WO2020134779A1 - Procédé d'imagerie, dispositif d'imagerie, appareil électronique, et support - Google Patents

Procédé d'imagerie, dispositif d'imagerie, appareil électronique, et support Download PDF

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Publication number
WO2020134779A1
WO2020134779A1 PCT/CN2019/120570 CN2019120570W WO2020134779A1 WO 2020134779 A1 WO2020134779 A1 WO 2020134779A1 CN 2019120570 W CN2019120570 W CN 2019120570W WO 2020134779 A1 WO2020134779 A1 WO 2020134779A1
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WO
WIPO (PCT)
Prior art keywords
image
images
field
view
area
Prior art date
Application number
PCT/CN2019/120570
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English (en)
Chinese (zh)
Inventor
张弓
Original Assignee
Oppo广东移动通信有限公司
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Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2020134779A1 publication Critical patent/WO2020134779A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/80—Camera processing pipelines; Components thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/698—Control of cameras or camera modules for achieving an enlarged field of view, e.g. panoramic image capture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/222—Studio circuitry; Studio devices; Studio equipment
    • H04N5/262—Studio circuits, e.g. for mixing, switching-over, change of character of image, other special effects ; Cameras specially adapted for the electronic generation of special effects
    • H04N5/265—Mixing

Definitions

  • the present application relates to the field of imaging technology, and in particular, to an imaging method, imaging device, electronic device, and medium.
  • the present application needs to provide an imaging method, imaging device, electronic device, and medium.
  • An imaging method is used in an electronic device.
  • the electronic device includes a wide-angle camera and a plurality of telephoto cameras.
  • the imaging method includes:
  • the imaging device in the embodiments of the present application is used in an electronic device.
  • the electronic device includes a wide-angle camera and a plurality of telephoto cameras.
  • the imaging device includes:
  • a first acquisition module configured to acquire the image collected by the wide-angle camera as a reference image
  • a second acquisition module configured to acquire images respectively collected by multiple telephoto cameras as preprocessed images, wherein the field of view areas of the plurality of preprocessed images cover the field of view areas of the reference image and exceed the reference The field of view of the image;
  • the synthesis module is used to synthesize the reference image and the plurality of preprocessed images to obtain the target image.
  • An electronic device includes a wide-angle camera, a plurality of telephoto cameras, and a processor, where the processor is used to obtain images collected by the wide-angle camera as reference images; and to obtain images respectively collected by the plurality of telephoto cameras As a preprocessed image, wherein the field of view area of the plurality of preprocessed images covers the field of view area of the reference image and exceeds the field of view area of the reference image; and for synthesizing the reference image and multiple The pre-processed image to obtain the target image.
  • FIG. 1 is a schematic plan view of an electronic device according to an embodiment of the present application.
  • FIG. 2 is a schematic perspective view of a first telephoto camera according to an embodiment of the present application.
  • FIG. 3 is an exploded schematic diagram of the first telephoto camera according to an embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional view of a first telephoto camera according to an embodiment of the present application.
  • FIG. 5 is a partial cross-sectional schematic diagram of a first telephoto camera according to an embodiment of the present application.
  • FIG. 6 is a schematic cross-sectional view of a first telephoto camera according to another embodiment of the present application.
  • FIG. 7 is a schematic perspective view of a reflective element according to an embodiment of the present application.
  • FIG. 8 is a schematic diagram of light reflection imaging of a first telephoto camera according to an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of an imaging module in the related art.
  • FIG. 10 is a schematic structural diagram of a first telephoto camera according to an embodiment of the present application.
  • FIG. 11 is a schematic cross-sectional view of a wide-angle camera according to an embodiment of the present application.
  • FIG. 12 is a schematic flowchart of an imaging method according to an embodiment of the present application.
  • FIG. 13 is a schematic diagram of an imaging method according to an embodiment of the present application.
  • FIG. 14 is a schematic block diagram of an imaging device according to an embodiment of the present application.
  • 15 is a schematic block diagram of an electronic device according to an embodiment of the present application.
  • 16 is a schematic flowchart of an imaging method according to an embodiment of the present application.
  • FIG. 17 is a schematic diagram of an imaging method according to another embodiment of the present application.
  • FIG. 22 is a schematic diagram of a scene of an imaging method according to another embodiment of the present application.
  • FIG. 23 is a schematic diagram of an imaging method according to still another embodiment of the present application.
  • the imaging method according to the embodiment of the present application may be used in the above electronic device 1000.
  • the electronic device includes a wide-angle camera 30 and a plurality of telephoto cameras 20.
  • the imaging method includes the following steps:
  • the imaging device 300 includes a first acquisition module 310, a second acquisition module 320, and a synthesis module 330.
  • Step S10 in the above imaging method may be performed by the first acquisition module 310
  • step S20 may be performed by the second acquisition module 320
  • step S30 may be performed by the synthesis module 330.
  • the first obtaining module 310 is used to obtain the image collected by the wide-angle camera 30 as the reference image P1.
  • the second acquisition module 320 is used to acquire images respectively acquired by the multiple telephoto cameras 20 as the preprocessed image P2, wherein the field of view area of the multiple preprocessed image P2 covers the field of view area of the reference image P1 and exceeds the reference image P1 Field of view.
  • the synthesis module 330 is used to synthesize the reference image P1 and the multiple pre-processed images P2 to obtain the target image P3.
  • the electronic device 1000 further includes a processor 10, which is used to obtain an image collected by the wide-angle camera 30 as a reference image P1; and used to obtain multiple telephoto cameras 20 to collect separately Is used as the pre-processed image P2, where the field of view of the multiple pre-processed images P2 covers the field of view of the reference image P1 and exceeds the field of view of the reference image P1; The image P2 is processed to obtain the target image P3.
  • a processor 10 which is used to obtain an image collected by the wide-angle camera 30 as a reference image P1; and used to obtain multiple telephoto cameras 20 to collect separately Is used as the pre-processed image P2, where the field of view of the multiple pre-processed images P2 covers the field of view of the reference image P1 and exceeds the field of view of the reference image P1;
  • the image P2 is processed to obtain the target image P3.
  • the electronic device 1000 includes a driving element 101
  • step S20 includes:
  • the electronic device includes a driving element 101
  • the processor 10 is used to control the driving element 101 to drive a plurality of telephoto cameras 20 to move from a first position to a second position relative to the wide-angle camera 30, wherein When the camera 20 is in the second position, the field of view of the multiple telephoto cameras 20 covers the field of view of the wide-angle camera 30 and exceeds the field of view of the wide-angle camera 30; and is used to control the multiple telephoto cameras 20 to capture images to The preprocessed image P2 is obtained.
  • the second acquisition module 320 is used to control the driving element 101 to drive the multiple telephoto cameras 20 to move from the first position to the second position relative to the wide-angle camera 30, wherein the telephoto camera 20 is located at the second position.
  • the field of view of multiple telephoto cameras 20 covers the field of view of wide-angle camera 30 and exceeds the field of view of wide-angle camera 30; and is used to control the acquisition of images by multiple telephoto cameras 20 to obtain preprocessed image P2 .
  • the driving element drives the telephoto camera by at least one of electromagnetic driving, piezoelectric driving, and memory alloy driving.
  • step S24 includes:
  • Step S242 controlling multiple telephoto cameras 20 to focus and image at the same position.
  • the processor 10 is used to control multiple telephoto cameras 20 to focus and image at the same position.
  • the second acquisition module 320 is used to control multiple telephoto cameras 20 to focus and image at the same position.
  • step S24 includes:
  • step S244 multiple telephoto cameras 20 are controlled to acquire images simultaneously to obtain a preprocessed image P2.
  • the processor 10 is used to control multiple telephoto cameras 20 to acquire images simultaneously to obtain a pre-processed image P2.
  • the second acquisition module 320 is used to control multiple telephoto cameras 20 to acquire images simultaneously to obtain a pre-processed image P2.
  • control method includes:
  • the processor 10 is used to control the wide-angle camera and multiple telephoto cameras to be exposed simultaneously to simultaneously acquire a reference image and multiple pre-processed images.
  • the first acquisition module 310 is used to control the wide-angle camera and multiple telephoto cameras to be exposed simultaneously to simultaneously acquire a reference image and multiple pre-processed images.
  • the reference image P1 includes an intermediate region P11 and an edge region P12.
  • the field of view region of the plurality of preprocessed images P2 includes the field of view region of the edge region P12.
  • the field of view area of the image P2 has an overlapping area P21 in the field of view area of the intermediate area P11, the focus position P22 of the preprocessed image P2 is located in the overlapping area P21, and step S30 includes:
  • the reference image P1 includes an intermediate region P11 and an edge region P12
  • the field of view region of the plurality of preprocessed images P2 includes the field of view region of the edge region P12
  • the field of view region of the plurality of preprocessed images P2 is in the middle
  • the field of view of the area P11 has an overlapping area P21
  • the focus position P22 of the preprocessed image P2 is located in the overlapping area P21
  • the processor 10 is used to synthesize a plurality of preprocessed images P2 according to the image of the overlapping area P21 to form a to-be-processed image P23 ; And for synthesizing the to-be-processed image P23 and the reference image P1 to obtain the target image P3.
  • the synthesis module 330 is used to synthesize a plurality of pre-processed images P2 according to the images of the overlapping area P21 to form the image to be processed P23; and to synthesize the image to be processed P23 and the reference image P1 to obtain the target image P3.
  • step S32 includes:
  • a plurality of pre-processed images P2 are sequentially spliced in a predetermined direction according to the image of the overlapping area P21 to form an image to be processed P23.
  • the processor 10 is configured to sequentially splice a plurality of pre-processed images P2 in a predetermined direction according to the images of the overlapping area P21 to form a to-be-processed image P23.
  • the synthesizing module 330 is used to sequentially splice a plurality of pre-processed images P2 in a predetermined direction according to the images of the overlapping area P21 to form a to-be-processed image P23.
  • the area of the intermediate region is 1/5-2/3 of the total area of the reference image.
  • the electronic device 1000 includes a casing 200 and a camera assembly 100.
  • the camera assembly 100 is exposed through the casing 200.
  • the electronic device 1000 may be any of various types of computer system devices that are mobile or portable and perform wireless communication (only one form is exemplarily shown in FIG. 1 ).
  • the electronic device 1000 may be a mobile phone or a smart phone (for example, a phone based on iPhone system (Apple system), a phone based on Android system (Android system)), a portable game device (for example, iPhone (Apple phone)), a laptop Computers, personal digital assistants (PDAs), portable Internet devices, music players and data storage devices, other hand-held devices and such as watches, earphones, pendants, headphones, etc.
  • the electronic device 100 can also be other Wearable devices (for example, head mounted devices (HMD) such as electronic glasses, electronic clothes, electronic bracelets, electronic necklaces, electronic tattoos, electronic devices, or smart watches).
  • HMD head mounted devices
  • the camera assembly 100 includes a telephoto camera 20 and a wide-angle camera 30.
  • the number of telephoto cameras 20 is plural.
  • the number of telephoto cameras 20 is 2, 3, 4 and so on.
  • the number of telephoto cameras 20 is 4 as an example.
  • the number of wide-angle cameras 30 is one.
  • the angle of view of the wide-angle camera 30 is greater than that of the telephoto camera 20.
  • the wide-angle camera 30 has a viewing angle range of 80-110 degrees, while the telephoto camera 20 has a viewing angle range of 10-40 degrees. Therefore, the field of view area of the wide-angle camera 30 is large, and the field of view area of the telephoto camera 20 is small. Therefore, the telephoto camera 20 has a better advantage for shooting the local position of the scene.
  • a plurality of telephoto cameras 20 and a wide-angle camera 30 are arranged in a matrix, as shown in FIG. 1.
  • the multiple telephoto cameras 20 and the wide-angle camera 30 may be arranged in any shape.
  • the telephoto cameras 20 may all be vertical cameras, or may be periscope cameras, and the wide-angle camera 30 may be a vertical camera.
  • the vertical lens module refers to that the optical axis of the lens module is a straight line, or that incident light is transmitted to the photosensitive device of the lens module along the direction of the linear optical axis.
  • the telephoto camera 20 is a periscope camera as an example for further description.
  • the telephoto camera 20 includes a housing 21, a reflective element 22, a mounting base 23, a first lens assembly 24, a moving element 25, a first image sensor 26, and a driving mechanism 27.
  • the reflective element 22, the mount 23, the first lens assembly 24, and the moving element 25 are all disposed in the housing 21.
  • the reflective element 22 is disposed on the mounting base 23, and the first lens assembly 24 is fixed on the moving element 25.
  • the moving element 25 is provided on the first image sensor 26 side. Further, the moving element 25 is located between the reflective element 22 and the first image sensor 26.
  • the driving mechanism 27 connects the moving element 25 and the housing 21. After the incident light enters the housing 21, it is turned by the reflective element 22, and then reaches the first image sensor 26 through the first lens assembly 24, so that the first image sensor 26 obtains an external image.
  • the driving mechanism 27 is used to drive the moving element 25 to move along the optical axis of the first lens assembly 24.
  • the housing 21 has a substantially square shape, and the housing 21 has a light inlet 211 from which incident light enters the telephoto camera 20.
  • the reflective element 22 is used to divert the incident light incident from the light entrance 211 and pass through the first lens assembly 24 to the first image sensor 26 so that the first image sensor 26 senses the exterior of the telephoto camera 20 Incident light.
  • the light inlet 211 is exposed through the through hole 11 so that outside light passes through the through hole 11 and enters the telephoto camera 20 from the light inlet 211.
  • the housing 21 includes a top wall 213 and a side wall 214.
  • the side wall 214 extends from the side 2131 of the top wall 213.
  • the top wall 213 includes two opposite sides 2131, and the number of side walls 214 is two.
  • Each side wall 214 extends from a corresponding side 2131, or the side walls 214 are respectively connected to the top wall 213 On both sides.
  • the light entrance 211 is formed on the top wall 213.
  • the reflective element 22 is a prism or a plane mirror. For more details, please refer to FIGS. 4 and 7.
  • the reflective element 22 has a light incident surface 222, a backlight surface 224, a reflective surface 226 and a light exit surface 228.
  • the light incident surface 222 approaches and faces the light entrance 211.
  • the backlight surface 224 is away from the light entrance 211 and opposite to the light entrance surface 222.
  • the reflective surface 226 is connected to the light incident surface 222 and the backlight surface 224.
  • the light exit surface 228 is connected to the light entrance surface 222 and the backlight surface 224.
  • the light exit surface 228 faces the first image sensor 26.
  • the reflective surface 226 is inclined relative to the light incident surface 222.
  • the light emitting surface 228 is opposite to the light reflecting surface 226.
  • the light passes through the light inlet 211 and enters the light reflecting element 22 from the light incident surface 222, then reflects through the light reflecting surface 226, and finally reflects the light reflecting element 22 from the light emitting surface 228 to complete the light conversion
  • the backlight surface 224 and the mounting base 23 are fixedly arranged, so that the reflective element 22 remains stable.
  • the reflective element 22 of the embodiment of the present application cuts off the corner away from the light entrance relative to the reflective element in the related art, which not only does not affect the reflected light effect of the reflective element 22, but also reduces the reflective element The overall thickness of 22.
  • the angle ⁇ of the reflective surface 226 relative to the light incident surface 222 is inclined at 45 degrees. In this way, the incident light is better reflected and converted, and has a better light conversion effect.
  • the reflective element 22 can be made of glass, plastic, or other materials with relatively good light transmittance.
  • a reflective material such as silver may be coated on one surface of the reflective element 22 to reflect incident light.
  • the mounting base 23 is used for mounting the reflective element 22, or the mounting base 23 is a carrier of the reflective element 22, and the reflective element 22 is fixed on the mounting base 23. This allows the position of the reflective element 22 to be determined, which is advantageous for the reflective element 22 to reflect or refract incident light.
  • the reflective element 22 may be fixed on the mounting base 23 by viscose to achieve a fixed connection with the mounting base 23.
  • the mounting base 23 is provided with a limiting structure 232, and the limiting structure 232 is connected to the reflective element 22 to limit the position of the reflective element 22 on the mounting base 23.
  • the position-limiting structure 232 restricts the position of the reflective element 22 on the mounting base 23, so that the reflective element 22 will not be displaced in the event of an impact, which is beneficial to the normal use of the telephoto camera 20.
  • the reflective element 22 is fixed on the mounting base 23 by means of bonding. If the limit structure 232 is omitted, then, when the telephoto camera 20 is impacted, if the reflective element 2222 and the mounting base 23 The adhesive force is insufficient, and the reflective element 22 is easily detached from the mount 23.
  • the mounting base 23 is formed with a mounting groove 233
  • the reflective element 22 is disposed in the mounting groove 233
  • the limiting structure 232 is disposed at the edge of the mounting groove 233 and abuts against the reflective element 22.
  • the mounting groove 233 can make the reflective element 22 easily mounted on the mounting base 23.
  • the limiting structure 232 is disposed at the edge of the mounting groove 233 and abuts the edge of the reflective element 22, which not only restricts the position of the reflective element 22 but also prevents the reflective element 22 from emitting incident light to the first image sensor 26.
  • the limiting structure 232 includes a protrusion 234 protruding from the edge of the mounting groove 233, and the protrusion 234 abuts the edge of the light emitting surface 228. Since the reflective element 22 is mounted on the mounting base 23 through the reflective surface 226, the light exit surface 228 is disposed opposite to the reflective surface 226. Therefore, when the light reflecting element 22 is impacted, it is more likely that the light generating surface 228 is located on the side where the light emitting surface 228 is located. In this embodiment, the limit structure 232 abuts against the edge of the light exit surface 228 can not only prevent the reflective element 22 from shifting to the light exit surface 228 side, but also ensure that the light exits the light exit surface 228 normally.
  • the limiting structure 232 may include other structures as long as the position of the reflective element 22 can be limited.
  • the limiting structure 232 is formed with a clamping slot, and the reflective element 22 forms a limiting column, and the limiting column is engaged in the clamping slot to limit the position of the reflective element 22.
  • the protrusion 234 is strip-shaped and extends along the edge of the light exit surface 228. In this way, the contact area between the protrusion 234 and the edge of the light exit surface 228 is large, so that the reflective element 22 can be more firmly located on the mounting base 23.
  • the protrusion 234 may also have a block-like structure.
  • the mounting base 23 can be movably disposed in the housing 21, and the mounting base 23 can rotate relative to the housing 21 to adjust the direction in which the reflective element 22 turns the incident light.
  • the mounting base 23 can drive the reflective element 22 to rotate in the opposite direction of the shake of the telephoto camera 20 together, so as to compensate the incident deviation of the incident light of the light inlet 211 and achieve the effect of optical anti-shake.
  • the first lens assembly 24 is accommodated in the moving element 25. Further, the first lens assembly 24 is disposed between the reflective element 22 and the first image sensor 26. The first lens assembly 24 is used to image incident light on the first image sensor 26. This allows the first image sensor 26 to obtain an image with better quality.
  • the first lens assembly 24 When the first lens assembly 24 moves integrally along its optical axis, it can image on the first image sensor 26, so that the telephoto camera 20 can focus.
  • the first lens assembly 24 includes a plurality of lenses 241. When at least one lens 241 moves, the overall focal length of the first lens assembly 24 changes, thereby realizing the zoom function of the telephoto camera 20. More, the driving mechanism 27 drives the moving element 25 moves in the housing 21 for zooming purposes.
  • the moving element 25 is cylindrical, and the plurality of lenses 241 in the first lens assembly 24 are fixed in the moving element 25 along the axial interval of the moving element 25.
  • the moving element 25 includes two clips 252 that sandwich the lens 241 between the two clips 252.
  • the moving element 25 is used to fix a plurality of lenses 241, the length of the required moving element 25 is large, and the moving element 25 may be cylindrical, square, etc., having a shape of a certain cavity.
  • the element 25 is arranged in a tube, so that a plurality of lenses 241 can be better arranged, and the lens 241 can be better protected in the cavity, so that the lens 241 is less likely to shake.
  • the moving element 25 sandwiches the plurality of lenses 241 between the two clips 252, which not only has a certain stability, but also reduces the weight of the moving element 25, and can reduce the driving of the driving mechanism 27.
  • the power required by the moving element 25, and the design difficulty of the moving element 25 is also relatively low, and the lens 241 is also easier to set on the moving element 25.
  • the moving element 25 is not limited to the cylindrical shape and the two clips 252 mentioned above.
  • the moving element 25 may include three or four clips 252 to form a more stable structure. , Or a simpler structure such as a clip 252; or a rectangular body, a circular body, etc. having a cavity to accommodate various regular or irregular shapes of the lens 241.
  • specific selection is sufficient.
  • the first image sensor 26 may use a complementary metal oxide semiconductor (CMOS, Complementary Metal Oxide Semiconductor) photosensitive element or a charge-coupled element (CCD, Charge-coupled Device) photosensitive element.
  • CMOS complementary metal oxide semiconductor
  • CCD Charge-coupled Device
  • the driving mechanism 27 is an electromagnetic driving mechanism, a piezoelectric driving mechanism, or a memory alloy driving mechanism.
  • the electromagnetic drive mechanism includes a magnetic field and a conductor. If the magnetic field moves relative to the conductor, an induced current is generated in the conductor. The induced current causes the conductor to be subjected to an ampere force, which causes the conductor to move.
  • the conductor here is electromagnetic.
  • the part of the drive mechanism that moves the moving element 25; the piezoelectric drive mechanism is based on the inverse piezoelectric effect of the piezoelectric ceramic material: if a voltage is applied to the piezoelectric material, mechanical stress is generated, that is, electrical energy and mechanical energy are converted, through Controlling its mechanical deformation to produce rotation or linear motion has the advantages of simple structure and low speed.
  • the drive of the memory alloy drive mechanism is based on the characteristics of the shape memory alloy: the shape memory alloy is a special alloy. Once it remembers any shape, even if it is deformed, it can be restored to a certain temperature when heated The shape before deformation, in order to achieve the purpose of driving, has the characteristics of rapid displacement and free direction.
  • the telephoto camera 20 further includes a driving device 28.
  • the driving device 28 is used to drive the mounting base 23 with the reflective element 22 to rotate around the rotation axis 29.
  • the driving device 28 is used to drive the mounting base 23 to move in the axial direction of the rotation axis 29.
  • the rotation axis 29 is perpendicular to the optical axis of the light inlet 211 and the photosensitive direction of the first image sensor 26, so that the telephoto camera 20 realizes optical image stabilization in the optical axis of the light inlet 211 and the axial direction of the rotation axis 29.
  • the driving device 28 drives the mounting base 23 to move in two directions, which not only can realize the optical anti-shake effect of the telephoto camera 20 in two directions, but also can make the long
  • the focal camera 20 has a small volume.
  • the width direction of the telephoto camera 20 is defined as the X direction
  • the height direction is defined as the Y direction
  • the length direction is defined as the Z direction.
  • the optical axis of the light inlet 211 is in the Y direction
  • the light receiving direction of the first image sensor 26 is in the Z direction
  • the axial direction of the rotation axis 29 is in the X direction.
  • the driving device 28 drives the mounting base 23 to rotate, so that the reflective element 22 rotates around the X direction, so that the telephoto camera 20 realizes the Y-direction optical image stabilization effect.
  • the driving device 28 drives the mounting base 23 to move in the axial direction of the rotation axis 29, so that the telephoto camera 20 achieves the X-direction optical image stabilization effect.
  • the first lens assembly 24 may be along the Z direction to enable the first lens assembly 24 to focus on the first image sensor 26.
  • the reflective element 22 rotates in the X direction
  • the light reflected by the reflective element 22 moves in the Y direction
  • the first image sensor 26 forms a different image in the Y direction to achieve the anti-shake effect in the Y direction.
  • the reflective element 22 moves in the X direction
  • the light reflected by the reflective element 22 moves in the X direction, so that the first image sensor 26 forms a different image in the X direction to achieve the anti-shake effect in the X direction.
  • the driving device 28 is formed with an arc-shaped guide rail 281, and the drive device 28 is used to drive the mounting base 23 to rotate along the arc-shaped guide rail 281 about the central axis 282 of the arc-shaped guide rail 281 and the axis along the central axis 282 Moving toward, the central axis 2282 coincides with the rotation axis 29.
  • the driving device 28 is used to drive the mounting base 23 to rotate along the arc guide rail 281 about the central axis 282 of the arc guide rail 281 and move axially along the central axis 282.
  • the driving device 28 uses the curved guide rail 281 to drive the mounting base 23 with the reflective element 22 to rotate together, the friction between the driving device 28 and the mounting base 23 is small, which is conducive to the smooth rotation of the mounting base 23 , The optical image stabilization effect of the telephoto camera 20 is improved.
  • the mounting base (not shown) is rotatably connected to the rotating shaft 23 a, and the mounting base rotates around the rotating shaft 23 a to drive the reflective element 22 a to rotate together.
  • the friction force is f1
  • the radius of the rotating shaft 23a is R1
  • the thrust force is F1
  • the turning radius is A.
  • the reflective element 22a only needs to rotate slightly when performing anti-shake, F1 cannot be too large, because the excessive rotation of F1 will cause the rotation of the reflective element 22a to be too large to achieve the anti-shake function; and the imaging module itself needs to be light and short to cause reflective
  • the size of the element 22a cannot be too large, so the space for the enlargement of A is also limited, so that the influence of friction cannot be further eliminated.
  • the mounting base 23 rotates along an arc-shaped guide rail 281, and the arc-shaped guide rail 281 may be formed by arranging a plurality of rolling bodies 2811.
  • the radius of the rolling element 2811 is R2, and the turning radius of the reflective element 22 is B.
  • f1 is not significantly changed compared to f2
  • R1 is compared to R2
  • F1 is compared to F2
  • B can not be limited by the size of the reflective element 22, and can even be more than a multiple of A.
  • the mounting base 23 includes an arc-shaped surface 231.
  • the arc-shaped surface 231 is concentrically arranged with the arc-shaped guide rail 281 and cooperates with the arc-shaped guide rail 281. In other words, the center of the curved surface 231 coincides with the center of the curved guide 281. This makes the mounting base 23 and the driving device 28 more compact.
  • the central axis 282 is located outside the telephoto camera 20. In this way, the radius R2 of the arc-shaped guide 281 is large, which can reduce the adverse effect of friction on the rotation of the mounting base 23.
  • the driving device 28 electromagnetically drives the mounting base 23 to rotate.
  • the driving device 28 is provided with a coil, and an electromagnetic sheet is fixed on the mounting base 23. After the coil is energized, the coil can generate a magnetic field to drive the movement of the electromagnetic sheet, thereby driving the mounting base 23 and the reflective element to rotate together.
  • the driving device 28 may drive the mounting base 23 by piezoelectric driving or memory alloy driving.
  • piezoelectric driving method and the memory alloy driving method please refer to the above description, which will not be repeated here.
  • the telephoto camera 20 further includes a chip circuit board 201 and a driving chip 202.
  • the chip circuit board 201 is fixed on the side of the driving mechanism 27, and the driving chip 202 is fixed on the chip circuit board 201 and the driving mechanism 27.
  • the driving chip 202 is electrically connected to the driving mechanism 27 through the chip circuit board 201.
  • the driving chip 202 is fixed to the side of the driving mechanism 27 through the chip circuit board 201, and is electrically connected to the driving mechanism 27 through the chip circuit board 201, which makes the structure between the driving chip 202 and the driving mechanism 27 more compact, which is beneficial to Reduce the volume of the telephoto camera 20.
  • the driving chip 202 is used to control the driving mechanism 27 to drive the moving element 25 to move along the optical axis of the first lens assembly 24, so that the first lens assembly 24 is focused and imaged on the first image sensor 26.
  • the driving chip 202 is used to control the driving device 28 according to the feedback data of the gyroscope 120 to drive the mounting base 23 with the reflective element 22 to rotate around the rotation axis 29.
  • the driving chip 202 is also used to control the driving device 28 to drive the mounting base 23 to move along the axis of the rotation axis 29 according to the feedback data of the gyroscope 120.
  • the driving chip 202 is also used to control the driving device 28 according to the feedback data of the gyroscope 120 to drive the mounting base 23 to rotate around the central axis 282 of the arc guide 281 along the arc guide 281 and move axially along the center axis 282.
  • the telephoto camera 20 includes a sensor circuit board 203
  • the first image sensor 26 is fixed to the sensor circuit board 203
  • the chip circuit board 201 includes a mounting portion 2011 and a connecting portion 2022
  • the mounting portion 2011 is fixed to the driving mechanism 27
  • the driving chip 202 is fixed to the mounting portion 2011, and the connecting portion 2022 connects the mounting portion 2011 and the sensor circuit board 203.
  • the driving chip 202 can be electrically connected to the first image sensor 26 through the sensor circuit board 203.
  • the connecting portion 2022 may be fixedly connected to the sensor circuit board 203 by soldering.
  • the driver chip 202 when assembling the telephoto camera 20, the driver chip 202 may be first fixed on the chip circuit board 201, and then the chip circuit board 201 with the driver chip 202 and the sensor circuit board 203 may be connected by soldering. Finally, the chip circuit board 201 with the driving chip 202 is fixed on the side of the driving mechanism 27.
  • the chip circuit board 201 may be fixedly connected to the driving mechanism 27 by soldering, bonding, or the like.
  • fixing the chip circuit board 201 on the side of the driving mechanism 27 may mean that the chip circuit board 201 is in contact with and fixed to the side of the driving mechanism 27, or may mean that the chip circuit board 201 is fixedly connected to the side of the driving mechanism 27 through other components.
  • the mounting portion 2011 is a rigid circuit board
  • the connecting portion 2022 is a flexible circuit board
  • the mounting portion 2011 is attached to the side surface of the drive mechanism 27.
  • the mounting portion 2011 is a rigid circuit board so that the mounting portion 2011 has good rigidity and is not easily deformed, which is beneficial to the fixed connection between the mounting portion 2011 and the side surface of the driving mechanism 27.
  • the mounting portion 2011 can be attached to the side surface of the drive mechanism 27 by adhesion.
  • the connection portion 2022 is a flexible circuit board so that the chip circuit board 201 is easily deformed, so that the chip circuit board 201 is easily mounted on the side of the driving mechanism 27.
  • the mounting portion 2011 may also be a flexible circuit board.
  • the housing 21 is formed with an escape hole 215, and the driving chip 202 is at least partially located in the escape hole 215 so as to be exposed to the housing 21.
  • the driving chip 202 penetrates the housing 21 so that there is an overlapping portion between the driving chip 202 and the housing 21, which makes the structure between the driving chip 202 and the housing 21 more compact, which can further reduce the volume of the telephoto camera 20.
  • the shape and size of the avoidance hole 215 match the shape and size of the driving chip 202 respectively.
  • the size of the avoidance hole 215 is slightly larger than the size of the driving chip 202, and the shape of the avoidance hole 215 is the same as the shape of the driving chip 202.
  • the escape hole 215 is formed on the side wall 214 of the housing 21. It can be understood that the escape hole 215 penetrates the inside and outside of the side wall 214. Of course, in other embodiments, the escape hole 215 may also be formed on the top wall 213 of the housing 21.
  • the telephoto camera 20 further includes a shielding cover 204 that is fixed to the chip circuit board 201 and covers the driving chip 202.
  • the shielding cover 204 can protect the driving chip 202 and prevent the driving chip 202 from being physically impacted.
  • the shielding cover 204 can also reduce the electromagnetic influence on the driving chip 202.
  • the shield 204 may be made of metal material.
  • the material of the shield 204 is stainless steel.
  • the chip circuit board 201 is fixed to the mounting portion 2011.
  • the mounting portion 2011 is preferably a rigid circuit board or a plate material combining a flexible circuit board and a reinforcement board.
  • the wide-angle camera 30 is a vertical lens module.
  • the wide-angle camera 30 may also be a periscope lens module.
  • the wide-angle camera 30 includes a second lens assembly 31 and a second image sensor 32.
  • the second lens assembly 31 is used to image light on the second image sensor 32.
  • the incident optical axis of the wide-angle camera 30 and the optical axis of the second lens assembly 31 coincide.
  • the wide-angle camera 30 may be a fixed-focus lens module. Therefore, the second lens assembly 31 has fewer lenses 241, so that the height of the wide-angle camera 30 is lower, which is beneficial to reduce the thickness of the electronic device 1000.
  • the type of the second image sensor 32 may be the same as the type of the first image sensor 26, which will not be repeated here.
  • the imaging method according to the embodiment of the present application may be used in the above electronic device 1000.
  • the electronic device includes a wide-angle camera 30 and a plurality of telephoto cameras 20.
  • the imaging method includes the following steps:
  • the imaging device 300 includes a first acquisition module 310, a second acquisition module 320, and a synthesis module 330.
  • Step S10 in the above imaging method may be performed by the first acquisition module 310
  • step S20 may be performed by the second acquisition module 320
  • step S30 may be performed by the synthesis module 330.
  • the first obtaining module 310 is used to obtain the image collected by the wide-angle camera 30 as the reference image P1.
  • the second acquisition module 320 is used to acquire images respectively acquired by the multiple telephoto cameras 20 as the preprocessed image P2, wherein the field of view area of the multiple preprocessed image P2 covers the field of view area of the reference image P1 and exceeds the reference image P1 Field of view.
  • the synthesis module 330 is used to synthesize the reference image P1 and the multiple pre-processed images P2 to obtain the target image P3.
  • the electronic device 1000 further includes a processor 10, which is used to obtain an image collected by the wide-angle camera 30 as a reference image P1; and used to obtain multiple telephoto cameras 20 to collect separately Is used as the pre-processed image P2, where the field of view of the multiple pre-processed images P2 covers the field of view of the reference image P1 and exceeds the field of view of the reference image P1; The image P2 is processed to obtain the target image P3.
  • a processor 10 which is used to obtain an image collected by the wide-angle camera 30 as a reference image P1; and used to obtain multiple telephoto cameras 20 to collect separately Is used as the pre-processed image P2, where the field of view of the multiple pre-processed images P2 covers the field of view of the reference image P1 and exceeds the field of view of the reference image P1;
  • the image P2 is processed to obtain the target image P3.
  • the field of view area of the plurality of preprocessed images P2 covers and exceeds the field of view area of the reference image P1, so that the plurality of preprocessed images P2 and the reference image P1
  • the synthesized target image P3 can achieve an ultra-wide-angle effect, which is conducive to improving the user experience.
  • the field of view area refers to the range of the field of view acquired by the camera corresponding to the image.
  • the size of a scene is 4*6m
  • the size of the target object in the scene is 2*3m. If the wide-angle camera 30 can capture an image of a scene, and the telephoto camera 20 can only capture an image of a target object, then the field of view area of the scene image includes the field of view area of the target object.
  • step S20 "the field of view area of the plurality of preprocessed images P2" refers to the combined field of view area of the plurality of preprocessed images P2, and the field of view area of the plurality of preprocessed images P2 covers the field of view area of the reference image P1 , And beyond the field of view of the reference image P1" means that the combined field of view field of the multiple pre-processed images P2 covers and exceeds the field of view of the reference image P1.
  • the field-of-view areas of the four pre-processed images P2 extend to the left from the upper left part of the reference image P1 and to the left from the lower left part of the reference image P1
  • the extension extends from the upper right portion of the reference image P1 to the right, and extends from the lower right portion of the reference image P1 to the right.
  • the stitched image content of the four pre-processed images P2 not only has all the image content of the reference image P1, but also has image content other than the reference image P1, that is, the combined view of the four pre-processed images P2
  • the field area covers and exceeds the field of view of the reference image P1.
  • the electronic device 1000 includes a driving element 101
  • step S20 includes:
  • the electronic device includes a driving element 101
  • the processor 10 is used to control the driving element 101 to drive a plurality of telephoto cameras 20 to move from a first position to a second position relative to the wide-angle camera 30, wherein When the camera 20 is in the second position, the field of view of the multiple telephoto cameras 20 covers the field of view of the wide-angle camera 30 and exceeds the field of view of the wide-angle camera 30; and is used to control the multiple telephoto cameras 20 to capture images to The preprocessed image P2 is obtained.
  • the images acquired by the multiple telephoto cameras 20 are acquired as the preprocessed image P2.
  • the field of view of multiple telephoto cameras 20 covers the field of view of the wide-angle camera 30 and exceeds the field of view of the wide-angle camera 30 refers to the coverage of the combined field of view of the multiple telephoto cameras 20 And beyond the field of view of the wide-angle camera 30.
  • the driving element 101 drives the plurality of telephoto cameras 20 to move from the first position to the second position relative to the wide-angle camera 30, due to the change in the relative position of the telephoto camera 20 and the wide-angle camera 30, the plurality of telephoto cameras The coverage relationship between the field of view area of 20 and the field of view area of the wide-angle camera 30 also changes.
  • the field of view of the plurality of telephoto cameras 20 covers the field of view of the wide-angle camera 30, but it does not exceed the field of view of the wide-angle camera 30.
  • the driving element 101 drives the plurality of telephoto cameras 20 to move from the first position to the second position relative to the wide-angle camera 30, the field of view of the plurality of telephoto cameras 20 covers and exceeds the field of view of the wide-angle camera 30.
  • the field of view of the plurality of telephoto cameras 20 may be within the field of view of the wide-angle camera 30.
  • the field of view refers to the range of the field of view acquired by the camera corresponding to the image. Therefore, when the combined field of view of the plurality of telephoto cameras 20 covers and exceeds the field of view of the wide-angle camera 30, the combined field of view of the plurality of preprocessed images P2 covers and exceeds the field of view of the reference image P1.
  • the driving element 101 drives the telephoto camera 20 by at least one of electromagnetic driving, piezoelectric driving, and memory alloy driving.
  • the driving element 101 drives the telephoto camera 20.
  • the driving element 101 electromagnetically drives the telephoto camera 20.
  • the driving element 101 includes a magnetic field and a conductor. If the magnetic field moves relative to the conductor, an induced current is generated in the conductor. The induced current causes the conductor to be subjected to an ampere force. The ampere force moves the conductor, where the conductor is the part of the driving element 101 that drives the telephoto camera 20 to move.
  • Piezoelectric drive is based on the inverse piezoelectric effect of piezoelectric ceramic materials, that is, if a voltage is applied to the piezoelectric material, mechanical stress is generated, that is, the conversion between electrical energy and mechanical energy occurs.
  • Piezoelectric drive generates rotary or linear motion by controlling its mechanical deformation, which has the advantages of simple structure and low speed.
  • Memory alloy drive is based on the characteristics of shape memory alloy: shape memory alloy is a special alloy. Once it remembers any shape, even if it is deformed, when heated to an appropriate temperature, it can be restored to the pre-deformation The shape, in order to achieve the purpose of driving, has the characteristics of rapid displacement and free direction.
  • step S24 includes:
  • Step S242 controlling multiple telephoto cameras 20 to focus and image at the same position.
  • the processor 10 is used to control multiple telephoto cameras 20 to focus and image at the same position.
  • the multiple telephoto cameras 20 are controlled to acquire images to obtain the preprocessed image P2. It can be understood that the quality and the like of the pre-processed image P2 obtained in this way are almost the same, which is beneficial to improve the quality of the target image P3 obtained by synthesis.
  • step S24 includes:
  • step S244 multiple telephoto cameras 20 are controlled to acquire images simultaneously to obtain a preprocessed image P2.
  • the processor 10 is used to control multiple telephoto cameras 20 to acquire images simultaneously to obtain a pre-processed image P2.
  • multiple pre-processed images P2 can be acquired at the same time, so that images of the object at the same time can be photographed, which is convenient for post-processing such as image stitching to obtain a target image P3 with better quality.
  • the reference image P1 and the multiple pre-processed images P2 can be collected simultaneously.
  • the wide-angle camera 30 and the telephoto camera 20 can be controlled to be exposed at the same time to simultaneously acquire the reference image P1 and the multiple pre-processed images P2.
  • the reference image P1 includes an intermediate region P11 and an edge region P12.
  • the field of view region of the plurality of preprocessed images P2 includes the field of view region of the edge region P12.
  • the field of view area of the image P2 has an overlapping area P21 in the field of view area of the intermediate area P11, the focus position P22 of the preprocessed image P2 is located in the overlapping area P21, and step S30 includes:
  • the reference image P1 includes an intermediate region P11 and an edge region P12
  • the field of view region of the plurality of preprocessed images P2 includes the field of view region of the edge region P12
  • the field of view region of the plurality of preprocessed images P2 is in the middle
  • the field of view of the area P11 has an overlapping area P21
  • the focus position P22 of the preprocessed image P2 is located in the overlapping area P21
  • the processor 10 is used to synthesize a plurality of preprocessed images P2 according to the image of the overlapping area P21 to form a to-be-processed image P23 ; And for synthesizing the to-be-processed image P23 and the reference image P1 to obtain the target image P3.
  • the synthetic reference image P1 and the plurality of preprocessed images P2 are realized to obtain the target image P3.
  • synthesizing a plurality of preprocessed images P2 according to the images of the overlapping area P21 makes any two preprocessed images P2 have more feature points when synthesized, so that the boundary portions of the two preprocessed images P2 can be synthesized better, The to-be-processed image P23 with better quality is obtained, and then the target image P3 with better quality can be obtained.
  • the middle region P11 of the reference image P1 refers to the region located at the center of the reference image P1 (as shown in FIG. 13 within the dotted frame in the reference image P1 ), and the edge region P12 refers to
  • the reference image P1 is an area other than the middle area P11 (a portion other than the dotted frame in FIG. 13).
  • the reference image P1 has a center point
  • the middle area P11 is an area distributed around the center point.
  • the area of the middle area P11 is 1/5-2/3 of the total area of the reference image P1.
  • the area of the intermediate area P11 is 1/5, 1/4, 1/3, or 2/3 of the total area of the reference image P1.
  • the reference image P1 is captured by the wide-angle camera 30
  • the image in the middle area P11 has higher definition and better quality
  • the image quality in the edge area P12 is worse than the image quality in the middle area P11.
  • the pre-processed images P2 in different fields of view can be obtained.
  • the focus position P22 of the preprocessed image P2 is located in the overlapping area P21.
  • the focus position P22 of the preprocessed image P2 has better quality such as sharpness, and each preprocessed image P2 is centered on the focus position P22
  • the image clarity and other qualities of the surrounding area are approximately the same, so that the consistency of the target image P3 obtained after synthesis is good.
  • the focus position P22 of the preprocessed image P2 is located at the position of the circle area.
  • the overlapping area P21 and the focus position P22 are shown in the pre-processed image P2. It should be noted that the image content of the target image P3 includes the background image P1 and the preprocessed image P2.
  • step S32 includes:
  • a plurality of pre-processed images P2 are sequentially spliced in a predetermined direction according to the image of the overlapping area P21 to form an image to be processed P23.
  • the processor 10 is configured to sequentially splice a plurality of pre-processed images P2 in a predetermined direction according to the images of the overlapping area P21 to form a to-be-processed image P23.
  • the predetermined direction is, for example, a clockwise direction, a counterclockwise direction, or other directions.
  • the four pre-processed images P2 are sequentially stitched in the clockwise direction to obtain the image to be processed P23.
  • four preprocessed images P2 are stitched in order from left to right to obtain an image P23 to be processed. In this way, the processing efficiency of the image P23 to be processed is high, and the power consumption of the electronic device 1000 can be reduced.
  • Embodiments of the present application also provide a non-volatile computer-readable storage medium containing computer-executable instructions.
  • the processor 10 executes any of the foregoing embodiments. Imaging method.
  • the electronic device 1000 includes a processor 10 and a memory 60 (for example, a non-volatile storage medium) connected through a system bus 50.
  • the memory 60 stores an operating system and computer readable instructions.
  • the computer readable instructions can be executed by the processor 10 to implement the imaging method of any of the above embodiments.
  • the processor 10 can be used to provide computing and control capabilities to support the operation of the entire electronic device 1000.
  • the internal memory 60 of the electronic device 1000 provides an environment for the execution of computer-readable instructions in the memory 60.
  • first and second are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.
  • the features defined as “first” and “second” may explicitly or implicitly include one or more of the features.
  • the meaning of “plurality” is two or more, unless otherwise specifically limited.
  • reference to the descriptions of the terms “one embodiment”, “certain embodiments”, “schematic embodiments”, “examples”, “specific examples” or “some examples” is meant to be combined with the specific features, structures, materials, or characteristics described in the embodiments or examples are included in at least one embodiment or example of the present application.
  • a person of ordinary skill in the art can understand that all or part of the steps carried in the method of the above embodiments can be completed by instructing relevant hardware through a program, and the program can be stored in a computer-readable storage medium. When executed, it includes one of the steps of the method embodiment or a combination thereof.
  • the storage medium mentioned above may be a read-only memory, a magnetic disk or an optical disk.

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Abstract

L'invention concerne un procédé d'imagerie, un dispositif d'imagerie (300), un appareil électronique (1000), et un support. Le procédé d'imagerie est appliqué à l'appareil électronique (1000). L'appareil électronique (1000) comprend une caméra grand angle (30) et plusieurs caméras à téléobjectif (20). Le procédé d'imagerie comprend les étapes consistant à : obtenir une image collectée par la caméra grand angle (30) en tant qu'image de référence (P1); obtenir les images collectées respectivement par les multiples caméras à téléobjectif (20) en tant qu'images pré-traitées (P2), les zones de champ visuel des multiples images prétraitées couvrant celle de l'image de référence (P1), et dépassant celle de l'image de référence (P1); et synthétiser l'image de référence (P1) et les multiples images prétraitées (P2) afin d'obtenir une image cible (P3). Au moyen du procédé d'imagerie des modes de réalisation de la présente invention, les zones de champ visuel des multiples images prétraitées (P2) recouvrent et dépassent celle de l'image de référence (P1), de sorte que l'image cible (P3) synthétisée à partir des multiples images prétraitées (P2) et de l'image de référence (P1) puisse réaliser un effet d'angle ultra-large, et il est avantageux d'améliorer l'expérience de l'utilisateur.
PCT/CN2019/120570 2018-12-29 2019-11-25 Procédé d'imagerie, dispositif d'imagerie, appareil électronique, et support WO2020134779A1 (fr)

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