WO2020134336A1

WO2020134336A1 - Millimeter-wave/terahertz-wave imaging apparatus, and inspection method for body or object

Info

Publication number: WO2020134336A1
Application number: PCT/CN2019/110406
Authority: WO
Inventors: 赵自然; 游�燕; 金颖康; 解欢; 乔灵博; 刘文国; 马旭明; 温建国
Original assignee: 清华大学; 同方威视技术股份有限公司
Priority date: 2018-12-29
Filing date: 2019-10-10
Publication date: 2020-07-02

Abstract

A millimeter-wave/terahertz-wave imaging apparatus (100), and an inspection method for a body or an object. The imaging apparatus comprises: a quasioptical assembly comprising a rotating polygon mirror (1") and a fourth reflector (7), wherein the rotating polygon mirror (1") is capable of rotating about a rotating axis (o) thereof, such that multiple reflectors on the rotating polygon mirror (1") alternately serve as a first reflector (1A) and receive and reflect a millimeter-wave/terahertz-wave beam from a first object under inspection (31A), and another reflector of the multiple reflectors that is adjacent to the first reflector (1A) serves as a second reflector (1B) and receives and reflects a millimeter-wave/terahertz-wave beam from a second object under inspection (31B); and a chopper (8) configured to only allow either a beam from the first reflector (1A) or a beam reflected by the fourth reflector (7) from the second reflector (1B) to be incident on a detector array (2), the chopper (8) rotating around a center axis (81) thereof, such that the detector array (2) alternately receives a beam from the first reflector (1A) or from the second reflector (1B). The apparatus achieves simultaneous imaging of two objects under inspection, thereby achieving high inspection efficiency, and a high detector utilization rate.

Description

Millimeter wave/terahertz wave imaging equipment and method for detecting human body or objects

Cross-reference of related applications

This application claims the priority of Chinese patent applications No. 201811654160.2, No. 201811654162.1 and No. 201811654159.X filed in the China Patent Office on December 29, 2018, the entire contents of which are hereby incorporated by reference.

Technical field

The present disclosure relates to the technical field of security inspection, in particular to a millimeter wave/terahertz wave imaging device and a method for detecting a human body or an article using the millimeter wave/terahertz wave imaging device.

Background technique

The human body security technology based on millimeter wave/terahertz wave has unique advantages. It can detect the human body by detecting the millimeter wave/terahertz wave radiation of the target itself to perform security inspection (without active radiation), and use the millimeter wave/terahertz wave The penetrating ability enables detection of hidden dangers. However, the existing millimeter wave/terahertz wave imaging equipment has low working efficiency.

Summary of the invention

The purpose of the present disclosure is to solve at least one aspect of the above-mentioned problems and defects existing in the prior art.

According to an embodiment of one aspect of the present disclosure, a millimeter wave/terahertz wave imaging device is provided, including a quasi-optical component, a millimeter wave/terahertz wave detector array, and a chopper,

The quasi-optical assembly includes:

A V-shaped reflecting plate, the V-shaped reflecting plate includes a first reflecting plate and a second reflecting plate, the V-shaped reflecting plate can swing about its swing axis, so that the first reflecting plate receives and reflects from the first The part of the object under inspection located at different positions in the first field of view spontaneously radiates or reflects the millimeter wave/terahertz waves, and the second reflecting plate respectively receives and reflects the parts of the second object under inspection at different positions in the second field of view Spontaneously radiated or reflected millimeter waves/terahertz waves; and

A fourth reflecting plate adapted to reflect the millimeter wave/terahertz wave from the second reflecting plate onto the chopper;

The chopper is located on the reflection wave path of the first reflection plate and the reflection wave path of the fourth reflection plate, and the chopper is configured to only receive millimeter waves from the first reflection plate at any time/ The terahertz wave or only the millimeter wave/terahertz wave from the fourth reflecting plate is reflected or transmitted to the millimeter wave/terahertz wave detector array, and the chopper is rotated about its central axis to cause the The millimeter wave/terahertz waves of the first reflector and the fourth reflector are alternately received by the millimeter wave/terahertz wave detector array; and

The millimeter wave/terahertz wave detector array is suitable for receiving beams from the quasi-optical assembly.

According to an embodiment of another aspect of the present disclosure, there is also provided a method for detecting a human body or an article using the above millimeter wave/terahertz wave imaging device, including the following steps:

S1: Drive the V-shaped reflecting plate to swing, so that the first reflecting plate respectively receives and reflects beams from portions of the first inspected object at different positions in the first field of view, and the second reflecting plate respectively receives and reflects the second inspected object Beams located at different positions in the second field of view; during the swinging of the V-shaped reflector, the chopper rotates about its central axis to make the millimeter wave/terahertz wave and the first from the first reflector The millimeter wave/terahertz waves from the second reflector reflected by the four reflectors are alternately received by the millimeter wave/terahertz wave detector array;

S2: Send the image data about the first object and the image data about the second object received by the millimeter wave/terahertz wave detector array to the data processing device; and

S3: Reconstruct the image data of the first object and the image data of the second object using the data processing device to generate the first object and the second object Millimeter wave/terahertz wave image.

According to an embodiment of another aspect of the present disclosure, a millimeter wave/terahertz wave imaging device is provided, including:

The quasi-optical assembly includes a Y-shaped reflecting plate including a first reflecting plate, a second reflecting plate, and a third reflecting plate, and the Y-shaped reflecting plate can rotate about its rotation axis so that the first The first reflecting surface of the reflecting plate, the first reflecting surface of the second reflecting plate and the first reflecting surface of the third reflecting plate are alternately used as the first working surface to receive and reflect that the first object to be inspected is located in a different first field of view The part of the position is spontaneously radiated or reflected back from the millimeter wave/terahertz wave; and

The millimeter wave/terahertz wave detector array is suitable for receiving the beam from the quasi-optical component.

According to an embodiment of yet another aspect of the present disclosure, there is also provided a method for detecting a human body or an object using the millimeter wave/terahertz wave imaging device, including the following steps:

S1: driving the Y-shaped reflecting plate to rotate, so that the first reflecting surface of the first reflecting plate, the first reflecting surface of the second reflecting plate, and the first reflecting surface of the third reflecting plate are alternately used as the first working surface to receive and reflect Millimeter wave/terahertz wave spontaneously radiated or reflected by the first object to be examined; passing through the second reflecting surface of the first reflecting plate, the second reflecting surface of the second reflecting plate, and the second reflecting surface of the third reflecting plate Take turns to be used as the second working surface to receive and reflect the spontaneously radiated or reflected millimeter wave/terahertz wave of the second test object; while the Y-shaped reflecting plate rotates, the chopper rotates around its central axis to alternately The millimeter wave/terahertz wave from the first working surface and the millimeter wave/terahertz wave from the second working surface reflected by the fifth reflecting plate are received by the millimeter wave/terahertz wave detector array ;

S2: Send the image data about the first object and about the second object received by the millimeter wave/terahertz wave detector array to the data processing device; and

According to an embodiment of yet another aspect of the present disclosure, a millimeter wave/terahertz wave imaging device is provided, including a quasi-optical component, a millimeter wave/terahertz wave detector array, and a chopper,

The quasi-optical assembly includes:

A polyhedral rotating mirror, each side surface of the polyhedral rotating mirror is respectively provided with a reflecting plate, the polyhedral rotating mirror can rotate around its rotation axis, so that the multiple reflecting plates are used in turn as the first working plate to receive and reflect the first A part of the millimeter wave/terahertz wave beam that is spontaneously radiated or reflected back from the detected object at different positions in the first field of view; another reflective plate adjacent to the first working plate among the multiple reflective plates is used as The second working board to receive and reflect the partly spontaneously radiated or reflected millimeter wave/terahertz wave beams of the second object at different positions in the second field of view; and

A seventh reflecting plate adapted to reflect the millimeter wave/terahertz wave from the second working plate onto the chopper;

The chopper is located on the reflected wave path of the first working plate and the reflected wave path of the seventh reflecting plate, and the chopper is configured to only receive millimeter waves from the first working plate at any time/ The terahertz wave or only the millimeter wave/terahertz wave from the seventh reflecting plate is reflected or transmitted to the millimeter wave/terahertz wave detector array, and the chopper is rotated about its central axis to cause the The millimeter wave/terahertz waves of the first working plate and the seventh reflecting plate are alternately received by the millimeter wave/terahertz wave detector array; and

S1: driving the rotating mirror of the polyhedron to make the multiple reflecting plates alternately serve as the first working plate to receive and reflect the spontaneously radiated or reflected millimeter wave/terahertz of the part of the first object at different positions in the first field of view Wave beam; another reflecting plate adjacent to the first working plate among the plurality of reflecting plates is used as a second working plate to receive and reflect the part of the second inspected object located at a different position in the second field of view spontaneously The millimeter wave/terahertz wave radiated or reflected back; during the rotation of the polygon mirror, the chopper rotates about its central axis to make the millimeter wave/terahertz wave and the seventh from the first working plate The millimeter wave/terahertz wave reflected from the second working plate reflected by the reflecting plate are alternately received by the millimeter wave/terahertz wave detector array;

BRIEF DESCRIPTION

FIG. 1 is a schematic structural diagram of a millimeter wave/terahertz wave imaging device according to an embodiment of the present disclosure;

2 is a schematic structural view of a millimeter wave/terahertz wave imaging device according to another embodiment of the present disclosure after the housing is removed;

3 is a schematic view of the installation of a V-shaped reflecting plate of a millimeter wave/terahertz wave imaging device according to an exemplary embodiment of the present disclosure;

4 is a side view of the V-shaped reflector shown in FIG. 3;

5 is a schematic structural view of an exemplary embodiment of a chopper of a millimeter wave/terahertz wave imaging device according to the present disclosure;

6 is a schematic structural view of another exemplary embodiment of the chopper of the millimeter wave/terahertz wave imaging device according to the present disclosure;

7 is a schematic structural view of still another exemplary embodiment of the chopper of the millimeter wave/terahertz wave imaging device according to the present disclosure;

8 is a schematic structural view of still another exemplary embodiment of the chopper of the millimeter wave/terahertz wave imaging device according to the present disclosure;

9 is a schematic diagram of lens imaging;

10 is a flowchart of a method for inspecting a human body or an article by a millimeter wave/terahertz wave imaging device according to an embodiment of the present disclosure; and

FIG. 11 is an application scenario diagram of a millimeter wave/terahertz wave imaging device according to an embodiment of the present disclosure.

12 is a schematic structural view of a millimeter wave/terahertz wave imaging device according to an embodiment of the present disclosure;

13 is a schematic structural view of a millimeter wave/terahertz wave imaging device according to another embodiment of the present disclosure after the housing is removed;

14 is a schematic view of the installation of the Y-shaped reflection plate of the millimeter wave/terahertz wave imaging device according to an exemplary embodiment of the present disclosure;

15 is a side view of the Y-shaped reflector shown in FIG. 14;

16 is a schematic diagram of the angle between each reflection plate and the rotation axis of the polygon mirror according to another embodiment of the present disclosure;

17 is a schematic structural view of a millimeter wave/terahertz wave imaging device according to yet another embodiment of the present disclosure;

18 is a schematic structural view of a millimeter wave/terahertz wave imaging device according to yet another embodiment of the present disclosure;

19 is a schematic diagram of the total pixels of the millimeter wave/terahertz wave imaging device, the scanning pixels of each reflecting plate, and the sparsely arranged millimeter wave/terahertz wave detector arrays according to an embodiment of the present disclosure;

20 is a flowchart of a method for inspecting a human body or an article by a millimeter wave/terahertz wave imaging device according to an embodiment of the present disclosure;

21 is a schematic structural diagram of a millimeter wave/terahertz wave imaging device according to an embodiment of the present disclosure;

22 is a schematic structural view of a millimeter wave/terahertz wave imaging device according to another embodiment of the present disclosure after the housing is removed;

23 is a front view of a polygon mirror of a millimeter wave/terahertz wave imaging device according to an exemplary embodiment of the present disclosure;

24 is a side view of the polygon mirror shown in FIG. 23;

FIG. 25 is a schematic diagram of the angle between each reflection plate and the rotation axis of the polygon mirror according to another embodiment of the present disclosure; and

FIG. 26 is a flowchart of a method for inspecting a human body or an article by a millimeter wave/terahertz wave imaging device according to an embodiment of the present disclosure.

detailed description

Although the present disclosure will be fully described with reference to the drawings containing preferred embodiments of the present disclosure, it should be understood by those of ordinary skill in the art before this description that the disclosure described herein can be modified while obtaining the technical effects of the present disclosure. Therefore, it should be understood that the above description is a broad disclosure for those of ordinary skill in the art, and its content is not intended to limit the exemplary embodiments described in the present disclosure.

In addition, in the following detailed description, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present disclosure. Obviously, however, one or more embodiments can be implemented without these specific details. In other cases, well-known structures and devices are shown in diagrammatic form to simplify the drawings.

FIG. 1 schematically shows a millimeter wave/terahertz wave imaging apparatus 100 according to an exemplary embodiment of the present disclosure. As shown in the figure, the millimeter wave/terahertz wave imaging device 100 includes a quasi-optical component, a millimeter wave/terahertz wave detector array 2 and a chopper 8, wherein the quasi-optical component includes a V-shaped reflecting plate 1, a V-shaped The reflecting plate 1 includes a first reflecting plate 1A and a second reflecting plate 1B connected to the first reflecting plate 1A. The first reflecting plate 1A is suitable for millimeter waves/terahertz waves that spontaneously radiate or reflect back the first subject 31A For reflection, the second reflecting plate 1B is suitable for reflecting the millimeter wave/terahertz wave spontaneously radiated or reflected by the second object 31B, and the V-shaped reflecting plate 1 can swing around the rotation axis o to make the first reflecting plate 1A Receiving and reflecting beams from portions of the first subject 31A located at different vertical positions in the first field of view 3A, respectively, and second reflecting plate 1B respectively receiving and reflecting second subjects 31B located at different vertical positions in the second field of view 3B In the beam of the straight position, the rotation axis o is located at the junction of the first reflector 1A and the second reflector 1B. The quasi-optical assembly further includes a fourth reflecting plate 7 adapted to reflect the beam reflected by the second reflecting plate 1B onto the chopper 8. The quasi-optical element further includes a first focusing lens 4A and a second focusing lens 4B, the first focusing lens 4A is suitable for condensing the beam from the first reflecting plate 1A, and the second focusing lens 4B is suitable for condensing the second reflecting plate 1B Beam. The chopper 8 is located on the reflection wave path of the first reflection plate 1A and the reflection wave path of the fourth reflection plate 7 and is configured to millimeter wave only from the first reflection plate 1A or only from the fourth reflection plate 7 at any time The terahertz wave is reflected to the millimeter wave/terahertz wave detector array 2, and the chopper 8 can be rotated about its central axis 81 to alternate the millimeter wave/terahertz wave from the first reflection plate 1A and the fourth reflection plate 7 Received by the millimeter wave/terahertz wave detector array 2. The millimeter-wave/terahertz wave detector array 2 is suitable for receiving beams reflected and condensed from quasi-optical components; the number of detectors in the millimeter-wave/terahertz wave detector array 2 depends on the required field of

view

3A, 3B The size and required resolution are determined. The arrangement direction is perpendicular to the normal of the field of view and parallel to the horizontal plane. The size of the detector is determined according to the wavelength, processing technology and required sampling density.

According to the millimeter wave/terahertz wave imaging apparatus 100 of the embodiment of the present disclosure, the first field of view 3A is completed by driving the V-shaped reflecting plate 1 to swing around the connection between the first reflecting plate 1A and the second reflecting plate 1B For data collection with the second field of view 3B, during the swinging of the V-shaped reflecting plate 1, the millimeter wave/terahertz wave from the first field of view 3A and the second field of view 3B are alternately switched to the chopper 8 The same millimeter wave/terahertz wave detector array 2, so as to realize the imaging of the two

objects

31A, 31B located in the two fields of

view

3A, 3B, while reducing the number of millimeter wave/terahertz wave detectors , To reduce equipment costs, and occupy a small space.

In this embodiment, the focusing lens 4 includes a first focusing lens 4A and a second focusing lens 4B, the first focusing lens 4A is located between the first reflecting plate 1A and the chopper 8 and the second focusing lens 4B is located at the second reflection Between the plate 1B and the fourth reflective plate 7, the focal lengths of the two focusing

lenses

4A and 4B are f1 and f2, respectively, and the sizes of f1 and f2 may be the same or different. Since the chopper 8 is placed in the wave path after being focused by the focusing

lenses

4A, 4B, the size of the blade 82 of the chopper 8 can be smaller. In this case, the specific size of the blade 82 of the chopper 8 is After focusing by the focusing

lenses

4A and 4B, the beam spot size at the place where the chopper 8 is pre-placed is determined. Assuming that the beam spot radius at the place where the chopper 8 is pre-placed after focusing by the focusing

lenses

4A and 4B is w _cut , then the size (area) of the blade 82 of the chopper 8 is selected as

It should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, as shown in FIG. 2, a focusing lens 4 may also be used. The focusing lens 4 is located in the chopper 8 and the millimeter wave/ Between the terahertz wave detector array 2. In this case, since the chopper 8 is placed in the unfocused wave path, the size of its blade 82 should match the reflecting surface of the V-shaped reflecting plate 1.

In the exemplary embodiment shown in FIGS. 1 and 2, the millimeter wave/terahertz wave imaging device 100 further includes a wave absorbing material 9, which is suitable for absorbing the reflection from the first reflected by the chopper 8. The millimeter wave/terahertz wave of the reflection plate 1A, and the millimeter wave/terahertz wave from the fourth reflection plate 7 transmitted through the chopper 8.

In the exemplary embodiment shown in FIGS. 1 and 2, the angle θ between the non-reflective surface of the first reflective plate 1A and the non-reflective surface of the second reflective plate 1B is 90°, that is, the The angle between the reflecting surface and the reflecting surface of the second reflecting plate 1B is 270°. It should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, the angle between the reflective surface of the first reflective plate 1A and the reflective surface of the second reflective plate 1B may also be other values, For example, in the range of 240° to 300°.

In the exemplary embodiments shown in FIG. 1 and FIG. 2, the first reflective plate 1A and the second reflective plate 1B are rectangular, and their lengths and widths should match the corresponding focusing

lenses

4A, 4B. In general, the first The widths of the first reflecting plate 1A and the second reflecting plate 1B are greater than or equal to the diameters of the corresponding focusing

lenses

4A and 4B, and the lengths of the first reflecting plate 1A and the second reflecting plate 1B should be their widths

Times, the diameter of the focusing

lenses

4A, 4B may be, for example, 3 cm-50 cm.

As shown in FIG. 1, in an exemplary embodiment, the millimeter wave/terahertz wave imaging device 100 further includes a housing 6, and the quasi-optical component and the millimeter wave/terahertz wave detector array 2 are located in the housing 6 The opposite side walls of the housing 6 are respectively provided with a first window 61A through which the millimeter wave/terahertz wave of the spontaneous radiation of the first subject 31A passes and a millimeter wave/terabyte of spontaneous radiation of the second subject 31B The second window 61B through which the Hertz wave passes.

As shown in FIGS. 3 and 4, in an exemplary embodiment, a rotating shaft 11 is provided at the connection between the first reflecting plate 1A and the second reflecting plate 1B, and both ends of the rotating shaft 11 are connected to the housing via

bearings

10A, 10B 6 is rotatably connected so that the V-shaped reflecting plate 1 can swing, so that the first reflecting plate 1A and the second reflecting plate 1B are respectively directed to the portions located at different vertical positions of the field of

view

3A, 3B from the inspected objects 31A, 31B Beams are reflected.

As shown in FIGS. 3 and 4, in an exemplary embodiment, the millimeter wave/terahertz wave imaging apparatus 100 further includes a first driving device 13 suitable for driving the V-shaped reflector to swing, such as a servo motor.

As shown in FIGS. 3 and 4, in an exemplary embodiment, the millimeter wave/terahertz wave imaging device 100 further includes an angular displacement measurement mechanism 12 that detects the angular displacement of the V-shaped reflector 1 in real time, such as a photoelectric code In order to accurately calculate the posture of the V-shaped reflector 1, this can reduce the difficulty of developing control algorithms and imaging algorithms to a considerable extent.

5 to 8 respectively show schematic structural diagrams of several choppers. The chopper 8 includes at least one blade, such as 1, 2, 3, and 4, etc., and a plurality of blades 82 are equally spaced around the center The axis 81 is provided. During the rotation of the chopper 8 around its central axis 81, at any moment when the millimeter wave/terahertz wave from the first reflector 1A is incident on the blade 82 of the chopper 8, the blade 82 will come from the first The millimeter wave/terahertz wave of the reflecting plate 1A is reflected to the wave absorbing material 9 to be absorbed by the wave absorbing material 9 while reflecting the millimeter wave/terahertz wave from the fourth reflecting plate 7 to the millimeter wave/terahertz wave detector Array 2. As the chopper 8 rotates about its central axis 81, at the next moment, the millimeter wave/terahertz wave from the first reflection plate 1A is incident on the portion of the chopper 8 where the blade 82 is not provided (ie, the empty portion) In order to transmit to the millimeter wave/terahertz wave detector array 2, the chopper 8 is not provided with the blade 82 part while transmitting the millimeter wave/terahertz wave from the fourth reflector 7 to the wave absorbing material 9, Absorbed by the absorbing material 9 and cycled in turn.

It should be noted that the chopper 8 can also be replaced by other devices that can quickly switch to a high reflection and high transmission state.

In the exemplary embodiment shown in FIGS. 1 and 2, the chopper 8 is placed at an angle of 45 degrees to the wave path from the first reflection plate 1A and the wave path from the fourth reflection plate 7. It should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, the chopper 8 and the wave path from the first reflection plate 1A and the wave path from the fourth reflection plate 7 may also have other angles place.

In an exemplary embodiment not shown, the millimeter wave/terahertz wave imaging device 100 further includes a second driving device suitable for driving the chopper 8 to rotate, such as a servo motor, to drive the chopper 8 around The central axis 81 rotates at a high speed, and the rotation period of the chopper 8 should match the scanning period of the V-shaped reflecting plate 1, so that the millimeter wave/terahertz wave imaging device 100 can simultaneously view two fields of

view

3A, 3B The two detected objects are imaged separately. Preferably, the rotation period of the chopper 8 is 1/1000-1/2 of the scanning period of the V-shaped reflecting plate 1.

In this embodiment, the static field of view of the detector is a horizontal field of view. Assuming that the number of detectors is N, when the center distance between two adjacent detectors is d, the maximum offset distance of the detector is y _m , then

From this, the static field of view of the millimeter wave/terahertz wave detector array 2 can be calculated as H ₀ . As shown in FIG. 9, the static field of view H _{0 of the} millimeter wave/terahertz wave detector array 2 and the object distance L ₁ and the image distance L ₂ need to satisfy the following relationship

The V-shaped reflector 1 swings around its rotation axis o. The swing angle is determined by the height of the field of view. Assuming that the maximum swing angle of the

reflectors

1A and 1B is θ _rot , the corresponding scanning field angle is θ _m = 2θ _rot .

The number of times N _v required for the first reflection plate 1A (the second reflection plate 1B) to complete the reflection of the vertical range of the field of view where the corresponding object 31A (31B) is located is calculated by the following formula:

In the formula, [] means round up;

L is the distance from the center of the field of view 3A (3B) to the center of the first reflector 1A (second reflector 1B);

δ represents the object-side resolution;

θ _m is the angle of the field of view corresponding to the vertical field of view H.

The V-shaped reflecting plate 1 swings one cycle to complete the collection of two images for each field of view, that is, the first reflecting plate 1A (the second reflecting plate 1B) collects data both during the upward and downward swings.

The sampling density in the height direction depends on the dwell time of the beam. The reflector 1 swings for half a period (that is, swings from the maximum angle to the minimum angle, or vice versa), and each field outputs an image. Assuming that the angular resolution of the detector is θ _res , the number of 3dB beams included in the half-cycle of the reflector 1 swing is

n＝360°/θ _res (4)

Assuming that the imaging rate requirement is mHz, the average dwell time τ _d of each sampling beam in the height direction is

Taking the imaging distance system at 3000 mm, the angular resolution θ _res =0.57°, the object-side resolution is δ=30 mm, and the imaging rate is 10 Hz. For example, the number of acquisition steps in the height direction is about 67, and each beam is averaged. The dwell time is τ _d =125 ms/632=198 μs. The first driving device 13 controls the V-shaped reflecting plate to swing, and its frequency is 5 Hz.

In an exemplary embodiment, a millimeter wave/terahertz wave imaging device 100 operating at a center frequency of 94 GHz, the number of detectors N=30, arranged in a row, the center distance of the detectors d=7 mm, the detectors array length 2y _m = 21cm. The object distance L ₁ = 3.5 m and the image distance L ₂ = 0.7 m, and the static field of view H ₀ = 105 cm can be calculated according to formula (2). Assuming that the size of the imaging area in the height direction is 1.8 m, the scan angle in the height direction for reconstructing the image is θ _m =34°.

In another exemplary embodiment, a millimeter wave/terahertz wave imaging device 100 operating at a center frequency of 220 GHz, the number of detectors N=48, arranged in a row, d=3 mm between the centers of the detectors, the detectors The array length is 2y _m = 14.4 cm. The object distance L ₁ = 5 m and the image distance L ₂ = 0.7 m, and the static field of view H ₀ = 103 cm can be calculated according to formula (2). Assuming that the size of the imaging area in the height direction is 1.8 m, the scan angle in the height direction for reconstructing the image is θ _m =20°.

In an exemplary embodiment, the millimeter wave/terahertz wave imaging apparatus 100 further includes data processing means (not shown). The data processing device is wirelessly or wiredly connected to the millimeter wave/terahertz wave detector array 2 to respectively receive the first object 31A and the second object detected by the millimeter wave/terahertz wave detector array 2 31B image data.

In an exemplary embodiment, the imaging apparatus may further include a display device connected to the data processing device for receiving and displaying millimeter wave/terahertz wave images from the data processing device.

As shown in FIG. 1, in an exemplary embodiment, the millimeter wave/terahertz wave imaging device 100 further includes a calibration source 5, which is located in the housing 6 and on the object surface of the quasi-optical assembly, So that when the first reflection plate 1A (second reflection plate 1B) rotates to the calibration area, the calibration data about the calibration source 5 is received by the millimeter wave/terahertz wave detector array 2, and the data processing device receives the millimeter wave/terahertz The calibration data about the calibration source 5 received by the wave detector array 2 and update the image data of the first subject 31A and the second subject 31B based on the calibration data in real time. Since the calibration source 5 is packaged inside the housing 1, the millimeter wave/terahertz wave imaging device 100 is more stable and reliable than using remote air for calibration.

In this embodiment, the calibration source 5 is located obliquely above the V-shaped reflector. It should be noted that the position of the calibration source 5 only needs to allow the millimeter wave/terahertz wave detector array 2 to receive the calibration data about the calibration source 5 and be The image data of the inspection objects 31A and 31B need not interfere with each other. The beam radiated by the calibration source 5 is reflected by the first reflection plate 1A and/or the second reflection plate 1B to the millimeter wave/terahertz wave detector array 2, which can be achieved The calibration of the complete receiving channel including the focusing lens 4 and the detector further ensures the consistency of the channel.

In the exemplary embodiment shown in FIGS. 1 and 2, the rotation axis o of the V-shaped reflecting plate 1 is horizontally arranged so that the first reflecting plate 1A and the second reflecting plate 1B are from the corresponding objects to be inspected 31A, 31B. The beams located in different vertical positions of the field of view are reflected. It should be noted that those skilled in the art should understand that, in some other embodiments of the present disclosure, the rotation axis o of the V-shaped reflector 1 may also be vertically arranged, so that the first reflector 1A and the second reflector 1B reflects the beams from the parts of the

corresponding objects

31A and 31B at different horizontal positions in the field of view. In addition, the calibration source 5 may be a absorbing material with an emissivity close to 1 such as plastic or foam, or a black body or semiconductor refrigerator or the like.

According to the Nyquist sampling law, at least two sampling points within a half-power beam width can fully restore the image. The arrangement direction of the millimeter wave/terahertz wave detector array 2 in this embodiment is perpendicular to the normal of the field of view and parallel to the horizontal plane to sample the field of view in the height direction. The millimeter wave/terahertz wave detector array 2 The arrangement density determines the sampling density. The image formed by the millimeter-wave imaging system is actually a grayscale image. When the spatial sampling rate does not meet the Nyquist sampling requirement (undersampling), the target scene can still be imaged, but the imaging effect is relatively poor. In order to make up for the lack of pixels caused by undersampling, an interpolation algorithm can be used to increase the data density during later signal processing.

As shown in FIG. 1, in an exemplary embodiment, the length direction of the calibration source 5 is parallel to the rotation axis 11 of the V-shaped reflector, and the length of the calibration source 5 is greater than or equal to the millimeter wave/terahertz wave detector array 2 in parallel For the size of the field of view in the direction of the rotation axis 11, the width of the calibration source 5 is 10 times the width of the antenna beam of the millimeter wave/terahertz wave detector 2. However, it should be noted that those skilled in the art should understand that the width of the calibration source 5 can also be 1 times or 2 times or other multiples of the antenna beam width of the millimeter wave/terahertz wave detector.

In one embodiment, the millimeter wave/terahertz wave imaging apparatus 100 further includes an optical camera device including a first optical camera device suitable for collecting an optical image of the first object 31A and suitable for collecting A second optical camera device for the optical image of the second object 31B connected to a display device, the optical camera device can realize real-time imaging of visible light, giving the first object 31A and the second object 31B The image information is compared with the millimeter wave/terahertz wave image for the user's reference.

In an exemplary embodiment not shown, the display device includes a display screen including a first display adapted to display millimeter-wave/terahertz-wave images of the first subject 31A and the second subject 31B Area and a second display area suitable for displaying the optical images of the first object 31A and the second object 31B collected by the optical camera device, so that the user can easily compare the optical images collected by the optical camera device with the millimeter wave/ Compare terahertz wave images.

In an exemplary embodiment not shown, the millimeter wave/terahertz wave imaging apparatus 100 further includes an alarm device connected to the data processing device so that when the first object to be inspected 31A and/or Or suspicious objects in the millimeter wave/terahertz wave image of the second object 31B, for example, an alarm is issued below the millimeter wave/terahertz wave image corresponding to the corresponding object to be inspected, for example, the warning lamp lights up, and it needs to be explained Yes, you can also use the alarm method of sound prompt.

In an exemplary embodiment, the data processing device may be used to generate a control signal and send the control signal to the first driving device 13 and the second driving device to drive the V-shaped reflector 1 and the chopper 8 to rotate, respectively. In another exemplary embodiment, the imaging apparatus may also include a control device independent of the data processing device.

As shown in FIG. 10, the present disclosure also provides a method for detecting a human body or an object using the millimeter wave/terahertz wave imaging device 100, including the following steps:

S1: The V-shaped reflector 1 is driven to swing so that the first reflector 1A receives and reflects the millimeter wave/terahertz waves from the portion of the first subject 31A located at different positions in the first field of view 3A, the second reflector 1B respectively receive and reflect the millimeter wave/terahertz wave of the part of the second subject 31B located at different positions in the second field of view 3B; while the V-shaped reflector 1 swings, the chopper 8 rotates around its central axis to make The millimeter wave/terahertz wave from the first reflector 1A and the millimeter wave/terahertz wave from the second reflector 1B reflected by the fourth reflector 7 are alternately received by the millimeter wave/terahertz wave detector array 2;

S2: Send the image data for the first object 31A and the image data for the second object 31B obtained by the millimeter wave/terahertz wave detector array 2 to the data processing device;

S3: Reconstruct the image data of the first object 31A and the image data of the second object 31B using a data processing device to generate the millimeter wave/terahertz of the first object 31A and the second object 31B Wave image.

The method can simultaneously perform imaging and detection on two

objects

31A and 31B in a full range, where the object 31 can be a human body or an object. When the

subjects

31A and 31B are human bodies, the millimeter-wave/terahertz-wave imaging device 100 can be used with the article imaging device 200, as shown in FIG. 11, the two

subjects

31A and 31B are respectively on the left to be examined And the right side to be inspected, or, when a subject 31A has been inspected at the left side to be inspected, it can walk to the right side to be inspected along the path indicated by the arrow, and complete the back Detection, so that the full range of detection can be completed without the subject 31A turning around.

In an exemplary embodiment, the method further includes the following step before step S3: when the V-shaped reflector 1 is rotated to the calibration area, the calibration about the calibration source 5 is received through the millimeter wave/terahertz wave detector array 2 Data; and based on the calibration data of the calibration source 5, update the received image data of the first subject 31A and the second subject 31B in real time.

The antenna temperature corresponding to the detected output voltage V _out is T _A , which should satisfy the following relationship,

T _A = (V _out -b)/a (6)

In the formula, a is the gain calibration coefficient,

b is the offset calibration coefficient.

Therefore, updating the received image data of the subject 31 based on the calibration data of the calibration source 5 includes the correction of the offset calibration coefficient b and the correction of the gain calibration coefficient a.

Within the calibration region the calibration source 5 and its surrounding environment brightness temperature can be regarded as uniform, i.e. all channels antennas temperature T _A is the same. When exactly the same channel, the receiving channel focal plane array output V _out to be exactly the same, if the output is not consistent, it is necessary to adjust the gain of each channel scaling coefficient a and the offset calibration factor B, all consistent channel output, in order to achieve Channel consistency adjustment. Gain calibration parameter a reflects the total gain and equivalent bandwidth of the channel. This part has been carefully adjusted during channel debugging. It can be considered that the gain calibration coefficient a of each channel is approximately equal, so it is corrected through adjustment during normal use. Offset calibration coefficient b to complete.

In an exemplary embodiment, updating the received image data of the subject 31 based on the calibration data of the calibration source 5 mainly includes correction of the offset calibration coefficient b, including the following steps:

A1: Calculate the average value of multiple measurement output voltages of all channels of the millimeter wave/terahertz wave detector array in the calibration area

A2: The calibrated data of the detection area of each channel is the data collected in the detection area of each channel V _i minus the average value

Then divide by the gain scaling factor a _i of each channel.

The method can perform overall calibration on the receiving channel array of the focusing plane array system. The calibration algorithm only needs simple calculation, takes very little time, and can realize real-time calibration; the channel consistency calibration is performed on each image.

When the equipment is operated for a long time or the place of use is changed, the system performance is deteriorated due to the system temperature drift, and the gain calibration coefficient a of each channel usually also changes. At this time, the gain calibration coefficient a and the offset calibration coefficient b of the channel need to be adjusted, including the following steps

B1: Use the millimeter wave/terahertz wave detector array to measure the voltage value of _air V _air (i), i ∈ [1, the number of channels], and calculate the average voltage value of the air in all channels

B2: Set the temperature of the calibration source and the temperature of the air to have a difference, and use the millimeter wave/terahertz wave detector array to measure the voltage value of the calibration source V _cal (i), i∈[1, number of channels ] And calculate the average voltage value of the calibration source for all channels

And calculate the gain calibration coefficient a _i and offset calibration coefficient b _i of each channel by the following equation:

B3: The data after calibration of the detection area of each channel is

The absolute value of, where V _i is the data collected in the detection area of each channel.

The data processing device collects twice in each 3dB beam orientation, so that in the embodiment shown in FIG. 1, each channel obtains at least 10 collected data in the calibration area. The output voltage data in the calibration area and the output voltage data in the detection area are stored in the same data table of the data processing device.

As an exemplary embodiment, the method may further include S4: After generating the millimeter wave/terahertz wave images of the first subject 31A and the second subject 31B, the first subject 31A and the second subject The inspection object 31B identifies whether there is a suspicious object and the position of the suspicious object and outputs the result.

In the above steps, the identification of suspicious objects and their locations can be performed by computer automatic identification, manual identification, or a combination of the two. The output of the result can be realized by, for example, displaying a conclusion marked with a direct display of whether there is a suspicious object on the display device, or the test result can be printed or sent directly.

The security inspector who performs the detection may confirm whether the human body or the article carries the suspicious object and the position of the suspicious object according to the detection result given in the above step S4, or may review it through manual detection.

According to another embodiment of the present disclosure, unlike the above embodiment, the V-shaped reflective plate 1 of the quasi-optical assembly is replaced by a Y-shaped reflective plate 1', which includes a first reflective plate 1A, a first The second reflecting plate 1B and the third reflecting plate 1C, and the Y-shaped reflecting plate 1'can rotate around the connection (ie, the rotation axis o) of the first reflecting plate 1A, the second reflecting plate 1B, and the third reflecting plate 1C so that the first The first reflecting surface of the reflecting plate 1A, the first reflecting surface of the second reflecting plate 1B, and the first reflecting surface of the third reflecting plate 1C alternately serve as the first working surface to receive and reflect the first object to be inspected 31A located in the first view The part of the field 3A at different positions of the spontaneously radiated or reflected millimeter wave/terahertz wave; the quasi-optical assembly also includes a fifth reflective plate 15, when the Y-shaped reflective plate 1'rotates, the first reflective plate 1A and the first reflection The second reflecting surface opposite to the surface, the second reflecting surface opposite to the first reflecting surface of the second reflecting plate 1B, and the second reflecting surface opposite to the first reflecting surface of the third reflecting plate 1C are alternately used as the second working surface The part of the millimeter wave/terahertz wave that spontaneously radiates or reflects back from the part of the second object 31B located at different positions in the second field of view 3B is received and reflected to the fifth reflecting plate 15. The quasi-optical element further includes a first focusing lens 4A and a second focusing lens 4B, the first focusing lens 4A is suitable for condensing the beam from the first working surface, and the second focusing lens 4B is suitable for condensing the beam from the second working surface . The chopper 8 is located on the reflected wave path of the first working surface and the reflected wave path of the fifth reflecting plate 15. The chopper 8 is configured to transmit only the millimeter wave/terahertz wave from the first working surface to the millimeter wave at any time /THz wave detector array 2 or only the millimeter wave from the fifth reflecting plate 15/THz wave is reflected to the millimeter wave/THz wave detector array 2, the chopper 8 rotates around its central axis to alternately cause the The millimeter wave/terahertz wave of the first working surface of the Y-shaped reflecting plate 1'and the fifth reflecting plate 15 are received by the millimeter wave/terahertz wave detector array 2. The millimeter-wave/terahertz wave detector array 2 is suitable for receiving beams reflected and condensed from quasi-optical components; the number of detectors in the millimeter-wave/terahertz wave detector array 2 depends on the required field of

view

3A, 3B The size and the required resolution are determined. The arrangement direction is perpendicular to the normal of the field of view and parallel to the horizontal plane. The size of the detector is determined according to the wavelength, processing technology and required sampling density.

The millimeter wave/terahertz wave imaging device 100 in this embodiment drives the Y-shaped reflecting plate 1'to rotate around the connection of the first reflecting plate 1A, the second reflecting plate 1B, and the third reflecting plate 1C to complete Data collection for the first field of view 3A and the second field of view 3B. During the rotation of the Y-shaped reflector 1', the millimeter wave/terahertz from the first field of view 3A and the second field of view 3B are transmitted through the chopper 8 The waves are alternately switched to the same millimeter wave/terahertz wave detector array 2 so as to realize the imaging of the two

objects

31A, 31B located in the two fields of

view

3A, 3B while reducing the millimeter wave/terahertz The number of wave detectors to reduce equipment costs, and high stability and small footprint.

In this embodiment, the first focusing lens 4A is located between the Y-shaped reflector 1'and the chopper 8 and is suitable for the millimeter wave/terahertz wave from the first working surface of the Y-shaped reflector Focusing, the second focusing lens 4B is located between the Y-shaped reflecting plate 1'and the fifth reflecting plate 15, and is suitable for focusing the millimeter wave/terahertz wave from the second working surface of the Y-shaped reflecting plate 1' .

In the exemplary embodiments shown in FIGS. 12 and 13, the angle θ between the first reflective plate 1A, the second reflective plate 1B, and the third reflective plate 1C is 120°. It should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, the angle θ of two adjacent ones of the first reflective plate 1A, the second reflective plate 1B, and the third reflective plate 1C is also It can be other values.

In the exemplary embodiments shown in FIGS. 12 and 13, the first reflective plate 1A, the second reflective plate 1B, and the third reflective plate 1C are rectangular, and their lengths and widths should match the corresponding focusing lenses 4, usually In this case, the widths of the first reflection plate 1A, the second reflection plate 1B, and the third reflection plate 1C are greater than or equal to the diameter of the corresponding focusing lens 4, the first reflection plate 1A, the second reflection plate 1B, the third reflection plate 1C Should be the width of

Times, the diameter of the focusing lens 4 may be, for example, 3 cm-50 cm.

As shown in FIGS. 14 and 15, in an exemplary embodiment, a rotation shaft 11 is provided at the connection between the first reflection plate 1A, the second reflection plate 1B, and the second reflection plate 1C, and both ends of the rotation shaft 11 pass through

bearings

10A and 10B are rotatably connected to the housing 6 so that the Y-shaped reflecting plate can rotate so that the first reflecting surface of the first reflecting plate 1A, the first reflecting surface of the second reflecting plate 1B and the second reflecting plate 1C The first reflecting surface reflects the beams from the portion of the object 31A located at different vertical positions in the field of view 3A, while the second reflecting surface of the first reflecting plate 1A, the second reflecting surface of the second reflecting plate 1B and The second reflecting surface of the second reflecting plate 1C reflects the beams from the parts of the object 31B located at different vertical positions of the field of view 3B, respectively.

In the exemplary embodiments shown in FIGS. 12 to 15, the first reflection plate 1A, the second reflection plate 1B, and the third reflection plate 1C are all parallel to the rotation axis o. It should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, the angle between the first reflective plate 1A, the second reflective plate 1B, the third reflective plate 1C and the rotation axis o may be along The rotation direction of the Y-shaped reflector 1'is increased or decreased in increments of α to realize the pixel difference, so that the detectors of the millimeter wave/terahertz wave detector array 2 can be sparsely distributed, thereby reducing the number of detectors .

Where α is calculated from the following equation:

Where λ is the wavelength of the millimeter wave/terahertz wave,

D is the diameter of the focusing lens 4.

It should be noted that the above formula is just an estimation formula for the angular resolution of the lens under ideal focusing. In the actual system, the size of α should be fine-tuned according to the experimental results, so that the final pixel arrangement is as uniform as possible without overlapping and gaps. That is to say, the angle between the

reflection plates

1A, 1B, 1C on the Y-shaped reflection plate 1'and the rotation axis o can be finely adjusted.

As shown in FIG. 16, in an exemplary embodiment, the angle between the first reflecting plate 1A, the second reflecting plate 1B, the third reflecting plate 1C and the rotation axis o is along the Y-shaped reflecting plate 1' The direction of rotation increases. The angle θ between the first reflection plate 1A and the rotation axis o is 0°, the angle θ between the second reflection plate 1B and the rotation axis o is +α, and the angle θ between the third reflection plate 1C and the rotation axis o Is -α. It should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, the angle between the first reflective plate 1A, the second reflective plate 1B, the third reflective plate 1C and the rotation axis o The direction of rotation of the Y-shaped reflector 1'decreases.

During the rotation of the chopper 8 about its central axis 81, at any moment when the millimeter wave/terahertz wave from the first working surface is incident on the blade 82 of the chopper 8, the blade 82 will come from the first working The surface millimeter wave/terahertz wave is reflected to the wave absorbing material 9 to be absorbed by the wave absorbing material 9 and at the same time reflects the millimeter wave/terahertz wave from the fifth reflecting plate 15 to the millimeter wave/terahertz wave detector array 2 . As the chopper 8 rotates about its central axis 81, at the next moment, the millimeter wave/terahertz wave from the first working surface is incident on the portion of the chopper 8 where the blade 82 is not provided (ie, the empty portion), In order to transmit to the millimeter wave/terahertz wave detector array 2, the portion of the chopper 8 that is not provided with the blade 82 simultaneously transmits the millimeter wave/terahertz wave from the fifth reflecting plate 15 to the wave absorbing material 9, so that The absorbing material 9 absorbs and cycles in turn.

In the exemplary embodiments shown in FIGS. 12 and 13, the chopper 8 is placed at an angle of 45 degrees to the wave path from the first working surface and the wave path from the fifth reflection plate 15. It should be noted that those skilled in the art should understand that, in some other embodiments of the present disclosure, the chopper 8 and the wave path from the first working surface and the wave path from the fifth reflection plate 15 may also be placed at other angles .

In the exemplary embodiments shown in FIGS. 12 and 13, the rotation axis 11 of the Y-shaped reflector 1 ′ is horizontally arranged so that the first working surface and the second working surface are located from the corresponding inspected

objects

31A, 31B. The beams of the parts at different vertical positions of the field are reflected. It should be noted that those skilled in the art should understand that, in some other embodiments of the present disclosure, the rotating shaft 11 of the Y-shaped reflector 1 ′ may also be vertically arranged so that the first working surface and the second working surface The beams from the parts of the

corresponding objects

31A and 31B located at different horizontal positions in the field of view are reflected. In addition, the calibration source 5 may be a absorbing material with an emissivity close to 1 such as plastic or foam, or a black body or semiconductor refrigerator or the like.

17 is a schematic structural diagram of a millimeter wave/terahertz wave imaging device according to yet another embodiment of the present disclosure. As shown in FIG. 11, the millimeter wave/terahertz wave imaging device includes a Y-shaped reflecting plate 1 ′ and a focusing lens 4. By driving the Y-shaped reflecting plate 1 ′ to rotate, the first reflecting surface of the first reflecting plate 1A 1. The first reflecting surface of the second reflecting plate 1B and the first reflecting surface of the second reflecting plate 1C respectively reflect beams from portions of the object 31A located at different positions in the field of view 3A, thereby realizing imaging in a single field of view The Y-shaped reflector 1'can complete the collection of 3 images by one rotation.

18 is a schematic structural diagram of a millimeter wave/terahertz wave imaging device according to still another embodiment of the present disclosure. As shown in FIG. 18, the millimeter wave/terahertz wave imaging device includes a Y-shaped reflecting plate 1', a focusing lens 4 and a sixth reflecting plate 16, the sixth reflecting plate 16 reciprocates around its central axis to receive and Reflect the spontaneously radiated or reflected millimeter wave/terahertz wave of the first object 31A to the first working surface to be reflected by the first working surface by the millimeter wave/terahertz wave detector array 2 Receiving, the swing period T1 of the sixth reflection plate 16 is 2m times the rotation period of the Y-shaped reflection plate 1', where m is an integer greater than or equal to 1. In this embodiment, the sixth reflective plate 16 is driven to reciprocate around its central axis to increase the number of scanning lines in the horizontal direction of the measured object 31. Since the swing range of the sixth reflective plate 16 is just right, the measured The moving range of the image formed by the object on the image plane is the distance between two adjacent detection units, so when the sixth reflector 16 swings back and forth around its central axis, it can detect the millimeter wave/terahertz wave The pixels adjacent to the detection units in the array 2 are sent to each detection unit in sequence.

When the sixth reflecting plate 16 does not swing, the millimeter wave/terahertz wave emitted or reflected by the subject 31A is reflected onto the Y-shaped reflecting plate 1'via the sixth reflecting plate 16, and the Y-shaped reflecting plate 1'surrounds it The rotation axis o performs high-speed and stable rotation. When the first reflector 1A, the second reflector 1B, and the third reflector 1C in the Y-shaped reflector 1'are turned into the wave path behind the sixth reflector 16, they will be inspected. The vertical column direction of the object 31A completes one-dimensional multi-column rapid scanning, and then converges by the focusing lens 4 to form the image of the object 31A to be detected, which is finally received by the millimeter wave/terahertz wave detector array 2 arranged in the image plane The number of columns detected on the subject 31A is consistent with the number of detection units in the millimeter wave/terahertz wave detector array 2.

When the sixth reflecting plate 16 is deflected by an angle around its central axis, the image plane of the object 31A behind the focusing lens 4 also moves by a certain angle accordingly, each detection unit in the millimeter wave/terahertz wave detector array 2 It will detect a column of pixels that are originally to the left or right of its location. If the angle of rotation of the sixth reflector 16 is appropriate, each detection unit can receive any pixels before the sixth reflector 16 rotates. The pixels not received by the detection unit, that is, the pixels between the original two adjacent detection units, as shown in FIG. 19. As a result, the sixth reflecting plate 16 can be deflected by a certain angle to increase the number of scanning columns of the measured object without increasing the detection unit in the millimeter wave/terahertz wave detector array 2, that is, the horizontal level of the measured object 31A is increased. The number of pixels in the row direction can increase the scanning speed. In addition, since the swing angle of the sixth reflecting plate 16 is small, the system stability is relatively high.

Before the imaging device is started, arrange the devices in the system as required to place the sixth reflector 16 at the maximum angle to the left or right of its central axis. The first reflector 1A in the Y-shaped reflector 1', The second reflection plate 1B and the third reflection plate 1C are parallel to the central axis of the sixth reflection plate 16. After the imaging device is started, the sixth reflecting plate 16 and the Y-shaped reflecting plate 1'move synchronously, and the millimeter wave/terahertz wave detector array 2 starts to receive the millimeter wave/terahertz wave transmitted by the focusing lens 4, the millimeter wave/terahertz wave The hertz wave detector array 2 converts the millimeter wave/terahertz wave signal into a DC voltage signal.

As shown in FIG. 20, the present disclosure also provides a method for detecting a human body or article using a millimeter wave/terahertz wave imaging device, including the following steps:

S1: Drive the Y-shaped reflecting plate 1'to rotate so that the first reflecting surface of the first reflecting plate 1A, the first reflecting surface of the second reflecting plate 1B, and the first reflecting surface of the third reflecting plate 1C receive and reflect the first A millimeter wave/terahertz wave spontaneously radiated or reflected by an object to be inspected 31A; passing through the second reflecting surface of the first reflecting plate 1A, the second reflecting surface of the second reflecting plate 1B and the third reflecting plate 1C The two reflecting surfaces receive and reflect the spontaneously radiated or reflected millimeter wave/terahertz wave of the second object 31B in turn; while the Y-shaped reflecting plate 1'rotates, the chopper 8 rotates around its central axis to alternately make The millimeter wave/terahertz wave from the first working surface and the millimeter wave/terahertz wave from the second working surface reflected by the fifth reflecting plate 15 are received by the millimeter wave/terahertz wave detector array 2;

S2: Send the image data for the first subject 31A and the image data for the second subject 31B obtained by the millimeter wave/terahertz wave detector array 2 to the data processing device; and

This method can simultaneously perform imaging and detection on two

objects

31A, 31B in a full range. The object 31 can be a human body or an object. When the

subjects

According to another embodiment of the present disclosure, unlike the above embodiment, the V-shaped reflecting plate 1 of the quasi-optical assembly is replaced by a polyhedral rotating mirror 1", and each side of the polyhedral rotating mirror 1" is provided with a reflecting

plate

1A , 1B, 1C, 1D, the polygon mirror 1" can rotate around its rotation axis o, so that the

multiple reflection plates

1A, 1B, 1C, 1D are used in turn as the first working plate to receive and reflect the first object 31A Part of the spontaneously radiated or reflected millimeter wave/terahertz wave at different positions in the first field of view 3A; at the same time, the other reflective plate adjacent to the first working plate among the multiple

reflective plates

1A, 1B, 1C, 1D As a second working plate to receive and reflect the part of spontaneously radiated or reflected millimeter wave/terahertz wave beams of the second object 31B at different positions of the second field of view 3B; the quasi-optical assembly also includes a seventh reflecting plate 17 The seventh reflecting plate 17 is adapted to reflect the beam reflected by the second working plate onto the chopper 8. The quasi-optical element further includes a first focusing lens 4A and a second focusing lens 4B, the first focusing lens 4A is suitable for converging For the beam from the first working plate 1A, the second focusing lens 4B is suitable for converging the beam from the second working plate 1B. The chopper 8 is located on the reflection wave path of the first work plate and the reflection wave path of the seventh reflection plate 17, And is configured to reflect or transmit only the millimeter wave/terahertz wave from the first working plate or the millimeter wave/terahertz wave from the seventh reflecting plate 17 to the millimeter wave/terahertz wave detector array 2 at any time, The chopper 8 can rotate about its central axis 81 so that the millimeter wave/terahertz waves from the first working plate and the seventh reflection plate 17 are alternately received by the millimeter wave/terahertz wave detector array 2. The millimeter wave/terahertz wave detector array 2. Hertz wave detector array 2 is suitable for receiving beams reflected and converged from quasi-optical components; the number of detectors in the millimeter wave/terahertz wave detector array 2 depends on the required field of

view

3A, 3B size and required The resolution is determined. The arrangement direction is perpendicular to the normal of the field of view and parallel to the horizontal plane. The size of the detector is determined according to the wavelength, processing technology and required sampling density.

The millimeter wave/terahertz wave imaging device of this embodiment, by driving the polyhedron rotating mirror 1" to rotate around its rotation axis o, so that the plurality of reflecting

plates

1A, 1B, 1C, 1D are used in turn as the first working plate to receive and The part of the millimeter wave/terahertz wave beam that spontaneously radiates or reflects back from the part of the first object to be inspected 31A located at different positions in the first field of view 3A; among the plurality of reflecting

plates

1A, 1B, 1C, 1D and the first Another reflecting plate adjacent to a working plate is used as a second working plate to receive and reflect a part of the millimeter wave/terahertz wave beam of spontaneous radiation or reflected back of the second object 31B at different positions of the second field of view 3B, During the rotation of the polygon mirror 1", the chopper 8 alternately switches the millimeter wave/terahertz wave from the first field of view 3A and the second field of view 3B to the same millimeter wave/terahertz wave detector Array 2 to achieve imaging of two

objects

31A, 31B located in two fields of

view

3A, 3B, while reducing the number of millimeter wave/terahertz wave detectors to reduce equipment costs and occupy space small.

In this embodiment, the first focusing lens 4A is located between the first working plate and the chopper 8, and the second focusing lens 4B is located between the second working plate and the seventh reflecting plate 17.

In the exemplary embodiments shown in FIGS. 21 and 22, each

reflector

1A, 1B, 1C, 1D is rectangular, and its length and width should match the corresponding focusing

lenses

4A, 4B. In general, each The width of each

reflector

1A, 1B, 1C, 1D is greater than or equal to the diameter of the corresponding focusing

lens

4A, 4B, and the length of each

reflector

1A, 1B, 1C, 1D should be the width of

Times, the diameter of the focusing

lenses

4A, 4B may be, for example, 3 cm-50 cm.

As shown in FIGS. 23 and 24, in an exemplary embodiment, the polyhedral lens 1 further includes a rotating shaft 11, and both ends of the rotating shaft 11 are rotatably connected to the housing 6 via

bearings

10A, 10B, so that the polyhedron rotates the mirror 1" can be rotated so that the first working plate and the second working plate respectively reflect the beams from the parts of the inspected objects 31A, 31B located at different vertical positions of the field of

view

3A, 3B.

During the rotation of the chopper 8 about its central axis 81, at any moment when the millimeter wave/terahertz wave from the first working plate is incident on the blade 82 of the chopper 8, the blade 82 will come from the first working The millimeter wave/terahertz wave of the board is reflected to the wave absorbing material 9 to be absorbed by the wave absorbing material 9 while reflecting the millimeter wave/terahertz wave from the seventh reflecting plate 17 to the millimeter wave/terahertz wave detector array 2 . As the chopper 8 rotates about its central axis 81, at the next moment, the millimeter wave/terahertz wave from the first working plate is incident on the portion of the chopper 8 where the blade 82 is not provided (ie, the empty portion), In order to transmit to the millimeter wave/terahertz wave detector array 2, the portion of the chopper 8 that is not provided with the blade 82 simultaneously transmits the millimeter wave/terahertz wave from the seventh reflecting plate 17 to the wave absorbing material 9, so that The absorbing material 9 absorbs and cycles in turn.

In the exemplary embodiments shown in FIGS. 21 and 22, the chopper 8 is placed at an angle of 45 degrees to the wave path from the first working plate and the wave path from the seventh reflection plate 17. It should be noted that those skilled in the art should understand that in other embodiments of the present disclosure, the chopper 8 and the wave path from the first working plate and the wave path from the seventh reflecting plate 17 may also be placed at other angles . The rotation period of the chopper 8 should match the scanning period of the polyhedron mirror 1", so that the millimeter wave/terahertz wave imaging device 100 can simultaneously detect the two inspected objects of the two fields of

view

3A, 3B respectively For imaging, it is preferable that the rotation period of the chopper 8 is 1/1000-1/2 of the scanning period of the polygon mirror.

In the exemplary embodiment shown in FIGS. 21 to 23, the polygon mirror 1" includes four reflecting

plates

1A, 1B, 1C, 1D, and the four reflecting plates are all parallel to the rotation axis o. It should be noted that It should be understood by those skilled in the art that, in some other embodiments of the present disclosure, the polygon mirror 1 ″ may also include other numbers of reflecting plates, preferably the number m of reflecting plates is 3 to 6. In addition, in some embodiments, the angle between the m reflecting plates and the rotation axis o may be increased in increments of α (where α is calculated by the above equation (9)) along the rotation direction of the polyhedral mirror 1″ Or decrease to achieve the pixel difference, so that the detectors of the millimeter wave/terahertz wave detector array 2 can be sparsely distributed (as shown in FIG. 19), thereby reducing the number of detectors.

As shown in FIG. 24, in an exemplary embodiment, the angle between the four reflecting

plates

1A, 1B, 1C, 1D and the rotation axis o increases along the direction of rotation of the polyhedron mirror 1". The first The angle θ between the reflecting plate 1A and the rotation axis o is

The angle between the second reflector and the rotation axis o is

The angle θ between the third reflector 1C and the rotation axis o is

The angle θ between the fourth reflector 1D and the rotation axis o is

It should be noted that those skilled in the art should understand that in some other embodiments of the present disclosure, the size of the angle θ between the four reflecting

plates

1A, 1B, 1C, 1D and the rotation axis o can also be rotated along the polyhedron The direction of rotation of the mirror 1" decreases.

In some embodiments, when m is an odd number, the angle θ between the first reflecting plate along the rotation direction of the polyhedral mirror 1″ and the rotation axis o among the m reflecting plates is 0°,

The angle θ between the reflector and the rotation axis o is

First

The angle θ between the reflector and the rotation axis o is

For example, when m is 3, the angle θ between the first reflector 1A and the rotation axis o is 0°, the angle θ between the second reflector 1B and the rotation axis o is +α, and the third reflection The angle θ between the plate 1C and the rotation axis o is -α.

In some embodiments, when m is an even number, the angle θ between the first reflector in the rotation direction and the rotation axis o of the m reflectors is

First

The angle θ between the reflector and the rotation axis o is

First

The angle θ between the reflector and the rotation axis o is

As shown in FIG. 26, the present disclosure also provides a method for detecting a human body or an object using the millimeter wave/terahertz wave imaging device 100, including the following steps:

S1: driving the polyhedron rotating mirror 1" to rotate, so that the plurality of reflecting

plates

1A, 1B, 1C, 1D are used in turn as the first working plate to receive and reflect the portion of the first object to be inspected 31A located at different positions in the first field of view 3A A millimeter wave/terahertz wave beam spontaneously radiated or reflected back; the other reflecting plate adjacent to the first working plate among the plurality of reflecting

plates

1A, 1B, 1C, 1D serves as a second working plate Receiving and reflecting a part of the millimeter wave/terahertz wave beam of the spontaneously radiated or reflected back part of the second object 31B at different positions in the second field of view 3B; during the rotation of the polygon mirror 1", the chopper 8 around it The central axis rotates so that the millimeter wave/terahertz wave from the first working plate and the millimeter wave/terahertz wave from the second working plate reflected by the seventh reflecting plate 17 are alternately composed of the millimeter wave/terahertz wave Wave detector array 2 receiving;

Those skilled in the art can understand that the embodiments described above are exemplary, and those skilled in the art can improve them. The structures described in the various embodiments do not conflict in structure or principle. Can be combined freely.

After describing the preferred embodiments of the present disclosure in detail, those skilled in the art can clearly understand that various changes and modifications can be made without departing from the scope and spirit of the appended claims, and the present disclosure is not subject to The implementation is limited to the exemplary embodiments cited in the specification.

Claims

A millimeter wave/terahertz wave imaging device includes a quasi-optical component, a millimeter wave/terahertz wave detector array and a chopper,

The quasi-optical assembly includes:

A V-shaped reflecting plate, the V-shaped reflecting plate includes a first reflecting plate and a second reflecting plate, the V-shaped reflecting plate can swing about its swing axis, so that the first reflecting plate receives and reflects from the first The part of the object under inspection located at different positions in the first field of view spontaneously radiates or reflects the millimeter wave/terahertz waves, and the second reflecting plate respectively receives and reflects the parts of the second object under inspection at different positions in the second field of view Spontaneously radiated or reflected millimeter waves/terahertz waves; and

A fourth reflecting plate adapted to reflect the millimeter wave/terahertz wave from the second reflecting plate onto the chopper;

The chopper is located on the reflection wave path of the first reflection plate and the reflection wave path of the fourth reflection plate, and the chopper is configured to only receive millimeter waves from the first reflection plate at any time/ The terahertz wave or only the millimeter wave/terahertz wave from the fourth reflecting plate is reflected or transmitted to the millimeter wave/terahertz wave detector array, and the chopper is rotated about its central axis to cause the The millimeter wave/terahertz waves of the first reflector and the fourth reflector are alternately received by the millimeter wave/terahertz wave detector array; and

The millimeter wave/terahertz wave detector array is suitable for receiving beams from the quasi-optical assembly.
The millimeter wave/terahertz wave imaging apparatus according to claim 1, wherein the quasi-optical assembly further includes a focusing lens, the focusing lens being located in the chopper and the millimeter wave/terahertz wave detector array between.
The millimeter wave/terahertz wave imaging apparatus according to claim 1, wherein the quasi-optical assembly further includes a first focusing lens and a second focusing lens, the first focusing lens is located on the first reflecting plate and the Between the chopper, the second focusing lens is located between the second reflecting plate and the fourth reflecting plate.
The millimeter wave/terahertz wave imaging device according to claim 1, further comprising a wave absorbing material adapted to absorb the millimeter wave reflected from the first reflecting plate via the chopper /THz wave, and the millimeter wave/THz wave transmitted from the fourth reflector through the chopper.
The millimeter wave/terahertz wave imaging apparatus according to claim 1, wherein the angle between the reflection surface of the first reflection plate and the reflection surface of the second reflection plate is 240° to 300°.
The millimeter wave/terahertz wave imaging apparatus according to claim 1, wherein the chopper includes at least one blade.
The millimeter wave/terahertz wave imaging apparatus according to claim 6, wherein a plurality of the blades are arranged at equal intervals around the central axis.
The millimeter wave/terahertz wave imaging device according to claim 1, further comprising a housing, the quasi-optical component and the millimeter wave/terahertz wave detector array are located in the housing, the housing The opposite side walls of the are provided with a first window through which the millimeter wave/terahertz wave from the first object to be inspected and a millimeter wave/terahertz wave from the second object to be inspected pass through The second window.
The millimeter wave/terahertz wave imaging apparatus according to claim 1, further comprising a first driving device adapted to drive the V-shaped reflecting plate to swing.
The millimeter wave/terahertz wave imaging apparatus according to claim 1, further comprising a second driving device adapted to drive the chopper to rotate.
The millimeter wave/terahertz wave imaging device according to any one of claims 1-10, further comprising:

A data processing device connected to the millimeter wave/terahertz wave detector array to respectively receive image data for the first subject from the millimeter wave/terahertz wave detector array and And generate millimeter wave/terahertz wave images for the image data of the second object to be inspected; and

A display device connected to the data processing device for receiving and displaying millimeter wave/terahertz wave images from the data processing device.
The millimeter wave/terahertz wave imaging apparatus according to claim 11, further comprising an alarm device connected to the data processing device so that when the data processing device recognizes the millimeter wave/ When there is a suspicious item in the terahertz wave image, an alarm indicating that there is a suspicious item in the millimeter wave/terahertz wave image is issued.
The millimeter wave/terahertz wave imaging apparatus according to claim 11, further comprising a calibration source, the calibration source is located on the object surface of the quasi-optical component, and the data processing device receives the millimeter wave/ The calibration data of the terahertz wave detector array for the calibration source, and update the image data of the first object and the image data of the second object based on the calibration data.
The millimeter-wave/terahertz-wave imaging device according to claim 11, further comprising an optical imaging device including a first optical imaging device adapted to acquire an optical image of the first object to be inspected and A second optical imaging device suitable for acquiring an optical image of the second object to be inspected, the first optical imaging device and the second optical imaging device are respectively connected to the display device.
The millimeter wave/terahertz wave imaging apparatus according to claim 14, wherein the display device includes a display screen, and the display screen includes a first display area suitable for displaying the millimeter wave/terahertz wave image and In a second display area for displaying the optical image collected by the optical camera device.
A method for detecting a human body or an article using the millimeter wave/terahertz wave imaging device according to any one of claims 1-15 includes the following steps:

S1: Drive the V-shaped reflecting plate to swing, so that the first reflecting plate respectively receives and reflects the millimeter wave/terahertz wave from the portion of the first object to be located at different positions in the first field of view, and the second reflecting plate respectively receives and reflects The millimeter wave/terahertz wave of the second object to be located at different positions in the second field of view; while the V-shaped reflecting plate swings, the chopper rotates about its central axis to make the The millimeter wave/terahertz wave and the millimeter wave/terahertz wave reflected from the second reflecting plate reflected by the fourth reflecting plate are alternately received by the millimeter wave/terahertz wave detector array;

S2: Send the image data about the first object and the image data about the second object received by the millimeter wave/terahertz wave detector array to the data processing device; and

S3: Reconstruct the image data of the first object and the image data of the second object using the data processing device to generate the first object and the second object Millimeter wave/terahertz wave image.
A millimeter wave/terahertz wave imaging device, including:

The quasi-optical assembly includes a Y-shaped reflecting plate including a first reflecting plate, a second reflecting plate, and a third reflecting plate, and the Y-shaped reflecting plate can rotate about its rotation axis so that the first The first reflecting surface of the reflecting plate, the first reflecting surface of the second reflecting plate and the first reflecting surface of the third reflecting plate are alternately used as the first working surface to receive and reflect that the first object to be inspected is located in a different first field of view The part of the position is spontaneously radiated or reflected back from the millimeter wave/terahertz wave; and

The millimeter wave/terahertz wave detector array is suitable for receiving the beam from the quasi-optical component.
The imaging device according to claim 17, wherein the quasi-optical assembly further includes a fifth reflecting plate, and when the Y-shaped reflecting plate rotates, the first reflecting plate is opposite to the first reflecting surface The second reflecting surface, the second reflecting surface of the second reflecting plate opposite to the first reflecting surface, and the second reflecting surface of the third reflecting plate opposite to the first reflecting surface are alternately used as the second work The surface receives and reflects the spontaneously radiated or reflected millimeter wave/terahertz wave part of the second object at different positions in the second field of view to the fifth reflecting plate;

A chopper, the chopper is located on the reflected wave path of the first working surface and the reflected wave path of the fifth reflecting plate, the chopper is configured to only come from the first working surface at any time The millimeter wave/terahertz wave or only the millimeter wave/terahertz wave from the fifth reflecting plate is reflected or transmitted to the millimeter wave/terahertz wave detector array, the chopper rotates around its central axis to The millimeter wave/terahertz waves from the first working surface of the Y-shaped reflecting plate and the fifth reflecting plate are alternately received by the millimeter wave/terahertz wave detector array.
The millimeter wave/terahertz wave imaging device according to claim 18, wherein the quasi-optical assembly further comprises a focusing lens, the focusing lens is located in the chopper and the millimeter wave/terahertz wave detector array between.
The millimeter-wave/terahertz-wave imaging device according to claim 18, wherein the quasi-optical assembly further includes a first focusing lens and a second focusing lens, the first focusing lens is adapted to reflect from the Y-shaped reflection The millimeter wave/terahertz wave of the first working surface of the plate is focused, and the second focusing lens is adapted to focus the millimeter wave/terahertz wave from the second working surface of the Y-shaped reflecting plate .
The millimeter wave/terahertz wave imaging apparatus according to claim 18, further comprising a wave absorbing material adapted to absorb the millimeter wave reflected from the first working surface via the chopper /THz wave, and the millimeter wave/THz wave transmitted from the fifth reflector through the chopper.
The millimeter wave/terahertz wave imaging device according to claim 18, wherein the angle between the three reflection plates and the rotation axis increases or decreases along the rotation direction of the Y-shaped reflection plate.
The millimeter wave/terahertz wave imaging device according to claim 18, further comprising a housing, the quasi-optical component and the millimeter wave/terahertz wave detector array are located in the housing, the housing The opposite side walls of the are respectively provided with a first window through which the beam from the first object to be inspected passes and a second window through which the beam from the second object to inspect passes through.
The millimeter wave/terahertz wave imaging device according to any one of claims 18-23, further comprising:

A data processing device connected to the millimeter wave/terahertz wave detector array to respectively receive image data for the first subject from the millimeter wave/terahertz wave detector array and And generate millimeter wave/terahertz wave images for the image data of the second object to be inspected; and

A display device connected to the data processing device for receiving and displaying millimeter wave/terahertz wave images from the data processing device.
The millimeter wave/terahertz wave imaging apparatus according to claim 24, further comprising an alarm device connected to the data processing device so that when the data processing device recognizes the millimeter wave/ When there is a suspicious item in the terahertz wave image, an alarm indicating that there is a suspicious item in the millimeter wave/terahertz wave image is issued.
The millimeter wave/terahertz wave imaging apparatus according to claim 24, further comprising a calibration source, the calibration source is located on the object surface of the quasi-optical assembly, and the data processing device receives the millimeter wave/ The calibration data of the terahertz wave detector array for the calibration source, and update the image data of the first object and the image data of the second object based on the calibration data.
The millimeter wave/terahertz wave imaging apparatus according to claim 24, further comprising an optical imaging device including a first optical imaging device adapted to acquire an optical image of the first object to be inspected and A second optical imaging device suitable for acquiring an optical image of the second object to be inspected, the first optical imaging device and the second optical imaging device are respectively connected to the display device.
The millimeter wave/terahertz wave imaging apparatus according to claim 27, wherein the display device includes a display screen, and the display screen includes a first display area suitable for displaying the millimeter wave/terahertz wave image and In a second display area for displaying the optical image collected by the optical camera device.
The millimeter wave/terahertz wave imaging apparatus according to claim 17, wherein the first reflection plate and the second reflection plate, the second reflection plate and the third reflection plate, and the third The included angle between the reflecting plate and the first reflecting plate is 120°.
The millimeter-wave/terahertz-wave imaging device according to claim 28, further comprising a sixth reflecting plate that reciprocates around its central axis to receive and reflect spontaneous radiation of the first subject or The reflected millimeter wave/terahertz wave reaches the first working surface to be received by the millimeter wave/terahertz wave detector array after being reflected by the first working surface, and the swing period of the sixth reflecting plate T1 is 2m times the rotation period of the Y-shaped reflector, where m is an integer greater than or equal to 1.
A method for detecting a human body or an object using the millimeter wave/terahertz wave imaging device according to any one of claims 18-27 includes the following steps:

S1: driving the Y-shaped reflecting plate to rotate, so that the first reflecting surface of the first reflecting plate, the first reflecting surface of the second reflecting plate, and the first reflecting surface of the third reflecting plate are alternately used as the first working surface to receive and reflect Millimeter wave/terahertz wave spontaneously radiated or reflected by the first object to be examined; passing through the second reflecting surface of the first reflecting plate, the second reflecting surface of the second reflecting plate, and the second reflecting surface of the third reflecting plate Take turns as the second working surface to receive and reflect the spontaneously radiated or reflected millimeter wave/terahertz wave of the second object; while the Y-shaped reflector rotates, the chopper rotates around its central axis to alternately make The millimeter wave/terahertz wave from the first working surface and the millimeter wave/terahertz wave from the second working surface reflected by the fifth reflecting plate are received by the millimeter wave/terahertz wave detector array;

S2: Send the image data about the first object and about the second object received by the millimeter wave/terahertz wave detector array to the data processing device; and

S3: Reconstruct the image data of the first object and the image data of the second object using the data processing device to generate the first object and the second object Millimeter wave/terahertz wave image.
A millimeter wave/terahertz wave imaging device includes a quasi-optical component, a millimeter wave/terahertz wave detector array and a chopper,

The quasi-optical assembly includes:

A polyhedral rotating mirror, each side surface of the polyhedral rotating mirror is respectively provided with a reflecting plate, the polyhedral rotating mirror can rotate around its rotation axis, so that the multiple reflecting plates are used in turn as the first working plate to receive and reflect the first A part of the millimeter wave/terahertz wave beam that is spontaneously radiated or reflected back from the detected object at different positions in the first field of view; another reflective plate adjacent to the first working plate among the multiple reflective plates is used as The second working board to receive and reflect the partly spontaneously radiated or reflected millimeter wave/terahertz wave beams of the second object at different positions in the second field of view; and

A seventh reflecting plate adapted to reflect the millimeter wave/terahertz wave from the second working plate onto the chopper;

The chopper is located on the reflected wave path of the first working plate and the reflected wave path of the seventh reflecting plate, and the chopper is configured to only receive millimeter waves from the first working plate at any time/ The terahertz wave or only the millimeter wave/terahertz wave from the seventh reflecting plate is reflected or transmitted to the millimeter wave/terahertz wave detector array, and the chopper is rotated about its central axis to cause the The millimeter wave/terahertz waves of the first working plate and the seventh reflecting plate are alternately received by the millimeter wave/terahertz wave detector array; and

The millimeter wave/terahertz wave detector array is suitable for receiving beams from the quasi-optical assembly.
The millimeter wave/terahertz wave imaging device according to claim 32, wherein the quasi-optical assembly further includes a focusing lens, the focusing lens is located in the chopper and the millimeter wave/terahertz wave detector array between.
The millimeter wave/terahertz wave imaging device according to claim 32, wherein the quasi-optical assembly further includes a first focusing lens and a second focusing lens, the first focusing lens is located on the first working plate and the Between the chopper, the second focusing lens is located between the second working plate and the seventh reflecting plate.
The millimeter wave/terahertz wave imaging device according to claim 32, further comprising a wave absorbing material adapted to absorb the millimeter wave reflected from the first working plate via the chopper /THz wave, and the millimeter wave/THz wave transmitted from the seventh reflector through the chopper.
The millimeter-wave/terahertz-wave imaging device according to claim 32, wherein the number of the reflection plates of the polygon mirror is m, where 6≥m≥3.
The millimeter wave/terahertz wave imaging device according to claim 36, wherein m of the reflection plates are all parallel to the rotation axis.
The millimeter wave/terahertz wave imaging device according to claim 36, wherein the angle between the m number of the reflection plates and the rotation axis increases or decreases along the rotation direction of the polygon mirror.
The millimeter wave/terahertz wave imaging device according to claim 32, further comprising a housing, the quasi-optical component and the millimeter wave/terahertz wave detector array are located in the housing, the housing The opposite side walls of the are respectively provided with a first window through which the beam from the first object to be inspected passes and a second window through which the beam from the second object to inspect passes through.
The millimeter wave/terahertz wave imaging device according to any one of claims 32-39, further comprising:

A data processing device connected to the millimeter wave/terahertz wave detector array to respectively receive image data for the first subject from the millimeter wave/terahertz wave detector array and And generate millimeter wave/terahertz wave images for the image data of the second object to be inspected; and

A display device connected to the data processing device for receiving and displaying millimeter wave/terahertz wave images from the data processing device.
The millimeter wave/terahertz wave imaging apparatus according to claim 40, further comprising an alarm device connected to the data processing device so that when the data processing device recognizes the millimeter wave/ When there is a suspicious item in the terahertz wave image, an alarm indicating that there is a suspicious item in the millimeter wave/terahertz wave image is issued.
The millimeter wave/terahertz wave imaging apparatus according to claim 40, further comprising a calibration source, the calibration source is located on the object surface of the quasi-optical assembly, and the data processing device receives the millimeter wave/ The calibration data of the terahertz wave detector array for the calibration source, and update the image data of the first object and the image data of the second object based on the calibration data.
The millimeter wave/terahertz wave imaging apparatus according to claim 40, further comprising an optical imaging device, the optical imaging device including a first optical imaging device adapted to acquire an optical image of the first object to be inspected and A second optical imaging device suitable for acquiring an optical image of the second object to be inspected, the first optical imaging device and the second optical imaging device are respectively connected to the display device.
The millimeter wave/terahertz wave imaging apparatus according to claim 43, wherein the display device includes a display screen, and the display screen includes a first display area suitable for displaying the millimeter wave/terahertz wave image and In a second display area for displaying the optical image collected by the optical camera device.
A method for detecting a human body or an article using the millimeter wave/terahertz wave imaging device according to any one of claims 32-43 includes the following steps:

S1: driving the rotating mirror of the polyhedron to make the multiple reflecting plates alternately serve as the first working plate to receive and reflect the spontaneously radiated or reflected millimeter wave/terahertz of the part of the first object at different positions in the first field of view Wave beam; another reflecting plate adjacent to the first working plate among the plurality of reflecting plates is used as a second working plate to receive and reflect the part of the second inspected object located at a different position in the second field of view spontaneously The millimeter wave/terahertz wave radiated or reflected back; while the polyhedron rotating mirror rotates, the chopper rotates about its central axis to make the millimeter wave/terahertz wave and the seventh reflection from the first working plate The millimeter wave/terahertz wave reflected from the second working plate is alternately received by the millimeter wave/terahertz wave detector array;

S2: Send the image data about the first object and the image data about the second object received by the millimeter wave/terahertz wave detector array to the data processing device; and

S3: Reconstruct the image data of the first object and the image data of the second object using the data processing device to generate the first object and the second object Millimeter wave/terahertz wave image.