WO2020093364A1

WO2020093364A1 - Electronic device and circuit board assembly

Info

Publication number: WO2020093364A1
Application number: PCT/CN2018/114812
Authority: WO
Inventors: 刘文俊
Original assignee: 深圳市柔宇科技有限公司
Priority date: 2018-11-09
Filing date: 2018-11-09
Publication date: 2020-05-14
Also published as: CN112640598A

Abstract

An electronic device (100), comprising: a hollow main body (10); and a circuit board assembly (30) provided inside the hollow main body (10). The circuit board assembly (30) comprises: a circuit board support (31); a circuit board (32) fixedly mounted on one side of the support (31); a heat source chip (321) mounted on the circuit board (32) and electrically connected to the circuit board (32); and a heat dissipation module (33) provided on a side of the heat source chip (321) away from the circuit board (32) and conductively connected to the heat source chip (321). Further provided is a circuit board assembly (30). The present invention features a better heat dissipation effect.

Description

Electronic device and circuit board assembly

Technical field

The present application relates to the technical field of electronic devices, in particular to an electronic device and a circuit board assembly.

Background technique

Electronic devices (for example, mobile phones, tablet computers, etc.) generally include a control chip (ie, core processor). With the diversification and intelligentization of their functions, the requirements on the chip are also very high. The main frequency of current chips is generally 1GHz, 2GHz or even higher, and dual-core, quad-core and even eight-core chips are already very common. The development of the chip not only brings about the problem of power consumption, but also the heat of the chip is sealed inside the electronic equipment due to the hermeticity of the electronic device, which in turn causes the temperature of the electronic device to rise and affect the performance of the electronic device.

Summary of the invention

The embodiments of the present application disclose an electronic device and a circuit board assembly. The heat dissipation effect of the electronic device and the circuit board assembly is better, thereby improving the performance of the electronic device.

An embodiment of the present application discloses an electronic device, including:

Hollow body;

The circuit board assembly is provided in the body; wherein, the circuit board assembly includes:

Circuit board bracket;

The circuit board is fixedly installed on one side of the circuit board bracket;

A heat source chip mounted on the circuit board and electrically connected to the circuit board; and

The heat dissipation module is disposed on the side of the heat source chip away from the circuit board and is thermally connected to the heat source chip.

An embodiment of the present application discloses a circuit board assembly, including

Circuit board bracket;

The electronic device and circuit board assembly disclosed in this application include a circuit board bracket, a circuit board and a heat dissipation module. The circuit board is fixedly installed on one side of the circuit board bracket. A heat source chip is also installed on the circuit board, and the heat source chip is electrically connected to the circuit board. The heat dissipation module is disposed on a side of the heat source chip away from the circuit board. In this way, the heat generated by the heat source chip during operation is dissipated through the heat dissipation module and further transmitted through the circuit board bracket, which prevents the heat source chip from being damaged due to poor heat dissipation and extends the heat source chip The service life of the electronic device is improved.

BRIEF DESCRIPTION

In order to more clearly explain the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. Those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts.

FIG. 1 is an exploded perspective view of an electronic device in an embodiment of this application.

FIG. 2 is an exploded perspective view of the circuit board assembly in FIG. 1.

3 is a schematic diagram of the assembly structure of the circuit board assembly, the functional module and the base.

4 is a perspective view of an electronic device in another embodiment of this application.

5 is a cross-sectional view of the electronic device in FIG. 4.

6 is a schematic perspective view of the electronic device in FIG. 4 from another angle.

7 is a schematic diagram of the functional module of the electronic device in FIG. 4 disassembled from the electronic device.

8 is a schematic diagram of the separation of the engaging portion and the stop portion in an embodiment of the present application.

9 is a schematic diagram of the engaging portion and the stop portion engaging in an embodiment of the present application.

10 is a cross-sectional view of an electronic device in another embodiment of this application.

FIG. 11 is a partially enlarged view at A in FIG. 10.

detailed description

The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

In the description of the embodiments of the present invention, it should be understood that the terms “first” and “second” are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the indicated technical features quantity. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise specifically limited.

In the description of the embodiments of the present invention, it should be noted that the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it may be a fixed connection or It is a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be a direct connection, or it can be indirectly connected through an intermediary, it can be a connection between two components or two components Interaction. Those of ordinary skill in the art can understand the specific meanings of the above terms in the embodiments of the present invention according to specific situations.

Please refer to FIG. 1, which is an exploded perspective view of the electronic device 100 in an embodiment of the present application. The electronic device 100 includes a hollow body 10 and a circuit board assembly 30 disposed in the body 10, and is thermally connected to the body 10.

Please refer to FIG. 2 again. The circuit board assembly 30 includes a circuit board holder 31, a circuit board 32 and a heat dissipation module 33. The circuit board 32 is fixedly installed on one side of the circuit board bracket 31. A heat source chip 321 is further mounted on the circuit board 32, and the heat source chip 321 is electrically connected to the circuit board 32. The heat dissipation module 33 is disposed on a side of the heat source chip 321 away from the circuit board 32. In this way, the heat generated by the heat source chip 321 during operation is dissipated through the heat dissipation module 33, which prevents the heat source chip 321 from being damaged due to poor heat dissipation and extends the service life of the heat source chip 321 The performance of the electronic device 100 is improved. Wherein, the heat source chip 321 is pluggable on the circuit board 32 or soldered on the circuit board 32.

The heat source chip 321 includes a chip that generates more heat in the working state, for example, CPU (Central Processing Unit) or GPU (Graphics Processing Unit), which is a chip that generates more heat among many chips, so It is necessary to dissipate heat to the chips in time to ensure the normal operation of the electronic device 100.

In this embodiment, the heat source chip 321 is a processor. Wherein, the processor may be a central processing unit (Central Processing Unit, CPU), a GPU (Graphics Processing Unit, graphics processor), or other general-purpose processors, digital signal processors (Digital Signal Processor, DSP), Application specific integrated circuit (Application Specific Integrated Circuit, ASIC), field programmable gate array (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or the processor may be any conventional processor, etc. The processor is the control center of the electronic device 100, and various interfaces and lines are used to connect the entire electronic device 100. Various parts. In addition, the circuit board 32 may also be provided with other electronic components, such as resistors, capacitors, diodes, transistors, etc., so that the electronic device 100 can realize various functions.

In other embodiments, the circuit board 32 is also provided with a memory (not shown). Wherein, the memory can be used to store computer programs and / or modules, and the processor implements the electronic by running or executing the computer programs and / or modules stored in the memory and calling the data stored in the memory Various functions of the device 100. For example, the display state of the display screen 20 can be controlled by storing a corresponding program in the memory. In this embodiment, the memory may mainly include a program storage area and a data storage area, where the program storage area may store an operating system, application programs required for multiple functions (such as a sound playback function, an image playback function, etc.), etc. ; The data storage area can store data (such as audio data, display data, etc.) created according to the use of audio.

As shown in FIGS. 1 and 2, in some embodiments, the body 10 includes a connection end 101 and a fixed end 102 opposite to the connection end 101. The circuit board bracket 31 includes a main body 311 and a first support frame 312 and a second support frame 313 respectively disposed at two ends of the main body 311. The circuit board 32 is disposed on one side of the main body 311 and is located between the first support frame 311 and the second support frame 312, and is respectively connected to the first support frame 312 and the second support frame The frame 313 contacts. Wherein, the main body 311, the first support frame 312 and the second support frame 313 included in the circuit board bracket 31 are all made of heat conductive material, for example, made of metal material. When the circuit board assembly 30 is installed in the body 10, the first support frame 312 is close to the connection end 101, and the second support frame 313 is close to the fixed end 102, that is, the circuit The board support 31 is thermally connected to the body 10 through the first support frame 312 and the second support frame 313, and the heat dissipated by the heat dissipation module 33 can be radiated outward through the end of the electronic device 100 , Which in turn improves the heat dissipation effect.

In some embodiments, when the circuit board 32 is a single panel, the heat source chip 321 is disposed on the side of the circuit board 32 facing the main body 311 of the circuit board holder 31, so that the heat dissipation module 33 It is disposed between the main body 311 of the circuit board holder 31 and the heat source chip 321, and conducts the heat dissipated by the heat dissipation module 33 to the circuit board holder 31, and further passes through the circuit board holder 31 It is transferred to the end of the electronic device 100, and heat is dissipated through the end of the electronic device 100. Since the end of the electronic device 100 is usually not held or operated by the user, heat dissipation through the end does not affect the user's experience. In some embodiments, the heat dissipation module 33 includes a shield 331 and a heat conductive layer 332. The shielding cover 331 is disposed on the circuit board 32 and surrounds the heat source chip 321. The heat conductive layer 332 is disposed between the heat source chip 321 and the shielding cover 331. Among them, the shielding cover 331 is a tool for shielding electronic signals, and its role is to shield the influence of external electromagnetic waves on the internal heat source chip 321 and the electromagnetic waves generated by the internal heat source chip 321 to radiate outward, thereby reducing or eliminating electromagnetic interference between the chips. The material of the shielding cover 331 is generally 0.2 mm thick stainless steel and nickel white copper as the material, and the nickel white copper is a metal shielding material that is easy to be tinned. In this way, the heat generated by the heat source chip 321 can be transferred to the shielding cover 331 through the heat conducting layer 332 to achieve the effect of heat dissipation, and the shielding cover 331 can also be used to shield the electronic signal.

In this embodiment, the thermally conductive layer 332 is thermally conductive silica gel or thermally conductive silicone grease with good thermal conductivity. Among them, the main role of thermally conductive silicone or thermal grease is to reduce the contact thermal resistance generated between the surface of the heat source and the contact surface of the heat sink. Since the thermally conductive silicone or thermal grease can fill the gap between the heat source chip 321 and the shielding cover 331 and squeeze air out of the contact surface, the contact surface can make better contact and achieve face-to-face contact. The reaction on temperature can also reach the smallest possible temperature difference.

In other embodiments, in order to further improve the heat dissipation effect, the heat dissipation module 33 further includes a heat dissipation layer 333. The heat dissipation layer 333 is disposed on the side of the shielding cover 331 away from the heat conduction layer 332. Wherein, the heat dissipation layer 333 may be any one of graphene, graphite sheet, heat dissipation sheet, graphene copper foil and nano-carbon copper foil. When the heat dissipation layer 333 is graphene, the heat dissipation layer 333 may be formed on the side of the shielding cover 331 away from the heat conduction layer 332 by spraying. In this embodiment, since a heat dissipation layer 333 is further provided on the side of the shielding cover 331 away from the heat conduction layer 332, the heat generated by the heat source chip 321 during operation is transferred to the heat conduction layer 332 When the shielding cover 331 is further diffused through the heat dissipation layer 333, the heat dissipation effect is further improved.

In other embodiments, the heat dissipation module 33 includes a first heat dissipation layer 334 and a thermally conductive layer 332. The first heat dissipation layer 334 is disposed on a side of the heat source chip 321 away from the circuit board 32 (that is, the heat source chips are provided on both sides of the circuit board). The heat conductive layer 332 is disposed between the heat source chip 321 and the first heat dissipation layer 334. Different from the foregoing embodiment, when the heat source chip 321 does not require shielding, the shielding cover 331 can be replaced with the first heat dissipation layer 334, so that the heat dissipation effect can be further improved. In this embodiment, the first heat dissipation layer 334 is an aluminum extruded heat sink. Further, in order to achieve a better heat dissipation effect, the heat dissipation module 33 further includes the second heat dissipation layer 335 as in the previous embodiment. The second heat dissipation layer 335 is disposed on a side of the first heat dissipation layer 334 away from the heat conduction layer 332. In this embodiment, the second heat dissipation layer 335 is any one of graphite sheets, graphene copper foil, and nano-carbon copper foil.

The circuit board bracket 31 may be a plastic bracket. The circuit board 32 refers to a PCB (Printed Circuit Board), which is an indispensable component in the electronic device 100. Various electronic components can be provided on the circuit board 32 and coupled thereto, optional The circuit board 32 includes a single-sided circuit board and a double-sided circuit board. The double-sided circuit board can mount electronic components on both sides of the circuit board 32. Taking a mobile phone as an example, a chip, a camera, a SIM card holder, a communication module, a sensor, etc. can be provided on the circuit board 32. It should be noted that when the circuit board 32 is a double-sided board and the heat source chips 321 are provided on both sides, that is, the heat sources are provided on both sides of the circuit board 32 facing and facing away from the circuit board holder 31片 321. At this time, the circuit board assembly 30 further includes another heat dissipation module 33, and the other heat dissipation module 33 is disposed between the another heat source chip 321 and the circuit board support 31. Of course, the heat dissipation module 33 in one embodiment can also be selected according to the specific situation, or the heat dissipation module 33 in various embodiments can also be used in combination.

As shown in FIG. 2, the circuit board 32 is a double-sided circuit board, that is, a heat source chip 321 is installed on both sides of the circuit board 32. Therefore, in this embodiment, the electronic device 100 includes two heat sinks The modules 33 are respectively disposed on both sides of the circuit board 32 and close to the heat source chips 321 installed on both sides of the circuit board 32, so as to dissipate heat from the heat source chips 321 on both sides of the circuit board 32. Among them, the heat generated by the heat source chip 321 near the circuit board support 31 is transferred to the first heat dissipation layer 334 through the heat conduction layer 332, and then diffuses to the circuit board support 31 through the first heat dissipation layer 334 and the second heat dissipation layer 335 The first support frame 312 and the second support frame 313 diffuse to both ends of the body 10. The heat generated by the heat source chip 321 away from the circuit board holder 31 is transferred to the shielding case 331 through the thermally conductive layer 332 and then to the heat dissipation layer 333 through the shielding case 331 and finally diffused to both ends of the body 10. In some embodiments, the main circuit board assembly 30 further includes a battery 34, the battery 34 is disposed on a side of the main body 311 of the circuit board support 31 away from the circuit board 32, and is connected to the circuit board 32 is electrically connected, that is, the battery 34 can power the memory, the heat source chip 321, and other electronic components. Wherein, the battery 34 is detachably installed on the circuit board bracket 31. The heat generated by the battery 34 during operation is transferred to both ends of the body 10 through the circuit board bracket 31, and then radiated to the outside through both ends of the body 10. In this embodiment, in order to protect the battery 34 and strengthen the fixing of the battery 34, the circuit board assembly 30 further includes a battery cover 35 provided on the battery 34. In other embodiments, the circuit board 32 may also be powered by an external power source (for example, an adapter, etc.). When an external power source is used to directly supply power, the battery 35 may exist or may be omitted.

Please refer to FIG. 3 and FIG. 4 again. In some embodiments, the electronic device 100 further includes a functional module 40. The functional module 40 is detachably installed at the connection end 101 of the body 10. The function module 40 has corresponding functions. When the function module 40 is installed on the body 10, the electronic device 100 realizes the corresponding function through the function module 40.

In the electronic device 100 provided by the present application, since the functional module 40 is detachably installed at one end of the body 10, the functional module 40 can be conveniently removed for individual maintenance. In addition, different functional modules 40 can also be installed on the body 10 according to different needs. Among them, different functional modules 40 have different functions. When different functional modules 40 are installed on the body 10, the The electronic device 100 realizes different functions, so that the electronic device 100 can switch among multiple functions, reducing the user's use cost, and facilitating maintenance and management.

In some embodiments, when the functional module 40 is installed on the body 10, the functional module 40 is electrically connected to the circuit board assembly 30 to receive the power provided by the circuit board assembly 30.

Please refer to FIG. 5 again. In some embodiments, the circuit board 32 is further provided with a first connector 322. The first connector 322 is disposed on the main circuit board 32 and passes through the first A supporting frame 312 is exposed, and faces the functional module 40 contained in the body 10. Correspondingly, the functional module 40 is also provided with a second connector 41 for plugging into the first connector 322. When the functional module 40 is installed on the body 10, the functional module 40 Abutting with the first support frame 312 makes the second connector 41 and the first connector 322 plug in, so that the functional module 40 and the circuit board 32 are electrically connected. In this embodiment, both the first connecting member 322 and the second connecting member 41 are connectors, so that it can be easily installed and disassembled, and only need to be directly inserted and removed. Preferably, the connector is a pogo pin connector, and then the electrical connection is achieved by means of spring pin interference. It should be noted that the manner of the heat dissipation module 33 in this embodiment is different from the embodiment in FIG. 2.

Please refer to FIG. 1 and FIG. 6 again. The electronic device 100 further includes a base 50. The base 50 is disposed on the fixed end 102 of the body 10. In some embodiments, in order to improve the heat dissipation effect of the electronic device 100, the base 50 is provided with a plurality of through holes 51, so that the heat generated by the electronic device 100 during operation is transferred to the second The support frame 313 is distributed through the through holes 51.

In other embodiments, a groove 52 is provided on a side of the base 50 away from the second support frame 313, the groove 52 surrounds the through holes 51, and the groove 52 The anti-slip rubber strip 53 is also provided. The non-slip rubber strip 53 protrudes or is flat on the end surface of the base 50. As such, when the electronic device 100 is placed on a load (eg, a table), a gap is left between the base 50 and the load, so that the heat is quickly dissipated from the through holes 51 It will further improve the heat dissipation effect. In addition, the anti-slip rubber strip 53 also increases the friction between the base 50 and the load, so that the electronic device 100 will not easily slide on the load, avoiding the electronic device 100 falling or falling due to sliding The situation happened. In this embodiment, the groove 52 is ring-shaped, and a plurality of non-slip rubber strips 53 are arranged at intervals.

Please refer to 7 again. In some embodiments, the body 10 is further provided with a receiving cavity 103 near the connecting end 101. The connecting end 101 is also used to install the functional module 40 for detachable installation, the receiving cavity 103 of the body 10 is used to receive the functional module 40, and the connecting end 101 is used to receive the functional module 40 in After being accommodated in the receiving cavity 103, the functional module 40 is detachably fixed. That is, after the functional module 40 is accommodated in the accommodating cavity 103, it is detachably mounted on the body 10 by being detachably mounted on the connecting end 101 of the body 10. When the functional module 40 is installed in the body 10, the functional module 40 is accommodated in the body 10 and is substantially flush with the end surface of the connecting end 101.

In this embodiment, a plurality of stop portions 11 are provided on the inner surface of the connecting end portion 101 of the body 10 for mounting the functional module 40 at intervals. Correspondingly, the outer surface of the functional module 40 is provided with a plurality of engaging portions for one-to-one corresponding engagement with the plurality of stop portions 11 when the functional module 40 is accommodated in the accommodating cavity 103 of the body 10 42. When the functional module 40 is installed on the body 10 and is relatively fixed to the connecting end 101, each engaging portion 42 is engaged with the corresponding stop portion 11. In this way, when the functional module 40 is installed and accommodated in the body 10, it will not fall off or shake easily, which improves the stability of the electronic device 100.

In some embodiments, the body 10 has a hollow cylindrical shape, that is, the receiving cavity 103 is a cylindrical cavity. The functional module 40 is also cylindrical, and the outer diameter of the functional module 40 is smaller than the inner diameter of the receiving cavity 103 of the body 10 and can be received in the receiving cavity 103. When the functional module 40 is installed in the body 10 and rotates in the first direction, the engaging portion 42 engages with the corresponding stopper portion 11 to secure the functional module 40; When the functional module 40 rotates in the second direction, the engaging portion 42 can be separated from the stop portion 11. When the engaging portion 42 is engaged with the corresponding stop portion 11, the functional module 40 is relatively fixed to the body 10, that is, the functional module 40 cannot be removed from the body 10 When the engaging portion 42 is separated from the corresponding stopper portion 11, the functional module 40 can be removed from the body 10 and taken out. Wherein the first direction and the second direction are opposite. In this embodiment, the first direction is a clockwise direction, the second direction is a counterclockwise direction, and the clockwise and counterclockwise directions are directions viewed from the side where the functional module 40 is located.

In some embodiments, an edge of one end of the functional module 40 protrudes outward to form an engaging edge 43, and the cavity wall of the receiving cavity 103 of the body 10 near the opening of the connecting end 101 forms a resisting portion 12 , For resisting the engaging edge 43 of the functional module 40. When the functional module 40 is installed on the body 10, the engaging edge 43 abuts the resisting portion 12, thereby preventing the functional module 40 from continuing to move into the body 10. In this embodiment, the resisting portion 12 has an annular step shape, which is formed by a cavity wall recess at the opening of the receiving cavity 103 of the body 10 near the connection end 101, so that the functional module 40 is received in In the case of the body 10, the outer end surface of the functional module 40 is substantially flush with the end surface of the connecting end 101 of the body 10. The engaging edge 43 also has a ring-shaped step matching the resisting portion 12. In addition, the user can also apply an external force to the engaging edge 43 to rotate the functional module 40 or remove the functional module 40 from the body 10 to facilitate user operation. It can be understood that a plurality of threads may be provided on the outer surface of the engaging edge 43, and the end surface of the engaging edge 43 is slightly higher than the end surface of the connecting end 101, thereby facilitating user operations.

Please refer to FIGS. 8 and 9 again. Preferably, the stop portion 11 is an arc-shaped long block-shaped protrusion formed by the inner wall of the connecting end 10 protruding into the body 10, and the stop The extending direction of the blocking portion 11 is perpendicular to the axial direction of the body 10, that is, perpendicular to the movement direction when the functional module 40 is accommodated in the body 10. The engaging portion 42 is an "L" formed by extending a first distance from the engaging edge 43 perpendicularly and away from the engaging edge 43, and then extending a second distance toward the direction parallel to the engaging edge 43形结构。 Shaped structure. In some embodiments, the first distance is less than the second distance. The engaging portion 42 includes a vertical arm 421 parallel to the axial direction of the body 10 and a horizontal arm 422 perpendicular to the vertical arm 421. In this embodiment, the extending direction of the lateral arm 422 is the same as the extending direction of the stopper 11. When the functional module 40 is accommodated in the body 10, the cross arm 422 is located below the stop portion 11. When the functional module 40 rotates in the first direction, the stop portion 11 is accommodated in the engaging portion 42 The horizontal arm 422 and the vertical arm 421 are engaged with and fixed in the storage space formed by the engaging edge 43. When the vertical arm 421 of the engaging portion 42 is in contact with the stopper portion 11, the functional module 40 cannot continue to move in the first direction and is in a fully engaged state. That is, at this time, the stop portion 11 and the corresponding cross arm 422 are aligned along the axial direction of the body 10, and the stop portion 11 is located above the cross arm 422, so that the functional module The group 40 also cannot move away from the body 10, that is, the functional module 40 is relatively fixed to the body 10 and cannot be removed from the body 10. When the functional module 40 is rotated in the second direction, the vertical arm 421 gradually moves away from the stop portion 11, and when the cross arm 422 is completely separated from the stop portion 11, the cross arm 422 When completely deviated from the stopper portion 11, the engaging portion 42 is separated from the stopper portion 11, so that as long as a force is applied to the engaging edge 43 away from the body 10, the The functional module 40 can be detached from the connecting end 101, that is, at this time, the functional module 40 can be detached from the body 10 for easy operation.

Please refer to FIG. 5 again. In this embodiment, the functional module 40 is a lighting module. The lighting module includes a cavity 401 and a light emitting element 402 disposed in the cavity 401. The light emitting element 402 is electrically connected to the second connector 41. When the lighting module is installed on the body 10, the end of the cavity 401 away from the body 10 is a light exit surface. In this embodiment, the light exit surface is further provided with a touchpad, which is used to sense touch operations to control the lighting module to turn on or off or other functions. It can be understood that the light-emitting element 402 may be disposed on a sub-circuit board (not shown), and electrically connected to the second connector 41 through the sub-circuit board. In this way, when the lighting module is installed on the body 10, the electronic device 100 realizes the lighting function. In other embodiments, the functional module 40 may also be a remote control module, an audio module, or other modules with specific functions, which is not limited herein.

It should be noted that when any functional module 40 is installed on the body 10, the main circuit board 40 is connected to the sub-circuit board in the functional module 40 through the first connector 322 and the second connector 41 Electrical connection, that is, the circuit board 32 supplies power to the functional module 40. The circuit board 32 may also be provided with a wireless communication module (not shown), and the main circuit board 40 may communicate with external devices. For example, the display screen 20 may display the content stored in the memory on the main circuit board 40, and may also display the video screen received from the external device through the wireless communication module. In addition, the display screen 20 may further include a touch area, so that the display screen 20 may also receive a user's touch operation to perform corresponding operations on the displayed content. For example, the resolution of the displayed content can be adjusted by touch operation.

Please refer to FIG. 1 again. The electronic device 100 further includes a display screen 20. The display screen 20 is disposed on the outer surface of the body 10. The display screen 20 includes, but is not limited to, an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display, a liquid crystal display (Liquid Crystal Display, LCD), a quantum dot display (Quantum Dot Light Emitting Diodes, QLED) , Electronic paper (E-paper Display, EPD), touch screen (Touch panel), etc.

In some embodiments, the body has a hollow cylindrical shape, the display screen 20 is a flexible display screen, and the display screen 20 is flexibly disposed on the outer surface of the cylinder of the body 10. When the display screen 20 is in an expanded state, the display screen 20 is rectangular. The unfolded state means that the display screen 20 is in a horizontal unfolded state without any folding. In this embodiment, the display screen 20 surrounds the outer surface of the cylindrical side of the body 10.

In some embodiments, the connecting end 101 protrudes outwardly along the radial direction to form a convex edge 13 near the opening end, wherein the outer surface of the convex edge 13 is a circular arc surface. When the functional module 40 is installed on the connecting end 101, the engaging edge 43 is flush with the outer end surface of the convex edge 13. When the display screen 20 is curvedly disposed on the outer surface of the cylinder of the body 10, one side thereof abuts the convex edge 13 and the other side is flush with the fixed end 102 of the body 10.

When assembling, the display screen 20 can be positioned into a cylindrical shape with the same shape as the body 10 by a positioning jig, and then the display screen 20 can be attached to the outer surface of the body 10 by tape or liquid glue . In some embodiments, the display screen 20 is also electrically connected to the circuit board 32 through a flexible circuit board 36, that is, the display content of the display screen 20 and the attributes of the display content are controlled by the circuit board 32, wherein the display Content attributes include display brightness, display color, and display resolution. As shown in FIG. 1, the body 10 may be provided with a groove 14. In this way, one end of the flexible circuit board 36 may be connected to the circuit board 32, and the other end may pass through the groove 14 to pass through the display Screen 20 is connected.

In some other embodiments, in order to protect the display screen 20, for example, to prevent being hit by hard objects, the electronic device 100 further includes a protective cover 60. The shape of the protective cover 60 matches the shape of the body 10, that is, the protective cover is also cylindrical, and is sleeved on the display screen 20. Specifically, one end of the protective cover 60 in the axial direction abuts the convex edge 13 and the other end is flush with the fixed end 102 of the body 10. In addition, for aesthetic purposes, the outer surface of the protective cover is flush with the outer surface of the convex edge 13 in the radial direction.

In some other embodiments, in order not to affect the display content of the display screen 20, the protective cover 70 is transparent. For example, the protective cover 70 may use high transparency and strong hardness acrylic or PMMA (polymethyl Made of methyl acrylate).

Please refer to FIGS. 10 and 11 again. In some embodiments, in order to achieve the effect of sealing and waterproofing, abutment of the convex edge 13 and the protective cover 60 is further provided with a groove 131, the groove A sealing ring 70 is provided in the 131, so that the sealing ring 70 is located between the convex edge 13 and the side of the protective cover 60, thereby achieving the effect of waterproof and dustproof. Wherein, the sealing ring 70 can be made of rubber material, so that the display screen 20 can be better protected.

In addition, please refer to FIGS. 1, 4 and 7 again. The electronic device 100 is further provided with a power key 104, a volume adjustment key 105 and a charging interface 106. It can be understood that the power key 104, the volume adjustment key 105, and the charging interface 106 are all electrically connected to the circuit board 32, and the functions of power on / off, volume adjustment, and charging can be realized by operating the case.

In addition, as shown in FIG. 1, in some embodiments, the electronic device 100 further includes a base bracket 70. The base 70 is disposed between the body 10 and the second support frame 313, and is in contact with the base 50, so that the circuit board assembly 30 can be fixed to prevent the circuit board assembly 30 from The body 10 is shaken.

The embodiments of the present application are described in detail above, and specific examples are used to explain the principles and embodiments of the present application. The descriptions of the above embodiments are only used to help understand the method and the core idea of the present application; Those of ordinary skill in the art, based on the ideas of the present application, may have changes in specific embodiments and application scopes. In summary, the content of this specification should not be construed as limiting the present application.

Claims

An electronic device, characterized in that it includes:

Hollow body;

A circuit board assembly is provided in the body, and the circuit board assembly is thermally connected to the body; wherein, the circuit board assembly includes:

Circuit board bracket;

The circuit board is fixedly installed on one side of the circuit board bracket;

A heat source chip mounted on the circuit board and electrically connected to the circuit board; and

The heat dissipation module is disposed on the side of the heat source chip away from the circuit board and is thermally connected to the heat source chip.
The electronic device according to claim 1, wherein the circuit board holder includes a main body and first and second support frames respectively disposed at both ends of the main body; the circuit board is provided on the main body On one side and between the first support frame and the second support frame.
The electronic device of claim 1, wherein the heat source chip is disposed on a side of the circuit board facing the circuit board bracket; the heat dissipation module is disposed on the circuit board bracket and the heat source Between chips.
The electronic device according to claim 3, wherein the circuit board assembly further includes another heat dissipation module, and a side of the circuit board facing away from the circuit board bracket is further provided with another heat source chip. The another heat dissipation module is disposed between the other heat source chip and the body.
The electronic device according to claim 2, wherein the body includes a connection end and a fixed end opposite to the connection end; the first support frame is close to the connection end, and the second support The frame is close to the fixed end; the circuit board support is thermally connected to the body through the first support frame and the second support frame.
The electronic device of claim 1, wherein the heat dissipation module comprises:

A shield cover, which is provided on the circuit board and surrounds the heat source chip; and

The heat conduction layer is disposed between the heat source chip and the shielding cover.
The electronic device of claim 5, wherein the heat dissipation module further comprises a heat dissipation layer, and the heat dissipation layer is disposed on a side of the shielding cover away from the heat conduction layer.
The electronic device according to claim 7, wherein the heat dissipation layer is any one of graphene, graphite sheet, heat dissipation sheet, graphene copper foil, and nano-carbon copper foil.
The electronic device of claim 1, wherein the heat dissipation module comprises:

A first heat dissipation layer provided on the side of the heat source chip away from the circuit board; and

The heat conduction layer is disposed between the heat source chip and the first heat dissipation layer.
The electronic device according to claim 5 or 9, wherein the thermally conductive layer is thermally conductive silica gel or thermally conductive silicone grease.
The electronic device of claim 9, wherein the heat dissipation module further comprises a second heat dissipation layer, and the second heat dissipation layer is disposed on a side of the first heat dissipation layer away from the heat conduction layer.
The electronic device of claim 1, wherein the electronic device further comprises:

The functional module is detachably installed on the body; wherein, the functional module has corresponding functions. When the functional module is installed on the body, the electronic device is realized through the functional module The corresponding function.
The electronic device of claim 12, wherein when the functional module is mounted on the body, the functional module is electrically connected to the circuit board assembly to receive the circuit board assembly Electrical energy.
The electronic device according to claim 13, wherein the circuit board holder includes a main body and first and second support frames respectively disposed at both ends of the main body; the circuit board is disposed on the main body On one side and between the first support frame and the second support frame; a first connector is also provided on the circuit; wherein, the first connector is provided on the main circuit board and passes through Passing the first support frame and facing the functional module contained in the body;

The functional module is also provided with a second connector. When the functional module is installed on the body, the functional module contacts the first support frame to make the second connector It is plugged into the first connector and realizes electrical connection.
The electronic device of claim 14, wherein the first connector and the second connector are both connectors.
The electronic device according to claim 4, wherein the electronic device further comprises a base, the base is mounted on a fixed end of the body and is in contact with the second support frame; the base is provided with Several through holes.
The electronic device according to claim 16, wherein the base is further provided with a groove on a side away from the second support frame, the groove surrounds the plurality of through holes and is provided with a non-slip rubber strip , And the non-slip rubber strip protrudes or is flat on the end surface of the base.
The electronic device according to claim 1, wherein the electronic device further comprises a display screen, and the display screen is a flexible display screen, and the flexible display screen is flexibly disposed on an outer surface of the body.
The electronic device of claim 18, wherein the electronic device further comprises a protective cover; wherein the shape of the protective cover matches the shape of the body and is sleeved on the display screen.
A circuit board assembly used in an electronic device, characterized in that the circuit board assembly includes:

Circuit board bracket;

The circuit board is fixedly installed on one side of the circuit board bracket;

A heat source chip, soldered to the circuit board and electrically connected to the circuit board; and

The heat dissipation module is disposed on the side of the heat source chip away from the circuit board and is thermally connected to the heat source chip.