WO2020118525A1 - Type-c集线器 - Google Patents

Type-c集线器 Download PDF

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Publication number
WO2020118525A1
WO2020118525A1 PCT/CN2018/120325 CN2018120325W WO2020118525A1 WO 2020118525 A1 WO2020118525 A1 WO 2020118525A1 CN 2018120325 W CN2018120325 W CN 2018120325W WO 2020118525 A1 WO2020118525 A1 WO 2020118525A1
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WO
WIPO (PCT)
Prior art keywords
type
interface
main board
hub
housing
Prior art date
Application number
PCT/CN2018/120325
Other languages
English (en)
French (fr)
Inventor
廖新辉
王超
胡杲辰
Original Assignee
深圳市通拓科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市通拓科技有限公司 filed Critical 深圳市通拓科技有限公司
Priority to PCT/CN2018/120325 priority Critical patent/WO2020118525A1/zh
Publication of WO2020118525A1 publication Critical patent/WO2020118525A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter

Definitions

  • the utility model relates to the field of electronic peripherals, in particular to a type-c hub.
  • the main purpose of the utility model is to provide a type-c hub, which aims to solve the above-mentioned problem of peripheral expansion of thin and light books.
  • a type-c hub including:
  • Type-c connector type-c connector protective shell, bending protective sleeve, connecting wire, tensile protective sleeve, shell and main board;
  • the type-c joint protective shell is provided with the type-c joint at the front; the type-c joint protective shell is provided with the bending protective sleeve at the rear; the type-c joint is protected by the bending
  • the sleeve is connected to the connecting wire; the main board is provided inside the casing, the connecting wire is connected to the main board through a hole provided in the casing, and the connecting wire is provided with a tensile protective sleeve at the hole ;
  • the main board is rectangular, and the main board is provided with a type-c interface on the same side of the connection line; the main board is provided with three parallel USB3.0 interfaces and HDMI interfaces on the opposite side of the type-c interface ;
  • One side of the mainboard short side is provided with a network cable interface, and the mainboard is provided with a VGA interface on the opposite side of the network cable interface;
  • the type-c interface can provide power for the motherboard
  • the main board is provided with three USB 3.0 respectively electrically connected with the USB 3.0 interface IC chip, the USB3.0 IC chip is used to control USB3.0 data transmission;
  • the mainboard is provided with a wireless network card chip and an antenna;
  • the bottom of the motherboard is provided with a heat dissipation metal sheet
  • the casing is provided with openings corresponding to the USB3.0 interface, type-c connector, type-c interface, HDMI interface and network cable interface.
  • a copper ring is riveted in the tensile protection sleeve.
  • the size of the housing is 108*60*18mm.
  • a signal shielding layer and an inner insulating layer are provided inside the connecting wire, and the signal shielding layer wraps the inner insulating layer;
  • the signal shielding layer is an aluminum mesh shielding layer or a copper mesh shielding layer;
  • the connecting wire Fireproof coating on the outside.
  • the upper and lower covers of the casing are mixed layers including a memory and an outer layer, the inner layer is a tinplate protective iron shell, and the outer layer is an ABS+PC plastic shell.
  • a removable suction cup is provided at the bottom of the casing.
  • a heat dissipation coating is provided on the outside of the casing.
  • an anti-interference coating is provided on the outside of the casing.
  • a power supply control IC chip is provided on the main board.
  • a memory chip is provided on the motherboard.
  • the upper and lower covers of the shell are mixed layers, the inner layer is a tinplate protective iron shell, and the outer layer is a matte ABS+PC plastic shell.
  • a removable suction cup is provided at the bottom of the casing.
  • the main board is provided with a breathing lamp
  • the casing is provided with an opening corresponding to the breathing lamp.
  • the main board is provided with an SD card interface, a TF card interface and a card reading controller.
  • the casing is provided with a heat dissipation coating.
  • the casing is coated with an anti-interference coating.
  • a sealed space is provided between the heat dissipation metal sheet of the main board and the housing, and the sealed space is filled with a phase change material.
  • the main board is provided with a power supply control IC chip.
  • the main board is provided with a network conversion controller.
  • the main board is provided with a memory chip.
  • the type-c hub proposed in this application includes: a type-c connector, a type-c connector protective shell, a bending protective sleeve, a connecting wire, a tensile protective sleeve, a housing and a main board; the main board is provided on the same side of the connecting wire There is a type-c interface; three parallel USB3.0 interfaces and HDMI interfaces are provided on the opposite side of the type-c interface; a network cable interface is provided on one side of the short side of the motherboard, and a network interface is provided on the opposite side of the network card interface VGA interface; the type-c interface can provide power for the motherboard; the motherboard is provided with three USB3.0 IC chips respectively electrically connected to the USB3.0 interface, the IC chip is used to control the USB3.0 Data transmission; the main board is provided with a wireless network card chip; the bottom of the main board is provided with a heat dissipation metal sheet; and the casing is provided with an opening corresponding to an interface or a joint.
  • FIG. 1 is a top view of a type-c hub of an embodiment of the present invention
  • FIG. 3 is a right side view of a type-c hub of an embodiment of the present invention.
  • FIG. 4 is a front view of a type-c hub of an embodiment of the present invention.
  • An embodiment of the present invention proposes a type-c hub, including:
  • Type-c connector 1 type-c connector protective shell 2, bending protective sleeve 3, connecting wire 4, tensile protective sleeve 5, casing 6 and main board;
  • the type-c joint protective shell 2 is provided with the type-c joint 1 at the front; the type-c joint protective shell 2 is provided with the bending protective sleeve 3 at the rear; the type-c joint 1 is passed through
  • the bending protection sleeve 3 is connected to the connecting wire 4; the main board is provided inside the housing 6, the connecting wire 4 is connected to the main board through a hole provided in the housing 6, the connecting wire 4 There is a stretch protective sleeve 5 at the hole;
  • the main board is rectangular, and the main board is provided with a type-c interface on the same side of the connecting line 4; the main board is provided with three parallel USB3.0 interfaces 9 on the opposite side of the type-c interface.
  • the type-c interface can provide power for the motherboard
  • the motherboard is provided with three USB3.0 IC chips electrically connected to the USB3.0 interface 9 respectively, and the USB3.0 IC chip is used to control USB3.0 data transmission;
  • the mainboard is provided with a wireless network card chip and an antenna;
  • the bottom of the main board is provided with a heat dissipation metal sheet
  • the housing 6 is provided with openings corresponding to the USB3.0 interface 9, type-c connector 1, type-c interface, HDMI interface 10, and network cable interface 7.
  • the type-c hub is provided with a bending protective sleeve 3 and a tensile protective sleeve 5 at both ends of the connecting wire 4, respectively.
  • a bending protective sleeve 3 When the type-c connector 1 is plugged and unplugged, and even when it is used in a hub, part of the wire body of the connecting wire 4 near the type-c connector 1 is often greatly bent, which is prone to breakage, short circuit, open circuit, etc.;
  • the function of the protective sleeve 3 is to protect the connecting wire 4 by receiving most of the force when the connecting wire 4 is bent.
  • the function of the stretch protective sleeve 5 is to protect the welding part of the connecting wire 4 and the main board from being broken by external force, and damage the hub.
  • the motherboard is provided with three USB3.0 interfaces 9, each USB3.0 interface 9 is provided with a USB3.0 IC chip electrically connected thereto, when the three USB3.0 interfaces 9 are used at the same time, all can reach USB3. 0 transfer speed, if only one USB3.0 is set IC chip, when two or three USB3.0 interfaces 9 are in use, only one interface can reach the transmission speed of USB3.0, and the remaining USB3.0 only has the transmission speed of USB2.0.
  • the simultaneous use of multiple peripherals will cause insufficient power supply to the hub, and multiple peripherals cannot be used at the same time.
  • the type-c interface set in this solution perfectly solves this problem.
  • the type-c interface can be used to supply power to the hub to solve external problems such as computers.
  • the bottom of the main board is provided with a heat dissipation metal sheet.
  • the main purpose is that when the hub is connected to multiple devices to work at the same time, the current passing through the main board is larger and generates more heat.
  • the heat dissipation metal sheet helps to dissipate heat and improve product stability. Sex.
  • the size of the housing 6 is 108*60*18mm.
  • the hub is set to 108*60*18mm, and the connecting cable 4, three USB3.0 interfaces 9, SD card interface, TF card interface and HDMI interface 10 are arranged on the hub so as not to be too tight, which affects the interface usage of.
  • the thickness is set to 18mm, there is enough space to set up the antenna on the motherboard, and cooperate with the wireless network card chip to build a wireless network.
  • a signal shielding layer and an internal insulating layer are provided inside the connecting wire 4, the signal shielding layer is an aluminum mesh shielding layer or a copper mesh shielding layer; the outside of the connecting wire 4 is provided with a fireproof coating.
  • the signal shielding layer can avoid the interference of external signals and ensure the effective transmission of the internal signals of the connection line 4.
  • the internal insulation layer separates the signal transmission line and the signal shielding layer inside the connection line 4 and plays a certain protective role.
  • the main board is provided with a breathing lamp
  • the housing 6 is provided with an opening corresponding to the breathing lamp.
  • the main board is provided with a breathing lamp
  • the breathing lamp also has the function of an indicator lamp, and some similar interfaces may not be connected properly, and the product may be insufficient in power supply.
  • the breathing lamp makes the type-c hub product more cool to use.
  • the upper and lower covers of the casing 6 are mixed layers, the inner layer is a tinplate protective iron shell, and the outer layer is a matte ABS+PC plastic shell.
  • the use of tinplate for the housing 6 has the following advantages: 1) The tinplate has strong electromagnetic shielding and enhances the anti-interference of the hub; 2) The tinplate is not easy to rust, and then has an outer layer of ABS+PC plastic shell , It can reach the impossible to rust during the normal life span of the hub; 3) Tinplate has excellent thermal conductivity and is conducive to heat dissipation; 4) Tinplate is cheap to manufacture.
  • the beneficial effects of the outer layer of ABS+PC plastic shell and matte treatment are as follows: 1) ABS+PC plastic material has strong corrosion resistance; 2) ABS+PC plastic shell and matte treatment have a good feel and user experience; 3) ABS+PC plastic and tinplate are the perfect combination of inner and outer layers.
  • the bottom of the housing 6 is provided with a removable suction cup.
  • the bottom of the housing 6 is provided with a suction cup, and the provided suction cup is detachable, which can facilitate the hub to be fixed in some special places during use without occupying space, such as being fixed on a wall. It is convenient for users to retract the hub when not in use.
  • the housing 6 is provided with a heat dissipation coating.
  • the housing 6 is provided with a heat dissipation coating, which can accelerate the heat dissipation of the hub and increase the use safety and service life of the hub.
  • a sealed space is provided between the motherboard heat dissipation metal sheet and the housing 6, and the sealed space is filled with a phase change material.
  • a phase change material is provided between the heat dissipation metal sheet of the motherboard and the housing 6, which can speed up the heat dissipation of the hub.
  • the heat dissipation efficiency of the phase change material is higher than the heat dissipation efficiency of the metal sheet shell and the heat dissipation coating More than times.
  • the housing 6 is coated with an anti-interference coating.
  • the computer uses multiple external devices to transmit data through the hub. Due to the multiple data transmission channels and the large amount of data, the computer is relatively susceptible to external interference and causes data transmission errors.
  • the case 6 coated with an anti-interference coating can better solve this problem.
  • the motherboard is provided with a power supply control IC chip.
  • the motherboard is provided with a power supply control IC chip to effectively protect the hub and prevent the hub from being hit due to excessive current. Wear damaged.
  • the power supply control IC chip limits the current that the first USB3.0 interface 9 can pass to 2A, the output current after the first USB3.0 interface 9 is connected to the device is between 0-2A.
  • the motherboard is provided with a memory chip.
  • the role of the type-c hub is to extend the interface of a terminal such as a computer tablet, and then access an external device through the extended interface.
  • Set a memory chip on the main board of the type-c hub, and some protocols can be stored on the product memory chip to improve the response speed of the product and broaden the scope of application of the product.
  • Users can store some commonly used data, such as drivers, to play the role of type-c hub to a greater extent.

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Abstract

本实用新型提出的type-c集线器，包括：type-c接头、type-c接头保护壳、折弯保护套、连接线、拉伸保护套、壳体和主板；所述主板在连接线同侧设有type-c接口；所述type-c接口对侧设有三个并列的USB3.0接口、HDMI接口；所述所述主板短边的一侧设有网线接口，所述网卡接口对侧设有VGA接口；所述type-c接口可为主板提供供电；所述主板上设有三个分别与所述USB3.0接口电连接的USB3.0 IC芯片，所述IC芯片用于控制USB3.0的数据传输；所述主板上设有无线网卡芯片；所述主板底部设置有散热金属片；所述壳体设有与接口或接头对应的开口。通过将type-c集线器连接相应设备，使设备达到扩展不同类型接口的目的。

Description

type-c集线器 技术领域
本实用新型涉及电子外设领域，特别涉及一种type-c集线器。
 背景技术
随着计算机的发展，尤其是笔记本电脑的发展，笔记本电脑产品做得越来越薄，以此带来轻便的效果。产品做得轻薄的缺点是少了很多原生的USB接口，并且没有了MS卡接口和TF卡接口，导致产品无法连接多个外部设备。
 技术问题
本实用新型的主要目的为提供的一种type-c集线器，旨在解决上述轻薄本的外设扩展问题。
 技术解决方案
为了实现上述发明目的，本实用新型提出一种type-c集线器，包括：
type-c接头、type-c接头保护壳、折弯保护套、连接线、拉伸保护套、壳体和主板；
所述type-c接头保护壳前部设有所述type-c接头；所述type-c接头保护壳后部设有所述折弯保护套；所述type-c接头通过所述折弯保护套连接所述连接线；所述主板设于所述壳体内部，所述连接线穿过壳体上所设的孔与所述主板连接，所述连接线在孔处设有拉伸保护套；
所述主板为长方形，所述主板上位于连接线的同侧设有type-c接口；所述主板上位于所述type-c接口的对侧设有并列的三个USB3.0接口、HDMI接口；所述主板短边的一侧设有网线接口，所述主板上位于所述网线接口的对侧设有VGA接口；
所述type-c接口可为主板提供供电；
所述主板上设有三个分别与所述USB3.0接口电连接的USB3.0 IC芯片，所述USB3.0 IC芯片用于控制USB3.0的数据传输；
所述主板上设有无线网卡芯片及天线；
所述主板底部设置有散热金属片；
所述壳体设有与所述USB3.0接口、type-c接头、type-c接口、HDMI接口和网线接口对应的开口。
进一步地，所述拉伸保护套内铆接有铜环。
进一步地，所述壳体尺寸为108*60*18mm。
进一步地，所述连接线内部设有信号屏蔽层、内部绝缘层，所述信号屏蔽层包裹所述内部绝缘层；所述信号屏蔽层为铝网屏蔽层或铜网屏蔽层；所述连接线外部设有防火涂层。
进一步地，所述壳体上下盖均为包括内存和外层的混合层，内层为马口铁防护铁壳，外层为ABS+PC塑胶壳。
进一步地，所述壳体底部设有可拆卸吸盘。
进一步地，所述壳体外侧设有散热涂层。
进一步地，所述壳体外侧设有防干扰涂层。
进一步地，所述主板上设置有供电控制IC芯片。
进一步地，所述主板上设有存储芯片。
进一步地，所述壳体上下盖为混合层，内层为马口铁防护铁壳，外层为做过磨砂处理的ABS+PC塑胶壳。
进一步地，所述壳体底部设有可拆卸吸盘。
进一步地，所述主板设有呼吸灯，所述壳体设有与呼吸灯对应的开口。
进一步地，所述主板设有SD卡接口、TF卡接口和读卡控制器。
进一步地，所述壳体设有散热涂层。
进一步地，所述壳体涂有防干扰涂层。
进一步地，所述主板散热金属片与壳体之间设有一密闭空间，所述密闭空间填充有相变材料。
进一步地，所述主板设置有供电控制IC芯片。
进一步地，所述主板设有网络转换控制器。
进一步地，所述主板设有存储芯片。
 有益效果
本申请提出的type-c集线器，包括：type-c接头、type-c接头保护壳、折弯保护套、连接线、拉伸保护套、壳体和主板；所述主板在连接线同侧设有type-c接口；所述type-c接口对侧设有三个并列的USB3.0接口、HDMI接口；所述所述主板短边的一侧设有网线接口，所述网卡接口对侧设有VGA接口；所述type-c接口可为主板提供供电；所述主板上设有三个分别与所述USB3.0接口电连接的USB3.0 IC芯片，所述IC芯片用于控制USB3.0的数据传输；所述主板上设有无线网卡芯片；所述主板底部设置有散热金属片；所述壳体设有与接口或接头对应的开口。通过将type-c集线器连接相应设备，使设备达到扩展不同类型接口的目的。
 附图说明
图1 为本实用新型实施例type-c集线器的俯视图；
图2 为本实用新型实施例type-c集线器的左视图；
图3 为本实用新型实施例type-c集线器的右视图；
图4 为本实用新型实施例type-c集线器的前视图。
 本发明的最佳实施方式
应当理解，此处所描述的具体实施例仅仅用以解释本实用新型，并不用于限定本实用新型。
本技术领域技术人员可以理解，除非特意声明，这里使用的单数形式“一”、“一个”、“所述”“上述”和“该”也可包括复数形式。应该进一步理解的是，本实用新型的说明书中使用的措辞“包括”是指存在所述特征、整数、步骤、操作、元件、单元、模块和/或组件，但是并不排除存在或添加一个或多个其他特征、整数、步骤、操作、元件、单元、模块、组件和/或它们的组。应该理解，当我们称元件被“连接”或“耦接”到另一元件时，它可以直接连接或耦接到其他元件，或者也可以存在中间元件。此外，这里使用的“连接”或“耦接”可以包括无线连接或无线耦接。这里使用的措辞“和/或”包括一个或更多个相关联的列出项的全部或任一单元和全部组合。
本技术领域技术人员可以理解，除非另外定义，这里使用的所有术语（包括技术术语和科学术语），具有与本实用新型所属领域中的普通技术人员的一般理解相同的意义。还应该理解的是，诸如通用字典中定义的那些术语，应该被理解为具有与现有技术的上下文中的意义一致的意义，并且除非像这里一样被特定定义，否则不会用理想化或过于正式的含义来解释。
本实用新型实施例提出一种type-c集线器，包括：
type-c接头1、type-c接头保护壳2、折弯保护套3、连接线4、拉伸保护套5、壳体6和主板；
所述type-c接头保护壳2前部设有所述type-c接头1；所述type-c接头保护壳2后部设有所述折弯保护套3；所述type-c接头1通过所述折弯保护套3连接所述连接线4；所述主板设于所述壳体6内部，所述连接线4通过壳体6上所设的孔与所述主板连接，所述连接线4在孔处设有拉伸保护套5；
所述主板为长方形，所述主板上位于连接线4的同侧设有type-c接口；所述主板上位于所述type-c接口的对侧设有并列的三个USB3.0接口9、HDMI接口10；所述主板短边的一侧设有网线接口7，所述主板上位于所述网线接口7的对侧设有VGA接口8；
所述type-c接口可为主板提供供电；
所述主板上设有三个分别与所述USB3.0接口9电连接的USB3.0 IC芯片，所述USB3.0 IC芯片用于控制USB3.0的数据传输；
所述主板上设有无线网卡芯片及天线；
所述主板底部设置有散热金属片；
所述壳体6设有与所述USB3.0接口9、type-c接头1、type-c接口、HDMI接口10和网线接口7对应的开口。
在本实施例中，所述type-c集线器，在连接线4两端分别设有折弯保护套3和拉伸保护套5。由于type-c接头1在拔插时，甚至在集线器使用时，连接线4靠近type-c接头1处的部分线体经常被大幅度弯曲，容易产生折断、短路、断路等问题；而折弯保护套3的作用就是连接线4被弯曲时，承受大部分力，保护连接线4。拉伸保护套5的作用是保护连接线4与主板连接的焊接部分不受到外力作用产生断路，损坏集线器。所述主板上设有三个USB3.0接口9，每个USB3.0接口9均设有USB3.0 IC芯片与之电连接，三个USB3.0接口9在同时使用时，均能达到USB3.0的传输速度，若只设置一个USB3.0 IC芯片，则在两个或三个USB3.0接口9在使用时，只有一个接口能达到USB3.0的传输速度，剩余的USB3.0则只有USB2.0的传输速度。在另一实施例中，一般的集线器在接入多个外设时，由于多个外设同时用电将会导致集线器供电不足，多个外设无法同时使用。本方案所设置的type-c接口则完美解决了这一问题，相比于一般的集线器，在集线器供电不足的时候，可通过所设置的type-c接口外接电源为集线器供电，解决电脑等外接设备供电不足的问题。所述主板底部设置有散热金属片，主要目的是，在集线器外接多个设备同时工作时，经过主板的电流较大，产生较多的热量，散热金属片有助于散热，提高产品使用的稳定性。
在一实施例中，所述壳体6大小为108*60*18mm。
在本实施例中，将集线器设置为108*60*18mm，连接线4、三个USB3.0接口9、SD卡接口、TF卡接口和HDMI接口10排列在集线器上不致于太紧密，影响接口的使用。厚度设置为18mm，可以有足够的空间在主板上设置天线，配合无线网卡芯片组建无线网络。
在一实施例中，所述连接线4内部设有信号屏蔽层、内部绝缘层，所述信号屏蔽层为铝网屏蔽层或铜网屏蔽层；所述连接线4外部设有防火涂层。
在本实施例中，所述信号屏蔽层可以避免外部信号的干扰，保证连接线4内部信号的有效传输。所述内部绝缘层将连接线4内部的信号传输线与信号屏蔽层分隔开来，并且起到一定的保护作用。
在一实施例中，所述主板设有呼吸灯，所述壳体6设有与呼吸灯对应的开口。
在本实施例中，所述主板设有呼吸灯，呼吸灯同时具备指示灯的作用，可以将一些类似接口没有接好，产品供电不足等问题提示给用户。例如，在集线器接入多个外设时，由于多个外设同时用电，同时呼吸灯使type-c集线器这一款产品在用起来更炫酷。
在一实施例中，所述壳体6上下盖为混合层，内层为马口铁防护铁壳，外层为做过磨砂处理的ABS+PC塑胶壳。
在本实施例中，壳体6选用马口铁具有如下好处：1）马口铁具有很强的电磁屏蔽性，增强了集线器的抗干扰性；2）马口铁不易生锈，再有外层ABS+PC塑胶壳，能达到在集线器的正常寿命期内不可能生锈；3）马口铁导热性能优良，利于散热；4）马口铁造价便宜。外层为ABS+PC塑胶壳并做磨砂处理的有益效果如下：1）ABS+PC塑胶材料的耐腐蚀性强；2）ABS+PC塑胶壳并做磨砂处理手感好，用户体验嘉；3）ABS+PC塑胶与马口铁为内外层可完美融合。
在一实施例中，所述壳体6底部设有可拆卸吸盘。
在本实施例中，所述壳体6底部设置吸盘，并且所设置的吸盘为可拆卸的，可在使用时方便集线器固定在一些特殊的地方，不占用空间，例如固定于墙上。不使用时方便用户收回集线器。
在一实施例中，所述壳体6设有散热涂层。
在本实施例中，集线器在接入多个外设时，由于多个外设同时耗能，将会产生较大热量。所述壳体6设有散热涂层，可以加快集线器的散热，增加集线器的使用安全性和使用寿命。
在一实施例中，所述主板散热金属片与壳体6之间设有一密闭空间，所述密闭空间填充有相变材料。
在本实施例中，主板散热金属片与壳体6间设有相变材料，能加快集线器的散热，相变材料的设置，散热效率较仅有金属片外壳、散热涂层的散热效率高3倍以上。在多个外设同时用电，集线器输出电流高，发热严重时，相变材料的设置可以加快集线器的散热，避免由于散热不足引起安全事故。大大增加集线器的使用安全性和使用寿命。
在一实施例中，所述壳体6涂有防干扰涂层。
在本实施例中，电脑通过集线器使用多个外接设备传输数据，由于数据的传输通道多，数据量大，比较容易受到外界的干扰导致数据传输错误。壳体6涂有防干扰涂层可以较好地解决这一问题。
在一实施例中，所述主板设置有供电控制IC芯片。
在本实施例中，由于集线器在使用不同的设备时，不同的设备所需的电流大小不同，因此所述主板设置有供电控制IC芯片可以有效的保护集线器，避免集线器由于电流过大而被击穿损坏。例如，供电控制IC芯片限制第一个USB3.0接口9可通过的电流为2A，则第一个USB3.0接口9接入设备后的输出电流为0-2A之间。
在一实施例中，所述主板设有存储芯片。
在本实施例中，由于type-c集线器的作用是扩展电脑平板等终端的接口，再通过扩展接口接入外部设备等。在type-c集线器的主板上设置存储芯片，在产品存储芯片上可以存储一些协议，提高产品的响应速度、扩宽产品的适用范围。用户可以存储一些常用数据，如驱动等，以更大程度发挥type-c集线器的作用。
以上所述仅为本实用新型的优选实施例，并非因此限制本实用新型的专利范围，凡是利用本实用新型说明书及附图所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本实用新型的专利保护范围内。

Claims (10)

  1. 一种type-c集线器，其特征在于，包括：type-c接头、type-c接头保护壳、折弯保护套、连接线、拉伸保护套、壳体和主板；
    所述type-c接头保护壳前部设有所述type-c接头；所述type-c接头保护壳后部设有所述折弯保护套；所述type-c接头通过所述折弯保护套连接所述连接线；所述主板设于所述壳体内部，所述连接线穿过壳体上所设的孔与所述主板连接，所述连接线在孔处设有拉伸保护套；
    所述主板为长方形，所述主板上位于连接线的同侧设有type-c接口；所述主板上位于所述type-c接口的对侧设有并列的三个USB3.0接口、HDMI接口；所述主板短边的一侧设有网线接口，所述主板上位于所述网线接口的对侧设有VGA接口；
    所述type-c接口可为主板提供供电；
    所述主板上设有无线网卡芯片及天线；
    所述壳体设有与所述USB3.0接口、type-c接头、type-c接口、HDMI接口和网线接口对应的开口。
  2. 如权利要求1所述的type-c集线器，其特征在于，所述拉伸保护套内铆接有铜环。
  3. 如权利要求1所述的type-c集线器，其特征在于，所述壳体尺寸为108*60*18mm。
  4. 如权利要求1所述的type-c集线器，其特征在于，所述连接线内部设有信号屏蔽层、内部绝缘层，所述信号屏蔽层包裹所述内部绝缘层；所述信号屏蔽层为铝网屏蔽层或铜网屏蔽层。
  5. 如权利要求1所述的type-c集线器，其特征在于，所述壳体上下盖均为包括内存和外层的混合层，内层为马口铁防护铁壳，外层为ABS+PC塑胶壳。
  6. 如权利要求1所述的type-c集线器，其特征在于，所述壳体底部设有可拆卸吸盘。
  7. 如权利要求1所述的type-c集线器，其特征在于，所述壳体外侧设有散热涂层。
  8. 如权利要求1所述的type-c集线器，其特征在于，所述壳体外侧设有防干扰涂层。
  9. 如权利要求1所述的type-c集线器，其特征在于，所述主板上设置有供电控制IC芯片。
  10. 如权利要求1所述的type-c集线器，其特征在于，所述主板上设有存储芯片。
PCT/CN2018/120325 2018-12-11 2018-12-11 Type-c集线器 WO2020118525A1 (zh)

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US20160036176A1 (en) * 2014-08-01 2016-02-04 Aces Electronics Co., Ltd. Connector
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CN207459369U (zh) * 2017-11-20 2018-06-05 森泊创意科技（深圳）有限公司 一种多头数据转换线
CN207588155U (zh) * 2017-08-16 2018-07-06 东莞市镭清电子实业有限公司 一种具有旋转插孔的转接器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160036176A1 (en) * 2014-08-01 2016-02-04 Aces Electronics Co., Ltd. Connector
CN206180335U (zh) * 2016-11-29 2017-05-17 东莞市三奕电子科技有限公司 一种Type C音频转接盒耳机插头旋入式结构
CN207588155U (zh) * 2017-08-16 2018-07-06 东莞市镭清电子实业有限公司 一种具有旋转插孔的转接器
CN207459369U (zh) * 2017-11-20 2018-06-05 森泊创意科技（深圳）有限公司 一种多头数据转换线

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