WO2020098868A1

WO2020098868A1 - Device for laser cutting shielded conductors, and method for laser cutting shielded conductors using a laser cutting device of this kind

Info

Publication number: WO2020098868A1
Application number: PCT/DE2019/100932
Authority: WO
Inventors: Herbert Mannherz; Tobias Mißlinger
Original assignee: Md Elektronik Gmbh
Priority date: 2018-11-16
Filing date: 2019-10-29
Publication date: 2020-05-22
Also published as: DE102018128922A1

Abstract

A laser cutting device (3) comprises a laser unit (4) for generating a laser beam (5). A housing assembly (15) defines a cutting chamber (10) and comprises a conductor introduction opening (9a) and a laser inlet region (9b). A shielded conductor (1) to be cut using the laser beam (5) can be arranged in the cutting chamber (10). There are provided n individual mirrors (8₁,..., 8_n), which are arranged offset to one another around the cutting chamber (10) within the housing assembly (15) and are designed to reflect the laser beam (5) in the direction of the shielded conductor (1). A laser beam deflection device (13) is designed to guide the laser beam (5) such that it is incident in turn on one of the n individual mirrors (8₁,..., 8_n). The n individual mirrors (8₁,..., 8_n) are mounted by their own fastening means on the housing assembly (15) so as to be separate from one another and/or a protective glass assembly (16) is arranged between the n individual mirrors (8₁,..., 8_n) and the cutting chamber (10), which assembly is transparent to the wavelength range of the laser beam (5).

Description

Laser cutting device for shielded lines and method for laser cutting shielded lines with such a laser cutting device

description

The invention relates to a laser cutting device for shielded lines and a method for laser cutting shielded lines with such a laser cutting device. The laser cutting device according to the invention is particularly suitable for making uniform circumferential cuts on shielded lines.

In order to assemble shielded cables, for example to provide them with a connector, a large number of work steps are necessary depending on the number of conductors and the different layers that make up such a shielded cable. In the case of a coaxial line, not only the at least one inner conductor or, in the case of an HSD line (high-speed data), the several inner conductors must be exposed, but also the outer conductors, which are shield wires and / or shield foils, for example be exposed and arranged in such a way that a line end prepared in this way can be provided with a plug connector.

The exposure of the individual electrical lines or wires of a shielded line can be done by hand on the one hand and by machine on the other hand. The quality and the throughput when manually removing the shielding wires and / or shielding foils are highly person-dependent. Even with automated

Removing the reject rate can be significant. This is particularly the case because rotating knives which are subject to very high wear are often used to remove these components. If these are not changed in time, the reject rate increases.

To make it easier to assemble shielded lines, US Pat. No. 4,761,535 A proposes using a laser for cutting cables. The Laser beam is focused via a first mirror in the direction of the cable to be cut. Another curved mirror is arranged in the beam path of the laser after the cable and focuses the laser beam on the opposite side of the cable. The cable is movably arranged on a carriage. The movement of the carriage moves the laser beam on the peripheral wall of the cable to be cut. A first portion of the peripheral wall can be cut by the first mirror and a second portion of the peripheral wall can be cut by the second mirror

A disadvantage of US Pat. No. 4,776,135 A is that the cuts are uneven and the laser process takes a long time due to the speed of the carriage.

In contrast, the subsequently published EP 17 171 445 explains that the cable is arranged stationary during the cutting process. Instead, the laser beam is guided accordingly for the cutting process, the laser beam striking an annular mirror device which delimits the cutting space of the cable. This ring mirror device extends 360 ° around the line to be cut. The laser beam itself is guided on a circular path along this ring mirror device and is reflected by it onto the line to be cut. The laser beam itself then moves around in the circumferential direction on the line to be cut.

It is therefore the object of the present invention a laser cutting device for shielded lines and a method for

To create laser cutting of shielded lines, with the help of which the processing costs of the lines are kept as low as possible, by reducing maintenance costs for the laser cutting device or maintenance-related failures of this laser cutting device to a minimum.

The object is achieved with respect to the laser cutting devices for shielded lines by claim 1 and with regard to the method for

Laser cutting solved by claim 25. Claims 2 to 24 explain further developments of the laser cutting device according to the invention and claim 26 explains further developments of the method for laser cutting according to the invention. The laser cutting device according to the invention is used in particular for the laser cutting of shielding wires and / or shielding foils. Shield wires consist in particular exclusively of a metal braid, whereas shield foils consist in particular of a plastic which is vapor-coated with a metal, for example aluminum, with a layer thickness of preferably 10 to 20 μm. The shielding film in particular comprises a PET film. The laser cutting device also comprises a laser device which is designed to generate a laser beam. The laser beam can have different wavelengths. For example, it can operate in a wavelength of 1060 nm to 1064 nm or 1600 nm. It would also be possible for it to operate in a wavelength of 10600 nm. The laser device can therefore change the wavelength accordingly or the laser device comprises different lasers which can be switched on in succession.

Furthermore, a housing arrangement is provided which delimits a cutting space. The housing arrangement is open on its end faces, as a result of which a cable entry opening is formed on the first end face and a laser entry region is formed on the second end face, which lies opposite the first end face. The cutting room is accessible from outside the housing arrangement through these openings. The shielded cable to be cut can be inserted through the cable entry opening and the laser beam can be fed to the cutting room via the laser entry area. The shielded cable to be cut can be arranged in particular in the cutting room along a central axis. A mirror arrangement is also provided which comprises n individual mirrors with n>

2, 3, 4, 5, 6, 7 or n> 8. These n individual mirrors are arranged offset from one another around the central axis within the housing arrangement. The n individual mirrors are designed to reflect the laser beam in the direction of the shielded cable. For this purpose, the laser beam preferably strikes the shielded line at an angle of approximately 90 °.

Furthermore, a laser beam deflection device is provided which is designed to guide the laser beam in such a way that the laser beam enters through the laser entry region and strikes one of the n individual mirrors. The laser beam deflection device is further designed to guide the laser beam in such a way that it alternately strikes one of the n individual mirrors and can be reflected by the latter in the direction of the shielded line, as a result of which the shielded line can be cut along its circumference. The n individual mirrors are included At least one separate fastening means is mounted separately from one another on the housing arrangement or a protective glass arrangement is provided between the n individual mirrors and the cutting space, which is transparent for the wavelength range of the laser beam of the laser device.

It is particularly advantageous that n individual mirrors are used, which are arranged in the circumferential direction around the line to be cut, and that the laser beam can be directed alternately onto the individual n individual mirrors by the laser beam deflection device, so that the line to be cut is along its circumference is cuttable. As a result, all points on the circumference of the shielded cable are evenly heated by the laser beam and ultimately cut. The energy distribution on the circumference of the shielded cable is (approximately) constant over the circumference. This ensures that the cutting process is carried out uniformly and that certain layers of the shielded cable have not already been cut through, whereas these layers are only partially cut in another area of the circumference. Damage underneath the layer to be cut can thereby be reliably avoided.

Furthermore, it is advantageous that the individual mirrors can be mounted on the housing arrangement separately from one another. If an individual mirror is damaged, this individual mirror can be specifically replaced and replaced with a new individual mirror. Such damage can occur, for example, if residues of the line to be cut fall onto this individual mirror and burn themselves there, for example. The production of a single mirror is also less complicated and therefore less expensive than the production of the rotating ring mirror device. It is also particularly advantageous to use a protective glass arrangement which is arranged between the respective individual mirror and the line to be cut, that is to say the cutting space. When using such a protective glass arrangement, no residues caused by the cutting process can become attached to one of the individual mirrors. These residues can be cut off shield wires, for example. The service life of the individual mirrors increases considerably. Maintenance is to be carried out less frequently with the laser cutting device according to the invention than with laser cutting devices from the prior art. The term "transparent" is understood to mean that more than 90% of the power, more than 95% of the power, more than 98% of the power or more than 99% of the power of the laser beam is transmitted through the protective glass arrangement.

In a preferred embodiment of the laser cutting device, the laser beam deflection device is designed to guide the laser beam at least along a partial distance on a reflection surface of the respective individual mirror. As a result, there is no permanent point loading on the reflection surface and therefore no point loading on the line to be cut. The pipe can be cut more evenly along its circumference. A stronger wear of the reflection surface by an energy input with a permanent point exposure despite good reflection properties would therefore be avoided.

These individual mirrors are preferably arranged symmetrically around the central axis and thus around the line to be cut. They are also preferably in one plane, this plane preferably being oriented perpendicular to the central axis and thus perpendicular to the line to be cut. The n individual mirrors are also preferably arranged equidistant from the central axis. They are preferably also arranged and aligned in such a way that the laser beam is preferably reflected at an angle of 90 ° onto the line to be cut. Deviations from this are preferably conceivable of less than 25 °, 20 °, 15 °, 10 ° or less than 5 °.

In a particularly preferred embodiment, a control device is provided which is designed to control the laser beam deflection device and the laser device accordingly. The control device is designed to switch on the laser device only when the

Laser beam deflection device is oriented such that the laser beam strikes one of the n individual mirrors or to switch off the laser device if the laser beam deflection device is oriented such that the laser beam does not strike any of the n individual mirrors. In this case, it is ensured that the energy of the laser beam hits only the respective individual mirrors and not objects that are located between the individual mirrors and that would also be illuminated when the laser beam deflection device is adjusted if the laser beam is switched on permanently. In a preferred embodiment of the laser cutting device, the inner wall of the housing arrangement comprises n receiving openings. One of the n individual mirrors is inserted and fastened in each of these n receiving openings. It is particularly advantageous here that the individual mirrors can each be inserted at the correct location and precisely aligned through these receiving openings. This simplifies the assembly process.

The shape of these receiving openings can be coded. The individual mirrors then have a shape corresponding to the coded shape of the receiving openings. In this case, for example, each individual mirror can only be inserted into a specific receiving opening. In addition or alternatively, it can also be the case that each individual mirror can also be inserted into each or exactly one receiving opening only in a specific orientation and angular position. In principle, it can be said that all individual mirrors are preferably constructed identically. They are preferably also constructed symmetrically so that twisting a single mirror has no effect on the cutting result (e.g. if the single mirror is round in plan view). In order to be able to ensure precise positioning of the individual mirrors, a (plate) spring is preferably arranged between a rear side of the respective individual mirror and a receiving base of the respective receiving opening, which spring is designed to press the respective individual mirror away from the receiving base. A part of the respective individual mirror, which is preferably arranged opposite the back of the respective individual mirror, rests on a support shoulder of the inner wall. The respective individual mirror is then pressed against this support shoulder by the spring force and held in position. This then ensures that the laser beam is always optimally reflected on the line to be cut. Additionally or alternatively, the individual mirrors could also be attached to an inner wall of the housing arrangement by means of a screw connection. The screw connection can then be used to set a distance of the respective individual mirror from the inner wall of the housing arrangement or from the central axis. Depending on the screw thread, i.e. depending on the pitch of the thread, this distance can be set to different degrees.

In a further preferred embodiment, a nozzle device is also provided. The nozzle device is penetrated by the central axis and arranged between the cable insertion opening and the laser entry area. The cutting space is limited in the direction of the laser entry area by the nozzle device. The nozzle device comprises at least one nozzle and is designed to blow air or a process gas into the cutting space (along the central axis). Furthermore, a suction device is provided which has one or more suction openings. These one or more suction openings are arranged in particular closer to the cable insertion opening than the at least one nozzle of the nozzle device. The supplied air or the supplied process gas or the emissions arising from the laser cutting process and / or the cut off parts of the shielded line can be sucked in via this suction device. The cutting process can be accelerated by blowing in a process gas. Air or the process gas itself simultaneously cool the individual mirrors and the line or the actual processing point. The blowing in also prevents residues (eg particles) from settling on the individual mirrors. When using a protective glass arrangement, the blowing in prevents residues from adhering to it and the protective glass arrangement is also cooled.

In a special embodiment, the protective glass arrangement can consist of n protective glasses. Each of these n protective glasses is arranged between one of the n individual mirrors and the cutting space and between the nozzle device and an inner wall of the housing arrangement. Alternatively, the protective glass arrangement can also consist of a protective glass ring, all of which n

Individual mirror separated from the cutting room. The protective glass arrangement seals the cutting space from the respective n individual mirrors in a dustproof and / or airtight manner. In a further preferred embodiment of the laser cutting device, a transport device is provided. This is designed to hold the shielded cable and to drive through the cable entry opening into the cutting room. The transport device and the n individual mirrors are arranged to be relatively immovable relative to one another or stationary during laser cutting. Additionally or alternatively, the transport device also includes one

Widening, this widening abutting the cable insertion opening during laser cutting and sealing it to the outside of the housing arrangement in a laser-tight and / or dust-tight and / or air-tight manner. This is ensures that the laser beam cannot escape to the outside and that cut parts of the line to be cut cannot get into other production processes. This would be disadvantageous in that cut-off shield wires that get caught in the line can trigger a short circuit. A cable harness that includes such a line would then have to be replaced. If assembly has already been carried out in a motor vehicle, considerable costs are to be expected here. In a preferred development, the laser beam deflection device comprises at least a first and a second mirror arrangement, and at least a first and a second adjusting device. The adjustment devices are preferably electric motors and / or piezo actuators. The mirror arrangements are arranged in the beam path of the laser beam and are designed to guide the laser beam accordingly so that it always strikes one of the n individual mirrors in alternation. The laser beam is preferably reflected from the first mirror arrangement to the second mirror arrangement and from the second mirror arrangement (or the last mirror arrangement) to the rotating mirror wall. The laser beam deflection device can also comprise further mirror arrangements. The first adjustment device is designed to twist and / or pivot the first mirror arrangement in such a way that the laser beam is adjusted or moved predominantly or exclusively along the Y axis. In this case, the second adjustment device is designed to rotate and / or pivot the second mirror arrangement such that the laser beam predominantly or exclusively along the

Z axis is adjusted or moved. In another embodiment, the first adjustment device can move or move the laser beam predominantly or exclusively along the Z axis and the second adjustment device can move or move the laser beam predominantly or exclusively along the Y axis. It is emphasized that the Y axis and the Z axis are at an angle of 90 ° to one another and that the two axes are in turn at an angle of 90 ° to the X axis, the X axis running along the central axis. This makes it possible for the laser beam to be guided over the individual mirrors very quickly (several rounds per second). In both cases the laser beam would be guided in a YZ plane. An additional adjustment along the X axis would also be possible. The shielded cable can be cut very precisely with a low energy input per revolution or around the laser beam. Such a cutting process requires that the laser beam hits each of the n individual mirrors alternately, preferably more than 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20 or more than 30 times per second . The laser beam is preferably directed at each of the n individual mirrors alternately less than 50 times per second.

In principle, it would also be possible for the laser beam deflection device to also include a robot arm that guides the laser beam.

In a further preferred embodiment, the central axis runs through the last mirror arrangement, in this case through the second mirror arrangement. As a result, the laser cutting device is particularly symmetrical, which allows precise and reproducible cuts on the entire circumference of the shielded line.

The method according to the invention for laser cutting with such a laser cutting device comprises several method steps. In a first process step, the shielded cable to be cut is prepared accordingly. These are to be understood in particular as the steps which provide for the exposure of the corresponding layers to be cut. In a further process step, the line is introduced into the shielded cutting room, so that in a subsequent step the laser beam can strike one of the n individual mirrors through the laser entry area in order to be away from it

Individual mirror to be reflected in the direction of the line to be cut. In a further step, the laser beam is (permanently) guided in such a way that it alternately strikes another of the n individual mirrors and is reflected by the respective individual mirror in the direction of the shielded line, so as to cut the shielded line along its circumference. It is particularly advantageous that no movement of the shielded line is necessary and at the same time an optimal cutting result is achieved because each point in the cutting area of the peripheral line of the shielded line is illuminated over approximately the same time period with approximately the same laser power and the same optical conditions. Various exemplary embodiments of the invention are described below by way of example with reference to the drawings. The same items have the same reference numerals. The corresponding figures in the drawings show in detail:

Figures 1A and 1B:

an exemplary structure of a coaxial line and an HSD line;

Figures 2A and 2B:

various steps that explain how to prepare a coaxial line and an HSD line and which parts of each line are cut in a laser cutting process;

Figure 3: a shielded line, its shield wires and their

Screen film was cut; Figure 4A: an embodiment of the invention

Laser cutting device with several individual mirrors and a laser beam deflection device;

Figures 4B and 4C:

various enlarged representations of an area around a cutting room from FIG. 4A;

Figure 5 is a sectional view showing a way to

Fixing a single mirror describes in more detail;

Figure 6: a simplified representation showing the separation of the

Describes cutting room of the individual mirrors through a protective glass arrangement; Figures 7A, 7B, 7C and 7D:

different representations, from which the use of different numbers of individual mirrors and their arrangement to each other emerge; Figure 8: another embodiment of the invention

Laser cutting device with a housing cover; and Figures 9A, 9B and 9C:

Various flow diagrams that explain a method according to the invention for laser cutting shielded lines.

FIGS. 1A and 1B show various exemplary embodiments of a shielded line 1, which are cut with a laser cutting device 3 described later. FIG. 1A shows a shielded line 1 in the form of a coaxial line. This comprises an outer jacket 1a, which preferably consists of an (elastic) dielectric such as plastic. Under this outer jacket shield wires 1 b are arranged, which can also be referred to as a shield wire braid. However, these shield wires 1 b are optional. These shield wires 1 b consist of a metal and are electrically conductive. A shielding foil 1c is preferably located under these shielding wires 1b or the shielding wire mesh. This shielding film 1c is optional, preferably at least the shielding wires 1b or the shielding film 1c being present. This shielding film 1c preferably comprises a dielectric material, in particular a plastic film (e.g. PET film), onto which a metal has been vapor-deposited or sputtered. The layer thickness of this metal, which can be aluminum, for example, is preferably

10 pm to 20 pm.

A dielectric 1d, which consists of an electrical insulator, in particular an (elastic) plastic, is arranged below this shielding film 1c.

This dielectric 1d surrounds an inner conductor 1e, which is made of an electrically conductive material such as e.g. Copper exists or includes one.

In contrast, an HSD line 1 is shown in FIG. 1B. The structure with respect to the outer sheath 1a, the shield wires 1b and the shielding foil 1c corresponds to that of the coaxial line 1 from FIG. 1A. Instead of a dielectric 1 d, which comprises an inner conductor 1e, the shielding film 1c in FIG. 1B surrounds several dielectrics 1 d, each of these dielectrics 1d having an inner conductor 1e includes, that is, surrounds. The HSD line 1 from FIG. 1B therefore comprises a plurality of inner conductors 1e, preferably 2, 3, 4, 5, 6, 8, 10 or more inner conductors 1e, each inner conductor 1e being surrounded by its own dielectric 1d. The dielectrics 1d are then surrounded together by the shielding film 1c. Such a structure allows a higher data set, in particular if a differential signal such as LVDS (low voltage differential signaling) is used.

As mentioned in the introduction, the aim of this invention is to assemble the shielded line 1 as fully automatically as possible, that is to be able to provide it with a plug connector. For this purpose, certain layers must be exposed, in which different parts of a plug connection, not shown, engage and make electrical contact with them. This state of affairs is explained in more detail with reference to FIGS. 2A and 2B.

FIG. 2A shows a shielded line 1 in the form of a coaxial line 1, as has already been shown with regard to its structure in FIG. 1A, to which reference is hereby made. In order to be able to assemble the shielded line 1 accordingly, the shielded line 1 is processed as explained below, that is to say it is prepared for assembly. The individual processing steps run in

Figure 2A from top to bottom. At the beginning, the shielded cable 1 can be labeled (optional). This is identified here with the example lettering "XXXX.XX". The outer jacket 1a is shown. The shielded line 1 is cut to a certain length.

Then the outer sheath 1a and layers below it are cut down to the dielectric 1d to a predetermined stripping length and removed. The dielectric 1d appears. Then the outer jacket 1a is again set to a predetermined one

Cut the length of the stripping and the piece of waste of the outer sheath 1a is partially pulled off, so that the shield wires 1b underneath come to the fore. A support impulse 2 or a support sleeve 2 is pressed onto these visible shield wires 1b. This Stützerimp 2 is preferably arranged axially immovable on the shielded line 1.

In a further step, the waste piece of the outer casing 1a is completely removed. Then the shield wires 1 b are folded back over the support impulse 2 or the support sleeve 2. The shielding foil 1c lying under the shielding wires 1b therefore appears.

In the next step, the screen wires 1b and / or the screen film 1c are cut and shortened accordingly by means of a laser. The laser cutting takes place at the shield wires 1b where the support arm 2 or the support sleeve 2 is located below the shield wires 1b. The cut shield wires 1b are removed and / or the cut shield foil 1c is pulled off. This results in the illustration of the shielded line 1 shown at the bottom in FIG. 2A. The shielded line 1 shown there can be used for further assembly. The laser cutting device 3 according to the invention serves, as will be explained later, to cut the shield wires 1b and the shielding foil 1c. Such a separation (circumferentially) is shown in dashed lines in FIG. 2A. This cut takes place on the entire circumference of the shielded line 1, only the shield wires 1b or only the shielding film 1c being cut through this cut. The layers below remain undamaged or are not cut. The cutting width is preferably less than 2 mm or less than 1.5 mm or less than 1 mm or less than 0.5 mm. The cutting takes place only at exactly one point on the circumference of the shielded line 1 at the same time. A shielded line 1 in the form of a coaxial line is shown in more detail in FIG. The separating cuts carried out are shown by means of the laser cutting device 3. The shield wires 1b are shortened and the shielding foil 1c is cut. FIG. 2B, on the other hand, shows how a multi-core shielded line 1 for the

Preparation is prepared. This shielded line 1 is preferably an HSD line 1, as has been explained with reference to FIG. 1B, to which reference is hereby made. The steps are approximately the same as for the coaxial line 1 from FIG. 2A. Only at the beginning can it still be decided whether the outer sheath 1a with the shielding wires 1b or the shielding braid 1b and the shielding foil 1c is completely removed or whether the outer sheath 1a is not only cut and partially removed, so that the shielding wires 1b appear to which the support impimp 2 or the support sleeve 2 is placed. The last illustration in FIG. 2B shows the different dielectrics 1d which surround the individual inner conductors 1e. As already explained, the separating cut is carried out by means of the laser cutting device 3 according to the invention at the same location as in the shielded coaxial line 1 from FIG. 2A, to which reference is hereby made.

FIG. 4A shows an exemplary embodiment of the laser cutting device 3 according to the invention.

The laser cutting device 3 comprises at least one laser device 4, which is designed to generate a laser beam 5. This laser beam 5 can have different wavelengths. The shielding wires 1b are preferably cut with a laser beam 5 which has a different wavelength than the laser beam 5 with which the shielding film 1c is cut. The shield wires 1b are preferably cut with a solid-state laser such as, for example, a fiber laser, disk laser or UKP laser (ultra-short pulse laser), which has a wavelength in the infrared range of, for example, 1060 to 1064 nm or approximately 1600 nm. The screen film 1c, which is partially made of plastic, is cut with a solid-state laser or a gas laser, depending on the side on which the metal or metal substrate is applied. A solid-state laser is used in particular when the metal or the metal substrate is applied to the side of the shielding film which faces outwards, ie away from the cable interior. Otherwise, a gas laser is preferably used, preferably a CO2 laser, which has a wavelength of approximately 10,600 nm. The metal or the vapor-deposited or sputtered-on metal substrate is heated by a solid-state laser, so that it cuts through the film underneath. This works regardless of how the screen film 1c is applied. For example, this can be applied partially overlapping or wound. The procedure is similar when using a gas laser.

Furthermore, a telescopic device 6 is provided, which is preferably arranged at the output of the laser device 4, that is to say in the beam path of the laser beam 5. The telescopic device 6 is designed to change the focusing of the laser beam 5, thereby causing different diameters and / or working distances of the shielded line 1 by moving the Mirror positions in the telescopic device can be reacted to. If the line 1 is thinner, the telescope device 6 can be controlled in such a way that the focusing of the laser beam 5 changes so that it is focused on the shielded line 1 with its reduced diameter. The same applies to a thicker line 1. The telescopic device 6 is preferably controlled by a control device 7 (see FIG. 8). This control device 7 also controls the laser device 4 (laser power, activation or deactivation, wavelength)

The telescopic device 6 can consist of different lenses 6a, 6b, which can be moved relative to each other. The position and orientation of the line 1 to be cut can optionally still be precisely recorded using a camera system (not shown) and the laser cutting device 3 can be controlled accordingly.

The laser cutting device 3 also comprises a housing arrangement 15 which delimits a cutting space 10. The housing arrangement 15 is open at its end faces 15a, 15b. A cable insertion opening 9a is formed on the first end face 15a. A laser entry region 9b is formed on the second end face 15b, which lies opposite the first end face 15a. The cutting space 10 is accessible from outside the housing arrangement 15 via these openings 9a, 9b. A shielded line 1 to be cut with the laser beam 5 can be arranged in the cutting space 10 along a central axis 11.

The central axis 11 preferably runs in alignment with a longitudinal axis of the shielded line 1, thus coincides with a longitudinal axis of the shielded line 1. The longitudinal axis of the shielded line 1 could also be spaced from the central axis 11 by preferably less than 5 cm, 3 cm, 2 cm, 1 cm, 0.5 cm. The shielded line 1 would then still be arranged "in the area" of the central axis 11. A mirror arrangement 8 is also provided, which comprises n individual mirrors 8 ₁ ,... 8 _n , with n> 2, 3, 4, 5, 6, 7, 8. The n individual mirrors 8 ₁ ,... 8 _n are arranged offset from one another about the central axis 11 within the housing arrangement 15. The n individual mirrors 8 ₁ ,... 8 _n are designed to reflect the laser beam 5 in the direction of the shielded line 1. Depending on which of the n individual mirrors 8 ₁ ,... 8 _n and which area in the respective individual mirror 8 ₁ ,... 8 _n, the laser beam 5 strikes this laser beam 5 at a different point (in the circumferential direction and / or in Axialerrichtung) of the shielded line 1 reflected. The different locations are spaced apart in the direction of the central axis 11. In the circumferential direction of the shielded line 1, it is therefore possible to make cuts in the shielded line 1 which are offset from one another and extend along the entire circumferential direction of the shielded line 1.

A laser beam deflection device 13 is provided so that the laser beam 5 can hit different areas of each individual mirror 8 ₁ ,... 8 _n and overall different individual mirrors 8 ₁ ,... 8 _n . This laser beam deflection device 13 is designed to guide the laser beam 5 in such a way that the laser beam 5 enters through the laser entry region 9b and strikes one of the n individual mirrors 8 ₁ ,... 8 _n . The laser beam deflection device 13 is further designed to guide the laser beam 5 in such a way that it strikes one of the n individual mirrors 8 ₁ ,... 8 _n alternately and is reflected by the latter in the direction of the shielded line 1. As a result, the shielded line 1 can be cut along its circumference. The laser beam deflection device 13 guides the laser beam 5 back and forth very quickly between the individual individual mirrors 8 ₁ ,... 8 _n , so that each of these n individual mirrors 8 ₁ ,... 8 _n per second, preferably at least 5, 10, 15,. 20, 25, 30, 40, 50, 60, 70, 80, or more than 90 times with the laser beam 5 is illuminated. Due to the reflection of the laser beam 5 in the direction of the shielded line 1, a uniform energy input can be achieved.

The laser beam deflection device 13 is also designed to guide the laser beam 5 at least along a section 40 (see FIG. 7B) on a reflection surface 8a of the respective individual mirror 8 ₁ ,... 8 _n . As a result, the laser beam is reflected at other points on the line 1 to be cut, so that a circumferential cut can be made. Depending on the material to be cut, another laser device 4 can be used. Line 1 must be at Change of the laser device 4 or the laser source are preferably not moved. Depending on the location on the shielded line 1 at which the circumferential cut is to be made, the laser beam deflection device 13 can be controlled such that it guides the laser beam 5 onto a region of the reflection surface 8a of the respective individual mirror 8 ₁ ,... 8 _n , which is sometimes closer to the cable insertion opening 9a and sometimes further away from the cable insertion opening 9a, so that the reflected laser beam 5 travels along a longitudinal axis of the line 1 to be cut. Thus, a cut can be made in the circumferential direction at one point of the shielded line 1 in order to cut off the shield wires 1b, and a further cut can be made at another point which is offset in the longitudinal direction of the shielded line 1, for example in order to cut the shielding foil 1c . Line 1 does not have to be moved.

Basically, the laser beam deflection device 13 can direct the laser beam 5 onto one of the n individual mirrors 8 ₁ ,... 8 _n , in order to then guide it to a partial distance 40 on the reflection surface 8 a of this individual mirror 8 ₁ ,... 8 _n , or . to move it to another single mirror 8 ₁ , ... 8 _n . It would also be possible for the laser beam deflection device 13 to direct the laser beam only to a specific point on the reflection surface 8a of an individual mirror 8 ₁ ,... 8 _{n in} order to then alternately direct it to the other individual mirrors 8 ₁ ,... 8 _n . If the laser beam 5 is then again directed onto the same individual mirror 8 ₁ ,... 8 _n , then the laser beam

Deflect the laser beam 5 at another point on the reflection surface 8a of the corresponding individual mirror 8 ₁ ,... 8 _n .

Figures 7B, 7C and 7D show the use of four, six and eight individual mirrors 8 ₁ , ... 8 _n . The individual mirrors 8 ₁ , ... 8 _n are evenly spaced from one another. In this case, they are each offset by a = 360 h from one another about the central axis 11 and thus around the line 1 to be cut. The n individual mirrors 8 ₁ , ... 8 _n lie in one plane. In this exemplary embodiment, they are also arranged equidistant from the central axis 11. A different distance would also be conceivable here. FIG. 4A furthermore shows that the n individual mirrors 8 ₁ ,... 8 _n are arranged and aligned in such a way that the laser beam 5 is deflected by the respective individual mirror 8 ₁ ,... 8 _n such that it is perpendicular to the central axis 11 strikes the line 1 to be cut. It could also run through an angle that deviates from it by less than +/- 25 ° or less than +/- 20 °, 15 °, 10 °, 5 °.

The laser beam deflection device 13 is preferably designed to guide the laser beam 5 in such a way that it walks or describes a two-dimensional path on the respective individual mirror 8 ₁ ,... 8 _n .

In other words, this means that in the event that the central axis 11 is also referred to as the X axis, the laser beam 5 is only moved on the respective individual mirror 8 ₁ ,... 8 _n in the Y direction and Z direction, where the Y and Z

Axis are perpendicular to each other and both axes are aligned perpendicular to the X axis, that is to the central axis 11.

The laser beam deflection device 13 preferably comprises at least a first mirror arrangement 13a and a second mirror arrangement 13b, as well as at least a first adjustment device 14a and a second adjustment device 14b. The mirror arrangements 13a, 13b are arranged in the beam path of the laser beam 5. The laser beam 5 first strikes the first mirror arrangement 13a and is reflected from the first mirror arrangement 13a to the next, in this case to the second and last mirror arrangement 13b. In the second or last

Mirror arrangement 13b, the laser beam 5 is further reflected in the direction of the respective individual mirror 8 ₁ , ..., 8 _n . The second or last mirror arrangement 13b lies in the central axis 11. The central axis 11 therefore runs through the second or last mirror arrangement 13b.

Both mirror arrangements 13a, 13b can have a rectangular or round mirror surface which, for example, comprises the same material as the respective individual mirrors 8 ₁ , ..., 8 _{n of} the mirror arrangement 8. The two mirror arrangements 13a, 13b or all mirror arrangements 13a, 13b are preferably arranged in a common plane. This plane is preferably perpendicular to the central axis 11. In this case, the two are Mirror arrangements 13a, 13b in the Y direction or in the Z direction or in the Z direction and Y direction are arranged offset to one another. The adjustment devices 14a, 14b are then designed to direct or guide the laser beam 5 in such a way on the respective individual mirror 8 ₁ ,... 8 _n , that is to say to reflect and along the respective individual mirror 8 ₁ ,..., 8 _n to guide over at least a section 40, so that the laser beam 5 follows a two-dimensional path around the central axis 11. This path is preferably interrupted because the laser device 4 is switched off if the laser beam 5 would not strike an individual mirror 8 ₁ ,..., 8 _n . A corresponding guidance can be realized in that the first adjustment device 14a rotates and / or swivels the first mirror arrangement 13a in such a way that the laser beam 5 is adjusted or moved predominantly or exclusively along the Y axis, whereas the second adjustment device 14b is designed for this purpose to rotate and / or pivot the second mirror arrangement 13d in such a way that the laser beam 5 is predominantly or exclusively adjusted or moved along the Z axis. In this case, the first mirror arrangement would move in the XY plane and the second mirror arrangement in the XZ plane.

The axes could also be interchanged. In principle, it would therefore also be possible for the first mirror arrangement 13a to move in the X-Z plane, whereas the second mirror arrangement 13b is moving in the X-Y plane. In principle, all mirror arrangements 13a, 13b can also be in all three

Move levels. The adjustment devices 14a, 14b preferably comprise an electric motor or a piezo actuator.

The adjustment devices 14a, 14b are preferably controlled by the control device 7, which is shown in FIG.

The laser beam deflection device 13 is designed to guide the laser beam 5 such that it is preferably more than 2, 5, 8, 10, 15, 20, 25, 30, 35, 40, 50, 60, 70, 80, 90, 100 times per second strikes each individual mirror and is moved on the respective reflection surface 8a of the respective individual mirror 8 ₁ ,... 8 _n over a partial distance 40 in a YZ plane. The mirror arrangements 13a, 13b are preferably rotated and / or pivoted with respect to one another by the respective adjusting device 14a, 14b. The reflection surfaces 8a of one, several or all of the n individual mirrors 8 ₁ ,... 8 _n are inclined in the direction of the central axis 11. Depending on how far the laser beam 5 strikes the respective reflection surface 8a of the respective individual mirror 8 ₁ ,... 8 _n , spaced apart from the laser entry region 9b, the circular path diameter of the circular path through which the laser beam 5 travels changes. With regard to FIG. 7D, it is shown that a distance between two adjacent individual mirrors 8 ₁ ,... 8 _{n is} minimal. In principle, even adjacent individual mirrors 8 ₁ , ... 8 _{n could} touch. In this case, the laser beam would run almost a complete circular path (since it is guided in the YZ plane). As mentioned, the control device 7 is, however, designed to switch on the laser device 4 only when the laser beam deflection device 13 is oriented such that the laser beam 5 strikes one of the n individual mirrors 8 ₁ ,... 8 _n . The control device 7 is therefore designed to switch off the laser device 4 when the laser beam deflection device 13 is oriented such that the laser beam 5 does not strike any of the n individual mirrors. The

Laser device 4 is therefore switched off if the laser beam 5 would otherwise be guided between two individual mirrors 8 ₁ ,... 8 _n . This prevents other parts of the laser cutting device 3 from being affected.

FIG. 7B shows, for example, the section 40 over which the laser beam 5 is guided. Depending on the point at which the laser beam 5 is located on a reflection surface 8a of the corresponding individual mirror 8 ₁ ,... 8 _n , it is reflected on a different part of the circumference of the line 1 to be cut. A second section 41 is also shown, which is arranged offset in the X direction, that is to say along the central axis 11, from the first section 40. If the laser beam 5 is guided along this second section 41, it is reflected on another point which is offset in the longitudinal direction of the line 1 to be cut. Depending on how long the beam path of the laser beam is, the focal point must be corrected by shifting the lenses 6a, 6b of the telescopic device 6 to one another. The individual mirrors 8 ₁ ,... 8 _{n shown} comprise reflection surfaces 8 a, which are preferably planar. They could also be concave, convex or faceted. When viewed from above, the reflection surface 8a is round in this exemplary embodiment. It could also be oval, square, rectangular or trapezoidal.

With regard to FIG. 4A and FIGS. 6, 7A to 7D, it can be seen that the individual mirrors 8 ₁ ,... 8 _n are mounted on the housing arrangement 15 separately from one another. The individual mirrors 8 ₁ , ... 8 _{n are} each mounted with their own fastening means. This allows them to be exchanged individually, which means that costs can be kept low. An inner wall 18 of the housing arrangement 15 comprises n receiving openings 19. Exactly one of the n individual mirrors 8 ₁ ,... 8 _{n is} inserted into each of these n receiving openings 19. The individual receiving openings 19 can also be connected to one another to form a receiving groove running around the central axis.

Such a receiving opening 19 is shown enlarged in FIG. At least one spring is between a rear side 8b of the respective individual mirror 8 ₁ ,... 8 _n and a receiving base 19a of the respective receiving opening 19

23 arranged. This is designed to press the respective individual mirror 8 ₁ ,... 8 _n away from the respective receiving base 19a. A part of the respective individual mirror 8 ₁ ,... 8 _n, which is preferably arranged opposite the rear side 8 b of the respective individual mirror 8 ₁ ,... 8 _n , rests on a support shoulder 24 of the inner wall 18, with the spring force of the respective individual mirror 8 ₁ , ... 8 _n pressed against the respective support shoulder 24 and thereby held in position. This support shoulder 24 can rest on the reflection surface 8a of the respective individual mirror 8 ₁ , ... 8 _n . The respective individual mirror 8 ₁ ,... 8 _n could also include corresponding projections or fastening flanges which then rest on the support shoulder 24. In this case, among other things, the

The reflection surface 8a ends flush with the inner wall 18 and not as offset in FIG. 5.

In principle, the individual mirrors 8 ₁ ,... 8 _{n could} also be screwed tight to the inner wall 18 of the housing arrangement 15 via a screw connection (not shown). The screw connection could, for example, also be accessible from outside the housing arrangement 15. In this case, the receiving opening 19 is also accessible from outside the housing arrangement 15. The respective individual mirror 8 ₁ ,... 8 _n can therefore be inserted into the respective receiving opening 19 from outside the housing arrangement 15. Subsequently, the receiving opening 19 is closed with a corresponding cover or a housing segment '\ 5z. This cover or the housing segment '\ 5z is screwed to the housing arrangement 15 in particular via a screw connection 27. FIG. 4A also shows that a protective glass arrangement 16 is also provided, which is arranged between the n individual mirrors 8 ₁ ,... 8 _n and the cutting space 10. The protective glass arrangement 16 is for the

Wavelength range of the laser beam 5 of the laser device 4 transparent. The protective glass arrangement 16 prevents residues or other emissions that arise in the cutting room 10 from damaging the individual mirrors 8 ₁ ,... 8 _n . The protective glass arrangement 16 can comprise at least n protective glasses 16i, ... 16 _n . Each of these protective glasses 16i, ... 16 _n is arranged between each of the n individual mirrors 8 ₁ , ... 8 _n and the cutting room 10. In principle, it would also be possible for the protective glass arrangement 16 to comprise a protective glass ring which separates all n individual mirrors 8 ₁ ,... 8 _n from the cutting space 10.

The individual protective glasses 16i, ... 16 _n are transparent to the wavelength of the laser beam 5. They are preferably also transparent for several wavelengths, so that the wavelength of the laser beam 5 can be changed.

The protective glass arrangement 16 or the individual protective glasses 16i,... 16 _n can be designed in such a way that they only pass the laser beam 5 in one direction (ie from the respective individual mirror 8 ₁ ,... 8 _n into the cutting space 10). and reflect in the other direction.

With regard to FIG. 7D (ie when using many individual mirrors 8 ₁ ,... 8 _n ), it would also be possible for a first group of protective glasses 16i,... 16 _n to be transparent for a first wavelength and for a second group of protective glasses 16i, ... 16 _n for a second wavelength. These protective glasses 16i,... 16 _{n of} the different groups would then be arranged alternately around the central axis 11 for each individual mirror 8 ₁ ,... 8 _n . Each second individual mirror 8 ₁ , ... 8 _n could then be irradiated with a laser beam 5 with the first wavelength and the other individual mirrors 8 ₁ , ... 8 _n with a laser beam 5 with the second wavelength.

As a result, different layers of line 1 can be cut in a common process without the cable having to be removed again and inserted into a further laser cutting device. In FIG. 4A, a nozzle device 20 is also provided, which is penetrated by the central axis 11. The nozzle device 20 is arranged between the cable insertion opening 9a and the laser entry region 9b. The cutting space 10 is delimited in the direction of the laser entry region 9b by the nozzle device 20. The nozzle device 20 comprises at least one nozzle 20a which is designed to blow air or a process gas along the central axis 11 into the cutting space 10 and onto the line 1 to be cut. The nozzle device also comprises a housing structure 20b which holds the nozzle 20a. This housing structure 20b comprises side walls which diverge starting from the nozzle 20a and end in the area of the protective glass arrangement 16 and thus delimit the cutting space 10. The central axis 11 preferably passes through the nozzle 20a.

A suction device 21 is also provided, which has one or more suction openings 21a (see FIG. 6). The one or more suction openings 21a are arranged closer to the cable insertion opening 9a than the at least one nozzle 20a of the nozzle device 20. The suction openings 21a are preferably arranged on an inner wall 18 of the housing arrangement 15. Through this suction opening 21a through the

Air supplied to the nozzle device 20 or the process gas supplied and the emissions resulting from the laser cutting process or the cut parts of the shielded line 1 resulting therefrom are sucked in or sucked away. The n protection glasses 16i, ... 16 _n are, in principle, arranged between the nozzle member 20 (the housing structure 20b of the nozzle member 20) and the inner wall 18 of the housing assembly 15 °. , ... _n between two adjacent protective glasses 16i 16 a separating device is still arranged in each case (see Figure 6) 30th This separator 30 has grooves 30a in which the protection glass 16 i, ... 16 can be inserted with an edge region _n. The separating device 30 can consist of a part of the nozzle device 20 (or the housing structure 20b) and / or a part of the

Housing arrangement 15 may be formed. The suction openings 21a are also formed in the separating device 30. Channels through which air or a process gas can be blown in the direction of the nozzle device 20 and thus the nozzle 20a could also be integrated in the separating devices 30.

The nozzle device 20 is preferably inserted into the housing arrangement and screwed to it. The housing arrangement 15 can consist of several housing segments 15i, 15 ₂ , 15 _ß , which are screwed together. A first housing segment 15i can the cable insertion opening 9a and

Hold or hold individual mirror 8 ₁ , ... 8 _n . A second housing segment 15 ₂ connects along the central axis 11 in the direction of the laser beam deflection device 13 and forms the laser entry region 9b. This second housing segment 15 ₂ is preferably screwed to the first housing segment 15i. The predominant part of the nozzle device 20 is also arranged in the second housing segment 15 ₂ , which in turn is preferably screwed to the first housing segment 15 i. The third housing segment 15 ₃ can be, for example, a cover for the receiving openings 19 accessible from outside the housing arrangement 15.

FIG. 4B shows a border or inner border of the cutting space 10. FIG. 4C shows a similar illustration and also explains the flow conditions through the nozzle 20a. The nozzle 20a of the nozzle device 20 preferably comprises a main nozzle outlet opening 20ai and a plurality of secondary nozzle outlet openings 20a ₂ . The main nozzle outlet opening 20ai is arranged such that air or a process gas flows out along the central axis 11 (see FIG. 4C) and strikes the line 1 to be cut. In contrast, the plurality of secondary nozzle outlet openings 20a ₂ are arranged in such a way that air or a process gas is applied to the protective glass arrangement 16 or to the individual protective glasses 16i,... 16 _n (or, in the absence of protective glasses 16i,... 16 _n, to the individual mirrors 8 ₁ ,

... 8 _n ) and keeps them free of residues. In FIG. 4A, an annular laser beam guide channel 50 is also provided, which extends from the laser entry region 9b on the second end face 15b of the housing arrangement 15 in the direction of the n individual mirrors 8 ₁ ,... 8 _n . The annular laser beam guide channel 50 is delimited on the outside by an inner wall 18 of the housing arrangement 15. It is delimited towards the inside by the nozzle device 20 or by the housing structure 20b of the nozzle device 20. A distance between the annular laser beam guide channel 50 and the central axis 11 is smaller in the laser entry area 9b than at the transition to the respective individual mirrors 8 ₁ ,... 8 _n . A diameter of the annular

The laser beam guide channel is constant or, as shown in FIG. 4A, at the transition to the respective individual mirrors 8 ₁ ,... 8 _n smaller than in the laser entry area 9b.

N separate laser beam guidance channels could also be provided. Each of these n laser beam guide channels would then extend from the laser entry region 9b on the second end face 15b of the housing arrangement 15 in the direction of one of the n individual mirrors 8 ₁ ,... 8 _n . To the outside, these laser beam guide channels would also be limited by the inner wall 18 of the housing arrangement 15. Inward through the nozzle device 20 or through the housing structure 20b of the nozzle device 20. In between there would then be corresponding delimiting elements through which, for example, air channels for supplying the nozzle 20a can also be guided.

Referring to FIG. 8, a transport device 22 is also shown. This is designed to hold the shielded line 1 and to drive through the cable insertion opening 9a into the cutting room 10. The

Transport device 22 and the n individual mirrors 8 ₁ ,... 8 _n are arranged so as to be relatively immovable relative to one another during laser cutting or are arranged in a fixed manner overall. The transport device 22 comprises a widening 51 which abuts the cable insertion opening 9a during laser cutting and closes it to the outside in a laser-tight and / or dust-tight and / or air-tight manner. The housing arrangement 15 preferably comprises in the region of the

Cable insertion opening 9a a circumferential flange-shaped projection 52, which in a corresponding groove 51a engages in the widening 51 of the transport device 22. Optionally, elastic sealing elements can also be provided. A protective cover 53 is also provided in FIG. 8, in which the predominant part of the housing arrangement 15 and the laser beam deflection device 13, the telescopic device 6 and the laser device 4 are arranged. A method according to the invention for laser cutting shielded lines 1 uses the laser cutting device 3 shown here. This method is described in more detail with reference to FIGS. 9A to 9C. In a first method step Si, the shielded line 1 is prepared. Some of the process steps that can be carried out to prepare the shielded line 1 are described in FIGS. 2A and 2B. These are, in particular, those steps which are carried out until the shield wires 1b are slipped over the support shaft 2 or the support sleeve 2 and the shielding film 1c appears. Method step S _{2 is then} carried out. In method step S ₂ , the shielded line 1 is inserted into the cutting room 10. It is arranged or aligned in such a way that its longitudinal axis runs parallel or identical to the central axis 11. Process step S _{3 is then} carried out. In this

Method step S ₃ , the laser beam deflection device 13 is controlled in such a way that the laser beam 5 hits one of the n individual mirrors 8 ₁ ,... 8 _n through the laser entry region 9 b in order to be reflected by it on the shielded line 1.

Method step S _{4 is then} carried out. In this method step S ₄ , the laser beam 5 is guided through the laser beam deflection device 13 such that it alternately strikes another one of the n individual mirrors 8 ₁ , ..., 8 _n and of the respective 8 ₁ , ..., 8 _{n is} reflected on the shielded line 1 and cuts the shielded line 1 along its circumference. The wording "alternately" also means that the laser beam 5 rotates at a high speed around the central axis 11 and strikes the individual individual mirrors 8 ₁ ,..., 8 _n . This can be more than 2, 3, 5, 10, 15, 20, 25, 30, 35, 40 but preferably less than 60 times a second. The laser device 4 is preferably switched off when the laser beam 5 is not directed at one of the individual mirrors 8 ₁ , 8 _n . The circular path diameter can be set by the laser beam deflection device 13. This also changes the point of incidence of the laser beam 5 on the shielded line 1, so that on the one hand the shield wires 1d and on the other hand the shield foil 1c can be cut. If the screen film 1c is to be cut, then the plastic film or the plastic coating of the screen film 1c evaporates as soon as the laser beam 5 strikes. The remaining metal, in particular aluminum, layer of the shielding film 1c then has only a very low strength and can then be removed using a gripper system. As already explained, the “prepare” method step Si comprises the steps shown in FIGS. 2A and 2B, but not all of which have to be carried out. Reference is also made here to FIG. 9B. In particular, however, the Prepare Si method step comprises the SIA method step, in which the shield wires 1b are at least partially exposed. The support impulse 2 or the support sleeve 2 is then pressed onto these exposed shield wires 1c. Subsequently, the exposed shield wires are turned over the support imp 2 or the support sleeve 2. After this method step, the shield wires, which are located above the support imps 2 or the support sleeve 2, can then be cut off by the laser cutting device 3. In addition or as an alternative to this, method step S _IB can also be carried out, in which the shielding film 1c is at least partially exposed. This partial exposure can also take place directly in that the shield wires 1b are slipped over the support impulse 2 or the support sleeve 2. The process step "leading" S ₄ can also do the following

Process steps include. Reference is also made here to FIG. 9C. In a further method step S _4A , the shield wires 1 b, which are located above the support shaft 2 or the support sleeve 2, are cut to a predetermined length. This takes place in the context of a circumferential cut on the shielded line 1. In addition or alternatively, in method step S _4B, the shielding film 1b can be cut at a predetermined point on the shielded line 1 over its entire circumference, that is, along its entire circumference. In principle, a corresponding cut line 1 is also protected, as can be produced by the method step shown here.

In the following, some important advantages are again emphasized, which are achieved by the laser cutting device 3 according to the invention for shielded lines 1 and the method for laser cutting.

A particular exemplary embodiment of the laser cutting device 3 according to the invention for shielded lines 1 comprises the following feature:

- Reflection surfaces 8a of one, several or all of the n individual mirrors 8 ₁ , ..., 8 _n are inclined in the direction of the central axis 11.

Another exemplary embodiment of the laser cutting device 3 according to the invention for shielded lines 1 comprises the following feature:

- The n individual mirrors 8 ₁ , ..., 8 _n are all spaced the same distance or different distances from the central axis 11 and the cable insertion opening 9a.

An additional embodiment of the invention

Laser cutting device 3 for shielded lines 1 comprises the following features:

- The n individual mirrors 8 ₁ , ..., 8 _n have a diameter of 1.27 cm (= 0.5 inches) (<± 80% or <± 60% or <± 50% or <± 40% or < ± 30% or <± 20%); and or

- The n individual mirrors 8 ₁ , ..., 8 _n are each more than 20mm, 25mm, 30mm, 35mm, 40mm, 45mm or more than 50mm but preferably less than 60mm, 55mm, 50mm, 45mm, 40mm, 35mm, 30mm or arranged less than 25mm from the central axis 11.

A supplementary embodiment of the invention

Laser cutting device 3 for shielded lines 1 comprises the following features:

- The laser device 4 is a CC> ₂ laser device and the protective glass arrangement 16 consists of or comprises zinc selenide; or

- The laser device 4 is a fiber (fiber) laser device and the protective glass arrangement 16 consists of or comprises (float) glass. A particular exemplary embodiment of the laser cutting device 3 according to the invention for shielded lines 1 comprises the following features:

- Reflection surfaces 8a of one, several or all of the n individual mirrors 8 ₁ , 8 _n are:

a) planar (even); or

b) concave; or

c) convex; or

d) be faceted;

and or

- A longitudinal section through one, several or all of the n individual mirrors 8 ₁ , ..., 8 _n is a top view:

a) round; or

b) oval; or c) polygonal, in particular square, or rectangular, or trapezoidal.

An additional embodiment of the invention

Laser cutting device 3 for shielded lines 1 comprises the following feature:

- The first mirror arrangement 13a and the second mirror arrangement 13b are only in

a) Y direction; or

b) Z direction; or

c) Z direction and Y direction;

staggered.

A special embodiment of the invention

Laser cutting device 3 for shielded lines 1 comprises the following feature:

- The laser beam deflection device 13 is designed to guide the laser beam 5 such that it is more than 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, 25, or more than 30 times but preferably less than 50 times per second hits each of the n individual mirrors 8 ₁ , ..., 8 _n and is reflected by the respective individual mirror 8 ₁ , ..., 8 _n onto the shielded line 1 to be cut. The invention is not restricted to the exemplary embodiments described. In the context of the invention, all of the described and / or drawn features can be combined with one another as desired.

Claims

1. Laser cutting device (3) for shielded lines (1), in particular for

Laser cutting of shield wires (1b) and / or shield foils (1c) on shielded ones

Lines (1) with the following features:

- At least one laser device (4) is provided, which is designed to generate a laser beam (5);

- A housing arrangement (15) is provided which delimits a cutting space (10);

- The housing arrangement (15) is open on its end faces (15a, 15b), whereby on the first end face (15a) a cable insertion opening (9a) and on the second end face (15b) opposite the first end face (15a) Laser entry area (9b) is formed, the cutting space (10) being accessible from outside the housing arrangement (15) via these openings (9a, 9b);

- A mirror arrangement (8) is provided which comprises n individual mirrors (8 ₁ , ..., 8 _n ), with n> 2, 3, 4, 5, 6, 7, 8;

- The n individual mirrors (8 ₁ , ..., 8 _n ) are offset from one another about a central axis (11) within the housing arrangement (15);

- The n individual mirrors (8 ₁ , ..., 8 _n ) are designed to reflect the laser beam (5) in the direction of the shielded line (1);

- A laser beam deflection device (13) is provided, which is designed to guide the laser beam (5) in such a way that the laser beam (5) enters through the laser entry region (9b) and onto one of the n individual mirrors (8 ₁ , ..., 8 _n ) hits;

- The laser beam deflection device (13) is further designed to guide the laser beam (5) in such a way that it alternately strikes one of the n individual mirrors (8 ₁ , ..., 8 _n ) and of the respective individual mirror (8 ₁ , ..., 8 _n ) in the direction of the shielded line (1) can be reflected, whereby the shielded line (1) can be cut along its circumference; and

the n individual mirrors (8 ₁ ,..., 8 _n ) are each mounted separately from one another on the housing arrangement (15) with at least one separate fastening means,

and / or between the n individual mirrors (8 ₁ , ..., 8 _n ) and the cutting room (10) a protective glass arrangement (16) is arranged, which for the Wavelength range of the laser beam (5) of the laser device (4) is transparent.

2. Laser cutting device (3) according to claim 1, characterized by the following feature:

- The laser beam deflection device (13) is designed to the laser beam

(5) at least along a section (40) on a reflection surface (8a) of the respective individual mirror (8 ₁ , 8 _n ).

3. Laser cutting device (3) according to claim 1 or 2, characterized by the following features:

- The n individual mirrors (8 ₁ , ..., 8 _n ) are each offset by a = 360 h from one another around the central axis (11); and or

- The n individual mirrors (8 ₁ , ..., 8 _n ) lie in one plane; and or

- The n individual mirrors (8 ₁ , ..., 8 _n ) are each equally spaced from the central axis (11); and or

- The n individual mirrors (8 ₁ , ..., 8 _n ) are arranged and aligned such that the laser beam (5) is deflected by the respective individual mirror (8 ₁ , ..., 8 _n ) in such a way that the deflected laser beam (5) perpendicular to the central axis (11) or at an angle which deviates from it by less than ± 25 ° or by less than ± 20 °, ± 15 °, ± 10 °, ± 5 °.

4. Laser cutting device (3) according to one of the preceding claims, characterized by the following features:

- A control device (7) is provided, which is designed to control the laser beam deflection device (13) and the laser device (4);

- The control device (7) is designed to:

a) to switch on the laser device (4) only when the laser beam deflection device (13) is oriented such that the laser beam (5) strikes one of the n individual mirrors (8 ₁ , ..., 8 _n ) and / or

b) switch off the laser device (4) when the laser beam deflection device (13) is oriented such that the laser beam (5) does not strike any of the n individual mirrors (8 ₁ , ..., 8 _n ).

5. Laser cutting device (3) according to one of the preceding claims, characterized by the following features:

- The inner wall (18) of the housing arrangement (15) comprises n receiving openings (19);

- In each of the n receiving openings (19) one of the n individual mirrors (8 ₁ , 8 _n ) is inserted and fastened.

6. Laser cutting device (3) according to claim 5, characterized by the following feature:

- The individual receiving openings (19) are connected to one another to form a circumferential groove around the central axis (11).

7. Laser cutting device (3) according to claim 5 or 6, characterized by the following features:

- The n receiving openings (19) are coded with respect to their shape;

- The individual mirrors (8 ₁ , ..., 8 _n ) have a shape corresponding to the coded shape of the receiving openings (19), so that each individual mirror (8 ₁ , ..., 8 _n ) only:

a) in a specific receiving opening (19); and or

b) in a specific orientation and angular position in the receiving opening (19)

can be used.

8. Laser cutting device (3) according to one of claims 5 to 7, characterized by the following features:

- Between a back (8b) of the respective individual mirror ((8 ₁ , ..., 8 _n )) and a receiving base (19a) of the respective receiving opening (19) a spring (23) is arranged, which is designed to the respective To brace individual mirrors (8 ₁ , ..., 8 _n ) away from the receiving base (19a);

- A part of the respective individual mirror (8 ₁ , ..., 8 _n ) bears on a support shoulder (24) of the inner wall (18), the respective individual mirror (8 ₁ , ..., 8 _n ) against the spring force this support shoulder (24) is pressed and held in position.

9. Laser cutting device (3) according to one of the preceding claims, characterized by the following features: - The n individual mirrors (8 ₁ ,, 8 _n ) are each via a screw connection to one

Inner wall (18) of the housing arrangement (15) is detachably fastened, the distance between the respective individual mirror (8 ₁ , ..., 8 _n ) to the inner wall (18) of the housing arrangement (15) and to the central axis (11) being adjustable by the screw connection .

10. Laser cutting device (3) according to one of the preceding claims, characterized by the following features:

- A nozzle device (20) is provided which is penetrated by the central axis (11), the nozzle device (20) being arranged between the cable insertion opening (9a) and the laser entry region (9b);

- The cutting space (10) is limited in the direction of the laser entry region (9b) by the nozzle device (20);

- The nozzle device (20) comprises at least one nozzle (20a) and is designed to blow air or a process gas into the cutting space (10) from this;

- A suction device (21) is provided, which has one or more suction openings (21a), the one or more suction openings (21a) being arranged closer to the cable insertion opening (9a) than the at least one nozzle (20a) of the nozzle device ( 20), and

wherein the suction device (21) is designed to suck in the air or the process gas supplied through the nozzle device (20) and the emissions and / or cut off parts of the shielded line (1) resulting from the laser cutting process.

11. Laser cutting device (3) according to claim 10, characterized by the following features:

- An annular laser beam guide channel (50) is provided, which extends from the laser entry region (9b) on the second end face (15b) of the housing arrangement (15) in the direction of the n individual mirrors (8 ₁ , ..., 8 _n ), wherein the annular laser beam guide channel (50) is bounded on the outside by an inner wall (18) of the housing arrangement (15) and the ring-shaped laser beam guide channel (50) is bounded on the inside by the nozzle device (20); or n separate laser beam guide channels are provided, each of the n laser beam guide channels extending from the laser entry region (9b) on the second end face (15b) of the housing arrangement (15) in the direction of one of the n individual mirrors (8 ₁ , 8 _n ), where the n

Laser beam guide channels are bounded on the outside by an inner wall (18) of the housing arrangement (15) and the laser beam guide channels are bounded on the inside by the nozzle device (20) and the n laser beam guide channels are separated from one another by additional limiting elements.

12. Laser cutting device (3) according to claim 10 and 11, characterized by the following features:

- The protective glass arrangement (16):

a) comprises at least n protective glasses (16i, ..., 16 _n ), each of these n

Protective glasses (16 ₁ , ..., 16 _n ) between each of the n individual mirrors (8 ₁ , ..., 8 _n ) and the cutting room (10) and between the nozzle device (20) and an inner wall (18) of the housing arrangement (15) are arranged; or

b) comprises a protective glass ring which separates all n individual mirrors (8 ₁ , ..., 8 _n ) from the cutting room (10);

and

- The protective glass arrangement (8) seals the cutting space (10) to the respective n individual mirrors (8 ₁ , ..., 8 _n ) dustproof or airtight.

13. Laser cutting device (3) according to one of claims 10 to 12, characterized by the following feature:

- The at least one nozzle (20a) of the nozzle device (20) has a main nozzle outlet opening (20ai) and a plurality of secondary nozzle outlet openings (20a ₂ ), the main nozzle outlet opening (20ai) being arranged such that air or the process gas flows out along the central axis (11) and wherein the plurality of secondary nozzle outlet openings (20a ₂ ) are arranged such that air or the process gas flows onto the protective glass arrangement (16) or onto the n individual mirrors (8 ₁ , ..., 8 _n ).

14. Laser cutting device (3) according to one of claims 10 to 13, characterized by the following features: - Between two adjacent protective glasses (16i, ..., 16 _n ) is one

Separating device (30) arranged;

- The separating device (30) is formed from the nozzle device (20) and / or from the housing arrangement (15).

15. Laser cutting device (3) according to one of claims 10 to 14, characterized by the following feature:

- The nozzle device (20) is connected to an inner wall (18) of the housing arrangement (18), this connection comprising an air channel through which air or the process gas of the nozzle (20a) can be fed.

16. Laser cutting device (3) according to one of claims 10 to 15, characterized by the following features:

- The nozzle device (20) also comprises a housing structure (20b);

- The housing structure (20b) holds the nozzle (20a);

- The housing structure (20b) comprises side walls, which diverge from the nozzle (20a) in the direction of the cable insertion opening (9a) and end in the area of the protective glass arrangement (16) and thus limit the cutting space (10).

17. Laser cutting device (3) according to one of the preceding claims, characterized by the following feature:

- The n individual mirrors (8 ₁ , ..., 8 _n ) are arranged immediately adjacent to each other and touch at their edge areas.

18. Laser cutting device (3) according to one of the preceding claims, characterized by the following features:

- A telescopic device (6) is provided;

- The telescopic device (6) is arranged between the laser device (4) and the laser beam deflection device (13) and designed to change the focus of the laser beam (5), whereby shielded lines (1) with different diameters can be cut and / or whereby a cutting position along the central axis (11) is displaceable.

19. Laser cutting device (3) according to one of the preceding claims, characterized by the following features: - The laser device (4) comprises at least two different laser sources which are designed to emit laser beams (5) with different wavelengths;

- A control device (7) is designed to the laser device (4) and

To control the laser beam deflection device (13) such that the shielded

Line (1) can be cut along its circumference with a laser beam (5) of the first wavelength and with a laser beam (5) of the second wavelength, the shielded line (1) during the cutting processes with laser beams (5) of the first and the second wavelength remains in the same position in the cutting room (10).

20. Laser cutting device (3) according to one of the preceding claims, characterized by the following features:

- The protective glass arrangement (16) comprises protective glasses (16i, ..., 16 _n ) of a first group and protective glasses (16i, ..., 16 _n ) of a second group;

- The protective glasses (16i, ..., 16 _n ) of the first group are transparent for a first wavelength and the protective glasses (16i, ..., 16 _n ) of the second group are transparent for a second wavelength;

- The protective glasses (16i, ..., 16 _n ) of the first group alternate with the

Protective glasses (16i, ..., 16 _n ) of the second group on the respective

Individual mirrors (8 ₁ , ..., 8 _n ) arranged;

- A control device (7) is designed to control the laser device (4) in such a way that it outputs a laser beam (5) with the first wavelength, and the control device (7) is also designed to control the laser beam deflection device (13) in this way that this directs the laser beam (5) only to those individual mirrors (8 ₁ , ..., 8 _n ) which are separated from the cutting room (10) by protective glasses (16i, ..., 16 _n ) of the first group; and

- The control device (7) is designed to control the laser device (4) in such a way that it outputs a laser beam (5) with the second wavelength, and the control device (7) is also designed to control the laser beam deflection device (13) in such a way that that this directs the laser beam (5) only to those individual mirrors (8 ₁ , ..., 8 _n ) that through

Protective glasses (16i, ..., 16 _n ) of the second group are separated from the cutting room (10).

21. Laser cutting device (3) according to one of the preceding claims, characterized by the following features:

- A transport device (22) is provided;

- The transport device (22) is designed to hold the shielded line (1) and to drive through the cable insertion opening (9a) into the cutting space (10);

- The transport device (22) and the n individual mirrors (8 ₁ , ..., 8 _n ) are during laser cutting

a) relatively immovable to each other; and or

b) stationary

arranged; and or

the transport device (22) comprises a widening (51), this widening (51) abutting the cable insertion opening (9a) during laser cutting and closing it light-tight and / or dust-tight and / or air-tight.

22. Laser cutting device (3) according to one of the preceding claims, characterized by the following features:

- The laser beam deflection device (13) comprises at least a first

Mirror arrangement (13a) and a second mirror arrangement (13b), as well as at least a first adjusting device (14a) and a second adjusting device (14b);

- The mirror arrangements (13a, 13b) are arranged in the beam path of the laser beam (5) and designed to remove the laser beam (5) from the first

To reflect the mirror arrangement (13a) to the second mirror arrangement (13b) and from the second mirror arrangement (13b) or last mirror arrangement (13b) to the respective individual mirror;

- The first adjustment device (14a) is designed to rotate and / or pivot the first mirror arrangement (13a) in such a way that the laser beam (5) predominantly or exclusively along

a) the Y axis; or

b) the Z axis

is adjusted or moved,

- The second adjustment device (14b) is designed to the second

Rotate and / or pivot the mirror arrangement (13b) in such a way that the laser beam (5) predominantly or exclusively along

a) the Z axis; or b) the Y axis

is adjusted or moved,

- The Y-axis and the Z-axis are at an angle of 90 ° to each other and at an angle of 90 ° to the X-axis, the X-axis running along the central axis (1 1).

23. Laser cutting device (3) according to claim 22, characterized by the following features:

- The shielded line (1) to be cut with the laser beam (5) can be arranged in the cutting room (10) such that the central axis (11) is aligned with a longitudinal axis of the shielded line (1); and or

- The central axis (11) runs through the second mirror arrangement (13b) or the last mirror arrangement (13b).

24. Laser cutting device (3) according to one of the preceding claims, characterized by the following feature:

- The n individual mirrors (8 ₁ , ..., 8 _n ) are coated with gold or molybdenum and / or the n individual mirrors (8 ₁ , ..., 8 _n ) are coated glass.

25. A method for laser cutting shielded lines (1) with a laser cutting device (3) according to one of the preceding claims, characterized by the following method steps:

- Preparing (Si) the shielded line (1);

- Introducing (S ₂ ) the shielded line (1) into the cutting room (10);

- Control (S ₃ ) of the laser beam deflection device (13) in such a way that the laser beam (5) hits one of the n individual mirrors (8 ₁ , ..., 8 _n ) through the laser entry region (9b) in order for the latter to reach the shielded line (1) to be reflected; and

- Guide the laser beam (S ₄ ) so that it alternately hits one of the n individual mirrors (8 ₁ , ..., 8 _n ) and from the respective individual mirror (8 ₁ , ..., 8 _n ) in the direction of the shielded Line (1) is reflected so as to cut the shielded line (1) along its circumference.

26. A method for laser cutting according to claim 25, characterized by the following features:

- the process step Prepare (S ₁ ) comprises the following process steps: a) at least partially exposing (S _IA ) shield wires (1 b) and pressing a support imps (2) or a support sleeve (2) onto the at least partially exposed shield wires (1 b) and everting under the support imp (2) or the support sleeve (2) protruding shield wires (1b) over the support imp (2) or the support sleeve (2); and or

b) at least partially exposing (S _IB ) a shielding film (1c);

the method step guiding (S ₄ ) comprises the following method steps: a) cutting (S4 _A ) the shield wires (1b), which are arranged above the support shaft (2) or the support sleeve (2) to a predetermined length; and / or b) cutting (S4 _B ) the screen film (1c) at a predetermined location.