WO2020098564A1

WO2020098564A1 - Optical module

Info

Publication number: WO2020098564A1
Application number: PCT/CN2019/116540
Authority: WO
Inventors: 胥嫏
Original assignee: 青岛海信宽带多媒体技术有限公司
Priority date: 2018-11-14
Filing date: 2019-11-08
Publication date: 2020-05-22

Abstract

The present invention relates to the technical field of optical communication, and provides an optical module. In the optical module, a low frequency signal pin of a processor outputs a low frequency electric signal; a laser outputs constant power light; an electroabsorption modulator receives a first high frequency electric signal and the low frequency electric signal; the electroabsorption modulator receives the constant power light, and modulates and outputs an optical signal on the basis of the first high frequency electric signal by taking the low frequency electric signal as a reference voltage.

Description

An optical module

This application requires submission to the China Patent Office on November 14, 2018, with the application number 201811351078.2, and the invention name is "optical module", and submission to the China Patent Office on October 28, 2019, with the application number 201911032662.6, and the invention name is "one Kind of optical module ", the priority of the Chinese patent application submitted to the Chinese Patent Office on October 28, 2019, with the application number 201921824673.3 and the utility model name" a kind of optical module ", the entire content of which is incorporated by reference in this application .

Technical field

This application relates to the technical field of optical communication, and in particular to an optical module.

Background technique

The optical module is an important part of the optical communication system, including the electro-optic converter and the optical modulator. The electrical signal is converted into an optical signal by the electro-optic converter, and the optical signal is encoded and modulated by the optical modulator and output, so that the output optical signal Carry information. Electro-absorption modulator is one of the commonly used optical modulators. Because of its fast response speed and low power consumption, it is widely used to transmit high-speed optical signals.

However, the electro-absorption modulators provided in the related art are mostly suitable for modulating high-frequency signals, and generally do not have the ability to modulate low-frequency signals at the same time. When the protocol requirements of the usage scenario stipulate that the high-frequency signal and the low-frequency signal are simultaneously modulated, it is difficult to apply the optical module in the related art. It can be seen that the optical module provided by the related art also has room for further improvement to expand its scope of application.

Summary of the invention

The implementation of the present application provides an optical module to realize superposition of low-frequency signals on high-frequency electrical signals.

On the one hand, the optical module provided by the embodiments of the present application mainly includes:

Processor, laser and electro-absorption modulator;

The processor has low-frequency signal pins for outputting low-frequency electrical signals;

The laser is used to output light with stable power;

The electro-absorption modulator has: a high-frequency control pin for receiving the first high-frequency electrical signal; and a reference voltage pin connected to the low-frequency signal pin to receive the low-frequency electrical signal;

The electro-absorption modulator receives light with stable power, and uses the low-frequency electrical signal as a reference voltage to modulate and output a high-low frequency mixed optical signal based on the first high-frequency electrical signal.

On the other hand, the optical module provided by the embodiment of the present application mainly includes:

Circuit board, with circuit and electrical components connected by the circuit;

Light emitting components, used to generate light signals;

Electrical components include:

Gold finger, used to receive the second high-frequency electrical signal from the host computer;

A laser driver for outputting the first high-frequency electrical signal driving the laser according to the second high-frequency electrical signal;

Processor, used to output low-frequency electrical signals;

The light emitting components include:

Laser, the anode is electrically connected to the output end of the laser driver, and the cathode is grounded, used to output a constant power laser under the current drive;

The electro-absorption modulator, its high-frequency control pin is electrically connected to the golden finger to access the first high-frequency electrical signal, its reference voltage pin is electrically connected to the processor to access the low-frequency electrical signal, and its ground pin is grounded for For receiving laser light, the low-frequency signal is used as a reference voltage, and the optical signal is modulated and output based on the first high-frequency electrical signal.

BRIEF DESCRIPTION

In order to more clearly explain the technical solution of the present application, the following will briefly introduce the drawings that need to be used in the embodiments. Obviously, for those of ordinary skill in the art, without paying creative labor, Other drawings can also be obtained from these drawings.

Figure 1 is a schematic diagram of the connection relationship of optical communication terminals;

Figure 2 is a schematic diagram of the structure of an optical network terminal;

3 is a schematic structural diagram of an optical module provided in an embodiment of the present application;

4 is a schematic diagram of an exploded structure of an optical module provided in an embodiment of the present application;

5 is a block diagram of an internal structure of an optical module provided in an embodiment of the present application;

6 is a schematic diagram of an internal circuit structure of an optical module provided by an embodiment of the present application;

7 is a circuit structure diagram of a dual data signal modulation circuit provided in an embodiment of this application;

8 is a schematic diagram of a signal modulation process provided in an embodiment of this application;

FIG. 9 is an internal circuit structure diagram of the high-speed signal driving chip provided in the embodiment of the present application.

detailed description

The technical solutions in the embodiments of the present application will be described clearly and completely in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

One of the core links of optical fiber communication is the conversion of photoelectric signals. Optical fiber communication uses optical signals that carry information to be transmitted in optical fibers / optical waveguides. The passive transmission characteristics of light in optical fibers can be used to realize low-cost and low-loss information transmission. And information processing equipment such as computers use electrical signals, which requires the mutual conversion of electrical signals and optical signals during signal transmission.

The optical module realizes the above-mentioned photoelectric conversion function in the field of optical fiber communication technology, and the mutual conversion of the optical signal and the electrical signal is the core function of the optical module. The optical module realizes the electrical connection with the external host computer through the golden finger on the circuit board. The main electrical connections include power supply, I2C signal, transmission of data signal, and grounding. The electrical connection method implemented by the golden finger has become the optical module industry. The standard way, on this basis, the circuit board is a necessary technical feature in most optical modules.

FIG. 1 is a schematic diagram of the connection relationship of optical communication terminals. As shown in FIG. 1, the connection of the optical communication terminal mainly includes an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103;

One end of the optical fiber is connected to the remote server, and one end of the network cable is connected to the local information processing device. The connection between the local information processing device and the remote server is completed by the connection of the optical fiber and the network cable; The terminal is complete.

The optical port of the optical module 200 is connected to the optical fiber 101 to establish a bidirectional optical signal connection with the optical fiber; the electrical port of the optical module 200 is connected to the optical network terminal 100 to establish a bidirectional electrical signal connection with the optical network terminal; the optical module implements the optical signal Mutual conversion with electrical signals to achieve a connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and input into the optical network terminal 100, the optical network terminal 100 The electrical signal is converted into an optical signal by the optical module and input into the optical fiber. The optical module 200 is a tool for realizing mutual conversion of photoelectric signals, and does not have the function of processing data. During the above photoelectric conversion process, information has not changed.

The optical network terminal has an optical module interface 102 for accessing the optical module to establish a bidirectional electrical signal connection with the optical module; the optical network terminal has a network cable interface 104 for accessing the network cable to establish a bidirectional electrical signal connection with the network cable; The connection between the module and the network cable is established through an optical network terminal. Specifically, the optical network terminal transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical module. work.

So far, the remote server has established a two-way signal transmission channel with the local information processing equipment through optical fibers, optical modules, optical network terminals and network cables.

Common information processing equipment includes routers, switches, electronic computers, etc .; the optical network terminal is the upper computer of the optical module, provides data signals to the optical module, and receives data signals from the optical module. The common optical module upper computer also has optical lines Terminal etc.

Figure 2 is a schematic diagram of the structure of an optical network terminal. As shown in FIG. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is provided on the surface of the circuit board 105; an electrical connector is provided in the cage 106 for access to electrical ports of optical modules such as gold fingers; A heat sink 107 is provided on the cage 106, and the heat sink 107 has a convex structure such as a fin that increases the heat radiation area.

The optical module 200 is inserted into the optical network terminal, specifically the electrical port of the optical module is inserted into the electrical connector in the cage 106, and the optical port of the optical module is connected to the optical fiber 101.

The cage 106 is located on the circuit board, and the electrical connectors on the circuit board are wrapped in the cage; the optical module is inserted into the cage, and the optical module is fixed by the cage, and the heat generated by the optical module is transmitted to the cage through the optical module housing and finally through the cage The heat sink 107 diffuses.

FIG. 3 is a schematic structural diagram of an optical module provided by an embodiment of the present application, and FIG. 4 is an exploded structural schematic diagram of an optical module provided by an embodiment of the present application. As shown in FIGS. 3 and 4, the optical module 200 provided by the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking component 203, a circuit board 204, a light emitting component 205 and a light receiving component 206.

The upper shell 201 is closed on the lower shell 202 to form a package cavity with two openings; the outer contour of the package cavity generally presents a square body. Specifically, the lower shell has a main board and two sides of the main board Two side plates arranged vertically; the upper shell has a cover plate, and the cover plate is closed on the two side plates of the upper shell to form a package cavity; the upper shell may also have two sides and a cover The two side walls of the board are arranged vertically, and the two side walls are combined with the two side boards to realize the upper housing cover closing on the lower housing.

The two openings can be two ends in the same direction (208, 209), or two openings in different directions; one of the openings is the electrical port 208, and the gold fingers of the circuit board extend from the electrical port 208 , Inserted into a host computer such as an optical network terminal; another opening is an optical port 209 for external optical fiber access to connect the light emitting component 205 and light receiving component 206 inside the optical module; circuit board 204, light emitting component 205 and light receiving component Optoelectronic devices such as 206 are located in the package cavity.

The assembly method of combining the upper case and the lower case is convenient for mounting the circuit board 204, the light emitting component 205 and the light receiving component 206 into the case, and the upper case and the lower case form the outermost layer of the optical module Encapsulate the protective shell; the upper shell and the lower shell are generally made of metal materials, which is conducive to electromagnetic shielding and heat dissipation; generally, the shell of the optical module will not be made into an integrated structure. The heat dissipation and electromagnetic shielding structure cannot be installed, which is also not conducive to production automation.

The unlocking component 203 is located on the outer wall of the package cavity / lower housing 202 and is used to realize a fixed connection between the optical module and the host computer, or to release a fixed connection between the optical module and the host computer.

The unlocking component 203 has an engagement structure matching the upper computer cage; pulling the end of the unlocking component can relatively move the unlocking component on the surface of the outer wall; the optical module is inserted into the cage of the upper computer, and the optical module is inserted into the cage of the unlocking component It is fixed in the cage of the host computer; by pulling the unlocking component, the engaging structure of the unlocking component moves with it, thereby changing the connection relationship between the engaging structure and the upper computer to release the engaging relationship between the optical module and the upper computer, so that the The optical module is withdrawn from the cage of the host computer.

The optical transmitting component (TOSA for short) 205 and the optical receiving component (ROSA for short) 206 are respectively used to realize the transmission of optical signals and the reception of optical signals. The light-emitting component 205 and the light-receiving component 206 may also be combined to form an integrated optical transceiver structure.

The circuit board 204 is provided with circuit traces, electronic components (such as capacitors, resistors, transistors, MOS tubes) and chips (such as a processor (abbreviated as MCU) 205, laser driver, limiting amplifier, clock data recovery CDR, power management chip , Data processing chip DSP), etc.

The circuit board 204 connects the electrical components in the optical module according to the circuit design through circuit traces, so as to realize electrical functions such as power supply, electrical signal transmission, and grounding.

The circuit board 204 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also carry a bearing effect. For example, the rigid circuit board can smoothly carry the chip; when the light emitting component 205 and the light receiving component 206 are located on the circuit board, The rigid circuit board can also provide a stable load; the rigid circuit board can also be inserted into the electrical connector in the cage of the upper computer, specifically, a metal pin / gold finger is formed on the end surface of one side of the rigid circuit board to Connector connection; these are inconvenient for flexible circuit boards.

Some optical modules also use flexible circuit boards as a supplement to rigid circuit boards; flexible circuit boards are generally used in conjunction with rigid circuit boards. For example, flexible circuit boards can be used to connect between rigid circuit boards and optical transceiver devices.

In some embodiments of the present application, the gold finger on the surface of the circuit board 204 has an I2C pin. The I2C protocol can be adopted between the host computer and the optical module to transfer information through the I2C pin.

During operation, the optical module provided by the embodiment of the present application sends relatively high-frequency data optical signals according to the data electrical signals from the optical line terminal to maintain the original external data transmission service of the optical line terminal. At the same time, the optical module also According to non-data electrical signals (that is, signals that are not used for normal transmission services), relatively low-frequency control optical signals are sent to send control information to the optical module at the opposite end, so as to transfer control data to the remote system without interrupting normal services For example, use the low-frequency message channel to transmit the system upgrade package to realize the online upgrade of the remote system, and report DDM (Digital Diagnostic Monitoring, Digital Monitoring) information. Since the optical module and the optical module at the opposite end are connected to each other by one optical fiber, the data optical signal and the control optical signal are mixed in the same beam to be transmitted by the same optical fiber. In order to distinguish different signals, the embodiments of the present application The set data light signal and the control light signal have different frequencies.

The realization principle is: through the design of the processor 2045, the light emitting component 205 and other devices in the optical module, the processor 2045 controls the light emitting component 205, and superimposes the low frequency optical signal on the high frequency optical signal (data optical signal) it emits (Manipulation optical signal), for example, superimposing a low-frequency modulation signal 50Kbps on a 10Gbps or 25Gbps signal, where the 10Gbps or 25Gbps signal is a normal service signal, and another added 50Kbps low-frequency signal performs other manipulation functions.

Based on the above principles, the manner in which the low-frequency optical signal is modulated in the optical module in the embodiment of the present application will be described in detail below in conjunction with the drawings.

5 is a block diagram of an internal structure of an optical module provided in an embodiment of the present application, FIG. 6 is a schematic diagram of an internal circuit structure of an optical module provided in an embodiment of the present application, and FIG. 7 is dual data provided in an embodiment of the present application Circuit diagram of the signal modulation circuit.

As shown in FIGS. 5, 6 and 7, a processor 2045 and a digital-to-analog converter (DAC) 2046 for converting digital signals into analog voltage signals are provided on the circuit board of the optical module And a laser drive chip (LDD) 2042b for generating a constant power current.

Among them, the processor 2045 is respectively connected to the digital-analog conversion chip 2046 and the laser drive chip 2042b, and is responsible for the power-on initialization and configuration of each chip, work supervision, etc .;

The processor has a low-frequency signal pin to output a low-frequency electrical signal a; in an embodiment of the present application, the low-frequency electrical signal a output from the processor 2045 is a low-frequency varying 0 and 1 digital signal to control the digital-analog conversion chip The change of the analog signal value output by 2046 enables the digital-to-analog conversion chip 2046 to output an analog voltage signal with a low frequency change. At this time, the analog voltage signal pin output by the digital-analog conversion chip with a low frequency change is a low-frequency signal pin.

The light emitting module 205 is provided with a laser (abbreviated as LD) 2051 and an electro-absorption modulator (abbreviated as EA) 2052. Among them, the laser 2051 outputs light c1 with stable power; the light emitted by the laser does not carry information, but the information is loaded into the light through the electro-absorption modulator; optical communication usually uses the power change of the optical signal to characterize "0" and "1" Information, and the light that cannot be resolved at the receiving end does not carry information. According to the optical modulation mode of the optical module, light that does not carry information generally refers to light without significant power change, that is, light with stable power, the most ideal state It is light with constant power.

In an embodiment of the present application, the anode of the laser 2051 is electrically connected to the output end of the laser drive chip 2042b, and the cathode is connected to the ground circuit on the circuit board 204, which is used to output constant power under the control of the laser drive chip 2042b Laser to electroabsorption modulator 2052.

In this embodiment of the present application, an independent laser driving chip 2042b is provided to drive the laser 2051. Compared with the method of using the processor 2045 to drive the laser 2051, on the one hand, the stability of the optical power output by the laser 2051 can be ensured, and on the other hand, the MCU can be relieved. Data processing pressure. In the embodiment of the present application, the laser driving chip 2042b is set to drive the laser to output laser with constant power, so as to help improve the quality of the optical signal output by the electro-absorption modulator 2052. It should be noted that in the embodiment of the present application, the laser emitted by the laser 205 may be a continuous mode constant power laser or a burst mode constant power laser; the burst mode constant power laser means that the laser emits light in time sequence , And the power is occasionally the same when illuminating.

The electro-absorption modulator 2052 has a high-frequency control pin (or modulation pin) and a reference voltage pin. The electro-absorption modulator 2052 receives the first high-frequency electrical signal b1 through the modulation pin, and receives the low-frequency electrical signal a through the reference voltage pin. In addition, the electro-absorption modulator 2052 receives light c1 with stable power, and uses the low-frequency electrical signal a as a reference voltage to output a high-low frequency mixed optical signal c2 based on the first high-frequency electrical signal b1.

The electro-absorption modulator 2052 is a component that is modulated into an optical signal according to a voltage signal. In use, the electro-absorption modulator 2052 receives light of constant power, and according to the voltage change caused by the reference voltage and the received electrical signal, outputs optical signals of different powers to reflect the change of the voltage signal on the optical signal to achieve Signal conversion.

In an embodiment of the present application, the high-frequency control pin of the electroabsorption modulator 2052 receives the first high-frequency electrical signal, the reference voltage pin and the low-frequency signal pin of the processor or the low-frequency signal of the digital-to-analog conversion chip The pin is connected, and the ground pin is connected to the ground circuit on the circuit board 204. The electroabsorption modulator 2052 is an optical signal modulation device made using the exciton absorption effect in semiconductors. It can output optical signals of different powers according to the reference voltage and the voltage change caused by the received high-frequency electrical signal, and the reference The magnitude of the voltage is directly related to the absorption capacity of the electroabsorption modulator 2052 to the laser. Therefore, when the analog voltage signal with a low frequency is used as the reference voltage of the electroabsorption modulator 2052, the absorption capacity of the electroabsorption modulator 2052 to the laser With the change of the voltage value of the low analog voltage signal, the low frequency signal is modulated into the high frequency electrical signal.

In the prior art, the reference voltage of the electro-absorption modulator 2052 is fixed. However, in the embodiment of the present application, the electro-absorption modulator 2052 uses a low-frequency electrical signal as a reference voltage, in other words, the reference voltage of the electro-absorption modulator 2052 varies. In addition, the reference voltage is directly related to the absorption capacity of the electro-absorption modulator 2052 for light with stable power. It can be further understood that the low-frequency electrical signal is used as the reference voltage of the electro-absorption modulator 2052, so that the absorption capacity of the electro-absorption modulator 2052 for light with stable power changes with the change of the low-frequency electrical signal.

FIG. 8 is a schematic diagram of a signal modulation process provided in an embodiment of the present application. As shown in FIG. 8, in such a case, the maximum value of the output optical signal c2 exhibits the same trend as the low-frequency electrical signal. It can be understood that in this case, the power state of the optical signal c2 output through encoding and modulation has two types of A and B, and when the power state of the optical signal c2 is A, the change trend of its power value and the low-frequency power The change trend of the signal is the same, and the coding and modulation of the low-frequency signal is realized; when the power state of the optical signal c2 is B, the change trend of the power value is the same as the change trend of the high-frequency electrical signal, and the high-frequency electrical signal is encoded modulation.

In summary, in the optical module provided by the embodiment of the present application, the low-frequency signal pin of the processor 2045 is connected to the reference voltage pin of the electro-absorption modulator 2052, and the low-frequency electrical signal a is used as the reference voltage of the electro-absorption modulator 2052, namely The modulation of the low-frequency signal can be achieved while modulating the first high-frequency electrical signal b1. The optical module provided by the embodiment of the present application does not need to add additional hardware devices when it is used, and the implementation mode is strong in operability, and helps to control the production cost of the optical module and expand the scope of application of the optical module.

Regarding the use scenario of the optical module, for example, when the optical module is applied to a tail-end device with automatic wavelength configuration, the low-frequency electrical signal a may be selected as a low-frequency signal carrying optical module status information or control channel information. At this time, the optical signal c2 output by the optical module carries both high-frequency electrical signals and low-frequency signals, so that the receiving end device demodulates the low-frequency signals to obtain control channel information, and then realizes automatic wavelength configuration to satisfy the simultaneous modulation of low-frequency signals and high-frequency signals Requirements for application scenarios of electrical signals.

In the optical module provided by the embodiment of the present application, the power of the light output by the laser 21 is unstable, which will affect the power change of the optical signal c2 output by the optical module. Therefore, the laser 21 outputs light with stable power to help improve the signal quality of the optical signal c2. The laser 21 emits continuous power-stabilized light, or the laser 21 emits sudden power-stabilized light.

The laser 21 needs to be driven with a constant current when outputting light c1 with stable power. Regarding the driving method of the laser 21, in an embodiment of the present application, the processor 2045 further has a constant current source to output a constant power current. The input pin of the laser 21 is connected to a constant current source, and outputs light with stable power under constant current drive. In this embodiment, the number of components in the optical module can be reduced, which is convenient for reducing the volume of the optical module.

In an embodiment of the present application, the electroabsorption modulator 2052 is reverse biased, and the signal output by the processor 2045 is generally a forward signal. Therefore, to ensure that the low frequency signal output by the electroabsorption modulator 2052 is As shown in FIGS. 5 and 7, the consistency of the signal change rule output by the processor 2045 is provided with an operational amplifier 2047 at the output end of the digital-to-analog conversion chip 2046. Among them, the inverting input terminal of the operational amplifier 2047 is connected to the output terminal of the digital-analog conversion chip 2046, the positive input terminal is connected to the ground circuit on the circuit board 204, and the output terminal is connected to the reference voltage pin of the electro-absorption modulator 2052, In addition, a matching resistor R2 is provided between the inverting input terminal of the operational amplifier 2047 and the output terminal of the digital-to-analog conversion chip 2046, and a matching resistor R1 is provided between the positive input terminal and the ground circuit. The matching resistor R1 is used to To maintain the static balance of the op amp, at the same time, a feedback resistor Rf is connected between the inverting input terminal and the output terminal of the operational amplifier 2047, so that the signal output from the digital-analog conversion chip 2046 is added to the inverse of the operational amplifier 2047 through the matching resistor R1 To the input terminal, the output signal voltage is fed back to the reverse input terminal through the feedback resistor Rf at the same time, forming deep voltage parallel negative feedback.

Using the above connection relationship, the signal voltage output by the digital-to-analog conversion chip 2046 and the voltage output signal of the operational amplifier 2047 are in opposite phases, and the magnitude is in a proportional relationship, where the proportionality factor is Rf / R2. By setting the operational amplifier 2047, not only can the phase of the signal output from the digital-analog conversion chip 2046 be inverted, but also the amplitude of the voltage input to the electro-absorption modulator 2052 can be controlled.

In some embodiments of the present application, in order to ensure the stability of the high-frequency electrical signal input to the electro-absorption modulator 2052, a first clock data recovery chip (CDR1) 2041 and high-speed are also provided on the circuit board 204 The signal drive chip (HD) 2042a, the first clock data recovery chip 2041 and the high-speed signal drive chip 2042a are also electrically connected to the processor 2045, so that the processor 2045 can control its power-on initialization and configuration, work supervision, etc .; In order to improve the device integration and reduce the layout area, the high-speed signal driving chip 2042a and the laser driving chip 2042b can be integrated into one device, collectively referred to as a laser driver (DD) 2042.

The golden finger transmits the second high-frequency electrical signal from the upper computer to the first clock data recovery chip 2041. The output pin of the first clock data recovery chip 2041 is connected to the high-frequency control pin of the electro-absorption modulator 2052. In use, the first clock data recovery chip 2041 shapes the high-frequency electrical signal, and outputs the shaped high-frequency electrical signal to the electro-absorption modulator 2052 as a modulation signal. Among them, the input terminal of the first clock data recovery chip 2041 is electrically connected to the gold finger for shaping the second high-frequency electrical signal from the host computer, so that the distortion of the signal sent to the electro-absorption modulator 2052 can be reduced Thus, the optical transmission sub-module 205 can output an optical signal with low signal distortion based on a high-quality high-frequency electrical signal.

The golden finger has a high-frequency electrical signal pin, and receives the second high-frequency electrical signal from the upper computer through the high-frequency electrical signal pin, and the second high-frequency electrical signal is input into the first clock data recovery chip; the high-speed signal drives the chip 2042a The input terminal is electrically connected to the output terminal of the first clock data recovery chip 2041, and the output terminal is electrically connected to the high-frequency control pin of the electro-absorption modulator 2052, which is used to shape the high-frequency electrical signal of the first clock data recovery chip 2041 Amplitude adjustment is performed to generate the first high-frequency electrical signal; after processing by the first clock data recovery chip and the high-speed signal driving chip, the stability of the amplitude input to the electro-absorption modulator 2052 can be ensured.

Based on the fact that the high-frequency electrical signal received by the golden finger is usually a differential signal, the embodiment of the present application also designs the high-speed signal driving chip 2042a. FIG. 9 is an internal circuit structure diagram of the high-speed signal driving chip provided in the embodiment of the present application. As shown in FIG. 9, the high-speed signal driving chip 2042a is provided with a first transistor V1, a second transistor V2, and a regulation control unit (abbreviated as CU).

Among them, the base of the first transistor V1 is connected to the first output end of the first clock data recovery chip 2041, and the collector is connected to one end of the third resistor R3 and the high-frequency control pin of the electro-absorption modulator 2052, The emitter is connected to one end of the control unit, and the other end of the third resistor R3 is connected to the power supply VCC. The base of the second transistor V2 is connected to the second output of the first clock data recovery chip 2041, the collector is connected to one end of the fourth resistor R4 and the ground circuit on the circuit board 204, the emitter and the control unit The other end of the fourth resistor R4 is connected to the power supply; the other end of the control unit is grounded and used to control the voltage value of the signal output by the first transistor and the second transistor. By using the high-frequency electrical signal from the first clock data recovery chip 2041, the first triode V1 and the second triode V2 can be controlled to turn on and off, by setting the voltage value of the power supply VCC, the third resistance The resistance value of R3 and the fourth resistor R4 and the voltage value output by the control unit can further adjust the amplitude of the high-frequency electrical signal output to the electro-absorption modulator 2052. The embodiment of the present application also adjusts the control unit The output voltage value can also output signals of different amplitudes to the electro-absorption modulator 2052 according to the needs of the electro-absorption modulator 2052.

In some embodiments of the present application, in order to achieve anti-static protection for the electro-absorption modulator 2052, between the collector of the first transistor V1 and the high-frequency control pin of the electro-absorption modulator 2052, and the second A clamping diode D is also provided between the collector of the transistor V2 and the ground circuit.

In order to reduce the noise of the input signal and affect the quality of the optical signal output by the optical transmission sub-module 205, as shown in FIG. 7, in the embodiment of the present application, a filter capacitor, an inductor L1 and an L2 are provided at the input end of the optical transmission sub-module 205, wherein , One end of the filter capacitor C1 is connected to the output end of the high-speed signal driving chip 2042a, and the other end is electrically connected to the high-frequency control pin of the electro-absorption modulator 2052 to realize the isolation of the DC signal; one end of the first inductor L1 and the operational amplifier The output end of 2047 is connected (in the specific implementation, if the operational amplifier 2047 is not provided, it is connected to the output end of the digital-analog conversion chip 2046), and the other end is connected to the reference voltage pin of the electro-absorption modulator 2052 to realize an AC signal Isolation; one end of the second inductor L2 is connected to the output end of the laser drive chip 2042b, and the other end is connected to the anode of the laser 2051 to achieve isolation of the AC signal.

In addition, the optical module provided in the embodiment of the present application can also realize signal reception. As shown in FIG. 5, the optical module is provided with an optical receiving component 206 for receiving optical signals sent by an external device and transmitting The optical signal is converted into an electrical signal; a limiting amplifier 2043 connected to the output of the light receiving component 206 is used to amplify the electric signal output from the light receiving component 206; and a second clock data connected to the output of the limiting amplifier 2043 A recovery chip (CDR2 for short) 2044 is used to perform the signal output from the limiting amplifier 2043, and the output terminal of the second clock data recovery chip 2044 is connected to the golden finger. By connecting the golden finger to the host computer, the signal received by the optical module can be sent to the host computer.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still Modifications to the technical solutions described in the foregoing embodiments, or equivalent replacement of some of the technical features therein; and these modifications or replacements do not deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

An optical module, characterized by comprising: a processor, a laser and an electro-absorption modulator;

The processor has a low-frequency signal pin for outputting low-frequency electrical signals;

The laser is used to output light with stable power;

The electro-absorption modulator has: a high-frequency control pin for receiving the first high-frequency electrical signal; and a reference voltage pin connected to the low-frequency signal pin to receive the low-frequency electrical signal;

The electric absorption modulator receives the light with stable power, uses the low-frequency electrical signal as a reference voltage, and modulates and outputs a high-low frequency mixed optical signal based on the first high-frequency electrical signal.
The optical module according to claim 1, wherein the processor further has a constant current source;

The input pin of the laser is connected to the constant current source, and the constant current source is used to drive the laser to output the light with stable power.
The optical module according to claim 1, further comprising a laser driver;

The laser driver has a drive output pin;

The input pin of the laser is connected to the driving output pin, and the laser driver is used to drive the laser to output the light with stable power.
The optical module according to claim 3, further comprising a gold finger and a first clock data recovery chip;

The golden finger has a high-frequency electrical signal pin to receive the second high-frequency electrical signal from the upper computer;

The input pin of the first clock data recovery chip is connected to the high-frequency electrical signal pin;

The output pin of the first clock data recovery chip is connected to the input pin of the laser driver, and outputs a shaping signal to the laser driver;

The laser driver is connected to the high-frequency control pin to output the first high-frequency electrical signal based on the shaping signal to drive the electro-absorption regulator.
The optical module according to claim 3, further comprising a gold finger;

The high-frequency electrical signal pin of the golden finger is connected to the input pin of the laser driver, and outputs a second high-frequency electrical signal from a host computer to the laser driver;

The laser driver is connected to the high-frequency control pin to output the first high-frequency electrical signal based on the second high-frequency electrical signal to drive the electrical absorption regulator.
An optical module, characterized in that it includes:

A circuit board having a circuit and electrical components connected by the circuit;

Light emitting components, used to generate light signals;

The electrical components include:

Gold finger, used to receive the second high-frequency electrical signal from the host computer;

A laser driver for outputting the first high-frequency electrical signal driving the laser according to the second high-frequency electrical signal;

Processor, used to output low-frequency electrical signals;

The light emitting component includes:

A laser, the anode is electrically connected to the output end of the laser driver, and the cathode is grounded, and is used to output a laser of constant power under the drive of the current;

The electro-absorption modulator, its high frequency control pin is electrically connected to the golden finger to access the first high frequency electrical signal, and its reference voltage pin is electrically connected to the processor to access the low frequency electrical signal, which The grounding pin is grounded and used to receive the laser, modulate and output an optical signal based on the first high-frequency electrical signal using the low-frequency signal as a reference voltage.
The optical module according to claim 6, wherein the electrical component further comprises:

A first clock data recovery chip, the input terminal is electrically connected to the golden finger, and used for shaping the second high-frequency electrical signal;

Laser driver, the input terminal is electrically connected to the output terminal of the first clock data recovery chip, and the output terminal is electrically connected to the high-frequency control pin of the electro-absorption modulator, which is used to restore the first clock data to the chip shaping The post-high-frequency electrical signal is transformed into the first high-frequency electrical signal.
The optical module according to claim 7, wherein the electrical component further comprises:

The filter capacitor has one end connected to the output end of the laser driver and the other end electrically connected to the high-frequency control pin of the electro-absorption modulator.
The optical module according to claim 7, wherein the laser driver comprises:

The first triode, the base is connected to the first output end of the first clock data recovery chip, the collector is connected to one end of the third resistor and the high-frequency control pin of the electro-absorption modulator, and the emitter Connected to one end of the regulation control unit, and the other end of the third resistor is connected to the power supply;

A second triode, the base is connected to the second output end of the first clock data recovery chip, the collector is connected to one end of the fourth resistor and the ground circuit, and the emitter is connected to one end of the control unit, The other end of the fourth resistor is connected to the power supply;

The other end of the regulation control unit is grounded and used to control the voltage value of the signals output by the first transistor and the second transistor.
The optical module according to claim 6 or 7, wherein the electrical component further comprises:

In the operational amplifier, the reverse input terminal is connected to the output terminal of the digital-analog conversion chip, the forward input terminal is connected to the ground circuit, and the output terminal is connected to the reference voltage pin of the electroabsorption modulator.