够吸附于所述吸附件。
  9. 根据权利要求1～7任一项所述的移动终端，其特征在于，所述子机包括相背设置的前端面和后端面，及连接于所述前端面和所述后端面之间的侧端面，所述显示屏的可显示区朝向所述前端面；所述主机包括外壳及与所述外壳连接的支架，所述外壳开设有容置槽，所述支架能够相对所述外壳翻转至扣合状态和展开状态；其中，在扣合状态时所述支架收容于所述容置槽，在展开状态时所述子机能够垂直或者倾斜地放置于所述外壳且所述支架能够与所述后端面接触，所述外壳能够与所述侧端面接触。
  10. 根据权利要求1所述的移动终端，其特征在于，所述主机包括无线调制解调模块、主机主控制器和主机无线收发模块；所述子机包括子机键盘、子机主控制器和子机无线收发模块；在所述移动终端的第一种工作状态下，所述子机键盘输出的控制命令，在所述子机主控制器控制下，经所述子机无线收发模块调制后，发给所述主机无线收发模块，在所述主机主控制器控制下，经所述无线调制解调模块调制后，发送到空中；来自空中的控制信号，经所述无线调制解调模块解调后，经过所述主机主控制器，由所述主机无线收发模块调制后发给所述子机，所述子机无线收发模块接收后，在所述子机主控制器的控制下， 由所述显示屏显示。
  11. 根据权利要求1所述的移动终端，其特征在于，所述主机包括无线调制解调模块、主机主控制器、主机无线收发模块；所述子机包括子机主控制器、子机麦克、子机受话器、子机音频编码器、子机音频解码器、能够与所述主机无线收发模块通信的子机无线收发模块；在第二种工作状态下，来自所述子机麦克的音频信号，经所述子机音频编码器编码后传输到所述子机主控制器中，经所述子机主控制器控制下，被所述子机无线收发模块发送出去，由所述主机无线收发模块接收后，在所述主机主控制器的控制下，传送到所述无线调制解调模块，经所述无线调制解调模块调制后发送到空中；来自空中的信号，经所述无线调制解调模块解调后传送到所述主机主控制器中，在所述主机主控制器的控制下，传送到所述主机无线收发模块中，经所述主机无线收发模块调制后，发送到所述子机，所述子机无线收发模块解调出的音频信号，在所述子机主控制器控制下，经所述子机音频解码器解码后，由所述子机受话器输出。
  12. 根据权利要求1所述的移动终端，其特征在于，所述主机包括无线调制解调模块、主机主控制器、主机无线收发模块，所述主机主控制器能够与所述无线调制解调模块和所述主机无线收发模块通信；所述子机包括子机主控制器、与所述主机无线收发模块能够通信的子机无线收发模块，所述子机主控制器能够与所述子机无线收发模块通信；所述子机能够通过所述主机接入通信网络。
  13. 根据权利要求1所述的移动终端，其特征在于，所述主机包括主机第一无线通信模块、主机主控制器、主机第二无线通信模块，所述主机主控制器能够与所述主机第一无线通信模块、所述主机第二无线通信模块通信；所述子机包括子机主控制器、子机无线通信模块，所述子机主控制器能够与所述子机无线通信模块通信，所述子机无线通信模块能够与所述主机第一无线通信模块进行通信；所述主机第二无线通信模块能够与基站通信。
  14. 一种移动终端，包括：
    子机，包括显示屏和第一极高频通信芯片；及
    主机，包括第二极高频通信芯片，所述子机能够安装于所述主机以使所述第一极高频通信芯片与所述第二极高频通信芯片配对，以实现所述子机与所述主机的通信连接；所述子机能够从所述主机拆卸，且在所述子机从所述主机拆卸后，所述子机能够与所述主机通信连接。
  15. 根据权利要求14所述的移动终端，其特征在于，所述子机包括间隔设置的第一主板和第一副板，以及连接于所述第一副板的摄像头模组；所述第一极高频通信芯片连接于所述第一主板或所述第一副板。
  16. 根据权利要求15所述的移动终端，其特征在于，所述子机包括指纹识别组件，所述显示屏覆盖所述指纹识别组件；所述第一主板开设有通孔，所述指纹识别组件容置于所述通孔并与所述第一主板连接。
  17. 根据权利要求16所述的移动终端，其特征在于，所述子机包括中板，所述显示屏、所述第一主板和所述第一副板分别连接所述中板，所述中板开设有贯穿孔，所述指纹识别组件穿设所述贯穿孔。
  18. 根据权利要求14所述的移动终端，其特征在于，所述主机包括间隔设置的第二主板和第二副板，所述第二极高频通信芯片连接于所述第二副板或者所述第二主板。
  19. 根据权利要求18所述的移动终端，其特征在于，所述子机包括连接于所述第一主板的子机触点，所述主机包括连接于所述第二副板的主机触点，在所述子机安装于所述主机时，所述子机触点能够与所述主机触点接触导通，以使所述主机能够为所述子机充电。
  20. 根据权利要求14所述的移动终端，其特征在于，所述子机包括磁吸组件，所述主机包括吸附件，在所述子机安装于所述主机时，所述磁吸组件能够吸附于所述吸附件。
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