WO2020107399A1 - 覆晶薄膜模组、显示面板及显示装置 - Google Patents

覆晶薄膜模组、显示面板及显示装置 Download PDF

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Publication number
WO2020107399A1
WO2020107399A1 PCT/CN2018/118540 CN2018118540W WO2020107399A1 WO 2020107399 A1 WO2020107399 A1 WO 2020107399A1 CN 2018118540 W CN2018118540 W CN 2018118540W WO 2020107399 A1 WO2020107399 A1 WO 2020107399A1
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WO
WIPO (PCT)
Prior art keywords
chip
stress relief
flip
groove
connection terminal
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Ceased
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PCT/CN2018/118540
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English (en)
French (fr)
Inventor
许小杰
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Shenzhen Royole Technologies Co Ltd
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Shenzhen Royole Technologies Co Ltd
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Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Priority to PCT/CN2018/118540 priority Critical patent/WO2020107399A1/zh
Priority to CN201880095924.0A priority patent/CN112640097A/zh
Publication of WO2020107399A1 publication Critical patent/WO2020107399A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Definitions

  • Embodiments of the present application relate to the field of display technology, and in particular, to a flip-chip thin film module, a display panel, and a display device.
  • COF Chip On On Flex, or Chip On Film (chip on film) packaging technology came into being.
  • This technology is a construction technology that fixes the chip on the flexible circuit board. It uses a flexible circuit board as a packaged chip carrier to join the chip and the flexible substrate circuit.
  • the flexible display screen it manufactures can be bent in various ways. Displayed in status.
  • the embodiments of the present application aim to provide a flip chip module, a display panel, and a display device to solve the technical problem that the chip in the flip chip is easy to be de-soldered in a bent state in the prior art.
  • a flip-chip thin film module including:
  • a flexible substrate including a stress relief structure
  • a chip the chip includes a connection terminal, the connection terminal fixedly connects the chip to the flexible substrate, and the stress relief structure is spaced from the connection terminal by a predetermined distance to bend the flexible substrate, The stress relief structure can reduce the stress on the connection terminal.
  • the stress relief structure includes a groove partially surrounding the connection terminal.
  • connection terminal penetrates the flexible substrate.
  • the stress relief structure includes a plurality of spaced-apart grooves, and the spaced-apart grooves are in the shape of teeth.
  • At least part of the grooves penetrate the flexible substrate.
  • the number of the stress relief structures is at least two, and the at least two stress relief structures are respectively disposed on opposite sides of the connection terminal.
  • the chip is rectangular; the connection terminals are arranged side by side along the edge of the chip; the at least two stress relief structures on opposite sides of the connection terminal are symmetrical with respect to the rectangle Axisymmetric; each of the stress relief structures is symmetrical with respect to the other axis of symmetry of the rectangle.
  • each of the stress-relieving structures includes a first linear groove, and the first linear groove is parallel to one of the sides of the rectangle.
  • each of the stress relief structures includes a first straight groove and a second straight groove; the number of the first straight groove is one, and is parallel to one of the sides of the rectangle; the second The number of linear grooves is two, two of the second linear grooves extend in the same direction from both ends of the first linear groove, and both of the second linear grooves are in line with the first linear
  • the groove forms an angle, and the angle faces the connection terminal; the second straight grooves on opposite sides of the connection terminal extend toward each other.
  • the included angle is obtuse, right or acute.
  • each of the stress relief structures includes a first straight groove and a second straight groove; the number of the first straight groove and the second straight groove are both one; the first straight groove One end of is connected to one end of the second straight groove, and an angle is formed at the connection between the first straight groove and the second straight groove; the angle is toward the connection terminal.
  • the included angle is obtuse, right or acute.
  • each of the stress relief structures includes a linear groove and an arc-shaped groove; the number of the linear grooves is one and parallel to one of the sides of the rectangle; the number of the arc-shaped grooves is two, The two arc-shaped grooves respectively extend from both ends of the linear groove and bend toward the connection terminal.
  • each of the stress relief structures includes an arc-shaped groove, and the arc-shaped groove is bent toward the connection terminal.
  • the stress relief structure is a hollow groove or a non-hollow groove.
  • a display panel includes: a display unit and the chip-on-film module described above, wherein the display unit is in communication connection with the chip.
  • a display device including:
  • a driving layer provided on the substrate.
  • the display panel is provided on the driving layer, and the driving layer is used to drive the display panel.
  • a stress relief structure is provided within a preset distance from the connection terminal of the chip to reduce the bending of the flexible substrate
  • the stress on the connection terminals of the chip can prevent the chip from being unsoldered in the bent state, and improve the reliability of the flip chip module in the bent state.
  • FIG. 1 is a schematic structural diagram of a flip-chip thin film module provided by an embodiment of this application;
  • 2 to 15 are schematic structural views of a flip-chip thin film module according to some embodiments.
  • 16 is a schematic structural diagram of a display device provided by another embodiment of the present application.
  • a flip-chip thin film module 100 provided by an embodiment of the present application includes a flexible substrate 10 and a chip 20.
  • the flexible substrate 10 includes a stress relief structure 12, and the chip 20 includes a connection terminal 22.
  • the connection terminal 22 fixedly connects the chip 20 to the flexible substrate 10, and the stress relief structure 12 is spaced apart from the connection terminal 22 by a preset distance, so that when the flexible substrate 10 is bent, the stress relief The structure 12 can reduce the stress on the connection terminal 22.
  • the preset distance can be obtained through experiments, as long as the flexible substrate 10 can be bent, the stress relief structure 12 can reduce the stress on the connection terminal 22, for example, the preset distance is 0.5 Up to 2 cm.
  • the flip-chip thin film module 100 is provided with the stress relief structure 12 within a preset distance from the connection terminal 22, so that the stress relief structure can be bent when the flexible substrate 10 is bent 12 Reducing the stress on the connection terminal 22 can prevent the chip 20 from being de-soldered in the bent state, and improve the reliability of the chip on film module 100 in the bent state.
  • the flexible substrate 10 serves as a carrier for supporting the chip 20.
  • the flexible substrate 10 uses a two-layer flexible copper clad laminate (referred to as "2L-FCCL"), which is composed of a flexible insulating base film and a metal foil, and the flexible insulating base film
  • the polyimide film is used, which is made of pyromellitic dianhydride (PMDA) and diaminodiphenyl ether (DDE) in a strong polar solvent through polycondensation and casting into a film and then imidization.
  • the metal foil is copper foil.
  • the bending radius of the two-layer flexible copper-clad laminate is 3 mm or less, which has excellent flexibility; the coefficient of thermal expansion of the two-layer flexible copper-clad laminate is less than 7 ⁇ 10 -6 °C -1 , which has good
  • the heat resistance stability of the two-layer flexible copper-clad laminate (WaterVaporTransmissionRate, referred to as WVTR) is less than 1 ⁇ 10 -6 g/(m 2 ⁇ d) and oxygen transmission rate (Oxygen Transmission Rale, referred to as OTR) is less than 1 ⁇ 10 -5 g/(m 2 ⁇ d), which has good water and oxygen resistance; the surface roughness of the two-layer flexible copper-clad laminate is 1nm smaller, which can not only have a multi-layer structure Integrity, and it is not easy to crack when the device is bent, and the device has a long life.
  • the flexible insulating base film can use other types of flexible materials, such as polyester and polynaphthalene, etc.
  • the metal foil can also use other types of metal materials, such as aluminum foil and composite metal, as needed. Foil etc.
  • the flexible substrate 10 may use a flexible copper clad laminate made of three different materials of copper foil, film, and adhesive, called a three-layer flexible copper clad laminate (referred to as "3L-FCCL”) .
  • 3L-FCCL three-layer flexible copper clad laminate
  • the flexible substrate 10 can also use other types of flexible materials as needed, for example: thermoplastic semi-crystalline polymers such as PET, PEN and PEEK, which have good transparency, low thermal expansion coefficient, good Water and oxygen resistance, and the price is relatively cheap; non-crystalline thermoplastic polymers, such as PC, PES, which are made by solvent injection or melt injection molding, have better optical transparency and higher glass transition temperature, when When the thickness of the PC and PES films reaches 0.1 mm, the transmittance in the visible light range can reach more than 85%.
  • thermoplastic semi-crystalline polymers such as PET, PEN and PEEK, which have good transparency, low thermal expansion coefficient, good Water and oxygen resistance, and the price is relatively cheap
  • non-crystalline thermoplastic polymers such as PC, PES, which are made by solvent injection or melt injection molding, have better optical transparency and higher glass transition temperature, when When the thickness of the PC and PES films reaches 0.1 mm, the transmittance in the visible light range can reach more than 85%.
  • the chip 20 may be any chip used in the display field, such as a driving chip or a control chip.
  • the chip 20 and the flexible substrate 10 are packaged using non-conductive adhesive (NCA) technology, and the interconnection of the circuit is achieved by the metal bumps of the chip 20 directly contacting the metal circuit of the flexible substrate 10 of.
  • the non-conductive adhesive is a material that does not contain conductive particles, and two types of non-conductive adhesive (NCP) and non-conductive film (NCF) can be used.
  • NCP non-conductive adhesive
  • NCF non-conductive film
  • the non-conductive adhesive uses a non-conductive film, so The non-conductive film is bonded between the chip 20 and the flexible substrate 10, and the pressure causes the bumps of the chip 20 to penetrate the non-conductive film directly below it to directly contact the corresponding flexible substrate 10, Thereby, electrical connection is achieved.
  • the non-conductive film is cured by heat, and its shrinkage can fix the direct contact between the bumps of the chip 20 and the printed wires.
  • the curing shrinkage of the non-conductive film at a certain temperature not only ensures a stable electrical connection between the chip 20 and the flexible substrate 10, but also provides a certain mechanical connection, which ensures good bonding performance of the package from these two aspects .
  • the chip 20 is rectangular.
  • the chip 20 includes a silicon substrate, a fixed sealing ring, a ground ring, at least one protective ring, at least one circuit, and a plurality of connection terminals 22.
  • the circuit is provided on a silicon substrate, and the circuit has at least one output/input pad.
  • the fixed seal ring is arranged on the silicon substrate and is arranged around the circuit and the output/input pad.
  • the ground ring is disposed between the silicon substrate and the output/input pad, and is electrically connected to the fixed seal ring.
  • the protective ring is arranged on the silicon substrate and is arranged around the output/input pad for electrically connecting with the fixed sealing ring.
  • connection terminals 22 are arranged side by side along the edge of the chip 20.
  • connection terminal 22 is juxtaposed along a rectangle at equal intervals to fix the chip 20 to the flexible substrate 10.
  • the connection terminal 22 may adopt any one of different types and shapes of connection terminals 22 according to needs, such as plug-in connection terminals, fence-type connection terminals, spring-type connection terminals and through-wall connection terminals, etc.
  • the stress relief structure 12 is disposed on the flexible substrate 10.
  • the stress relief structure 12 has a predetermined distance between the connection terminals 22 of the chip 20.
  • the stress relief structure 12 is along the flexible substrate 10. The extending direction of the bending portion is provided to reduce the stress on the connection terminal 22 when the flexible substrate 10 is bent.
  • the stress relief structure 12 may be a hollow groove, a non-hollow groove, or a groove partially penetrating the flexible substrate 10, and the stress relief structure 12 is partially disposed around the connection terminal.
  • the hollow groove is a groove that penetrates the flexible substrate 10
  • the non-hollow groove is a groove or a recess that does not penetrate the flexible substrate 10.
  • the number of the stress relief structures 12 is two, and they are respectively disposed on opposite sides of the connection terminal 22 and located on opposite sides of the connection terminal 22.
  • the two stress relief structures 12 are symmetrical with respect to the rectangular first symmetry axis O1; each of the stress relief structures 12 is symmetrical with respect to the rectangular second symmetry axis O2, and the first symmetry axis O1 is The second symmetry axis O2 is perpendicular to each other.
  • the stress relief structure 12 includes a first linear groove 122 and a second linear groove 124; the number of the first linear groove 122 is one, and is parallel to one of the sides of the rectangle, The shortest distance between the first linear groove 122 and the connection terminal 22 is 0.5 cm; the number of the second linear grooves 124 is two, and the two second linear grooves 124 are respectively from the first Both ends of the wire groove 122 extend in the same direction, and the shortest distance between each second straight groove 124 and the connection terminal 22 is 0.5 cm; each second straight groove 124 and the first straight groove Each 122 forms an angle, and the angle formed by each second straight groove 124 and the first straight groove 122 is a right angle, and the right angle faces the connection terminal 22.
  • the two second linear grooves 124 extend toward each other.
  • the flip-chip thin film module 100 of the embodiment of the present application and the flip-chip thin film module that does not include the stress relief structure are tested.
  • the test results of the finite element simulation show that the stress relief structure is not provided
  • the maximum stress in the area around the chip is 33MPa
  • the maximum stress in the area around the chip provided with the stress relief structure is 17MPa, which shows that the stress relief structure 12 can greatly reduce the stress on the connection terminal 22 .
  • the shape of the stress relief structure 12 can be changed according to actual needs, as long as the flexible substrate 10 can be bent, the stress relief structure 12 can reduce the stress on the connection terminal 22 .
  • the flip-chip thin film module 100a provided by some embodiments of the present application is basically the same as the flip-chip thin film module 100 shown in FIGS. 1 and 2 except for the stress relief structure of the flip-chip thin film module 100a.
  • 12a includes a first straight groove 122a and a second straight groove 124a; the number of the first straight groove 122a is one and is parallel to one of the sides of the rectangle; the number of the second straight groove 124a is two Two, the two second straight grooves 124a extend from both ends of the first straight groove 122a in the same direction; each second straight groove 124a and the first straight groove 122a form a clip Angle, an angle formed by each second straight groove 124a and the first straight groove 122a is an obtuse angle, and the obtuse angle faces the connection terminal 22. It can be understood that, in some other embodiments, the angle formed by each second straight groove 124 a and the first straight groove 122 a may also be an acute angle, and the acute angle faces
  • the shortest distance between the first straight groove 122a and the connection terminal 22 is 0.5 cm, and the shortest distance between each second straight groove 124a and the connection terminal 22 is 0.8 cm.
  • the flip-chip thin film module 100b provided by some embodiments of the present application is basically the same as the flip-chip thin film module 100 shown in FIGS.
  • the shape of 12b is substantially triangular.
  • the stress relief structure 12b includes a first linear groove 122b and a second linear groove 124b.
  • the number of the first linear groove 122b and the second linear groove 124b are both one;
  • One end of the first straight groove 122b is connected to one end of the second straight groove 124b;
  • the angle between the first straight groove 122b and the second straight groove 124b is an obtuse angle, and the obtuse angle is toward the connection Terminal 22.
  • the shortest distance between the first straight groove 122b and the connection terminal 22 is 0.6 cm, and the shortest distance between the second straight groove 124b and the connection terminal 22 is also 0.6 cm.
  • the angle between the first straight groove 122b and the second straight groove 124b may also be a right angle or an acute angle, and the right angle or the acute angle faces the connection terminal 22 .
  • the flip-chip thin film module 100c provided by some embodiments of the present application is basically the same as the flip-chip thin film module 100 shown in FIGS.
  • the shape of 12c is linear, and the stress-relieving structure 12c includes a first linear groove that is parallel to one of the sides of the rectangle.
  • the shortest distance between the first straight groove and the connection terminal 22 is 0.5 cm.
  • the flip-chip thin film module 100 d provided by some embodiments of the present application is basically the same as the flip-chip thin film module 100 shown in FIGS. 1 and 2, the difference lies in the stress relief structure of the flip-chip thin film module 100 b
  • the shape of 12d is a circular arc.
  • the stress relief structure 12d includes an arc-shaped groove, and the arc-shaped groove is curved toward the connection terminal 22.
  • the shortest distance between the arc-shaped groove and the connection terminal 22 is 0.5 cm.
  • the flip-chip thin film module 100e provided by some embodiments of the present application is basically the same as the flip-chip thin film module 100 shown in FIGS. 1 and 2, the difference lies in the stress relief structure of the flip-chip thin film module 100e 12e includes a straight groove 122e and an arc groove 124e; the number of the straight groove 122e is one and parallel to one of the sides of the rectangle; the number of the arc groove 124e is two, two of the arc The groove 124e extends from both ends of the linear groove 122e, and is bent toward the connection terminal 22.
  • the shortest distance between the first straight groove 122e and the connection terminal 22 is 0.5 cm, and the shortest distance between the arc groove 124e and the connection terminal 22 is also 0.8 cm.
  • the stress relief structure 12e may also be arranged into other bar shapes with circular arcs according to needs, and the bar shape of the circular arc may be a regular shape or an irregular shape .
  • the stress-relieving structure 12 can also be arranged in other strip shapes with angled corners, for example: pentagon, hexagon, star and so on.
  • the stress-relieving structure 12 may also be an irregular shape with folded corners, for example, an irregular quadrilateral, an irregular straight line, an irregular triangle, and so on.
  • the flip-chip thin film module 100f provided by some embodiments of the present application is basically the same as the flip-chip thin film module 100c shown in FIG. 4, the difference is that the stress relief structure 12f of the flip-chip thin film module 100f includes A zigzag groove, the zigzag groove is arranged substantially along a straight line. Saw-tooth grooves provide strength while absorbing stress.
  • edges of the stress relief structures 12, 12a, 12b, 12c, 12d, or 12e in any of the above embodiments can be provided in a zigzag shape, and the jagged stress relief structures at the edges can absorb stress While providing strength.
  • the flip-chip thin film module 100g provided by some embodiments of the present application is basically the same as the flip-chip thin film module 100 shown in FIGS. 1 and 2, except that the flip-chip thin film module
  • the 100g stress relief structure 12g includes a plurality of grooves 122g, the plurality of grooves 122g are spaced from the flexible substrate 10, the plurality of spaced grooves 122g form a tooth structure, and the shape of the grooves It can be set as quadrangular groove and arc-shaped groove as needed.
  • the stress relief structure 12g can not only absorb the stress received by the connection terminal 22, but also because the bottom of the flexible substrate 10 is not penetrated, the flexible substrate 10 can still maintain good bending strength.
  • the flip-chip thin film module 100h provided by some embodiments of the present application is basically the same as the flip-chip thin film module 100 shown in FIGS. 1 and 2, the difference is that the flip-chip thin film module
  • the 100h stress relief structure 12h includes at least one hollow groove 122h that penetrates the flexible substrate 10 and at least one non-hollow groove 124h that does not penetrate the flexible substrate 10, and the hollow groove 122h and the non-hollow groove 124h are spaced apart from the flexible substrate 10.
  • the stress relief structure 12h can not only absorb the stress received by the connection terminal 22, but also increase the strength.
  • the stress relief structure 12g or the stress relief structure 12h may be different from the stress relief structures 12, 12a, 12b, 12c, 12d, 12e, or 12f in any of the foregoing embodiments. Same shape.
  • the hollow grooves and the non-hollow grooves may be disposed at any positions of the stress relief structures 12, 12a, 12b, 12c, 12d, 12e, or 12f in any of the foregoing embodiments as required.
  • the first straight groove 122b of the stress relief structure 12b is set as the hollow groove
  • the second straight groove 124b is set as the non-hollow groove
  • the straight groove 122e of the stress relief structure 12e is set as the hollow groove
  • the arc groove 124e is set as a non-hollow groove.
  • the groove partially penetrating the flexible substrate 10 can not only absorb the stress received by the connection terminal 22, but also improve the strength.
  • the number of the stress relief structures can be changed according to actual requirements, as long as the flexible substrate can be bent, the stress relief structures can reduce the stress on the connection terminals. Therefore, in some embodiments, the number of the stress relief structures may be one, and are provided on one side of the connection terminal; or, the number of the stress relief structures is plural, and the plurality of stress relief structures It is provided on one side of the connection terminal; or, the number of the stress relief structures is plural, and the plurality of stress relief structures are respectively provided on opposite sides of the connection terminal.
  • the flip-chip thin film module 100i provided by some embodiments of the present application is basically the same as the flip-chip thin film module 100 shown in FIGS. 1 and 2, except that the flip-chip thin film module 100i includes four In the stress relief structure 12, two of the stress relief structures 12 are disposed on one side of the chip 20, and the other two of the stress relief structures 12 are disposed on the other side of the chip 20.
  • the four stress-relieving structures 12 have the same shape, and the two stress-relieving structures 12 on the same side of the chip 20 are arranged separately, one of which is larger, and the larger stress-relieving structure 12 partially surrounds the smaller Described stress relief structure 12.
  • the flip-chip thin film module 100j provided by some embodiments of the present application is basically the same as the flip-chip thin film module 100a shown in FIG.
  • the structure 12a two of the stress relief structures 12a are disposed on one side of the chip 20, and the other two of the stress relief structures 12a are disposed on the other side of the chip 20.
  • the four stress-relief structures 12a have the same shape, and the two stress-relief structures 12a on the same side of the chip 20 are arranged separately, one of which is larger, and the larger stress-relief structure 12a partially surrounds the smaller The stress relief structure 12a.
  • the flip-chip thin film module includes a plurality of the stress relief structures in each of the above embodiments, and the stress relief structures in each of the above embodiments may be arbitrarily combined,
  • the stress relief structures in each of the foregoing embodiments are arranged in parallel at a predetermined distance, and at the same time, the stress relief structures in each of the foregoing embodiments are disposed toward the connection terminal.
  • the flip-chip thin film module 100k provided by some embodiments of the present application is basically the same as the flip-chip thin film module 100i shown in FIG. 13, except that the flip-chip thin film module 100k includes two The stress relief structure 12 and the two stress relief structures 12f, one stress relief structure 12 and one stress relief structure 12f are provided on one side of the chip 20, and the other stress relief structure 12 and the other The stress relief structure 12f is disposed on the other side of the chip 20, and the stress relief structure 12 on the same side of the chip 20 partially surrounds the stress relief structure 12f.
  • another embodiment of the present application further provides a display device 200 including a substrate 40, a driving layer 50, a display panel 60, and a protective layer 70.
  • the driving layer 50 is used to drive the display panel 60.
  • the base 40 may use a flexible substrate, such as a thin glass, metal foil, or plastic base, etc. having a flexible material, for example, the plastic base has a flexible structure including coating on both sides of the base film,
  • Base film includes materials such as polyimide (PI), polycarbonate (PC), polyethylene glycol terephthalate (PET), polyethersulfone (PES), polyethylene film (PEN), fiber-reinforced plastic (FRP) ) Wait for resin.
  • the driving layer 50 includes a scanning circuit and a switching circuit, the scanning circuit is connected to the switching circuit, and the switching circuit is connected to the organic light emitting diode device in the display panel 60.
  • the scanning circuit scans and selects the corresponding pixel unit through the switch circuit, and applies a driving voltage to the pixel unit to cause the pixel unit to emit light, thereby displaying an image.
  • the driving layer 50 may use different driving methods to drive the display panel 60, and the driving methods include a passive driving method (Passive Matrix, PMOLED) and an active driving method (Active Matrix, AMOLED).
  • the switching circuit may select a thin-film transistor (TFT) as a switching tube, and realizes static driving or dynamic driving through the function of the scanning circuit.
  • the switching circuit can select a low-temperature polysilicon thin-film transistor (Low-Temperature Poly-Si Thin Film Transistor (LTP-Si TFT), amorphous silicon TFT, polycrystalline silicon TFT, oxide semiconductor TFT or organic TFT, etc. are used as switch tubes.
  • LTP-Si TFT Low-Temperature Poly-Si Thin Film Transistor
  • amorphous silicon TFT polycrystalline silicon TFT
  • oxide semiconductor TFT or organic TFT etc.
  • the display panel 60 includes a display unit and the flip-chip thin film module 100, 100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h, 100i, 100j, or 100k in any of the foregoing embodiments, wherein the display The unit is communicatively connected to the chip 20 for light-emitting display.
  • the protective layer 70 is used to protect the display panel 60, wherein the protective layer 70 may include substances such as ZrO, CeO 2 , ThO 2 and the like.
  • the protective layer 70 may form a transparent film to cover the entire surface of the display panel 60.
  • the display device 200 provided by the embodiment of the present application is made flexible by using a flexible material and becomes bendable.
  • the display device 200 is not only bendable, but also transparent.
  • the material of the display device 200 is a flexible transparent element
  • the substrate 40 is composed of a polymer such as transparent plastic.
  • the driving layer 50 uses a transparent transistor, and the organic light emitting diode device in the display panel 60 uses a transparent material. Therefore, the display device 200 can become flexible and transparent.
  • the transparent transistor is a TFT transistor made of opaque silicon by replacing the TFT transistor made of a transparent substance such as zinc oxide or titanium dioxide with the related art.
  • the transparent electrode may be composed of a material such as indium tin oxide (ITO) or graphene.
  • ITO indium tin oxide
  • graphene has a honeycomb lattice structure composed of carbon atoms, and has transparency.
  • the transparent organic light-emitting layer can be realized with various substances.
  • the display device 200 can implement the execution of various application functions by setting bending parameters such as a bending sensor and using bending parameters detected by the bending sensor, thereby greatly improving the user's experience.
  • the display panel 60 of the display device 200 of the present application provides a flip chip module 100, 100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h, 100i, 100j or 100k,
  • the stress relief structure can reduce the stress on the connection terminal when the flexible substrate is bent, and can prevent the chip from bending De-soldering in the folded state improves the reliability of the flip chip module in the folded state.

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Abstract

一种覆晶薄膜结构(100)、显示面板(60)及显示装置(200)，其中覆晶薄膜结构(100)包括柔性基板(10)和芯片(20)，柔性基板(10)包括消应力结构(12)，芯片(20)包括连接端子(22)，连接端子(22)将芯片(20)固定连接于柔性基板(10)上，消应力结构(12)与连接端子(22)间隔预设距离，以使柔性基板(10)弯曲时，消应力结构(12)可减小连接端子(22)受到的应力，可防止芯片(20)在弯折状态下脱焊，提高覆晶薄膜结构(100)在弯折状态下的可靠性。

Description

覆晶薄膜模组、显示面板及显示装置 技术领域
本申请实施例涉及显示技术领域，特别是涉及一种覆晶薄膜模组、显示面板及显示装置。
背景技术
现阶段的移动电子产品如手机和数码相机等以轻薄短小为发展趋势，这就要求必须有高密度、小体积，能自由安装的新一代封装技术来满足以上需求，在此情况下，COF(Chip On Flex，或者说Chip On Film，覆晶薄膜)封装技术应运而生。该技术是将芯片固定于柔性线路板上的构装技术，其运用软质电路板作为封装芯片载体将芯片与软性基板电路接合，其所制造的柔性显示屏，能够实现在各种弯折状态下显示。
然而，当柔性显示屏弯折时会带动覆晶薄膜弯曲，这会使覆晶薄膜上的芯片边角承受较大的拉力，导致芯片焊点有脱焊的风险。
发明内容
本申请实施例旨在提供一种覆晶薄膜模组、显示面板及显示装置，以解决现有技术中覆晶薄膜中的芯片在弯折状态下容易脱焊的技术问题。
本申请实施例解决其技术问题提供以下技术方案：
一种覆晶薄膜模组，包括：
柔性基板，所述柔性基板包括消应力结构；以及
芯片，所述芯片包括连接端子，所述连接端子将所述芯片固定连接于所述柔性基板上，所述消应力结构与所述连接端子间隔预设距离，以使所述柔性基板弯曲时，所述消应力结构可减小所述连接端子受到的应力。
可选地，所述消应力结构包括部分环绕所述连接端子设置的凹槽。
可选地，所述环绕连接端子设置的凹槽至少部分凹槽贯穿所述柔性基板。
可选地，所述消应力结构包括多个间隔设置的凹槽，所述间隔设置的凹槽呈齿状。
可选地，所述多个间隔设置的凹槽中，至少部分凹槽贯穿所述柔性基板。
可选地，所述消应力结构的数量为至少两个，所述至少两个消应力结构分别设置于所述连接端子的相对两侧。
可选地，所述芯片为矩形；所述连接端子沿所述芯片的边缘处并排设置；位于所述连接端子的相对两侧的所述至少两个消应力结构相对于所述矩形的一对称轴对称；每个所述消应力结构相对于所述矩形的另一对称轴对称。
可选地，每个所述消应力结构包括一个第一直线槽，所述第一直线槽平行于所述矩形的其中一条边。
可选地，每个所述消应力结构包括第一直线槽和第二直线槽；所述第一直线槽的数量为一个，并且平行于所述矩形的其中一条边；所述第二直线槽的数量为两个，两个所述第二直线槽分别从所述第一直线槽的两端朝同一方向延伸，且两个所述第二直线槽均与所述第一直线槽形成一夹角，所述夹角朝向所述连接端子；位于所述连接端子的相对两侧的所述第二直线槽相向延伸。
可选地，所述夹角为钝角、直角或锐角。
可选地，每个所述消应力结构包括第一直线槽和第二直线槽；所述第一直线槽和所述第二直线槽的数量均为一个；所述第一直线槽的一端与所述第二直线槽的一端连接，所述第一直线槽与所述第二直线槽的连接处形成一夹角；所述夹角朝向所述连接端子。
可选地，所述夹角为钝角、直角或锐角。
可选地，每个所述消应力结构包括直线槽和弧形槽；所述直线槽的数量为一个，并且平行于所述矩形的其中一条边；所述弧形槽的数量为两个，两个所述弧形槽分别从所述直线槽的两端延伸，并且朝向所述连接端子弯曲。
可选地，每个所述消应力结构包括一个弧形槽，所述弧形槽朝向所述连接端子弯曲。
可选地，所述消应力结构为镂空槽或非镂空槽。
本申请实施例解决其技术问题还提供以下技术方案：
一种显示面板，包括：显示单元及以上所述的覆晶薄膜模组，其中，所述显示单元与所述芯片通信连接。
本申请实施例解决其技术问题还提供以下技术方案：
一种显示装置，包括：
基底；
驱动层，所述驱动层设置于所述基底上；以及
以上所述的显示面板，所述显示面板设置于所述驱动层上，所述驱动层用于驱动所述显示面板。
与现有技术相比较，在本申请实施例提供的覆晶薄膜模组中，在距离所述芯片的连接端子的预设距离内设置消应力结构，以使柔性基板弯曲时，用于减小所述芯片的连接端子受到的应力，可防止芯片在弯折状态下脱焊，提高覆晶薄膜模组在弯折状态下的可靠性。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1是本申请其中一实施例提供的一种覆晶薄膜模组的结构示意图；
图2至图15是根据不同的一些实施例示出的覆晶薄膜模组的结构示意图；
图16是本申请另一实施例提供的一种显示装置的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。若本申请实施例中有涉及“第一”、“第二”等的描述，则该“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。
请参阅图1，本申请一实施例提供的一种覆晶薄膜模组100，包括柔性基板10和芯片20，所述柔性基板10包括消应力结构12，所述芯片20包括连接端子22，所述连接端子22将所述芯片20固定连接于所述柔性基板10上，所述消应力结构12与所述连接端子22间隔预设距离，以使所述柔性基板10弯曲时，所述消应力结构12可减小所述连接端子22受到的应力。
所述预设距离可通过实验获得，只要能使得所述柔性基板10弯曲时，所述消应力结构12可减小所述连接端子22受到的应力即可，例如，所述预设距离为0.5至2厘米。
在本申请实施例中，所述覆晶薄膜模组100在距离所述连接端子22的预设距离内设置所述消应力结构12，可使得所述柔性基板10弯曲时，所述消应力结构12减小所述连接端子22受到的应力，可防止所述芯片20在弯折状态下脱焊，提高所述覆晶薄膜模组100在弯折状态下的可靠性。所述柔性基板10作为载体，用于支承所述芯片20。在本实施例中，所述柔性基板10采用的是二层型挠性覆铜板(简称“2L-FCCL”)，是由挠性绝缘基膜与金属箔组成 的，所述挠性绝缘基膜采用的是聚酰亚胺薄膜，其是由均苯四甲酸二酐(PMDA)和二胺基二苯醚(DDE)在强极性溶剂中经缩聚并流延成膜再经亚胺化而成，所述金属箔采用的是铜箔。所述二层型挠性覆铜板弯折曲率半径为到3mm以下,其具有优良的柔韧性；所述二层型挠性覆铜板的热膨胀系数小于7×10 －6℃ －1，其具有良好的耐热稳定性；所述二层型挠性覆铜板水汽穿透率(WaterVaporTransmissionRate，简称WVTR)小于1×10 －6g/(m 2·d)以及氧气穿透率(Oxygen Transmission Rale,简称OTR)小于1×10 －5g/(m 2·d)，其具有良好的阻水阻氧能力；所述二层型挠性覆铜板表面粗糙度小1nm，其不仅能具有多层结构的完整性，而且在器件弯曲时不易产生裂纹，器件寿命高。
在一些实施例中，所述挠性绝缘基膜可采用其他种类的柔性材料，例如聚酯和聚萘酯等，所述金属箔也可根据需要采用其他种类的金属材料，例如铝箔、复合金属箔等。
在一些实施例中，所述柔性基板10可采用由铜箔、薄膜、胶粘剂三种不同材料符合而成的挠性覆铜板，称为三层型挠性覆铜板(简称“3L-FCCL”)。
在一些实施例中，所述柔性基板10也可根据需要采用其他种类的柔性材料，例如：热塑性半结晶聚合物，如PET、PEN和PEEK，其具有良好的透明度、较低的热膨胀系数、良好的阻水阻氧能力，而且价格比较便宜；非结晶热塑性聚合物，如PC、PES，其由溶剂注造或熔融注塑而成，具有较好的光学透明度和较高的玻璃化转变温度，当PC、PES薄膜的厚度达到0.1mm时，在可见光范围内的透过率可以达到85％以上。
所述芯片20可为任意一种应用于显示领域的芯片，例如驱动芯片或控制芯片等等。
在本实施例中，所述芯片20与所述柔性基板10之间采用非导电胶(NCA)技术封装，电路的互连是通过芯片20的金属凸点与柔性基板10的金属线路直接接触实现的。所述非导电胶是不含导电颗粒的材料，可采用非导电胶(NCP)和非导电膜(NCF)两种类型，在本实施例中，所述非导电胶采用的 是非导电膜，所述非导电膜被贴合于所述芯片20与所述柔性基板10之间，加压使芯片20凸点穿透其正下方的所述非导电膜而与对应的柔性基板10线路直接接触，由此实现电连接。所述非导电膜受热固化，其收缩可以固定芯片20凸点和印制线间的直接接触。所述非导电膜在一定温度下的固化收缩不仅能保证了芯片20和柔性基板10之间稳定的电连接，还提供了一定的机械连接，从这两方面保证了封装体良好的键合性能。
所述芯片20为矩形，所述芯片20包括硅基板、固定封环、接地环、至少一个防护环、至少一个电路及若干所述连接端子22。所述电路设于硅基板上，所述电路具有至少一输出/输入垫。所述固定封环设于所述硅基板上，并围绕所述电路及输出/输入垫设置。所述接地环设置于硅基板及输出/输入垫之间，并与所述固定封环电连接。防护环设于硅基板之上，并围绕输出/输入垫设置，用以与所述固定封环电连接。
所述连接端子22沿所述芯片20的边缘处并排设置。
在本实施例中，每个所述连接端子22等间隔沿一矩形并排，用于将所述芯片20固定连接于所述柔性基板10上。所述连接端子22可根据需要采用任意一种的不同型号及形状的连接端子22，例如插拔式接线端子、栅栏式接线端子、弹簧式接线端子及穿墙式接线端子等等。
所述消应力结构12设置于所述柔性基板10，所述消应力结构12与所述芯片20的连接端子22之间具有预设距离，且所述消应力结构12沿所述柔性基板10的弯曲部延伸方向设置，以使所述柔性基板10弯曲时，用于减小所述连接端子22受到的应力。
所述消应力结构12可为镂空槽、非镂空槽或部分贯穿所述柔性基板10的凹槽，所述消应力结构12部分环绕所述连接端子设置。所述镂空槽为贯穿所述柔性基板10的开槽，所述非镂空槽为不贯穿所述柔性基板10的开槽或凹陷。
请继续参阅图2，在本实施例中，所述消应力结构12的数量为两个，且 分别设置于所述连接端子22的相对两侧，位于所述连接端子22的相对两侧的所述两个消应力结构12相对于所述矩形的第一对称轴O1对称；每个所述消应力结构12相对于所述矩形的第二对称轴O2对称，所述第一对称轴O1与所述第二对称轴O2相互垂直。
在本实施例中，所述消应力结构12包括第一直线槽122和第二直线槽124；所述第一直线槽122的数量为一个，并且平行于所述矩形的其中一条边，所述第一直线槽122与所述连接端子22的最短距离为0.5厘米；所述第二直线槽124的数量为两个，两个所述第二直线槽124分别从所述第一直线槽122的两端朝同一方向延伸，每个所述第二直线槽124与所述连接端子22的最短距离为0.5厘米；每个所述第二直线槽124与所述第一直线槽122均形成一夹角，每个所述第二直线槽124与所述第一直线槽122形成的夹角为直角，所述直角朝向所述连接端子22。两个所述第二直线槽124相向延伸。
在相同的测试条件下，测试本申请实施例的覆晶薄膜模组100与未包括所述消应力结构的覆晶薄膜模组，有限元仿真的测试结果显示，未设置有所述消应力结构的芯片周围区域的最大应力为33MPa，设置有所述消应力结构的芯片周围区域的最大应力为17MPa，由此可见，所述消应力结构12可大幅度减小所述连接端子22受到的应力。
可以理解的是，所述消应力结构12的形状可以根据实际需求进行改变，只要可使所述柔性基板10弯曲时，所述消应力结构12可减小所述连接端子22受到的应力即可。
请参阅图3，本申请一些实施例提供的覆晶薄膜模组100a与图1和图2所示的覆晶薄膜模组100基本相同，区别在于所述覆晶薄膜模组100a的消应力结构12a包括第一直线槽122a和第二直线槽124a；所述第一直线槽122a的数量为一个，并且平行于所述矩形的其中一条边；所述第二直线槽124a的数量为两个，两个所述第二直线槽124a从所述第一直线槽122a的两端朝同一方向延伸；每个所述第二直线槽124a与所述第一直线槽122a均形成一夹角， 每个所述第二直线槽124a与所述第一直线槽122a形成的夹角为钝角，所述钝角朝向所述连接端子22。可以理解的是，在一些其它实施例中，每个所述第二直线槽124a与所述第一直线槽122a形成的夹角也可为锐角，所述锐角朝向所述连接端子22。
所述第一直线槽122a与所述连接端子22的最短距离为0.5厘米，每个所述第二直线槽124a与所述连接端子22的最短距离为0.8厘米。
请参阅图4，本申请一些实施例提供的覆晶薄膜模组100b与图1和图2所示的覆晶薄膜模组100基本相同，区别在于所述覆晶薄膜模组100b的消应力结构12b的形状大致为三角形，所述消应力结构12b包括第一直线槽122b和第二直线槽124b，所述第一直线槽122b和所述第二直线槽124b的数量均为一个；所述第一直线槽122b的一端与所述第二直线槽124b的一端连接；所述第一直线槽122b与所述第二直线槽124b的夹角为钝角，所述钝角朝向所述连接端子22。
所述第一直线槽122b与所述连接端子22的最短距离为0.6厘米，所述第二直线槽124b与所述连接端子22的最短距离也为0.6厘米。
可以理解的是，在可替换的实施例中，所述第一直线槽122b与所述第二直线槽124b的夹角也可为直角或锐角，所述直角或锐角朝向所述连接端子22。
请参阅图5，本申请一些实施例提供的覆晶薄膜模组100c与图1和图2所示的覆晶薄膜模组100基本相同，区别在于所述覆晶薄膜模组100c的消应力结构12c的形状为直线形，所述消应力结构12c包括一个第一直线槽，所述第一直线槽平行于所述矩形的其中一条边。所述第一直线槽与所述连接端子22的最短距离为0.5厘米。
请参阅图6，本申请一些实施例提供的覆晶薄膜模组100d与图1和图2所示的覆晶薄膜模组100基本相同，区别在于所述覆晶薄膜模组100b的消应力结构12d的形状为圆弧形，所述消应力结构12d包括一个弧形槽，所述弧形槽朝向所述连接端子22弯曲。所述弧形槽与所述连接端子22的最短距离 为0.5厘米。
请参阅图7，本申请一些实施例提供的覆晶薄膜模组100e与图1和图2所示的覆晶薄膜模组100基本相同，区别在于所述覆晶薄膜模组100e的消应力结构12e包括直线槽122e和弧形槽124e；所述直线槽122e的数量为一个，并且平行于所述矩形的其中一条边；所述弧形槽124e的数量为两个，两个所述弧形槽124e从所述直线槽122e的两端延伸，并且朝向所述连接端子22弯曲。
所述第一直线槽122e与所述连接端子22的最短距离为0.5厘米，所述弧形槽124e与所述连接端子22的最短距离也为0.8厘米。
可以理解的是，在可替换的实施例中，所述消应力结构12e也可根据需要设置成其它具有圆弧的条形状，所述圆弧的条形状可为规则形状也可为不规则形状。
在一些实施例中，所述消应力结构12也可根据需要设置成其它具有折角的条形状，例如：五边形、六边形和星形等等。
在一些实施例中，所述消应力结构12也可为具有折角的不规则形状，例如：不规则四边形、不规则直线形和不规则三角形等等。
请参阅图8，本申请一些实施例提供的覆晶薄膜模组100f与图4所示的覆晶薄膜模组100c基本相同，区别在于所述覆晶薄膜模组100f的消应力结构12f包括呈锯齿状的凹槽，所述呈锯齿状的凹槽大致沿一直线设置。呈锯齿状的凹槽可在吸收应力的同时提供强度。
可以理解是，上述任一实施例中的消应力结构12、12a、12b、12c、12d或12e的边缘处均可设置为锯齿状，所述边缘处呈锯齿状的消应力结构可在吸收应力的同时提供强度。
请一并参阅图9和图10，本申请一些实施例提供的覆晶薄膜模组100g与图1和图2所示的覆晶薄膜模组100基本相同，区别在于所述覆晶薄膜模组100g的消应力结构12g包括多个凹槽122g，多个所述凹槽122g间隔开设于 所述柔性基板10，多个所述间隔设置的凹槽122g形成齿状结构，所述凹槽的形状可根据需要设置为四边形凹槽和圆弧形凹槽等等。所述消应力结构12g不仅能够吸收连接端子22受到的应力，而且由于柔性基板10底部没有被贯穿，柔性基板10依然可以保持较好的耐弯折强度。
请一并参阅图11和图12，本申请一些实施例提供的覆晶薄膜模组100h与图1和图2所示的覆晶薄膜模组100基本相同，区别在于所述覆晶薄膜模组100h的消应力结构12h包括至少一个贯穿柔性基板10的镂空槽122h和至少一个不贯穿柔性基板10的非镂空槽124h，所述镂空槽122h和所述非镂空槽124h间隔开设于所述柔性基板10。所述消应力结构12h不仅能够吸收连接端子22受到的应力，而且能够提高强度。
可以理解的是，在一些实施例中，所述消应力结构12g或所述消应力结构12h可与上述任一实施例中的消应力结构12、12a、12b、12c、12d、12e或12f的形状相同。
可以理解的是，在一些实施例中，所述镂空槽和非镂空槽可根据需要设置于上述任一实施例中的消应力结构12、12a、12b、12c、12d、12e或12f的任意位置，例如，将消应力结构12b的第一直线槽122b设置为所述镂空槽，第二直线槽124b设置为非镂空槽；将消应力结构12e的直线槽122e设置为镂空槽，弧形槽124e设置为非镂空槽。部分贯穿所述柔性基板10的凹槽不仅能够吸收连接端子22受到的应力，而且能够提高强度。
可以理解的是，所述消应力结构的数量可以根据实际需求进行改变，只要可使所述柔性基板弯曲时，所述消应力结构可减小所述连接端子受到的应力即可。因此，在一些实施例中，所述消应力结构的数量可为一个，且设置于所述连接端子的一侧；或者，所述消应力结构的数量为多个，多个所述消应力结构设置于所述连接端子的一侧；或者，所述消应力结构的数量为多个，多个所述消应力结构分别设置于所述连接端子的相对两侧。
请参阅图13，本申请一些实施例提供的覆晶薄膜模组100i与图1和图2 所示的覆晶薄膜模组100基本相同，区别在于所述覆晶薄膜模组100i包括四个所述消应力结构12，两个所述消应力结构12设置于所述芯片20的一侧，另两个所述消应力结构12设置于所述芯片20的另一侧。四个所述消应力结构12的形状相同，位于所述芯片20同一侧的两个所述消应力结构12分离设置，其中一个较大，较大的所述消应力结构12部分包围较小的所述消应力结构12。
请参阅图14，本申请一些实施例提供的覆晶薄膜模组100j与图3所示的覆晶薄膜模组100a基本相同，区别在于所述覆晶薄膜模组100j包括四个所述消应力结构12a，两个所述消应力结构12a设置于所述芯片20的一侧，另两个所述消应力结构12a设置于所述芯片20的另一侧。四个所述消应力结构12a的形状相同，位于所述芯片20同一侧的两个所述消应力结构12a分离设置，其中一个较大，较大的所述消应力结构12a部分包围较小的所述消应力结构12a。
可以理解的是，在一些实施例中，所述覆晶薄膜模组包括多个上述各个实施例中的所述消应力结构，每个上述各个实施例中的所述消应力结构可以任意组合，且每个上述各个实施例中的所述消应力结构之间间隔预设距离并列设置，同时每个上述各个实施例中的所述消应力结构均朝向所述连接端子设置。
例如，请参阅图15，本申请一些实施例提供的覆晶薄膜模组100k与图13所示的覆晶薄膜模组100i基本相同，区别在于所述覆晶薄膜模组100k包括两个所述消应力结构12和两个所述消应力结构12f，一个所述消应力结构12和一个所述消应力结构12f设置于所述芯片20的一侧，另一个所述消应力结构12和另一个所述消应力结构12f设置于所述芯片20的另一侧，位于所述芯片20的同一侧的所述消应力结构12部分围绕所述消应力结构12f。
请参阅图16，本申请另一实施例还提供一种显示装置200，包括基底40、驱动层50、显示面板60以及保护层70。其中，所述驱动层50用于驱动所述 显示面板60。
所述基底40可以使用柔性基板，所述柔性基板诸如包括薄玻璃、金属箔片或塑料基底等等具有柔性的材料，例如，塑料基底具有包括涂覆在基膜的两侧上的柔性结构，基膜包括诸如聚酰亚胺(PI)、聚碳酸酯(PC)、聚乙二醇对酞酸酯(PET)、聚醚砜(PES)、聚乙烯薄膜(PEN)、纤维增强塑料(FRP)等等树脂。
所述驱动层50包括扫描电路与开关电路，所述扫描电路与所述开关电路连接，所述开关电路与所述显示面板60中有机发光二极管器件连接。
所述扫描电路通过所述开关电路扫描并选择对应的像素单元，并向像素单元施加驱动电压，以使像素单元发光，从而显示图像。
所述驱动层50可采用不同驱动方式驱动显示面板60，驱动方式包括无源驱动方式(Passive Matrix，PMOLED)与有源驱动方式(Active Matrix，AMOLED)。当所述驱动层50采用PMOLED方式，所述开关电路可以选择薄膜晶体管(Thin-film transistor，TFT)作为开关管，通过所述扫描电路的作用，实现静态驱动或动态驱动。当所述驱动层50采用AMOLED方式，所述开关电路可以选择低温多晶硅薄膜晶体管(Low Temperature Poly-Si Thin Film Transistor，LTP-Si TFT)、非晶硅TFT、多晶硅TFT、氧化物半导体TFT或者有机TFT等等作为开关管。
所述显示面板60包括显示单元和上述任一实施例中的覆晶薄膜模组100、100a、100b、100c、100d、100e、100f、100g、100h、100i、100j或100k，其中，所述显示单元与所述芯片20通信连接，以进行发光显示。
所述保护层70用于保护显示面板60，其中，所述保护层70可以包括诸如ZrO，CeO 2、ThO 2等等的物质。所述保护层70可以形成透明膜以覆盖显示面板60的整个表面。
如前所述，本申请实施例提供的所述显示装置200通过采用柔性材料制造而具有柔性，变得可折弯。在一些实施例中，所述显示装置200不仅可折 弯，而且还可透明，例如，制造所述显示装置200的材料采用柔性透明元件，所述基底40由诸如透明塑料的聚合物质组成，所述驱动层50使用透明晶体管，所述显示面板60中的有机发光二极管器件采用透明材料，因此，所述显示装置200便可以变得柔性而透明。
所述透明晶体管是通过利用诸如氧化锌或二氧化钛之类的透明物质制造成的TFT晶体管替换相关技术由不透明硅制造的TFT晶体管。此外，透明电极可以由诸如铟锡氧化物(Indium tin oxide，ITO)或者石墨烯的材料组成。石墨烯具有由碳原子构成的蜂巢晶格面结构，并且具有透明性。此外，透明有机发光层可以利用各种各样的物质实现。
借助柔性性质，所述显示装置200可通过设置诸如弯曲传感器之类，利用弯曲传感器检测的弯曲参数，以实现各类应用功能地执行，从而极大提升用户的体验感。
与现有技术相比较，本申请显示装置200的显示面板60中提供了一种覆晶薄膜模组100、100a、100b、100c、100d、100e、100f、100g、100h、100i、100j或100k，通过在距离所述连接端子的预设距离内设置所述消应力结构，可使得所述柔性基板弯曲时，所述消应力结构减小所述连接端子受到的应力，可防止所述芯片在弯折状态下脱焊，提高所述覆晶薄膜模组在弯折状态下的可靠性。
最后应说明的是：以上实施例仅用以说明本申请的技术方案，而非对其限制；在本申请的思路下，以上实施例或者不同实施例中的技术特征之间也可以进行组合，步骤可以以任意顺序实现，并存在如上所述的本申请的不同方面的许多其它变化，为了简明，它们没有在细节中提供；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。

Claims (17)

  1. 一种覆晶薄膜模组，其特征在于，包括：
    柔性基板，所述柔性基板包括消应力结构；以及
    芯片，所述芯片包括连接端子，所述连接端子将所述芯片固定连接于所述柔性基板上，所述消应力结构与所述连接端子间隔预设距离，以使所述柔性基板弯曲时，所述消应力结构可减小所述连接端子受到的应力。
  2. 根据权利要求1所述的一种覆晶薄膜模组，其特征在于，所述消应力结构包括部分环绕所述连接端子设置的凹槽。
  3. 根据权利要求2所述的一种覆晶薄膜模组，其特征在于，所述环绕连接端子设置的凹槽至少部分凹槽贯穿所述柔性基板。
  4. 根据权利要求1所述的一种覆晶薄膜模组，其特征在于，所述消应力结构包括多个间隔设置的凹槽，所述间隔设置的凹槽呈齿状。
  5. 根据权利要求4所述的一种覆晶薄膜模组，其特征在于，所述多个间隔设置的凹槽中，至少部分凹槽贯穿所述柔性基板。
  6. 根据权利要求1所述的一种覆晶薄膜模组，其特征在于，所述消应力结构的数量为至少两个，所述至少两个消应力结构分别设置于所述连接端子的相对两侧。
  7. 根据权利要求6所述的一种覆晶薄膜模组，其特征在于，
    所述芯片为矩形；
    所述连接端子沿所述芯片的边缘处并排设置；
    位于所述连接端子的相对两侧的所述至少两个消应力结构相对于所述矩形的一对称轴对称；
    每个所述消应力结构相对于所述矩形的另一对称轴对称。
  8. 根据权利要求7所述的一种覆晶薄膜模组，其特征在于，每个所述消应力结构包括一个第一直线槽，所述第一直线槽平行于所述矩形的其中一条 边。
  9. 根据权利要求7所述的一种覆晶薄膜模组，其特征在于，每个所述消应力结构包括第一直线槽和第二直线槽；
    所述第一直线槽的数量为一个，并且平行于所述矩形的其中一条边；
    所述第二直线槽的数量为两个，两个所述第二直线槽分别从所述第一直线槽的两端朝同一方向延伸，且两个所述第二直线槽均与所述第一直线槽形成一夹角，所述夹角朝向所述连接端子；
    位于所述连接端子的相对两侧的所述第二直线槽相向延伸。
  10. 根据权利要求9所述的一种覆晶薄膜模组，其特征在于，
    所述夹角为钝角、直角或锐角。
  11. 根据权利要求7所述的一种覆晶薄膜模组，其特征在于，每个所述消应力结构包括第一直线槽和第二直线槽；
    所述第一直线槽和所述第二直线槽的数量均为一个；
    所述第一直线槽的一端与所述第二直线槽的一端连接，所述第一直线槽与所述第二直线槽的连接处形成一夹角；
    所述夹角朝向所述连接端子。
  12. 根据权利要求11所述的一种覆晶薄膜模组，其特征在于，
    所述夹角为钝角、直角或锐角。
  13. 根据权利要求7所述的一种覆晶薄膜模组，其特征在于，每个所述消应力结构包括直线槽和弧形槽；
    所述直线槽的数量为一个，并且平行于所述矩形的其中一条边；
    所述弧形槽的数量为两个，两个所述弧形槽分别从所述直线槽的两端延伸，并且朝向所述连接端子弯曲。
  14. 根据权利要求7所述的一种覆晶薄膜模组，其特征在于，每个所述消应力结构包括一个弧形槽，所述弧形槽朝向所述连接端子弯曲。
  15. 根据权利要求6至14任一项所述的一种覆晶薄膜模组，其特征在于， 所述消应力结构为镂空槽或非镂空槽。
  16. 一种显示面板，其特征在于，包括显示单元及如权利要求1至15任一项所述的覆晶薄膜模组；其中，所述显示单元与所述芯片通信连接。
  17. 一种显示装置，其特征在于，包括：
    基底；
    驱动层，所述驱动层设置于所述基底上；以及
    如权利要求16所述的显示面板，所述显示面板设置于所述驱动层上，所述驱动层用于驱动所述显示面板。
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