WO2020125291A1 - 成像组件及其制造方法、摄像模组和电子设备 - Google Patents

成像组件及其制造方法、摄像模组和电子设备 Download PDF

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Publication number
WO2020125291A1
WO2020125291A1 PCT/CN2019/118771 CN2019118771W WO2020125291A1 WO 2020125291 A1 WO2020125291 A1 WO 2020125291A1 CN 2019118771 W CN2019118771 W CN 2019118771W WO 2020125291 A1 WO2020125291 A1 WO 2020125291A1
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Prior art keywords
light
light guide
blocking layer
guide channel
imaging assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/118771
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English (en)
French (fr)
Inventor
陈振宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
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Ningbo Sunny Opotech Co Ltd
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Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Publication of WO2020125291A1 publication Critical patent/WO2020125291A1/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/10—Image acquisition
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/95—Computational photography systems, e.g. light-field imaging systems
    • H04N23/955—Computational photography systems, e.g. light-field imaging systems for lensless imaging

Definitions

  • the present application relates to an imaging component, in particular to an optoelectronic imaging component that uses a light guide as a light guide channel to restrict light, and also relates to a manufacturing method of the optoelectronic imaging component, a camera module and an electronic device including the imaging component.
  • imaging components used in mobile terminal devices to help users acquire images (such as videos or images) have been rapidly developed and advanced.
  • imaging components have been widely used in many fields such as medical treatment, security, industrial production and so on.
  • lens imaging systems In the lens imaging system, there must be various problems such as aberration and loss of brightness after the light passes through the lens. After the light passes through the lens, there must be some loss of brightness.
  • the manufacturing tolerances of its various components are continuously accumulated during the assembly process, and the assembly process will also produce assembly tolerances. These tolerances limit the further improvement of lens performance.
  • the maximum effective size of the chip (that is, the area where the chip can be illuminated) is limited by the size of the lens aperture. In the optical design, there is very limited space for increasing the aperture size of the lens.
  • the spacer has a plurality of light guide channels formed by through holes, and the object-side light enters the light guide channels and is received and imaged by the photosensitive chip on the image side.
  • the light guide channel is formed by etching or molding such as chemical or photolithography on the substrate.
  • the planar imaging device has no aberration problem, and the brightness loss is smaller. Smaller size, simple structure, fewer assembly tolerance items.
  • the plane camera device is provided with light guide channels at intervals on the screen, the maximum effective size of the chip, that is, the area of the illuminated chip can be increased by increasing the distribution area of the light guide channels on the screen, so the chip area is not affected by the size of the lens aperture Limited, adjustable range.
  • the light guide channels are arranged at intervals from the imaging pixels in the projection direction, and are not on the same horizontal plane.
  • the number of pixels that make up the chip ⁇ pixel size chip area, pixel size is positively related to sensitivity, and the number is positively related to resolution.
  • the overall thickness of the mobile phone is reduced.
  • the rear camera is the largest item of the thickness of the smart terminal. It is possible to reduce the overall thickness of the smart terminal by reducing the rear camera thickness.
  • the imaging using the plane imaging device does not involve a lens, the phenomenon of out-of-focus at close range does not occur, and macro imaging can be realized.
  • the via structure will be deformed due to the inevitable high temperature, which will affect the imaging.
  • the cost of laser equipment used to manufacture nano-sized vias is high.
  • the present application aims to provide a solution that can overcome at least one of the above-mentioned drawbacks of the prior art.
  • an imaging assembly which may include:
  • a light guide attached to the base and transmitting light, to form at least one light guide channel;
  • a light-blocking layer which is arranged on the substrate, surrounds the radial side of the light guide and is opaque;
  • the spacer is provided on the light-blocking layer.
  • At least one photoelectric converter the photoelectric converter is parallel to the light blocking layer, is spaced apart from the light blocking layer by a spacing portion, and can be respectively arranged in a one-to-one correspondence with the light guide channel, so that the light emitted by the object to be imaged passes through the light guide After the channel reaches the corresponding photoelectric converter.
  • the light guide member may form multiple light guide channels, and the multiple light guide channels may form an array of light guide channels in the light blocking layer.
  • the size of the light guide channel can be set above the operating wavelength, and the operating wavelength can be 800 nm.
  • the size of the light guide channel may be set to diffract at a specific wavelength in the light passing through to perform light splitting, so that light in a specific wavelength band reaches a preset photoelectric converter.
  • the light blocking layer may be made of an opaque material.
  • the photoelectric converter can receive all the light from the corresponding light guide channel, and the light of the corresponding light guide channel can illuminate the entire light receiving surface of the corresponding photoelectric converter.
  • the light guide member may be a cylindrical cylindrical member.
  • the cylindrical member may be made of a light-transmissive or opaque material.
  • both ends of the light guide can be flush with the light blocking layer.
  • the light guide and the light blocking layer can be made of the same material.
  • the cylindrical member may be filled with a light-transmitting material to form a refractive layer, thereby adjusting incident light.
  • a filter layer may be provided on the light-transmitting material.
  • the filter layer may be an infrared filter layer.
  • the light guide member may be a light-transmitting columnar member.
  • the spacing portion may be a continuous annular cylindrical portion.
  • a method of manufacturing an imaging assembly is also provided.
  • the method may include the following steps:
  • the light blocking layer is disposed on the substrate, so that the light blocking layer surrounds the radial side of the light guide and is opaque;
  • At least one photoelectric converter is disposed on the spacer, and the photoelectric converter may be disposed parallel to the light blocking layer, spaced apart from the light blocking layer by the partition, and respectively corresponding to the light guide channel one by one, so that the object to be imaged The emitted light reaches the corresponding photoelectric converter after passing through the light guide channel.
  • a camera module including the imaging component as described above.
  • an electronic device including the camera module as described above.
  • the light guide is attached to the substrate to form a light guide channel, so there is no need to make holes in the substrate, avoiding losses due to etching, etc., thereby improving production yield.
  • the imaging component manufacturing process according to the present application is short, the process is simple, and the production efficiency is high.
  • Figure 1 shows a schematic diagram of an embodiment according to the prior art
  • FIG. 2 shows a detailed schematic diagram of a single light guide channel according to FIG. 1;
  • FIG. 3 shows a schematic diagram of an embodiment of an imaging assembly according to the present application
  • FIG. 4 shows a schematic diagram of a single light guide channel and a single photoelectric converter according to FIG. 3;
  • FIG. 5 shows a schematic diagram of a method of forming an imaging assembly according to the present application
  • FIG. 6 shows a perspective view of an embodiment of an imaging assembly according to the present application.
  • FIG. 7a to 7b show schematic diagrams of a single light guide channel in an embodiment of an imaging assembly according to the present application
  • FIG. 7c shows a schematic diagram of a single light guide channel and a single photoelectric converter in an embodiment of an imaging assembly according to the present application
  • FIG. 8 shows a schematic diagram of another embodiment of the imaging assembly according to the present application, wherein the photoelectric converter is not shown;
  • FIG. 9a to 9b show schematic diagrams of a single light guide channel in an embodiment of an imaging assembly according to the present application
  • 9c shows a schematic diagram of a single light guide channel and a single photoelectric converter in an embodiment of an imaging assembly according to the present application.
  • FIG. 10 shows a schematic diagram of a single light guide channel in an embodiment of an imaging assembly according to the present application.
  • first, second, etc. are only used to distinguish one feature from another feature, and do not represent any limitation on the feature. Therefore, without departing from the teachings of the present application, the first body discussed below may also be referred to as the second body.
  • the terms “substantially”, “approximately”, and similar terms are used as an approximation term, not as a degree term, and are intended to illustrate measurement that will be recognized by those of ordinary skill in the art. The inherent deviation in the value or calculated value.
  • Figure 1 shows a schematic diagram of an embodiment according to the prior art.
  • the imaging assembly 1 includes a spacer 2 and a plurality of photoelectric converters 3.
  • the spacer 2 is opaque and multiple light guide channels 21 are formed therein.
  • the photoelectric converter 3 is parallel to and spaced from the spacer 2 and respectively corresponds to the light guide channel 21 one by one, so that the light emitted by the object to be imaged passes through the light guide channel 21 and reaches the photoelectric converter 3.
  • FIG. 2 shows a detailed schematic diagram of a single light guide channel according to FIG. 1.
  • FIG. 2 according to the principle of linear propagation of light, light from an object located on the object side can be received by the photoelectric converter 3 located on the other side of the spacer 2 through the light guide channel 21.
  • the spacer 2 including the light guide channel 21 and the photoelectric converter 3 constitute the imaging assembly 1.
  • the periphery of the light guide channel 21 is a spacer, and the spacer functions to block the light irradiated to the spacer, that is, the light guide channel 21 restricts the passage of light.
  • the spacer may be made of an opaque material, such as ferrous metal.
  • the spacer 2 may be coated with a light blocking layer, which may be a diffuse reflection coating or a light blocking coating.
  • the size of the light guide channel 21 may be a size where no significant diffraction occurs, that is, the size of the light guide channel 21 is 800 nm or more.
  • the size of the light guide channel 21 may be a size that diffracts light passing through the light guide channel 21, that is, only a specific wavelength is diffracted, thereby achieving a color filter function.
  • the size of the light guide channel 21 diffracts specific wavelengths of the incident light to achieve light splitting, thereby distributing light of each wave band on the pre-arranged photoelectric converters, that is, allowing light of the desired wave band to reach the photoelectric The converter, the undesired band of light reaches the non-photosensitive area.
  • the photoelectric converter After the photoelectric converter receives the corresponding band of light, it can process the electrical signal provided by the photoelectric converter through an algorithm to synthesize a color image.
  • the above process realizes a function similar to a Bayer array. Therefore, in the embodiment according to the present application, the Bayer array on the photoelectric converter can be eliminated, thereby further reducing the size.
  • the height of the light guide channel 21 is h, and the width is d.
  • the maximum angle of the range of light passing through the light guide channel 21 on the object side is defined as 2 ⁇ .
  • the light guide channel 21 having a height h and a width d restricts part of the light on the object side.
  • the constraint range is defined as the collection angle of the light guide channel 21 in this application, wherein the light on the object side can only be transmitted to the image side through the light guide channel 21 in the area of the collection angle. Object-side light that is not in this range will be blocked by the spacer.
  • the object-side area is divided into a collection area and a non-collection area. The relationship between the acquisition area and the image-side receiving area is constrained by the light guide channel 21 on the one hand, and controlled by the size of the photoelectric converter 3 on the other hand.
  • a photoelectric converter 3 is provided in the image-side receiving area so as to receive the object-side light.
  • one or more imaging components 1 constitute the photosensitive surface on the image side.
  • the light on the object side is transmitted to the photosensitive surface through the light guide channel 21, and finally received by the photoelectric converter 3.
  • the spacer 2 has a plurality of light guide channels 21 arranged uniformly.
  • the imaging assembly 1 may have a plurality of cross-sections similar to the cross-section. Therefore, the light guide channel 21 may form an array of the light guide channels 21 in the spacer 2, and accordingly, the photoelectric converters 3 are respectively The positions of the light guide channels 21 correspond to each other, and thus an array of photoelectric converters 3 is also formed.
  • FIG. 1 also shows the relationship between the position of the photoelectric converter 3 according to the present application and the collection area on the object side.
  • the photoelectric converter 3 of the present application does not have a lens to restrict the received light, but receives light in all directions through the photoelectric converter 3.
  • the side of the photoelectric converter 3 facing the spacer 2 defines a photosensitive surface, and is located on an imaginary first boundary receiving surface formed on the image side through the collection range of each light guide channel 21.
  • the light received by the photoelectric converter 3 through the light guide channel 21 from the object side has no overlapping area, and the area of the photosensitive surface is the largest.
  • the photoelectric converter receives all light from the corresponding light guide channel, and the light of the corresponding light guide channel illuminates the entire light receiving surface of the corresponding photoelectric converter. Therefore, the photoelectric converter 3 can be arranged at this position, wherein both the black bar and the striped grid in the figure are the photoelectric converter 3.
  • FIG. 3 shows a schematic diagram of an embodiment of the imaging assembly 4 according to the present application.
  • the imaging assembly 4 includes a substrate 5, a light guide 6, a light blocking layer 7, a spacer 8, and at least one photoelectric converter 9.
  • the substrate 5 is flat and transparent.
  • the substrate 5 has high surface flatness and transparency, so that the resulting imaging assembly has an array of light guide channels parallel in the height direction.
  • the substrate 5 can be made of any suitable material, such as glass.
  • the light guide 6 is attached to the substrate 5 and transmits light to form at least one light guide channel 41.
  • the light guide member 6 may have any shape, for example, a hollow cylindrical cylindrical member 10.
  • the bottom surface of one end of the light guide 6 is attached to the substrate 5, for example, adhered to the substrate 5 and then cured.
  • the light guide 6 may be transparent or opaque.
  • the light blocking layer 7 is provided on the substrate 5, surrounds the radial side of the light guide 6 and is opaque.
  • the light-blocking layer 7 is realized by flowing or filling an opaque material or a material with strong light-blocking property in the gap between the light guides 6 and curing.
  • the height of the light blocking layer 7 does not exceed the height of the light guide 6 to prevent it from overflowing into the light guide 6.
  • the spacer 8 is provided on the light blocking layer 7.
  • the spacer 8 is an annular cylindrical portion provided on the edge of the substrate 5 or on the light blocking layer 7.
  • the annular cylindrical portion may be continuous or discontinuous, preferably continuous.
  • the space 8 is higher than the light guide 6 so as to keep the light guide 6 and the photoelectric converter 9 spaced apart at a certain interval.
  • At least one photoelectric converter 9 is parallel to the light-blocking layer 7 and is spaced apart from the light-blocking layer 7 by a spacer 8 and can be respectively arranged one-to-one corresponding to the light guide channel 41 so that the light emitted by the object to be imaged passes through the light guide The channel 41 then reaches the corresponding photoelectric converter 9.
  • the light guide 6 may form a plurality of light guide channels 41, and the plurality of light guide channels 41 may form a light guide channel array in the light blocking layer 7.
  • the size of the light guide channel 41 may be set to be above the operating wavelength, and the operating wavelength may be 800 nm.
  • the size of the light guide channel 41 may be set to diffract at a specific wavelength in the light passing through to perform light splitting, so that light in a specific wavelength band reaches the preset photoelectric converter 9.
  • the photoelectric converter 9 can receive all light from the corresponding light guide channel 41, and the light corresponding to the light guide channel 41 can illuminate the entire light receiving surface of the corresponding photoelectric converter 9.
  • the photoelectric converter 9 can also receive part of the light from the corresponding light guide channel 41, and the light corresponding to the light guide channel 41 can illuminate a part of the light receiving surface of the corresponding photoelectric converter 9.
  • FIG. 4 shows a schematic diagram of a single light guide channel 41 and a single photoelectric converter 9 according to FIG. 3.
  • the unit pixel size of the photoelectric converter 9 is set to a.
  • a minimum safety distance b should be set between the light guide 6 and the photoelectric converter 9 to prevent impacts from generating particles or causing damage.
  • the size of the light guide channel 41 is set according to requirements. In this embodiment, the size is, for example, 800 nm or more to reduce the diffraction of incident light. Understandably, in order to achieve color filtering or other purposes, the size of the light guide channel 41 may be less than or equal to 800 nm.
  • FIG. 5 shows a schematic diagram of the method of forming the imaging assembly 4 according to the present application. As shown in FIG. 5, the method of forming the imaging assembly 4 according to the present application includes the following steps:
  • the substrate 5 has high surface flatness and transparency, so that the resulting imaging assembly 4 has an array of light guide channels parallel in the height direction.
  • the substrate 5 can be made of any suitable material, such as glass.
  • the at least one light guide channel 41 may be formed as an array of light guide channels 41.
  • the light guide member 6 may have any shape, for example, a hollow cylindrical cylindrical member 10. The bottom surface of one end of the light guide 6 is attached to the substrate 5, for example, adhered to the substrate 5 and then cured. In an embodiment, the light guide 6 may be transparent or opaque.
  • the light blocking layer 7 is disposed on the substrate 5 so that the light blocking layer 7 surrounds the radial side of the light guide 6 and is opaque. This step is achieved by flowing or filling an opaque material or a material with strong light blocking property into the gap between the light guides 6 and curing to form the light blocking layer 7. The height of the light blocking layer 7 does not exceed the height of the light guide 6 to prevent it from overflowing into the light guide 6.
  • the spacer 8 is provided on the light blocking layer 7.
  • the spacer 8 is an annular cylindrical portion provided on the edge of the substrate 5 or on the light blocking layer 7.
  • the annular cylindrical portion may be continuous or discontinuous, preferably continuous.
  • the spacing portion 8 is higher than the light guide 6 so as to keep the light guide 6 and the photoelectric converter 9 spaced at a certain interval.
  • S5- At least one photoelectric converter 9 is disposed on the partition 8.
  • the photoelectric converter 9 is disposed parallel to the light blocking layer 7, and is separated from the light blocking layer 7 by the partition 8, and is one by one with the light guide channel 41 Correspondence, so that the light emitted by the object to be imaged passes through the light guide channel 41 and reaches the corresponding photoelectric converter 9.
  • the photoelectric converter 9 may be prepared and then attached to the spacer 8 at a corresponding position, for example, adhered to the spacer 8. It is conceivable that in other embodiments, the electrical converter 9 remains stationary, and then the substrate 5 provided with the light guide 6, the light blocking layer 7, the spacer 8 is attached to the electrical converter 9.
  • FIG. 6 shows a top perspective view of an embodiment of an imaging assembly according to the present application. It can be seen from FIG. 6 that the light guide 6 forms a light guide channel array on the substrate 5. Not shown in the figure is that the photoelectric converter 9 forms a photoelectric converter array corresponding to the light guide channel array on the lower side portion of the imaging assembly.
  • FIG. 7a to 7b show schematic diagrams of a single light guide channel in an embodiment of an imaging assembly according to the present application. For clarity, only the light blocking layer 7 and the light guide 6 are shown. As shown in the figure and as described above, the material of the light guide 6 may be transparent and opaque.
  • the light guide 6 shown in Fig. 7a is made of an opaque material.
  • the path of light from the object side is defined by the light guide 6, in other words, the height h of the light guide channel is equal to the height of the light guide 6.
  • the light guide 6 is made of a transparent material.
  • the path of light from the object side is defined by the light blocking layer 7, in other words, the height h of the light guide channel is equal to the thickness of the light blocking layer.
  • FIG. 7c shows a schematic diagram of a single light guide channel and a single photoelectric converter in an embodiment of an imaging assembly according to the present application.
  • the light guide 6 is made of a transparent material.
  • the minimum safety distance b between the light guide 6 and the photoelectric converter 9 is actually the sum of the minimum safety distance b2 and the distance b1 from which the light guide 6 protrudes from the light blocking layer 7.
  • the spacers of the array can be formed on a larger substrate by the above method, and then bonded to the wafer, and finally a single imaging component is integrally cut.
  • Embodiment 3 of the imaging assembly 4 of the present application with reference to FIG. 8.
  • the spacer 8 and the photoelectric converter 9 are not shown in the drawings.
  • FIG. 8 shows the formation process of Embodiment 2 of the imaging assembly 4 according to the present application.
  • the formation process of the imaging assembly 4 described in this Embodiment 2 is similar to the formation process of the imaging assembly 4 described in Embodiment 1. For the sake of brevity, description of steps similar to those of Embodiment 1 will be omitted.
  • FIG. 8 shows a schematic diagram of another embodiment of the imaging assembly according to the present application, wherein the spacer and the photoelectric converter are not shown.
  • Embodiment 2 differs from Embodiment 1 in that both ends of the light guide 6 are flush with the light blocking layer 7.
  • step S3 in the above embodiment another step is added: removing the portion of the light guide 6 protruding from the light blocking layer 7 to reduce the height of the light guide 6 so that the light guide 6 Both ends are flush with the light blocking layer 7.
  • the thickness of the light-blocking layer 7 can be reduced at the same time, so that the end of the light guide 6 and the surface of the light-blocking layer 7 are smoother, thereby improving the integrity and symmetry of the optical path.
  • Etching, grinding and cutting such as chemical etching, dissolving, mechanical or laser cutting, grinding, etc., can be used to complete this step. After completing this step, the light guide channel is closer to the photoelectric converter 9, thereby reducing the overall thickness of the imaging assembly.
  • the imaging assembly 4 described in Embodiment 3 is similar to that of the imaging assembly 4 described in Embodiment 1. For the sake of brevity, description of components similar to those of Embodiment 1 will be omitted.
  • the light blocking layer 7 and the light guide 6 are made of the same material.
  • the light blocking layer 7 and the light guide 6 have the same coefficient of thermal expansion, so that the deformation due to temperature change can be reduced, thereby improving the optical and structural stability.
  • Embodiment 4 of the imaging assembly 4 of the present application is described below with reference to FIGS. 9a to 9c.
  • the imaging assembly 4 described in this Embodiment 4 is similar to the imaging assembly 4 described in Embodiment 1. For the sake of brevity, description of components similar to Embodiment 1 will be omitted.
  • Embodiment 4 is different from Embodiment 1 in that the light guide 6 is filled with the light-transmitting material 11 and the light-filtering material 13 is provided on the light-transmitting material 11.
  • FIGS. 9 a to 9 b show schematic diagrams of a single light guide channel in another embodiment of the imaging assembly according to the present application. For clarity, only the light blocking layer 7 and the light guide 6 are shown in the drawings.
  • the cylindrical member 10 as the light guide member 6 is filled with a light-transmitting material 11 to form a refractive layer 12 with a certain diopter, which can be used as a lens to adjust incident light.
  • the filter layer 13 is provided on the light-transmitting material 11 by, for example, plating.
  • the filter layer 13 may be an infrared filter layer, thereby simultaneously realizing the function of an infrared filter.
  • FIG. 9c shows a schematic diagram of a single light guide channel and a single photoelectric converter in an embodiment of an imaging assembly according to the present application. For clarity, only the light guide 6 and the photoelectric converter 9 are shown in the drawings.
  • the size of the light guide channel is usually above 800 nm.
  • the light emitted from the light guide channel may be crossed or lost.
  • a transparent material can be filled inside the light guide channel to form a refractive layer with a certain diopter.
  • the incident light passes through the refractive layer, it is deviated from the original direction to the direction of the optical axis, so that the light spot formed by the incident light is adapted to the unit pixel of the photosensitive chip.
  • Embodiment 5 of the imaging assembly 4 of the present application with reference to FIG. 10.
  • the imaging assembly 4 described in this Embodiment 5 is similar to the imaging assembly 4 described in Embodiment 1. For the sake of brevity, description of components similar to Embodiment 1 will be omitted.
  • Embodiment 5 is different from Embodiment 1 in that the light guide member 6 is a light-transmitting cylindrical member instead of the cylindrical member 10.
  • FIG. 10 shows a schematic diagram of a single light guide channel in Embodiment 5 of the imaging assembly according to the present application. As shown in FIG. 10, the light guide channel is no longer formed by the cylindrical member 10 but by the light-transmitting column 14.
  • the light-transmitting column 14 has a high light-transmitting property. In this case, the light-transmitting column 14 directly serves as a light guide channel.
  • the present application provides a camera module including the imaging component as described above.
  • the electronic device is equipped with the depth camera as described above.
  • the electronic device can be any suitable setting, such as a mobile phone, tablet, computer, e-book reader.

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Abstract

本申请提供了一种成像组件，包括：基底，平坦且透光；导光件，附接至基底且透光，以形成至少一个导光通道；阻光层，设置在基底上，围绕导光件的径向侧部且不透光；间隔部，设置在阻光层上；以及至少一个光电转换器，光电转换器与阻光层平行，通过间隔部与阻光层间隔开，且可分别与导光通道一一对应地设置，以使得待成像物体发出的光通过导光通道后到达对应的光电转换器。本申请还提供了制造成像组件的方法、摄像模组和电子设备。

Description

成像组件及其制造方法、摄像模组和电子设备
交叉引用
本申请要求于2018年12月20日向中国专利局提交的、发明名称为“成像组件及其制造方法、摄像模组和电子设备”的第201811563396.5号发明专利申请的优先权，上述专利申请的全部内容通过引用并入本文。
技术领域
本申请涉及成像组件，具体涉及利用导光件作为导光通道进行光线约束的光电成像组件，还涉及该光电成像组件的制造方法以及包括该成像组件的摄像模组和电子设备。
背景技术
随着移动智能终端设备的发展和普及，移动终端设备中用于帮助使用者获取影像(例如视频或者图像)的成像组件的相关技术得到了迅猛的发展和进步。在近年来，成像组件在例如医疗、安防、工业生产等诸多的领域均得到广泛应用。
现在移动终端设备的重要发展趋势之一是移动终端设备的尺寸越来越小。
为了满足越来越广泛的市场需求，小尺寸、大光圈是现有摄像模组不可逆转的发展趋势。
移动终端设备的另一发展趋势是市场对摄像模组的成像质量提出了越来越高的需求。
在尺寸需求越来越高的前提下，现有常规摄像装置的结构无法满足人们对电子产品尺寸的需求。
具体来说，传统摄像装置多采用透镜成像系统。在透镜成像系统中，由于光线在通过透镜后必定存在各种像差、亮度损失等问题。光线通过透镜后，亮度也必然会有一定损失。
另外，由于透镜成像系统的结构较复杂，要再进一步缩小尺寸必然导致成本增高，而且满足不了人们对电子产品轻薄化的需求。
另外，如果透镜成像系统包括多个镜片与镜筒，则其各个组件的制造公差在组装过程中不断累积，而且组装过程还会产生组装公差。这些公差限制了镜头性能的进一步提升。
传统透镜成像光学系统，芯片的最大有效尺寸(即芯片能被照亮的面积)受透镜光圈大小限制。而光学设计上透镜的光圈大小可提升的空间十分有限。
为了解决上述问题，目前已研发出一种平面摄像装置。在该平面摄像装置中，间隔体具有多个由通孔构成的导光通道，物侧光线进入导光通道并由像侧的感光芯片所接收并成像。该导光通道通过在基板上进行诸如化学或光刻蚀的蚀刻打孔或模制形成。该平面摄像装置不存在像差问题，亮度损耗更小。尺寸更小，结构简单组装公差项更少。该平面摄像装置通过在屏幕上间隔设置导光通道，芯片的最大有效尺寸，即可照亮芯片的面积可以通过增加导光通道在屏幕上的分布面积来提升，因而芯片面积不受透镜光圈大小限制，可调范围大。其中，导光通道在投影方向上与成像像素为间隔设置，不在同一水平面上。组成芯片的像素点个数×像素点大小＝芯片面积，像素点大小与感光度正相关，个数与分辨率正相关。
在将该平面摄像装置用做前摄的情况下，小孔与显示屏成像像素交替布置，从而提升智能终端的屏占比。
在将该平面摄像装置用做后摄的情况下，减小手机整体厚度，其中后摄为智能终端厚度最大项，减小后摄厚度才有可能降低智能终端的整体厚度。
由于使用该平面摄像装置成像不涉及透镜，不会出现近距离失焦的现象，可以实现微距成像。
然而，在该平面摄像装置的制造过程中，在间隔体中形成多个由通孔构成的导光通道会带来多个问题。
具体而言，如果采用化学刻蚀工艺来形成通孔，则需要涂覆抗蚀剂、显影、刻蚀等多个步骤，工艺复杂、耗时且成本高昂。
如果采用激光刻蚀来形成通孔，则会因为不可避免的高温而导致通孔结构变形，从而影响成像。另外，制造纳米尺寸级别的通孔所用到的激光设备的成本高。
发明内容
本申请旨在提供一种能够克服现有技术的上述至少一个缺陷的解决方案。
根据本申请的一个方面，提供了一种成像组件，可包括：
基底，平坦且透光；
导光件，附接至基底且透光，以形成至少一个导光通道；
阻光层，设置在基底上，围绕导光件的径向侧部且不透光；
间隔部，设置在阻光层上；以及
至少一个光电转换器，光电转换器与阻光层平行，通过间隔部与阻光层间隔开，且可分别与导光通道一一对应地设置，以使得待成像物体发出的光通过导光通道后到达对应的光电转换器。
其中，导光件可形成多个导光通道，多个导光通道可在阻光层中形成导光通道阵列。
其中，导光通道的尺寸可设置为工作波长以上，工作波长可为800nm。
其中，导光通道的尺寸可设置为通过的光线中的特定波长发生衍射，以进行分光，使得特定波段的光到达预设的光电转换器。
其中，阻光层可由不透光材料制成。
其中，光电转换器可接收来自对应导光通道的所有光，且对应导光通道的光可照射对应光电转换器的整个光接收面。
其中，导光件可为柱形筒状件。
其中，筒状件可由透光或不透光材料制成。
其中，导光件的两个端部可均与阻光层齐平。
其中，导光件和阻光层可由相同材料制成。
其中，筒状件中可填充透光材料以形成折射层，从而调节入射光。
其中，在透光材料上可设置滤光层。
其中，滤光层可为红外滤光层。
其中，导光件可为透光柱状件。
其中，间隔部可为连续的环形筒状部。
根据本申请的一个方面，还提供了一种制造成像组件的方法。该方法可包括以下步骤：
设置平坦且透光的基底；
将透光的导光件附接至基底，以形成至少一个导光通道；
将阻光层设置在基底上，使得阻光层围绕导光件的径向侧部且不透光；
将间隔部设置在阻光层上；以及
将至少一个光电转换器设置在间隔部上，光电转换器可设置为与阻光层平行，通过间隔部与阻光层间隔开，且分别与导光通道一一对应，以使得待成像物体发出的光通过导光通道后到达对应的光电转换器。
根据本申请的一个方面，还提供了一种摄像模组，该摄像模组包括如上所述的成像组件。
根据本申请的一个方面，还提供了一种电子设备，该电子设备包括如上所述的摄像模组。
与现有技术相比，上述技术方案具有下列至少一个技术效果：
1.导光件附接至基底以形成导光通道，因而不必在基底上制作孔洞，避免了因蚀刻等导致的损耗，从而提高了生产良率。
2.不需要现有的化学与激光蚀刻往往需要的诸如抗蚀层或掩膜等的保护材料以及昂贵的生产设备，降低了生产成本。
3.根据本申请的成像组件制作流程短，工艺简单，生产效率高。
附图说明
在参考附图中示出示例性实施例。本文中公开的实施例和附图应被视作说明性的，而非限制性的。
图1示出了根据现有技术的实施例的示意图；
图2示出了根据图1的单个导光通道的详细示意图；
图3示出了根据本申请的成像组件的实施例的示意图；
图4示出了根据图3的单个导光通道和单个光电转换器的示意图；
图5示出了根据本申请的形成成像组件的方法的示意图；
图6示出了根据本申请的成像组件的实施例的立体图；
图7a至图7b示出了根据本申请的成像组件的实施例中单个导光通道的示意图；
图7c示出了根据本申请的成像组件的实施例中单个导光通道和单个光电转换器的示意图；
图8示出了根据本申请的成像组件的另一实施例的示意图，其中未示出光电转换器；
图9a至图9b示出了根据本申请的成像组件的实施例中单个导光通道的示意图；
图9c示出了根据本申请的成像组件的实施例中单个导光通道和单个光电转换器的示意图；以及
图10示出了根据本申请的成像组件的实施例中单个导光通道的示意图。
具体实施方式
为了更好地理解本申请，将参考附图对本申请的各个方面做出更详细的说明。应理解，这些详细说明只是对本申请的示例性实施方式的描述，而非以任何方式限制本申请的范围。在说明书全文中，相同的附图标号指代相同的元件。表述“和/或”包括相关联的所列项目中的一个或多个的任何和全部组合。
应注意，在本说明书中，第一、第二等的表述仅用于将一个特征与另一个特征区分开来，而不表示对特征的任何限制。因此，在不背离本申请的教导的情况下，下文中讨论的第一主体也可被称作第二主体。
在附图中，为了便于说明，已稍微夸大了物体的厚度、尺寸和形状。附图仅为示例而并非严格按比例绘制。
还应理解的是，用语“包括”、“包括有”、“具有”、“包含”和/或“包含有”， 当在本说明书中使用时表示存在所陈述的特征、整体、步骤、操作、元件和/或部件，但不排除存在或附加有一个或多个其它特征、整体、步骤、操作、元件、部件和/或它们的组合。此外，当诸如“...中的至少一个”的表述出现在所列特征的列表之后时，修饰整个所列特征，而不是修饰列表中的单独元件。此外，当描述本申请的实施方式时，使用“可以”表示“本申请的一个或多个实施方式”。并且，用语“示例性的”旨在指代示例或举例说明。
如在本文中使用的，用语“基本上”、“大约”以及类似的用语用作表近似的用语，而不用作表程度的用语，并且旨在说明将由本领域普通技术人员认识到的、测量值或计算值中的固有偏差。
除非另外限定，否则本文中使用的所有用语(包括技术用语和科学用语)均具有与本申请所属领域普通技术人员的通常理解相同的含义。还应理解的是，用语(例如在常用词典中定义的用语)应被解释为具有与它们在相关技术的上下文中的含义一致的含义，并且将不被以理想化或过度正式意义解释，除非本文中明确如此限定。
需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。下面将参考附图并结合实施例来详细说明本申请。
图1示出了根据现有技术的实施例的示意图。如图1所示，成像组件1包括间隔件2和多个光电转换器3。间隔件2不透光且其中形成多个导光通道21。光电转换器3与间隔件2平行且间隔开，且分别与导光通道21一一相对应，以使得待成像物体发出的光通过导光通道21后到达光电转换器3。
图2示出了根据图1的单个导光通道的详细示意图。如图2所示，根据光直线传播原理，来自位于物侧的物体的光线可经过导光通道21由位于间隔件2另一侧的光电转换器3接收。
包括导光通道21的该间隔件2和光电转换器3组成了成像组件1。该导光通道21的四周为间隔体，该间隔体起到阻碍被照射到间隔体的光线，即，该导光通道21约束光线通过。间隔体可由不透光材料制成，例如黑色金属。另外，在其他实施例中，间隔件2上可涂覆有阻光层，该阻光层可为漫反射涂层或阻光涂层。
导光通道21的尺寸可为不发生明显衍射的尺寸，即，导光通道21的尺寸为800nm以上。
在一些实施例中，导光通道21的尺寸可为对导光通道21内通过的光线发生衍射的尺寸，即，仅特定波长发生衍射，从而实现滤色功能。
具体地，导光通道21的尺寸使入射的光线中的特定波长发生衍射，以实现分光，从而将各波段光线分布在预排布的光电转换器上，即，使得需要的波段的光到达光电转换器，而不需要的波段的光则到达非感光区。在光电转换器接收对应波段光线后，可通过算法处理光电转换器提供的电信号而合成彩色图像。上述过程实现了类似拜耳阵列的功能，因而，在根据本申请的实施方式中可取消光电转换器上的拜耳阵列，从而进一步减少尺寸。
如图2所示，该导光通道21的高度为h，宽度为d，在物侧的光线通过导光通道21的范围的最大角度定义为2α。
其中，Tanα＝d÷h，因而，α＝arc tan(d/h)
如图所示，在该导光通道21的采集角被限定为2α的情况下，具有高度h和宽度d导光通道21约束了部分物侧的光线。该约束范围在本申请中被定义为导光通道21采集角，其中，该物侧的光线只有在该采集角的区域内才能通过导光通道21传输至像侧。不在该范围内的物侧光线会被间隔体阻碍。另外，该物侧区域内分为采集区域和不可采集区域。采集区域与该像侧接收区域之间的关系一方面由导光通道21约束，另一方面由光电转换器3的尺寸控制。
在像侧接收区域内设置有光电转换器3，从而接收该物侧光线。在此基础上，由一个或多个成像组件1组成像侧的感光面。物侧的光线通过导光通道21输送至感光面，最终由光电转换器3接收。
在图1示出的示意图中，仅示出了根据本申请的成像组件1的实施例的一个截面。从该截面中可看出的是，间隔件2中具有均匀排列的多个导光通道21。在该实施例中，成像组件1可具有多个与该截面类似的截面，因而，导光通道21可在间隔件2中形成导光通道21的阵列，而相应地，光电转换器3分别与导光通道21的位置向对应，因而也形成光电转换器3阵列。
图1还示出了根据本申请的光电转换器3设置的位置与物侧的采集区域的关系。在该方式中，本申请的光电转换器3没有透镜来约束所接收的光线，而是通过光电转换器3来接收所有方向的光线。
光电转换器3面向间隔件2的侧部限定感光面，位于通过各个导光通道21的采集范围在像侧形成的假想的第一分界接收面。
在图1中，从物侧通过导光通道21而由光电转换器3接收的光线不存在重叠的区域，而且感光面的面积最大。在这种情况下，光电转换器接收来自对应导光通道的所有光，且对应导光通道的光照射对应光电转换器的整个光接收面。因此，光电转换器3可设置在该位置，其中，图中黑条和条纹格条均为光电转换器3。
实施例1
图3示出了根据本申请的成像组件4的实施例的示意图。如图所示，成像组件4包括基底5、导光件6、阻光层7、间隔部8和至少一个光电转换器9。
在图3中所示的成像组件4中，基底5平坦且透光。在实施例中，基底5具有高的表面平整度和透明性，以使得到的成像组件具有沿高度方向平行的导光通道阵列。基底5可由任何适当材料制成，例如玻璃。
导光件6附接至基底5且透光，以形成至少一个导光通道41。导光件6可以是任意形状，例如为空心圆柱筒状件10。导光件6的一端底面附接至基底5上，例如粘接至基底5，然后进行固化。在实施例中，导光件6可以是透明的或不透明的。
阻光层7设置在基底5上，围绕导光件6的径向侧部且不透光。在实施例中，阻光层7通过在导光件6之间的间隙中流入或填充不透光材料或具有强烈阻光性的材料并固化来实现。阻光层7的高度不超过导光件6的高度，以防止其溢出至导光件6内。
间隔部8设置在阻光层7上。在实施例中，间隔部8为设置在基底5的边缘上或设置在阻光层7上的环形筒状部。该环形筒状部可以是连续的或是不连续的，优选为连续的。如图所示，该间隔部8比导光件6高，从而保持导光件6与光电转换器9以一定间距间隔开。
至少一个光电转换器9与阻光层7平行，通过间隔部8与阻光层7间隔开，且可分别与导光通道41一一对应地设置，以使得待成像物体发出的光通过导光通道41后到达对应的光电转换器9。
导光件6可形成多个导光通道41，多个导光通道41可在阻光层7中形成导光通道阵列。导光通道41的尺寸可设置为工作波长以上，工作波长可为800nm。导光通道41的尺寸可设置为通过的光线中的特定波长发生衍射，以进行分光，使得特定波段的光到达预设的光电转换器9。
举例但不限定光电转换器9可接收来自对应导光通道41的所有光，且对应导光通道41的光可照射对应光电转换器9的整个光接收面。所述光电转换器9还可接收来自对应导光通道41的部分光，对应导光通道41的光可照射对应光电转换器9的部分光接收面。
图4示出了根据图3的单个导光通道41和单个光电转换器9的示意图。
如图4所示，不同的光电转换器9具有不同的感光尺寸及光电转换器尺寸，为了实现上述最佳实施方式，将光电转换器9的单位像素尺寸设置为a。同时，导光件6与光电转换器9应设置最小安全距离b，以防止撞击而产生颗粒或导致损坏。导光通道41的尺寸依需求设定，本实施例中例如为800nm以上，以减小入射光的衍射。可理解的是，为了实现滤色或其他目的，导光通道41的尺寸可以小于等于800nm。
结合前述采集角2α、导光通道尺寸d和间隔体高度h的限定(如图4所述)，其中：
tanα＝d/h；
tanα＝(a/2)/((h/2)+b)
d＞800nm
由上述可得：h＞1600b/(a-800)
图5示出了根据本申请的形成成像组件4的方法的示意图。如图5所示，根据本申请的形成成像组件4的方法包括以下步骤：
S1-设置平坦且透光的基底5；在实施例中，基底5具有高的表面平 整度和透明性，以使得到的成像组件4具有沿高度方向平行的导光通道阵列。
基底5可由任何适当材料制成，例如玻璃。
S2-将透光的导光件6附接至基底5，以形成至少一个导光通道41。该至少一个导光通道41可形成为导光通道41阵列。导光件6可以是任意形状，例如为空心圆柱筒状件10。导光件6的一端底面附接至基底5上，例如粘接至基底5，然后进行固化。在实施例中，导光件6可以是透明的或不透明的。
S3-将阻光层7设置在基底5上，使得阻光层7围绕导光件6的径向侧部且不透光。该步骤通过在导光件6之间的间隙中流入或填充不透光材料或具有强烈阻光性的材料并固化而形成阻光层7来实现。阻光层7的高度不超过导光件6的高度，以防止其溢出至导光件6内。
S4-将间隔部8设置在阻光层7上。在实施例中，间隔部8为设置在基底5的边缘上或设置在阻光层7上的环形筒状部。该环形筒状部可以是连续的或是不连续的，优选为连续的。如图所示，该间隔部8比导光件6高，从而保持导光件6与光电转换器9以一定间距间隔开。
S5-将至少一个光电转换器9设置在间隔部8上，光电转换器9设置为与阻光层7平行，通过间隔部8与阻光层7间隔开，且分别与导光通道41一一对应，以使得待成像物体发出的光通过导光通道41后到达对应的光电转换器9。在实施例中，可准备好光电转换器9，然后在对应位置处附接至间隔部8，例如粘接至间隔部8。可设想到的是，在其他实施例中，电转换器9保持静止，然后将设置有导光件6、阻光层7、间隔部8的基底5附接至电转换器9。
图6示出了根据本申请的成像组件的实施例的俯视立体图。从图6中可以看出的是，导光件6在基底5上形成导光通道阵列。在图中未示出的是，光电转换器9在成像组件的下侧部形成与导光通道阵列相对应的光电转换器阵列。
图7a至图7b示出了根据本申请的成像组件的实施例中单个导光通道 的示意图。为了清晰起见，仅示出了阻光层7和导光件6。如图所示且如上文所述，导光件6的材料可为透明的和不透明的。
图7a中所示出的导光件6由不透明材料制成。在这种情况下，来自物侧的光线的路径由导光件6限定，换言之，导光通道的高度h等于导光件6高度。
如图7b所示，导光件6由透明材料制成。在这种情况下，来自物侧的光线的路径由阻光层7来限定，换言之，导光通道的高度h等于阻光层的厚度。
图7c示出了根据本申请的成像组件的实施例中单个导光通道和单个光电转换器的示意图。为了清晰起见，仅示出了阻光层7、导光件6和光电转换器9。其中，导光件6由透明材料制成。在这种情况下，导光件6与光电转换器9之间的最小安全距离b实际上为最小安全距离b2与导光件6伸出阻光层7的距离b1之和。
以上描述了制造单个成像组件的流程。可以理解的是，为了提高生产效率，可在一较大的基底上通过上述方法形成阵列的间隔体，再与晶圆接合，最后整体切割得到单个的成像组件。
实施例2
以下参照图8来描述本申请的成像组件4的实施例3。为清晰起见，附图中未示出间隔部8和光电转换器9。
为了更清楚地描述根据本申请的成像组件4，图8中示出了根据本申请的成像组件4的实施例2的形成过程。
在本实施例2中描述的成像组件4的形成过程与实施例1中描述的成像组件4的形成过程类似。为了简洁起见，将省略与实施例1相似的步骤的描述。
图8示出了根据本申请的成像组件的另一实施例的示意图，其中未示出间隔部和光电转换器。
实施例2与实施例1的不同之处在于：导光件6的两个端部均与阻光层7齐平。
具体而言，在上述实施例中的步骤S3之后，增加另一步骤：去除导光 件6从阻光层7凸出的部分，以降低导光件6的高度，从而使导光件6的两个端部均与阻光层7齐平。
另外，在该步骤中，可同时减低阻光层7的厚度，使得导光件6的端部和阻光层7的表面更平整，从而提高光路的完整度与对称度。
可采用蚀刻、研磨及切割，例如化学蚀刻、溶解，机械或激光切割、研磨等方式来完成该步骤。在完成该步骤后，导光通道更接近光电转换器9，从而降低了成像组件的整体厚度。
实施例3
在实施例3中描述的成像组件4的与实施例1中描述的成像组件4的类似。为了简洁起见，将省略与实施例1相似的部件的描述。
在本实施例中，阻光层7与导光件6由相同材料制成。在这种情况下，阻光层7与导光件6具有相同的热膨胀系数，因而可减小因温度变化带来的形变，从而提高光学及结构稳定性。
实施例4
以下参照图9a至图9c来描述本申请的成像组件4的实施例4。
在本实施例4中描述的成像组件4与实施例1中描述的成像组件4类似。为了简洁起见，将省略与实施例1相似的组件的描述。
实施例4与实施例1的不同之处在于：导光件6中填充有透光材料11，以及透光材料11上设置滤光层13。
具体来说，图9a至图9b示出了根据本申请的成像组件的另一实施例中单个导光通道的示意图。为清晰起见，附图中仅示出了阻光层7和导光件6。
如图9a所示，作为导光件6的筒状件10中填充有透光材料11，以形成具有一定屈光度的折射层12，从而可作为透镜以调节入射光。
如图9b所示，在筒状件10中填充透光材料11后，在透光材料11上通过例如镀膜的方式来设置滤光层13。滤光层13可为红外滤光层，从而同时实现红外滤光片的功能。
图9c示出了根据本申请的成像组件的实施例中单个导光通道和单个 光电转换器的示意图。为清晰起见，附图中仅示出了导光件6和光电转换器9。
如图所示，为了降低衍射的发生，导光通道的尺寸通常为800nm以上，当使用具有较小单位像素面积的感光芯片时，导光通道的出射光可能存在交叉、损失的情况。此时可在导光通道内部填充透明材料以形成具有一定屈光度的折射层。在这种情况下，入射光线经折射层后，较原方向偏向光轴方向，以使入射光线形成的光斑适配于感光芯片单位像素。
实施例5
以下参照图10来描述本申请的成像组件4的实施例5。
在本实施例5中描述的成像组件4与实施例1中描述的成像组件4类似。为了简洁起见，将省略与实施例1相似的组件的描述。
实施例5与实施例1的不同之处在于：导光件6为透光柱状件，而不是筒状件10。
具体地，图10示出了根据本申请的成像组件的实施例5中单个导光通道的示意图。如图10所示，导光通道不再由筒状件10形成，而是由透光柱状件14形成。
为了清晰起见，附图中仅示出阻光层7和透光柱状件14。
该透光柱状件14具有很高的透光性。在这种情况下，该透光柱状件14直接作为导光通道。
本申请提供了一种摄像模组，该摄像模组包括如上所述的成像组件。
本申请还提出了一种电子设备。该电子设备装配有如上所述的深度相机。该电子设备可为任何适当的设置，例如手机、平板、电脑、电子书阅读器。
以上描述仅为本申请的较佳实施方式以及对所运用技术原理的说明。本领域技术人员应当理解，本申请中所涉及的申请范围，并不限于上述技术特征的特定组合而成的技术方案，同时也应涵盖在不脱离所述申请构思的情况下，由上述技术特征或其等同特征进行任意组合而形成的其 它技术方案。例如上述特征与本申请中公开的(但不限于)具有类似功能的技术特征进行互相替换而形成的技术方案。

Claims (32)

  1. 一种成像组件，其特征在于，包括：
    基底，平坦且透光；
    导光件，附接至所述基底且透光，以形成至少一个导光通道；
    阻光层，设置在所述基底上，围绕所述导光件的径向侧部且不透光；
    间隔部，设置在所述阻光层上；以及
    至少一个光电转换器，所述光电转换器与所述阻光层平行，通过所述间隔部与所述阻光层间隔开，且分别与所述导光通道一一对应地设置，以使得待成像物体发出的光通过所述导光通道后到达对应的光电转换器。
  2. 如权利要求1所述的成像组件，其特征在于，所述导光件形成多个导光通道，多个所述导光通道在所述阻光层中形成导光通道阵列。
  3. 如权利要求1所述的成像组件，其特征在于，所述导光通道的尺寸设置为工作波长以上。
  4. 如权利要求1所述的成像组件，其特征在于，所述导光通道的尺寸设置为通过的光线中的特定波长发生衍射，以进行分光，使得特定波段的光到达预设的光电转换器。
  5. 如权利要求1所述的成像组件，其特征在于，所述阻光层由不透光材料制成。
  6. 如权利要求1所述的成像组件，其特征在于，所述光电转换器接收来自对应导光通道的所有光，且所述对应导光通道的光照射对应光电转换器的整个光接收面。
  7. 如权利要求1所述的成像组件，其特征在于，所述导光件为柱形筒状件。
  8. 如权利要求7所述的成像组件，其特征在于，所述筒状件由透光或不透光材料制成。
  9. 如权利要求1所述的成像组件，其特征在于，所述导光件的两个端部均与所述阻光层齐平。
  10. 如权利要求1所述的成像组件，其特征在于，所述导光件和所述阻光层由相同材料制成。
  11. 如权利要求7所述的成像组件，其特征在于，所述筒状件中填充透光材料以形成折射层，从而调节入射光。
  12. 如权利要求11所述的成像组件，其特征在于，在所述透光材料上设置滤光层。
  13. 如权利要求12所述的成像组件，其特征在于，所述滤光层为红外滤光层。
  14. 如权利要求1所述的成像组件，其特征在于，所述导光件为透光柱状件。
  15. 如权利要求1所述的成像组件，其特征在于，所述间隔部为连续的环形筒状部。
  16. 一种制造成像组件的方法，其特征在于，包括以下步骤：
    设置平坦且透光的基底；
    将透光的导光件附接至所述基底上，以形成至少一个导光通道；
    将阻光层设置在所述基底上，使得所述阻光层围绕所述导光件的径向侧部且不透光；
    将间隔部设置在所述阻光层上；以及
    将至少一个光电转换器设置在所述间隔部上，所述光电转换器设置为与所述阻光层平行，通过所述间隔部与所述阻光层间隔开，且分别与所述导光通道一一对应，以使得待成像物体发出的光通过所述导光通道后到达对应的光电转换器。
  17. 如权利要求16所述的方法，其特征在于，形成至少一个导光通道的步骤包括：
    布置多个所述导光通道以在所述阻光层中形成导光通道阵列。
  18. 如权利要求16所述的方法，其特征在于，所述导光通道的尺寸设置为工作波长以上。
  19. 如权利要求16所述的方法，其特征在于，所述导光通道的尺寸设置为通过的光线中的特定波长发生衍射，以进行分光，使得特定波段的光到达预设的光电转换器。
  20. 如权利要求16所述的方法，其特征在于，所述阻光层由不透光材料制成。
  21. 如权利要求16所述的方法，其特征在于，所述光电转换器接收来自对应导光通道的所有光，且所述对应导光通道的光照射对应光电转换器的整个光接收面。
  22. 如权利要求16所述的方法，其特征在于，所述导光件为柱形筒状件。
  23. 如权利要求22所述的方法，其特征在于，所述筒状件由透光或不透光材料制成。
  24. 如权利要求16所述的方法，其特征在于，所述导光件的两个端部均与所述阻光层齐平。
  25. 如权利要求16所述的方法，其特征在于，所述导光件和所述阻光层由相同材料制成。
  26. 如权利要求22所述的方法，其特征在于，所述筒状件中填充透光材料以形成折射层，从而调节入射光。
  27. 如权利要求26所述的方法，其特征在于，在所述透光材料上设置滤光层。
  28. 如权利要求27所述的方法，其特征在于，所述滤光层为红外滤光层。
  29. 如权利要求16所述的方法，其特征在于，所述导光件为透光柱状件。
  30. 如权利要求16所述的方法，其特征在于，所述间隔部为连续的环形筒状部。
  31. 一种摄像模组，其特征在于，包括如权利要求1-15中任一项所述的成像组件。
  32. 一种电子设备，其特征在于，包括如权利要求31中的任一项所述的摄像模组。
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