WO2020098216A1 - 一种高频率低损耗数据传输线 - Google Patents

一种高频率低损耗数据传输线 Download PDF

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Publication number
WO2020098216A1
WO2020098216A1 PCT/CN2019/082583 CN2019082583W WO2020098216A1 WO 2020098216 A1 WO2020098216 A1 WO 2020098216A1 CN 2019082583 W CN2019082583 W CN 2019082583W WO 2020098216 A1 WO2020098216 A1 WO 2020098216A1
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Prior art keywords
layer
insulating layer
silver
plated copper
shielding
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PCT/CN2019/082583
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English (en)
French (fr)
Inventor
李军
于国庆
祝平衡
贾利宾
查阳
郝顺
丁彬华
孔浩
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东莞金信诺电子有限公司
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Publication of WO2020098216A1 publication Critical patent/WO2020098216A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H01B7/18—Protection against damage caused by wear, mechanical force or pressure; Sheaths; Armouring
    • H01B7/22—Metal wires or tapes, e.g. made of steel
    • H01B7/221—Longitudinally placed metal wires or tapes
    • H01B7/225—Longitudinally placed metal wires or tapes forming part of an outer sheath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H01B7/0258—Disposition of insulation comprising one or more longitudinal lapped layers of insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H01B7/0807—Twin conductor or cable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H01B7/0823—Parallel wires, incorporated in a flat insulating profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H01B7/0861—Flat or ribbon cables comprising one or more screens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H01B7/18—Protection against damage caused by wear, mechanical force or pressure; Sheaths; Armouring
    • H01B7/1875—Multi-layer sheaths

Definitions

  • the invention relates to the technical field of communication wires, in particular to a high-frequency low-loss data transmission line.
  • 5G network is the key 5G wireless technology: micro base station and Massive MIMO.
  • the capacity of 5G is 1000 times that of 4G, and the peak rate is 10Gbps-20Gbps.
  • To increase the capacity and speed is nothing more than three axes: spectrum bandwidth, spectrum efficiency and the number of cells.
  • the spectrum bandwidth and the high frequency band are rich in frequency resources.
  • the low frequency band currently less than 3GHz is basically occupied by 2/3 / 4G networks, so the 5G network must be extended to the high frequency band 3.5GHz-30GHz (or even higher).
  • Micro base stations have become the key to solving network coverage and capacity in the future. In the future, various street facilities such as city street lights, billboards, and electric poles will become places where small base stations are anchored.
  • Massive MIMO is MU-MIMO with much larger antenna arrays on the base station side than existing systems to serve multiple users simultaneously. It can greatly improve wireless spectrum efficiency, enhance network coverage and system capacity. In short, it is to improve transmission reliability through diversity technology, spatial multiplexing to increase data rate, and beamforming to improve coverage.
  • the technical problem to be solved by the present invention is to provide a high-frequency, low-loss data transmission line with reduced attenuation of high-frequency signals, strong high-temperature resistance, and the ability to ensure the stable and efficient transmission of 5G network data signals based on the deficiencies of the prior art.
  • the first technical solution of the present invention is: a high-frequency low-loss data transmission line, including an inner conductor, a first insulating layer, a second insulating layer, a first shielding layer, a second shielding layer and an outer cover Layer; the first insulating layer is wrapped around the inner conductor, the second insulating layer is wrapped around the first insulating layer, the first shielding layer is wrapped around the second insulating layer, the The second shielding layer is wrapped outside the first shielding layer, and the outer covering layer is wrapped outside the second shielding layer.
  • the number of the inner conductors is two, and the first insulating layer is separately coated on the outside of the two inner conductors, and the first insulating layer is coated on the second insulating layer at the same time;
  • the inner conductor is any one of silver-plated copper inner conductor, tin-plated copper inner conductor, bare copper inner conductor, silver-plated copper-clad steel inner conductor, silver-plated copper-clad aluminum inner conductor, and the diameter is 127-511 ⁇ m;
  • the thickness of the silver-plated copper inner conductor, tin-plated copper inner conductor, silver-plated copper-clad steel inner conductor or silver-plated copper-clad aluminum inner conductor is 0.3-2.0 ⁇ m.
  • the first insulating layer is provided with an air insulating structure, and the air insulating structure is a porous structure or a microporous structure, and the pore type is circular, fan-shaped, or irregular.
  • the first insulating layer is a polyethylene insulating layer, a foamed polyethylene insulating layer, a perfluoroethylene propylene insulating layer, a fusible polytetrafluoroethylene insulating layer, a polytetrafluoroethylene insulating layer, a foamed polymer
  • the thickness of the first insulation layer is 100-300 ⁇ m
  • the second insulation layer is wrapped around the first insulation layer, the second insulation layer is poly Ethylene insulation layer, foamed polyethylene insulation layer, PTFE insulation layer, fusible PTFE insulation layer, PTFE insulation layer, foamed PTFE insulation layer, polypropylene insulation layer
  • the thickness of the second insulating layer is 50-300 ⁇ m.
  • the first shielding layer is longitudinally wrapped outside the second insulating layer, and the first shielding layer is hot-melt self-adhesive aluminum foil, hot-melt self-adhesive copper foil, hot-melt self-adhesive silver-plated copper foil, aluminum foil , Copper foil, silver-plated copper foil, the thickness of the first shielding layer is 10-200 ⁇ m;
  • the second shielding layer is wrapped around the first shielding layer, the second shielding layer It is any one of hot-melt self-adhesive aluminum foil, hot-melt self-adhesive copper foil, hot-melt self-adhesive silver-plated copper foil, aluminum foil, copper foil, silver-plated copper foil, and the thickness of the second shielding layer is 10-200 ⁇ m ;
  • the outer layer is any one of the plastic Mylar belt outer layer, polyethylene outer layer, polytetrafluoroethylene outer layer, polyperfluoroethylene propylene outer layer, polyolefin outer layer, so The thickness
  • the second technical solution of the present invention is: a high-frequency low-loss data transmission line, which is characterized by comprising an inner conductor, a first insulating layer, a second insulating layer, a first shielding layer, an inner cladding layer , A second shielding layer and an outer coating layer; the first insulating layer is wrapped around the inner conductor, the second insulating layer is wrapped around the first insulating layer, and the first shielding layer is wrapped around the first Outside the second insulating layer, the inner covering layer is wrapped around the first shielding layer, the second shielding layer is wrapped around the inner covering layer, and the outer covering layer is wrapped around the second shielding layer .
  • the number of the inner conductors is two, and the first insulating layer is separately coated on the outside of the two inner conductors, and the first insulating layer is coated on the second insulating layer at the same time;
  • the inner conductor is any one of silver-plated copper inner conductor, tin-plated copper inner conductor, bare copper inner conductor, silver-plated copper-clad steel inner conductor, silver-plated copper-clad aluminum inner conductor, and the diameter is 127-511 ⁇ m;
  • the thickness of the silver-plated copper inner conductor, tin-plated copper inner conductor, silver-plated copper-clad steel inner conductor or silver-plated copper-clad aluminum inner conductor is 0.3-2.0 ⁇ m.
  • the first insulating layer is provided with an air insulating structure, and the air insulating structure is a porous structure or a microporous structure, and the pore type is circular, fan-shaped, or irregular.
  • the first insulating layer is a polyethylene insulating layer, a foamed polyethylene insulating layer, a perfluoroethylene propylene insulating layer, a fusible polytetrafluoroethylene insulating layer, a polytetrafluoroethylene insulating layer, a foamed polymer
  • the thickness of the first insulation layer is 100-300 ⁇ m
  • the second insulation layer is wrapped around the first insulation layer, the second insulation layer is poly Ethylene insulation layer, foamed polyethylene insulation layer, PTFE insulation layer, fusible PTFE insulation layer, PTFE insulation layer, foamed PTFE insulation layer, polypropylene insulation layer
  • the thickness of the second insulating layer is 50-300 ⁇ m.
  • the first shielding layer is longitudinally wrapped outside the second insulating layer, and the first shielding layer is hot-melt self-adhesive aluminum foil, hot-melt self-adhesive copper foil, hot-melt self-adhesive silver-plated copper foil, aluminum foil , Copper foil, silver-plated copper foil, the thickness of the first shielding layer is 10-200 ⁇ m;
  • the inner cover layer is an outer layer of plastic Mylar tape, an outer layer of polyethylene, PTFE Ethylene outer layer, polyperfluoroethylene propylene outer layer, polyolefin outer layer, the inner layer has a thickness of 10-600 ⁇ m;
  • the second shield layer is wrapped around the inner layer
  • the second shielding layer is any one of hot-melt self-adhesive aluminum foil, hot-melt self-adhesive copper foil, hot-melt self-adhesive silver-plated copper foil, aluminum foil, copper foil, and silver-plated copper foil.
  • the thickness of the second shielding layer is 10-200 ⁇ m;
  • the outer covering layer is a plastic Mylar belt outer covering layer, a polyethylene outer covering layer, a polytetrafluoroethylene outer covering layer, a polyperfluoroethylene propylene outer covering layer, a polyolefin outer layer
  • the thickness of the outer coating layer is 10-600 ⁇ m.
  • the shielding layer structure of the present invention includes a first shielding layer and a second shielding layer, when the inner conductor transmits 3.5GHz-30GHz high frequency signals, the signal attenuation is very small, and the inner conductor transmits 60GHz When the above high-frequency signal is exceeded, the signal attenuation is reduced by more than 20% compared with ordinary wires;
  • the present invention coats the first insulation layer outside the inner conductor, covers the second insulation layer outside the first insulation layer, and the second shield The outer covering layer is re-coated.
  • the first shielding layer and the second shielding layer are also provided with an inner covering layer. Therefore, the invention has good insulation and strong protection, and greatly reduces signal attenuation. Therefore, the present invention can well guarantee the stable and effective transmission of signals during the transmission process of high frequency and large power consumption signals in the 5G era.
  • FIG. 1 is a schematic diagram of a cross-sectional structure of a high-frequency low-loss data transmission line.
  • Figure 2 is the second schematic diagram of the cross-sectional structure of the high-frequency low-loss data transmission line.
  • Figure 3 is the third schematic diagram of the cross-sectional structure of the high-frequency low-loss data transmission line.
  • FIG. 4 is a fourth schematic diagram of a cross-sectional structure of a high-frequency low-loss data transmission line.
  • FIG. 5 is the fifth schematic diagram of the cross-sectional structure of the high-frequency low-loss data transmission line.
  • FIG. 6 is a sixth schematic diagram of a cross-sectional structure of a high-frequency low-loss data transmission line.
  • Inner conductor 1. Inner conductor; 2. First insulating layer; 3. Second insulating layer; 4. First shielding layer; 5. Second shielding layer; 6. Outer coating layer; 7. Inner coating layer.
  • Embodiment 1 As shown in FIGS. 1, 2 and 3, a high-frequency low-loss data transmission line includes an inner conductor 1, a first insulating layer 2, a second insulating layer 3, a first shielding layer 4, a second Shielding layer 5 and outer coating layer 6; the first insulating layer 2 is wrapped around the inner conductor 1, the second insulating layer 3 is wrapped around the first insulating layer 2, the first shielding layer 4 Wrapped around the second insulating layer 3, the second shielding layer 5 is wrapped around the first shielding layer 4, and the outer layer 6 is wrapped around the second shielding layer 5.
  • the inner conductor 1 is used to conduct current, and the corresponding conductor specification is selected according to the required strength; the number of the inner conductor 1 is two, and two inner conductors 1 The outside is individually covered with a first insulating layer 2, and the second insulating layer 3 simultaneously covers the first insulating layer 2 other than the two inner conductors; the inner conductor 1 is a silver-plated copper inner conductor, tin-plated copper Any one of inner conductor, bare copper inner conductor, silver-plated copper-clad steel inner conductor, silver-plated copper-clad aluminum inner conductor, diameter 127-511 ⁇ m; the silver-plated copper inner conductor or tin-plated copper inner conductor or plating The thickness of the silver copper-clad steel inner conductor or silver-plated copper-clad aluminum inner conductor is 0.3-2.0 ⁇ m.
  • the first insulating layer 2 is provided with an air insulating structure, which is a porous structure or a microporous structure, and the pore shape is circular, fan-shaped, or irregular.
  • the air insulation structure in FIG. 2 is a fan-shaped hole structure
  • the air insulation structure in FIG. 3 is a round hole structure. The provision of the air insulation structure can significantly improve the insulation of the first insulation layer.
  • the first insulating layer 2 is a polyethylene insulating layer, a foamed polyethylene insulating layer, a perfluoroethylene propylene insulating layer, a fusible polytetrafluoroethylene insulating layer, Any one of polytetrafluoroethylene insulation layer and foamed perfluoroethylene propylene insulation layer, the thickness of the first insulation layer 2 is 100-300 ⁇ m; the second insulation layer 3 is wrapped around the first insulation
  • the second insulating layer 3 is a polyethylene insulating layer, a foamed polyethylene insulating layer, a perfluoroethylene propylene insulating layer, a fusible polytetrafluoroethylene insulating layer, a polytetrafluoroethylene insulating layer,
  • the foamed polyperfluoroethylene propylene insulation layer or the polypropylene insulation layer is any one of which, the thickness of the second insulation layer 3 is 50-300 ⁇ m.
  • the first shielding layer 4 is longitudinally wrapped outside the second insulating layer 3, and the first shielding layer 4 is hot-melt self-adhesive aluminum foil, hot-melt self-adhesive copper Any one of foil, hot melt self-adhesive silver-plated copper foil, aluminum foil, copper foil, silver-plated copper foil, the thickness of the first shielding layer 4 is 10-200 ⁇ m;
  • the second shielding layer 5 is wrapped around Outside the first shielding layer 4, the second shielding layer 5 is one of hot-melt self-adhesive aluminum foil, hot-melt self-adhesive copper foil, hot-melt self-adhesive silver-plated copper foil, aluminum foil, copper foil, silver-plated copper foil Any one, the thickness of the second shielding layer 5 is 10-200 ⁇ m;
  • the outer coating layer 6 is a plastic Mylar tape outer coating layer, a polyethylene outer coating layer, a polytetrafluoroethylene outer coating layer, a polyperfluor
  • Embodiment 2 As shown in FIG. 4, FIG. 5 and FIG. 6, a high-frequency low-loss data transmission line is characterized by including an inner conductor 1, a first insulating layer 2, a second insulating layer 3, and a first shielding layer 4. Inner cover layer 7, second shielding layer 5 and outer cover layer 6; the first insulating layer 2 is wrapped outside the inner conductor 1, and the second insulating layer 3 is wrapped around the first insulating layer 2 In addition, the first shielding layer 4 is wrapped around the second insulating layer 3, the inner covering layer 7 is wrapped around the first shielding layer 4, and the second shielding layer 5 is wrapped around the inner covering layer Outside of 7, the outer cover layer 6 is wrapped outside the second shielding layer 5.
  • the inner conductor 1 is used to conduct current, and the corresponding conductor specification is selected according to the required strength; the number of the inner conductor 1 is two, and one of the two inner conductors 1
  • the outer part is individually covered with a first insulating layer 2, and the second insulating layer 3 simultaneously covers the first insulating layer 2 other than the two inner conductors;
  • the inner conductor 1 is a silver-plated copper inner conductor, tin-plated copper Any one of inner conductor, bare copper inner conductor, silver-plated copper-clad steel inner conductor, silver-plated copper-clad aluminum inner conductor, diameter 127-511 ⁇ m; the silver-plated copper inner conductor or tin-plated copper inner conductor or plating
  • the thickness of the silver copper-clad steel inner conductor or silver-plated copper-clad aluminum inner conductor is 0.3-2.0 ⁇ m.
  • the first insulating layer 2 is provided with an air insulating structure, and the air insulating structure is a porous structure or a microporous structure, and the pore type is a circular shape or a fan shape or a special shape.
  • the air insulation structure in FIG. 5 is a fan-shaped hole structure, and the air insulation structure in FIG. 6 is a round hole structure. The provision of the air insulation structure can significantly improve the insulation of the first insulation layer.
  • the first insulating layer 2 is a polyethylene insulating layer, a foamed polyethylene insulating layer, a perfluoroethylene propylene insulating layer, a fusible polytetrafluoroethylene insulating layer, Any one of polytetrafluoroethylene insulation layer and foamed perfluoroethylene propylene insulation layer, the thickness of the first insulation layer 2 is 100-300 ⁇ m; the second insulation layer 3 is wrapped around the first insulation
  • the second insulating layer 3 is a polyethylene insulating layer, a foamed polyethylene insulating layer, a perfluoroethylene propylene insulating layer, a fusible polytetrafluoroethylene insulating layer, a polytetrafluoroethylene insulating layer,
  • the foamed polyperfluoroethylene propylene insulation layer or the polypropylene insulation layer is any one of which, the thickness of the second insulation layer 3 is 50-300 ⁇ m.
  • the first shielding layer 4 is longitudinally wrapped outside the second insulating layer 3, and the first shielding layer 4 is hot-melt self-adhesive aluminum foil, hot-melt self-adhesive copper Any one of foil, hot melt self-adhesive silver-plated copper foil, aluminum foil, copper foil, silver-plated copper foil, the thickness of the first shielding layer 4 is 10-200 ⁇ m;
  • the inner cover layer 7 is plastic Mylar
  • the outer cover layer, the polyethylene outer cover layer, the polytetrafluoroethylene outer cover layer, the polyperfluoroethylene propylene outer cover layer, the polyolefin outer cover layer, the thickness of the inner cover layer 7 is 10- 600 ⁇ m;
  • the second shielding layer 5 is wrapped around the inner cover layer 7, the second shielding layer 5 is hot-melt self-adhesive aluminum foil, hot-melt self-adhesive copper foil, hot-melt self-adhesive silver-plated copper foil, Any one of aluminum foil,
  • the invention is a high-frequency low-loss data transmission line.
  • the shielding layer structure includes a first shielding layer and a second shielding layer.
  • the inner conductor transmits 3.5GHz-30GHz high-frequency signals
  • the signal attenuation is very small, and the inner conductor transmits more than 60GHz.
  • the signal attenuation is reduced by more than 20% compared to ordinary wires;
  • the present invention coats the first insulation layer outside the inner conductor, covers the second insulation layer outside the first insulation layer, and then covers the second shielding layer
  • the outer cover layer is also provided with an inner cover layer, so the present invention has good insulation and strong protection, and greatly reduces the attenuation of the signal.
  • the present invention can be well protected during the transmission of high frequency and large power consumption signals in the 5G era Stable and effective transmission of signals. Therefore, the present invention has industrial applicability.

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Abstract

一种高频率低损耗数据传输线，包括内导体、第一绝缘层、第二绝缘层、第一屏蔽层、第二屏蔽层及外被层；第一绝缘层包覆于内导体之外，第二绝缘层包覆于第一绝缘层之外，第一屏蔽层包覆于第二绝缘层之外，第二屏蔽层包覆于第一屏蔽层之外，外被层包覆于第二屏蔽层之外。该数据传输线高频信号衰减少、耐高温性能强、能保障5G网络数据信号稳定和有效传递。

Description

一种高频率低损耗数据传输线 技术领域
本发明涉及通信线材技术领域，特别涉及一种高频率低损耗数据传输线。
 背景技术
5G网络作为第五代移动通信网络，5G无线关键技术：微基站和Massive MIMO。
5G的容量是4G的1000倍，峰值速率10Gbps-20Gbps，要提升容量和速率无非就是三板斧：频谱带宽、频谱效率和小区数量。
频谱带宽，高频段的频率资源丰富，同时，目前小于3GHz的低频段基本被2/3/4G网络占用，所以5G网络就得向高频段3.5GHz-30GHz（甚至更高）扩展。微基站已成为未来解决网络覆盖和容量的关键。未来城市路灯、广告牌、电杆等各种街道设施都将成为小基站挂靠的地方。
Massive MIMO就是在基站侧配置远多于现有的系统的大规模天线阵列的MU-MIMO，来同时服务多个用户。它可以大幅提升无线频谱效率，增强网络覆盖和系统容量，简而言之，就是通过分集技术提升传输可靠性、空间复用提升数据速率、波束赋形提升覆盖范围。
这是一场由海量数据引发的从量变到质变的数据革命，是一场由技术创新去推动社会进步的革命。为了实现5G网络的数据传输，对数据传输线也提出了越来越高的要求。但是，现在技术中的数据传输线，对高频段3.5GHz-30GHz甚至更高的高频信号衰减严重，不适合于实现5G网络的数据传输，此外，现有技术中的数据传输线其绝缘层结构一般，耐高温性能差，也不适合5G网络的数据传输，不能保障5G网络信号的稳定和有效传递。
 技术问题
本发明要解决的技术问题是根据上述现有技术的不足，提供一种高频信号衰减少、耐高温性能强、能保障5G网络数据信号稳定和有效传递的高频率低损耗数据传输线。
 技术解决方案
为解决上述技术问题，本发明的第一技术方案是：一种高频率低损耗数据传输线，包括内导体、第一绝缘层、第二绝缘层、第一屏蔽层、第二屏蔽层及外被层；所述第一绝缘层包覆于内导体之外，所述第二绝缘层包覆于第一绝缘层之外，所述第一屏蔽层包覆于第二绝缘层之外，所述第二屏蔽层包覆于第一屏蔽层之外，所述外被层包覆于第二屏蔽层之外。
优选地，所述内导体的数量为两根，两根内导体之外分别单独包覆有第一绝缘层，所述第二绝缘层同时包覆两根内导体之外的第一绝缘层；所述内导体为镀银铜内导体、镀锡铜内导体、裸铜内导体、镀银铜包钢内导体、镀银铜包铝内导体中的任意一种，直径为127-511μm；所述镀银铜内导体或镀锡铜内导体或镀银铜包钢内导体或镀银铜包铝内导体的镀层厚度为0.3-2.0μm。
优选地，所述第一绝缘层设有空气绝缘结构，所述空气绝缘结构为多孔结构或微孔结构，其孔型为圆形或扇形或异形。
优选地，所述第一绝缘层为聚乙烯绝缘层、发泡聚乙烯绝缘层、聚全氟乙丙烯绝缘层、可熔性聚四氟乙烯绝缘层、聚四氟乙烯绝缘层、发泡聚全氟乙丙烯绝缘层中的任意一种，所述第一绝缘层的厚度为100-300μm；所述第二绝缘层绕包覆于第一绝缘层之外，所述第二绝缘层为聚乙烯绝缘层、发泡聚乙烯绝缘层、聚全氟乙丙烯绝缘层、可熔性聚四氟乙烯绝缘层、聚四氟乙烯绝缘层、发泡聚全氟乙丙烯绝缘层、聚丙烯绝缘层中的任意一种，所述第二绝缘层的厚度为50-300μm。
优选地，所述第一屏蔽层纵包覆于第二绝缘层之外，所述第一屏蔽层为热熔自粘铝箔、热熔自粘铜箔、热熔自粘镀银铜箔、铝箔、铜箔、镀银铜箔中的任意一种，所述第一屏蔽层的厚度为10-200μm；所述第二屏蔽层绕包覆于第一屏蔽层之外，所述第二屏蔽层为热熔自粘铝箔、热熔自粘铜箔、热熔自粘镀银铜箔、铝箔、铜箔、镀银铜箔中的任意一种，所述第二屏蔽层的厚度为10-200μm；所述外被层为塑料麦拉带外被层、聚乙烯外被层、聚四氟乙烯外被层、聚全氟乙丙烯外被层、聚烯烃外被层中的任意一种，所述外被层的厚度为10-600μm。
为解决上述技术问题，本发明的第二技术方案是：一种高频率低损耗数据传输线，其特征在于：包括内导体、第一绝缘层、第二绝缘层、第一屏蔽层、内被层、第二屏蔽层及外被层；所述第一绝缘层包覆于内导体之外，所述第二绝缘层包覆于第一绝缘层之外，所述第一屏蔽层包覆于第二绝缘层之外，所述内被层包覆于第一屏蔽层之外，所述第二屏蔽层包覆于内被层之外，所述外被层包覆于第二屏蔽层之外。
优选地，所述内导体的数量为两根，两根内导体之外分别单独包覆有第一绝缘层，所述第二绝缘层同时包覆两根内导体之外的第一绝缘层；所述内导体为镀银铜内导体、镀锡铜内导体、裸铜内导体、镀银铜包钢内导体、镀银铜包铝内导体中的任意一种，直径为127-511μm；所述镀银铜内导体或镀锡铜内导体或镀银铜包钢内导体或镀银铜包铝内导体的镀层厚度为0.3-2.0μm。
优选地，所述第一绝缘层设有空气绝缘结构，所述空气绝缘结构为多孔结构或微孔结构，其孔型为圆形或扇形或异形。
优选地，所述第一绝缘层为聚乙烯绝缘层、发泡聚乙烯绝缘层、聚全氟乙丙烯绝缘层、可熔性聚四氟乙烯绝缘层、聚四氟乙烯绝缘层、发泡聚全氟乙丙烯绝缘层中的任意一种，所述第一绝缘层的厚度为100-300μm；所述第二绝缘层绕包覆于第一绝缘层之外，所述第二绝缘层为聚乙烯绝缘层、发泡聚乙烯绝缘层、聚全氟乙丙烯绝缘层、可熔性聚四氟乙烯绝缘层、聚四氟乙烯绝缘层、发泡聚全氟乙丙烯绝缘层、聚丙烯绝缘层中的任意一种，所述第二绝缘层的厚度为50-300μm。
优选地，所述第一屏蔽层纵包覆于第二绝缘层之外，所述第一屏蔽层为热熔自粘铝箔、热熔自粘铜箔、热熔自粘镀银铜箔、铝箔、铜箔、镀银铜箔中的任意一种，所述第一屏蔽层的厚度为10-200μm；所述内被层为塑料麦拉带外被层、聚乙烯外被层、聚四氟乙烯外被层、聚全氟乙丙烯外被层、聚烯烃外被层中的任意一种，所述内被层的厚度为10-600μm；所述第二屏蔽层绕包覆于内被层之外，所述第二屏蔽层为热熔自粘铝箔、热熔自粘铜箔、热熔自粘镀银铜箔、铝箔、铜箔、镀银铜箔中的任意一种，所述第二屏蔽层的厚度为10-200μm；所述外被层为塑料麦拉带外被层、聚乙烯外被层、聚四氟乙烯外被层、聚全氟乙丙烯外被层、聚烯烃外被层中的任意一种，所述外被层的厚度为10-600μm。
 有益效果
本发明的有益效果是：其一、本发明的屏蔽层结构包括第一屏蔽层和第二屏蔽层，内导体在传输3.5GHz-30GHz高频信号时，信号衰减非常小，内导体在传输60GHz以上的高频信号时,信号衰减比普通线材降低20%以上；其二、本发明在内导体外包覆第一绝缘层，在第一绝缘层之外包覆第二绝缘层，第二屏蔽层再包覆外被层，在一个技术方案中，第一屏蔽层与第二屏蔽层还设置内被层，因而本发明绝缘性好，保护性强，大幅降低了信号的衰减。因此，本发明在5G时代的高频率、大功耗信号传输过程中，能很好地保障信号的稳定和有效传递。
 附图说明
图1为高频率低损耗数据传输线的截面结构示意图之一。
图2为高频率低损耗数据传输线的截面结构示意图之二。
图3为高频率低损耗数据传输线的截面结构示意图之三。
图4为高频率低损耗数据传输线的截面结构示意图之四。
图5为高频率低损耗数据传输线的截面结构示意图之五。
图6为高频率低损耗数据传输线的截面结构示意图之六。
图中：1.内导体；2.第一绝缘层；3.第二绝缘层；4.第一屏蔽层；5.第二屏蔽层；6.外被层；7.内被层。
 本发明的实施方式
下面结合附图对本发明的结构原理和工作原理作进一步详细说明。
实施例一:如图1、图2和图3所示，一种高频率低损耗数据传输线，包括内导体1、第一绝缘层2、第二绝缘层3、第一屏蔽层4、第二屏蔽层5及外被层6；所述第一绝缘层2包覆于内导体1之外，所述第二绝缘层3包覆于第一绝缘层2之外，所述第一屏蔽层4包覆于第二绝缘层3之外，所述第二屏蔽层5包覆于第一屏蔽层4之外，所述外被层6包覆于第二屏蔽层5之外。
如图1、图2和图3所示，所述内导体1用于传导电流，根据需要的强度，选择相应的导体规格；所述内导体1的数量为两根，两根内导体1之外分别单独包覆有第一绝缘层2，所述第二绝缘层3同时包覆两根内导体之外的第一绝缘层2；所述内导体1为镀银铜内导体、镀锡铜内导体、裸铜内导体、镀银铜包钢内导体、镀银铜包铝内导体中的任意一种，直径为127-511μm；所述镀银铜内导体或镀锡铜内导体或镀银铜包钢内导体或镀银铜包铝内导体的镀层厚度为0.3-2.0μm。
如图2和图3所示，所述第一绝缘层2设有空气绝缘结构，所述空气绝缘结构为多孔结构或微孔结构，其孔型为圆形或扇形或异形。图2中的空气绝缘结构为扇形孔结构，图3中的空气绝缘结构为圆孔结构。设置空气绝缘结构能显著提升第一绝缘层的绝缘性。
如图1、图2和图3所示，所述第一绝缘层2为聚乙烯绝缘层、发泡聚乙烯绝缘层、聚全氟乙丙烯绝缘层、可熔性聚四氟乙烯绝缘层、聚四氟乙烯绝缘层、发泡聚全氟乙丙烯绝缘层中的任意一种，所述第一绝缘层2的厚度为100-300μm；所述第二绝缘层3绕包覆于第一绝缘层2之外，所述第二绝缘层3为聚乙烯绝缘层、发泡聚乙烯绝缘层、聚全氟乙丙烯绝缘层、可熔性聚四氟乙烯绝缘层、聚四氟乙烯绝缘层、发泡聚全氟乙丙烯绝缘层、聚丙烯绝缘层中的任意一种，所述第二绝缘层3的厚度为50-300μm。
如图1、图2和图3所示，所述第一屏蔽层4纵包覆于第二绝缘层3之外，所述第一屏蔽层4为热熔自粘铝箔、热熔自粘铜箔、热熔自粘镀银铜箔、铝箔、铜箔、镀银铜箔中的任意一种，所述第一屏蔽层4的厚度为10-200μm；所述第二屏蔽层5绕包覆于第一屏蔽层4之外，所述第二屏蔽层5为热熔自粘铝箔、热熔自粘铜箔、热熔自粘镀银铜箔、铝箔、铜箔、镀银铜箔中的任意一种，所述第二屏蔽层5的厚度为10-200μm；所述外被层6为塑料麦拉带外被层、聚乙烯外被层、聚四氟乙烯外被层、聚全氟乙丙烯外被层、聚烯烃外被层中的任意一种，所述外被层6的厚度为10-600μm。
实施例二:如图4、图5和图6所示，一种高频率低损耗数据传输线，其特征在于：包括内导体1、第一绝缘层2、第二绝缘层3、第一屏蔽层4、内被层7、第二屏蔽层5及外被层6；所述第一绝缘层2包覆于内导体1之外，所述第二绝缘层3包覆于第一绝缘层2之外，所述第一屏蔽层4包覆于第二绝缘层3之外，所述内被层7包覆于第一屏蔽层4之外，所述第二屏蔽层5包覆于内被层7之外，所述外被层6包覆于第二屏蔽层5之外。
如图4、图5和图6所示，所述内导体1用于传导电流，根据需要的强度，选择相应的导体规格；所述内导体1的数量为两根，两根内导体1之外分别单独包覆有第一绝缘层2，所述第二绝缘3层同时包覆两根内导体之外的第一绝缘层2；所述内导体1为镀银铜内导体、镀锡铜内导体、裸铜内导体、镀银铜包钢内导体、镀银铜包铝内导体中的任意一种，直径为127-511μm；所述镀银铜内导体或镀锡铜内导体或镀银铜包钢内导体或镀银铜包铝内导体的镀层厚度为0.3-2.0μm。
如图5和图6所示，所述第一绝缘层2设有空气绝缘结构，所述空气绝缘结构为多孔结构或微孔结构，其孔型为圆形或扇形或异形。图5中的空气绝缘结构为扇形孔结构，图6中的空气绝缘结构为圆孔结构。设置空气绝缘结构能显著提升第一绝缘层的绝缘性。
如图4、图5和图6所示，所述第一绝缘层2为聚乙烯绝缘层、发泡聚乙烯绝缘层、聚全氟乙丙烯绝缘层、可熔性聚四氟乙烯绝缘层、聚四氟乙烯绝缘层、发泡聚全氟乙丙烯绝缘层中的任意一种，所述第一绝缘层2的厚度为100-300μm；所述第二绝缘层3绕包覆于第一绝缘层2之外，所述第二绝缘层3为聚乙烯绝缘层、发泡聚乙烯绝缘层、聚全氟乙丙烯绝缘层、可熔性聚四氟乙烯绝缘层、聚四氟乙烯绝缘层、发泡聚全氟乙丙烯绝缘层、聚丙烯绝缘层中的任意一种，所述第二绝缘层3的厚度为50-300μm。
如图4、图5和图6所示，所述第一屏蔽层4纵包覆于第二绝缘层3之外，所述第一屏蔽层4为热熔自粘铝箔、热熔自粘铜箔、热熔自粘镀银铜箔、铝箔、铜箔、镀银铜箔中的任意一种，所述第一屏蔽层4的厚度为10-200μm；所述内被层7为塑料麦拉带外被层、聚乙烯外被层、聚四氟乙烯外被层、聚全氟乙丙烯外被层、聚烯烃外被层中的任意一种，所述内被层7的厚度为10-600μm；所述第二屏蔽层5绕包覆于内被层7之外，所述第二屏蔽层5为热熔自粘铝箔、热熔自粘铜箔、热熔自粘镀银铜箔、铝箔、铜箔、镀银铜箔中的任意一种，所述第二屏蔽层5的厚度为10-200μm；所述外被层6为塑料麦拉带外被层、聚乙烯外被层、聚四氟乙烯外被层、聚全氟乙丙烯外被层、聚烯烃外被层中的任意一种，所述外被层6的厚度为10-600μm。
以上所述，仅是本发明较佳实施方式，凡是依据本发明的技术方案对以上的实施方式所作的任何细微修改、等同变化与修饰，均属于本发明技术方案的范围内。
 工业实用性
本发明为一种高频率低损耗数据传输线，屏蔽层结构包括第一屏蔽层和第二屏蔽层，内导体在传输3.5GHz-30GHz高频信号时，信号衰减非常小，内导体在传输60GHz以上的高频信号时,信号衰减比普通线材降低20%以上；本发明在内导体外包覆第一绝缘层，在第一绝缘层之外包覆第二绝缘层，第二屏蔽层再包覆外被层，还设置内被层，因而本发明绝缘性好，保护性强，大幅降低了信号的衰减，本发明在5G时代的高频率、大功耗信号传输过程中，能很好地保障信号的稳定和有效传递。因此，本发明具有工业实用性。

Claims (10)

  1. 一种高频率低损耗数据传输线，其特征在于：包括内导体、第一绝缘层、第二绝缘层、第一屏蔽层、第二屏蔽层及外被层；所述第一绝缘层包覆于内导体之外，所述第二绝缘层包覆于第一绝缘层之外，所述第一屏蔽层包覆于第二绝缘层之外，所述第二屏蔽层包覆于第一屏蔽层之外，所述外被层包覆于第二屏蔽层之外。
  2. 根据权利要求1所述的高频率低损耗数据传输线，其特征在于：所述内导体的数量为两根，两根内导体之外分别单独包覆有第一绝缘层，所述第二绝缘层同时包覆两根内导体之外的第一绝缘层；所述内导体为镀银铜内导体、镀锡铜内导体、裸铜内导体、镀银铜包钢内导体、镀银铜包铝内导体中的任意一种，直径为127-511μm；所述镀银铜内导体或镀锡铜内导体或镀银铜包钢内导体或镀银铜包铝内导体的镀层厚度为0.3-2.0μm。
  3. 根据权利要求1所述的高频率低损耗数据传输线，其特征在于：所述第一绝缘层设有空气绝缘结构，所述空气绝缘结构为多孔结构或微孔结构，其孔型为圆形或扇形或异形。
  4. 根据权利要求1所述的高频率低损耗数据传输线，其特征在于：所述第一绝缘层为聚乙烯绝缘层、发泡聚乙烯绝缘层、聚全氟乙丙烯绝缘层、可熔性聚四氟乙烯绝缘层、聚四氟乙烯绝缘层、发泡聚全氟乙丙烯绝缘层中的任意一种，所述第一绝缘层的厚度为100-300μm；所述第二绝缘层绕包覆于第一绝缘层之外，所述第二绝缘层为聚乙烯绝缘层、发泡聚乙烯绝缘层、聚全氟乙丙烯绝缘层、可熔性聚四氟乙烯绝缘层、聚四氟乙烯绝缘层、发泡聚全氟乙丙烯绝缘层、聚丙烯绝缘层中的任意一种，所述第二绝缘层的厚度为50-300μm。
  5. 根据权利要求1所述的高频率低损耗数据传输线，其特征在于：所述第一屏蔽层纵包覆于第二绝缘层之外，所述第一屏蔽层为热熔自粘铝箔、热熔自粘铜箔、热熔自粘镀银铜箔、铝箔、铜箔、镀银铜箔中的任意一种，所述第一屏蔽层的厚度为10-200μm；所述第二屏蔽层绕包覆于第一屏蔽层之外，所述第二屏蔽层为热熔自粘铝箔、热熔自粘铜箔、热熔自粘镀银铜箔、铝箔、铜箔、镀银铜箔中的任意一种，所述第二屏蔽层的厚度为10-200μm；所述外被层为塑料麦拉带外被层、聚乙烯外被层、聚四氟乙烯外被层、聚全氟乙丙烯外被层、聚烯烃外被层中的任意一种，所述外被层的厚度为10-600μm。
  6. 一种高频率低损耗数据传输线，其特征在于：包括内导体、第一绝缘层、第二绝缘层、第一屏蔽层、内被层、第二屏蔽层及外被层；所述第一绝缘层包覆于内导体之外，所述第二绝缘层包覆于第一绝缘层之外，所述第一屏蔽层包覆于第二绝缘层之外，所述内被层包覆于第一屏蔽层之外，所述第二屏蔽层包覆于内被层之外，所述外被层包覆于第二屏蔽层之外。
  7. 根据权利要求6所述的高频率低损耗数据传输线，其特征在于：所述内导体的数量为两根，两根内导体之外分别单独包覆有第一绝缘层，所述第二绝缘层同时包覆两根内导体之外的第一绝缘层；所述内导体为镀银铜内导体、镀锡铜内导体、裸铜内导体、镀银铜包钢内导体、镀银铜包铝内导体中的任意一种，直径为127-511μm；所述镀银铜内导体或镀锡铜内导体或镀银铜包钢内导体或镀银铜包铝内导体的镀层厚度为0.3-2.0μm。
  8. 根据权利要求6所述的高频率低损耗数据传输线，其特征在于：所述第一绝缘层设有空气绝缘结构，所述空气绝缘结构为多孔结构或微孔结构，其孔型为圆形或扇形或异形。
  9. 根据权利要求6所述的高频率低损耗数据传输线，其特征在于：所述第一绝缘层为聚乙烯绝缘层、发泡聚乙烯绝缘层、聚全氟乙丙烯绝缘层、可熔性聚四氟乙烯绝缘层、聚四氟乙烯绝缘层、发泡聚全氟乙丙烯绝缘层中的任意一种，所述第一绝缘层的厚度为100-300μm；所述第二绝缘层绕包覆于第一绝缘层之外，所述第二绝缘层为聚乙烯绝缘层、发泡聚乙烯绝缘层、聚全氟乙丙烯绝缘层、可熔性聚四氟乙烯绝缘层、聚四氟乙烯绝缘层、发泡聚全氟乙丙烯绝缘层、聚丙烯绝缘层中的任意一种，所述第二绝缘层的厚度为50-300μm。
  10. 根据权利要求6所述的高频率低损耗数据传输线，其特征在于：所述第一屏蔽层纵包覆于第二绝缘层之外，所述第一屏蔽层为热熔自粘铝箔、热熔自粘铜箔、热熔自粘镀银铜箔、铝箔、铜箔、镀银铜箔中的任意一种，所述第一屏蔽层的厚度为10-200μm；所述内被层为塑料麦拉带外被层、聚乙烯外被层、聚四氟乙烯外被层、聚全氟乙丙烯外被层、聚烯烃外被层中的任意一种，所述内被层的厚度为10-600μm；所述第二屏蔽层绕包覆于内被层之外，所述第二屏蔽层为热熔自粘铝箔、热熔自粘铜箔、热熔自粘镀银铜箔、铝箔、铜箔、镀银铜箔中的任意一种，所述第二屏蔽层的厚度为10-200μm；所述外被层为塑料麦拉带外被层、聚乙烯外被层、聚四氟乙烯外被层、聚全氟乙丙烯外被层、聚烯烃外被层中的任意一种，所述外被层的厚度为10-600μm。
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