WO2020087728A1 - 背光模块及液晶显示器 - Google Patents

背光模块及液晶显示器 Download PDF

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Publication number
WO2020087728A1
WO2020087728A1 PCT/CN2018/123828 CN2018123828W WO2020087728A1 WO 2020087728 A1 WO2020087728 A1 WO 2020087728A1 CN 2018123828 W CN2018123828 W CN 2018123828W WO 2020087728 A1 WO2020087728 A1 WO 2020087728A1
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WO
WIPO (PCT)
Prior art keywords
backlight module
size
pads
layer
microns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/123828
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English (en)
French (fr)
Inventor
查国伟
马长文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
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Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to US16/321,047 priority Critical patent/US11353747B2/en
Publication of WO2020087728A1 publication Critical patent/WO2020087728A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133612—Electrical details
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13458—Terminal pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means

Definitions

  • the invention relates to the field of displays, in particular to a backlight module and a liquid crystal display.
  • the side-entry light entrance scheme has a limit in the reduction of the frame.
  • the connection area of the flexible circuit board needs to be reserved in the lower frame area, so the limit of the width of the lower frame is roughly 2 to About 3 mm.
  • the direct-incoming light solution does not need to reserve the connection area of the above-mentioned flexible circuit board, so the width of the upper, lower, left and right borders can be further reduced.
  • FIGS. 1A and 1B are a schematic cross-sectional view and a schematic top view of a conventional backlight module 10, respectively.
  • the light-emitting diode (not shown) and the pad 11 are non-reflectors, it is necessary to provide the reflective layer 12 at a position where the light-emitting diode and the pad 11 are not provided to improve the brightness.
  • the prior art defines a restricted area 13 around the pad 11 where the reflective layer 12 is not provided.
  • the above method will reduce the ratio of the reflective layer 12 and further reduce the brightness.
  • the present invention provides a backlight module and a liquid crystal display to solve the problem of insufficient brightness of the backlight module and the liquid crystal display due to the decrease in the ratio of the reflective layer.
  • An object of the present invention is to provide a backlight module which is provided with a plurality of openings corresponding to the positions of a plurality of pads in the reflective pattern layer, and the openings of the plurality of openings are smaller than the soldering of the plurality of pads.
  • Another object of the present invention is to provide a liquid crystal display, which may include the backlight module of the embodiment of the present invention, thereby improving the display brightness of the liquid crystal display.
  • an embodiment of the invention provides a backlight module, wherein the backlight module includes: a substrate, a plurality of pads, a reflective pattern layer, and a plurality of light-emitting diode chips.
  • the plurality of pads are scattered on the substrate and each has a pad size.
  • the reflection pattern layer covers the plurality of pads and the substrate, wherein the reflection pattern layer has a plurality of openings, the positions of the plurality of openings correspond to the positions of the plurality of pads, and the plurality of The openings each have an opening size, wherein the opening size is smaller than the corresponding pad size.
  • the plurality of light-emitting diode chips are provided on the plurality of pads and electrically connected to the plurality of pads through the corresponding plurality of openings, wherein the plurality of light-emitting diode chips each have a chip size, so The chip size is less than or equal to the corresponding opening size, wherein the backlight module is a direct-lit backlight module.
  • the chip size is between 100 and 500 microns.
  • the backlight module further includes at least one optical layer, and the at least one optical layer covers the reflective pattern layer and the plurality of light-emitting diode chips.
  • the at least one optical layer includes at least one of a fluorescent layer, a diffusion layer, and a brightness enhancement layer.
  • the pad size is between 600 and 1000 microns.
  • the opening size is between 100 and 500 microns.
  • an embodiment of the invention provides a backlight module, wherein the backlight module includes: a substrate, a plurality of pads, and a reflective pattern layer.
  • the plurality of pads are scattered on the substrate and each has a pad size.
  • the reflection pattern layer covers the plurality of pads and the substrate, wherein the reflection pattern layer has a plurality of openings, the positions of the plurality of openings correspond to the positions of the plurality of pads, and the plurality of The openings each have an opening size, wherein the opening size is smaller than the corresponding pad size.
  • the backlight module further includes a plurality of light-emitting diode chips, which are provided on the plurality of pads and electrically connected to the plurality of pads, wherein the plurality of light-emitting diode chips each It has a chip size that is smaller than or equal to the corresponding opening size.
  • the chip size is between 100 and 500 microns.
  • the backlight module further includes at least one optical layer, and the at least one optical layer covers the reflective pattern layer and the plurality of light-emitting diode chips.
  • the at least one optical layer includes at least one of a fluorescent layer, a diffusion layer, and a brightness enhancement layer.
  • the backlight module is a direct-lit backlight module.
  • the pad size is between 600 and 1000 microns.
  • the opening size is between 100 and 500 microns.
  • another embodiment of the present invention provides a liquid crystal display, wherein the liquid crystal display includes the above-mentioned backlight module.
  • the backlight module and the liquid crystal display of the embodiments of the present invention have a plurality of openings corresponding to the positions of a plurality of pads in the reflective pattern layer of the backlight module, and the opening sizes of the plurality of openings
  • the pad size smaller than the plurality of pads further increases the ratio of the reflective pattern layer to the substrate, so the brightness of the backlight module and the liquid crystal display can be improved.
  • FIG. 1A is a schematic cross-sectional view of a conventional backlight module.
  • FIG. 1B is a schematic top view of a conventional backlight module.
  • FIG. 2A is a schematic cross-sectional view of a backlight module according to an embodiment of the invention.
  • FIG. 2B is a schematic top view of a backlight module according to an embodiment of the invention.
  • 2C is a schematic cross-sectional view of a backlight module according to another embodiment of the invention.
  • FIG. 3 is a schematic cross-sectional view of a liquid crystal display according to an embodiment of the invention.
  • FIG. 2A is a schematic cross-sectional view of a backlight module 20 according to an embodiment of the present invention
  • FIG. 2B is a schematic top view of a backlight module 20 according to an embodiment of the present invention, where FIG. 2B is not shown
  • the backlight module 20 according to an embodiment of the invention is, for example, a straight type backlight module.
  • the backlight module 20 mainly includes a substrate 21, a plurality of pads 22 and a reflective pattern layer 23.
  • the substrate 21 may carry components of the backlight module 20, such as the plurality of pads 22 and the reflective pattern layer 23, or other components.
  • the substrate 21 is, for example, a soft substrate or a hard substrate.
  • the flexible substrate is, for example, a flexible circuit board.
  • the hard substrate is, for example, a hard circuit board.
  • the flexible circuit board or the rigid circuit board may include a protective layer, a first copper wire pattern layer, an insulating spacer layer, and a second copper wire pattern in order from bottom to top Floor.
  • a plurality of pads 22 of the backlight module 20 according to an embodiment of the present invention are scattered on the substrate 21 and each has a pad size 22A.
  • the bottoms of the plurality of pads 22 can be electrically connected to the substrate 21 (such as the flexible circuit board or the rigid circuit board).
  • the pad size 22A is larger than the pad size used in the prior art. Specifically, please refer to FIGS. 1A to 2B together. In the prior art, since the prohibited area 13 needs to be defined around the pad 11 and the pad 13 itself is not a reflector, the pad 13 tends to face a small size Make.
  • the backlight module 20 of the embodiment of the present invention expands the pad size 22A (for example, if the pad 11 size of the prior art is between 100 and 500 microns, the pad size 22A of the embodiment of the present invention It is between 600 and 1000 microns), and the reflection pattern layer 23 is arranged to enhance the reflection effect, thereby improving the brightness.
  • the pad size 22A is, for example, 650 microns, 700 microns, 750 microns, 800 microns, 850 microns, 900 microns, or 950 microns.
  • the reflective pattern layer 23 of the backlight module 20 covers the plurality of pads 22 and the substrate 21, wherein the reflective pattern layer 23 has a plurality of openings 231, and the positions of the plurality of openings 231 correspond to The positions of the plurality of pads 22, and each of the plurality of openings 231 has an opening size 231A, wherein the opening size 231A is smaller than the corresponding pad size 22A.
  • the reflective pattern layer 23 is a white reflective layer, and its main function is to provide electrical blocking and improve light reflectivity.
  • the reflective pattern layer 23 may be a white pigment resin mixed layer commonly used in the field of backlight modules, or may be a composite optical reflective layer having multiple inorganic film layers.
  • a material of the reflective pattern layer 23 is, for example, a mixture of liquid hydrocarbons formed by refining petroleum.
  • the opening size 231A corresponds to the pad size of the prior art, for example.
  • the opening size 231A of the embodiment of the present invention is also between 100 and 500 microns (eg, 150 microns, 200 microns, 250 microns, 300 microns , 350 microns, 400 microns or 450 microns).
  • at least a part of each of the plurality of pads 22 (for example, the edge of the plurality of pads 22) of the embodiment of the present invention is covered by the reflective pattern layer 23, and the plurality of solders The remaining part of the disc 22 is exposed through the plurality of openings 231.
  • the backlight module 20 may include a plurality of light-emitting diode chips 24 that are disposed on the plurality of pads 22 and are electrically connected, for example, through the plurality of openings 231
  • the plurality of light emitting diode chips 24 can emit light 241, and the light 241 can be reflected by the reflective pattern layer 23 to increase the brightness of the backlight module 20.
  • the chip size 24A is between 100 and 500 microns (eg, 150 microns, 200 microns, 250 microns, 300 microns, 350 microns, 400 microns, or 450 microns).
  • the opening size 231A is associated with the chip size 24A, that is, the opening size 231A is designed according to the chip size 24A. For example, when the chip size 24A is 300 microns, the opening size 231A may be more than 300 microns. In a preferred example, the chip size 24A is equal to the opening size 231A to avoid a decrease in the ratio of the reflective layer 12.
  • the pad size 22A is determined. For example, when the opening size 231A is 300 microns, the pad size 22A may be 700 microns. It can be seen from the above that the pad size 22A and the corresponding opening size 231A and the corresponding chip size 24A can be adjusted appropriately according to requirements.
  • the backlight module 20 of the embodiment of the present invention expands the pad size, and the exposed area of the plurality of pads 22 is defined by the reflective pattern layer 23, so that no prohibited area 13 can be provided On the premise of ensuring that the plurality of pads 22 are not covered by the reflective pattern layer 23. Furthermore, since there is no need to provide the forbidden area 13, the brightness of the backlight module 20 of the embodiment of the present invention can be improved.
  • FIG. 2C is a schematic cross-sectional view of a backlight module 20 according to another embodiment of the present invention.
  • the backlight module 20 further includes at least one optical layer 25 that covers the reflective pattern layer 23 and the plurality of light-emitting diode chips 24.
  • the at least one optical layer includes at least one of a fluorescent layer 251 (eg, may include transparent silica gel and fluorescent particles), a diffusion layer 252, and a brightness enhancement layer 253.
  • the materials and manufacturing methods used for the fluorescent layer 251, the diffusion layer 252 and the brightness enhancement layer 253 can be referred to, for example, the phosphor layer, diffusion layer and brightness enhancement used in a general backlight module The material and production method of the layer are not repeated here.
  • FIG. 3 is a schematic cross-sectional view of a liquid crystal display 30 according to an embodiment of the invention.
  • the liquid crystal display 30 includes the backlight module 20 of any of the foregoing embodiments.
  • the liquid crystal display 30 may further include other components of a general liquid crystal display, such as a display module 31, wherein the light generated by the backlight module 20 may pass through the display module 31, and then display the The image or video of the liquid crystal display 20.
  • the liquid crystal display 30 of the embodiment of the present invention uses the above-mentioned backlight module 20.
  • the backlight module 20 expands the pad size, and the reflective pattern layer 23 defines the exposed areas of the plurality of pads 22, thereby ensuring that the plurality of The pad 22 is not covered by the reflective pattern layer 23.
  • the brightness of the backlight module 20 can be increased. Therefore, the brightness of the liquid crystal display 30 of the embodiment of the present invention including the backlight module 20 can be improved.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Planar Illumination Modules (AREA)
  • Liquid Crystal (AREA)

Abstract

一种背光模块及液晶显示器。所述背光模块包含：一基板、多个焊盘及一反射图案层。所述多个焊盘散布在所述基板上且各具有一焊盘尺寸。所述反射图案层覆盖所述多个焊盘及所述基板，其中所述反射图案层具有多个开口，所述多个开口的位置对应所述多个焊盘的位置，且所述多个开口各具有一开口尺寸，其中所述开口尺寸小于对应的所述焊盘尺寸。所述背光模块通过在反射图案层设有对应多个焊盘的位置的多个开口，并且所述多个开口的开口尺寸小于所述多个焊盘的焊盘尺寸，进而提升反射图案层占所述基板的比例，故可提升亮度。

Description

背光模块及液晶显示器 技术领域
本发明是有关于显示器领域，特别是有关于一种背光模块及液晶显示器。
 背景技术
为了达成全面屏的需求，侧入式入光方案在边框的缩减存在极限，一般而言，在下边框区需要预留软性电路板的连接区，因此下边框的宽度的极限大致上是2至3毫米左右。相反的，直下式入光方案不需预留上述软性电路板的连接区，所以可进一步缩减上、下、左及右边框的宽度。
请参照图1A及1B，分别为现有的背光模块10的剖面示意图与上视示意图。目前的直下式入光方案，由于发光二极管(未绘示)及焊盘11为非反射体，所以需在未设置发光二极管与焊盘11的位置设置反射层12，以提高亮度。然而，为了避免在设置反射层12时的工艺误差而遮挡所述焊盘11，现有技术是在焊盘11的周围定义不设置反射层12的一禁制区13。然而，上述的方式会使得反射层12的比例下降，进而降低了亮度。
故，有必要提供一种背光模块及液晶显示器，以解决现有技术所存在的问题。
 技术问题
有鉴于此，本发明提供一种背光模块及液晶显示器，以解决由于反射层的比例下降，而导致背光模块及液晶显示器的亮度不足的问题。
 技术解决方案
本发明的一目的在于提供一种背光模块，其通过在反射图案层设有对应多个焊盘的位置的多个开口，并且所述多个开口的开口尺寸小于所述多个焊盘的焊盘尺寸，进而提升反射图案层占所述基板的比例，故可提升亮度。
本发明的另一目的在于提供一种液晶显示器，其可以包含有本发明实施例的背光模块，进而提升液晶显示器的显示亮度。
为达成本发明的前述目的，本发明一实施例提供一种背光模块，其中所述背光模块包含：一基板、多个焊盘、一反射图案层及多个发光二极管芯片。所述多个焊盘散布在所述基板上且各具有一焊盘尺寸。所述反射图案层覆盖所述多个焊盘及所述基板，其中所述反射图案层具有多个开口，所述多个开口的位置对应所述多个焊盘的位置，且所述多个开口各具有一开口尺寸，其中所述开口尺寸小于对应的所述焊盘尺寸。所述多个发光二极管芯片设在所述多个焊盘上且通过对应的所述多个开口电性连接所述多个焊盘，其中所述多个发光二极管芯片各具有一芯片尺寸，所述芯片尺寸小于或等于对应的所述开口尺寸，其中所述背光模块是一直下式背光模块。
在本发明的一实施例中，所述芯片尺寸介于100至500微米之间。
在本发明的一实施例中，所述背光模块更包含至少一光学层，所述至少一光学层覆盖所述反射图案层与所述多个发光二极管芯片。
在本发明的一实施例中，所述至少一光学层包含一荧光层、一扩散层与一增亮层中的至少一个。
在本发明的一实施例中，所述焊盘尺寸是介于600至1000微米之间。
在本发明的一实施例中，所述开口尺寸是介于100至500微米之间。
为达成本发明的前述目的，本发明一实施例提供一种背光模块，其中所述背光模块包含：一基板、多个焊盘及一反射图案层。所述多个焊盘散布在所述基板上且各具有一焊盘尺寸。所述反射图案层覆盖所述多个焊盘及所述基板，其中所述反射图案层具有多个开口，所述多个开口的位置对应所述多个焊盘的位置，且所述多个开口各具有一开口尺寸，其中所述开口尺寸小于对应的所述焊盘尺寸。
在本发明的一实施例中，所述背光模块更包含多个发光二极管芯片，设在所述多个焊盘上且电性连接所述多个焊盘，其中所述多个发光二极管芯片各具有一芯片尺寸，所述芯片尺寸小于或等于对应的所述开口尺寸。
在本发明的一实施例中，所述芯片尺寸介于100至500微米之间。
在本发明的一实施例中，所述背光模块更包含至少一光学层，所述至少一光学层覆盖所述反射图案层与所述多个发光二极管芯片。
在本发明的一实施例中，所述至少一光学层包含一荧光层、一扩散层与一增亮层中的至少一个。
在本发明的一实施例中，所述背光模块是一直下式背光模块。
在本发明的一实施例中，所述焊盘尺寸是介于600至1000微米之间。
在本发明的一实施例中，所述开口尺寸是介于100至500微米之间。
再者，本发明另一实施例提供一种液晶显示器，其中所述液晶显示器包含上述的背光模块。
 有益效果
与现有技术相比较，本发明实施例的背光模块及液晶显示器，其通过在背光模块的反射图案层设有对应多个焊盘的位置的多个开口，并且所述多个开口的开口尺寸小于所述多个焊盘的焊盘尺寸，进而提升反射图案层占所述基板的比例，故可提升背光模块及液晶显示器的亮度。
为让本发明的上述内容能更明显易懂，下文特举优选实施例，并配合所附图式，作详细说明如下：
 附图说明
图1A是现有的背光模块的剖面示意图。
图1B是现有的背光模块的上视示意图。
图2A是本发明实施例的背光模块的剖面示意图。
图2B是本发明实施例的背光模块的上视示意图。
图2C是本发明另一实施例的背光模块的剖面示意图。
图3是本发明实施例的液晶显示器的剖面示意图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。再者，本发明所提到的方向用语，例如上、下、顶、底、前、后、左、右、内、外、侧面、周围、中央、水平、横向、垂直、纵向、轴向、径向、最上层或最下层等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
请参照一并参照图2A及2B所示，图2A是本发明实施例的背光模块20的剖面示意图；及图2B是本发明实施例的背光模块20的上视示意图，其中图2B未绘示有发光二极管芯片24。本发明一实施例的背光模块20例如是一直下型背光模块。所述背光模块20主要包含一基板21、多个焊盘22及一反射图案层23。所述基板21可承载所述背光模块20的构件，例如所述多个焊盘22及所述反射图案层23，或者其他构件。在一实施例中，所述基板21例如是一软质基板或一硬质基板。在一范例中，所述软质基板例如是一软质电路板。在另一范例中，所述硬质基板例如是一硬质电路板。在另一实施例中，所述软质电路板或所述硬质电路板由下至上依序可包含有一保护层、一第一铜线图案层、一绝缘间隔层及一第二铜线图案层。
本发明一实施例的背光模块20的多个焊盘22散布在所述基板21上且各具有一焊盘尺寸22A。在一实施例中，所述多个焊盘22的底部可电性连接所述基板21(例如所述软质电路板或所述硬质电路板)。在另一实施例中，所述焊盘尺寸22A大于现有技术中所使用的焊盘尺寸。具体而言，请一并参照图1A至2B，现有技术由于需要在焊盘11的周围定义有禁制区13，且焊盘13本身非反射体，所以焊盘13往往是朝向小尺寸的方向制作。相反的，本发明实施例的背光模块20则是扩大焊盘尺寸22A(例如若是现有技术的焊盘11尺寸介于100至500微米之间，则本发明实施例的所述焊盘尺寸22A是介于600至1000微米之间)，并且通过反射图案层23的设置方式来增强反射效果，进而提高亮度。详细说明请参照后面段落的描述。在一实施例中，所述焊盘尺寸22A例如是650微米、700微米、750微米、800微米、850微米、900微米或950微米。
本发明一实施例的背光模块20的反射图案层23覆盖所述多个焊盘22及所述基板21，其中所述反射图案层23具有多个开口231，所述多个开口231的位置对应所述多个焊盘22的位置，且所述多个开口231各具有一开口尺寸231A，其中所述开口尺寸231A小于对应的所述焊盘尺寸22A。在一实施例中，所述反射图案层23为一白色反射层，其主要功能可提供电性阻隔和提高光线反射率。所述反射图案层23可以为背光模块领域中常用的白色颜料树脂混合层，也可以为具有多个无机膜层的一复合光学反射层。在一范例中，所述反射图案层23的一材质例如是石油通过精炼后所形成液态烃的混合物。
这边要提到的是，所述开口尺寸231A例如是对应于现有技术的焊盘尺寸。例如，现有技术的焊盘尺寸11A介于100至500微米之间，则本发明实施例的开口尺寸231A也是介于100至500微米之间(例如150微米、200微米、250微米、300微米、350微米、400微米或450微米)。这边要提到的是，本发明实施例的多个焊盘22各至少有一部分(例如所述多个焊盘22的边缘)被所述反射图案层23所覆盖，并且所述多个焊盘22的剩余部分是通过所述多个开口231所露出。在一实施例中，所述背光模块20可包含多个发光二极管芯片24，所述多个发光二极管芯片24设在所述多个焊盘22上且例如通过所述多个开口231来电性连接所述多个焊盘22，其中所述多个发光二极管芯片24各具有一芯片尺寸24A，所述芯片尺寸小于或等于对应的所述开口尺寸。所述多个发光二极管芯片24可发出光线241，并且所述光线241可通过所述反射图案层23的反射以增加所述背光模块20的亮度。在一范例中，所述芯片尺寸24A介于100至500微米之间(例如150微米、200微米、250微米、300微米、350微米、400微米或450微米)。
再次说明的是对于所述焊盘尺寸22A与对应的所述开口尺寸231A与对应的所述芯片尺寸24A之间的关系。首先，所述开口尺寸231A关联于所述芯片尺寸24A，亦即所述开口尺寸231A是根据所述芯片尺寸24A来设计。例如，所述芯片尺寸24A为300微米时，则所述开口尺寸231A可以是300微米以上。在较佳的范例中，所述芯片尺寸24A与所述开口尺寸231A相等，以避免所述反射层12的比例下降。在决定所述开口尺寸231A后，再决定所述焊盘尺寸22A，例如所述开口尺寸231A为300微米时，所述焊盘尺寸22A可为700微米。由上可知，所述焊盘尺寸22A与对应的所述开口尺寸231A与对应的所述芯片尺寸24A是可以根据需求进行适当调整。
由上可知，本发明实施例的背光模块20是通过扩大焊盘尺寸的方式，并且通过所述反射图案层23来定义所述多个焊盘22的露出区域，进而可在不设置禁制区13的前提下，保证所述多个焊盘22不被所述反射图案层23所覆盖。再者，由于不需设置禁制区13，所以可提升本发明实施例的背光模块20的亮度。
请参照图2C，其是本发明另一实施例的背光模块20的剖面示意图。在一实施例中，所述背光模块20更包含至少一光学层25，所述至少一光学层25覆盖所述反射图案层23与所述多个发光二极管芯片24。在一范例中，所述至少一光学层包含一荧光层251(例如可包含透明硅胶及萤光颗粒)、一扩散层252与一增亮层253中的至少一个。要提到的是，所述荧光层251、所述扩散层252与所述增亮层253所使用的材质与制作方式例如可参考一般的背光模块中所使用的荧光层、扩散层与增亮层的材质与制作方式，故不再赘述。
请参照图3，其是本发明一实施例的液晶显示器30的剖面示意图。本发明另一实施例提出一种液晶显示器30，所述液晶显示器30包含有上述任一实施例的背光模块20。在一实施例中，所述液晶显示器30还可包含一般液晶显示器的其他构件，例如一显示模块31，其中所述背光模块20所产生的光线可穿过所述显示模块31，进而显示所述液晶显示器20的图像或影像。
由上可知，本发明实施例的液晶显示器30的采用上述的背光模块20。背光模块20是通过扩大焊盘尺寸的方式，并且通过所述反射图案层23来定义所述多个焊盘22的露出区域，进而可在不设置禁制区13的前提下，保证所述多个焊盘22不被所述反射图案层23所覆盖。再者，由于不需设置禁制区13，所以可提升背光模块20的亮度。因此，可提升包含有背光模块20的本发明实施例的液晶显示器30的亮度。
本发明已由上述相关实施例加以描述，然而上述实施例仅为实施本发明的范例。必需指出的是，已公开的实施例并未限制本发明的范围。相反地，包含于权利要求书的精神及范围的修改及均等设置均包括于本发明的范围内。

Claims (15)

  1. 一种背光模块，其包含：
    一基板；
    多个焊盘，散布在所述基板上且各具有一焊盘尺寸；
    一反射图案层，覆盖所述多个焊盘及所述基板，其中所述反射图案层具有多个开口，所述多个开口的位置对应所述多个焊盘的位置，且所述多个开口各具有一开口尺寸，其中所述开口尺寸小于对应的所述焊盘尺寸；及
    多个发光二极管芯片，设在所述多个焊盘上且通过对应的所述多个开口电性连接所述多个焊盘，其中所述多个发光二极管芯片各具有一芯片尺寸，所述芯片尺寸小于或等于对应的所述开口尺寸，
    其中所述背光模块是一直下式背光模块。
  2. 如权利要求1所述的背光模块，其中所述芯片尺寸介于100至500微米之间。
  3. 如权利要求1所述的背光模块，其中所述背光模块更包含至少一光学层，所述至少一光学层覆盖所述反射图案层与所述多个发光二极管芯片。
  4. 如权利要求3所述的背光模块，其中所述至少一光学层包含一荧光层、一扩散层与一增亮层中的至少一个。
  5. 如权利要求1所述的背光模块，其中所述焊盘尺寸是介于600至1000微米之间。
  6. 如权利要求1所述的背光模块，其中所述开口尺寸是介于100至500微米之间。
  7. 一种背光模块，其包含：
    一基板；
    多个焊盘，散布在所述基板上且各具有一焊盘尺寸；及
    一反射图案层，覆盖所述多个焊盘及所述基板，其中所述反射图案层具有多个开口，所述多个开口的位置对应所述多个焊盘的位置，且所述多个开口各具有一开口尺寸，其中所述开口尺寸小于对应的所述焊盘尺寸。
  8. 如权利要求7所述的背光模块，其中所述背光模块更包含多个发光二极管芯片，设在所述多个焊盘上且通过对应的所述多个开口电性连接所述多个焊盘，其中所述多个发光二极管芯片各具有一芯片尺寸，所述芯片尺寸小于或等于对应的所述开口尺寸。
  9. 如权利要求8所述的背光模块，其中所述芯片尺寸介于100至500微米之间。
  10. 如权利要求8所述的背光模块，其中所述背光模块更包含至少一光学层，所述至少一光学层覆盖所述反射图案层与所述多个发光二极管芯片。
  11. 如权利要求10所述的背光模块，其中所述至少一光学层包含一荧光层、一扩散层与一增亮层中的至少一个。
  12. 如权利要求7所述的背光模块，其中所述背光模块是一直下式背光模块。
  13. 如权利要求7所述的背光模块，其中所述焊盘尺寸是介于600至1000微米之间。
  14. 如权利要求7所述的背光模块，其中所述开口尺寸是介于100至500微米之间。
  15. 一种液晶显示器，其包含如权利要求7所述的背光模块。
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