CN209182530U - Millimeter wave/THz wave imaging device - Google Patents

Millimeter wave/THz wave imaging device Download PDF

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Publication number
CN209182530U
CN209182530U CN201822275813.8U CN201822275813U CN209182530U CN 209182530 U CN209182530 U CN 209182530U CN 201822275813 U CN201822275813 U CN 201822275813U CN 209182530 U CN209182530 U CN 209182530U
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China
Prior art keywords
wave
reflecting plate
millimeter wave
thz
imaging device
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CN201822275813.8U
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Chinese (zh)
Inventor
赵自然
游�燕
金颖康
解欢
乔灵博
刘文国
马旭明
温建国
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Tsinghua University
Nuctech Co Ltd
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Tsinghua University
Nuctech Co Ltd
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Abstract

Disclose a kind of millimeter wave/THz wave imaging device, it include: quasi-optics component, it includes V-arrangement reflecting plate and third reflecting plate, V-arrangement reflecting plate includes the first reflecting plate and the second reflecting plate, V-arrangement reflecting plate can be swung around its axis of oscillation so that the first reflecting plate receives respectively and reflects the wave beam for being located at the part of the first visual field different location from the first checked object, and the second reflecting plate receives respectively and reflect the wave beam that the second checked object is located at the part of the second visual field different location;Chopper is configured to be only from the beams incident from the second reflecting plate of the first reflecting plate or third baffle reflection at any one time to detector array, and chopper is around center axis thereof rotation so that the wave beam from the first reflecting plate and third reflecting plate is alternately received by detector array.Two checked objects can be imaged simultaneously in the equipment, and detection efficiency is high, detector utilization rate is high.

Description

Millimeter wave/THz wave imaging device
Technical field
This disclosure relates to technical field of imaging, more particularly to a kind of millimeter wave/THz wave imaging device.
Background technique
Under the increasingly serious situation of current anti-probably situation both at home and abroad, terrorist carries knife in the way of concealment The dangerous goods such as tool, gun, explosive constitute serious threat to public safety.Based on passive millimeter wave/THz wave Human body safety check technology, have the advantages that uniqueness, by detect target itself millimeter wave/terahertz radiation realize imaging, It is radiated without active, safety check is carried out to human body, the inspection for concealing danger is realized using millimeter wave/THz wave penetration capacity It surveys.However existing millimeter wave/THz wave imaging device working efficiency is low.
Utility model content
The purpose of the disclosure aims to solve the problem that at least one aspect of the above-mentioned problems in the prior art and defect.
In accordance with an embodiment of the present disclosure, a kind of millimeter wave/THz wave imaging device is provided, including quasi-optics component, Millimeter wave/terahertz wave detector array and chopper,
The quasi-optics component includes:
V-arrangement reflecting plate, the V-arrangement reflecting plate include the first reflecting plate and the second reflecting plate, and the V-arrangement reflecting plate can be around Its axis of oscillation is swung, so that first reflecting plate, which is received respectively and reflected, is located at the first visual field from the first checked object The part spontaneous radiation of different location or reflected millimeter wave/THz wave and second reflecting plate receive respectively And reflect the second checked object be located at the second visual field different location part spontaneous radiation or reflected millimeter wave/Terahertz Wave;With
Third reflecting plate, the third reflecting plate is adapted to will be from millimeter wave // THz wave of second reflecting plate It is reflected on the chopper;
The chopper is located at the reflection wave paths of first reflecting plate and the back wave road of the third reflecting plate, institute Chopper is stated to be configured to be only from millimeter wave/THz wave of first reflecting plate at any one time or be only from described The millimeter wave of three reflecting plates/THz wave reflection is transmitted to the millimeter wave/terahertz wave detector array, the chopper Around center axis thereof rotate so that millimeter wave/THz wave from first reflecting plate and the third reflecting plate alternately By the millimeter wave/terahertz wave detector array received;And
The millimeter wave/terahertz wave detector array is suitable for receiving the wave beam from the quasi-optics component.
In some embodiments, the quasi-optics component further includes condenser lens, and the condenser lens is located at the copped wave Between device and the millimeter wave/terahertz wave detector array.
In some embodiments, the quasi-optics component further includes the first condenser lens and the second condenser lens, and described For one condenser lens between first reflecting plate and the chopper, second condenser lens is located at second reflection Between plate and the third reflecting plate.
In some embodiments, the millimeter wave/THz wave imaging device further includes absorbing material, and the absorbing material is suitable For absorbing the millimeter wave/THz wave from first reflecting plate reflected via the chopper, and via described Millimeter wave/THz wave from the third reflecting plate of chopper transmission.
In some embodiments, the angle between the reflecting surface of first reflecting plate and the reflecting surface of second reflecting plate Degree is 240 ° to 300 °.
In some embodiments, the chopper includes at least one blade.
In some embodiments, multiple blades are equally spaced about the central axis setting.
In some embodiments, the millimeter wave/THz wave imaging device further includes shell, the quasi-optics component and institute It states millimeter wave/terahertz wave detector array to be located in the shell, be respectively arranged in the opposing sidewalls of the shell for coming The first window that is passed through from the wave beam of first checked object and passed through for the wave beam from second checked object the Two windows.
In some embodiments, the millimeter wave/THz wave imaging device further includes being suitable for driving the V-arrangement reflecting plate The first driving device of swing.
In some embodiments, the millimeter wave/THz wave imaging device further includes being suitable for that the chopper is driven to turn The second dynamic driving device.
In some embodiments, the millimeter wave/THz wave imaging device further include:
Data processing equipment, the data processing equipment are connect to divide with the millimeter wave/terahertz wave detector array Not Jie Shou from the millimeter wave/terahertz wave detector array for the image data of first checked object and for The image data of second checked object simultaneously generates millimeter wave/THz wave image respectively;With
Display device, the display device are connected with the data processing equipment, for receiving and showing from described The millimeter wave of data processing equipment/THz wave image.
In some embodiments, the millimeter wave/THz wave imaging device further includes warning device, the warning device with The data processing equipment connection, so that when the data processing equipment identifies in the millimeter wave/THz wave image Suspicious object when issue instruction the millimeter wave/THz wave image there are the alarms of suspicious object.
In some embodiments, the millimeter wave/THz wave imaging device further includes calibration source, and the calibration source is located at institute On the object plane for stating quasi-optics component, the data processing equipment is received from the millimeter wave/terahertz wave detector array For the calibration data of the calibration source, and update based on the calibration data image data and the institute of first checked object State the image data of the second checked object.
In some embodiments, the millimeter wave/THz wave imaging device further includes optical pick-up apparatus, and the optics is taken the photograph As device includes being suitable for acquiring the first optical pick-up apparatus of the optical imagery of first checked object and being suitable for acquiring Second optical pick-up apparatus of the optical imagery of second checked object, first optical pick-up apparatus and second light Photographic device is learned to connect with the display device respectively.
In some embodiments, the display device includes display screen, and the display screen includes being suitable for showing the milli The first viewing area of metric wave/THz wave image and suitable for showing optical pick-up apparatus optical imagery collected Second viewing area.
According to millimeter wave/THz wave imaging device described in the above-mentioned various embodiments of the disclosure, pass through driving V-arrangement reflection Plate is swung around its axis of oscillation, to be received and be reflected from the first checked object by the first reflecting plate and the second reflecting plate respectively With the wave beam of the second checked object, and chopper is configured to be only from the millimeter wave of the first reflecting plate/too at any one time Hertz wave is transmitted to millimeter wave/terahertz wave detector array or is only from the second reflecting plate and passes through third baffle reflection Millimeter wave/THz wave is reflected into millimeter wave/terahertz wave detector array, and the chopper is rotated around center axis thereof Alternately to make millimeter wave/THz wave from the first reflecting plate and third reflecting plate by millimeter wave/terahertz wave detector Array received is imaged two checked objects to realize, thus improves detection efficiency, and detector utilization rate height, It controls simple, at low cost.
Detailed description of the invention
Fig. 1 is millimeter wave/THz wave imaging device structural schematic diagram according to an embodiment of the disclosure;
Fig. 2 is the knot according to millimeter wave/THz wave imaging device of another embodiment of the present disclosure after removing shell Structure schematic diagram;
Fig. 3 is millimeter wave/THz wave imaging device V-arrangement reflecting plate according to an exemplary embodiment of the disclosure Scheme of installation;
Fig. 4 is the side view of V-arrangement reflecting plate shown in Fig. 3;
Fig. 5 is the knot according to an exemplary embodiment of millimeter wave/THz wave imaging device chopper of the disclosure Structure schematic diagram;
Fig. 6 is the another exemplary embodiment according to millimeter wave/THz wave imaging device chopper of the disclosure Structural schematic diagram;
Fig. 7 is another exemplary embodiment according to millimeter wave/THz wave imaging device chopper of the disclosure Structural schematic diagram;
Fig. 8 is the another exemplary embodiment according to millimeter wave/THz wave imaging device chopper of the disclosure Structural schematic diagram;
Fig. 9 is the schematic diagram of lens imaging;
Figure 10 is to be examined according to millimeter wave/THz wave imaging device of an embodiment of the disclosure to human body or article The flow chart for the method looked into;And
Figure 11 is millimeter wave/THz wave imaging device application scenario diagram according to an embodiment of the disclosure.
Specific embodiment
Although being answered the disclosure is fully described referring to the attached drawing of the preferred embodiment containing the disclosure before being described herein Disclosure described herein can be modified by understanding those skilled in the art, while obtain the technical effect of the disclosure.Cause This, it should be understood that above description is an extensive announcement for those of ordinary skill in the art, and its content does not lie in limit Exemplary embodiment described in the disclosure processed.
In addition, in the following detailed description, to elaborate many concrete details to provide to present disclosure convenient for explaining The comprehensive understanding of embodiment.It should be apparent, however, that one or more embodiments without these specific details can also be with It is carried out.In other cases, well known construction and device is diagrammatically embodied to simplify attached drawing.
Millimeter wave/THz wave imaging that Fig. 1 schematically shows a kind of exemplary embodiment according to the disclosure is set Standby 100.As shown, the millimeter wave/THz wave imaging device 100 includes quasi-optics component, millimeter wave/THz wave detection Device array 2 and chopper 8, wherein quasi-optics component includes V-arrangement reflecting plate 1, V-arrangement reflecting plate 1 include the first reflecting plate 1A and with Second reflecting plate 1B of the first reflecting plate 1A connection, the first reflecting plate 1A be suitable for the first checked object 31A spontaneous radiation or Reflected millimeter wave/THz wave is reflected, and the second reflecting plate 1B is suitable for the second checked object 32B spontaneous radiation Or reflected millimeter wave/THz wave is reflected, V shape reflecting plate 1 can be swung around axis of oscillation o so that first Reflecting plate 1A is received respectively and is reflected the wave for being located at the part of the first visual field 3A difference vertical position from the first checked object 31A Beam and the second reflecting plate 1B, which are received respectively and reflected the second checked object 31B, is located at the second visual field 3B difference vertical position Partial wave beam, wherein axis of oscillation o is located at the junction of the first reflecting plate 1A and the second reflecting plate 1B.The quasi-optics component It further include third reflecting plate 7, third reflecting plate 7 is adapted on the beams reflected to chopper 8 for reflecting the second reflecting plate 1B. Collimating optical element further includes the first condenser lens 4A and the second condenser lens 4B, which is suitable for convergence and comes from The wave beam of first reflecting plate 1A, the second condenser lens 4B are suitable for converging the wave beam from the second reflecting plate 1B.Chopper 8 In the reflection wave paths of the first reflecting plate 1A and the back wave road of third reflecting plate 7, and it is configured to only come at any one time Millimeter wave/terahertz wave detector is reflected into from the first reflecting plate 1A or the millimeter wave/THz wave for being only from third reflecting plate 7 Array 2, chopper 8 can rotate around center axis thereof 81 so that the millimeter wave from the first reflecting plate 1A and third reflecting plate 7/ THz wave is alternately received by millimeter wave/terahertz wave detector array 2.Millimeter wave/terahertz wave detector array 2 is applicable in Wave beam after reception is reflected and converged from quasi-optics component;Detector in millimeter wave/terahertz wave detector array 2 Number determines that arragement direction is vertical and parallel with visual field normal according to required visual field 3A, 3B size and required resolution ratio It is determined in the size of horizontal plane, detector according to wavelength, processing technology and required sampling density.
Millimeter wave according to an embodiment of the present disclosure/THz wave imaging device 100, by driving V shape reflecting plate 1 around The junction of first reflecting plate 1A and the second reflecting plate 1B are swung, to be respectively completed the number to the first visual field 3A and the second visual field 3B According to acquisition, during V-arrangement reflecting plate 1 is swung, by chopper 8 by the millimeter from the first visual field 3A and the second visual field 3B Wave/THz wave is to switch alternately to the same millimeter wave/terahertz wave detector array 2, to realize to positioned at two views While two checked objects 31A, 31B of field 3A, 3B are imaged, millimeter wave/terahertz wave detector number can be reduced Amount, to reduce equipment cost, and space occupied is small.
In this embodiment, condenser lens 4 includes the first condenser lens 4A and the second condenser lens 4B, the first condenser lens For 4A between the first reflecting plate 1A and chopper 8, the second condenser lens 4B is located at the second reflecting plate 1B and third reflecting plate 7 Between, the focal length of two condenser lenses 4A, 4B are respectively that the size of f1, f2, wherein f1 and f2 can be the same, are also possible to It is different.It is placed in the wave paths after condenser lens 4A, 4B focusing due to chopper 8, the blade of chopper 8 82 size can be smaller, and in this case, the specific size of the blade 82 of chopper 8 by condenser lens 4A, 4B by gathering The beam spot size in the defocused place in pre-placing chopper 8 determines.Assuming that being cut after condenser lens 4A, 4B focusing in pre-placing The beam size in the place of wave device 8 is wcut, then the size (area) of the blade 82 of chopper 8 is selected as
It should be noted that it will be understood by those of skill in the art that such as scheming in some other embodiment of the disclosure Shown in 2, a condenser lens 4 can also be used, which is located at chopper 8 and millimeter wave/terahertz wave detector battle array Between column 2.In this case, since chopper 8 is placed in unfocused wave paths, so the size of its blade 82 is answered Match with the reflecting surface of V-arrangement reflecting plate.
In Fig. 1 and exemplary embodiment shown in Fig. 2, the millimeter wave/THz wave imaging device 100 further includes inhaling Wave material 9, the absorbing material 9 are suitable for absorbing the millimeter wave/Terahertz from the first reflecting plate 1A reflected via chopper 8 Wave, and the millimeter wave/THz wave from third reflecting plate 7 transmitted via chopper 8.
In Fig. 1 and exemplary embodiment shown in Fig. 2, the non-reflecting surface of the first reflecting plate 1A and the second reflecting plate 1B's Angle, θ between non-reflecting surface is 90 °, i.e. angle between the reflecting surface of the first reflecting plate 1A and the reflecting surface of the second reflecting plate 1B Degree is 270 °.It should be noted that it will be understood by those of skill in the art that in some other embodiment of the disclosure, Angle between the reflecting surface of one reflecting plate 1A and the reflecting surface of the second reflecting plate 1B may be other numerical value, such as In the range of 240 ° to 300 °.
In Fig. 1 and exemplary embodiment shown in Fig. 2, the first reflecting plate 1A and the second reflecting plate 1B are rectangle, Length and width should match with corresponding condenser lens 4A, 4B, it is generally the case that the first reflecting plate 1A and the second reflecting plate 1B Width be greater than or equal to the diameter of corresponding condenser lens 4A, 4B, the length of the first reflecting plate 1A and the second reflecting plate 1B are answered For its widthTimes, the diameter of condenser lens 4A, 4B for example can be 3cm-50cm.
As shown in Figure 1, the millimeter wave/THz wave imaging device 100 further includes shell in a kind of exemplary embodiment Body 6, quasi-optics component and millimeter wave/terahertz wave detector array 2 are located in shell 6, in the opposing sidewalls of shell 6 respectively It is provided with the first window 61A for supplying millimeter wave/THz wave of the first checked object 31A spontaneous radiation to pass through and is detected for second The second window 61B that millimeter wave/THz wave of object 31B spontaneous radiation passes through.
As shown in Figure 3 and Figure 4, in a kind of exemplary embodiment, the connection of the first reflecting plate 1A and the second reflecting plate 1B Place is provided with shaft 11, and the both ends of shaft 11 are rotatably coupled via bearing 10A, 10B and shell 6, so that V-arrangement reflects Plate 1 can be swung, so that the first reflecting plate 1A and the second reflecting plate 1B are located at view to from checked object 31A, 31B respectively The wave beam of the part of field 3A, 3B difference vertical position is reflected.
As shown in Figure 3 and Figure 4, in a kind of exemplary embodiment, the millimeter wave/THz wave imaging device 100 is also wrapped Include the first driving device 13 for being suitable for that V-arrangement reflecting plate is driven to swing, such as servo motor.
As shown in Figure 3 and Figure 4, in a kind of exemplary embodiment, the millimeter wave/THz wave imaging device 100 is also wrapped The angle displacement measurement mechanism 12 of the angular displacement of real-time detection V-arrangement reflecting plate 1, such as photoelectric code disk are included, so that V is accurately calculated The posture of shape reflecting plate 1, this can reduce the development difficulty of control algolithm and imaging algorithm to a great extent.
Fig. 5 to Fig. 8 respectively illustrates the structural schematic diagram of several choppers, and chopper 8 includes at least one blade, such as 1,2,3 and 4 etc., multiple blades 82 are equally spaced about the setting of central axis 81.In chopper 8 around center axis thereof During 81 rotations, at any one time when millimeter wave/THz wave from the first reflecting plate 1A is incident on the leaf of chopper 8 On piece 82, which is reflected into absorbing material 9 for millimeter wave/THz wave from the first reflecting plate 1A, by suction wave material Material 9 absorbs, while millimeter wave/THz wave from third reflecting plate 7 is reflected into millimeter wave/terahertz wave detector array 2.As chopper 8 is around the rotation of center axis thereof 81, in subsequent time, millimeter wave/Terahertz from the first reflecting plate 1A Wave is incident on the part (i.e. empty part) that chopper 8 is not provided with blade 82, to be transmitted to millimeter wave/terahertz wave detector Array 2, the part which is not provided with blade 82 simultaneously transmit the millimeter wave from third reflecting plate 7/THz wave It is circuited sequentially down to absorbing material 9 with being absorbed by absorbing material 9.
It should be noted that chopper 8 can also be by that can be quickly switched into other dresses of high reflection and highly transmissive state It sets to replace.
In Fig. 1 and exemplary embodiment shown in Fig. 2, chopper 8 and the wave paths from the first reflecting plate 1A and come from The wave paths of third reflecting plate 7 are in that 45 degree of angles are placed.It should be noted that it will be understood by those of skill in the art that at this In some other disclosed embodiment, chopper 8 and the wave paths from the first reflecting plate 1A and the wave from third reflecting plate 7 Road can also be placed in other angles.
In a kind of unshowned exemplary embodiment, the millimeter wave/THz wave imaging device 100 further includes being suitable for The second driving device for driving chopper 8 to rotate, such as servo motor, to drive chopper 8 to revolve at a high speed around center axis thereof 81 Turn, the swing circle of chopper 8 should match with the scan period of V-arrangement reflecting plate 1, so as to the millimeter wave/THz wave Imaging device 100 can simultaneously be imaged two checked objects of two visual fields 3A, 3B respectively, the preferably rotation of chopper 8 The turn-week phase is the 1/1000-1/2 of the scan period of V-arrangement reflecting plate 1.
In this embodiment, the static visual field of detector is horizontal field of view, it is assumed that the number of detector is N, and two adjacent Detector center spacing d when, then the maximum offset-fed distance y of detectorm, then
It is possible thereby to which calculating the static visual field of millimeter wave/terahertz wave detector array 2 is H0.As shown in figure 9, millimeter The static visual field H of wave/terahertz wave detector array 20With object distance L1, image distance L2Need to meet following relational expression
V-arrangement reflecting plate 1 is swung around its pivot center o, and the angular dimension of swing is determined by the field range of short transverse, Assuming that the maximum pendulum angle of first reflecting plate 1A, 1B is θrot, corresponding scanning field of view angle is θm=2 θrot
Wherein, the first reflecting plate 1A (the second reflecting plate 1B) is completed to the view where corresponding checked object 31A (31B) The times N swung required for the reflection of the vertical range in fieldvIt is calculate by the following formula:
In formula, [], expression rounded up;
L be visual field 3A (3B) center to the center of the first reflecting plate 1A (the second reflecting plate 1B) distance;
δ indicates object space resolution ratio;
θmCorresponding field of view angle is beaten for vertical field range.
V-arrangement reflecting plate 1 swings the acquisition that a cycle completes 2 width images to each visual field, i.e. the first reflecting plate 1A (second Reflecting plate 1B) during up swinging and past lower swing, all acquire data.
Short transverse sampling density is decided by that wave beam residence time, reflecting plate 1 swing half period and (put from maximum angle To minimum angles, or otherwise), each visual field respectively exports a sub-picture.Assuming that the angular resolution of detector is θres, reflecting plate 1 Swinging the 3dB numbers of beams that half period includes is
N=360 °/θres (4)
Assuming that imaging rate requirement be mHz, then it is each sampling wave beam the average residence time τ in short transversedFor
At image-forming range system 3000mm, angular resolution θres=0.57 °, then object space resolution ratio is δ=30mm, imaging For rate 10Hz, the step number that can be acquired in the hope of short transverse is about 67, and average each wave beam residence time is τd= 125ms/632=198 μ s.First driving device 13 controls V-arrangement reflecting plate and swings, frequency 5Hz.
In a kind of exemplary embodiment, work in millimeter wave/THz wave imaging device that centre frequency is 94GHz 100, it detector number N=30, forms a line, the center spacing d=7mm of detector, the long 2y of detector arraym=21cm. Object distance Ll=3.5m, image distance L2=0.7m can calculate static visual field H according to formula (2)0=105cm.Assuming that imaging region Short transverse size is 1.8m, then the scanning angle of the short transverse for reconstruction image is θm=34 °.
In a further exemplary embodiment, it works in millimeter wave/THz wave imaging device that centre frequency is 220GHz 100, it detector number N=48, forms a line, d=3mm between the center of detector, detector array length is 2ym= 14.4cm.Object distance Ll=5m, image distance L2=0.7m can calculate static visual field H according to formula (2)0=103cm.It assumes Picture region height direction size is 1.8m, then the scanning angle of the short transverse for reconstruction image is θm=20 °.
In a kind of exemplary embodiment, the millimeter wave/THz wave imaging device 100 further includes data processing equipment (not shown).The data processing equipment and millimeter wave/terahertz wave detector array 2 are wirelessly connected or wired connection is with respectively It is received about the first checked object 31A and about the second checked object to receive 2 institute of millimeter wave/terahertz wave detector array The image data of 31B.
In one exemplary embodiment, which can also include display device, at the display device and data Reason device is connected, for receiving and showing the millimeter wave from data processing equipment/THz wave image.
As shown in Figure 1, the millimeter wave/THz wave imaging device 100 further includes school in a kind of exemplary embodiment Quasi- source 5, the calibration source 5 are located in shell 6 and on the object plane of quasi-optics component, so that when (second is anti-by the first reflecting plate 1A Penetrate plate 1B) when turning to calibration region, passes through millimeter wave/terahertz wave detector array 2 and receive calibration number about calibration source 5 According to, data processing equipment receive millimeter wave/terahertz wave detector array 2 the received calibration data about calibration source 5, and Update the image data of the first checked object 31A and the second checked object 31B in real time based on calibration data.Due to calibration source 5 It is encapsulated in inside shell 1, so that the millimeter wave/THz wave imaging device 100 using the air of distant place than being calibrated It is more reliable and more stable.
In this embodiment, calibration source 5 is located at the oblique upper of V-arrangement reflecting plate, it should be noted that the position of calibration source 5 As long as millimeter wave/terahertz wave detector array 2 is made to receive calibration data and checked object 31A, 31B about calibration source 5 Image data do not interfere, calibration source 5 radiate wave beam via the first reflecting plate 1A and/or the second reflecting plate 1B It is reflected into millimeter wave/terahertz wave detector array 2, may be implemented to connect to comprising condenser lens 4 and the complete of detector in this way The calibration for receiving channel, further ensures the consistency in channel.
In Fig. 1 and exemplary embodiment shown in Fig. 2, the pivot center o of V-arrangement reflecting plate 1 is horizontally disposed, so that First reflecting plate 1A, the second reflecting plate 1B are to the portion for being located at visual field difference vertical position from corresponding checked object 31A, 31B The wave beam divided is reflected.It should be noted that it will be understood by those of skill in the art that some other in the disclosure is implemented In example, the pivot center o of V-arrangement reflecting plate 1 can also be vertically arranged, so that the first reflecting plate 1A, the second reflecting plate 1B are to next The wave beam for being located at the part of visual field different level position from corresponding checked object 31A, 31B is reflected.In addition, calibration source 5 The emissivity such as plastics, foam be can be close to 1 absorbing material, black matrix or semiconductor cooler etc. can also be used.
By nyquist sampling law, could at least restore completely there are two sampled point in a half-power beam width Image.Millimeter wave/terahertz wave detector array 2 arragement direction in the embodiment is vertical with visual field normal and is parallel to water Plane is sampled with the visual field to short transverse, and millimeter wave/terahertz wave detector array 2 arranging density determines sampling Density.Millimeter wave imaging system institute practical at image is gray level image, and space sampling frequency is wanted nyquist sampling is not achieved When asking (lack sampling), still target scene can be imaged, only imaging effect is relatively poor.It is brought to make up lack sampling Pixel missing, can in later period signal processing using interpolation algorithm increase packing density.
As shown in Figure 1, the length direction of calibration source 5 is parallel to turning for V shape reflecting plate in a kind of exemplary embodiment Axis 11, the length of calibration source 5 are more than or equal to millimeter wave/terahertz wave detector array 2 in the view being parallel on 11 direction of shaft Field size, the width of calibration source 5 are 10 times of the antenna beamwidth of millimeter wave/terahertz wave detector 2.However, it is necessary to say It is bright, it will be understood by those of skill in the art that the width of calibration source 5 may be millimeter wave/terahertz wave detector 1 times of antenna beamwidth or 2 times or other multiples.
In one embodiment, the millimeter wave/THz wave imaging device 100 further includes optical pick-up apparatus, the optics Photographic device includes being suitable for acquiring the first optical pick-up apparatus of the optical imagery of the first checked object 31A and being suitable for acquiring Second optical pick-up apparatus of the optical imagery of the second checked object 31B, the optical pick-up apparatus are connect with display device, the light Learning photographic device may be implemented visible light real time imagery, provide the image letter of the first checked object 31A and the second checked object 31B Breath, to be compareed with millimeter wave/THz wave image, for user's reference.
In a kind of unshowned exemplary embodiment, display device includes display screen, and display screen includes being suitable for display The first viewing area of the millimeter wave of first checked object 31A and the second checked object 31B/THz wave image and it is suitable for aobvious Show the second display of the optical imagery of optical pick-up apparatus the first checked object 31A collected and the second checked object 31B Area, in order to which user compares optical pick-up apparatus optical imagery collected and millimeter wave/THz wave image.
In a kind of unshowned exemplary embodiment, the millimeter wave/THz wave imaging device 100 further includes alarm Device, the warning device are connect with data processing equipment, so that when identifying that the first checked object 31A and/or second is tested When suspicious object in the millimeter wave of object 31B/THz wave image, such as the millimeter corresponding to corresponding checked object It sounds an alarm such as alarm lamp below wave/THz wave image to light, it should be noted that can also be using auditory tone cues Type of alarm.
In one exemplary embodiment, data processing equipment can be used for generating control signal and send control signal To first driving device 13 and the second driving device, rotated with respectively driving V-arrangement reflecting plate 1 and chopper 8.In another example In property embodiment, imaging device also may include and the mutually independent control device of data processing equipment.
As shown in fig. 7, the disclosure additionally provide it is a kind of using millimeter wave/THz wave imaging device 100 to human body or object The method that product are detected, comprising the following steps:
S1: driving V-arrangement reflecting plate 1 is swung, so that the first reflecting plate 1A is received respectively and reflected from first tested pair As 31A is located at millimeter wave/THz wave of the part of the first visual field 3A different location, the second reflecting plate 1B is received and is reflected respectively Second checked object 31B is located at millimeter wave/THz wave of the part of the second visual field 3B different location;It is put in V-arrangement reflecting plate 1 While dynamic, chopper 8 is rotated around center axis thereof so that millimeter wave/THz wave and third from the first reflecting plate 1A are anti- Millimeter wave/THz wave from the second reflecting plate 1B that plate 7 is reflected is penetrated alternately by millimeter wave/terahertz wave detector battle array Column 2 receive;
S2: by millimeter wave/terahertz wave detector array 2 image data obtained for the first checked object 31A Data processing equipment is sent to the image data about the second checked object 31B;
S3: the data processing equipment image data to the first checked object 31A and the second checked object 31B respectively are utilized Image data is rebuild to generate millimeter wave/THz wave image of the first checked object 31A and the second checked object 31B.
This method can carry out comprehensive imaging and detection to two checked objects 31A, 31B simultaneously, wherein tested pair As 31 can be human body, it is also possible to article.When checked object 31A, 31B are human bodies, the millimeter wave/THz wave imaging is set Standby 100 can cooperate article imaging device 200 to use, as shown in figure 11, two checked objects 31A and 31B respectively left side to Inspection position and right side suspected location are detected, alternatively, can also complete just as a checked object 31A in left side suspected location It after the detection of face, can run to along path shown in arrow to right side suspected location, and complete back side detection, without Checked object 31A, which is turned round, can be completed comprehensive detection.
In a kind of exemplary embodiment, this method is further comprising the steps of before step S3: when V-arrangement reflecting plate turns When moving calibration region, the calibration data about calibration source 5 is received by millimeter wave/terahertz wave detector array 2;And base In calibration source 5 calibration data real-time update received first checked object 31A and the second checked object 31B picture number According to.
The output voltage V of detectionoutCorresponding antenna temperature is TA, following relationship should be met,
TA=(Vout-b)/a (6)
In formula, a is gain calibration coefficient,
B is biasing calibration coefficient.
Therefore, calibration data based on calibration source 5 update the image data of received checked object 31 include to biasing The correction of calibration coefficient b and correction to gain calibration coefficient a.
In calibration region, the radiation brightness of calibration source 5 and its ambient enviroment can be considered as uniformly, i.e., all logical The antenna temperature T in roadAIt is consistent.When channel is completely the same, the output V of Caustic method receiving channeloutShould be completely the same, If output is inconsistent, needs to adjust the gain calibration coefficient a and biasing calibration coefficient b in each channel, export all channels Unanimously, to realize that the consistency in channel is adjusted.What gain scaling parameter a reflected is the overall gain and equivalent bandwidth in channel, This part has already passed through careful adjusting when channel debugging, it is believed that the gain calibration coefficient a in each channel is approximately equal, therefore Adjusting biasing calibration coefficient b is passed through in normal use process lieutenant colonel to complete.
In a kind of exemplary embodiment, calibration data based on calibration source 5 update received checked object 31 figure As data mainly include the correction to biasing calibration coefficient b, comprising the following steps:
A1: all channels of the millimeter wave/terahertz wave detector array are calculated in the multiple survey of the calibration region Measure the average value of output voltage
A2: the data after the detection zone calibration in each channel are the data V that the detection zone in each channel acquiresiIt subtracts The average valueThen again divided by the gain calibration coefficient a in each channeli
This method can carry out piece calibration with focal plane array 1 system receiving channel array, and calibration algorithm only need to be transported simply It calculates, it is time-consuming few, real time calibration may be implemented;Passage consistency calibration is all carried out to each image.
When equipment longtime running or replacement field of employment when, due to system temperature drift and bring system The gain calibration coefficient a of penalty, each channel can generally also change.At this moment the gain calibration coefficient a to channel is needed It is adjusted with biasing calibration coefficient b, specifically includes following steps
B1: the millimeter wave/terahertz wave detector array measurement air voltage value V is usedair(i), i ∈ [1, lead to Road number], and calculate the average voltage level of the air in all channels
B2: the temperature of temperature and air that the calibration source is arranged has difference, uses the millimeter wave/THz wave Detector array measures the voltage value V of the calibration sourcecal(i), [1, port number] i ∈, and calculate the calibration source in all channels Average voltage levelAnd the gain calibration coefficient a in each channel is calculated by following equalitiesiWith biasing calibration coefficient bi:
B3: each channel detection zone calibration after data beAbsolute value, wherein ViThe data acquired for the detection zone in each channel.
It is acquired in each 3dB beam positional of data processing equipment twice, so in the embodiment shown in fig. 1, Mei Getong Road obtains at least ten acquisition data in calibration region.In the output voltage data of calibration region and the output voltage of detection zone Data are stored in the same data form of data processing equipment.
Property embodiment as an example, this method can also include S4: generate the first checked object 31A and the second quilt After the millimeter wave/THz wave image for examining object 31B, whether the first checked object 31A and the second checked object 31B are had The position of suspicious item and suspicious item identify and export result.
In above-mentioned steps, Computer Automatic Recognition or artificial knowledge can be passed through for the identification of suspicious item and its position Not or the two method for combining carries out.As a result output can be directly displayed for example, by showing to indicate on the display apparatus Whether the modes such as the conclusion of suspicious item are had to realize, can also will test result and directly print or send.
Execute detection security staff can according to the testing result that above-mentioned steps S4 is provided come to human body or article whether Position with suspicious item and suspicious item is confirmed, can also be checked by artificial detection.
It will be understood to those skilled in the art that embodiment described above is all exemplary, and this field Technical staff can make improvements, the rushing in terms of not recurring structure or principle of structure described in various embodiments It can be freely combined in the case where prominent.
After the preferred embodiment that the disclosure is described in detail, those skilled in the art can be apparent from, It does not depart from the protection scope of appended claims and spirit is lower can carry out various change and change, and the disclosure is also not only restricted to The embodiment of examples cited embodiment in bright book.

Claims (15)

1. a kind of millimeter wave/THz wave imaging device, which is characterized in that visited including quasi-optics component, millimeter wave/THz wave Device array and chopper are surveyed,
The quasi-optics component includes:
V-arrangement reflecting plate, the V-arrangement reflecting plate include the first reflecting plate and the second reflecting plate, and the V-arrangement reflecting plate can be around its pendulum Shaft line is swung, so that first reflecting plate, which is received respectively and reflected, is located at the first visual field difference from the first checked object The part spontaneous radiation of position or reflected millimeter wave/THz wave and second reflecting plate receive and anti-respectively Penetrate the second checked object be located at the second visual field different location part spontaneous radiation or reflected millimeter wave/THz wave; With
Third reflecting plate, the third reflecting plate is adapted to will the millimeter wave from second reflecting plate // THz wave reflection Onto the chopper;
The chopper is located at the reflection wave paths of first reflecting plate and the back wave road of the third reflecting plate, described to cut Wave device is configured to be only from millimeter wave/THz wave of first reflecting plate at any one time or to be only from the third anti- It penetrates millimeter wave/THz wave reflection of plate or is transmitted to the millimeter wave/terahertz wave detector array, the chopper is around it Center axis thereof so that millimeter wave/THz wave from first reflecting plate and the third reflecting plate alternately by institute State millimeter wave/terahertz wave detector array received;And
The millimeter wave/terahertz wave detector array is suitable for receiving the wave beam from the quasi-optics component.
2. millimeter wave according to claim 1/THz wave imaging device, which is characterized in that the quasi-optics component is also Including condenser lens, the condenser lens is between the chopper and the millimeter wave/terahertz wave detector array.
3. millimeter wave according to claim 1/THz wave imaging device, which is characterized in that the quasi-optics component is also Including the first condenser lens and the second condenser lens, first condenser lens is located at first reflecting plate and the chopper Between, second condenser lens is between second reflecting plate and the third reflecting plate.
4. millimeter wave according to claim 1/THz wave imaging device, which is characterized in that it further include absorbing material, institute Absorbing material is stated to be suitable for absorbing the millimeter wave/THz wave from first reflecting plate reflected via the chopper, And millimeter wave/the THz wave from the third reflecting plate transmitted via the chopper.
5. millimeter wave according to claim 1/THz wave imaging device, which is characterized in that first reflecting plate Angle between reflecting surface and the reflecting surface of second reflecting plate is 240 ° to 300 °.
6. millimeter wave according to claim 1/THz wave imaging device, which is characterized in that the chopper includes extremely A few blade.
7. millimeter wave according to claim 6/THz wave imaging device, which is characterized in that between multiple described blades etc. It is arranged every ground around the central axis.
8. millimeter wave according to claim 1/THz wave imaging device, which is characterized in that it further include shell, the standard Optical module and the millimeter wave/terahertz wave detector array are located in the shell, divide in the opposing sidewalls of the shell It is not provided with the first window for supplying millimeter wave/THz wave from first checked object to pass through and for from described second The second window that millimeter wave/THz wave of checked object passes through.
9. millimeter wave according to claim 1/THz wave imaging device, which is characterized in that further include being suitable for driving The first driving device that the V-arrangement reflecting plate is swung.
10. millimeter wave according to claim 1/THz wave imaging device, which is characterized in that further include being suitable for driving Second driving device of the chopper rotation.
11. millimeter wave according to claim 1 to 10/THz wave imaging device, which is characterized in that also wrap It includes:
Data processing equipment, the data processing equipment are connect with the millimeter wave/terahertz wave detector array to connect respectively It receives from the millimeter wave/terahertz wave detector array for the image data of first checked object and for described The image data of second checked object simultaneously generates millimeter wave/THz wave image respectively;With
Display device, the display device are connected with the data processing equipment, for receiving and showing from the data The millimeter wave of processing unit/THz wave image.
12. millimeter wave according to claim 11/THz wave imaging device, which is characterized in that it further include warning device, The warning device is connect with the data processing equipment so that when the data processing equipment identify the millimeter wave/ The instruction millimeter wave/THz wave image is issued when suspicious object in THz wave image, and there are the alarms of suspicious object.
13. millimeter wave according to claim 11/THz wave imaging device, which is characterized in that it further include calibration source, institute It states calibration source to be located on the object plane of the quasi-optics component, the data processing equipment, which receives, comes from the millimeter wave/Terahertz The calibration data for the calibration source of wave detector array, and first checked object is updated based on the calibration data Image data and second checked object image data.
14. millimeter wave according to claim 11/THz wave imaging device, which is characterized in that further include optical camera Device, the optical pick-up apparatus include the first optical camera dress suitable for acquiring the optical imagery of first checked object It sets and the second optical pick-up apparatus of the optical imagery suitable for acquiring second checked object, first optical camera fills It sets and is connect respectively with the display device with second optical pick-up apparatus.
15. millimeter wave according to claim 14/THz wave imaging device, which is characterized in that the display device packet Display screen is included, the display screen includes being suitable for showing the first viewing area of the millimeter wave/THz wave image and being applicable in In the second viewing area for showing the optical pick-up apparatus optical imagery collected.
CN201822275813.8U 2018-12-29 2018-12-29 Millimeter wave/THz wave imaging device Withdrawn - After Issue CN209182530U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109828313A (en) * 2018-12-29 2019-05-31 清华大学 Millimeter wave/THz wave imaging device and detection method to human body or article
WO2020134336A1 (en) * 2018-12-29 2020-07-02 清华大学 Millimeter-wave/terahertz-wave imaging apparatus, and inspection method for body or object

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109828313A (en) * 2018-12-29 2019-05-31 清华大学 Millimeter wave/THz wave imaging device and detection method to human body or article
WO2020134336A1 (en) * 2018-12-29 2020-07-02 清华大学 Millimeter-wave/terahertz-wave imaging apparatus, and inspection method for body or object
CN109828313B (en) * 2018-12-29 2023-11-24 清华大学 Millimeter wave/terahertz wave imaging device and method for detecting human body or article

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