WO2020097906A1

WO2020097906A1 - Fan speed control apparatus and computing device

Info

Publication number: WO2020097906A1
Application number: PCT/CN2018/115861
Authority: WO
Inventors: 修洪雨
Original assignee: 北京比特大陆科技有限公司
Priority date: 2018-11-16
Filing date: 2018-11-16
Publication date: 2020-05-22

Abstract

Provided in embodiments of the present disclosure are a fan speed control apparatus and a computing device. The fan speed control apparatus is used for controlling the speed of a fan in a computing device, the computing device comprising at least one PCB; the control apparatus comprises: a temperature sensor, the temperature sensor being disposed in a structural component of a chip assembly on the PCB and being used for monitoring the temperature of the chip in real time; and a control unit, which is used for receiving a chip temperature value monitored in real time by the temperature sensor and adjusting the speed of the fan according to the chip temperature value. In the embodiments of the present disclosure, an externally-provided temperature sensor is directly provided in the structural component of the chip assembly on the PCB, and the control unit adjusts the speed of the fan on the basis of the temperature value of the chip that changes in real time and that is monitored by the temperature sensor. The embodiments of the present disclosure may avoid the problem wherein change is not immediate and is not accurate that occurs when adjusting fan speed by using the temperature of a PCB.

Description

Fan speed control device and computing equipment

Technical field

The present invention relates to the technical field of heat dissipation control of computing equipment, and in particular, to a fan rotation speed control device and computing equipment.

Background technique

In the existing artificial intelligence (referred to as AI) solutions, in order to meet the accelerated processing needs of large-scale data operations, technicians use multiple sets of processing chips to form a tandem structure to build a computing board, and use one or more computing boards to form high performance Computing equipment has greatly improved the computing and processing capabilities for artificial intelligence.

In the prior art, for such a multi-chip computing board, a heat sink is usually attached to each chip, and the fan of the device is used for air cooling. At the same time, in order to ensure the heat dissipation effect of the radiator, the existing computing equipment needs to adjust the fan speed according to the temperature change of the computing device on the computing board. An optional solution is based on the judgment of the temperature sensor on the PCB board of the computing device. The PCB board temperature sensor can accurately reflect the change of the ambient temperature. However, under abnormal operating conditions, such as fan failure, low air pressure, high altitude, structural component clogging, device power changes, etc., the temperature change reported by the PCB board temperature sensor is less than the actual temperature change of the chip, so according to the PCB The change of the fan speed adjusted by the board temperature sensor is not timely, and cannot meet the fan speed actually required by the chip at this time, so that the problem that the temperature of the chip increases and the chip and the computing board are burned out easily occurs.

Summary of the invention

Embodiments of the present disclosure provide a fan speed control device and a computing device, to solve the problem that the adjustment of the fan speed based on the PCB board temperature sensor in the prior art does not change in time under abnormal operating conditions, and it is prone to increase the chip temperature until the chip is burned and the operation Board problem.

In a first aspect, an embodiment of the present disclosure provides a fan rotation speed control device for controlling the rotation speed of a fan in a computing device, where the computing device includes at least one PCB board, and the control device includes:

A temperature sensor, which is placed in the structural component of the chip assembly on the PCB board and used for real-time monitoring of the temperature of the chip;

The control unit is configured to receive the chip temperature value monitored by the temperature sensor in real time, and adjust the rotation speed of the fan based on the chip temperature value.

In an optional embodiment, the chip assembly includes a chip and a heat sink connected thereto.

In an optional embodiment, the chip includes a chip housing.

In an optional embodiment, the structural components of the chip assembly include the heat sink and the chip housing.

In an optional embodiment, the temperature sensor is placed in a groove on the bottom surface of the heat sink that is in contact with the chip housing.

In an optional embodiment, the temperature sensor is placed in a groove on the surface of the chip housing.

In an optional embodiment, the temperature sensor is sealed in the groove by thermally conductive adhesive.

In an optional embodiment, the temperature sensor is connected to the PCB board through a wire, and transmits the chip temperature value to the control unit via the PCB board.

In an optional embodiment, the wire is connected to the PCB through a connection terminal.

In an optional embodiment, the wire is connected to the PCB by soldering.

In a second aspect, an embodiment of the present disclosure provides a computing device, including: a fan; at least one PCB board; and a control device for controlling the fan speed of the fan according to any one of the embodiments of the first aspect.

The fan speed control device and the computing device disclosed in the embodiments of the present disclosure, by placing an external temperature sensor directly in the structure of the chip assembly on the PCB board, the control unit is based on the temperature of the chip real-time change sensed by the temperature sensor Value to adjust the fan speed, can avoid the problem of untimely and inaccurate changes that occur when the PCB board temperature is used to adjust the fan speed.

BRIEF DESCRIPTION

In order to more clearly explain the embodiments of the present disclosure or the technical solutions in the prior art, the following will briefly introduce the drawings used in the description of the embodiments or the prior art. Obviously, the drawings in the following description These are some embodiments of the present disclosure. For those of ordinary skill in the art, without paying creative labor, other drawings may be obtained based on these drawings.

FIG. 1 is a schematic structural diagram of a fan speed control device 200 according to an embodiment of the present disclosure;

2 is a schematic structural diagram of a chip component 11 in a computing device 100 according to an embodiment of the present disclosure;

FIG. 3 is a schematic structural view of the temperature sensor 30 according to an embodiment of the present disclosure placed in the radiator 13;

FIG. 4 is a schematic structural diagram of the temperature sensor 30 according to an embodiment of the present disclosure placed in the chip housing 123;

FIG. 5 is a flowchart of a method for controlling the rotation speed of a fan according to an embodiment of the present disclosure.

detailed description

To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present disclosure will be described clearly and completely in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are a part of the embodiments of the present disclosure, but not all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

FIG. 1 is a schematic structural diagram of a fan speed control device 200 according to an embodiment of the present disclosure. As shown in FIG. 1, the fan rotation speed control apparatus 200 of the embodiment of the present disclosure is used to control the rotation speed of the fan 20 in the computing device 100. The computing device 100 includes at least one PCB board 10, and the PCB board 10 At least one chip assembly 11 is installed.

The fan speed control device 200 includes:

The temperature sensor 30 is placed in the structural component of the chip assembly 11 on the PCB board 10, and is used for real-time monitoring of the temperature of the chip;

The control unit 40 is configured to receive the chip temperature value monitored by the temperature sensor 30 in real time, and adjust the rotation speed of the fan 20 based on the chip temperature value.

In this embodiment, by placing the external temperature sensor directly in the structural component of the chip assembly on the PCB board, since the structural component of the chip assembly closely contacts the chip body, the temperature of the structural component changes with the temperature of the chip device The real-time change can accurately reflect the temperature of the chip device, so the fan speed can be adjusted according to the temperature value of the chip monitored by the external temperature sensor in real time, which can avoid the use of PCB board temperature to adjust the fan speed. The problem.

In some optional embodiments, the temperature sensor 30 includes but is not limited to a resistance temperature sensor, a thermocouple temperature sensor, a thermistor temperature sensor, etc., which measures the temperature value of the contacted object through a temperature sensing element, and The temperature sensing signal is output to the control unit 40 through the transmission wire.

In some optional embodiments, the control unit 40 may be a control board in a computing device, such as a main board provided in a computer, a main board provided in a terminal device, a control board provided in an AI computing device, and the like. The control unit 40 may also be a control unit integrated on various components of the computing device, such as a controller or processor integrated on the control board of the computing device, or a controller or processor integrated on the computing board of the computing device Etc., or controllers, processors, etc. integrated on other components of the computing device. In addition, the control module 40 can also be a separately provided control unit, such as a controller and processor that are independent of the computing board, control board and other components in the computing device, or even a controller and processor that are independent of the computing device Etc., such as a controller, a processor, etc., provided outside the chassis of the computing device, as long as it can perform the task of controlling the rotation speed of the fan of the computing device, which is not limited in any way.

FIG. 2 is a schematic structural diagram of the chip assembly 11 in the computing device 100 according to an embodiment of the present disclosure. As shown in FIG. 2, the chip assembly 11 includes a chip 12 and a heat sink 13 connected thereto.

The chip 12 includes a substrate 121, a chip body 122 on the substrate 121, and a chip housing 123 covering the chip body 122 and the substrate 121.

In some optional embodiments, the chip body 122 is a bare chip of the chip, and the chip shell 123 may be a plastic package shell, a metal shell or a ceramic shell, preferably a plastic package shell, which is not limited in this application.

Wherein, the chip 12 may be an integrated circuit IC chip, specifically an ASIC dedicated integrated circuit chip, which is used to perform various data processing operations, for example, it may include, but is not limited to, performing artificial intelligence AI operations.

The heat sink 13 includes a bottom plate 131 tightly connected to the upper surface 120 of the chip case 123 via the bottom surface 130 and a plurality of fins 132 connected to the bottom surface 131. The heat sink 13 dissipates heat generated by the chip body 122 through thermal conduction.

In this embodiment, the structural components of the chip assembly 11 include a chip housing 123 and a heat sink 13 connected to the chip housing 123. Since the chip casing 123 closely contacts the chip body 122, the temperature of the chip casing 123 will change in real time with the change of the temperature of the chip body, which can accurately reflect the temperature of the chip body 122. In addition, the heat sink 13 connected to the chip housing 123 can accurately reflect the temperature of the chip body 122 due to its good thermal conductivity characteristics. Therefore, the temperature sensor 30 can be placed in the chip housing 123 or the heat sink 13 connected to the chip housing 123 to realize the temperature monitoring of the chip.

FIG. 3 is a schematic structural view of the temperature sensor 30 according to an embodiment of the present disclosure placed in the radiator 13. As shown in FIG. 3, an embodiment of the present disclosure defines a groove 133 on the bottom surface 130 of the bottom plate 131 of the heat sink 13 to fix the temperature sensor 30 in the groove 133. The transmission wire of the temperature sensor 30 is led to the outside for transmitting the temperature sensing signal to the control unit 40.

In an alternative embodiment, the temperature sensor can be sealed in the groove 133 by thermally conductive glue, so as to ensure that the temperature sensor 30 will not fall off, and maintain close contact with the bottom plate 131 of the heat sink to sense Real-time temperature change of the radiator.

FIG. 4 is a schematic diagram of the temperature sensor 30 according to an embodiment of the present disclosure placed in the chip housing 123. As shown in FIG. 4, an embodiment of the present disclosure defines a groove 124 on the upper surface 120 of the chip housing 123 to fix the temperature sensor 30 in the groove 124. The transmission wire of the temperature sensor 30 is led to the outside for transmitting the temperature sensing signal to the control unit 40.

In an alternative embodiment, the temperature sensor can be sealed in the groove 124 by thermally conductive glue, so as to ensure that the temperature sensor 30 does not fall off and maintain close contact with the chip housing 123, thereby sensing the chip housing Real-time temperature changes.

In an alternative embodiment, the PCB board 10 of the computing device 100 has a connection interface for connecting the wires of the temperature sensor, and the transmission wires of the temperature sensor 30 are plugged into the connection interface on the PCB board 10 through the connection terminals In order to transmit the temperature sensing signal output by the temperature sensor 30 to the control unit 40 through the logic circuit on the PCB board 10.

In an alternative embodiment, the transmission wire of the temperature sensor 30 can also be welded to the connection interface on the PCB board 10 by soldering, so that the temperature output by the temperature sensor 30 can be output by the logic circuit on the PCB board The sensing signal is transmitted to the control unit 40.

The control unit 40 recognizes the chip temperature value according to the received temperature sensing signal of the temperature sensor 30 and adjusts the rotation speed of the fan 20 based on the chip temperature value.

FIG. 5 is a flowchart of a method for controlling the rotation speed of a fan according to an embodiment of the present disclosure. As shown in FIG. 5, the fan rotation speed control method of the embodiment of the present disclosure is used to control the rotation speed of the fan 20 in the computing device 100. The computing device 100 includes at least one PCB board 10. The method includes:

Step S101: Place a temperature sensor in the structural component of the chip assembly on the PCB board for real-time monitoring of the temperature of the chip;

Step S102: Receive the chip temperature value monitored by the temperature sensor in real time, and adjust the rotation speed of the fan based on the chip temperature value.

In this embodiment, by placing the external temperature sensor directly in the structural component of the chip assembly on the PCB board, since the structural component of the chip assembly closely contacts the chip body, the temperature of the structural component changes with the temperature of the chip device Real-time changes can accurately reflect the temperature of the chip device, so the speed of the fan can be adjusted according to the temperature value of the chip monitored by the external temperature sensor in real time, which can avoid the use of PCB board temperature to adjust the fan speed. The problem.

In some optional embodiments, the temperature sensor includes, but is not limited to, a resistive temperature sensor, a thermocouple temperature sensor, a thermistor temperature sensor, etc., which measures the temperature value of the contacted object through a temperature sensing element.

In an alternative embodiment, the implementation of the chip assembly and the structural component is as described in FIG. 2, the chip assembly includes a chip 12 and a heat sink 13 connected thereto, and the structural component of the chip assembly includes a chip The casing 123 and the heat sink 13 connected to the chip casing 123 will not be repeated here.

In an alternative embodiment, the step S101 of placing the temperature sensor in the structure of the chip assembly on the PCB includes: placing the temperature sensor on the heat sink and the In the groove on the bottom surface where the chip housing contacts. Specifically, refer to the embodiment described in FIG. 3.

In an optional embodiment, the step S101 of placing the temperature sensor in the structural component of the chip assembly on the PCB includes: placing the temperature sensor in a recess on the surface of the chip housing In the slot. Specifically, refer to the embodiment described in FIG. 4.

In an optional embodiment, the method further includes: sealing the temperature sensor in the groove by a thermally conductive adhesive, so as to ensure that the temperature sensor does not fall off and maintain close contact with the chip housing 123, In this way, the real-time temperature change of the chip casing is sensed.

In an alternative embodiment, the method further includes: connecting the temperature sensor to the PCB board 10 through a wire, and transmitting the chip temperature value to the fan via the PCB board 10 control unit.

The control unit may be a control board in a computing device, such as a main board provided in a computer, a main board provided in a terminal device, and a control board provided in an AI computing device. The control unit 40 may also be a control unit integrated on various components of the computing device, such as a controller or processor integrated on the control board of the computing device, or a controller or processor integrated on the computing board of the computing device Etc., or controllers, processors, etc. integrated on other components of the computing device. In addition, the control module 40 can also be a separately provided control unit, such as a controller and processor that are independent of the computing board, control board and other components in the computing device, or even a controller and processor that are independent of the computing device Etc., such as a controller, a processor, etc., provided outside the chassis of the computing device, as long as it can perform the task of controlling the rotation speed of the fan of the computing device, which is not limited in any way.

In an optional embodiment, the PCB board 10 of the computing device 100 has a connection interface for connecting the wires of the temperature sensor, and the transmission wires of the temperature sensor are plugged into the connection interface on the PCB board 10 through the connection terminals, Therefore, the temperature sensing signal output by the temperature sensor is transmitted to the control unit through the logic circuit on the PCB board 10.

In an optional embodiment, the transmission wire of the temperature sensor can also be soldered to the connection interface on the PCB board 10, so that the temperature output by the temperature sensor is sensed by the logic circuit on the PCB board 10 The signal is transmitted to the control unit.

The control unit recognizes the chip temperature value according to the received temperature sensing signal of the temperature sensor, and adjusts the rotation speed of the fan 20 based on the chip temperature value.

As shown in FIG. 1, the present disclosure also proposes a computing device 100. In the embodiment of the present disclosure, the computing device 100 includes: a fan 20; at least one PCB board 10; and a fan rotation speed control device 200 according to any of the foregoing embodiments.

In this embodiment, the computing device 100 may generally be any computer or other terminal device capable of performing a computing task, which is not limited in any way.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than limiting them; although the present disclosure has been described in detail with reference to the foregoing embodiments, persons of ordinary skill in the art should understand The technical solutions described in the foregoing embodiments can still be modified, or some or all of the technical features can be equivalently replaced; and these modifications or replacements do not deviate from the essence of the corresponding technical solutions of the technical solutions of the embodiments of the present invention. range.

Claims

A fan rotation speed control device is used to control the rotation speed of a fan in a computing device. The computing device includes at least one PCB board. The control device includes:

A temperature sensor, which is placed in the structural component of the chip assembly on the PCB board and used for real-time monitoring of the temperature of the chip;

The control unit is configured to receive the chip temperature value monitored by the temperature sensor in real time, and adjust the rotation speed of the fan based on the chip temperature value.
The fan speed control device according to claim 1, wherein the chip assembly includes a chip and a heat sink connected thereto.
The fan rotation speed control device according to claim 2, wherein the chip includes a chip housing.
The fan rotation speed control device according to claim 3, wherein the structural components of the chip assembly include the heat sink and the chip housing.
The fan rotation speed control device according to claim 4, wherein the temperature sensor is placed in a groove on the bottom surface of the heat sink that is in contact with the chip housing.
The fan rotation speed control device according to claim 4, wherein the temperature sensor is placed in a groove on the surface of the chip housing.
The fan speed control device according to claim 5 or 6, wherein the temperature sensor is sealed in the groove by a thermally conductive adhesive.
The fan rotation speed control device according to claim 1, wherein the temperature sensor is connected to the PCB board through a wire, and transmits the chip temperature value to the control unit via the PCB board.
The fan rotation speed control device according to claim 8, wherein the wire is connected to the PCB through a connection terminal.
The fan rotation speed control device according to claim 8, wherein the wire is connected to the PCB board by soldering.
A computing device, characterized in that it includes:

fan;

At least one PCB board; and

The control device for the fan speed according to any one of claims 1-10 for controlling the fan.