WO2020109361A3 - Gaseinlassvorrichtung für einen cvd-reaktor - Google Patents
Gaseinlassvorrichtung für einen cvd-reaktor Download PDFInfo
- Publication number
- WO2020109361A3 WO2020109361A3 PCT/EP2019/082679 EP2019082679W WO2020109361A3 WO 2020109361 A3 WO2020109361 A3 WO 2020109361A3 EP 2019082679 W EP2019082679 W EP 2019082679W WO 2020109361 A3 WO2020109361 A3 WO 2020109361A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- gas
- gas distribution
- gas inlet
- inlet device
- cvd reactor
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/4558—Perforated rings
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45502—Flow conditions in reaction chamber
- C23C16/45508—Radial flow
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45574—Nozzles for more than one gas
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201980089790.6A CN113330142A (zh) | 2018-11-28 | 2019-11-27 | 用于cvd-反应器的进气设备 |
JP2021530047A JP7461351B2 (ja) | 2018-11-28 | 2019-11-27 | Cvdリアクタ用のガス入口装置 |
KR1020217019341A KR20210094019A (ko) | 2018-11-28 | 2019-11-27 | Cvd-반응기용 가스 유입 장치 |
EP19816554.0A EP3887569A2 (de) | 2018-11-28 | 2019-11-27 | Gaseinlassvorrichtung für einen cvd-reaktor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102018130139.1A DE102018130139A1 (de) | 2018-11-28 | 2018-11-28 | Gaseinlassvorrichtung für einen CVD-Reaktor |
DE102018130139.1 | 2018-11-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2020109361A2 WO2020109361A2 (de) | 2020-06-04 |
WO2020109361A3 true WO2020109361A3 (de) | 2020-09-03 |
Family
ID=68808294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2019/082679 WO2020109361A2 (de) | 2018-11-28 | 2019-11-27 | Gaseinlassvorrichtung für einen cvd-reaktor |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP3887569A2 (de) |
JP (1) | JP7461351B2 (de) |
KR (1) | KR20210094019A (de) |
CN (1) | CN113330142A (de) |
DE (1) | DE102018130139A1 (de) |
TW (1) | TW202035777A (de) |
WO (1) | WO2020109361A2 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019133023A1 (de) * | 2019-12-04 | 2021-06-10 | Aixtron Se | Gaseinlassvorrichtung für einen CVD-Reaktor |
DE102021103245A1 (de) * | 2021-02-11 | 2022-08-11 | Aixtron Se | CVD-Reaktor mit einem in einer Vorlaufzone ansteigenden Prozesskammerboden |
DE102021103368A1 (de) | 2021-02-12 | 2022-08-18 | Aixtron Se | CVD-Reaktor mit einem ein Gaseinlassorgan umgebenden Temperrierring |
CN115852343A (zh) * | 2021-11-24 | 2023-03-28 | 无锡先为科技有限公司 | 一种进气分配机构及具有其的cvd反应设备 |
CN114318300B (zh) * | 2021-12-30 | 2024-05-10 | 拓荆科技股份有限公司 | 一种半导体加工设备及其反应腔室、工艺管路穿腔模块 |
CN117418218A (zh) * | 2023-12-19 | 2024-01-19 | 北京北方华创微电子装备有限公司 | 进气组件、进气装置及半导体工艺腔室 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5851294A (en) * | 1995-10-23 | 1998-12-22 | Watkins-Johnson Company | Gas injection system for semiconductor processing |
DE102008055582A1 (de) * | 2008-12-23 | 2010-06-24 | Aixtron Ag | MOCVD-Reaktor mit zylindrischem Gaseinlassorgan |
EP2215282A2 (de) * | 2007-10-11 | 2010-08-11 | Valence Process Equipment, Inc. | Cvd-reaktor |
DE102014104218A1 (de) * | 2014-03-26 | 2015-10-01 | Aixtron Se | CVD-Reaktor mit Vorlaufzonen-Temperaturregelung |
DE202017002851U1 (de) * | 2017-05-30 | 2017-06-27 | WERRTA GmbH i. G. | Düsenkörper, insbesondere für Sprühköpfe von Sprühdosen |
DE202017005165U1 (de) * | 2017-10-06 | 2017-10-18 | WERRTA GmbH Düsen- und Zerstäubungstechnik | Düsenkörper |
DE102017100725A1 (de) * | 2016-09-09 | 2018-03-15 | Aixtron Se | CVD-Reaktor und Verfahren zum Reinigen eines CVD-Reaktors |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10029110B4 (de) | 1999-06-15 | 2006-05-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren für die Materialbearbeitung und Verwendung desselben |
US6793966B2 (en) * | 2001-09-10 | 2004-09-21 | Howmet Research Corporation | Chemical vapor deposition apparatus and method |
DE10247921A1 (de) * | 2002-10-10 | 2004-04-22 | Aixtron Ag | Hydrid VPE Reaktor |
KR101004822B1 (ko) * | 2008-04-18 | 2010-12-28 | 삼성엘이디 주식회사 | 화학 기상 증착 장치 |
CN102776489B (zh) * | 2011-05-09 | 2014-08-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 进气环、进气组件、工艺腔装置和cvd设备 |
DE102011056589A1 (de) * | 2011-07-12 | 2013-01-17 | Aixtron Se | Gaseinlassorgan eines CVD-Reaktors |
DE102013014069B3 (de) | 2013-08-22 | 2014-08-21 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Laserbearbeitung eines Werkstücks mit polierter Oberfläche und Verwendung dieses Verfahrens |
CN105331953B (zh) * | 2014-07-23 | 2019-04-23 | 北京北方华创微电子装备有限公司 | 进气装置以及半导体加工设备 |
CN106894001B (zh) * | 2015-12-17 | 2019-04-12 | 杨永亮 | 复合式匀气装置 |
EP3315207B1 (de) * | 2016-10-25 | 2019-10-02 | WERRTA GmbH | Sprühkopf und verfahren zu dessen herstellung |
DE102018202687A1 (de) | 2018-02-22 | 2018-05-03 | Carl Zeiss Smt Gmbh | Herstellungsverfahren für Komponenten einer Projektionsbelichtungsanlage für die Halbleiterlithographie und Projektionsbelichtungsanlage |
-
2018
- 2018-11-28 DE DE102018130139.1A patent/DE102018130139A1/de active Pending
-
2019
- 2019-11-27 KR KR1020217019341A patent/KR20210094019A/ko active Search and Examination
- 2019-11-27 CN CN201980089790.6A patent/CN113330142A/zh active Pending
- 2019-11-27 JP JP2021530047A patent/JP7461351B2/ja active Active
- 2019-11-27 EP EP19816554.0A patent/EP3887569A2/de active Pending
- 2019-11-27 WO PCT/EP2019/082679 patent/WO2020109361A2/de unknown
- 2019-11-28 TW TW108143461A patent/TW202035777A/zh unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5851294A (en) * | 1995-10-23 | 1998-12-22 | Watkins-Johnson Company | Gas injection system for semiconductor processing |
EP2215282A2 (de) * | 2007-10-11 | 2010-08-11 | Valence Process Equipment, Inc. | Cvd-reaktor |
DE102008055582A1 (de) * | 2008-12-23 | 2010-06-24 | Aixtron Ag | MOCVD-Reaktor mit zylindrischem Gaseinlassorgan |
DE102014104218A1 (de) * | 2014-03-26 | 2015-10-01 | Aixtron Se | CVD-Reaktor mit Vorlaufzonen-Temperaturregelung |
DE102017100725A1 (de) * | 2016-09-09 | 2018-03-15 | Aixtron Se | CVD-Reaktor und Verfahren zum Reinigen eines CVD-Reaktors |
DE202017002851U1 (de) * | 2017-05-30 | 2017-06-27 | WERRTA GmbH i. G. | Düsenkörper, insbesondere für Sprühköpfe von Sprühdosen |
DE202017005165U1 (de) * | 2017-10-06 | 2017-10-18 | WERRTA GmbH Düsen- und Zerstäubungstechnik | Düsenkörper |
Non-Patent Citations (2)
Title |
---|
JENS GOTTMANN ET AL: "Selective Laser-Induced Etching of 3D Precision Quartz Glass Components for Microfluidic Applications-Up-Scaling of Complexity and Speed", MICROMACHINES, vol. 8, no. 4, 1 April 2017 (2017-04-01), pages 110, XP055631473, DOI: 10.3390/mi8040110 * |
MARTIN HERMANS ET AL: "Selective, Laser-Induced Etching of Fused Silica at High Scan-Speeds Using KOH", JOURNAL OF LASER MICRO/NANOENGINEERING, vol. 9, no. 2, 1 June 2014 (2014-06-01), pages 126 - 131, XP055674997, DOI: 10.2961/jlmn.2014.02.0009 * |
Also Published As
Publication number | Publication date |
---|---|
CN113330142A (zh) | 2021-08-31 |
JP7461351B2 (ja) | 2024-04-03 |
TW202035777A (zh) | 2020-10-01 |
WO2020109361A2 (de) | 2020-06-04 |
KR20210094019A (ko) | 2021-07-28 |
DE102018130139A1 (de) | 2020-05-28 |
EP3887569A2 (de) | 2021-10-06 |
JP2022510900A (ja) | 2022-01-28 |
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