WO2020134473A1 - 封装天线系统及移动终端 - Google Patents

封装天线系统及移动终端 Download PDF

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Publication number
WO2020134473A1
WO2020134473A1 PCT/CN2019/113361 CN2019113361W WO2020134473A1 WO 2020134473 A1 WO2020134473 A1 WO 2020134473A1 CN 2019113361 W CN2019113361 W CN 2019113361W WO 2020134473 A1 WO2020134473 A1 WO 2020134473A1
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WO
WIPO (PCT)
Prior art keywords
antenna
packaged
mobile terminal
antenna system
screen
Prior art date
Application number
PCT/CN2019/113361
Other languages
English (en)
French (fr)
Inventor
夏晓岳
王超
Original Assignee
瑞声声学科技(深圳)有限公司
瑞声科技（南京）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞声声学科技(深圳)有限公司, 瑞声科技（南京）有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Publication of WO2020134473A1 publication Critical patent/WO2020134473A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/08—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a rectilinear path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/06—Details
    • H01Q9/065—Microstrip dipole antennas

Definitions

  • the invention relates to the technical field of wireless communication, in particular to a packaged antenna system and a mobile terminal.
  • the rich bandwidth resources of the millimeter wave band provide a guarantee for the high-speed transmission rate, but due to the severe space loss of electromagnetic waves in this band, the wireless communication system using the millimeter wave band needs to adopt a phased array architecture.
  • the phase shifter makes the phase of each array element distributed according to a certain rule, thereby forming a high-gain beam, and changes the phase shift to make the beam scan within a certain spatial range.
  • the antenna is an indispensable component in the RF front-end system. While the RF circuit is developing towards integration and miniaturization, it is an inevitable trend for the future development of the RF front-end to integrate and package the antenna and the RF front-end circuit.
  • Encapsulated antenna (AiP) technology is to integrate the antenna into the package that carries the chip through the packaging material and process. It takes into account the antenna performance, cost and volume, and is favored by the majority of chip and package manufacturers.
  • Qualcomm, Intel, IBM and other companies have adopted packaged antenna technology. Needless to say, AiP technology will also provide a good antenna solution for 5G millimeter wave mobile communication systems.
  • the packaged antenna cannot cover the two bands, so the 28 GHz band and The 39GHz band is two independent channels and requires a large area in the mobile phone space.
  • An object of the present invention is to provide a packaged antenna system and a mobile terminal, which can achieve 28 GHz and 39 GHz dual-frequency coverage and reduce the overall area occupied by the packaged antenna system.
  • An encapsulated antenna system is applied to a mobile terminal.
  • the mobile terminal includes a screen, a back cover that covers the screen and cooperates with it to form a receiving space, and is sandwiched between the screen and the
  • the main board between the back cover, the packaged antenna system includes a substrate provided between the back cover and the main board, a metal antenna provided on the side of the base board away from the main board, and a close position on the substrate
  • An integrated circuit chip on one side of the main board and a circuit provided in the substrate to connect the metal antenna and the integrated circuit chip, the circuit is connected to the main board, and the metal antenna includes a stacked first An antenna and a second antenna, and the first antenna is disposed on a side of the second antenna away from the main board;
  • the mobile terminal be placed in a three-dimensional coordinate system that takes the center point of the installation position of the packaged antenna as an origin, the X axis of the three-dimensional coordinate system extends along the long axis direction of the mobile terminal, and the three-dimensional coordinate system
  • the Y axis of the mobile terminal extends along the short axis direction of the mobile terminal, the Z axis of the three-dimensional coordinate system extends along the thickness direction of the mobile terminal, and the positive axis of the Y axis points away from the mobile terminal.
  • the positive axis of the Z axis points to the back cover;
  • the beam of the first antenna covers the space of Y>0;
  • the beam of the second antenna covers the space where Z>0.
  • the rear cover includes a bottom wall spaced apart from the screen and a side wall bent and extending from the outer periphery of the bottom wall toward the screen, and the packaged antenna system is adjacent to the side wall Set and parallel to the bottom wall.
  • the first antenna implements beam scanning in the space of Y>0; the second antenna implements beam scanning in the space of Z>0.
  • the packaged antenna system is a millimeter wave phased array antenna system.
  • the packaged antenna system is a dual-band antenna system, the first antenna works in the 28 GHz frequency band; and the second antenna works in the 39 GHz frequency band.
  • the first antenna is a one-dimensional linear array, which includes a plurality of first antenna units, and the plurality of first antenna units are arranged at intervals in the X-axis direction.
  • the second antenna is a one-dimensional linear array, which includes a plurality of second antenna units, and the plurality of second antenna units are arranged at intervals in the X-axis direction.
  • the first antenna is selected from one of a dipole antenna, a monopole antenna and a slot antenna.
  • the second antenna is selected from one of a square patch antenna, a loop patch antenna, a round patch antenna and a cross patch antenna.
  • the invention also provides a mobile terminal, which includes the packaged antenna system.
  • the packaged antenna system and the mobile terminal provided by the present invention have the following beneficial effects: the packaged antenna system packages the first antenna and the second antenna on the substrate at the same time, achieving dual-frequency coverage of the packaged antenna system, At the same time, the packaged antenna system is formed by stacking PCB technology or LTCC technology.
  • the size is reduced to 22*6mm, the occupied area is greatly reduced, and the first antenna Stacked with the second antenna can further reduce the space occupied by the packaged antenna system;
  • the millimeter wave phased array antenna system uses a linear array instead of a planar array, and the space occupied by the mobile phone becomes narrower, only An angle needs to be scanned to simplify the design difficulty, test difficulty, and complexity of beam management.
  • FIG. 1 is a schematic diagram of a stereo structure of a mobile terminal provided by the present invention.
  • FIG. 2 is a schematic diagram of a connection structure of the packaged antenna shown in FIG. 1 and the main board;
  • FIG. 3 is a front view of the packaged antenna system shown in FIG. 1;
  • 5 is a radiation pattern of the second antenna unit with a phase shift of 0° when the packaged antenna system provided by the present invention is in the 39 GHz frequency band;
  • 6(a) is a graph of the coverage efficiency of the packaged antenna system provided by the present invention in the 28 GHz frequency band;
  • 6(b) is a graph of the coverage efficiency of the packaged antenna system provided by the present invention in the 39 GHz frequency band.
  • the present invention provides a mobile terminal 100.
  • the mobile terminal 100 may be a mobile phone, an iPad, and a POS machine.
  • the present invention does not limit this.
  • the mobile terminal 100 includes a screen 1 and a cover.
  • the screen 1 cooperates with the screen 1 to form a back cover 2 of a receiving space, a main board 3 interposed between the screen 1 and the back cover 2, and a packaged antenna system 4 connected to the main board 3.
  • the mobile terminal 100 is placed in a three-dimensional coordinate system with the center point of the package antenna 4 as the origin, and the X axis of the three-dimensional coordinate system is along the mobile terminal
  • the long axis direction of 100 extends
  • the Y axis of the three-dimensional coordinate system extends along the short axis direction of the mobile terminal 100
  • the Z axis of the three-dimensional coordinate system extends along the thickness direction of the mobile terminal 100
  • the Y axis The positive axis of is directed away from the mobile terminal 100
  • the positive axis of the Z axis is directed toward the back cover 2.
  • the back cover 2 is a 3D glass back cover, which can provide better protection, aesthetics, thermal diffusion, color and user experience.
  • the rear cover 2 includes a bottom wall 21 spaced apart from the screen 1 and a side wall 22 bent and extending from the outer periphery of the bottom wall 21 toward the screen 1.
  • the side wall 22 is connected to the screen 1, and the bottom wall 21 and the side wall 22 are integrally formed.
  • the main board 3 is accommodated in the accommodation space.
  • the encapsulated antenna system 4 is disposed adjacent to the side wall 22 and parallel to the bottom wall 21.
  • the encapsulated antenna system is used to receive and transmit electromagnetic wave signals, thereby implementing the communication function of the mobile terminal 100.
  • the packaged antenna system 4 may be packaged through a solder ball array (Ball Grid Array (BGA) technology is connected to the motherboard 3.
  • BGA solder ball array
  • the packaged antenna system 4 includes a substrate 41 disposed between the screen 1 and the back cover 2, an integrated circuit chip 42 disposed on a side of the substrate 41 near the main board 3, and disposed on the substrate 41 is a metal antenna 43 on a side away from the main board 3 and a circuit 44 provided in the substrate 41 to connect the integrated circuit chip 42 and the metal antenna 43.
  • the substrate 41 is used to carry the metal antenna 43 and the circuit 44.
  • the substrate 41 may be integrally formed, or may be arranged in layers.
  • the integrated circuit chip 42 is fixedly connected to the substrate 41 through an inverted pile welding process.
  • the packaged antenna system 4 is a dual-band antenna system.
  • the metal antenna 43 includes a first antenna 431 and a second antenna 432 that are stacked, and the first antenna 431 is located away from the second antenna 432 On the side of the main board 3, wherein the first antenna 431 works in the 28GHz frequency band, the second antenna 432 works in the 39GHz frequency band, and the isolation between the first antenna 431 and the second antenna 432 is better than -30dB.
  • the packaged antenna system 4 is a millimeter wave phased array system, which occupies a narrow space in the mobile phone; and only needs to scan one angle, which simplifies the design difficulty, test difficulty, and beam management complexity.
  • the first antenna 431 is a one-dimensional linear array, which includes a plurality of first antenna units 4311, and the plurality of first antenna units 4311 are arranged at intervals in the X-axis direction;
  • the second antenna 432 is a A dimensional linear array includes a plurality of second antenna units 4321, and the plurality of second antenna units 4321 are arranged at intervals in the X-axis direction.
  • the first antenna 431 is a linear array of 1*4, that is, the first antenna 431 includes four of the first antenna units 4311; the second antenna 432 is a linear of 1*4 In other words, the second antenna 432 includes four of the second antenna units 4321.
  • the first antenna 431 is selected from one of a dipole antenna, a monopole antenna, and a slot antenna; the second antenna 432 is selected from a square patch antenna, a loop patch antenna, and a round patch One of patch antenna and cross-shaped patch antenna.
  • the first antenna 431 is a dipole antenna
  • the second antenna 432 is a square patch antenna.
  • the first antenna 431 and the second antenna 432 may also be Use other types of antennas.
  • the beam of the first antenna 431 covers the space of Y>0; the beam of the second antenna 432 covers the space of Z>0, that is, the first antenna 431 realizes the beam scanning in the space of Y>0; The second antenna 432 realizes beam scanning in the space where Z>0.
  • the packaged antenna system 4 in this embodiment packages the first antenna 431 and the second antenna 432 on the substrate 41 at the same time, and is stacked to make the structure of the antenna system 3 more Compact, reduces space occupation, and at the same time realizes the dual-frequency coverage of the packaged antenna system 4, and at the same time, the packaged antenna system 4 is formed by stacking a PCB process or an LTCC process, compared to the dual-band antenna in the related art The size of the system is reduced to 22*6mm, and the occupied area is greatly reduced.
  • 5 is a radiation pattern of the second antenna unit with a phase shift of 0° when the packaged antenna system provided by the present invention is in the 39 GHz frequency band;
  • 6(a) is a graph of the coverage efficiency of the packaged antenna system provided by the present invention in the 28 GHz frequency band;
  • 6(b) is a graph of the coverage efficiency of the packaged antenna system provided by the present invention in the 39 GHz frequency band.
  • the packaged antenna system 4 provided by the present invention can realize Y-direction and Z-direction coverage.
  • the gain threshold of the packaged antenna system 4 drops by 7 dB when the coverage efficiency is 50% in the 28 GHz frequency band, while in the 3GPP discussion, for 50% coverage Efficiency, the gain threshold is reduced to 12.98dB; in the 39GHz band, at a coverage efficiency of 50%, the gain threshold of the packaged antenna system 4 is reduced by 10dB, and in the 3GPP discussion, for 50% coverage efficiency, the gain The threshold drop is 13.6-18.0dB, indicating that the packaged antenna system 4 of the present invention has better coverage efficiency.
  • the packaged antenna system 4 and the mobile terminal 100 provided by the present invention have the following beneficial effects: the packaged antenna system 4 packages the first antenna 431 and the second antenna 432 on the substrate 41 at the same time, realizing the packaged antenna The dual-frequency coverage of the system 4 and at the same time, the packaged antenna system 4 is laminated by PCB technology or LTCC technology.
  • the size is reduced to 22*6mm, and the occupied area is greatly reduced Small, and the first antenna 431 and the second antenna 432 are stacked, which can further reduce the space occupied by the packaged antenna system 4;
  • the millimeter wave phased array antenna system uses a linear array instead of a planar array
  • the space occupied by the mobile phone is narrow, and only one angle of scanning is required, which simplifies the design difficulty, test difficulty, and the complexity of beam management.

Abstract

本发明提供了一种封装天线系统及移动终端。所述移动终端包括屏幕、盖合于所述屏幕并与其配合形成收容空间的后盖及夹设于所述屏幕和所述后盖之间的主板，所述封装天线系统包括设于所述屏幕和所述后盖之间的基板及设于所述基板远离所述主板的一侧的金属天线所述金属天线包括堆叠设置的第一天线和第二天线，且所述第一天线设置于所述第二天线远离所述主板的一侧，所述第一天线的波束覆盖Y>0的空间；所述第二天线的波束覆盖Z>0的空间。本发明提供的封装天线系统实现了28GHz和39GHz的双频覆盖，同时，尺寸减小为22*6mm，所占面积大幅减小，并且增益降低小。

Description

封装天线系统及移动终端 技术领域
本发明涉及无线通信技术领域，尤其涉及一种封装天线系统及移动终端。
 背景技术
5G作为全球业界的研发焦点，发展5G技术制定5G标准已经成为业界共识。国际电信联盟 ITU 在 2015 年 6 月召开的 ITU-RWP5D 第 22 次会议上明确了 5G 的三个主要应用场景：增强型移动宽带、大规模机器通信、高可靠低延时通信。这三个应用场景分别对应着不同的关键指标，其中增强型移动带宽场景下用户峰值速度为20Gbps，最低用户体验速率为100Mbps。目前3GPP正在对5G技术进行标准化工作，第一个5G非独立组网(NSA)国际标准于2017年12月正式完成并冻结，并计划在2018年6月完成5G独立组网标准。3GPP会议期间诸多关键技术和系统架构等研究工作得到迅速聚焦，其中包含毫米波技术。毫米波独有的高载频、大带宽特性是实现5G超高数据传输速率的主要手段。
毫米波频段丰富的带宽资源为高速传输速率提供了保障，但是由于该频段电磁波剧烈的空间损耗，利用毫米波频段的无线通信系统需要采用相控阵的架构。通过移相器使得各个阵元的相位按一定规律分布，从而形成高增益波束，并且通过相移的改变使得波束在一定空间范围内扫描。
天线作为射频前端系统中不可缺少的部件，在射频电路向着集成化、小型化方向发展的同时，将天线与射频前端电路进行系统集成和封装成为未来射频前端发展的必然趋势。封装天线（AiP）技术是通过封装材料与工艺将天线集成在携带芯片的封装内，很好地兼顾了天线性能、成本及体积，深受广大芯片及封装制造商的青睐。目前高通，Intel，IBM等公司都采用了封装天线技术。毋庸置疑，AiP技术也将为5G毫米波移动通信系统提供很好的天线解决方案。
相关技术中，由于28GHz和39GHz频段相距甚远，封装天线无法覆盖两个频段，因此28GHz频段和 39GHz频段是两个独立的通道，在手机空间内需要占用较大的面积。
因此，实有必要提供一种新的封装天线系统及移动终端以解决上述问题。
 技术问题
本发明的目的在于提供一种封装天线系统及移动终端，其能够实现28GHz和39GHz双频覆盖，并缩小封装天线系统整体所占面积。
 技术解决方案
本发明的技术方案如下：一种封装天线系统，应用于移动终端，所述移动终端包括屏幕、盖合于所述屏幕并与其配合形成收容空间的后盖及夹设于所述屏幕和所述后盖之间的主板，所述封装天线系统包括设于所述后盖与所述主板之间的基板、设于所述基板远离所述主板的一侧的金属天线、设于所述基板靠近所述主板的一侧的集成电路芯片及设于所述基板内连接所述金属天线和所述集成电路芯片的电路，所述电路与所述主板连接，所述金属天线包括堆叠设置的第一天线和第二天线，且所述第一天线设置于所述第二天线远离所述主板的一侧；
设所述移动终端摆放于以所述封装天线设置位置的中心点为原点的三维坐标系中，所述三维坐标系的X轴沿所述移动终端的长轴方向延伸，所述三维坐标系的Y轴沿所述移动终端的短轴方向延伸，所述三维坐标系的Z轴沿所述移动终端的厚度方向延伸，所述Y轴的正轴指向远离所述移动终端的方向，所述Z轴的正轴指向所述后盖；
则所述第一天线的波束覆盖Y>0的空间；
所述第二天线的波束覆盖Z>0的空间。
优选的，所述后盖包括与所述屏幕相对间隔设置的底壁及自所述底壁的外周缘向靠近所述屏幕方向弯折延伸的侧壁，所述封装天线系统临近所述侧壁设置并与所述底壁平行。
优选的，所述第一天线在Y>0的空间内实现波束扫描；所述第二天线在Z>0的空间内实现波束扫描。
优选的，所述封装天线系统为毫米波相控阵天线系统。
优选的，所述封装天线系统为双频天线系统，所述第一天线工作于28GHz频段；所述第二天线工作于39GHz频段。
优选的，所述第一天线为一维直线阵，其包括多个第一天线单元，多个所述第一天线单元沿X轴方向间隔排布。
优选的，所述第二天线为一维直线阵，其包括多个第二天线单元，多个所述第二天线单元沿X轴方向间隔排布。
优选的，所述第一天线选自偶极子天线、单极子天线及缝隙天线中的一种。
优选的，所述第二天线选自方形贴片天线、环形贴片天线、圆形贴片天线及十字形贴片天线中的一种。
本发明还提供一种移动终端，其包括所述的封装天线系统。
 有益效果
与相关技术相比，本发明提供的封装天线系统及移动终端具有如下有益效果：封装天线系统将第一天线和第二天线同时封装在基板上，实现了所述封装天线系统的双频覆盖，同时，所述封装天线系统采用PCB工艺或者LTCC工艺层叠而成，相比于相关技术中的双频天线系统，尺寸减小为22*6mm，所占面积大幅减小，且所述第一天线和所述第二天线堆叠设置，可以进一步减小所述封装天线系统所占用的空间；所述毫米波相控阵天线系统采用线阵而非平面阵，在手机中占用的空间变窄，只需扫描一个角度，简化了设计难度、测试难度、以及波束管理的复杂度。
 附图说明
图1为本发明提供的移动终端的立体结构示意图；
图2为图1所示的封装天线与所述主板的连接结构示意图；
图3为图1所示的封装天线系统的正视图；
图4为本发明提供的封装天线系统在28GHz频段时，第一天线单元的相移为0°的辐射方向图；
图5为本发明提供的封装天线系统在39GHz频段时，第二天线单元的相移为0°的辐射方向图；
图6（a）为本发明提供的封装天线系统在28GHz频段下的覆盖效率曲线图；
图6（b）为本发明提供的封装天线系统在39GHz频段下的覆盖效率曲线图。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部份实施例，而不是全部的实施例。
如图1-3所示，本发明提供一种移动终端100，该移动终端100可以是手机、ipad以及POS机等，本发明对此不作限定，所述移动终端100包括屏幕1、盖合于所述屏幕1并与所述屏幕1配合形成收容空间的后盖2、夹设于所述屏幕1和所述后盖2之间的主板3及与所述主板3连接的封装天线系统4。
为更清楚的表达本发明内容，将所述移动终端100摆放于以所述封装天线4设置位置的中心点为原点的三维坐标系中，所述三维坐标系的X轴沿所述移动终端100的长轴方向延伸，所述三维坐标系的Y轴沿所述移动终端100的短轴方向延伸，所述三维坐标系的Z轴沿所述移动终端100的厚度方向延伸，所述Y轴的正轴指向远离所述移动终端100的方向，所述Z轴的正轴指向所述后盖2。
所述后盖2为3D玻璃后盖，能提供更好的保护、美观度、热扩散、色彩度以及用户体验。具体的，所述后盖2包括与所述屏幕1相对间隔设置的底壁21及自所述底壁21的外周缘向靠近所述屏幕1方向弯折延伸的侧壁22，所述侧壁22与所述屏幕1连接，所述底壁21和所述侧壁22一体成型。
所述主板3收容于所述收容空间内。
所述封装天线系统4临近所述侧壁22设置并与所述底壁21平行，所述封装天线系统用于接收和发送电磁波信号，进而实现所述移动终端100的通信功能。具体地，所述封装天线系统4可以通过焊球阵列封装（Ball Grid Array，BGA）技术与所述主板3连接。
所述封装天线系统4包括设于所述屏幕1和所述后盖2之间的基板41、设于所述基板41靠近所述主板3的一侧的集成电路芯片42、设于所述基板41远离所述主板3的一侧的金属天线43及设于所述基板41内连接所述集成电路芯片42和所述金属天线43的电路44。
所述基板41用于承载所述金属天线43和所述电路44，所述基板41可以一体成型，也可以分层设置。所述集成电路芯片42通过倒桩焊工艺与所述基板41固定连接。
所述封装天线系统4为双频天线系统，具体的，所述金属天线43包括堆叠设置的第一天线431和第二天线432，且所述第一天线431设置于所述第二天线432远离所述主板3的一侧，其中，所述第一天线431工作于28GHz频段，所述第二天线432工作于39GHz频段，所述第一天线431和所述第二天线432的隔离度优于-30dB。
进一步的，所述封装天线系统4为毫米波相控阵系统，在手机中占用的空间变窄；并只需扫描一个角度，简化了设计难度、测试难度、以及波束管理的复杂度。
具体的，所述第一天线431为一维直线阵，其包括多个第一天线单元4311，多个所述第一天线单元4311沿X轴方向间隔排布；所述第二天线432为一维直线阵，其包括多个第二天线单元4321，多个所述第二天线单元4321沿X轴方向间隔排布。优选的，优选的，所述第一天线431为1*4的直线阵，即所述第一天线431包括四个所述第一天线单元4311；所述第二天线432为1*4的直线阵，即所述第二天线432包括四个所述第二天线单元4321。
更进一步的，所述第一天线431选自偶极子天线、单极子天线及缝隙天线中的一种；所述第二天线432选自方形贴片天线、环形贴片天线、圆形贴片天线及十字形贴片天线中的一种。优选的，所述第一天线431为偶极子天线，所述第二天线432为方形贴片天线，当然，在其他实施方式中，所述第一天线431和所述第二天线432也可以选用其他形式的天线。
所述第一天线431的波束覆盖Y>0的空间；所述第二天线432的波束覆盖Z>0的空间，即所述第一天线431在Y>0的空间内实现波束扫描；所述第二天线432在Z>0的空间内实现波束扫描。
相比于相关技术中的封装天线，本实施方式中的封装天线系统4将第一天线431和第二天线432同时封装在基板41上，并且堆叠设置，使得所述天线系统3的结构更为紧凑，减小了占用空间，同时实现了所述封装天线系统4的双频覆盖，同时，所述封装天线系统4采用PCB工艺或者LTCC工艺层叠而成，相比于相关技术中的双频天线系统，尺寸减小为22*6mm，所占面积大幅减小。
请参阅图4~图6（b），其中：
图4为本发明提供的封装天线系统在28GHz频段时，第一天线单元的相移为0°的辐射方向图；
图5为本发明提供的封装天线系统在39GHz频段时，第二天线单元的相移为0°的辐射方向图；
图6（a）为本发明提供的封装天线系统在28GHz频段下的覆盖效率曲线图；
图6（b）为本发明提供的封装天线系统在39GHz频段下的覆盖效率曲线图。
结合图4和图5可知，本发明提供的封装天线系统4可以实现Y方向和Z方向覆盖。结合图6（a）和图6（b）可知，28GHz频段时，在覆盖效率为50%的情况下，所述封装天线系统4的增益阈值下降7dB，而在3GPP讨论中，对于50%覆盖效率, 该增益阈值下降为12.98dB；39GHz频段时，在覆盖效率为50%的情况下，所述封装天线系统4的增益阈值下降10dB，而在3GPP讨论中，对于50%覆盖效率, 该增益阈值下降为13.6-18.0dB，说明本发明的封装天线系统4具有更优的覆盖效率。
与相关技术相比，本发明提供的封装天线系统4及移动终端100具有如下有益效果：封装天线系统4将第一天线431和第二天线432同时封装在基板41上，实现了所述封装天线系统4的双频覆盖，同时，所述封装天线系统4采用PCB工艺或者LTCC工艺层叠而成，相比于相关技术中的双频天线系统，尺寸减小为22*6mm，所占面积大幅减小，且所述第一天线431和所述第二天线432堆叠设置，可以进一步减小所述封装天线系统4所占用的空间；所述毫米波相控阵天线系统采用线阵而非平面阵，在手机中占用的空间变窄，只需扫描一个角度，简化了设计难度、测试难度、以及波束管理的复杂度。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (10)

  1. 一种封装天线系统，应用于移动终端，所述移动终端包括屏幕、盖合于所述屏幕并与其配合形成收容空间的后盖及夹设于所述屏幕和所述后盖之间的主板，其特征在于，所述封装天线系统包括设于所述后盖与所述主板之间的基板、设于所述基板远离所述主板的一侧的金属天线、设于所述基板靠近所述主板的一侧的集成电路芯片及设于所述基板内连接所述金属天线和所述集成电路芯片的电路，所述电路与所述主板连接，所述金属天线包括堆叠设置的第一天线和第二天线，且所述第一天线设置于所述第二天线远离所述主板的一侧；
    设所述移动终端摆放于以所述封装天线设置位置的中心点为原点的三维坐标系中，所述三维坐标系的X轴沿所述移动终端的长轴方向延伸，所述三维坐标系的Y轴沿所述移动终端的短轴方向延伸，所述三维坐标系的Z轴沿所述移动终端的厚度方向延伸，且所述Y轴的正轴指向远离所述移动终端的方向，所述Z轴的正轴指向所述后盖；
    则所述第一天线的波束覆盖Y>0的空间；
    所述第二天线的波束覆盖Z>0的空间。
  2. 根据权利要求1所述的封装天线系统，其特征在于，所述后盖包括与所述屏幕相对间隔设置的底壁及自所述底壁的外周缘向靠近所述屏幕方向弯折延伸的侧壁，所述封装天线系统临近所述侧壁设置并与所述底壁平行。
  3. 根据权利要求1所述的封装天线系统，其特征在于，所述第一天线在Y>0的空间内实现波束扫描；所述第二天线在Z>0的空间内实现波束扫描。
  4. 根据权利要求1所述的封装天线系统，其特征在于，所述封装天线系统为毫米波相控阵天线系统。
  5. 根据权利要求4所述的封装天线系统，其特征在于，所述封装天线系统为双频天线系统，所述第一天线工作于28GHz频段；所述第二天线工作于39GHz频段。
  6. 根据权利要求4所述的封装天线系统，其特征在于，所述第一天线为一维直线阵，其包括多个第一天线单元，多个所述第一天线单元沿X轴方向间隔排布。
  7. 根据权利要求4所述的封装天线系统，其特征在于，所述第二天线为一维直线阵，其包括多个第二天线单元，多个所述第二天线单元沿X轴方向间隔排布。
  8. 根据权利要求1所述的封装天线系统，其特征在于，所述第一天线选自偶极子天线、单极子天线及缝隙天线中的一种。
  9. 根据权利要求1所述的封装天线系统，其特征在于，所述第二天线选自方形贴片天线、环形贴片天线、圆形贴片天线及十字形贴片天线中的一种。
  10. 一种移动终端，其特征在于，包括权利要求1-9任一项所述的封装天线系统。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11201119B2 (en) 2018-06-06 2021-12-14 At&S Austria Technologie & Systemtechnik Aktiengesellschaft RF functionality and electromagnetic radiation shielding in a component carrier

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109088180B (zh) * 2018-08-12 2020-11-20 瑞声科技（南京）有限公司 Aog天线系统及移动终端
CN109119768A (zh) * 2018-08-12 2019-01-01 瑞声科技（南京）有限公司 Aog天线系统及移动终端
CN109786933B (zh) * 2018-12-29 2021-09-07 瑞声科技（南京）有限公司 封装天线系统及移动终端
CN109830799A (zh) * 2018-12-29 2019-05-31 瑞声科技（南京）有限公司 介质谐振器封装天线系统及移动终端
CN111430939A (zh) * 2019-12-13 2020-07-17 瑞声科技(新加坡)有限公司 相控阵天线阵列
CN111244605B (zh) * 2020-01-16 2021-09-14 Oppo广东移动通信有限公司 电子设备
CN112993592B (zh) * 2021-02-08 2023-06-09 维沃移动通信有限公司 天线封装模组及电子设备
TWI825463B (zh) * 2021-08-10 2023-12-11 矽品精密工業股份有限公司 封裝基板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103457029A (zh) * 2013-09-04 2013-12-18 北京合众思壮科技股份有限公司 双频天线
WO2016003237A1 (ko) * 2014-07-04 2016-01-07 삼성전자주식회사 무선 통신 기기에서 안테나 장치
CN105990666A (zh) * 2015-01-30 2016-10-05 深圳光启尖端技术有限责任公司 通信天线、天线系统和通信设备
CN107248613A (zh) * 2017-06-19 2017-10-13 深圳市维力谷无线技术股份有限公司 一种高增益双频天线单元
CN109088180A (zh) * 2018-08-12 2018-12-25 瑞声科技（南京）有限公司 Aog天线系统及移动终端
CN109786933A (zh) * 2018-12-29 2019-05-21 瑞声科技（南京）有限公司 封装天线系统及移动终端

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101132447B1 (ko) * 2006-06-23 2012-03-30 엘지전자 주식회사 휴대 단말기
US7728774B2 (en) * 2008-07-07 2010-06-01 International Business Machines Corporation Radio frequency (RF) integrated circuit (IC) packages having characteristics suitable for mass production
US8912957B2 (en) * 2011-12-12 2014-12-16 Qualcomm Incorporated Reconfigurable millimeter wave multibeam antenna array
US8648454B2 (en) * 2012-02-14 2014-02-11 International Business Machines Corporation Wafer-scale package structures with integrated antennas
US9806422B2 (en) * 2013-09-11 2017-10-31 International Business Machines Corporation Antenna-in-package structures with broadside and end-fire radiations
CN107546486B (zh) * 2016-06-23 2021-06-29 康普技术有限责任公司 具有恒定反转相位的天线馈送元件
CN108232422B (zh) * 2017-12-29 2019-12-06 维沃移动通信有限公司 一种天线及无线移动终端
CN108649019B (zh) * 2018-05-14 2020-12-08 中国科学院微电子研究所 扇出型封装结构

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103457029A (zh) * 2013-09-04 2013-12-18 北京合众思壮科技股份有限公司 双频天线
WO2016003237A1 (ko) * 2014-07-04 2016-01-07 삼성전자주식회사 무선 통신 기기에서 안테나 장치
CN105990666A (zh) * 2015-01-30 2016-10-05 深圳光启尖端技术有限责任公司 通信天线、天线系统和通信设备
CN107248613A (zh) * 2017-06-19 2017-10-13 深圳市维力谷无线技术股份有限公司 一种高增益双频天线单元
CN109088180A (zh) * 2018-08-12 2018-12-25 瑞声科技（南京）有限公司 Aog天线系统及移动终端
CN109786933A (zh) * 2018-12-29 2019-05-21 瑞声科技（南京）有限公司 封装天线系统及移动终端

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11201119B2 (en) 2018-06-06 2021-12-14 At&S Austria Technologie & Systemtechnik Aktiengesellschaft RF functionality and electromagnetic radiation shielding in a component carrier

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