WO2020113535A1 - 超声换能器 - Google Patents

超声换能器 Download PDF

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Publication number
WO2020113535A1
WO2020113535A1 PCT/CN2018/119637 CN2018119637W WO2020113535A1 WO 2020113535 A1 WO2020113535 A1 WO 2020113535A1 CN 2018119637 W CN2018119637 W CN 2018119637W WO 2020113535 A1 WO2020113535 A1 WO 2020113535A1
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WIPO (PCT)
Prior art keywords
layer
array
ultrasonic transducer
transducer
array elements
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PCT/CN2018/119637
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English (en)
French (fr)
Inventor
冯伟
黄林冰
张艳辉
张晨宁
孙健铨
冯亚春
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Shenzhen Institute of Advanced Technology of CAS
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Shenzhen Institute of Advanced Technology of CAS
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Priority to PCT/CN2018/119637 priority Critical patent/WO2020113535A1/zh
Publication of WO2020113535A1 publication Critical patent/WO2020113535A1/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy

Definitions

  • the present application relates to the technical field of transducers, in particular to an ultrasonic transducer.
  • the frequency of commonly used ultrasonic probes is low, many are within 10MHz, of which single probes are the majority, and some probes are phased array probes.
  • the design of commonly used ultrasonic phased array probes is based on Huygens' principle. There are array elements arranged one-dimensionally in the azimuth direction. Each array element is independent of each other, and each array element is processed according to a certain electronic delay. Excitation, thereby forming a new ultrasonic array, through the application of different electronic delays, will cause the ultrasonic beam to deflect to meet various detection needs.
  • the inventor of the present application has found in a long-term research that when the workpiece to be inspected has a hole in the cylinder face and needs to detect the subtle defects near the cylinder face, the existing probe frequency is not high enough, and the ultrasound can only be reached through other surfaces on the workpiece Near the cylinder, so as to indirectly detect defects near the cylinder, that is to say, the existing probe is not sensitive enough and the resolution is not enough.
  • the present application provides an ultrasonic transducer capable of detecting irregularly shaped workpieces and providing detection sensitivity.
  • an ultrasonic transducer including:
  • a first ultrasonic transducer array is a phased array transducer array, which includes a plurality of independent first array elements, and the plurality of independent first array elements are arranged in a plane Cloth for testing planes;
  • a second ultrasonic transducer array is a convex array transducer array, which includes a plurality of independent second array elements, and the plurality of independent second array elements are arranged in a curved surface , Used to detect curved surfaces.
  • the ultrasonic transducer in the present application includes a phased array transducer array arranged in a plane and a convex array transducer array arranged in a curved surface, which can simultaneously detect defects on the plane and the curved surface.
  • the ability to detect irregularly shaped workpieces can increase the detection sensitivity compared to the prior art.
  • FIG. 1 is a schematic structural diagram of an embodiment of an ultrasonic transducer of the present application
  • FIG. 2 is a cross-sectional view of the ultrasonic transducer in FIG. 1 along the A-A direction;
  • FIG. 3 is a cross-sectional view of the ultrasonic transducer in FIG. 1 along the B-B direction.
  • FIG. 1 is a schematic structural view of an embodiment of an ultrasonic transducer of the present application
  • FIG. 2 is a cross-sectional view of the ultrasonic transducer in FIG. 1 along the AA direction
  • FIG. 3 is an ultrasonic transducer in FIG. Cross-sectional view of the device along the BB direction.
  • the ultrasonic transducer 100 includes a first ultrasonic transducer array 10 and a second ultrasonic transducer array 20, the first ultrasonic transducer array 10 is a phased array transducer array 10, and the second ultrasonic transducer array 20 is a convex array transducer array 20.
  • phased array transducer array 10 is used in a phased array probe
  • convex array transducer array 20 is used in a convex array probe
  • the first ultrasonic transducer array 10 is used to detect a plane, and includes a plurality of independent first array elements 11, wherein the plurality of first array elements 11 are arranged in a plane, wherein the number of the first array elements 11 may be multiple, For example, 5, 8, etc.; the second ultrasonic transducer array 20 is used to detect curved surfaces, including a plurality of independent second array elements 21, and the plurality of independent second array elements 21 are arranged in a curved surface, of which the second The number of array elements 21 is also multiple, such as 64, 128, 256, etc. In this application, the number of first array elements 11 and second array elements 21 is not limited.
  • the working principles of the first ultrasonic transducer array 10 and the second ultrasonic transducer array 20 are different.
  • an independent Excitation signal when the second ultrasonic transducer array 20 is working, assuming that it includes 128 second array elements 21, set the second array element 1 to 8 as the sub array 1 and the second array element 2 to 9 No. 2 sub-array, No. 3 to No. 10 sub-array is No. 3 sub-array... No. 121 to No. 128 sub-array is No. 121 sub-array, the sequence of the entire scanning cycle is that No. 1 sub-array sends and receives ultrasound, 2 No.
  • the scanning mode of the second ultrasonic transducer array 20 may also be an interval scanning mode, which is not limited herein.
  • the convex array transducer array 20 is generally used in medical instruments, which can image human tissue, and the human tissue is soft. After the inspection equipment contacts the human body during inspection, the human tissue will be deformed.
  • the human tissue can be regarded as a curved surface, and the wavefront generated by the convex array transducer array 20 is also a curved surface, that is to say, the convex array transducer array 20 has a good effect on the detection of the curved surface.
  • the ultrasonic transducer 100 is configured to include a phased array transducer array 10 for detecting planes and a convex array transducer array 20 for detecting curved surfaces.
  • the first ultrasonic transducer array 10 can detect the planar portion on the workpiece
  • the second ultrasonic transducer array 20 can detect the curved portion on the workpiece, or That is, compared with the prior art, the ultrasonic transducer 100 in the present application can directly detect the curved surface on the workpiece without using the indirect detection method, so the detection sensitivity can be improved.
  • a plurality of independent first array elements 11 are arranged to form a circular surface 12, and a plurality of second array elements 21 are arranged to form a curved surface 22 around the circumference of the circular surface 12 and to the side of the vertical circular surface 12 The direction extends, that is, the curved surface 22 stands vertically from the side wall of the round surface 12.
  • the ultrasonic transducer 100 composed of the first ultrasonic transducer array 10 and the second ultrasonic transducer array 20 has a cylindrical shape.
  • the transducer 100 can go deep into the cylindrical hole for detection, wherein the first ultrasonic transducer array 10 can detect defects on the bottom of the cylindrical hole, and the second ultrasonic transducer
  • the detector array 20 can detect the defects of the cylindrical face of the cylindrical face.
  • the curved surface 22 arranged by the plurality of second array elements 21 surrounds the circumference of the circular surface 12, so that when detecting the cylindrical hole on the workpiece, the second ultrasonic transducer array 20 can The entire cylinder is inspected.
  • the curved surface 22 formed by the plurality of second array elements 21 may also partially surround the circular surface 12 formed by the plurality of first array elements 11. At this time, when detecting the hole in the cylindrical face, the ultrasonic energy can be converted by rotating The method of the device 100 completes the detection of the entire cylindrical surface in the cylindrical hole.
  • the plurality of first array elements 21 are distributed in a ring shape according to concentric circles, and the plurality of second array elements 22 are juxtaposed and extend in a direction away from the circular surface 12, that is, the extension directions of the plurality of second array elements 22 are perpendicular to the circular surface 12 .
  • multiple first array elements 11 may also be arranged in parallel along the diameter direction of the circular surface 12
  • multiple second array elements 22 may also be arranged in parallel along the circumferential direction, that is, a single second array element 21 is one In the shape of a ring, the relative arrangement of the first array element 11 and the second array element 22 is not limited in this application.
  • the ultrasonic transducer 100 further includes a substrate 30 that extends around the circumference of the circular surface 12 and extends in a direction perpendicular to the circular surface 12, wherein the second ultrasonic transducer array 20 is fixed to the substrate On the upper 30, that is, the first ultrasonic transducer array 10 and the second ultrasonic transducer array 20 are fixed and supported by the substrate 30.
  • the material of the substrate 30 may be a single material or a composite material. Specifically, the material may be a material with good flexibility, such as metal or polyimide, or an epoxy resin with good flexibility after curing. In an application scenario, a ground wire electrically connected to the first ultrasonic transducer array 10 and the second ultrasonic transducer array 20 may be fabricated on the substrate 30.
  • the first ultrasonic transducer array 11 includes a first backing layer 111, a first transducer layer 112 covering the first backing layer 111, and a first matching layer 113 covering the first transducer layer 112 At the same time, a plurality of first slits 114 extend from the first matching layer 113 to the first backing layer 111 to form a plurality of independent first array elements 11.
  • the flowable and curable backing layer material can be combined with the first transducer layer 112 by pouring, or the first backing layer 111 is pre-made and then bonded to the first by an adhesive On the transducer layer 112.
  • the acoustic impedance of the first backing layer 111 is uniform or gradual along the sound wave emission direction.
  • the first backing layer 111 is a solid layer 111, and a plurality of first cutouts 114 are filled with solid fillers or gaseous fillers, or the first backing layer 111 is a gas layer 111, and a plurality of first cutouts The 114 is filled with solid filler.
  • the material of the first backing layer 111 is a single material or a composite material.
  • the single material includes but is not limited to metal, epoxy resin, zirconia, alumina, etc.
  • the composite material includes suspended in epoxy resin or other flowable, Microspheres in a curable liquid substance.
  • the material of the microspheres can be metal, silica, alumina, zirconia, rubber or other materials.
  • the microspheres can include surrounding or encapsulating gas (air or hydrocarbon gas etc. ) Hollow solid microspheres can also be solid solid microspheres, the microspheres can be mixed with epoxy resin or polymer in different proportions, so as to obtain composite materials with different consistency and density.
  • the material filled in the plurality of first cuts 114 may be a single material or a composite material.
  • the single material includes but is not limited to epoxy resin, silicone rubber and other curable filler materials, and the composite material includes suspended in epoxy resin or Microspheres in other flowable and curable liquid substances.
  • the material of the microspheres may be metal, silica, alumina, zirconia, rubber or other materials.
  • the microspheres may include surrounding or encapsulating gas (air or Hollow solid microspheres (hydrocarbon gas and other gases) can also be solid solid microspheres, which can be mixed with epoxy resin or polymer in different proportions to obtain composite materials with different consistency and density.
  • the plurality of first cutouts 114 may also be filled with a gaseous filler. In this case, the filled gaseous filler may be a gas or a mixed gas. It is worth noting that when the first backing layer 111 is the gas layer 111, in order to fix the plurality of first array elements 11, the plurality of first slits 114 must be filled with solid fillers.
  • the widths of the plurality of first slits 114 are approximately the same, and the width is between 10-100 ⁇ m, and the acoustic impedance of the fillers in the plurality of first slits 114 is uniform or gradual along the sound wave emission direction.
  • the first transducer layer 112 includes one or more transducer elements configured to emit ultrasonic energy at a central operating frequency (100 MHz or more).
  • the first transducer layer 112 is a thin film layer whose material is K 0.5 Na 0.5 NbO 3 /Bi 0.5 Na 0.5 TiO 3 (KNN/BNT, potassium sodium niobate/sodium bismuth titanate), LiNbO 3 (lithium niobate), one of Ba 0.5 Na 0.5 TiO 3 (BNT, sodium barium titanate), the first transducer layer 112 prepared from these materials will be very thin, usually only a few tens of microns thick, and Ultrasonic waves with extremely high frequency can be generated when vibrating, which can reach 100 MHz or more, so that the resolution of the ultrasonic transducer 100 can be improved compared with the prior art.
  • the first transducer layer 112 passes Made by sol-gel method.
  • the first transducer layer 112 may also be other materials that can be made into a piezoelectric thin film, or be prepared by other manufacturing processes, which is not limited herein.
  • the first matching layer 113 is smaller than the acoustic impedance of the first transducer layer 112, and because the frequency of the ultrasonic waves generated by the first transducer layer 112 in this embodiment is high, the thickness of the first matching layer 113 will be small.
  • the first matching layer 113 can be formed directly on the first transducer layer 112 through a process including but not limited to vacuum coating, or by using a type of curable adhesive such as epoxy resin. The separately prepared first matching layer 113 is adhered to the surface of the first transducer layer 112.
  • the first matching layer 113 includes a plurality of stacked sub-matching layers, and two layers of sub-matching layers 1131 and 1132 are schematically illustrated in FIG. 2.
  • the acoustic impedance of the multilayer sub-matching layer gradually decreases along the acoustic wave emission direction, that is, the acoustic impedance of the layer 1132 in FIG. 2 is smaller than the acoustic impedance of the layer 1131.
  • first matching layer 113 After the first backing layer 111, the first transducer layer 112, and the first matching layer 113 are combined, a process of photolithography, chemical etching, ion etching, or blade mechanical cutting is used to form the first matching layer 113
  • a plurality of first slits 114 extending to the first backing layer 111 form a plurality of independent first array elements 11.
  • a plurality of first slits 114 extend to the first backing layer 111, but do not penetrate the first backing layer 111.
  • the acoustic wave emission areas of the plurality of first array elements 11 are the same.
  • the second ultrasonic transducer array 20 includes a second backing layer 211 fixed on the substrate 30, a second transducer layer 212 covering the second backing layer 211, and a second transducer layer covering In the second matching layer 213 of 212, a plurality of second cutouts 214 extend from the second matching layer 213 to the second backing layer 211 to form a plurality of independent second array elements 21.
  • the manufacturing method of the second ultrasonic transducer array 20 is similar to that of the first ultrasonic transducer array 10, and will not be described in detail here.
  • the second backing layer 211, the second transducer layer 212, and the second matching layer 213 in the second ultrasonic transducer array 20 and the first backing layer 111, the first transducer in the first ultrasonic transducer array 10 The roles of the transducer layer 112 and the first matching layer 113 are the same, and the selection range of the material of each layer is roughly the same as the selection range of the material of each layer in the first ultrasonic transducer array 10. For details, please refer to the above, here No longer.
  • each layer of the second ultrasound transducer array 20 may be the same as or different from those of the first ultrasound transducer array 10, for example, when the first ultrasound transducer array 10 and the second ultrasound When the frequency of ultrasonic waves emitted by the transducer array 20 is different, the material properties and thickness of the first transducer layer 112 and the second transducer layer 212 may be different, so that the first backing layer 111 and the second backing layer 211 The material properties and thickness of the first and second matching layers 113 and 213 are different.
  • the plurality of second cutouts 214 may extend only from the second matching layer 213 to the second backing layer 211, or may extend from the second matching layer 213 and penetrate therethrough
  • the second backing layer 211 extends to the substrate 30, but cannot penetrate the substrate 30 at this time, wherein the material selection range filled by the second cutout 214 is substantially the same as the material selection range filled by the first cutout 114, here Without going into details, at the same time, the acoustic impedance of the material filled in the second cutout 214 is uniform or gradual along the sound wave emission direction.
  • the width of the second notch 214 is also between 10-100 microns.
  • the second backing layer 20 is a solid layer 20
  • the second cutout 214 is filled with a solid filler or a gaseous filler, that is, with the first ultrasonic transducer array 10
  • the material of the second backing layer 211 cannot be a gas.
  • the acoustic emission area of the plurality of second array elements 21 is the same, ensuring that the electrical impedance of the plurality of second array elements 21 is the same; the acoustic impedance of the second transducer layer 212 is greater than that of the second
  • the acoustic impedance of the matching layer 213, and the second matching layer 213 also includes a plurality of sub-matching layers.
  • two sub-matching layers 2131 and 2132 are used for illustration.
  • the acoustic impedance of the sub-matching layer gradually decreases along the acoustic emission direction Small, that is, the acoustic impedance of layer 2132 in FIG. 3 is smaller than the acoustic impedance of layer 2131.
  • the ultrasonic transducer 100 in the present application includes a phased array transducer array 10 arranged in a plane and a convex array transducer array 20 arranged in a curved surface, which can simultaneously detect defects on the plane and the curved surface and can detect Irregularly shaped workpieces can improve the detection sensitivity compared to the prior art.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

一种超声换能器（100），包括：第一超声换能器阵列（10），第一超声换能器阵列（10）为相控阵换能器阵列（10），其包括多个独立的第一阵元（11），多个独立的第一阵元（11）呈平面排布，用于检测平面；第二超声换能器阵列（20），第二超声换能器阵列（20）为凸阵换能器阵列（20），其包括多个独立的第二阵元（21），多个独立的第二阵元（21）呈曲面排布，用于检测曲面，通过超声换能器（100）能够检测不规则形状工件的缺陷，提高检测的灵敏度。

Description

超声换能器 【技术领域】
本申请涉及换能器技术领域，特别是涉及一种超声换能器。
【背景技术】
在超声无损检测技术方面，常用的检测超声探头频率较低，很多在10MHz以内，其中单探头占多数，部分探头为相控阵探头。常用的超声相控阵探头的设计基于惠更斯原理，探头存在着在方位方向上呈一维排列的阵元，每个阵元间相互独立，按照一定的电子延时对每个阵元进行激励，从而形成一个新的超声波阵面，通过施加不同的电子延时，会使得超声波束发生偏转，以满足各种检测需要。
本申请的发明人在长期的研究中发现，当待检测工件存在柱面孔洞并需要检测柱面附近的细微缺陷时，现有的探头频率不够高，且只能通过工件上其他表面使得超声波到达柱面附近，从而间接对柱面附近的缺陷进行探测，也就是说，现有的探头灵敏度不够高，且分辨率不够。
【发明内容】
有鉴于此，本申请提供一种超声换能器，能够检测不规则形状的工件，提供检测的灵敏度。
为解决上述技术问题，本申请采用的一个技术方案是：提供一种超声换能器，包括：
第一超声换能器阵列，所述第一超声换能器阵列为相控阵换能器阵列，其包括多个独立的第一阵元，多个所述独立的第一阵元呈平面排布，用于检测平面；
第二超声换能器阵列，所述第二超声换能器阵列为凸阵换能器阵列，其包括多个独立的第二阵元，多个所述独立的第二阵元呈曲面排布，用于检测曲面。
本申请的有益效果是：本申请中的超声换能器包括呈平面排布的相控阵换能器阵列以及曲面排布的凸阵换能器阵列，可以同时检测平面和曲面上的缺陷，能够检测形状不规则的工件，相比现有技术，能够提高检测的灵敏度。
【附图说明】
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。其中：
图1是本申请超声换能器一实施方式的结构示意图；
图2是图1中的超声换能器沿A-A方向的剖视图；
图3是图1中的超声换能器沿B-B方向的剖视图。
【具体实施方式】
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性的劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
参阅图1至图3，图1是本申请超声换能器一实施方式的结构示意图，图2是图1中的超声换能器沿A-A方向的剖视图，图3是图1中的超声换能器沿B-B方向的剖视图。该超声换能器100包括第一超声换能器阵列10以及第二超声换能器阵列20，第一超声换能器阵列10为相控阵换能器阵列10，第二超声换能器阵列20为凸阵换能器阵列20。
在现有技术中，相控阵换能器阵列10用在相控阵探头中，凸阵换能器阵列20用在凸阵探头中。
第一超声换能器阵列10用于检测平面，包括多个独立的第一阵元11，其中多个第一阵元11呈平面排布，其中第一阵元11的数量可以为多个，例如为5个、8个等；第二超声换能器阵列20用于检测曲面，包括多个独立的第二阵元21，多个独立的第二阵元21呈曲面排布，其中第二阵元21的数量也为多个，例如64个、128个、256个等，在本申请中对第一阵元11和第二阵元21的数量不做限制。
第一超声换能器阵列10和第二超声换能器阵列20的工作原理不同，第一超声换能器阵列10在工作时，按照一定的延时对每个第一阵元11施加独立的 激励信号；第二超声换能器阵列20在工作时，假设其包括128个第二阵元21，设1～8号第二阵元21为1号子阵，2～9号第二阵元为2号子阵，3～10号第二阵元为3号子阵……121～128号第二阵元为121号子阵，整个扫描周期的顺序是1号子阵发收超声波，2号子阵去完成发、收超声波的任务，接着是3号子阵进行发收超声波的工作，依序进行下去，直到121号子阵完成发收超声波任务后，即完成一个扫描周期。需要说明的是，第二超声换能器阵列20的扫描方式还可以是间隔扫描方式，在此不做限制。在现有技术中，凸阵换能器阵列20一般用于医疗器械上，其能够对人体组织进行成像，人体组织柔软，检查设备在检查时与人体接触后，人体组织会产生形变，此时人体组织可视为曲面，同时凸阵换能器阵列20产生的波阵面也为曲面，也就是说，凸阵换能器阵列20对曲面检测的效果良好。
因此在本实施方式中，将超声换能器100设置为包括用于检测平面的相控阵换能器阵列10和用于检测曲面的凸阵换能器阵列20，当待检测工件的形状不规则，例如待检测工件既包括平面，也包括曲面时，第一超声换能器阵列10可以检测该工件上的平面部分，第二超声换能器阵列20可以检测该工件上的曲面部分，也就是说，相比现有技术，采用本申请中的超声换能器100可以直接检测工件上的曲面，而不用采用间接检测的方法，因此能够提高检测的灵敏度。
继续参阅图1，多个独立的第一阵元11排布成圆面12，多个第二阵元21排布而成的曲面22围绕圆面12的圆周且向垂直圆面12的一侧方向延伸，即曲面22自圆面12的侧壁垂直而立。
具体地，第一超声换能器阵列10和第二超声换能器阵列20组成的超声换能器100呈柱形。当待检测工件上存在柱面孔洞时，该换能器100可以深入该柱面孔洞内进行检测，其中第一超声换能器阵列10可以检测该柱面孔洞底面的缺陷，第二超声换能器阵列20可以检测该柱面孔洞柱面的缺陷。
其中，多个第二阵元21排布而成的曲面22包围圆面12的圆周，从而在检测工件上的柱面孔洞时，第二超声换能器阵列20可以一次性对柱面孔洞的整个柱面进行检测。当然在其他实施方式中，多个第二阵元21形成的曲面22也可以部分包围多个第一阵元11形成的圆面12，此时在检测柱面孔洞时，可以通过旋转超声换能器100的方式完成对柱面孔洞内整个柱面的检测。
其中，多个第一阵元21按照同心圆呈环形分布，多个第二阵元22并列且沿远离圆面12的方向延伸，即多个第二阵元22的延伸方向与圆面12垂直。当 然在其他实施方式中，多个第一阵元11也可以并列沿圆面12的直径方向设置，多个第二阵元22也可以并列沿圆周方向设置，即单个第二阵元21为一个环形，本申请中对于第一阵元11、第二阵元22的相对排布方式不做限制。
继续参阅图1，超声换能器100还包括衬底30，衬底30围绕圆面12的圆周且向垂直圆面12的一侧方向延伸，其中第二超声换能器阵列20固定在衬底上30上，即，通过衬底30固定、支撑第一超声换能器阵列10以及第二超声换能器阵列20。
其中，衬底30的材料可以是单一材料，也可以是复合材料。具体地，其材料可以是金属、聚酰亚胺等具有较好柔性的材料，也可以是固化后有较好柔韧性的环氧树脂。在一应用场景中，可在衬底30上制作与第一超声换能器阵列10和第二超声换能器阵列20电连接的地线。
参阅图2，第一超声换能器阵列11包括第一背衬层111、覆盖第一背衬层111的第一换能器层112以及覆盖第一换能器层112的第一匹配层113，同时多个第一切口114自第一匹配层113延伸至第一背衬层111而形成多个独立的第一阵元11。
在制备时，可以通过灌注的方式让可流动、可固化的背衬层材料与第一换能器层112结合，或者预先制作好第一背衬层111后通过粘合剂粘合到第一换能器层112上。第一背衬层111声阻抗均匀或沿声波发射方向渐变。
其中，第一背衬层111为固体层111，多个第一切口114内填充有固态填充物或气态填充物，或，第一背衬层111为气体层111，多个第一切口114内填充有固态填充物。
具体地，第一背衬层111的材料为单一材料或复合材料，单一材料包括但不限于金属、环氧树脂、氧化锆、氧化铝等，复合材料包括悬浮在环氧树脂或者其他可流动、可固化液态物质中的微球，该微球的材质可以是金属、二氧化硅、氧化铝、氧化锆、橡胶或其他材质，该微球可以是包括围绕或封装气体(空气或烃气等气体)的空心固体微球，也可以是实心固体微球，该微球可以以不同的比例与环氧树脂或聚合物混合，从而获得具有不同稠度和密度的复合材料。多个第一切口114内填充的材料可以是单一材料，也可以是复合材料，单一材料包括但不限于环氧树脂、硅橡胶等可固化的填充物质，复合材料包括悬浮在环氧树脂或者其他可流动、可固化液态物质中的微球，该微球的材质可以是金属、二氧化硅、氧化铝、氧化锆、橡胶或其他材质，该微球可以是包括围绕或 封装气体(空气或烃气等气体)的空心固体微球，也可以是实心固体微球，该微球可以以不同的比例与环氧树脂或聚合物混合，从而获得具有不同稠度和密度的复合材料。其中多个第一切口114内还可以填充有气态填充物，此时填充的气态填充物可以是一种气体，也可以是混合型气体。值得注意的是，当第一背衬层111为气体层111，此时为了固定住多个第一阵元11，多个第一切口114必须内填充有固态填充物。
其中多个第一切口114的宽度大致相同，其宽度在10-100μm之间，且多个第一切口114内的填充物声阻抗均匀或沿声波发射方向渐变。
第一换能器层112包括一个或多个配置为以中心操作频率(百兆赫兹或以上)发射超声波能量的换能器元件。在一应用场景中，第一换能器层112为薄膜层，其材料为K 0.5Na 0.5NbO 3/Bi 0.5Na 0.5TiO 3(KNN/BNT，铌酸钾钠/钛酸铋钠)、LiNbO 3(铌酸锂)、Ba 0.5Na 0.5TiO 3(BNT，钛酸钡钠)中的一种，通过这些材料制备的第一换能器层112会很薄，通常厚度只有几十微米，且在振动时能够产生频率极高的超声波，能够达到百兆赫兹或以上，从而相比现有技术能够提高超声换能器100的分辨率，在一应用场景中，第一换能器层112通过采用溶胶-凝胶法制作而成。当然在其他应用场景中，第一换能器层112还可以是其他可以制成压电薄膜的材料，或者采用其他制备工艺制备，在此不做限制。
第一匹配层113小于第一换能器层112的声阻抗，同时由于本实施方式中第一换能器层112产生的超声波频率很高，第一匹配层113的厚度会很小。在一应用场景中，可以通过包括但不限于真空镀膜的工艺直接在第一换能器层112上形成第一匹配层113，或者是通过使用环氧树脂等类型的可固化的粘合剂将单独制备好的第一匹配层113粘接到第一换能器层112的表面上。
在一应用场景中，第一匹配层113包括多个层叠设置的子匹配层，图2中以两层子匹配层1131、1132进行示意说明。其中，沿声波发射方向，多层子匹配层的声阻抗逐渐减小，即图2中层1132的声阻抗小于层1131的声阻抗。
在第一背衬层111、第一换能器层112以及第一匹配层113结合完毕后，采用光刻、化学刻蚀、离子刻蚀、或刀片机械切割的工艺形成自第一匹配层113延伸至第一背衬层111的多个第一切口114而形成多个独立的第一阵元11。在一应用场景中，多个第一切口114延伸至第一背衬层111，但不贯穿第一背衬层111。
其中，为保证多个第一阵元11的电阻抗相当，多个第一阵元11的声波发 射面积相同。
参阅图3，第二超声换能器阵列20包括固定在衬底30上的第二背衬层211、覆盖第二背衬层211的第二换能器层212以及覆盖第二换能器层212的第二匹配层213，同时多个第二切口214自第二匹配层213延伸至第二背衬层211而形成多个独立的第二阵元21。
第二超声换能器阵列20与第一超声换能器阵列10的制备方法类似，在此不再详述。其中第二超声换能器阵列20中第二背衬层211、第二换能器层212以及第二匹配层213与第一超声换能器阵列10中第一背衬层111、第一换能器层112以及第一匹配层113的作用对应相同，且每层材料的选择范围与第一超声换能器阵列10中每层材料选择的范围大致对应相同，详见可参见上述，在此不再赘述。其中第二超声换能器阵列20各层的属性、厚度与第一超声换能器阵列10各层的属性、厚度可以相同也可以不同，例如当第一超声换能器阵列10和第二超声换能器阵列20发射超声波的频率不同时，第一换能器层112和第二换能器层212的材料属性、厚度可能不一样，从而第一背衬层111和第二背衬层211的材料属性、厚度不一样，第一匹配层113和第二匹配层213的材料属性、厚度不一样。
值得注意的是，在第二超声换能器阵列20中，多个第二切口214可以自第二匹配层213只延伸至第二背衬层211，也可以自第二匹配层213延伸并贯穿第二背衬层211，从而延伸至衬底30，但此时不能贯穿衬底30，其中第二切口214填充的材料选择范围与第一切口114中填充的材料选择范围大致相同，在此不在赘述，同时第二切口214填充的材料的声阻抗均匀或沿声波发射方向渐变。其中第二切口214的宽度也在10-100微米之间。
同时在第二超声换能器阵列20中，第二背衬层20为固体层20，第二切口214被填充有固态填充物或气态填充物，也就是说，与第一超声换能器阵列10不同的是，第二背衬层211的材料不能为气体。
与第一超声换能器阵列10一样，多个第二阵元21的声波发射面积相同，保证多个第二阵元21的电阻抗相同；第二换能器层212的声阻抗大于第二匹配层213的声阻抗，同时第二匹配层213也包括多个子匹配层，图3中以2层子匹配层2131、2132进行示意说明，同时沿声波发射方向，子匹配层的声阻抗逐渐减小，即图3中层2132的声阻抗小于层2131的声阻抗。
总而言之，本申请中的超声换能器100包括呈平面排布的相控阵换能器阵 列10以及曲面排布的凸阵换能器阵列20，可以同时检测平面和曲面上的缺陷，能够检测形状不规则的工件，相比现有技术，能够提高检测的灵敏度。
以上所述仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (10)

  1. 一种超声换能器，其特征在于，包括：
    第一超声换能器阵列，所述第一超声换能器阵列为相控阵换能器阵列，其包括多个独立的第一阵元，多个所述独立的第一阵元呈平面排布，用于检测平面；
    第二超声换能器阵列，所述第二超声换能器阵列为凸阵换能器阵列，其包括多个独立的第二阵元，多个所述独立的第二阵元呈曲面排布，用于检测曲面。
  2. 根据权利要求1所述的超声换能器，其特征在于，
    多个所述独立的第一阵元排布成圆面，多个所述第二阵元排布而成的所述曲面围绕所述圆面的圆周且向垂直所述圆面的一侧方向延伸。
  3. 根据权利要求2所述的超声换能器，其特征在于，
    多个所述第二阵元排布而成的所述曲面包围所述圆面的圆周，同时多个所述第一阵元按照同心圆呈环形分布，多个所述第二阵元并列且沿远离所述圆面的方向延伸。
  4. 根据权利要求2所述的超声换能器，其特征在于，
    所述超声换能器包括：衬底，所述衬底围绕所述圆面的圆周且向垂直所述圆面的一侧方向延伸，其中，所述第二超声换能器阵列固定在所述衬底上；
    所述第一超声换能器阵列包括第一背衬层、覆盖所述第一背衬层的第一换能器层以及覆盖所述第一换能器层的第一匹配层，同时多个第一切口自所述第一匹配层延伸至所述第一背衬层而形成多个所述独立的第一阵元；
    所述第二超声换能器阵列包括固定在所述衬底上的第二背衬层、覆盖所述第二背衬层的第二换能器层以及覆盖所述第二换能器层的第二匹配层，同时多个第二切口自所述第二匹配层延伸至所述第二背衬层而形成多个所述独立的第二阵元。
  5. 根据权利要求4所述的超声换能器，其特征在于，
    所述第一换能器层的声阻抗大于所述第一匹配层的声阻抗，所述第二换能器层的声阻抗大于所述第二匹配层的声阻抗，同时所述第一匹配层/第二匹配层包括层叠设置的多层子匹配层，且沿声波发射的方向，多层子匹配层的声阻抗逐渐减小。
  6. 根据权利要求4所述的超声换能器，其特征在于，
    多个所述第一切口不贯穿所述第一背衬层，多个所述第二切口贯穿所述第二背衬层且延伸至所述衬底，但多个所述第二切口不贯穿所述衬底。
  7. 根据权利要求4所述的超声换能器，其特征在于，
    所述第一背衬层为固体层，多个所述第一切口内填充有固态填充物或气态填充物，或，所述第一背衬层为气体层，多个所述第一切口内填充有固态填充物；
    所述第二背衬层为固体层，所述第二切口被填充有固态填充物或气态填充物。
  8. 根据权利要求4所述的超声换能器，其特征在于，所述第一换能器层/第二换能器层的材料为铌酸钾钠/钛酸铋钠、铌酸锂、钛酸钡钠中的一种。
  9. 根据权利要求4所述的超声换能器，其特征在于，所述第一换能器层/第二换能器层通过采用溶胶-凝胶法制作而成。
  10. 根据权利要求的1所述的超声换能器，其特征在于，
    多个所述第一阵元的声波发射面积相同，多个所述第二阵元的声波发射面积相同。
PCT/CN2018/119637 2018-12-06 2018-12-06 超声换能器 Ceased WO2020113535A1 (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4552021A (en) * 1982-12-30 1985-11-12 Fujitsu Limited Electro-sound transducer eliminating acoustic multi-reflection, and ultrasonic diagnostic apparatus applying it
US20130043768A1 (en) * 2009-09-21 2013-02-21 University Of Birmingham Ultrasound transducer array
CN105105791A (zh) * 2015-09-02 2015-12-02 上海爱声生物医疗科技有限公司 一种血管内超声聚焦方法、聚焦诊断仪及聚焦换能器
CN106823164A (zh) * 2017-03-21 2017-06-13 南京广慈医疗科技有限公司 一种带直线移动成像探头的双曲面条状功率超声装置
CN106964083A (zh) * 2017-03-21 2017-07-21 南京广慈医疗科技有限公司 一种带中心旋转成像探头的双曲面条状功率超声装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4552021A (en) * 1982-12-30 1985-11-12 Fujitsu Limited Electro-sound transducer eliminating acoustic multi-reflection, and ultrasonic diagnostic apparatus applying it
US20130043768A1 (en) * 2009-09-21 2013-02-21 University Of Birmingham Ultrasound transducer array
CN105105791A (zh) * 2015-09-02 2015-12-02 上海爱声生物医疗科技有限公司 一种血管内超声聚焦方法、聚焦诊断仪及聚焦换能器
CN106823164A (zh) * 2017-03-21 2017-06-13 南京广慈医疗科技有限公司 一种带直线移动成像探头的双曲面条状功率超声装置
CN106964083A (zh) * 2017-03-21 2017-07-21 南京广慈医疗科技有限公司 一种带中心旋转成像探头的双曲面条状功率超声装置

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