WO2020082223A1 - Black phosphorus-like ultra-thin bismuth nano-sheet modified compound film and preparation method therefor - Google Patents

Black phosphorus-like ultra-thin bismuth nano-sheet modified compound film and preparation method therefor Download PDF

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WO2020082223A1
WO2020082223A1 PCT/CN2018/111346 CN2018111346W WO2020082223A1 WO 2020082223 A1 WO2020082223 A1 WO 2020082223A1 CN 2018111346 W CN2018111346 W CN 2018111346W WO 2020082223 A1 WO2020082223 A1 WO 2020082223A1
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bismuth
black phosphorus
film
base film
phosphorus phase
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PCT/CN2018/111346
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French (fr)
Chinese (zh)
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王干
陈俊树
何洪涛
叶飞
梅佳伟
周良
王琳晶
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南方科技大学
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Priority to PCT/CN2018/111346 priority Critical patent/WO2020082223A1/en
Priority to CN201880096143.3A priority patent/CN112689609A/en
Publication of WO2020082223A1 publication Critical patent/WO2020082223A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N52/00Hall-effect devices
    • H10N52/01Manufacture or treatment

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  • the present disclosure relates to the technical field of material preparation, for example, to a composite film modified by a black phosphorus phase ultra-thin bismuth nanosheet and a preparation method thereof.
  • Molecular beam epitaxy is a thin-film growth technology that epitaxially grows high-quality single crystal thin films or superlattice structures on single crystal substrates. The technology was born in Bell Laboratories in the 1960s. (Cho, AY; Arthur, JR; Jr (1975). "Molecular beam epitaxy". Prog. Solid State Chem. 10: 157-192.) Because this molecular beam epitaxy growth technology can be realized in an ultra-high vacuum environment Atomic-level wafer-level semiconductor thin film growth, therefore, is widely used in high-quality semiconductor optoelectronic chips, high mobility field effect transistors, cascade lasers and other semiconductor technology industries, resulting in significant economic value.
  • the molecular beam epitaxy technology is used to achieve cutting-edge scientific research such as the giant magnetoresistive effect, the fractional quantum Hall effect, and the inverse constant quantum Hall effect, which directly gave birth to several Nobel Prize-level research achievements.
  • Bismuth (Bi) is a non-toxic and stable heavy element (atomic number 83). In actual life, bismuth is mainly used in the pharmaceutical and other industrial fields. Under normal pressure, elemental bismuth has a layered structure with hexagonal symmetry and the electrical properties of metals. In 2004, Japanese research scholar Nagao et al published a paper in the Physical Review Letters and found that bismuth atoms under the thickness of four atomic layers, due to the reconstruction of atomic bonds, will form a kind of black phosphorus phase The physical structure of the diatomic layered structure has also been significantly changed. (T. Nagao, JTSadowski, M. Saito, S. Yaginuma, Y. Fujikawa, T. Kogure, T.
  • Black phosphorus phase bismuth is a two-dimensional layered bismuth material that will only appear in the initial stage of film growth, further electronic structure research It is shown that this black phosphorus phase bismuth layer material is a new type of semiconductor material and has remarkable spintronic properties. (Shin YAGINUMA et al. "Electronic Structure of Ultrathin Bismuth Films with A7 and Black-Phosphorus-like Structures".
  • the present disclosure provides a black phosphorus phase ultra-thin bismuth nanosheet modified composite film and a preparation method thereof.
  • a black phosphorus phase bismuth nanosheet modified composite film is provided.
  • the composite film includes a base film and a black phosphorus phase bismuth nanosheet interposed in the base film.
  • the composite film of the present disclosure is a crystalline film, in which the base film and the black phosphorus phase bismuth nanoplate are both of a crystal structure.
  • the composite film of the present disclosure is clearly different from the prior art. Although there are a small amount of black phosphorus phase bismuth nanomaterials in the prior art, they are all formed on the surface in a small amount, and there is no intercalation type structure.
  • the composite film of the present disclosure is black The large-scale preparation of phosphorus phase bismuth nanosheets and the application of interlayer doping modification to realize the application of matrix films (such as semiconductors, insulating materials or metal conductors, etc.) are of great significance.
  • the formation of the composite film of the present disclosure involves not only the preparation of black phosphorus phase bismuth nanosheets, but also the doping modification of the base film.
  • the base film includes any one of a conductor, a semiconductor, or an insulator.
  • the conductor may be, for example, a metal / semi-metal, specifically a metal elemental or alloy thin film such as Fe, Co, Cr, or FeCr, a CrTe compound such as CrTe, Cr 2 Te 3 , Cr 3 Te 4, or Cr 5 Te 8 ;
  • a semiconductor may, for example, is ZnSe, ZnTe, ZnS and other group II-VI semiconductors, GaN and other group III-V semiconductors, or MoTe 2, MoSe 2, MoS 2 and the like of the two-dimensional transition metal chalcogenide (TMDCs).
  • TMDCs two-dimensional transition metal chalcogenide
  • the base film is any one of metal element, alloy thin film, CrTe compound, group II-VI semiconductor, group III-V semiconductor, or two-dimensional transition metal chalcogenide compound.
  • the base film is chromium telluride.
  • the percentage surface area of the black phosphorus phase bismuth nanosheets is 5% -15%, such as 5%, 7%, 8%, 10%, 11 %, 12%, 13%, 14% or 15%, etc.
  • the thickness of the black phosphorus phase bismuth nanoplate is a double layer of black phosphorus phase bismuth.
  • the thickness of the black phosphorus phase bismuth nanoplates is 0.5 nm to 0.7 nm, such as 0.5 nm, 0.52 nm, 0.53 nm, 0.55 nm, 0.58 nm, 0.6 nm, 0.63 nm, 0.66 nm, 0.68 nm Or 0.7nm, etc.
  • the composite film is located on a substrate, and the disclosure does not limit the type of the substrate, for example, it may be a wafer substrate.
  • the composite film is prepared as follows: during the epitaxial growth of the base film, a thermal evaporation source of bismuth is introduced to produce a beam of bismuth atoms, and Bi atoms are deposited to form a black phosphorus phase bismuth nanosheet, and The black phosphorus phase bismuth nanoplates are buried in the base film as the base film grows, thereby forming a composite film.
  • a method for preparing the composite film modified with black phosphorus phase bismuth nanosheets includes the following steps:
  • a thermal evaporation source of bismuth element is passed to produce a beam of bismuth atoms.
  • Bi atoms are deposited to form a black phosphorus phase bismuth nanoplate, and the black phosphorus phase bismuth nanoplate As the base film grows, it is buried in the base film to form a composite film on the substrate;
  • the substrate temperature is controlled at 200 ° C to 400 ° C, for example, 200 ° C, 220 ° C, 240 ° C, 260 ° C, 280 ° C, 300 ° C, 325 ° C, 350 ° C, 370 ° C, 380 °C or 400 °C, if the temperature is lower than 200 °C, it will cause the composite film to be amorphous; if the temperature is higher than 400 °C, Bi atoms will not be deposited due to evaporation to form black phosphorus phase bismuth nanoplates.
  • the method of the present disclosure can realize a large amount of synthesis and intercalation application of black phosphorus phase bismuth nanosheets by opening the bismuth source during the growth of the thin film.
  • the dual goal of regulating physical properties is to solve the technical problem that black phosphorus phase bismuth nanosheets are difficult to prepare in large quantities and the technical problem of application.
  • the method of epitaxially growing the base film is: a method of molecular beam epitaxial growth.
  • the type of the substrate is not limited, for example, it may be a wafer substrate.
  • the base film includes any one of a conductor, a semiconductor, or an insulator, preferably a metal / half metal, a group II-VI semiconductor, a group III-V semiconductor, or a two-dimensional transition metal Any one of the chalcogenide compounds.
  • the base film is any one of a metal element, an alloy thin film, a CrTe compound, a group II-VI semiconductor, a group III-V semiconductor, or a two-dimensional transition metal chalcogenide compound.
  • the base film is a chromium telluride film.
  • the temperature of the thermal evaporation source that evaporates to produce bismuth element is controlled at 450 ° C to 650 ° C, such as 450 ° C, 475 ° C, 500 ° C, 520 ° C, 550 ° C, 570 ° C, 580 ° C, 600 ° C, 625 °C or 650 °C etc.
  • the temperature of the thermal evaporation source that produces bismuth by evaporation is controlled at 450 ° C to 550 ° C, and within this range of 450 ° C to 650 ° C, a stable vapor pressure can be formed to produce a stable Bi beam flow, thereby The structure of the interlayer substrate film of the black phosphorus phase bismuth nanosheets is well formed.
  • the bismuth atomic beam current can be adjusted by adjusting the temperature of the thermal evaporation source of the bismuth element, and the size and density of the black phosphorus phase bismuth nanoplates can be adjusted. Flow into a positive correlation.
  • the substrate film is a chromium telluride film
  • the temperature of the chromium source is controlled at 900 ° C to 1200 ° C, for example, 900 ° C, 925 ° C, 950 ° C, 980 ° C, 1000 ° C, 1050 °C, 1100 °C, 1150 °C or 1200 °C, etc .; control tellurium source temperature at 300 °C ⁇ 400 °C, such as 300 °C, 325 °C, 350 °C, 370 °C, 380 °C, 390 °C or 400 °C.
  • the method includes the following steps:
  • the chromium source, tellurium source and bismuth element thermal evaporation source are simultaneously passed into the epitaxial growth equipment to control the chromium source temperature at 900 °C ⁇ 1200 °C, tellurium source temperature at 300 °C ⁇ 400 °C, evaporation produced
  • the temperature of the thermal evaporation source of bismuth element is 450 °C ⁇ 550 °C, and the substrate temperature is 200 °C ⁇ 400 °C.
  • Bi atoms deposit to form black phosphorus phase bismuth nanoplates, and the black phosphorus phase bismuth nanoplates follow
  • the growth of the base film is buried in the base film, thereby forming a composite film on the substrate.
  • the embodiments of the present disclosure achieve the first efficient preparation of stable black phosphorus phase bismuth nanoplates.
  • a specially designed molecular beam epitaxial growth process is used to realize the first large-scale and efficient preparation of black phosphorus phase bismuth two-dimensional ultra-thin nanosheets, and the percentage surface area of the resulting black phosphorus phase bismuth nanosheets can reach 15 %.
  • the dual goals of synthesizing a large number of black phosphorus phase bismuth nanosheets and regulating the physical properties of the material (matrix film) are achieved.
  • a large number of black phosphorus phase bismuth two-dimensional materials are synthesized and applied to Cr 2 Te 3
  • the black phosphorus phase bismuth nanosheets were intercalated into a magnetic film such as chromium telluride (Cr 2 Te 3 ), and the physical properties of the chromium telluride magnetic film were successfully adjusted, such as
  • the topological magnetic structure of stigmine is generated, and the controllable preparation of magnetic stigmine is realized.
  • the method of the embodiment of the present disclosure can realize the doping of thin films such as semiconductors, insulators or metal conductors with black phosphorus phase nanosheets, and the resulting composite film has broad application prospects:
  • the black phosphorous phase bismuth nanosheets in the composite film formed in the embodiments of the present disclosure have an ultra-thin thickness, and the growth technology of the black phosphorous phase bismuth nanosheets is compatible with the epitaxial growth process of other semiconductor insulators, metals, and other thin films.
  • the described growth process of black phosphorus phase bismuth nanosheets can be extended to other thin film growth processes, which can produce more abundant physical property control applications.
  • the present disclosure provides a feasible route for the industry to use black phosphorus phase bismuth materials to control the properties of magnetic, semiconductor and other materials, and is expected to greatly expand the application field of bismuth metal.
  • FIG. 1a is a schematic diagram of an apparatus for growing a black phosphorus phase Bi nanosheet according to an embodiment of the present disclosure, wherein, 1-evaporation source, 2-heating coil, 3-electron gun, 4-substrate, 5-beam current monitoring, 6-ion gauge , 7-low temperature panel, 8-RHEED screen;
  • FIG. 1b is an electron diffraction pattern monitored during film growth according to an embodiment of the present disclosure
  • HAADF high-angle annular dark field
  • Figure 1d is a cross-sectional high-angle annular dark field (HAADF) scanning transmission electron microscope image of a bismuth nanosheet (corresponding to the bright line in the ellipse on the right) of Figure 1c;
  • HAADF high-angle annular dark field
  • Figure 1e is a first-principles calculation of the atomic structure of the black phosphorus phase bismuth nanosheet intercalation (also known as embedding) into the chromium telluride crystal lattice, where 1 represents tellurium atoms and 2 represents chromium atoms, 3 represents bismuth atom;
  • 2a is a schematic diagram of the generation of stigmine intercalated in a chromium telluride film of a black phosphorus phase bismuth nanosheet according to an embodiment of the present disclosure
  • 2b is a calculation simulation result of the change of the stigmine intercalated in the chromium telluride of the black phosphorus phase bismuth nanosheet according to an embodiment of the present disclosure with the applied magnetic field;
  • 2c and 2d are schematic diagrams of the regulation of stigmine using STM needle tip according to an embodiment of the present disclosure
  • Figure 2e is the mechanism of regulation described in Figure 2c and Figure 2d.
  • the thermal evaporation source of bismuth element (the temperature of the evaporation source is controlled between 450-650 degrees) is opened to provide a beam of Bi,
  • the substrate temperature is controlled between 200-400 °C, Bi atoms will be deposited on the sample surface to form a bismuth black phosphorus phase nanosheet structure and buried in the material as the material grows, as the growth process continues, A large number of black phosphorus phase bismuth nanosheet intercalation structures will be embedded inside the grown film, thereby achieving the dual goals of a large amount of synthesis of black phosphorus phase bismuth and material property control.
  • the epitaxial growth method described here can not only modify and modify bismuth nanoplatelets of chromium telluride, but also apply to the modification of bismuth nanoplatelets of other semiconductors, insulators, conductors and other thin films.
  • the evaporation source of chromium and tellurium is heated, and the temperature of the chromium source is controlled between 900-1200 degrees Celsius, and the temperature of the tellurium source is controlled between 300-400 degrees Celsius.
  • the bismuth evaporation source furnace is turned on And the temperature of the bismuth evaporation source furnace is controlled between 450-650 degrees Celsius, and the substrate temperature is adjusted between 200-400 degrees Celsius.
  • a chromium telluride film will be epitaxially grown on the surface of the wafer.
  • the bismuth atom will not form a stable compound with the chromium or tellurium element, it will diffuse on the surface of the film, free, and then It will be deposited on the surface of the sample and form a bismuth black phosphorus phase double-layer structure, and will be buried in the material as the material grows, forming many black phosphorus phase bismuth / chromium telluride heterojunction interfaces inside the film, thus changing The physical properties of the material, the black phosphorus phase nanosheets are intercalated in the chromium telluride film.
  • the size and density of the black phosphorus phase bismuth nanoplates can be effectively controlled, thereby effectively controlling the ferromagnetic properties of chromium telluride.
  • Figure 1a is a schematic diagram of a device for growing black phosphorus phase Bi nanosheets, where 1-evaporation source, 2-heating coil, 3-electron gun, 4-substrate, 5-beam monitoring, 6-ion gauge, 7-low temperature Panel, 8-RHEED screen.
  • the three thermal evaporation sources of Cr, Te, and Bi are simultaneously turned on and adjusted to the temperature described above, and the corresponding atoms are sprayed onto the surface of the gallium arsenide semiconductor wafer to perform the black phosphorus phase
  • the epitaxial growth of bismuth nanoplates are simultaneously turned on and adjusted to the temperature described above.
  • Figure 1b is the electron diffraction pattern monitored during the film growth process.
  • the electron diffraction pattern shows that the black phosphorus phase bismuth nanosheet / chromium telluride composite film grown by the above molecular beam epitaxy method has high quality surface flatness and Lattice perfection.
  • Figure 1c is a cross-sectional high-angle annular dark field (HAADF) scanning transmission electron microscope image of a chromium telluride film doped with black phosphorus phase bismuth nanoplates.
  • HAADF high-angle annular dark field
  • Figure 1d is a high-angle annular dark field (HAADF) scanning transmission electron microscope image of the cross-section of a bismuth nanosheet (corresponding to the bright line in the ellipse on the right) in FIG. 1c.
  • Bismuth atoms with higher brightness constitute a
  • the two-dimensional structure of the black phosphorus phase the figure also shows that the black phosphorus phase bismuth nanoplates are chromium telluride atoms above and below, forming a black phosphorus phase bismuth nanoplate / chromium telluride composite interface.
  • Figure 1e is a first-principles calculation of the atomic structure of the black phosphorus phase bismuth nanosheet intercalation (also known as embedding) into the chromium telluride crystal lattice, where 1 represents tellurium atoms and 2 represents chromium atoms, 3 represents the bismuth atom, indicating that the black phosphorus phase bismuth nanoplates will interact with the chromium telluride lattice at the electronic level.
  • FIGS. 1 a to 1 e show a schematic diagram of a growth method of black phosphorus phase bismuth nanoplates and a structure characterization structure, illustrating that the method of the present disclosure can effectively synthesize black phosphorus phase bismuth nanoplates.
  • the application principle of black phosphorus phase bismuth nanosheets is provided:
  • Figure 2a is a schematic diagram of the generation of stigmine intercalated in the chromium telluride film of the black phosphorus phase bismuth nanosheet.
  • the chromium telluride film doped with the black phosphorus phase bismuth has a strong bismuth atom.
  • the spin-orbit coupling effect, the magnetic interaction of the interface will cause the topological magnetic stigmine to be produced at the interface of the bismuth double layer and chromium telluride. Therefore, the chromium telluride film becomes intercalated after the black phosphorus phase bismuth nanosheet Get the Sigmar material.
  • Figure 2b is the calculated simulation results of the change of the stigmine intercalated in the chromium telluride of the black phosphorus phase bismuth nanosheets with the applied magnetic field.
  • H 0.46-1.0 Tesla
  • the chromium telluride is formed.
  • the diameter of each stigmine is determined by the size of the black phosphorus phase bismuth nanoplates. It can also be found that when a magnetic field is provided, the material vortexes, with and without vortex, the 0, 1 in the information can be seen.
  • the regulation mechanism of Figure 2e is to change the ferromagnetic state and magnetic field by applying a voltage
  • the electrons of the gemingon state interact with each other a month ago, thereby creating or eliminating a skyming son there.
  • data can be written and deleted by adjusting the voltage of the tip and the surface of the material to change the number of electrons in the ferromagnetic state and the stigmine state.
  • the chromium telluride magnetic storage device based on the intercalation of black phosphorus phase bismuth nanosheets realized by this method can contain about 5TB of information in a square centimeter square film, which has an increased capacity compared to the current Blu-ray DVD More than a hundred times.
  • FIGS. 2a-2e show simulation diagrams of the topological magnetic structure of strimine produced by Cr 2 Te 3 doped with black phosphorus phase bismuth, illustrating that the present disclosure can not only synthesize a large amount of black phosphorus phase bismuth nanoplates, but also achieve Cr 2 Te 3.
  • the doping of 3 realizes physical property control and realizes its application.

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Abstract

A black phosphorus-like ultra-thin bismuth nano-sheet modified compound film and a preparation method therefor. The compound film comprises a base film and a black phosphorus-like bismuth nano-sheet intercalation in the base film. Realizing large-scale synthesis of a black phosphorus-like two-dimensional bismuth material and control of physical properties of the material provides a viable path for industrial use of a black phosphorus-like bismuth material for controlling physical properties of materials such as magnetism and semiconductivity, expanding the field of use for metallic bismuth.

Description

一种黑磷相超薄铋纳米片改性的复合膜及其制备方法Composite film modified by black phosphorus phase ultra-thin bismuth nanosheets and preparation method thereof 技术领域Technical field
本公开涉及材料制备技术领域,例如涉及一种黑磷相超薄铋纳米片改性的复合膜及其制备方法。The present disclosure relates to the technical field of material preparation, for example, to a composite film modified by a black phosphorus phase ultra-thin bismuth nanosheet and a preparation method thereof.
背景技术Background technique
分子束外延技术是一种在单晶基片上外延生长高质量单晶薄膜或者超晶格结构的薄膜生长技术,该技术诞生于上世纪60年代的贝尔实验室。(Cho,A.Y.;Arthur,J.R.;Jr(1975).″Molecular beam epitaxy″.Prog.Solid State Chem.10:157-192.)由于此种分子束外延生长技术可以在超高真空环境中,实现原子水平的晶圆级半导体薄膜生长,因此,被广泛的应用于高质量半导体光电芯片、高迁移率场效应管、联级激光器等半导体技术产业,产生了显著的经济价值。除此以外,分子束外延技术被用于实现巨磁阻效应、分数量子霍尔效应、反常量子霍尔效应等前沿科学研究,直接催生了若干个诺贝尔奖级的研究成果。(①McCray,W.P.(2007).″MBE Deserves a Place in the History Books″.Nature Nanotechnology.2(5):259-261.,②H.
Figure PCTCN2018111346-appb-000001
S.Strite,G.B.Gao,M.E.Lin,B.Sverdlov,and M.Burns.“Large-band-gap SiC,III-V nitride,and II-VI ZnSe-based semiconductor device technologies”.Journal of Applied Physics 76,1363(1994).,③M.Z.Hasan and C.L.Kane.″Colloquium:Topological insulators″.Rev.Mod.Phys.82,3045.,以及④Wanjun Jiang,Gong Chen,Kai Liu,Jiadong Zang,Suzanne G.E.te Velthuis,Axel Hoffmann.″Skyrmions in magnetic multilayers″.Physics Reports 704(2017)1-49)最近几年,随着石墨烯等二维材料的研究突破,分子束外延技术也在此类二维半导体电子材料的研究中崭露头角,被研究人员 以及工业界广泛采用,从而实现外延生长具有精确原子层数的二维半导体薄膜的技术应用。
Molecular beam epitaxy is a thin-film growth technology that epitaxially grows high-quality single crystal thin films or superlattice structures on single crystal substrates. The technology was born in Bell Laboratories in the 1960s. (Cho, AY; Arthur, JR; Jr (1975). "Molecular beam epitaxy". Prog. Solid State Chem. 10: 157-192.) Because this molecular beam epitaxy growth technology can be realized in an ultra-high vacuum environment Atomic-level wafer-level semiconductor thin film growth, therefore, is widely used in high-quality semiconductor optoelectronic chips, high mobility field effect transistors, cascade lasers and other semiconductor technology industries, resulting in significant economic value. In addition, the molecular beam epitaxy technology is used to achieve cutting-edge scientific research such as the giant magnetoresistive effect, the fractional quantum Hall effect, and the inverse constant quantum Hall effect, which directly gave birth to several Nobel Prize-level research achievements. (①McCray, WP (2007). "MBE Deserves a Place in the History Books". Nature Nanotechnology. 2 (5): 259-261., ②H.
Figure PCTCN2018111346-appb-000001
S. Strite, GBGao, MELin, B. Sverdlov, and M. Burns. "Large-band-gap SiC, III-V nitride, and II-VI ZnSe-based semiconductor device technologies". Journal of Applied Physics 76, 1363 ( 1994)., ③ M.Z. Hasan and CLKane. "Colloquium: Topological insulators". Rev. Mod. Phys. 82, 3045., and ④ Wanjun Jiang, Gong Chen, Kai Liu, Jiadong Zang, Suzanne GEte Velthuis, Axel Hoffmann. "Skyrmions in magnetic multilayers". Physics Reports 704 (2017) 1-49) In recent years, with the breakthrough of graphene and other two-dimensional materials, molecular beam epitaxy technology has also emerged in the research of such two-dimensional semiconductor electronic materials. It is widely used by researchers and industry to realize the technical application of epitaxial growth of two-dimensional semiconductor thin films with precise atomic layers.
金属铋(Bi)是一种无毒、稳定的重元素(原子序数为83),在实际生活中,铋元素主要被应用于制药等工业领域。在常压下,单质铋拥有六角对称性的层状结构,以及金属的电学特性。2004年,日本的研究学者Nagao等人在物理评论快报上发表论文,发现铋原子在低于四个原子层厚的情况下,由于原子键的重构,会形成一种类似于黑磷相的双原子层状结构,物理性质亦被显著改变。(T.Nagao,J.T.Sadowski,M.Saito,S.Yaginuma,Y.Fujikawa,T.Kogure,T.Ohno,Y.Hasegawa,S.Hasegawa,and T.Sakurai.″Nanofilm Allotrope and Phase Transformation of Ultrathin Bi Film on Si(111)″.Phys.Rev.Lett.93(2004)105501.)黑磷相铋是一种只会在薄膜生长初期才会出现的二维层状铋材料,进一步的电子结构研究表明,该种黑磷相铋层材料是一种新型半导体材料,并且具有显著的自旋电子学性质。(Shin YAGINUMA et al.″Electronic Structure of Ultrathin Bismuth Films with A7 and Black-Phosphorus-like Structures″.Journal of the Physical Society of Japan 77(2008)014701.)然而,尽管早在2004年,人们就已经确定了此种黑磷相铋二维材料的存在,但是由于其极其苛刻的外延生长条件,以及较低的稳定性,科学家却无法实现黑磷相铋结构的可控大量外延生长,而且其仅仅生长在材料表面,这显著的阻碍了人们对该种铋的同素异形体的进一步研究和使用。Bismuth (Bi) is a non-toxic and stable heavy element (atomic number 83). In actual life, bismuth is mainly used in the pharmaceutical and other industrial fields. Under normal pressure, elemental bismuth has a layered structure with hexagonal symmetry and the electrical properties of metals. In 2004, Japanese research scholar Nagao et al published a paper in the Physical Review Letters and found that bismuth atoms under the thickness of four atomic layers, due to the reconstruction of atomic bonds, will form a kind of black phosphorus phase The physical structure of the diatomic layered structure has also been significantly changed. (T. Nagao, JTSadowski, M. Saito, S. Yaginuma, Y. Fujikawa, T. Kogure, T. Ohno, Y. Hasegawa, S. Hasegawa, and T. Sakurai. “Nanofilm” Allotrope and Phase Transformation Transformation of Ultrathin Bi Film (Si) (Phys. Rev. Lett. 93 (2004) 105501.) Black phosphorus phase bismuth is a two-dimensional layered bismuth material that will only appear in the initial stage of film growth, further electronic structure research It is shown that this black phosphorus phase bismuth layer material is a new type of semiconductor material and has remarkable spintronic properties. (Shin YAGINUMA et al. "Electronic Structure of Ultrathin Bismuth Films with A7 and Black-Phosphorus-like Structures". Journal of the Physical Society of Japan Japan 77 (2008) 014701.) However, although as early as 2004, people have already determined The existence of such two-dimensional material of black phosphorus phase bismuth, but due to its extremely harsh epitaxial growth conditions and low stability, scientists cannot achieve a controlled large amount of epitaxial growth of black phosphorus phase bismuth structure, and it only grows On the surface of the material, this significantly hindered the further research and use of this allotrope of bismuth.
发明内容Summary of the invention
本公开提供一种黑磷相超薄铋纳米片改性的复合膜及其制备方法。The present disclosure provides a black phosphorus phase ultra-thin bismuth nanosheet modified composite film and a preparation method thereof.
本公开在一实施例中提供一种黑磷相铋纳米片改性的复合膜,所述复合膜包括基体膜以及插层在基体膜中的黑磷相铋纳米片。In an embodiment of the present disclosure, a black phosphorus phase bismuth nanosheet modified composite film is provided. The composite film includes a base film and a black phosphorus phase bismuth nanosheet interposed in the base film.
本公开的复合膜为晶态膜,其中的基体膜以及黑磷相铋纳米片均为晶体结构。本公开的复合膜明显区别于现有技术,现有技术中虽然有少量黑磷相铋纳米材料,但是其均是在表面少量形成,并不存在插层型结构,本公开的复合膜对黑磷相铋纳米片的大量制备以及插层掺杂改性实现基体膜(比如半导体、绝缘材料或金属导体等)的应用具有重要意义。The composite film of the present disclosure is a crystalline film, in which the base film and the black phosphorus phase bismuth nanoplate are both of a crystal structure. The composite film of the present disclosure is clearly different from the prior art. Although there are a small amount of black phosphorus phase bismuth nanomaterials in the prior art, they are all formed on the surface in a small amount, and there is no intercalation type structure. The composite film of the present disclosure is black The large-scale preparation of phosphorus phase bismuth nanosheets and the application of interlayer doping modification to realize the application of matrix films (such as semiconductors, insulating materials or metal conductors, etc.) are of great significance.
本公开的复合膜的形成,不仅涉及黑磷相铋纳米片的制备,还涉及对基体膜的掺杂改性。The formation of the composite film of the present disclosure involves not only the preparation of black phosphorus phase bismuth nanosheets, but also the doping modification of the base film.
在一实施例中,所述基体膜包括导体、半导体或绝缘体中的任意一种。导体例如可以是金属/半金属,具体可以是Fe、Co、Cr或FeCr等的金属单质或合金薄膜,CrTe、Cr 2Te 3、Cr 3Te 4或Cr 5Te 8等CrTe化合物;半导体例如可以是ZnSe、ZnTe、ZnS等II-VI族半导体,GaN等III-V族半导体,或者MoTe 2、MoSe 2、MoS 2等二维过渡期金属硫族化合物(TMDCs)。但并不限于上述列举的基体膜,其他本领域常用的可达到相同技术效果的基体膜也可用于本公开的技术方案。 In an embodiment, the base film includes any one of a conductor, a semiconductor, or an insulator. The conductor may be, for example, a metal / semi-metal, specifically a metal elemental or alloy thin film such as Fe, Co, Cr, or FeCr, a CrTe compound such as CrTe, Cr 2 Te 3 , Cr 3 Te 4, or Cr 5 Te 8 ; a semiconductor may, for example, is ZnSe, ZnTe, ZnS and other group II-VI semiconductors, GaN and other group III-V semiconductors, or MoTe 2, MoSe 2, MoS 2 and the like of the two-dimensional transition metal chalcogenide (TMDCs). However, it is not limited to the above-mentioned base films, and other base films commonly used in the art that can achieve the same technical effect can also be used in the technical solutions of the present disclosure.
在一实施例中,所述基体膜为金属单质、合金薄膜、CrTe化合物、II-VI族半导体、III-V族半导体或二维过渡期金属硫族化合物中的任意一种。In one embodiment, the base film is any one of metal element, alloy thin film, CrTe compound, group II-VI semiconductor, group III-V semiconductor, or two-dimensional transition metal chalcogenide compound.
在一实施例中,所述基体膜为碲化铬。In one embodiment, the base film is chromium telluride.
在一实施例中,以所述复合膜的表面积为100%计,所述黑磷相铋纳米片的百分比表面积在5%~15%,例如5%、7%、8%、10%、11%、12%、13%、14%或15%等。In an embodiment, based on the surface area of the composite membrane as 100%, the percentage surface area of the black phosphorus phase bismuth nanosheets is 5% -15%, such as 5%, 7%, 8%, 10%, 11 %, 12%, 13%, 14% or 15%, etc.
在一实施例中,所述黑磷相铋纳米片的厚度为一个黑磷相铋的双层。In one embodiment, the thickness of the black phosphorus phase bismuth nanoplate is a double layer of black phosphorus phase bismuth.
在一实施例中,所述黑磷相铋纳米片的厚度为0.5nm~0.7nm,例如0.5nm、0.52nm、0.53nm、0.55nm、0.58nm、0.6nm、0.63nm、0.66nm、0.68nm或0.7nm等。In an embodiment, the thickness of the black phosphorus phase bismuth nanoplates is 0.5 nm to 0.7 nm, such as 0.5 nm, 0.52 nm, 0.53 nm, 0.55 nm, 0.58 nm, 0.6 nm, 0.63 nm, 0.66 nm, 0.68 nm Or 0.7nm, etc.
在一实施例中,所述复合膜位于衬底上,本公开对所述衬底的种类不作限定,例如可以是晶圆衬底。In an embodiment, the composite film is located on a substrate, and the disclosure does not limit the type of the substrate, for example, it may be a wafer substrate.
在一实施例中,所述复合膜按如下方法制备得到:在外延生长基体膜的过程中引入铋元素的热蒸发源,产生铋原子束流,Bi原子沉积形成黑磷相铋纳米 片,且黑磷相铋纳米片随着基体膜的生长被埋入基体膜中,从而形成复合膜。In one embodiment, the composite film is prepared as follows: during the epitaxial growth of the base film, a thermal evaporation source of bismuth is introduced to produce a beam of bismuth atoms, and Bi atoms are deposited to form a black phosphorus phase bismuth nanosheet, and The black phosphorus phase bismuth nanoplates are buried in the base film as the base film grows, thereby forming a composite film.
本公开在一实施例中提供一种所述的黑磷相铋纳米片改性的复合膜的制备方法,所述方法包括以下步骤:In one embodiment of the present disclosure, a method for preparing the composite film modified with black phosphorus phase bismuth nanosheets is provided. The method includes the following steps:
在衬底上生长基体膜的过程中,通入铋元素的热蒸发源,产生铋原子束流,随着基体膜的生长Bi原子沉积形成黑磷相铋纳米片,且黑磷相铋纳米片随着基体膜的生长被埋入基体膜中,从而在衬底上形成复合膜;In the process of growing the base film on the substrate, a thermal evaporation source of bismuth element is passed to produce a beam of bismuth atoms. As the base film grows, Bi atoms are deposited to form a black phosphorus phase bismuth nanoplate, and the black phosphorus phase bismuth nanoplate As the base film grows, it is buried in the base film to form a composite film on the substrate;
其中,制备所述复合膜的过程中,衬底温度控制在200℃~400℃,例如200℃、220℃、240℃、260℃、280℃、300℃、325℃、350℃、370℃、380℃或400℃等,若温度低于200℃,会导致复合膜为非晶态;若温度高于400℃,会因蒸发导致Bi原子无法沉积形成黑磷相铋纳米片。In the process of preparing the composite film, the substrate temperature is controlled at 200 ° C to 400 ° C, for example, 200 ° C, 220 ° C, 240 ° C, 260 ° C, 280 ° C, 300 ° C, 325 ° C, 350 ° C, 370 ° C, 380 ℃ or 400 ℃, if the temperature is lower than 200 ℃, it will cause the composite film to be amorphous; if the temperature is higher than 400 ℃, Bi atoms will not be deposited due to evaporation to form black phosphorus phase bismuth nanoplates.
本公开的方法通过在生长薄膜过程中打开铋源,可以实现黑磷相铋纳米片的大量合成和插层应用,该方法操作简单,可以实现大量合成黑磷相铋纳米片以及对基体膜材料的物性进行调控的双重目标,解决了黑磷相铋纳米片难以大量制备的技术问题以及应用的技术问题。The method of the present disclosure can realize a large amount of synthesis and intercalation application of black phosphorus phase bismuth nanosheets by opening the bismuth source during the growth of the thin film. The dual goal of regulating physical properties is to solve the technical problem that black phosphorus phase bismuth nanosheets are difficult to prepare in large quantities and the technical problem of application.
在一实施例中,所述外延生长基体膜的方法为:分子束外延生长的方法。In one embodiment, the method of epitaxially growing the base film is: a method of molecular beam epitaxial growth.
本公开的方法中,对所述衬底的种类不作限定,例如可以是晶圆衬底。In the method of the present disclosure, the type of the substrate is not limited, for example, it may be a wafer substrate.
在所述方法的一实施例中,所述基体膜包括导体、半导体或绝缘体中的任意一种,优选为金属/半金属、II-VI族半导体、III-V族半导体或二维过渡期金属硫族化合物中的任意一种。In an embodiment of the method, the base film includes any one of a conductor, a semiconductor, or an insulator, preferably a metal / half metal, a group II-VI semiconductor, a group III-V semiconductor, or a two-dimensional transition metal Any one of the chalcogenide compounds.
在所述方法的一实施例中,所述基体膜为金属单质、合金薄膜、CrTe化合物、II-VI族半导体、III-V族半导体或二维过渡期金属硫族化合物中的任意一种。In an embodiment of the method, the base film is any one of a metal element, an alloy thin film, a CrTe compound, a group II-VI semiconductor, a group III-V semiconductor, or a two-dimensional transition metal chalcogenide compound.
在所述方法的一实施例中,所述基体膜为碲化铬膜。In an embodiment of the method, the base film is a chromium telluride film.
在一实施例中,蒸发产生铋元素的热蒸发源的温度控制在450℃~650℃,例如450℃、475℃、500℃、520℃、550℃、570℃、580℃、600℃、625℃或650℃等。In one embodiment, the temperature of the thermal evaporation source that evaporates to produce bismuth element is controlled at 450 ° C to 650 ° C, such as 450 ° C, 475 ° C, 500 ° C, 520 ° C, 550 ° C, 570 ° C, 580 ° C, 600 ° C, 625 ℃ or 650 ℃ etc.
在一实施例中,蒸发产生铋元素的热蒸发源的温度控制在450℃~550℃,在 此范围450℃~650℃内,可以形成稳定的蒸气压,产生稳定的Bi束流,从而更好地形成黑磷相铋纳米片插层基体膜的结构。In one embodiment, the temperature of the thermal evaporation source that produces bismuth by evaporation is controlled at 450 ° C to 550 ° C, and within this range of 450 ° C to 650 ° C, a stable vapor pressure can be formed to produce a stable Bi beam flow, thereby The structure of the interlayer substrate film of the black phosphorus phase bismuth nanosheets is well formed.
在一实施例中,通过调整铋元素的热蒸发源的温度可以调整铋原子束流,可以调控黑磷相铋纳米片的尺寸和密度,黑磷相铋纳米片的尺寸和密度与铋原子束流成正向相关关系。In one embodiment, the bismuth atomic beam current can be adjusted by adjusting the temperature of the thermal evaporation source of the bismuth element, and the size and density of the black phosphorus phase bismuth nanoplates can be adjusted. Flow into a positive correlation.
在一实施例中,所述基体膜为碲化铬膜,生长碲化铬膜时,控制铬源温度在900℃~1200℃,例如900℃、925℃、950℃、980℃、1000℃、1050℃、1100℃、1150℃或1200℃等;控制碲源温度在300℃~400℃,例如300℃、325℃、350℃、370℃、380℃、390℃或400℃等。In one embodiment, the substrate film is a chromium telluride film, and when the chromium telluride film is grown, the temperature of the chromium source is controlled at 900 ° C to 1200 ° C, for example, 900 ° C, 925 ° C, 950 ° C, 980 ° C, 1000 ° C, 1050 ℃, 1100 ℃, 1150 ℃ or 1200 ℃, etc .; control tellurium source temperature at 300 ℃ ~ 400 ℃, such as 300 ℃, 325 ℃, 350 ℃, 370 ℃, 380 ℃, 390 ℃ or 400 ℃.
在一实施例中,所述方法包括以下步骤:In an embodiment, the method includes the following steps:
采用分子束外延生长的方法,铬源、碲源以及铋元素的热蒸发源同时通入外延生长设备,控制铬源温度在900℃~1200℃,碲源温度在300℃~400℃,蒸发产生铋元素的热蒸发源的温度在450℃~550℃,衬底温度200℃~400℃,随着基体膜的生长Bi原子沉积形成黑磷相铋纳米片,且黑磷相铋纳米片随着基体膜的生长被埋入基体膜中,从而在衬底上形成复合膜。Using the molecular beam epitaxial growth method, the chromium source, tellurium source and bismuth element thermal evaporation source are simultaneously passed into the epitaxial growth equipment to control the chromium source temperature at 900 ℃ ~ 1200 ℃, tellurium source temperature at 300 ℃ ~ 400 ℃, evaporation produced The temperature of the thermal evaporation source of bismuth element is 450 ℃ ~ 550 ℃, and the substrate temperature is 200 ℃ ~ 400 ℃. As the base film grows, Bi atoms deposit to form black phosphorus phase bismuth nanoplates, and the black phosphorus phase bismuth nanoplates follow The growth of the base film is buried in the base film, thereby forming a composite film on the substrate.
与相关技术相比,本公开实施例首次实现了稳定的黑磷相铋纳米片的高效制备。本公开在一实施例中采用一种特殊设计的分子束外延生长工艺,首次实现了黑磷相铋二维超薄纳米片的大量高效制备,所得黑磷相铋纳米片的百分比表面积可达15%。Compared with the related art, the embodiments of the present disclosure achieve the first efficient preparation of stable black phosphorus phase bismuth nanoplates. In one embodiment of the present disclosure, a specially designed molecular beam epitaxial growth process is used to realize the first large-scale and efficient preparation of black phosphorus phase bismuth two-dimensional ultra-thin nanosheets, and the percentage surface area of the resulting black phosphorus phase bismuth nanosheets can reach 15 %.
本公开实施例中实现了大量合成黑磷相铋纳米片和对材料(基体膜)物性调控的双重目标,首次实现了黑磷相铋二维材料的大量合成及应用,以在Cr 2Te 3中掺杂黑磷相铋为例,将黑磷相铋纳米片插层在到碲化铬(Cr 2Te 3)此种磁性薄膜中,成功对碲化铬磁性薄膜的物性进行了调控,比如对磁性材料的磁畴调控,产生斯格明子拓扑磁结构,实现了磁性斯格明子可控制备。 In the embodiments of the present disclosure, the dual goals of synthesizing a large number of black phosphorus phase bismuth nanosheets and regulating the physical properties of the material (matrix film) are achieved. For the first time, a large number of black phosphorus phase bismuth two-dimensional materials are synthesized and applied to Cr 2 Te 3 In the case of medium-doped black phosphorus phase bismuth, the black phosphorus phase bismuth nanosheets were intercalated into a magnetic film such as chromium telluride (Cr 2 Te 3 ), and the physical properties of the chromium telluride magnetic film were successfully adjusted, such as By controlling the magnetic domains of magnetic materials, the topological magnetic structure of stigmine is generated, and the controllable preparation of magnetic stigmine is realized.
本公开实施例的方法可以实现黑磷相纳米片对半导体、绝缘体或金属导体等薄膜的掺杂,掺杂所得复合膜具有广阔的应用前景:The method of the embodiment of the present disclosure can realize the doping of thin films such as semiconductors, insulators or metal conductors with black phosphorus phase nanosheets, and the resulting composite film has broad application prospects:
本公开实施例形成的复合膜中的黑磷相铋纳米片具有超薄的厚度,并且黑磷相铋纳米片的生长技术可与其他半导体绝缘体、金属等薄膜的外延生长工艺 兼容,本公开所描述的黑磷相铋纳米片的生长工艺可以扩展到其它的薄膜生长工艺中,由此可产生更为丰富的物性调控应用。The black phosphorous phase bismuth nanosheets in the composite film formed in the embodiments of the present disclosure have an ultra-thin thickness, and the growth technology of the black phosphorous phase bismuth nanosheets is compatible with the epitaxial growth process of other semiconductor insulators, metals, and other thin films. The described growth process of black phosphorus phase bismuth nanosheets can be extended to other thin film growth processes, which can produce more abundant physical property control applications.
本公开为工业界利用黑磷相铋材料对磁性、半导体等材料进行物性调控提供一条可行的路线,有望大大拓展铋金属的应用领域,预计将对铋金属的工业应用产生积极促进作用。The present disclosure provides a feasible route for the industry to use black phosphorus phase bismuth materials to control the properties of magnetic, semiconductor and other materials, and is expected to greatly expand the application field of bismuth metal.
附图说明BRIEF DESCRIPTION
附图用来提供对本公开技术方案的进一步理解,并且构成说明书的一部分,与本申请的实施例一起用于解释本公开的技术方案,并不构成对本公开技术方案的限制。The drawings are used to provide a further understanding of the technical solutions of the present disclosure, and form a part of the specification, and are used to explain the technical solutions of the present disclosure together with the embodiments of the present application, and do not constitute limitations on the technical solutions of the present disclosure.
图1a是本公开一实施例黑磷相Bi纳米片生长的装置示意图,其中,1-蒸发源,2-加热线圈,3-电子枪,4-衬底,5-束流监控,6-离子规,7-低温面板,8-RHEED屏;FIG. 1a is a schematic diagram of an apparatus for growing a black phosphorus phase Bi nanosheet according to an embodiment of the present disclosure, wherein, 1-evaporation source, 2-heating coil, 3-electron gun, 4-substrate, 5-beam current monitoring, 6-ion gauge , 7-low temperature panel, 8-RHEED screen;
图1b是本公开一实施例薄膜生长过程中监控到的电子衍射图案;FIG. 1b is an electron diffraction pattern monitored during film growth according to an embodiment of the present disclosure;
图1c是本公开一实施例提供的黑磷相铋纳米片掺杂的碲化铬薄膜的横截面高角环形暗场(HAADF)扫描透射电子显微镜图像;1c is a cross-sectional high-angle annular dark field (HAADF) scanning transmission electron microscope image of a chromium telluride film doped with black phosphorus phase bismuth nanoplates provided by an embodiment of the present disclosure;
图1d是图1c中一个铋纳米片(对应右侧椭圆内的亮线)的横截面高角环形暗场(HAADF)扫描透射电子显微镜图像;Figure 1d is a cross-sectional high-angle annular dark field (HAADF) scanning transmission electron microscope image of a bismuth nanosheet (corresponding to the bright line in the ellipse on the right) of Figure 1c;
图1e是图1d的第一性原理计算黑磷相铋纳米片插层(也称为嵌入)到碲化铬晶格里的原子结构模拟图片,其中,1代表碲原子,2代表铬原子,3代表铋原子;Figure 1e is a first-principles calculation of the atomic structure of the black phosphorus phase bismuth nanosheet intercalation (also known as embedding) into the chromium telluride crystal lattice, where 1 represents tellurium atoms and 2 represents chromium atoms, 3 represents bismuth atom;
图2a是本公开一实施例插层在黑磷相铋纳米片的碲化铬薄膜中的斯格明子产生示意图;2a is a schematic diagram of the generation of stigmine intercalated in a chromium telluride film of a black phosphorus phase bismuth nanosheet according to an embodiment of the present disclosure;
图2b是本公开一实施例插层在黑磷相铋纳米片的碲化铬中的斯格明子随外加磁场变化的计算模拟结果;2b is a calculation simulation result of the change of the stigmine intercalated in the chromium telluride of the black phosphorus phase bismuth nanosheet according to an embodiment of the present disclosure with the applied magnetic field;
图2c和图2d是本公开一实施例利用STM针尖对斯格明子的调控示意图;2c and 2d are schematic diagrams of the regulation of stigmine using STM needle tip according to an embodiment of the present disclosure;
图2e为图2c和图2d所述调控的机理。Figure 2e is the mechanism of regulation described in Figure 2c and Figure 2d.
具体实施例Specific examples
下面结合附图并通过具体实施方式来进一步说明本公开的技术方案。The technical solutions of the present disclosure will be further described below with reference to the drawings and through specific implementations.
在利用分子束外延生长半导体、绝缘体或金属导体薄膜等基体膜的过程中,同时将铋元素的热蒸发源(蒸发源温度控制在450-650度之间)打开,提供一个Bi的束流,同时将衬底温度控制在200-400℃之间,Bi原子会在样品表面沉积形成铋的黑磷相纳米片结构并随着材料的生长被埋入材料中,随着生长过程的不断进行,所生长薄膜内部将会嵌入大量的黑磷相铋纳米片插层结构,从而实现了大量合成黑磷相铋和材料物性调控的双重目标。In the process of using molecular beam epitaxy to grow substrate films such as semiconductors, insulators or metal conductor films, at the same time, the thermal evaporation source of bismuth element (the temperature of the evaporation source is controlled between 450-650 degrees) is opened to provide a beam of Bi, At the same time, the substrate temperature is controlled between 200-400 ℃, Bi atoms will be deposited on the sample surface to form a bismuth black phosphorus phase nanosheet structure and buried in the material as the material grows, as the growth process continues, A large number of black phosphorus phase bismuth nanosheet intercalation structures will be embedded inside the grown film, thereby achieving the dual goals of a large amount of synthesis of black phosphorus phase bismuth and material property control.
实施例1Example 1
黑磷相铋纳米片的分子束外延方法Molecular beam epitaxy method of black phosphorus phase bismuth nanosheets
在这里,将以外延生长碲化铬薄膜为例,阐述技术路线。此处所描述的外延生长方法,不仅可针对碲化铬的铋纳米片掺杂改性,也同样适用于其它半导体、绝缘体、导体等薄膜的铋纳米片掺杂改性。Here, taking the epitaxial growth of chromium telluride thin film as an example, the technical route is described. The epitaxial growth method described here can not only modify and modify bismuth nanoplatelets of chromium telluride, but also apply to the modification of bismuth nanoplatelets of other semiconductors, insulators, conductors and other thin films.
在一个实施例中,加热铬、碲的蒸发源,并将铬源温度控制在900-1200摄氏度之间,碲源温度控制在300-400摄氏度之间,与此同时,打开铋的蒸发源炉,并将铋蒸发源炉的温度控制在450-650摄氏度之间,衬底温度调整为200-400摄氏度之间。随着外延生长的进行,在晶圆表面,将会进行碲化铬薄膜外延生长,与此同时,由于铋原子不会与铬或者碲元素形成稳定化合物,其在薄膜表面扩散,游离,紧接着就会在样品表面沉积并形成铋的黑磷相双层结构,并随着材料的生长被埋入材料中,在薄膜内部形成众多黑磷相铋/碲化铬的异质结界面,从而改变材料的物理性质,黑磷相纳米片插层在碲化铬薄膜中。In one embodiment, the evaporation source of chromium and tellurium is heated, and the temperature of the chromium source is controlled between 900-1200 degrees Celsius, and the temperature of the tellurium source is controlled between 300-400 degrees Celsius. At the same time, the bismuth evaporation source furnace is turned on And the temperature of the bismuth evaporation source furnace is controlled between 450-650 degrees Celsius, and the substrate temperature is adjusted between 200-400 degrees Celsius. As the epitaxial growth proceeds, a chromium telluride film will be epitaxially grown on the surface of the wafer. At the same time, since the bismuth atom will not form a stable compound with the chromium or tellurium element, it will diffuse on the surface of the film, free, and then It will be deposited on the surface of the sample and form a bismuth black phosphorus phase double-layer structure, and will be buried in the material as the material grows, forming many black phosphorus phase bismuth / chromium telluride heterojunction interfaces inside the film, thus changing The physical properties of the material, the black phosphorus phase nanosheets are intercalated in the chromium telluride film.
在一个实施例中,通过调整铋源的蒸发温度,进一步调整铋原子束流,黑磷相铋纳米片的尺寸和密度可以得到有效调控,从而实现对碲化铬铁磁性的有效调控。In one embodiment, by adjusting the evaporation temperature of the bismuth source and further adjusting the bismuth atomic beam current, the size and density of the black phosphorus phase bismuth nanoplates can be effectively controlled, thereby effectively controlling the ferromagnetic properties of chromium telluride.
附图1a是黑磷相Bi纳米片生长的装置示意图,其中,1-蒸发源,2-加热线圈,3-电子枪,4-衬底,5-束流监控,6-离子规,7-低温面板,8-RHEED屏。在外延生长碲化铬薄膜的过程中,同时打开Cr、Te、Bi三个热蒸发源,并调节到前文所描述温度,向砷化镓半导体晶圆表面喷射相应原子,即可进行黑磷相铋纳米片的外延生长。Figure 1a is a schematic diagram of a device for growing black phosphorus phase Bi nanosheets, where 1-evaporation source, 2-heating coil, 3-electron gun, 4-substrate, 5-beam monitoring, 6-ion gauge, 7-low temperature Panel, 8-RHEED screen. During the epitaxial growth of the chromium telluride thin film, the three thermal evaporation sources of Cr, Te, and Bi are simultaneously turned on and adjusted to the temperature described above, and the corresponding atoms are sprayed onto the surface of the gallium arsenide semiconductor wafer to perform the black phosphorus phase The epitaxial growth of bismuth nanoplates.
附图1b是薄膜生长过程中监控到的电子衍射图案,该电子衍射图案表明采用上述分子束外延方法所生长的黑磷相铋纳米片/碲化铬复合薄膜,具有高质量的表面平整度和晶格完美度。Figure 1b is the electron diffraction pattern monitored during the film growth process. The electron diffraction pattern shows that the black phosphorus phase bismuth nanosheet / chromium telluride composite film grown by the above molecular beam epitaxy method has high quality surface flatness and Lattice perfection.
附图1c是黑磷相铋纳米片掺杂的碲化铬薄膜的横截面高角环形暗场(HAADF)扫描透射电子显微镜图像,图中碲化铬晶格内部所表现的白色亮线(比如椭圆区域的亮线)即为黑磷相铋纳米片。Figure 1c is a cross-sectional high-angle annular dark field (HAADF) scanning transmission electron microscope image of a chromium telluride film doped with black phosphorus phase bismuth nanoplates. In the figure, white bright lines (such as ellipses) appear inside the chromium telluride lattice. The bright line in the area) is the black phosphorus phase bismuth nanoplate.
附图1d是图1c中一个铋纳米片(对应右侧椭圆内的亮线)的横截面高角环形暗场(HAADF)扫描透射电子显微镜图像,具有较高亮度的铋原子在图中构成了一个黑磷相的二维结构,该图还表明黑磷相铋纳米片上下均为碲化铬原子,构成了一个黑磷相铋纳米片/碲化铬的复合界面。Figure 1d is a high-angle annular dark field (HAADF) scanning transmission electron microscope image of the cross-section of a bismuth nanosheet (corresponding to the bright line in the ellipse on the right) in FIG. 1c. Bismuth atoms with higher brightness constitute a The two-dimensional structure of the black phosphorus phase, the figure also shows that the black phosphorus phase bismuth nanoplates are chromium telluride atoms above and below, forming a black phosphorus phase bismuth nanoplate / chromium telluride composite interface.
图1e是图1d的第一性原理计算黑磷相铋纳米片插层(也称为嵌入)到碲化铬晶格里的原子结构模拟图片,其中,1代表碲原子,2代表铬原子,3代表铋原子,说明黑磷相铋纳米片会与碲化铬晶格产生电子层次的相互作用。Figure 1e is a first-principles calculation of the atomic structure of the black phosphorus phase bismuth nanosheet intercalation (also known as embedding) into the chromium telluride crystal lattice, where 1 represents tellurium atoms and 2 represents chromium atoms, 3 represents the bismuth atom, indicating that the black phosphorus phase bismuth nanoplates will interact with the chromium telluride lattice at the electronic level.
前述图1a-图1e展示了黑磷相铋纳米片的生长方法示意图以及结构表征结构,说明本公开的方法能够有效合成黑磷相铋纳米片。The foregoing FIGS. 1 a to 1 e show a schematic diagram of a growth method of black phosphorus phase bismuth nanoplates and a structure characterization structure, illustrating that the method of the present disclosure can effectively synthesize black phosphorus phase bismuth nanoplates.
本公开在一实施例中提供黑磷相铋纳米片的应用原理:In one embodiment of the present disclosure, the application principle of black phosphorus phase bismuth nanosheets is provided:
图2a是插层在黑磷相铋纳米片的碲化铬薄膜中的斯格明子产生示意图,如图2a所示,掺入黑磷相铋的碲化铬薄膜,由于铋原子有很强的自旋轨道耦合效应,界面的磁相互作用会导致拓扑的磁斯格明子在铋双层与碲化铬的界面处产生,因此,插层在黑磷相铋纳米片后碲化铬薄膜就成为了斯格明子材料。Figure 2a is a schematic diagram of the generation of stigmine intercalated in the chromium telluride film of the black phosphorus phase bismuth nanosheet. As shown in FIG. 2a, the chromium telluride film doped with the black phosphorus phase bismuth has a strong bismuth atom. The spin-orbit coupling effect, the magnetic interaction of the interface will cause the topological magnetic stigmine to be produced at the interface of the bismuth double layer and chromium telluride. Therefore, the chromium telluride film becomes intercalated after the black phosphorus phase bismuth nanosheet Get the Sigmar material.
图2b是插层在黑磷相铋纳米片的碲化铬中的斯格明子随外加磁场变化的计算模拟结果,在外加场H=0.46-1.0特斯拉的情况下,碲化铬中形成斯格明子阵列,每个斯格明子的直径由黑磷相铋纳米片的尺寸决定。还可以发现当提供一个磁场下,材料出现涡旋,有涡旋和无涡旋可以看出信息中的0,1。Figure 2b is the calculated simulation results of the change of the stigmine intercalated in the chromium telluride of the black phosphorus phase bismuth nanosheets with the applied magnetic field. In the case of the applied field H = 0.46-1.0 Tesla, the chromium telluride is formed. For the stigmine array, the diameter of each stigmine is determined by the size of the black phosphorus phase bismuth nanoplates. It can also be found that when a magnetic field is provided, the material vortexes, with and without vortex, the 0, 1 in the information can be seen.
根据Fert等人的报导,我们可以通过扫描隧道显微镜针尖对每个斯格明子调控(Albert Fert,Nicolas Reyren and Vincent Cros.″Magnetic skyrmions:advances in physics and potential applications″.NATURE REVIEWS,MATERIALS 2(2017)17031.以及Niklas Romming,Christian Hanneken,Matthias Menzel,Jessica E.Bickel,Boris Wolter,Kirsten von Bergmann,Andr é Kubetzka,Roland Wiesendanger.“Writing and Deleting Single Magnetic Skyrmions”.Science,Vol 341,2013.)。图2c和图2d是利用STM针尖对斯格明子的调控示意图;图2e为图2c和图2d所述调控的机理,图2e的调控机理是通过施加一个电压,使得改变处于铁磁态和斯格明子态的电子相互月前,从而在该处制造或消除一个斯格 明子。如图2c-图2e所示,通过调控针尖与材料表面的电压改变处于铁磁态和斯格明子态的电子的占据数从而实现数据的写入和删除。通过这种方法实现的基于插层在黑磷相铋纳米片的碲化铬磁储存元器件,在一个平方厘米见方的薄膜内可以容纳大约5TB的信息,相比于目前的蓝光DVD,容量提高了百倍以上。According to the report of Fert et al., We can regulate each stigmine by the tip of the scanning tunnel microscope (Albert, Fert, Nicolas, Reyren, and Vincent, Cros. "Magnetic skyrmions: advances, physics, and potential applications". NATURE REVIEWS, MATERIALS 2 (2017 ) 17031. And Niklas Romming, Christian Hanneken, Matthias Menzel, Jessica E. Bickel, Boris Wolter, Kirsten von Bergmann, Andr Kubetzka, Roland Wiesendanger. "Writing and Deleting Singles Magnetic Vol. 2013,". Figures 2c and 2d are schematic diagrams of the regulation of stigmine using the STM tip; Figure 2e is the mechanism of regulation described in Figures 2c and 2d. The regulation mechanism of Figure 2e is to change the ferromagnetic state and magnetic field by applying a voltage The electrons of the gemingon state interact with each other a month ago, thereby creating or eliminating a skyming son there. As shown in Figures 2c-2e, data can be written and deleted by adjusting the voltage of the tip and the surface of the material to change the number of electrons in the ferromagnetic state and the stigmine state. The chromium telluride magnetic storage device based on the intercalation of black phosphorus phase bismuth nanosheets realized by this method can contain about 5TB of information in a square centimeter square film, which has an increased capacity compared to the current Blu-ray DVD More than a hundred times.
图2a-图2e展示了掺入黑磷相铋的Cr 2Te 3产生斯格明子拓扑磁结构的模拟图,说明本公开不仅可以大量合成黑磷相铋纳米片,还可以实现对Cr 2Te 3的掺杂,实现物性调控,实现其应用。 2a-2e show simulation diagrams of the topological magnetic structure of strimine produced by Cr 2 Te 3 doped with black phosphorus phase bismuth, illustrating that the present disclosure can not only synthesize a large amount of black phosphorus phase bismuth nanoplates, but also achieve Cr 2 Te 3. The doping of 3 realizes physical property control and realizes its application.
申请人声明,本公开通过上述实施例来说明本申请的详细方法,但本公开并不局限于上述详细方法,即不意味着本公开必须依赖上述详细方法才能实施。所属技术领域的技术人员应该明了,对本公开的任何改进,对本公开产品各原料的等效替换及辅助成分的添加、具体方式的选择等,均落在本公开的保护范围和公开范围之内。The applicant declares that the present disclosure illustrates the detailed method of the present application through the above-mentioned embodiments, but the present disclosure is not limited to the detailed method, that is, it does not mean that the disclosed method must rely on the detailed method to be implemented. Those skilled in the art should understand that any improvement to the present disclosure, equivalent replacement of various raw materials of the disclosed product, addition of auxiliary components, choice of specific methods, etc., fall within the scope of protection and disclosure of the present disclosure.

Claims (20)

  1. 一种黑磷相铋纳米片改性的复合膜,所述复合膜包括基体膜以及插层在基体膜中的黑磷相铋纳米片。A composite film modified by black phosphorus phase bismuth nanosheets, the composite film includes a base film and a black phosphorus phase bismuth nanosheet interposed in the base film.
  2. 根据权利要求1所述的复合膜,其中,所述基体膜包括导体、半导体或绝缘体中的任意一种。The composite film according to claim 1, wherein the base film includes any one of a conductor, a semiconductor, or an insulator.
  3. 根据权利要求2所述的复合膜,其中,所述基体膜为金属/半金属、II-VI族半导体、III-V族半导体或二维过渡期金属硫族化合物中的任意一种。The composite film according to claim 2, wherein the base film is any one of metal / semimetal, group II-VI semiconductor, group III-V semiconductor, or two-dimensional transition metal chalcogenide compound.
  4. 根据权利要求3所述的复合膜,其中,所述基体膜为金属单质、合金薄膜、CrTe化合物、II-VI族半导体、III-V族半导体或二维过渡期金属硫族化合物中的任意一种。The composite film according to claim 3, wherein the base film is any one of a metal element, an alloy thin film, a CrTe compound, a II-VI semiconductor, a III-V semiconductor, or a two-dimensional transition metal chalcogenide compound Species.
  5. 根据权利要求4所述的复合膜,其中,所述基体膜为碲化铬。The composite film according to claim 4, wherein the base film is chromium telluride.
  6. 根据权利要求1-5任一项所述的复合膜,其中,以所述复合膜的表面积为100%计,所述黑磷相铋纳米片的百分比表面积在5%~15%。The composite membrane according to any one of claims 1 to 5, wherein the percentage surface area of the black phosphorus phase bismuth nanosheets is 5% to 15% based on the surface area of the composite membrane being 100%.
  7. 根据权利要求1-6任一项所述的复合膜,其中,所述黑磷相铋纳米片的厚度为一个黑磷相铋的双层。The composite film according to any one of claims 1 to 6, wherein the thickness of the black phosphorus phase bismuth nanoplate is a double layer of black phosphorus phase bismuth.
  8. 根据权利要求1-7任一项所述的复合膜,其中,所述黑磷相铋纳米片的厚度为0.5nm~0.7nm。The composite film according to any one of claims 1 to 7, wherein the black phosphorus phase bismuth nanoplate has a thickness of 0.5 nm to 0.7 nm.
  9. 根据权利要求1-8任一项所述的复合膜,其中,所述复合膜位于衬底上。The composite film according to any one of claims 1 to 8, wherein the composite film is located on a substrate.
  10. 一种如权利要求1-9任一项所述的黑磷相铋纳米片改性的复合膜的制备方法,所述方法包括以下步骤:A method for preparing a composite film modified with black phosphorus phase bismuth nanosheets according to any one of claims 1-9, the method comprising the following steps:
    在衬底上外延生长基体膜的过程中,通入铋元素的热蒸发源,产生铋原子束流,随着基体膜的生长Bi原子沉积形成黑磷相铋纳米片,且黑磷相铋纳米片随着基体膜的生长被埋入基体膜中,从而在衬底上形成复合膜;In the process of epitaxial growth of the base film on the substrate, a thermal evaporation source of bismuth element is passed to produce a beam of bismuth atoms. As the base film grows, Bi atoms are deposited to form black phosphorus phase bismuth nanoplates, and the black phosphorus phase bismuth nanometers The sheet is buried in the base film as the base film grows, thereby forming a composite film on the substrate;
    制备所述复合膜的过程中,衬底温度控制在200℃~400℃。During the preparation of the composite film, the substrate temperature is controlled at 200 ° C to 400 ° C.
  11. 根据权利要求10所述的方法,其中,所述外延生长基体膜的方法为:分子束外延生长的方法。The method according to claim 10, wherein the method of epitaxially growing the base film is a method of molecular beam epitaxial growth.
  12. 根据权利要求10或11所述的方法,其中,所述基体膜包括导体、半导体或绝缘体中的任意一种。The method according to claim 10 or 11, wherein the base film includes any one of a conductor, a semiconductor, or an insulator.
  13. 根据权利要求12所述的方法,其中,所述基体膜为金属/半金属、II-VI族半导体、III-V族半导体或二维过渡期金属硫族化合物中的任意一种。The method according to claim 12, wherein the base film is any one of a metal / semi-metal, a group II-VI semiconductor, a group III-V semiconductor, or a two-dimensional transition metal chalcogenide compound.
  14. 根据权利要求13所述的方法,其中,所述基体膜为金属单质、合金薄 膜、CrTe化合物、II-VI族半导体、III-V族半导体或二维过渡期金属硫族化合物中的任意一种。The method according to claim 13, wherein the base film is any one of a metal element, an alloy thin film, a CrTe compound, a group II-VI semiconductor, a group III-V semiconductor, or a two-dimensional transition metal chalcogenide compound .
  15. 根据权利要求14所述的方法,其中,所述基体膜为碲化铬膜。The method according to claim 14, wherein the base film is a chromium telluride film.
  16. 根据权利要求10所述的方法,其中,蒸发产生铋元素的热蒸发源的温度控制在450℃~650℃。The method according to claim 10, wherein the temperature of the thermal evaporation source that evaporates to produce bismuth element is controlled at 450 ° C to 650 ° C.
  17. 根据权利要求16所述的方法,其中,蒸发产生铋元素的热蒸发源的温度控制在450℃~550℃。The method according to claim 16, wherein the temperature of the thermal evaporation source that evaporates to produce bismuth element is controlled at 450 ° C to 550 ° C.
  18. 根据权利要求10-17任一项所述的方法,其中,通过调整铋元素的热蒸发源的温度调整铋原子束流,从而调控黑磷相铋纳米片的尺寸和密度。The method according to any one of claims 10 to 17, wherein the bismuth atomic beam current is adjusted by adjusting the temperature of the thermal evaporation source of the bismuth element, thereby adjusting the size and density of the black phosphorus phase bismuth nanoplates.
  19. 根据权利要求10-18任一项所述的方法,其中,所述基体膜为碲化铬膜,生长碲化铬膜时,控制铬源温度在900℃~1200℃,控制碲源温度在300℃~400℃。The method according to any one of claims 10 to 18, wherein the base film is a chromium telluride film, and when the chromium telluride film is grown, the chromium source temperature is controlled at 900 ° C to 1200 ° C, and the tellurium source temperature is controlled at 300 ℃ ~ 400 ℃.
  20. 根据权利要求10-19任一项所述的方法,其中,所述方法包括以下步骤:The method according to any one of claims 10-19, wherein the method comprises the following steps:
    采用分子束外延生长的方法,铬源、碲源以及铋元素的热蒸发源同时通入外延生长设备,控制铬源温度在900℃~1200℃,碲源温度在300℃~400℃,蒸发产生铋元素的热蒸发源的温度在450℃~550℃,衬底温度200℃~400℃,随着基体膜的生长Bi原子沉积形成黑磷相铋纳米片,且黑磷相铋纳米片随着基体膜的生长被埋入基体膜中,从而在衬底上形成复合膜。Using the molecular beam epitaxial growth method, the chromium source, tellurium source and bismuth element thermal evaporation source are simultaneously passed into the epitaxial growth equipment to control the chromium source temperature at 900 ℃ ~ 1200 ℃, tellurium source temperature at 300 ℃ ~ 400 ℃, evaporation The temperature of the thermal evaporation source of bismuth element is 450 ℃ ~ 550 ℃, and the substrate temperature is 200 ℃ ~ 400 ℃. As the base film grows, Bi atoms deposit to form black phosphorus phase bismuth nanoplates, and the black phosphorus phase bismuth nanoplates follow The growth of the base film is buried in the base film, thereby forming a composite film on the substrate.
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