WO2020125351A1 - Filter unit with improved support structure, filter and electronic device - Google Patents

Filter unit with improved support structure, filter and electronic device Download PDF

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Publication number
WO2020125351A1
WO2020125351A1 PCT/CN2019/121081 CN2019121081W WO2020125351A1 WO 2020125351 A1 WO2020125351 A1 WO 2020125351A1 CN 2019121081 W CN2019121081 W CN 2019121081W WO 2020125351 A1 WO2020125351 A1 WO 2020125351A1
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Prior art keywords
cavity
filter unit
resonator
unit according
piezoelectric layer
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PCT/CN2019/121081
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French (fr)
Chinese (zh)
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杨清瑞
庞慰
张孟伦
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天津大学
诺思(天津)微系统有限责任公司
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Publication of WO2020125351A1 publication Critical patent/WO2020125351A1/en

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    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46Filters
    • H03H9/54Filters comprising resonators of piezoelectric or electrostrictive material
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02007Details of bulk acoustic wave devices
    • H03H9/02015Characteristics of piezoelectric layers, e.g. cutting angles
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/205Constructional features of resonators consisting of piezoelectric or electrostrictive material having multiple resonators
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H2009/02165Tuning
    • H03H2009/02173Tuning of film bulk acoustic resonators [FBAR]

Definitions

  • Embodiments of the present invention relate to the semiconductor field, and in particular, to a filter unit, a filter with the filter unit, and an electronic device with the filter unit or filter.
  • a conventional filter composed of several individual acoustic wave resonators has a top-view structure as shown in FIG. 1a.
  • a cross-sectional structure as shown in FIG. 1B can be obtained.
  • the filters shown in FIGS. 1a and 1b include several individual acoustic wave resonators, and the specific structure of each resonator includes a substrate P100; a cavity-type acoustic mirror P200 (P210, P220) embedded on the surface of the substrate;
  • the piezoelectric layer film P400 covering the bottom electrode and part of the substrate surface, and P400 is shared by multiple resonators; the top electrode P500 (P510, P520) above the piezoelectric layer ).
  • the overlapping part of the piezoelectric layer and the acoustic mirror, bottom electrode, and top electrode of each resonator in the lateral direction defines the effective acoustic region of the resonator (P600, P610, and P620).
  • each film layer constituting the filter Since the thickness of each film layer constituting the filter is only on the order of micrometers, the film is easily deformed by the influence of stress. The distortion of the sandwich structure will seriously reduce the Q value of the resonator constituting the filter, thereby seriously affecting the performance of the filter. Therefore, traditional bulk acoustic wave filters with cavity-type acoustic mirrors usually use the base of a discrete cavity structure: that is, each resonator in the filter has its own independent cavity.
  • the advantage of this structure is that a supporting structure (P110 in Figure 1c) can be formed below the resonators, thereby enhancing the stability of the overall structure of the filter.
  • the drawback of this structure is that under ideal conditions, when the resonator is operating, the energy conversion only occurs in the effective acoustic region.
  • the energy of the resonator is always inevitably dissipated outside the effective acoustic region and passes through the support structure on the substrate that contacts the bottom electrode and the piezoelectric layer (P110 and P120 in Figure 1c) Further escape into the substrate (as shown by arrows EL100, EL110, EL120 and EL130 in Fig. 1b).
  • This structure will cause significant energy loss, and eventually cause the Q value to decline severely and cause the filter performance to deteriorate.
  • a filter unit including:
  • a functional device which is provided on the functional substrate and includes a plurality of bulk acoustic wave resonators, the plurality of resonators share a piezoelectric layer, and each resonator has a top electrode and a bottom provided on both sides of a corresponding portion of the shared piezoelectric layer Electrodes, the top electrode, the bottom electrode and the common piezoelectric layer form a sandwich structure, and each resonator constitutes a sub-sandwich structure,
  • the sub-sandwich structure and the cavity-type acoustic mirror underneath form an effective area of the corresponding resonator, and the cavity-type acoustic mirror is a part of the cavity;
  • the sandwich structure is supported by the cavity and cavity-type acoustic mirrors of at least two resonators communicate with each other.
  • the sandwich structure is supported only by the edge of the cavity.
  • the cavity has a substantially rectangular shape; the sandwich structure is supported by two opposite edges of the cavity.
  • the two opposite edges simultaneously support the bottom electrode and the piezoelectric layer of the outermost resonator.
  • the functional device has electrode pins for the resonator; the piezoelectric layer is located between and spaced apart from the two opposite edges; and the sandwich structure is provided by the The electrode pins at the two opposite edges are supported on the two opposite edges.
  • two sides of the piezoelectric layer are respectively supported on the two opposite edges.
  • the sandwich structure is supported by opposite edges of the cavity; and in a top view of the filter unit, there is a gap between at least a part of the edge of the sandwich structure and the edge of the cavity.
  • the sandwich structure is supported only by a plurality of supporting protrusions provided in the cavity.
  • the plurality of support protrusions includes at least one island-shaped support protrusion spaced apart from the edge of the cavity.
  • the resonator is a polygonal resonator; and the island-shaped support protrusion is used to support an apex portion of the polygonal resonator. Further, each island-shaped supporting protrusion is used to simultaneously support the apex portions of multiple resonators.
  • the resonator is a polygonal resonator; and the island-shaped support protrusion is used to support the side portion of the resonator. Further, each island-shaped supporting protrusion is used to simultaneously support a plurality of side portions of the resonator.
  • the plurality of support protrusions includes at least one peninsula-shaped support protrusion from the edge of the cavity to the cavity radially inward.
  • the sandwich structure is supported only by support bar ribs connected between the edges of the cavity.
  • the sandwich structure is composed of an edge of the cavity, at least one support protrusion provided in the cavity, an electrode pin of the resonator, and a support bar rib connected between the edges of the cavity At least two structural supports.
  • all resonators are provided on the functional substrate, and the filter unit has a packaging substrate opposite to the functional substrate; and the sum of the areas of the effective areas of all resonators is not greater than the 1/2 of the area of one surface of the functional substrate; or the area where the functional area where the functional device is located is projected vertically onto the packaging substrate is not larger than 2/3 of the surface area of the packaging substrate.
  • the piezoelectric layer is doped with one or more of the following elements: scandium, yttrium, magnesium, titanium, lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, Gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium; and the atomic fraction of doping elements ranges from 1% to 40%.
  • the piezoelectric layer is an aluminum nitride piezoelectric layer, a zinc oxide piezoelectric layer, a lithium niobate piezoelectric layer, or a lead titanium zirconate piezoelectric layer.
  • the atomic fraction of the doping element ranges from 3% to 20%.
  • An embodiment of the present invention also relates to a functional substrate for a filter, provided with a cavity, wherein: the cavity is provided with a plurality of support protrusions that are independent of each other, and the support protrusions are suitable for supporting filter functional devices Or there is no supporting structure for supporting the functional device in the cavity.
  • Embodiments of the present invention also relate to a filter, including: the filter unit according to the above or the above functional base.
  • Embodiments of the present invention also relate to an electronic device, including the above filter unit or the above filter.
  • FIG. 1a is a schematic plan view of a filter unit composed of a plurality of bulk acoustic wave resonators in the prior art
  • Figure 1b is a schematic cross-sectional view taken along line AA' in Figure 1a;
  • FIG. 1c is a schematic top view of the functional base of the filter unit in FIG. 1a;
  • FIG. 1d is a schematic perspective view of the functional base of the filter unit in FIG. 1a;
  • FIG. 2 is a schematic top view of a functional substrate of a filter unit according to an exemplary embodiment of the present invention
  • FIG. 3 is a schematic top view of a functional base of a filter unit according to an exemplary embodiment of the present invention.
  • FIG. 4a is a schematic top view of a functional substrate of a filter unit according to an exemplary embodiment of the present invention.
  • FIG. 4b is a schematic cross-sectional view of a filter unit using the functional substrate in FIG. 4a according to an exemplary embodiment of the present invention, which shows the supporting state of the sandwich structure;
  • FIG. 4c is an exemplary schematic diagram of the support edge of the cavity of the functional substrate in FIG. 4a after further moving outward;
  • FIG. 4d is a schematic cross-sectional view of a filter unit using the functional substrate in FIG. 4c according to another exemplary embodiment of the present invention, which shows the supporting state of the sandwich structure;
  • FIG. 4e is a schematic cross-sectional view of a filter unit using the functional substrate in FIG. 4c according to another exemplary embodiment of the present invention, which shows the supporting state of the sandwich structure;
  • FIG. 5 is a schematic top view of a functional base of a filter unit according to an exemplary embodiment of the present invention.
  • FIG. 6 is a schematic diagram of a sandwich structure of a bulk acoustic wave resonator.
  • FIG. 7 is a graph showing the relationship between the electromechanical coupling coefficient Nkt and the ratio r of a bulk acoustic wave resonator.
  • FIG. 2 is a schematic top view of a functional substrate of a filter unit according to an exemplary embodiment of the present invention A100.
  • the acoustic structure of the filter in the upper part of the base in Embodiment A100 is omitted in FIG. 2.
  • the filter unit in Embodiment A100 includes the functional substrate 100.
  • the cavity structure of the functional substrate 100 includes a cavity edge 120, and a number of island-shaped support structures 110 located in the cavity.
  • the island-shaped support structure 110 is used to support the apex portion of the polygonal resonator, where the dotted line portion shows the removed portion relative to the conventional structure of FIG. 1c.
  • Each island-shaped supporting protrusion can simultaneously support the apex portions of multiple resonators.
  • the embodiment A100 reduces the support structure in contact with the resonator. For example, in the case where only the four support structures 110 in FIG. 2 are in contact with the acoustic structure of the resonator, only these four islands exist The leakage channel formed by the support structure. Therefore, the solution of Example A100 reduces the energy leakage into the functional substrate.
  • the sandwich structure When the sandwich structure is placed on the cavity, the sandwich structure may be supported only by the four support structures 110 in FIG. 2, or may be supported by the edge 120 of the cavity together with the four support structures 110.
  • FIG. 3 is a schematic top view of a functional substrate of a filter unit according to an exemplary embodiment of the present invention A200.
  • the acoustic structure of the filter located above the functional base in Embodiment A200 is omitted in FIG. 3.
  • the filter unit in the embodiment A200 includes the substrate 200.
  • the cavity structure of the substrate 200 includes a cavity edge 220 and a number of island-shaped support structures 210 located in the cavity.
  • the island-shaped support structure 210 is used to support the side portion of the polygonal resonator (ie, the portion between the vertices of the resonator), where the dotted portion shows the portion removed relative to the conventional structure of FIG. 1c.
  • Each island-shaped supporting protrusion may simultaneously support a plurality of side portions of the resonator.
  • the embodiment A200 reduces the support structure in contact with the resonator, thereby reducing the energy leakage into the functional substrate.
  • the supporting protrusion may protrude from the edge of the cavity toward the inside of the cavity (ie, protrude radially inward). This solution can also be combined with the support protrusion in FIG. 3 or FIG. 2.
  • all of the cavity-type acoustic mirrors of the nine resonators are in communication with each other.
  • the support structure is a plurality of separate protrusions.
  • two longitudinal support ribs or two lateral support ribs in FIG. 2 may be provided.
  • the nine resonators are divided into three columns, and each column includes three, and the cavity-type acoustic mirrors of the three resonators in each column communicate with each other.
  • 4a is a schematic top view of a functional substrate of a filter unit according to an exemplary embodiment of the present invention A300.
  • 4b is a schematic cross-sectional view of a filter unit using the functional substrate in FIG. 4a according to an exemplary embodiment of the present invention, which shows a supporting state of a sandwich structure.
  • the area of the resonator is small enough (the rigidity is strong enough), all the supporting structures in the cavity on the surface of the functional substrate 300 can be removed.
  • the dashed line in the cavity of the embodiment A300 shown in FIG. 4a represents the portion removed with respect to the conventional structure of FIG. 1c.
  • the region 330 in FIG. 4b in the embodiment A300, only the cavity edge 320 is used to support the bottom electrode and the piezoelectric layer of the outermost resonator.
  • Fig. 4c is an exemplary schematic diagram of the support edge of the cavity of the functional substrate in Fig. 4a after further moving outward.
  • the functional substrate 400, the cavity support edge 410 (dashed line) in FIG. 4b, and the new support edge 420 are shown in FIG. 4c.
  • FIG. 4d is a schematic cross-sectional view of a filter unit using the functional substrate in FIG. 4c according to another exemplary embodiment of the present invention, which shows the supporting state of the sandwich structure.
  • FIG. 4d it can be seen that both ends of the piezoelectric layer of the sandwich structure are supported by the edge of the cavity, as shown by the support region 430 in FIG. 4d.
  • FIG. 4e is a schematic cross-sectional view of a filter unit using the functional substrate in FIG. 4c according to another exemplary embodiment of the present invention, which shows the supporting state of the sandwich structure.
  • the two sides of the sandwich structure are supported on the support edge of the cavity via the electrode pins 450 of the resonator, and the support area 440 shows the specific support situation.
  • Figure 4d and Figure 4e can also be combined.
  • the sandwich structure of the filter unit can be supported only by the edge of the cavity, and no protrusions or ribs for supporting the sandwich structure are provided inside the cavity at all.
  • the cavity is substantially rectangular, and the two opposite edges of the cavity support the sandwich structure, however, the present invention is not limited thereto.
  • the cavity can have other shapes based on actual needs, and even a substantially rectangular cavity can be sandwiched by more sides.
  • the sandwich structure is supported by the opposite edges of the cavity, in a plan view of the filter unit, at least a part of the edges of the sandwich structure may also have a gap between the edges of the cavity.
  • the support structure 92 provided in the cavity 92 has some missing support ribs compared to the prior art (FIG. 1 c ), as shown by the dotted line in FIG. 5.
  • a filter unit including:
  • a functional substrate for example, 100 in FIG. 2 provided with a cavity (for example, a space enclosed by the edge 120 in FIG. 2);
  • a functional device which is provided on the functional substrate and includes a plurality of bulk acoustic resonators (see, for example, FIG. 1b, except that the supporting structure of the sandwich structure is replaced by the structure shown in FIGS. 2 to 4e of the present invention),
  • a plurality of resonators share a piezoelectric layer (for example, see P400 in FIG. 1b), and each resonator has a top electrode (for example, P500 in FIG. 1b) and a bottom electrode provided on both sides of a corresponding portion of the common piezoelectric layer ( For example, P300 in FIG.
  • the top electrode, the bottom electrode, and the common piezoelectric layer form a sandwich structure, and each resonator forms a sub-sandwich structure. It should be noted that the resonator structure shown in FIG. 1b is also applicable In the embodiment shown in FIGS. 2 to 4e of the present invention,
  • the sub-sandwich structure and the cavity-type acoustic mirror underneath form an effective area of the corresponding resonator, and the cavity-type acoustic mirror is a part of the cavity;
  • the sandwich structure is supported by the cavity and cavity-type acoustic mirrors of at least two resonators communicate with each other.
  • At least two cavity-type acoustic mirrors here communicate with each other indicating that the two cavity-type acoustic mirrors are not closed independent sub-cavities. It is precisely because the cavity-type acoustic mirror is not a closed independent subspace, so, for example, the support bar rib in FIG. 1c is in a disconnected state, and the disconnection directly leads to a reduction in the contact area of the support bar rib and the acoustic structure, thereby reducing The energy loss dissipated into the functional substrate.
  • the filter unit adopts, for example, the technical solutions of FIG. 2 to FIG. 4e, which can be implemented in the case of the size of the current resonator, or can be implemented in the case of reducing the size of the current resonator.
  • the present invention proposes a solution to reduce the size of the resonator by reducing the area of the effective area of the resonator. Reducing the size of the resonator can directly increase the rigidity of the sandwich structure of the filter. In the case where the rigidity of the sandwich structure is increased, even if the corresponding supporting structure is reduced or eliminated in the cavity, the sandwich structure of the resonator will not be severely deformed to lower the Q value of the resonator.
  • a bulk acoustic wave resonator (having a piezoelectric layer, a bottom electrode, and a top electrode), by incorporating an impurity element in a piezoelectric layer such as an aluminum nitride (AlN) piezoelectric layer, makes the resonator The area of the effective area is reduced, making the size of the resonator smaller.
  • a piezoelectric layer such as an aluminum nitride (AlN) piezoelectric layer
  • Electromechanical coupling coefficient (Nkt) is one of the important performance indicators of bulk acoustic wave resonators. This performance parameter is closely related to the following factors: (1) the proportion of the impurity elements incorporated into the piezoelectric film; and (2) the electrode layer and The thickness ratio of the piezoelectric layer.
  • the sandwich structure of the bulk acoustic wave resonator shown in FIG. 6 includes a top electrode TE having a thickness t, a bottom electrode BE, and a piezoelectric layer PZ having a thickness d. Define scale here
  • the characteristic curve C0 moves upward to form a curve C1. If the electromechanical coupling coefficient of the resonator with the thickness ratio r 0 is Nkt 0 before undoping, then the coefficient increases to Nkt 1 after doping.
  • the electromechanical coupling coefficient is limited by the technical specifications of the filter's relative bandwidth and roll-off characteristics, so it needs to remain unchanged. Therefore, in the case of doping, the electromechanical coupling coefficient needs to be restored to the undoped level by adjusting the ratio r.
  • curve C1 has a maximum value, so there are two ways to adjust the ratio r, which can reduce the ratio r from r 0 to r 2 or increase to r 1 .
  • reducing r means that the electrode layer becomes thinner and the resistance increases, which causes the device loss to increase, the ratio r to r 1 is selected to be increased.
  • the frequency f of the resonator is constrained by the technical specifications of the filter center frequency and needs to be fixed.
  • the frequency f has the following simplified relationship with the overall thickness of the sandwich structure:
  • the impedance of the resonator 50 ohms
  • the impedance Z and the thickness d of the piezoelectric layer are related by the following formula:
  • is the dielectric constant of the piezoelectric material
  • A is the effective area of the resonator
  • j is the imaginary unit representing the phase
  • the impedance Z is required to be constant, if the thickness d of the piezoelectric layer becomes smaller, the effective area A must also become smaller.
  • the piezoelectric layer is doped with one or more of the following elements: scandium, yttrium, magnesium, titanium, lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium , Holmium, erbium, thulium, ytterbium, lutetium; and the atomic fraction of the doping element ranges from 1% to 40%, further, from 3% to 20%. The specific atomic fraction may be 1%, 3%, 6%, 20%, 30%, 40%, etc.
  • the piezoelectric layer may be an aluminum nitride piezoelectric layer, a zinc oxide piezoelectric layer, a lithium niobate piezoelectric layer, or a titanium zirconate piezoelectric layer.
  • the materials of the top electrode and the bottom electrode may be selected but not limited to: molybdenum, ruthenium, gold, aluminum, magnesium, tungsten, copper, titanium, iridium, osmium, chromium, or a combination of the above metals or alloys thereof.
  • the use of the above doping technical solution greatly reduces the area of the resonator, which in turn can reduce the size of the sandwich structure of the filter (resonator as the core device of the filter), thereby improving the rigidity of the sandwich structure.
  • the present invention also proposes a functional substrate for a filter provided with a cavity, wherein: the cavity is provided with a plurality of support protrusions independent of each other, and the support protrusions are suitable for supporting the filter function Device (for example, see the embodiments of FIGS. 2 and 3); or there is no supporting structure for supporting the functional device in the cavity (for example, see the embodiments of FIGS. 4a-4e).
  • all resonators are provided on the functional substrate; and the sum of the effective area areas of all resonators is not greater than 2/3 of the area of one surface of the functional substrate. Further, 1/2. It should be noted that the area of the surface of the functional substrate here is the entire area of one surface (including the area where the via and the functional device are located).
  • the invention also relates to a filter, including the above-mentioned filter unit.
  • the invention also relates to an electronic device, including the above-mentioned filter unit or filter or functional substrate.
  • the electronic devices here include but are not limited to intermediate products such as radio frequency front-ends, filter amplification modules, and terminal products such as mobile phones, WIFI, and drones.

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Abstract

The present invention relates to a filter unit, comprising: a functional substrate arranged with a cavity; and a functional means arranged at the functional substrate and comprising a plurality of bulk acoustic wave resonators, wherein the plurality of resonators share a piezoelectric layer, and each resonator is provided with a top electrode and a bottom electrode arranged at two sides of the corresponding portion of the shared piezoelectric layer, and the top electrode, the bottom electrode and the shared piezoelectric layer form a sandwich structure, and each resonator constitutes a sub-sandwich structure; the sub-sandwich structure and a cavity-type acoustic lens arranged therebelow form an effective area corresponding to the resonator, and the cavity-type acoustic lens is part of the cavity; and the sandwich structure is supported by the cavity, and the cavity-type acoustic lenses of at least two resonators are in communication with each other. The present invention also relates to a filter and an electronic device with the filter.

Description

具有改进的支撑结构的滤波器单元、滤波器和电子设备Filter unit, filter and electronic equipment with improved support structure 技术领域Technical field
本发明的实施例涉及半导体领域,尤其涉及一种滤波器单元,具有该滤波器单元的滤波器以及一种具有该滤波器单元或者滤波器的电子设备。Embodiments of the present invention relate to the semiconductor field, and in particular, to a filter unit, a filter with the filter unit, and an electronic device with the filter unit or filter.
背景技术Background technique
通常,由若干个体声波谐振器构成的传统滤波器具有如图1a所示的俯视结构。沿图1a中的直线AA’剖开,可得到如图1B所示的剖视结构。Generally, a conventional filter composed of several individual acoustic wave resonators has a top-view structure as shown in FIG. 1a. Along the line AA' in FIG. 1a, a cross-sectional structure as shown in FIG. 1B can be obtained.
图1a和1b中所示的滤波器包含若干个体声波谐振器,每个谐振器的具体结构包含基底P100;嵌于基底表面的空腔型声学镜P200(P210、P220);位于声学镜上方并覆盖部分基底表面的底电极P300(P310、P320);覆盖底电极和部分基板表面的压电层薄膜P400,且P400由多个谐振器共享;位于压电层上方的顶电极P500(P510、P520)。其中压电层和每个谐振器的声学镜、底电极、顶电极在横向上的重合部分定义了该谐振器的有效声学区域(P600,P610和P620)。The filters shown in FIGS. 1a and 1b include several individual acoustic wave resonators, and the specific structure of each resonator includes a substrate P100; a cavity-type acoustic mirror P200 (P210, P220) embedded on the surface of the substrate; The bottom electrode P300 (P310, P320) covering part of the base surface; the piezoelectric layer film P400 covering the bottom electrode and part of the substrate surface, and P400 is shared by multiple resonators; the top electrode P500 (P510, P520) above the piezoelectric layer ). The overlapping part of the piezoelectric layer and the acoustic mirror, bottom electrode, and top electrode of each resonator in the lateral direction defines the effective acoustic region of the resonator (P600, P610, and P620).
若从图1a和1b中将底电极,压电层和顶电极完全移除,则可以获得图1c和图1d所示的具有空腔的基底结构。If the bottom electrode, the piezoelectric layer and the top electrode are completely removed from FIGS. 1a and 1b, the substrate structure with cavities shown in FIGS. 1c and 1d can be obtained.
由于构成滤波器的各个膜层的厚度仅为微米级别,薄膜很容易受到应力的影响而发生形变。三明治结构扭曲形变会严重降低构成滤波器的谐振器的Q值,从而严重影响滤波器的性能。因此具有空腔型声学镜的传统体声波滤波器通常采用分立空腔结构的基底:即滤波器中的每个谐振器拥有自己独立的空腔。Since the thickness of each film layer constituting the filter is only on the order of micrometers, the film is easily deformed by the influence of stress. The distortion of the sandwich structure will seriously reduce the Q value of the resonator constituting the filter, thereby seriously affecting the performance of the filter. Therefore, traditional bulk acoustic wave filters with cavity-type acoustic mirrors usually use the base of a discrete cavity structure: that is, each resonator in the filter has its own independent cavity.
这种结构的好处是可在谐振器之间的下方形成支撑结构(图1c中的P110),从而增强滤波器整体结构的稳定性。The advantage of this structure is that a supporting structure (P110 in Figure 1c) can be formed below the resonators, thereby enhancing the stability of the overall structure of the filter.
但是,这种结构的缺陷是:理想状态下,谐振器在工作时,能量转换只发生在有效声学区域内。然而,实际情况下,谐振器的能量总是不可避免的要逸散到有效声学区域之外,并通过基底上的与底电极和压电层接触的支撑结构(图1c中的P110和P120)进一步逸散到基底中(如图1b中的箭头EL100、EL110、EL120和EL130所示)。该结构会造成显著的能量损失,最终使Q值严重下滑并造成滤波器性能劣化。However, the drawback of this structure is that under ideal conditions, when the resonator is operating, the energy conversion only occurs in the effective acoustic region. However, in practice, the energy of the resonator is always inevitably dissipated outside the effective acoustic region and passes through the support structure on the substrate that contacts the bottom electrode and the piezoelectric layer (P110 and P120 in Figure 1c) Further escape into the substrate (as shown by arrows EL100, EL110, EL120 and EL130 in Fig. 1b). This structure will cause significant energy loss, and eventually cause the Q value to decline severely and cause the filter performance to deteriorate.
发明内容Summary of the invention
为缓解或解决使用现有技术中的上述问题的至少一个方面,提出本发明。In order to alleviate or solve at least one aspect of using the above problems in the prior art, the present invention is proposed.
根据本发明的实施例的一个方面,提出了一种滤波器单元,包括:According to an aspect of an embodiment of the present invention, a filter unit is proposed, including:
功能基底,设置有空腔;和A functional base with a cavity; and
功能器件,设置于所述功能基底且包括多个体声波谐振器,所述多个谐振器共用压电层,每个谐振器具有设置于共用压电层的对应部分的两侧的顶电极和底电极,所述顶电极、底电极和共用压电层形成三明治结构,且每个谐振器构成子三明治结构,A functional device, which is provided on the functional substrate and includes a plurality of bulk acoustic wave resonators, the plurality of resonators share a piezoelectric layer, and each resonator has a top electrode and a bottom provided on both sides of a corresponding portion of the shared piezoelectric layer Electrodes, the top electrode, the bottom electrode and the common piezoelectric layer form a sandwich structure, and each resonator constitutes a sub-sandwich structure,
其中:among them:
所述子三明治结构与其下方的空腔型声学镜形成对应谐振器的有效区域,所述空腔型声学镜为所述空腔的一部分;The sub-sandwich structure and the cavity-type acoustic mirror underneath form an effective area of the corresponding resonator, and the cavity-type acoustic mirror is a part of the cavity;
所述三明治结构由所述空腔支撑且至少两个谐振器的空腔型声学镜彼此相通。The sandwich structure is supported by the cavity and cavity-type acoustic mirrors of at least two resonators communicate with each other.
在一个实施例中,所述三明治结构仅由所述空腔的边缘支撑。In one embodiment, the sandwich structure is supported only by the edge of the cavity.
进一步的,所述空腔为大致矩形的形状;所述三明治结构被所述空腔的两个相对的边缘支撑。Further, the cavity has a substantially rectangular shape; the sandwich structure is supported by two opposite edges of the cavity.
可选的,所述两个相对的边缘同时支撑最外围的谐振器的底电极和压电层。Optionally, the two opposite edges simultaneously support the bottom electrode and the piezoelectric layer of the outermost resonator.
可选的,所述功能器件具有用于谐振器的电极引脚;所述压电层位于所述两个相对的边缘之间且与其间隔开;且所述三明治结构通过分别设置于所述两个相对的边缘处的电极引脚被支撑在所述两个相对的边缘上。Optionally, the functional device has electrode pins for the resonator; the piezoelectric layer is located between and spaced apart from the two opposite edges; and the sandwich structure is provided by the The electrode pins at the two opposite edges are supported on the two opposite edges.
可选的,所述压电层的两侧分别支撑在所述两个相对的边缘上。Optionally, two sides of the piezoelectric layer are respectively supported on the two opposite edges.
可选的,所述三明治结构被所述空腔的相对的边缘支撑;且在所述滤波器单元的俯视图中,所述三明治结构的至少一部分边缘与所述空腔的边缘之间存在空隙。Optionally, the sandwich structure is supported by opposite edges of the cavity; and in a top view of the filter unit, there is a gap between at least a part of the edge of the sandwich structure and the edge of the cavity.
在另一个实施例中,所述三明治结构仅由设置于空腔中的多个支撑突起支撑。In another embodiment, the sandwich structure is supported only by a plurality of supporting protrusions provided in the cavity.
可选的,所述多个支撑突起包括与空腔的边缘间隔开的至少一个岛状支撑突起。Optionally, the plurality of support protrusions includes at least one island-shaped support protrusion spaced apart from the edge of the cavity.
可选的,所述谐振器为多边形谐振器;且所述岛状支撑突起用于支撑所述多边形谐振器的顶点部分。进一步的,每一个岛状支撑突起用于同时支撑多个谐振器的顶点部分。Optionally, the resonator is a polygonal resonator; and the island-shaped support protrusion is used to support an apex portion of the polygonal resonator. Further, each island-shaped supporting protrusion is used to simultaneously support the apex portions of multiple resonators.
可选的,所述谐振器为多边形谐振器;且所述岛状支撑突起用于支撑谐振器的边部分。进一步的,每一个岛状支撑突起用于同时多个支撑谐振器的边部分。Optionally, the resonator is a polygonal resonator; and the island-shaped support protrusion is used to support the side portion of the resonator. Further, each island-shaped supporting protrusion is used to simultaneously support a plurality of side portions of the resonator.
可选的,所述多个支撑突起包括自空腔的边缘向空腔径向向内的至少一个半岛状 支撑突起。Optionally, the plurality of support protrusions includes at least one peninsula-shaped support protrusion from the edge of the cavity to the cavity radially inward.
在再一个实施例中,所述三明治结构仅由连接在空腔的边缘之间的支撑条肋支撑。In yet another embodiment, the sandwich structure is supported only by support bar ribs connected between the edges of the cavity.
在另外的实施例中,所述三明治结构由所述空腔的边缘、设置于空腔中的至少一个支撑突起、谐振器的电极引脚以及连接在空腔的边缘之间的支撑条肋中的至少两种结构支撑。In another embodiment, the sandwich structure is composed of an edge of the cavity, at least one support protrusion provided in the cavity, an electrode pin of the resonator, and a support bar rib connected between the edges of the cavity At least two structural supports.
可选的,上述滤波器单元中,所有谐振器均设置于功能基底上,所述滤波器单元具有与功能基底对置的封装基底;且所有谐振器的有效区域的面积之和不大于所述功能基底的一个表面的面积的1/2;或者所述功能器件所位于的功能区域垂直投影到所述封装基底上的区域的面积不大于所述封装基底的表面的面积的2/3。Optionally, in the above filter unit, all resonators are provided on the functional substrate, and the filter unit has a packaging substrate opposite to the functional substrate; and the sum of the areas of the effective areas of all resonators is not greater than the 1/2 of the area of one surface of the functional substrate; or the area where the functional area where the functional device is located is projected vertically onto the packaging substrate is not larger than 2/3 of the surface area of the packaging substrate.
可选的,上述滤波器单元中,所述压电层掺杂有如下元素中的一种或多种:钪、钇、镁、钛、镧、铈、镨、钕、钷、钐、铕、钆、铽、镝、钬、铒、铥、镱、镥;且掺杂元素的原子分数范围为1%-40%。可选的,所述压电层为氮化铝压电层、氧化锌压电层、铌酸锂压电层或钛锆酸铅压电层。Optionally, in the above filter unit, the piezoelectric layer is doped with one or more of the following elements: scandium, yttrium, magnesium, titanium, lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, Gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, lutetium; and the atomic fraction of doping elements ranges from 1% to 40%. Optionally, the piezoelectric layer is an aluminum nitride piezoelectric layer, a zinc oxide piezoelectric layer, a lithium niobate piezoelectric layer, or a lead titanium zirconate piezoelectric layer.
可选的,上述滤波器单元中,掺杂元素的原子分数范围为3%-20%。Optionally, in the above filter unit, the atomic fraction of the doping element ranges from 3% to 20%.
本发明的实施例还涉及一种用于滤波器的功能基底,设置有空腔,其中:所述空腔内设置有彼此独立的多个支撑突起,所述支撑突起适于支撑滤波器功能器件;或者所述空腔内不存在用于支撑所述功能器件的支撑结构。An embodiment of the present invention also relates to a functional substrate for a filter, provided with a cavity, wherein: the cavity is provided with a plurality of support protrusions that are independent of each other, and the support protrusions are suitable for supporting filter functional devices Or there is no supporting structure for supporting the functional device in the cavity.
本发明的实施例也涉及一种滤波器,包括:根据上述的滤波器单元或者上述的功能基底。Embodiments of the present invention also relate to a filter, including: the filter unit according to the above or the above functional base.
本发明的实施例也涉及一种电子设备,包括上述的滤波器单元或者上述的滤波器。Embodiments of the present invention also relate to an electronic device, including the above filter unit or the above filter.
附图说明BRIEF DESCRIPTION
以下描述与附图可以更好地帮助理解本发明所公布的各种实施例中的这些和其他特点、优点,图中相同的附图标记始终表示相同的部件,其中:The following description and drawings can better help to understand these and other features and advantages in the various embodiments disclosed in the present invention. The same reference numerals in the figures always denote the same parts, among which:
图1a为现有技术中由多个体声波谐振器构成的滤波器单元的示意性俯视图;FIG. 1a is a schematic plan view of a filter unit composed of a plurality of bulk acoustic wave resonators in the prior art;
图1b为沿图1a中的AA’线截得的示意性剖视图;Figure 1b is a schematic cross-sectional view taken along line AA' in Figure 1a;
图1c为图1a中的滤波器单元的功能基底的示意性俯视图;FIG. 1c is a schematic top view of the functional base of the filter unit in FIG. 1a;
图1d为图1a中的滤波器单元的功能基底的示意性立体图;FIG. 1d is a schematic perspective view of the functional base of the filter unit in FIG. 1a;
图2为根据本发明的一个示例性实施例的滤波器单元的功能基底的示意性俯视 图;2 is a schematic top view of a functional substrate of a filter unit according to an exemplary embodiment of the present invention;
图3为根据本发明的一个示例性实施例的滤波器单元的功能基底的示意性俯视图;3 is a schematic top view of a functional base of a filter unit according to an exemplary embodiment of the present invention;
图4a为根据本发明的一个示例性实施例的滤波器单元的功能基底的示意性俯视图;4a is a schematic top view of a functional substrate of a filter unit according to an exemplary embodiment of the present invention;
图4b为根据本发明的一个示例性实施例的采用了图4a中的功能基底的滤波器单元的示意性剖视图,其中示出了三明治结构的支撑状态;4b is a schematic cross-sectional view of a filter unit using the functional substrate in FIG. 4a according to an exemplary embodiment of the present invention, which shows the supporting state of the sandwich structure;
图4c为图4a中的功能基底的空腔的支撑边缘进一步向外移动后的示例性示意图;4c is an exemplary schematic diagram of the support edge of the cavity of the functional substrate in FIG. 4a after further moving outward;
图4d为根据本发明的另一个示例性实施例的采用了图4c中的功能基底的滤波器单元的示意性剖视图,其中示出了三明治结构的支撑状态;4d is a schematic cross-sectional view of a filter unit using the functional substrate in FIG. 4c according to another exemplary embodiment of the present invention, which shows the supporting state of the sandwich structure;
图4e为根据本发明的另一个示例性实施例的采用了图4c中的功能基底的滤波器单元的示意性剖视图,其中示出了三明治结构的支撑状态;4e is a schematic cross-sectional view of a filter unit using the functional substrate in FIG. 4c according to another exemplary embodiment of the present invention, which shows the supporting state of the sandwich structure;
图5为根据本发明的一个示例性实施例的滤波器单元的功能基底的示意性俯视图;5 is a schematic top view of a functional base of a filter unit according to an exemplary embodiment of the present invention;
图6为体声波谐振器的三明治结构示意图;以及6 is a schematic diagram of a sandwich structure of a bulk acoustic wave resonator; and
图7为体声波谐振器的机电耦合系数Nkt与比例r之间的关系曲线图。7 is a graph showing the relationship between the electromechanical coupling coefficient Nkt and the ratio r of a bulk acoustic wave resonator.
具体实施方式detailed description
下面通过实施例,并结合附图,对本发明的技术方案作进一步具体的说明。在说明书中,相同或相似的附图标号指示相同或相似的部件。下述参照附图对本发明实施方式的说明旨在对本发明的总体发明构思进行解释,而不应当理解为对本发明的一种限制。The technical solutions of the present invention will be further specifically described below through the embodiments and the accompanying drawings. In the description, the same or similar reference numerals indicate the same or similar components. The following description of the embodiments of the present invention with reference to the drawings is intended to explain the general inventive concept of the present invention, and should not be construed as a limitation of the present invention.
下面参照附图示例性描述本发明。The present invention will be exemplarily described below with reference to the drawings.
图2为根据本发明的一个示例性实施例A100的滤波器单元的功能基底的示意性俯视图。FIG. 2 is a schematic top view of a functional substrate of a filter unit according to an exemplary embodiment of the present invention A100.
为了方便显示和描述功能基底结构,图2中省略了实施例A100中位于基底上部的滤波器声学结构。In order to facilitate the display and description of the functional base structure, the acoustic structure of the filter in the upper part of the base in Embodiment A100 is omitted in FIG. 2.
实施例A100中的滤波器单元包含功能基底100。功能基底100的空腔结构包含空 腔边缘120,和位于空腔中的若干岛状支撑结构110。其中,岛状支撑结构110用于支撑多边形谐振器的顶点部分,其中虚线部分显示了相对于图1c的传统结构所移除的部分。每一个岛状支撑突起可同时支撑多个谐振器的顶点部分。The filter unit in Embodiment A100 includes the functional substrate 100. The cavity structure of the functional substrate 100 includes a cavity edge 120, and a number of island-shaped support structures 110 located in the cavity. Among them, the island-shaped support structure 110 is used to support the apex portion of the polygonal resonator, where the dotted line portion shows the removed portion relative to the conventional structure of FIG. 1c. Each island-shaped supporting protrusion can simultaneously support the apex portions of multiple resonators.
相对于传统结构,实施例A100削减了与谐振器接触的支撑结构,例如,在仅有图2中的四个支撑结构110与谐振器的声学结构接触的情况下,仅存在这四个岛状支撑结构形成的泄漏通道。因此,实施例A100的方案减少了泄漏到功能基底中的能量。Compared with the conventional structure, the embodiment A100 reduces the support structure in contact with the resonator. For example, in the case where only the four support structures 110 in FIG. 2 are in contact with the acoustic structure of the resonator, only these four islands exist The leakage channel formed by the support structure. Therefore, the solution of Example A100 reduces the energy leakage into the functional substrate.
当三明治结构置于空腔上时,该三明治结构可以仅由图2中的四个支撑结构110支撑,也可以由空腔的边缘120与所述四个支撑结构110共同支撑。When the sandwich structure is placed on the cavity, the sandwich structure may be supported only by the four support structures 110 in FIG. 2, or may be supported by the edge 120 of the cavity together with the four support structures 110.
图3为根据本发明的一个示例性实施例A200的滤波器单元的功能基底的示意性俯视图。FIG. 3 is a schematic top view of a functional substrate of a filter unit according to an exemplary embodiment of the present invention A200.
为了方便显示和描述基底结构,图3中省略了实施例A200中位于功能基底上部的滤波器声学结构。In order to facilitate the display and description of the base structure, the acoustic structure of the filter located above the functional base in Embodiment A200 is omitted in FIG. 3.
实施例A200中的滤波器单元包含基底200。基底200的空腔结构包含空腔边缘220,和位于空腔中的若干岛状支撑结构210。其中,岛状支撑结构210用于支撑多边形谐振器的边部分(即谐振器的顶点之间的部分),其中虚线部分显示了相对于图1c的传统结构所移除的部分。每一个岛状支撑突起可以同时多个支撑谐振器的边部分。The filter unit in the embodiment A200 includes the substrate 200. The cavity structure of the substrate 200 includes a cavity edge 220 and a number of island-shaped support structures 210 located in the cavity. Among them, the island-shaped support structure 210 is used to support the side portion of the polygonal resonator (ie, the portion between the vertices of the resonator), where the dotted portion shows the portion removed relative to the conventional structure of FIG. 1c. Each island-shaped supporting protrusion may simultaneously support a plurality of side portions of the resonator.
相对于传统结构,实施例A200削减了与谐振器接触的支撑结构,从而减少了泄漏到功能基底中的能量。Compared with the conventional structure, the embodiment A200 reduces the support structure in contact with the resonator, thereby reducing the energy leakage into the functional substrate.
虽然没有示出,支撑突起也可以从空腔边缘朝向空腔内突出(即径向向内突出)。这种方案还可以与图3或者图2中的支撑突起结合。Although not shown, the supporting protrusion may protrude from the edge of the cavity toward the inside of the cavity (ie, protrude radially inward). This solution can also be combined with the support protrusion in FIG. 3 or FIG. 2.
在例如图2或图3的使用支撑突起的情况下,所有的九个谐振器的空腔型声学镜均是彼此相通的。In the case where, for example, the supporting protrusions of FIG. 2 or FIG. 3 are used, all of the cavity-type acoustic mirrors of the nine resonators are in communication with each other.
在图2与图3示出的方案中,支撑结构为多个单独的突起,不过,如图2所示,可以设置图2中的纵向两条支撑肋或者横向的两条支撑肋。在这种情况下,例如如果存在两条纵向的支撑肋,则九个谐振器被分为三列,每一列包括三个,且每列的三个谐振器的空腔型声学镜彼此相通。In the solutions shown in FIGS. 2 and 3, the support structure is a plurality of separate protrusions. However, as shown in FIG. 2, two longitudinal support ribs or two lateral support ribs in FIG. 2 may be provided. In this case, for example, if there are two longitudinal support ribs, the nine resonators are divided into three columns, and each column includes three, and the cavity-type acoustic mirrors of the three resonators in each column communicate with each other.
图4a为根据本发明的一个示例性实施例A300的滤波器单元的功能基底的示意性俯视图。图4b为根据本发明的一个示例性实施例的采用了图4a中的功能基底的滤波器单元的示意性剖视图,其中示出了三明治结构的支撑状态。4a is a schematic top view of a functional substrate of a filter unit according to an exemplary embodiment of the present invention A300. 4b is a schematic cross-sectional view of a filter unit using the functional substrate in FIG. 4a according to an exemplary embodiment of the present invention, which shows a supporting state of a sandwich structure.
当谐振器的面积足够小时(刚性足够强),可以移除位于功能基底300表面空腔 内全部的支撑结构。图4a所示的实施例A300的空腔内的虚线表示相对于图1c的传统结构所移除的部分。如图4b中区域330所示,实施例A300中,仅依靠空腔边缘320来支撑最外围的谐振器的底电极和压电层。When the area of the resonator is small enough (the rigidity is strong enough), all the supporting structures in the cavity on the surface of the functional substrate 300 can be removed. The dashed line in the cavity of the embodiment A300 shown in FIG. 4a represents the portion removed with respect to the conventional structure of FIG. 1c. As shown in the region 330 in FIG. 4b, in the embodiment A300, only the cavity edge 320 is used to support the bottom electrode and the piezoelectric layer of the outermost resonator.
图4c为图4a中的功能基底的空腔的支撑边缘进一步向外移动后的示例性示意图。在图4c中示出了功能基底400、图4b中的空腔支撑边缘410(虚线)、新的支撑边缘420。Fig. 4c is an exemplary schematic diagram of the support edge of the cavity of the functional substrate in Fig. 4a after further moving outward. The functional substrate 400, the cavity support edge 410 (dashed line) in FIG. 4b, and the new support edge 420 are shown in FIG. 4c.
图4d为根据本发明的另一个示例性实施例的采用了图4c中的功能基底的滤波器单元的示意性剖视图,其中示出了三明治结构的支撑状态。在图4d中,可以看到,三明治结构的压电层的两端由空腔的边缘支撑,如图4d中的支撑区域430所示。FIG. 4d is a schematic cross-sectional view of a filter unit using the functional substrate in FIG. 4c according to another exemplary embodiment of the present invention, which shows the supporting state of the sandwich structure. In FIG. 4d, it can be seen that both ends of the piezoelectric layer of the sandwich structure are supported by the edge of the cavity, as shown by the support region 430 in FIG. 4d.
图4e为根据本发明的另一个示例性实施例的采用了图4c中的功能基底的滤波器单元的示意性剖视图,其中示出了三明治结构的支撑状态。图4e中,三明治结构的两侧边缘经由谐振器的电极引脚450支撑在空腔的支撑边缘,支撑区域440示出了具体的支撑情况。需要指出的是,图4d与图4e也是可以结合的。FIG. 4e is a schematic cross-sectional view of a filter unit using the functional substrate in FIG. 4c according to another exemplary embodiment of the present invention, which shows the supporting state of the sandwich structure. In FIG. 4e, the two sides of the sandwich structure are supported on the support edge of the cavity via the electrode pins 450 of the resonator, and the support area 440 shows the specific support situation. It should be pointed out that Figure 4d and Figure 4e can also be combined.
从图4a-4e可以看出,滤波器单元的三明治结构可以仅由空腔的边缘支撑,而在空腔之内完全没有设置用于支撑三明治结构的突起或者条肋。As can be seen from FIGS. 4a-4e, the sandwich structure of the filter unit can be supported only by the edge of the cavity, and no protrusions or ribs for supporting the sandwich structure are provided inside the cavity at all.
在图4a-4e的示例中,空腔为大致矩形,而且空腔的两个相对的边缘支撑三明治结构,不过,本发明不限于此。空腔可以基于实际需要为其他形状,而且,即使是大致矩形的空腔,也可以由更多条边支撑三明治结构。在三明治结构被空腔的相对的边缘支撑时,在滤波器单元的俯视图中,三明治结构的至少一部分边缘还可以与空腔的边缘之间存在空隙。In the example of FIGS. 4a-4e, the cavity is substantially rectangular, and the two opposite edges of the cavity support the sandwich structure, however, the present invention is not limited thereto. The cavity can have other shapes based on actual needs, and even a substantially rectangular cavity can be sandwiched by more sides. When the sandwich structure is supported by the opposite edges of the cavity, in a plan view of the filter unit, at least a part of the edges of the sandwich structure may also have a gap between the edges of the cavity.
在可选的实施例中,如图5所示,设置于空腔92内的支撑结构92相较于现有技术(图1c)存在部分支撑肋缺失,如图5中虚线所示。In an alternative embodiment, as shown in FIG. 5, the support structure 92 provided in the cavity 92 has some missing support ribs compared to the prior art (FIG. 1 c ), as shown by the dotted line in FIG. 5.
虽然没有示出,图2、图3的方案、图4a-4e的方案以及图5的方案彼此之间可以结合使用。Although not shown, the solutions of FIGS. 2 and 3, the solutions of FIGS. 4a-4e and the solution of FIG. 5 can be used in combination with each other.
基于以上,本发明提出了一种滤波器单元,包括:Based on the above, the present invention proposes a filter unit, including:
功能基底(例如图2中的100),设置有空腔(例如图2中的边缘120围合而成的空间);和A functional substrate (for example, 100 in FIG. 2) provided with a cavity (for example, a space enclosed by the edge 120 in FIG. 2); and
功能器件,设置于所述功能基底且包括多个体声波谐振器(例如参见图1b,只不过其中的三明治结构的支撑结构换为了本发明的图2-图4e中示出的结构),所述多个 谐振器共用压电层(例如参见图1b中的P400),每个谐振器具有设置于共用压电层的对应部分的两侧的顶电极(例如图1b中的P500)和底电极(例如图1b中的P300),所述顶电极、底电极和共用压电层形成三明治结构,且每个谐振器构成子三明治结构,需要说明的是,图1b中示出的谐振器结构同样适用于本发明的图2-图4e中示出的实施例,A functional device, which is provided on the functional substrate and includes a plurality of bulk acoustic resonators (see, for example, FIG. 1b, except that the supporting structure of the sandwich structure is replaced by the structure shown in FIGS. 2 to 4e of the present invention), A plurality of resonators share a piezoelectric layer (for example, see P400 in FIG. 1b), and each resonator has a top electrode (for example, P500 in FIG. 1b) and a bottom electrode provided on both sides of a corresponding portion of the common piezoelectric layer ( For example, P300 in FIG. 1b), the top electrode, the bottom electrode, and the common piezoelectric layer form a sandwich structure, and each resonator forms a sub-sandwich structure. It should be noted that the resonator structure shown in FIG. 1b is also applicable In the embodiment shown in FIGS. 2 to 4e of the present invention,
其中:among them:
所述子三明治结构与其下方的空腔型声学镜形成对应谐振器的有效区域,所述空腔型声学镜为所述空腔的一部分;The sub-sandwich structure and the cavity-type acoustic mirror underneath form an effective area of the corresponding resonator, and the cavity-type acoustic mirror is a part of the cavity;
所述三明治结构由所述空腔支撑且至少两个谐振器的空腔型声学镜彼此相通。The sandwich structure is supported by the cavity and cavity-type acoustic mirrors of at least two resonators communicate with each other.
需要指出的是,这里的至少两个空腔型声学镜彼此相通表明该两个空腔型声学镜并非是闭合的独立子空腔。正是因为空腔型声学镜并非闭合的独立子空间,所以,例如图1c中的支撑条肋出现断开的状态,该断开直接导致支撑条肋与声学结构的接触面积减小,从而降低了散逸到功能基底中的能量损失。It should be noted that at least two cavity-type acoustic mirrors here communicate with each other indicating that the two cavity-type acoustic mirrors are not closed independent sub-cavities. It is precisely because the cavity-type acoustic mirror is not a closed independent subspace, so, for example, the support bar rib in FIG. 1c is in a disconnected state, and the disconnection directly leads to a reduction in the contact area of the support bar rib and the acoustic structure, thereby reducing The energy loss dissipated into the functional substrate.
滤波器单元采用例如图2-图4e的技术方案,可以在当前谐振器的尺寸的情况下实现,也可以在减小当前谐振器的尺寸的情况下实现。针对后一种情况,本发明提出了减小谐振器的有效区域的面积的方式来减小谐振器的尺寸的方案。谐振器的尺寸缩减,可以直接提高滤波器的三明治结构的刚性。在三明治结构的刚性提高的情况下,即使空腔中减少或者消除对应的支撑结构,谐振器的三明治结构也不会严重变形而降低谐振器的Q值。The filter unit adopts, for example, the technical solutions of FIG. 2 to FIG. 4e, which can be implemented in the case of the size of the current resonator, or can be implemented in the case of reducing the size of the current resonator. For the latter case, the present invention proposes a solution to reduce the size of the resonator by reducing the area of the effective area of the resonator. Reducing the size of the resonator can directly increase the rigidity of the sandwich structure of the filter. In the case where the rigidity of the sandwich structure is increased, even if the corresponding supporting structure is reduced or eliminated in the cavity, the sandwich structure of the resonator will not be severely deformed to lower the Q value of the resonator.
具体的,在一个实施例中,体声波谐振器(具有压电层、底电极和顶电极),通过在例如氮化铝(AlN)压电层的压电层中参入杂质元素,使谐振器的有效区域的面积缩小,从而使得谐振器的尺寸变小。Specifically, in one embodiment, a bulk acoustic wave resonator (having a piezoelectric layer, a bottom electrode, and a top electrode), by incorporating an impurity element in a piezoelectric layer such as an aluminum nitride (AlN) piezoelectric layer, makes the resonator The area of the effective area is reduced, making the size of the resonator smaller.
下面参照附图6-7具体说明利用元素掺杂降低体声波谐振器的有效区域的面积的原理。The principle of using element doping to reduce the area of the effective area of the bulk acoustic wave resonator is specifically described below with reference to FIGS. 6-7.
机电耦合系数(Nkt)是体声波谐振器的重要性能指标之一,该性能参数和如下因素有密切关系:(1)压电薄膜参入杂质元素的比例;以及(2)三明治结构中电极层和压电层的厚度比例。Electromechanical coupling coefficient (Nkt) is one of the important performance indicators of bulk acoustic wave resonators. This performance parameter is closely related to the following factors: (1) the proportion of the impurity elements incorporated into the piezoelectric film; and (2) the electrode layer and The thickness ratio of the piezoelectric layer.
图6所示的体声波谐振器的三明治结构包含厚度为t的顶电极TE、底电极BE以及厚度为d的压电层PZ。此处定义比例The sandwich structure of the bulk acoustic wave resonator shown in FIG. 6 includes a top electrode TE having a thickness t, a bottom electrode BE, and a piezoelectric layer PZ having a thickness d. Define scale here
Figure PCTCN2019121081-appb-000001
Figure PCTCN2019121081-appb-000001
对于特定的未掺杂的谐振器,其归一化的机电耦合系数Nkt和比例r之间的关系可用图7所示的特性曲线C0描述。For a specific undoped resonator, the relationship between the normalized electromechanical coupling coefficient Nkt and the ratio r can be described by the characteristic curve C0 shown in FIG. 7.
如图7所示,当对该谐振器的压电层掺杂时,特性曲线C0向上移动形成曲线C1。若未掺杂之前,具有厚度比r 0的谐振器的机电耦合系数为Nkt 0,那么掺杂之后该系数升高至Nkt 1As shown in FIG. 7, when the piezoelectric layer of the resonator is doped, the characteristic curve C0 moves upward to form a curve C1. If the electromechanical coupling coefficient of the resonator with the thickness ratio r 0 is Nkt 0 before undoping, then the coefficient increases to Nkt 1 after doping.
通常机电耦合系数受到滤波器相对带宽及滚降特性的技术指标限制而需保持不变,因此在掺杂的情况下,需要通过调节比例r来将机电耦合系数恢复到未掺杂的水平。注意到曲线C1有一个最大值,因此对比例r的调节有两种方式,可使比例r从r 0缩小到r 2或增大至r 1。但由于缩小r意味着电极层变薄阻抗增大,从而造成器件损耗上升,因此选择增大比例r至r 1Generally, the electromechanical coupling coefficient is limited by the technical specifications of the filter's relative bandwidth and roll-off characteristics, so it needs to remain unchanged. Therefore, in the case of doping, the electromechanical coupling coefficient needs to be restored to the undoped level by adjusting the ratio r. Note that curve C1 has a maximum value, so there are two ways to adjust the ratio r, which can reduce the ratio r from r 0 to r 2 or increase to r 1 . However, since reducing r means that the electrode layer becomes thinner and the resistance increases, which causes the device loss to increase, the ratio r to r 1 is selected to be increased.
另一方面,谐振器的频率f受滤波器中心频率技术指标约束而需固定不变。频率f与三明治结构的总体厚度有如下简化关系:On the other hand, the frequency f of the resonator is constrained by the technical specifications of the filter center frequency and needs to be fixed. The frequency f has the following simplified relationship with the overall thickness of the sandwich structure:
Figure PCTCN2019121081-appb-000002
Figure PCTCN2019121081-appb-000002
其中D是将电极材料(Mo)等效为压电材料的等效总厚度,具体为D=2tv 1/v 2+d,其中,v 2是电极材料中纵波声速,v 1是压电材料中纵波声速。将公式(1)带入公式(2)中,可以得到: Where D is the equivalent total thickness of the electrode material (Mo) to the piezoelectric material, specifically D = 2tv 1 /v 2 + d, where v 2 is the longitudinal wave sound velocity in the electrode material and v 1 is the piezoelectric material Medium longitudinal wave sound velocity. Taking formula (1) into formula (2), we can get:
Figure PCTCN2019121081-appb-000003
Figure PCTCN2019121081-appb-000003
由于掺杂带来的声速v 1降低,同时,r增大,那么若要求频率f不发生变化,那么压电层厚度d应减小。 Since the sound velocity v 1 due to doping decreases, and at the same time, r increases, then if the frequency f is not required to change, then the thickness d of the piezoelectric layer should decrease.
此外,对谐振器的阻抗也有限制(50欧姆)的技术要求,而阻抗Z与压电层厚度d之间由下式相联系:In addition, there is a technical requirement for the impedance of the resonator (50 ohms), and the impedance Z and the thickness d of the piezoelectric layer are related by the following formula:
Figure PCTCN2019121081-appb-000004
Figure PCTCN2019121081-appb-000004
其中,ε是压电材料的介电常数,A是谐振器的有效面积,j是表示相位的虚数单位。Where ε is the dielectric constant of the piezoelectric material, A is the effective area of the resonator, and j is the imaginary unit representing the phase.
当要求阻抗Z不变时,若压电层厚度d变小时,有效面积A也必须变小。When the impedance Z is required to be constant, if the thickness d of the piezoelectric layer becomes smaller, the effective area A must also become smaller.
基于以上,可以通过向压电层添加杂质元素使得压电层厚度d变小,从而减小谐振器的有效面积A。Based on the above, it is possible to reduce the thickness d of the piezoelectric layer by adding an impurity element to the piezoelectric layer, thereby reducing the effective area A of the resonator.
在实施例中,所述压电层掺杂有如下元素中的一种或多种:钪、钇、镁、钛、镧、铈、镨、钕、钷、钐、铕、钆、铽、镝、钬、铒、铥、镱、镥;且掺杂元素的原子分 数范围为1%-40%,进一步的,为3%-20%。具体的原子分数可以为1%、3%、6%、20%、30%、40%等。In an embodiment, the piezoelectric layer is doped with one or more of the following elements: scandium, yttrium, magnesium, titanium, lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium , Holmium, erbium, thulium, ytterbium, lutetium; and the atomic fraction of the doping element ranges from 1% to 40%, further, from 3% to 20%. The specific atomic fraction may be 1%, 3%, 6%, 20%, 30%, 40%, etc.
所述压电层可为氮化铝压电层、氧化锌压电层、铌酸锂压电层或钛锆酸铅压电层。The piezoelectric layer may be an aluminum nitride piezoelectric layer, a zinc oxide piezoelectric layer, a lithium niobate piezoelectric layer, or a titanium zirconate piezoelectric layer.
在本发明中,顶电极和底电极的材料可选但不限于:钼、钌、金、铝、镁、钨、铜,钛、铱、锇、铬等或以上金属的复合或其合金。In the present invention, the materials of the top electrode and the bottom electrode may be selected but not limited to: molybdenum, ruthenium, gold, aluminum, magnesium, tungsten, copper, titanium, iridium, osmium, chromium, or a combination of the above metals or alloys thereof.
利用上述掺杂的技术方案使得谐振器的面积大幅缩小,进而可以减小滤波器(谐振器作为滤波器的核心器件)的三明治结构的尺寸,从而可以提高三明治结构的刚性。The use of the above doping technical solution greatly reduces the area of the resonator, which in turn can reduce the size of the sandwich structure of the filter (resonator as the core device of the filter), thereby improving the rigidity of the sandwich structure.
相应的,本发明也提出了一种用于滤波器的功能基底,设置有空腔,其中:所述空腔内设置有彼此独立的多个支撑突起,所述支撑突起适于支撑滤波器功能器件(例如参见图2和图3的实施例);或者所述空腔内不存在用于支撑所述功能器件的支撑结构(例如参见图4a-4e的实施例)。Correspondingly, the present invention also proposes a functional substrate for a filter provided with a cavity, wherein: the cavity is provided with a plurality of support protrusions independent of each other, and the support protrusions are suitable for supporting the filter function Device (for example, see the embodiments of FIGS. 2 and 3); or there is no supporting structure for supporting the functional device in the cavity (for example, see the embodiments of FIGS. 4a-4e).
在一个可选的实施例中,所有谐振器均设置于功能基底上;且所有谐振器的有效区域的面积之和不大于所述功能基底的一个表面的面积的2/3,进一步的,为1/2。需要指出的是,这里的功能基底的表面的面积为其一个表面的整个面积(包括了过孔以及功能器件所在的面积)。In an alternative embodiment, all resonators are provided on the functional substrate; and the sum of the effective area areas of all resonators is not greater than 2/3 of the area of one surface of the functional substrate. Further, 1/2. It should be noted that the area of the surface of the functional substrate here is the entire area of one surface (including the area where the via and the functional device are located).
相应的,本发明也涉及一种滤波器,包括上述的滤波器单元。Correspondingly, the invention also relates to a filter, including the above-mentioned filter unit.
本发明也涉及一种电子设备,包括上述的滤波器单元或者滤波器或者功能基底。需要指出的是,这里的电子设备,包括但不限于射频前端、滤波放大模块等中间产品,以及手机、WIFI、无人机等终端产品。The invention also relates to an electronic device, including the above-mentioned filter unit or filter or functional substrate. It should be noted that the electronic devices here include but are not limited to intermediate products such as radio frequency front-ends, filter amplification modules, and terminal products such as mobile phones, WIFI, and drones.
尽管已经示出和描述了本发明的实施例,对于本领域的普通技术人员而言,可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行变化,本发明的范围由所附权利要求及其等同物限定。Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that these embodiments can be changed without departing from the principle and spirit of the present invention. The appended claims and their equivalents are limited.

Claims (23)

  1. 一种滤波器单元,包括:A filter unit, including:
    功能基底,设置有空腔;和A functional base with a cavity; and
    功能器件,设置于所述功能基底且包括多个体声波谐振器,所述多个谐振器共用压电层,每个谐振器具有设置于共用压电层的对应部分的两侧的顶电极和底电极,所述顶电极、底电极和共用压电层形成三明治结构,且每个谐振器构成子三明治结构,A functional device, which is provided on the functional substrate and includes a plurality of bulk acoustic wave resonators, the plurality of resonators share a piezoelectric layer, and each resonator has a top electrode and a bottom provided on both sides of a corresponding portion of the shared piezoelectric layer Electrodes, the top electrode, the bottom electrode and the common piezoelectric layer form a sandwich structure, and each resonator constitutes a sub-sandwich structure,
    其中:among them:
    所述子三明治结构与其下方的空腔型声学镜形成对应谐振器的有效区域,所述空腔型声学镜为所述空腔的一部分;The sub-sandwich structure and the cavity-type acoustic mirror underneath form an effective area of the corresponding resonator, and the cavity-type acoustic mirror is a part of the cavity;
    所述三明治结构由所述空腔支撑且至少两个谐振器的空腔型声学镜彼此相通。The sandwich structure is supported by the cavity and cavity-type acoustic mirrors of at least two resonators communicate with each other.
  2. 根据权利要求1所述的滤波器单元,其中:The filter unit according to claim 1, wherein:
    所述三明治结构仅由所述空腔的边缘支撑。The sandwich structure is only supported by the edge of the cavity.
  3. 根据权利要求2所述的滤波器单元,其中:The filter unit according to claim 2, wherein:
    所述空腔为大致矩形的形状;The cavity is substantially rectangular in shape;
    所述三明治结构被所述空腔的两个相对的边缘支撑。The sandwich structure is supported by two opposite edges of the cavity.
  4. 根据权利要求3所述的滤波器单元,其中:The filter unit according to claim 3, wherein:
    所述两个相对的边缘同时支撑最外围的谐振器的底电极和压电层。The two opposite edges simultaneously support the bottom electrode and the piezoelectric layer of the outermost resonator.
  5. 根据权利要求3或4所述的滤波器单元,其中:The filter unit according to claim 3 or 4, wherein:
    所述功能器件具有用于谐振器的电极引脚;The functional device has electrode pins for the resonator;
    所述压电层位于所述两个相对的边缘之间且与其间隔开;且The piezoelectric layer is located between and spaced from the two opposing edges; and
    所述三明治结构通过分别设置于所述两个相对的边缘处的电极引脚被支撑在所述两个相对的边缘上。The sandwich structure is supported on the two opposite edges by electrode pins provided at the two opposite edges, respectively.
  6. 根据权利要求3所述的滤波器单元,其中:The filter unit according to claim 3, wherein:
    所述压电层的两侧分别支撑在所述两个相对的边缘上。Two sides of the piezoelectric layer are respectively supported on the two opposite edges.
  7. 根据权利要求2所述的滤波器单元,其中:The filter unit according to claim 2, wherein:
    所述三明治结构被所述空腔的相对的边缘支撑;且The sandwich structure is supported by opposite edges of the cavity; and
    在所述滤波器单元的俯视图中,所述三明治结构的至少一部分边缘与所述空腔的边缘之间存在空隙。In a top view of the filter unit, there is a gap between at least a part of the edge of the sandwich structure and the edge of the cavity.
  8. 根据权利要求1所述的滤波器单元,其中:The filter unit according to claim 1, wherein:
    所述三明治结构仅由设置于空腔中的多个支撑突起支撑。The sandwich structure is only supported by a plurality of supporting protrusions provided in the cavity.
  9. 根据权利要求8所述的滤波器单元,其中:The filter unit according to claim 8, wherein:
    所述多个支撑突起包括与空腔的边缘间隔开的至少一个岛状支撑突起。The plurality of support protrusions includes at least one island-shaped support protrusion spaced apart from the edge of the cavity.
  10. 根据权利要求9所述的滤波器单元,其中:The filter unit according to claim 9, wherein:
    所述谐振器为多边形谐振器;且The resonator is a polygonal resonator; and
    所述岛状支撑突起用于支撑所述多边形谐振器的顶点部分。The island-shaped support protrusion is used to support the vertex portion of the polygonal resonator.
  11. 根据权利要求10所述的滤波器单元,其中:The filter unit according to claim 10, wherein:
    每一个岛状支撑突起用于同时支撑多个谐振器的顶点部分。Each island-shaped supporting protrusion is used to simultaneously support the apex portions of multiple resonators.
  12. 根据权利要求9所述的滤波器单元,其中:The filter unit according to claim 9, wherein:
    所述谐振器为多边形谐振器;且The resonator is a polygonal resonator; and
    所述岛状支撑突起用于支撑谐振器的边部分。The island-shaped supporting protrusion is used to support the side portion of the resonator.
  13. 根据权利要求12所述的滤波器单元,其中:The filter unit according to claim 12, wherein:
    每一个岛状支撑突起用于同时多个支撑谐振器的边部分。Each island-shaped supporting protrusion serves to simultaneously support a plurality of side portions of the resonator.
  14. 根据权利要求8-13中任一项所述的滤波器单元,其中:The filter unit according to any one of claims 8 to 13, wherein:
    所述多个支撑突起包括自空腔的边缘向空腔径向向内的至少一个半岛状支撑突起。The plurality of support protrusions includes at least one peninsula-shaped support protrusion from the edge of the cavity to the cavity radially inward.
  15. 根据权利要求1所述的滤波器单元,其中:The filter unit according to claim 1, wherein:
    所述三明治结构仅由连接在空腔的边缘之间的支撑条肋支撑。The sandwich structure is only supported by the support bar ribs connected between the edges of the cavity.
  16. 根据权利要求1所述的滤波器单元,其中:The filter unit according to claim 1, wherein:
    所述三明治结构由所述空腔的边缘、设置于空腔中的至少一个支撑突起、谐振器的电极引脚以及连接在空腔的边缘之间的支撑条肋中的至少两种结构支撑。The sandwich structure is supported by at least two structures among the edge of the cavity, at least one supporting protrusion provided in the cavity, the electrode pin of the resonator, and the support bar rib connected between the edges of the cavity.
  17. 根据权利要求1-16中任一项所述的滤波器单元,其中:The filter unit according to any one of claims 1-16, wherein:
    所有谐振器均设置于功能基底上,所述滤波器单元具有与功能基底对置的封装基底;且All resonators are provided on the functional substrate, and the filter unit has a packaging substrate opposite to the functional substrate; and
    所有谐振器的有效区域的面积之和不大于所述功能基底的一个表面的面积的1/2;或者所述功能器件所位于的功能区域垂直投影到所述封装基底上的区域的面积不大于所述封装基底的表面的面积的2/3。The sum of the effective areas of all resonators is not greater than 1/2 of the area of one surface of the functional substrate; or the area of the functional area where the functional device is located is projected vertically onto the packaging substrate is not greater than 2/3 of the area of the surface of the packaging substrate.
  18. 根据权利要求1-17中任一项所述的滤波器单元,其中:The filter unit according to any one of claims 1-17, wherein:
    所述压电层掺杂有如下元素中的一种或多种:钪、钇、镁、钛、镧、铈、镨、钕、钷、钐、铕、钆、铽、镝、钬、铒、铥、镱、镥;且The piezoelectric layer is doped with one or more of the following elements: scandium, yttrium, magnesium, titanium, lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, Thulium, Ytterbium, Lutetium; and
    掺杂元素的原子分数范围为1%-40%。The atomic fraction of the doping element ranges from 1% to 40%.
  19. 根据权利要求18所述的滤波器单元,其中:The filter unit according to claim 18, wherein:
    所述压电层为氮化铝压电层、氧化锌压电层、铌酸锂压电层或钛锆酸铅压电层。The piezoelectric layer is an aluminum nitride piezoelectric layer, a zinc oxide piezoelectric layer, a lithium niobate piezoelectric layer, or a lead titanium zirconate piezoelectric layer.
  20. 根据权利要求18或19所述的滤波器单元,其中:The filter unit according to claim 18 or 19, wherein:
    掺杂元素的原子分数范围为3%-20%。The atomic fraction of the doping element ranges from 3% to 20%.
  21. 一种用于滤波器的功能基底,设置有空腔,其中:A functional base for a filter, provided with a cavity, in which:
    所述空腔内设置有彼此独立的多个支撑突起,所述支撑突起适于支撑滤波器功能器件;或者A plurality of support protrusions independent of each other are provided in the cavity, the support protrusions are suitable for supporting the filter functional device; or
    所述空腔内不存在用于支撑所述功能器件的支撑结构。There is no supporting structure for supporting the functional device in the cavity.
  22. 一种滤波器,包括:A filter, including:
    根据权利要求1-20中任一项所述的滤波器单元或者根据权利要求21所述的功能基底。The filter unit according to any one of claims 1-20 or the functional substrate according to claim 21.
  23. 一种电子设备,包括根据权利要求1-20中任一项所述的滤波器单元或者根据权利要求22所述的滤波器。An electronic device comprising the filter unit according to any one of claims 1-20 or the filter according to claim 22.
PCT/CN2019/121081 2018-12-18 2019-11-26 Filter unit with improved support structure, filter and electronic device WO2020125351A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101069344A (en) * 2004-12-07 2007-11-07 松下电器产业株式会社 Thin film elastic wave resonator
CN107231138A (en) * 2016-12-29 2017-10-03 杭州左蓝微电子技术有限公司 FBAR with supporting construction and preparation method thereof
WO2018038915A1 (en) * 2016-08-25 2018-03-01 Qualcomm Incorporated Single-chip multi-frequency film bulk acoustic-wave resonators

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9450561B2 (en) * 2009-11-25 2016-09-20 Avago Technologies General Ip (Singapore) Pte. Ltd. Bulk acoustic wave (BAW) resonator structure having an electrode with a cantilevered portion and a piezoelectric layer with varying amounts of dopant
US9520855B2 (en) * 2014-02-26 2016-12-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Bulk acoustic wave resonators having doped piezoelectric material and frame elements

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101069344A (en) * 2004-12-07 2007-11-07 松下电器产业株式会社 Thin film elastic wave resonator
WO2018038915A1 (en) * 2016-08-25 2018-03-01 Qualcomm Incorporated Single-chip multi-frequency film bulk acoustic-wave resonators
CN107231138A (en) * 2016-12-29 2017-10-03 杭州左蓝微电子技术有限公司 FBAR with supporting construction and preparation method thereof

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