WO2020124926A1 - 柔性oled面板 - Google Patents

柔性oled面板 Download PDF

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Publication number
WO2020124926A1
WO2020124926A1 PCT/CN2019/084878 CN2019084878W WO2020124926A1 WO 2020124926 A1 WO2020124926 A1 WO 2020124926A1 CN 2019084878 W CN2019084878 W CN 2019084878W WO 2020124926 A1 WO2020124926 A1 WO 2020124926A1
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WO
WIPO (PCT)
Prior art keywords
layer
area
light
emitting
groove
Prior art date
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Ceased
Application number
PCT/CN2019/084878
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English (en)
French (fr)
Inventor
吕林鸿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US16/484,274 priority Critical patent/US11322697B2/en
Publication of WO2020124926A1 publication Critical patent/WO2020124926A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the invention relates to the field of display technology, in particular to a flexible OLED panel.
  • OLED organic light-emitting
  • the light-emitting area 11 is made into an island form, which means that the light-emitting area 11 is connected by the wiring area 12, and the remaining areas are hollowed out to form a disconnection area 13.
  • the hollowed-out design around the light-emitting area 11 reduces the resistance to moisture and external forces, and fails to pass the strict reliability test (Reliability Analysis, RA), that is, the quality of the OLED panel will be reduced, such as using Short life or weak structural strength.
  • RA Reliability Analysis
  • this design requires additional process steps and masks, which also increase the cost and difficulty of the process.
  • the object of the present invention is to provide a flexible OLED panel that has better resistance to moisture and external forces while increasing bending and extension capabilities. This means that the OLED panel can be expanded and bent under the premise of ensuring the quality of the OLED panel, and the effect of flexible display can be achieved.
  • the present invention provides a flexible OLED panel, which includes:
  • a flexible substrate has a first surface and a second surface, the second surface is opposite to the first surface, the flexible substrate includes a light emitting area, a thinning area and a routing area, wherein the The light-emitting area is adjacent to the wiring area, the thinning area is provided between the light-emitting area and the wiring area, and the thinning area includes:
  • a first extensible material disposed in the groove of the base
  • a plurality of metal wires formed on the first surface
  • An encapsulation layer disposed above the light-emitting layer, and the encapsulation layer includes an encapsulation layer groove located in the thinned area, and the encapsulation layer groove is opposite to the base groove;
  • a second extensible material is disposed in the groove of the packaging layer.
  • the plurality of metal wires are located in the light-emitting area and the wiring area of the flexible substrate.
  • the flexible OLED panel further includes:
  • a flat layer disposed on the plurality of metal wires and the flexible substrate
  • a pixel definition layer disposed on the first electrode and the flat layer
  • a second conductive layer is disposed on the pixel definition layer.
  • the second conductive layer includes a second electrode on the light-emitting layer and a second conductive trace on the trace area.
  • the first conductive layer and the second conductive layer are made of transparent conductive material.
  • the first extensible material and the second extensible material include resin.
  • the flat layer has a conductive via in the light-emitting area to electrically connect the metal wire located in the light-emitting area.
  • the invention also provides a flexible OLED panel.
  • the flexible OLED panel includes:
  • a flexible substrate including a light emitting area, a thinning area and a wiring area, wherein the light emitting area is adjacent to the wiring area, the thinning area is provided between the light emitting area and the wiring area , And the thinned area includes:
  • a first extensible material disposed in the groove of the base
  • a plurality of metal wires are provided on the light-emitting area and the wiring area of the flexible substrate;
  • An encapsulation layer is provided above the light-emitting layer, and the encapsulation layer includes an encapsulation layer groove located in the thinned area, and the encapsulation layer groove is opposite to the base groove.
  • the groove of the packaging layer is provided with a second extensible material.
  • the first extensible material and the second extensible material include resin.
  • the invention also provides a flexible OLED panel.
  • the flexible OLED panel includes:
  • a flexible substrate including a light emitting area, a thinning area and a wiring area, wherein the light emitting area is adjacent to the wiring area, the thinning area is provided between the light emitting area and the wiring area , And the thinned area includes:
  • a first extensible material disposed in the groove of the base
  • a plurality of metal wires are provided on the flexible substrate, and the plurality of metal wires are located in the light-emitting area and the wiring area;
  • a flat layer disposed on the plurality of metal wires and the flexible substrate
  • a pixel definition layer disposed on the first electrode and the flat layer
  • An encapsulation layer is provided on the second conductive layer.
  • the first malleable material includes resin
  • the packaging layer includes a packaging layer groove located in the thinned area, and the packaging layer groove is opposite to the substrate groove.
  • the groove of the packaging layer is provided with a second extensible material.
  • the first extensible material and the second extensible material include resin.
  • the recess of the packaging layer exposes a portion of the first extensible material.
  • the flat layer and the pixel definition layer are only located in the light emitting area and the wiring area.
  • the beneficial effects of the present invention are: through the encapsulation layer around the light-emitting area, the flexible substrate and even the film layer on the flexible substrate, such as a flat layer or a pixel definition layer, thinning treatment, and filled with good ductility and bendability Materials, such as resins; thus, on the premise of ensuring the quality of the OLED panel, the extension and bending performance of the OLED panel can be increased, and the effect of flexible display can be achieved.
  • FIG. 1 is a top view of the existing OLED panel structure.
  • FIG. 2 is an upper view of a partial structure of an embodiment of a flexible OLED panel of the present invention.
  • Fig. 3 is a cross-sectional view of the line A-A in the embodiment of Fig. 2.
  • FIG. 4 is a cross-sectional view of another embodiment of a flexible OLED panel of the present invention.
  • FIG. 2 is an upper view of a partial structure of an embodiment of a flexible OLED panel of the present invention
  • FIG. 3 is a cross-sectional view of line A-A in the embodiment of FIG.
  • the flexible OLED panel provided in this embodiment includes: a flexible substrate 20, a plurality of metal wires 30 and 31, a flat layer 40, a first conductive layer, a pixel definition layer 60, a light emitting layer 70, a second The conductive layer and a packaging layer 90.
  • the flexible substrate 20 includes a light-emitting area 21, a thinned area 23, and a wiring area 22, wherein the light-emitting area 21 is adjacent to the wiring area 22, and the thinned area 23 is disposed on the light-emitting area 21 And the trace area 22, and the thinned area 23 includes: a base groove 201 and a first extensible material 201 disposed in the base groove 201.
  • the flexible substrate 20 has a first surface 210 and a second surface 220.
  • the second surface 220 is opposite to the first surface 210.
  • the base groove 201 is formed on the second surface 220.
  • the first malleable material 201 may include resin.
  • Filling the base groove 201 with the first extensible material 201 can appropriately increase the structural strength of the thinned region 23 to avoid insufficient structural strength due to the thinning process.
  • filling in the first extensible material 201 can prevent moisture from penetrating into the inside of the flexible OLED panel from the thinned area 23.
  • the plurality of metal wires 30 and 31 are formed on the first surface 210.
  • the plurality of metal wires 30 are disposed on the light emitting area 21 and the wiring area 22 of the flexible substrate 20.
  • the plurality of metal wires 30 and 21 may be a metal film formed on the light-emitting area 21 and the wiring area 22 through a patterning process.
  • the metal wires 30 located in the light-emitting area 21 can be connected to the first conductive layer, and the metal wires 31 located in the trace area 22 can be used to connect adjacent components or transmit signals.
  • the flat layer 40 is disposed on the plurality of metal wires 30 and the flexible substrate 20.
  • the flat layer 40 has a conductive via 401 in the light emitting area 21 to electrically connect the metal wire 30 located in the light emitting area 21.
  • the first conductive layer is disposed on the flat layer 40.
  • the first conductive layer includes a first electrode 50 located in the light-emitting area 21.
  • the first electrode 50 is electrically connected to the conductive via 401.
  • the first conductive layer forms the first electrode 50 through a patterning process.
  • the material of the first conductive layer may be indium tin oxide (ITO) or other transparent conductive materials with similar characteristics.
  • the pixel definition layer 60 is disposed on the first electrode 50 and the flat layer 40.
  • the pixel definition layer 60 may include a via for accommodating the light-emitting layer 70.
  • the via hole is located on the first electrode 50.
  • the light emitting layer 70 is disposed above one of the plurality of metal wires 30, and the light emitting layer 70 is located in the light emitting area 21.
  • the light emitting layer 70 is disposed in the via of the pixel definition layer 60 and is located on the first electrode 50.
  • the light-emitting layer 70 may be an organic material.
  • the second conductive layer is disposed on the pixel definition layer 60.
  • the second conductive layer includes a second electrode 80 on the light-emitting layer 70 and a second conductive walk on the trace area 22 Line 81.
  • the second conductive layer forms the second electrode 80 and the second conductive trace 81 through a patterning process.
  • the material of the second conductive layer may be indium tin oxide (ITO) or other transparent conductive materials with similar characteristics.
  • the encapsulation layer 90 is disposed above the light-emitting layer 70 and the pixel definition layer 60, and the encapsulation layer 90 includes an encapsulation layer groove 901 in the thinned area 23, and the encapsulation layer groove 901 Opposite to the base groove 201.
  • the packaging layer groove 901 is provided with a second malleable material 902.
  • the second extensible material 902 may include a resin, wherein the second extensible material 902 and the first extensible material 201 may be the same material.
  • the filling of the second extensible material 902 into the encapsulation layer groove 901 can increase the structural strength of the thinned region 23.
  • the second extensible material 902 can also prevent moisture from penetrating into the inside of the flexible OLED panel from the thinned area 23.
  • FIG. 4 is a cross-sectional view of another embodiment of a flexible OLED panel of the present invention.
  • This embodiment provides a flexible OLED panel including: a flexible substrate 20, a plurality of metal wires 30 and 31, a flat layer 40, a first conductive layer, a pixel definition layer 60, a light emitting Layer 70, a second conductive layer and an encapsulation layer 90.
  • the flexible substrate 20 includes a light-emitting area 21, a thinned area 23, and a wiring area 22, wherein the light-emitting area 21 is adjacent to the wiring area 22, and the thinned area 23 is disposed on the light-emitting area 21 And the trace area 22, and the thinned area 23 includes: a base groove 201 and a first extensible material 201 disposed in the base groove 201.
  • the flexible substrate 20 has a first surface 210 and a second surface 220. The second surface 220 is opposite to the first surface 210.
  • a substrate groove 201 is formed on the second surface 220 of the flexible substrate 20.
  • the first malleable material 201 may include resin.
  • Filling the base groove 201 with the first extensible material 201 can appropriately increase the structural strength of the thinned region 23 to avoid insufficient structural strength due to the thinning process.
  • filling in the first extensible material 201 can prevent moisture from penetrating into the inside of the flexible OLED panel from the thinned area 23.
  • the plurality of metal wires 30 and 31 are formed on the first surface 210.
  • the plurality of metal wires 30 are disposed on the light emitting area 21 and the wiring area 22 of the flexible substrate 20.
  • the plurality of metal wires 30 and 21 may be a metal film formed on the light-emitting area 21 and the wiring area 22 through a patterning process.
  • the metal wires 30 located in the light-emitting area 21 can be connected to the first conductive layer, and the metal wires 31 located in the trace area 22 can be used to connect adjacent components or transmit signals.
  • the flat layer 40 is disposed on the plurality of metal wires 30 and the flexible substrate 20.
  • the flat layer 40 has a conductive via 401 in the light emitting area 21 to electrically connect the metal wire 30 located in the light emitting area 21.
  • the flat layer 40 is formed in the light-emitting area 21 and the trace area 22 through a patterning process.
  • the first conductive layer is disposed on the flat layer 40.
  • the first conductive layer includes a first electrode 50 located in the light-emitting area 21.
  • the first electrode 50 is electrically connected to the conductive via 401.
  • the first conductive layer forms the first electrode 50 through a patterning process.
  • the material of the first conductive layer may be indium tin oxide (ITO) or other transparent conductive materials with similar characteristics.
  • the pixel definition layer 60 is disposed on the first electrode 50 and the flat layer 40.
  • the pixel definition layer 60 may include a via for accommodating the light-emitting layer 70.
  • the via hole is located on the first electrode 50.
  • the pixel definition layer 60 is formed on the light emitting area 21 and the trace area 22 through a patterning process.
  • the light emitting layer 70 is disposed above one of the plurality of metal wires 30, and the light emitting layer 70 is located in the light emitting area 21.
  • the light emitting layer 70 is disposed in the via of the pixel definition layer 60 and is located on the first electrode 50.
  • the light-emitting layer 70 may be an organic material.
  • the second conductive layer is disposed on the pixel definition layer 60.
  • the second conductive layer includes a second electrode 80 on the light-emitting layer 70 and a second conductive walk on the trace area 22 Line 81.
  • the second conductive layer forms the second electrode 80 and the second conductive trace 81 through a patterning process.
  • the material of the second conductive layer may be indium tin oxide (ITO) or other transparent conductive materials with similar characteristics.
  • the encapsulation layer 90 is disposed above the light-emitting layer 70 and the pixel definition layer 60, and the encapsulation layer 90 includes an encapsulation layer groove 901 in the thinned area 23, and the encapsulation layer groove 901 Opposite to the base groove 201.
  • the packaging layer groove 901 exposes a portion of the first malleable material 202.
  • the substrate groove 201 is formed on the second surface 220 of the flexible substrate 20.
  • the encapsulation layer groove 901 is opposite to the base groove 201, and the encapsulation layer groove 901 exposes a portion of the first malleable material 202.
  • the flat layer 40 and the pixel definition layer 60 are only located in the light emitting area 21 and the trace area 22, meaning that there is no flat layer 40 and the pixel definition on the thinned area 23 Layer 60. With this, the performance of OLED panel extension and bending can be further increased.
  • the packaging layer groove 901 may further be provided with a second extensible material 902.
  • the second extensible material 902 may include a resin, wherein the second extensible material 902 and the first extensible material 201 may be the same material. Filling the second extensible material 902 into the encapsulation layer groove 901 can further enhance the structural strength of the thinned area 23. In addition, the second extensible material 902 can further prevent the penetration of moisture from the thinned area 23 into the inside of the flexible OLED panel.
  • the above patterning process can use thin film deposition technology, photolithography technology, etching technology or other similar technologies that can define the shape, position and size of the pattern.
  • the above-mentioned thin film deposition process may use physical vapor deposition technology, chemical vapor deposition technology, vapor deposition technology, sputtering technology or other feasible technologies.
  • the above photolithography technology can also define the pattern position and appearance through other similar technologies.
  • the above etching process may use wet etching technology or dry etching technology.
  • the beneficial effects of the present invention are: by thinning the encapsulation layer, flexible substrate and even the film layer on the flexible substrate around the light-emitting area, such as a flat layer or a pixel definition layer, and filling in good ductility and bendability Materials, such as resins; thus, on the premise of ensuring the quality of the OLED panel, the extension and bending performance of the OLED panel can be increased, and the effect of flexible display can be achieved.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种柔性OLED面板，所述柔性OLED面板包括：一柔性基底(20)，包括一发光区(21)、一薄化区(23)及一走线区(22)，其中所述发光区(21)邻接所述走线区(22)，所述薄化区(23)设于所述发光区(21)及所述走线区(22)之间，并且所述薄化区(23)包括：一基底凹槽(201)；及一第一可延展材料(202)，设置于所述基底凹槽(201)中；多个金属导线(30、31)，设置于所述柔性基底(20)的所述发光区(21)及所述走线区(22)上；一发光层(70)，设置于所述多个金属导线(30、31)其中之一的上方，且所述发光层(70)位于所述发光区(21)；及一封装层(90)，设于所述发光层(70)上方，且所述封装层(90)包括一封装层凹槽(901)，位于所述薄化区(23)，并且所述封装层凹槽(901)与所述基底凹槽(201)相对。

Description

柔性OLED面板 技术领域
本发明涉及显示技术领域，特别是涉及一种柔性OLED面板。
 背景技术
在显示技术领域中，有机发光(OLED)面板由于具有宽广的色域、高的对比度、节能等优点之外，可折叠/可延展的柔性OLED面板一直是人们的关注的发展方向。
 技术问题
在目前的一种柔性OLED面板技术中，请参阅图1，是将发光区11做成孤岛的形式，意即发光区11靠走线区12相连，其余地方挖空形成断开区13，来增加OLED面板的弯折及延展能力。然而，发光区11周围挖空的设计，降低了抵抗水气进入及抗外力的能力，无法通过较严苛的可靠度测试(Reliability Analysis, RA)，也就是OLED面板的质量会下降，例如使用寿命较短或结构强度较弱。此外，这种设计需要额外的制程步骤及掩膜，也增加制程成本及难度。
故，有必要提供一种柔性OLED面板，以解决现有技术所存在的问题。
 技术解决方案
本发明的目的在于提供一种柔性OLED面板，在增加弯折及延展能力时，同时具有较佳的抵抗水气及外力的能力。意即可以在保证OLED面板的质量的前提下，增加OLED面板延展与弯折的性能，并达到柔性显示的效果。
为达成本发明的前述目的，本发明提供一种柔性OLED面板，其包含：
一柔性基底，具有一第一表面及一第二表面，所述第二表面相对于所述第一表面，所述柔性基底包括一发光区、一薄化区及一走线区，其中所述发光区邻接所述走线区，所述薄化区设于所述发光区及所述走线区之间，并且所述薄化区包括：
一基底凹槽，所述基底凹槽形成在所述第二表面；及
一第一可延展材料，设置于所述基底凹槽中；
多个金属导线，形成在所述第一表面上；
一发光层，设置于所述多个金属导线其中之一的上方，且所述发光层位于所述发光区；
一封装层，设于所述发光层上方，且所述封装层包括一封装层凹槽，位于所述薄化区，并且所述封装层凹槽与所述基底凹槽相对；以及
一第二可延展材料，设置于所述封装层凹槽。
根据本发明一实施例，所述多个金属导线位于所述柔性基底的所述发光区及所述走线区。
根据本发明一实施例，所述柔性OLED面板，更包含：
一平坦层，设置于所述多个金属导线及所述柔性基底上；
一第一导电层，设置于所述平坦层上，所述第一导电层包括位于所述发光区的一第一电极；
一像素定义层，设置于所述第一电极及所述平坦层上；及
一第二导电层，设置于所述像素定义层上，所述第二导电层包括位于所述发光层上的一第二电极及位于所述走线区的一第二导电走线。
根据本发明一实施例，所述第一导电层及所述第二导电层是由透明导电材料所制成。
根据本发明一实施例，所述第一可延展材料及所述第二可延展材料包含树脂。
根据本发明一实施例，所述平坦层在所述发光区具有一导电通孔电性连接位于所述发光区的所述金属导线。
本发明还提供一种柔性OLED面板，所述柔性OLED面板包括：
一柔性基底，包括一发光区、一薄化区及一走线区，其中所述发光区邻接所述走线区，所述薄化区设于所述发光区及所述走线区之间，并且所述薄化区包括：
一基底凹槽；及
一第一可延展材料，设置于所述基底凹槽中；
多个金属导线，设置于所述柔性基底的所述发光区及所述走线区上；
一发光层，设置于所述多个金属导线其中之一的上方，且所述发光层位于所述发光区；及
一封装层，设于所述发光层上方，且所述封装层包括一封装层凹槽，位于所述薄化区，并且所述封装层凹槽与所述基底凹槽相对。
根据本发明一实施例，所述封装层凹槽设置有一第二可延展材料。
根据本发明一实施例，所述第一可延展材料及所述第二可延展材料包含树脂。
本发明还提供一种柔性OLED面板，所述柔性OLED面板包括：
一柔性基底，包括一发光区、一薄化区及一走线区，其中所述发光区邻接所述走线区，所述薄化区设于所述发光区及所述走线区之间，并且所述薄化区包括：
一基底凹槽；及
一第一可延展材料，设置于所述基底凹槽中；
多个金属导线，设置于所述柔性基底上，并且所述多个金属导线位于所述发光区及所述走线区；
一平坦层，设置于所述多个金属导线及所述柔性基底上；
一第一导电层，设置于所述平坦层上，所述第一导电层包括位于所述发光区的一第一电极；
一像素定义层，设置于所述第一电极及所述平坦层上；
一发光层，设置于所述像素定义层中及所述第一电极上，且所述发光层位于所述发光区；
一第二导电层，设置于所述像素定义层上，所述第二导电层包括位于所述发光层上的一第二电极及位于所述走线区的一第二导电走线；及
一封装层，设于所述第二导电层上。
根据本发明一实施例，所述第一可延展材料包含树脂。
根据本发明一实施例，所述封装层包括一封装层凹槽，位于所述薄化区，并且所述封装层凹槽与所述基底凹槽相对。
根据本发明一实施例，所述封装层凹槽设置有一第二可延展材料。
根据本发明一实施例，所述第一可延展材料及所述第二可延展材料包含树脂。
根据本发明一实施例，所述封装层凹槽暴露出部分所述第一可延展材料。
根据本发明一实施例，所述平坦层及所述像素定义层仅位于所述发光区及所述走线区。
 有益效果
本发明的有益效果为：通过对发光区的周围的封装层、柔性基底甚至柔性基底上的膜层，例如平坦层或像素定义层，进行薄化处理，并且填入延展性及弯折性好的材料，例如树脂；从而可以在保证OLED面板的质量的前提下，增加OLED面板延展与弯折的性能，并达到柔性显示的效果。
 附图说明
为让本发明的上述内容能更明显易懂，下文特举优选实施例，并配合所附图式，作详细说明如下：
图1是现有OLED面板结构上视图。
图2是本发明一种柔性OLED面板的一实施例的部分结构上视图。
图3是图2实施例中A-A线段的截面图。
图4是本发明一种柔性OLED面板的另一实施例的截面图。
 本发明的实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。再者，本发明所提到的方向用语，例如上、下、顶、底、前、后、左、右、内、外、侧面、周围、中央、水平、横向、垂直、纵向、轴向、径向、最上层或最下层等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
请参照图2及图3，图2是本发明一种柔性OLED面板的一实施例的部分结构上视图，图3是图2实施例中A-A线段的截面图。本实施例提供的所述柔性OLED面板包括：一柔性基底20、多个金属导线30及31、一平坦层40、一第一导电层、一像素定义层60、一发光层70、一第二导电层及一封装层90。
所述柔性基底20包括一发光区21、一薄化区23及一走线区22，其中所述发光区21邻接所述走线区22，所述薄化区23设于所述发光区21及所述走线区22之间，并且所述薄化区23包括：一基底凹槽201及一第一可延展材料201设置于所述基底凹槽201中。所述柔性基底20具有一第一表面210及一第二表面220，所述第二表面220相对于所述第一表面210。所述基底凹槽201形成在所述第二表面220。所述第一可延展材料201可以包含树脂。所述第一可延展材料201填入所述基底凹槽201可以适度地提升所述薄化区23的结构强度，避免因为薄化处理导致结构强度不足。此外，填入所述第一可延展材料201可以避免水气由所述薄化区23渗透进入所述柔性OLED面板内部。
所述多个金属导线30及31形成在所述第一表面210上。所述多个金属导线30设置于所述柔性基底20的所述发光区21及所述走线区22上。所述多个金属导线30及21可以是一金属薄膜通过图案化制程形成在所述发光区21及所述走线区22。其中位于所述发光区21的金属导线30可以连接所述第一导电层，而位于所述走线区22的金属导线31可以用来连接邻近的元件或传输讯号。
所述平坦层40设置于所述多个金属导线30及所述柔性基底20上。所述平坦层40在所述发光区21具有一导电通孔401电性连接位于所述发光区21的所述金属导线30。
所述第一导电层设置于所述平坦层40上，所述第一导电层包括位于所述发光区21的一第一电极50。所述第一电极50电性连结所述导电通孔401。所述第一导电层通过图案化制程形成所述第一电极50。所述第一导电层的材料可以是氧化铟锡(ITO)或其他具有类似特性的透明导电材料。
所述像素定义层60设置于所述第一电极50及所述平坦层40上。所述像素定义层60可以包含一过孔，用于容置所述发光层70。所述过孔位于所述第一电极50上。
所述发光层70设置于所述多个金属导线30其中之一的上方，且所述发光层70位于所述发光区21。所述发光层70设置于所述像素定义层60的所述过孔中，并且位于所述第一电极50上。所述发光层70可以为有机材料。
所述第二导电层设置于所述像素定义层60上，所述第二导电层包括位于所述发光层70上的一第二电极80及位于所述走线区22的一第二导电走线81。所述第二导电层通过图案化制程形成所述第二电极80及所述第二导电走线81。所述第二导电层的材料可以是氧化铟锡(ITO)或其他具有类似特性的透明导电材料。
所述封装层90设于所述发光层70及所述像素定义层60上方，且所述封装层90包括一封装层凹槽901位于所述薄化区23，并且所述封装层凹槽901与所述基底凹槽201相对。所述封装层凹槽901设置有一第二可延展材料902。所述第二可延展材料902可以包含树脂，其中所述第二可延展材料902与所述第一可延展材料201可以是相同材料。所述第二可延展材料902填入所述封装层凹槽901中可以提升所述薄化区23的结构强度。此外，所述第二可延展材料902也可以避免水气由所述薄化区23渗透进入所述柔性OLED面板内部。
请参照图4，是本发明一种柔性OLED面板的另一实施例的截面图。此实施例提供了一种柔性OLED面板，所述柔性OLED面板包括：一柔性基底20、多个金属导线30及31、一平坦层40、一第一导电层、一像素定义层60、一发光层70、一第二导电层及一封装层90。
所述柔性基底20包括一发光区21、一薄化区23及一走线区22，其中所述发光区21邻接所述走线区22，所述薄化区23设于所述发光区21及所述走线区22之间，并且所述薄化区23包括：一基底凹槽201及一第一可延展材料201设置于所述基底凹槽201中。所述柔性基底20具有一第一表面210及一第二表面220，所述第二表面220相对于所述第一表面210。基底凹槽201形成在所述柔性基底20的所述第二表面220。所述第一可延展材料201可以包含树脂。所述第一可延展材料201填入所述基底凹槽201可以适度地提升所述薄化区23的结构强度，避免因为薄化处理导致结构强度不足。此外，填入所述第一可延展材料201可以避免水气由所述薄化区23渗透进入所述柔性OLED面板内部。
所述多个金属导线30及31形成在所述第一表面210上。所述多个金属导线30设置于所述柔性基底20的所述发光区21及所述走线区22上。所述多个金属导线30及21可以是一金属薄膜通过图案化制程形成在所述发光区21及所述走线区22。其中位于所述发光区21的金属导线30可以连接所述第一导电层，而位于所述走线区22的金属导线31可以用来连接邻近的元件或传输讯号。
所述平坦层40设置于所述多个金属导线30及所述柔性基底20上。所述平坦层40在所述发光区21具有一导电通孔401电性连接位于所述发光区21的所述金属导线30。所述平坦层40通过图案化制程形成在所述发光区21及所述走线区22。
所述第一导电层设置于所述平坦层40上，所述第一导电层包括位于所述发光区21的一第一电极50。所述第一电极50电性连结所述导电通孔401。所述第一导电层通过图案化制程形成所述第一电极50。所述第一导电层的材料可以是氧化铟锡(ITO)或其他具有类似特性的透明导电材料。
所述像素定义层60设置于所述第一电极50及所述平坦层40上。所述像素定义层60可以包含一过孔，用于容置所述发光层70。所述过孔位于所述第一电极50上。所述像素定义层60通过图案化制程形成在所述发光区21及所述走线区22上。
所述发光层70设置于所述多个金属导线30其中之一的上方，且所述发光层70位于所述发光区21。所述发光层70设置于所述像素定义层60的所述过孔中，并且位于所述第一电极50上。所述发光层70可以为有机材料。
所述第二导电层设置于所述像素定义层60上，所述第二导电层包括位于所述发光层70上的一第二电极80及位于所述走线区22的一第二导电走线81。所述第二导电层通过图案化制程形成所述第二电极80及所述第二导电走线81。所述第二导电层的材料可以是氧化铟锡(ITO)或其他具有类似特性的透明导电材料。
所述封装层90设于所述发光层70及所述像素定义层60上方，且所述封装层90包括一封装层凹槽901位于所述薄化区23，并且所述封装层凹槽901与所述基底凹槽201相对。所述封装层凹槽901暴露出部分所述第一可延展材料202。
而图4实施例与图3实施例的差别在于，所述基底凹槽201形成在所述柔性基底20的所述第二表面220。所述封装层凹槽901与所述基底凹槽201相对，并且所述封装层凹槽901暴露出部分所述第一可延展材料202。此外，所述平坦层40及所述像素定义层60仅位于所述发光区21及所述走线区22，意即在所述薄化区23上没有所述平坦层40及所述像素定义层60。藉此，可以更进一步地增加OLED面板延展与弯折的性能。
此外，在本实施例中，所述封装层凹槽901还可以另外设置有一第二可延展材料902。所述第二可延展材料902可以包含树脂，其中所述第二可延展材料902与所述第一可延展材料201可以是相同材料。所述第二可延展材料902填入所述封装层凹槽901中可以进一步地提升所述薄化区23的结构强度。此外，所述第二可延展材料902也可以更进一步地避免水气由所述薄化区23渗透进入所述柔性OLED面板内部。
上述图案化制程可以利用薄膜沉积技术、光刻技术、蚀刻技术或其他相似可以定义图案形状、位置及大小的技术。上述薄膜沉积制程可以利用物理气相沈积技术、化学气相沈积技术、蒸镀技术、溅镀技术或其他可行的技术。上述光刻技术也可以通过其他相似可以定义图案位置及外型的技术。上述蚀刻制程可以利用湿蚀刻技术或是干蚀刻技术。
本发明的有益效果为：通过对发光区的周围的封装层、柔性基底甚至柔性基底上的膜层，例如平坦层或像素定义层，进行薄化处理，并且填入延展性及弯折性好的材料，例如树脂；从而可以在保证OLED面板的质量的前提下，增加OLED面板延展与弯折的性能，并达到柔性显示的效果。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (16)

  1. 一种柔性OLED面板，其包含：
    一柔性基底，具有一第一表面及一第二表面，所述第二表面相对于所述第一表面，所述柔性基底包括一发光区、一薄化区及一走线区，其中所述发光区邻接所述走线区，所述薄化区设于所述发光区及所述走线区之间，并且所述薄化区包括：
    一基底凹槽，所述基底凹槽形成在所述第二表面；及
    一第一可延展材料，设置于所述基底凹槽中；
    多个金属导线，形成在所述第一表面上；
    一发光层，设置于所述多个金属导线其中之一的上方，且所述发光层位于所述发光区；
    一封装层，设于所述发光层上方，且所述封装层包括一封装层凹槽，位于所述薄化区，并且所述封装层凹槽与所述基底凹槽相对；以及
    一第二可延展材料，设置于所述封装层凹槽。
  2. 如权利要求1所述的柔性OLED面板，其中所述多个金属导线位于所述柔性基底的所述发光区及所述走线区。
  3. 如权利要求1所述的柔性OLED面板，更包含：
    一平坦层，设置于所述多个金属导线及所述柔性基底上；
    一第一导电层，设置于所述平坦层上，所述第一导电层包括位于所述发光区的一第一电极；
    一像素定义层，设置于所述第一电极及所述平坦层上；及
    一第二导电层，设置于所述像素定义层上，所述第二导电层包括位于所述发光层上的一第二电极及位于所述走线区的一第二导电走线。
  4. 如权利要求3所述的柔性OLED面板，其中所述第一导电层及所述第二导电层是由透明导电材料所制成。
  5. 如权利要求4所述的柔性OLED面板，其中所述第一可延展材料及所述第二可延展材料包含树脂。
  6. 如权利要求3所述的柔性OLED面板，其中所述平坦层在所述发光区具有一导电通孔电性连接位于所述发光区的所述金属导线。
  7.    一种柔性OLED面板，其包含：
    一柔性基底，包括一发光区、一薄化区及一走线区，其中所述发光区邻接所述走线区，所述薄化区设于所述发光区及所述走线区之间，并且所述薄化区包括：
    一基底凹槽；及
    一第一可延展材料，设置于所述基底凹槽中；
    多个金属导线，设置于所述柔性基底的所述发光区及所述走线区上；
    一发光层，设置于所述多个金属导线其中之一的上方，且所述发光层位于所述发光区；及
    一封装层，设于所述发光层上方，且所述封装层包括一封装层凹槽，位于所述薄化区，并且所述封装层凹槽与所述基底凹槽相对。
  8.    如权利要求7所述的柔性OLED面板，其中所述封装层凹槽设置有一第二可延展材料。
  9.    如权利要求8所述的柔性OLED面板，其中所述第一可延展材料及所述第二可延展材料包含树脂。
  10. 一种柔性OLED面板，其包含：
    一柔性基底，包括一发光区、一薄化区及一走线区，其中所述发光区邻接所述走线区，所述薄化区设于所述发光区及所述走线区之间，并且所述薄化区包括：
    一基底凹槽；及
    一第一可延展材料，设置于所述基底凹槽中；
    多个金属导线，设置于所述柔性基底上，并且所述多个金属导线位于所述发光区及所述走线区；
    一平坦层，设置于所述多个金属导线及所述柔性基底上；
    一第一导电层，设置于所述平坦层上，所述第一导电层包括位于所述发光区的一第一电极；
    一像素定义层，设置于所述第一电极及所述平坦层上；
    一发光层，设置于所述像素定义层中及所述第一电极上，且所述发光层位于所述发光区；
    一第二导电层，设置于所述像素定义层上，所述第二导电层包括位于所述发光层上的一第二电极及位于所述走线区的一第二导电走线；及
    一封装层，设于所述第二导电层上。
  11. 如权利要求10所述的柔性OLED面板，其中所述第一可延展材料包含树脂。
  12. 如权利要求10所述的柔性OLED面板，其中所述封装层包括一封装层凹槽，位于所述薄化区，并且所述封装层凹槽与所述基底凹槽相对。
  13. 如权利要求12所述的柔性OLED面板，其中所述封装层凹槽设置有一第二可延展材料。
  14. 如权利要求13所述的柔性OLED面板，其中所述第一可延展材料及所述第二可延展材料包含树脂。
  15. 如权利要求12所述的柔性OLED面板，其中所述封装层凹槽暴露出部分所述第一可延展材料。
  16. 如权利要求15所述的柔性OLED面板，其中所述平坦层及所述像素定义层仅位于所述发光区及所述走线区。
PCT/CN2019/084878 2018-12-19 2019-04-29 柔性oled面板 Ceased WO2020124926A1 (zh)

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