WO2020134469A1 - 镜头组件、感光组件和摄像模组及其组装方法 - Google Patents
镜头组件、感光组件和摄像模组及其组装方法 Download PDFInfo
- Publication number
- WO2020134469A1 WO2020134469A1 PCT/CN2019/113352 CN2019113352W WO2020134469A1 WO 2020134469 A1 WO2020134469 A1 WO 2020134469A1 CN 2019113352 W CN2019113352 W CN 2019113352W WO 2020134469 A1 WO2020134469 A1 WO 2020134469A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- photosensitive
- lens
- circuit board
- lens holder
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
Definitions
- the invention relates to the field of camera modules, and more specifically relates to a lens assembly, a photosensitive assembly, a camera module and an assembling method thereof, so as to reduce the influence of the deformation of glue on imaging during the baking process.
- most camera modules include a lens assembly, a lens holder, a color filter, a photosensitive element, and a circuit board.
- the assembly process of the camera module is generally to attach the photosensitive chip to the circuit board electrically, the lens holder to the circuit board, the color filter to the lens holder, and A photosensitive element is formed.
- the lens assembly In a fixed-focus camera module, the lens assembly is generally assembled from an optical lens assembly, a lens barrel, and a support.
- the lens assembly In the autofocus camera module, the lens assembly generally uses an actuator as the support of the lens barrel to carry the optical lens assembly and the lens barrel. The lens assembly is supported on the top side of the photosensitive assembly, and finally forms the camera module.
- most of the components are exposed and fixed by dispensing.
- the assembly tolerance of each component continues to accumulate.
- the support of the lens assembly is installed on the top side of the photosensitive assembly, and then a lens (ie, the The lens barrel of the optical lens assembly) and the support are assembled to reduce tolerances. That is, by lighting the photosensitive chip, fixing the photosensitive assembly, adjusting the mechanical arm to clamp the lens, and taking pictures of the standard target. By running the defocus curve, the optimal assembly position of the lens and the support is obtained, and the relative position of the two is fixed by glue curing.
- the photosensitive chip and a photosensitive area thereof are rectangular, and an imaging surface of an optical system of the lens assembly is circular.
- the light area of the optical system reaching the photosensitive area needs to fully cover the photosensitive area, as shown in FIG. 1.
- the offset value of the imaging surface of the optical system in the long-side direction (X direction) of the photosensitive chip is smaller than that in the wide-side direction (Y direction).
- a slight offset and tilt in the X direction may cause the imaging surface of the optical system to not cover the photosensitive area well, which may result in blurred imaging.
- the photosensitive region is more sensitive to the shift or tilt of the photosensitive chip in the X direction.
- the prior art In order to strengthen the fixing strength between the lens and the supporting member, the prior art usually adopts a four-point dispensing method with uniform and symmetrical distribution. After the AA adjustment is performed and the optimal position of the lens and the supporting member is glued and cured, the camera module needs to undergo baking in the subsequent process. During the baking process, the glue will be deformed due to the increase of temperature and other reasons, and the thermal expansion and contraction of the lens assembly itself will force the lens in all directions. The amount of variation in different amounts of glue in the same environment is different, the pulling force applied to the lens is also different, and the uneven force on the lens causes it to deviate from the original assembly position. In some cases, because the amount of deformation at each dispensing position is different, they pull on each other, causing the glue to crack where the adhesion is relatively small.
- the lens and the supporting member are dispensed in the corresponding areas of the two long-side directions and the two short-side directions of the photosensitive chip.
- the dispense amount of the four-point dispensing position is inconsistent, resulting in inconsistent deformation of the various dispensing positions during the baking process, or even causing the glue to crack.
- the position indicated by the arrow in the figure is the four-point dispensing position commonly used in the prior art for mounting the lens and the support member.
- the lens does not stick to the glue, and naturally cannot recover from the glue during the cooling and recovery process. Therefore, during the baking process, the lens that is pulled by the pulling force is pushed and offset, because it does not receive the corresponding restoring force, it cannot be restored to the original position during the cooling process, so that the lens and the support member in the final product are produced. Offset.
- the photosensitive area of the wide-angle camera module is larger than that of the ordinary camera module, and the offset value in the X direction is smaller.
- the misalignment of the offset directions caused by the glue deformation will cause the optical axes of the two modules in the array module to be non-parallel or deviate from the calibration coordinates, making the image matching between the two more difficult.
- the lens and the supporting member will be offset due to the deformation of the glue
- the deformation of the glue between these components will cause the position of the optical imaging surface and the photosensitive area to shift, thereby affecting the imaging quality.
- An object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module and an assembling method thereof, wherein the dispensing scheme adopted between the components of the camera module can be reduced during the baking process and the cooling process The possibility of deviation between an optical system of the lens assembly and a photosensitive chip of the photosensitive assembly is even avoided, and product yield is improved.
- An object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module and an assembling method thereof, wherein the dispensing scheme adopted between the components of the camera module can be reduced during the baking process and the cooling process It is even avoided that the optical system and the photosensitive chip are shifted in the shift-sensitive X direction, and the product yield is improved.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembly method thereof, wherein the glue between a support and a lens barrel of the lens assembly allows the two to be offset in the Y direction To limit the two to produce an offset in the X direction, thereby reducing the impact of the offset between the optical system and the photosensitive chip on imaging.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module and an assembly method thereof, wherein the glue between the support and the lens barrel is arranged between the two and is longer than the photosensitive chip
- the two opposing first regions corresponding to the side regions allow the two to be offset in the Y direction and limit the two to be offset in the X direction.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembling method thereof, wherein the glue between the support and the lens barrel is coated on the opposite first area
- the area and the center of the lens assembly are substantially straight lines, and the straight lines substantially overlap the Y direction.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembly method thereof, wherein between the support and the lens barrel, two opposing first regions are coated with a binding force Strong glue to enhance the bonding strength between the two; and the second area corresponding to the short side area of the photosensitive chip is coated with glue with low bonding force or low deformation to achieve the effect of dust prevention.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembling method thereof, wherein the glue between the support and the lens barrel is respectively disposed between the two, adjacent A set of first area and second area, so that the support and the lens barrel are only unilaterally stressed in the X direction and the Y direction, avoiding the phenomenon of mutual pulling in the four-point dispensing in the prior art, reducing The effect of glue deformation on the offset to avoid the occurrence of glue cracking.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembling method thereof, wherein the glue between the support and the lens barrel is respectively disposed between the two, adjacent A group of middle regions of the first region and middle regions of the second region, thereby reducing and avoiding the possibility of deviations.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembly method thereof, wherein the glue between the support and the photosensitive assembly allows the two to be offset in the Y direction, limiting the two The shift occurs in the X direction, thereby reducing the impact of the shift between the optical system of the lens assembly and the photosensitive chip of the photosensitive assembly on imaging.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembling method thereof, wherein the glue between the support and the photosensitive assembly is disposed between the two, two opposing
- the first region allows the two to shift in the Y direction and restricts the two to shift in the X direction.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembling method thereof, wherein between the support and the photosensitive assembly, two opposing first regions are coated with strong binding force Glue to enhance the bonding strength between the two; and the second area is coated with glue with low binding force or low deformation to achieve the effect of dust prevention.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembly method thereof, wherein the glue between the support and the photosensitive assembly is provided between the two adjacent A set of first area and second area, so that only one side of the X- and Y-direction forces are applied between the support and the photosensitive component, avoiding the occurrence of mutual pulling in the four-point dispensing in the prior art, reducing The effect of glue deformation on the offset to avoid the occurrence of glue cracking.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module and an assembly method thereof, wherein the glue between a circuit board and a lens holder of the photosensitive assembly allows the two to be offset in the Y direction , Limiting the two to produce an offset in the X direction, thereby reducing the impact of the offset between the optical system of the lens assembly and the photosensitive chip of the photosensitive assembly on imaging.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module and an assembling method thereof, wherein the glue between the circuit board and the lens holder is arranged between the two A region, thereby allowing the two to shift in the Y direction, limiting the two to shift in the X direction.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module and an assembling method thereof, wherein between the circuit board and the lens holder, two opposing first regions are coated with strong binding force Glue to enhance the bonding strength between the two; and the second area is coated with glue with low binding force or low deformation to achieve the effect of dust prevention.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembling method thereof, wherein the glue between the circuit board and the lens holder is respectively disposed between the two, adjacent A set of first area and second area, so that the circuit board and the lens holder are only stressed on one side in the X direction and the Y direction, avoiding the phenomenon of mutual pulling in the four-point dispensing in the prior art, reducing The effect of glue deformation on the offset to avoid the occurrence of glue cracking.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembling method thereof, wherein the glue between the photosensitive chip of the photosensitive assembly and the circuit board allows both to be produced in the Y direction Offset, which limits the offset between the two in the X direction, thereby reducing the impact of the offset between the optical system of the lens assembly and the photosensitive chip of the photosensitive assembly on imaging.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembly method thereof, wherein the glue between the photosensitive chip and the circuit board is disposed between the two, two opposing
- the first region allows the two to shift in the Y direction and restricts the two to shift in the X direction.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module and an assembling method thereof, wherein between the photosensitive chip and the circuit board, two opposing first regions are coated with strong binding force Glue to enhance the bonding strength between the two; and the second area is coated with glue with low binding force or low deformation to achieve the effect of dust prevention.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembly method thereof, wherein the glue between the photosensitive chip and the circuit board is provided between the two, adjacent A set of first area and second area, so that the photosensitive chip and the circuit board are only stressed on one side in the X direction and the Y direction, avoiding the phenomenon of mutual pulling in the four-point dispensing in the prior art, reducing The effect of glue deformation on the offset to avoid the occurrence of glue cracking.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module and an assembling method thereof.
- the components are used between the components
- the dispensing solution of the present invention can reduce or even avoid the deviation of the optical system and the corresponding photosensitive chip in the X direction, which is more sensitive to the deviation than the ordinary camera module during the baking process, and improve the product yield.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembling method thereof.
- the components are used between the components
- the dispensing solution of the present invention can reduce or even avoid the offset caused by the glue deformation from affecting the matching between the images.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembling method thereof, wherein between the support and the lens barrel, when the opposing first area is coated with glue, The area corresponding to the second area is coated with dustproof glue to prevent dust from entering the camera module.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module and an assembling method thereof, wherein the dustproof glue between the support and the lens barrel only contacts the outer wall of the lens barrel, or only It is in contact with the inner side wall of the support, thereby adhering the dust in the gap between the outer side wall of the lens barrel and the inner side wall of the support.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembling method thereof, wherein the dustproof glue between the support member and the lens barrel is filled in the support member In at least one dustproof groove of the inner side wall, a distance is set at a predetermined distance from the outer side wall of the lens barrel, and the dust in the gap between the outer side wall of the lens barrel and the inner side wall of the support member is bonded.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembling method thereof, wherein the dustproof glue between the support and the lens barrel is filled in the lens barrel In at least one dustproof groove of the outer side wall, a predetermined distance from the inner side wall of the support member is adhered to the dust in the gap between the outer side wall of the lens barrel and the inner side wall of the support member.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembly method thereof, wherein between the support and the lens holder of the photosensitive assembly, when the opposing first area is When the glue is applied, the second area is coated with dustproof glue to prevent dust from entering the camera module.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembling method thereof, wherein between the circuit board and the lens holder, when the opposing first area is coated with glue, The second area is coated with dustproof glue to prevent dust from entering the camera module.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembly method thereof, wherein between the circuit board and the photosensitive chip, when the opposing first area is coated with glue, The second area is covered with dustproof glue to prevent dust from entering the camera module.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module and an assembling method thereof, wherein between the support and the lens barrel, when the opposing first area is coated with glue, the The second area adopts a staggered convex structure to extend the path of dust entering the camera module, thereby preventing dust from affecting the imaging of the photosensitive chip.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module, and an assembling method thereof, wherein between the support and the lens holder, when the opposing first area is coated with glue, A staggered convex structure is used in the second area to extend the path of dust entering the camera module, thereby preventing dust from affecting the imaging of the photosensitive chip.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module and an assembling method thereof, wherein a space for dispensing is reserved between the support member and the lens barrel only in the opposite first area to seal the first Two areas to prevent dust from entering.
- Another object of the present invention is to provide a lens assembly, a photosensitive assembly, a camera module and an assembling method thereof, wherein the dispensing scheme adopted between the components of the camera module is carried out without changing the original design
- the improvement not only ensures the good combination of the lens and the supporting member, but also ensures the imaging quality of the camera module.
- the present invention further provides a lens assembly suitable for assembling a camera module with a photosensitive assembly, including:
- a lens barrel wherein the optical lens group is installed in the lens barrel to form a lens
- a support wherein by dispense the two opposing first areas between the lens barrel and the support, the lens barrel is fixed to the inside of the support to limit the deviation of the two in the X direction Shift, wherein the first area corresponds to a long-side area of a photosensitive chip of the photosensitive element.
- the glue between the support and the lens barrel is respectively applied to the middle area of the first area between the two opposed to each other.
- the lens assembly further includes a dustproof glue, wherein the dustproof glue is applied to the two opposing second regions between the lens barrel and the support member, wherein The second area corresponds to a short-side area of a photosensitive chip of the photosensitive element.
- At least one dustproof groove is provided on the inner side wall of the support, wherein the dustproof glue is filled in the dustproof groove,
- the distance between the outer surface of the dustproof glue and the outer side wall of the lens barrel is a predetermined distance, and the dust in the gap between the outer side wall of the lens barrel and the inner side wall of the support member is bonded.
- At least one dustproof groove is provided on the outer side wall of the lens barrel, wherein the dustproof glue is filled on the outer side wall In the dust-proof groove, a predetermined distance from the inner side wall of the support member is used to bind the dust in the gap between the outer side wall of the lens barrel and the inner side wall of the support member.
- the outer side wall of the lens barrel and the inner side wall of the support member are provided with interlaced and matching protrusions to form a staggered protrusion Structure to extend the path of dust into the camera module.
- the lens assembly further has two dispensing spaces, wherein the two dispensing spaces are respectively formed in two opposing first regions between the lens barrel and the support, and the two The opposite second area is closed.
- the present invention further provides a lens assembly suitable for assembling a camera module with a photosensitive assembly, including:
- a lens barrel wherein the optical lens group is installed in the lens barrel to form a lens
- a support wherein the lens barrel is fixed to the inside of the support by dispensing a set of first and second regions between the lens barrel and the support to limit the deviation between the two Shift, wherein the first area corresponds to a long-side area of a photosensitive chip of the photosensitive element, and the second area corresponds to a short-side area of a photosensitive chip of the photosensitive element.
- the glue between the support and the lens barrel is respectively applied to a group of adjacent middle regions of the first region and middle regions of the second region.
- the lens assembly further includes a dustproof glue, wherein the dustproof glue is applied between the lens barrel and the support member, and the other set of adjacent The first area and the second area.
- At least one set of adjacent one of the first area and the second area, at least one dustproof groove is provided on the inner side wall of the support, wherein the Dust glue is filled in the dustproof groove, wherein the outer surface of the dustproof glue is spaced from the outer side wall of the lens barrel by a preset distance, and the outer side wall of the lens barrel and the inner side wall of the support are bonded The dust between the gaps.
- At least one set of adjacent one of the first area and the second area, at least one dustproof groove is provided on the outer side wall of the lens barrel, wherein the Dust glue is filled in the dustproof groove located on the outer side wall, and is spaced from the inner side wall of the support by a predetermined distance, and is bonded between the outer side wall of the lens barrel and the inner side wall of the support Dust in the gap.
- the outer side wall of the lens barrel and the inner side wall of the support member are interlaced and mutually
- the matching protrusions form a staggered protrusion structure to extend the path of dust entering the camera module.
- the lens assembly further has two dispensing spaces, wherein two dispensing spaces are respectively formed between the lens barrel and the support member, and a group of adjacent One area and the second area, and another set of adjacent first areas and the second area are closed.
- the present invention further provides a camera module, including:
- a photosensitive component wherein the photosensitive component includes a photosensitive chip, a lens holder and a circuit board, wherein
- the photosensitive chip is electrically attached to the circuit board, wherein the lens holder surrounds the photosensitive chip and is attached to the circuit board, wherein the lens holder has a light window corresponding to the photosensitive
- the support member is fixed to the top side of the lens holder.
- the glue between the support and the lens holder is coated along the two long sides of the lens holder, respectively.
- the support member by dispensing a set of adjacent first regions and second regions between the lens holder and the support member, the support member is fixed to the Mirror mount top side.
- the glue in one of the first regions is coated along the long side of the lens holder, and is located in the adjacent second region
- the glue is applied along the short side of the lens holder.
- the camera module further includes a dustproof glue, wherein the dustproof glue is applied to the two opposing second areas between the lens holder and the support member.
- the camera module further includes a dustproof glue, wherein the dustproof glue is applied between the lens holder and the support member, and another set of adjacent ones The first area and the second area.
- At least one dust-proof groove and a dust-proof protrusion matching it are provided to the lens holder and the support member, wherein the dust-proof protrusion is fixed to the dust-proof recess Groove to prevent dust from entering the internal space.
- the lens holder by dispensing glue at two opposing first areas between the lens holder and the circuit board, the lens holder is fixed to the circuit board.
- the glue between the lens holder and the circuit board is respectively coated along the two long sides of the lens holder.
- the lens holder by dispensing a set of adjacent first regions and second regions between the lens holder and the circuit board, the lens holder is fixed to the circuit board.
- the glue in one of the first regions is coated along the long side of the lens holder, and is located in the adjacent second region
- the glue is applied along the short side of the lens holder.
- the photosensitive chip by dispensing glue in two opposing first regions between the photosensitive chip and the circuit board, the photosensitive chip is fixed to the circuit board.
- the glue between the photosensitive chip and the circuit board is respectively coated along the two long sides of the photosensitive chip.
- the photosensitive chip by dispensing a set of adjacent first regions and second regions between the photosensitive chip and the circuit board, the photosensitive chip is fixed to the circuit board.
- the glue in one of the first regions is coated along the long side of the photosensitive chip, and is located in the adjacent second region The glue is applied along the short side of the photosensitive chip.
- the present invention further provides an array of camera modules, including:
- At least two photosensitive chips At least two photosensitive chips
- a circuit board wherein the photosensitive chips are attached to the circuit board correspondingly and electrically connected, wherein the integrated lens holder surrounds the peripheral side of each of the photosensitive chips and is attached to the circuit board, wherein the integrated lens holder has at least two light windows, corresponding to the photosensitive area of the photosensitive chip, wherein the support member supports the lens, corresponding to the light window, wherein the support member is formed by the integrated The lens holder extends.
- the present invention further provides an array of camera modules, including:
- At least two photosensitive chips At least two photosensitive chips
- At least two mirror mounts At least two mirror mounts.
- a circuit board wherein the photosensitive chip is attached to the circuit board correspondingly and electrically connected, wherein each of the mirror bases surrounds the corresponding peripheral side of the photosensitive chip and is attached to the circuit board,
- the lens holder has a light window corresponding to the photosensitive area of the photosensitive chip, wherein the support member supports the lens, corresponding to the light window, wherein the support member is extended by the corresponding lens holder .
- the present invention further provides a photosensitive assembly, including:
- a circuit board wherein the photosensitive chip is electrically attached to the circuit board
- a mirror base in which by dispense glue between the circuit board and the mirror base, the two opposing first areas,
- the present invention further provides a photosensitive assembly, including:
- a circuit board wherein the photosensitive chip is electrically connected and attached to the circuit board
- a lens holder wherein the lens holder is fixed to the circuit board by dispensing a set of adjacent first regions and second regions between the circuit board and the lens holder, Wherein the lens holder surrounds the peripheral side of the photosensitive chip, wherein the lens holder has at least one light window corresponding to the photosensitive area of the photosensitive chip, wherein the first area and a photosensitive chip of the photosensitive assembly
- the long-side area corresponds to, wherein the second area corresponds to a short-side area of a photosensitive chip of the photosensitive element.
- the present invention further provides a photosensitive assembly, including:
- a circuit board wherein the photosensitive chip is electrically attached to the circuit board by dispensing two opposing first regions between the circuit board and the photosensitive region, wherein the first The area corresponds to a long-side area of a photosensitive chip of the photosensitive assembly;
- a lens holder wherein the lens holder is fixed to the circuit board, wherein the lens holder surrounds the peripheral side of the photosensitive chip, wherein the lens holder has at least one light window corresponding to the photosensitive of the photosensitive chip area.
- the present invention further provides a photosensitive assembly, including:
- a circuit board wherein the photosensitive chip is electrically attached to the circuit board by dispensing a set of adjacent first regions and second regions between the circuit board and the photosensitive region , wherein the first area corresponds to a long-side area of a photosensitive chip of the photosensitive assembly, and the second area corresponds to a short-side area of a photosensitive chip of the photosensitive assembly; and
- a lens holder wherein the lens holder is fixed to the circuit board, wherein the lens holder surrounds the peripheral side of the photosensitive chip, wherein the lens holder has at least one light window corresponding to the photosensitive of the photosensitive chip area.
- the present invention further provides a method for assembling a camera module, including:
- the step (b) further includes:
- (b1) fix the support member and the photosensitive member by dispensing along two long sides of the lens holder of the photosensitive member by two opposing first regions between the support member and the photosensitive member respectively Components.
- the step (b) further includes:
- the step (c) further includes:
- the two photosensitive regions and the circuit board are respectively disposed in two opposing first regions, and glue is applied along the two long sides of the photosensitive chip to electrically attach the photosensitive chip to the circuit board.
- the step (c) further includes:
- (c2) fix the mirror base to the circuit board by dispensing glue along two long sides of the mirror base through two opposing first areas between a mirror base and the circuit board respectively, wherein the The lens holder surrounds the photosensitive chip and has a light window corresponding to the photosensitive area of the photosensitive chip.
- the step (c) further includes:
- the step (c) further includes:
- (c4) Dispensing along one of the first area between the lens holder and the circuit board, along the long side of the lens holder, and a second area between the two along the Dispensing the short sides of the lens holder to fix the lens holder to the circuit board, wherein the lens holder surrounds the photosensitive chip and has a light window corresponding to the photosensitive region of the photosensitive chip.
- the assembly method further includes the steps of:
- the present invention further provides a method for assembling a camera module, including:
- the lens corresponds to the photosensitive path of the photosensitive element, wherein the first area corresponds to a long-side area of a photosensitive chip of the photosensitive element.
- the assembly method further includes steps:
- FIG. 1 is a relationship diagram of an optical system and a photosensitive chip of a lens assembly.
- FIGS. 2A and 2B are schematic diagrams of dispensing positions of a lens assembly in the prior art.
- FIG 3 is an exploded view of a camera module according to a preferred embodiment of the present invention.
- FIG. 4 is a perspective view of the camera module according to the above preferred embodiment of the present invention.
- FIG. 5 is a top view of the camera module according to the above preferred embodiment of the present invention.
- 6A is a cross-sectional view of the camera module taken along the line A-A according to the above-described preferred embodiment of the present invention.
- 6B is a cross-sectional view of the camera module in the B-B direction according to the above preferred embodiment of the present invention.
- FIG. 7A is a top view of a camera module according to an embodiment of the invention.
- FIG. 7B is a cross-sectional view of the camera module in the C-C direction according to the above-described embodiment of the present invention.
- 7C is a cross-sectional view in the D-D direction of the camera module according to the above-described embodiment of the present invention.
- FIG. 8A is a partial schematic diagram of a lens assembly according to an embodiment of the invention.
- FIG. 8B is a partial schematic diagram of a lens assembly according to an embodiment of the invention.
- FIG. 9 is a top view of a camera module according to an embodiment of the invention.
- FIG. 10A is a top view of a camera module according to an embodiment of the invention.
- FIG. 10B is a cross-sectional view in the E-E direction of the camera module according to the above-described embodiment of the present invention.
- 10C is a cross-sectional view of the camera module in the F-F direction according to the above-described embodiment of the present invention.
- FIG. 11 is a top view of a photosensitive assembly according to an embodiment of the invention.
- 12A and 12B are cross-sectional views in different directions of a camera module according to an embodiment of the invention.
- FIG. 13A is a partial schematic diagram of a camera module according to an embodiment of the invention.
- FIG. 13B is a partial schematic view of a camera module according to an embodiment of the invention.
- FIG. 13C is a partial schematic diagram of a camera module according to an embodiment of the invention.
- 13D is a partial schematic view of a camera module according to an embodiment of the invention.
- 14A is a top view of an array camera module according to an embodiment of the invention.
- 14B is a cross-sectional view in the G-G direction of the array camera module according to the above-described embodiment of the present invention.
- 14C is a cross-sectional view in the H-H direction of the array camera module according to the above-described embodiment of the present invention.
- 14D is a cross-sectional view of the array camera module in the I-I direction according to the above-described embodiment of the present invention.
- 15A is a top view of a camera module according to a second embodiment of the invention.
- 15B is a cross-sectional view of the camera module in the J-J direction according to the second embodiment of the present invention.
- 15C is a cross-sectional view in the K-K direction of the camera module according to the second embodiment of the present invention.
- 16A and 16B are cross-sectional views of the camera module in different directions according to another embodiment of the present invention.
- 17A is a top view of an array camera module according to a second embodiment of the invention.
- 17B is a cross-sectional view in the L-L direction of the array camera module according to the above-described second embodiment of the present invention.
- 17C is a cross-sectional view in the M-M direction of the array camera module according to the above-described second embodiment of the present invention.
- 17D is a cross-sectional view in the N-N direction of the array camera module according to the above-described second embodiment of the present invention.
- 18A is a top view of a camera module according to an embodiment of the invention.
- 18B is a top view of an array camera module according to another embodiment of the invention.
- FIG. 19 is a flowchart of an assembling method of a camera module according to the present invention.
- FIG. 20 is a flowchart of an assembly method of a photosensitive component according to the present invention.
- 21 is a flowchart of another assembly method of a photosensitive assembly according to the present invention.
- 22A to 22C are cross-sectional views of different positions of another array camera module according to the present invention.
- 23A to 23C are cross-sectional views of different positions of another array camera module according to the present invention.
- the term “a” should be understood as “at least one” or “one or more”, that is, in one embodiment, the number of an element can be one, and in other embodiments, the The number can be more than one, and the term “one” cannot be understood as a limitation on the number.
- the camera module 300 includes the lens assembly 100 and the photosensitive assembly 200.
- the lens assembly 100 is supported on the top side of the photosensitive assembly 200, corresponding to the photosensitive path of the photosensitive assembly 200.
- the long-side direction of a photosensitive chip 210 of the photosensitive module 200 is taken as the X direction, and the short-side direction of the photosensitive chip 210 is taken as the Y direction for explanation.
- the center of the photosensitive area 211 and the optical axis of the optical system of the lens assembly 100 are on the same straight line, an overlapping central axis is defined, and the imaging of the optical system
- the surface radius should be larger than the diagonal radius of the photosensitive region 211.
- the point where each horizontal section intersects the overlapping central axis is the center position of the corresponding horizontal plane.
- the photosensitive chip 210 and the photosensitive area 211 are both rectangular, and the imaging surface of an optical system of the lens assembly 100 is circular, as shown in FIG. 1. It can be seen that the offset value of the imaging surface of the optical system in the X direction is smaller than the offset value in the Y direction. A slight offset and tilt in the X direction may cause the imaging surface of the optical system to not cover the photosensitive area well, which may result in blurred imaging. In other words, the photosensitive region is more sensitive to shift or tilt in the X direction.
- the lens assembly 100 includes an optical lens assembly 110, a lens barrel 120 for receiving the optical lens assembly 110, and a support 130.
- the optical lens assembly 110 includes a single or multiple optical lenses. During assembly, the optical lens assembly 110 is installed in the lens barrel 120 to form a lens, and then the support member 130 carries the lens and is installed on the top side of the photosensitive assembly 200 to make the optical The lens assembly 110 corresponds to the photosensitive path of the photosensitive assembly 200.
- the assembly of the lens and the support 130 is fixed by four-point dispensing, that is, between the inner side wall 131 of the support 130 and the outer side wall 121 of the lens barrel 120
- the areas corresponding to the X and Y directions are fixed by glue.
- the four-point dispensing method can easily cause the lens to shift in the X-direction that is sensitive to shift, resulting in a shift of the imaging surface of an optical system of the lens assembly 100 from the position of the photosensitive area, which affects the product yield.
- the glue 400 on the inner side wall 131 of the support member 130 and the outer side wall 121 of the lens barrel 120 allows the two to be offset in the Y direction, limiting the two to be generated in the X direction Offset, thereby reducing the impact of the offset between the optical system of the lens assembly and the photosensitive chip of the photosensitive assembly on imaging. That is to say, in the present invention, the support 130 and the lens barrel 120 are prohibited from being shifted in the X direction as much as possible to improve the product yield.
- the glue 400 between the support member 130 and the lens barrel 120 is disposed between the two opposite first regions corresponding to the long side region of the photosensitive chip 140, so that during the baking deformation and the subsequent cooling recovery process, the X-direction component forces are cancelled out as much as possible to avoid deviation in the X-direction, as shown in FIGS. 5 and 6A.
- the long-side region of the photosensitive chip refers to a region where the center of the photosensitive region 211 and the two ends of the long side of the photosensitive chip 210 are connected by radiation, as shown in FIG. 5.
- the first region 140 between the support member 130 and the lens barrel 120 is an extension of the long-side region of the photosensitive chip between the support member 130 and the lens barrel 120 in the Z direction. It can be understood that, corresponding to the two opposite long sides of the photosensitive chip, the long side regions of the photosensitive chip formed by it are also two opposite regions, correspondingly, the support 130 and the lens barrel 120
- the first area 140 in between is also two opposite areas.
- the short-side region of the photosensitive chip refers to a region where the center of the photosensitive region 211 and the two ends of the short side of the photosensitive chip 210 are connected to radiate.
- the second region 150 between the supporting member 130 and the lens barrel 120 is an extension of the short-side region of the photosensitive chip between the supporting member 130 and the lens barrel 120 in the Z direction. It can be understood that, corresponding to the two opposite short sides of the photosensitive chip, the short side regions of the photosensitive chip formed by it are also two opposite regions, correspondingly, the support 130 and the lens barrel 120 The second area 150 in between is also two opposite areas.
- the glue 400 between the support 130 and the lens barrel 120 is applied to the first region between the two 140 in the middle area. That is to say, between the supporting member 130 and the lens barrel 120, the coating regions 141 of the two first regions 140 that are opposite to each other form a substantially straight line with the corresponding center position, and the straight line is in the Y direction Roughly overlap. At this time, the effect of the force centers canceling each other in the X direction is better.
- the coating area 141 of the first area 140 is coated with glue 400 with strong binding force to satisfy Glue strength requirements, such as thermosetting glue.
- the second area 150 is coated with glue or the like having a low binding force or a low amount of variation as a dustproof adhesive 152, to To achieve a dustproof effect, such as UV glue (photosensitive glue, Ultraviolet Rays), as shown in Figures 7A to 7C.
- UV glue photosensitive glue, Ultraviolet Rays
- the inner side wall 131 of the support member 130 is recessed to form at least one dustproof groove 151, and the dustproof adhesive 152 is filled on the inner side
- the dustproof groove 151 of the wall 131, and the top outer surface of the dustproof adhesive 152 and the outer side wall 121 of the lens barrel 120 are separated by a preset distance, and the outer side wall 121 of the lens barrel 120 and the The dust in the gap between the inner side walls 131 of the support 130 is as shown in FIG. 8A.
- At least one dustproof groove 151 is formed on the outer side wall 121 of the lens barrel 120, and is recessed from the outer side wall 121 of the lens barrel 120.
- the dustproof glue 152 is filled in the dustproof groove 151 of the outer side wall 121, and is spaced from the inner side wall 131 of the supporting member 130 by a predetermined distance, and adheres to the outer side wall 121 of the lens barrel 120
- the dust in the gap between the inner side wall 131 of the support 130 is as shown in FIG. 8B.
- the dustproof adhesive 152 only contacts one of the outer side wall 121 of the lens barrel 120 and the inner side wall 131 of the support member 130, and is only used for dustproof, avoiding the second area 150 Generate binding force.
- a staggered convex structure is used in the second area between the support member 130 and the lens barrel 120 to extend the path of dust entering the camera module, thereby preventing dust Affect the imaging of the photosensitive chip, as shown in FIGS. 10A to 10C.
- the outer side wall 121 of the lens barrel 120 and the inner side wall 131 of the support 130 are provided with protrusions that are staggered and matched with each other.
- the protrusion of the outer side wall 121 of the lens barrel 120 is against the bottom of the corresponding groove of the inner side wall 131 of the supporting member 130, or against the top of the inner side wall 131 of the supporting member 130 that is not the groove
- the protrusion of the inner side wall 131 of the supporting member 130 is against the bottom of the corresponding groove 121 of the outer side wall 121 of the lens barrel 120, or against the top of the outer groove 121 of the lens barrel 120 not groove surface.
- FIG. 10C here is only an example for explaining the staggered protrusion structure, and the staggered protrusion structure according to the present invention can be formed by reducing or adding staggered protrusions, and the present invention is not limited .
- the dispensing space 160 is reserved only in the opposite first area 140, and the dispensing space is not reserved in the second area 150, to avoid dust enter.
- the lens barrel 120 has reserved dispensing spaces in all directions, that is, in the shape of petals.
- the lens barrel 120 only reserves a dispensing space in the opposite first area 140, corresponding to the dispensing method of the present invention, only between the support 130 and the lens barrel 120 Dispensing at the first area 140 can also prevent other voids from allowing dust to enter the internal space, as shown in FIG. 9.
- the above solution for dispensing on the long-side regions on both sides can also be applied to bond between the support member 130 and the photosensitive assembly 200 to prevent the support member 130 from deflecting the original assembly position with the lens, As shown in Figures 11 to 13D.
- the photosensitive assembly 200 includes the photosensitive chip 210, a lens holder 220 and a circuit board 230.
- the photosensitive chip 210 is electrically connected to the circuit board 230.
- the lens holder 220 surrounds the photosensitive chip 210 and is attached to the circuit board 230.
- the mirror base 220 has a light window 221 corresponding to the photosensitive area 211 of the photosensitive chip 210.
- the supporting member 130 supports the lens, corresponding to the light window 221.
- the support 130 is bonded to the top surface 222 of the lens holder 220.
- the glue 400 on the bottom surface 132 of the support member 130 and the top surface 222 of the lens holder 220 allows the two to be offset in the Y direction, limiting the two to be offset in the X direction Shift, thereby reducing the impact of the offset between the optical system of the lens assembly 100 and the photosensitive chip 210 on imaging.
- the support member 130 and the lens holder 220 are prohibited from being displaced in the X direction as much as possible, thereby improving the product yield.
- the glue 400 between the supporting member 130 and the lens holder 220 is disposed between the two opposite first regions 140 corresponding to the long side regions of the photosensitive chip, so that the baking deformation and subsequent temperature reduction During the recovery process, the X-direction component forces are cancelled out as much as possible to avoid deviations in the X-direction.
- the first region 140 between the support 130 and the lens holder 220 corresponds to the long-side region of the photosensitive chip, and the long-side region of the photosensitive chip is between the support 130 and the lens holder 220
- the extension in the Z direction is shown in FIGS. 11 and 12A.
- the two opposing second regions 150 between the supporting member 130 and the lens holder 220 corresponding to the short side regions of the photosensitive chip are not dispensed, and the second region 150 is not baked. It will be subjected to pulling force, and will not be subjected to restoring force during the subsequent cooling process, thereby reducing the possibility of X-direction deviation.
- the second region 150 between the support 130 and the lens holder 220 corresponds to the short-side region of the photosensitive chip, and the short-side region of the photosensitive chip is between the support 130 and the lens holder 220 Extension in the Z direction.
- the structure of the lens holder is mostly a rectangular shape
- the coating regions 141 of the two first regions 140 opposite to each other are disposed on the lens holder
- the two long sides of 220 extend along the long sides of the lens holder 220.
- the coating area 141 of the first area 140 is coated with glue 400 with strong binding force to meet Glue strength requirements, such as thermosetting glue.
- the second area 150 is coated with glue or the like having a low binding force or a low variation as a dustproof adhesive 152
- glue photosensitive glue, Ultraviolet Rays
- the top surface 222 of the lens holder 220 forms at least one dustproof groove 151, as shown in FIG. 13D.
- the dustproof groove 151 is formed by recessing the top surface 222.
- the dustproof glue 152 is filled into the dustproof groove 151 on the top surface 222 and is spaced a predetermined distance from the bottom surface 132 of the support 130.
- the dustproof adhesive 152 located on the top surface 222 does not contact the bottom surface 132 of the support member 130, but uses viscosity to prevent dust from entering.
- the top surface 222 of the lens holder 220 forms at least one dust-proof groove 223, correspondingly, the support member 130
- the bottom surface of the bottom surface 132 forms a matching dust protrusion 133. That is, in the second area 150, the lens holder 220 and the support member 130 are fixedly matched by the dust-proof groove 223 and the dust-proof protrusion 133. At this time, the dust-proof protrusions 133 not only extend the path of dust into the internal space, but also block dust from entering. Between the lens holder 220 and the support member 130, the first area 140 is fixed by dispensing, and the second area 150 is protected by a raised structure by dust.
- the bottom surface 132 of the supporting member 130 is provided with a dust-proof groove, and the top surface 222 of the lens holder 220 forms a corresponding dust-proof protrusion, which can also play a dust-proof role in cooperation with each other, which is not limited here .
- the convex structure and the dustproof adhesive 152 may be used in combination, as shown in FIG. 13B.
- the dust-proof glue 152 is coated on the opposite outer area of the second area 150, and on the opposite inner area With raised structure, it plays a double dustproof role.
- the dustproof adhesive 152 may be coated on the outer area of the top surface 222 of the lens holder 220, while forming a dustproof protrusion on the inner side thereof, and correspondingly on the support
- the bottom surface 132 of the piece 130 forms a dustproof groove.
- the above-mentioned solution for dispensing the long-side regions on both sides can also be applied to bond between the lens holder 220 and the circuit board 230 to prevent the lens holder 220 from deviating from the original assembly position with the lens. That is to say, when the glue 400 is fixed between the lens holder 220 and the circuit board 230, the technical solution of the present invention can be adopted, as shown in FIG. 12A.
- Glue 400 on the top surface 231 of the circuit board 230 and the bottom surface 223 of the lens holder 220 allows the two to shift in the Y direction, restricting the two to shift in the X direction, thereby reducing the optical impact on the lens assembly 100
- the circuit board 230 and the lens holder 220 are prohibited from being shifted in the X direction as much as possible, thereby improving the product yield.
- the glue 400 between the circuit board 230 and the lens holder 220 is disposed between the two opposite first regions 140 corresponding to the long-side regions of the photosensitive chip, so that baking deformation and subsequent temperature reduction During the recovery process, the X-direction component forces are cancelled out as much as possible to avoid deviations in the X-direction.
- the first region 140 between the circuit board 230 and the lens holder 220 corresponds to the long-side region of the photosensitive chip, and the long-side region of the photosensitive chip is between the circuit board 230 and the lens holder 220
- the extension in the Z direction is shown in FIGS. 11 and 12A.
- the two opposing second regions 150 between the circuit board 230 and the lens holder 220 corresponding to the short side regions of the photosensitive chip are not dispensed, and the second region 150 is not baked. It will be subjected to pulling force, and will not be subjected to restoring force during the subsequent cooling process, thereby reducing the possibility of X-direction deviation.
- the second region 150 between the circuit board 230 and the lens holder 220 corresponds to the short-side region of the photosensitive chip, and the short-side region of the photosensitive chip is between the circuit board 230 and the lens holder 220 Extension in the Z direction.
- the coating regions 141 of the two first regions 140 opposite to each other are provided in The two long sides of the lens holder 220 extend along the long sides of the lens holder 220.
- the second area 150 is coated with glue with low binding force or low variation as a dustproof adhesive 152 in order to achieve the dustproof effect, such as UV glue (photosensitive glue, Ultraviolet Rays), as shown in Figure 11 and Figure 12B.
- UV glue photosensitive glue, Ultraviolet Rays
- the above solution for dispensing on the long-side regions on both sides can also be applied to bond between the photosensitive chip 210 and the circuit board 230 to prevent the photosensitive chip 210 from deviating from the original assembly position.
- the technical solution of the present invention can be adopted, as shown in FIG. 11 and FIG. 12A.
- the glue 400 between the top surface 231 of the circuit board 230 and the photosensitive chip 210 allows the two to shift in the Y direction, restricting the two to shift in the X direction, thereby reducing the optics of the lens assembly 100
- the circuit board 230 and the photosensitive chip 210 are prohibited from being shifted in the X direction as much as possible, thereby improving the product yield.
- the glue 400 between the circuit board 230 and the photosensitive chip 210 is disposed between the two opposite first regions 140 corresponding to the long side regions of the photosensitive chip, so that the baking deformation and subsequent temperature reduction During the recovery process, the X-direction component forces are cancelled out as much as possible to avoid deviations in the X-direction.
- the first region 140 between the circuit board 230 and the photosensitive chip 210 corresponds to the long-side region of the photosensitive chip, and the long-side region of the photosensitive chip is between the circuit board 230 and the photosensitive chip 210 Extension in the Z direction.
- the two opposing second regions 150 between the circuit board 230 and the photosensitive chip 210 corresponding to the short side regions of the photosensitive chip are not dispensed, and the second region 150 is not baked. It will be subjected to pulling force, and will not be subjected to restoring force during the subsequent cooling process, thereby reducing the possibility of X-direction deviation.
- the second area 150 between the circuit board 230 and the photosensitive chip 210 corresponds to the short-side area of the photosensitive chip, and the short-side area of the photosensitive chip is between the circuit board 230 and the photosensitive chip 210 Extension in the Z direction.
- the photosensitive chip is mostly rectangular in shape
- the coating regions 141 of the two first regions 140 opposite to each other are disposed on the photosensitive chip 210
- the two long sides of the lens extend along the long side of the photosensitive chip 210.
- the second area 150 is coated with glue or the like having a low binding force or a low variation as a dustproof adhesive 152
- glue photosensitive glue, Ultraviolet Rays
- the array camera module includes at least two of the lens assembly 100, at least two photosensitive chips 210, an integrated lens holder 240 and a circuit ⁇ 230 ⁇ Board 230.
- Each of the photosensitive chips 210 is correspondingly and electrically connected to the circuit board 230.
- the integrated lens holder surrounds the peripheral side of each photosensitive chip and is attached to the circuit board.
- the integrated lens holder has at least two light windows, respectively corresponding to the photosensitive regions of the photosensitive chip.
- the support member supports the lens, corresponding to the light window. The support member extends from the integrated lens holder.
- the circuit board 230 may be an integrated circuit board or a split circuit board, which is not limited at this time.
- each photosensitive chip 210 corresponds to two photosensitive chip long-side regions, so that two corresponding first regions 140, and two photosensitive chip short-side regions, and thus corresponding two opposite second regions 150. That is to say, in the array camera module, corresponding to the distribution and number of the photosensitive chips, the first area 140 and the second area 150 of the array camera module are correspondingly arranged and distributed.
- the array camera module also adopts the dispensing solution of the present invention. Between the lens barrel 120 and the support 130 of each lens assembly 100, between each lens assembly 100 and the array Between the assembly of the integrated lens holder 240 of the camera module, between the integrated lens holder 240 and the circuit board 230, and between each photosensitive chip 210 and the corresponding circuit board 230 area, this comparison can still be used.
- the dispensing solution only dispenses in the first region 140, as shown in FIGS. 14A to 14D.
- dust can be prevented from entering the internal space by applying dustproof adhesive 152, raised structures or staggered raised structures, and combined use.
- the array camera module includes at least two lens assemblies 100, at least two photosensitive chips 210, at least two lens holders 220, and a circuit board 230.
- Each of the photosensitive chips 210 is correspondingly and electrically connected to the circuit board 230.
- Each mirror base has a light window corresponding to the photosensitive area of the photosensitive chip.
- Each lens holder surrounds the corresponding peripheral side of the photosensitive chip and is attached to the circuit board.
- the support member supports the lens, corresponding to the light window. The support member extends from the corresponding lens holder.
- the circuit board 230 may be an integrated circuit board or a split circuit board, which is not limited at this time.
- the array camera module may also adopt the dispensing solution of the present invention.
- the comparison can still be used
- the dispensing solution in the preferred embodiment only dispenses 140 in the first area, as shown in FIGS. 22A to 22C.
- dust can be prevented from entering the internal space by applying dustproof adhesive 152, raised structures or staggered raised structures, and combined use.
- the lens assembly 100, the photosensitive assembly 200, and the camera module 300 of the second embodiment of the present invention are described.
- glue 400A is applied to the adjacent first group 140A and the second region 150A to fix each group Between the components, only one side is stressed in the X direction and the Y direction, which avoids the mutual pulling phenomenon in the four-point dispensing in the prior art, reduces the influence of the glue deformation on the offset, and avoids the occurrence of glue cracking.
- the first region 140A is still a region corresponding to the long-side region of the photosensitive chip extending along the Z axis.
- the second area 150A is still an area corresponding to the short-side area of the photosensitive chip extending along the Z axis.
- one adjacent first region 140A and one second region 150A are called a group.
- the glue 400A between the lens barrel 120 and the support 130 is provided between the two, a group of the first area 140A and the second area 150A, so that the baking deformation and subsequent During the cooling recovery process, the lens barrel 120 and the support 130 are only unilaterally stressed in the X direction and the Y direction, and the other set of the first area 140A and the second area 150A are free of glue
- the 400A limit is relatively free, and does not produce pulling force and restoring force, which avoids the mutual pulling phenomenon in the four-point dispensing in the prior art, as shown in FIGS. 15A to 15C.
- the glue 400A between the support member 130 and the lens barrel 120 is applied between the middle area of the adjacent set of first areas 140A and the middle area of the second area 150A between the two, thereby Reduce and avoid the possibility of deviations. That is to say, between the support 130 and the lens barrel 120, the coating area of the first area 140A and the corresponding center position are substantially overlapping in a straight line in the Y direction; the coating of the second area 150A The covering area and the corresponding center position are substantially overlapping in a straight line in the X direction.
- the first area 140A and the second area 150A are coated with glue with low binding force or low variation as a dustproof glue 152A to achieve the dustproof effect, such as UV glue (photosensitive glue, Ultraviolet Rays), as shown in the figure 15A to 15C.
- UV glue photosensitive glue, Ultraviolet Rays
- the dust prevention solution in the above preferred embodiment for example, a dust prevention groove filled with dust prevention glue, a convex structure, or the like, can also be applied to those not coated with adhesive glue
- Another set of the first area 140A and the second area 150A, to prevent dust from entering the inside will not be repeated here.
- only one group of the first region 140A and the second region 150A reserves a dispensing space 160A, while another group of the first region 140A and the second There is no space for dispensing in the area 150A to prevent dust from entering, as shown in FIGS. 18A and 18B.
- a set of dispensing solutions for the first region 140A and the second region 150A can also be applied to bond between the support 130 and the photosensitive assembly 200 to avoid The supporting member 130 takes the original assembly position of the lens deflection, as shown in FIGS. 16A and 16B.
- the glue 400A between the support 130 and the photosensitive assembly 200 is provided between the two, a set of the first region 140A and the second region 150A.
- the glue 400A located in the first region 140A between the support member 130 and the photosensitive assembly 200 is coated along the long side of the lens holder 120 ;
- the glue 400A located in the adjacent second area 150A is coated along the short side of the lens holder 120.
- the dustproof solution in the above preferred embodiment such as applying dustproof glue, setting dustproof grooves to fill the dustproof glue, raised structures, or a combination of the two, can also be Another group of the first area 140A and the second area 150A applied between the support 130 and the photosensitive assembly 200 in the second embodiment to prevent dust from entering inside, no longer here Repeat.
- a set of dispensing solutions for the first region 140A and the second region 150A can also be applied to bond between the lens holder 220 and the circuit board 230 to avoid
- the lens mount 220 carries the original assembly position of the lens deflection, as shown in FIGS. 16A and 16B.
- the glue 400A between the lens holder 220 and the circuit board 230 is disposed between the two, a group of the first area 140A and the second area 150A.
- the glue 400A located in the first region 140A between the lens holder 220 and the circuit board 230 is along the lens holder The long side of 120 is coated; and the glue 400A located in the adjacent second area 150A is coated along the short side of the lens holder 120.
- the dustproof solution in the above preferred embodiment such as applying dustproof glue, setting dustproof grooves to fill the dustproof glue, raised structures, or a combination of the two, can also be Another set of the first area 140A and the second area 150A applied to the second embodiment between the lens holder 220 and the circuit board 230 to prevent dust from entering the interior, here is no longer Repeat.
- a set of dispensing solutions for the first region 140A and the second region 150A can also be applied to bond between the photosensitive chip 210 and the circuit board 230 to avoid The photosensitive chip deviates from the original assembly position, as shown in FIGS. 16A and 16B.
- the glue 400A between the photosensitive chip 210 and the circuit board 230 is disposed between the two, a group of the first region 140A and the second region 150A.
- the glue 400A located in one of the first regions 140A between the photosensitive chip 210 and the circuit board 230 is coated along the long side of the photosensitive chip 210; and The glue 400A located in the adjacent second area 150A is applied along the short side of the photosensitive chip 210.
- the dustproof solution in the above preferred embodiment such as applying dustproof glue, setting dustproof grooves to fill the dustproof glue, raised structures, or a combination of the two, can also be Another set of the first area 140A and the second area 150A applied between the photosensitive chip 210 and the circuit board 230 in this second embodiment to prevent dust from entering inside, no longer here Repeat.
- the camera module 300 when the camera module 300 is implemented as an array camera module, between the lens barrel 120 and the support 130 of each lens assembly 100, between each lens assembly 100 and Between the assembly of the integrated lens holder 240 of the array camera module, between the integrated lens holder 240 and the circuit board 230, and between each photosensitive chip 210 and the corresponding circuit board 230 area, it can still be used
- the dispensing solution in this second embodiment only dispenses in a set of the first region 140A and the second region 150A.
- the second embodiment can still be used for the dispensing solution, only the first region 140A and the second region 150A are dispensed, as shown in FIGS. 23A to 23C.
- the present invention further provides a method for assembling a camera module.
- the method of assembling the camera module may be applied to the assembly of the camera module 300 described above to achieve at least one object and advantage of the present invention.
- FIG. 19 it is a flowchart of the camera module assembly method.
- Step 410 Assemble a set of optical lenses and a lens barrel to form a lens.
- Step 420 Attach a support member to a reserved position on the top side of a photosensitive element.
- the step 420 may further include the steps of: dispensing glue along two long sides of the lens holder of the photosensitive assembly by two opposing first regions between the support and the photosensitive assembly respectively , To fix the support and the photosensitive assembly.
- the step 420 may further include the steps of: dispensing the first region between the support member and the photosensitive assembly along the long side of the lens holder of the photosensitive assembly, and between the two One of the second regions in the middle dispenses along the short side of the lens holder of the photosensitive assembly to fix the support member and the photosensitive assembly.
- step 410 and the step 420 is not limited.
- Step 430 Fix the support and the lens barrel by dispensing in the middle of two opposing first areas between the support and the lens barrel, wherein the lens corresponds to the The photosensitive path of the photosensitive component.
- Step 450 Apply dustproof glue to the two opposing second areas between the support and the lens barrel to prevent dust.
- step 440 is performed: fixing the support by dispensing glue in the middle region of the first region and the second region between the set of support and the lens barrel, respectively And the lens barrel, wherein the lens corresponds to a photosensitive path of the photosensitive assembly.
- Step 460 Apply dustproof glue to the other set of first and second areas between the support and the lens barrel to prevent dust.
- FIG. 20 it is a flow chart of the method for assembling the photosensitive component of the camera module of the present invention.
- Step 510 Dispensing along the two long sides of the photosensitive chip along two long sides of a photosensitive chip and a circuit board respectively, and electrically attaching the photosensitive chip to the circuit board.
- Step 520 Fix the mirror base to the circuit board by dispensing along two long sides of the mirror base through two opposing first areas between a mirror base and the circuit board, respectively
- the lens holder surrounds the photosensitive chip and has a light window corresponding to the photosensitive area of the photosensitive chip.
- FIG. 21 it is a flowchart of another assembly method of the photosensitive component of the camera module of the present invention.
- Step 610 Dispensing along a long side of the photosensitive chip by a first area between a photosensitive chip and a circuit board, and a second area between the two along a The short side of the photosensitive chip is glued, and the photosensitive chip is electrically attached to the circuit board.
- Step 620 Dispense glue along a long side of the lens holder and a second area between the lens holder and the circuit board Dispensing the short sides of the lens holder to fix the lens holder to the circuit board, wherein the lens holder surrounds the photosensitive chip and has a light window corresponding to the photosensitive area of the photosensitive chip.
- dispensing positions between the components in the preferred embodiment and the second embodiment can be combined or mixed, that is to say, the above steps 510 and 620 can be combined, and step 610 It can be combined with step 520, and at least one object and advantage of the present invention can also be achieved.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Lens Barrels (AREA)
- Studio Devices (AREA)
Abstract
本发明提供镜头组件、感光组件和摄像模组及其组装方法。所述镜头组件,适于和一感光组件组装成一摄像模组,包括:一光学镜片组、一镜筒和一支撑件,其中所述光学镜片组被安装于所述镜筒内,形成一镜头;其中通过在所述镜筒和所述支撑件之间的、两相对的第一区域点胶,固定所述镜筒于所述支撑件内侧,以限制两者在X方向产生偏移,其中所述第一区域与所述感光组件的一感光芯片长边区域对应。
Description
本发明涉及摄像模组领域,更详而言之地涉及一镜头组件、感光组件和摄像模组及其组装方法,以降低烘烤过程中胶水的变形对成像的影响。
近年来,为了满足人们对拍照的需求,摄像头已经成为手机等终端设备的必要配件之一。并且,随着人们对摄像的要求不断提高,需求也越来越多元化,多阵列摄像模组也应运而生,比如广角长焦的阵列模组等。
目前,大多数摄像模组包括一镜头组件、一镜座、一滤色片、一感光元件以及一线路板等元件。摄像模组的组装过程一般是将所述感光芯片电连接地贴附于所述线路板,所述镜座贴附于所述线路板,所述滤色片贴附于所述镜座,进而形成一感光组件。定焦摄像模组中,所述镜头组件一般由一光学镜片组件、一镜筒和一支撑件组装而成。自动对焦摄像模组中,所述镜头组件一般由一致动器作为所述镜筒的所述支撑件承载所述光学镜片组件和所述镜筒。所述镜头组件被支持于所述感光组件的顶侧,最终形成所述摄像模组。在组装过程中,各组件之间大多通过点胶方式曝光固定。
实际组装过程中,随着各组件的堆叠,各部件的组装公差不断累积。为实现所述镜头组件与所述感光芯片的良好配合,组装时,将所述镜头组件的所述支撑件安装于所述感光组件的顶侧,再采用AA工艺将一镜头(即装有所述光学镜片组件的所述镜筒)和所述支撑件组装,以降低公差。也就是,通过点亮所述感光芯片,固定所述感光组件,调整机械臂夹持镜头,对标准标板拍照开图。通过运行离焦曲线,得到所述镜头与所述支撑件的最佳组装位置,并通过点胶固化固定两者的相对位置。
在现有工艺中,所述感光芯片以及其一感光区域均为矩形,而所述镜头组件的一光学系统成像面为圆形状。为提高所述感光芯片的所述感光区域的利用率,所述光学系统到达所述感光区域的光区域需要全面覆盖所述感光区域,如图1所 示。可以看出得是,所述光学系统成像面在所述感光芯片长边方向(X方向)的可偏移值要小于在宽边方向(Y方向)的可偏移值要小。在X方向的略微偏移和倾斜有可能导致所述光学系统成像面无法良好地覆盖所述感光区域,进而导致成像模糊。换句话说,所述感光区域对感光芯片X方向的偏移或倾斜更敏感。
为加强所述镜头和所述支撑件之间的固定强度,现有技术通常采用均匀对称分布的四点点胶方式。在进行AA调整,对所述镜头和所述支撑件相对的最佳位置进行点胶固化后,所述摄像模组在后道工艺中需要经历烘烤。而烘烤的过程中,胶水会因为温度的升高等原因产生变形,加上所述镜头组件本身的热胀冷缩的原因,会使所述镜头在各个方向受力。不同量的胶水在相同的环境中发生的变异量也不一样,对所述镜头施加的拉扯力也不一样,所述镜头受力不均匀,导致其偏离原来的组装位置。在有些情况下,因为各个点胶位置的变形量不同,相互拉扯,导致胶水附着力相对小的地方胶水开裂。
当采用四点点胶方式时,所述镜头和所述支撑件在感光芯片的两长边方向对应区域和两短边方向对应区域均被点胶。此时,极有可能存在由于各个点胶不均匀,四点点胶的位置点胶量不一致,从而导致烘烤过程中,各个点胶位置变形不一致,甚至导致胶水开裂。如图2A和图2B所示,图中箭头所指位置为现有技术中常见的所述镜头和所述支撑件安装时采用的四点点胶位置。
胶水开裂和变形不一致会导致在后续降温的过程中,胶水因温度降低恢复原状时,对所述镜头施加的恢复力将不同于烘烤过程中的拉扯力,所述镜头无法回到原位,使所述镜头相对于所述支撑件的位置发生偏移,进而使光学系统相对于所述感光区域的位置发生偏移,两者配合不良,成像不清晰。尤其是在对倾斜和偏移敏感的感光芯片的X方向,对成像的影响更为严重。
特别是当胶水开裂时,所述镜头与胶水不粘结,自然在降温恢复的过程中,无法受到来自胶水的恢复力。所以,在烘烤过程中,受到拉扯力被推偏移的镜头,因为没有受到对应的恢复力,在降温过程中,无法恢复到原位,使得最终产品中所述镜头和所述支撑件产生偏移。
这种影响在广角摄像模组中影响更为严重。一方面,广角摄像模组的所述感光区域相对普通摄像模组更大,X方向的可偏移值更小。另一方面,胶水变形导致的偏移方向不一致,会导致阵列模组中两个模组的光轴不平行或者偏离校准坐标,使得两者图像匹配难度加大。
除了在所述镜头和所述支撑件会因为胶水变形导致偏移,其他采用四点点胶方式结合的组件之间均存在类似的问题,比如所述支撑件与所述镜座之间,所述镜座和所述线路板之间,和所述感光芯片和所述线路板之间。这些组件之间的胶水变形都会使得光学成像面和感光区域位置发生偏移,从而影响成像质量。
发明内容
本发明的一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中所述摄像模组的各组件之间采用的点胶方案可以在烘烤过程和降温过程中,降低甚至避免镜头组件的一光学系统和感光组件的一感光芯片产生偏移的可能性,提高产品良率。
本发明的一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中所述摄像模组的各组件之间采用的点胶方案可以在烘烤过程和降温过程中,降低甚至避免所述光学系统和所述感光芯片在偏移敏感的X方向产生偏移,提高产品良率。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中所述镜头组件的一支撑件和一镜筒之间的胶水允许两者在Y方向产生偏移,限制两者在X方向产生偏移,从而降低对光学系统和感光芯片之间的偏移对成像造成的影响。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中所述支撑件和所述镜筒之间的胶水被设置于两者之间、与感光芯片长边区域对应的、两个相对的第一区域,从而允许两者在Y方向产生偏移,限制两者在X方向产生偏移。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中所述支撑件和所述镜筒之间的胶水,在相对的所述第一区域的涂覆区域与所述镜头组件的中心呈大致的直线,并且所呈直线大致重叠于Y方向。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中在所述支撑件和所述镜筒之间,两个相对的第一区域被涂覆结合力强的胶水,以增强两者之间的结合强度;而与感光芯片短边区域对应的第二区域被涂覆结合力低或变形量低的胶水,以达到防尘的作用。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装 方法,其中所述支撑件和所述镜筒之间的胶水被分别设置于两者之间、相邻的一组第一区域和第二区域,使得所述支撑件和所述镜筒之间在X方向和Y方向仅单边受力,避免现有技术中四点点胶中相互拉扯现象的发生,降低胶水变形对偏移的影响,避免胶水开裂的发生。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中所述支撑件和所述镜筒之间的胶水被分别设置于两者之间、相邻的一组第一区域的中间区域和第二区域的中间区域,从而降低和避免偏移发生的可能性。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中所述支撑件和所述感光组件之间的胶水允许两者在Y方向产生偏移,限制两者在X方向产生偏移,从而降低对镜头组件的光学系统和感光组件的感光芯片之间的偏移对成像造成的影响。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中所述支撑件和所述感光组件之间的胶水被设置于两者之间、两个相对的第一区域,从而允许两者在Y方向产生偏移,限制两者在X方向产生偏移。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中在所述支撑件和所述感光组件之间,两个相对的第一区域涂覆结合力强的胶水,以增强两者之间的结合强度;而第二区域被涂覆结合力低或变形量低的胶水,以达到防尘的作用。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中所述支撑件和所述感光组件之间的胶水被分别设置于两者之间、相邻的一组第一区域和第二区域,使得所述支撑件和所述感光组件之间在X方向和Y方向仅单边受力,避免现有技术中四点点胶中相互拉扯现象的发生,降低胶水变形对偏移的影响,避免胶水开裂的发生。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中所述感光组件的一线路板和一镜座之间的胶水允许两者在Y方向产生偏移,限制两者在X方向产生偏移,从而降低对镜头组件的光学系统和感光组件的感光芯片之间的偏移对成像造成的影响。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中所述线路板和所述镜座之间的胶水被设置于两者之间、两个相对第一 区域,从而允许两者在Y方向产生偏移,限制两者在X方向产生偏移。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中在所述线路板和所述镜座之间,两个相对的第一区域涂覆结合力强的胶水,以增强两者之间的结合强度;而第二区域被涂覆结合力低或变形量低的胶水,以达到防尘的作用。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中所述线路板和所述镜座之间的胶水被分别设置于两者之间、相邻的一组第一区域和第二区域,使得所述线路板和所述镜座之间在X方向和Y方向仅单边受力,避免现有技术中四点点胶中相互拉扯现象的发生,降低胶水变形对偏移的影响,避免胶水开裂的发生。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中所述感光组件的所述感光芯片和所述线路板之间的胶水允许两者在Y方向产生偏移,限制两者在X方向产生偏移,从而降低对镜头组件的光学系统和感光组件的感光芯片之间的偏移对成像造成的影响。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中所述感光芯片和所述线路板之间的胶水被设置于两者之间、两个相对的第一区域,从而允许两者在Y方向产生偏移,限制两者在X方向产生偏移。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中在所述感光芯片和所述线路板之间,两个相对的第一区域涂覆结合力强的胶水,以增强两者之间的结合强度;而第二区域被涂覆结合力低或变形量低的胶水,以达到防尘的作用。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中所述感光芯片和所述线路板之间的胶水被分别设置于两者之间、相邻的一组第一区域和第二区域,使得所述感光芯片和所述线路板之间在X方向和Y方向仅单边受力,避免现有技术中四点点胶中相互拉扯现象的发生,降低胶水变形对偏移的影响,避免胶水开裂的发生。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中对于一阵列摄像模组,尤其是广角加长焦组合的阵列摄像模组,其各组件之间采用的本发明的点胶方案可以在烘烤过程中,降低甚至避免其光学系统和对应的感光芯片在比普通摄像模组对偏移更敏感的X方向产生偏移,提高产 品良率。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中对一阵列摄像模组,尤其是广角加长焦组合的阵列摄像模组,其各组件之间采用的本发明的点胶方案可以降低甚至避免胶水变形导致的偏移对各个图像之间匹配产生影响。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中在所述支撑件和所述镜筒之间,当相对的第一区域被涂覆胶水时,第二区域对应的区域涂覆有防尘胶,用于防止灰尘进入所述摄像模组内部。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中所述支撑件和所述镜筒之间的防尘胶只与镜筒外侧壁接触,或只与支撑件内侧壁接触,从而粘结镜筒外侧壁和支撑件内侧壁之间间隙的灰尘。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中所述支撑件和所述镜筒之间的防尘胶被填充于被设于所述支撑件内侧壁的至少一防尘槽内,与所述镜筒外侧壁间距预设距离,粘结所述镜筒外侧壁和所述支撑件内侧壁之间间隙的灰尘。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中所述支撑件和所述镜筒之间的防尘胶被填充于被设于所述镜筒外侧壁的至少一防尘槽内,与所述支撑件内侧壁间距预设距离,粘结所述镜筒外侧壁和所述支撑件内侧壁之间间隙的灰尘。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中在所述支撑件和所述感光组件的所述镜座之间,当相对的第一区域被涂覆胶水时,第二区域被涂覆有防尘胶,用于防止灰尘进入所述摄像模组内部。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中在所述线路板和所述镜座之间,当相对的第一区域被涂覆胶水时,第二区域被涂覆有防尘胶,用于防止灰尘进入所述摄像模组内部。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中在所述线路板和所述感光芯片之间,当相对的第一区域被涂覆胶水时,第二区域被覆有防尘胶,用于防止灰尘进入所述摄像模组内部。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中所述支撑件和所述镜筒之间,当相对的第一区域被涂覆胶水时,在第 二区域采用交错凸起的结构,延长灰尘进入所述摄像模组的路径,从而防止灰尘影响感光芯片成像。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中在所述支撑件和所述镜座之间,当相对的第一区域被涂覆胶水时,在第二区域采用交错凸起的结构,延长灰尘进入所述摄像模组的路径,从而防止灰尘影响感光芯片成像。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中支撑件和所述镜筒之间,仅在相对的第一区域预留点胶空间,封闭第二区域,避免灰尘进入。
本发明的另一个目的在于提供一种镜头组件、感光组件和摄像模组及其组装方法,其中所述摄像模组的各组件之间采用的点胶方案在不改变原有的设计基础上进行改进,既保证所述镜头与所述支撑件的良好结合,又保证摄像模组的成像质量。
依本发明的一个方面,本发明进一步提供一镜头组件,适于和一感光组件组装成一摄像模组,包括:
一光学镜片组;
一镜筒,其中所述光学镜片组被安装于所述镜筒内,形成一镜头;和
一支撑件,其中通过在所述镜筒和所述支撑件之间的、两相对的第一区域点胶,固定所述镜筒于所述支撑件内侧,以限制两者在X方向产生偏移,其中所述第一区域与所述感光组件的一感光芯片长边区域对应。
根据本发明的一个实施例,所述支撑件和所述镜筒之间的胶水分别被涂覆于两者之间、相对的所述第一区域的中间区域。
根据本发明的一个实施例,所述镜头组件进一步包括一防尘胶,其中所述防尘胶被涂覆于所述镜筒和所述支撑件之间的、两相对的第二区域,其中所述第二区域与所述感光组件的一感光芯片短边区域对应。
根据本发明的一个实施例,于至少两所述第二区域之一,至少一防尘槽被设置于所述支撑件的内侧壁,其中所述防尘胶被填充于所述防尘槽,其中所述防尘胶的外表面与所述镜筒的外侧壁间距预设距离,粘结所述镜筒的外侧壁和所述支撑件的内侧壁之间间隙的灰尘。
根据本发明的一个实施例,于至少两所述第二区域之一,至少一防尘槽被设 置于所述镜筒的外侧壁,其中所述防尘胶被填充于位于所述外侧壁的所述防尘槽内,与所述支撑件的内侧壁间距预设距离,粘结所述镜筒的外侧壁和所述支撑件的内侧壁之间间隙的灰尘。
根据本发明的一个实施例,于至少两所述第二区域之一,所述镜筒的外侧壁和所述支撑件的内侧壁设有相互交错的且相互匹配的凸起,形成一交错凸起结构,以延长灰尘进入所述摄像模组的路径。
根据本发明的一个实施例,所述镜头组件进一步具有两点胶空间,其中两所述点胶空间分别形成于所述镜筒和所述支撑件之间的两相对的第一区域,且两相对的所述第二区域被封闭。
依据本发明的另一方面,本发明进一步提供一镜头组件,适于和一感光组件组装成一摄像模组,包括:
一光学镜片组;
一镜筒,其中所述光学镜片组被安装于所述镜筒内,形成一镜头;和
一支撑件,其中通过在所述镜筒和所述支撑件之间的、一组第一区域和第二区域点胶,固定所述镜筒于所述支撑件内侧,以限制两者产生偏移,其中所述第一区域与所述感光组件的一感光芯片长边区域对应,其中所述第二区域与所述感光组件的一感光芯片短边区域对应。
根据本发明的一个实施例,所述支撑件和所述镜筒之间的胶水分别被涂覆于一组相邻的所述第一区域的中间区域和所述第二区域的中间区域。
根据本发明的一个实施例,所述镜头组件进一步包括一防尘胶,其中所述防尘胶被涂覆于所述镜筒和所述支撑件之间的、另一组相邻的所述第一区域和所述第二区域。
根据本发明的一个实施例,于至少另一组相邻的所述第一区域和所述第二区域之一,至少一防尘槽被设置于所述支撑件的内侧壁,其中所述防尘胶被填充于所述防尘槽,其中所述防尘胶的外表面与所述镜筒的外侧壁间距预设距离,粘结所述镜筒的外侧壁和所述支撑件的内侧壁之间间隙的灰尘。
根据本发明的一个实施例,于至少另一组相邻的所述第一区域和所述第二区域之一,至少一防尘槽被设置于所述镜筒的外侧壁,其中所述防尘胶被填充于位于所述外侧壁的所述防尘槽内,与所述支撑件的内侧壁间距预设距离,粘结所述镜筒的外侧壁和所述支撑件的内侧壁之间间隙的灰尘。
根据本发明的一个实施例,于至少另一组相邻的所述第一区域和所述第二区域,所述镜筒的外侧壁和所述支撑件的内侧壁设有相互交错的且相互匹配的凸起,形成一交错凸起结构,以延长灰尘进入所述摄像模组的路径。
根据本发明的一个实施例,所述镜头组件进一步具有两点胶空间,其中两所述点胶空间分别形成于所述镜筒和所述支撑件之间的、一组相邻的所述第一区域和所述第二区域,且另一组相邻的所述第一区域和所述第二区域被封闭。
依据本发明的另一方面,本发明进一步提供一摄像模组,包括:
一如上所述的镜头组件;和
一感光组件,其中所述感光组件包括一感光芯片、一镜座和一线路板,其中
所述感光芯片电连接地贴附于所述线路板,其中所述镜座环绕所述感光芯片,并贴附于所述线路板,其中所述镜座具有一光窗,对应于所述感光芯片的感光区域,其中所述支撑件支撑所述镜头,对应于所述光窗,其中所述支撑件由所述镜座延伸。
根据本发明的一个实施例,通过在所述镜座和所述支撑件之间的、两相对的第一区域点胶,固定所述支撑件于所述镜座顶侧。
根据本发明的一个实施例,所述支撑件和所述镜座之间的胶水被分别沿所述镜座的两长边涂覆。
根据本发明的一个实施例,通过在所述镜座和所述支撑件之间的、一组相邻的所述第一区域和所述第二区域点胶,固定所述支撑件于所述镜座顶侧。
根据本发明的一个实施例,所述镜座和所述支撑件之间,位于一个所述第一区域的胶水沿所述镜座的长边涂覆,而位于相邻的所述第二区域的胶水沿所述镜座的短边涂覆。
根据本发明的一个实施例,所述摄像模组进一步包括防尘胶,其中所述防尘胶被涂覆于所述镜座和所述支撑件之间的、两相对的第二区域。
根据本发明的一个实施例,所述摄像模组进一步包括防尘胶,其中所述防尘胶被涂覆于所述镜座和所述支撑件之间的、另一组相邻的所述第一区域和所述第二区域。
根据本发明的一个实施例,至少一防尘凹槽和与其匹配的防尘凸起被设置于所述镜座和所述支撑件,其中所述防尘凸起被固定于所述防尘凹槽,以防止灰尘进入内部空间。
根据本发明的一个实施例,通过在所述镜座和所述线路板之间的、两相对的第一区域点胶,固定所述镜座于所述线路板。
根据本发明的一个实施例,所述镜座和所述线路板之间的胶水分别被分别沿所述镜座的两长边涂覆。
根据本发明的一个实施例,通过在所述镜座和所述线路板之间的、一组相邻的所述第一区域和所述第二区域点胶,固定所述镜座于所述线路板。
根据本发明的一个实施例,所述镜座和所述线路板之间,位于一个所述第一区域的胶水沿所述镜座的长边涂覆,而位于相邻的所述第二区域的胶水沿所述镜座的短边涂覆。
根据本发明的一个实施例,通过在所述感光芯片和所述线路板之间的、两相对的第一区域点胶,固定所述感光芯片于所述线路板。
根据本发明的一个实施例,所述感光芯片和所述线路板之间的胶水分别被分别沿所述感光芯片的两长边涂覆。
根据本发明的一个实施例,通过在所述感光芯片和所述线路板之间的、一组相邻的所述第一区域和所述第二区域点胶,固定所述感光芯片于所述线路板。
根据本发明的一个实施例,所述感光芯片和所述线路板之间,位于一个所述第一区域的胶水沿所述感光芯片的长边涂覆,而位于相邻的所述第二区域的胶水沿所述感光芯片的短边涂覆。
依据本发明的另一方面,本发明进一步提供一阵列摄像模组,包括:
至少两如上所述的镜头组件;和
至少两感光芯片;
一一体式镜座;和
一线路板,其中所述感光芯片对应地且电连接地贴附于所述线路板,其中所述一体式镜座环绕每个所述感光芯片的周侧,并贴附于所述线路板,其中所述一体式镜座具有至少两光窗,对应于所述感光芯片的感光区域,其中所述支撑件支撑所述镜头,对应于所述光窗,其中所述支撑件由所述一体式镜座延伸。
依据本发明的另一方面,本发明进一步提供一阵列摄像模组,包括:
至少两如上所述的镜头组件;和
至少两感光芯片;
至少两镜座;和
一线路板,其中所述感光芯片对应地且电连接地贴附于所述线路板,其中每个所述镜座环绕对应的所述感光芯片的周侧,并贴附于所述线路板,其中所述镜座具有一光窗,对应于所述感光芯片的感光区域,其中所述支撑件支撑所述镜头,对应于所述光窗,其中所述支撑件由对应的所述镜座延伸。
依据本发明的另一方面,本发明进一步提供一感光组件,包括:
一感光芯片;
一线路板,其中所述感光芯片电连接地贴附于所述线路板;以及
一镜座,其中通过在所述线路板和所述镜座之间的、两相对的第一区域点胶,
固定所述镜座于所述线路板,其中所述镜座环绕所述感光芯片的周侧,其中所述镜座具有至少一光窗,对应于所述感光芯片的感光区域,其中所述第一区域与所述感光组件的一感光芯片长边区域对应。
依据本发明的另一方面,本发明进一步提供一感光组件,包括:
一感光芯片;
一线路板,其中所述感光芯片电连接贴附于所述线路板;以及
一镜座,其中通过在所述线路板和所述镜座之间的、一组相邻的所述第一区域和所述第二区域点胶,固定所述镜座于所述线路板,其中所述镜座环绕所述感光芯片的周侧,其中所述镜座具有至少一光窗,对应于所述感光芯片的感光区域,其中所述第一区域与所述感光组件的一感光芯片长边区域对应,其中所述第二区域与所述感光组件的一感光芯片短边区域对应。
依据本发明的另一方面,本发明进一步提供一感光组件,包括:
一感光芯片;
一线路板,其中通过在所述线路板和所述感光区域之间的、两相对的第一区域点胶,将所述感光芯片电连接地贴附于所述线路板,其中所述第一区域与所述感光组件的一感光芯片长边区域对应;以及
一镜座,其中所述镜座被固定于所述线路板,其中所述镜座环绕所述感光芯片的周侧,其中所述镜座具有至少一光窗,对应于所述感光芯片的感光区域。
依据本发明的另一方面,本发明进一步提供一感光组件,包括:
一感光芯片;
一线路板,其中通过在所述线路板和所述感光区域之间的、一组相邻的第一区域和第二区域点胶,将所述感光芯片电连接地贴附于所述线路板,其中所述第 一区域与所述感光组件的一感光芯片长边区域对应,其中所述第二区域与所述感光组件的一感光芯片短边区域对应;以及
一镜座,其中所述镜座被固定于所述线路板,其中所述镜座环绕所述感光芯片的周侧,其中所述镜座具有至少一光窗,对应于所述感光芯片的感光区域。
依据本发明的另一方面,本发明进一步提供一摄像模组的组装方法,包括:
(a)组装一组光学镜片和一镜筒,形成一镜头;
(b)将一支撑件贴附于一感光组件的顶侧的预留位置;以及
(c)通过分别在所述支撑件和所述镜筒之间的两个相对的第一区域的中
间区域点胶,固定所述支撑件和所述镜筒,其中所述镜头对应于所述感光组件的感光路径,其中所述第一区域与所述感光组件的一感光芯片长边区域对应。
根据本发明的一个实施例,所述步骤(b)还包括:
(b1)通过分别在所述支撑件和所述感光组件之间的两个相对的第一区域,沿所述感光组件的镜座的两长边点胶,固定所述支撑件和所述感光组件。
根据本发明的一个实施例,所述步骤(b)还包括:
(b2)通过分别在所述支撑件和所述感光组件之间的一个所述第一区域,沿所述感光组件的镜座的长边点胶,和在两者之间的一个所述第二区域,沿所述感光组件的镜座的短边点胶。
根据本发明的一个实施例,所述步骤(c)还包括:
(c1)通过分别在一感光芯片和一线路板之间的两个相对的第一区域,沿所述感光芯片的两长边点胶,通电地贴附所述感光芯片于所述线路板。
根据本发明的一个实施例,所述步骤(c)还包括:
(c2)通过分别一镜座和所述线路板之间的两个相对的第一区,沿所述镜座的两长边点胶,固定所述镜座于所述线路板,其中所述镜座环绕所述感光芯片,具有与所述感光芯片的感光区域对应的一光窗。
根据本发明的一个实施例,所述步骤(c)还包括:
(c3)通过分别在一感光芯片和一线路板之间的一个所述第一区域,沿所述感光芯片的长边点胶,和在两者之间的一个所述第二区域,沿所述感光芯片的短边点胶点胶,通电地贴附所述感光芯片于所述线路板。
根据本发明的一个实施例,所述步骤(c)还包括:
(c4)通过分别一镜座和所述线路板之间的一个所述第一区域,沿所述镜座 的长边点胶,和在两者之间的一个所述第二区域,沿所述镜座的短边点胶,固定所述镜座于所述线路板,其中所述镜座环绕所述感光芯片,具有与所述感光芯片的感光区域对应的一光窗。
根据本发明的一个实施例,所述组装方法进一步包括步骤:
(d)通过在所述支撑件和所述镜筒之间的两个相对的第二区域涂覆防尘胶,从而防止灰尘,其中所述第二区域与所述感光组件的一感光芯片短边区域对应。
依据本发明的另一方面,本发明进一步提供一摄像模组的组装方法,包括:
(A)组装一组光学镜片和一镜筒,形成一镜头;
(B)将一支撑件贴附于一感光组件的顶侧的预留位置;以及
(C)通过分别在所述支撑件和所述镜筒之间、一组第一区域的中间区域和第二区域的中间区域点胶,固定所述支撑件和所述镜筒,其中所述镜头对应于所述感光组件的感光路径,其中所述第一区域与所述感光组件的一感光芯片长边区域对应。
根据本发明的一个实施例,所述组装方法还包括步骤:
(D)通过在所述支撑件和所述镜筒之间的另一组第一区域和第二区域涂覆防尘胶,从而防止灰尘。
图1是一个镜头组件的一光学系统和一感光芯片的关系图。
图2A和图2B是现有技术的一镜头组件的点胶位置示意图。
图3是根据本发明的一较佳实施例的一摄像模组的爆炸图。
图4是根据本发明的上述较佳实施例的所述摄像模组的透视图。
图5是根据本发明的上述较佳实施例的所述摄像模组的俯视图。
图6A是根据本发明的上述较佳实施例的所述摄像模组A-A方向的截面图。
图6B是根据本发明的上述较佳实施例的所述摄像模组B-B方向的截面图。
图7A是根据本发明的一实施例的一摄像模组的俯视图。
图7B是根据本发明的上述实施例的所述摄像模组C-C方向的截面图。
图7C是根据本发明的上述实施例的所述摄像模组D-D方向的截面图。
图8A是根据本发明的一实施例的镜头组件的局部示意图。
图8B是根据本发明的一实施例的镜头组件的局部示意图。
图9是根据本发明的一实施例的摄像模组的俯视图。
图10A是根据本发明的一实施例的一摄像模组的俯视图。
图10B是根据本发明的上述实施例的所述摄像模组E-E方向的截面图。
图10C是根据本发明的上述实施例的所述摄像模组F-F方向的截面图。
图11是根据本发明的一实施例的感光组件的俯视图。
图12A和图12B是根据本发明的一实施例的摄像模组的不同方向截面图。
图13A是根据本发明的一实施例的一摄像模组局部示意图。
图13B是根据本发明的一实施例的一摄像模组局部示意图。
图13C是根据本发明的一实施例的一摄像模组局部示意图。
图13D是根据本发明的一实施例的一摄像模组局部示意图。
图14A是根据本发明的一实施例的阵列摄像模组的俯视图。
图14B是根据本发明的上述实施例的阵列摄像模组的G-G方向的截面图。
图14C是根据本发明的上述实施例的阵列摄像模组的H-H方向的截面图。
图14D是根据本发明的上述实施例的阵列摄像模组的I-I方向的截面图。
图15A是根据本发明的第二实施例的摄像模组的俯视图。
图15B是根据本发明的第二实施例的所述摄像模组的J-J方向的截面图。
图15C是根据本发明的第二实施例的所述摄像模组的K-K方向的截面图。
图16A和图16B是根据本发明的另一实施例的所述摄像模组的不同方向的截面图。
图17A是根据本发明的第二实施例的阵列摄像模组的俯视图。
图17B是根据本发明的上述第二实施例的阵列摄像模组的L-L方向的截面图。
图17C是根据本发明的上述第二实施例的阵列摄像模组的M-M方向的截面图。
图17D是根据本发明的上述第二实施例的阵列摄像模组的N-N方向的截面图。
图18A是根据本发明的一实施例的摄像模组的俯视图。
图18B是根据本发明的另一实施例的阵列摄像模组的俯视图。
图19是根据本发明的一摄像模组的组装方法的流程图。
图20是根据本发明的一感光组件的组装方法的流程图。
图21是根据本发明的一感光组件的另一组装方法的流程图。
图22A至图22C是根据本发明的另一阵列摄像模组的不同位置的截面图。
图23A至图23C是根据本发明的另一阵列摄像模组的不同位置的截面图。
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例,本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。
本领域技术人员应理解的是,在本发明的揭露中,术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系,其仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此上述术语不能理解为对本发明的限制。
可以理解的是,术语“一”应理解为“至少一”或“一个或多个”,即在一个实施例中,一个元件的数量可以为一个,而在另外的实施例中,该元件的数量可以为多个,术语“一”不能理解为对数量的限制。
参考图3至图14D,根据本发明的一较佳实施例的一镜头组件、一感光组件和一摄像模组被阐述,提供一不同于现有技术的点胶方案,可以在烘烤过程中,降低甚至避免所述镜头组件的一光学系统和所述感光组件的一感光芯片之间的偏移,提高产品良率。所述摄像模组300包括所述镜头组件100和所述感光组件200。所述镜头组件100被支持于所述感光组件200的顶侧,对应于所述感光组件200的感光路径。
本发明中,以所述感光组件200的一感光芯片210的长边方向为X方向,以所述感光芯片210的短边方向为Y方向,进行阐述说明。为了保证所述感光芯片210的一感光区域211被充分利用,所述感光区域211中心与所述镜头组件100的光学系统的光轴处于同一直线上,定义一重叠中轴,并且光学系统的成像面半径应大于所述感光区域211的对角线半径。对应地,各个水平截面于所述重叠中轴相交点即为对应水平面的中心位置。
现有工艺中,所述感光芯片210以及所述感光区域211均为矩形,而所述镜 头组件100的一光学系统成像面为圆形状,如图1所示。可以看出得是,所述光学系统成像面在X方向的可偏移值要小于在Y方向的可偏移值要小。在X方向的略微偏移和倾斜有可能导致所述光学系统成像面无法良好地覆盖所述感光区域,进而导致成像模糊。换句话说,所述感光区域对X方向的偏移或倾斜更敏感。
所述镜头组件100包括一光学镜片组件110、用于容纳所述光学镜片组件110的一镜筒120和一支撑件130。所述光学镜片组件110包括单个或多个的光学透镜。组装时,所述光学镜片组件110被安装于所述镜筒120内,形成一镜头,之后所述支撑件130承载所述镜头,被安装于所述感光组件200顶侧,以使所述光学镜片组件110对应于所述感光组件200的感光路径。
如上所述,现有技术中,所述镜头和支撑件130的组装会采用四点点胶的方式固定,即所述支撑件130的内侧壁131和所述镜筒120的外侧壁121之间的X方向和Y方向对应的区域均由胶水固定。但是,四点点胶方式很容易使得所述镜头在偏移敏感的X方向产生偏移,致使所述镜头组件100的一光学系统成像面与感光区域位置发生偏移,影响产品良率。
而在本发明的一较佳实施中,所述支撑件130的内侧壁131和所述镜筒120的外侧壁121的胶水400允许两者在Y方向产生偏移,限制两者在X方向产生偏移,从而降低对镜头组件的光学系统和感光组件的感光芯片之间的偏移对成像造成的影响。也就是说,在本发明中,所述支撑件130和所述镜筒120被尽可能地禁止在X方向产生偏移,提高产品良率。
本发明的较佳实施例中,所述支撑件130和所述镜筒120之间的胶水400被设置于两者之间的、与感光芯片长边区域对应的、两个相对的第一区域140,使得烘烤变形和后续降温恢复过程中,X方向的分力被尽可能地相互抵消,避免在X方向产生偏移,如图5和图6A所示。所述感光芯片长边区域是指由所述感光区域211的中心分别和所述感光芯片210的长边的两端点连接所辐射的区域,如图5所示。而所述支撑件130和所述镜筒120之间的第一区域140是所述感光芯片长边区域在所述支撑件130和所述镜筒120之间于Z方向的延伸。可以理解的是,对应于所述感光芯片的两个相对的长边,其形成的所述感光芯片长边区域也是两个相对的区域,对应地,所述支撑件130和所述镜筒120之间的第一区域140也是两个相对的区域。
此时,由于所述支撑件130和所述镜筒120之间、与感光芯片短边区域对应的、两个相对的第二区域150均未被点胶,在烘烤第二区域150不会受到拉扯力,并且在后续降温的过程中,也不会受到恢复力,进而降低X方向偏移产生的可能性,如图5和图6B所示。所述感光芯片短边区域是指由所述感光区域211的中心分别和所述感光芯片210的短边的两端点连接所辐射的区域。而所述支撑件130和所述镜筒120之间的第二区域150是所述感光芯片短边区域在所述支撑件130和所述镜筒120之间于Z方向的延伸。可以理解的是,对应于所述感光芯片的两个相对的短边,其形成的所述感光芯片短边区域也是两个相对的区域,对应地,所述支撑件130和所述镜筒120之间的第二区域150也是两个相对的区域。
优选地,为了尽可能地避免所述镜筒120受到X方向分力而偏移,所述支撑件130和所述镜筒120之间的胶水400被涂覆于两者之间的第一区域140的中间区域。也就是说,所述支撑件130和所述镜筒120之间,分别在相对的两个第一区域140的涂覆区域141与对应的中心位置呈大致的直线,并且所呈直线于Y方向大致重叠。此时,受力中心在X方向上相互抵消的效果更佳。
为了保证所述镜头和所述支撑件130的结合强度,避免摄像模组受到冲击力时,所述镜头和所述支撑件130脱落。在本发明的较佳实施例中,在所述支撑件130和所述镜筒120之间,所述第一区域140的所述涂覆区域141被涂覆结合力强的胶水400,以满足胶水强度要求,例如热固胶水。
进一步,现有的所述镜头与所述支撑件中,如果仅在采用第一区域140上的点胶,导致第二区域150的点胶孔存在,需要进行防尘处理以防止外部灰尘通过预留的点胶孔进入摄像模组内,从而影响成像。在本发明的较佳实施例中,在所述镜头和所述支撑件130之间,于所述第二区域150被涂覆结合力低或低变异量的胶水等作为防尘胶152,以达到防尘作用,例如UV胶(光敏胶水,Ultraviolet Rays),如图7A至7C所示。
具体地,在本发明的一实施例中,在所述第二区域150,所述支撑件130的内侧壁131凹陷,形成至少一防尘槽151所述防尘胶152被填充位于所述内侧壁131的所述防尘槽151,且所述防尘胶152的顶外表面与所述镜筒120的外侧壁121间距预设距离,粘结所述镜筒120的外侧壁121和所述支撑件130的内侧壁131之间间隙的灰尘,如图8A所示。
在本发明的另一实施例中,在所述第二区域150,至少一防尘槽151被形成 于所述镜筒120的外侧壁121,由所述镜筒120的外侧壁121凹陷形成。所述防尘胶152被填充于位于所述外侧壁121的所述防尘槽151内,与所述支撑件130的内侧壁131间距预设距离,粘结所述镜筒120的外侧壁121和所述支撑件130的内侧壁131之间间隙的灰尘,如图8B所示。
也就是说,所述防尘胶152只与所述镜筒120的外侧壁121和所述支撑件130的内侧壁131中之一接触,仅用于防尘,避免在所述第二区域150产生结合力。
在本发明的另一实施例中,在所述支撑件130和所述镜筒120之间,于第二区域采用交错凸起的结构,延长灰尘进入所述摄像模组的路径,从而防止灰尘影响感光芯片成像,如图10A至图10C所示。具体地,所述镜筒120的外侧壁121和所述支撑件130的内侧壁131设有相互交错的且相互匹配的凸起。也就是说,所述镜筒120的外侧壁121的凸起抵于所述支撑件130的内侧壁131对应凹槽的底部,或抵于所述支撑件130的内侧壁131非凹槽的顶表面;同时,所述支撑件130的内侧壁131的凸起抵于所述镜筒120的外侧壁121对应凹槽的底部,或抵于所述镜筒120的外侧壁121非凹槽的顶表面。本领域技术人员可以知道的是,此处附图10C仅为解释交错凸起结构的示例,可以通过减少或增加交错的凸起构成本发明所述的交错凸起的结构,本发明并不限制。
在本发明的另一实施例中,通过改变所述镜筒120的结构,即仅在相对的第一区域140预留点胶空间160,而不在第二区域150预留点胶空间,避免灰尘进入。对比图2A和图2B,现有技术中,所述镜筒120在各个方向上预留了点胶空间,也就是呈花瓣状。而本实施例中,所述镜筒120仅在相对的第一区域140预留点胶空间,对应于本发明的点胶方法,仅在所述支撑件130和所述镜筒120之间的第一区域140点胶,也可以避免其他空隙让灰尘进入内部空间,如图9所示。
进一步,上述两侧长边区域点胶的方案也可以应用于粘结所述支撑件130和所述感光组件200之间,避免所述支撑件130带着所述镜头偏斜原本的组装位置,如图11至13D所示。
所述感光组件200包括所述感光芯片210、一镜座220和一线路板230。所述感光芯片210电连接地贴附于所述线路板230。所述镜座220环绕所述感光芯片210,并贴附于所述线路板230。所述镜座220具有一光窗221,对应于所述感光芯片210的感光区域211。所述支撑件130支撑所述镜头,对应于所述光窗 221。所述支撑件130被粘结于所述镜座220的顶表面222。
在本发明的一较佳实施例中,所述支撑件130的底面132和所述镜座220的顶表面222的胶水400允许两者在Y方向产生偏移,限制两者在X方向产生偏移,从而降低所述镜头组件100的光学系统和所述感光芯片210之间的偏移对成像造成的影响。也就是说,在本发明中,所述支撑件130和所述镜座220被尽可能地禁止在X方向产生偏移,提高产品良率。
所述支撑件130和所述镜座220之间的胶水400被设置于两者之间的、与感光芯片长边区域对应的、两个相对的第一区域140,使得烘烤变形和后续降温恢复过程中,X方向的分力被尽可能地相互抵消,避免在X方向产生偏移。所述支撑件130和所述镜座220之间的第一区域140对应于所述感光芯片长边区域,是所述感光芯片长边区域在所述支撑件130和所述镜座220之间于Z方向的延伸,如图11和图12A所示。
同理,此时所述支撑件130和所述镜座220之间、与感光芯片短边区域对应的、两个相对的第二区域150均未被点胶,在烘烤第二区域150不会受到拉扯力,并且在后续降温的过程中,也不会受到恢复力,进而降低X方向偏移产生的可能性。所述支撑件130和所述镜座220之间的第二区域150对应于所述感光芯片短边区域,是所述感光芯片短边区域在所述支撑件130和所述镜座220之间于Z方向的延伸。
优选地,由于所述镜座结构多为矩形形状,所述支撑件130和所述镜座220之间,分别在相对的两个第一区域140的涂覆区域141被设置于所述镜座220的两个长边,也就是沿所述镜座220的长边延伸。
为了保证所述镜座220和所述支撑件130的结合强度,避免摄像模组受到冲击力时,所述镜座220和所述支撑件130脱落。在本发明的较佳实施例中,在所述支撑件130和所述镜座220之间,所述第一区域140的所述涂覆区域141被涂覆结合力强的胶水400,以满足胶水强度要求,例如热固胶水。
进一步,为了防止外部灰尘通过所述镜座220和所述支撑件130之间的缝隙进入摄像模组内,从而影响成像。在本发明的较佳实施例中,在所述镜座220和所述支撑件130之间,于所述第二区域150被涂覆结合力低或低变异量的胶水等作为防尘胶152,以达到防尘作用,例如UV胶(光敏胶水,Ultraviolet Rays),如图11、图12B和图13A所示。
在本发明的一个实施例中,在所述第二区域150,所述镜座220的所述顶表面222形成至少一防尘槽151,如图13D所示。所述防尘槽151由所述顶表面222凹陷形成。所述防尘胶152被填充入位于所述顶表面222的所述防尘槽151,与所述支撑件130的底面132间距预设距离。位于所述顶表面222的所述防尘胶152不与所述支撑件130的底面132接触,但利用粘性防止灰尘进入。
在本发明的另一实施例中,如图13C所示,在所述第二区域150,所述镜座220的顶表面222形成至少一防尘凹槽223,对应地,所述支撑件130的底面132的底面形成匹配的防尘凸起133。也就是说,在所述第二区域150,所述镜座220和所述支撑件130通过所述防尘凹槽223和所述防尘凸起133匹配地被固定。此时,所述防尘凸起133不仅延长了灰尘进入内部空间的路径,还可以阻挡灰尘进入。在所述镜座220和所述支撑件130之间,在第一区域140通过点胶的方式固定,而在第二区域150通过凸起结构防止灰尘进入。或者,所述支撑件130的底面132设有防尘凹槽,而所述镜座220的顶表面222形成对应的防尘凸起,相互配合也可以起到防尘作用,此处并不限制。
进一步,在所述镜座220和所述支撑件130之间,于所述第二区域150,凸起结构和所述防尘胶152可以组合使用,如图13B所示。在本发明的一实施例中,在所述镜座220和所述支撑件130之间,于所述第二区域150的相对外侧区域被涂覆所述防尘胶152,并且于相对内侧区域设有凸起结构,起到双重防尘作用。例如,于所述第二区域150,可以在所述镜座220的顶表面222的外侧区域涂覆所述防尘胶152,同时在其内侧形成防尘凸起,并对应地在所述支撑件130的底面132形成防尘凹槽。本领域技术人员可以知道的是,此处组合使用只是举例说明,并非限制,本领域也可以将防尘胶152涂覆于所述支撑件130的底面132,与凸起结构组合使用,等等。
进一步,上述两侧长边区域点胶的方案也可以应用于粘结所述镜座220和所述线路板230之间,避免所述镜座220带着所述镜头偏斜原本的组装位置。也就是说,当所述镜座220和所述线路板230之间采用胶水400固定时,即可采用本发明的技术方案,如图12A所示。
所述线路板230的顶面231和所述镜座220的底面223胶水400允许两者在Y方向产生偏移,限制两者在X方向产生偏移,从而降低对所述镜头组件100的光学系统和所述感光芯片210之间的偏移对成像造成的影响。也就是说,在本 发明中,所述线路板230和所述镜座220之间被尽可能地禁止在X方向产生偏移,提高产品良率。
所述线路板230和所述镜座220之间的胶水400被设置于两者之间的、与感光芯片长边区域对应的、两个相对的第一区域140,使得烘烤变形和后续降温恢复过程中,X方向的分力被尽可能地相互抵消,避免在X方向产生偏移。所述线路板230和所述镜座220之间的第一区域140对应于所述感光芯片长边区域,是所述感光芯片长边区域在所述线路板230和所述镜座220之间于Z方向的延伸,如图11和图12A所示。
同理,此时所述线路板230和所述镜座220之间、与感光芯片短边区域对应的、两个相对的第二区域150均未被点胶,在烘烤第二区域150不会受到拉扯力,并且在后续降温的过程中,也不会受到恢复力,进而降低X方向偏移产生的可能性。所述线路板230和所述镜座220之间的第二区域150对应于所述感光芯片短边区域,是所述感光芯片短边区域在所述线路板230和所述镜座220之间于Z方向的延伸。
优选地,由于所述镜座和所述线路板多为矩形形状,所述线路板230和所述镜座220之间,分别在相对的两个第一区域140的涂覆区域141被设置于所述镜座220的两个长边,也就是沿所述镜座220的长边延伸。
进一步,为了防止外部灰尘通过所述镜座220和所述线路板230之间的缝隙进入摄像模组内,从而影响成像。在本发明的较佳实施例中,在所述镜座220和所述线路板230之间,于所述第二区域150被涂覆结合力低或低变异量的胶水等作为防尘胶152,以达到防尘作用,例如UV胶(光敏胶水,Ultraviolet Rays),如图11和图12B所示。
进一步,上述两侧长边区域点胶的方案也可以应用于粘结所述感光芯片210和所述线路板230之间,避免所述感光芯片210偏离原本的组装位置。也就是说,当所述感光芯片210和所述线路板230之间采用胶水400固定时,即可采用本发明的技术方案,如图11和图12A所示。
所述线路板230的顶面231和所述感光芯片210之间的胶水400允许两者在Y方向产生偏移,限制两者在X方向产生偏移,从而降低对所述镜头组件100的光学系统和所述感光芯片210之间的偏移对成像造成的影响。也就是说,在本发明中,所述线路板230和所述感光芯片210之间被尽可能地禁止在X方向产 生偏移,提高产品良率。
所述线路板230和所述感光芯片210之间的胶水400被设置于两者之间的、与感光芯片长边区域对应的、两个相对的第一区域140,使得烘烤变形和后续降温恢复过程中,X方向的分力被尽可能地相互抵消,避免在X方向产生偏移。所述线路板230和所述感光芯片210之间的第一区域140对应于所述感光芯片长边区域,是所述感光芯片长边区域在所述线路板230和所述感光芯片210之间于Z方向的延伸。
同理,此时所述线路板230和所述感光芯片210之间、与感光芯片短边区域对应的、两个相对的第二区域150均未被点胶,在烘烤第二区域150不会受到拉扯力,并且在后续降温的过程中,也不会受到恢复力,进而降低X方向偏移产生的可能性。所述线路板230和所述感光芯片210之间的第二区域150对应于所述感光芯片短边区域,是所述感光芯片短边区域在所述线路板230和所述感光芯片210之间于Z方向的延伸。
优选地,由于所述感光芯片多为矩形形状,所述线路板230和所述感光芯片210之间,分别在相对的两个第一区域140的涂覆区域141被设置于所述感光芯片210的两个长边,也就是沿所述感光芯片210的长边延伸。
进一步,为了防止外部灰尘通过所述感光芯片210和所述线路板230之间的缝隙进入摄像模组内,从而影响成像。在本发明的较佳实施例中,在所述感光芯片210和所述线路板230之间,于所述第二区域150被涂覆结合力低或低变异量的胶水等作为防尘胶152,以达到防尘作用,例如UV胶(光敏胶水,Ultraviolet Rays),如图11和图12B所示。
进一步,当所述摄像模组300被实施为阵列摄像模组时,所述阵列摄像模组包括至少两个所述镜头组件100、至少两感光芯片210、一一体式镜座240和一线路板230。每个所述感光芯片210对应地且电连接地贴附于所述线路板230。所述一体式镜座环绕每个所述感光芯片的周侧,并贴附于所述线路板。所述一体式镜座具有至少两光窗,分别对应于所述感光芯片的感光区域。所述支撑件支撑所述镜头,对应于所述光窗。所述支撑件由所述一体式镜座延伸。本领域技术人员可以知道的是,在所述阵列摄像模组中,所述线路板230可以是一体式线路板也可以是分体式线路板,此时并不限制。
此时,每个感光芯片210都对应有两感光芯片长边区域,从而对应的两个相 对的第一区域140,和两感光芯片短边区域,从而对应的两个相对的第二区域150。也就是说,在所述阵列摄像模组中,对应于所述感光芯片的分布和数量,所述阵列摄像模组的所述第一区域140和所述第二区域150对应地设置和分布。
所述阵列摄像模组同样地采取本发明的点胶方案,每个所述镜头组件100的所述镜筒120和所述支撑件130之间、在每个所述镜头组件100和所述阵列摄像模组的一体式镜座240组装之间、所述一体式镜座240和所述线路板230之间、以及每个感光芯片210和对应的线路板230区域之间,仍可以采用该较佳实施例中的点胶方案,仅在第一区域140点胶,如图14A至图14D所示。此外,还可以在第二区域150,通过上防尘胶152、凸起结构或者交错凸起结构以及组合使用等方法防止灰尘进入内部空间。
或者当所述摄像模组300被实施为阵列摄像模组时,所述阵列摄像模组包括至少两个所述镜头组件100、至少两感光芯片210、至少两镜座220和一线路板230。每个所述感光芯片210对应地且电连接地贴附于所述线路板230。每个所述镜座具有一光窗,对应于所述感光芯片的感光区域。每个所述镜座环绕对应的所述感光芯片的周侧,并贴附于所述线路板。所述支撑件支撑所述镜头,对应于所述光窗。所述支撑件由对应的所述镜座延伸。本领域技术人员可以知道的是,在所述阵列摄像模组中,所述线路板230可以是一体式线路板也可以是分体式线路板,此时并不限制。
此时,所述阵列摄像模组同样地也可以采取本发明的点胶方案,每个所述镜头组件100的所述镜筒120和所述支撑件130之间、在每个所述镜头组件100和对应的所述镜座220组装之间、每个所述镜座220和所述线路板230之间、以及每个感光芯片210和对应的线路板230区域之间,仍可以采用该较佳实施例中的点胶方案,仅在第一区域140点胶,如图22A至图22C所示。此外,还可以在第二区域150,通过上防尘胶152、凸起结构或者交错凸起结构以及组合使用等方法防止灰尘进入内部空间。
如图15A至图18B所示,本发明的第二实施例的所述镜头组件100、所述感光组件200和所述摄像模组300被阐述。不同于上述较佳实施例,本第二实施例,所述镜筒120和所述支撑件130之间、所述镜头组件100和所述镜座220之间、所述镜座220和所述线路板230之间、或者所述感光芯片210和所述线路板230区域之间,于一组相邻的所述第一区域140A和所述第二区域150A涂覆胶水 400A以固定,使得各个元件之间在X方向和Y方向仅单边受力,避免现有技术中四点点胶中相互拉扯现象的发生,降低胶水变形对偏移的影响,避免胶水开裂的发生。
在本第二实施例中,所述第一区域140A仍然是与感光芯片长边区域在Z轴延伸所对应的区域。所述第二区域150A仍然是与感光芯片短边区域在Z轴延伸所对应的区域。为了阐述方便,相邻的一个所述第一区域140A和一个所述第二区域150A被称为一组。
具体地,所述镜筒120和所述支撑件130之间的胶水400A被设置于两者之间的、一组所述第一区域140A和所述第二区域150A,使得烘烤变形和后续降温恢复过程中,所述镜筒120和所述支撑件130之间在X方向和Y方向仅单边受力,相对的另一组所述第一区域140A和所述第二区域150A没有胶水400A限制,相对自由,不会产生拉扯力和恢复力,也就避免现有技术中四点点胶中相互拉扯现象的发生,如图15A至图15C。
优选地,所述支撑件130和所述镜筒120之间的胶水400A被涂覆于两者之间、相邻的一组第一区域140A的中间区域和第二区域150A的中间区域,从而降低和避免偏移发生的可能性。也就是说,所述支撑件130和所述镜筒120之间,所述第一区域140A的涂覆区域与对应的中心位置所呈直线于Y方向大致重叠;所述第二区域150A的涂覆区域与对应的中心位置所呈直线于X方向大致重叠。
进一步,为了防止灰尘从多余的点胶孔进入摄像模组内部,在本第二实施例中,在所述镜头和所述支撑件130之间,未被涂覆粘合胶的另一组所述第一区域140A和所述第二区域150A被涂覆结合力低或低变异量的胶水等作为防尘胶152A,以达到防尘作用,例如UV胶(光敏胶水,Ultraviolet Rays),如图15A至图15C。
本领域技术人员可以知道的是,上述较佳实施例中的防尘方案,例如设置防尘凹槽填充防尘胶、凸起结构或者等,也可以被应用于未被涂覆粘合胶的另一组所述第一区域140A和所述第二区域150A,以防止灰尘进入内部,此处不再赘述。或者通过改变所述镜筒120A的结构,仅在一组所述第一区域140A和所述第二区域150A预留点胶空间160A,而另一组所述第一区域140A和所述第二区域150A不预留点胶空间,进而避免灰尘进入,如图18A和图18B所示。
进一步,本第二实施例中的,一组所述第一区域140A和所述第二区域150A 点胶的方案也可以应用于粘结所述支撑件130和所述感光组件200之间,避免所述支撑件130带着所述镜头偏斜原本的组装位置,如图16A和图16B所示。
具体地,所述支撑件130和所述感光组件200之间的胶水400A被设置于两者之间的、一组所述第一区域140A和所述第二区域150A。优选地,由于所述镜座120多为矩形结构,所述支撑件130和所述感光组件200之间,位于一个所述第一区域140A的胶水400A沿所述镜座120的长边涂覆;而位于相邻的所述第二区域150A的胶水400A沿所述镜座120的短边涂覆。
本领域技术人员可以知道的是,上述较佳实施例的中的防尘方案,例如涂覆防尘胶、设置防尘凹槽填充防尘胶、凸起结构或者两者结合等,也可以被应用于本第二实施例的、所述支撑件130和所述感光组件200之间的另一组所述第一区域140A和所述第二区域150A,以防止灰尘进入内部,此处不再赘述。
进一步,本第二实施例中的,一组所述第一区域140A和所述第二区域150A点胶的方案也可以应用于粘结所述镜座220和所述线路板230之间,避免所述镜座220带着所述镜头偏斜原本的组装位置,如图16A和图16B所示。
具体地,所述镜座220和所述线路板230之间的胶水400A被设置于两者之间的、一组所述第一区域140A和所述第二区域150A。优选地,由于所述镜座120和所述线路板230多为矩形结构,所述镜座220和所述线路板230之间,位于一个所述第一区域140A的胶水400A沿所述镜座120的长边涂覆;而位于相邻的所述第二区域150A的胶水400A沿所述镜座120的短边涂覆。
本领域技术人员可以知道的是,上述较佳实施例的中的防尘方案,例如涂覆防尘胶、设置防尘凹槽填充防尘胶、凸起结构或者两者结合等,也可以被应用于本第二实施例的、所述镜座220和所述线路板230之间的另一组所述第一区域140A和所述第二区域150A,以防止灰尘进入内部,此处不再赘述。
进一步,本第二实施例中的,一组所述第一区域140A和所述第二区域150A点胶的方案也可以应用于粘结所述感光芯片210和所述线路板230之间,避免所述感光芯片偏离原本的组装位置,如图16A和图16B。
具体地,所述感光芯片210和所述线路板230之间的胶水400A被设置于两者之间的、一组所述第一区域140A和所述第二区域150A。优选地,由于感光芯片210多为矩形结构,所述感光芯片210和所述线路板230之间,位于一个所述第一区域140A的胶水400A沿所述感光芯片210的长边涂覆;而位于相邻的 所述第二区域150A的胶水400A沿所述感光芯片210的短边涂覆。
本领域技术人员可以知道的是,上述较佳实施例的中的防尘方案,例如涂覆防尘胶、设置防尘凹槽填充防尘胶、凸起结构或者两者结合等,也可以被应用于本第二实施例的、所述感光芯片210和所述线路板230之间的另一组所述第一区域140A和所述第二区域150A,以防止灰尘进入内部,此处不再赘述。
进一步,当所述摄像模组300被实施为阵列摄像模组时,每个所述镜头组件100的所述镜筒120和所述支撑件130之间、在每个所述镜头组件100和所述阵列摄像模组的一体式镜座240组装之间、所述一体式镜座240和所述线路板230之间、以及每个感光芯片210和对应的线路板230区域之间,仍可以采用该第二实施例中的点胶方案,仅在一组所述第一区域140A和所述第二区域150A点胶。此外,还可以在另一组所述第一区域140A和所述第二区域150A点胶,通过上防尘胶、凸起结构或者交错凸起结构以及组合使用等方法防止灰尘进入内部空间,如图17A至图17D所示。
或者,当所述阵列摄像模组采用分体式镜座时,每个所述镜头组件100的所述镜筒120和所述支撑件130之间、在每个所述镜头组件100和对应的所述镜座220组装之间、每个所述镜座2200和所述线路板230之间、以及每个感光芯片210和对应的线路板230区域之间,仍可以采用该第二实施例中的点胶方案,仅在一组所述第一区域140A和所述第二区域150A点胶,如23A图至23C图所示。
依据本发明的另一方面,本发明进一步提供一摄像模组的组装方法。所述摄像模组的组装方法可以应用于上述摄像模组300的组装,实现本发明的至少一个目的和优势。具体地,如图19所示,为所述摄像模组组装方法的流程图。
步骤410:组装一组光学镜片和一镜筒,形成一镜头。
步骤420:将一支撑件贴附于一感光组件的顶侧的预留位置。
具体地,所述步骤420还可以进一步包括步骤:通过分别在所述支撑件和所述感光组件之间的两个相对的第一区域、沿所述感光组件的镜座的两长边点胶,固定所述支撑件和所述感光组件。
或者所述步骤420还可以包括步骤:通过分别在所述支撑件和所述感光组件之间的一个所述第一区域沿所述感光组件的镜座的长边点胶,和在两者之间的一个所述第二区域沿所述感光组件的镜座的的短边点胶,固定所述支撑件和所述感光组件。
可以知道的是,所述步骤410和所述步骤420的顺序并不限定。
步骤430:通过分别在所述支撑件和所述镜筒之间的两个相对的第一区域的中间区域点胶,固定所述支撑件和所述镜筒,其中所述镜头对应于所述感光组件的感光路径。
步骤450:通过在所述支撑件和所述镜筒之间的两个相对的第二区域涂覆防尘胶,从而防止灰尘。
或者在所述步骤420之后,执行步骤440:通过分别在所述支撑件和所述镜筒之间的一组第一区域的中间区域和第二区域的中间区域点胶,固定所述支撑件和所述镜筒,其中所述镜头对应于所述感光组件的感光路径。
步骤460:通过在所述支撑件和所述镜筒之间的另一组第一区域和第二区域涂覆防尘胶,从而防止灰尘。
如图20所示,为本发明的所述摄像模组的感光组件的组装方法的流程图。
步骤510:通过分别在一感光芯片和一线路板之间的两个相对的第一区域,沿所述感光芯片的两长边点胶,通电地贴附所述感光芯片于所述线路板。
步骤520:通过分别在一镜座和所述线路板之间的两个相对的第一区,沿所述镜座的两长边点胶,固定所述镜座于所述线路板,其中所述镜座环绕所述感光芯片,具有与所述感光芯片的感光区域对应的一光窗。
如图21所示,为本发明的所述摄像模组的感光组件的另一种组装方法的流程图。
步骤610:通过分别在一感光芯片和一线路板之间的一个所述第一区域,沿所述感光芯片的长边点胶,和在两者之间的一个所述第二区域,沿所述感光芯片的短边点胶,通电地贴附所述感光芯片于所述线路板。
步骤620:通过分别一镜座和所述线路板之间的一个所述第一区域,沿所述镜座的长边点胶,和在两者之间的一个所述第二区域,沿所述镜座的短边点胶,,固定所述镜座于所述线路板,其中所述镜座环绕所述感光芯片,具有与所述感光芯片的感光区域对应的一光窗。
本领域技术人员可以知道的是,较佳实施例和第二实施例中各个元件之间的点胶位置方案可以组合或混合使用,也就说,上述步骤510和步骤620可以组合,而步骤610和步骤520可以组合,同样可以实现本发明的至少一个目的和优势。
本领域的技术人员应理解,上述描述及附图中所示的本发明的实施例只作为 举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明,在没有背离所述原理下,本发明的实施方式可以有任何变形或修改。
Claims (67)
- 一镜头组件,适于和一感光组件组装成一摄像模组,其特征在于,包括:一光学镜片组;一镜筒,其中所述光学镜片组被安装于所述镜筒内,形成一镜头;和一支撑件,其中通过在所述镜筒和所述支撑件之间的、两相对的第一区域点胶,固定所述镜筒于所述支撑件内侧,以限制两者在X方向产生偏移,其中所述第一区域与所述感光组件的一感光芯片长边区域对应。
- 根据权利要求1所述的镜头组件,其中所述支撑件和所述镜筒之间的胶水分别被涂覆于两者之间、相对的所述第一区域的中间区域。
- 根据权利要求1或2所述的镜头组件,进一步包括一防尘胶,其中所述防尘胶被涂覆于所述镜筒和所述支撑件之间的、两相对的第二区域,其中所述第二区域与所述感光组件的一感光芯片短边区域对应。
- 根据权利要求3所述的镜头组件,其中于至少两所述第二区域之一,至少一防尘槽被设置于所述支撑件的内侧壁,其中所述防尘胶被填充于所述防尘槽,其中所述防尘胶的外表面与所述镜筒的外侧壁间距预设距离,粘结所述镜筒的外侧壁和所述支撑件的内侧壁之间间隙的灰尘。
- 根据权利要求3所述的镜头组件,其中于至少两所述第二区域之一,至少一防尘槽被设置于所述镜筒的外侧壁,其中所述防尘胶被填充于位于所述外侧壁的所述防尘槽内,与所述支撑件的内侧壁间距预设距离,粘结所述镜筒的外侧壁和所述支撑件的内侧壁之间间隙的灰尘。
- 根据权利要求3所述的镜头组件,其中于至少两所述第二区域之一,所述镜筒的外侧壁和所述支撑件的内侧壁设有相互交错的且相互匹配的凸起,形成一交错凸起结构,以延长灰尘进入所述摄像模组的路径。
- 根据权利要求所述的镜头组件,进一步具有两点胶空间,其中两所述点胶空间分别形成于所述镜筒和所述支撑件之间的两相对的第一区域,且两相对的所述第二区域被封闭。
- 一镜头组件,适于和一感光组件组装成一摄像模组,其特征在于,包括:一光学镜片组;一镜筒,其中所述光学镜片组被安装于所述镜筒内,形成一镜头;和一支撑件,其中通过在所述镜筒和所述支撑件之间的、一组第一区域和第二区域点胶,固定所述镜筒于所述支撑件内侧,以限制两者产生偏移,其中所述第一区域与所述感光组件的一感光芯片长边区域对应,其中所述第二区域与所述感光组件的一感光芯片短边区域对应。
- 根据权利要求8所述的镜头组件,其中所述支撑件和所述镜筒之间的胶水分别被涂覆于一组相邻的所述第一区域的中间区域和所述第二区域的中间区域。
- 根据权利要求8或9所述的镜头组件,进一步包括一防尘胶,其中所述防尘胶被涂覆于所述镜筒和所述支撑件之间的、另一组相邻的所述第一区域和所述第二区域。
- 根据权利要求10所述的镜头组件,于至少另一组相邻的所述第一区域和所述第二区域之一,至少一防尘槽被设置于所述支撑件的内侧壁,其中所述防尘胶被填充于所述防尘槽,其中所述防尘胶的外表面与所述镜筒的外侧壁间距预设距离,粘结所述镜筒的外侧壁和所述支撑件的内侧壁之间间隙的灰尘。
- 根据权利要求8或9所述的镜头组件,其中于至少另一组相邻的所述第一区域和所述第二区域,所述镜筒的外侧壁和所述支撑件的内侧壁设有相互交错的且相互匹配的凸起,形成一交错凸起结构,以延长灰尘进入所述摄像模组的路径。
- 据权利要求8或9所述的镜头组件,进一步具有两点胶空间,其中两所述点胶空间分别形成于所述镜筒和所述支撑件之间的、一组相邻的所述第一区域和所述第二区域,且另一组相邻的所述第一区域和所述第二区域被封闭。
- 一摄像模组,其特征在于,包括:一如权利要求1至7任一所述的镜头组件;和一感光组件,其中所述感光组件包括一感光芯片、一镜座和一线路板,其中所述感光芯片电连接地贴附于所述线路板,其中所述镜座环绕所述感光芯片,并贴附于所述线路板,其中所述镜座具有一光窗,对应于所述感光芯片的感光区域,其中所述支撑件支撑所述镜头,对应于所述光窗,其中所述支撑件由所述镜座延伸。
- 根据权利要求14所述的摄像模组,其中通过在所述镜座和所述支撑件之间的、两相对的第一区域点胶,固定所述支撑件于所述镜座顶侧。
- 根据权利要求15所述的摄像模组,其中所述支撑件和所述镜座之间的胶水被分别沿所述镜座的两长边涂覆。
- 根据权利要求14所述的摄像模组,其中通过在所述镜座和所述支撑件之间的、一组相邻的所述第一区域和所述第二区域点胶,固定所述支撑件于所述镜座顶侧。
- 根据权利要求17所述的摄像模组,其中所述镜座和所述支撑件之间,位于一个所述第一区域的胶水沿所述镜座的长边涂覆,而位于相邻的所述第二区域的胶水沿所述镜座的短边涂覆。
- 根据权利要求15所述的摄像模组,进一步包括防尘胶,其中所述防尘胶被涂覆于所述镜座和所述支撑件之间的、两相对的第二区域。
- 根据权利要求17所述的摄像模组,进一步包括防尘胶,其中所述防尘胶被涂覆于所述镜座和所述支撑件之间的、另一组相邻的所述第一区域和所述第二区域。
- 根据权利要求15所述的摄像模组,其中至少一防尘凹槽和与其匹配的防尘凸起被设置于所述镜座和所述支撑件,其中所述防尘凸起被固定于所述防尘凹槽,以防止灰尘进入内部空间。
- 根据权利要求14所述的摄像模组,其中通过在所述镜座和所述线路板之间的、两相对的第一区域点胶,固定所述镜座于所述线路板。
- 根据权利要求22所述的摄像模组,其中所述镜座和所述线路板之间的胶水分别被分别沿所述镜座的两长边涂覆。
- 根据权利要求14所述的摄像模组,其中通过在所述镜座和所述线路板之间的、一组相邻的所述第一区域和所述第二区域点胶,固定所述镜座于所述线路板。
- 根据权利要求24所述的摄像模组,其中所述镜座和所述线路板之间,位于一个所述第一区域的胶水沿所述镜座的长边涂覆,而位于相邻的所述第二区域的胶水沿所述镜座的短边涂覆。
- 根据权利要求14所述的摄像模组,其中通过在所述感光芯片和所述线路板之间的、两相对的第一区域点胶,固定所述感光芯片于所述线路板顶侧。
- 根据权利要求26所述的摄像模组,其中所述感光芯片和所述线路板之间的胶水被分别沿所述感光芯片的两长边涂覆。
- 根据权利要求14所述的摄像模组,其中通过在所述感光芯片和所述线路板之间的、一组相邻的所述第一区域和所述第二区域点胶,固定所述感光芯片于所述线路板顶侧。
- 根据权利要求28所述的摄像模组,其中所述感光芯片和所述线路板之间,位于一个所述第一区域的胶水沿所述感光芯片的长边涂覆,而位于相邻的所述第二区域的胶水沿所述感光芯片的短边涂覆。
- 一摄像模组,其特征在于,包括:一如权利要求8至13任一所述的镜头组件;和一感光组件,其中所述感光组件包括一感光芯片、一镜座和一线路板,其中所述感光芯片电连接地贴附于所述线路板,其中所述镜座环绕所述感光芯片,并贴附于所述线路板,其中所述镜座具有一光窗,对应于所述感光芯片的感光区域,其中所述支撑件支撑所述镜头,对应于所述光窗,其中所述支撑件由所述镜座延伸。
- 根据权利要求30所述的摄像模组,其中通过在所述镜座和所述支撑件之间的、两相对的第一区域点胶,固定所述支撑件于所述镜座顶侧。
- 根据权利要求31所述的摄像模组,其中所述支撑件和所述镜座之间的胶水被分别沿所述镜座的两长边涂覆。
- 根据权利要求30所述的摄像模组,其中通过在所述镜座和所述支撑件之间的、一组相邻的所述第一区域和所述第二区域点胶,固定所述支撑件于所述镜座顶侧。
- 根据权利要求33所述的摄像模组,其中所述镜座和所述支撑件之间,位于一个所述第一区域的胶水沿所述镜座的长边涂覆,而位于相邻的所述第二区域的胶水沿所述镜座的短边涂覆。
- 根据权利要求31所述的摄像模组,进一步包括防尘胶,其中所述防尘胶被涂覆于所述镜座和所述支撑件之间的、两相对的第二区域。
- 根据权利要求33所述的摄像模组,进一步包括防尘胶,其中所述防尘胶被涂覆于所述镜座和所述支撑件之间的、另一组相邻的所述第一区域和所述第二区域。
- 根据权利要求31所述的摄像模组,其中至少一防尘凹槽和与其匹配的防尘凸起被设置于所述镜座和所述支撑件,其中所述防尘凸起被固定于所述防尘凹槽,以防止灰尘进入内部空间。
- 根据权利要求30所述的摄像模组,其中通过在所述镜座和所述线路板之间的、两相对的第一区域点胶,固定所述镜座于所述线路板。
- 根据权利要求38所述的摄像模组,其中所述镜座和所述线路板之间的胶水分别被分别沿所述镜座的两长边涂覆。
- 根据权利要求30所述的摄像模组,其中通过在所述镜座和所述线路板之间的、一组相邻的所述第一区域和所述第二区域点胶,固定所述镜座于所述线路板。
- 根据权利要求40所述的摄像模组,其中所述镜座和所述线路板之间,位于一个所述第一区域的胶水沿所述镜座的长边涂覆,而位于相邻的所述第二区域的胶水沿所述镜座的短边涂覆。
- 根据权利要求30所述的摄像模组,其中通过在所述感光芯片和所述线路板之间的、两相对的第一区域点胶,固定所述感光芯片于所述线路板顶侧。
- 根据权利要求42所述的摄像模组,其中所述感光芯片和所述线路板之间的胶水被分别沿所述感光芯片的两长边涂覆。
- 根据权利要求30所述的摄像模组,其中通过在所述感光芯片和所述线路板之间的、一组相邻的所述第一区域和所述第二区域点胶,固定所述感光芯片于所述线路板顶侧。
- 根据权利要求44所述的摄像模组,其中所述感光芯片和所述线路板之间,位于一个所述第一区域的胶水沿所述感光芯片的长边涂覆,而位于相邻的所述第二区域的胶水沿所述感光芯片的短边涂覆。
- 一阵列摄像模组,其特征在于,包括:至少两如权利要求1至7任一所述的镜头组件;和至少两感光芯片;一一体式镜座;和一线路板,其中所述感光芯片对应地且电连接地贴附于所述线路板,其中所述一体式镜座环绕每个所述感光芯片的周侧,并贴附于所述线路板,其中所述一体式镜座具有至少两光窗,对应于所述感光芯片的感光区域,其中所述支撑件支撑所述镜头,对应于所述光窗,其中所述支撑件由所述一体式镜座延伸。
- 一阵列摄像模组,其特征在于,包括:至少两如权利要求8至13任一所述的镜头组件;和至少两感光芯片;一一体式镜座;和一线路板,其中所述感光芯片对应地且电连接地贴附于所述线路板,其中所 述一体式镜座环绕每个所述感光芯片的周侧,并贴附于所述线路板,其中所述一体式镜座具有至少两光窗,对应于所述感光芯片的感光区域,其中所述支撑件支撑所述镜头,对应于所述光窗,其中所述支撑件由所述一体式镜座延伸。
- 一感光组件,其特征在于,包括:一感光芯片;一线路板,其中所述感光芯片电连接地贴附于所述线路板;以及一镜座,其中通过在所述线路板和所述镜座之间的、两相对的第一区域点胶,固定所述镜座于所述线路板,其中所述镜座环绕所述感光芯片的周侧,其中所述镜座具有至少一光窗,对应于所述感光芯片的感光区域,其中所述第一区域与所述感光组件的一感光芯片长边区域对应。
- 根据权利要求48所述的感光组件,其中所述镜座和所述线路板之间的胶水被分别沿所述镜座的两长边涂覆。
- 一感光组件,其特征在于,包括:一感光芯片;一线路板,其中所述感光芯片电连接地贴附于所述线路板;以及一镜座,其中通过在所述线路板和所述镜座之间的、一组相邻的所述第一区域和所述第二区域点胶,固定所述镜座于所述线路板,其中所述镜座环绕所述感光芯片的周侧,其中所述镜座具有至少一光窗,对应于所述感光芯片的感光区域,其中所述第一区域与所述感光组件的一感光芯片长边区域对应,其中所述第二区域与所述感光组件的一感光芯片短边区域对应。
- 根据权利要求50所述的感光组件,其中所述镜座和所述线路板之间的胶水,位于一个所述第一区域的胶水沿所述镜座的长边涂覆,而位于相邻的所述第二区域的胶水沿所述镜座的短边涂覆。
- 一感光组件,其特征在于,包括:一感光芯片;一线路板,其中通过在所述线路板和所述感光区域之间的、两相对的第一区域点胶,将所述感光芯片电连接地贴附于所述线路板,其中所述第一区域与所述感光组件的一感光芯片长边区域对应;以及一镜座,其中所述镜座被固定于所述线路板,其中所述镜座环绕所述感光芯片的周侧,其中所述镜座具有至少一光窗,对应于所述感光芯片的感光区域。
- 根据权利要求52所述的感光组件,其中所述感光芯片和所述线路板之间的胶水被分别沿所述感光芯片的两长边涂覆。
- 一感光组件,其特征在于,包括:一感光芯片;一线路板,其中通过在所述线路板和所述感光区域之间的、一组相邻的第一区域和第二区域点胶,将所述感光芯片电连接地贴附于所述线路板,其中所述第一区域与所述感光组件的一感光芯片长边区域对应,其中所述第二区域与所述感光组件的一感光芯片短边区域对应;以及一镜座,其中所述镜座被固定于所述线路板,其中所述镜座环绕所述感光芯片的周侧,其中所述镜座具有至少一光窗,对应于所述感光芯片的感光区域。
- 根据权利要求54所述的感光组件,其中所述感光芯片和所述线路板之间的胶水,位于一个所述第一区域的胶水沿所述感光芯片的长边涂覆,而位于相邻的所述第二区域的胶水沿所述感光芯片的短边涂覆。
- 一摄像模组的组装方法,其特征在于,包括:(a)组装一组光学镜片和一镜筒,形成一镜头;(b)将一支撑件贴附于一感光组件的顶侧的预留位置;以及(c)通过分别在所述支撑件和所述镜筒之间的两个相对的第一区域的中间区域点胶,固定所述支撑件和所述镜筒,其中所述镜头对应于所述感光组件的感光路径,其中所述第一区域与所述感光组件的一感光芯片长边区域对应。
- 根据权利要求56所述的组装方法,其中所述步骤(b)还包括:(b1)通过分别在所述支撑件和所述感光组件之间的两个相对的第一区域,沿所述感光组件的镜座的两长边点胶,固定所述支撑件和所述感光组件。
- 根据权利要求56所述的组装方法,其中所述步骤(b)还包括:(b2)通过分别在所述支撑件和所述感光组件之间的一个所述第一区域,沿所述感光组件的镜座的长边点胶,和在两者之间的一个所述第二区域,沿所述感光组件的镜座的短边点胶。
- 根据权利要求56所述的组装方法,其中所述步骤(c)还包括:(c1)通过分别在一感光芯片和一线路板之间的两个相对的第一区域,沿所述感光芯片的两长边点胶,通电地贴附所述感光芯片于所述线路板。
- 根据权利要求56或59所述的组装方法,其中所述步骤(c)还包括:(c2)通过分别在一镜座和所述线路板之间的两个相对的第一区,沿所述镜座的两长边点胶,固定所述镜座于所述线路板,其中所述镜座环绕所述感光芯片,具有与所述感光芯片的感光区域对应的一光窗。
- 根据权利要求56所述的组装方法,其中所述步骤(c)还包括:(c3)通过分别在一感光芯片和一线路板之间的一个所述第一区域,沿所述感光芯片的长边点胶,和在两者之间的一个所述第二区域,沿所述感光芯片的短边点胶,通电地贴附所述感光芯片于所述线路板。
- 根据权利要求56、59或61所述的组装方法,其中所述步骤(c)还包括:(c4)通过分别一镜座和所述线路板之间的一个所述第一区域,沿所述镜座的长边点胶,和在两者之间的一个所述第二区域,沿所述镜座的短边点胶,固定所述镜座于所述线路板,其中所述镜座环绕所述感光芯片,具有与所述感光芯片的感光区域对应的一光窗。
- 根据权利要求56所述的组装方法,进一步包括步骤:(d)通过在所述支撑件和所述镜筒之间的两个相对的第二区域涂覆防尘胶,从而防止灰尘,其中所述第二区域与所述感光组件的一感光芯片短边区域对应。
- 一摄像模组的组装方法,其特征在于,包括:(A)组装一组光学镜片和一镜筒,形成一镜头;(B)将一支撑件贴附于一感光组件的顶侧的预留位置;以及(C)通过分别在所述支撑件和所述镜筒之间、一组第一区域的中间区域和第二区域的中间区域点胶,固定所述支撑件和所述镜筒,其中所述镜头对应于所述感光组件的感光路径,其中所述第一区域与所述感光组件的一感光芯片长边区域对应。
- 根据权利要求64所述的组装方法,还包括步骤:(D)通过在所述支撑件和所述镜筒之间的另一组第一区域和第二区域涂覆防尘胶,从而防止灰尘。
- 一阵列摄像模组,其特征在于,包括:至少两如权利要求1至7任一所述的镜头组件;和至少两感光芯片;至少两镜座;和一线路板,其中所述感光芯片对应地且电连接地贴附于所述线路板,其中每个所述镜座环绕对应的所述感光芯片的周侧,并贴附于所述线路板,其中所述镜座具有一光窗,对应于所述感光芯片的感光区域,其中所述支撑件支撑所述镜头,对应于所述光窗,其中所述支撑件由对应的所述镜座延伸。
- 一阵列摄像模组,其特征在于,包括:至少两如权利要求8至13任一所述的镜头组件;和至少两感光芯片;至少两镜座;和一线路板,其中所述感光芯片对应地且电连接地贴附于所述线路板,其中每个所述镜座环绕对应的所述感光芯片的周侧,并贴附于所述线路板,其中所述镜座具有一光窗,对应于所述感光芯片的感光区域,其中所述支撑件支撑所述镜头,对应于所述光窗,其中所述支撑件由对应的所述镜座延伸。
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811616407.1A CN111385442B (zh) | 2018-12-28 | 2018-12-28 | 镜头组件、感光组件和摄像模组及其组装方法 |
| CN201822222747.8 | 2018-12-28 | ||
| CN201822222747.8U CN209881885U (zh) | 2018-12-28 | 2018-12-28 | 镜头组件、感光组件和摄像模组 |
| CN201811616407.1 | 2018-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2020134469A1 true WO2020134469A1 (zh) | 2020-07-02 |
Family
ID=71127597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2019/113352 Ceased WO2020134469A1 (zh) | 2018-12-28 | 2019-10-25 | 镜头组件、感光组件和摄像模组及其组装方法 |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2020134469A1 (zh) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201410011A (zh) * | 2012-08-28 | 2014-03-01 | Hon Hai Prec Ind Co Ltd | 鏡頭模組 |
| US20160021283A1 (en) * | 2014-07-18 | 2016-01-21 | Primax Electronics Ltd. | Method for cleaning off particles within camera module and camera module |
| CN206136070U (zh) * | 2016-05-11 | 2017-04-26 | 宁波舜宇光电信息有限公司 | 具有粘结结构的摄像模组 |
| CN206725921U (zh) * | 2016-10-14 | 2017-12-08 | 宁波舜宇光电信息有限公司 | 基于一体封装工艺的阵列摄像模组 |
| CN107544108A (zh) * | 2016-06-23 | 2018-01-05 | 宁波舜宇光电信息有限公司 | 滤光元件和摄像模组及其制造方法和应用 |
| CN107547777A (zh) * | 2016-06-23 | 2018-01-05 | 宁波舜宇光电信息有限公司 | 定焦摄像模组及其制造方法 |
| CN207528997U (zh) * | 2017-10-25 | 2018-06-22 | 瑞声科技(新加坡)有限公司 | 镜头模组及电子设备 |
| CN108267826A (zh) * | 2017-01-04 | 2018-07-10 | 宁波舜宇光电信息有限公司 | 摄像模组 |
| CN207820032U (zh) * | 2017-10-13 | 2018-09-04 | 宁波舜宇光电信息有限公司 | 摄像模组和感光组件及电子设备 |
| CN108933127A (zh) * | 2017-05-22 | 2018-12-04 | 海华科技股份有限公司 | 可携式电子装置及其影像获取模块与承载组件 |
-
2019
- 2019-10-25 WO PCT/CN2019/113352 patent/WO2020134469A1/zh not_active Ceased
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201410011A (zh) * | 2012-08-28 | 2014-03-01 | Hon Hai Prec Ind Co Ltd | 鏡頭模組 |
| US20160021283A1 (en) * | 2014-07-18 | 2016-01-21 | Primax Electronics Ltd. | Method for cleaning off particles within camera module and camera module |
| CN206136070U (zh) * | 2016-05-11 | 2017-04-26 | 宁波舜宇光电信息有限公司 | 具有粘结结构的摄像模组 |
| CN107544108A (zh) * | 2016-06-23 | 2018-01-05 | 宁波舜宇光电信息有限公司 | 滤光元件和摄像模组及其制造方法和应用 |
| CN107547777A (zh) * | 2016-06-23 | 2018-01-05 | 宁波舜宇光电信息有限公司 | 定焦摄像模组及其制造方法 |
| CN206725921U (zh) * | 2016-10-14 | 2017-12-08 | 宁波舜宇光电信息有限公司 | 基于一体封装工艺的阵列摄像模组 |
| CN108267826A (zh) * | 2017-01-04 | 2018-07-10 | 宁波舜宇光电信息有限公司 | 摄像模组 |
| CN108933127A (zh) * | 2017-05-22 | 2018-12-04 | 海华科技股份有限公司 | 可携式电子装置及其影像获取模块与承载组件 |
| CN207820032U (zh) * | 2017-10-13 | 2018-09-04 | 宁波舜宇光电信息有限公司 | 摄像模组和感光组件及电子设备 |
| CN207528997U (zh) * | 2017-10-25 | 2018-06-22 | 瑞声科技(新加坡)有限公司 | 镜头模组及电子设备 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102292096B1 (ko) | 광학 렌즈 헤드, 촬상 모듈 및 이들의 조립 방법 | |
| CN101536488B (zh) | 摄像装置及其制造方法及便携式电话装置 | |
| US20210116610A1 (en) | Camera module including liquid lens, optical device including the same, and method of manufacturing camera module including liquid lens | |
| CN110032024B (zh) | 光学致动器及相应的摄像模组和摄像模组阵列 | |
| US11733477B2 (en) | Optical actuator, and corresponding camera module and camera module array | |
| US20230358996A1 (en) | Lens assembly, camera module, and optical device | |
| US11463568B2 (en) | Camera module and electronic device | |
| KR102431380B1 (ko) | 광학 모듈에 이용되는 용접 구조 및 이의 응용 | |
| WO2021135186A1 (zh) | 棱镜马达及成像系统 | |
| CN113009749B (zh) | 光学组件、潜望式摄像模组和电子设备 | |
| CN107820576A (zh) | 双相机模块及光学装置 | |
| CN114185155B (zh) | 多群组镜头、摄像模组及电子设备 | |
| US20220163750A1 (en) | Lens structure and method for assembling same, and camera module | |
| CN214756582U (zh) | 光学镜头及摄像模组 | |
| CN114879430A (zh) | 基于一体封装工艺的摄像模组和阵列摄像模组 | |
| CN209881885U (zh) | 镜头组件、感光组件和摄像模组 | |
| CN111385442B (zh) | 镜头组件、感光组件和摄像模组及其组装方法 | |
| CN112311968B (zh) | 感光组件和摄像模组及其制造方法和电子设备 | |
| US12164215B2 (en) | Reflective module and camera module comprising same | |
| US10200578B2 (en) | Camera device and electronic device with the same | |
| WO2020134469A1 (zh) | 镜头组件、感光组件和摄像模组及其组装方法 | |
| EP3851882B1 (en) | Optical lens, camera module, method for assembling same, and corresponding terminal device | |
| US20100045846A1 (en) | Image pickup device, method of manufacturing the same, and mobile terminal device | |
| CN114390161B (zh) | 摄像头模组及电子设备 | |
| CN211123444U (zh) | 棱镜马达及成像系统 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 19902212 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 19902212 Country of ref document: EP Kind code of ref document: A1 |