WO2020133508A1 - Module d'antenne conditionné et dispositif électronique - Google Patents

Module d'antenne conditionné et dispositif électronique Download PDF

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Publication number
WO2020133508A1
WO2020133508A1 PCT/CN2018/125829 CN2018125829W WO2020133508A1 WO 2020133508 A1 WO2020133508 A1 WO 2020133508A1 CN 2018125829 W CN2018125829 W CN 2018125829W WO 2020133508 A1 WO2020133508 A1 WO 2020133508A1
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WO
WIPO (PCT)
Prior art keywords
antenna module
antenna
arm
packaged
substrate
Prior art date
Application number
PCT/CN2018/125829
Other languages
English (en)
Chinese (zh)
Inventor
赵伟
邾志民
马荣杰
Original Assignee
瑞声精密制造科技(常州)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞声精密制造科技(常州)有限公司 filed Critical 瑞声精密制造科技(常州)有限公司
Priority to PCT/CN2018/125829 priority Critical patent/WO2020133508A1/fr
Publication of WO2020133508A1 publication Critical patent/WO2020133508A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems

Definitions

  • the invention relates to the field of communication, in particular to a packaged antenna module and electronic equipment.
  • the International Telecommunication Union ITU identified three main application scenarios of 5G: enhanced mobile broadband, large-scale machine communications, and high-reliability and low-latency communications. These three application scenarios correspond to different key indicators, in which the peak user speed in the enhanced mobile bandwidth scenario is 20Gbps, and the minimum user experience rate is 100Mbps. Millimeter wave's unique high carrier frequency and large bandwidth characteristics are the main means to achieve 5G ultra-high data transmission rate. And the space reserved for 5G antennas in future mobile phones is small, and there are not many optional positions.
  • the object of the present invention is to provide a packaged antenna module to achieve a wide coverage and a small occupied space.
  • a packaged antenna module includes a substrate, antenna groups and integrated circuit chip groups disposed on opposite sides of the substrate, and a feed network embedded in the substrate, the integrated The circuit chip set includes a first integrated circuit chip and a second integrated circuit chip, and the antenna set includes a first antenna module electrically connected to the first integrated circuit chip and a second electrically connected to the second integrated circuit chip
  • the maximum radiation direction of the first antenna module is perpendicular to the substrate, and the maximum radiation direction of the second antenna module is parallel to the substrate and away from the first antenna module.
  • the first antenna module and the second antenna module are arranged side by side along a first direction, a number of the back cavity patch antenna units of the first antenna module and a number of the second antenna modules
  • the dipole antenna elements are all arranged in a straight line along the second direction, and the first direction is perpendicular to the second direction.
  • the antenna group includes a system ground stacked on the substrate, and the back cavity patch antenna unit includes a back cavity opened in the system ground, and an upper patch and a lower layer accommodated in the back cavity Patch, the upper layer patch is stacked on the side of the lower layer patch away from the substrate, the feeding network is electrically connected to the lower layer patch for feeding, the upper layer patch and the lower layer The patch is coupled to feed.
  • the antenna group further includes a clearance area arranged side by side at the end of the system
  • the dipole antenna unit includes a reversely extending first radiating arm and a second radiating arm provided at the clearance area ,
  • a first feed arm extending from an end of the first radiation arm near the second radiation arm perpendicular to the first radiation arm, and a vertical end from the end of the second radiation arm close to the first radiation arm
  • a second feed arm extending from the second radiation arm, the first feed arm is stacked on a side of the second feed arm away from the substrate, the first radiation arm and the first A feeding arm is arranged on the same plane, and the second radiation arm and the second feeding arm are arranged on the same plane.
  • both the first feed arm and the second feed arm extend along the first direction.
  • the first feed arm is electrically connected to the system ground
  • the second feed arm is electrically connected to the feed network to feed power
  • the system is provided with a clearing window adjacent to the clearing area, and the second feeding arm extends into the clearing window to be electrically connected to the feeding network.
  • the first antenna module includes 4 back cavity patch antenna units
  • the second antenna module includes 4 dipole antenna units.
  • the present invention also provides an electronic device, which includes a housing and the above-mentioned packaged antenna module.
  • the packaged antenna module is disposed in the housing.
  • the beneficial effect of the present invention is that: the first antenna module encapsulating the antenna module includes a plurality of back cavity patch antenna units, the second antenna module includes a plurality of dipole antenna units, and the first antenna module and the second antenna module respectively correspond to an integrated
  • the circuit chip has a high degree of integration, saving the space occupied by the packaged antenna module, and through the cooperation of the back cavity patch antenna unit and the dipole antenna unit, the coverage efficiency is high.
  • FIG. 1 is a logical block diagram of a packaged antenna module provided by the present invention.
  • FIG. 2 is a perspective structural view of a packaged antenna module provided by the present invention.
  • FIG. 3 is a top view of the packaged antenna module provided by the present invention.
  • FIG. 4 is an enlarged view of the area A in FIG. 2;
  • FIG. 5 is an enlarged view of area B in FIG. 2;
  • FIG. 6 is a beam direction diagram of the dipole antenna unit of the packaged antenna module provided by the present invention.
  • FIG. 7 is a beam direction diagram of the back cavity patch antenna unit of the packaged antenna module provided by the present invention.
  • an element when an element is referred to as being “fixed” or “disposed” on another element, the element can be directly on the other element or there can be a centering element at the same time.
  • an element When an element is said to "connect” another element, it may be directly connected to the other element or there may be a center element at the same time.
  • the packaged antenna module provided by the present invention is applied to an electronic device.
  • the electronic device includes a packaged antenna module and a housing.
  • the packaged antenna module is provided in the housing and used for transmitting and receiving signals.
  • the packaged antenna module includes a substrate 10, antenna groups 20 and integrated circuit chipsets 30 disposed on opposite sides of the substrate 10, and a feed network 40 embedded in the substrate 10, the integrated circuit chip
  • the group 30 includes a first integrated circuit chip 31 and a second integrated circuit chip 32
  • the antenna group 20 includes a first antenna module 21 electrically connected to the first integrated circuit chip 31 and a second antenna electrically connected to the second integrated circuit chip 32
  • the first antenna module 21 includes several back cavity patch antenna units 211
  • the second antenna module 22 includes several dipole antenna units 221.
  • the back cavity patch antenna unit 211 is electrically connected to the first integrated circuit chip 31, and the dipole antenna unit 221 is electrically connected to the second integrated circuit chip 32 through the cooperation of the back cavity patch antenna unit 211 and the dipole antenna unit 221 , To form a packaged antenna module, make full use of the substrate 10 space, high integration, and high coverage efficiency.
  • the maximum radiation direction of the first antenna module 21 is perpendicular to the substrate 10 to form an orthobeam
  • the maximum radiation direction of the second antenna module 22 is parallel to The substrate 10 and away from the first antenna module 21 form an end-fire beam, thereby increasing the coverage efficiency of the packaged antenna module.
  • the first antenna module 21 and the second antenna module 22 are arranged side by side along the first direction, and a plurality of back cavity patch antenna units 211 and the second antenna module 22 of the first antenna module 21
  • the plurality of dipole antenna units 221 are all arranged in a straight line along the second direction, and the first direction is perpendicular to the second direction.
  • the antenna group 20 includes a system ground 23 stacked on the substrate 10, and the back cavity patch antenna unit 211 includes a back cavity 212 opened in the system ground 23 and an upper patch contained in the back cavity 212 213 and the lower patch 214, the upper patch 213 is stacked on the side of the lower patch 214 away from the substrate 10, the feeding network 40 is electrically connected to the lower patch 214 for feeding, and the upper patch 213 is coupled to the lower patch 214 To feed.
  • the antenna group 20 further includes a clearance area 24 disposed side by side at the end of the system ground 23, and the dipole antenna unit 221 includes a reversely extending first radiation arm 222 and second radiation arm 223 disposed in the clearance area 24.
  • the end of the radiation arm 222 near the second radiation arm 223 is perpendicular to the first feed arm 224 extending from the first radiation arm 222 and the end of the second radiation arm 223 near the first radiation arm 222 is perpendicular to the second radiation arm 223
  • the second feed arm 225, the first feed arm 224 is stacked on the side of the second feed arm 225 away from the substrate 10, the first radiating arm 222 and the first feed arm 224 are disposed on the same plane, the second radiating The arm 223 and the second feeding arm 225 are disposed on the same plane.
  • both the first power feeding arm 224 and the second power feeding arm 225 extend along the first direction.
  • the first feed arm 224 is electrically connected to the system ground 23, and the second feed arm 225 is electrically connected to the feed network 40 to feed power.
  • the system ground 23 is provided with a clearance window 25 adjacent to the clearance area 24.
  • the second feed arm 225 extends into the clearance window 25 to be electrically connected to the feed network 40.
  • the first antenna module 21 includes 4 back cavity patch antenna units 211, and the second antenna module includes 4 dipole antenna units 221.
  • the second antenna module is provided with a system ground close to the first antenna module, the maximum radiation direction of the second antenna module is away from the first antenna module.
  • the coverage efficiency curve diagram of the packaged antenna module provided by the present invention As shown in FIG. 8, the coverage efficiency curve diagram of the packaged antenna module provided by the present invention, it can be seen that the packaged antenna provided by the present invention has better coverage efficiency.
  • the first antenna module 21 includes a plurality of back cavity patch antenna units 211
  • the second antenna module 22 includes a plurality of dipole antenna units 221
  • the modules 22 each correspond to an integrated circuit chip, which has a high degree of integration, saves the space occupied by the packaged antenna module, and through the cooperation of the back cavity patch antenna unit 211 and the dipole antenna unit 221, the coverage efficiency is high.

Landscapes

  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Details Of Aerials (AREA)
  • Support Of Aerials (AREA)

Abstract

La présente invention concerne un module d'antenne conditionné et un dispositif électronique. Le module d'antenne conditionné comprend un substrat, un groupe d'antennes et un groupe de puces de circuit intégré disposés sur deux côtés opposés du substrat, et un réseau d'alimentation intégré dans le substrat. Le groupe de puces de circuit intégré comprend une première puce de circuit intégré et une seconde puce de circuit intégré. Le groupe d'antennes comprend un premier module d'antenne connecté électriquement à la première puce de circuit intégré et un second module d'antenne connecté électriquement à la seconde puce de circuit intégré. Le premier module d'antenne comprend une pluralité d'éléments d'antenne à plaque à cavité, et le second module d'antenne comprend une pluralité d'éléments d'antenne dipôle. Selon le module d'antenne conditionné et le dispositif électronique de la présente invention, le module d'antenne conditionné est petit dans l'espace occupé et présente une efficacité de rayonnement élevée.
PCT/CN2018/125829 2018-12-29 2018-12-29 Module d'antenne conditionné et dispositif électronique WO2020133508A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/125829 WO2020133508A1 (fr) 2018-12-29 2018-12-29 Module d'antenne conditionné et dispositif électronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/125829 WO2020133508A1 (fr) 2018-12-29 2018-12-29 Module d'antenne conditionné et dispositif électronique

Publications (1)

Publication Number Publication Date
WO2020133508A1 true WO2020133508A1 (fr) 2020-07-02

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230114757A1 (en) * 2021-10-12 2023-04-13 Qualcomm Incorporated Multi-directional dual-polarized antenna system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1716695A (zh) * 2004-06-30 2006-01-04 国际商业机器公司 构建和封装印刷天线装置的设备和方法
US20100090903A1 (en) * 2006-12-05 2010-04-15 Woo-Jin Byun Omni-directional planar antenna
US20120154238A1 (en) * 2010-12-20 2012-06-21 Stmicroelectronics Sa Integrated millimeter wave transceiver
US20150070228A1 (en) * 2013-09-11 2015-03-12 International Business Machines Corporation Antenna-in-package structures with broadside and end-fire radiations
CN107134632A (zh) * 2016-02-29 2017-09-05 松下电器产业株式会社 天线基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1716695A (zh) * 2004-06-30 2006-01-04 国际商业机器公司 构建和封装印刷天线装置的设备和方法
US20100090903A1 (en) * 2006-12-05 2010-04-15 Woo-Jin Byun Omni-directional planar antenna
US20120154238A1 (en) * 2010-12-20 2012-06-21 Stmicroelectronics Sa Integrated millimeter wave transceiver
US20150070228A1 (en) * 2013-09-11 2015-03-12 International Business Machines Corporation Antenna-in-package structures with broadside and end-fire radiations
CN107134632A (zh) * 2016-02-29 2017-09-05 松下电器产业株式会社 天线基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230114757A1 (en) * 2021-10-12 2023-04-13 Qualcomm Incorporated Multi-directional dual-polarized antenna system
US11784418B2 (en) * 2021-10-12 2023-10-10 Qualcomm Incorporated Multi-directional dual-polarized antenna system

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