WO2020125380A1 - 应用于3d打印设备的数据处理方法和3d打印设备 - Google Patents

应用于3d打印设备的数据处理方法和3d打印设备 Download PDF

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WO2020125380A1
WO2020125380A1 PCT/CN2019/122076 CN2019122076W WO2020125380A1 WO 2020125380 A1 WO2020125380 A1 WO 2020125380A1 CN 2019122076 W CN2019122076 W CN 2019122076W WO 2020125380 A1 WO2020125380 A1 WO 2020125380A1
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slice
printing device
intersection point
data processing
scan line
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PCT/CN2019/122076
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English (en)
French (fr)
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朱鸣
吕帅
朱鹏飞
浦东林
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苏州苏大维格科技集团股份有限公司
苏州大学
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Publication of WO2020125380A1 publication Critical patent/WO2020125380A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes

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  • the invention relates to the technical field of 3D printing, in particular to a data processing method and a 3D printing device applied to a 3D printing device.
  • 3D printing is most commonly used to obtain printing data based on the STL (Standard Template) Library model.
  • the model entities are constructed by layer-by-layer superposition.
  • STL files are the standard file type for rapid prototyping system applications.
  • the vertex coordinates and the external normal vector form a triangle patch, which does not contain a triangle topology, and discretely represents a three-dimensional CAD model. Due to the simple data format of the STL model and easy exchange processing, the STL model-based slice processing has been adopted by most rapid prototyping systems.
  • the commonly used method of STL layered slicing algorithm is: by analyzing the positional relationship between the tangent plane and the triangular grid, if it intersects, the intersection line segment is obtained. After finding all the intersection lines of the tangent plane and the STL grid model, all the intersection lines of the layered layer are connected in order to obtain the contour line of the layered slice plane. The orderly arrangement of intersecting line segments is a very time-consuming process.
  • most slicing algorithms first establish a geometric topology information, and then perform hierarchical slicing based on the topology information. The algorithm needs to optimize and repair the triangle patches in the original 3D model: remove intersecting triangle patches, repair triangles with wrong vertex ordering, repair gaps, etc.
  • the more triangles in the model the slower the processing speed and the higher the probability of error.
  • the optimized contour line also needs to generate a scanning path, and the scanning line is used to solidify and fill, so that the printed model has a certain strength.
  • This algorithm takes a long time to process the overall topology information. Especially for complex STL models, it takes up more system resources, requires more calculations, and has low data processing efficiency.
  • the object of the present invention is to provide a data processing method and a 3D printing device applied to a 3D printing device to solve the need to establish topology information in the existing 3D printing data processing method, This leads to the problems of long processing time, large data volume, and low data processing efficiency.
  • the invention provides a data processing method applied to a 3D printing device, including the steps of:
  • each column contains at least one scan line in the same direction as the column, determine each scan line and the triangular patch in the slice The intersection point and the coordinates of the intersection point;
  • step S6 All the scanning lines in the slice are processed in step S5 to obtain the bitmap graphics filled in the slice.
  • this step S1 includes:
  • the number of layers of the slice is determined.
  • this step S2 includes:
  • the minimum Z coordinate of the triangular patch is less than or equal to the Z coordinate of the Nth slice, the maximum Z coordinate of the triangular patch is greater than or equal to the Z coordinate of the Nth slice, and the triangular patch is not parallel to the slice, Then the triangular patch intersects the Nth slice;
  • N starts from 1 and is an integer less than or equal to the number of layers.
  • this step S3 includes:
  • the intersection point of the scan line and the triangular patch in the slice and the coordinates of the intersection point are determined.
  • the width of one scanning line is the width of one pixel.
  • step S4 further includes: first determining whether there is a vertex of the bitmap graphic in the slice on the scan line, and if there is a vertex, the vertex is not sorted.
  • determining whether there is a vertex of the slice on the scan line specifically: when an intersection point of the scan line and at least two of the triangle patches in the slice is a point, it is determined that the intersection point is the bitmap in the slice The vertex of the graphic.
  • this step S5 includes:
  • the pixel coordinates of the intersection point are obtained according to the coordinate value of the physical coordinates of the intersection point divided by the pixel size projected by the device;
  • step S6 it further includes: when the area difference of the bitmap graphics in the two adjacent slices is less than a fixed threshold, merge the two adjacent slice graphics into a bitmap graphic, and use the One of the bitmap graphics in the two adjacent slices represents the merged bitmap graphics.
  • the present invention also provides a 3D printing device.
  • the 3D printing device includes a processor for executing program data to implement the data processing method applied to the 3D printing device as described above.
  • the beneficial effect of the present invention is that by dividing each slice into several columns according to one of the X-axis direction or the Y-axis direction, each column contains at least one scanning line in the same direction as the column, The intersection points are sorted according to the size of the coordinates in the other axis direction of the X-axis direction or the Y-axis direction, and the intersection points on all scan lines are converted into corresponding pixel coordinates, and then the odd intersection point and the odd number on each scan line are converted. All pixels between the adjacent even intersections under the intersection are filled and connected, and finally a complete sliced bitmap graphic is obtained.
  • the present invention can eliminate the need to establish topology information for the STL model, avoid a lot of calculation and sorting, and improve the efficiency of data processing.
  • the data of each slice is stored as bitmap data, so the amount of graphics data in each bitmap is fixed and will not increase suddenly due to the complexity of the graphics.
  • FIG. 1 is a flowchart of a data processing method applied to a 3D printing device in the present invention
  • FIGS. 2a to 2f are schematic flowcharts of a data processing method applied to a 3D printing device in the present invention
  • FIG. 3 is a schematic diagram of the structure of the 3D printing device in the present invention.
  • FIG. 1 is a flowchart of a data processing method applied to a 3D printing device in the present invention. As shown in FIG. 1, a data processing method applied to a 3D printing device provided by the present invention includes the following steps:
  • K H/h.
  • the number of layers K of the slice is determined according to the thickness of the layer.
  • the thickness of the layer is determined first, and the number K of layers is obtained according to the height H of the STL model and the thickness h of the layer.
  • the minimum Z coordinate Zmin of the STL model can be set to 0.
  • the basis for determining the layer thickness is: first calculate the minimum Z coordinate and maximum Z coordinate of each triangular patch in the STL model, and then according to The difference between the maximum Z coordinate and the minimum Z coordinate is the height of each triangle patch.
  • This step is to group all the triangle patches so that each group contains a slice and all triangle patches that intersect the slice. Therefore, before that, you need to determine the triangle that intersects the slice in each slice. Noodles.
  • the minimum Z coordinate of the triangular patch be Z 1 min and the maximum Z coordinate be Z 1 max, where the Z coordinate of the Nth slice is Zn.
  • each column contains at least one scanning line in the same direction as the column direction, for example, each slice is divided into several columns according to the X-axis direction, Then the scanning line is parallel to the Y-axis direction; or, each slice is divided into several columns according to the Y-axis direction, then the scanning line is parallel to the X-axis direction. Then determine the intersection of each scan line and the triangle patch in the slice and the coordinates of the intersection.
  • each slice can be divided into several columns according to the pixel size projected by the 3D printing device, but the width of each column does not exceed the width projected by the 3D printing device, even if the width of each column is the width of one pixel, at least Contains a scan line.
  • each slice can also be divided into several columns according to the integer multiple of the pixel size projected by the 3D printing device.
  • Each column contains multiple scan lines, so that each column of pixels contains one scan line, which is converted into bitmap coordinates.
  • the width of the scan line is the width of one pixel, that is, a line of pixels after a scan line is converted into bitmap coordinates.
  • the intersection point and the coordinates of the intersection point of the scan line and the triangle patch in the slice can be determined.
  • the seventh column (N7) of the Nth layer intersects with the four triangular patches at points (a, b, c, d), as shown in Figure 2d, the points (a, b, c , D) displayed in the two-dimensional coordinate graph, the Z coordinate of the point (a, b, c, d) is the same as the Z coordinate of the current slice, according to the coordinate equation of the scan line and the coordinates of the three vertices of the triangular patch The X and Y coordinates of the out point (a, b, c, d).
  • Step S4 Sort the intersection points on each scanning line according to the size of the coordinate in the other axis direction in the X-axis direction or the Y-axis direction. For example, each slice is divided into several columns according to the X-axis direction, then the intersection points on each scan line are sorted according to the size of the Y coordinate in the Y-axis direction; or, each slice is divided into several columns according to the Y-axis direction, then each The intersection points on the scan line are sorted according to the size of the X coordinate in the X axis direction.
  • Step S3 divides each slice into several columns according to the X-axis direction. In this embodiment, the intersection points on each scanning line are correspondingly sorted according to the size of the Y coordinate in the Y-axis direction.
  • the vertex Before sorting, first determine whether there is a vertex of the bitmap graphics on the scan line. If there is a vertex, the vertex is not sorted. When the intersection point of the scan line and at least two triangular patches in the slice is the same point, the intersection point is determined to be the vertex of the bitmap graphics in the slice, for example, when the STL model is a hollow structure, and the inner surface and the outer surface intersect At this time, the intersection point of the scan line and the four triangular patches in the slice is the same point.
  • the third point (e) where the fourth column (X4) intersects the triangular patch is the vertex of the bitmap graphic, so when sorting by the Y coordinate in this column, only the front Sort the Y coordinates of the two intersections.
  • the scan line enters the bitmap graphic from the odd intersection point until the next adjacent even intersection point passes out
  • all pixels between such adjacent parity intersections are within the bitmap graphics.
  • the pixels between the first point (a) and the second point (b) need to be connected, and the pixels between the third point (c) and the fourth point (d) need to be connected.
  • the pixels corresponding to dots and lines are filled with black, and black represents the pattern area.
  • the pixels between the second point (b) and the third point (c) are outside the STL model or the hollow area of the STL model, that is, outside the bitmap graphics, so there is no need to fill it with black.
  • the triangular patches parallel to the slices have been filled with black by filling. What is printed by the 3D printing device is a solid model, which increases the strength of the model.
  • step S6 All the scanning lines in each slice are processed in step S5 to obtain the bitmap graphics filled with slices.
  • the entire STL model is processed into bitmap data with graphics.
  • all the black pixels (cured areas) in each slice represent the completeness and generate a corresponding black and white bitmap as an input data of the printer.
  • the bitmap data is used as the storage data for each slice, so the amount of bitmap graphics data is fixed, and the data volume will not increase sharply due to the complexity of the graphics. It also reduces the large number of calculations and sorting caused by the establishment of topological relationships.
  • two adjacent slices can be adaptively changed according to the complexity, curvature, change speed, etc. of the bitmap graphic structure. Specifically, by comparing the difference between the area of the number of black pixels (cured area) corresponding to the structure of the bitmap graphics in the previous slice and the structure of the bitmap graphics in the latter slice, when the bitmap bitmap graphics of two adjacent slices When the area difference is less than a fixed threshold, it means that the structure of the bitmap graphics in the current slice is not much different from the structure of the bitmap graphics in the latter slice. You can combine two adjacent slices into one slice and use the two adjacent slices. One of the slices and the merged slices further reduce the amount of data.
  • the present invention also provides a 3D printing device, including a processor 21, a memory 22, a display 23, and a printer 24.
  • the processor 21 is used to execute the program data
  • the memory 22 can be used to store the program data
  • the display 23 can be used to display the processed screen
  • the printer 24 is used to print out the 3D model.
  • the processor 21 executes the program data, it implements the steps of the above data processing method applied to the 3D printing device. For details, reference may be made to the description of the above method, and details are not described herein again.
  • the 3D printing device provided by the present invention may be a DPL (Digital Light Processing, digital light processing) 3D printing device.
  • DLP equipment contains a liquid tank that can contain resin for holding resin that can be cured after being irradiated with ultraviolet light of a specific wavelength.
  • the DLP imaging system is placed under the liquid tank, and its imaging surface is located at the bottom of the liquid tank. Through energy and graphic control, a thin layer of resin with a certain thickness and shape can be cured each time (the layer resin is exactly the same as the cross-sectional shape obtained by the previous division).
  • a lifting mechanism is set above the liquid tank.

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Abstract

一种应用于3D打印设备的数据处理方法，包括：确定切片的分层数目；确定STL模型中与每个切片相交的所有三角形面片；将每个切片按X轴方向或Y轴方向中其中一个轴方向分成若干列，每一列中至少包含有一条与列方向相同的扫描线，确定每条扫描线与切片中三角形面片所相交的交点及交点的坐标；将每条扫描线上的交点按照坐标的大小进行排序；将所有扫描线上的交点转换长对应的像素坐标，再将每条扫描线上奇数交点和奇数交点下一个相邻的偶数交点之间的所有像素填充连接；将切片中所有的扫描线经过处理，得到切片填充的位图图形。不用对STL模型建立拓扑信息，避免大量计算和排序，提高数据处理的效率。

Description

应用于3D打印设备的数据处理方法和3D打印设备
本申请要求了申请日为2018年12月17日，申请号为201811544100.5的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及3D打印技术领域，特别是涉及一种应用于3D打印设备的数据处理方法和3D打印设备。
背景技术
3D打印(3D Printing)最常用的是依据STL(Standard Template Library)模型来获取打印数据的，通过层层叠加构造出模型实体，STL文件是快速原型系统应用的标准文件类型，由三角形网格单元顶点坐标和外法向量构成三角形面片，不包含三角形拓扑结构，离散近似表现三维CAD模型。由于STL模型数据格式简单，易于交换处理，基于STL模型的切片处理已被大多数快速原型系统采用。
STL分层切片算法常用的方法是：通过分析切平面与三角形网格之间的位置关系，若相交则求出交线段。求出该切平面与STL网格模型所有的交线段后，将该分层面的所有交线段有序地连接起来，从而获得该分层切片面的轮廓线。其中交线段的有序排列是一个很费时的过程，目前大部分切片算法都是先建立一个基于几何拓扑信息，然后再根据拓扑信息进行分层切片。该算法需要对原有的3D模型中的三角形面片做优化和修复处理：去除相交的三角形面片，修复顶点排序错误的三角形，修补缺口空洞等。模型的三角形数量越多，处理的速度越慢，产生错误的概率也越高。经过优化处理后的轮廓线还需要生成扫描路径，通过扫描线来固化填充，使打印出来的模型具有一定的强度。这种算法在整体拓扑信息的处理时间较长，尤其对于复杂的STL 模型，占用系统资源较多，计算量较大，数据处理效率低下。
发明内容
为了克服现有技术中存在的缺点和不足，本发明的目的在于提供一种应用于3D打印设备的数据处理方法和3D打印设备，以解决现有3D打印的数据处理方法中需建立拓扑信息，导致处理时间较长、数据量较大、数据处理效率低的问题。
本发明的目的通过下述技术方案实现：
本发明提供一种应用于3D打印设备的数据处理方法，包括步骤：
S1：确定切片的分层数目；
S2：确定STL模型中与每个切片相交的所有三角形面片；
S3：将每个切片按X轴方向或Y轴方向中其中一个轴方向分成若干列，每一列中至少含有一条与该列方向相同的扫描线，确定每条扫描线与该切片中三角形面片所相交的交点以及该交点的坐标；
S4：将每条扫描线上的该交点按照该坐标的大小进行排序；
S5：将所有扫描线上的交点转换成对应的像素坐标，再将每条扫描线上奇数交点和该奇数交点下一个相邻的偶数交点之间的所有像素填充连接；
S6：将该切片中所有扫描线经过步骤S5处理，得到该切片填充的位图图形。
进一步地，该步骤S1包括：
确定分层厚度；
根据该STL模型的高度和该分层厚度，确定该切片的分层数目。
进一步地，该步骤S2包括：
若三角形面片的最小Z坐标小于或等于第N个切片的Z坐标，该三角形面片的最大Z坐标大于或等于该第N个切片的Z坐标，并且该三角形面片与该切片非平行，则该三角形面片与该第N个切片相交；
其中，N的值为从1开始且小于或等于该分层数目的整数。
进一步地，该步骤S3包括：
将每个切片按预设宽度分成若干列，每一列的宽度不超过3D打印设备投影的宽度；
根据该扫描线的坐标方程和该切片中该三角形面片的三个顶点的坐标，确定该扫描线与该切片中该三角形面片的交点及该交点的坐标。
进一步地，一条扫描线的宽度为一个像素的宽度。
进一步地，该步骤S4还包括：先判断该扫描线上是否存在该切片中该位图图形的顶点，若存在该顶点则该顶点不进行排序。
进一步地，判断该扫描线上是否存在该切片的顶点，具体为：当该扫描线与该切片中至少两个该三角形面片的交点为一个点时，确定该交点为该切片中该位图图形的顶点。
进一步地，该步骤S5包括：
根据该交点的物理坐标的坐标值除以该设备投影的像素大小，得到该交点的像素坐标；
将该扫描线上对应的该奇数交点和该奇数交点下一个相邻的该偶数交点之间的所有像素填充连接；
当该切片内所有交点转换成像素坐标并完成连接后，得到该切片的填充的位图图形。
进一步地，在该步骤S6之后还包括：当相邻两个切片中该位图图形的面积差值小于一个固定阀值时，将相邻两个该切片图形合并为一个位图图形，并用该相邻两个切片中其中一个位图图形表示合并后的位图图形。
本发明还提供一种3D打印设备，该3D打印设备包括处理器，该处理器用于执行程序数据，以实现如上所述的应用于3D打印设备的数据处理方法。
本发明有益效果在于：通过将每个切片按X轴方向或Y轴方向中其中一个轴方向分成若干列，每一列中至少含有一条与该列方向相同的扫描线，将 每条扫描线上的该交点按X轴方向或Y轴方向中其另一个轴方向上的坐标的大小进行排序，将所有扫描线上的交点转换成对应的像素坐标，再将每条扫描线上奇数交点和该奇数交点下一个相邻的偶数交点之间的所有像素填充连接，最后得到切片完整的位图图形，本发明可以不用对STL模型建立拓扑信息，避免了大量计算和排序，提高了数据处理的效率，每一个切片的数据存储为位图数据，所以每个位图图形数据量固定不变，不会因为图形的复杂而数据量陡增。
附图说明
图1是本发中应用于3D打印设备的数据处理方法的流程框图；
图2a至图2f是本发中应用于3D打印设备的数据处理方法的流程示意图；
图3是本发明中3D打印设备的结构示意图。
具体实施方式
为更进一步阐述发明为达成预定发明目的所采取的技术手段及功效，以下结合附图及较佳实施例，对依据发明提出的应用于3D打印设备的数据处理方法和3D打印设备结构的具体实施方式、结构、特征及其功效，详细说明如下：
图1是本发中应用于3D打印设备的数据处理方法的流程框图。如图1所示，本发明提供的一种应用于3D打印设备的数据处理方法，包括步骤：
S1：确定切片的分层数目。
设分层数目为K、STL模型的高度H和分层的厚度h，所以K＝H/h。
具体地，切片的分层数目K是根据分层厚度决定的，先确定分层厚度，根据STL模型的高度H和分层的厚度h，得到分层数目K。其中STL模型的高度H为STL模型的最大Z坐标Zmax减去STL模型的最小Z坐标Zmin， 即H＝Zmax-Zmin，本实施例中，可以设STL模型的最小Z坐标Zmin为0。而分层的厚度h可以根据实际情况手动设定，所以可以计算得到分层数目K为STL模型的高度H除以分层的厚度h，即K＝H/h，本实施例中也就是K＝Zmax/h；
或者，根据每个三角形面片的最小高度来设定分层的厚度h，例如确定分层厚度的依据是：首先计算STL模型中每个三角形面片的最小Z坐标和最大Z坐标，然后根据最大Z坐标与最小Z坐标的差值得到每个三角形面片的高度，选取所有三角形面片中最小且非零的高度值作为分层厚度h，即能够保证即使是具有最小高度的三角形面片也能够与切片平面相交。所以可以计算得到分层数目K为STL模型的高度H除以分层的厚度h，即K＝H/h，本实施例中也就是K＝Zmax/h。
S2：确定STL模型中与每个切片相交的所有三角形面片。
该步骤的目的在于将所有的三角形面片建立分组，使得每个分组中包含一个切片和与该切片相交的所有三角形面片，因此，在此之前，需要确定每一个切片中与该切片相交三角形面片。
设三角形面片的最小Z坐标为Z 1min和最大Z坐标为Z 1max，其中第N个切片的Z坐标为Zn。由步骤S1已经可以得出每一个切片的Z坐标Zn(Zn＝Zmin+n*h，1＜＝n＜＝K)，然后根据每个三角形面片的最小Z坐标Z 1min和最大Z坐标Z 1max来确定其属于哪一个或几个切片。具体为，若三角形面片的最小Z坐标Z 1min小于或等于第N个切片的Z坐标Zn；而其最大高度大于或等于第N个切片的Z坐标Zn；并且三角形面片与切片非平行。当三个条件同时成立时，则三角形面片与第N个切片相交，其中，N为从1开始且小于或等于分层数目的整数。
如图2a所示，其为第N个切片与三角形面片的位置关系，其中三角形面片(1、3、4、5、6)与第N个切片相交，并与第N个切片分为第N组，而三角形面片(2、7)不与第N个切片相交，分为其它组。当然一个三角形面片可 以同与两个不同的切片相交。
当STL模型中所有的三角形面片的层数确定后，即建立分组完成。
S3：将每个切片按X轴方向或Y轴方向中其中一个轴方向分成若干列，每一列中至少含有一条与列方向相同的扫描线，例如，每个切片按X轴方向分成若干列，则扫描线与Y轴方向平行；或者，每个切片按Y轴方向分成若干列，则扫描线与X轴方向平行。再确定每条扫描线与切片中三角形面片所相交的交点以及交点的坐标。
在本实施例中，如图2b所示，每个切片按X轴方向分成若干列(N1，N2.....Nm，m＞＝1)，每一个列都是一个二维平面，每个二维平面内都含有若干条与Y轴方向相同的扫描线。
具体地，可以将每个切片按3D打印设备投影的像素大小分成若干列，但每一列的宽度不超过3D打印设备投影的宽度，即使每一列的宽度为一个像素的宽度，每一列中均至少含有一条扫描线。每个切片中所有的扫描线可以用坐标方程表示为X＝S，其中S的范围为当前切片的X坐标的最小值到最大值，S按3D打印设备的像素的宽度递增或递减。例如，设3D打印设备的像素大小为F，则第n条扫描线的坐标方程为X＝X0+n*F。例如，还可以将每个切片按3D打印设备投影的像素大小的整数倍分成若干列，每一列均含有多条扫描线，使每一列像素中含有一条扫描线，转换成位图坐标后，一条扫描线的宽度为一个像素的宽度，即一条扫描线转换成位图坐标后就是一列像素。
进一步地，根据每条扫描线的坐标方程和切片中三角形面片的三个顶点的坐标，可以确定扫描线与切片中三角形面片的交点及交点的坐标。如图2c所示，第N层的第7列(N7)与四个三角形面片分别相交于点(a、b、c、d)，如图2d所示，将点(a、b、c、d)展示到二维坐标图中，点(a、b、c、d)的Z坐标与当前切片的Z坐标相同，根据扫描线的坐标方程和三角形面片的三个顶点的坐标可以得出点(a、b、c、d)的X坐标和Y坐标。
S4：将每条扫描线上的交点按X轴方向或Y轴方向中其另一个轴方向上的坐标的大小进行排序。例如，每个切片按X轴方向分成若干列，则每条扫描线上的交点按Y轴方向上的Y坐标的大小进行排序；或者，每个切片按Y轴方向分成若干列，则每条扫描线上的交点按X轴方向上的X坐标的大小进行排序。步骤S3将每个切片按X轴方向分成若干列，本实施例中，则对应的将每条扫描线上的交点按Y轴方向上的Y坐标的大小进行排序。
在进行排序前，先判断扫描线上是否存在位图图形的顶点，若存在顶点则顶点不进行排序。当扫描线与切片中的至少两个三角形面片的交点为同一个点时，确定该交点为切片中位图图形的顶点，例如，当STL模型为中空结构，且内表面与外表面相交时，此时扫描线与切片中的四个三角形面片的交点为同一个点。如图2d所示，其中第4列(X4)与三角形面片相交的第3点(e)为位图图形的顶点，所以在本列中按Y坐标的大小进行排序的时候，只对前两个交点的Y坐标进行排序。
S5：将所有扫描线上的交点转换成对应的像素坐标，再将每条扫描线上奇数交点和奇数交点下一个相邻的偶数交点之间的所有像素填充连接。可以理解的是：交点和顶点，都需要转换成对应的像素坐标。
具体地，根据交点的物理坐标值除以3D打印设备的像素大小，得到交点的像素坐标；例如，设3D打印设备的像素大小为F，对应的像素坐标为：横坐标x＝X/F；纵坐标y＝Y/F，其中x、y代表像素坐标，X、Y代表物理坐标。因为切片中的位图图形为一个二维图形，在转换成像素坐标的时候，只转换切片平面中的X和Y坐标，Z坐标可以不用转换，以减少计算量。
进一步地，将每条扫描线上对应的奇数交点和奇数交点下一个相邻的偶数交点之间像素连接，即扫描线从奇数交点开始进入位图图形，直到下一个相邻的偶数交点穿出位图图形，在这样相邻配对的奇偶交点之间的所有象素都在位图图形内。如图2e所示，第一个点(a)与第二个点(b)之间的像素需要相连，第三个点(c)与第四个点(d)之间的像素需要相连。即点以及连线对应的 像素填充为黑色，黑色代表图案区域。而第二个点(b)与第三个点(c)之间的像素在STL模型的外面或者是STL模型的镂空区域，也就是位图图形的外侧，所以也就不需要填充为黑色。而与切片平行的三角形面片，通过填充，则已全部填充为黑色。通过3D打印设备打印出来的则是一个实体的模型，增加了模型的强度。
S6：将每层切片中所有扫描线经过步骤S5处理，得到切片填充的位图图形。
如图2f所示，当切片内所有交点转换成像素坐标并完成连接后，得到当前切片填充的位图图形，并进行存储。
当所有切片按照上述方法处理完成后，也就把整个STL模型处理成了一张张带有图形的位图数据。最终每个切片中所有用黑色像素(固化区域)表示完整并生成一幅对应的黑白位图，作为打印机的一条输入数据，例如，可以将每一列的位图图形作为打印机的一条输入数据，以减缓打印机的工作量，但打印时间有所增加。采用位图数据作为每一个切片的存储数据，所以位图图形数据量是固定不变，不会因为图形的复杂而数据量陡增，也减少了因建立拓扑关系而产生的大量计算和排序。
在本实施例中，相邻两个切片可以根据位图图形结构的复杂度、曲率、变化速度等自适应改变。具体为，通过比较前一个切片中位图图形的结构及后一个切片中位图图形的结构对应黑色像素数(固化区域)面积的差值，当相邻两个切片的位图位图图形的面积差值小于一个固定阀值时，说明当前切片中位图图形的结构与后一个切片中位图图形的结构相差不大，可以将相邻两个切片合并为一个切片，并用该相邻两个切片中其中一个切片及表示合并后的切片，进一步减少数据量。
如图3所示，本发明还提供一种3D打印设备，包括处理器21、存储器22、显示器23和打印机24。
处理器21用于执行程序数据，存储器22可以用于存储程序数据，显示 器23可以用于显示处理后的画面，打印机24用于打印出3D模型。
处理器21在执行程序数据时，实现上述的应用于3D打印设备的数据处理方法的步骤，具体可参照上述方法的描述，在此不再赘述。
本发明还提供的3D打印设备可以为DPL(Digital Light Processing，数字光处理)3D打印设备。其原理为：DLP设备中包含一个可以容纳树脂的液槽，用于盛放可被特定波长的紫外光照射后固化的树脂，DLP成像系统置于液槽下方，其成像面正好位于液槽底部，通过能量及图形控制，每次可固化一定厚度及形状的薄层树脂(层树脂与前面切分所得的截面外形完全相同)。液槽上方设置一个提拉机构，每次截面曝光完成后向上提拉一定高度(高度与分层厚度一致)，使得当前固化完成的固态树脂与液槽底面分离并粘接在提拉板或上一次成型的树脂层上，这样，通过逐层曝光并提升来生成三维实体模型。其详细介绍请参考现有技术，这里不再赘述。
在本文中，所涉及的上、下、左、右、前、后等方位词是以附图中的结构位于图中以及结构相互之间的位置来定义的，只是为了表达技术方案的清楚及方便。应当理解，该方位词的使用不应限制本申请请求保护的范围。
以上该，仅是发明的较佳实施例而已，并非对发明做任何形式上的限定，虽然发明已以较佳实施例揭露如上，然而并非用以限定发明，任何熟悉本专业的技术人员，在不脱离发明技术方案范围内，当可利用上述揭示的技术内容作出些许更动或修饰，为等同变化的等效实施例，但凡是未脱离发明技术方案内容，依据发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰，均仍属于发明技术方案的保护范围之内。

Claims (10)

  1. 一种应用于3D打印设备的数据处理方法，其特征在于，包括步骤：
    S1：确定切片的分层数目；
    S2：确定STL模型中与每个切片相交的所有三角形面片；
    S3：将每个切片按X轴方向或Y轴方向中其中一个轴方向分成若干列，每一列中至少含有一条与该列方向相同的扫描线，确定每条扫描线与该切片中三角形面片所相交的交点以及该交点的坐标；
    S4：将每条扫描线上的该交点按照该坐标的大小进行排序；
    S5：将所有扫描线上的交点转换成对应的像素坐标，再将每条扫描线上奇数交点和该奇数交点下一个相邻的偶数交点之间的所有像素填充连接；
    S6：将该切片中所有扫描线经过步骤S5处理，得到该切片填充的位图图形。
  2. 根据权利要求1所述的应用于3D打印设备的数据处理方法，其特征在于，该步骤S1包括：
    确定分层厚度；
    根据该STL模型的高度和该分层厚度，确定该切片的分层数目。
  3. 根据权利要求1所述的应用于3D打印设备的数据处理方法，其特征在于，该步骤S2包括：
    若三角形面片的最小Z坐标小于或等于第N个切片的Z坐标，该三角形面片的最大Z坐标大于或等于该第N个切片的Z坐标，并且该三角形面片与该切片非平行，则该三角形面片与该第N个切片相交；
    其中，N的值为从1开始且小于或等于该分层数目的整数。
  4. 根据权利要求1所述的应用于3D打印设备的数据处理方法，其特征在于，该步骤S3包括：
    将每个切片按预设宽度分成若干列，每一列的宽度不超过3D打印设备投影的宽度；
    根据该扫描线的坐标方程和该切片中该三角形面片的三个顶点的坐标，确定该扫描线与该切片中该三角形面片的交点及该交点的坐标。
  5. 根据权利要求4所述的应用于3D打印设备的数据处理方法，其特征在于，一条扫描线的宽度为一个像素的宽度。
  6. 根据权利要求1所述的应用于3D打印设备的数据处理方法，其特征在于，该步骤S4还包括：先判断该扫描线上是否存在该切片中该位图图形的顶点，若存在该顶点则该顶点不进行排序。
  7. 根据权利要求6所述的应用于3D打印设备的数据处理方法，其特征在于，判断该扫描线上是否存在该切片的顶点，具体为：当该扫描线与该切片中至少两个该三角形面片的交点为一个点时，确定该交点为该切片中该位图图形的顶点。
  8. 根据权利要求1所述的应用于3D打印设备的数据处理方法，其特征在于，该步骤S5包括：
    根据该交点的物理坐标的坐标值除以该设备投影的像素大小，得到该交点的像素坐标；
    将该扫描线上对应的该奇数交点和该奇数交点下一个相邻的该偶数交点之间的所有像素填充连接；
    当该切片内所有交点转换成像素坐标并完成连接后，得到该切片的填充的位图图形。
  9. 根据权利要求1所述的应用于3D打印设备的数据处理方法，其特征在于，在该步骤S6之后还包括：当相邻两个切片中该位图图形的面积差值小于一个固定阀值时，将相邻两个该切片图形合并为一个位图图形，并用该相邻两个切片中其中一个位图图形表示合并后的位图图形。
  10. 一种3D打印设备，其特征在于，该3D打印设备包括处理器，该处理器用于执行程序数据，以实现如权利要求1至9任一项所述的应用于3D打印设备的数据处理方法。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112846232A (zh) * 2020-12-31 2021-05-28 南京英尼格玛工业自动化技术有限公司 一种金属结构多层多道电弧增材自动轨迹规划方法及系统

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113204527A (zh) * 2021-05-28 2021-08-03 苏州大学 一种基于成型区域像素坐标标记的切片压缩方法
CN113715338B (zh) * 2021-08-30 2023-08-18 深圳市纵维立方科技有限公司 三维模型的切片方法、打印方法及相关设备
CN115770885A (zh) * 2021-09-07 2023-03-10 广东汉邦激光科技有限公司 三维打印方法以及三维打印装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005176139A (ja) * 2003-12-12 2005-06-30 Canon Inc 色分解テーブル作成方法および画像処理装置
CN103761397A (zh) * 2014-01-26 2014-04-30 张靖 用于面曝光增材成型的3d模型切片及投影面生成方法
CN104504186A (zh) * 2014-12-10 2015-04-08 广州中国科学院先进技术研究所 一种基于3d打印数据处理软件平台的实现方式
CN104503711A (zh) * 2014-11-17 2015-04-08 杭州先临三维科技股份有限公司 一种3d打印的自适应分层方法
US20160133050A1 (en) * 2014-11-11 2016-05-12 Roland Dg Corporation Slice data creation device, slice data creation method, program, and computer-readable recording medium
CN108961359A (zh) * 2018-05-17 2018-12-07 长沙八思量信息技术有限公司 激光打标系统及其闭合图形的填充算法、存储介质

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5596504A (en) * 1995-04-10 1997-01-21 Clemson University Apparatus and method for layered modeling of intended objects represented in STL format and adaptive slicing thereof
CN1242293A (zh) * 1995-09-27 2000-01-26 3D系统公司 局部沉积成型系统中作数据操作和系统控制用的方法和设备
KR101552828B1 (ko) * 2015-05-27 2015-09-14 (주)이지스 3차원 객체 모델의 다각형 정보 추출 방법
CN106903889A (zh) * 2015-12-21 2017-06-30 姜海涛 一种stl模型的快速切片算法
CN108262970A (zh) * 2018-01-09 2018-07-10 华中科技大学 一种激光增材制造方法及系统

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005176139A (ja) * 2003-12-12 2005-06-30 Canon Inc 色分解テーブル作成方法および画像処理装置
CN103761397A (zh) * 2014-01-26 2014-04-30 张靖 用于面曝光增材成型的3d模型切片及投影面生成方法
US20160133050A1 (en) * 2014-11-11 2016-05-12 Roland Dg Corporation Slice data creation device, slice data creation method, program, and computer-readable recording medium
CN104503711A (zh) * 2014-11-17 2015-04-08 杭州先临三维科技股份有限公司 一种3d打印的自适应分层方法
CN104504186A (zh) * 2014-12-10 2015-04-08 广州中国科学院先进技术研究所 一种基于3d打印数据处理软件平台的实现方式
CN108961359A (zh) * 2018-05-17 2018-12-07 长沙八思量信息技术有限公司 激光打标系统及其闭合图形的填充算法、存储介质

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112846232A (zh) * 2020-12-31 2021-05-28 南京英尼格玛工业自动化技术有限公司 一种金属结构多层多道电弧增材自动轨迹规划方法及系统
CN112846232B (zh) * 2020-12-31 2023-03-03 南京英尼格玛工业自动化技术有限公司 一种金属结构多层多道电弧增材自动轨迹规划方法及系统

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