WO2020125690A1

WO2020125690A1 - Light-emitting device

Info

Publication number: WO2020125690A1
Application number: PCT/CN2019/126390
Authority: WO
Inventors: 洪裕萍; 黄泓文; 刘建男
Original assignee: 亿光电子工业股份有限公司
Priority date: 2018-12-21
Filing date: 2019-12-18
Publication date: 2020-06-25
Also published as: TWM601501U; CN214745483U

Abstract

A light-emitting device (1, 2), comprising a support structure (10, 10'), a packaging structure (20, 20'), a control element (30, 30'), a plurality of LED chips (40, 40'), and a plurality of colloids (50, 50', 60, 60'). The packaging structure (20, 20') is disposed on the support structure (10, 10'), and comprises a peripheral wall (210, 210') and an inner partition wall (220, 220') to form a plurality of accommodating chambers. The control element (30, 30') and the plurality of LED chips (40, 40') are located in different accommodating chambers, and are separated from each other by the inner partition wall (220, 220'). The plurality of colloids (50, 50', 60, 60') are respectively disposed in the plurality of accommodating chambers, and cover the control element (30, 30') and the plurality of LED chips (40, 40'). Thus, the light-emitting device can have multiple purposes and a compact structure, and the control element would not be easily damaged due to the irradiation of the light of the LED chips.

Description

Light emitting device

Technical field

The invention relates to a light-emitting device, in particular to a light-emitting device suitable for moving vehicles.

Background technique

Mobile vehicles (such as cars or locomotives) include several lighting devices, such as headlights, reversing lights, daytime running lights, taillights, direction lights, reading lights, and atmosphere lights. The light-emitting devices (light sources) in these lighting devices currently It includes a light-emitting diode (LED) chip and a package. The LED chip is packaged in the package. Then, the light emitting device is electrically connected to the control element outside the package.

Generally, in order to provide sufficient brightness, multiple light-emitting devices and a corresponding number of control elements are required. That is, each light-emitting device is connected to its own control element. The circuit design is intricate and it is difficult to reduce the distance between the light-emitting devices and the control element. Therefore, the light-emitting devices and the control elements occupy a lot of configuration space in the lighting equipment.

In addition, since the LED chip and the control element are not packaged together (that is, the LED chip and the control element are not provided in the same package), the LED chip and the control element need to be individually stocked, which inevitably increases costs. If the LED chip and the control element are packaged together, it will cause the control element to be damaged or fail due to the light irradiation of the LED chip, especially when the light intensity of the LED chip is high.

In addition, the lighting equipment of the mobile vehicle will emit different colors of light according to different uses. For example, reversing lights and daytime running lights usually emit white light, and tail lights and direction lights emit red and yellow lights.

In summary, in the technical field of light-emitting devices for mobile vehicles, there are several issues to be improved.

Summary of the invention

An object of the present invention is to provide a light-emitting device that can integrate an LED chip and a control element in the same packaging structure to reduce the volume of the light-emitting device, and the control element is not easily damaged by light from the LED chip.

To achieve the above object, the light-emitting device provided by the present invention may include a support structure, a packaging structure, a control element, a plurality of LED chips, a first colloid, a second colloid, and a third colloid. The bracket structure includes a plurality of conductive brackets, the packaging structure is disposed on the bracket structure, and includes an outer wall and an inner partition wall to form at least a first accommodating cavity, a second accommodating cavity and a third accommodating cavity Cavity. The control element is arranged on one of the conductive brackets and is located in the first accommodating cavity. The LED chips are arranged on the other of the conductive supports, and are respectively located in the second accommodating cavity and the third accommodating cavity, and are electrically connected to the control element. The first colloid is disposed in the first accommodating cavity and covers the control element. The second colloid and the third colloid are respectively disposed in the second accommodating cavity and the third accommodating cavity, and cover the LED chips.

To achieve the above object, the light-emitting device provided by the present invention may also include a support structure, a packaging structure, a control element, a plurality of LED chips, a first colloid, and a second colloid. The bracket structure includes a plurality of conductive brackets, the packaging structure is disposed on the bracket structure, and includes a peripheral wall and an inner partition wall to form at least a first receiving cavity and a second receiving cavity, wherein the inner partition wall The top surface of is lower than the top surface of the peripheral wall. The control element is disposed on one of the conductive brackets and is located in the first accommodating cavity, and the LED chips are disposed on the other of the conductive brackets and is located in the second accommodating cavity , And electrically connected to the control element, wherein the control element is electrically connected to the LED chips through a plurality of wires, and the wires cross a top surface of the inner partition wall. The first colloid and the second colloid are respectively disposed in the first accommodating cavity and the second accommodating cavity, and respectively cover the control element and the LED chips.

In an embodiment, a bottom area of the first accommodating cavity is larger than a bottom area of the second accommodating cavity or the third accommodating cavity.

In an embodiment, a top surface of the inner partition wall is lower than a top surface of the peripheral wall, but higher than the top surfaces of the LED chips and the top surface of the control element.

In an embodiment, the control element is electrically connected to the LED chips through a plurality of wires, and the wires cross a top surface of the inner partition wall.

In one embodiment, the inner partition wall includes a first inner wall and a second inner wall, and the first inner wall and the second inner wall intersect each other.

In one embodiment, the inner partition wall includes a first inner wall and a second inner wall, and the first inner wall and the second inner wall are parallel to each other.

In an embodiment, the LED chip includes a red LED chip, a green LED chip and a blue LED chip disposed in the second accommodating cavity,

In an embodiment, the LED chip includes two red LED chips and one yellow LED chip located in the second accommodating cavity,

In an embodiment, the LED chip further includes another blue LED chip disposed in the third receiving cavity, and the third colloid includes yellow photoluminescent material.

In an embodiment, the LED chip includes another blue LED chip located in the third accommodating cavity, and a fluorescent patch including a photoluminescent material is disposed on the other blue LED chip.

In an embodiment, the LED chip further includes a white LED chip disposed in the third receiving cavity.

In one embodiment, the LED chips are arranged in one direction.

In an embodiment, the first colloid includes a light scattering material, so that the first colloid is opaque.

The light-emitting device provided by the present invention may also include a support structure including a plurality of conductive supports;

The packaging structure, which is arranged on the support structure, includes an outer wall and an inner partition wall to form at least a first accommodating cavity and a second accommodating cavity, and the top surface of the inner partition wall is lower than the top surface of the peripheral wall; the control element , Which is arranged on one of the plurality of conductive supports and is located in the first accommodating cavity; the plurality of LED chips is arranged on the other of the plurality of conductive supports and is located in the second accommodating cavity, and is electrically The control element is electrically connected to the control element, and the control element is electrically connected to the plurality of LED chips through a plurality of wires, and the plurality of wires cross the top surface of the inner partition wall; and the first colloid and the second colloid are respectively disposed in the first accommodation cavity and The second accommodating cavity covers the control element and the multiple LED chips respectively.

In an embodiment, the bottom area of the first accommodating cavity is larger than the bottom area of the second accommodating cavity.

In one embodiment, the top surface of the inner partition wall is higher than the top surfaces of the plurality of LED chips and the top surfaces of the control elements.

In an embodiment, the plurality of LED chips include a red LED chip, a green LED chip, and a blue LED chip disposed in the second accommodating cavity.

In an embodiment, the plurality of LED chips include two red LED chips and a yellow LED chip disposed in the second accommodating cavity.

In an embodiment, the second colloid further covers the top surface of the inner partition wall and the top surface of the first colloid.

In order to make the above purpose, technical features and advantages more comprehensible, the following is a detailed description with preferred embodiments and accompanying drawings.

BRIEF DESCRIPTION

1 is a top view of a light emitting device according to a first preferred embodiment of the present invention;

2 is a perspective schematic view of a light emitting device according to a second preferred embodiment of the present invention;

3 is a top view of the light emitting device of FIG. 2;

4 is a bottom view of the light emitting device of FIG. 2; and

FIG. 5 is a cross-sectional view of the light emitting device of FIG. 2 (along the cutting plane line A-A of FIG. 3).

Description of Drawing Symbols:

1, 2 lighting device

10. 10’ Bracket structure

11, 12, 13, 14, 15, 16, 11’ conductive support

20, 20’ package structure

30, 30’ control elements

40, 40’ multiple LED chips

50, 50’ first colloid

60, 60’ second colloid

70 Third colloid

80, 80’ wire

210, 210’ peripheral wall

220, 220’ internal partition

221 the first interior wall

222 Second interior wall

230, 230’ first receiving cavity

240, 240’ second receiving cavity

250 third receiving cavity

2101, 2101’ top surface

2201, 2201’ top surface

40R red LED chip

40G green LED chip

40B Blue LED chip

40BW blue LED chip

detailed description

The following description will describe some embodiments of the present invention in detail in conjunction with the accompanying drawings. In the case of no conflict, the following embodiments and the features in the embodiments can be combined with each other. Unless the context clearly indicates otherwise, the singular form "a" as used herein also includes multiple forms, and the orientations (such as front, back, up, down, sides, horizontal, vertical, etc.) are relative orientations, It can be defined according to the use state of the light-emitting device, and it does not express or imply that the light-emitting device needs to have a specific direction of construction or operation, nor can it be understood as a limitation to the present invention.

Please refer to FIG. 1, which is a top view of the light emitting device 1 according to the first preferred embodiment of the present invention. The light-emitting device 1 can be used for mobile vehicles (such as cars, locomotives, etc.) as a light source of the lighting equipment of the mobile vehicle to generate lighting and indication light; in this embodiment, the light-emitting device 1 uses four LED chips 40 as For example, it is not limited to this. The light-emitting device 1 may include a support structure 10, a packaging structure 20, a control element 30, a plurality of LED chips 40, a first colloid 50, a second colloid 60 and a third colloid 70. The technical content of each element depends on The order is explained as follows.

The support structure 10 includes a plurality of spaced apart conductive supports (for example, conductive support 11 to conductive support 16) for conducting current. Conductive brackets are usually made of metal materials, metal alloys or metal plating with high conductivity. The packaging structure 20 is disposed on the support structure 10 and partially covers the support structure 10. The packaging structure 20 includes an outer peripheral wall 210 formed along the periphery of the support structure 10 and an inner partition wall 220 located inside the outer peripheral wall 210. The peripheral wall 210 can completely surround the support structure 10 to define an accommodating space on the support structure 10; some of the conductive supports can protrude or be exposed from the side or bottom of the peripheral wall 210. The inner partition wall 220 is disposed in the foregoing accommodating space and integrally connected with the peripheral wall 210, and the accommodating space is divided into a first accommodating cavity 230, a second accommodating cavity 240, and a third accommodating cavity 250.

Preferably, the inner partition wall 220 includes a first inner wall 221 and a second inner wall 222, and the first and second

inner walls

221 and 222 extend laterally, that is, perpendicular to the height direction of the inner partition wall 220 . In this embodiment, the first and second

inner walls

221 and 222 intersect each other, but the two may also be parallel to each other. Preferably, a bottom area of the first accommodating cavity 230 is greater than that of the second accommodating cavity 240 and the third accommodating cavity 250, and the bottom area of the second accommodating cavity 240 is greater than that of the third accommodating cavity 250 Bottom area; thus, the first accommodating cavity 230 can accommodate the control element 30 of a larger size, and the second accommodating cavity 240 can accommodate a larger number of LED chips 40.

The control element 30 can be a horizontal chip, a vertical chip or a flip chip, which is disposed on the conductive support 11 and is located in the first accommodating cavity 230. The control element 30 generally includes contacts such as a power supply terminal (VCC), a ground terminal (GND), a data input terminal (DIN), a data output terminal (DOUT), and a clock terminal (CLK), but is not limited thereto. The contacts can be electrically connected to the conductive supports via wires 80 respectively.

The control element 30 may be an ASIC, CPLD, or FPGA. ASIC is the abbreviation of English Application Specific Integrated Circuits, that is, an application specific integrated circuit, which refers to an integrated circuit designed and manufactured according to the requirements of specific users and the needs of specific electronic systems. FPGA is the abbreviation of English Field Programmable Gate Array, that is, field programmable gate array, it is in programmable array logic PAL (Programmable Array Logic), gate array logic GAL (Gate Array Logic), programmable logic device PLD (Programmable Logic Device) ) And other products developed on the basis of programmable devices. CPLD (Complex Programmable Logic Device) is a device developed from PAL and GAL devices. It is relatively large in scale and complex in structure, and belongs to the scope of large-scale integrated circuits. It is a kind of digital integrated circuit that users construct logic functions according to their own needs. The basic design method is to use the integrated development software platform, use schematics, hardware description languages, etc. to generate the corresponding target file, and transfer the program code to the target chip through the download cable ("in-system" programming) to realize the design of the digital system.

The LED chips 40 are disposed on the conductive support 12. In other words, the LED chips 40 are not disposed on the conductive support 11 where the control element 30 is located. The LED chips 40 are located in the second accommodating cavity 240 and the third accommodating cavity 250, in other words, part of the LED chips of the LED chips 40 are located in the second accommodating cavity 240, and the remaining part of the LED chips are located in In the third accommodating cavity 250; in addition, no LED chip 40 exists in the first accommodating cavity 230, only the control element 30 exists.

The LED chip 40 can be electrically connected to the

conductive brackets

13, 14, 15, and 16 carrying the inner partition wall 220 through the wire 80, and then electrically connected to the control element 30. In other embodiments (such as the second preferred embodiment to be described later), the LED chip 40 can also be electrically connected to the control element 30 via the wire 80 across the inner partition 220. At this time, the top surface 2201 of the inner partition 220 can be Lower than the top surface 2101 of the peripheral wall 210, but still higher than the top surface of the LED chip 40 and the top surface of the control element 30; in addition, the first inner wall 221 and the second inner wall 222 may have different height top surfaces 2201, It does not limit the height of the two.

Thereby, the control element 30 controls the operation of the LED chips 40, so that the LED chips 40 can be independently turned on or off, so that the LED chips 40 produce different color and/or brightness combinations. The control element 30 can also turn on the LED chips 40 simultaneously. In addition, when the LED chips 40 are lit, light can be reflected or absorbed by the opaque inner partition 220, so the light does not directly illuminate the control element 30, and the control unit 30 is less likely to fail or be damaged.

Furthermore, according to the possible use of the light emitting device 1, the LED chips 40 may include LED chips of different color combinations. For example, if it is used in an atmosphere lamp in a moving vehicle, the LED chips 40 may include a red LED chip 40R, a green LED chip 40G, and a blue LED chip 40B, all located in the second receiving cavity 240 In order to provide red light, green light, blue light and combinations thereof in the second accommodating cavity 240. If it is used for a tail light, a direction light or a reversing light of a moving vehicle, the LED chip 40 may include two red LED chips 40R and one yellow LED chip 40Y (not shown), all located in the second accommodating cavity 240, In order to provide higher brightness red and yellow light required for braking and steering.

In the third accommodating cavity 250, the LED chips 40 may include another blue LED chip 40BW, together with a photoluminescent material or a fluorescent light including a photoluminescent material disposed on the other blue LED chip 40BW Patches (not shown) to provide the white light required for reversing (blue light is mixed with yellow light, green light and/or red light); photoluminescent materials can be yellow phosphor, green phosphor and red phosphor Any combination of yellow phosphors can be Y ₃ Al ₅ O ₁₂ : Ce ³⁺ (YAG for short) and (Sr,Ba) ₂ SiO ₄ :Eu ²⁺ (Sr ²⁺ content is high, Silicate for short), green The phosphor can be Si _6-z Al _z O _z N _8-z : Eu ²⁺ (abbreviated as β-SiAlON) and Lu ₃ Al ₅ O ₁₂ : Ce ³⁺ (abbreviated as LuAG), and the red phosphor can be CaAlSiN ₃ : Eu ²⁺ (CASN or 1113 for short), Sr ₂ Si ₅ N ₈ : Eu ²⁺ (258 for short) and K ₂ SiF ₆ : Mn ⁴⁺ (KSF for short). The LED chips 40 may also include at least one white LED chip located in the third receiving cavity 250 (not shown) to directly provide white light.

The second accommodating cavity 240 mainly provides at least one monochromatic LED chip, such as R, G, and B monochromatic LED chips. In addition, the second accommodating cavity 240 can also provide the arrangement of UV LED chips and/or IR LED chips. In addition, the third accommodating cavity 250 is mainly provided for the arrangement of white LEDs, such as the combination of white LED chips, blue LED chips and yellow phosphors, the combination of blue LED chips, yellow phosphors and green phosphors, blue LEDs Combination of chip, yellow phosphor, green phosphor and red phosphor, combination of UV LED chip, blue phosphor, green phosphor and red phosphor. Furthermore, the third accommodating cavity 250 mainly provides a laser diode chip or a VCSEL (Vertical Resonant Cavity Surface Emitting Laser) chip. In addition, the third accommodating cavity 250 mainly provides the arrangement of the sensor element.

The LED chips 40 may be horizontal chips, vertical chips, or flip chips.

The LED chips 40 located in the second accommodating cavity 240 may be arranged in a row at intervals in a direction to reduce the bottom area of the second accommodating cavity 240, but not limited thereto. In addition, the LED chips 40 are located in the smaller second accommodating cavity 240 to enhance the light gathering and light mixing effects.

The first colloid 50, the second colloid 60, and the third colloid 70 may be thermosetting plastics or thermoplastics, for example, including Phenylpropanolamine (PPA), Polycyclohexylenedimethylene terephthalate (PCT) ), sheet molded composite (Sheet molding compound, SMC), epoxy molded composite (Epoxy Molding Compound, EMC), unsaturated polyester material (Unsaturated Polyester, UP), polycarbonate (Polycarbonate, PC), polymer Ethylene (PE), polyethylene terephthalate (PET), cyclic olefin copolymers (COC), etc.; the first colloid 50 is disposed in the first accommodating cavity 230 to The control element 30 is covered, and the second colloid 60 and the third colloid 70 are respectively disposed in the second accommodating cavity 240 and the third accommodating cavity 250 to cover the LED chips 40. The top surfaces of the first colloid 50, the second colloid 60, and the third colloid 70 are not higher than the top surface 2201 of the inner partition wall 220 and the top surface 2101 of the peripheral wall 210.

The first colloid 50 preferably includes a light-scattering material, such as titanium dioxide, silicon dioxide, zirconium dioxide, boron nitride, etc., so that the first colloid 50 is opaque (can reflect or absorb the light of the LED chip 40) In this way, the light of the LED chip 40 will not irradiate the control element 30 and make it invalid (even if the light cannot be completely reflected or absorbed by the first colloid 50, the light entering the first colloid 50 is hard to damage the control element 30). The second colloid 60 and the third colloid 70 can transmit light, and the third colloid 70 can include the aforementioned photoluminescent material.

Please refer to FIGS. 2 to 5, which are a perspective view, a top view, a bottom view and a cross-sectional view of a light emitting device 2 according to a second preferred embodiment of the present invention. The light emitting device 2 can also be used in the lighting equipment of the moving vehicle, and like the first preferred embodiment, the light emitting device 2 also includes a support structure 10', a packaging structure 20', a control element 30', an LED chip 40', a first For the colloid 50' and the second colloid 60', etc., the support structure 10' includes a plurality of separated conductive supports 11' for conducting current. The same technical parts of these elements will be omitted or simplified, and the technical features in the first and second preferred embodiments can be combined or applied to each other without conflict.

In the light-emitting device 2, the packaging structure 20' includes an outer wall 210' and an inner partition wall 220', wherein the inner partition wall 220' separates the receiving space defined by the outer wall 210' into a first receiving cavity 230' and a second The accommodating cavity 240' (without the third accommodating cavity), and the top surface 2201' of the inner partition wall 220' is lower than the top surface 2101' of the peripheral wall 210'. In this way, the plurality of wires 80' electrically connected to the control element 30' and the LED chips 40' can cross the top surface 2201' of the inner partition 220' to avoid the inner partition 220' being squeezed due to the higher thermal expansion coefficient Pressing the wire 80' causes damage, and the wire 80' does not protrude from the top surface 2101' of the peripheral wall 210'. Furthermore, the second colloid 60' can cover the top surface 2201' of the inner partition wall 220' and the top surface of the first colloid 50' to cover the wire 80', and the top surface of the second colloid 60' can be higher or lower At or flush with the top surface 2101' of the peripheral wall 210'.

In addition, the lighting equipment of the mobile vehicle usually includes a plurality of light-emitting devices 1 and/or light-emitting devices 2 (series or parallel to each other, not shown), and the

control elements

30 or 30 of the light-emitting devices 1 or 2 'Can be connected to a control device (such as the electronic control unit (Electronic Control Unit, ECU) or driving computer) of the vehicle, the control device can issue commands to the control elements 30 or 30', for example The light-emitting

device

1 or 2 lights up, and part of the light-emitting

device

1 or 2 goes out to achieve different usage purposes.

In summary, in the light-emitting device of the present invention, the control element and the LED chip are arranged in the same package structure to reduce complicated wiring and reduce the appearance size of the light-emitting device. In addition, the control element is preferably covered by an opaque colloid or blocked by an opaque inner partition wall, so that the control element will not be irradiated by the light of the LED chip and become invalid or damaged. Furthermore, the wire preferably spans the top surface of the inner partition wall to avoid the wire being crushed and damaged by the inner partition wall. The light-emitting device of the present invention can provide not only a combination of red light, green light and blue light, but also white light to meet various lighting requirements of mobile vehicles.

The above-mentioned embodiments are only used to illustrate the implementation of the present invention and to explain the technical features of the present invention, but not to limit the scope of protection of the present invention. Any changes or equivalence arrangements that can be easily completed by those skilled in the art belong to the scope claimed by the present invention, and the scope of protection of the rights of the present invention shall be subject to the claims.

Claims

A light-emitting device, characterized in that it includes:

Support structure, including a plurality of separated conductive supports;

An encapsulation structure, which is arranged on the support structure and includes an outer wall and an inner partition wall to form at least a first accommodating cavity, a second accommodating cavity and a third accommodating cavity;

The control element is arranged on one of the conductive brackets and is located in the first accommodating cavity;

A plurality of LED chips are disposed on the other of the plurality of conductive supports, and are respectively located in the second accommodating cavity and the third accommodating cavity, and are electrically connected to the control element;

A first colloid disposed in the first accommodating cavity and covering the control element; and

The second colloid and the third colloid are respectively disposed in the second accommodating cavity and the third accommodating cavity, and cover the plurality of LED chips.
The light emitting device according to claim 1, wherein the bottom area of the first accommodating cavity is larger than the bottom area of the second accommodating cavity or the third accommodating cavity.
The light-emitting device according to claim 1, wherein the top surface of the inner partition wall is lower than the top surface of the peripheral wall, but higher than the top surface of the plurality of LED chips and the control element Top surface.
The light-emitting device according to claim 3, wherein the plurality of LED chips are electrically connected to the control element through a plurality of wires, and the plurality of wires cross the top surface of the inner partition wall .
The light-emitting device according to claim 1, wherein the inner partition wall includes a first inner wall and a second inner wall, and the first inner wall and the second inner wall intersect each other.
The light-emitting device according to claim 1, wherein the inner partition wall includes a first inner wall and a second inner wall, and the first inner wall and the second inner wall are parallel to each other.
The light-emitting device according to claim 1, wherein the plurality of LED chips include a red LED chip, a green LED chip, and a blue LED chip located in the second accommodating cavity.
The light-emitting device according to claim 1, wherein the plurality of LED chips include two red LED chips and one yellow LED chip located in the second accommodating cavity.
The light-emitting device according to claim 1, wherein the plurality of LED chips include another blue LED chip in the third accommodating cavity, and the third colloid includes a yellow photoluminescent material.
The light-emitting device according to claim 1, wherein the plurality of LED chips include another blue LED chip located in the third accommodating cavity, and the another blue LED chip includes photoluminescence Fluorescent patch of luminescent material.
The light emitting device according to claim 1, wherein the plurality of LED chips include white LED chips located in the third receiving cavity.
The light-emitting device according to claim 1, wherein the plurality of LED chips are arranged in one direction.
The light-emitting device according to claim 1, wherein the first colloid includes a light scattering material so that the first colloid is opaque.
A light-emitting device, characterized in that it includes:

Support structure, including multiple conductive supports;

An encapsulation structure, disposed on the support structure, includes an outer wall and an inner partition wall to form at least a first containing cavity and a second containing cavity, and the top surface of the inner partition wall is lower than the outer wall The top of

The control element is arranged on one of the conductive brackets and is located in the first accommodating cavity;

A plurality of LED chips are disposed on the other of the plurality of conductive supports and located in the second accommodating cavity, and are electrically connected to the control element, and the control element is electrically connected through a plurality of wires The plurality of LED chips, and the plurality of wires span the top surface of the inner partition wall; and

The first colloid and the second colloid are respectively disposed in the first accommodating cavity and the second accommodating cavity, and respectively cover the control element and the plurality of LED chips.
The light emitting device according to claim 14, wherein the bottom area of the first accommodating cavity is larger than the bottom area of the second accommodating cavity.
The light emitting device according to claim 14, wherein the top surface of the inner partition wall is higher than the top surfaces of the plurality of LED chips and the top surface of the control element.
The light-emitting device according to claim 14, wherein the plurality of LED chips include a red LED chip, a green LED chip, and a blue LED chip disposed in the second accommodating cavity.
The light-emitting device according to claim 14, wherein the plurality of LED chips include two red LED chips and a yellow LED chip disposed in the second accommodating cavity.
The light-emitting device according to claim 14, wherein the first colloid includes a light scattering material so that the first colloid is opaque.
The light-emitting device according to claim 14, wherein the second colloid further covers the top surface of the inner partition wall and the top surface of the first colloid.