WO2020107787A1 - 网孔的制作方法 - Google Patents

网孔的制作方法 Download PDF

Info

Publication number
WO2020107787A1
WO2020107787A1 PCT/CN2019/084084 CN2019084084W WO2020107787A1 WO 2020107787 A1 WO2020107787 A1 WO 2020107787A1 CN 2019084084 W CN2019084084 W CN 2019084084W WO 2020107787 A1 WO2020107787 A1 WO 2020107787A1
Authority
WO
WIPO (PCT)
Prior art keywords
manufacturing
magnet
mesh
parts
portions
Prior art date
Application number
PCT/CN2019/084084
Other languages
English (en)
French (fr)
Inventor
张桂洋
Original Assignee
武汉华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电技术有限公司 filed Critical 武汉华星光电技术有限公司
Priority to US16/620,898 priority Critical patent/US11444064B2/en
Publication of WO2020107787A1 publication Critical patent/WO2020107787A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Definitions

  • the invention relates to the technical field of display technology, in particular to a method for manufacturing a mesh.
  • Thin film transistor is the current liquid crystal display (Liquid Crystal Display, LCD) and active matrix driven organic electroluminescence display device (Active Matrix Organic Light-Emitting The main driving element in Diode, AMOLED) is directly related to the display performance of the flat panel display device.
  • liquid crystal displays which include a liquid crystal display panel and a backlight module.
  • the working principle of the liquid crystal display panel is based on the thin film transistor array substrate (Thin Film Transistor Array Substrate, TFT Array Substrate) and the color filter (Color Filter, CF) liquid crystal molecules are poured in between the substrates, and pixel voltage and common voltage are applied to the two substrates respectively.
  • the electric field formed between the pixel voltage and the common voltage controls the rotation direction of the liquid crystal molecules to change the backlight module’s
  • the light is transmitted out to produce the picture.
  • the backlight module of the prior art is an edge-lit backlight module.
  • the linear light source emitted by the lateral LED is converted into a surface light source through the light guide plate and the dots in the light guide plate, and the light is uniformed and brightened by the upper film layer.
  • a color display is formed through the polarizer, liquid crystal layer and color filter.
  • the light coupling efficiency of the light guide plate is about 60%
  • the transmittance of the upper film layer plus the polarizer is about 40%
  • the color filter The transmittance of the film is about 30%.
  • the total light transmittance is about 7.2%.
  • most liquid crystal displays based on the side-entry backlight module cannot even achieve this value.
  • AMOLED uses light-emitting small molecules to display under the excitation of current. Due to the limitations of material characteristics, its brightness and reliability need to be improved. Traditional inorganic LED displays use large-sized LEDs for display. Due to the resolution limitation, most of them are used. To make a billboard
  • mini-LED and micro-LED displays have recently been proposed.
  • the size of the LED in the mini-LED is hundreds of microns, which is used to make direct-lit backlight.
  • the size of the LED in the micro-LED is tens of microns, which is directly used as the display pixel.
  • each display panel requires tens of thousands or even millions of LEDs, which is affected by current technology and equipment Due to technological limitations, the micro-LED display needs to be further developed, but the mini-LED display can directly use traditional technology and process equipment for large-scale production, and has been tried on products such as vehicles.
  • the purpose of the present invention is to provide a method for manufacturing a mesh, which can dynamically adjust the position of the opening area, improve the applicability of the mesh, and greatly reduce the production cost.
  • the present invention provides a method for manufacturing a mesh, including the following steps:
  • Step S1 providing a plurality of first parts extending parallel to each other in the horizontal direction and a plurality of second parts extending parallel to each other in the vertical direction; the materials of the first and second parts are magnets and magnetic materials, respectively kind of
  • Step S2 Adjust the positions of the plurality of first portions and the plurality of second portions according to the positions of the preset opening areas so as to interlace to form a plurality of opening areas.
  • the first part and the second part are fixedly connected by an attractive force between the magnet and the magnetic material or the magnet and the magnet.
  • step S2 an electromagnetic induction device connected to at least one of the first part and the second part is provided, through the electromagnetic induction device At least one of the first part and the second part is magnetically generated to fixedly connect the first part and the second part.
  • the electromagnetic induction device is an electromagnetic induction coil.
  • a frame is provided, and the first part and the second part are both located in the frame and slidingly connected to the frame, and the first part and the second part slide on the frame to adjust the first part and the The location of the second part.
  • the first part and the second part are fixedly connected by an attractive force between the magnet and the magnetic material or the magnet and the magnet.
  • the frame When the materials of the first part and the second part are both magnetic materials, the frame generates electromagnetic induction to cause the first part and the second part to generate magnetic force to fixedly connect the first part and the second part.
  • the second part is located above the first part, and the second part is provided with a groove at an overlapping position of the second part and the first part so that the bottom surfaces of the second part and the first part are located same plane.
  • the thickness of the second portion is greater than the thickness of the first portion.
  • the shapes of the first part and the second part are one of a long bar, a zigzag, a wave, and a square wave; the shape of the opening area is one of a rectangle, a diamond, and a circle.
  • the method for manufacturing a mesh of the present invention includes a plurality of first parts extending parallel to each other in the horizontal direction and a plurality of second parts extending parallel to each other in the vertical direction;
  • the materials of the two parts are one of a magnet and a magnetic material, respectively, and the positions of the plurality of first parts and the plurality of second parts are adjusted according to the position of the preset opening area to form a plurality of opening areas interlaced with each other to achieve dynamic Adjust the position of the opening area to achieve a mesh corresponding to multiple LED arrangements, that is, the mesh and LED arrangement is a "one-to-many" relationship, improve the applicability of the mesh, greatly reduce production costs, and make There is no waste and waste gas in the process, and it has the characteristics of energy saving and environmental protection.
  • FIG. 2 is a schematic diagram of a first embodiment of a method for manufacturing a mesh of the present invention
  • FIG. 3 is a schematic diagram of a second embodiment of the method for manufacturing a mesh of the present invention.
  • FIG. 4 is a schematic diagram of a third embodiment of the method for manufacturing a mesh of the present invention.
  • FIG 5 is a schematic view of the second part overlapping with the first part in the method for manufacturing a mesh of the present invention.
  • the present invention provides a method for manufacturing a mesh, including the following steps:
  • Step S1 Provide a plurality of first portions 10 extending in the horizontal direction and parallel to each other and a plurality of second portions 20 extending in the vertical direction and parallel to each other; the materials of the first portion 10 and the second portion 20 are magnets And one of the magnetic materials;
  • Step S2 Adjust the positions of the plurality of first portions 10 and the plurality of second portions 20 according to the preset positions of the opening areas so as to form a plurality of opening areas 30 alternately with each other.
  • the present invention by providing a plurality of first portions 10 and a plurality of second portions 20 of one of the magnet and the magnetic material, a plurality of first portions 10 and a plurality of second portions 20
  • the position of the mesh realizes that a mesh corresponds to a variety of LED arrangements, that is, the mesh and LED arrangement are in a "one-to-many" relationship, improving the applicability of the mesh and greatly reducing production costs.
  • the manufacturing method of the mesh of the present invention has no waste materials and waste gas, and has the characteristics of energy saving and environmental protection.
  • the mesh array of the present invention is aligned with the driving substrate, and then a solder paste coating and solid crystal process are used to manufacture the LED array.
  • the magnetic material is one or a combination of iron, cobalt, nickel, ferrite, neodymium iron boron, silicon steel, and chromium steel; the magnet is a permanent magnet.
  • step S2 when at least one of the first portion 10 and the second portion 20 is a magnet, in step S2, by The attractive force between the magnet and the magnetic material or the magnet and the magnet fixedly connects the first portion 10 and the second portion 20.
  • the step S2 provides An electromagnetic induction device 40 connected to at least one of the first part 10 and the second part 20, and at least one of the first part 10 and the second part 20 generates a magnetic force through the electromagnetic induction device 40 to fix the connection The first part 10 and the second part 20.
  • the electromagnetic induction device 40 is an electromagnetic induction coil, of course, it may be other devices that can generate electromagnetic induction, and the invention is not limited herein.
  • a frame 50 is provided, and the first portion 10 and the second portion 20 are both located in the frame 50 And slidingly connected with the frame 50, the first portion 10 and the second portion 20 slide on the frame 50 to adjust the position of the first portion 10 and the second portion 20.
  • the first part 10 and the second part 20 are fixedly connected by the attractive force between the magnet and the magnetic material or the magnet and the magnet .
  • the frame 50 when the materials of the first portion 10 and the second portion 20 are both magnetic materials, the frame 50 generates electromagnetic induction to cause the first portion 10 and the second portion 20 to generate magnetic force to fixedly connect the The first part 10 and the second part 20.
  • the second portion 20 is located above the first portion 10, and the second portion 20 is provided with a recess at the overlapping position of the second portion 20 and the first portion 10
  • the groove 21 is such that the bottom surfaces of the second portion 20 and the first portion 10 are on the same plane.
  • the thickness of the second portion 20 is greater than the thickness of the first portion 10.
  • the shapes of the first portion 10 and the second portion 20 are one of a long shape, a sawtooth shape, a wave shape, and a square wave shape.
  • the shape of the opening area 30 is one of a rectangle, a diamond, and a circle by combining the shapes of the first portion 10 and the second portion 20.
  • the shapes of the first portion 10, the second portion 20, and the opening area 30 can be adjusted according to actual needs, and the invention is not limited herein.
  • the manufacturing method of the mesh of the present invention includes a plurality of first parts extending in the horizontal direction and parallel to each other and a plurality of second parts extending in the vertical direction and parallel to each other; the first part and the second part
  • the material of the part is one of a magnet and a magnetic material, and the positions of the plurality of first parts and the plurality of second parts are adjusted according to the position of the preset opening area to form a plurality of opening areas interlaced with each other to achieve dynamic adjustment
  • the position of the opening area realizes that a mesh corresponds to a variety of LED arrangements, that is, the mesh and LED arrangement is a "one-to-many" relationship, improving the applicability of the mesh, greatly reducing production costs, and the manufacturing process No waste and waste gas are produced, and it has the characteristics of energy saving and environmental protection.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

一种网孔的制作方法，该网孔的制作方法通过沿水平方向延伸且相互平行的多个第一部（10）以及沿垂直方向延伸且相互平行的多个第二部（20）；所述第一部（10）与第二部（20）的材料分别为磁体和磁性材料中的一种（S1），根据预设的开口区的位置调节所述多个第一部（10）与多个第二部（20）的位置以相互交错形成多个开口区（30）（S2），实现动态调节开口区的位置，实现一张网孔对应多种LED排列方式，即网孔与LED排列方式是"一对多"的关系，提高网孔的适用性，极大的降低生产成本，并且制作过程无废料和废气产生，具有节能环保的特性。

Description

网孔的制作方法 技术领域
本发明涉及显示技术制程领域，尤其涉及一种网孔的制作方法。
 背景技术
薄膜晶体管（Thin Film Transistor，TFT）是目前液晶显示装置（Liquid Crystal Display，LCD）和有源矩阵驱动式有机电致发光显示装置（Active Matrix Organic Light-Emitting Diode，AMOLED）中的主要驱动元件，直接关系平板显示装置的显示性能。
现有市场上的液晶显示器大部分为背光型液晶显示器，其包括液晶显示面板及背光模组（backlight module）。液晶显示面板的工作原理是在薄膜晶体管阵列基板（Thin Film Transistor Array Substrate，TFT Array Substrate）与彩色滤光片（Color Filter，CF）基板之间灌入液晶分子，并在两片基板上分别施加像素电压和公共电压，通过像素电压和公共电压之间形成的电场控制液晶分子的旋转方向，以将背光模组的光线透射出来产生画面。
现有技术的背光模组多数情况下是侧入式背光模组，侧向的LED发出的线光源通过导光板以及导光板中的网点被转化成面光源，经上层膜层匀光及增亮处理后，再通过偏光片、液晶层和彩色滤光片形成彩色显示，其中导光板的光耦合效率约为60%，上层膜层加上偏光片的透过率约为40%，彩色滤光片的透过率约为30%。将三者叠加，总的光透过率约为7.2%，当前多数基于侧入式背光模组的液晶显示器，其透过率甚至达不到这个数值。这就会给显示设备带来一系列的问题，如续航能力差、电池老化快、充电时间长及难以做轻做薄等问题。AMOLED使用发光小分子在电流的激发下进行显示，受材料特性限制，其亮度及可靠性等方面有待提升，而传统的无机LED显示是采用大尺寸的LED进行显示，受分辨率限制，大多用来制作广告牌
为解决液晶显示和LED显示面临的困境，最近提出了mini-LED和micro-LED显示的概念。mini-LED中的LED尺寸为上百微米，用来制作直下式背光。micro-LED中的LED尺寸为几十微米，直接用作显示像素，通过搭配驱动矩阵进行逐颗LED驱动显示，每块显示面板上都需要几万甚至上百万颗LED，受当前技术、设备和工艺限制，micro-LED显示还需要进一步开发，但mini-LED显示可以直接利用传统的技术和工艺设备，进行大规模生产，目前已在车载等产品上试用。目前的mini-LED和micro-LED都要将LED固定至导电基板上，这就需要开模制作网孔，利用网孔将锡膏均匀涂布到对应的开窗区，用以连接LED与底层电极以及固定LED，通常网孔的开模成本是比较昂贵、耗时的，每种LED排列方式对应一张网孔设计，二者是“一对一”的关系，且一旦开模完成后就无法更改设计，适用性低。
 技术问题
本发明的目的在于提供一种网孔的制作方法，可以动态调节开口区的位置，提高网孔的适用性，极大的降低生产成本。
 技术解决方案
为实现上述目的，本发明提供了一种网孔的制作方法，包括如下步骤：
步骤S1、提供沿水平方向延伸且相互平行的多个第一部以及沿垂直方向延伸且相互平行的多个第二部；所述第一部与第二部的材料分别为磁体和磁性材料中的一种；
步骤S2、根据预设的开口区的位置调节所述多个第一部与多个第二部的位置以相互交错形成多个开口区。
当所述第一部和第二部中的至少一个为磁体时，所述步骤S2中，通过磁体与磁性材料或者磁体与磁体之间的吸引力固定连接所述第一部和第二部。
当所述第一部与第二部的材料均为磁性材料时，所述步骤S2中，提供与所述第一部和第二部中的至少一个相连接的电磁感应装置，通过电磁感应装置使所述第一部和第二部中的至少一个产生磁力以固定连接所述第一部和第二部。
所述电磁感应装置为电磁感应线圈。
所述步骤S2中，提供一框架，所述第一部与第二部均位于框架中并与框架滑动连接，通过第一部与第二部在框架上滑动以调节所述第一部与第二部的位置。
当所述第一部和第二部中的至少一个为磁体时，通过磁体与磁性材料或者磁体与磁体之间的吸引力固定连接所述第一部和第二部。
当所述第一部与第二部的材料均为磁性材料时，所述框架产生电磁感应使所述第一部和第二部均产生磁力以固定连接所述第一部和第二部。
所述第二部位于所述第一部的上方，所述第二部设有位于所述第二部与第一部的重叠位置处的凹槽以使第二部和第一部的底面位于同一平面。
所述第二部的厚度大于所述第一部的厚度。
所述第一部与第二部的形状均为长条形、锯齿形、波浪形和方波形中的一种；所述开口区的形状为矩形、菱形和圆形中的一种。
 有益效果
本发明的有益效果：本发明的网孔的制作方法通过沿水平方向延伸且相互平行的多个第一部以及沿垂直方向延伸且相互平行的多个第二部；所述第一部与第二部的材料分别为磁体和磁性材料中的一种，根据预设的开口区的位置调节所述多个第一部与多个第二部的位置以相互交错形成多个开口区，实现动态调节开口区的位置，实现一张网孔对应多种LED排列方式，即网孔与LED排列方式是“一对多”的关系，提高网孔的适用性，极大的降低生产成本，并且制作过程无废料和废气产生，具有节能环保的特性。
 附图说明
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图中，
图1为本发明的网孔的制作方法的流程图；
图2为本发明的网孔的制作方法第一实施例的示意图；
图3为本发明的网孔的制作方法第二实施例的示意图；
图4为本发明的网孔的制作方法第三实施例的示意图；
图5为本发明的网孔的制作方法中第二部与第一部重叠的示意图。
 本发明的实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图1，本发明提供一种网孔的制作方法，包括如下步骤：
步骤S1、提供沿水平方向延伸且相互平行的多个第一部10以及沿垂直方向延伸且相互平行的多个第二部20；所述第一部10与第二部20的材料分别为磁体和磁性材料中的一种；
步骤S2、根据预设的开口区的位置调节所述多个第一部10与多个第二部20的位置以相互交错形成多个开口区30。
需要说明的是，本发明通过设置材料为磁体和磁性材料中的一种的多个第一部10和多个第二部20，通过多个第一部10和多个第二部20之间磁力相互吸引，从而可以根据预设的多个开口区的位置调节所述多个第一部10与多个第二部20的位置以相互交错形成多个开口区30，实现动态调节开口区30的位置，实现一张网孔对应多种LED排列方式，即网孔与LED排列方式是“一对多”的关系，提高网孔的适用性，极大的降低生产成本。此外，本发明的网孔的制作方法无废料和废气产生，具有节能环保的特性。
具体的，后续在制作mini-LED和micro-LED时，将本发明的网孔与驱动基板对位后进行锡膏涂布及固晶工艺制作LED阵列。
具体的，所述磁性材料为铁、钴、镍、铁氧体、钕铁硼、硅钢及铬钢中的一种或多种的组合；所述磁体为永磁体。
具体的，请参阅图2，在本发明的网孔的制作方法第一实施例中，当所述第一部10和第二部20中的至少一个为磁体时，所述步骤S2中，通过磁体与磁性材料或者磁体与磁体之间的吸引力固定连接所述第一部10和第二部20。
具体的，请参阅图3，在本发明的网孔的制作方法第二实施例中，当所述第一部10与第二部20的材料均为磁性材料时，所述步骤S2中，提供与所述第一部10和第二部20中的至少一个相连接的电磁感应装置40，通过电磁感应装置40使所述第一部10和第二部20中的至少一个产生磁力以固定连接所述第一部10和第二部20。
进一步的，所述电磁感应装置40为电磁感应线圈，当然也可以为其他可以产生电磁感应的装置，本发明在此不做限制。
具体的，请参阅图4，在本发明的网孔的制作方法第三实施例中，所述步骤S2中，提供一框架50，所述第一部10与第二部20均位于框架50中并与框架50滑动连接，通过第一部10与第二部20在框架50上滑动以调节所述第一部10与第二部20的位置。
进一步的，当所述第一部10和第二部20中的至少一个为磁体时，通过磁体与磁性材料或者磁体与磁体之间的吸引力固定连接所述第一部10和第二部20。
进一步的，当所述第一部10与第二部20的材料均为磁性材料时，所述框架50产生电磁感应使所述第一部10和第二部20均产生磁力以固定连接所述第一部10和第二部20。
具体的，请参阅图5，所述第二部20位于所述第一部10的上方，所述第二部20设有位于所述第二部20与第一部10的重叠位置处的凹槽21以使第二部20和第一部10的底面位于同一平面。
具体的，所述第二部20的厚度大于所述第一部10的厚度。
具体的，所述第一部10与第二部20的形状均为长条形、锯齿形、波浪形和方波形中的一种。
进一步的，通过第一部10与第二部20的形状组合使所述开口区30的形状为矩形、菱形和圆形中的一种。当然第一部10、第二部20及开口区30的形状均可以根据实际需要而调整，本发明在此不做限制。
综上所述，本发明的网孔的制作方法通过沿水平方向延伸且相互平行的多个第一部以及沿垂直方向延伸且相互平行的多个第二部；所述第一部与第二部的材料分别为磁体和磁性材料中的一种，根据预设的开口区的位置调节所述多个第一部与多个第二部的位置以相互交错形成多个开口区，实现动态调节开口区的位置，实现一张网孔对应多种LED排列方式，即网孔与LED排列方式是“一对多”的关系，提高网孔的适用性，极大的降低生产成本，并且制作过程无废料和废气产生，具有节能环保的特性。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (10)

  1. 一种网孔的制作方法，包括如下步骤：
    步骤S1、提供沿水平方向延伸且相互平行的多个第一部以及沿垂直方向延伸且相互平行的多个第二部；所述第一部与第二部的材料分别为磁体和磁性材料中的一种；
    步骤S2、根据预设的开口区的位置调节所述多个第一部与多个第二部的位置以相互交错形成多个开口区。
  2. 如权利要求1所述的网孔的制作方法，其中，当所述第一部和第二部中的至少一个为磁体时，所述步骤S2中，通过磁体与磁性材料或者磁体与磁体之间的吸引力固定连接所述第一部和第二部。
  3. 如权利要求1所述的网孔的制作方法，其中，当所述第一部与第二部的材料均为磁性材料时，所述步骤S2中，提供与所述第一部和第二部中的至少一个相连接的电磁感应装置，通过电磁感应装置使所述第一部和第二部中的至少一个产生磁力以固定连接所述第一部和第二部。
  4. 如权利要求3所述的网孔的制作方法，其中，所述电磁感应装置为电磁感应线圈。
  5. 如权利要求1所述的网孔的制作方法，其中，所述步骤S2中，提供一框架，所述第一部与第二部均位于框架中并与框架滑动连接，通过第一部与第二部在框架上滑动以调节所述第一部与第二部的位置。
  6. 如权利要求5所述的网孔的制作方法，其中，当所述第一部和第二部中的至少一个为磁体时，通过磁体与磁性材料或者磁体与磁体之间的吸引力固定连接所述第一部和第二部。
  7. 如权利要求5所述的网孔的制作方法，其中，当所述第一部与第二部的材料均为磁性材料时，所述框架产生电磁感应使所述第一部和第二部均产生磁力以固定连接所述第一部和第二部。
  8. 如权利要求1所述的网孔的制作方法，其中，所述第二部位于所述第一部的上方，所述第二部设有位于所述第二部与第一部的重叠位置处的凹槽以使第二部和第一部的底面位于同一平面。
  9. 如权利要求8所述的网孔的制作方法，其中，所述第二部的厚度大于所述第一部的厚度。
  10. 如权利要求1所述的网孔的制作方法，其中，所述第一部与第二部的形状均为长条形、锯齿形、波浪形和方波形中的一种；所述开口区的形状为矩形、菱形和圆形中的一种。
PCT/CN2019/084084 2018-11-28 2019-04-24 网孔的制作方法 WO2020107787A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/620,898 US11444064B2 (en) 2018-11-28 2019-04-24 Method of forming mesh plate and display device containing the mesh plate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811437607.0 2018-11-28
CN201811437607.0A CN109599477B (zh) 2018-11-28 2018-11-28 网孔的制作方法

Publications (1)

Publication Number Publication Date
WO2020107787A1 true WO2020107787A1 (zh) 2020-06-04

Family

ID=65959801

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/084084 WO2020107787A1 (zh) 2018-11-28 2019-04-24 网孔的制作方法

Country Status (3)

Country Link
US (1) US11444064B2 (zh)
CN (1) CN109599477B (zh)
WO (1) WO2020107787A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109599477B (zh) * 2018-11-28 2020-06-02 武汉华星光电技术有限公司 网孔的制作方法
CN112700733A (zh) * 2020-12-30 2021-04-23 惠州视维新技术有限公司 显示屏及显示屏的制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN200983722Y (zh) * 2006-12-15 2007-11-28 捷营精密有限公司 一种可调式pcb板载具
US20170170360A1 (en) * 2015-01-06 2017-06-15 Apple Inc. Led structures for reduced non-radiative sidewall recombination
CN108365081A (zh) * 2018-05-18 2018-08-03 武汉华星光电技术有限公司 网版、面光源的制作方法及直下式背光模组的制作方法
CN109599477A (zh) * 2018-11-28 2019-04-09 武汉华星光电技术有限公司 网孔的制作方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006233286A (ja) * 2005-02-25 2006-09-07 Seiko Epson Corp マスク、マスクの製造方法、パターン形成装置、パターン形成方法
CN201454843U (zh) * 2009-08-28 2010-05-12 庞红顺 可连续调整筛孔尺寸的筛网
CN204076459U (zh) * 2014-08-15 2015-01-07 山东鲁帆集团有限公司 混凝土浇筑模具
CN205856592U (zh) * 2016-08-08 2017-01-04 合肥鑫晟光电科技有限公司 掩膜板和蒸镀装置
CN206768207U (zh) * 2017-04-27 2017-12-19 昆山国显光电有限公司 蒸镀掩膜板
US10748792B2 (en) * 2017-10-13 2020-08-18 Maven Optronics Co., Ltd. Method and system for mass arrangement of micro-component devices
KR102009346B1 (ko) * 2018-08-14 2019-08-12 (주)현대포멕스 접을 수 있는 회로선과 led가 구비된 조명장치 및 이의 제조방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN200983722Y (zh) * 2006-12-15 2007-11-28 捷营精密有限公司 一种可调式pcb板载具
US20170170360A1 (en) * 2015-01-06 2017-06-15 Apple Inc. Led structures for reduced non-radiative sidewall recombination
CN108365081A (zh) * 2018-05-18 2018-08-03 武汉华星光电技术有限公司 网版、面光源的制作方法及直下式背光模组的制作方法
CN109599477A (zh) * 2018-11-28 2019-04-09 武汉华星光电技术有限公司 网孔的制作方法

Also Published As

Publication number Publication date
CN109599477A (zh) 2019-04-09
US11444064B2 (en) 2022-09-13
US20210296290A1 (en) 2021-09-23
CN109599477B (zh) 2020-06-02

Similar Documents

Publication Publication Date Title
TWI739931B (zh) 顯示裝置
CN203069818U (zh) 导光板、阵列基板、背光源及液晶模组
KR101800669B1 (ko) 액정표시장치 및 이의 제조방법
WO2017080034A1 (zh) Pdlc显示装置的制作方法及pdlc显示装置
CN109326548B (zh) 一种实现垂直结构mLED或uLED巨量转移的方法
US8830151B2 (en) Backlight unit and liquid crystal display including the same
CN105527753A (zh) 一种背光模组、显示装置、照明设备
KR20060001697A (ko) 다램프 구동을 위한 백라이트 유닛 및 이를 채용한액정표시장치
CN110456538A (zh) 可实现视角切换的显示装置及其显示方法、制作方法
WO2016026181A1 (zh) 彩色液晶显示模组结构及其背光模组
WO2020107787A1 (zh) 网孔的制作方法
KR20100071877A (ko) 액정 표시 장치, 그 제조 방법 및 구동 방법
KR101422147B1 (ko) 액정표시장치
WO2020155452A1 (zh) 异形显示装置
WO2020244120A1 (zh) 背光组件、显示面板组件及背光控制方法
US10018873B2 (en) Display substrate, display panel, and display device having a full color gamut, absent a color filter, and using infrared light and up-conversion material
CN114740655B (zh) 背光模组及显示装置
CN109375421B (zh) 液晶显示器
CN107918224A (zh) 显示面板及显示装置
WO2014173004A1 (zh) 液晶面板
KR20130024163A (ko) 기판에 발광소자가 부착된 액정표시소자
KR20120075866A (ko) 나노 와이어 그리드 편광판 및 그 제조방법과 이를 포함하는 액정표시장치
WO2015096257A1 (zh) 彩色滤光基板及液晶显示面板
US10061076B2 (en) Liquid crystal display and backlight module of the same
CN101127292B (zh) 发光装置以及利用该发光装置作为光源的显示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19890110

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19890110

Country of ref document: EP

Kind code of ref document: A1